16-Bit, 2 MSPS/1 MSPS/500 kSPS,
Precision, Pseudo Differential, SAR ADCs
AD4000/AD4004/AD4008
Data Sheet
FEATURES
GENERAL DESCRIPTION
Easy Drive
Greatly reduced input kickback
Input current reduced to 0.4 μA/MSPS
Enhanced acquisition phase, ≥79% of cycle time at 1 MSPS
First conversion accurate, no latency or pipeline delay
Input span compression for single-supply operation
Fast conversion time allows low SPI clock rates
Input overvoltage clamp protection sinks up to 50 mA
SPI-/QSPI-/MICROWIRE-/DSP-compatible serial interface
High performance
Pseudo differential input range
0 V to VREF with VREF from 2.4 V to 5.1 V
Throughput: 2 MSPS/1 MSPS/500 kSPS options
INL: ±1.0 LSB maximum
Guaranteed 16-bit, no missing codes
SNR: 93 dB at fIN = 1 kHz, VREF = 5 V
THD: −115 dB at fIN = 1 kHz; −95 dB at fIN = 100 kHz
SINAD: 82 dB at fIN = 1 MHz (see Figure 17)
Oversampled dynamic range
96 dB for OSR = 2
123 dB for OSR = 1024
Low power
Single 1.8 V supply operation with 1.71 V to 5.5 V logic
interface
2.5 mW at 500 kSPS (VDD only)
70 μW at 10 kSPS, 14 mW typical at 2 MSPS (total power)
10-lead packages: 3 mm × 3 mm LFCSP, 3 mm × 4.90 mm MSOP
Pin compatible with AD4003/AD4007/AD4011 family
Guaranteed operation: −40°C to +125°C
The AD4000/AD4004/AD4008 are high accuracy, high speed, low
power, 16-bit, Easy Drive, precision successive approximation
register (SAR) analog-to-digital converters (ADCs) that operate
from a single power supply, VDD. The reference voltage, VREF, is
applied externally and can be set independent of the supply
voltage. The AD4000/AD40004/AD4008 power scales linearly
with throughput.
Easy Drive features reduce both signal chain complexity and power
consumption while enabling higher channel density. The reduced
input current, particularly in high-Z mode, coupled with a long
signal acquisition phase, eliminates the need for a dedicated ADC
driver. Easy Drive broadens the range of companion circuitry that
is capable of driving these ADCs (see Figure 2).
Input span compression eliminates the need to provide a negative
supply to the ADC driver amplifier while preserving access to the
full ADC code range. The input overvoltage clamp protects the
ADC inputs against overvoltage events, minimizing disturbances
on the reference pin and eliminating the need for external
protection diodes.
Fast device throughput up to 2 MSPS allows users to accurately
capture high frequency signals and to implement oversampling
techniques to alleviate the challenges associated with antialias
filter designs. Decreased serial peripheral interface (SPI) clock
rate requirements reduce digital input and output power
consumption, broadens digital host options, and simplifies the
task of sending data across digital isolation. The SPI-compatible
serial user interface is compatible with 1.8 V, 2.5 V, 3 V, and 5 V
logic by using the separate VIO logic supply.
APPLICATIONS
25
Automated test equipment
Machine automation
Medical equipment
Battery-powered equipment
Precision data acquisition systems
Instrumentation and control systems
INPUT CURRENT (μA)
15
FUNCTIONAL BLOCK DIAGRAM
IN+
IN–
HIGH-Z
MODE
REF
AD4000/
AD4004/
AD4008
16-BIT
SAR ADC
SPAN
CLAMP
COMPRESSION
GND
VDD
TURBO
MODE
SERIAL
INTERFACE
STATUS
BITS
VIO
SDI
SCK
SDO
CNV
5
0
–5
–10
–15
1.8V TO 5V
–20
3-WIRE OR 4-WIRE
SPI INTERFACE
(DAISY CHAIN, CS)
–25
Figure 1.
Rev. E
10
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
INPUT DIFFERENTIAL VOLTAGE (V)
5.0
14956-102
10µF
VREF
VREF /2
0
1.8V
14956-001
2.4V TO 5.1V
HIGH-Z DISABLED, 2MSPS
HIGH-Z ENABLED, 2MSPS
20
Figure 2. Input Current vs. Input Differential Voltage
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AD4000/AD4004/AD4008
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Driver Amplifier Choice ........................................................... 23
Applications ....................................................................................... 1
Ease of Drive Features ............................................................... 24
Functional Block Diagram .......................................................... 1
Voltage Reference Input ............................................................ 25
General Description ......................................................................... 1
Power Supply............................................................................... 25
Revision History ............................................................................... 2
Digital Interface .......................................................................... 25
Specifications..................................................................................... 5
Register Read/Write Functionality........................................... 28
Timing Specifications .................................................................. 8
Status Bits .................................................................................... 30
Absolute Maximum Ratings.......................................................... 10
CS Mode, 3-Wire Turbo Mode ................................................. 31
Thermal Resistance .................................................................... 10
CS Mode, 3-Wire Without Busy Indicator ............................. 32
ESD Caution ................................................................................ 10
CS Mode, 3-Wire with Busy Indicator .................................... 33
Pin Configurations and Function Descriptions ......................... 11
CS Mode, 4-Wire Turbo Mode ................................................. 34
Typical Performance Characteristics ........................................... 12
CS Mode, 4-Wire Without Busy Indicator ............................. 35
Terminology .................................................................................... 18
Theory of Operation ...................................................................... 19
Circuit Information .................................................................... 19
Converter Operation .................................................................. 20
Transfer Functions...................................................................... 20
Applications Information .............................................................. 21
Typical Application Diagrams .................................................. 21
CS Mode, 4-Wire with Busy Indicator .................................... 36
Daisy-Chain Mode ..................................................................... 37
Layout Guidelines....................................................................... 38
Evaluating the AD4000/AD4004/AD4008 Performance ...... 38
Outline Dimensions ....................................................................... 39
Ordering Guide .......................................................................... 40
Analog Inputs .............................................................................. 22
REVISION HISTORY
2/2021—Rev. D to Rev. E
Changes to Features Section, Applications Section, General
Description Section .......................................................................... 1
Changes to Specifications Section and Table 1 ............................. 5
Changes to Timing Specifications Section .................................... 8
Added Note 1 to Table 2; Renumbered Sequentially ................... 8
Deleted Timing Diagram Section and Figure 3; Renumbered
Sequentially ....................................................................................... 8
Added Note 1 to Table 3; Renumbered Sequentially ................... 9
Changes to Thermal Resistance Section...................................... 10
Changes to Table 7 .......................................................................... 11
Changes to Effective Number of Bits (ENOB) Section ............. 18
Changes to Figure 7 Caption and Figure 10 Caption ................ 12
Changes to Figure 11 and Figure 14 ............................................. 12
Changes to Circuit Information Section and Table 8 ................ 19
Changes to Typical Application Diagrams Section .................... 21
Changes to Input Overvoltage Clamp Circuit Section .............. 22
Changes to Table 10, Driver Amplifier Choice Section, and
High Frequency Input Signals Section ........................................ 23
Changes to Multiplexed Applications Section, Input Span
Compression Section, and High-Z Mode Section ..................... 24
Changes to Figure 44 Caption, Figure 45 Caption, Voltage
Reference Input Section, and Digital Interface Section ............ 25
Changes to Register Read/Write Functionality Section and
Figure 46 .......................................................................................... 28
Changes to Figure 47...................................................................... 29
Changes to Status Bit Section and Figure 49 .............................. 30
Changes to CS Mode, 3-Wire Turbo Mode Section .................. 31
Changes to CS Mode, 3-Wire Without Busy Indicator Section...... 32
Changes to CS Mode, 3-Wire With Busy Indicator Section,
Figure 54, and Figure 55 ................................................................ 33
Changes to CS Mode, 4-Wire Turbo Mode Section .................. 34
Changes to CS Mode, 4-Wire Without Busy Indicator Section...... 35
Changes to CS Mode, 4-Wire with Busy Indicator Section and
