AD4011BCPZ-RL7

AD4011BCPZ-RL7

  • 厂商:

    AD(亚德诺)

  • 封装:

    VFDFN10

  • 描述:

    IC ADC 18BIT SAR 10LFCSP

  • 数据手册
  • 价格&库存
AD4011BCPZ-RL7 数据手册
18-Bit, 2 MSPS/1 MSPS/500 kSPS, Easy Drive, Differential SAR ADCs AD4003/AD4007/AD4011 Data Sheet FEATURES GENERAL DESCRIPTION Easy Drive Greatly reduced input kickback Input current reduced to 0.5 μA/MSPS Enhanced acquisition phase, ≥79% of cycle time at 1 MSPS First conversion accurate, no latency or pipeline delay Input span compression for single-supply operation Fast conversion allows low SPI clock rates Input overvoltage clamp protection sinks up to 50 mA SPI-/QSPI-/MICROWIRE-/DSP-compatible serial interface High performance Differential analog input range: ±VREF, VREF from 2.4 V to 5.1 V Throughput: 2 MSPS/1 MSPS/500 kSPS options INL: ±1.0 LSB (±3.8 ppm) maximum Guaranteed 18-bit, no missing codes SNR: 100.5 dB at fIN = 1 kHz, VREF = 5 V THD: −123 dB at fIN = 1 kHz, −100 dB at fIN = 100 kHz SINAD: 89 dB at fIN = 1 MHz (see Figure 17) Oversampled dynamic range 103.5 dB for OSR = 2 130.5 dB for OSR = 1024 Low power Single 1.8 V supply operation with 1.71 V to 5.5 V logic interface 2.4 mW at 500 kSPS (VDD only) 80 μW at 10 kSPS, 16 mW at 2 MSPS (total power) 10-lead packages: 3 mm × 3 mm LFCSP, 3 mm × 4.90 mm MSOP Pin compatible with AD4000/AD4004/AD4008 family Guaranteed operation: −40°C to +125°C The AD4003/AD4007/AD4011 are high accuracy, high speed, low power, 18-bit, Easy Drive, precision successive approximation register (SAR) analog-to-digital converters (ADCs) that operate from a single power supply, VDD. The reference voltage, VREF, is applied externally and can be set independent of the supply voltage. The AD4003/AD4007/AD4011 power scales linearly with throughput. APPLICATIONS Automated test equipment Machine automation Medical equipment Battery-powered equipment Precision data acquisition systems Instrumentation and control systems INPUT CURRENT (μA) VDD TURBO MODE 18-BIT SAR ADC CLAMP SPAN COMPRESSION SERIAL INTERFACE STATUS BITS GND 3 0 –3 –6 –9 –12 –15 –5 Figure 1. Rev. D 6 –4 –3 –2 –1 0 1 2 3 4 INPUT DIFFERENTIAL VOLTAGE (V) 5 14957-443 IN– HIGH-Z MODE VIO 1.8V TO 5V SDI 3-WIRE OR SCK 4-WIRE SDO SPI INTERFACE (DAISY CHAIN, CS) CNV 14957-001 VREF VREF /2 0 IN+ HIGH-Z DISABLED, 2MSPS HIGH-Z ENABLED, 2MSPS 9 AD4003/ AD4007/ AD4011 VREF VREF/2 0 Fast device throughput up to 2 MSPS allows users to accurately capture high frequency signals and to implement oversampling techniques to alleviate the challenges associated with antialias filter designs. Decreased serial peripheral interface (SPI) clock rate requirements reduce digital input and output power consumption, broadens digital host options, and simplifies the task of sending data across digital isolation. The SPI-compatible serial user interface is compatible with 1.8 V, 2.5 V, 3 V, and 5 V logic by using the separate VIO logic supply. 12 1.8V REF Input span compression eliminates the need to provide a negative supply to the ADC driver amplifier while preserving access to the full ADC code range. The input overvoltage clamp protects the ADC inputs against overvoltage events, minimizing disturbances on the reference pin and eliminating the need for external protection diodes. 15 FUNCTIONAL BLOCK DIAGRAM 2.4V TO 5.1V 10µF Easy Drive features reduce both signal chain complexity and power consumption while enabling higher channel density. The reduced input current, particularly in high-Z mode, coupled with a long signal acquisition phase, eliminates the need for a dedicated ADC driver. Easy Drive broadens the range of companion circuitry that is capable of driving these ADCs (see Figure 2). Figure 2. Input Current vs. Input Differential Voltage Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2016–2021 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com AD4003/AD4007/AD4011 Data Sheet TABLE OF CONTENTS Features ............................................................................................... 1  Driver Amplifier Choice ........................................................... 23  Applications ........................................................................................ 1  Ease of Drive Features ............................................................... 24  Functional Block Diagram .............................................................. 1  Voltage Reference Input ............................................................ 25  General Description ......................................................................... 1  Power Supply............................................................................... 26  Revision History ............................................................................... 2  Digital Interface .......................................................................... 26  Specifications..................................................................................... 4  Register Read/Write Functionality........................................... 28  Timing Specifications .................................................................. 7  Status Bits .................................................................................... 30  Absolute Maximum Ratings............................................................ 9  CS Mode, 3-Wire Turbo Mode ................................................. 31  Thermal Resistance ...................................................................... 9  CS Mode, 3-Wire Without Busy Indicator ............................. 32  ESD Caution .................................................................................. 9  CS Mode, 3-Wire with Busy Indicator .................................... 33  Pin Configurations and Function Descriptions ......................... 10  CS Mode, 4-Wire Turbo Mode ................................................. 34  Typical Performance Characteristics ........................................... 11  CS Mode, 4-Wire Without Busy Indicator ............................. 35  Terminology .................................................................................... 17  Theory of Operation ...................................................................... 18  Circuit Information .................................................................... 18  Converter Operation .................................................................. 19  Transfer Functions...................................................................... 19  Applications Information .............................................................. 20  Typical Application Diagrams .................................................. 20  CS Mode, 4-Wire with Busy Indicator .................................... 36  Daisy-Chain Mode ..................................................................... 37  Layout Guidelines....................................................................... 38  Evaluating the AD4003/AD4007/AD4011 Performance ...... 38  Outline Dimensions ....................................................................... 