Data Sheet
AD5253/AD5254
Quad 64-/256-Position I2C Nonvolatile Memory Digital Potentiometers
FEATURES
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FUNCTIONAL BLOCK DIAGRAM
AD5253: quad 64-position resolution
AD5254: quad 256-position resolution
1 kΩ, 10 kΩ, 50 kΩ, 100 kΩ
Nonvolatile memory stores wiper settings with write protection
Power-on refreshed to EEMEM settings in 300 µs typ
EEMEM rewrite time = 540 µs typ
Resistance tolerance stored in nonvolatile memory
12 extra bytes in EEMEM for user-defined information
I2C-compatible serial interface
Direct read/write access of RDAC and EEMEM registers
Predefined linear increment/decrement commands
Predefined ±6 dB step change commands
Synchronous or asynchronous quad-channel update
Wiper setting readback
4 MHz bandwidth—1 kΩ version
Single supply 2.7 V to 5.5 V
Dual supply ±2.25 V to ±2.75 V
2 slave address-decoding bits allow operation of 4 devices
100-year typical data retention, TA = 55°C
Operating temperature: –40°C to +105°C
APPLICATIONS
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Mechanical potentiometer replacement
Low resolution DAC replacement
RGB LED backlight control
White LED brightness adjustment
RF base station power amp bias control
Programmable gain and offset control
Programmable attenuators
Programmable voltage-to-current conversion
Programmable power supply
Programmable filters
Sensor calibrations
Figure 1.
GENERAL DESCRIPTION
The AD5253/AD52541 are quad-channel, I2C, nonvolatile memory,
digitally controlled potentiometers with 64/256 positions, respectively. These devices perform the same electronic adjustment functions
as mechanical potentiometers, trimmers, and variable resistors.
The parts’ versatile programmability allows multiple modes of operation, including read/write access in the RDAC and EEMEM
registers, increment/decrement of resistance, resistance changes
in ±6 dB scales, wiper setting readback, and extra EEMEM for
storing user-defined information, such as memory data for other
components, lookup table, or system identification information.
The AD5253/AD5254 allow the host I2C controllers to write any
of the 64-/256-step wiper settings in the RDAC registers and
store them in the EEMEM. Once the settings are stored, they are
restored automatically to the RDAC registers at system power-on;
the settings can also be restored dynamically.
The AD5253/AD5254 provide additional increment, decrement, +6
dB step change, and –6 dB step change in synchronous or asynchronous channel update mode. The increment and decrement
functions allow stepwise linear adjustments, with a ± 6 dB step
change equivalent to doubling or halving the RDAC wiper setting.
These functions are useful for steep-slope, nonlinear adjustments,
such as white LED brightness and audio volume control.
The AD5253/AD5254 have a patented resistance-tolerance storing
function that allows the user to access the EEMEM and obtain the
absolute end-to-end resistance values of the RDACs for precision
applications.
The AD5253/AD5254 are available in TSSOP-20 packages in 1 kΩ,
10 kΩ, 50 kΩ, and 100 kΩ options. All parts are guaranteed to
operate over the –40°C to +105°C extended industrial temperature
range. In this data sheet, the nonvolatile memory and EEMEM
terms are used interchangeably, as are the digital potentiometer
and RDAC terms.
1
Protected by U.S. Patent 7,688,240.
Rev. D
DOCUMENT FEEDBACK
TECHNICAL SUPPORT
Information furnished by Analog Devices is believed to be accurate and reliable "as is". However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to
change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
Data Sheet
AD5253/AD5254
TABLE OF CONTENTS
Features................................................................ 1
Applications........................................................... 1
Functional Block Diagram......................................1
General Description...............................................1
Electrical Characteristics....................................... 3
1 kΩ Version.......................................................3
10 kΩ, 50 kΩ, 100 kΩ Versions..........................4
Interface Timing Characteristics.........................6
Absolute Maximum Ratings...................................8
ESD Caution.......................................................8
Pin Configuration and Function Descriptions........ 9
Typical Performance Characteristics................... 10
I2C Interface.........................................................14
I2C Interface General Description.................... 14
I2C Interface Detail Description........................ 15
I2C-Compatible 2-Wire Serial Bus ...................20
Theory of Operation.............................................21
Linear Increment/Decrement Commands........ 21
±6 dB Adjustments (Doubling/Halving Wiper
Setting)........................................................... 21
Digital Input/Output Configuration.................... 21
Multiple Devices on One Bus........................... 22
Terminal Voltage Operation Range.................. 22
Power-Up and Power-Down Sequences..........23
Layout and Power Supply Biasing....................23
Digital Potentiometer Operation....................... 23
Programmable Rheostat Operation..................23
Programmable Potentiometer Operation..........24
Applications Information...................................... 25
RGB LED Backlight Controller for LCD
Panels............................................................ 25
Outline Dimensions............................................. 26
Ordering Guide.................................................26
Evaluation Boards............................................ 26
REVISION HISTORY
1/2022—Rev. C to Rev. D
Changes to –3 dB Bandwidth Parameter, Table 1........................................................................................... 3
Changes to –3 dB Bandwidth Parameter, Table 2........................................................................................... 4
Moved Table 7................................................................................................................................................16
Changes to Figure 30.................................................................................................................................... 17
Moved Table 9................................................................................................................................................18
Moved Table 10 and Figure 32...................................................................................................................... 18
Change to Programmable Rheostat Operation Section.................................................................................23
Changes to Figure 45.................................................................................................................................... 25
Changes to Ordering Guide........................................................................................................................... 26
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Rev. D | 2 of 26
Data Sheet
AD5253/AD5254
ELECTRICAL CHARACTERISTICS
1 KΩ VERSION
VDD = +3 V ± 10% or +5 V ± 10%, VSS = 0 V or VDD/VSS = ±2.5 V ± 10%, VA = VDD, VB = 0 V, –40°C < TA < +105°C, unless otherwise noted.
Table 1.