Figure 61 .......................................................................................... 36
Changes to Daisy-Chain Mode Section and Figure 62 ............. 37
Changes to Layout Guidelines and Evaluating the
AD4000/AD4004/AD4008 Performance Section ............................. 38
Updated Outline Dimensions................................................................ 39
Changes to Ordering Guide ................................................................... 40
Rev. E | Page 2 of 40
Data Sheet
AD4000/AD4004/AD4008
8/2019—Rev. C to Rev. D
Added Figure 2; Renumbered Sequentially ................................... 1
Changes to Features Section and General Description Section ..... 1
Added Figure 18 and Figure 21 .....................................................13
Added Figure 27, Figure 28, and Figure 29 ..................................14
Added Figure 33 and Figure 35 .....................................................15
Changes to Figure 31 and Figure 32 .............................................15
Changes to Figure 38 ......................................................................18
Changes to Input Overvoltage Clamp Circuit Section...............21
Changes to High-Z Mode Section, Figure 45, and Figure 46 ....23
Added Configuration Register Details Section and Serial Clock
Frequency Requirements Section .................................................24
Changes to Digital Interface Section ............................................24
Deleted Table 12 and Table 13; Renumbered Sequentially ........25
Added Table 12 and Table 13; Renumbered Sequentially ..........25
Changes to Register Read/Write Functionality Section and
Figure 47 ...........................................................................................26
Changes to Figure 48 ......................................................................27
Added Table 58 ................................................................................28
Changes to Status Bits Section .......................................................28
Changes to CS Mode, 3-Wire Turbo Mode Section and
Figure 51 ...........................................................................................29
Changes to CS Mode, 3-Wire Without Busy Indicator Section
and Figure 53 ...................................................................................30
Changes to CS Mode, 3-Wire with Busy Indicator Section and
Figure 55 ...........................................................................................31
Changes to CS Mode, 4-Wire Turbo Mode Section and
Figure 57 ...........................................................................................32
Changes to CS Mode, 4-Wire Without Busy Indicator Section
and Figure 59 ...................................................................................33
Changes to CS Mode, 4-Wire with Busy Indicator Section and
Figure 61 ...........................................................................................34
Changes to Daisy-Chain Mode Section and Figure 64 ..............35
Updated Outline Dimensions ........................................................37
Changes to Ordering Guide ...........................................................38
10/2017—Rev. B to Rev. C
Changes to Features Section ............................................................ 1
Added Multiplexed Applications Section ....................................21
Changes to Ordering Guide ...........................................................36
Added Timing Diagram Section ..................................................... 8
Moved Figure 3 .................................................................................. 8
9/2017—Rev. A to Rev. B
Added AD4008 ................................................................... Universal
Changes to Title, Features Section, General Description Section,
and Figure 1........................................................................................ 1
Changes to Table 1 ............................................................................ 4
Changes to Timing Specifications Section and Table 2 ............... 7
Changes to Table 4 ............................................................................ 8
Changes to Table 5 ............................................................................ 9
Changes to Typical Performance Characteristics Section Layout .. 11
Changes to Figure 19 ............................................................................... 13
Added Figure 25; Renumbered Sequentially ............................... 14
Changes to Figure 28 ...................................................................... 14
Change to Zero Error Definition, Terminology Section ........... 16
Changes to Circuit Information Section and Table 8 ................. 17
Changes to Converter Operation Section and Note 1 and
Note 2, Table 9 ................................................................................. 18
Changes to High Frequency Input Signals Section, Figure 36
Caption, and Figure 37 Caption .................................................... 21
Added Figure 38 .............................................................................. 21
Changes to Input Span Compression Section, High-Z Mode
Section, Figure 40, and Figure 41 Caption................................... 22
Changes to Figure 42 Caption, Figure 43 Caption, Power Supply
Section, and Figure 44 Caption ..................................................... 23
Changes to Figure 45, Digital Interface Section, and Table 11 ........ 24
Changes to Register Read/Write Functionality Section and
Figure 46 Caption ............................................................................ 25
Changes to CS Mode, 3-Wire Turbo Mode Section ................... 28
Changes to CS Mode, 3-Wire with Busy Indicator Section ...... 30
Changes to CS Mode, 4-Wire Turbo Mode Section ................... 31
Changes to CS Mode, 4-Wire with Busy Indicator Section ...... 33
Changes to Daisy-Chain Mode Section ....................................... 34
Changed Evaluating the AD4000/AD4004 Performance Section
to Evaluating the AD4000/AD4004/AD4008 Performance
Section .............................................................................................. 35
Changes to Evaluating the AD4000/AD4004/AD4008
Performance Section ....................................................................... 35
Changes to Ordering Guide ........................................................... 36
4/2017—Rev. 0 to Rev. A
Added AD4004 ................................................................... Universal
Changes to Title, Features Section, General Description Section,
and Figure 1 ....................................................................................... 1
Changes to Table 1 ............................................................................ 3
Changes to Table 2 ............................................................................ 6
Changes to Table 4 ............................................................................ 7
Changes to Table 7 ............................................................................ 9
Changes to Figure 19 and Figure 21 ............................................. 12
Changes to Figure 24 ...................................................................... 13
Added Figure 25; Renumbered Sequentially ............................... 13
Moved Terminology Section ......................................................... 15
Changes to Circuit Information Section and Table 8 ................. 16
Changes to Figure 33 ...................................................................... 18
Changes to RC Filters Section ....................................................... 19
Changes to High Frequency Input Signals Section .................... 20
Changes to High-Z Mode Section, Figure 38, and Figure 39 .... 21
Changes to Long Acquisition Phase Section and Figure 43 ...... 22
Changes to Digital Interface Section and Register Read/Write
Functionality Section ...................................................................... 23
Changes to Figure 45 ...................................................................... 24
Rev. E | Page 3 of 40
AD4000/AD4004/AD4008
Data Sheet
Changes to CS Mode, 3-Wire Turbo Mode Section .................. 26
Added Figure 48.............................................................................. 26
Changes to CS Mode, 4-Wire Turbo Mode................................. 29
Added Figure 54.............................................................................. 29
Changes to Figure 56 and Figure 57 ............................................. 30
Changes to Layout Guidelines Section and Evaluating the
AD4000/AD4004 Performance Section ...................................... 33
Updated Outline Dimensions ....................................................... 34
Changes to Ordering Guide Section ............................................ 34
10/2016—Revision 0: Initial Version
Rev. E | Page 4 of 40
Data Sheet
AD4000/AD4004/AD4008
SPECIFICATIONS
VDD = 1.71 V to 1.89 V, VIO = 1.71 V to 5.5 V, REF = VREF = 5 V, all specifications TMIN to TMAX, high-Z mode disabled, span compression
disabled, turbo mode enabled, and sampling frequency (fS) = 2 MSPS for the AD4000, fS = 1 MSPS for the AD4004, and fS = 500 kSPS for the
AD4008, unless otherwise noted.
Table 1.