39  Ordering Guide .......................................................................... 40  Analog Inputs .............................................................................. 21  REVISION HISTORY 2/2021—Rev. C to Rev. D Changes to Features Section, Applications Section, and General Description Section .......................................................................... 1 Changes to Specifications Section and Table 1 ............................. 4 Changes to Timing Specifications Section .................................... 7 Added Note 1 to Table 2; Renumbered Sequentially ................... 7 Added Note 1 to Table 3 .................................................................. 8 Deleted Figure 3; Renumbered Sequentially................................. 8 Changes to Thermal Resistance Section........................................ 9 Changes to Table 7 .......................................................................... 10 Changes to Typical Performance Characteristics Section......... 11 Changes to Terminology Section ................................................. 17 Changes to Circuit Information Section and Table 8 ................ 18 Changes to Typical Application Diagrams Section .................... 20 Changes to Input Overvoltage Clamp Circuit Section .............. 21 Change to Differential Input Considerations Section and Table 10 ............................................................................................ 22 Changes to Driver Amplifier Choice Section, Single to Differential Driver Section, and High Frequency Input Signals Section .............................................................................................. 23 Moved Figure 44 ............................................................................. 23 Changes to Multiplexed Applications Section and High-Z Mode Section.............................................................................................. 24 Changes to Figure 47, Figure 48, Long Acquisition Phase Section, and Voltage Reference Input Section ............................ 25 Deleted Table 12 and Table 14; Renumbered Sequentially .............. 26 Changes to Power Supply Section and Digital Interface Section.... 26 Added Configuration Register Details Section and Serial Clock Frequency Requirements Section ......................................................... 26 Added Table 12 and Table 13; Renumbered Sequentially ................ 27 Changes to Register Read/Write Functionality Section ................... 28 Changes to Figure 49 and Figure 50 ..................................................... 29 Changed Status Word Section to Status Bits Section ........................ 30 Changes to Status Bits Section, Table 15, and Figure 52 ................... 30 Changes to CS Mode, 3-Wire Turbo Mode Section, Figure 53, and Figure 54 Caption..................................................................................... 31 Changes to CS Mode, 3-Wire Without Busy Indicator Section, Figure 55, and Figure 56 Caption.......................................................... 32 Changes to CS Mode, 3-Wire with Busy Indicator Section, Figure 57, and Figure 58 ......................................................................... 33 Changes to CS Mode, 4-Wire Turbo Mode Section, Figure 59, and Figure 60 Caption..................................................................................... 34 Rev. D | Page 2 of 40 Data Sheet AD4003/AD4007/AD4011 Changes to CS Mode, 4-Wire Without Busy Indicator Section and Figure 62 Caption .................................................................................... 35 Changes to CS Mode, 4-Wire with Busy Indicator Section and Figure 64 .................................................................................................... 36 Changes to Daisy-Chain Mode Section and Figure 66 Caption..... 37 Changes to Layout Guide Section and Evaluating the AD4003/AD4007/AD4011 Performance Section ............................. 38 Updated Outline Dimensions ............................................................... 39 4/2019—Rev. B to Rev. C Added Figure 2; Renumbered Sequentially ................................... 1 Changes to Features Section and General Description Section ..... 1 10/2017—Rev. A to Rev. B Changes to Features and General Description .............................. 1 Moved Figure 1 .................................................................................. 1 Changes to Specifications Section and Table 1 ............................. 4 Changes to Endnote 1 and Endnote 2, Table 1 .............................. 6 Changes to Timing Specifications Section, CNV or SDI Low to SDO D17 (MSB) Valid Delay (CS Mode) Parameter, Table 2 .... 7 Changes to Endnote 3, Table 2 ........................................................ 7 Changes to Analog Input Parameter, Table 5 ................................ 9 Added Endnote 2, Table 5 ................................................................ 9 Changes to Figure 4 and Table 7 ...................................................10 Changes to Typical Performance Characteristics Section .........11 Reorganized Typical Performance Characteristics Section .......11 Changes to Figure 19 and Figure 19 Caption ..............................13 Changes to Figure 25 Caption through Figure 27 Caption and Changes to Figure 28 ......................................................................14 Changes to Circuit Information Section and Table 8 .................17 Changes to Converter Operations Section and Table 9 .............18 Changes to Endnote 1 and Endnote 2, Table 9 ............................18 Changes to Applications Information Section ............................19 Moves Figure 38; Renumbered Sequentially ...............................20 Change to Analog Input Section ...................................................20 Changes to Input Overvoltage Clamp Section................................... 21 Changes to High Frequency Input Signals Section, Multiplexed Applications Section, Driver Amplifier Choice Section, RC Filter Values Section, Figure 39, and Figure 40 Caption ............................. 22 Changes to High-Z Mode Section, Figure 42, Figure 43, and Figure 43 Caption ............................................................................23 Changes to Voltage Reference Input Section, Figure 44 Caption, Figure 45, Figure 46 Caption, and Figure 47 ...............................24 Changes to Digital Interface Section, Power Supply Section, and Figure 48 Caption ............................................................................25 Changes to Read/Write Functionality Section, Table 12, and Table 14 .............................................................................................26 Changes to Figure 49 ...................................................................... 27 Changes to Status Word Section and Table 15 ............................ 28 Changes to CS Mode, 4-Wire Turbo Mode Section ....................... 