Dual 12-Bit, High Bandwidth, Multiplying DAC
with 4-Quadrant Resistors and Serial Interface
AD5415
Data Sheet
FEATURES
GENERAL DESCRIPTION
10 MHz multiplying bandwidth
On-chip 4-quadrant resistors allow flexible output ranges
INL of ±1 LSB
24-lead TSSOP package
2.5 V to 5.5 V supply operation
±10 V reference input
50 MHz serial interface
2.47 MSPS update rate
Extended temperature range: −40°C to 125°C
4-quadrant multiplication
Power-on reset
0.5 µA typical current consumption
Guaranteed monotonic
Daisy-chain mode
Readback function
The AD54151 is a CMOS, 12-bit, dual-channel, current output
digital-to-analog converter (DAC). This device operates from a
2.5 V to 5.5 V power supply, making it suited to battery-powered
applications and other applications. As a result of being manufactured on a CMOS submicron process, this device offers excellent
4-quadrant multiplication characteristics with large signal
multiplying bandwidths of 10 MHz.
The applied external reference input voltage (VREF) determines
the full-scale output current. An integrated feedback resistor (RFB)
provides temperature tracking and full-scale voltage output when
combined with an external current to voltage precision amplifier.
In addition, this device contains the 4-quadrant resistors necessary
for bipolar operation and other configuration modes.
This DAC uses a double-buffered, 3-wire serial interface that is
compatible with SPI®, QSPI™, MICROWIRE™, and most DSP
interface standards. In addition, a serial data out pin (SDO) allows
daisy-chaining when multiple packages are used. Data readback
allows the user to read the contents of the DAC register via the
SDO pin. On power-up, the internal shift register and latches
are filled with 0s, and the DAC outputs are at zero scale.
APPLICATIONS
Portable battery-powered applications
Waveform generators
Analog processing
Instrumentation applications
Programmable amplifiers and attenuators
Digitally controlled calibration
Programmable filters and oscillators
Composite video
Ultrasound
Gain, offset, and voltage trimming
The AD5415 DAC is available in a 24-lead TSSOP package. The
EV-AD5415/49SDZ evaluation board is available for evaluating
DAC performance. For more information, see UG-296, Evaluating
the AD5415 Serial Input, Dual-Channel Current Output DAC.
FUNCTIONAL BLOCK DIAGRAM
R3A
VDD
R3
2R
AD5415
R2A
R2_3A
R2
2R
VREFA R1A
R1
2R
RFB
2R
RFBA
SYNC
SCLK
INPUT
REGISTER
SHIFT
REGISTER
DAC
REGISTER
IOUT1A
12-BIT
R-2R DAC A
IOUT2A
SDIN
SDO
LDAC
CLR
R3
2R
R3B
IOUT2B
R1
2R
R2
2R
R2_3B
R2B
VREFB R1B
RFB
2R
RFBB
Figure 1.
U.S. Patent Number 5,689,257.