Parameter
Symbol
Conditions
DC CHARACTERISTICS—
RHEOSTAT MODE
Resolution
N
AD5253
AD5254
RWB, RWA = NC, VDD = 5.5 V, AD5253
RWB, RWA = NC, VDD = 5.5 V, AD5254
RWB, RWA = NC, VDD = 2.7 V, AD5253
RWB, RWA = NC, VDD = 2.7 V, AD5254
RWB, RWA = NC, VDD = 5.5 V, AD5253
RWB, RWA = NC, VDD = 5.5 V, AD5254
RWB, RWA = NC, VDD = 2.7 V, AD5253
RWB, RWA = NC, VDD = 2.7 V, AD5254
TA = 25°C
Resistor Differential Nonlinearity2
R-DNL
Resistor Nonlinearity2
R-INL
Nominal Resistor Tolerance
Resistance Temperature Coefficient
Wiper Resistance
ΔRAB/RAB
(ΔRAB/RAB) × 106/ΔT
RW
Channel-Resistance Matching
DC CHARACTERISTICS—
POTENTIOMETER DIVIDER MODE
Differential Nonlinearity3
DNL
INL
Voltage Divider Tempco
Full-Scale Error
(ΔVW/VW) × 106/ΔT
VWFSE
Zero-Scale Error
VWZSE
Capacitance5 W
Common-Mode Leakage Current
DIGITAL INPUTS AND OUTPUTS
Input Logic High
VA, VB, VW
CA, CB
CW
ICM
VIH
Input Logic Low
VIL
Output Logic High (SDA)
Output Logic Low (SDA)
VOH
VOL
analog.com
–0.5
–1.00
–0.75
–1.5
–0.5
–2.0
–1.0
–2
–30
AD5253
AD5254
AD5253
AD5254
Code = half scale
Code = full scale, VDD = 5.5 V, AD5253
Code = full scale, VDD = 5.5 V, AD5254
Code = full scale, VDD = 2.7 V, AD5253
Code = full scale, VDD = 2.7 V, AD5254
Code = zero scale, VDD = 5.5 V, AD5253
Code = zero scale, VDD = 5.5 V, AD5254
Code = zero scale, VDD = 2.7 V, AD5253
Code = zero scale, VDD = 2.7 V, AD5254
Typ1
±0.2
±0.25
±0.30
±0.3
±0.2
±0.5
+2.5
+9
650
75
200
0.15
IW = 1 V/R, VDD = 5 V
IW = 1 V/R, VDD = 3 V
ΔRAB1/ΔRAB2
Integral Nonlinearity3
RESISTOR TERMINALS
Voltage Range4
Capacitance5 A, B
Min
–0.5
–1.00
–0.5
–2.0
–5
–16
–6
–23
0
0
0
0
±0.1
±0.25
±0.2
±0.5
25
–3
–11
–4
–16
3
11
4
15
VSS
f = 1 kHz, measured to GND, code = half
scale
f = 1 kHz, measured to GND, code = half
scale
VA = VB = VDD/2
VDD = 5 V, VSS = 0 V
VDD/VSS = +2.7 V/0 V or VDD/VSS = ±2.5 V
VDD = 5 V, VSS = 0 V
VDD/VSS = +2.7 V/0 V or VDD/VSS = ±2.5 V
RPULL-UP = 2.2 kΩ to VDD = 5 V, VSS = 0 V
RPULL-UP = 2.2 kΩ to VDD = 5 V, VSS = 0 V
Max
Unit
6
8
+0.5
+1.00
+0.75
+1.5
+0.5
+2.0
+4.0
+14
+30
Bits
Bits
LSB
LSB
LSB
LSB
LSB
LSB
LSB
LSB
%
ppm/°C
Ω
Ω
%
130
300
+0.5
+1.00
+0.5
+2.0
0
0
0
0
5
16
6
20
VDD
LSB
LSB
LSB
LSB
ppm/°C
LSB
LSB
LSB
LSB
LSB
LSB
LSB
LSB
85
V
pF
95
pF
0.01
1.00
µA
0.8
0.6
V
V
V
V
V
V
2.4
2.1
4.9
0.4
Rev. D | 3 of 26
Data Sheet
AD5253/AD5254
ELECTRICAL CHARACTERISTICS
Table 1.
Parameter
Symbol
Conditions
WP Leakage Current
A0 Leakage Current
Input Leakage Current (Other than WP
and A0)
Input Capacitance5
POWER SUPPLIES
Single-Supply Power Range
Dual-Supply Power Range
Positive Supply Current
Negative Supply Current
IWP
IA0
II
WP = VDD
A0 = GND
VIN = 0 V or VDD
Min
CI
VDD
VDD/VSS
IDD
ISS
EEMEM Data Storing Mode Current
EEMEM Data Restoring Mode Current6
Power Dissipation7
Power Supply Sensitivity
IDD_STORE
IDD_RESTORE
PDISS
PSS
DYNAMIC CHARACTERISTICS5, 8
–3 dB Bandwidth
Total Harmonic Distortion
VW Settling Time
Resistor Noise Voltage
Digital Crosstalk
BW
THD
tS
eN_WB
CT
Analog Coupling
CAT
Typ1
Max
Unit
8
3
±1
µA
µA
µA
5
VSS = 0 V
2.7
±2.25
VIH = VDD or VIL = GND
VIH = VDD or VIL = GND, VDD = 2.5 V,
VSS = –2.5 V
VIH = VDD or VIL = GND
VIH = VDD or VIL = GND
VIH = VDD = 5 V or VIL = GND
ΔVDD = 5 V ± 10%
ΔVDD = 3 V ± 10%
5
–5
pF
5.5
±2.75
15
–15
V
V
µA
µA
0.075
+0.025
+0.04
mA
mA
mW
%/%
%/%
35
2.5
−0.025
–0.04
RAB = 1 kΩ, code = midscale
VA =1 V rms, VB = 0 V, f = 1 kHz
VA = VDD, VB = 0 V
RWB = 500 Ω, f = 1 kHz (thermal noise only)
VA = VDD, VB = 0 V, measure VW with adjacent
RDAC making full-scale change
Signal input at A0 and measure the output at
W1, f = 1 kHz
+0.010
+0.02
4
0.05
0.2
3
–80
MHz
%
µs
nV/√Hz
dB
–72
dB
1
Typical values represent average readings at 25°C and VDD = 5 V.
2
Resistor position nonlinearity error (R-INL) is the deviation from an ideal value measured between the maximum and minimum resistance wiper positions. R-DNL is the
relative step change from an ideal value measured between successive tap positions. Parts are guaranteed monotonic, except R-DNL of AD5254 1 kΩ version at VDD = 2.7
V, IW = VDD/R for both VDD = 3 V and VDD = 5 V.
3
INL and DNL are measured at VW with the RDAC configured as a potentiometer divider similar to a voltage output digital-to-analog converter. VA = VDD and VB = 0 V. DNL
specification limits of ±1 LSB maximum are guaranteed monotonic operating conditions.
4
Resistor Terminal A, Terminal B, and Terminal W have no limitations on polarity with respect to each other.
5
Guaranteed by design and not subject to production test.
6
Command 0 NOP should be activated after Command 1 to minimize IDD_RESTORE current consumption.
7
PDISS is calculated from IDD × VDD = 5 V.
8
All dynamic characteristics use VDD = 5 V.
10 KΩ, 50 KΩ, 100 KΩ VERSIONS
VDD = +3 V ± 10% or +5 V ± 10%, VSS = 0 V or VDD/VSS = ±2.5 V ± 10%, VA = VDD, VB = 0 V, –40°C < TA < +105°C, unless otherwise noted.
Table 2.
Parameter
Symbol
Conditions
DC CHARACTERISTICS—RHEOSTAT
MODE
Resolution
N
AD5253
AD5254
RWB, RWA = NC, AD5253
RWB, RWA = NC, AD5254
Resistor Differential Nonlinearity2
analog.com
R-DNL
Min
−0.75
−1.00
Typ1
Max
Unit
±0.10
±0.25
6
8
+0.75
+1.00
Bits
Bits
LSB
LSB
Rev. D | 4 of 26
Data Sheet
AD5253/AD5254
ELECTRICAL CHARACTERISTICS
Table 2.