32 Changes to CS Mode, 4-Wire Without Busy Indicator Section......33 Changes to CS Mode, 4-Wire With Busy Indicator Section ..... 34 Change to Daisy-Chain Mode Section ......................................... 35 Changes to Evaluating the AD4003/AD4007/AD4011 Performance Section ....................................................................... 36 Changes to Ordering Guide ........................................................... 38 7/2017—Rev. 0 to Rev. A Added AD4007 and AD4011............................................ Universal Changes to Features Section and General Description................ 1 Moved Figure 1 .................................................................................. 3 Changes to Specifications Section .................................................. 4 Changes to Table 1 ............................................................................ 4 Changes to Timing Specifications Section .................................... 7 Changes to Table 2 ............................................................................ 7 Changes to Absolute Maximum Ratings Section ......................... 9 Added Endnote 2 and Endnote 3, Table 6 ..................................... 9 Changes to Typical Performance Characteristics Section ......... 11 Changes to Figure 11 and Figure 14 ............................................. 12 Changes to Figure 19 and Figure 21 ............................................. 13 Added Figure 25 and Figure 26; Renumbered Sequentially ...... 14 Moved Terminology Section ......................................................... 16 Changes to Terminology Section .................................................. 16 Changes to Circuit Information Section and Table 8 ................. 17 Moved Figure 38 .............................................................................. 22 Changes to High Frequency Input Signals Section .................... 22 Added Multiplexed Applications Section .................................... 22 Added Figure 41 .............................................................................. 23 Moved Figure 42 .............................................................................. 23 Changes to High-Z Mode Section and Figure 43 ....................... 23 Changes to Voltage Reference Input Section............................... 24 Changes to Figure 48, Digital Interface Section, and Table 11 ....... 25 Changes to CS Mode, 3-Wire Turbo Mode Section ................... 29 Added Figure 53 .............................................................................. 29 Changes to CS Mode, 4-Wire Turbo Mode Section ................... 32 Added Figure 59 .............................................................................. 32 Change to CS Mode, 4-Wire with Busy Signal Indicator Section .............................................................................................. 34 Changes to Layout Guidelines Section and Evaluating the AD4003/AD4007/AD4011 Performance Section ....................... 36 Updated Outline Dimensions........................................................ 37 Changes to Ordering Guide ........................................................... 38 10/2016—Revision 0: Initial Version Rev. D | Page 3 of 40 AD4003/AD4007/AD4011 Data Sheet SPECIFICATIONS VDD = 1.71 V to 1.89 V, VIO = 1.71 V to 5.5 V, REF = VREF = 5 V, all specifications TMIN to TMAX, high-Z mode disabled, span compression disabled, turbo mode enabled, and sampling frequency (fS) = 2 MSPS for the AD4003, fS = 1 MSPS for the AD4007, and fS = 500 kSPS for the AD4011, unless otherwise noted. Table 1. Parameter RESOLUTION ANALOG INPUT Voltage Range Operating Input Voltage Common-Mode Input Range Common-Mode Rejection Ratio (CMRR) Analog Input Current Test Conditions/Comments Min 18 IN+ voltage (VIN+) − IN− voltage (VIN−) Span compression enabled VIN+, VIN− to GND Span compression enabled −VREF −VREF × 0.8 −0.1 0.1 × VREF VREF/2 − 0.125 Input frequency (fIN) = 500 kHz Acquisition phase, T = 25°C High-Z mode enabled, converting dc input at 2 MSPS THROUGHPUT Complete Cycle AD4003 AD4007 AD4011 Conversion Time Acquisition Phase1 AD4003 AD4007 AD4011 Throughput Rate2 AD4003 AD4007 AD4011 Transient Response3 DC ACCURACY No Missing Codes Integral Nonlinearity Error (INL) Differential Nonlinearity Error (DNL) Transition Noise Zero Error Zero Error Drift4 Gain Error Gain Error Drift4 Power Supply Sensitivity 1/f Noise5 AC ACCURACY Dynamic Range Oversampled Dynamic Range 500 1000 2000 270 Typ VREF/2 68 0.3 1 290 Max Unit Bits +VREF +VREF × 0.8 VREF + 0.1 0.9 × VREF VREF/2 + 0.125 V V V V V dB nA μA 320 290 790 1790 ns ns ns 0 0 0 2 1 500 250 18 −1.0 −3.8 −0.75 ns ns ns ns MSPS MSPS kSPS ns VDD = 1.8 V ± 5% Bandwidth = 0.1 Hz to 10 Hz 1.5 6 Bits LSB ppm LSB LSB LSB ppm/°C LSB ppm/°C LSB μV p-p Oversampling ratio (OSR) = 2 OSR = 256 OSR = 1024 101 104 125 131 31.5 dB dB dB dB μV rms −7 −0.21 −26 −1.23 Total RMS Noise Rev. D | Page 4 of 40 ±0.4 ±1.52 ±0.3 0.8 ±3 +1.0 +3.8 +0.75 +7 +0.21 +26 +1.23 Data Sheet Parameter fIN = 1 kHz, −0.5 dBFS, VREF = 5 V Signal-to-Noise Ratio (SNR) Spurious-Free Dynamic Range (SFDR) Total Harmonic Distortion (THD) Signal-to-Noise-and-Distortion Ratio (SINAD) fIN = 1 kHz, −0.5 dBFS, VREF = 2.5 V SNR SFDR THD SINAD fIN = 100 kHz, −0.5 dBFS, VREF = 5 V SNR THD SINAD fIN = 400 kHz, −0.5 dBFS, VREF = 5 V SNR THD SINAD −3 dB Input Bandwidth Aperture Delay Aperture Jitter REFERENCE VREF Voltage Range Current AD4003 AD4007 AD4011 INPUT OVERVOLTAGE CLAMP IN+/IN− Current, IIN+/IIN− VIN+/VIN− at Maximum IIN+/IIN− VIN+/VIN− Clamp On/Off Threshold Deactivation Time REF Current at Maximum IIN+/IIN− DIGITAL INPUTS Logic Levels Input Voltage, Low (VIL) Input Voltage, High (VIH) AD4003/AD4007/AD4011 Test Conditions/Comments Min Typ 99 100.5 122 −123 100 dB dB dB dB 94.5 122 −119 94 dB dB dB dB 99 −100 96.5 dB dB dB 91.5 −94 90 10 1 1 dB dB dB MHz ns ps rms 98.5 93.5 93 REF − GND 2.4 2 MSPS 1 MSPS 500 kSPS Max 5.1 1.1 0.5 0.26 VREF = 5 V VREF = 2.5 V VREF = 5 V VREF = 2.5 V VREF = 5 V VREF = 2.5 V 5.25 2.68 VIN+/VIN− > VREF VIO > 2.7 V VIO ≤ 2.7 V VIO > 2.7 V VIO ≤ 2.7 V Input Current, Low (IIL) Input Current, High (IIH) Input Pin Capacitance 6 Rev. D | Page 5 of 40 V mA mA mA 50 50 mA mA V V V V ns μA +0.3 × VIO +0.2 × VIO VIO + 0.3 VIO + 0.3 +1 +1 V V V V μA μA pF 5.4 3.1 5.4 2.8 360 100 −0.3 −0.3 0.7 × VIO 0.8 × VIO −1 −1 Unit AD4003/AD4007/AD4011 Data Sheet Parameter DIGITAL OUTPUTS Data Format Pipeline Delay Test Conditions/Comments Min Output Voltage, Low (VOL) Output Voltage, High (VOH) POWER SUPPLIES VDD VIO Standby Current Power Dissipation Output current = 500 μA Output current = −500 μA Serial 18 bits, twos complement Conversion results available immediately after completed conversion 0.4 VIO − 0.3 VDD Only REF Only VIO Only Energy per Conversion TEMPERATURE RANGE Specified Performance 1.71 1.71 VDD = 1.8 V, VIO = 1.8 V, T = 25°C VDD = 1.8 V, VIO = 1.8 V, VREF = 5 V 10 kSPS, high-Z mode disabled 500 kSPS, high-Z mode disabled 1 MSPS, high-Z mode disabled 2 MSPS, high-Z mode disabled 500 kSPS, high-Z mode enabled 1 MSPS, high-Z mode enabled 2 MSPS, high-Z mode enabled 500 kSPS, high-Z mode disabled 1 MSPS, high-Z mode disabled 2 MSPS, high-Z mode disabled 500 kSPS, high-Z mode disabled 1 MSPS, high-Z mode disabled 2 MSPS, high-Z mode disabled 500 kSPS, high-Z mode disabled 1 MSPS, high-Z mode disabled 2 MSPS, high-Z mode disabled Typ 1.8 Max 1.89 5.5 1.6 80 4 8 16 5 10 20 2.4 4.9 9.5 1.4 2.8 5.5 0.1 0.4 1.0 4.7 9.3 18.5 6.2 12.3 24.5 8 TMIN to TMAX −40 1 Unit V V V V μA μW mW mW mW mW mW mW mW mW mW mW mW mW mW mW mW nJ/sample +125 °C The acquisition phase is the time available for the input sampling capacitors to acquire a new input with the ADC running at a throughput rate of 2 MSPS for the AD4003, 1 MSPS for the AD4007, and 500 kSPS for the AD4011. 