AD5522

Quad Parametric Measurement Unit with Integrated 16-Bit Level Setting DACs AD5522 FEATURES Quad parametric measurement unit (PMU) FV, FI, FN (high-Z), MV, MI functions 4 programmable current ranges (internal RSENSE) ±5 μA, ±20 μA, ±200 μA, and ±2 mA 1 programmable current range up to ±80 mA (external RSENSE) 22.5 V FV range with asymmetrical operation Integrated 16-bit DACs provide programmable levels Gain and offset correction on chip Low capacitance outputs suited to relayless systems On-chip comparators per channel FI voltage clamps and FV current clamps Guard drive amplifier System PMU connections Programmable temperature shutdown SPI- and LVDS-compatible interfaces Compact 80-lead TQFP with exposed pad (top or bottom) APPLICATIONS Automated test equipment (ATE) Per-pin parametric measurement unit Continuity and leakage testing Device power supply Instrumentation Source measure unit (SMU) Precision measurement FUNCTIONAL BLOCK DIAGRAM AGND AVSS AVDD DVCC DGND CCOMP[0:3] SYS_FORCE SYS_SENSE VREF REFGND 16 16 16 16 16 16 X1 REG M REG C REG 16 X2 REG ×2 ×2 16-BIT CLH DAC ×4 – FIN AGND MEASVH (Hi-Z) SW1 + EN EXTFOH[0:3] SW3 CLH CFF[0:3] OFFSET DAC ×6 INTERNAL RANGE SELECT (±5µA, ±20µA, ±200µA, ±2mA) 60Ω + FORCE AMPLIFIER 1kΩ X1 REG M REG C REG ×6 16-BIT 16 FIN DAC X2 REG FOH[0:3] SW5 – SW2 RSENSE SW6 4kΩ 16 16 16 X1 REG M REG C REG 16 X2 REG ×2 ×2 16-BIT CLL DAC SW10 SW4 VMID TO CENTER I RANGE CLL + – EXTMEASIH[0:3] SW8 2kΩ SW7 + ×5 or ×10 MEASOUT[0:3] SW12 MEASOUT MUX AND GAIN ×1/×0.2 EXTMEASIL[0:3] + – MEASURE CURRENT IN-AMP + – 4kΩ SW9 EXTERNA L RSENSE (CURRENTS UP TO ±80mA) – TEMP SENSOR SW11 AGND 16 16 16 ×6 X1 REG M REG C REG ×6 X1 REG M REG C REG ×6 16 MEASVH[0:3] GUARD[0:3] SW13 X2 REG 16-BIT CPH DAC AGND ×1 CPH + 16 16 16 DUTGND – + – MEASURE VOLTAGE IN-AMP AGND SW14 GUARD AMP SW16 GUARDIN[0:3]/ DUTGND[0:3] DUTGND DUT ×6 16 16-BIT CPL DAC CPL – + – + X2 REG SW15 COMPARATOR 10kΩ 16 16 POWER-ON RESET 16-BIT OFFSET DAC TO ALL DAC OUTPUT AMPLIFIERS SERIAL INTERFACE TO MEASOUT MUX TEMP SENSOR CLAMP AND GUARD ALARM TMPALM CGALM 06197-001 RESET SDO SCLK SDI SYNC BUSY LOAD SPI/ CPOL0/ LVDS SCLK CPOH0/ SDI CPOL1/ SYNC CPOH1/ SDO CPOL2/ CPOH2/ CPO0 CPO1 CPOL3/ CPO2 CPOH3/ CPO3 Figure 1. Rev. A Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2008 Analog Devices, Inc. All rights reserved. AD5522 TABLE OF CONTENTS Features .............................................................................................. 1  Applications ....................................................................................... 1  Functional Block Diagram .............................................................. 1  Revision History ............................................................................... 3  General Description ......................................................................... 4  Specifications..................................................................................... 6  Timing Characteristics .............................................................. 11  Absolute Maximum Ratings.......................................................... 15  Thermal Resistance .................................................................... 15  ESD Caution ................................................................................ 15  Pin Configurations and Function Descriptions ......................... 16  Typical Performance Characteristics ........................................... 22  Terminology .................................................................................... 28  Theory of Operation ...................................................................... 29  Force Amplifier ........................................................................... 29  Comparators................................................................................ 29  Clamps ......................................................................................... 29  Current Range Selection ............................................................ 30  High Current Ranges ................................................................. 30  Measure Current Gains.............................................................. 31  VMID Voltage ............................................................................. 31  Choosing Power Supply Rails ................................................... 32  Measure Output (MEASOUTx Pins) ...................................... 32  Device Under Test Ground (DUTGND)................................. 32  Guard Amplifier ......................................................................... 33  Compensation Capacitors ......................................................... 33  System Force and Sense Switches ............................................. 33  Temperature Sensor ................................................................... 33  DAC Levels ...................................................................................... 34  Offset DAC .................................................................................. 34  Gain and Offset Registers .......................................................... 34  Cached X2 Registers................................................................... 35  Reference Voltage (VREF)......................................................... 35  Reference Selection .................................................................... 35  Calibration................................................................................... 36  System Level Calibration ........................................................... 37  Circuit Operation ........................................................................... 38  Force Voltage (FV) Mode .......................................................... 38  Force Current (FI) Mode ........................................................... 39  Serial Interface ................................................................................ 40  SPI Interface ................................................................................ 40  LVDS Interface............................................................................ 40  Serial Interface Write Mode ...................................................... 40  RESET Function ......................................................................... 40  BUSY and LOAD Functions ..................................................... 40  Register Update Rates ................................................................ 41  Register Selection ....................................................................... 41  Write System Control Register ................................................. 43  Write PMU Register ................................................................... 45  Write DAC Register ................................................................... 47  Read Registers ............................................................................. 50  Readback of System Control Register...................................... 51  Readback of PMU Register ....................................................... 52  Readback of Comparator Status Register ................................ 53  Readback of Alarm Status Register .......................................... 53  Readback of DAC Register ........................................................ 54  Applications Information .............................................................. 55  Power-On Default ...................................................................... 55  Setting Up the Device on Power-On ....................................... 55  Changing Modes ........................................................................ 56  Required External Components ............................................... 56  Power Supply Decoupling ......................................................... 57  Power Supply Sequencing ......................................................... 57  Typical Application for the AD5522 ........................................ 57  Outline Dimensions ....................................................................... 59  Ordering Guide .......................................................................... 60  Rev. A | Page 2 of 60 AD5522 REVISION HISTORY 10/08—Rev. 0 to Rev. A Changes to Table 1 ............................................................................ 6 Change to 4 DAC X1 Parameter, Table 2 .....................................11 Changes to Table 3 ..........................................................................12 Change to Reflow Soldering Parameter, Table 4 .........................15 Changes to Figure 18, Figure 19, Figure 20, and Figure 21 .......23 Changes to Figure 25 ......................................................................24 Changes to Force Amplifier Section .............................................29 Changes to Clamps Section ...........................................................29 Changes to High Current Ranges Section ...................................30 Changes to Choosing Power Supply Rails Section ..................... 32 Changes to Compensation Capacitors Section ........................... 33 Added Table 14, Renumbered Tables Sequentially ..................... 36 Changes to Reference Selection Example .................................... 36 Changes to Table 15 and BUSY and LOAD Functions Section .............................................................................................. 40 Changes to Table 17 and Register Update Rates Section ........... 41 Added Table 38 ................................................................................ 57 Changes to Ordering Guide ........................................................... 60 7/08—Revision 0: Initial Version Rev. A | Page 3 of 60 AD5522 GENERAL DESCRIPTION The AD5522 is a high performance, highly integrated parametric measurement unit consisting of four independent channels. Each per-pin parametric measurement unit (PPMU) channel includes five 16-bit, voltage output DACs that set the programmable input levels for the force voltage inputs, clamp inputs, and comparator inputs (high and low). Five programmable force and measure current ranges are available, ranging from ±5 μA to ±80 mA. Four of these ranges use on-chip sense resistors; one high current range up to ±80 mA is available per channel using off-chip sense resistors. Currents in excess of ±80 mA require an external amplifier. Low capacitance DUT connections (FOH and EXTFOH) ensure that the device is suited to relayless test systems. The PMU functions are controlled via a simple 3-wire serial interface compatible with SPI, QSPI™, MICROWIRE™, and DSP interface standards. Interface clocks of 50 MHz allow fast updating of modes. The low voltage differential signaling (LVDS) interface protocol at 83 MHz is also supported. Comparator outputs are provided per channel for device go-no-go testing and characterization. Control registers allow the user to easily change force or measure conditions, DAC levels, and selected current ranges. The SDO (serial data output) pin allows the user to read back information for diagnostic purposes. Rev. A | Page 4 of 60 AD5522 AGND AVSS AVDD DVCC DGND CCOMP0 VREF REFGND 16 16 16 16 16 16 X1 REG M REG C REG 16 X2 REG ×2 ×2 16-BIT CLH DAC CH0 – FIN AGND MEASVH (Hi-Z) SW1 + EN EXTFOH0 SW3 CLH CFF0 OFFSET DAC ×6 X1 REG M REG C REG ×6 16-BIT 16 FIN DAC INTERNAL RANGE SELECT (±5µA, ±20µA, ±200µA, ±2mA) + FORCE AMPLIFIER SW5 X2 REG FOH0 RSENSE SW4 SW6 – SW2 4kΩ 16 16 16 X1 REG M REG C REG 16 X2 REG ×2 ×2 16-BIT CLL DAC SW10 VMID TO CENTER I RANGE CLL + – 2kΩ SW7 SW8 EXTMEASIH0 EXTERNAL RSENSE (CURRENTS UP TO ±80mA) + ×5 OR ×10 MEASOUT0 SW12 MEASOUT MUX AND GAIN ×1/×0.2 EXTMEASIL0 + – MEASURE CURRENT IN-AMP + – SW16 SW13 4kΩ SW9 – TEMP SENSOR SW11 AGND 16 16 16 ×6 X1 REG M REG C REG ×6 X1 REG M REG C REG MEASVH0 ×6 16 X2 REG 16-BIT CPH DAC AGND ×1 CPH + GUARD0 GUARD AMP DUT DUTGND 16 16 16 DUTGND – + – MEASURE VOLTAGE IN-AMP SW14 ×6 16 16-BIT CPL CPL DAC COMPARATOR X2 REG – + – GUARDIN0/ DUTGND0 SW15 + CPOL0/SCLK AGND 10kΩ EXTFOH1 CFF1 CPOH0/SDI CCOMP1 MEASOUT1 CPOL1/SYNC CPOH1/SDO AGND MUX MUX FOH1 CH1 EXTMEASIH1 EXTMEASIL1 MEASVH1 GUARD1 GUARDIN1/DUTGND1 SYS_SENSE SYS_FORCE EXTFOH2 CCOMP2 MEASOUT2 CPOL2/CPO0 CPOH2/CPO1 AGND CFF2 FOH2 CH2 EN EXTMEASIH2 EXTMEASIL2 MEASVH2 GUARD2 GUARDIN2/DUTGND2 CCOMP3 16 16 16 16 16 16 EXTFOH3 SW3 X1 REG M REG C REG 16 X2 REG ×2 ×2 16-BIT CLH DAC CLH OFFSET DAC ×6 – CH3 FIN AGND MEASVH (Hi-Z) SW1 + CFF3 X1 REG M REG C REG ×6 16-BIT 16 FIN DAC INTERNAL RANGE SELECT (±5µA, ±20µA, ±200µA, ±2mA) + FORCE AMPLIFIER SW5 X2 REG FOH3 RSENSE SW6 SW4 4kΩ – SW2 16 16 16 X1 REG M REG C REG 16 X2 REG ×2 ×2 16-BIT CLL DAC SW10 VMID TO CENTER I RANGE CLL + – 2kΩ + – 4kΩ MEASURE CURRENT IN-AMP + – SW7 SW8 EXTMEASIH3 EXTERNAL RSENSE (CURRENTS UP TO ±80mA) + x5 or x10 EXTMEASIL3 SW9 MEASOUT3 SW12 MEASOUT MUX AND GAIN x1/x0.2 – TEMP SENSOR SW11 AGND 16 16 16 ×6 X1 REG M REG C REG ×6 X1 REG M REG C REG MEASVH3 ×6 16 X2 REG 16-BIT CPH DAC AGND x1 CPH + SW13 16 16 16 DUTGND – + – MEASURE VOLTAGE IN-AMP AGND SW14 GUARD AMP SW16 GUARD3 GUARDIN3/ DUTGND3 DUT ×6 16 16-BIT CPL CPL DAC – COMPARATOR + – + X2 REG SW15 10kΩ DUTGND 16 16-BIT OFFSET DAC TO ALL DAC OUTPUT AMPLIFIERS SERIAL INTERFACE SW15a TO MEASOUT MUX TEMP SENSOR CLAMP AND GUARD ALARM TMPALM 06197-002 16 POWER-ON RESET AGND 10kΩ CGALM CPOL3/ RESET SDO SCLK SDI SYNC BUSY LOAD SPI/ LVDS CPO2 CPOH3/ CPO3 Figure 2. Detailed Block Diagram Rev. A | Page 5 of 60 AD5522 SPECIFICATIONS AVDD ≥ 10 V; AVSS ≤ −5 V; |AVDD − AVSS| ≥ 20 V and ≤ 33 V; DVCC = 2.3 V to 5.25 V; VREF = 5 V; REFGND = DUTGND = AGND = 0 V; gain (M), offset (C), and DAC offset registers at default values; TJ = 25°C to 90°C, unless otherwise noted. (FV = force voltage, FI = force current, MV = measure voltage, MI = measure current, FS = full scale, FSR = full-scale range, FSVR = full-scale voltage range, FSCR = full-scale current range.) Table 1. Parameter FORCE VOLTAGE FOHx Output Voltage Range2 EXTFOHx Output Voltage Range2 Output Voltage Span Offset Error Offset Error Tempco2 Gain Error Gain Error Tempco2 Linearity Error Short-Circuit Current Limit2 Noise Spectral Density (NSD)2 MEASURE CURRENT Differential Input Voltage Range2 Output Voltage Span Offset Error Offset Error Tempco2 Gain Error Gain Error Tempco2 Linearity Error −1.125 22.5 −0.5 1 −1 −0.5 −2 −0.015 −0.01 Common-Mode Voltage Range2 Common-Mode Error Sense Resistors 200 50 5 0.5 Measure Current Ranges2 ±5 ±20 ±200 ±2 ±80 Noise Spectral Density (NSD)2 400 μA μA μA mA mA nV/√Hz kΩ kΩ kΩ kΩ AVSS + 4 −0.005 +0.015 +0.01 AVDD − 4 +0.005 +1 +0.5 +0.5 Min AVSS + 4 AVSS + 3 22.5 −50 −10 −0.5 0.5 −0.01 −150 −10 320 +0.01 +150 +10 +0.5 +50 Typ1 Max AVDD − 4 AVDD − 3 Unit V V V mV μV/°C % FSR ppm/°C % FSR mA mA nV/√Hz Test Conditions/Comments All current ranges from FOHx at full-scale current; includes ±1 V dropped across sense resistor External high current range at full-scale current; does not include ±1 V dropped across sense resistor Measured at midscale code; prior to calibration Standard deviation = 20 μV/°C Prior to calibration Standard deviation = 0.5 ppm/°C FSR = full-scale range (±10 V), gain and offset errors calibrated out ±80 mA range All other ranges 1 kHz, at FOHx in FV mode Measure current = (IDUT × RSENSE × gain); amplifier gain = 5 or 10, unless otherwise noted Voltage across RSENSE; gain = 5 or 10 Measure current block with VREF = 5 V, MEASOUT scaling happens after V(RSENSE) = ±1 V, measured with zero current flowing Referred to MI input; standard deviation = 4 μV/°C Using internal current ranges Measure current amplifier alone Standard deviation = 2 ppm/°C Gain and offset errors calibrated out; MEASOUTx gain = 1; MI gain = 10 Gain and offset errors calibrated out; MEASOUTx gain = 1; MI gain = 5 % of full-scale change at measure output per V change in DUT voltage Sense resistors are trimmed to within 1% ±5 μA range ±20 μA range ±200 μA range ±2 mA range Specified current ranges are achieved with VREF = 5 V and MI gain = 10, or with VREF = 2.5 V and MI gain = 5 Set using internal sense resistor Set using internal sense resistor Set using internal sense resistor Set using internal sense resistor Set using external sense resistor; internal amplifier can drive up to ±80 mA 1 kHz, MI amplifier only, inputs grounded +1.125 V V % FSCR μV/°C % FSCR % FSCR ppm/°C % FSCR % FSCR V % FSVR/V Rev. A | Page 6 of 60 AD5522 Parameter FORCE CURRENT Voltage Compliance, FOHx2 Voltage Compliance, EXTFOHx2 Offset Error Offset Error Tempco2 Gain Error Gain Error Tempco2 Linearity Error Force Current Ranges Min AVSS + 4 AVSS + 3 −0.5 5 −1.5 −6 −0.02 +0.02 +1.5 Typ 1 Max AVDD − 4 AVDD − 3 +0.5 Unit V V % FSCR ppm FS/°C % FSCR ppm/°C % FSCR Test Conditions/Comments Measured at midscale code, 0 V, prior to calibration Standard deviation = 5 ppm/°C Prior to calibration Standard deviation = 5 ppm/°C Specified current ranges achieved with VREF = 5 V and MI gain = 10, or with VREF = 2.5 V and MI gain = 5 V Set using internal sense resistor, 200 kΩ Set using internal sense resistor, 50 kΩ Set using internal sense resistor, 5 kΩ Set using internal sense resistor, 500 Ω Set using external sense resistor; internal amplifier can drive up to ±80 mA ±5 ±20 ±200 ±2 ±80 MEASURE VOLTAGE Measure Voltage Range2 Offset Error Offset Error Tempco2 Gain Error Gain Error Tempco2 Linearity Error Noise Spectral Density (NSD)2 OFFSET DAC Span Error COMPARATOR Comparator Span Offset Error Offset Error Tempco2 Propagation Delay2 VOLTAGE CLAMPS Clamp Span Positive Clamp Accuracy Negative Clamp Accuracy CLL to CLH2 Recovery Time2 Activation Time2 CURRENT CLAMPS Clamp Accuracy μA μA μA mA mA AVSS + 4 −10 −25 −1 −0.25 −0.5 1 −0.01 100 AVDD − 4 +10 +25 +0.25 +0.5 +0.01 V mV mV μV/°C % FSR % FSR ppm/°C % FSR nV/√Hz Gain = 1, measured at 0 V Gain = 0.2, measured at 0 V Standard deviation = 6 μV/°C MEASOUTx gain = 1 MEASOUTx gain = 0.2 Standard deviation = 4 ppm/°C Gain = 1 1 kHz; measure voltage amplifier only, inputs grounded ±30 22.5 +1 1 0.25 22.5 155 −155 500 0.5 1.5 Programmed clamp value Programmed clamp value 5 10 1.5 3 Programmed clamp value + 10 Programmed clamp value + 20 mV V mV μV/°C μs V mV mV mV μs μs % FSCR % FSCR % of IRANGE % of IRANGE μs μs −2 +2 Measured directly at comparator; does not include measure block errors Standard deviation = 2 μV/°C CLL < CLH and minimum voltage apart MI gain = 10, clamp current scales with selected range MI gain = 5, clamp current scales with selected range CLL < CLH and minimum setting apart, MI gain = 10 CLL < CLH and minimum setting apart, MI gain = 5 CLL to CLH2 Recovery Time2 Activation Time2 0.5 1.5 1.5 3 Rev. A | Page 7 of 60 AD5522 Parameter FOHx, EXTFOHx, EXTMEASILx, EXTMEASIHx, CFFx PINS Pin Capacitance2 Leakage Current Min Typ 1 Max Unit Test Conditions/Comments 10 −3 +3 pF nA Individual pin on or off switch leakage, measured with ±11 V stress applied to pin, channel enabled, but tristate Leakage Current Tempco2 MEASVHx PIN Pin Capacitance2 Leakage Current Leakage Current Tempco2 SYS_SENSE PIN Pin Capacitance2 Switch Impedance Leakage Current Leakage Current Tempco2 SYS_FORCE PIN Pin