Parameter
RESOLUTION
ANALOG INPUT
Voltage Range
Operating Input Voltage
Analog Input Current
Test Conditions/Comments
Min
16
IN+ voltage (VIN+) − IN− voltage (VIN−)
VIN+ to GND
VIN− to GND
Span compression enabled
Acquisition phase, T = 25°C
High-Z mode enabled, converting dc
input at 2 MSPS
0
−0.1
−0.1
0.1 × VREF
THROUGHPUT
Complete Cycle
AD4000
AD4004
AD4008
Conversion Time
Acquisition Phase1
AD4000
AD4004
AD4008
Throughput Rate2
AD4000
AD4004
AD4008
Transient Response3
DC ACCURACY
No Missing Codes
Integral Nonlinearity Error (INL)
500
1000
2000
270
Max
Unit
Bits
VREF
VREF + 0.1
+0.1
0.9 × VREF
0.3
1
V
V
V
V
nA
μA
290
ns
ns
ns
ns
320
290
790
1790
ns
ns
ns
0
0
0
2
1
500
150
16
−1.0
−0.8
−0.5
MSPS
MSPS
kSPS
ns
VDD = 1.8 V ± 5%
Bandwidth = 0.1 Hz to 10 Hz
0.5
6
Bits
LSB
LSB
LSB
LSB
LSB
ppm/°C
LSB
ppm/°C
LSB
μV p-p
Oversampling ratio (OSR) = 2
OSR = 256
OSR = 1024
93.5
96
117
123
37
dB
dB
dB
dB
μV rms
T = 0°C to 85°C
Differential Nonlinearity Error (DNL)
Transition Noise
Zero Error
Zero Error Drift4
Gain Error
Gain Error Drift4
Power Supply Sensitivity
1/f Noise5
AC ACCURACY
Dynamic Range
Oversampled Dynamic Range
Typ
−4.5
−0.55
−20
−0.92
Total RMS Noise
Rev. E | Page 5 of 40
±0.2
±0.2
±0.15
0.5
±3
+1.0
+0.8
+0.5
+4.5
+0.55
+20
+0.92
AD4000/AD4004/AD4008
Parameter
fIN = 1 kHz, −0.5 dBFS, VREF = 5 V
Signal-to-Noise Ratio (SNR)
Spurious-Free Dynamic Range (SFDR)
Total Harmonic Distortion (THD)
Signal-to-Noise-and-Distortion Ratio
(SINAD)
fIN = 1 kHz, −0.5 dBFS, VREF = 2.5 V
SNR
SFDR
THD
SINAD
fIN = 100 kHz, −0.5 dBFS, VREF = 5 V
SNR
THD
SINAD
fIN = 400 kHz, −0.5 dBFS, VREF = 5 V
SNR
THD
SINAD
−3 dB Input Bandwidth
Aperture Delay
Aperture Jitter
REFERENCE
VREF Voltage Range
Current
AD4000
AD4004
AD4008
INPUT OVERVOLTAGE CLAMP
IN+/IN− Current (IIN+/IIN−)
VIN+/VIN− at Maximum IIN+/IIN−
VIN+/VIN− Clamp On/Off Threshold
Deactivation Time
REF Current at Maximum IIN+
DIGITAL INPUTS
Logic Levels
Input Voltage Low (VIL)
Input Voltage High (VIH)
Data Sheet
Test Conditions/Comments
Min
Typ
91
93
112
−115
92.5
dB
dB
dB
dB
87.5
115
−113
87
dB
dB
dB
dB
90
−95
89
dB
dB
dB
85
−91
84
10
1
1
dB
dB
dB
MHz
ns
ps rms
91
85.5
85.5
REF − GND
VREF = 5 V
2 MSPS
1 MSPS
500 kSPS
2.4
Max
5.1
0.75
0.325
0.185
VREF = 5 V
VREF = 2.5 V
VREF = 5 V
VREF = 2.5 V
VREF = 5 V
VREF = 2.5 V
5.25
2.68
VIN+ > VREF
VIO > 2.7 V
VIO ≤ 2.7 V
VIO > 2.7 V
VIO ≤ 2.7 V
Input Current Low (IIL)
Input Current High (IIH)
Input Pin Capacitance
6
Rev. E | Page 6 of 40
V
mA
mA
mA
50
50
mA
mA
V
V
V
V
ns
μA
+0.3 × VIO
+0.2 × VIO
VIO + 0.3
VIO + 0.3
+1
+1
V
V
V
V
μA
μA
pF
5.4
3.1
5.4
2.8
360
100
−0.3
−0.3
0.7 × VIO
0.8 × VIO
−1
−1
Unit
Data Sheet
AD4000/AD4004/AD4008
Parameter
DIGITAL OUTPUTS
Data Format
Pipeline Delay
Test Conditions/Comments
Min
Output Voltage, Low (VOL)
Output Voltage, High (VOH)
POWER SUPPLIES
VDD
VIO
Standby Current
Power Dissipation
Output current = 500 μA
Output current = −500 μA
Serial 16 bits, straight binary
Conversion results available
immediately after completed
conversion
0.4
VIO − 0.3
VDD Only
REF Only
VIO Only
Energy per Conversion
TEMPERATURE RANGE
Specified Performance
1.71
1.71
VDD and VIO = 1.8 V, T = 25°C
VDD = 1.8 V, VIO = 1.8 V, VREF = 5 V
10 kSPS, high-Z mode disabled
500 kSPS, high-Z mode disabled
1 MSPS, high-Z mode disabled
2 MSPS, high-Z mode disabled
500 kSPS, high-Z mode enabled
1 MSPS, high-Z mode enabled
2 MSPS, high-Z mode enabled
500 kSPS, high-Z mode disabled
1 MSPS, high-Z mode disabled
2 MSPS, high-Z mode disabled
500 kSPS, high-Z mode disabled
1 MSPS, high-Z mode disabled
2 MSPS, high-Z mode disabled
500 kSPS, high-Z mode disabled
1 MSPS, high-Z mode disabled
2 MSPS, high-Z mode disabled
TMIN to TMAX
1.8
Max
1.89
5.5
1.6
70
3.5
7
14
4
8
16
2.5
4.9
9.75
0.9
1.9
3.75
0.1
0.2
0.5
7
−40
1
Typ
4.2
8.2
16
5
9.9
19
+125
Unit
V
V
V
V
μA
μW
mW
mW
mW
mW
mW
mW
mW
mW
mW
mW
mW
mW
mW
mW
mW
nJ/sample
°C
The acquisition phase is the time available for the input sampling capacitors to acquire a new input with the ADC running at a throughput rate of 2 MSPS for the
AD4000, 1 MSPS for the AD4004, and 500 kSPS for the AD4008.
2
A throughput rate of 2 MSPS can only be achieved with turbo mode enabled and a minimum SCK rate of 70 MHz. Refer to Table 4 for the maximum achievable
throughput for different modes of operation.
3
Transient response is the time required for the ADC to acquire a full-scale input step to ±0.5 LSB accuracy.
4
The minimum and maximum values are guaranteed by characterization, but not production tested.
5
See the 1/f noise plot in Figure 25.
Rev. E | Page 7 of 40
AD4000/AD4004/AD4008
Data Sheet
TIMING SPECIFICATIONS
VDD = 1.71 V to 1.89 V, VIO = 1.71 V to 5.5 V, VREF = 5 V, all specifications TMIN to TMAX, high-Z mode disabled, span compression disabled,
turbo mode enabled, and fS = 2 MSPS for the AD4000, fS = 1 MSPS for the AD4004, and fS = 500 kSPS for the AD4008, unless otherwise noted.
See Figure 46 to Figure 49, Figure 51, Figure 53, Figure 55, Figure 57, Figure 59, Figure 61, and Figure 63 for timing diagrams.