2 A throughput rate of 2 MSPS can only be achieved with turbo mode enabled and a minimum SCK frequency of 75 MHz. Refer to Table 4 for the maximum achievable throughput for different modes of operation. 3 Transient response is the time required for the ADC to acquire a full-scale input step to ±1 LSB accuracy. 4 The minimum and maximum values are guaranteed by characterization, but not production tested. 5 See the 1/f noise plot in Figure 25. Rev. D | Page 6 of 40 Data Sheet AD4003/AD4007/AD4011 TIMING SPECIFICATIONS VDD = 1.71 V to 1.89 V; VIO = 1.71 V to 5.5 V; VREF = 5 V; all specifications TMIN to TMAX, high-Z mode disabled, span compression disabled, turbo mode enabled, and fS = 2 MSPS for the AD4003, fS = 1 MSPS for the AD4007, and fS = 500 kSPS for the AD4011, unless otherwise noted. See Figure 49 to Figure 52, Figure 54, Figure 56, Figure 58, Figure 60, Figure 62, Figure 64, and Figure 66 for timing diagrams. Table 2. Digital Interface Timing Parameter1 CONVERSION TIME—CNV RISING EDGE TO DATA AVAILABLE ACQUISITION PHASE2 AD4003 AD4007 AD4011 TIME BETWEEN CONVERSIONS AD4003 AD4007 AD4011 CNV PULSE WIDTH (CS MODE)3 Symbol tCONV tACQ Min 270 Typ 290 Max 320 Unit ns 290 790 1790 ns ns ns 500 1000 2000 10 ns ns ns ns 9.8 12.3 ns ns 20 25 3 3 1.5 ns ns ns ns ns tCYC tCNVH SCK PERIOD (CS MODE)4 tSCK VIO > 2.7 V VIO > 1.7 V SCK PERIOD (DAISY-CHAIN MODE)5 VIO > 2.7 V VIO > 1.7 V SCK LOW TIME SCK HIGH TIME SCK FALLING EDGE TO DATA REMAINS VALID DELAY SCK FALLING EDGE TO DATA VALID DELAY VIO > 2.7 V VIO > 1.7 V CNV OR SDI LOW TO SDO D17 MOST SIGNIFICANT BIT (MSB) VALID DELAY (CS MODE) tSCK tSCKL tSCKH tHSDO tDSDO 7.5 10.5 ns ns 10 13 ns ns ns ns ns tEN VIO > 2.7 V VIO > 1.7 V CNV RISING EDGE TO FIRST SCK RISING EDGE DELAY LAST SCK FALLING EDGE TO CNV RISING EDGE DELAY6 CNV OR SDI HIGH OR LAST SCK FALLING EDGE TO SDO HIGH IMPEDANCE (CS MODE) tQUIET1 tQUIET2 tDIS 190 60 SDI VALID SETUP TIME FROM CNV RISING EDGE SDI VALID HOLD TIME FROM CNV RISING EDGE (CS MODE) tSSDICNV tHSDICNV 2 2 ns ns SCK VALID HOLD TIME FROM CNV RISING EDGE (DAISY-CHAIN MODE) SDI VALID SETUP TIME FROM SCK RISING EDGE (DAISY-CHAIN MODE) SDI VALID HOLD TIME FROM SCK RISING EDGE (DAISY-CHAIN MODE) tHSCKCNV tSSDISCK tHSDISCK 12 2 2 ns ns ns 1 20 Timing parameters measured with respect to a falling edge are defined as triggered at x% VIO. Timing parameters measured with respect to a rising edge are defined as triggered at y% VIO. For VIO ≤ 2.7 V, x = 80 and y = 20. For VIO > 2.7 V, x = 70 and y =30. The minimum VIH and maximum VIL are used. See the digital inputs specifications in Table 1. 2 The acquisition phase is the time available for the input sampling capacitors to acquire a new input with the ADC running at a throughput rate of 2 MSPS for the AD4003, 1 MSPS for the AD4007, and 500 kSPS for the AD4011. 3 For turbo mode, tCNVH must match the tQUIET1 minimum. 4 A throughput rate of 2 MSPS can only be achieved with turbo mode enabled and a minimum SCK rate of 75 MHz. Refer to Table 4 for the maximum achievable throughput for different modes of operation. 5 A 50% duty cycle is assumed for SCK. 6 See Figure 24 for SINAD vs. tQUIET2. Rev. D | Page 7 of 40 AD4003/AD4007/AD4011 Data Sheet Table 3. Register Read/Write Timing Parameter READ/WRITE OPERATION CNV Pulse Width2 SCK Period VIO > 2.7 V VIO > 1.7 V SCK Low Time SCK High Time READ OPERATION CNV Low to SDO D17 MSB Valid Delay VIO > 2.7 V VIO > 1.7 V SCK Falling Edge to Data Remains Valid SCK Falling Edge to Data Valid Delay VIO > 2.7 V VIO > 1.7 V CNV Rising Edge to SDO High Impedance WRITE OPERATION SDI Valid Setup Time from SCK Rising Edge SDI Valid Hold Time from SCK Rising Edge CNV Rising Edge to SCK Edge Hold Time CNV Falling Edge to SCK Active Edge Setup Time 1 2 Symbol1 Min tCNVH tSCK 10 ns 9.8 12.3 3 3 ns ns ns ns tSCKL tSCKH Typ Max Unit tEN tHSDO tDSDO ns ns ns 7.5 10.5 20 ns ns ns 1.5 tDIS tSSDISCK tHSDISCK tHCNVSCK tSCNVSCK 10 13 2 2 0 6 ns ns ns ns See Figure 49 to Figure 52, Figure 54, Figure 56, Figure 58, Figure 60, Figure 62, Figure 64, and Figure 66. For turbo mode, tCNVH must match the tQUIET1 minimum. Table 4. Achievable Throughput for Different Modes of Operation Parameter Test Conditions/Comments Min Typ Max Unit 2 2 2 1.78 1.75 1.62 1.59 1.44 MSPS MSPS MSPS MSPS MSPS MSPS MSPS MSPS THROUGHPUT, CS MODE 3-Wire and 4-Wire Turbo Mode 3-Wire and 4-Wire Turbo Mode and Six Status Bits 3-Wire and 4-Wire Mode 3-Wire and 4-Wire Mode and Six Status Bits fSCK = 100 MHz, VIO ≥ 2.7 V fSCK = 80 MHz, VIO < 2.7 V fSCK = 100 MHz, VIO ≥ 2.7 V fSCK = 80 MHz, VIO < 2.7 V fSCK = 100 MHz, VIO ≥ 2.7 V fSCK = 80 MHz, VIO < 2.7 V fSCK = 100 MHz, VIO ≥ 2.7 V fSCK = 80 MHz, VIO < 2.7 V Rev. D | Page 8 of 40 Data Sheet AD4003/AD4007/AD4011 ABSOLUTE MAXIMUM RATINGS Note that the input overvoltage clamp cannot sustain the overvoltage condition for an indefinite amount of time. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. Table 5. Parameter Analog Inputs IN+, IN− to GND1 Supply Voltage REF, VIO to GND VDD to GND VDD to VIO Digital Inputs to GND Digital Outputs to GND Storage Temperature Range Junction Temperature Lead Temperature Soldering Electrostatic Discharge (ESD) Ratings Human Body Model (HBM) Machine Model Field Induced Charged Device Model 1 2 Rating −0.3 V to VREF + 0.4 V or ± 130 mA2 −0.3 V to +6.0 V −0.3 V to +2.1 V −6 V to +2.4 V −0.3 V to VIO + 0.3 V −0.3 V to VIO + 0.3 V −65°C to +150°C 150°C 260°C reflow as per JEDEC J-STD-020 θJA is the natural convection, junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. θJC is the junction to case thermal resistance. Table 6. Thermal Resistance Package Type1 RM-10 CP-10-9 1 θJA 147 114 θJC 38 33 Unit °C/W °C/W Test Condition 1: thermal impedance simulated values are based upon use of 2S2P JEDEC PCB. See the Ordering Guide. ESD CAUTION 4 kV 200 V 1.25 kV See the Analog Inputs section for an explanation of IN+ and IN−. Current condition tested over a 10 ms time interval. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. D | Page 9 of 40 AD4003/AD4007/AD4011 Data Sheet PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS REF 1 IN+ 3 IN– 4 VDD 2 IN+ 3 IN– 4 GND 5 AD4003/ AD4007 TOP VIEW (Not to Scale) 10 VIO 9 SDI 8 SCK 7 SDO 6 CNV GND 5 TOP VIEW (Not to Scale) 9 SDI 8 SCK 7 SDO 6 CNV NOTES 1. CONNECT THE EXPOSED PAD TO GND. THIS CONNECTION IS NOT REQUIRED TO MEET THE SPECIFIED PERFORMANCE. 