Capacitance2 Switch Impedance Leakage Current Leakage Current Tempco2 COMBINED LEAKAGE AT DUT ±0.01 3 −3 ±0.01 3 1 −3 ±0.01 6 60 −3 ±0.01 +3 nA/°C pF nA nA/°C SYS_SENSE connected, force amplifier inhibited 1.3 +3 pF kΩ nA nA/°C pF Ω nA nA/°C Measured with ±11V stress applied to pin, channel enabled, but tristate Measured with ±11 V stress applied to pin, switch off SYS_FORCE connected, force amplifier inhibited 80 +3 Measured with ±11 V stress applied to pin, switch off Includes FOHx, MEASVHx, SYS_SENSE, SYS_FORCE, EXTMEASILx, EXTMEASIHx, EXTFOHx, and CFFx; calculation of all the individual leakage contributors TJ = 25°C to 70°C TJ = 25°C to 90°C Leakage Current Leakage Current Tempco2 DUTGND PIN Voltage Range Leakage Current MEASOUTx PIN Output Voltage Span Output Impedance Output Leakage Current Output Capacitance2 Maximum Load Capacitance2 Output Current Drive2 Short-Circuit Current Slew Rate2 Enable Time2 Disable Time2 MI to MV Switching Time2 GUARDx PIN Output Voltage Span Output Offset Short-Circuit Current Maximum Load Capacitance2 Output Impedance Tristate Leakage Current2 Slew Rate2 Alarm Activation Time2 −15 −25 ±0.1 −500 −30 22.5 60 −3 +15 +25 nA nA nA/°C mV nA V Ω nA pF μF mA mA V/μs ns ns ns +500 +30 With respect to AGND Software programmable output range With SW12 off 80 +3 15 0.5 +10 2 −10 2 150 400 200 320 1100 Closing SW12, measured from BUSY rising edge Opening SW12, measured from BUSY rising edge Measured from BUSY rising edge; does not include slewing or settling 22.5 −10 −15 85 −30 5 200 +30 +10 +15 100 V mV mA nF Ω nA V/μs μs When guard amplifier is disabled CLOAD = 10 pF Alarm delayed to eliminate false alarms Rev. A | Page 8 of 60 AD5522 Parameter FORCE AMPLIFIER2 Slew Rate Gain Bandwidth Max Stable Load Capacitance Min Typ1 0.4 1.3 10,000 100 FV SETTLING TIME TO 0.05% OF FS2 ±80 mA Range ±2 mA Range ±200 μA Range ±20 μA Range ±5 μA Range MI SETTLING TIME TO 0.05% OF FS2 22 24 40 300 1400 40 40 80 μs μs μs μs μs Max Unit V/μs MHz pF nF Test Conditions/Comments CCOMPx = 100 pF, CFFx = 220 pF, CLOAD = 200 pF CCOMPx = 100 pF, CFFx = 220 pF, CLOAD = 200 pF CCOMPx = 100 pF, larger CLOAD requires larger CCOMP CCOMPx = 1 nF, larger CLOAD requires larger CCOMP Midscale to full-scale change; measured from SYNC rising edge, clamps on CCOMPx = 100 pF, CFFx = 220 pF, CLOAD = 200 pF CCOMPx = 100 pF, CFFx = 220 pF, CLOAD = 200 pF CCOMPx = 100 pF, CFFx = 220 pF, CLOAD = 200 pF CCOMPx = 100 pF, CFFx = 220 pF, CLOAD = 200 pF CCOMPx = 100 pF, CFFx = 220 pF, CLOAD = 200 pF Midscale to full-scale change; driven from force amplifier in FV mode, so includes FV settling time; measured from SYNC rising edge, clamps on CCOMPx = 100 pF, CFFx = 220 pF, CLOAD = 200 pF CCOMPx = 100 pF, CFFx = 220 pF, CLOAD = 200 pF CCOMPx = 100 pF, CFFx = 220 pF, CLOAD = 200 pF CCOMPx = 100 pF, CFFx = 220 pF, CLOAD = 200 pF CCOMPx = 100 pF, CFFx = 220 pF, CLOAD = 200 pF Midscale to full-scale change; measured from SYNC rising edge, clamps on CCOMPx = 100 pF, CLOAD = 200 pF CCOMPx = 100 pF, CLOAD = 200 pF CCOMPx = 100 pF, CLOAD = 200 pF CCOMPx = 100 pF, CLOAD = 200 pF CCOMPx = 100 pF, CLOAD = 200 pF Midscale to full-scale change; driven from force amplifier in FV mode, so includes FV settling time; measured from SYNC rising edge, clamps on CCOMPx = 100 pF, CLOAD = 200 pF CCOMPx = 100 pF, CLOAD = 200 pF CCOMPx = 100 pF, CLOAD = 200 pF CCOMPx = 100 pF, CLOAD = 200 pF CCOMPx = 100 pF, CLOAD = 200 pF ±80 mA Range ±2 mA Range ±200 μA Range ±20 μA Range ±5 μA Range FI SETTLING TIME TO 0.05% OF FS2 ±80 mA Range ±2 mA Range ±200 μA Range ±20 μA Range ±5 μA Range MV SETTLING TIME TO 0.05% OF FS2 22 24 60 462 1902 40 40 100 μs μs μs μs μs 24 24 50 450 2700 55 60 120 μs μs μs μs μs ±80 mA Range ±2 mA Range ±200 μA Range ±20 μA Range ±5 μA Range DAC SPECIFICATIONS Resolution Output Voltage Span2 Differential Nonlinearity2 COMPARATOR DAC DYNAMIC SPECIFICATIONS2 Output Voltage Settling Time Slew Rate Digital-to-Analog Glitch Energy Glitch Impulse Peak Amplitude REFERENCE INPUT VREF DC Input Impedance VREF Input Current VREF Range2 DIE TEMPERATURE SENSOR Accuracy2 Output Voltage at 25°C Output Scale Factor2 Output Voltage Range2 24 24 50 450 2700 55 60 120 μs μs μs μs μs Bits V LSB 16 22.5 −1 +1 VREF = 5 V, within a range of −16.25 V to +22.5 V Guaranteed monotonic by design over temperature 1 5.5 20 10 1 −10 2 100 +0.03 μs V/μs nV-s mV MΩ μA V °C V mV/°C V 500 mV change to ±½ LSB +10 5 ±7 1.5 4.6 0 3 Rev. A | Page 9 of 60 AD5522 Parameter INTERACTION AND CROSSTALK2 DC Crosstalk (FOHx) Min Typ 1 0.05 Max 0.65 Unit mV Test Conditions/Comments DC change resulting from a dc change in any DAC in the device, FV and FI modes, ±2 mA range, CLOAD = 200 pF, RLOAD = 5.6 kΩ DC change resulting from a dc change in any DAC in the device, MV and MI modes, ±2 mA range, CLOAD = 200 pF, RLOAD = 5.6 kΩ All channels in FVMI mode, one channel at midscale; measure the current for one channel in the lowest current range for a change in comparator or clamp DAC levels for that PMU (2.3 V to 2.7 V)/(2.7 V to 5.25 V), JEDEC-compliant input levels (2.3 V to 2.7 V)/(2.7 V to 5.25 V), JEDEC-compliant input levels DC Crosstalk (MEASOUTx) 0.05 0.65 mV DC Crosstalk Within a Channel 0.05 mV SPI INTERFACE LOGIC INPUTS Input High Voltage, VIH Input Low Voltage, VIL Input Current, IINH, IINL Input Capacitance, CIN2 CMOS LOGIC OUTPUTS Output High Voltage, VOH Output Low Voltage, VOL Tristate Leakage Current Output Capacitance2 OPEN-DRAIN LOGIC OUTPUTS Output Low Voltage, VOL Output Capacitance2 LVDS INTERFACE LOGIC INPUTS REDUCED RANGE LINK2 Input Voltage Range Input Differential Threshold External Termination Resistance Differential Input Voltage LVDS INTERFACE LOGIC OUTPUTS REDUCED RANGE LINK Output Offset Voltage Output Differential Voltage POWER SUPPLIES AVDD AVSS DVCC AIDD AISS AIDD AISS AIDD AISS DICC Maximum Power Dissipation2 1.7/2.0 0.7/0.8 −1 +1 10 V V μA pF SDO, CPOx DVCC − 0.4 −2 −1 0.4 +2 +1 10 0.4 10 V V μA μA pF V pF IOL = 500 μA. SDO, CPOH1/SDO All other output pins BUSY, TMPALM, CGALM IOL = 500 μA, CLOAD = 50 pF, RPULLUP = 1 kΩ 875 −100 80 100 100 1575 +100 120 mV mV Ω mV 1200 400 10 −23 2.3 28 −5 5.25 26 mV mV V V V mA mA 28 mA mA 36 mA mA mA W |AVDD − AVSS| ≤ 33 V −26 −28 −36 1.5 7 Internal ranges (±5 μA to ±2 mA), excluding load conditions; comparators and guard disabled Internal ranges (±5 μA to ±2 mA), excluding load conditions; comparators and guard disabled Internal ranges (±5 μA to ±2 mA), excluding load conditions; comparators and guard enabled Internal ranges (±5 μA to ±2 mA), excluding load conditions; comparators and guard enabled External range, excluding load conditions External range, excluding load conditions Maximum power that should be dissipated in this package under worst-case load conditions; careful consideration should be given to supply selection and thermal design Rev. A | Page 10 of 60 AD5522 Parameter Power Supply Sensitivity2 ΔForced Voltage/ΔAVDD ΔForced Voltage/ΔAVSS ΔMeasured Current/ΔAVDD ΔMeasured Current/ΔAVSS ΔForced Current/ΔAVDD ΔForced Current/ΔAVSS ΔMeasured Voltage/ΔAVDD ΔMeasured Voltage/ΔAVSS ΔForced Voltage/ΔDVCC ΔMeasured Current/ΔDVCC ΔForced Current/ΔDVCC ΔMeasured Voltage/ΔDVCC 1 2 Min Typ 1 −80 −80 −85 −75 −75 −75 −85 −80 −90 −90 −90 −90 Max Unit dB dB dB dB dB dB dB dB dB dB dB dB Test Conditions/Comments From dc to 1 kHz Typical specifications are at 25°C and nominal supply, ±15.25 V, unless otherwise noted. Guaranteed by design and characterization; not production tested. Tempco values are mean and standard deviation, unless otherwise noted. TIMING CHARACTERISTICS AVDD ≥ 10 V, AVSS ≤ −5 V, |AVDD − AVSS| ≥ 20 V and ≤ 33 V, DVCC = 2.3 V to 5.25 V, VREF = 5 V, TJ = 25°C to 90°C, unless otherwise noted. Table 2. SPI Interface Parameter tWRIT E 4 1 , 2, 3 DVCC, Limit at TMIN, TMAX 2.3 V to 2.7 V 2.7 V to 3.6 V 4.5 V to 5.25 V 1030 735 735 950 655 655 30 8 8 10 150 70 20 8 8 10 150 70 5 5 7 75 1.5 2.1 2.7 3.3 270 20 20 150 0 100 20 8 8 10 150 70 5 5 4.5 55 1.5 2.1 2.7 3.3 270 20 20 150 0 100 Unit ns min ns min ns min ns min ns min ns min ns min ns min ns min ns min ns min ns max μs max μs max μs max μs max ns max ns min ns min ns min ns min ns max t1 t2 t3 t4 t54 t6 t7 t8 t9 t10 1 DAC X1 2 DAC X1 3 DAC X1 4 DAC X1 Other Registers t11 t12 t13 t14 t15 10 5 9 120 1.5 2.1 2.7 3.3 270 20 20 150 0 100 Description Single channel update cycle time (X1 register write) Single channel update cycle time (any other register write) SCLK cycle time SCLK high time SCLK low time SYNC falling edge to SCLK falling edge setup time Minimum SYNC high time in write mode after X1 register write (one channel) Minimum SYNC high time in write mode after any other register write 29th SCLK falling edge to SYNC rising edge Data setup time Data hold time SYNC rising edge to BUSY falling edge BUSY pulse width low; see Table 17 System control register/PMU registers 29th SCLK falling edge to LOAD falling edge LOAD pulse width low BUSY rising edge to FOHx output response time BUSY rising edge to LOAD falling edge LOAD rising edge to FOHx output response time Rev. A | Page 11 of 60 AD5522 Parameter 1 , 2, 3 t16 t17 t18 t19 5, 6 1 2 DVCC, Limit at TMIN, TMAX 2.3 V to 2.7 V 2.7 V to 3.6 V 4.5 V to 5.25 V 1.8 1.2 0.9 670 700 750 400 400 400 60 45 25 Unit ns min μs max ns min ns max Description RESET pulse width low RESET time indicated by BUSY low Minimum SYNC high time in readback mode SCLK rising edge to SDO valid; DVCC = 5 V to 5.25 V Guaranteed by design and characterization; not production tested. All input signals are specified with tR = tF = 2 ns (10% to 90% of DVCC) and timed from a voltage level of 1.2 V. 3 See Figure 5 and Figure 6. 4 Writes to more than one X1 register, engages the calibration engine for longer times, shown by the BUSY low time, t10. Subsequent writes to one or more X1 registers should either be timed or should wait until BUSY returns high (see Figure 53). This is required to ensure data is not lost or overwritten. 5 t19 is measured with the load circuit shown in Figure 4. 6 SDO output slows with lower DVCC supply and may require use of a slower SCLK. Table 3. LVDS Interface Parameter 1, 2, 3 t1 t2 t3 t4 t5 t6 t7 4 t8 DVCC, Limit at TMIN, TMAX 2.7 V to 3.6 V 4.5 V to 5.25 V 20 12 8 5 3 3 3 3 5 3 3 3 45 25 150 150 70 400 1 2 Unit ns min ns min ns min ns min ns min ns min ns min ns min ns min ns min 70 400 Description SCLK cycle time SCLK pulse width high and low time SYNC to SCLK setup time Data setup time Data hold time SCLK to SYNC hold time SCLK rising edge to SDO valid Minimum SYNC high time in write mode after X1 register write Minimum SYNC high time in write mode after any other register write Minimum SYNC high time in readback mode Guaranteed by design and characterization; not production tested. All input signals are specified with tR = tF = 2 ns (10% to 90% of DVCC) and timed from a voltage level of 1.2 V. 3 See Figure 7. 4 SDO output slows with lower DVCC supply and may require use of slower SCLK. Rev. A | Page 12 of 60 AD5522 Circuit and Timing Diagrams DVCC 200µA 2.2kΩ IOL RLOAD TO OUTPUT PIN 06197-003 VOL CLOAD 50pF TO OUTPUT PIN CLOAD 50pF 200µA IOH VOH(MIN) – VOL(MAX) 2 06197-004 Figure 3. Load Circuit for CGALM, TMPALM Figure 4. Load Circuit for SDO, BUSY Timing Diagram t1 SCLK 1 2 29 1 29 t3 t4 t2 t6 SYNC t7 t8 SDI DB28 DB0 t5 DB28 DB0 t9 t10 BUSY t11 LOAD1 FOHx1 t12 t13 t14 t12 LOAD2 FOHx2 t15 t16 RESET BUSY 1LOAD ACTIVE DURING BUSY. 2LOAD ACTIVE AFTER BUSY. t17 06197-005 Figure 5. SPI Write Timing (Write Word Contains 29 Bits) Rev. A | Page 13 of 60 AD5522 SCLK 29 t19 t18 58 SYNC SDI DB28 DB0 DB23/ DB28 DB0 INPUT WORD SPECIFIES REGISTER TO BE READ SDO DB23/ DB28 NOP CONDITION DB0 06197-006 UNDEFINED SELECTED REGISTER DATA CLOCKED OUT Figure 6. SPI Read Timing (Readback Word Contains 24 Bits and Can Be Clocked Out with a Minimum of 24 Clock Edges) t8 SYNC SYNC t3 SCLK SCLK SDI MSB D28 t1 t6 t2 LSB D0 t4 MSB D23/D28 LSB D0 SDI t5 t7 MSB DB23/ DB28 LSB DB0 06197-007 SDO SDO UNDEFINED SELECTED REGISTER DATA CLOCKED OUT Figure 7. LVDS Read and Write Timing (Readback Word Contains 24 Bits and Can Be Clocked Out with a Minimum of 24 Clock Edges) Rev. A | Page 14 of 60 AD5522 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Supply Voltage, AVDD to AVSS AVDD to AGND AVSS to AGND VREF to AGND DUTGND to AGND REFGND to AGND DVCC to DGND AGND to DGND Digital Inputs to DGND Analog Inputs to AGND Storage Temperature Range Operating Junction Temperature Range (J Version) Reflow Soldering Junction Temperature Rating 34 V −0.3 V to +34 V +0.3 V to −34 V −0.3 V to +7 V AVDD + 0.3 V to AVSS − 0.3 V AVDD + 0.3 V to AVSS − 0.3 V −0.3 V to +7 V −0.3 V to +0.3 V −0.3 V to DVCC + 0.3 V AVSS − 0.3 V to AVDD + 0.3 V −65°C to +125°C 25°C to 90°C JEDEC Standard (J-STD-020) 150°C max 1 2 THERMAL RESISTANCE Thermal resistance values are specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 5. Thermal Resistance1 (JEDEC 4-Layer (1S2P) Board) Package Type TQFP Exposed Pad Down No Heat Sink2 Airflow (LFPM) 0 200 500 N/A 0 200 500 N/A4 θJA 22.3 17.2 15.1 5.4 42.4 37.2 35.7 3.0 θJC 4.8 Unit °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W With Cooling Plate at 45°C3 TQFP Exposed Pad Up No Heat Sink2 4.8 2 With Cooling Plate at 45°C3 2 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The information in this section is based on simulated thermal information. These values apply to the package with no heat sink attached. The actual thermal performance of the package depends on the attached heat sink and environmental conditions. 3 Natural convection at 55°C ambient. Assumes perfect thermal contact between the cooling plate and the exposed paddle. 3 N/A means not applicable. ESD CAUTION Rev. A | Page 15 of 60 AD5522 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS SYS_FORCE SYS_SENSE MEASOUT0 MEASOUT1 MEASOUT2 MEASOUT3 EXTFOH0 EXTFOH1 60 AVDD PIN 1 59 CFF1 58 CCOMP1 57 EXTMEASIH1 56 EXTMEASIL1 55 FOH1 54 GUARD1 53 GUARDIN1/DUTGND1 52 MEASVH1 51 AGND 50 AGND 49 MEASVH3 48 GUARDIN3/DUTGND3 47 GUARD3 46 FOH3 45 EXTMEASIL3 44 EXTMEASIH3 43 CCOMP3 42 CFF3 41 AVDD 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 SPI/LVDS TMPALM DUTGND REFGND CGALM RESET AGND AVDD AVSS AVSS 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 AVDD 1 CFF0 2 CCOMP0 3 EXTMEASIH0 4 EXTMEASIL0 5 FOH0 6 GUARD0 7 GUARDIN0/DUTGND0 8 MEASVH0 9 AGND 10 AGND 11 MEASVH2 12 GUARDIN2/DUTGND2 13 GUARD2 14 FOH2 15 EXTMEASIL2 16 EXTMEASIH2 17 CCOMP2 18 CFF2 19 AVDD 20 AD5522 TOP VIEW EXPOSED PAD ON BOTTOM (Not to Scale) AVSS VREF EXTFOH2 CPOL2/CPO0 CPOL1/SYNC CPOL3/CPO2 CPOL0/SCLK CPOH2/CPO1 NOTES: 1. FOR PROPER CONNECTION OFTHE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. Figure 8. Pin Configuration, Exposed Pad on Bottom Table 6. Pin Function Descriptions Pin No. Mnemonic Exposed pad Description The exposed pad is internally electrically connected to AVSS. For enhanced thermal, electrical, and board level performance, the exposed paddle on the bottom of the package should be soldered to a corresponding thermal land paddle on the PCB. Positive Analog Supply Voltage. External Capacitor for Channel 0. This pin optimizes the stability and settling time performance of the force amplifier when in force voltage mode. See the Compensation Capacitors section. Compensation Capacitor Input for Channel 0. See the Compensation Capacitors section. Sense Input (High Sense) for High Current Range (Channel 0). Sense Input (Low Sense) for High Current Range (Channel 0). Force Output for Internal Current Ranges (Channel 0). Guard Output Drive for Channel 0. Guard Amplifier Input for Channel 0/DUTGND Input for Channel 0. This dual function pin is configured via the serial interface. The default function at power-on is GUARDIN0. If this pin is configured as a DUTGND input for the channel, the input to the guard amplifier is internally connected to MEASVH0. For more information, see the Device Under Test Ground (DUTGND) section and the Guard Amplifier section. DUT Voltage Sense Input (High Sense) for Channel 0. Analog Ground. These pins are the reference points for the analog supplies and the measure circuitry. DUT Voltage Sense Input (High Sense) for Channel 2. 1, 20, 41, 60, 74 2 3 4 5 6 7 8 AVDD CFF0 CCOMP0 EXTMEASIH0 EXTMEASIL0 FOH0 GUARD0 GUARDIN0/ DUTGND0 9 10, 11, 50, 51, 69 12 MEASVH0 AGND MEASVH2 Rev. A | Page 16 of 60 CPOH3/CPO3 CPOH0/SDI CPOH1/SDO EXTFOH3 06197-008 LOAD SCLK SDI AVSS SDO SYNC DGND DVCC BUSY AVSS AD5522 Pin No. 13 Mnemonic GUARDIN2/ DUTGND2 Description Guard Amplifier Input for Channel 2/DUTGND Input for Channel 2. This dual function pin is configured via the serial interface. The default function at power-on is GUARDIN2. If this pin is configured as a DUTGND input for the channel, the input to the guard amplifier is internally connected to MEASVH2. For more information, see the Device Under Test Ground (DUTGND) section and the Guard Amplifier section. Guard Output Drive for Channel 2. Force Output for Internal Current Ranges (Channel 2). Sense Input (Low Sense) for High Current Range (Channel 2). Sense Input (High Sense) for High Current Range (Channel 2). Compensation Capacitor Input for Channel 2. See the Compensation Capacitors section. External Capacitor for Channel 2. This pin optimizes the stability and settling time performance of the force amplifier when in force voltage mode. See the Compensation Capacitors section. Force Output for High Current Range (Channel 2). Use an external resistor at this pin for current ranges up to ±80 mA. For more information, see the Current Range Selection section. Negative Analog Supply Voltage. Digital Input/Open-Drain Output. This pin indicates the status of the interface. See the BUSY and LOAD Functions section for more information. Serial Clock Input, Active Falling Edge. Data is clocked into the shift register on the falling edge of SCLK. This pin operates at clock speeds up to 50 MHz. Comparator Output Low (Channel 0) for SPI Interface/Differential Serial Clock Input (Complement) for LVDS Interface. Comparator Output High (Channel 0) for SPI Interface/Differential Serial Data Input (Complement) for LVDS Interface. Serial Data Input for SPI or LVDS Interface. Active Low Frame Synchronization Input for SPI or LVDS Interface. Comparator Output Low (Channel 1) for SPI Interface/Differential SYNC Input for LVDS Interface. Digital Ground Reference Point. Comparator Output High (Channel 1) for SPI Interface/Differential Serial Data Output (Complement) for LVDS Interface. Serial Data Output for SPI or LVDS Interface. This pin can be used for data readback and diagnostic purposes. Logic Input (Active Low). This pin synchronizes updates within one device or across a group of devices. If synchronization is not required, LOAD can be tied low; in this case, DAC channels and PMU modes are updated immediately after BUSY goes high. See the BUSY and LOAD Functions section for more information. Digital Supply Voltage. Comparator Output Low (Channel 2) for SPI Interface/Comparator Output Window (Channel 0) for LVDS Interface. Comparator Output High (Channel 2) for SPI Interface/Comparator Output Window (Channel 1) for LVDS Interface. Comparator Output Low (Channel 3) for SPI Interface/Comparator Output Window (Channel 2) for LVDS Interface. Comparator Output High (Channel 3) for SPI Interface/Comparator Output Window (Channel 3) for LVDS Interface. Force Output for High Current Range (Channel 3). Use an external resistor at this pin for current ranges up to ±80 mA. For more information, see the Current Range Selection section. External Capacitor for Channel 3. This pin optimizes the stability and settling time performance of the force amplifier when in force voltage mode. See the Compensation Capacitors section. Compensation Capacitor Input for Channel 3. See the Compensation Capacitors section. Sense Input (High Sense) for High Current Range (Channel 3). Sense Input (Low Sense) for High Current Range (Channel 3). Force Output for Internal Current Ranges (Channel 3). Guard Output Drive for Channel 3. Guard Amplifier Input for Channel 3/DUTGND Input for Channel 3. This dual function pin is configured via the serial interface. The default function at power-on is GUARDIN3. If this pin is configured as a DUTGND input for the channel, the input to the guard amplifier is internally connected to MEASVH3. For more information, see the Device Under Test Ground (DUTGND) section and the Guard Amplifier section. 