Table 2. Digital Interface Timing
Parameter1
CONVERSION TIME—CNV RISING EDGE TO DATA AVAILABLE
ACQUISITION PHASE2
AD4000
AD4004
AD4008
TIME BETWEEN CONVERSIONS
AD4000
AD4004
AD4008
CNV PULSE WIDTH (CS MODE)3
Symbol
tCONV
tACQ
Min
270
Typ
290
Max
320
Unit
ns
290
790
1790
ns
ns
ns
500
1000
2000
10
ns
ns
ns
ns
9.8
12.3
ns
ns
20
25
3
3
1.5
ns
ns
ns
ns
ns
tCYC
tCNVH
SCK PERIOD (CS MODE)4
tSCK
VIO > 2.7 V
VIO > 1.7 V
SCK PERIOD (DAISY-CHAIN MODE)5
VIO > 2.7 V
VIO > 1.7 V
SCK LOW TIME
SCK HIGH TIME
SCK FALLING EDGE TO DATA REMAINS VALID DELAY
SCK FALLING EDGE TO DATA VALID DELAY
VIO > 2.7 V
VIO > 1.7 V
CNV OR SDI LOW TO SDO D15 MOST SIGNIFICANT BIT (MSB) VALID DELAY (CS MODE)
tSCK
tSCKL
tSCKH
tHSDO
tDSDO
7.5
10.5
ns
ns
10
13
ns
ns
ns
ns
ns
tEN
VIO > 2.7 V
VIO > 1.7 V
CNV RISING EDGE TO FIRST SCK RISING EDGE DELAY
LAST SCK FALLING EDGE TO CNV RISING EDGE DELAY6
CNV OR SDI HIGH OR LAST SCK FALLING EDGE TO SDO HIGH IMPEDANCE (CS MODE)
tQUIET1
tQUIET2
tDIS
190
60
SDI VALID SETUP TIME FROM CNV RISING EDGE
SDI VALID HOLD TIME FROM CNV RISING EDGE (CS MODE)
tSSDICNV
tHSDICNV
2
2
ns
ns
SCK VALID HOLD TIME FROM CNV RISING EDGE (DAISY-CHAIN MODE)
SDI VALID SETUP TIME FROM SCK RISING EDGE (DAISY-CHAIN MODE)
SDI VALID HOLD TIME FROM SCK RISING EDGE (DAISY-CHAIN MODE)
tHSCKCNV
tSSDISCK
tHSDISCK
12
2
2
ns
ns
ns
1
20
Timing parameters measured with respect to a falling edge are defined as triggered at x% VIO. Timing parameters measured with respect to a rising edge are defined
as triggered at y% VIO. For VIO ≤ 2.7 V, x = 80 and y = 20. For VIO > 2.7 V, x = 70 and y = 30. The minimum VIH and maximum VIL are used. See the digital inputs
specifications in Table 1.
2
The acquisition phase is the time available for the input sampling capacitors to acquire a new input with the ADC running at a throughput rate of 2 MSPS for the
AD4000, 1 MSPS for the AD4004, and 500 kSPS for the AD4008.
3
For turbo mode, tCNVH must match the tQUIET1 minimum.
4
A throughput rate of 2 MSPS can only be achieved with turbo mode enabled and a minimum SCK frequency of 70 MHz. Refer to Table 4 for the maximum achievable
throughput for different modes of operation. See the Serial Clock Frequency Requirements section for guidelines on determining the minimum SCK rate required for a
given throughput.
5
A 50% duty cycle is assumed for SCK.
6
See Figure 24 for SINAD, SNR, and ENOB vs. tQUIET2.
Rev. E | Page 8 of 40
Data Sheet
AD4000/AD4004/AD4008
Table 3. Register Read/Write Timing
Parameter
READ/WRITE OPERATION
CNV Pulse Width2
SCK Period
VIO > 2.7 V
VIO > 1.7 V
SCK Low Time
SCK High Time
READ OPERATION
CNV Low to SDO D15 MSB Valid Delay
VIO > 2.7 V
VIO > 1.7 V
SCK Falling Edge to Data Remains Valid
SCK Falling Edge to Data Valid Delay
VIO > 2.7 V
VIO > 1.7 V
CNV Rising Edge to SDO High Impedance
WRITE OPERATION
SDI Valid Setup Time from SCK Rising Edge
SDI Valid Hold Time from SCK Rising Edge
CNV Rising Edge to SCK Edge Hold Time
CNV Falling Edge to SCK Active Edge Setup Time
1
2
Symbol1
Min
tCNVH
tSCK
10
ns
9.8
12.3
3
3
ns
ns
ns
ns
tSCKL
tSCKH
Typ
Max
Unit
tEN
tHSDO
tDSDO
ns
ns
ns
7.5
10.5
20
ns
ns
ns
1.5
tDIS
tSSDISCK
tHSDISCK
tHCNVSCK
tSCNVSCK
10
13
2
2
0
6
ns
ns
ns
ns
See Figure 46 to Figure 49, Figure 51, Figure 53, Figure 55, Figure 57, Figure 59, Figure 61, and Figure 63.
For turbo mode, tCNVH must match the tQUIET1 minimum.
Table 4. Achievable Throughput for Different Modes of Operation
Parameter
THROUGHPUT, CS MODE
3-Wire and 4-Wire Turbo Mode
3-Wire and 4-Wire Turbo Mode and Six Status Bits
3-Wire and 4-Wire Mode
3-Wire and 4-Wire Mode and Six Status Bits
Test Conditions/Comments
fSCK = 100 MHz, VIO ≥ 2.7 V
fSCK = 80 MHz, VIO < 2.7 V
fSCK = 100 MHz, VIO ≥ 2.7 V
fSCK = 80 MHz, VIO < 2.7 V
fSCK = 100 MHz, VIO ≥ 2.7 V
fSCK = 80 MHz, VIO < 2.7 V
fSCK = 100 MHz, VIO ≥ 2.7 V
fSCK = 80 MHz, VIO < 2.7 V
Rev. E | Page 9 of 40
Min
Typ
Max
Unit
2
2
2
1.86
1.82
1.69
1.64
1.5
MSPS
MSPS
MSPS
MSPS
MSPS
MSPS
MSPS
MSPS
AD4000/AD4004/AD4008
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Note that the input overvoltage clamp cannot sustain the
overvoltage condition for an indefinite amount of time.
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 5.
Parameter
Analog Inputs
IN+, IN− to GND1
Supply Voltage
REF, VIO to GND
VDD to GND
VDD to VIO
Digital Inputs to GND
Digital Outputs to GND
Storage Temperature Range
Junction Temperature
Lead Temperature Soldering
ESD Ratings
Human Body Model
Machine Model
Field Induced Charged Device Model
1
2
Rating
−0.3 V to VREF + 0.4 V
or ±130 mA2
−0.3 V to +6.0 V
−0.3 V to +2.1 V
−6 V to +2.4 V
−0.3 V to VIO + 0.3 V
−0.3 V to VIO + 0.3 V
−65°C to +150°C
150°C
260°C reflow as per
JEDEC J-STD-020
θJA is the natural convection junction-to-ambient thermal
resistance measured in a one cubic foot sealed enclosure.
θJC is the junction-to-case thermal resistance.
Table 6. Thermal Resistance
Package Type1
RM-10
CP-10-9
1
θJA
147
114
θJC
38
33
Unit
°C/W
°C/W
Test Condition 1: thermal impedance simulated values are based upon use
of 2S2P JEDEC PCB. See the Ordering Guide.
ESD CAUTION
4 kV
200 V
1.25 kV
See the Analog Inputs section for an explanation of IN+ and IN−.
Current condition tested over a 10 ms time interval.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. E | Page 10 of 40
Data Sheet
AD4000/AD4004/AD4008
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
IN+ 3
IN– 4
GND 5
TOP VIEW
(Not to Scale)
10
VIO
REF 1
9
SDI
VDD 2
8
SCK
IN+ 3
7
SDO
6
CNV
IN– 4
GND 5
AD4000/
AD4004/
AD4008
TOP VIEW
(Not to Scale)
10 VIO
9
SDI
8
SCK
7
SDO
6
CNV
NOTES
1. CONNECT THE EXPOSED PAD TO GND.
THIS CONNECTION IS NOT REQUIRED TO
MEET THE SPECIFIED PERFORMANCE.
14956-004
AD4000/
AD4004
14956-003
REF 1
VDD 2
Figure 4. 10-Lead LFCSP Pin Configuration
Figure 3. 10-Lead MSOP Pin Configuration
Table 7. Pin Function Descriptions
Pin No.
1
Mnemonic
REF
Type1
AI
2
3
VDD
IN+
P
AI
4
5
6
IN−
GND
CNV
AI
P
DI
7
SDO
DO
8
9
SCK
SDI
DI
DI
10
VIO
P
N/A2
EPAD
P
1
2
Description
Reference Input Voltage. The VREF range is 2.4 V to 5.1 V. This pin is referred to the GND pin and must be
decoupled closely to the GND pin with a 10 μF, X7R ceramic capacitor.
