AD5324SRMZ-EP-RL7

AD5324SRMZ-EP-RL7

  • 厂商:

    AD(亚德诺)

  • 封装:

    MSOP-10

  • 描述:

    IC DAC 12BIT V-OUT 10MSOP

  • 数据手册
  • 价格&库存
AD5324SRMZ-EP-RL7 数据手册
2.5 V to 5.5 V, 500 μA, Quad Voltage Output 12-Bit DAC in 10-Lead Package AD5324-EP Enhanced Product FEATURES GENERAL DESCRIPTION Enhanced product features Supports defense and aerospace applications (AQEC) Military temperature range (−55°C to +125°C) Controlled manufacturing baseline One assembly/test site One fabrication site Enhanced product change notification Qualification data available on request Four buffered 12-Bit DACs in 10-lead MSOP S Version: ±10 LSB INL Low power operation: 500 μA at 3 V, 600 μA at 5 V 2.5 V to 5.5 V power supply Guaranteed monotonic by design over all codes Power-down to 80 nA at 3 V, 200 nA at 5 V Double-buffered input logic Output range: 0 V to VREF Power-on reset to 0 V Simultaneous update of outputs (LDAC function) On-chip, rail-to-rail output buffer amplifiers Temperature range –55°C to +125°C The AD5324-EP1 is a quad 12-bit buffered voltage output digital-to-analog converter (DAC) in a 10-lead MSOP package that operates from a single 2.5 V to 5.5 V supply, consuming 500 μA at 3 V. The on-chip output amplifiers allows rail-to-rail output swing to be achieved with a slew rate of 0.7 V/μs. A 3-wire serial interface is used; it operates at clock rates up to 30 MHz and is compatible with standard serial peripheral interface (SPI), QSPI™, MICROWIRE™, and DSP interface standards. APPLICATIONS Full details about this enhanced product are available in the AD5324 data sheet, which must be consulted in conjunction with this data sheet. The references for the four DACs are derived from one reference pin. The outputs of all DACs can be updated simultaneously using the software LDAC function. The part incorporates a power-on reset circuit and ensures that the DAC outputs power up to 0 V and remains there until a valid write takes place to the device. The part contains a power-down feature that reduces the current consumption of the device to 200 nA at 5 V (80 nA at 3 V). The low power consumption of this part in normal operation makes it ideally suited to portable battery-operated equipment. The power consumption is 3 mW at 5 V, and 1.5 mW at 3 V, reducing to 1 μW in power-down mode. Portable battery-powered instruments Digital gain and offset adjustment Programmable voltage and current sources Programmable attenuators Industrial process control 1 Protected by U.S. Patent No. 5,969,657. FUNCTIONAL BLOCK DIAGRAM VDD AD5324-EP REFIN LDAC BUFFER INPUT REGISTER DAC REGISTER STRING DAC A INPUT REGISTER DAC REGISTER STRING DAC B INPUT REGISTER DAC REGISTER STRING DAC C INPUT REGISTER DAC REGISTER STRING DAC D VOUTA BUFFER SYNC INTERFACE LOGIC SCLK VOUTB BUFFER DIN VOUTC BUFFER POWER-DOWN LOGIC GND 08971-001 POWER-ON RESET VOUTD Figure 1. Rev. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2010–2019 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com AD5324-EP Enhanced Product TABLE OF CONTENTS Features .............................................................................................. 1  Timing Characteristics .................................................................5  Applications ....................................................................................... 1  Absolute Maximum Ratings ............................................................6  General Description ......................................................................... 1  ESD Caution...................................................................................6  Functional Block Diagram .............................................................. 