Rev. F
IOUT1B
12-BIT
R-2R DAC B
POWER-ON
RESET
GND
1
DAC
REGISTER
04461-001
INPUT
REGISTER
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2004–2015 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
AD5415
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Circuit Operation ....................................................................... 15
Applications ....................................................................................... 1
Single-Supply Applications ....................................................... 16
General Description ......................................................................... 1
Adding Gain ................................................................................ 17
Functional Block Diagram .............................................................. 1
Divider or Programmable Gain Element ................................ 17
Revision History ............................................................................... 2
Reference Selection .................................................................... 18
Specifications..................................................................................... 3
Amplifier Selection .................................................................... 18
Timing Characteristics ................................................................ 5
Serial Interface ............................................................................ 20
Absolute Maximum Ratings............................................................ 7
Microprocessor Interfacing ....................................................... 22
ESD Caution .................................................................................. 7
PCB Layout and Power Supply Decoupling ........................... 24
Pin Configuration and Function Descriptions ............................. 8
Overview of the AD5424 to AD5547 Devices ............................ 25
Typical Performance Characteristics ............................................. 9
Outline Dimensions ....................................................................... 26
Terminology .................................................................................... 14
Ordering Guide .......................................................................... 26
General Description ....................................................................... 15
DAC Section ................................................................................ 15
REVISION HISTORY
12/15—Rev. E to Rev. F
Deleted Positive Output Voltage Section..................................... 17
Changes to Adding Gain Section ................................................. 17
Changes to Reference Selection Section ...................................... 18
Changes to ADSP21xx to AD5415 Interface Section,
ADSP-BF504 to ADSP-BF592 Device Family to AD5415 Interface
Section, Figure 41, and Figure 42 .................................................. 22
Changes to MC68HC11 to AD5415 Interface Section and
PIC16C6x/PIC16C7x to AD5415 Interface Section .................. 23
Changes to Overview of the AD5424 to AD5547 Devices
Section Title ...................................................................................... 25
5/13—Rev. D to Rev. E
Changes to General Description .................................................... 1
Change to Ordering Guide ............................................................ 26
5/12—Rev. C to Rev. D
Changes SDO Control (SDO1 and SDO2) Section ................... 20
6/11—Rev. B to Rev. C
Changes to General Description ................................................... 1
Deleted Evaluation Board for the DAC Section and Power
Supplies for the Evaluation Board Section .................................. 24
Changes to Ordering Guide .......................................................... 26
7/05—Rev. 0 to Rev. A
Changes to Features List ...................................................................1
Change to General Description .......................................................1
Changes to Specifications .................................................................3
Changes to Timing Characteristics .................................................5
Change to Figure 8 and Figure 9 .....................................................9
Change to Figure 13 ....................................................................... 10
Change to Figure 27 Through Figure 29 ..................................... 12
Change to Figure 32 ....................................................................... 15
Changes to Table 5 and Table 6 .................................................... 15
Change to Stability Section ........................................................... 16
Changes to Voltage-Switching Mode of Operation Section ..... 16
Change to Figure 35 ....................................................................... 16
Changes to Divider or Programmable Gain Element Section .... 17
Changes to Figure 36 Through Figure 38.................................... 17
Changes to Table 7 Through Table 10 ......................................... 19
Added ADSP-BF5xx-to-AD5415 Interface Section................... 22
Change to 80C51/80L51-to-AD5415 Interface Section ............ 23
Change to MC68HC11-to-AD5415 Interface Section .............. 23
Change to Power Supplies for the Evaluation Board Section ... 24
Changes to Table 13 ....................................................................... 28
Updated Outline Dimensions ....................................................... 29
Changes to Ordering Guide .......................................................... 29
7/04—Revision 0: Initial Version
4/10—Rev. A to Rev. B
Added Figure 4 .................................................................................. 6
Rev. F | Page 2 of 27
Data Sheet
AD5415
SPECIFICATIONS
VDD = 2.5 V to 5.5 V, VREF = 10 V, IOUT2 = 0 V. Temperature range for Y version: −40°C to +125°C. All specifications TMIN to TMAX, unless
otherwise noted. DC performance is measured with OP177, and ac performance is measured with AD8038, unless otherwise noted.
