Internally Trimmed
Integrated Circuit Multiplier
AD532
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Pretrimmed to ±1.0% (AD532K)
No external components required
Guaranteed ±1.0% maximum 4-quadrant error (AD532K)
Differential inputs for (X1 − X2) (Y1 − Y2)/10 V transfer function
Monolithic construction, low cost
VX
X1
X2
R
R
X
VY
Z
Y1
OUTPUT
Y2
10R
APPLICATIONS
Multiplication, division, squaring, square rooting
Algebraic computation
Power measurements
Instrumentation applications
Available in chip form
GENERAL DESCRIPTION
The AD532 is the first pretrimmed, single chip, monolithic
multiplier/divider. It guarantees a maximum multiplying error
of ±1.0% and a ±10 V output voltage without the need for any
external trimming resistors or output op amp. Because the AD532
is internally trimmed, its simplicity of use provides design
engineers with an attractive alternative to modular multipliers,
and its monolithic construction provides significant advantages
in size, reliability, and economy. Further, the AD532 can be a
direct replacement for other IC multipliers that require external
trim networks.
FLEXIBILITY OF OPERATION
The AD532 multiplies in four quadrants with a transfer function of
(X1 − X2)(Y1 − Y2)/10 V, divides in two quadrants with a 10 V Z/
(X1 − X2) transfer function, and square roots in one quadrant
with a transfer function of 10 V Z . In addition to these basic
functions, the differential X and Y inputs provide significant
operating flexibility both for algebraic computation and transducer
instrumentation applications. Transfer functions, such as XY/10 V,
(X2 − Y2)/10 V, ±X2/10 V, and 10 V Z/(X1 − X2), are easily attained
and are extremely useful in many modulation and function
generation applications, as well as in trigonometric calculations
for airborne navigation and guidance applications, where the
monolithic construction and small size of the AD532 offer
considerable system advantages. In addition, the high commonmode rejection ratio (CMRR) (75 dB) of the differential inputs
makes the AD532 especially well qualified for instrumentation
applications, as it can provide an output signal that is the product of
two transducer generated input signals.
Rev. E
R
(WITH Z TIED TO OUTPUT)
00502-003
VOS
(X1 – X2) (Y1 – Y2)
VOUT =
10V
Figure 1.
GUARANTEED PERFORMANCE OVER
TEMPERATURE
The AD532J and AD532K are specified for maximum multiplying
errors of ±2% and ±1% of full scale, respectively at 25°C, and
are rated for operation from 0°C to 70°C. The AD532S has a
maximum multiplying error of ±1% of full scale at 25°C; it is
also 100% tested to guarantee a maximum error of ±4% at the
extended operating temperature limits of −55°C and +125°C.
All devices are available in either a hermetically sealed TO-100
metal can or 14-lead D-14 side brazed ceramic DIP. The J, K,
and S grade chips are also available.
ADVANTAGES OF ON THE CHIP TRIMMING OF
THE MONOLITHIC AD532
1.
2.
3.
4.
5.
True ratiometric trim for improved power supply rejection.
Reduced power requirements since no networks across
supplies are required.
More reliable because standard monolithic assembly
techniques can be used rather than more complex hybrid
approaches.
High impedance X and Y inputs with negligible circuit
loading.
Differential X and Y inputs for noise rejection and additional
computational flexibility.