14 15 16 17 18 19 21 22, 39, 62, 67, 79 23 24 25 26 27 28 29 30 31 32 33 GUARD2 FOH2 EXTMEASIL2 EXTMEASIH2 CCOMP2 CFF2 EXTFOH2 AVSS BUSY SCLK CPOL0/SCLK CPOH0/SDI SDI SYNC CPOL1/SYNC DGND CPOH1/SDO SDO LOAD 34 35 36 37 38 40 42 43 44 45 46 47 48 DVCC CPOL2/CPO0 CPOH2/CPO1 CPOL3/CPO2 CPOH3/CPO3 EXTFOH3 CFF3 CCOMP3 EXTMEASIH3 EXTMEASIL3 FOH3 GUARD3 GUARDIN3/ DUTGND3 Rev. A | Page 17 of 60 AD5522 Pin No. 49 52 53 Mnemonic MEASVH3 MEASVH1 GUARDIN1/ DUTGND1 Description DUT Voltage Sense Input (High Sense) for Channel 3. DUT Voltage Sense Input (High Sense) for Channel 1. Guard Amplifier Input for Channel 1/DUTGND Input for Channel 1. This dual function pin is configured via the serial interface. The default function at power-on is GUARDIN1. If this pin is configured as a DUTGND input for the channel, the input to the guard amplifier is internally connected to MEASVH1. For more information, see the Device Under Test Ground (DUTGND) section and the Guard Amplifier section. Guard Output Drive for Channel 1. Force Output for Internal Current Ranges (Channel 1). Sense Input (Low Sense) for High Current Range (Channel 1). Sense Input (High Sense) for High Current Range (Channel 1). Compensation Capacitor Input for Channel 1. See the Compensation Capacitors section. External Capacitor for Channel 1. This pin optimizes the stability and settling time performance of the force amplifier when in force voltage mode. See the Compensation Capacitors section. Force Output for High Current Range (Channel 1). Use an external resistor at this pin for current ranges up to ±80 mA. For more information, see the Current Range Selection section. Multiplexed DUT Voltage, Current Sense Output, Temperature Sensor Voltage for Channel 3. This pin is referenced to AGND. Multiplexed DUT Voltage, Current Sense Output, Temperature Sensor Voltage for Channel 2. This pin is referenced to AGND. Multiplexed DUT Voltage, Current Sense Output, Temperature Sensor Voltage for Channel 1. This pin is referenced to AGND. Multiplexed DUT Voltage, Current Sense Output, Temperature Sensor Voltage for Channel 0. This pin is referenced to AGND. External Force Signal Input. This pin enables the connection of the system PMU. External Sense Signal Output. This pin enables the connection of the system PMU. Accurate Analog Reference Input Ground. Reference Input for DAC Channels (5 V for specified performance). DUT Voltage Sense Input (Low Sense). By default, this input is shared among all four PMU channels. If a DUTGND input is required for each channel, the user can configure the GUARDINx/DUTGNDx pins as DUTGND inputs for each PMU channel. Interface Select Pin. Logic low selects SPI-compatible interface mode; logic high selects LVDS interface mode. This pin has a pull-down current source (~350 μA). In LVDS interface mode, the CPOHx and CPOLx pins default to differential interface pins. Open-Drain Output for Guard and Clamp Alarms. This open-drain pin provides shared alarm information about the guard amplifier and clamp circuitry. By default, this output pin is disabled. The system control register allows the user to enable this function and to set the open-drain output as a latched output. The user can also choose to enable alarms for the guard amplifier, the clamp circuitry, or both. When this pin flags an alarm, the origins of the alarm can be determined by reading back the alarm status register. Two flags per channel in this word (one latched, one unlatched) indicate which function caused the alarm and whether the alarm is still present. Open-Drain Output for Temperature Alarm. This latched, active low, open-drain output flags a temperature alarm to indicate that the junction temperature has exceeded the default temperature setting (130°C) or the user programmed temperature setting. Two flags in the alarm status register (one latched, one unlatched) indicate whether the temperature has dropped below 130°C or remains above 130°C. User action is required to clear this latched alarm flag by writing to the clear bit (Bit 6) in any of the PMU registers. Digital Reset Input. This active low, level sensitive input resets all internal nodes on the device to their poweron reset values. Force Output for High Current Range (Channel 0). Use an external resistor at this pin for current ranges up to ±80 mA. For more information, see the Current Range Selection section. 54 55 56 57 58 59 61 63 64 65 66 68 70 71 72 73 GUARD1 FOH1 EXTMEASIL1 EXTMEASIH1 CCOMP1 CFF1 EXTFOH1 MEASOUT3 MEASOUT2 MEASOUT1 MEASOUT0 SYS_FORCE SYS_SENSE REFGND VREF DUTGND 75 SPI/LVDS 76 CGALM 77 TMPALM 78 80 RESET EXTFOH0 Rev. A | Page 18 of 60 AD5522 GUARDIN0/DUTGND0 GUARDIN2/DUTGND2 EXTMEASIH0 EXTMEASIH2 EXTMEASIL0 EXTMEASIL2 MEASVH0 MEASVH2 CCOMP0 CCOMP2 GUARD0 GUARD2 AGND AGND AVDD 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 AVDD FOH0 FOH2 CFF0 CFF2 EXTFOH0 1 AVSS 2 RESET 3 TMPALM 4 CGALM 5 SPI/LVDS 6 AVDD 7 DUTGND 8 VREF 9 REFGND 10 SYS_SENSE 11 AGND 12 SYS_FORCE 13 AVSS 14 MEASOUT0 15 MEASOUT1 16 MEASOUT2 17 MEASOUT3 18 AVSS 19 EXTFOH1 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 PIN 1 60 59 58 57 56 55 54 EXTFOH2 AVSS BUSY SCLK CPOL0/SCLK CPOH0/SDI SDI SYNC CPOL1/SYNC DGND CPOH1/SDO SDO LOAD DVCC CPOL2/CPO0 CPOH2/CPO1 CPOL3/CPO2 CPOH3/CPO3 AVSS EXTFOH3 AD5522 TOP VIEW EXPOSED PAD ON TOP (Not to Scale) 53 52 51 50 49 48 47 46 45 44 43 42 41 EXTMEASIL1 EXTMEASIL3 EXTMEASIH1 EXTMEASIH3 CCOMP1 MEASVH1 MEASVH3 CCOMP3 GUARD1 GUARDIN1/DUTGND1 NOTES: 1. FOR PROPER CONNECTION OFTHE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. Figure 9. Pin Configuration, Exposed Pad on Top Table 7. Pin Function Descriptions Pin No. 1 2, 14, 19, 42, 59 3 4 Mnemonic Exposed pad EXTFOH0 AVSS RESET TMPALM Description The exposed pad is electrically connected to AVSS. Force Output for High Current Range (Channel 0). Use an external resistor at this pin for current ranges up to ±80 mA. For more information, see the Current Range Selection section. Negative Analog Supply Voltage. Digital Reset Input. This active low, level sensitive input resets all internal nodes on the device to their poweron reset values. Open-Drain Output for Temperature Alarm. This latched, active low, open-drain output flags a temperature alarm to indicate that the junction temperature has exceeded the default temperature setting (130°C) or the user programmed temperature setting. Two flags in the alarm status register (one latched, one unlatched) indicate whether the temperature has dropped below 130°C or remains above 130°C. User action is required to clear this latched alarm flag by writing to the clear bit (Bit 6) in any of the PMU registers. Open-Drain Output for Guard and Clamp Alarms. This open-drain pin provides shared alarm information about the guard amplifier and clamp circuitry. By default, this output pin is disabled. The system control register allows the user to enable this function and to set the open-drain output as a latched output. The user can also choose to enable alarms for the guard amplifier, the clamp circuitry, or both. When this pin flags an alarm, the origins of the alarm can be determined by reading back the alarm status register. Two flags per channel in this word (one latched, one unlatched) indicate which function caused the alarm and whether the alarm is still present. 5 CGALM Rev. A | Page 19 of 60 GUARDIN3/DUTGND3 GUARD3 06197-009 FOH1 FOH3 CFF1 AGND AGND AVDD CFF3 AVDD AD5522 Pin No. 6 Mnemonic SPI/LVDS Description Interface Select Pin. Logic low selects SPI-compatible interface mode; logic high selects LVDS interface mode. This pin has a pull-down current source (~350 μA). In LVDS interface mode, the CPOHx and CPOLx pins default to differential interface pins. Positive Analog Supply Voltage. DUT Voltage Sense Input (Low Sense). By default, this input is shared among all four PMU channels. If a DUTGND input is required for each channel, the user can configure the GUARDINx/DUTGNDx pins as DUTGND inputs for each PMU channel. Reference Input for DAC Channels. 5 V for specified performance. Accurate Analog Reference Input Ground. External Sense Signal Output. This pin enables the connection of the system PMU. Analog Ground. These pins are the reference points for the analog supplies and the measure circuitry. External Force Signal Input. This pin enables the connection of the system PMU. Multiplexed DUT Voltage, Current Sense Output, Temperature Sensor Voltage for Channel 0. This pin is referenced to AGND. Multiplexed DUT Voltage, Current Sense Output, Temperature Sensor Voltage for Channel 1. This pin is referenced to AGND. Multiplexed DUT Voltage, Current Sense Output, Temperature Sensor Voltage for Channel 2. This pin is referenced to AGND. Multiplexed DUT Voltage, Current Sense Output, Temperature Sensor Voltage for Channel 3. This pin is referenced to AGND. Force Output for High Current Range (Channel 1). Use an external resistor at this pin for current ranges up to ±80 mA. For more information, see the Current Range Selection section. External Capacitor for Channel 1. This pin optimizes the stability and settling time performance of the force amplifier when in force voltage mode. See the Compensation Capacitors section. Compensation Capacitor Input for Channel 1. See the Compensation Capacitors section. Sense Input (High Sense) for High Current Range (Channel 1). Sense Input (Low Sense) for High Current Range (Channel 1). Force Output for Internal Current Ranges (Channel 1). Guard Output Drive for Channel 1. Guard Amplifier Input for Channel 1/DUTGND Input for Channel 1. This dual function pin is configured via the serial interface. The default function at power-on is GUARDIN1. If this pin is configured as a DUTGND input for the channel, the input to the guard amplifier is internally connected to MEASVH1. For more information, see the Device Under Test Ground (DUTGND) section and the Guard Amplifier section. DUT Voltage Sense Input (High Sense) for Channel 1. DUT Voltage Sense Input (High Sense) for Channel 3. Guard Amplifier Input for Channel 3/DUTGND Input for Channel 3. This dual function pin is configured via the serial interface. The default function at power-on is GUARDIN3. If this pin is configured as a DUTGND input for the channel, the input to the guard amplifier is internally connected to MEASVH3. For more information, see the Device Under Test Ground (DUTGND) section and the Guard Amplifier section. Guard Output Drive for Channel 3. Force Output for Internal Current Ranges (Channel 3). Sense Input (Low Sense) for High Current Range (Channel 3). Sense Input (High Sense) for High Current Range (Channel 3). Compensation Capacitor Input for Channel 3. See the Compensation Capacitors section. External Capacitor for Channel 3. This pin optimizes the stability and settling time performance of the force amplifier when in force voltage mode. See the Compensation Capacitors section. Force Output for High Current Range (Channel 3). Use an external resistor at this pin for current ranges up to ±80 mA. For more information, see the Current Range Selection section. Comparator Output High (Channel 3) for SPI Interface/Comparator Output Window (Channel 3) for LVDS Interface. Comparator Output Low (Channel 3) for SPI Interface/Comparator Output Window (Channel 2) for LVDS Interface. Comparator Output High (Channel 2) for SPI Interface/Comparator Output Window (Channel 1) for LVDS Interface. Rev. A | Page 20 of 60 7, 21, 40, 61, 80 8 AVDD DUTGND 9 10 11 12, 30, 31, 70, 71 13 15 16 17 18 20 22 23 24 25 26 27 28 VREF REFGND SYS_SENSE AGND SYS_FORCE MEASOUT0 MEASOUT1 MEASOUT2 MEASOUT3 EXTFOH1 CFF1 CCOMP1 EXTMEASIH1 EXTMEASIL1 FOH1 GUARD1 GUARDIN1/ DUTGND1 29 32 33 MEASVH1 MEASVH3 GUARDIN3/ DUTGND3 34 35 36 37 38 39 41 43 44 45 GUARD3 FOH3 EXTMEASIL3 EXTMEASIH3 CCOMP3 CFF3 EXTFOH3 CPOH3/CPO3 CPOL3/CPO2 CPOH2/CPO1 AD5522 Pin No. 46 47 48 Mnemonic CPOL2/CPO0 DVCC LOAD Description Comparator Output Low (Channel 2) for SPI Interface/Comparator Output Window (Channel 0) for LVDS Interface. Digital Supply Voltage. Logic Input (Active Low). This pin synchronizes updates within one device or across a group of devices. If synchronization is not required, LOAD can be tied low; in this case, DAC channels and PMU modes are updated immediately after BUSY goes high. See the BUSY and LOAD Functions section for more information. Serial Data Output for SPI or LVDS Interface. This pin can be used for data readback and diagnostic purposes. Comparator Output High (Channel 1) for SPI Interface/Differential Serial Data Output (Complement) for LVDS Interface. Digital Ground Reference Point. Comparator Output Low (Channel 1) for SPI Interface/Differential SYNC Input for LVDS Interface. Active Low Frame Synchronization Input for SPI or LVDS Interface. Serial Data Input for SPI or LVDS Interface. Comparator Output High (Channel 0) for SPI Interface/Differential Serial Data Input (Complement) for LVDS Interface. Comparator Output Low (Channel 0) for SPI Interface/Differential Serial Clock Input (Complement) for LVDS Interface. Serial Clock Input, Active Falling Edge. Data is clocked into the shift register on the falling edge of SCLK. This pin operates at clock speeds up to 50 MHz. Digital Input/Open-Drain Output. This pin indicates the status of the interface. See the BUSY and LOAD Functions section for more information. Force Output for High Current Range (Channel 2). Use an external resistor at this pin for current ranges up to ±80 mA. For more information, see the Current Range Selection section. External Capacitor for Channel 2. This pin optimizes the stability and settling time performance of the force amplifier when in force voltage mode. See the Compensation Capacitors section. Compensation Capacitor Input for Channel 2. See the Compensation Capacitors section. Sense Input (High Sense) for High Current Range (Channel 2). Sense Input (Low Sense) for High Current Range (Channel 2). Force Output for Internal Current Ranges (Channel 2). Guard Output Drive for Channel 2. Guard Amplifier Input for Channel 2/DUTGND Input for Channel 2. This dual function pin is configured via the serial interface. The default function at power-on is GUARDIN2. If this pin is configured as a DUTGND input for the channel, the input to the guard amplifier is internally connected to MEASVH2. For more information, see the Device Under Test Ground (DUTGND) section and the Guard Amplifier section. DUT Voltage Sense Input (High Sense) for Channel 2. DUT Voltage Sense Input (High Sense) for Channel 0. Guard Amplifier Input for Channel 0/DUTGND Input for Channel 0. This dual function pin is configured via the serial interface. The default function at power-on is GUARDIN0. If this pin is configured as a DUTGND input for the channel, the input to the guard amplifier is internally connected to MEASVH0. For more information, see the Device Under Test Ground (DUTGND) section and the Guard Amplifier section. Guard Output Drive for Channel 0. Force Output for Internal Current Ranges (Channel 0). Sense Input (Low Sense) for High Current Range (Channel 0). Sense Input (High Sense) for High Current Range (Channel 0). Compensation Capacitor Input for Channel 0. See the Compensation Capacitors section. External Capacitor for Channel 0. This pin optimizes the stability and settling time performance of the force amplifier when in force voltage mode. See the Compensation Capacitors section. 