Symbol
Conditions
Min
Typ1
Max
Unit
Resistor Nonlinearity2
R-INL
ΔRAB/RAB
(ΔRAB/RAB) × 106/ΔT
RW
−0.75
−2.5
−20
±0.25
±1.0
Nominal Resistor Tolerance
Resistance Temperature Coefficient
Wiper Resistance
RWB, RWA = NC, AD5253
RWB, RWA = NC, AD5254
TA = 25°C
+0.75
+2.5
+20
Channel-Resistance Matching
ΔRAB1/ΔRAB2
LSB
LSB
%
ppm/°C
Ω
Ω
%
%
Parameter
DC CHARACTERISTICS—
POTENTIOMETER DIVIDER MODE
Differential Nonlinearity3
DNL
Integral Nonlinearity3
INL
Voltage Divider
Temperature Coefficient
Full-Scale Error
(ΔVW/VW) × 106/ΔT
Zero-Scale Error
VWZSE
RESISTOR TERMINALS
Voltage Range4
Capacitance5 A, B
Capacitance5 W
Common-Mode Leakage Current
DIGITAL INPUTS AND OUTPUTS
Input Logic High
Input Logic Low
Output Logic High (SDA)
Output Logic Low (SDA)
WP Leakage Current
A0 Leakage Current
Input Leakage Current (Other than WP
and A0)
Input Capacitance5
POWER SUPPLIES
Single-Supply Power Range
Dual-Supply Power Range
Positive Supply Current
Negative Supply Current
EEMEM Data Storing Mode Current
EEMEM Data Restoring Mode Current6
Power Dissipation7
Power Supply Sensitivity
VWFSE
650
75
200
0.15
0.05
IW = 1 V/R, VDD = 5 V
IW = 1 V/R, VDD = 3 V
RAB = 10 kΩ, 50 kΩ
RAB = 100 kΩ
130
300
AD5253
AD5254
AD5253
AD5254
Code = half scale
−0.5
−1.0
−0.50
−1.5
±0.1
±0.3
±0.15
±0.5
15
+0.5
+1.0
+0.50
+1.5
LSB
LSB
LSB
LSB
ppm/°C
Code = full scale, AD5253
Code = full scale, AD5254
Code = zero scale, AD5253
Code = zero scale, AD5254
−1.0
−3
0
0
−0.3
−1
0.3
1.2
0
0
1.0
3.0
LSB
LSB
LSB
LSB
VDD
VA, VB, VW
CA, CB
f = 1 kHz, measured to GND, code = half scale
85
V
pF
CW
ICM
f = 1 kHz, measured to GND, code = half scale
VA = VB = VDD/2
95
0.01
pF
µA
VIH
VDD = 5 V, VSS = 0 V
VDD/VSS = +2.7 V/0 V or VDD/VSS = ±2.5 V
VDD = 5 V, VSS = 0 V
VDD/VSS = +2.7 V/0 V or VDD/VSS = ±2.5 V
RPULL-UP = 2.2 kΩ to VDD = 5 V, VSS = 0 V
RPULL-UP = 2.2 kΩ to VDD = 5 V, VSS = 0 V
WP = VDD
A0 = GND
VIN = 0 V or VDD
VIL
VOH
VOL
IWP
IA0
II
VSS
2.4
2.1
IDD_STORE
IDD_RESTORE
PDISS
PSS
V
V
V
V
V
V
µA
µA
µA
0.8
0.6
4.9
0.4
8
3
±1
CI
VDD
VDD/VSS
IDD
ISS
1
5
VSS = 0 V
VIH = VDD or VIL = GND
VIH = VDD or VIL = GND, VDD = 2.5 V, VSS =
−2.5 V
VIH = VDD or VIL = GND, TA = 0°C to 105°C
VIH = VDD or VIL = GND, TA = 0°C to 105°C
VIH = VDD = 5 V or VIL = GND
ΔVDD = 5 V ± 10%
ΔVDD = 3 V ± 10%
2.7
±2.25
5
−5
pF
5.5
±2.75
15
−15
V
V
µA
µA
0.075
+0.005
+0.010
mA
mA
mW
%/%
%/%
35
2.5
−0.005
−0.010
+0.002
+0.002
DYNAMIC CHARACTERISTICS5, 8
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Rev. D | 5 of 26
Data Sheet
AD5253/AD5254
ELECTRICAL CHARACTERISTICS
Table 2.
Parameter
Symbol
Conditions
–3 dB Bandwidth
BW
Total Harmonic Distortion
VW Settling Time
THDW
tS
Resistor Noise Voltage
eN_WB
RAB = 10 kΩ, code = midscale
RAB = 50 kΩ, code = midscale
RAB = 100 kΩ, code = midscale
VA = 1 V rms, VB = 0 V, f = 1 kHz
VA = VDD, VB = 0 V, RAB = 10 kΩ
VA = VDD, VB = 0 V, RAB = 50 kΩ
VA = VDD, VB = 0 V, RAB = 100 kΩ
RAB = 10 kΩ, code = midscale, f = 1 kHz
(thermal noise only)
RAB = 50 kΩ, code = midscale, f = 1 kHz
(thermal noise only)
RAB = 100 kΩ, code = midscale, f = 1 kHz
(thermal noise only)
VA = VDD, VB = 0 V, measure VW with adjacent
RDAC making full-scale change
Signal input at A0 and measure output at W1, f
= 1 kHz
Digital Crosstalk
CT
Analog Coupling
CAT
Min
Typ1
Max
Unit
400
80
40
0.05
1.5
7
14
9
kHz
kHz
kHz
%
µs
µs
µs
nV/√Hz
20
nV/√Hz
29
nV/√Hz
−80
dB
−72
dB
1
Typical values represent average readings at 25°C and VDD = 5 V.
2
Resistor position nonlinearity error (R-INL) is the deviation from an ideal value measured between the maximum and minimum resistance wiper positions. R-DNL is the
relative step change from an ideal value measured between successive tap positions. Parts are guaranteed monotonic, except R-DNL of AD5254 1 kΩ version at VDD = 2.7
V, IW = VDD/R for both VDD = 3 V and VDD = 5 V.
3
INL and DNL are measured at VW with the RDAC configured as a potentiometer divider, similar to a voltage output DAC. VA = VDD and VB = 0 V. DNL specification limits of
±1 LSB maximum are guaranteed monotonic operating conditions.
4
Resistor Terminal A, Terminal B, and Terminal W have no limitations on polarity with respect to each other.
5
Guaranteed by design and not subject to production test.
6
Command 0 NOP should be activated after Command 1 to minimize IDD_RESTORE current consumption.
7
PDISS is calculated from IDD × VDD = 5 V.
8
All dynamic characteristics use VDD = 5 V.
INTERFACE TIMING CHARACTERISTICS
All input control voltages are specified with tR = tF = 2.5 ns (10% to 90% of 3 V) and timed from a voltage level of 1.5 V. Switching
characteristics are measured using both VDD = 3 V and 5 V.
Table 3.
Parameter1
Symbol
INTERFACE TIMING
SCL Clock Frequency
tBUF Bus-Free Time Between Stop and Start
tHD;STA Hold Time (Repeated Start)
tLOW Low Period of SCL Clock
tHIGH High Period of SCL Clock
tSU;STA Set-up Time for Start Condition
tHD;DAT Data Hold Time
tSU;DAT Data Set-up Time
tF Fall Time of Both SDA and SCL Signals
tR Rise Time of Both SDA and SCL Signals
tSU;STO Set-up Time for Stop Condition
EEMEM Data Storing Time
fSCL
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
tEEMEM_STORE
analog.com
Conditions
After this period, the first clock pulse is generated.
Min
Typ2
1.3
0.6
1.3
0.6
0.6
0
100
Max
Unit
400
kHz
µs
µs
µs
µs
µs
µs
ns
ns
ns
µs
ms
0.9
300
300
0.6
26
Rev. D | 6 of 26
Data Sheet
AD5253/AD5254
ELECTRICAL CHARACTERISTICS
Table 3.
Parameter1
Symbol
Conditions
EEMEM Data Restoring Time at Power-On3
tEEMEM_RESTORE1
EEMEM Data Restoring Time upon Restore
Command or Reset Operation3
EEMEM Data Rewritable Time4
FLASH/EE MEMORY RELIABILITY
Endurance5
Data Retention6, 7
tEEMEM_RESTORE2
VDD rise time dependent. Measure without
decoupling capacitors at VDD and VSS.
VDD = 5 V.
Min
tEEMEM_REWRITE
Typ2
Max
Unit
300
µs
300
µs
540
µs
100
K cycles
Years
100
1
See Figure 23 for location of measured values.
2
Typical values represent average readings at 25°C and VDD = 5 V.
3
During power-up, all outputs are preset to midscale before restoring the EEMEM contents. RDAC0 has the shortest EEMEM restore time, whereas RDAC3 has the longest.
4
Delay time after power-on or reset before new EEMEM data to be written.
5
Endurance is qualified to 100,000 cycles per JEDEC Std. 22 Method A117 and measured at –40°C, +25°C, and +105°C; typical endurance at +25°C is 700,000 cycles.
6
Retention lifetime equivalent at junction temperature TJ = 55°C per JEDEC Std. 22, Method A117. Retention lifetime based on an activation energy of 0.6 eV derates with
junction temperature.
7
When the part is not in operation, the SDA and SCL pins should be pulled high. When these pins are pulled low, the I2C interface at these pins conducts a current of about
0.8 mA at VDD = 5.5 V and 0.2 mA at VDD = 2.7 V.