Table 1.1
Parameter
STATIC PERFORMANCE
Resolution
Relative Accuracy
Differential Nonlinearity
Gain Error
Gain Error Temperature Coefficient
Bipolar Zero Code Error
Output Leakage Current
REFERENCE INPUT
Reference Input Range
VREFA, VREFB Input Resistance
VREFA to VREFB Input Resistance
Mismatch
R1, RFB Resistance
R2, R3 Resistance
R2 to R3 Resistance Mismatch
Input Capacitance
Code 0
Code 4095
DIGITAL INPUTS/OUTPUT
Input High Voltage, VIH
Min
Typ
Max
Unit
12
±1
−1/+2
±25
±25
±1
±15
Bits
LSB
LSB
mV
ppm FSR/°C
mV
nA
nA
±10
10
13
V
kΩ
1.6
2.5
%
Input resistance temperature coefficient (TC) =
−50 ppm/°C
Typ = 25°C, max = 125°C
20
20
0.06
25
25
0.18
kΩ
kΩ
%
Input resistance TC = −50 ppm/°C
Input resistance TC = −50 ppm/°C
Typ = 25°C, max = 125°C
±5
8
17
17
Measured to ±1 mV of Full Scale (FS)
Measured to ±4 mV of FS
Measured to ±16 mV of FS
Digital Delay
10% to 90% Settling Time
Digital-to-Analog Glitch Impulse
Multiplying Feedthrough Error
Output Capacitance
Data = 0x0000, TA = 25°C, IOUT1
Data = 0x0000, TA = −40°C to +125°C, IOUT1
pF
pF
VDD = 3.6 V to 5.5 V
VDD = 2.5 V to 3.6 V
VDD = 2.7 V to 5.5 V
VDD = 2.5 V to 2.7 V
VDD = 4.5 V to 5.5 V, ISOURCE = 200 μA
VDD = 2.5 V to 3.6 V, ISOURCE = 200 μA
VDD = 4.5 V to 5.5 V, ISINK = 200 μA
VDD = 2.5 V to 3.6 V, ISINK = 200 μA
4
V
V
V
V
V
V
V
V
μA
pF
MHz
VREF = ±3.5 V p-p, DAC loaded all 1s
RLOAD = 100 Ω, CLOAD = 15 pF, VREF = 10 V
DAC latch alternately loaded with 0s and 1s
1.7
1.7
0.8
0.7
VDD − 1
VDD − 0.5
Output Low Voltage, VOL
Input Leakage Current, IIL
Input Capacitance
DYNAMIC PERFORMANCE
Reference Multiplying Bandwidth (BW)
Output Voltage Settling Time
Guaranteed monotonic
3.5
3.5
Input Low Voltage, VIL
Output High Voltage, VOH
Test Conditions/Comments
0.4
0.4
1
10
10
80
35
30
20
15
3
12
25
120
70
60
40
30
ns
ns
ns
ns
ns
nV-sec
70
48
17
30
dB
dB
pF
pF
Rev. F | Page 3 of 27
Rise and fall times
1 LSB change around major carry, VREF = 0 V
DAC latches loaded with all 0s, VREF = ±3.5 V
1 MHz
10 MHz
DAC latches loaded with all 0s
DAC latches loaded with all 1s
AD5415
Parameter
Digital Feedthrough
Output Noise Spectral Density
Analog THD
Digital THD
100 kHz fOUT
50 kHz fOUT
SFDR Performance (Wide Band)
Clock = 10 MHz
500 kHz fOUT
100 kHz fOUT
50 kHz fOUT
Clock = 25 MHz
500 kHz fOUT
100 kHz fOUT
50 kHz fOUT
SFDR Performance (Narrow Band)
Clock = 10 MHz
500 kHz fOUT
100 kHz fOUT
50 kHz fOUT
Clock = 25 MHz
500 kHz fOUT
100 kHz fOUT
50 kHz fOUT
Intermodulation Distortion
f1 = 40 kHz, f2 = 50 kHz
f1 = 40 kHz, f2 = 50 kHz
POWER REQUIREMENTS
Power Supply Range
IDD
Data Sheet
Min
Typ
3
Max
5
25
81
nV/√Hz
dB
61
66
dB
dB
Test Conditions/Comments
Feedthrough to DAC output with CS high and
alternate loading of all 0s and all 1s
At 1 kHz
VREF =3. 5 V p-p, all 1s loaded, f = 1 kHz
Clock = 10 MHz, VREF = 3.5 V
VREF = 3.5 V
55
63
65
dB
dB
dB
50
60
62
dB
dB
dB
VREF = 3.5 V
73
80
87
dB
dB
dB
70
75
80
dB
dB
dB
72
65
dB
dB
VREF = 3.5 V
Clock = 10 MHz
Clock = 25 MHz
V
μA
μA
%/%
TA = 25°C, logic inputs = 0 V or VDD
TA = −40°C to +125°C, logic inputs = 0 V or VDD
∆VDD = ±5%
2.5
5.5
0.7
10
0.001
0.5
Power Supply Sensitivity
1
Unit
nV-sec
Guaranteed by design and characterization, not subject to production test.