14957-003 REF 1 10 VIO AD4003/ AD4007/ AD4011 Figure 3. 10-Lead MSOP Pin Configuration 14957-004 VDD 2 Figure 4. 10-Lead LFCSP Pin Configuration Table 7. Pin Function Descriptions Pin No. 1 Mnemonic REF Type1 AI 2 3 4 5 6 VDD IN+ IN− GND CNV P AI AI P DI 7 SDO DO 8 9 SCK SDI DI DI 10 VIO P N/A2 EPAD P 1 2 Description Reference Input Voltage. The VREF range is 2.4 V to 5.1 V. This pin is referred to the GND pin and must be decoupled closely to the GND pin with a 10 μF X7R ceramic capacitor. 1.8 V Power Supply. The VDD range is 1.71 V to 1.89 V. Bypass VDD to GND with a 0.1 μF ceramic capacitor. Differential Positive Analog Input. See the Differential Input Considerations section. Differential Negative Analog Input. See the Differential Input Considerations section. Power Supply Ground. Connect to the ground plane of the board. Convert Input. This input has multiple functions. On its leading edge, the input initiates the conversions and selects the interface mode of the device, which is either daisy-chain mode or CS mode. In CS mode, the SDO pin is enabled when CNV is low. In daisy-chain mode, the data is read when CNV is high. Serial Data Output. The conversion result is output on the SDO pin. It is synchronized to the SCK signal on the SCK pin. Serial Data Clock Input. When the device is selected, the conversion result is shifted out by this clock. Serial Data Input. This input provides multiple features and selects the interface mode of the ADC as follows: Daisy-chain mode is selected if SDI is low during the CNV rising edge. In this mode, SDI is used as a data input to daisy-chain the conversion results of two or more ADCs onto a single SDO line. The digital data level on SDI is output on SDO with a delay of 18 SCK cycles. CS mode is selected if SDI is high during the CNV rising edge. In this mode, either SDI or CNV can enable the serial output signals when low. If SDI or CNV is low when the conversion is complete, the busy indicator feature is enabled. With CNV low, program the device by clocking in a 16-bit word on SDI on the rising edge of SCK. Input/Output Interface Digital Power. Nominally, this pin is at the same supply as the host interface (1.8 V, 2.5 V, 3 V, or 5 V). Bypass VIO to GND with a 0.1 μF ceramic capacitor. Exposed Pad. Connect the exposed pad to GND. This connection is not required to meet the specified performance. Note that the exposed pad only applies to the LFCSP. AI is analog input, P is power, DI is digital input, and DO is digital output. N/A means not applicable. Rev. D | Page 10 of 40 Data Sheet AD4003/AD4007/AD4011 TYPICAL PERFORMANCE CHARACTERISTICS VDD = 1.8 V, VIO = 3.3 V, VREF = 5 V, T = 25°C, high-Z mode disabled, span compression disabled, turbo mode enabled, and fS = 2 MSPS for the AD4003, fS = 1 MSPS for the AD4007, and fS = 500 kSPS for the AD4011, unless otherwise noted. 1.0 0.4 0.8 +125°C +25°C –40°C 0.6 +125°C +25°C –40°C 0.3 0.2 0.2 DNL (LSB) INL (LSB) 0.4 0 –0.2 –0.4 0.1 0 –0.1 –0.2 –0.6 0 32768 65536 98304 131072 163840 196608 229376 262144 CODE –0.4 14957-200 –1.0 Figure 5. INL vs. Code for Various Temperatures, VREF = 5 V 0 32768 65536 98304 131072 163840 196608 229376 262144 CODE 14957-203 –0.3 –0.8 Figure 8. DNL vs. Code for Various Temperatures, VREF = 5 V 1.0 0.4 0.8 +125°C +25°C –40°C 0.6 0.3 0.2 0.2 DNL (LSB) INL (LSB) 0.4 0 –0.2 0.1 0 –0.1 –0.4 –0.2 –0.6 32768 65536 98304 131072 163840 196608 229376 262144 CODE –0.4 0 32768 65536 98304 131072 163840 196608 229376 262144 CODE Figure 9. DNL vs. Code for Various Temperatures, VREF = 2.5 V Figure 6. INL vs. Code for Various Temperatures, VREF = 2.5 V 1.8 0.8 1.7 0.6 +125°C +25°C –40°C 1.6 TRANSITION NOISE (LSB) 0.4 0 –0.2 –0.4 1.5 1.4 1.3 1.2 1.1 1.0 –0.6 0.9 HIGH-Z ENABLED SPAN COMPRESSION ENABLED 32768 65536 98304 131072 163840 196608 229376 262144 CODE 0.8 2.5 14957-202 0 Figure 7. INL vs. Code for High-Z and Span Compression Modes Enabled, VREF = 5 V 3.0 3.5 4.0 REFERENCE VOLTAGE (V) 4.5 5.0 14957-206 INL (LSB) 0.2 –0.8 14957-204 0 14957-201 –1.0 +125°C +25°C –40°C –0.3 –0.8 Figure 10. Transition Noise vs. Reference Voltage for Various Temperatures Rev. D | Page 11 of 40 AD4003/AD4007/AD4011 Data Sheet 4.5M 3.0M 3.0M 2.5M 2.0M 2.0M 1.0M 1.0M 0.5M 0.5M 0 0 14957-205 1.5M 131078 131079 131080 131081 1.5M CODE Figure 11. Histogram of a DC Input at Code Center, VREF = 2.5 V and VREF = 5 V CODE Figure 14. Histogram of a DC Input at Code Transition, VREF = 2.5 V and VREF = 5 V 0 0 VREF = 5V SNR = 100.33dB THD = –123.99dB SINAD = 100.31dB –40 –60 –80 –100 –120 –140 –40 –60 –80 –100 –120 –140 –160 10k 100k 1M FREQUENCY (Hz) –180 100 14957-207 1k 1M 0 VREF = 5V SNR = 98.37dB THD = –98.52dB SINAD = 95.58dB FUNDAMENTAL AMPLITUDE (dB) –20 –60 –80 –100 –120 –140 –40 VREF = 5V SNR = 91.22dB THD = –91.97dB SINAD = 89.15dB –60 –80 –100 –120 –140 –160 10k 100k FREQUENCY (Hz) 1M Figure 13. 100 kHz, −0.5 dBFS Input Tone FFT –180 1k 10k 100k FREQUENCY (Hz) Figure 16. 400 kHz, −0.5 dBFS Input Tone FFT Rev. D | Page 12 of 40 1M 14957-213 –160 14957-210 FUNDAMENTAL AMPLITUDE (dB) 100k Figure 15. 1 kHz, −0.5 dBFS Input Tone FFT, VREF = 2.5 V 0 –180 1k 10k FREQUENCY (Hz) Figure 12. 1 kHz, −0.5 dBFS Input Tone Fast Fourier Transform (FFT), VREF = 5 V –40 1k 14957-209 –160 –20 VREF = 2.5V SNR = 95.01dB THD = –118.60dB SINAD = 94.99dB –20 FUNDAMENTAL AMPLITUDE (dB) –20 FUNDAMENTAL AMPLITUDE (dB) 2.5M 131062 131063 131064 131065 131066 131067 131068 131069 131070 131071 131072 131073 131074 131075 131076 131077 CODE COUNT 3.5M –180 100 VREF = 2.5V VREF = 5V 4.0M 3.5M 131062 131063 131064 131065 131066 131067 131068 131069 131070 131071 131072 131073 131074 131075 131076 131077 CODE COUNT 4.0M 14957-208 VREF = 2.5V VREF = 5V 131078 131079 131080 131081 4.5M Data Sheet AD4003/AD4007/AD4011 102 100 17.0 –90 120 16.5 –95 115 16.0 –100 110 –105 105 15.0 –110 100 14.5 –115 SFDR (dB) 15.5 94 THD (dB) 96 ENOB (Bits) SNR, SINAD (dB) 98 92 ENOB SINAD SNR –120 1k INPUT FREQUENCY (Hz) Figure 20. THD and SFDR vs. Input Frequency Figure 17. SNR, SINAD, and Effective Number of Bits (ENOB) vs. Input Frequency 16.6 101 16.4 16.2 –116 132 98 16.0 97 130 –122 129 –124 15.8 128 –126 96 15.6 ENOB SINAD SNR 2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 15.4 5.1 –130 2.4 REFERENCE VOLTAGE (V) 3.3 3.6 3.9 4.2 4.5 4.8 126 5.1 –114.0 16.40 ENOB SINAD SNR 3.0 REFERENCE VOLTAGE (V) 16.42 100.6 2.7 127 Figure 21. THD and SFDR vs. Reference Voltage, fIN = 1 kHz Figure 18. SNR, SINAD, and ENOB vs. Reference Voltage, fIN = 1 kHz 100.8 SFDR THD –128 14957-219 95 118.0 THD SFDR –114.5 117.9 117.8 16.38 100.4 –115.0 100.2 16.32 100.0 16.30 THD (dB) 16.34 ENOB (Bits) 16.36 16.28 99.8 117.7 117.6 –115.5 117.5 –116.0 117.4 117.3 –116.5 117.2 16.26 99.6 99.4 –40 –117.0 16.24 –20 0 20 40 60 80 100 120 16.22 TEMPERATURE (°C) 14957-222 SNR, SINAD (dB) 131 –120 THD (dB) 99 ENOB (Bits) SNR, SINAD (dB) 133 –118 100 94 2.4 –114 –117.5 –40 117.1 –20 0 20 40 60 80 100 120 TEMPERATURE (°C) Figure 22. THD and SFDR vs. Temperature, fIN = 1 kHz Figure 