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Rev. D | 7 of 26
Data Sheet
AD5253/AD5254
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted
Table 4.
Parameter
Rating
VDD to GND
VSS to GND
VDD to VSS
VA, VB, VW to GND
Maximum Current
IWB, IWA Pulsed
IWB Continuous (RWB ≤ 1 kΩ, A Open)1
IWA Continuous (RWA ≤ 1 kΩ, B Open)1
IAB Continuous (RAB = 1 kΩ)1
IAB Continuous (RAB = 10 kΩ)1
IAB Continuous (RAB = 50 kΩ)1
IAB Continuous (RAB = 100 kΩ)1
Digital Inputs and Output Voltage to GND
Operating Temperature Range
Maximum Junction Temperature (TJMAX)
Storage Temperature Range
Lead Temperature (Soldering, 10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
TSSOP-20 Thermal Resistance2 θJA
−0.3 V, +7 V
+0.3 V, −7 V
7V
VSS, VDD
±20 mA
±5 mA
±5 mA
±5 mA
±500 µA
±100 µA
±50 µA
0 V, 7 V
−40°C to +105°C
150°C
−65°C to +150°C
300°C
215°C
220°C
143°C/W
1
Maximum terminal current is bound by the maximum applied voltage across
any two of the A, B, and W terminals at a given resistance, the maximum
current handling of the switches, and the maximum power dissipation of the
package. VDD = 5 V.
2
Package power dissipation = (TJMAX − TA)/θJA.
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Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although
this product features patented or proprietary protection circuitry,
damage may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to avoid
performance degradation or loss of functionality.
Rev. D | 8 of 26
Data Sheet
AD5253/AD5254
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
2
3
4
5
6
7
8
9
W0
B0
A0
AD0
WP
W1
B1
A1
SDA
10
VSS
11
12
13
14
A2
B2
W2
SCL
15
16
17
18
19
20
DGND
AD1
A3
B3
W3
VDD
Wiper Terminal of RDAC0. VSS ≤ VW0 ≤ VDD.
B Terminal of RDAC0. VSS ≤ VB0 ≤ VDD.
A Terminal of RDAC0. VSS ≤ VA0 ≤ VDD.
I2C Device Address 0. AD0 and AD1 allow four AD5253/AD5254 devices to be addressed.
Write Protect, Active Low. VWP ≤ VDD + 0.3 V.
Wiper Terminal of RDAC1. VSS ≤ VW1 ≤ VDD.
B Terminal of RDAC1. VSS ≤ VB1 ≤ VDD.
A Terminal of RDAC1. VSS ≤ VA1 ≤ VDD.
Serial Data Input/Output Pin. Shifts in one bit at a time upon positive clock edges. MSB loaded first. Open-drain MOSFET requires pull-up
resistor.
Negative Supply. Connect to 0 V for single supply or –2.7 V for dual supply, where VDD – VSS ≤ +5.5 V. If VSS is used rather than grounded in
dual supply, VSS must be able to sink 35 mA for 26 ms when storing data to EEMEM.
A Terminal of RDAC2. VSS ≤ VA2 ≤ VDD.
B Terminal of RDAC2. VSS ≤ VB2 ≤ VDD.
Wiper Terminal of RDAC2. VSS ≤ VW2 ≤ VDD.
Serial Input Register Clock Pin. Shifts in one bit at a time upon positive clock edges. VSCL ≤ (VDD + 0.3 V). Pull-up resistor is recommended
for SCL to ensure minimum power.
Digital Ground. Connect to system analog ground at a single point.
I2C Device Address 1. AD0 and AD1 allow four AD5253/AD5254 devices to be addressed.
A Terminal of RDAC3. VSS ≤ VA3 ≤ VDD.
B Terminal of RDAC3. VSS ≤ VB3 ≤ VDD.
Wiper Terminal of RDAC3. VSS ≤ VW3 ≤ VDD.
Positive Power Supply Pin. Connect +2.7 V to +5 V for single supply or ±2.7 V for dual supply, where VDD – VSS ≤ +5.5 V. VDD must be able
to source 35 mA for 26 ms when storing data to EEMEM.
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Rev. D | 9 of 26
Data Sheet
AD5253/AD5254
TYPICAL PERFORMANCE CHARACTERISTICS
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Figure 3. R-INL vs. Code
Figure 6. DNL vs. Code
Figure 4. R-DNL vs. Code
Figure 7. Supply Current vs. Temperature
Figure 5. INL vs. Code
Figure 8. Supply Current vs. Digital Input Voltage, TA = 25°C
Rev. D | 10 of 26
Data Sheet
AD5253/AD5254
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 9. Wiper Resistance vs. VBIAS
Figure 12. Potentiometer Mode Tempco (∆VWB/VWB)/∆T × 106 vs. Code
Figure 10. Change of RWB vs. Temperature
Figure 13. Gain vs. Frequency vs. Code, RAB = 1 kΩ, TA = 25°C
Figure 11. Rheostat Mode Tempco (∆RWB/RWB)/∆T × 106 vs. Code
Figure 14. Gain vs. Frequency vs. Code, RAB = 10 kΩ, TA = 25°C
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Rev. D | 11 of 26
Data Sheet
AD5253/AD5254
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 15. Gain vs. Frequency vs. Code, RAB = 50 kΩ, TA = 25°C
Figure 16. Gain vs. Frequency vs. Code, RAB = 100 kΩ, TA = 25°C
Figure 18. Supply Current vs. Digital Input Clock Frequency
Figure 19. Clock Feedthrough and Midscale Transition Glitch
Figure 20. tEEMEM_RESTORE of RDAC0 and RDAC3
Figure 17. ΔRAB vs. Code, TA = 25°C
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Rev. D | 12 of 26
Data Sheet
AD5253/AD5254
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 21. AD5253 IWB_MAX vs. Code
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Figure 22. AD5254 IWB_MAX vs. Code
Rev. D | 13 of 26
Data Sheet
AD5253/AD5254
I2C INTERFACE
Figure 23. I2C Interface Timing Diagram
I2C INTERFACE GENERAL DESCRIPTION
S = start condition
P = stop condition
A = acknowledge (SDA low)
A = not acknowledge (SDA high)
R/W = read enable at high; write enable at low
Figure 24. I2C—Master Writing Data to Slave
Figure 25. I2C—Master Reading Data from Slave
Figure 26. I2C—Combined Write/Read
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Rev. D | 14 of 26
Data Sheet
AD5253/AD5254
I2C INTERFACE
I2C INTERFACE DETAIL DESCRIPTION
S = start condition
P = stop condition
A = acknowledge (SDA low)
A= not acknowledge (SDA high)
AD1, AD0 = I2C device address bits, must match with the logic states at Pins AD1, AD0
R/W= read enable bit at logic high; write enable bit at logic low
CMD/REG = command enable bit at logic high; register access bit at logic low
EE/RDAC = EEMEM register at logic high; RDAC register at logic low
A4, A3, A2, A1, A0 = RDAC/EEMEM register addresses
Figure 27. Single Write Mode
Figure 28. Consecutive Write Mode
Table 6. Addresses for Writing Data Byte Contents to RDAC Registers (R/W = 0, CMD/REG = 0, EE/RDAC = 0)
A4
A3
A2
A1
A0
RDAC
Data Byte Description
0
0
0
0
0
:
:
0
0
0
0
0
0
:
:
1
0
0
0
0
1
:
:
1
0
0
1
1
0
:
:
1
0
1
0
1
0
:
:
1
RDAC0
RDAC1
RDAC2
RDAC3
Reserved
:
:
Reserved
6-/8-bit wiper setting (2 MSB of AD5253 are X)
6-/8-bit wiper setting (2 MSB of AD5253 are X)
6-/8-bit wiper setting (2 MSB of AD5253 are X)
6-/8-bit wiper setting (2 MSB of AD5253 are X)
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Rev. D | 15 of 26
Data Sheet
AD5253/AD5254
I2C INTERFACE
RDAC/EEMEM Write
RDAC/EEMEM Read
Setting the wiper position requires an RDAC write operation. The
single write operation is shown in Figure 27, and the consecutive
write operation is shown in Figure 28. In the consecutive write
operation, if the RDAC is selected and the address starts at 0,
the first data byte goes to RDAC0, the second data byte goes to
RDAC1, the third data byte goes to RDAC2, and the fourth data
byte goes to RDAC3. This operation can be continued for up to
eight addresses with four unused addresses; it then loops back to
RDAC0. If the address starts at any of the eight valid addresses, N,
the data first goes to RDAC_N, RDAC_N + 1, and so on; it loops
back to RDAC0 after the eighth address. The RDAC address is
shown in Table 6.