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Technical Support
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AD532
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Functional Description .....................................................................9
Applications ....................................................................................... 1
AD532 Performance Characteristics ........................................... 10
General Description ......................................................................... 1
Nonlinearity ................................................................................ 10
Flexibility of Operation .................................................................... 1
AC Feedthrough ......................................................................... 10
Functional Block Diagram .............................................................. 1
Common-Mode Rejection ........................................................ 10
Guaranteed Performance Over Temperature ............................... 1
Dynamic Characteristics ........................................................... 10
Advantages of On The Chip Trimming of The Monolithic
AD532 ................................................................................................ 1
Power Supply Considerations ................................................... 10
Revision History ............................................................................... 2
Applications..................................................................................... 11
Specifications..................................................................................... 3
Replacing Other IC Multipliers ................................................ 11
Thermal Resistance .......................................................................... 5
Square Root ................................................................................. 12
Chip Dimensions And Bonding Diagram ................................ 5
Difference of Squares ................................................................. 12
ESD Caution .................................................................................. 5
Additional Information ............................................................. 12
Pin Configuration and Function Descriptions ............................. 6
Outline Dimensions ....................................................................... 13
Typical Performance Characteristics ............................................. 7
Ordering Guide .......................................................................... 13
Noise Characteristics ................................................................. 10
REVISION HISTORY
9/15—Rev. D to Rev. E
Deleted E-20-1 Package ................................................ Throughout
Changes to Guaranteed Performance Over Temperature Section ... 1
Deleted Figure 4; Renumbered Sequentially................................. 6
Deleted Table 4; Renumbered Sequentially .................................. 7
Changes to Figure 14, Figure 15, and Figure 16 ......................... 11
Changes to Figure 17 and Figure 18 ............................................. 12
Added Additional Information Section....................................... 12
Updated Outline Dimensions ....................................................... 13
Changes to Ordering Guide .......................................................... 14
2/11—Rev. C to Rev. D
Updated Format .................................................................. Universal
Added Pin Configuration and Function Descriptions Section .. 6
Added Typical Performance Characteristics Section .................. 8
Changes to Figure 11 ........................................................................ 8