49 50 51 52 53 54 55 56 57 58 60 62 63 64 65 66 67 68 SDO CPOH1/SDO DGND CPOL1/SYNC SYNC SDI CPOH0/SDI CPOL0/SCLK SCLK BUSY EXTFOH2 CFF2 CCOMP2 EXTMEASIH2 EXTMEASIL2 FOH2 GUARD2 GUARDIN2/ DUTGND2 69 72 73 MEASVH2 MEASVH0 GUARDIN0/ DUTGND0 74 75 76 77 78 79 GUARD0 FOH0 EXTMEASIL0 EXTMEASIH0 CCOMP0 CFF0 Rev. A | Page 21 of 60 AD5522 TYPICAL PERFORMANCE CHARACTERISTICS 1.0 TA = 25°C 0.8 0.6 0.4 LINEARITY (LSB) LINEARITY (LSB) 5 TA = 25°C 4 3 2 1 0 –1 –2 –3 06197-010 DNL INL 0.2 0 –0.2 –0.4 –0.6 –0.8 –1.0 0 10,000 20,000 30,000 CODE 40,000 50,000 60,000 DNL INL –4 –5 0 10,000 20,000 30,000 CODE 40,000 50,000 60,000 Figure 10. Force Voltage Linearity vs. Code, All Ranges, 1 LSB = 0.0015% FSR (20 V FSR) 2.0 TA = 25°C 1.5 Figure 13. Measure Current Linearity vs. Code, All Ranges, 1 LSB = 0.0015% FSR (20 V FSR), MI Gain = 10, MEASOUTx Gain = 1 1.0 V = 0V 0.8 LEAKAGE CURRENT (nA) 1.0 LINEARITY (LSB) 0.6 0.5 0 –0.5 –1.0 06197-011 0.4 EXTFOHx CFFx FOHx EXTMEASIHx EXTMEASILx MEASVHx GUARDINx/DUTGNDx COMBINED LEAKAGE 0.2 –2.0 0 10,000 20,000 30,000 CODE 40,000 50,000 60,000 –0.2 25 35 45 55 65 75 85 95 TEMPERATURE (°C) Figure 11. Force Current Linearity vs. Code, All Ranges, 1 LSB = 0.0015% FSR (20 V FSR) 2.0 TA = 25°C 1.5 Figure 14. Leakage Current vs. Temperature (Stress Voltage = 0 V) 2.0 V = 12V 1.5 EXTFOHx CFFx FOHx EXTMEASIHx EXTMEASILx MEASVHx GUARDINx/DUTGNDx COMBINED LEAKAGE 0.5 0 –0.5 –1.0 06197-012 LEAKAGE CURRENT (nA) 1.0 LINEARITY (LSB) 1.0 0.5 0 06197-015 –1.5 –2.0 0 DNL INL 10,000 20,000 30,000 CODE 40,000 50,000 60,000 –0.5 25 35 45 55 65 75 85 95 TEMPERATURE (°C) Figure 12. Measure Voltage Linearity vs. Code, All Ranges, 1 LSB = 0.0015% FSR (20 V FSR), MEASOUTx Gain = 1 or 0.2 Figure 15. Leakage Current vs. Temperature (Stress Voltage = 12 V) Rev. A | Page 22 of 60 06197-014 –1.5 0 DNL INL 06197-013 AD5522 0.2 0 0 –10 –20 VSS LEAKAGE CURRENT (nA) –0.2 ACPSRR (dB) –30 –40 –50 –60 –70 V = –12V 06197-016 –0.4 –0.6 –0.8 –1.0 –1.2 25 EXTFOHx CFFx FOHx EXTMEASIHx EXTMEASILx MEASVHx GUARDINx/DUTGNDx COMBINED LEAKAGE 35 45 55 65 75 VDD VCC –80 –90 –100 10 100 85 95 TEMPERATURE (°C) 1k 10k FREQUENCY (Hz) 100k 1M Figure 16. Leakage Current vs. Temperature (Stress Voltage = −12 V) 0.15 TA = 25°C 0.10 Figure 19. ACPSRR at FOHx in Force Current Mode vs. Frequency (MI Gain = 10) 0 –10 –20 VSS VDD LEAKAGE CURRENT (nA) 0.05 0 –0.05 –0.10 –0.15 –0.20 –12 –10 EXTFOHx CFFx FOHx EXTMEASIHx EXTMEASILx MEASVHx GUARDINx/DUTGNDx COMBINED LEAKAGE –8 –6 –4 –2 0 2 4 STRESS VOLTAGE (V) 6 8 10 ACPSRR (dB) –30 –40 –50 –60 –70 –80 –90 06197-017 VCC –100 –110 10 100 1k 10k FREQUENCY (Hz) 100k 1M 06197-119 06197-020 12 Figure 17. Leakage Current vs. Stress Voltage 0 AVDD ACPSRR AVSS ACPSRR DVCC ACPSRR Figure 20. ACPSRR at FOHx in Force Current Mode vs. Frequency (MI Gain = 5) 0 –10 –20 –30 VSS –20 –40 ACPSRR (dB) ACPSRR (dB) –40 –50 –60 –70 –80 –90 VDD VCC –60 –80 –100 –100 –110 –120 10 06197-018 100 1k 10k FREQUENCY (Hz) 100k 1M –120 10 100 1k 10k FREQUENCY (Hz) 100k 1M Figure 18. ACPSRR at FOHx in Force Voltage Mode vs. Frequency Figure 21. ACPSRR at MEASOUTx in Measure Voltage Mode vs. Frequency (Measout Gain = 1) Rev. A | Page 23 of 60 06197-019 AD5522 0 –10 –20 –30 ACPSRR (dB) 0 –10 VSS –20 –30 –40 ACPSRR (dB) –40 –50 –60 –70 –80 –90 –100 VDD VSS VCC VDD –50 –60 –70 –80 –90 –100 –110 VCC 06197-120 100 1k 10k FREQUENCY (Hz) 100k 1M –120 10 100 1k 10k FREQUENCY (Hz) 100k 1M Figure 22. ACPSRR at MEASOUTx in Measure Voltage Mode vs. Frequency (Measout Gain = 0.2) 0 –10 –20 –30 –40 ACPSRR (dB) Figure 25. APCSRR at MEASOUTx in Measure Current Mode vs. Frequency (MI Gain = 10, Measout Gain = 0.2) 0 –10 VSS VDD ACPSRR (dB) –20 –30 –40 VSS VCC VDD –50 –60 –70 –80 –90 –100 –110 –120 10 VCC –50 –60 –70 –80 –90 –100 –110 100 1k 10k FREQUENCY (Hz) 100k 1M –120 10 100 1k 10k FREQUENCY (Hz) 100k 1M Figure 23. ACPSRR at MEASOUTx in Measure Current Mode vs. Frequency (MI Gain = 10, Measout Gain = 1) 0 –10 –20 –30 –40 VDD VCC VSS Figure 26. APCSRR at MEASOUTx in Measure Current Mode vs. Frequency (MI Gain = 5, Measout Gain = 0.2) 900 800 700 600 MEASURE CURRENT IN-AMP MEASURE VOLTAGE IN-AMP FORCE AMP –50 –60 –70 –80 –90 –100 –110 –120 10 NSD (nV/ Hz) ACPSRR (dB) 500 400 300 200 100 06197-022 06197-121 100 1k 10k FREQUENCY (Hz) 100k 1M 0 10 100 1k 10k 100k 1M FREQUENCY (Hz) Figure 24. APCSRR at MEASOUTx in Measure Current Mode vs. Frequency (MI Gain = 5, Measout Gain = 1) Figure 27. NSD vs. Frequency (Measured in FVMV and FVMI Mode) Rev. A | Page 24 of 60 06197-123 06197-021 06197-122 –110 10 AD5522 TA = 25°C TA = 25°C 1 FOH0 1 FOHx VICTIM MEASOUTx VICTIM 2 MEASOUT0 2 3 4 LOAD 06197-023 MEASOUTx ATTACK 06197-026 4 TRIGGER B CH1 10.0mV W CH2 50.0mV CH3 5.00V CH4 5.00V CH2 Pk-Pk 14.38mV B W B CH2 100mV W CH4 5.00V CH1 Pk-Pk 39.00mV CH2 Pk-Pk 325.8mV CH1 20.0mV B W M4.00µs T 10.0000µs M100µs T 200.000µs Figure 28. AC Crosstalk, FVMI Mode, PMU 0, Full-Scale Transition on One CPH DAC, MI Gain = 10, MEASOUTx Gain = 1, ±2 mA Range, CLOAD = 200 pF TA = 25°C Figure 31. Shorted DUT AC Crosstalk, Victim PMU in FVMI Mode (±200 μA Range) 1.80 1.75 1 FOH1 MEASOUTx VOLTAGE (V) 1.70 1.65 1.60 1.55 1.50 06197-127 06197-128 MEASOUT1 2 4 LOAD 06197-024 1.45 1.40 25 NOMINAL SUPPLIES ±15.25V 5 DIFFERENT DEVICES 35 45 55 65 75 85 B CH2 100mV M4.00µs W CH4 5.00V T 10.0000µs CH1 Pk-Pk 18.80mV CH2 Pk-Pk 140.0mV CH1 20.0mV B W FORCED TEMPERATURE (°C) Figure 29. AC Crosstalk, FVMI Mode, PMU 1, Full-Scale Transition on One CPH DAC, MI Gain = 10, MEASOUTx Gain = 1, ±2 mA Range, CLOAD = 200 pF T Figure 32. Temperature Sensor Voltage on MEASOUTx vs. Forced Temperature ATTACK FROM FIN1 16.70mV p-p FOH0 ATTACK FROM FIN2 10.35mV p-p FOH0 1 SYNC 4 1 3 BUSY ATTACK FROM FIN3 11.75mV p-p FOH0 1 FOH0 11 CH1 10mV B W M10µs T 30.0µs 06197-025 CH1 100mV B B W CH3 5.00V W CH4 5.00V BW M2.00µs CH4 T 6.0000µs 2.10V Figure 30. AC Crosstalk at FOH0 in FI Mode from FIN DAC of Each Other PMU (FullScale Transition), MI Gain = 10, MEASOUTx Gain = 1, ±2 mA Range, CLOAD = 200 pF Figure 33. Range Change, PMU 0, ±5 μA to ±2 mA, CLOAD = 1 nF, RLOAD = 620 kΩ, FV = 3 V Rev. A | Page 25 of 60 AD5522 SYNC 4 4 SYNC BUSY 3 BUSY 3 FOH0 1 1 FOH0 06197-129 CH1 50.0mV B CH3 5.00V B W W CH4 5.00V BW M800ns CH4 T 2.40000µs 2.10V CH1 100.0mV B B W CH3 5.00V W CH4 5.00V BW M2.00µs CH4 T 6.00000µs 2.10V Figure 34. Range Change, PMU 0, ±2 mA to ±5 μA, CLOAD = 1 nF, RLOAD = 620 kΩ, FV = 3 V Figure 37. Range Change, PMU 0, ±20 μA to ±2 mA, CLOAD = 1 nF, RLOAD = 150 kΩ, FV = 3 V SYNC 4 4 SYNC BUSY 3 BUSY 3 FOH0 FOH0 1 1 06197-130 CH1 20.0mV B CH3 5.00V B W W CH4 5.00V BW M20.0µs CH4 T 60.0000µs 2.10V CH1 50.0mV B CH3 5.00V B W W CH4 5.00V BW M2.000µs CH4 T 6.00000µs 2.10V Figure 35. Range Change, PMU 0, ±5 μA to ±2 mA, CLOAD = 100 nF, RLOAD = 620 kΩ, FV = 3 V Figure 38. Range Change, PMU 0, ±2 mA to ±20 μA, CLOAD = 1 nF, RLOAD = 150 kΩ, FV = 3 V SYNC 4 SYNC 4 BUSY 3 BUSY 3 FOH0 2 1 MEASOUTx (MI) FOHx 1 06197-131 CH1 20.0mV B CH3 5.00V B W W CH4 5.00V BW M20.0µs CH4 T 60.0000µs 2.10V CH1 2.00V CH3 5.00V CH2 2.00V CH4 5.00V M10.0µs CH1 3.84V Figure 36. Range Change, PMU 0, ±2 mA to ±5 μA, CLOAD = 100 nF, RLOAD = 620 kΩ, FV = 3 V Figure 39. FV Settling, 0 V to 5 V, ±2 mA Range, CLOAD = 220 pF, CCOMPx = 1 nF, RLOAD = 5.6 kΩ Rev. A | Page 26 of 60 06197-134 06197-133 06197-132 AD5522 SYNC SYNC 4 4 BUSY 3 BUSY 3 MEASOUTx (MI) MEASOUTx (MI) 2 2 FOHx FOHx 1 06197-135 1 06197-137 CH1 2.00V CH3 5.00V CH2 2.00V CH4 5.00V M5.0µs CH1 3.84V CH1 2.00V CH3 5.00V CH2 10.0V CH4 5.00V M25.0µs CH1 3.20V Figure 40. FV Settling, 0 V to 5 V, ±2 mA Range, CLOAD = 220 pF, CCOMPx = 100 pF, RLOAD = 5.6 kΩ Figure 42. FV Settling, 0 V to 5 V, ±20 μA Range, CLOAD = 220 pF, CCOMPx = 100 pF, RLOAD = 270 kΩ SYNC 4 4 SYNC BUSY 3 3 BUSY MEASOUTx (MI) MEASOUTx (MI) 2 2 FOHx FOHx 1 06197-136 06197-138 1 CH1 2.00V CH3 5.00V CH2 10.00V CH4 5.00V M100µs CH1 3.20V CH1 2.00V CH3 5.00V CH2 10.0V CH4 5.00V M10.0µs CH1 3.20V Figure 41. FV Settling, 0 V to 5 V, ±5 μA Range, CLOAD = 220 pF, CCOMPx = 100 pF, RLOAD = 1 MΩ Figure 43. FV Settling, 0 V to 5 V, ±200 μA Range, CLOAD = 220 pF, CCOMPx = 100 pF, RLOAD = 27 kΩ Rev. A | Page 27 of 60 AD5522 TERMINOLOGY Offset Error Offset error is a measure of the difference between the actual voltage and the ideal voltage at midscale or at zero current expressed in mV or % FSR. Gain Error Gain error is the difference between full-scale error and zeroscale error. It is expressed in % FSR. Gain Error = Full-Scale Error − Zero-Scale Error where: Full-Scale Error is the difference between the actual voltage and the ideal voltage at full scale. Zero-Scale Error is the difference between the actual voltage and the ideal voltage at zero scale. Linearity Error Linearity error, or relative accuracy, is a measure of the maximum deviation from a straight line passing through the endpoints of the full-scale range. It is measured after adjusting for gain error and offset error and is expressed in % FSR. Differential Nonlinearity (DNL) Differential nonlinearity is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures monotonicity. Common-Mode (CM) Error Common-mode (CM) error is the error at the output of the amplifier due to the common-mode input voltage. It is expressed in % of FSVR/V. Leakage Current Leakage current is the current measured at an output pin when that function is off or high impedance. Pin Capacitance Pin capacitance is the capacitance measured at a pin when that function is off or high impedance. Slew Rate The slew rate is the rate of change of the output voltage expressed in V/μs. Output Voltage Settling Time Output voltage settling time is the amount of time it takes for the output of a DAC to settle to a specified level for a full-scale input change. Digital-to-Analog Glitch Energy Digital-to-analog glitch energy is the amount of energy that is injected into the analog output at the major code transition. It is specified as the area of the glitch in nV-s. It is measured by toggling the DAC register data between 0x7FFF and 0x8000. Digital Crosstalk Digital crosstalk is defined as the glitch impulse transferred to the output of one converter due to a change in the DAC register code of another converter. It is specified in nV-s. AC Crosstalk AC crosstalk is defined as the glitch impulse transferred to the output of one PMU due to a change in any of the DAC registers in the package. ACPSRR ACPSRR is a measure of the ability of the device to avoid coupling noise and spurious signals that appear on the supply voltage pin to the output of the switch. The dc voltage on the device is modulated by a sine wave of 0.2 V p-p. The ratio of the amplitude of the signal on the output to the amplitude of the modulation is the ACPSRR. Rev. A | Page 28 of 60 AD5522 THEORY OF OPERATION The AD5522 is a highly integrated, quad per-pin parametric measurement unit (PPMU) for use in semiconductor automated test equipment. It provides programmable modes to force a pin voltage and measure the corresponding current (FVMI) and to force a pin current and measure the corresponding voltage. The device is also capable of all other combinations, including force high-Z and measure high-Z. The PPMU can force or measure a voltage range of 22.5 V. It can force or measure currents up to ±80 mA per channel using the internal amplifier; the addition of an external amplifier enables higher current ranges. All the DAC levels required for each PMU channel are on chip. window. Information on whether the measurement was high or low is available via the serial interface (comparator status register). Table 9. Comparator Output Function Using LVDS Interface Test Condition (CPL < (VDUT or IDUT)) and ((VDUT or IDUT) < CPH) (CPL > (VDUT or IDUT)) or ((VDUT or IDUT) > CPH) CPOx Output 1 0 CLAMPS Current and voltage clamps are included on chip, one clamp for each PMU channel. The clamps protect the DUT in the event of an open-circuit or short-circuit condition. Internal DAC levels set the CLL (clamp low) and CLH (clamp high) levels. The clamps work to limit the force amplifier if a voltage or current at the DUT exceeds the set levels. The clamps also protect the DUT if a transient voltage or current spike occurs when changing to a different operating mode or when programming the device to a different current range. The voltage clamps are available while forcing current, and the current clamps are available while forcing voltage. The user can set up the clamp status using the serial interface (system control register or PMU register). Each clamp has a smooth, finite transition region between normal (unclamped) operation and the final clamped level, and an internal flag is activated within this transition zone. The open-drain CGALM pin indicates whether one or more PMU channels has clamped. The clamp status of an individual PMU can be determined by polling the alarm status register using the SPI or LVDS interface. CLL should never be greater than CLH. For the voltage clamps, there should be 500 mV between the CLL and CLH levels to ensure that a region exists in the middle of the clamps where both are off. Similarly, set current clamps ±250 mV away from 0 A. The transfer function for voltage clamping in FI mode is VCLL or VCLH = 4.5 × VREF × (DAC_CODE/216) − (3.5 × VREF × (OFFSET_DAC_CODE/216)) + DUTGND See the DAC Levels section for more information. The transfer function for current clamping in FV mode is ICLL or ICLH = 4.5 × VREF × ((DAC_CODE − 32,768)/216)/(RSENSE × MI_Amplifier_Gain) where: RSENSE is the sense resistor of the selected current range. MI_Amplifier_Gain is the gain of the measure current instrumentation amplifier, either 5 or 10. Do not change clamp levels while the channel is in force mode because this can affect the forced voltage or current applied to the DUT. Similarly, the clamps should not be enabled or disabled during a force operation. FORCE AMPLIFIER The force amplifier drives the analog output FOH, which drives a programmed current or voltage to the DUT (device under test). Headroom and footroom requirements for this amplifier are 3 V on either end. An additional ±1 V is dropped across the sense resistor when maximum (rated) current is flowing through it. The force amplifier is designed to drive DUT capacitances up to 10 nF, with a compensation value of 100 pF. Larger DUT capacitive loads require larger compensation capacitances. Local feedback ensures that the amplifiers are stable when disabled. A disabled channel reduces power consumption by 2.5 mA per channel. COMPARATORS Per channel, the DUT measured voltage or current is monitored by two comparators configured as window comparators. Internal DAC levels set the CPL (comparator low) and CPH (comparator high) threshold values. There are no restrictions on the voltage settings of the comparator highs and lows. CPL going higher than CPH is not a useful operation; however, it does not cause any problems with the device. CPOLx (comparator output low) and CPOHx (comparator output high) are continuous time comparator outputs. Table 8. Comparator Output Function Using SPI Interface Test Condition VDUT or IDUT > CPH VDUT or IDUT < CPH VDUT or IDUT > CPL VDUT or IDUT < CPL CPH > VDUT or IDUT > CPL CPOLx CPOHx 0 1 1 0 1 1 When using the SPI interface, full comparator functionality is available. When using the LVDS interface, the comparator function is limited to one output per comparator, due to the large pin count requirement of the LVDS interface. When using the LVDS interface, the comparator output available pins, CPO0 to CPO3, provide information on whether the measured voltage or current is inside or outside the set CPH and CPL Rev. A | Page 29 of 60 AD5522 CURRENT RANGE SELECTION Integrated thin film resistors minimize the need for external components and allow easy selection of any of these current ranges: ±5 μA (200 kΩ), ±20 μA (50 kΩ), ±200 μA (5 kΩ), and ±2 mA (500 Ω). One current range up to ±80 mA can be accommodated per channel by connecting an external sense resistor. For current ranges in excess of ±80 mA, it is necessary that an external amplifier be used. For the suggested current ranges, the maximum voltage drop across the sense resistors is ±1 V. However, to allow for error correction, there is some overrange available in the current ranges (±12.5% or ±0.125 V across RSENSE). The full-scale voltage range that can be loaded to the FIN DAC is ±11.5 V; the forced current can be calculated as follows: FI = 4.5 × VREF × ((DAC_CODE − 32,768)/216)/(RSENSE × MI_Amplifier_Gain) where: FI is the forced current. RSENSE is the selected sense resistor. MI_Amplifier_Gain is the gain of the measure current instrumentation amplifier. This gain can be set to 5 or 10 via the serial interface. In the ±200 μA range with the 5 kΩ sense resistor and an ISENSE gain of 10, the maximum current range possible is ±225 μA. Similarly, for the other current ranges, there is an overrange of 12.5% to allow for error correction. Also, the forced current range is the quoted full-scale range only with an applied reference of 5 V or 2.5 V (with ISENSE amplifier gain = 5). The ISENSE amplifier is biased by the VMID DAC voltage in such a way as to center the measure current output irrespective of the voltage span used. When using the EXTFOHx outputs for current ranges up to ±80 mA, there is no switch in series with the EXTFOHx line, ensuring minimum capacitance present at the output of the force amplifier. This feature is important when using a pin electronics driver to provide high current ranges. HIGH CURRENT RANGES With the use of an external high current amplifier, one high current range in excess of ±80 mA is possible. The high current amplifier buffers the force output and provides the drive for the required current. The AD8397 is a dual high current output amplifier (300 mA depending on supply conditions). To achieve full swing from this amplifier, it should be used with a gain of 2 or more, thus requiring a voltage divider at the output of EXTFOHx. This amplifier is available in an SOIC exposed pad package which is well-suited to high power applications. To eliminate any timing concerns when switching between the internal ranges and the external high current range, there is a mode where the internal ±80 mA stage can be enabled at all times. See Table 25 for more information. EN HIGH CURRENT AMPLIFIER EXTFOHx CFFx INTERNAL RANGE SELECT (±5µA, ±20µA, ±200µA, ±2mA) DAC FIN + FOHx RSENSE – VMID TO CENTER I RANGE + MEASOUTx ×1 OR ×0.2 ×5 or ×10 4kΩ + – EXTMEASIHx RSENSE EXTMEASILx 2kΩ + – – 4kΩ AGND + – MEASVHx + ×1 – + – DUT DUTGND 06197-028 Figure 44. Addition of High Current Amplifier for Wider Current Range (>±80 mA) Rev. A | Page 30 of 60 AD5522 MEASURE CURRENT GAINS The measure current amplifier has two gain settings, 5 and 10. The two gain settings allow users to achieve the quoted/specified current ranges with large or small voltage swing. Use the 10 gain setting with a 5 V reference, and use the 5 gain setting with a 2.5 V reference. Both combinations ensure the specified current ranges. Using other VREF/gain setting combinations should achieve smaller current ranges only. Achieving greater current ranges than the specified ranges is outside the intended operation of the AD5522. The maximum guaranteed voltage across RSENSE = ±1.125 V. Following are examples of VREF/gain setting combinations. In these examples, the offset DAC is at its default value of 0xA492. • VREF = 5 V results in a ±11.25 V range. Using a gain setting of 10, there is ±1.125 V maximum across RSENSE, resulting in current ranges of ±5.625 μA, ±22.5 μA, and so on (including overrange of ±12.5% to allow for error correction). VREF = 2.5 V results in a ±5.625 V range. Using a gain setting of 5 results in current ranges of ±5.625 μA, ±22.5 μA, and so on (including overrange of ±12.5% to allow for error correction). VREF VREF = 3.5 V results in a ±7.87 V range. Using a gain setting of 10, there is ±0.785 V maximum across RSENSE, resulting in current ranges of ±3.92 μA, ±15.74 μA, and so on (including overrange of ±12.5% to allow for error correction). VMID VOLTAGE The midcode voltage (VMID) is used in the measure current amplifier block to center the current ranges about 0 A. This is required to ensure that the quoted current ranges can be achieved when using offset DAC settings other than the default. VMID corresponds to 0x8000 or the DAC midcode value, that is, the middle of the voltage range set by the offset DAC setting (see Table 13). See the block diagram in Figure 45. VMID = 4.5 × VREF × (32,768/216) − (3.5 × VREF × (OFFSET_DAC_CODE/216)) or VMID = 3.5 × VREF × ((42,130 − OFFSET_DAC_CODE)/216) VMIN = −3.5 × VREF × (OFFSET_DAC_CODE/216) • VTOP VDAC_MID VMID DATA ADDRESS DAC DAC HV AMP VOFFSET 2R VDAC_MIN VMIN REFGND DAC HV AMP VOFFSET 2R ATTB 1R ATT MEASOUTx 50Ω MI 5R ATTB 1R ATTB 5R INAMP1 ATT R AGND MV 1R 1R ATT = ATTENUATION FOR MEASOUTx ×0.2 MI = MEASURE CURRENT MV = MEASURE VOLTAGE SEL×5 = MI GAIN = 5 SEL×10 = MI GAIN = 10 06197-043 7R 7R 10R MEASURE CURRENT IN-AMP SEL×10 SEL×5 5R INAMP10 1R 10R 1R 1R INT/EXTMEASIHx INT/EXTMEASILx SEL×5 SEL×10 1R MEASVHx DUTGND AGND MEASURE VOLTAGE IN-AMP Figure 45. Measure Block and VMID Influence Rev. A | Page 31 of 60 AD5522 CHOOSING POWER SUPPLY RAILS As noted in the Specifications section, the minimum supply variation across the part |AVDD − AVSS| ≥ 20 V. For the AD5522 circuits to operate correctly, the supply rails must take into account not only the force voltage range, but also the internal DAC minimum voltage level, as well as headroom and so on. The DAC amplifier gains VREF by 4.5, and the offset DAC centers that range about some chosen point. The supplies need to cater to the DAC output voltage range to avoid impinging on other parts of the circuit (for example, if the measure current block for rated current ranges has a gain of 10/5, the supplies need to provide sufficient headroom and footroom to not clip the measure current circuit when full current range is required). Also, the measout gain = 0.2 setting uses the VMIN level for scaling purposes; if there