The AD5253/AD5254 provide two different RDAC or EEMEM read
operations. For example, Figure 29 shows the method of reading
the RDAC0 to RDAC3 contents without specifying the address,
assuming Address RDAC0 was already selected in the previous operation. If an RDAC_N address other than RDAC0 was previously
selected, readback starts with Address N, followed by N + 1, and so
on.
While the RDAC wiper setting is controlled by a specific RDAC
register, each RDAC register corresponds to a specific EEMEM
location, which provides nonvolatile wiper storage functionality. The
addresses are shown in Table 7. The single and consecutive write
operations also apply to EEMEM write operations.
There are 12 nonvolatile memory locations: EEMEM4 to EEMEM15. Users can store 12 bytes of information, such as memory
data for other components, look-up tables, or system identification
information.
In a write operation to the EEMEM registers, the device disables
the I2C interface during the internal write cycle. Acknowledge polling is required to determine the completion of the write cycle. See
the EEMEM Write-Acknowledge Polling section.
Table 7. Addresses for Writing (Storing) RDAC Settings and User-Defined
Data to EEMEM Registers (R/W = 0, CMD/REG = 0, EE/RDAC = 1)
A4
A3
A2
A1
A0
Data Byte Description
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Store RDAC0 setting to EEMEM01
Store RDAC1 setting to EEMEM11
Store RDAC2 setting to EEMEM21
Store RDAC3 setting to EEMEM31
Store user data to EEMEM4
Store user data to EEMEM5
Store user data to EEMEM6
Store user data to EEMEM7
Store user data to EEMEM8
Store user data to EEMEM9
Store user data to EEMEM10
Store user data to EEMEM11
Store user data to EEMEM12
Store user data to EEMEM13
Store user data to EEMEM14
Store user data to EEMEM15
1
Figure 30 illustrates a random RDAC or EEMEM read operation.
This operation allows users to specify which RDAC or EEMEM
register is read by issuing a dummy write command to change the
RDAC address pointer and then proceeding with the RDAC read
operation at the new address location.
Table 8. Addresses for Reading (Restoring) RDAC Settings and User Data
from EEMEM (R/W = 1, CMD/REG = 0, EE/RDAC = 1)
A4
A3
A2
A1
A0
Data Byte Description
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Read RDAC0 setting from EEMEM0
Read RDAC1 setting from EEMEM1
Read RDAC2 setting from EEMEM2
Read RDAC3 setting from EEMEM3
Read User data from EEMEM4
Read user data from EEMEM5
Read user data from EEMEM6
Read user data from EEMEM7
Read user data from EEMEM8
Read user data from EEMEM9
Read user data from EEMEM10
Read user data from EEMEM11
Read user data from EEMEM12
Read user data from EEMEM13
Read user data from EEMEM14
Read user data from EEMEM15
Users can store any of the 64 RDAC settings for AD5253 or any of the 256
RDAC settings for the AD5254 directly to the EEMEM. This is not limited to
current RDAC wiper setting.
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Rev. D | 16 of 26
Data Sheet
AD5253/AD5254
I2C INTERFACE
S = start condition
P = stop condition
A = acknowledge (SDA low)
A = not acknowledge (SDA high)
AD1, AD0 = I2C device address bits, must match with the logic states at Pins AD1, AD0
R/W = read enable bit at logic high; write enable bit at logic low
CMD/REG = command enable bit at logic high; register access bit at logic low
C3, C2, C1, C0 = command bits
A2, A1, A0 = RDAC/EEMEM register addresses
Figure 29. RDAC Current Read (Restricted to Previously Selected Address Stored in the Register)
Figure 30. RDAC or EEMEM Random Read
Figure 31. RDAC Quick Command Write (Dummy Write)
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Rev. D | 17 of 26
Data Sheet
AD5253/AD5254
I2C INTERFACE
RDAC/EEMEM Quick Commands
The AD5253/AD5254 feature 12 quick commands that facilitate
easy manipulation of RDAC wiper settings and provide RDAC-toEEMEM storing and restoring functions. The command format is
shown in Figure 31, and the command descriptions are shown in
Table 9.
When using a quick command, issuing a third byte is not needed,
but is allowed. The quick commands reset and store RDAC to
EEMEM require acknowledge polling to determine whether the
command has finished executing.
Table 9. RDAC-to-EEMEM Interface and RDAC Operation Quick Command
Bits (CMD/REG = 1, A2 = 0)
C3
C2
C1
C0
Command Description
0
0
0
0
0
0
0
0
1
1
1
1
1
:
:
1
0
0
0
0
1
1
1
1
0
0
0
0
1
:
:
1
0
0
1
1
0
0
1
1
0
0
1
1
0
:
:
1
0
1
0
1
0
1
0
1
0
1
0
1
0
:
:
1
NOP
Restore EEMEM (A1, A0) to RDAC (A1, A0)1
Store RDAC (A1, A0) to EEMEM (A1, A0)
Decrement RDAC (A1, A0) 6 dB
Decrement all RDACs 6 dB
Decrement RDAC (A1, A0) one step
Decrement all RDACs one step
Reset: restore EEMEMs to all RDACs
Increment RDACs (A1, A0) 6 dB
Increment all RDACs 6 dB
Increment RDACs (A1, A0) one step
Increment all RDACs one step
Reserved
:
:
Reserved
1
This command leaves the device in the EEMEM read power state, which
consumes power. Issue the NOP command to return the device to its idle state.
RAB Tolerance Stored in Read-Only Memory
The AD5253/AD5254 feature patented RAB tolerances storage in
the nonvolatile memory. The tolerance of each channel is stored
in the memory during the factory production and can be read by
users at any time. The knowledge of the stored tolerance, which
is the average of RAB over all codes (see Figure 16), allows users
to predict RAB accurately. This feature is valuable for precision,
rheostat mode, and open-loop applications, in which knowledge of
absolute resistance is critical.
The stored tolerances reside in the read-only memory and are
expressed as percentages. Each tolerance is 16 bits long and is
stored in two memory locations (see Table 10). The tolerance data
is expressed in sign magnitude binary format stored in two bytes;
an example is shown in Figure 32. For the first byte in Register N,
the MSB is designated for the sign (0 = + and 1 = –) and the 7
LSB is designated for the integer portion of the tolerance. For the
second byte in Register N + 1, all eight data bits are designated for
the decimal portion of tolerance. As shown in Table 10 and Figure
32, for example, if the rated RAB is 10 kΩ and the data readback
from Address 11000 shows 0001 1100 and Address 11001 shows
0000 1111, then RDAC0 tolerance can be calculated as
MSB: 0 = +
Next 7 MSB: 001 1100 = 28
8 LSB: 0000 1111 = 15 × 2–8 = 0.06
Tolerance = 28.06% and, therefore,
RAB_ACTUAL = 12.806 kΩ
Table 10. Address Table for Reading Tolerance (CMD/REG = 0, EE/RDAC = 1,
A4 = 1)
A4
A3 A2 A1 A0 Data Byte Description
1
1
0
0
0
1
1
1
1
0
0
0
1
1
0
1
1
1
1
0
1
1
0
1
0
1
1
1
1
1
1
0
1
1
0
1
1
1
1
1
Sign and 7-bit integer values of RDAC0 tolerance (read
only)
8-bit decimal value of RDAC0 tolerance (read only)
Sign and 7-bit integer values of RDAC1 tolerance (read
only)
8-bit decimal value of RDAC1 tolerance (read only)
Sign and 7-bit integer values of RDAC2 tolerance (read
only)
8-bit decimal value of RDAC2 tolerance (read only)
Sign and 7-bit integer values of RDAC3 tolerance (read
only)
8-bit decimal value of RDAC3 tolerance (read only)
Figure 32. Format of Stored Tolerance in Sign Magnitude Format with Bit Position Descriptions (Unit is %, Only Data Bytes Are Shown)
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Rev. D | 18 of 26
Data Sheet
AD5253/AD5254
I2C INTERFACE
EEMEM Write-Acknowledge Polling
After each write operation to the EEMEM registers, an internal
write cycle begins. The I2C interface of the device is disabled.