19. SNR, SINAD, and ENOB vs. Temperature, fIN = 1 kHz Rev. D | Page 13 of 40 117.0 14957-225 102 90 1M 100k 14957-216 INPUT FREQUENCY (Hz) 10k 14957-214 14.0 1M 100k SFDR (dB) 10k SFDR (dB) 88 1k 95 THD SFDR 14957-211 90 AD4003/AD4007/AD4011 130 –90 –95 120 –100 THD (dB) 125 115 –110 105 –115 100 –120 95 –125 1 2 4 8 16 32 64 128 256 512 1024 DECIMATION RATE 1 10 20 10 98 97 0 10 20 30 40 50 60 70 80 tQUIET2 (ns) 4 2 0 –2 –4 –6 –8 –10 –40 14957-215 VIO = 1.89V VIO = 3.6V VIO = 5.5V PFS GAIN ERROR NFS GAIN ERROR ZERO ERROR 6 –20 0 20 40 60 80 100 120 TEMPERATURE (°C) Figure 27. Zero Error and Gain Error vs. Temperature (PFS Is Positive Full Scale and NFS Is Negative Full Scale ) Figure 24. SINAD vs. tQUIET2 15 60 12 ANALOG INPUT CURRENT (μA) 59 58 57 56 55 9 HIGH-Z HIGH-Z HIGH-Z HIGH-Z HIGH-Z HIGH-Z DISABLED, 2MSPS DISABLED, 1MSPS DISABLED, 500kSPS ENABLED, 2MSPS ENABLED, 1MSPS ENABLED, 500kSPS 6 3 0 –3 –6 –9 1 2 3 4 5 6 7 8 9 TIME (Seconds) 10 –15 –5 –4 –3 –2 –1 0 1 2 3 4 5 INPUT DIFFERENTIAL VOLTAGE (V) Figure 28. Analog Input Current vs. Input Differential Voltage Figure 25. 1/f Noise for 0.1 Hz to 10 Hz Bandwidth, 50 kSPS, 2500 Samples Averaged per Reading Rev. D | Page 14 of 40 14957-343 0 14957-217 –12 54 14957-221 99 96 8 ZERO ERROR AND GAIN ERROR (LSB) 100 ADC OUTPUT READING (µV) 150Ω HIGH-Z DISABLED 150Ω HIGH-Z ENABLED Figure 26. THD vs. Input Frequency for Various Source Impedances 101 95 1kΩ HIGH-Z DISABLED 1kΩ HIGH-Z ENABLED 510Ω HIGH-Z DISABLED 510Ω HIGH-Z ENABLED INPUT FREQUENCY (KHz) Figure 23. SNR vs. Decimation Rate for Various Input Frequencies, 2 MSPS SINAD (dB) –105 110 14957-212 SNR (dB) –85 DYNAMIC RANGE fIN = 1kHz fIN = 10kHz 14957-228 135 Data Sheet Data Sheet AD4003/AD4007/AD4011 8 72 OPERATING CURRENT (mA) 7 71 6 70 CMRR (dB) 5 VDD HIGH-Z DISABLED VDD HIGH-Z ENABLED REF HIGH-Z DISABLED REF HIGH-Z ENABLED VIO HIGH-Z DISABLED VIO HIGH-Z ENABLED 4 3 69 68 2 –20 0 20 40 60 80 100 120 TEMPERATURE (°C) 66 100 14957-223 0 –40 1k 10k 100k 1M FREQUENCY (Hz) Figure 29. Operating Current vs. Temperature, AD4003, 2 MSPS 14957-303 67 1 Figure 32. CMRR vs. Frequency 4.5 80 4.0 3.0 70 PSRR (dB) 2.5 1.5 1.0 VDD HIGH-Z ENABLED VDD HIGH-Z DISABLED REF HIGH-Z ENABLED REF HIGH-Z DISABLED VIO HIGH-Z ENABLED VIO HIGH-Z DISABLED 60 55 0.5 –20 0 20 40 60 80 100 120 TEMPERATURE (°C) 50 100 14957-326 0 –40 65 1k Figure 30. Operating Current vs. Temperature, AD4007, 1 MSPS REFERENCE CURRENT (mA) 1.5 0 –40 1M 2MSPS 1MSPS 500kSPS 1.0 VDD HIGH-Z ENABLED VDD HIGH-Z DISABLED REF HIGH-Z ENABLED REF HIGH-Z DISABLED VIO HIGH-Z ENABLED VIO HIGH-Z DISABLED 0.8 0.6 0.4 0.2 –20 0 20 40 60 80 100 120 TEMPERATURE (°C) 14957-325 OPERATING CURRENT (mA) 1.2 2.0 0.5 100k Figure 33. PSRR vs. Frequency 2.5 1.0 10k FREQUENCY (Hz) 14957-302 2.0 Figure 31. Operating Current vs. Temperature, AD4011, 500 kSPS 0 2.4 2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 REFERENCE VOLTAGE (V) Figure 34. Reference Current vs. Reference Voltages Rev. D | Page 15 of 40 5.1 14957-218 OPERATING CURRENT (mA) 75 3.5 AD4003/AD4007/AD4011 100k 23 VDD VIO REF TOTAL POWER 21 1k tDSDO (ns) 17 100 10 15 13 11 1 9 POWER DISSIPATION MEASUREMENTS APPLY TO EACH PRODUCT OVER ITS SPECIFIED THROUGHPUT RANGE. 0.01 10 100 1k 10k 100k 1M 2M THROUGHPUT (SPS) 7 25.0 22.5 20.0 17.5 15.0 12.5 10.0 7.5 5.0 0 20 40 60 80 100 TEMPERATURE (°C) 120 14957-226 2.5 –20 0 20 40 60 80 100 120 140 160 LOAD CAPACITANCE (pF) Figure 37. tDSDO vs. Load Capacitance Figure 35. Power Dissipation vs. Throughput, VIO = 1.8 V 0 –40 5 Figure 36. Standby Current vs. Temperature Rev. D | Page 16 of 40 180 200 220 14957-224 0.1 STANDBY CURRENT (µA) VIO = 5V VIO = 3.3V VIO = 1.8V 19 14957-220 POWER DISSIPATION (µW) 10k Data Sheet Data Sheet AD4003/AD4007/AD4011 TERMINOLOGY Integral Nonlinearity Error (INL) INL is the deviation of each individual code from a line drawn from negative full scale through positive full scale. The point used as negative full scale occurs ½ LSB before the first code transition. Positive full scale is defined as a level 1½ LSB beyond the last code transition. The deviation is measured from the middle of each code to the true straight line (see Figure 39). Differential Nonlinearity Error (DNL) In an ideal ADC, code transitions are 1 LSB apart. DNL is the maximum deviation from this ideal value. It is often specified in terms of resolution for which no missing codes are guaranteed. Zero Error Zero error is the difference between the ideal voltage that results in the first code transition (1/2 LSB above analog ground) and the actual voltage producing that code. Gain Error The first transition (from 100 ... 00 to 100 ... 01) occurs at a level ½ LSB above nominal negative full scale (−4.999981 V for the ±5 V range). The last transition (from 011 … 10 to 011 … 11) occurs for an analog voltage 1½ LSB below the nominal full scale (+4.999943 V for the ±5 V range). The gain error is the deviation of the difference between the actual level of the last transition and the actual level of the first transition from the difference between the ideal levels. Spurious-Free Dynamic Range (SFDR) SFDR is the difference, in decibels (dB), between the rms amplitude of the input signal and the peak spurious signal. Effective Number of Bits (ENOB) ENOB is a measurement of the resolution with a sine wave input. It is related to SINAD as follows: ENOB = (SINADdB − 1.76)/6.02 ENOB is expressed in bits. Total Harmonic Distortion (THD) THD is the ratio of the rms sum of the first five harmonic components to the rms value of a full-scale input signal and is expressed in decibels. Dynamic Range Dynamic range is the ratio of the rms value of the full scale to the total rms noise measured. The value for dynamic range is expressed in decibels. It is measured with a signal at −60 dBFS so that it includes all noise sources and DNL artifacts. Signal-to-Noise Ratio (SNR) SNR is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components below the Nyquist frequency, excluding harmonics and dc. The value for SNR is expressed in decibels. Signal-to-Noise-and-Distortion Ratio (SINAD) SINAD is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components that are less than the Nyquist frequency, including harmonics but excluding dc. The value of SINAD is expressed in decibels. Aperture Delay Aperture delay is the measure of the acquisition performance and is the time between the rising edge of the CNV input and when the input signal is held for a conversion. Transient Response Transient response is the time required for the ADC to acquire a full-scale input step to ±1 LSB accuracy. Common-Mode Rejection Ratio (CMRR) CMRR is the ratio of the power in the ADC output at the frequency, f, to the power of a 200 mV p-p sine wave applied to the common-mode voltage of IN+ and IN− of frequency, f. CMRR (dB) = 10log(PADC_IN/PADC_OUT) where: PADC_IN is the common-mode power at the frequency, f, applied to the IN+ and IN− inputs. PADC_OUT is the power at the frequency, f, in the ADC output. Power Supply Rejection Ratio (PSRR) PSRR is the ratio of the power in the ADC output at the