is not enough footroom for this VMIN level, then the MV and MI output voltage range is affected. For the measout gain = 0.2 setting, it is important to choose AVSS based on the following: AVSS ≤ −3.5 × (VREF × (OFFSET_DAC_CODE/216)) − AVSS_footroom − VDUTGND − (RCABLE × ILOAD) where: AVSS_footroom = 4 V. VDUTGND is the voltage range anticipated at DUTGND. RCABLE is the cable/path resistance. ILOAD is the maximum load current. MEASURE OUTPUT (MEASOUTx PINS) The measured DUT voltage or current (voltage representation of DUT current) is available on the MEASOUTx pin with respect to AGND. The default MEASOUTx range is the forced voltage range for voltage measure and current measure (nominally ±11.25 V, depending on the reference voltage and offset DAC) and includes some overrange to allow for offset correction. The serial interface allows the user to select another MEASOUTx range of 0.9 × VREF to AGND, allowing an ADC with a 5 V input range to be used. The MEASOUTx line for each PMU channel can be made high impedance via the serial interface. The offset DAC directly offsets the measured output voltage level, but only when GAIN1 = 0. When the MEASOUTx gain is 0.2, the minimum code from the DAC is used to center the MEASOUTx voltage and to ensure that the voltage is within the range of 0 to 0.9 × VREF (see Figure 45). When using low supply voltages, ensure that there is sufficient headroom and footroom for the DAC output range (set by the VREF and offset DAC setting). DEVICE UNDER TEST GROUND (DUTGND) By default, there is one DUTGND input available for all four PMU channels. However, in some PMU applications, it is necessary that each channel operate from its own DUTGND level. The dual function pin, GUARDINx/DUTGNDx, can be configured as an input to the guard amplifier (GUARDIN) or as a DUTGND input for each channel. The pin function can be configured through the serial interface on power-on for the required operation. The default connection is SW13b (GUARDIN) and SW14b (shared DUTGND). Table 10. MEASOUTx Output Ranges for GAIN1 = 0, MEASOUT Gain = 1 MEASOUT Function MV MI GAIN0 = 0 GAIN0 = 1 1 Measure Current Gain 5 or 10 10 5 Transfer Function ±VDUT (IDUT × RSENSE × 10) + VMID (IDUT × RSENSE × 5) + VMID Output Voltage Range for VREF = 5 V 1 Offset DAC = 0x0 Offset DAC = 0xA492 Offset DAC = 0xED67 0 V to 22.5 V ±11.25 V −16.26 V to +6.25 V 0 V to 22.5 V 0 V to 11.25 V (VREF = 2.5 V) ±11.25 V ±5.625 V (VREF = 2.5 V) −16.26 V to +6.25 V −8.13 V to +3.12 V (VREF = 2.5 V) VREF = 5 V unless otherwise noted. Table 11. MEASOUTx Output Ranges for GAIN1 = 1, MEASOUT Gain = 0.2 MEASOUT Function MV MI GAIN0 = 0 GAIN0 = 1 Measure Current Gain 5 or 10 10 5 Transfer Function VDUT × 0.2 + (0.45 × VREF) (IDUT × RSENSE × 10 × 0.2) + (0.45 × VREF) (IDUT × RSENSE × 5 × 0.2) + (0.45 × VREF) Output Voltage Range for VREF = 5 V 1, 2 0 V to 4.5 V (±2.25 V centered around 2.25 V) 0 V to 4.5 V (±2.25 V centered around 2.25 V) 1.125 V to 3.375 V (±1.125 V, centered around 2.25 V) 0 V to 2.25 V (±1.125 V, centered around 1.125 V) (VREF = 2.5 V) 1 2 VREF = 5 V unless otherwise noted. The offset DAC setting has no effect on the output voltage range. Rev. A | Page 32 of 60 AD5522 When configured as DUTGND per channel, this dual function pin is no longer connected to the input of the guard amplifier. Instead, it is connected to the low end of the instrumentation amplifier (SW14a), and the input of the guard amplifier is connected internally to MEASVHx (SW13a). MEASVH[0:3] capacitances must be driven, an external multiplexer connected to the CCOMP pin allows optimization of settling time vs. stability. The series resistance of a switch placed on CCOMP should typically be 100 kHz Table 12. Suggested Compensation Capacitor Selection CLOAD ≤1 nF ≤10 nF ≤100 nF CCOMP 100 pF 100 pF CLOAD/100 CFF 220 pF 1 nF CLOAD/10 + – SW13 DUT a SW16 AGND + x1 – MEASURE VOLTAGE IN-AMP SW14 a b GUARD GUARD[0:3] AMP + – b GUARDIN[0:3]/ DUTGND[0:3] 06197-029 DUTGND Figure 46. Using the DUTGND per Channel Feature GUARD AMPLIFIER A guard amplifier allows the user to bootstrap the shield of the cable to the voltage applied to the DUT, ensuring minimal drops across the cable. This is particularly important for measurements requiring a high degree of accuracy and in leakage current testing. If not required, all four guard amplifiers can be disabled via the serial interface (system control register). Disabling the guard amplifiers decreases power consumption by 400 μA per channel. As described in the Device Under Test Ground (DUTGND) section, GUARDINx/DUTGNDx are dual function pins. Each pin can function either as a guard amplifier input for one channel or as a DUTGND input for one channel, depending on the requirements of the end application (see Figure 46). A guard alarm event occurs when the guard output moves more than 100 mV away from the guard input voltage for more than 200 μs. In this case, the event is flagged via the open-drain output CGALM. Because the guard and clamp alarm functions share the same alarm output, CGALM, the alarm information (alarm trigger and alarm channel) is available via the serial interface in the alarm status register. Alternatively, the serial interface allows the user to set up the CGALM output to flag either the clamp status or the guard status. By default, this open-drain alarm pin is an unlatched output, but it can be configured as a latched output via the serial interface (system control register). SYSTEM FORCE AND SENSE SWITCHES Each channel has switches to allow connection of the force (FOHx) and sense (MEASVHx) lines to a central PMU for calibration purposes. There is one set of SYS_FORCE and SYS_SENSE pins per device. It is recommended that these connections be made individually to each PMU channel. FOH0 FOH1 SYS_FORCE FOH2 FOH3 MEASVH0 MEASVH1 SYS_SENSE 06197-042 MEASVH2 MEASVH3 Figure 47. SYS_FORCE and SYS_SENSE Connections to FOHx and MEASVHx Pins COMPENSATION CAPACITORS Each channel requires an external compensation capacitor (CCOMP) to ensure stability into the maximum load capacitance while ensuring that settling time is optimized. In addition, one CFF pin per channel is provided to further optimize stability and settling time performance when in force voltage (FV) mode. When changing from force current (FI) mode to FV mode, the switch connecting the CFF capacitor is automatically closed. Although the force amplifier is designed to drive load capacitances up to 10 nF (with CCOMP = 100 pF), it is possible to use larger compensation capacitor values to drive larger loads, at the expense of an increase in settling time. If a wide range of load TEMPERATURE SENSOR An on-board temperature sensor monitors die temperature. The temperature sensor is located at the center of the die. If the temperature exceeds the factory specified value (130°C) or a user programmable value, the device protects itself by shutting down all channels and flagging an alarm through the latched, open-drain TMPALM pin. Alarm status can be read back from the alarm status register or the PMU register, where latched and unlatched bits indicate whether an alarm has occurred and whether the temperature has dropped below the set alarm temperature. The shutdown temperature is set using the system control register. Rev. A | Page 33 of 60 AD5522 DAC LEVELS Each channel contains five dedicated DAC levels: one for the force amplifier, one each for the clamp high and clamp low levels, and one each for the comparator high and comparator low levels. The architecture of a single DAC channel consists of a 16-bit resistor-string DAC followed by an output buffer amplifier. This resistor-string architecture guarantees DAC monotonicity. The 16-bit binary digital code loaded to the DAC register determines at which node on the string the voltage is tapped off before being fed into the output amplifier. The transfer function for DAC outputs is as follows: VOUT = 4.5 × VREF × (X2/216) − (3.5 × VREF × (OFFSET_DAC_CODE/216)) + DUTGND where: VREF is the reference voltage and is in the range of 2 V to 5 V. X2 is the calculated DAC code value and is in the range of 0 to 65,535 (see the Gain and Offset Registers section). OFFSET_DAC_CODE is the code loaded to the offset DAC. It is multiplied by 3.5 in the transfer function. On power-up, the default code loaded to the offset DAC is 0xA492; with a 5 V reference, this gives a span of ±11.25 V. The power supplies should be selected to support the required range and should take into account amplifier headroom and footroom and sense resistor voltage drop (±4 V). Therefore, depending on the headroom available, the input to the force amplifier can be unipolar positive or bipolar, either symmetrical or asymmetrical about DUTGND, but always within a voltage span of 22.5 V. The offset DAC offsets all DAC functions. It also centers the current range so that zero current always flows at midscale code, regardless of the offset DAC setting. Rearranging the transfer function for the DAC output gives the following equation to determine which offset DAC code is required for a given reference and output voltage range. OFFSET_DAC_CODE = (216 × (VOUT − DUTGND))/(3.5 × VREF) − ((4.5 × DAC_CODE)/3.5) When the output range is adjusted by changing the default value of the offset DAC, an extra offset is introduced due to the gain error of the offset DAC channel. The amount of offset is dependent on the magnitude of the reference and how much the offset DAC channel deviates from its default value. See the Specifications section for this offset. The worst-case offset occurs when the offset DAC channel is at positive or negative full scale. This value can be added to the offset present in the main DAC channel to give an indication of the overall offset for that channel. In most cases, the offset can be removed by programming the C register of the channel with an appropriate value. The extra offset caused by the offset DAC needs to be taken into account only when the offset DAC is changed from its default value. OFFSET DAC The AD5522 is capable of forcing a 22.5 V (4.5 × VREF) voltage span. Included on chip is one 16-bit offset DAC (one for all four channels) that allows for adjustment of the voltage range. The usable range is −16.25 V to +22.5 V. Zero scale loaded to the offset DAC gives a full-scale range of 0 V to 22.5 V, midscale gives ±11.25 V, and the most useful negative range is −16.25 V to +6.25 V. Full scale loaded to the offset DAC does not give a useful output voltage range, because the output amplifiers are limited by the available footroom. Table 13 shows the effect of the offset DAC on the other DACs in the device. Table 13. Relationship of Offset DAC to Other DACs (VREF = 5 V) Offset DAC Code 0 DAC Code 0 32,768 65,535 0 32,768 65,535 0 32,768 65,535 0 32,768 65,535 DAC Output Voltage (V) 0 +11.25 +22.50 −8.75 +2.50 +13.75 −11.25 0 +11.25 −16.25 −5.00 +6.25 Footroom limitations GAIN AND OFFSET REGISTERS Each DAC level has an independent gain (M) register and an independent offset (C) register, which allow trimming out of the gain and offset errors of the entire signal chain, including the DAC. All registers in the AD5522 are volatile, so they must be loaded on power-on during a calibration cycle. Data from the X1 register is operated on by a digital multiplier and adder controlled by the contents of the M and C registers. The calibrated DAC data is then stored in the X2 register. The digital input transfer function for each DAC can be represented as follows: X2 = [(M + 1)/2n × X1] + (C − 2n − 1) where: X2 is the data-word loaded to the resistor-string DAC. X1 is the 16-bit data-word written to the DAC input register. M is the code in gain register (default code = 216 − 1). C is the code in offset register (default code = 215). n is the DAC resolution (n = 16). 32,768 42,130 60,855 65,535 Rev. A | Page 34 of 60 AD5522 The calibration engine is engaged only when data is written to the X1 register. The calibration engine is not engaged when data is written to the M or C register. This has the advantage of minimizing the initial setup time of the device. To calculate a result that includes new M or C data, a write to X1 is required. Gain and Offset Registers for the Clamp DACs The clamp DAC levels contain independent gain and offset control registers that allow the user to digitally trim gain and offset. There are two sets of X1, M, and C registers: one set for the force voltage mode and one set for all five current ranges. Two X2 registers store the calculated DAC values, ready to load to the DAC register upon a PMU mode change. VREF 16 16 16 16 16 16 16 CACHED X2 REGISTERS Each DAC has a number of cached X2 registers. These registers store the result of a gain and offset calibration in advance of a mode change. This enables the user to preload registers, allowing the calibration engine to calculate the appropriate X2 value and store it until a change in mode occurs. Because the data is ready and held in the appropriate register, mode changing is as time efficient as possible. If an update occurs to a DAC register set that is currently part of the operating PMU mode, the DAC output is updated immediately (depending on the LOAD condition). X1 REG M REG C REG ×2 X1 REG M REG C REG X2 REG 16-BIT CLH DAC CLH X2 REG ×2 16-BIT 16 CLL DAC CLL SERIAL I/F Gain and Offset Registers for the FIN DAC The force amplifier input (FIN) DAC level contains independent gain and offset control registers that allow the user to digitally trim gain and offset. There are six sets of X1, M, and C registers: one set for the force voltage range and one set for each force current range (four internal current ranges and one external current range). Six X2 registers store the calculated DAC values, ready to load to the DAC register upon a PMU mode change. OFFSET DAC 16 16 16 Figure 50. Clamp Registers REFERENCE VOLTAGE (VREF) One buffered analog input, VREF, supplies all 21 DACs with the necessary reference voltage to generate the required dc levels. REFERENCE SELECTION The voltage applied to the VREF pin determines the output voltage range and span applied to the force amplifier, clamp, and comparator inputs. The AD5522 can be used with a reference input ranging from 2 V to 5 V; however, for most applications, a reference input of 5 V or 2.5 V is sufficient to meet all voltage range requirements. The DAC amplifier gain is 4.5, which gives a DAC output span of 22.5 V. The DACs have gain and offset registers that can be used to trim out system errors. In addition, the gain register can be used to reduce the DAC output range to the desired force voltage range. The FIN DAC retains 16-bit resolution even with a gain register setting of quarter scale (0x4000). Therefore, from a single 5 V reference, it is possible to obtain a voltage span as high as 22.5 V or as low as 5.625 V. When using the gain and offset registers, the selected output range should take into account the system gain and offset errors that need to be trimmed out. Therefore, the selected output range should be larger than the actual required range. When using low supply voltages, ensure that there is sufficient headroom and footroom for the required force voltage range. Also, the forced current range is the quoted full-scale range only with an applied reference of 5 V (ISENSE amplifier gain = 10) or 2.5 V (ISENSE amplifier gain = 5). VREF X1 REG M REG C REG ×6 16 SERIAL I/F Figure 48. FIN DAC Registers Gain and Offset Registers for the Comparator DACs The comparator DAC levels contain independent gain and offset control registers that allow the user to digitally trim gain and offset. There are six sets of X1, M, and C registers: one set for the force voltage mode and one set for each force current range (four internal current ranges and one external current range). In this way, X2 can be preprogrammed, which allows for efficient switching into the required compare mode. Six X2 registers store the calculated DAC values, ready to load to the DAC register upon a PMU mode change. 16 16 16 X1 REG M REG C REG ×6 16 X2 REG 16-BIT CPH DAC CPH VREF 16 16 16 06197-031 SERIAL I/F X1 REG M REG C REG ×6 16 X2 REG 16-BIT CPL DAC CPL Figure 49. Comparator Registers Rev. A | Page 35 of 60 06197-030 X2 REG 16-BIT FIN DAC FIN 06197-032 AD5522 Table 14. References Suggested For Use with AD5522 1 Part No. ADR435 ADR445 ADR431 ADR441 1 Voltage (V) 5 5 2.5 2.5 Initial Accuracy % 0.04 0.04 0.04 0.04 Ref Out TC (ppm/°C) 1 1 1 1 Ref Output Current (mA) 30 10 30 10 Supply Voltage Range (V) +7 to +18 +5.5 to +18 +4.5 to +18 +3 to +18 Package MSOP, SOIC MSOP, SOIC MSOP, SOIC MSOP, SOIC Subset of the possible references suitable for use with the AD5522. Visit www.analog.com for more options. For other voltage and current ranges, the required reference level can be calculated as follows: 1. 2. 3. 4. Identify the nominal range required. Identify the maximum offset span and the maximum gain required on the full output signal range. Calculate the new maximum output range, including the expected maximum gain and offset errors. Choose the new required VOUTMAX and VOUTMIN, keeping the VOUT limits centered on the nominal values. Note that AVDD and AVSS must provide sufficient headroom. Calculate the value of VREF as follows: VREF = (VOUTMAX − VOUTMIN)/4.5 In this case, the optimum reference is a 2.5 V reference; the user can use the M and C registers and the offset DAC to achieve the required −2 V to +8 V range. Change the ISENSE amplifier gain to 5 to ensure a full-scale current range of the specified values (see the Current Range Selection section). This gain also allows optimization of power supplies and minimizes power consumption within the device. It is important to bear in mind when choosing a reference value that values other than 5 V (MI gain= 10) and 2.5 V (MI gain= 5) result in current ranges other than those specified. See the Measure Current Gains section for more details. 5. CALIBRATION Calibration involves determining the gain and offset of each channel in each mode and overwriting the default values in the M and C registers of the individual DACs. In some cases (for example, FI mode), the calibration constants, particularly those for gains, may be range dependent. Reference Selection Example If Nominal output range = 10 V (−2 V to +8 V) Offset error = ±100 mV Gain error = ±0.5%, and REFGND = AGND = 0 V Then Gain error = ±0.5% => Maximum positive gain error = +0.5% => Output range including gain error = 10 V + 0.005(10 V) = 10.05 V Offset error = ±100 mV => Maximum offset error span = 2(100 mV) = 0.2 V => Output range including gain error and offset error = 10.05 V + 0.2 V = 10.25 V VREF calculation Actual output range = 10.25 V, that is, −2.125 V to +8.125 V (centered); VREF = (8.125 V + 2.125 V)/4.5 = 2.28 V If the solution yields an inconvenient reference level, the user can adopt one of the following approaches: • • Use a resistor divider to divide down a convenient, higher reference level to the required level. Select a convenient reference level above VREF and modify the gain and offset registers to digitally downsize the reference. In this way, the user can use almost any convenient reference level. Use a combination of these two approaches. Reducing Zero-Scale Error Zero-scale error can be reduced as follows: 1. 