Changes to Figure 12 and Figure 13 ............................................... 9
Changes to Ordering Guide .......................................................... 15
2/01—Revision 0: Initial Version
Rev. E | Page 2 of 14
Data Sheet
AD532
SPECIFICATIONS
At 25°C, VS = ±15 V, R ≥ 2 kΩ VOS grounded, unless otherwise noted.
Table 1.
Model
MULTIPLIER PERFORMANCE
Transfer Function
Test Conditions
Min
AD532J
Typ
Max
( X 1 X 2 ) (Y1 Y2 )
Min
( X 1 X 2 ) (Y1 Y2 )
10 V
Total Error
TA = Minimum to Maximum
Total Error vs. Temperature
Supply Rejection
Nonlinearity, X
Nonlinearity, Y
Feedthrough, X
−10 V ≤ X, Y ≤ +10 V
±15 V ±10%
X = 20 V p-p, Y = 10 V
Y = 20 V p-p, X = 10 V
Y nulled, X = 20 V p-p 50 Hz
Feedthrough, Y (X Nulled,
Y = 20 V p-p 50 Hz)
Feedthrough vs.
Temperature
Feedthrough vs. Power
Supply
DYNAMICS
Small Signal BW
1% Amplitude Error
Slew Rate
Settling Time
NOISE
Wideband Noise
f = 5 Hz to 10 kHz
f = 5 Hz to 5 MHz
OUTPUT
Voltage Swing
Impedance
Offset Voltage
Offset Voltage vs.
Temperature
Offset Voltage vs. Supply
INPUT AMPLIFIERS (X, Y, and Z)
Signal Voltage Range
CMRR
Input Bias Current
X, Y Inputs
X, Y Inputs TMIN to TMAX
Z Input
Z Input TMIN to TMAX
Offset Current
Differential Resistance
DIVIDER PERFORMANCE
Transfer Function
Total Error
VOUT = 0.1 rms
VOUT 20 p-p
to 2%, ΔVOUT = 20 V
±10
f ≤ 1 kHz
Differential or CM
operating differential
±1.5
±2.5
±0.04
±0.05
± 0.8
±0.3
50
30
AD532S
Typ
Max
Unit
( X 1 X 2 ) (Y1 Y2 )
10 V
±1.0
±0.5
200
±0.7
±1.5
±0.03
±0.05
±0.5
±0.2
30
100
±0.01
±0.05
±0.5
±0.2
30
100
%
%
%/°C
%/%
%
%
mV
150
25
80
25
80
mV
±1.0
±4.0
±0.04
2.0
1.0
1.0
mV p-p/°C
±0.25
±0.25
±0.25
mV/%
1
75
45
1
1
75
45
1
1
75
45
1
MHz
kHz
V/μs
μs
0.6
0.6
0.6
mV (rms)
3.0
3.0
3.0
mV (rms)
±13
1
V
Ω
mV
mV/°C
±13
1
±40
0.7
±10
±13
1
±10
±30
±30
2.0
0.7
±2.5
±2.5
±2.5
mV/%
±10
±10
±10
V
50
3
10
±10
±30
±0.3
10
VX = −10 V, −10 V ≤ VZ ≤
+10 V
VX = −1 V, −10 V ≤ VZ ≤
+10 V
Min
10 V
±2.0
40
X l > X2
AD532K
Typ
Max
10 V Z/(X1 − X2)
50
1.5
8
±5
±25
±0.1
10
4
±15
10 V Z/(X1 − X2)
dB
1.5
8
±5
±25
±0.1
10
4
±15
μA
μA
μA
μA
μA
MΩ
10 V Z/(X1 − X2)
±2
±1
±1
%
±4
±3
±3
%
Rev. E | Page 3 of 14
AD532
Model
SQUARE PERFORMANCE
Data Sheet
Test Conditions
Min
POWER SUPPLY
SPECIFICATIONS
Supply Voltage
Rated Performance
Operating
Supply Current
Quiescent
Min
0 V ≤ VZ ≤ 10 V
AD532K
Typ
Max
Min
AD532S
Typ
Max
( X1 X 2 )
( X1 X 2 )
( X1 X 2 )
10 V
10 V
10 V
±0.8
±0.4
10 V Z
10 V Z
±1.5
±1.0
2
Transfer Function
Total Error
SQUARE ROOTER
PERFORMANCE
Transfer Function
Total Error
AD532J
Typ
Max
2
±15
±10
4
±0.4
6
Rev. E | Page 4 of 14
±10
±1.0
%
±15
±18
4
%
10 V Z
±15
±18
Unit
2
6
±10
4
±22
V
V
6
mA
Data Sheet
AD532
THERMAL RESISTANCE
Table 2. Thermal Resistance
Package Type
H-10A
D-14
θJA
150
85
θJC
25
22
CHIP DIMENSIONS AND BONDING DIAGRAM
Contact factory for the latest dimensions. Dimensions are
shown in inches and (millimeters).
Unit
°C/W
°C/W
0.107
(2.718)
–VS
OUTPUT
Z
X1
0.062
(1.575)
+VS
Y1
X2
GND
Figure 2.
ESD CAUTION
Rev. E | Page 5 of 14
VOS
Y2
00502-002
θJA is specified for the worst case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
AD532
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Y2
VOS
GND
+VS
13
Y1
12
Y2
TOP VIEW
(Not to Scale)
X2
X1
OUT
–VS
00502-103
Z
9
X2
X1 7
8
NC
Figure 4. 14-Lead Side Brazed DIP (D-14)
Table 3. 10-Lead Header Pin Function Descriptions
Description
Y Multiplicand Input 1
Positive Supply Voltage
Dual Purpose Input
Product Output
Negative Supply Voltage
X Multiplicand Input 1
X Multiplicand Input 2
Common
Output Offset Adjust
Y Multiplicand Input 2
Table 4. 14-Lead Side Brazed DIP Pin Function Descriptions
Mnemonic
Z
OUT
−VS
NC
X1
X2
GND
VOS
Y2
Y1
+VS
NC 6
NC = NO CONNECT.
DO NOT CONNECT TO THIS PIN.
Figure 3. 10-Lead Header Pin Configuration (H-10)
Mnemonic
Y1
+VS
Z
OUT
−VS
X1
X2
GND
VOS
Y2
AD532
TOP VIEW 11 VOS
(Not to Scale)
10 GND
NC 5
NC 4
AD532
Pin No.
1
2
3
4, 5, 6, 8
7
9
10
11
12
13
14
14
–VS 3
+VS
Pin No.