frequency, f, to the power of a 200 mV p-p sine wave applied to the ADC VDD supply of frequency, f. PSRR (dB) = 10 log(PVDD_IN/PADC_OUT) where: PVDD_IN is the power at the frequency, f, at the VDD pin. PADC_OUT is the power at the frequency, f, in the ADC output. Rev. D | Page 17 of 40 AD4003/AD4007/AD4011 Data Sheet THEORY OF OPERATION IN+ SWITCHES CONTROL LSB MSB REF GND 131,072C 65,536C 4C 2C C SW+ C BUSY COMP 131,072C 65,536C 4C 2C C CONTROL LOGIC C MSB OUTPUT CODE LSB SW– 14957-007 CNV IN– Figure 38. ADC Simplified Schematic CIRCUIT INFORMATION The AD4003/AD4007/AD4011 are high speed, low power, single-supply, precise, 18-bit ADCs based on a SAR architecture. The AD4003 is capable of converting 2,000,000 samples per second (2 MSPS), the AD4007 is capable of converting 1,000,000 samples per second (1 MSPS), and the AD4011 is capable of converting 500,000 samples per second (500 kSPS). The power consumption of the AD4003/AD4007/AD4011 scales with throughput, because they power down in between conversions. For example, when operating at 10 kSPS, the devices typically consume 80 μW, making them ideal for battery-powered applications. The AD4003/AD4007/AD4011 also have a valid first conversion after being powered down for long periods, which can further reduce power consumed in applications in which the ADC does not need to be constantly converting. The AD4003/AD4007/AD4011 provide the user with an on-chip, track-and-hold and do not exhibit any pipeline delay or latency, making them ideal for multiplexed applications. The AD4003/AD4007/AD4011 incorporate a multitude of unique easy to use features that result in a lower system power and smaller footprint. The AD4003/AD4007/AD4011 each have an internal voltage clamp that protects the device from overvoltage damage on the analog inputs. range up to 100 kHz. For frequencies greater than 100 kHz and multiplexing functionality, disable high-Z mode. For single-supply applications, a span compression feature creates additional headroom and footroom for the driving amplifier to access the full range of the ADC. The fast conversion time of the AD4003/AD4007/AD4011, along with turbo mode, allows low clock rates to read back conversions, even when running at their respective maximum throughput rates. Note that for the AD4003, the full throughput rate of 2 MSPS can be achieved only with turbo mode enabled. The AD4003/AD4007/AD4011 can interface with any 1.8 V to 5 V digital logic family. They are available in a 10-lead MSOP or a tiny 10-lead LFCSP that allows space savings and flexible configurations. The AD4003/AD4007/AD4011 are pin for pin compatible with some of the 14-/16-/18-/20-bit precision SAR ADCs listed in Table 8. Table 8. MSOP, LFCSP 14-/16-/18-/20-Bit Precision SAR ADCs Bits 100 kSPS 201 Not applicable 181 AD7989-12 The analog input incorporates circuitry that reduces the nonlinear charge kickback seen from a typical switched capacitor SAR input. This reduction in kickback, combined with a longer acquisition phase, allows the use of lower bandwidth and lower power amplifiers as drivers. This combination has the additional benefit of allowing a larger resistor value in the input RC filter and a corresponding smaller capacitor, which results in a smaller RC load for the amplifier, improving stability and power dissipation. 183 High-Z mode can be enabled via the SPI interface by programming a register bit (see Table 14). When high-Z mode is enabled, the ADC input has a low input charging current at low input signal frequencies as well as improved distortion over a wide frequency 250 kSPS Not applicable AD76912 AD7684 AD76872 163 AD7680, AD7683, AD7988-12 AD76852, AD7694 143 AD7940 AD79422 True differential. Pin for pin compatible. 3 Pseudo differential. 2 Rev. D | Page 18 of 40 AD40112, AD76902, AD7989-52 AD40102 161 1 400 kSPS to 500 kSPS AD40222 AD76882, AD76932, AD79162 AD40082, AD76862, AD7988-52 AD79462 ≥1000 kSPS AD40202, AD40212 AD40032, AD40072, AD79822, AD79842 AD40022, AD40062 AD4001, AD4005, AD79152 AD40002, AD40042, AD79802, AD7983 Not applicable Data Sheet AD4003/AD4007/AD4011 During the acquisition phase, terminals of the array tied to the input of the comparator are connected to ground via the SW+ and SW− switches (see Figure 38). All independent switches connect the other terminal of each capacitor to the analog inputs. The capacitor arrays are used as sampling capacitors and acquire the analog signal on the IN+ and IN− inputs. When the acquisition phase is complete and the CNV input goes high, a conversion phase initiates. When the conversion phase begins, SW+ and SW− are opened first. The two capacitor arrays are then disconnected from the inputs and connected to the GND input. The differential voltage between the IN+ and IN− inputs captured at the end of the acquisition phase is applied to the comparator inputs, causing the comparator to become unbalanced. By switching each element of the capacitor array between GND and VREF, the comparator input varies by binary weighted voltage steps (VREF/2, VREF/4, …, VREF/262,144). The control logic toggles these switches, starting with the MSB, to bring the comparator back into a balanced condition. After the Because the AD4003, AD4007, and AD4011 have on-board conversion clocks, the serial clock (SCK) is not required for the conversion process. TRANSFER FUNCTIONS The ideal transfer characteristics for the AD4003/AD4007/ AD4011 are shown in Figure 39 and Table 9. 011...111 011...110 011...101 100...010 100...001 100...000 –FSR –FSR + 1 LSB –FSR + 0.5 LSB +FSR – 1 LSB +FSR – 1.5 LSB ANALOG INPUT 14957-008 The AD4003/AD4007/AD4011 are SAR-based ADCs using a charge redistribution sampling digital-to-analog converter (DAC). Figure 38 shows the simplified schematic of the ADC. The capacitive DAC consists of two identical arrays of 18 binary weighted capacitors, which are connected to the comparator inputs. completion of this process, the control logic generates the ADC output code and a busy signal indicator. ADC CODE (TWOS COMPLEMENT) CONVERTER OPERATION Figure 39. ADC Ideal Transfer Function (FSR Is Full-Scale Range) Table 9. Output Codes and Ideal Input Voltages Description FSR − 1 LSB Midscale + 1 LSB Midscale Midscale − 1 LSB −FSR + 1 LSB −FSR Analog Input, VREF = 5 V +4.999962 V +38.15 μV 0V −38.15 μV −4.999962 V −5 V VREF = 5 V with Span Compression Enabled +3.999969 V +30.5 μV 0V −30.5 μV −3.999969 V −4 V 1 Digital Output Code (Hex) 0x1FFFF1 0x00001 0x00000 0x3FFFF 0x20001 0x200002 This output code is also the code for an overranged analog input (VIN+ − VIN− above VREF with the span compression disabled and above 0.8 ×VREF with the span compression enabled). 