Rev. F | Page 4 of 27
Data Sheet
AD5415
TIMING CHARACTERISTICS
All input signals are specified with tr = tf = 1 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. VDD = 2.5 V to 5.5 V,
VREF = 10 V, IOUT2 = 0 V, temperature range for Y version: −40°C to +125°C. All specifications TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter 1
fSCLK
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11
t12 3
Update Rate
Limit at TMIN, TMAX
50
20
8
8
13
5
4
5
30
0
12
10
25
60
2.47
Unit
MHz max
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
MSPS
Test Conditions/Comments 2
Maximum clock frequency
SCLK cycle time
SCLK high time
SCLK low time
SYNC falling edge to SCLK falling edge setup time
Data setup time
Data hold time
SYNC rising edge to SCLK falling edge
Minimum SYNC high time
SCLK falling edge to LDAC falling edge
LDAC pulse width
SCLK falling edge to LDAC rising edge
SCLK active edge to SDO valid, strong SDO driver
SCLK active edge to SDO valid, weak SDO driver
Consists of cycle time, SYNC high time, data setup, and output voltage settling time
Guaranteed by design and characterization, not subject to production test.
Falling or rising edge as determined by the control bits of the serial word. Strong or weak SDO driver selected via the control register.
3
Daisy-chain and readback modes cannot operate at maximum clock frequency. SDO timing specifications measured with a load circuit, as shown in Figure 5.
1
2
t1
SCLK
t8
t2
t4
t3
t7
SYNC
t6
t5
DIN
DB15
DB0
t9
t10
LDAC1
t11
LDAC2
NOTES
ALTERNATIVELY, DATA CAN BE CLOCKED INTO THE INPUT SHIFT REGISTER ON THE RISING EDGE OF SCLK AS
DETERMINED BY THE CONTROL BITS. TIMING IS AS ABOVE, WITH SCLK INVERTED.
Figure 2. Standalone Mode Timing Diagram
Rev. F | Page 5 of 27
04461-002
1ASYNCHRONOUS LDAC UPDATE MODE.
2SYNCHRONOUS LDAC UPDATE MODE.
AD5415
Data Sheet
t1
SCLK
t3
t2
t4
t7
SYNC
t6
t8
t5
SDIN
DB0
(N)
DB15
(N)
DB15
(N + 1)
DB0
(N + 1)
DB15
(N)
DB0
(N)
SDO
04461-003
t12
NOTES
1. ALTERNATIVELY, DATA CAN BE CLOCKED INTO THE INPUT SHIFT REGISTER ON THE RISING EDGE OF SCLK AS
DETERMINED BY THE CONTROL BITS. IN THIS CASE, DATA IS CLOCKED OUT OF SDO ON THE FALLING
EDGE OF SCLK. TIMING IS AS ABOVE, WITH SCLK INVERTED.
Figure 3. Daisy-Chain Timing Diagram
SCLK
32
16
SYNC
DB15
DB15
DB0
DB0
INPUT WORD SPECIFIES
REGISTER TO BE READ
NOP CONDITION
SELECTED REGISTER DATA
CLOCKED OUT
UNDEFINED
Figure 4. Readback Mode Timing Diagram
200µA
TO OUTPUT
PIN
IOL
VOH (MIN) + VOL (MAX)
2
CL
50pF
200µA
IOH
Figure 5. Load Circuit for SDO Timing Specifications
Rev. F | Page 6 of 27
04461-053
DB0
DB15
SDO
04461-004
SDIN
Data Sheet
AD5415
ABSOLUTE MAXIMUM RATINGS
Transient currents of up to 100 mA do not cause SCR latch-up.
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
VDD to GND
VREF, RFB to GND
IOUT1, IOUT2 to GND
Input Current to Any Pin Except Supplies
Logic Inputs and Output1
Operating Temperature Range
Extended (Y Version)
Storage Temperature Range
Junction Temperature
24-Lead TSSOP, θJA Thermal Impedance
Lead Temperature, Soldering (10 sec)
Infrared (IR) Reflow, Peak Temperature
(