To determine if the internal write cycle is complete and the I2C
interface is enabled, interface polling can be executed. I2C interface
polling can be conducted by sending a start condition followed by
the slave address and the write bit. If the I2C interface responds
with an ACK, the write cycle is complete and the interface is ready
to proceed with further operations. Otherwise, I2C interface polling
can be repeated until it succeeds. Command 2 and Command 7
also require acknowledge polling.
EEMEM Write Protection
Setting the WP pin to logic low after EEMEM programming protects
the memory and RDAC registers from future write operations. In
this mode, the EEMEM and RDAC read operations function as
normal.
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Rev. D | 19 of 26
Data Sheet
AD5253/AD5254
I2C INTERFACE
I2C-COMPATIBLE 2-WIRE SERIAL BUS
Figure 33. General I2C Write Pattern
Figure 34. General I2C Read Pattern
The first byte of the AD5253/AD5254 is a slave address byte (see
Figure 33 and Figure 34). It has a 7-bit slave address and an R/W
bit. The 5 MSB of the slave address is 01011, and the next 2 LSB
is determined by the states of the AD1 and AD0 pins. AD1 and AD0
allow the user to place up to four AD5253/AD5254 devices on one
bus.
AD5253/AD5254 can be controlled via an I2C-compatible serial bus
and are connected to this bus as slave devices. The 2-wire I2C
serial bus protocol (see Figure 33 and Figure 34) follows:
1. The master initiates a data transfer by establishing a start
condition, such that SDA goes from high to low while SCL is
high (see Figure 33). The following byte is the slave address
byte, which consists of the 5 MSB of a slave address defined as
01011. The next two bits are AD1 and AD0, I2C device address
bits. Depending on the states of their AD1 and AD0 bits, four
AD5253/AD5254 devices can be addressed on the same bus.
The last LSB, the R/W bit, determines whether data is read
from or written to the slave device. The slave whose address
corresponds to the transmitted address responds by pulling the
SDA line low during the ninth clock pulse (this is called an
acknowledge bit). At this stage, all other devices on the bus
remain idle while the selected device waits for data to be written
to or read from its serial register.
2. In the write mode (except when restoring EEMEM to the RDAC
register), there is an instruction byte that follows the slave
address byte. The MSB of the instruction byte is labeled CMD/
REG. MSB = 1 enables CMD, the command instruction byte;
MSB = 0 enables general register writing. The third MSB in
the instruction byte, labeled EE/RDAC, is true when MSB =
0 or when the device is in general writing mode. EE enables
the EEMEM register, and REG enables the RDAC register. The
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5 LSB, A4 to A0, designates the addresses of the EEMEM
and RDAC registers (see Figure 27 and Figure 28). When
MSB = 1 or when the device is in CMD mode, the four bits
following the MSB are C3 to C1, which correspond to 12
predefined EEMEM controls and quick commands; there are
also four factory-reserved commands. The 3 LSB—A2, A1, and
A0—are 4-channel RDAC addresses (see Figure 31). After
acknowledging the instruction byte, the last byte in the write
mode is the data byte. Data is transmitted over the serial bus in
sequences of nine clock pulses (eight data bits followed by an
acknowledge bit). The transitions on the SDA line must occur
during the low period of SCL and remain stable during the high
period of SCL (see Figure 33).
3. In current read mode, the RDAC0 data byte immediately follows the acknowledgment of the slave address byte. After an
acknowledgment, RDAC1 follows, then RDAC2, and so on.
(There is a slight difference in write mode, where the last
eight data bits representing RDAC3 data are followed by a no
acknowledge bit.) Similarly, the transitions on the SDA line must
occur during the low period of SCL and remain stable during the
high period of SCL (see Figure 34). Another reading method,
random read method, is shown in Figure 30.
4. When all data bits have been read or written, a stop condition
is established by the master. A stop condition is defined as a
low-to-high transition on the SDA line that occurs while SCL is
high. In write mode, the master pulls the SDA line high during
the 10th clock pulse to establish a stop condition (see Figure
33). In read mode, the master issues a no acknowledge for
the ninth clock pulse, that is, the SDA line remains high. The
master brings the SDA line low before the 10th clock pulse and
then brings the SDA line high to establish a stop condition (see
Figure 34).
Rev. D | 20 of 26
Data Sheet
AD5253/AD5254
THEORY OF OPERATION
The AD5253/AD5254 are quad-channel digital potentiometers in 1
kΩ, 10 kΩ, 50 kΩ, or 100 kΩ that allow 64/256 linear resistance
step adjustments. The AD5253/AD5254 employ double-gate CMOS
EEPROM technology, which allows resistance settings and userdefined data to be stored in the EEMEM registers. The EEMEM
is nonvolatile, such that settings remain when power is removed.
The RDAC wiper settings are restored from the nonvolatile memory
settings during device power-up and can also be restored at any
time during operation.
The AD5253/AD5254 resistor wiper positions are determined by the
RDAC register contents. The RDAC register acts like a scratch-pad
register, allowing unlimited changes of resistance settings. RDAC
register contents can be changed using the device’s serial I2C
interface. The format of the data-words and the commands to
program the RDAC registers are discussed in the I2C Interface
section.
The four RDAC registers have corresponding EEMEM memory
locations that provide nonvolatile storage of resistor wiper position
settings. The AD5253/AD5254 provide commands to store the
RDAC register contents to their respective EEMEM memory locations. During subsequent power-on sequences, the RDAC registers
are automatically loaded with the stored value.
Whenever the EEMEM write operation is enabled, the device activates the internal charge pump and raises the EEMEM cell gate
bias voltage to a high level; this essentially erases the current
content in the EEMEM register and allows subsequent storage of
the new content. Saving data to an EEMEM register consumes
about 35 mA of current and lasts approximately 26 ms. Because of
charge-pump operation, all RDAC channels may experience noise
coupling during the EEMEM writing operation.
The EEMEM restore time in power-up or during operation is about
300 µs. Note that the power-up EEMEM refresh time depends
on how fast VDD reaches its final value. As a result, any supply
voltage decoupling capacitors limit the EEMEM restore time during
power-up. For example, Figure 20 shows the power-up profile of
the VDD where there is no decoupling capacitors and the applied
power is a digital signal. The device initially resets the RDACs to
midscale before restoring the EEMEM contents. The omission of
the decoupling capacitors should only be considered when the fast
restoring time is absolutely needed in the application. In addition,
users should issue a NOP Command 0 immediately after using
Command 1 to restore the EEMEM setting to RDAC, thereby
minimizing supply current dissipation. Reading user data directly
from EEMEM does not require a similar NOP command execution.
In addition to the movement of data between RDAC and EEMEM
registers, the AD5253/AD5254 provide other shortcut commands
that facilitate programming, as shown in Table 11.