1
2
3
4
5
6
7
8
9
10
Z 1
OUT 2
00502-105
Y1
Description
Dual Purpose Input
Product Output
Negative Supply Voltage
No Connection
X Multiplicand Input 1
X Multiplicand Input 2
Common
Output Offset Adjust
Y Multiplicand Input 2
Y Multiplicand Input 1
Positive Supply Voltage
Rev. E | Page 6 of 14
Data Sheet
AD532
TYPICAL PERFORMANCE CHARACTERISTICS
1
70
60
Y COMMON-MODE REJ
(X1 – X2) = +10V
XIN
CMRR (dB)
DISTORTION (%)
50
YIN
0.1
40
X COMMON-MODE REJ
(Y1 – Y2) = +10V
30
20
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PEAK SIGNAL AMPLITUDE (V)
0
100
00502-005
0.01
1k
10k
100k
1M
10M
FREQUENCY (Hz)
Figure 5. Distortion vs. Peak Signal Amplitude
00502-008
10
Figure 8. CMRR vs. Frequency
1
100
20V p-p SIGNAL
RL = 2kΩ, CL = 1000pF
AMPLITUDE (V)
DISTORTION (%)
10
1
RL = 2kΩ, CL = 0pF
0.1
XIN
100
1k
10k
100k
1M
FREQUENCY (Hz)
0.01
10k
00502-006
0.1
10
1M
10M
FREQUENCY (Hz)
Figure 6. Distortion vs. Frequency
Figure 9. Frequency Response, Multiplying
1k
10
VZ = 0.1 × VX sin ωT
Y FEEDTHROUGH
AMPLITUDE (V)
100
X FEEDTHROUGH
10
1
VX = 10V
VX = 1V
1
100
1k
10k
100k
1M
FREQUENCY (Hz)
10M
0.1
10k
100k
1M
FREQUENCY (Hz)
Figure 7. Feedthrough vs. Frequency
Figure 10. Frequency Response, Dividing
Rev. E | Page 7 of 14
10M
00502-010
VX = 5V
00502-007
FEEDTHROUGH (mV)
100k
00502-009
YIN
AD532
Data Sheet
5
4
12
SPOT NOISE (µV/ Hz)
SATURATED OUTPUT
SWING
10
MAX X OR Y INPUT
FOR 1% LINEARITY
8
2
12
14
16
18
POWER SUPPLY VOLTAGE (V)
20
22
0
10
100
1k
10k
FREQUENCY (Hz)
Figure 11. Signal Swing vs. Supply
Figure 12. Spot Noise vs. Frequency
Rev. E | Page 8 of 14
100k
00502-012
4
10
3
1
6
00502-011
PEAK SIGNAL VOLTAGE (±V)
14
Data Sheet
AD532
FUNCTIONAL DESCRIPTION
The product of the two inputs is resolved in the multiplier cell
using Gilbert’s linearized transconductance technique. The cell
is laser trimmed to obtain VOUT = (X1 − X2)(Y1 − Y2)/10 V. The
built in op amp is used to obtain low output impedance and make
possible self contained operation. The residual output voltage offset
can be zeroed at VOS in critical applications. Otherwise, the VOS pin
should be grounded.
The functional block diagram for the AD532 is shown in Figure 1
and the complete schematic in Figure 13. In the multiplying and
squaring modes, Z is connected to the output to close the feedback
around the output op amp. In the divide mode, it is used as an
input terminal.
The X and Y inputs are fed to high impedance differential
amplifiers featuring low distortion and good common-mode
rejection. The amplifier voltage offsets are actively laser trimmed to
zero during production.
X2
+VS
R6
R2
R8
R23
R16
R27
Z
C1
Q2
Q1
Q7 Q8
Q14 Q15
X1
Q25
R22
R9
R1
R33
Q21
R20
R34
Y1
Q16 Q17
Q3
VOS
Q10
Q9
R13
Q4
R21
Q22 Q26
R3
R31
R30
R28
COM
Q12
Q11
Q6
R29
Q24
R32
R19
R11
R14
R4
Y2
R5
Q28
R12
Q27
Q20
Q19
Q13
R15
R24
R25
R26
–VS CAN
R18
Figure 13. Schematic Diagram
Rev. E | Page 9 of 14
00502-004
Q5
OUTPUT
Q23
Q18
R10
AD532
Data Sheet
AD532 PERFORMANCE CHARACTERISTICS
Multiplication accuracy is defined in terms of total error at 25°C
with the rated power supply. The value specified is in percent of
full scale and includes XIN and YIN nonlinearities, feedback and
scale factor error. To this must be added such application
dependent error terms as power supply rejection, commonmode rejection and temperature coefficients (although worst
case error over temperature is specified for the AD532S). Total
expected error is the rms sum of the individual components
because they are uncorrelated.