1  Pin Configuration and Function Descriptions..............................7  Revision History ............................................................................... 2  Typical Performance Characteristics ..............................................8  Specifications..................................................................................... 3  Outline Dimensions ....................................................................... 11  AC Characteristics........................................................................ 4  Ordering Guide .......................................................................... 11  REVISION HISTORY 6/2019—Rev. 0 to Rev. A Changes to Patent Information ....................................................... 1 Changes to Offset Error Parameter, Table 1 and Gain Error Parameter, Table 1............................................................................. 3 Changes to Peak Temperature Parameter, Table 4 ....................... 6 Updated Outline Dimensions ....................................................... 11 4/2010—Revision 0: Initial Version Rev. A | Page 2 of 11 Enhanced Product AD5324-EP SPECIFICATIONS VDD = 2.5 V to 5.5 V; VREF = 2 V; RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications TMIN to TMAX, unless otherwise noted. Table 1. Parameter DC PERFORMANCE 1 Resolution Relative Accuracy Differential Nonlinearity 2 Offset Error Gain Error Lower Dead Band Offset Error Drift 3 Gain Error Drift3 DC Power Supply Rejection Ratio3 DC Crosstalk3 DAC REFERENCE INPUTS3 VREF Input Range VREF Input Impedance Min S Version Typ 12 ±2 ±0.2 ±0.4 ±0.15 20 –12 –5 –60 200 0.25 37 Reference Feedthrough OUTPUT CHARACTERISTICS3 Minimum Output Voltage 4 Maximum Output Voltage4 DC Output Impedance Short Circuit Current ±10 ±1 ±3 ±1 60 VDD 45 >10 –90 0.001 VDD – 0.001 0.5 25 16 2.5 5 Power-Up Time LOGIC INPUTS3 Input Current VIL, Input Low Voltage VIH, Input High Voltage Max V kΩ MΩ dB Ω mA mA μs μs ±1 0.8 0.6 0.5 2.4 3 2.5 Bits LSB LSB % of FSR % of FSR mV ppm of FSR/°C ppm of FSR/°C dB μV V 2.1 2.0 Pin Capacitance POWER REQUIREMENTS VDD IDD (Normal Mode) 5 VDD = 4.5 V to 5.5 V VDD = 2.5 V to 3.6 V IDD (Power-Down Mode) VDD = 4.5 V to 5.5 V VDD = 2.5 V to 3.6 V Unit μA V V V V V V pF Conditions/Comments Guaranteed monotonic by design over all codes See Figure 6 and Figure 8 See Figure 6 and Figure 8 Lower dead band exists only if offset error is negative ΔVDD = ±10% RL = 2 kΩ to GND or VDD Normal operation Power-down mode Frequency = 10 kHz Measurement of the minimum and maximum V drive capability of the output amplifier VDD = 5 V VDD = 3 V Coming out of power-down mode VDD = 5 V Coming out of power-down mode VDD = 3 V VDD = 5 V ± 10% VDD = 3 V ± 10% VDD = 2.5 V VDD = 5 V ± 10% VDD = 3 V ± 10% VDD = 2.5 V 5.5 V 600 500 900 700 μA μA VIH = VDD and VIL = GND VIH = VDD and VIL = GND 0.2 0.08 1 1 μA μA VIH = VDD and VIL = GND VIH = VDD and VIL = GND DC specifications tested with the outputs unloaded. Linearity is tested using a reduced code range: Code 115 to Code 3981. Guaranteed by design and characterization, not production tested. 4 For the amplifier output to reach the minimum voltage, offset error must be negative. For the amplifier output to reach the maximum voltage, VREF = VDD and offset plus gain error must be positive. 5 IDD specification is valid for all DAC codes; interface inactive; all DACs active; load currents excluded. 