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Table 11. Quick Commands
Command
Description
0
1
NOP.
Restore EEMEM content to RDAC. User should issue NOP
immediately after this command to conserve power.
Store RDAC register setting to EEMEM.
Decrement RDAC 6 dB (shift data bits right).
Decrement all RDACs 6 dB (shift all data bits right).
Decrement RDAC one step.
Decrement all RDACs one step.
Reset EEMEM contents to all RDACs.
Increment RDAC 6 dB (shift data bits left).
Increment all RDACs 6 dB (shift all data bits left).
Increment RDAC one step.
Increment all RDACs one step.
Reserved.
2
3
4
5
6
7
8
9
10
11
12 to 15
LINEAR INCREMENT/DECREMENT
COMMANDS
The increment and decrement commands (10, 11, 5, and 6) are
useful for linear step-adjustment applications. These commands
simplify microcontroller software coding by allowing the controller
to send just an increment or decrement command to the AD5253/
AD5254. The adjustments can be directed to a single RDAC or to
all four RDACs.
±6 DB ADJUSTMENTS (DOUBLING/HALVING
WIPER SETTING)
The AD5253/AD5254 accommodate ±6 dB adjustments of the
RDAC wiper positions by shifting the register contents to left/
right for increment/decrement operations, respectively. Command 3,
Command 4, Command 8, and Command 9 can be used to increment or decrement the wiper positions in 6 dB steps synchronously
or asynchronously.
Incrementing the wiper position by +6 dB essentially doubles the
RDAC register value, whereas decrementing the wiper position by
–6 dB halves the register content. Internally, the AD5253/AD5254
use shift registers to shift the bits left and right to achieve a ±6 dB
increment or decrement. The maximum number of adjustments is
nine and eight steps for incrementing from zero scale and decrementing from full scale, respectively. These functions are useful
for various audio/video level adjustments, especially for white LED
brightness settings in which human visual responses are more
sensitive to large adjustments than to small adjustments.
DIGITAL INPUT/OUTPUT CONFIGURATION
SDA is a digital input/output with an open-drain MOSFET that
requires a pull-up resistor for proper communication. On the other
hand, SCL and WP are digital inputs for which pull-up resistors are
recommended to minimize the MOSFET cross-conduction current
when the driving signals are lower than VDD. SCL and WP have
ESD protection diodes, as shown in Figure 35 and Figure 36.
Rev. D | 21 of 26
Data Sheet
AD5253/AD5254
THEORY OF OPERATION
WP can be permanently tied to VDD without a pull-up resistor if the
write-protect feature is not used. If WP is left floating, an internal
current source pulls it low to enable write protection. In applications
in which the device is programmed infrequently, this allows the part
to default to write-protection mode after any one-time factory programming or field calibration without using an on-board pull-down
resistor. Because there are protection diodes on all inputs, the
signal levels must not be greater than VDD to prevent forward
biasing of the diodes.
In wireless base station smart-antenna systems that require arrays
of digital potentiometers to bias the power amplifiers, large numbers of AD5253/AD5254 devices can be addressed by using extra
decoders, switches, and I/O buses, as shown in Figure 38. For
example, to communicate to a total of 16 devices, four decoders
and 16 sets of combinational switches (four sets shown in Figure
38) are needed. Two I/O buses serve as the common inputs of
the four 2 × 4 decoders and select four sets of outputs at each
combination. Because the four sets of combination switch outputs
are unique, as shown in Figure 38, a specific device is addressed
by properly programming the I2C with the slave address defined
as 01011(AD1)(AD0). This operation allows one of 16 devices to
be addressed, provided that the inputs of the two decoders do not
change states. The inputs of the decoders are allowed to change
once the operation of the specified device is completed.
Figure 35. SCL Digital Input
Figure 36. Equivalent WP Digital Input
MULTIPLE DEVICES ON ONE BUS
The AD5253/AD5254 are equipped with two addressing pins, AD1
and AD0, that allow up to four AD5253/AD5254 devices to be
operated on one I2C bus. To achieve this result, the states of
AD1 and AD0 on each device must first be defined. An example
is shown in Table 12 and Figure 37. In I2C programming, each
device is issued a different slave address—01011(AD1)(AD0)—to
complete the addressing.
Table 12. Multiple Devices Addressing
AD1
AD0
Device Addressed
0
0
1
1
0
1
0
1
U1
U2
U3
U4
Figure 37. Multiple AD5253/AD5254 Devices on a Single Bus
analog.com
Figure 38. Four Devices with AD1 and AD0 of 00
TERMINAL VOLTAGE OPERATION RANGE
The AD5253/AD5254 are designed with internal ESD diodes for
protection; these diodes also set the boundaries for the terminal
operating voltages. Positive signals present on Terminal A, Terminal
B, or Terminal W that exceed VDD are clamped by the forwardbiased diode. Similarly, negative signals on Terminal A, Terminal B,
or Terminal W that are more negative than VSS are also clamped
(see Figure 39). In practice, users should not operate VAB, VWA,
and VWB to be higher than the voltage across VDD to VSS, but VAB,
VWA, and VWB have no polarity constraint.
Rev. D | 22 of 26
Data Sheet
AD5253/AD5254
THEORY OF OPERATION
64/256 connection points with 64/256 equal resistance, RS, allowing
them to provide better than 1.5%/0.4% resolution.
Figure 39. Maximum Terminal Voltages Set by VDD and VSS
POWER-UP AND POWER-DOWN SEQUENCES
Because the ESD protection diodes limit the voltage compliance at
Terminal A, Terminal B, and Terminal W (Figure 39), it is important
to power VDD/VSS before applying any voltage to these terminals.
Otherwise, the diodes are forward biased such that VDD/VSS are
powered unintentionally and may affect the user’s circuit. Similarly, VDD/VSS should be powered down last. The ideal power-up
sequence is in the following order: GND, VDD, VSS, digital inputs,
and VA/VB/VW. The order of powering VA, VB, VW, and the digital
inputs is not important, as long as they are powered after VDD/VSS.
Figure 41 provides an equivalent diagram of the connections between the three terminals that make up one channel of the RDAC.
Switches SWA and SWB are always on, but only one of switches
SW(0) to SW(2N–1) can be on at a time (determined by the setting
decoded from the data bit). Because the switches are nonideal,
there is a 75 Ω wiper resistance, RW. Wiper resistance is a function
of supply voltage and temperature: Lower supply voltages and higher temperatures result in higher wiper resistances. Consideration
of wiper resistance dynamics is important in applications in which
accurate prediction of output resistance is required.
LAYOUT AND POWER SUPPLY BIASING
It is always a good practice to employ a compact, minimum leadlength layout design. The leads to the input should be as direct as
possible, with a minimum conductor length. Ground paths should
have low resistance and low inductance.
Similarly, it is also good practice to bypass the power supplies with
quality capacitors. Low equivalent series resistance (ESR) 1 µF
to 10 µF tantalum or electrolytic capacitors should be applied at
the supplies to minimize any transient disturbance and filter low
frequency ripple. Figure 40 illustrates the basic supply-bypassing
configuration for the AD5253/AD5254.
Figure 41. Equivalent RDAC Structure
PROGRAMMABLE RHEOSTAT OPERATION
If either the W-to-B or W-to-A terminal is used as a variable resistor,
the unused terminal can be opened or shorted with W; such
operation is called rheostat mode (see Figure 42). The resistance
tolerance can range ±20%.
Figure 42. Rheostat Mode Configuration
Figure 40. Power Supply-Bypassing Configuration
The ground pin of the AD5253/AD5254 is used primarily as a
digital ground reference. To minimize the digital ground bounce, the
AD5253/AD5254 ground terminal should be joined remotely to the
common ground (see Figure 40).