2. 3. Set the output to the lowest possible value. Measure the actual output voltage and compare it to the required value. This gives the zero-scale error. Calculate the number of LSBs equivalent to the zero-scale error and add this number to the default value of the C register. Note that only negative zero-scale error can be reduced. Reducing Gain Error Gain error can be reduced as follows: 1. 2. 3. 4. Measure the zero-scale error. Set the output to the highest possible value. Measure the actual output voltage and compare it to the required value. This is the gain error. Calculate the number of LSBs equivalent to the gain error and subtract this number from the default value of the M register. Note that only positive gain error can be reduced. Calibration Example Nominal offset coefficient = 32,768 Nominal gain coefficient = 65,535 For example, the gain error = 0.5%, and the offset error = 100 mV. • Rev. A | Page 36 of 60 AD5522 Gain error (0.5%) calibration: 65,535 × 0.995 = 65,207 => Load Code 1111 1110 1011 0111 to the M register. Offset error (100 mV) calibration: LSB size = 10.25/65,535 = 156 μV; Offset coefficient for 100 mV offset = 100/0.156 = 641 LSBs => Load Code 0111 1101 0111 1111 to the C register. 2. Calibrate the measure voltage (2 points). Connect SYS_FORCE to FOHx and SYS_SENSE to MEASVHx, and close the internal force/sense switch (SW7). Force voltage on FOHx via SYS_FORCE and measure the voltage at MEASOUTx. The difference is the error between the actual forced voltage and the voltage at MEASOUTx. 3. Calibrate the force current (2 points). In FI mode, write zero scale to the FIN DAC. Connect SYS_FORCE to an external ammeter and to the FOHx pin. Measure the error between the ammeter reading and the MEASOUTx reading. Repeat this step with full scale loaded to the FIN DAC. Calculate the M and C values. Calibrate the measure current (2 points). In FI mode, write zero scale to the FIN DAC. Connect SYS_FORCE to an external ammeter and to the FOHx pin. Measure the error between the ammeter reading and the MEASOUTx reading. Repeat this step with full scale loaded to the FIN DAC. Repeat this procedure for all four channels. Additional Calibration The techniques described in the previous section are usually sufficient to reduce the zero-scale and gain errors. However, there are limitations whereby the errors may not be sufficiently reduced. For example, the offset (C) register can only be used to reduce the offset caused by negative zero-scale error. A positive offset cannot be reduced. Likewise, if the maximum voltage is below the ideal value, that is, a negative gain error, the gain (M) register cannot be used to increase the gain to compensate for the error. These limitations can be overcome by increasing the reference value. 4. SYSTEM LEVEL CALIBRATION There are many ways to calibrate the device on power-on. Following is an example of how to calibrate the FIN DAC of the device without a DUT or DUT board connected. The calibration procedure for the force and measure circuitry is as follows: 1. Calibrate the force voltage (2 points). In FV mode, write zero scale to the FIN DAC. Connect SYS_FORCE to FOHx and SYS_SENSE to MEASVHx, and close the internal force/sense switch (SW7). Using the system PMU, measure the error between the voltage at FOHx/MEASVHx and the desired value. Similarly, load full scale to the FIN DAC and measure the error between the voltage at FOHx/MEASVHx and the desired value. Calculate the M and C values. Load these values to the appropriate M and C registers of the FIN DAC. 5. Similarly, calibrate the comparator and clamp DACs, and load the appropriate gain and offset registers. Calibrating these DACs requires some successive approximation to find where the comparator trips or the clamps engage. Rev. A | Page 37 of 60 AD5522 CIRCUIT OPERATION FORCE VOLTAGE (FV) MODE Most PMU measurements are performed in force voltage/measure current (FVMI) mode, for example, when the device is used as a device power supply, or in continuity or leakage testing. In force voltage (FV) mode, the voltage forced is mapped directly to the DUT. The measure voltage amplifier completes the loop, giving negative feedback to the forcing amplifier (see Figure 51). The forced voltage can be calculated as follows: Forced Voltage at DUT = VOUT VOUT = 4.5 × VREF × (DAC_CODE/216) − (3.5 × VREF × (OFFSET_DAC_CODE/216)) + DUTGND where: VOUT is the voltage of the FIN DAC (see the DAC Levels section). EXTFOHx CFFx FORCE AMPLIFIER DAC FIN + INTERNAL RANGE SELECT (±5µA, ±20µA, ±200µA, ±2mA) FOHx RSENSE – VMID TO CENTER I RANGE + MEASOUTx ×1 OR ×0.2 ×5 or ×10 4kΩ + – EXTMEASIHx RSENSE (UP TO ±80mA) 2kΩ + – EXTMEASILx 4kΩ – AGND + – MEASVHx + ×1 – DUT DUTGND 06197-033 + – MEASURE VOLTAGE AMPLIFIER Figure 51. Forcing Voltage, Measuring Current Rev. A | Page 38 of 60 AD5522 FORCE CURRENT (FI) MODE In force current (FI) mode, the voltage at the FIN DAC is converted to a current and is applied to the DUT. The feedback path is the measure current amplifier, feeding back the voltage measured across the sense resistor. MEASOUTx reflects the voltage measured across the DUT (see Figure 52). For the suggested current ranges, the maximum voltage drop across the sense resistors is ±1 V. However, to allow for error correction, there is some overrange available in the current ranges. The maximum full-scale voltage range that can be loaded to the FIN DAC is ±11.5 V. The forced current can be calculated as follows: FI = 4.5 × VREF × ((DAC_CODE − 32,768)/216)/(RSENSE × MI_Amplifier_Gain) where: FI is the forced current. RSENSE is the selected sense resistor. MI_Amplifier_Gain is the gain of the measure current instrumentation amplifier. This gain can be set to 5 or 10 via the serial interface. The ISENSE amplifier is biased by the offset DAC output voltage in such a way as to center the measure current output regardless of the voltage span used. In the ±200 μA range with the 5 kΩ sense resistor and an ISENSE gain of 10, the maximum current range possible is ±225 μA. Similarly, for the other current ranges, there is an overrange of 12.5% to allow for error correction. EXTFOHx CFFx FORCE AMPLIFIER DAC FIN INTERNAL RANGE SELECT (±5µA, ±20µA, ±200µA, ±2mA) FOHx + – RSENSE VMID TO CENTER I RANGE MEASURE CURRENT AMPLIFIER + – 4kΩ EXTMEASIHx + MEASOUTx ×1 OR ×0.2 ×5 or ×10 2kΩ RSENSE (UP TO ±80mA) EXTMEASILx – + – 4kΩ AGND + ×1 – MEASVHx + – DUT DUTGND 06197-034 + – Figure 52. Forcing Current, Measuring Voltage Rev. A | Page 39 of 60 AD5522 SERIAL INTERFACE The AD5522 provides two high speed serial interfaces: an SPIcompatible interface operating at clock frequencies up to 50 MHz and an EIA-644-compliant LVDS interface. To minimize both the power consumption of the device and the on-chip digital noise, the serial interface powers up fully only when the device is being written to, that is, on the falling edge of SYNC. RESET FUNCTION Bringing the level-sensitive RESET line low resets the contents of all internal registers to their power-on reset state (see the Power-On Default section). This sequence takes approximately 600 μs. BUSY goes low for the duration, returning high when RESET is brought high again and the initialization is complete. While BUSY is low, all interfaces are disabled. When BUSY returns high, normal operation resumes, and the status of the RESET pin is ignored until it goes low again. The SDO output is high impedance during a power-on reset or a RESET. Power-on reset functions the same way as RESET. SPI INTERFACE The serial interface operates from a 2.3 V to 5.25 V DVCC supply range. The SPI interface is selected when the SPI/LVDS pin is held low. It is controlled by four pins, as described in Table 15. Table 15. Pins That Control the SPI Interface Pin SYNC SDI SCLK SDO Description Frame synchronization input Serial data input pin Clocks data in and out of the device Serial data output pin for data readback (weak SDO output driver, may require reduction in SCLK frequency to correctly readback, see Table 2) BUSY AND LOAD FUNCTIONS The BUSY pin is an open-drain output that indicates the status of the AD5522 interface. When writing to any register, BUSY goes low and stays low until the command completes. A write operation to a DAC register drives the BUSY signal low for longer than a write to a PMU or system control register. For DACs, the value of the internal cached (X2) data is calculated and stored each time that the user writes new data to the corresponding X1 register. During the calculation and writing of X2, the BUSY output is driven low. While BUSY is low, the user can continue writing new data to the X1, M, or C register, but no DAC output updates can take place (applies to single channel writes). X2 values are stored and held until a PMU word is written that calls the appropriate cached X2 register. Only then is a DAC output updated. The DAC outputs and PMU modes are updated by taking the LOAD input low. If LOAD goes low while BUSY is active, the LOAD event is stored and the DAC outputs or PMU modes are updated immediately after BUSY goes high. A user can also hold the LOAD input permanently low. In this case, the DAC outputs or PMU modes are updated immediately after BUSY goes high. The BUSY pin is bidirectional and has a 50 kΩ internal pull-up resistor. When multiple AD5522 devices are used in one system, the BUSY pins can be tied together. This is useful when it is required that no DAC or PMU in any device be updated until all others are ready to be updated. When each device finishes updating its X2 registers, it releases the BUSY pin. If another device has not finished updating its X2 registers, it holds BUSY low, thus delaying the effect of LOAD going low. Because there is only one calibration engine shared among four channels, the task of calculating X2 values must be done sequentially, so that the length of the BUSY pulse varies according to the number of channels being updated. Following multiple channel updates, subsequent writes to single or multiple X1 registers should either be timed or should wait until BUSY returns high (see Figure 53). If subsequent X1 writes are LVDS INTERFACE The LVDS interface uses the same input pins, with the same designations, as the SPI interface. In addition, four other pins are provided for the complementary signals needed for differential operation, as described in Table 16. Table 16. Pins That Control the LVDS Interface Pin SYNC SYNC SDI SDI SCLK SCLK SDO SDO Description Differential frame synchronization signal Differential frame synchronization signal (complement) Differential serial data input Differential serial data input (complement) Differential serial clock input Differential serial clock input (complement) Differential serial data output for data readback Differential serial data output for data readback (complement) SERIAL INTERFACE WRITE MODE The AD5522 allows writing of data via the serial interface to every register directly accessible to the serial interface, that is, all registers except the DAC registers. The serial word is 29 bits long. The serial interface works with both a continuous and a burst (gated) serial clock. Serial data applied to SDI is clocked into the AD5522 by clock pulses applied to SCLK. The first falling edge of SYNC starts the write cycle. At least 29 falling clock edges must be applied to SCLK to clock in 29 bits of data before SYNC is taken high again. The input register addressed is updated on the rising edge of SYNC. For another serial transfer to take place, SYNC must be taken low again. Rev. A | Page 40 of 60 AD5522 presented before the calibration engine completes the first stage of the last Channel X2 calculation, data may be lost. For other writes, (PMU, system control registers, and so forth), the write command should not be completed (SYNC returning high) until BUSY returns high. This is necessary to ensure that calibration data is not lost and that the calibration data is not corrupted. Table 17. BUSY Pulse Widths Action Loading Data to PMU, System Control Register, or Readback Loading X1 to 1 PMU DAC Channel Loading X1 to 2 PMU DAC Channels Loading X1 to 3 PMU DAC Channels Loading X1 to 4 PMU DAC Channels 1 CALIBRATION ENGINE TIME ~600ns WRITE 1 600ns FIRST STAGE WRITE 2 600ns SECOND STAGE FIRST STAGE WRITE 3 300ns THIRD STAGE SECOND STAGE FIRST STAGE THIRD STAGE SECOND STAGE THIRD STAGE 06197-036 Figure 54. Multiple Single Channel Writes Engaging the Calibration Engine BUSY Pulse Width1 0.27 μs maximum 1.5 μs maximum 2.1 μs maximum 2.7 μs maximum 3.3 μs maximum REGISTER SELECTION The serial word assignment consists of 29 bits. Bit 28 to Bit 22 are common to all registers, whether writing to or reading from the device. The PMU3 to PMU0 data bits (Bit 27 to Bit 24) address each PMU channel (or associated DAC register). When the PMU3 to PMU0 bits are all zeros, the system control register is addressed. The mode bits, MODE0 and MODE1, address the different sets of DAC registers and the PMU register. Table 18. Mode Bits B23 MODE1 0 0 1 1 B22 MODE0 0 1 0 1 Action Write to the system control register or the PMU register Write to the DAC gain (M) register Write to the DAC offset (C) register Write to the DAC input data (X1) register BUSY pulse width = ((number of channels + 1) × 600 ns) + 300 ns. BUSY also goes low during a power-on reset and when a falling edge is detected on the RESET pin. CALIBRATION ENGINE TIME ~600ns WRITE 1 600ns FIRST STAGE 600ns SECOND STAGE FIRST STAGE 300ns THIRD STAGE SECOND STAGE FIRST STAGE WRITE 2 THIRD STAGE SECOND STAGE FIRST STAGE THIRD STAGE SECOND STAGE THIRD STAGE 06197-035 FOR EXAMPLE, WRITE TO 3 FIN DAC REGISTERS Readback Control, RD/WR Setting the RD/WR bit (Bit 28) high initiates a readback sequence of the PMU, alarm status, comparator status, system control, or DAC register, as determined by the address bits. Figure 53. Multiple Writes to DAC X1 Registers Writing data to the system control register, the PMU control register, the M register, or the C register does not involve the digital calibration engine, thus speeding up configuration of the device on power-on, but care should be taken not to issue these commands while BUSY is low as previously described. PMU Address Bits: PMU3, PMU2, PMU1, PMU0 The PMU3 to PMU0 data bits (Bit 27 to Bit 24) address each PMU channel on chip. These bits allow individual control of each PMU channel or any combination of channels, in addition to multichannel programming. PMU bits also allow access to write registers such as the system control register and the DAC registers, in addition to reading from all the registers (see Table 19). REGISTER UPDATE RATES The value of the X2 register is calculated each time the user writes new data to the corresponding X1 register. The calculation is performed in a three-stage process. The first two stages take approximately 600 ns each, and the third stage takes approximately 300 ns. When the write to the X1 register is complete, the calculation process begins. If the write operation involves the update of a single DAC channel, the user is free to write to another X1 register, provided that the write operation does not finish (SYNC returns high) until after the first-stage calculation is complete, that is, 600 ns after the completion of the first write operation. NOP (No Operation) If an NOP (no operation) command is loaded, no change is made to DAC or PMU registers. This code is useful when performing a readback of a register within the device (via the SDO pin) where a change of DAC code or PMU function may not be required. Reserved Commands Any bit combination that is not described in the register address tables for the PMU, DAC, and system control registers indicates a reserved command. These commands are unassigned and are reserved for factory use. To ensure correct operation of the device, do not use reserved commands. Rev. A | Page 41 of 60 AD5522 All codes not explicitly referenced in this table are reserved and should not be used (see Table 28). Table 19. Read and Write Functions of the AD5522 B28 RD/WR B27 PMU3 B26 PMU2 0 B25 PMU1 0 B24 PMU0 0 B23 MODE1 0 0 1 1 1 B22 MODE0 0 1 0 1 1 B21 to B0 Data bits Data bits Data bits Data bits All ones Data bits other than all ones Address and data bits CH1 CH1 CH2 CH2 CH2 CH2 CH3 CH3 CH3 CH3 CH3 CH3 CH3 CH3 0 0 1 1 0 1 0 1 All zeros All zeros X All zeros Selected Channel CH3 CH2 CH1 CH0 Write Functions 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Write Addressed DAC or PMU Register 0 0 0 0 1 0 0 0 1 0 0 0 0 1 1 0 0 1 0 0 0 0 1 0 1 0 0 1 1 0 0 0 1 1 1 0 1 0 0 0 0 1 0 0 1 0 1 0 1 0 0 1 0 1 1 0 1 1 0 0 0 1 1 0 1 0 1 1 1 0 0 1 1 1 1 Read Functions 1 0 0 0 0 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 Write to system control register (see Table 22) Reserved Reserved NOP (no operation) Reserved CH0 CH0 CH0 CH1 CH1 CH0 CH0 CH1 CH1 CH2 CH2 CH2 CH2 CH0 CH0 CH1 CH1 CH0 Select DAC or PMU register (see Table 18) Read from system control register Read from comparator status register Reserved Read from alarm status register CH0 CH1 CH2 CH3 Read Addressed DAC or PMU Register (Only One PMU or DAC Register Can Be Read at One Time) 1 0 0 0 1 Select PMU or All zeros if reading PMU registers; DAC register DAC address plus all zeros if reading a 1 0 0 1 0 (see Table 18) DAC register DAC address (see Table 28) 1 0 1 0 0 1 1 0 0 0 Rev. A | Page 42 of 60 AD5522 WRITE SYSTEM CONTROL REGISTER The system control register is accessed when the PMU channel address bits (PMU3 to PMU0) and the mode bits (MODE1 and MODE0) are all zeros. This register allows quick setup of various functions in the device. The system control register operates on a per-device basis. Table 20. System Control Register Bits—Bit B28 to Bit B15 B28 RD/WR B27 PMU3 B26 PMU2 B25 PMU1 B24 PMU0 B23 MODE1 B22 MODE0 B21 CL3 B20 CL2 B19 CL1 B18 CL0 B17 CPOLH3 B16 CPOLH2 B15 CPOLH1 Table 21. System Control Register Bits—Bit B14 to Bit B0 B14 CPOLH0 1 B13 CPBIASEN B12 DUTGND/CH B11 GUARD ALM B10 CLAMP ALM B9 INT10K B8 GUARD EN B7 GAIN1 B6 GAIN0 B5 TMP ENABLE B4 TMP1 B3 TMP0 B2 LATCHED B11 0 B01 0 Bit B1 and Bit B0 are unused data bits. Table 22. System Control Register Functions Bit 28 (MSB) Bit Name RD/WR Description When low, a write function takes place to the selected register; setting the RD/WR bit high initiates a readback sequence of the PMU, alarm status, comparator status, system control, or DAC register, as determined by the address bits. Set Bit PMU3 to Bit PMU0 to 0 to address the system control register. 27 PMU3 26 PMU2 25 PMU1 24 PMU0 23 MODE1 Set the MODE1 and MODE0 bits to 0 to address the system control register. 22 MODE0 System Control Register Specific Bits 21 CL3 Current clamp enable. Bit CL3 to Bit CL0 enable and disable the current clamp function per channel (0 = disable; 1 = enable). The clamp enable function is also available in the PMU register on a per-channel basis. This dual 20 CL2 functionality allows flexible enabling or disabling of this function. When reading back information about the 19 CL1 status of the current clamp enable function, the data that was most recently written to the current clamp 18 CL0 register is available in the readback word from either the PMU register or the system control register. 