1 2 3 Rev. A | Page 3 of 11 AD5324-EP Enhanced Product AC CHARACTERISTICS VDD = 2.5 V to 5.5 V; RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications TMIN to TMAX, unless otherwise noted. Table 2. Parameter Output Voltage Settling Time 1 S Version 2 Min Typ Max Slew Rate Major Code Transition Glitch Energy Digital Feedthrough Digital Crosstalk DAC-to-DAC Crosstalk Multiplying Bandwidth Total Harmonic Distortion 1 2 8 0.7 12 1 1 3 200 –70 10 Unit μs V/μs nV-sec nV-sec nV-sec nV-sec kHz dB Guaranteed by design and characterization, not production tested. Temperature range (S Version): −55°C to +125°C; typical at +25°C. Rev. A | Page 4 of 11 Conditions/Comments VREF = VDD = 5 V ¼ scale to ¾ scale change (0x400 to 0xC00) 1 LSB change around major carry VREF = 2 V ± 0.1 V p-p VREF = 2.5 V ± 0.1 V p-p; frequency = 10 kHz Enhanced Product AD5324-EP TIMING CHARACTERISTICS VDD = 2.5 V to 5.5 V; all specifications TMIN to TMAX, unless otherwise noted. Table 3. Parameter 1, 2, 3 t1 t2 t3 t4 t5 t6 t7 t8 Limit at TMIN, TMAX VDD = 2.5 V to 3.6 V VDD = 3.6 V to 5.5 V 40 33 16 13 16 13 16 13 5 5 4.5 4.5 0 0 80 33 Unit ns min ns min ns min ns min ns min ns min ns min ns min Conditions/Comments SCLK cycle time SCLK high time SCLK low time SYNC to SCLK falling edge setup time Data setup time Data hold time SCLK falling edge to SYNC rising edge Minimum SYNC high time Guaranteed by design and characterization, not production tested. All input signals are specified with tr = tf = 5 ns (10% to 90 % of VDD) and timed from a voltage level of (VIL + VIH)/2. 3 See Figure 2. 1 2 t1 SCLK t8 t3 t4 t2 t7 SYNC DIN DB15 t5 DB0 Figure 2. Serial Interface Timing Diagram Rev. A | Page 5 of 11 00929-002 t6 AD5324-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 4. Parameter1 VDD to GND Digital Input Voltage to GND Reference Input Voltage to GND VOUTA through VOUTD to GND Operating Temperature Range Industrial (EP Version) Storage Temperature Range Junction Temperature (TJ max) 10-Lead MSOP Power Dissipation θJA Thermal Impedance θJC Thermal Impedance Reflow Soldering Peak Temperature Time at Peak Temperature 1 Rating –0.3 V to +7 V –0.3 V to VDD + 0.3 V –0.3 V to VDD + 0.3 V –0.3 V to VDD + 0.3 V –55°C to +125°C –65°C to +150°C 150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. ESD CAUTION (TJ max – TA)/ θJA 206°C/W 44°C/W 260°C 10 sec to 40 sec Transient currents of up to 100 mA do not cause SCR latch-up. Rev. A | Page 6 of 11 Enhanced Product AD5324-EP PIN CONFIGURATION AND FUNCTION DESCRIPTIONS VOUTB 3 VOUTC 4 REFIN 5 10 SYNC AD5324-EP TOP VIEW (Not to Scale) 9 SCLK 8 DIN 7 GND 6 VOUTD 08971-003 VDD 1 VOUTA 2 Figure 3. MSOP Pin Configuration Table 5. Pin Function Descriptions Pin No. 1 2 3 4 5 6 7 8 Mnemonic VDD VOUTA VOUTB VOUTC REFIN VOUTD GND DIN 9 SCLK 10 SYNC Description Power Supply Input. This part can be operated from 2.5 V to 5.5 V and the supply can be decoupled to GND. Buffered Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation. Buffered Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation. Buffered Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation. Reference Input Pin for All Four DACs. It has an input range from 0.25 V to VDD. Buffered Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation. Ground Reference Point for All Circuitry on the Part. Serial Data Input. This device has a 16-bit shift register. Data is clocked into the register on the falling edge of the serial clock input. The DIN input buffer is powered down after each write cycle. Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. Data can be transferred at clock speeds up to 30 MHz. The SCLK input buffer is powered down after each write cycle. Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes low, it enables the input shift register and data is transferred in on the falling edges of the following 16 clocks. If SYNC is taken high before the 16th falling edge of SCLK, the rising edge of SYNC acts as an interrupt and the write sequence is ignored by the device. Rev. A | Page 7 of 11 AD5324-EP Enhanced Product TYPICAL PERFORMANCE CHARACTERISTICS 2.0 12 TA = 25°C VDD = 5V MAX INL 1.5 8 ERROR (LSB) INL ERROR (LSB) 1.0 4 0 MAX DNL 0.5 MIN DNL 0 0.5 –4 1.0 –8 0 500 1000 1500 2000 2500 3000 3500 4000 CODE 2.0 80 08971-004 –12 40 20 0 40 20 60 80 100 120 140 TEMPERATURE (°C) Figure 7. INL and DNL Error vs. Temperature Figure 4. Typical Integral Nonlinearity (INL) Plot 0.2 1.0 TA = 25°C VDD = 5V TA = 25°C VREF = 2V 0.1 GAIN ERROR 0 ERROR (%) 0.5 DNL ERROR (LSB) 60 08971-023 MIN INL 1.5 0 –0.1 –0.2 –0.3 –0.4 –0.5 OFFSET ERROR 0 500 1000 1500 2000 2500 3000 3500 4000 CODE –0.6 08971-005 –1.0 0 1 2 3 5 6 Figure 8. Offset Error and Gain Error vs. VDD Figure 5. Typical Differential Nonlinearity (DNL) Plot 0.8 5 0.7 5V SOURCE 0.6 4 GAIN ERROR 0.5 VOUT (V) 0.4 0.3 0.2 3V SOURCE 3 2 0.1 5V SINK 3V SINK OFFSET ERROR 0 1 –0.2 –80 –60 –40 –20 0 20 40 60 80 100 120 TEMPERATURE (°C) 140 0 0 1 2 3 4 5 SINK/SOURCE CURRENT (mA) Figure 6. Offset Error and Gain Error vs. Temperature Figure 9. VOUT Source and Sink Current Capability Rev. A | Page 8 of 11 6 08971-009 –0.1 08971-022 ERROR (%) 4 VDD (V) 08971-008 –0.5 Enhanced Product 600 AD5324-EP 1000 TA = 25°C VDD = 5V VREF = 2V 500 TA = 25°C 900 800 IDD (µA) IDD (µA) 400 300 VDD = 5V 700 600 200 VDD = 3V 500 100 FULL SCALE CODE 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VLOGIC (V) Figure 10. Supply Current vs. DAC Code Figure 13. Supply Current vs. Logic Input Voltage 600 TA = 25°C VDD = 5V VREF = 5V –40°C 500 +25°C 400 CH1 VOUTA IDD (µA) +105°C 300 200 SCLK CH2 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) CH1 1V, CH2 5V, TIME BASE = 1µs/DIV 08971-014 0 2.5 08971-011 100 Figure 14. Half-Scale Settling (¼ to ¾ Scale Code Change) Figure 11. Supply Current vs. Supply Voltage 0.5 TA = 25°C VDD = 5V VREF = 2V CH1 VDD CH2 VOUTA 0.3 –40°C 0.2 +25°C 0.1 0 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V) 5.5 CH1 2V, CH2 200mV, TIME BASE = 200µs/DIV Figure 15. Power-On Reset to 0 V Figure 12. Power-Down Current vs. Supply Voltage Rev. A | Page 9 of 11 08971-015 +105°C 08971-012 IDD (µA) 0.4 08971-013 ZERO SCALE 08971-010 400 0 AD5324-EP Enhanced Product 10 TA = 25°C VDD = 5V VREF = 2V 0 –10 VOUTA CH1 (dB) –20 –30 SCLK CH2 –40 CH1 500mV, CH2 5V, TIME BASE = 1µs/DIV –60 10 100 1k 10k 100k 1M 10M FREQUENCY (Hz) Figure 16. Exiting Power-Down to Midscale 08971-019 08971-016 –50 Figure 19. Multiplying Bandwidth (Small-Signal Frequency Response) 0.02 350 400 450 500 550 600 IDD (µA) 0.01 0 –0.01 –0.02 0 1 2 3 4 5 6 VREF (V) Figure 17. IDD Histogram with VDD = 3 V and VDD = 5 V Figure 20. Full-Scale Error vs. VREF 2.50 VOUT (V) 1mV/DIV 2.49 1µs/DIV 150ns/DIV Figure 21. DAC-to-DAC Crosstalk Figure 18. Major-Code Transition Glitch Energy Rev. A | Page 10 of 11 08971-021 2.47 08971-018 2.48 08971-020 300 VDD = 5V 08971-017 FREQUENCY VDD = 3V FULL-SCALE ERROR (V) VDD = 5V TA = 25°C Enhanced Product AD5324-EP OUTLINE DIMENSIONS 3.10 3.00 2.90 10 3.10 3.00 2.90 5.15 4.90 4.65 6 1 5 PIN 1 IDENTIFIER 0.50 BSC 0.95 0.85 0.75 15° MAX 1.10 MAX 0.30 0.15 6° 0° 0.23 0.13 0.70 0.55 0.40 COMPLIANT TO JEDEC STANDARDS MO-187-BA 091709-A 0.15 0.05 COPLANARITY 0.10 Figure 22. 10-Lead Mini Small Outline Package [MSOP] (RM-10) Dimensions shown in millimeters ORDERING GUIDE Model1 AD5324SRMZ-EP-RL7 1 Temperature Range –55°C to +125°C Package Description 10-Lead Mini Small Outline Package (MSOP) Z = RoHS Compliant Part. ©2010–2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08971-0-6/19(A) Rev. A | Page 11 of 11 Package Option RM-10 Marking Code DFT
AD5324SRMZ-EP-RL7 价格&库存

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