1.8 V Power Supply. The VDD range is 1.71 V to 1.89 V. Bypass VDD to GND with a 0.1 μF ceramic capacitor.
Analog Input. This input is referred to analog ground sense pin (IN−). The device samples the voltage
differential between IN+ and IN− on the leading edge on CNV. The operating input range of IN+ − IN− is
0 V to VREF.
Analog Input Ground Sense. Connect this pin to the analog ground plane or to a remote sense ground.
Power Supply Ground. Connect to the ground plane of the board.
Convert Input. This input has multiple functions. On the leading edge, the input initiates the conversions and
selects the interface mode of the device, which is either daisy-chain mode or CS mode. In CS mode, the
SDO pin is enabled when CNV is low. In daisy-chain mode, the data is read when CNV is high.
Serial Data Output. The conversion result is output on this pin. The SDO pin is synchronized to the SCK
signal on the SCK pin.
Serial Data Clock Input. When the device is selected, the conversion result is shifted out by this clock.
Serial Data Input. This input provides multiple features and selects the interface mode of the ADC as follows:
Daisy-chain mode is selected if SDI is low during the CNV rising edge. In this mode, SDI is used as a data
input to daisy-chain the conversion results of two or more ADCs onto a single SDO line. The digital data
level on SDI is output on SDO with a delay of 16 SCK cycles.
CS mode is selected if SDI is high during the CNV rising edge. In this mode, either SDI or CNV can enable
the serial output signals when low. If SDI or CNV is low when the conversion is complete, the busy indicator
feature is enabled. With CNV low, program the device by clocking in a 16-bit word on SDI on the rising
edge of SCK.
Input/Output Interface Digital Power. Nominally, this pin is at the same supply as the host interface (1.8 V,
2.5 V, 3 V, or 5 V). Bypass VIO to GND with a 0.1 μF ceramic capacitor.
Exposed Pad. Connect the exposed pad to GND. This connection is not required to meet the specified
performance. Note that the exposed pad only applies to the LFCSP.
AI is analog input, P is power, DI is digital input, and DO is digital output.
N/A means not applicable.
Rev. E | Page 11 of 40
AD4000/AD4004/AD4008
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
VDD = 1.71 V to 1.89 V, VIO = 1.71 V to 5.5 V, VREF = 5 V, all specifications TMIN to TMAX, high-Z mode disabled, span compression disabled,
turbo mode enabled, and fS = 2 MSPS for the AD4000, fS = 1 MSPS for the AD4004, and fS = 500 kSPS for the AD4008, unless otherwise noted.
0.5
0.20
+125°C
+25°C
–40°C
0.4
0.15
0.3
0.10
0.1
DNL (LSB)
INL (LSB)
0.2
0
–0.1
0.05
0
–0.05
–0.2
–0.10
–0.3
8192
16384
24576
32768
40960
49152
57344
65536
CODE
–0.20
0
8192
16384
24576
32768
40960
49152
57344
65536
CODE
Figure 5. INL vs. Code for Various Temperatures, VREF = 5 V
14956-203
0
14956-200
–0.5
+125°C
+25°C
–40°C
–0.15
–0.4
Figure 8. DNL vs. Code for Various Temperatures, VREF = 5 V
0.3
0.20
+125°C
+25°C
–40°C
0.2
0.15
0.10
DNL (LSB)
INL (LSB)
0.1
0
–0.1
0.05
0
–0.05
–0.10
0
8192
16384
24576
32768
40960
49152
57344
65536
CODE
–0.20
14956-201
16384
24576
32768
40960
49152
57344
65536
Figure 9. DNL vs. Code for Various Temperatures, VREF = 2.5 V
0.4
0.20
0.3
0.15
0.2
0.10
0.1
0.05
DNL (LSB)
INL (LSB)
8192
CODE
Figure 6. INL vs. Code for Various Temperatures, VREF = 2.5 V
0
–0.1
0
–0.05
–0.10
–0.2
–0.3
–0.15
SPAN COMPRESSION ENABLED
HIGH-Z ENABLED
0
8192
16384
24576
32768
CODE
40960
49152
57344
65536
–0.20
14956-202
–0.4
0
Figure 7. INL vs. Code for High-Z and Span Compression Modes Enabled,
VREF = 5 V
SPAN COMPRESSION ENABLED
HIGH-Z ENABLED
0
8192
16384
24576
32768
CODE
40960
49152
57344
65536
14956-205
–0.3
+125°C
+25°C
–40°C
–0.15
14956-204
–0.2
Figure 10. DNL vs. Code for High-Z and Span Compression Modes Enabled,
VREF = 5 V
Rev. E | Page 12 of 40
Data Sheet
AD4000/AD4004/AD4008
90000
50000
VREF = 2.5V
VREF = 5V
80000
40000
70000
35000
CODE COUNT
50000
40000
30000
25000
20000
15000
20000
14956-209
32760
32761
32762
32763
32764
32765
32766
32767
32768
32769
32770
32771
32772
32773
32774
32775
32776
32777
32778
32779
32780
0
32760
32761
32762
32763
32764
32765
32766
32767
32768
32769
32770
32771
32772
32773
32774
32775
32776
32777
32778
32779
32780
5000
0
Figure 11. Histogram of a DC Input at Code Center, VREF = 2.5 V and VREF = 5 V
ADC CODE
Figure 14. Histogram of a DC Input at Code Transition, VREF = 2.5 V and VREF = 5 V
0
0
VREF = 5V
SNR = 92.47dB
THD = –115.10dB
SINAD = 92.41dB
–40
–60
–80
–100
–120
–140
–40
–60
–80
–100
–120
–140
–160
10k
100k
1M
FREQUENCY (Hz)
–180
100
14956-207
1k
100k
1M
Figure 15. 1 kHz, −0.5 dBFS Input Tone FFT,
VREF = 2.5 V
0
0
VREF = 5V
SNR = 90.16 dB
THD = –94.52dB
SINAD = 88.33dB
FUNDAMENTAL AMPLITUDE (dB)
–20
–60
–80
–100
–120
–140
–160
–40
VREF = 5V
SNR = 84.65 dB
THD = –90.80dB
SINAD = 83.89dB
–60
–80
–100
–120
–140
–160
10k
100k
FREQUENCY (Hz)
1M
14956-211
FUNDAMENTAL AMPLITUDE (dB)
10k
FREQUENCY (Hz)
Figure 12. 1 kHz, −0.5 dBFS Input Tone Fast Fourier Transform (FFT),
VREF = 5 V
–180
1k
1k
14956-210
–160
–40
VREF = 2.5V
SNR = 87.54dB
THD = –112.33dB
SINAD = 87.49dB
–20
FUNDAMENTAL AMPLITUDE (dB)
–20
–180
100
14956-206
10000
10000
ADC CODE
FUNDAMENTAL AMPLITUDE (dB)
30000
Figure 13. 100 kHz, −0.5 dBFS Input Tone FFT
–180
1k
10k
100k
FREQUENCY (Hz)
Figure 16. 400 kHz, −0.5 dBFS Input Tone FFT
Rev. E | Page 13 of 40
1M
14956-208
CODE COUNT
60000
–20
VREF = 2.5V
VREF = 5V
45000
AD4000/AD4004/AD4008
Data Sheet
94
–80
15.2
ENOB
SINAD
SNR
92
15.0
120
THD
SFDR
–85
115
14.2
86
14.0
THD (dB)
14.4
88
13.8
84
13.6
82
13.4
10k
13.2
1M
100k
14956-212
80
1k
INPUT FREQUENCY (Hz)
–90
110
–95
105
–100
100
–105
95
–110
90
–115
85
–120
1k
10k
80
1M
100k
14956-215
14.6
ENOB (Bits)
INPUT FREQUENCY (Hz)
Figure 17. SNR, SINAD, and Effective Number of Bits (ENOB) vs. Input
Frequency
Figure 20. THD and SFDR vs. Input Frequency
ENOB
SINAD
SNR
93
–110
15.2
–111
15.1
111
–112
91
14.8
90
14.7
109
–114
108
–115
14.6
107
–116
14.5
88
110
–113
THD (dB)
14.9
89
108
–117
107
14.4
3.3
3.6
3.9
4.2
4.5
4.8
REFERENCE VOLTAGE (V)
Figure 18. SNR, SINAD, and ENOB vs.