17 16 15 14 13 CPOLH3 CPOLH2 CPOLH1 CPOLH0 CPBIASEN Comparator output enable. By default, the comparator outputs are high-Z on power-on. A 1 in each bit position enables the comparator output for the selected channel. Bit 13 (CPBIASEN) must be enabled to power on the comparator functions. The comparator enable function is also available in the PMU register on a per-channel basis. This dual functionality allows flexible enabling or disabling of this function. When reading back information about the status of the comparator enable function, the data that was most recently written to the comparator status register is available in the readback word from either the PMU register or the system control register. Comparator enable. By default, the comparators are powered down when the device is powered on. To enable the comparator function for all channels, write a 1 to this bit. A 0 disables the comparators and shuts them down. The comparator output enable bits (CPOLHx, Bit 17 to Bit 14) allow the user to turn on each comparator output individually, enabling busing of comparator outputs. DUTGND per channel enable. The GUARDINx/DUTGNDx pins are shared pins that can be configured to enable a DUTGND per PMU channel or a guard input per PMU channel. Setting this bit to 1 enables DUTGND per channel. In this mode, the pin functions as a DUTGND pin on a per-channel basis. The guard inputs are disconnected from this pin and instead are connected directly to the MEASVHx line by an internal connection. The default power-on condition is GUARDINx. Clamp and guard alarm functions share one open-drain alarm pin (CGALM). By default, the CGALM pin is disabled. The GUARD ALM and CLAMP ALM bits allow the user to choose whether clamp alarm information, guard alarm information, or both sets of alarm information are flagged by the CGALM pin. Set high to enable either alarm function. Internal sense short. Setting this bit high allows the user to connect an internal sense short resistor of 10 kΩ (4 kΩ + 2 kΩ switch + 4 kΩ) between the FOHx and the MEASVHx lines (SW7 is closed). Setting this bit high also closes SW15, allowing the user to connect another 10 kΩ resistor between DUTGND and AGND. Guard enable. The guard amplifier is disabled on power-on; to enable the guard amplifier, set this bit to 1. If the guard function is not in use, disabling it saves power (typically 400 μA per channel). 12 DUTGND/CH 11 10 GUARD ALM CLAMP ALM 9 INT10K 8 GUARD EN Rev. A | Page 43 of 60 AD5522 Bit 7 6 Bit Name GAIN1 GAIN0 Description MEASOUT output range. The MEASOUT range defaults to the force voltage span for voltage and current measurements, which includes some overrange to allow for offset correction. The nominal output voltage range is ±11.25 V with the default offset DAC setting, but changes for other offset DAC settings when GAIN1 = 0. Therefore, the MEASOUT range can be an asymmetrical bipolar voltage range. GAIN1 = 1 enables a unipolar output voltage range, which allows the use of asymmetrical supplies or a smaller input range ADC. See Table 10 and Table 11 for more details. Output Voltage Range for VREF = 5 V, Offset DAC = 0xA492 MEASOUT Measure GAIN1 = 0, MEASOUT Gain = 1 GAIN1 = 1, MEASOUT Gain = 0.2 Function Current Gain MV 5 or 10 ±VDUT (up to 11.25 V) 0 V to (4.5 × VREF)/5 MI GAIN0 = 0 10 ±VRSENSE × 10 = up to ±11.25 V 0 V to 4.5 V GAIN0 = 1 5 ±VRSENSE × 5 = up to ±5.625 V 0 V to 2.25 V Thermal shutdown feature. To disable the thermal shutdown feature, set the TMP ENABLE bit to 0 (thermal shutdown is enabled by default). The TMP1 and TMP0 bits allow the user to program the temperature that triggers thermal shutdown. TMP ENABLE TMP1 TMP0 Action 0 X X Thermal shutdown disabled 1 X X Thermal shutdown enabled 1 0 0 Shutdown at junction temperature of 130°C (power-on default) 1 0 1 Shutdown at junction temperature of 120°C 1 1 0 Shutdown at junction temperature of 110°C 1 1 1 Shutdown at junction temperature of 100°C Configure the open-drain pin (CGALM) as a latched or unlatched output pin. When high, this bit configures the CGALM alarm output as a latched output, allowing it to drive a controller I/O without needing to poll the line constantly. The power-on default for this pin is unlatched. Unused bits. Set to 0. 5 4 3 TMP ENABLE TMP1 TMP0 2 LATCHED 1 0 (LSB) 0 0 Rev. A | Page 44 of 60 AD5522 WRITE PMU REGISTER To address PMU functions, set the MODE1 and MODE0 bits to 0. This setting selects the PMU register (see Table 18 and Table 19). The AD5522 has very flexible addressing, which allows writing of data to a single PMU channel, any Table 23. PMU Register Bits—Bit B28 to Bit B15 B28 RD/WR 1 combination of PMU channels, or all PMU channels. This functionality enables multipin broadcasting to similar pins on a DUT. Bit 27 to Bit 24 select the PMU or group of PMUs that is addressed. B27 PMU3 B26 PMU2 B25 PMU1 B24 PMU0 B23 MODE1 B22 MODE0 B21 CH EN B20 FORCE1 B19 FORCE0 B181 0 B17 C2 B16 C1 B15 C0 Bit B18 is reserved. Table 24. PMU Register Bits—Bit B14 to Bit B0 B14 MEAS1 1 B13 MEAS0 B12 FIN B11 SF0 B10 SS0 B9 CL B8 CPOLH B7 COMPAREV/I B6 CLEAR B51 0 B41 0 B31 0 B21 0 B11 0 B01 0 Bit B5 to Bit B0 are unused data bits. Table 25. PMU Register Functions Bit 28 (MSB) Bit Name RD/WR Description When low, a write function takes place to the selected register; setting the RD/WR bit high initiates a readback sequence of the PMU, alarm status, comparator status, system control, or DAC register, as determined by the address bits. Bit PMU3 to Bit PMU0 address each PMU channel in the device. These bits allow control of an individual PMU channel or any combination of channels, in addition to multichannel programming. See Table 19. 27 PMU3 26 PMU2 25 PMU1 24 PMU0 23 MODE1 Set the MODE1 and MODE0 bits to 0 to access the PMU register selected by the PMU3 to PMU0 bits (Bit 27 to Bit 24). 22 MODE0 PMU Register Specific Bits 21 CH EN Channel enable. Set high to enable the selected channel or group of channels; set low to disable the selected channel or channels. When disabled, SW2 is closed and SW5 is open (outputs are high-Z). The measure mode is determined by the MEAS1 and MEAS0 bits at all times and is not affected by the CH EN bit. The guard amplifier and the comparators are not affected by this bit. 20 FORCE1 The FORCE1 and FORCE0 bits set the force function for each PMU channel (in association with the PMUx bits). All combinations of forcing and measuring (using the MEAS1 and MEAS0 bits) are available. The high-Z (voltage 19 FORCE0 and current) modes allow the user to optimize glitch response during mode changes. While in high-Z voltage or current mode, with the PMU high-Z, new X1 codes loaded to the FIN DAC register and to the clamp DAC register are calibrated, stored in the X2 register, and loaded directly to the DAC outputs. FORCE1 FORCE0 Action 0 0 FV and current clamp (if clamp is enabled) 0 1 FI and voltage clamp (if clamp is enabled) 1 0 High-Z FOHx voltage (preload FIN DAC and clamp DAC) 1 1 High-Z FOHx current (preload FIN DAC and clamp DAC) 18 Reserved 0 17 C2 Bit C2 to Bit C0 specify the required current range. High-Z FV/FI commands ignore the current range address bits (C2, C1, and C0); therefore, these bit combinations cannot be used to enable or disable the force function 16 C1 for a PMU channel. 15 C0 C2 C1 C0 Selected Current Range 0 0 0 ±5 μA current range 0 0 1 ±20 μA current range 0 1 0 ±200 μA current range 0 1 1 ±2 mA current range (default) 1 0 0 ± external current range 1 0 1 Disable the always on mode for the external current range buffer1 1 1 0 Enable the always on mode for the external current range buffer2 1 1 1 Reserved Rev. A | Page 45 of 60 AD5522 Bit 14 13 Bit Name MEAS1 MEAS0 Description The MEAS1 and MEAS0 bits specify the required measure mode, allowing the MEASOUTx line to be disabled, connected to the temperature sensor, or enabled for measurement of current or voltage. MEAS1 MEAS0 Action 0 0 MEASOUTx is connected to ISENSE 0 1 MEASOUTx is connected to VSENSE 1 0 MEASOUTx is connected to the temperature sensor 1 1 MEASOUTx is high-Z (SW12 open) This bit sets the status of the force input (FIN) amplifier. 0 = input of the force amplifier switched to GND. 1 = input of the force amplifier connected to the FIN DAC output. The SF0 and SS0 bits specify the switching of system force and sense lines to the force and sense paths at the DUT. The channel to which the system force and system sense lines are connected is set by the PMU3 to PMU0 bits. For correct operation, only one PMU channel should be connected to the SYS_FORCE and SYS_SENSE paths at any one time. SF0 SS0 Action 0 0 SYS_FORCE and SYS_SENSE are high-Z for the selected channel 0 1 SYS_FORCE is high-Z and SYS_SENSE is connected to MEASVHx for the selected channels 1 0 SYS_FORCE is connected to FOHx and SYS_SENSE is high-Z for the selected channel 1 1 SYS_FORCE is connected to FOHx and SYS_SENSE is connected to MEASVHx for the selected channel Per-PMU current clamp enable bit. A logic high enables the clamp function for the selected PMU. The current clamp enable function is also available in the system control register. This dual functionality allows flexible enabling or disabling of this function. When reading back information about the status of the current clamp enable function on a per-channel basis, the data that was most recently written to the current clamp register is available in the readback word from either the PMU register or the system control register. Comparator output enable bit. By default, the comparator outputs are high-Z on power-on. A logic high enables the comparator output for the selected PMU. The comparator function CPBIASEN (Bit 13 in the system control register) must be enabled. The comparator output enable function is also available in the system control register. This dual functionality allows flexible enabling or disabling of this function. When reading back information about the status of the comparator enable function, the data that was most recently written to the comparator status register is available in the readback word from either the PMU register or the system control register. A logic high selects the compare voltage function; a logic low selects the compare current function. To clear or reset a latched alarm bit and pin (temperature, guard, or clamp), write a 1 to this bit. This bit applies to latched alarm conditions (clamp and guard) on all four PMU channels. Unused bits. Set to 0. 12 FIN 11 10 SF0 SS0 9 CL 8 CPOLH 7 6 5 4 3 2 1 0 (LSB) 1 COMPARE V/I CLEAR Unused Writing 101 in Bit 17 to Bit 15 disables the always on mode for the external current range buffer. Use with FV mode (FORCE1 = FORCE0 = 0) only. To complete the disabling of the always on mode, the PMU channel is placed into high-Z mode and the external current range buffer is returned to its default operation (off). 2 Writing 110 in Bit 17 to Bit 15 places the external current range buffer into always on mode. In this mode, the buffer is always active with no regard to the selected current range. The always on mode is intended for use where an external high current stage is being used for a current drive in excess of ±80 mA; having the internal stage always on should help to eliminate timing concerns when transitioning between this current range and other ranges. When first enabling the always on mode, use it in conjunction with FV mode (FORCE1 = FORCE0 = 0); the device now enables the external current range buffer. The 110 code also places the device into high-Z mode (necessary to complete the enabling function). To return to an FV or FI operating mode, select the appropriate mode and current range. The external range sense resistor is connected to an MI circuit only when the external current range address is selected (C2 to C0 are set to 100). The default operation at power-on is disabled (or off). Rev. A | Page 46 of 60 AD5522 WRITE DAC REGISTER The DAC input, gain, and offset registers are addressed through a combination of PMU bits (Bit 27 to Bit 24) and mode bits (Bit 23 and Bit 22). Bit A5 to Bit A0 address each DAC level on chip. Bit D15 to Bit D0 are the DAC data bits used when writing to these registers. The PMU address bits allow addressing of a particular DAC for any combination of PMU channels. Table 26. DAC Register Bits B28 RD/WR B27 PMU3 B26 PMU2 B25 PMU1 B24 PMU0 B23 MODE1 B22 MODE0 B21 A5 B20 A4 B19 A3 B18 A2 B17 A1 B16 A0 B15 to B0 Data Bits[D15 (MSB):D0 (LSB)] Table 27. DAC Register Functions Bit 28 (MSB) Bit Name RD/WR Description When this bit is low, a write function takes place to the selected register; setting the RD/WR bit high initiates a readback sequence of the PMU, alarm status, comparator status, system control, or DAC register, as determined by the address bits. Bit PMU3 to Bit PMU0 address each PMU and DAC channel in the device. These bits allow control of each individual DAC channel or any combination of channels, in addition to multichannel programming. 27 26 25 24 23 22 PMU3 PMU2 PMU1 PMU0 MODE1 MODE0 The MODE1 and MODE0 bits allow addressing of the DAC gain (M), offset (C), or input (X1) register. MODE1 MODE0 Action 0 0 Write to the system control register or the PMU register 0 1 Write to the DAC gain (M) register 1 0 Write to the DAC offset (C) register 1 1 Write to the DAC input data (X1) register DAC address bits. The A5 to A3 bits select the register set that is addressed. See the DAC Addressing section. DAC address bits. The A2 to A0 bits select the DAC that is addressed. See the DAC Addressing section. DAC Register Specific Bits 21 A5 20 A4 19 A3 18 A2 17 A1 16 A0 15 to 0 D15 (MSB) to D0 (LSB) 16 DAC data bits. Rev. A | Page 47 of 60 AD5522 DAC Addressing For the FIN and comparator (CPH and CPL) DACs, there is a set of X1, M, and C registers for each current range, and one set for the voltage range; for the clamp DACs (CLL and CLH), there are only two sets of X1, M, and C registers. When calibrating the device, the M and C registers allow volatile storage of gain and offset coefficients. Calculation of the corresponding DAC X2 register occurs only when the X1 data is loaded (no internal calculation occurs on M or C updates). There is one offset DAC for all four channels in the device that is addressed using the PMUx bits. The offset DAC has only an input register associated with it; no M or C registers are associated with this DAC. When writing to the offset DAC, set the Table 28. DAC Register Addressing A5 0 0 A4 0 0 A3 0 1 A2 0 0 A1 0 0 A0 0 0 MODE1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 MODE0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 Register Set ±5 μA current range Addressed Register Offset DAC X FIN M FIN C FIN X1 FIN M FIN C FIN X1 FIN M FIN C FIN X1 FIN M FIN C FIN X1 FIN M FIN C FIN X1 FIN M FIN C FIN X1 CLL M CLL C CLL X1 1 CLL M CLL C CLL X11 CLH M CLH C CLH X1 2 CLH M CLH C CLH X12 CPL M CPL C CPL X1 MODE1 and MODE0 bits high to address the DAC input register (X1). The same address table is also used for readback of a particular DAC address. Note that CLL is clamp level low and CLH is clamp level high. • When forcing a voltage, the current clamps are engaged; therefore, both the CLL current ranges register set and the CLH current ranges register set are loaded to the clamp DACs. When forcing a current, the voltage clamps are engaged; therefore, both the CLL voltage range register set and the CLH voltage range register set are loaded to the clamp DACs. • All codes not explicitly referenced in this table are reserved and should not be used. 0 0 1 0 0 1 ±20 μA current range 0 0 1 0 1 0 ±200 μA current range 0 0 1 0 1 1 ±2 mA current range 0 0 1 1 0 0 ±external current range 0 0 1 1 0 1 Voltage range 0 1 0 1 0 0 Current ranges 0 1 0 1 0 1 Voltage range 0 1 1 1 0 0 Current ranges 0 1 1 1 0 1 Voltage range 1 0 0 0 0 0 ±5 μA current range Rev. A | Page 48 of 60 AD5522 A5 1 A4 0 A3 0 A2 0 A1 0 A0 1 MODE1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 MODE0 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 Register Set ±20 μA current range Addressed Register CPL M CPL C CPL X1 CPL M CPL C CPL X1 CPL M CPL C CPL X1 CPL M CPL C CPL X1 CPL M CPL C CPL X1 CPH M CPH C CPH X1 CPH M CPH C CPH X1 CPH M CPH C CPH X1 CPH M CPH C CPH X1 CPH M CPH C CPH X1 CPH M CPH C CPH X1 1 0 0 0 1 0 ±200 μA current range 1 0 0 0 1 1 ±2 mA current range 1 0 0 1 0 0 ± external current range 1 0 0 1 0 1 Voltage range 1 0 1 0 0 0 ±5 μA current range 1 0 1 0 0 1 ±20 μA current range 1 0 1 0 1 0 ±200 μA current range 1 0 1 0 1 1 ±2 mA current range 1 0 1 1 0 0 ±external current range 1 0 1 1 0 1 Voltage range 1 2 CLL should be within the range of 0x0 to 0x7FFF. CLH should be within the range of 0x8000 to 0xFFFF. Rev. A | Page 49 of 60 AD5522 READ REGISTERS Readback of all the registers in the device is possible via the SPI and the LVDS interfaces. To read data from a register, it is first necessary to write a readback command to tell the device which register is required for readback. See Table 29 to address the appropriate channel. When the required channel is addressed, the device loads the 24-bit readback data into the MSB positions of the 29-bit serial shift register (the 5 LSBs are filled with zeros). SCLK rising edges clock this readback data out on SDO (framed by the SYNC signal). A minimum of 24 clock rising edges is required to shift the readback data out of the shift register. If writing a 24-bit word to shift data out of the device, the user must ensure that the 24-bit write is effectively an NOP (no operation) command. The last five bits in the shift register are always 00000: these five bits become the MSBs of the shift register when the 24-bit write is loaded. To ensure that the device receives an NOP command as described in Table 19, the recommended flush command is 0xFFFFFF; thus, no change is made to any register in the device. Readback data can also be shifted out by writing another 29-bit write or read command. If writing a 29-bit command, the readback data is MSB data available on SDO, followed by 00000. Table 29. Read Functions of the AD5522 B28 RD/WR B27 PMU3 B26 PMU2 B25 PMU1 B24 PMU0 B23 MODE1 B22 MODE0 B21 to B0 Data bits CH3 Selected Channel CH2 CH1 CH0 Read Functions 1 0 0 0 0 0 0 All zeros 1 0 0 0 0 0 1 All zeros 1 0 0 0 0 1 0 X 1 0 0 0 0 1 1 All zeros Read Addressed PMU Register (Only One PMU Register Can Be Read at One Time) 1 0 0 0 1 0 0 All zeros 1 0 0 1 0 0 0 1 0 1 0 0 0 0 1 1 0 0 0 0 0 Read Addressed DAC M Register (Only One DAC Register Can Be Read at One Time) 1 0 0 0 1 0 1 DAC address (see Table 28) 1 0 0 1 0 0 1 1 0 1 0 0 0 1 1 1 0 0 0 0 1 Read Addressed DAC C Register (Only One DAC Register Can Be Read at One Time) 1 0 0 0 1 1 0 DAC address (see Table 28) 1 0 0 1 0 1 0 1 0 1 0 0 1 0 1 1 0 0 0 1 0 Read Addressed DAC X1 Register (Only One DAC Register Can Be Read at One Time) 1 0 0 0 1 1 1 DAC address (see Table 28) 1 0 0 1 0 1 1 1 1 0 1 1 0 0 0 0 0 1 1 1 1 Read from system control register Read from comparator status register Reserved Read from alarm status register CH0 CH1 CH2 CH3 CH0 CH1 CH2 CH3 CH0 CH1 CH2 CH3 CH0 CH1 CH2 CH3 Rev. A | Page 50 of 60 AD5522 READBACK OF SYSTEM CONTROL REGISTER The system control register readback function is a 24-bit word. Mode and system control register data bits are shown in Table 30. Table 30. System Control Register Readback Bit Bit Name Description 23 (MSB) MODE1 Set the MODE1 and MODE0 bits to 0 to address the system control register. 