Accuracy in the divide mode is only a little more complex. To
achieve division, the multiplier cell must be connected in the
feedback of the output op amp as shown in Figure 16. In this
configuration, the multiplier cell varies the closed-loop gain of
the op amp in an inverse relationship to the denominator voltage.
Therefore, as the denominator is reduced, output offset, bandwidth,
and other multiplier cell errors are adversely affected. The divide
error and drift are then εm × 10 V/(X1 − X2), where εm represents
multiplier full-scale error and drift and (X1 − X2) is the absolute
value of the denominator.
NONLINEARITY
Nonlinearity is easily measured in percent harmonic distortion.
The curves of Figure 5 and Figure 6 characterize output distortion
as a function of input signal level and frequency respectively,
with one input held at plus or minus 10 V dc. In Figure 6, the
sine wave amplitude is 20 V p-p.
AC FEEDTHROUGH
AC feedthrough is a measure of the multiplier’s zero suppression.
With one input at zero, the multiplier output should be zero
regardless of the signal applied to the other input. Feedthrough
as a function of frequency for the AD532 is shown in Figure 7.
It is measured for the condition VX = 0, VY = 20 V p-p and VY = 0,
VX = 20 V (p-p) over the given frequency range. It consists
primarily of the second harmonic and is measured in millivolts
peak-to-peak.
COMMON-MODE REJECTION
The AD532 features differential X and Y inputs to enhance its
flexibility as a computational multiplier/divider. Common-mode
rejection for both inputs as a function of frequency is shown in
Figure 8. It is measured with X1 = X2 = 20 V p-p, (Y1 − Y2) = 10 V
dc and Y1 = Y2 = 20 V p-p, (X1 − X2) = 10 V dc.
DYNAMIC CHARACTERISTICS
The closed-loop frequency response of the AD532 in the multiplier
mode typically exhibits a 3 dB bandwidth of 1 MHz and rolls off
at 6 dB/octave, thereafter. Response through all inputs is essentially
the same as shown in Figure 9. In the divide mode, the closedloop frequency response is a function of the absolute value of
the denominator voltage as shown in Figure 10.
Stable operation is maintained with capacitive loads to 1000 pF
in all modes, except the square root for which 50 pF is a safe
upper limit. Higher capacitive loads can be driven if a 100 Ω
resistor is connected in series with the output for isolation.
POWER SUPPLY CONSIDERATIONS
Although the AD532 is tested and specified with ±15 V dc
supplies, the device may be operated at any supply voltage from
±10 V to ±18 V for the J and K versions, and ±10 V to ±22 V
for the S version. The input and output signals must be reduced
proportionately to prevent saturation; however, with supply
voltages below ±15 V, as shown in Figure 11. Because power
supply sensitivity is not dependent on external null networks as
in other conventionally nulled multipliers, the power supply
rejection ratios are improved from 3 to 40 times in the AD532.
NOISE CHARACTERISTICS
The AD532 is sampled to assure that output noise will have no
appreciable effect on accuracy. Typical spot noise vs. frequency
is shown in Figure 12.
Rev. E | Page 10 of 14
Data Sheet
AD532
APPLICATIONS
Z
X1
X2
AD532
VIN
20kΩ
X1
X2
Z
VOUT
OUT
VOS
VOUT =
(OPTIONAL)
(X1 – X2) (Y1 – Y2)
10V
20kΩ
+VS
–VS
00502-013
AD532
Y1
Y2
Figure 14. Multiplier Connection
For operation as a multiplier, the AD532 must be connected as
shown in Figure 14. The inputs can be fed differentially to the X
and Y inputs or single-ended by simply grounding the unused
input. Connect the inputs according to the desired polarity in
the output. The Z terminal is tied to the output to close the
feedback loop around the op amp (see Figure 1). The offset adjust
VOS is optional and is adjusted when both inputs are zero volts
to obtain zero out, or to null other system offsets.