2 This output code is also the code for an underranged analog input (VIN+ − VIN− below −VREF with the span compression disabled and above 0.8 ×VREF with the span compression enabled). Rev. D | Page 19 of 40 AD4003/AD4007/AD4011 Data Sheet APPLICATIONS INFORMATION Figure 41 shows a recommended connection diagram when using a single-supply system. This setup is preferable when only a limited number of rails are available in the system and power dissipation is of critical importance. TYPICAL APPLICATION DIAGRAMS Figure 40 shows an example of the recommended connection diagram for the AD4003/AD4007/AD4011 when multiple supplies, V+ and V−, are available. This configuration is used for optimal performance because the amplifier supplies can be selected to allow the maximum signal range (see Figure 40 for the range). Figure 42 shows a typical application diagram when using a fully differential amplifier (FDA). V+ ≥ +6.5V REF LDO 1.8V AMP VCM = VREF/2 5V 10kΩ 0.1µF 10kΩ AMP VREF R REF C 0V V+ VCM = VREF /2 VDD VIO SDI IN+ V– AD4003/ AD4007/ AD4011 IN– R AMP VREF SCK DIGITAL HOST (MICROPROCESSOR/ FPGA) SDO CNV GND 3-WIRE/4-WIRE INTERFACE C 0V HOST SUPPLY V– 14957-009 VCM = VREF /2 1.8V TO 5V 0.1µF 10µF V+ V– ≤ –0.5V Figure 40. Typical Application Diagram with Multiple Supplies V+ = 5V REF1 LDO AMP VCM = VREF /2 1.8V 4.096V 10kΩ 10kΩ AMP 0.9 × VREF VCM = VREF /2 0.1 × VREF 0.1µF 0.1µF 100nF 100nF R REF C VDD SDI AD4003/AD4007/ AD40112 IN– AMP 0.9 × VREF VCM = VREF /2 0.1 × VREF HOST SUPPLY VIO IN+ R 1.8V TO 5V 10µF1 GND SCK SDO DIGITAL HOST (MICROPROCESSOR/ FPGA) CNV 3-WIRE/4-WIRE INTERFACE C 1 SEE THE VOLTAGE REFERENCE INPUT SECTION FOR REFERENCE SELECTION. C REF IS USUALLY A 10µF CERAMIC CAPACITOR (X7R). 2 SPAN COMPRESSION MODE ENABLED. 3 SEE TABLE 10 FOR RC FILTER AND AMPLIFIER SELECTION. Figure 41. Typical Application Diagram with a Single Supply Rev. D | Page 20 of 40 14957-010 3 Data Sheet AD4003/AD4007/AD4011 V+ = 5V REF LDO AMP VCM = VREF/2 VCM = VREF/2 R4 1kΩ R3 1kΩ VREF 10kΩ 0 4.096V 10kΩ 10µF 1.8V 1.8V TO 5V 0.1µF 0.1µF HOST SUPPLY V+ +IN VOCM 0.1µF –IN GND SCK SDO CNV 3-WIRE/4-WIRE INTERFACE V– R1 1kΩ 0 DIGITAL HOST (MICROPROCESSOR/ FPGA) 14957-011 VREF SDI IN– R DIFFERENTIAL AMPLIFIER VIO AD4003/AD4007/ AD4011 C +OUT VDD IN+ C VCM = VREF /2 VCM = VREF/2 REF R –OUT R2 1kΩ Figure 42. Typical Application Diagram with a Fully Differential Amplifier If the analog input exceeds the reference voltage by 0.4 V, the internal clamp circuit turns on and the current flows through the clamp into ground, preventing the input from rising further and potentially causing damage to the device. The clamp turns on before D1 (see Figure 43) and can sink up to 50 mA of current. ANALOG INPUTS Figure 43 shows an equivalent circuit of the analog input structure, including the overvoltage clamp of the AD4003/ AD4007/AD4011. REF D1 VIN REXT RIN IN+/IN– CEXT CPIN D2 CLAMP GND 14957-013 0V TO 15V CIN Figure 43. Equivalent Analog Input Circuit Input Overvoltage Clamp Circuit Most ADC analog inputs, IN+ and IN−, have no overvoltage protection circuitry apart from ESD protection diodes. During an overvoltage event, an ESD protection diode from an analog input pin (IN+ or IN−) pin to REF forward biases and shorts the input pin to REF, potentially overloading the reference or causing damage to the device. The AD4003/AD4007/AD4011 internal overvoltage clamp circuit with a larger external resistor (REXT = 200 Ω) eliminates the need for external protection diodes and protects the ADC inputs against dc overvoltages. When the clamp is active, it sets the overvoltage (OV) clamp flag bit in the configuration register that is accessed with a 16-bit SPI read command or via the OV in the status bits. The OV clamp flag gives an indication of overvoltage condition when it is set to 0. The OV clamp flag is a read only sticky bit and is cleared only if the register is a read while the overvoltage condition is no longer present. The clamp circuit does not dissipate static power in the off state. Note that the clamp cannot sustain the overvoltage condition for an indefinite amount of time. The external RC filter, formed by the REXT resistor and The CEXT capacitor (see Figure 43) is usually present at the ADC input to band limit the input signal. During an overvoltage event, excessive voltage is dropped across REXT and REXT becomes part of a protection circuit. The REXT value can vary from 200 Ω to 20 kΩ for 15 V protection. The CEXT value can be as low as 100 pF for correct operation of the clamp. See Table 1 for input overvoltage clamp specifications. In applications where the amplifier rails are greater than VREF and less than ground, it is possible for the output to exceed the input voltage range (specified in Table 1) of the device. In this case, the AD4003/AD4007/AD4011 internal overvoltage clamp circuit ensures that the voltage on the input pin does not exceed VREF + 0.4 V and prevents damage to the device by clamping the input voltage in a safe operating range and avoiding disturbance of the reference, which is particularly important for systems that share the reference among multiple ADCs. Rev. D | Page 21 of 40 AD4003/AD4007/AD4011 Data Sheet During the conversion phase, where the switches are open, the input impedance is limited to CPIN. RIN and CIN make a singlepole, low-pass filter that reduces undesirable aliasing effects and limits noise. Differential Input Considerations The analog input structure allows the sampling of the true differential signal between IN+ and IN−. By using these differential inputs, signals common to both inputs are rejected. Figure 32 shows the common-mode rejection capability of the AD4003/ AD4007/AD4011 over frequency. It is important to note that the differential input signals must be truly antiphase in nature, 180° out of phase, which is required to keep the common-mode voltage of the input signal within the specified range around VREF/2 as shown in Table 1. RC Filter Values The RC filter value (represented by R and C in Figure 40 to Figure 42 and Figure 44) and driving amplifier can be selected depending on the input signal bandwidth of interest at the full throughput. Lower input signal bandwidth means that the RC cutoff can be lower, thereby reducing noise into the converter. For optimum performance at various throughputs, use the recommended RC values (200 Ω, 180 pF) and the ADA4807-1. Switched Capacitor Input During the acquisition phase, the impedance of the analog inputs (IN+ or IN−) can be modeled as a parallel combination of Capacitor CPIN and the network formed by the series connection of RIN and CIN. CPIN is primarily the pin capacitance. RIN is typically 400 Ω and is a lumped component composed of serial resistors and the on resistance of the switches. CIN is typically 40 pF and is mainly the ADC sampling capacitor. The RC values shown in Table 10 are chosen for ease of drive considerations and greater ADC input protection. The combination of a large R value (200 Ω) and small C value results in a reduced dynamic load for the amplifier to drive. The smaller value of C means fewer stability and phase margin concerns with the amplifier. The large value of R limits the current into the ADC input when the amplifier output exceeds the ADC input range. Table 10. RC Filter and Amplifier Selection for Various Input Bandwidths Input Signal Bandwidth (kHz)
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AD4011BCPZ-RL7

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