Reference Voltage, fIN = 1 kHz
3.3
3.6
3.9
4.2
REFERENCE VOLTAGE (V)
4.5
106
5.1
4.8
Figure 21. THD and SFDR vs. Reference Voltage, fIN = 1 kHz
93.2
15.15
–100
SNR
SINAD
ENOB
93.0
3.0
14956-216
3.0
2.7
–102
15.10
92.8
92.2
15.00
THD (dB)
15.05
ENOB (Bits)
92.6
92.4
92.0
91.8
111
THD
SFDR
14.95
110
–104
109
–106
108
–108
107
–110
106
–112
105
–114
104
–116
103
SFDR (dB)
2.7
14.3
5.1
–118
2.4
14956-213
87
2.4
91.6
91.4
–40
–20
0
20
40
60
80
100
120
14.90
TEMPERATURE (°C)
14956-220
SNR, SINAD (dB)
112
15.0
ENOB (Bits)
SNR, SINAD (dB)
92
113
THD
SFDR
SFDR (dB)
15.3
94
–118
–40
Figure 19. SNR, SINAD, and ENOB vs. Temperature, fIN = 1 kHz
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
Figure 22. THD and SFDR vs. Temperature, fIN = 1 kHz
Rev. E | Page 14 of 40
102
14956-222
SNR, SINAD (dB)
90
SFDR (dB)
14.8
Data Sheet
125
AD4000/AD4004/AD4008
–75
DYNAMIC RANGE
fIN = 1kHz
fIN = 10kHz
120
–80
–85
115
THD (dB)
SNR (dB)
–90
110
105
500Ω HIGH-Z OFF
500Ω HIGH-Z ON
1000Ω HIGH-Z OFF
1000Ω HIGH-Z ON
–95
–100
100
95
2
4
8
16
32
64
128
256
512 1024 2048
DECIMATION RATE
–115
ZERO ERROR AND GAIN ERROR (LSB)
15.15
92.6
ENOB (Bits)
15.05
92.4
0
10
20
30
40
50
60
70
14.95
tQUIET2 (ns)
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
Figure 27. Zero Error and Gain Error vs. Temperature
Figure 24. SNR, SINAD, and ENOB vs. tQUIET2
25
955
HIGH-Z
HIGH-Z
HIGH-Z
HIGH-Z
HIGH-Z
HIGH-Z
20
954
15
953
INPUT CURRENT (μA)
ADC OUTPUT READING (µV)
50
ZERO ERROR
GAIN ERROR
0.8
–1.0
–40
14956-217
92.0
15.00
ENOB
SINAD
SNR
92.2
20
952
951
950
DISABLED, 2MSPS
DISABLED, 1MSPS
DISABLED, 500kSPS
ENABLED, 2MSPS
ENABLED, 1MSPS
ENABLED, 500kSPS
10
5
0
–5
–10
–15
949
0
2
4
6
TIME (Seconds)
8
10
14956-218
948
–20
Figure 25. 1/f Noise for 0.1 Hz to 10 Hz Bandwidth, 50 kSPS, 2500 Samples
Averaged per Reading
Rev. E | Page 15 of 40
–25
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
INPUT DIFFERENTIAL VOLTAGE (V)
Figure 28. Analog Input Current vs. Input Differential Voltage
14956-221
SNR, SINAD (dB)
93.0
15.10
10
1.0
15.20
92.8
5
Figure 26. THD vs. Input Frequency for Various Source Impedances
15.25
93.2
2
INPUT FREQUENCY (kHz)
Figure 23. SNR vs. Decimation Rate for Various Input Frequencies, 2 MSPS
93.4
1
14956-223
1
14956-225
–110
14956-214
90
200Ω HIGH-Z OFF
200Ω HIGH-Z ON
–105
AD4000/AD4004/AD4008
Data Sheet
80
8
7
OPERATING CURRENT (mA)
75
6
PSRR (dB)
5
VDD HIGH-Z ENABLED
VDD HIGH-Z DISABLED
REF HIGH-Z ENABLED
REF HIGH-Z DISABLED
VIO HIGH-Z ENABLED
VIO HIGH-Z DISABLED
4
3
70
65
2
60
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
55
100
14956-226
1k
3.5
0.8
3.0
0.7
2.5
VDD HIGH-Z ENABLED
VDD HIGH-Z DISABLED
REF HIGH-Z ENABLED
REF HIGH-Z DISABLED
VIO HIGH-Z ENABLED
VIO HIGH-Z DISABLED
1.5
1.0
0.5
2MSPS
1MSPS
500kSPS
0.6
0.5
0.4
0.3
0.2
0
20
40
60
80
100
120
0
2.4
3.0
3.3
3.6
3.9
4.2
4.5
4.8
5.1
REFERENCE VOLTAGE (V)
Figure 33. Reference Current vs. Reference Voltage
Figure 30. Operating Current vs. Temperature, AD4004, 1 MSPS
100k
2.0
1.8
10k
1.6
POWER DISSIPATION (µW)
OPERATING CURRENT (mA)
2.7
14956-219
–20
TEMPERATURE (°C)
1.4
1.2
VDD HIGH-Z ENABLED
VDD HIGH-Z DISABLED
REF HIGH-Z ENABLED
REF HIGH-Z DISABLED
VIO HIGH-Z ENABLED
VIO HIGH-Z DISABLED
1.0
0.8
0.6
VDD
VIO
REF
TOTAL POWER
1k
100
10
1
0.4
POWER DISSIPATION
MEASUREMENTS APPLY TO
EACH PRODUCT OVER ITS
SPECIFIED THROUGHPUT RANGE.
0.1
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
14956-325
0.2
0
–40
1M
0.1
14956-232
0
–40
100k
Figure 32. PSRR vs. Frequency
REFERENCE CURRENT (mA)
OPERATING CURRENT (mA)
Figure 29. Operating Current vs. Temperature, AD4000, 2 MSPS
2.0
10k
FREQUENCY (Hz)
0.01
10
100
1k
10k
100k
THROUGHPUT (SPS)
Figure 34. Power Dissipation vs. Throughput
Figure 31. Operating Current vs. Temperature, AD4008, 500 kSPS
Rev. E | Page 16 of 40
1M 2M
14956-227
0
–40
14956-230
1
Data Sheet
AD4000/AD4004/AD4008
12
23
11
VIO = 5.0V
VIO = 3.3V
VIO = 1.8V
21
19
9
8
17
tDSDO (ns)
7
6
5
4
15
13
11
3
9
2
0
–40
–20
0
20
40
60
80
100
TEMPERATURE (°C)
120
Figure 35. Standby Current vs. Temperature
5
0
20
40
60
80
100
120
140
160
180
LOAD CAPACITANCE (pF)
Figure 36. tDSDO vs. Load Capacitance
Rev. E | Page 17 of 40
200
220
14956-228
7
1
14956-224
STANDBY CURRENT (µA)
10
AD4000/AD4004/AD4008
Data Sheet
TERMINOLOGY
Integral Nonlinearity Error (INL)
INL is the deviation of each individual code from a line drawn
from negative full scale through positive full scale. The point
used as negative full scale occurs ½ LSB before the first code
transition. Positive full scale is defined as a level 1½ LSB beyond
the last code transition. The deviation is measured from the
middle of each code to the true straight line (see Figure 38).
Differential Nonlinearity Error (DNL)
In an ideal ADC, code transitions are 1 LSB apart. DNL is the
maximum deviation from this ideal value. It is often specified in
terms of resolution for which no missing codes are guaranteed.
Zero Error
Zero error is the difference between the ideal voltage that results
in the first code transition (½ LSB above analog ground) and
the actual voltage producing that code.