DIGITAL POTENTIOMETER OPERATION
The structure of the RDAC is designed to emulate the performance
of a mechanical potentiometer. The RDAC contains a string of
resistor segments with an array of analog switches that act as the
wiper connection to the resistor array. The number of points is the
resolution of the device. For example, the AD5253/AD5254 emulate
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The nominal resistance of the AD5253/AD5254 has 64/256 contact
points accessed by the wiper terminal, plus the B terminal contact.
The 6-/8-bit data-word in the RDAC register is decoded to select
one of the 64/256 settings. The wiper’s first connection starts at
the B terminal for Data 0x00. This B terminal connection has a
wiper contact resistance, RW, of 75 Ω, regardless of the nominal
resistance. The second connection (the AD5253 10 kΩ part) is the
first tap point where RWB = 231 Ω (RWB = RAB/64 + RW = 156 Ω
+ 75 Ω) for Data 0x01, and so on. Each LSB data value increase
moves the wiper up the resistor ladder until the last tap point is
reached at RWB = 9919 Ω. See Figure 41 for a simplified diagram of
the equivalent RDAC circuit.
Rev. D | 23 of 26
Data Sheet
AD5253/AD5254
THEORY OF OPERATION
The general equation that determines the digitally programmed
output resistance between W and B is
AD5253: RWB D = D/64 × RAB + 75 Ω
AD5254: RWB D = D/256 × RAB + 75 Ω
(1)
(2)
where:
D is the decimal equivalent of the data contained in the RDAC
latch.
RAB is the nominal end-to-end resistance.
AD5254: RWA D =
256 – D /256 × RAB + 75 Ω
(4)
The typical distribution of RAB from channel-to-channel matches is
about ±0.15% within a given device. On the other hand, device-todevice matching is process-lot dependent with a ±20% tolerance.
PROGRAMMABLE POTENTIOMETER
OPERATION
If all three terminals are used, the operation is called potentiometer
mode (see Figure 44); the most common configuration is the
voltage divider operation.
Figure 44. Potentiometer Mode Configuration
If the wiper resistance is ignored, the transfer function is simply
AD5253: VW =
Figure 43. AD5253 RWA(D) and RWB(D) vs. Decimal Code
Since the digital potentiometer is not ideal, a 75 Ω finite wiper
resistance is present that can easily be seen when the device
is programmed at zero scale. Because of the fine geometric and
interconnects employed by the device, care should be taken to
limit the current conduction between W and B to no more than
±5 mA continuous for a total resistance of 1 kΩ or a pulse of ±20
mA to avoid degradation or possible destruction of the device. The
maximum dc current for AD5253 and AD5254 are shown in Figure
21 and Figure 22, respectively.
Similar to the mechanical potentiometer, the resistance of the
RDAC between Wiper W and Terminal A also produces a digitally
controlled complementary resistance, RWA. When these terminals
are used, the B terminal can be opened. The RWA starts at a
maximum value and decreases as the data loaded into the latch
increases in value (see Figure 43. The general equation for this
operation is
AD5253: RWA D =
analog.com
64 – D /64 × RAB + 75 Ω
(3)
AD5254: VW =
D
64
× VAB + VB
D
256
× VAB + VB
(5)
(6)
A more accurate calculation that includes the wiper resistance
effect is
VW(D) =
D
RAB + RW
2N
RAB + 2RW VA
(7)
where 2N is the number of steps.
Unlike in rheostat mode operation, where the tolerance is high,
potentiometer mode operation yields an almost ratiometric function
of D/2N with a relatively small error contributed by the RW terms.
Therefore, the tolerance effect is almost canceled. Similarly, the ratiometric adjustment also reduces the temperature coefficient effect
to 50 ppm/°C, except at low value codes where RW dominates.
Potentiometer mode operations include other applications such as
op amp input, feedback-resistor networks, and other voltage-scaling
applications. The A, W, and B terminals can, in fact, be input or
output terminals, provided that |VA|, |VW|, and |VB| do not exceed
VDD to VSS.
Rev. D | 24 of 26
Data Sheet
AD5253/AD5254
APPLICATIONS INFORMATION
RGB LED BACKLIGHT CONTROLLER FOR
LCD PANELS
Because high power (>1 W) RGB LEDs offer superior color quality
compared with cold cathode florescent lamps (CCFLs) as backlighting sources, it is likely that high-end LCD panels will employ
RGB LEDs as backlight in the near future. Unlike conventional
LEDs, high power LEDs have a forward voltage of 2 V to 4 V
and consume more than 350 mA at maximum brightness. The
LED brightness is a linear function of the conduction current, but
not of the forward voltage. To increase the brightness of a given
color, multiple LEDs can be connected in series, rather than in
parallel, to achieve uniform brightness. For example, three red
LEDs configured in series require an average of 6 V to 12 V
headroom, but the circuit operation requires current control. As a
result, Figure 45 shows the implementation of one high power RGB
LED controller using an AD5254, a boost regulator, an op amp, and
power MOSFETs.
should be set high enough for proper operation but low enough
to conserve power. The ADP1610’s 1.2 V band gap reference is
buffered to provide the reference level for the voltage dividers set
by the AD5254’s RDAC0 to RDAC2 and Resistor R2 to Resistor
R4. For example, by adjusting the AD5254’s RDAC0, the desirable
voltage appears across the sense resistors, RR. If U2’s output is
set properly, op amp U3A and power MOSFET N1 do whatever
is necessary to regulate the current of the loop. As a result, the
current through the sense resistor and the red LEDs is
IR =
VRR
RR
(8)
R8 is needed to prevent oscillation.
In addition to the 256 levels of adjustable current/brightness, users
can also apply a PWM signal at U3’s SD pin to achieve finer
brightness resolution or better power efficiency.
The ADP1610 (U2 in Figure 45) is an adjustable boost regulator
with its output adjusted by the AD5254’s RDAC3. Such an output
Figure 45. Digital Potentiometer-Based RGB LED Controller
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Rev. D | 25 of 26
Data Sheet
AD5253/AD5254
OUTLINE DIMENSIONS
Figure 46. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
Updated: October 11, 2021
ORDERING GUIDE
Model1
Temperature Range
Package Description
Packing Quantity
Package
Option
AD5253BRUZ10
AD5253BRUZ10-RL7
AD5253BRUZ50
AD5253BRUZ50-RL7
AD5254BRUZ1
AD5254BRUZ10
AD5254BRUZ100
AD5254BRUZ100-RL7
AD5254BRUZ10-RL7
AD5254BRUZ1-RL7
AD5254BRUZ50
AD5254BRUZ50-RL7
AD5254C1-R5
-40°C to +105°C
-40°C to +105°C
-40°C to +105°C
-40°C to +105°C
-40°C to +105°C
-40°C to +105°C
-40°C to +105°C
-40°C to +105°C
-40°C to +105°C
-40°C to +105°C
-40°C to +105°C
-40°C to +105°C
20-Lead TSSOP
20-Lead TSSOP
20-Lead TSSOP
20-Lead TSSOP
20-Lead TSSOP
20-Lead TSSOP
20-Lead TSSOP
20-Lead TSSOP
20-Lead TSSOP
20-Lead TSSOP
20-Lead TSSOP
20-Lead TSSOP
CHIPS OR DIE
Tube, 75
Reel, 1000
Tube, 75
Reel, 1000
Tube, 75
Tube, 75
Tube, 75
Reel, 1000
Reel, 1000
Reel, 1000
Tube, 75
Reel, 1000
Reel, 500
RU-20
RU-20
RU-20
RU-20
RU-20
RU-20
RU-20
RU-20
RU-20
RU-20
RU-20
RU-20
DIE
1
Z = RoHS Compliant Part.
EVALUATION BOARDS
Model1, 2
Package Description
EVAL-AD5254SDZ
Evaluation Board
1
The evaluation board is shipped with the 10 kΩ RAB resistor option. However, the board is compatible with all available resistor value options.
2
Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
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One Analog Way, Wilmington, MA 01887-2356, U.S.A.
Rev. D | 26 of 26