VIN2
10V
–VS
Figure 15. Squarer Connection
The squaring circuit in Figure 15 is a simple variation of the
multiplier. The differential input capability of the AD532, however,
can obtain a positive or negative output response to the input, a
useful feature for control applications, as it might eliminate the
need for an additional inverter somewhere else.
Division
Z
X1
X2
X
VOUT =
Z
AD532
Y1
Y2 +VS
OUT
10VZ
X
VOUT
–VS
1kΩ
(SF)
2.2kΩ
47kΩ
REPLACING OTHER IC MULTIPLIERS
Multiplication
VOUT =
(OPTIONAL)
+VS
Provision for fine trimming the output voltage offset has been
included. This connection is optional, however, as the AD532 has
been factory trimmed for total performance as described in the
listed specifications.
Existing designs using IC multipliers that require external
trimming networks can be simplified using the pin for pin
replaceability of the AD532 by merely grounding the X2, Y2,
and VOS terminals. The VOS terminal must always be grounded
when unused.
VOUT
OUT
Y1
Y2 +VS VOS –VS
00502-014
Trimming on the chip eliminates the need for a hybrid substrate
and the additional bonding wires that are required between the
resistors and the multiplier chip. By trimming more appropriate
resistors on the AD532 chip itself, the second input terminals
that were committed to external trimming networks have been
freed to allow fully differential operation at both the X and Y
inputs. Further, the requirement for an input attenuator to
adjust the gain at the Y input has been eliminated, letting the
user take full advantage of the high input impedance properties
of the input differential amplifiers. Therefore, the AD532 offers
greater flexibility for both algebraic computation and transducer
instrumentation applications.
Squaring
+VS
20kΩ
(X0)
10kΩ
–VS
00502-015
The performance and ease of use of the AD532 is achieved through
the laser trimming of thin film resistors deposited directly on
the monolithic chip. This trimming on the chip technique provides
a number of significant advantages in terms of cost, reliability,
and flexibility over conventional in package trimming of off the
chip resistors mounted or deposited on a hybrid substrate.
Figure 16. Divider Connection
The AD532 can be configured as a two-quadrant divider by
connecting the multiplier cell in the feedback loop of the op
amp and using the Z terminal as a signal input, as shown in
Figure 16. It should be noted, however, that the output error is
given approximately by 10 V εm/(X1 − X2), where εm is the total
error specification for the multiply mode and bandwidth by fm ×
(X1 − X2)/10 V, where fm is the bandwidth of the multiplier.
Further, to avoid positive feedback, the X input is restricted to
negative values. Thus, for single-ended negative inputs (0 V to
−10 V), connect the input to X and the offset null to X2; for singleended positive inputs (0 V to +10 V), connect the input to X2
and the offset null to X1. For optimum performance, gain (SF)
and offset (X0) adjustments are recommended as shown and
explained in Table 5.
For practical reasons, the useful range in denominator input is
approximately 500 mV ≤ |(X1 − X2)| ≤ 10 V. The voltage offset
adjust (VOS), if used, is trimmed with Z at zero and (X1 − X2) at
full scale.
Rev. E | Page 11 of 14
AD532
Data Sheet
Divider
Adjust
Scale
Factor
X0 (Offset)
With:
X
−10 V
−1 V
Z
+10 V
Adjust for:
VOUT
−10 V
Square Rooter
With:
Adjust for:
Z
VOUT
+10 V
−10 V
+0.1 V
−1 V
+0.1 V
DIFFERENCE OF SQUARES
Y
AD532
VOUT = 10VZ
OUT
VOUT
–VS
1kΩ
(SF)
47kΩ
+VS
20kΩ
(X0)
10kΩ
–VS
20kΩ
+VS
VOUT
OUT
VOUT =
X2 – Y 2
10V
(OPTIONAL)
–VS
Figure 18. Differential of Squares Connection
ADDITIONAL INFORMATION
00502-016
2.2kΩ
–Y
AD532
Y1
Y2 +VS VOS –VS
The differential input capability of the AD532 allows for the
algebraic solution of several interesting functions, such as the
difference of squares, X2 − Y2/10 V. As shown in Figure 18, the
AD532 is configured in the square mode, with a simple unity
gain inverter connected between one of the signal inputs (Y)
and one of the inverting input terminals (−YIN) of the multiplier.