Gain Error
The first transition (from 100 ... 00 to 100 ... 01) occurs at a level
½ LSB above nominal negative full scale (−4.999981 V for the
±5 V range). The last transition (from 011 … 10 to 011 … 11)
occurs for an analog voltage 1½ LSB below the nominal full
scale (+4.999943 V for the ±5 V range). The gain error is the
deviation of the difference between the actual level of the last
transition and the actual level of the first transition from the
difference between the ideal levels.
Spurious-Free Dynamic Range (SFDR)
SFDR is the difference, in decibels (dB), between the rms
amplitude of the input signal and the peak spurious signal.
Effective Number of Bits (ENOB)
ENOB is a measurement of the resolution with a sine wave
input. It is related to SINAD as follows:
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first five harmonic
components to the rms value of a full-scale input signal and
is expressed in decibels.
Dynamic Range
Dynamic range is the ratio of the rms value of the full scale to
the total rms noise measured. The value for dynamic range is
expressed in decibels. It is measured with a signal at −60 dBFS
so that it includes all noise sources and DNL artifacts.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the actual input signal to the
rms sum of all other spectral components below the Nyquist
frequency, excluding harmonics and dc. The value for SNR is
expressed in decibels.
Signal-to-Noise-and-Distortion Ratio (SINAD)
SINAD is the ratio of the rms value of the actual input signal to
the rms sum of all other spectral components that are less than
the Nyquist frequency, including harmonics but excluding dc.
The value of SINAD is expressed in decibels.
Aperture Delay
Aperture delay is the measure of the acquisition performance
and is the time between the rising edge of the CNV input and
when the input signal is held for a conversion.
Transient Response
Transient response is the time required for the ADC to acquire a
full-scale input step to ±0.5 LSB accuracy.
Power Supply Rejection Ratio (PSRR)
PSRR is the ratio of the power in the ADC output at the frequency,
f, to the power of a 200 mV p-p sine wave applied to the ADC
VDD supply of frequency, f.
ENOB = (SINAD − 1.76)/6.02
ENOB is expressed in bits and SINAD is expressed in dB.
PSRR (dB) = 10 log(PVDD_IN/PADC_OUT)
where:
PVDD_IN is the power at the frequency, f, at the VDD pin.
PADC_OUT is the power at the frequency, f, in the ADC output.
Rev. E | Page 18 of 40
Data Sheet
AD4000/AD4004/AD4008
THEORY OF OPERATION
IN+
SWITCHES CONTROL
MSB
REF
GND
32,768C
LSB
16,384C
4C
2C
C
SW+
C
BUSY
COMP
32,768C
16,384C
4C
2C
MSB
C
CONTROL
LOGIC
C
LSB
OUTPUT CODE
SW–
14956-006
CNV
IN–
Figure 37. ADC Simplified Schematic
CIRCUIT INFORMATION
The AD4000/AD4004/AD4008 are high speed, low power, singlesupply, precise, 16-bit pseudo differential ADCs based on a SAR
architecture.
The AD4000 is capable of converting 2,000,000 samples per
second (2 MSPS), the AD4004 is capable of converting
1,000,000 samples per second (1 MSPS), and the AD4008 is
capable of converting 500,000 samples per second (500 kSPS).
The power consumption of the AD4000/AD4004/AD4008
scales with throughput because they power down in between
conversions. For example, when operating at 10 kSPS, the devices
typically consume 70 μW, making them ideal for batterypowered applications. The AD4000/AD4004/AD4008 also
have a valid first conversion after being powered down for
long periods, which can further reduce power consumed in
applications in which the ADC does not need to be constantly
converting.
The AD4000/AD4004/AD4008 provide the user with an on-chip
track-and-hold and do not exhibit any pipeline delay or latency,
making them ideal for multiplexed applications.
The AD4000/AD4004/AD4008 incorporate a multitude of unique
easy to use features that result in a lower system power and
smaller footprint.
The AD4000/AD4004/AD4008 each have an internal voltage
clamp that protects the device from overvoltage damage on the
analog inputs.
The analog input incorporates circuitry that reduces the nonlinear
charge kickback seen from a typical switched capacitor SAR
input. This reduction in kickback, combined with a longer
acquisition phase allows the use of lower bandwidth and lower
power amplifiers as drivers. This combination has the additional
benefit of allowing a larger resistor value in the input RC filter
and a corresponding smaller capacitor, which results in a smaller
RC load for the amplifier, improving stability and power
dissipation.
High-Z mode can be enabled via the SPI interface by programming
a register bit (see Table 12). When high-Z mode is enabled,
the ADC input has a low input charging current at low input
signal frequencies as well as improved distortion over a wide
frequency range up to 100 kHz. For frequencies greater than
100 kHz and multiplexing functionality, disable high-Z mode.
For single-supply applications, a span compression feature
creates additional headroom and footroom for the driving
amplifier to access the full range of the ADC.
The fast conversion time of the AD4000/AD4004/AD4008,
along with turbo mode, allows low clock rates to read back
conversions, even when running at their respective maximum
throughput rates. Note that, for the AD4000, the full throughput
rate of 2 MSPS can be achieved only with turbo mode enabled.
The AD4000/AD4004/AD4008 can interface with any 1.8 V to
5 V digital logic family. These devices are available in a 10-lead
MSOP or a tiny 10-lead LFCSP that allows space savings and
flexible configurations.
The AD4000/AD4004/AD4008 are pin for pin compatible with
some of the 14-/16-/18-/20-bit precision SAR ADCs listed in
Table 8.
Table 8. MSOP and LFCSP 14-/16-/18-/20-Bit Precision SAR
ADCs
Bits 100 kSPS
201 Not
applicable
1
18 AD7989-12
250 kSPS
Not
applicable
AD76912
183
161
Rev. E | Page 19 of 40
400 kSPS to
500 kSPS
AD40222
AD40112,
AD76902,
AD7989-52
AD40102
AD7684
AD76872
AD76882,
AD76932,
AD79162
≥1000 kSPS
AD40202,
AD40212
AD40032,
AD40072,
AD79822,
AD79842
AD40022,
AD40062
AD40012,
AD40052,
AD79152
AD4000/AD4004/AD4008
Bits 100 kSPS
163 AD7680,
AD7683,
AD7988-12
250 kSPS
AD76852,
AD7694
400 kSPS to
500 kSPS
AD40082,
AD76862,
AD7988-52
143
AD79422
AD79462
AD7940
Data Sheet
≥1000 kSPS
AD40002,
AD40042,
AD79802,
AD79832
Not applicable
between GND and VREF, the comparator input varies by binary
weighted voltage steps (VREF/2, VREF/4, …, VREF/65,536). The
control logic toggles these switches, starting with the MSB, to
bring the comparator back into a balanced condition. After the
process completes, the control logic generates the ADC output
code and a busy signal indicator.
Because the AD4000, the AD4004, and the AD4008 have onboard conversion clocks, the serial clock, SCK, is not required
for the conversion process.
CONVERTER OPERATION
TRANSFER FUNCTIONS
The AD4000/AD4004/AD4008 are SAR-based ADCs using a
charge redistribution sampling digital-to-analog converter
(DAC). Figure 37 shows the simplified schematic of the ADC.
The capacitive DAC consists of two identical arrays of 16 binary
weighted capacitors, that are connected to the comparator inputs.
The ideal transfer characteristics for the AD4000/AD4004/AD4008
are shown in Figure 38 and Table 9.
When the acquisition phase is complete and the CNV input
goes high, a conversion phase initiates. When the conversion
phase begins, SW+ and SW− are opened first. The two capacitor
arrays are then disconnected from the inputs and connected to
the GND input. The differential voltage between the IN+ and
IN− inputs captured at the end of the acquisition phase is applied
to the comparator inputs, causing the comparator to become
unbalanced. By switching each element of the capacitor array
111...111
111...110
111...101
000...010
000...001
000...000
–FSR
–FSR + 1 LSB
–FSR + 0.5 LSB
+FSR – 1 LSB
+FSR – 1.5 LSB
ANALOG INPUT
14956-007
During the acquisition phase, terminals of the array tied to the
input of the comparator are connected to ground via the SW+
and SW− switches (see Figure 37). All independent switches
connect the other terminal of each capacitor to the analog
inputs. The capacitor arrays are used as sampling capacitors
and acquire the analog signal on the IN+ and IN− inputs.
ADC CODE (STRAIGHT BINARY)
True differential.
2
Pin for pin compatible.
3
Pseudo differential.
1
Figure 38. ADC Ideal Transfer Function (FSR Is Full-Scale Range)
Table 9. Output Codes and Ideal Input Voltages
Description
FSR − 1 LSB
Midscale + 1 LSB
Midscale
Midscale − 1 LSB
−FSR + 1 LSB
−FSR
Analog Input, VREF = 5 V
4.999924 V
2.500076 V
2.5 V
2.499924 V
76.3 μV
0V
VREF = 5 V with Span Compression Enabled (V)
4.499939
2.500061
2.5
2.499939
0.50006103
0.5
1
Digital Output Code
0xFFFF1
0x8001
0x8000
0x7FFF
0x0001
0x00002
This output code is also the code for an overranged analog input (VIN+ − VIN− above VREF with span compression disabled and above 0.9 × VREF with span compression
enabled).
2
This output code is also the code for an underranged analog input (VIN+ − VIN− below 0 V with span compression disabled and below 0.1 × VREF with span compression
enabled).
Rev. E | Page 20 of 40
Data Sheet
AD4000/AD4004/AD4008
APPLICATIONS INFORMATION
Figure 40 shows a recommended connection diagram when
using a single-supply system. This setup is preferable when only
a limited number of rails are available in the system and power
dissipation is of critical importance.
TYPICAL APPLICATION DIAGRAMS
Figure 39 shows an example of the recommended connection
diagram for the AD4000/AD4004/AD4008 when multiple
supplies, V+ and V−, are available. This configuration is used
for optimal performance because the amplifier supplies can be
selected to allow the maximum signal range (see Figure 39 for
the range).
V+ ≥ +6.5V
REF1
LDO
1.8V
AMP
VCM = VREF /2
5V
10kΩ
100nF
10kΩ
VREF
VCM = VREF /2
100nF
1.8V TO 5V
HOST
SUPPLY
10µF
V+
R
AMP
REF
C
0V
V–
VDD
VIO
SDI
IN+
AD4000/
AD4004/
AD4008
SCK
DIGITAL HOST
(MICROPROCESSOR/
FPGA)
SDO
IN–
CNV
GND
14956-008
3-WIRE/4-WIRE
INTERFACE
V– ≤ –0.5V
Figure 39. Typical Application Diagram with Multiple Supplies
V+ = 5V
REF1
LDO
AMP
VCM = VREF /2
10kΩ
0.9 × VREF
VCM = VREF/2
0.1 × VREF
AMP
1.8V
4.096V
10kΩ
100nF
100nF
1.8V TO 5V
HOST
SUPPLY
10µF1
R
REF
C
VDD
VIO
SDI
IN+
AD4000/
AD4004/
AD40082
3
IN–
GND
SCK
SDO
DIGITAL HOST
(MICROPROCESSOR/
FPGA)
CNV
1SEE THE VOLTAGE REFERENCE INPUT SECTION FOR REFERENCE
2SPAN COMPRESSION MODE ENABLED.
3SEE TABLE 10 FOR RC FILTER AND AMPLIFIER SELECTION.
SELECTION. CREF IS USUALLY A 10µF CERAMIC CAPACITOR (X7R).
Figure 40. Typical Application Diagram with a Single Supply
Rev. E | Page 21 of 40
14956-009
3-WIRE/4-WIRE
INTERFACE
AD4000/AD4004/AD4008
Data Sheet
ANALOG INPUTS
Figure 41 shows an equivalent circuit of the analog input structure,
including the overvoltage clamp of the AD4000/AD4004/AD4008.
REF
D1
VIN
REXT
RIN CIN
IN+
CEXT
CPIN
D2
CLAMP
GND
14956-010
0V TO 15V
Figure 41. Equivalent Analog Input Circuit
Input Overvoltage Clamp Circuit
Most ADC analog inputs, IN+ and IN−, have no overvoltage
protection circuitry apart from ESD protection diodes. During
an overvoltage event, an ESD protection diode from an analog
input pin (IN+ or IN−) to REF forward biases and shorts the
input pin to REF, potentially overloading the reference or
damaging the device. The AD4000/AD4004/AD4008 internal
overvoltage clamp circuit, with a larger external resistor (REXT =
200 Ω), eliminates the need for external protection diodes and
protects the ADC inputs against dc overvoltages.
In applications where the amplifier rails are greater than VREF
and less than ground, it is possible for the output to exceed the
input voltage range (specified in Table 1) of the device. In this
case, the AD4000/AD4004/AD4008 internal overvoltage clamp
circuit ensures that the voltage on the input pin does not exceed
VREF + 0.4 V and prevents damage to the device by clamping the
input voltage in a safe operating range and avoiding disturbance
of the reference, which is particularly important for systems
that share the reference among multiple ADCs.
If the analog input exceeds the reference voltage by 0.4 V, the
internal clamp circuit turns on and the current flows through
the clamp into ground, preventing the input from rising further
and potentially causing damage to the device. The clamp turns
on before D1 (see Figure 41) and can sink up to 50 mA of current.
When the clamp is active, it sets the overvoltage (OV) clamp flag
bit in the configuration register that is accessed with a 16-bit
SPI read command or via the OV in the status bits. The OV
clamp flag gives an indication of overvoltage condition when it
is set to 0. The OV clamp flag is a read only sticky bit, and is
cleared only if the register is read while the overvoltage
condition is no longer present.
The clamp circuit does not dissipate static power in the off state.
Note that the clamp cannot sustain the overvoltage condition
for an indefinite amount of time.
The external RC filter, formed by the REXT resistor and the CEXT
capacitor (see Figure 41), is usually present at the ADC input
to band limit the input signal. During an overvoltage event,
excessive voltage is dropped across REXT, and REXT becomes part
of a protection circuit. The REXT value can vary from 200 Ω to
20 kΩ for 15 V protection. The CEXT value can be as low as 100 pF
for correct operation of the clamp. See Table 1 for input overvoltage
clamp specifications.
The analog input structure allows the sampling of the true
differential signal between IN+ and IN−. Signals common to
both inputs are rejected when using these differential inputs.
Ground potential differences between the sensor and the local
ADC ground are eliminated when using IN− to sense a remote
signal ground.
Switched Capacitor Input
During the acquisition phase, the impedance of the analog
inputs (IN+ or IN−) can be modeled as a parallel combination
of Capacitor CPIN and the network formed by the series connection
of RIN and CIN. CPIN is primarily the pin capacitance. RIN is typically
400 Ω and is a lumped component composed of serial resistors
and the on resistance of the switches. CIN is typically 40 pF and
is mainly the ADC sampling capacitor.
During the conversion phase, where the switches are open, the
input impedance is limited to CPIN. RIN and CIN make a singlepole, low-pass filter that reduces undesirable aliasing effects
and limits noise.
RC Filter Values
The RC filter value (represented by R and C in Figure 39 and
Figure 40) and driving amplifier can be selected depending on
the input signal bandwidth of interest at the full throughput.
Lower input signal bandwidth means that the RC cutoff can be
lower, thereby reducing noise into the converter. For optimum
performance at various throughputs, use the recommended RC
values (200 Ω, 180 pF) and the ADA4805-1.
The RC values shown in Table 10 are chosen for ease of drive
considerations and greater ADC input protection. The combination of a large R value (200 Ω) and small C value results in a
reduced dynamic load for the amplifier to drive. The smaller value
of C means fewer stability and phase margin concerns with the
amplifier. The large value of R limits the current into the ADC
input when the amplifier output exceeds the ADC input range.
Rev. E | Page 22 of 40
Data Sheet
AD4000/AD4004/AD4008
Table 10. RC Filter and Amplifier Selection for Various Input Bandwidths
Input Signal Bandwidth (kHz)