The inverter should use precision (0.1%) resistors or be otherwise
trimmed for unity gain for best accuracy.
Z
Y1
Y2 +VS
20kΩ
AD741KH
SQUARE ROOT
Z
20kΩ
10kΩ
−1 V
The optional scale factor and offset adjustments listed in Table 5
may be interactive. Repeat until satisfactory results are obtained.
X1
X2
Z
X1
X2
X
00502-017
Table 5. Adjustment Procedure (Divider or Square Rooter)
For additional information about the applications for the AD532,
refer to the Multiplier Application Guide.
Figure 17. Square Rooter Connection
The connections for square root mode are shown in Figure 17.
Similar to the divide mode, the multiplier cell is connected in
the feedback of the op amp by connecting the output back to
both the X and Y inputs. The diode D1 is connected as shown to
prevent latch-up as ZIN approaches 0 V. In this case, the VOS
adjustment is made with ZIN = +0.1 V dc, adjusting VOS to obtain
−1.0 V dc in the output, VOUT = 10 V Z . For optimum
performance, gain (SF) and offset (X0) adjustments are
recommended as shown and explained in Table 5.
Rev. E | Page 12 of 14
Data Sheet
AD532
OUTLINE DIMENSIONS
0.005 (0.13) MIN
0.080 (2.03) MAX
8
14
1
PIN 1
0.200 (5.08)
MAX
0.310 (7.87)
0.220 (5.59)
7
0.100 (2.54)
BSC
0.765 (19.43) MAX
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.070 (1.78)
0.030 (0.76)
0.320 (8.13)
0.290 (7.37)
0.060 (1.52)
0.015 (0.38)
0.150
(3.81)
MIN
SEATING
PLANE
0.015 (0.38)
0.008 (0.20)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 19. 14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
(D-14)
Dimensions shown in inches and (millimeters)
REFERENCE PLANE
0.160 (4.06)
0.110 (2.79)
0.500 (12.70)
MIN
0.185 (4.70)
0.165 (4.19)
PIN 5 IS INTEGRAL
CONNECTION TO
HEADER
0.370 (9.40)
0.335 (8.51)
0.021 (0.53)
0.016 (0.40)
0.335 (8.51)
0.305 (7.75)
0.115
(2.92)
BSC
6
8
4
9
3
2
SIDE VIEW
0.040 (1.02) MAX
BASE & SEATING PLANE
7
5
0.230 (5.84)
BSC
10
1
0.045 (1.14)
0.025 (0.65)
0.034 (0.86)
0.025 (0.64)
BOTTOM VIEW
36° BSC
DIMENSIONS PER JEDEC STANDARDS MO-006-AF
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
01-19-2015-A
0.050 (1.27) MAX
Figure 20. 10-Pin Metal Header Package [TO-100]
(H-10)
Dimensions shown in inches and (millimeters)
ORDERING GUIDE
Model 1
AD532JCHIPS
AD532JDZ
AD532JHZ
AD532KDZ
AD532KHZ
AD532SCHIPS
AD532SD
AD532SD/883B
AD532SH
AD532SH/883B
1
Temperature Range
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
Package Description
Chip
14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
10-Pin Metal Header Package [TO-100]
14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
10-Pin Metal Header Package [TO-100]
Chip
14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
10-Pin Metal Header Package [TO-100]
10-Pin Metal Header Package [TO-100]
Z = RoHS Compliant Part.
Rev. E | Page 13 of 14
Package Option
D-14
H-10
D-14
H-10
D-14
D-14
H-10
H-10
AD532
Data Sheet
NOTES
©2001–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00502-0-9/15(E)
Rev. E | Page 14 of 14
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