22 MODE0 System Control Register Specific Readback Bits 21 CL3 Read back the status of the individual current clamp enable bits. 0 = clamp is disabled. 20 CL2 1 = clamp is enabled. 19 CL1 When reading back information about the status of the clamp enable function, the data that was most 18 CL0 recently written to the current clamp register from either the system control register or the PMU register is available in the readback word. 17 CPOLH3 Read back information about the status of the comparator output enable bits. 1 = PMU comparator output is enabled. 16 CPOLH2 0 = PMU comparator output is disabled. 15 CPOLH1 When reading back information about the status of the comparator output enable function, the data that 14 CPOLH0 was most recently written to the comparator status register from either the system control register or the PMU register is available in the readback word. 13 CPBIASEN This readback bit indicates the status of the comparator enable function. 1 = comparator function is enabled. 0 = comparator function is disabled. 12 DUTGND/CH DUTGND per channel enable. 1 = DUTGND per channel is enabled. 0 = individual guard inputs are available per channel. 11 GUARD ALM These bits provide information about which of these alarm bits trigger the CGALM pin. 1 = guard/clamp alarm is enabled. 10 CLAMP ALM 0 = guard/clamp alarm is disabled. 9 INT10K If this bit is high, the internal 10 kΩ resistor (SW7) is connected between FOHx and MEASVHx, and between DUTGND and AGND. If this bit is low, SW7 is open. 8 GUARD EN Read back the status of the guard amplifiers. If this bit is high, the amplifiers are enabled. 7 GAIN1 Status of the selected MEASOUTx output range. See Table 10 and Table 11. 6 GAIN0 5 TMP ENABLE Read back the status of the thermal shutdown function. 0XX = thermal shutdown disabled. 4 TMP1 100 = thermal shutdown enabled at junction temperature of 130°C (power-on default). 3 TMP0 101 = thermal shutdown enabled at junction temperature of 120°C. 110 = thermal shutdown enabled at junction temperature of 110°C. 111 = thermal shutdown enabled at junction temperature of 100°C. 2 LATCHED This bit indicates the status of the open-drain alarm outputs, TMPALM and CGALM. 1 = open-drain alarm outputs are latched. 0 = open-drain alarm outputs are unlatched. 1 Loads with zeros. Unused readback bits 0 (LSB) Rev. A | Page 51 of 60 AD5522 READBACK OF PMU REGISTER The PMU register readback function is a 24-bit word that includes the mode and PMU data bits. Only one PMU register can be read back at any one time. Table 31. PMU Register Readback Bit Bit Name 23 (MSB) MODE1 22 MODE0 PMU Register Specific Bits 21 CH EN 20 FORCE1 19 FORCE0 Description Set the MODE1 and MODE0 bits to 0 to access the selected PMU register. 18 17 16 15 14 13 Reserved C2 C1 C0 MEAS1 MEAS0 Channel enable. If this bit is high, the selected channel is enabled; if this bit is low, the channel is disabled. These bits indicate which force mode the selected channel is in. 00 = FV and current clamp (if clamp is enabled). 01 = FI and voltage clamp (if clamp is enabled). 10 = high-Z FOHx voltage. 11 = high-Z FOHx current. 0 These three bits indicate which forced or measured current range is set for the selected channel. See Table 25. These bits indicate which measure mode is selected: voltage, current, temperature sensor, or high-Z. 00 = MEASOUTx is connected to ISENSE. 01 = MEASOUTx is connected to VSENSE. 10 = MEASOUTx is connected to the temperature sensor. 11 = MEASOUTx is high-Z (SW12 open). This bit shows the status of the force input (FIN) amplifier. 0 = input of the force amplifier switched to GND. 1 = input of the force amplifier connected to the FIN DAC output. The system force and sense lines can be connected to any of the four PMU channels. These bits indicate whether the system force and sense lines are switched in. See Table 25. Read back the status of the individual current clamp enable bits. 1 = clamp is enabled on this channel. 0 = clamp is disabled on this channel. When reading back information about the status of the current clamp enable function, the data that was most recently written to the current clamp register from either the system control register or the PMU register is available in the readback word. Read back the status of the comparator output enable bit. 1 = PMU comparator output is enabled. 0 = PMU comparator output is disabled. When reading back information about the status of the comparator output enable function, the data that was most recently written to the comparator register from either the system control register or the PMU register is available in the readback word. 1 = compare voltage function is enabled on the selected channel. 0 = compare current function is enabled on the selected channel. TMPALM corresponds to the open-drain TMPALM output pin that flags a temperature event exceeding the default or user programmed level. The temperature alarm is a per-device alarm; the latched (LTMPALM) and unlatched (TMPALM) bits indicate whether a temperature event occurred and whether the alarm still exists (that is, whether the junction temperature still exceeds the programmed alarm level). To reset an alarm event, the user must write a 1 to the clear bit (Bit 6) in the PMU register. Loads with zeros. 12 FIN 11 10 9 SF0 SS0 CL 8 CPOLH 7 6 5 COMPARE V/I LTMPALM TMPALM 4 to 0 (LSB) Unused readback bits Rev. A | Page 52 of 60 AD5522 READBACK OF COMPARATOR STATUS REGISTER The comparator status register is a read-only register that provides access to the output status of each comparator pin on the chip. Table 32 shows the format of the comparator register readback word. Table 32. Comparator Status Register (Read-Only) Bit Bit Name Description 23 (MSB) MODE1 0 22 MODE0 1 Comparator Status Register Specific Bits 21 CPOL0 Comparator output conditions per channel corresponding to the comparator output pins. 1 = PMU comparator output is high. 20 CPOH0 0 = PMU comparator output is low. 19 CPOL1 18 17 16 15 14 13 to 0 (LSB) CPOH1 CPOL2 CPOH2 CPOL3 CPOH3 Unused readback bits Loads with zeros. READBACK OF ALARM STATUS REGISTER The alarm status register is a read-only register that provides information about temperature, clamp, and guard alarm events. Temperature alarm status is also available in any of the four PMU readback registers. Table 33. Alarm Status Register Readback Bit Bit Name Description 23 (MSB) MODE1 1 22 MODE0 1 Alarm Status Register Specific Bits 21 TMPALM corresponds to the open-drain TMPALM output pin that flags a temperature event LTMPALM exceeding the default or user programmed level. The temperature alarm is a per-device alarm; the 20 TMPALM latched (LTMPALM) and unlatched (TMPALM) bits indicate whether a temperature event occurred and whether the alarm still exists (that is, whether the junction temperature still exceeds the programmed alarm level). To reset an alarm event, the user must write a 1 to the clear bit (Bit 6) in the PMU register. 19 LGx is the per-channel latched guard alarm bit, and Gx is the unlatched guard alarm bit. These bits LG0 indicate which channel flagged the alarm on the open-drain alarm pin CGALM and whether the 18 G0 alarm condition still exists. 17 LG1 16 G1 15 LG2 14 G2 13 LG3 12 G3 11 10 9 8 7 6 5 4 3 to 0 (LSB) LC0 C0 LC1 C1 LC2 C2 LC3 C3 Unused readback bits LCx is the per-channel latched clamp alarm bit, and Cx is the unlatched clamp alarm bit. These bits indicate which channel flagged the alarm on the open-drain alarm pin CGALM and whether the alarm condition still exists. Loads with zeros. Rev. A | Page 53 of 60 AD5522 READBACK OF DAC REGISTER The DAC register readback function is a 24-bit word that includes the mode, address, and DAC data bits. Table 34. DAC Register Readback Bit 23 (MSB) 22 Bit Name MODE1 MODE0 Description The MODE1 and MODE0 bits indicate the type of DAC register (X1, M, or C) that is read. 01 = DAC gain (M) register. 10 = DAC offset (C) register. 11 = DAC input data (X1) register. Address bits indicating the DAC register that is read. See Table 28. Contents of the addressed DAC register (X1, M, or C). DAC Register Specific Bits 21 to 16 A5 to A0 15 to 0 (LSB) D15 to D0 Rev. A | Page 54 of 60 AD5522 APPLICATIONS INFORMATION POWER-ON DEFAULT The power-on default for all DAC channels is that the contents of each M register are set to full scale (0xFFFF), and the contents of each C register are set to midscale (0x8000). The contents of the DAC X1 registers at power-on are listed in Table 35. The power-on default for the alarm status register is 0xFFFFF0, and the power-on default for the comparator status register is 0x400000. The power-on default values of the PMU register and the system control register are shown in Table 36 and Table 37. Table 36. Power-On Default for System Control Register Bit 21 (MSB) 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 (LSB) Bit Name CL3 CL2 CL1 CL0 CPOLH3 CPOLH2 CPOLH1 CPOLH0 CPBIASEN DUTGND/CH GUARD ALM CLAMP ALM INT10K GUARD EN GAIN1 GAIN0 TMP ENABLE TMP1 TMP0 LATCHED Unused data bit Unused data bit Default Value 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 SETTING UP THE DEVICE ON POWER-ON On power-on, default conditions are recalled from the poweron reset register to ensure that each PMU and DAC channel is powered up in a known condition. To operate the device, the user must follow these steps: 1. 2. Configure the device by writing to the system control register to set up different functions as required. Calibrate the device to trim out errors, and load the required calibration values to the gain (M) and offset (C) registers. Load codes to each DAC input (X1) register. When X1 values are loaded to the individual DACs, the calibration engine calculates the appropriate X2 value and stores it, ready for the PMU address to call it. Load the required PMU channel with the required force mode, current range, and so on. Loading the PMU channel configures the switches around the force amplifier, measure function, clamps, and comparators, and also acts as a load signal for the DACs, loading the DAC register with the appropriate stored X2 value. Because the voltage and current ranges have individual DAC registers associated with them, each PMU register mode of operation calls a particular X2 register. Therefore, only updates (that is, changes to the X1 register) to DACs associated with the selected mode of operation are reflected in the output of the PMU. If there is a change to the X1 value associated with a different PMU mode of operation, this X1 value and its M and C coefficients are used to calculate a corresponding X2 value, which is stored in the correct X2 register, but this value is not loaded to the DAC. 3. Table 37. Power-On Default for PMU Register Bit 21 (MSB) 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 (LSB) Bit Name CH EN FORCE1 FORCE0 Reserved C2 C1 C0 MEAS1 MEAS0 FIN SF0 SS0 CL CPOLH COMPARE V/I LTMPALM TMPALM Unused data bit Unused data bit Unused data bit Unused data bit Unused data bit Default Value 0 0 0 0 0 1 1 1 1 0 0 0 0 0 0 1 1 0 0 0 0 0 4. Table 35. Default Contents of DAC Registers at Power-On DAC Register Offset DAC FIN DAC CLL DAC CLH DAC CPL DAC CPH DAC Default Value 0xA492 0x8000 0x0000 0xFFFF 0x0000 0xFFFF Rev. A | Page 55 of 60 AD5522 CHANGING MODES There are different ways of handling a mode change. 1. Load any DAC X1 values that require changes. Remember that for force amplifier and comparator DACs, X1 registers are available per voltage and current range, so the user can preload new DAC values to make DAC updates ahead of time; the calibration engine calculates the X2 values and stores them. Change to the new PMU mode (FI or FV). This action loads the new switch conditions to the PMU circuitry and loads the DAC register with the stored X2 data. 3. When the high-Z (voltage or current) mode is used, the relevant DAC outputs are automatically updated (FIN, CLL, and CLH DACs). For example, in high-Z voltage mode, when new X1 writes occur, the FIN voltage X2 result is calculated, cached, and loaded to the FIN DAC. When forcing a voltage, current clamps are engaged, so the CLL current register can be loaded, and the gain and offset corrected and loaded to the DAC register. (The CLH current register works the same way.) Change to the new PMU mode (FI or FV). This action loads the new switch conditions to the PMU circuitry. Because the DAC outputs are already loaded, transients are minimized when changing current or voltage mode. 2. 4. The following steps describe another method for changing modes: 1. In the PMU register (Bit 20 and Bit 19), enable the high-Z voltage or high-Z current mode to make the amplifier high impedance (SW5 open). Load any DAC X1 values that require changes. Remember that for force amplifier and comparator DACs, X1 registers are available per voltage and current range, so the user can preload new DAC values to make DAC updates ahead of time; the calibration engine calculates the X2 values and stores them. AVSS AVDD DVCC 10µF 10µF REQUIRED EXTERNAL COMPONENTS The minimum required external components for use with the AD5522 are shown in Figure 55. Decoupling is greatly dependent on the type of supplies used, other decoupling on the board, and the noise in the system. It is possible that more or less decoupling may be required. 2. 10µF 0.1µF 0.1µF 0.1µF REF 0.1µF AVSS AVDD DVCC VREF CCOMP[0:3] EXTFOH3 CFF3 FOH3 MEASVH3 EXTMEASIH3 EXTFOH0 CFF0 FOH0 MEASVH0 EXTMEASIH0 RSENSE (UP TO ±80mA) EXTMEASIL0 EXTMEASIL3 RSENSE (UP TO ±80mA) DUT DUT EXTFOH1 CFF1 FOH1 MEASVH1 EXTMEASIH1 EXTFOH2 CFF2 FOH2 MEASVH2 EXTMEASIH2 RSENSE (UP TO ±80mA) EXTMEASIL1 DUTGND EXTMEASIL2 RSENSE (UP TO ±80mA) Figure 55. External Components Required for Use with the AD5522 Rev. A | Page 56 of 60 06197-037 DUT DUT AD5522 Table 38. ADCs and ADC Drivers Suggested For Use with AD5522 1 Part No. AD7685 AD7686 AD7693 AD7610 3 Resolution 16 16 16 16 Sample Rate 250 kSPS 500 kSPS 500 kSPS 250 kSPS Ch. No. 1 1 1 1 AIN Range 0 to VREF 0 to VREF −VREF to +VREF Bipolar 10 V, Bipolar 5 V, Unipolar 10 V, Unipolar 5 V 0 V to 5 V Interface Serial, SPI Serial, SPI Serial, SPI Serial/Parallel ADC Driver ADA4841-x ADA4841-x ADA4841-x, ADA4941-1 AD8021 Multiplexer 2 ADG704, ADG708 ADG704, ADG708 ADG1404, ADG1408, ADG1204 ADG1404, ADG1408, ADG1204 Package MSOP, LFCSP MSOP, LFCSP MSOP, LFCSP LFCSP, LQFP AD7655 1 2 16 1 MSPS 4 Serial/Parallel ADA4841-x/ AD8021 Subset of the possible ADCs suitable for use with the AD5522. Visit www.analog.com for more options For purposes of sharing an ADC among multiple PMU channels. Note, that the multiplexer is not absolutely necessary as the AD5522 MEASOUTx path has a tri-state mode per channel. 3 Do not allow the MEASOUT output range to exceed the AIN range of the ADC. POWER SUPPLY DECOUPLING Careful consideration of the power supply and ground return layout helps to ensure the rated performance. Design the printed circuit board (PCB) on which the AD5522 is mounted so that the analog and digital sections are separated and confined to certain areas of the board. If the AD5522 is in a system where multiple devices require an AGND-to-DGND connection, the connection should be made at one point only. Establish the star ground point as close as possible to the device. For supplies with multiple pins (AVSS and AVDD), it is recommended that these pins be tied together and that each supply be decoupled only once. The AD5522 should have ample supply decoupling of 10 μF in parallel with 0.1 μF on each supply located as close to the package as possible, ideally right up against the device. The 10 μF capacitors are the tantalum bead type. The 0.1 μF capacitors should have low effective series resistance (ESR) and low effective series inductance (ESL)—typical of the common ceramic types that provide a low impedance path to ground at high frequencies—to handle transient currents due to internal logic switching. Avoid running digital lines under the device because they can couple noise onto the device. However, allow the analog ground plane to run under the AD5522 to avoid noise coupling (applies only to the package with paddle up). The power supply lines of the AD5522 should use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the power supply line. Fast switching digital signals should be shielded with digital ground to avoid radiating noise to other parts of the board, and they should never be run near the reference inputs. It is essential to minimize noise on all VREF lines. Avoid crossover of digital and analog signals. Traces on opposite sides of the board should run at right angles to each other to reduce the effects of feedthrough through the board. As is the case for all thin packages, care must be taken to avoid flexing the package and to avoid a point load on the surface of this package during the assembly process. Also, note that the exposed paddle of the AD5522 is connected to the negative supply, AVSS. POWER SUPPLY SEQUENCING When the supplies are connected to the AD5522, it is important that the AGND and DGND pins be connected to the relevant ground planes before the positive or negative supplies are applied. This is the only power sequencing requirement for this device. TYPICAL APPLICATION FOR THE AD5522 Figure 56 shows the AD5522 used in an ATE system. The device can be used as a per-pin parametric unit to speed up the rate at which testing can be done. The central PMU (shown in the block diagram) is usually a highly accurate PMU and is shared among a number of pins in the tester. In general, many discrete levels are required in an ATE system for the pin drivers, comparators, clamps, and active loads. DAC devices such as the AD537x family offer a highly integrated solution for a number of these levels. Rev. A | Page 57 of 60 AD5522 DRIVEN SHIELD DAC ADC CENTRAL PMU GUARD AMP AD5522 DAC DAC PMU DAC PMU DUT VCH DAC VTERM VH RELAYS FORMATTER DESKEW DAC DAC DAC COMPARE MEMORY DAC ACTIVE LOAD DAC IOL FORMATTER DESKEW VTH COMP VTL VCL DRIVER VL ADC PMU DAC PMU TIMING DATA MEMORY DAC DAC TIMING GENERATOR DLL, LOGIC 50Ω COAX GND SENSE DAC GUARD AMP DEVICE POWER SUPPLY ADC DAC VCOM DAC IOH Figure 56. Typical Applications Circuit Using the AD5522 as a Per-Pin Parametric Unit Rev. A | Page 58 of 60 06197-038 AD5522 OUTLINE DIMENSIONS 14.20 14.00 SQ 13.80 0.75 0.60 0.45 1.20 MAX 80 1 PIN 1 12.20 12.00 SQ 11.80 61 60 60 61 80 1 TOP VIEW (PINS DOWN) EXPOSED PAD 9.50 BSC SQ 1.05 1.00 0.95 0° MIN BOTTOM VIEW (PINS UP) 20 21 40 41 41 40 20 21 0.15 0.05 SEATING PLANE 0.20 0.09 7° 3.5° 0° 0.08 MAX COPLANARITY VIEW A 0.50 BSC LEAD PITCH 0.27 0.22 0.17 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. VIEW A ROTATED 90° CCW COMPLIANT TO JEDEC STANDARDS MS-026-ADD-HD Figure 57. 80-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP] SV-80-3 Dimensions shown in millimeters 14.20 14.00 SQ 13.80 0.75 0.60 0.45 1.20 MAX 80 1 PIN 1 12.20 12.00 SQ 11.80 61 60 60 61 80 1 EXPOSED PAD 9.50 BSC BOTTOM VIEW (PINS UP) 1.05 1.00 0.95 0° MIN 0.15 0.05 SEATING PLANE 0.20 0.09 7° 3.5° 0° 0.08 MAX COPLANARITY TOP VIEW (PINS DOWN) 20 21 40 41 41 40 20 21 VIEW A 6.50 BSC 0.50 BSC LEAD PITCH FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.27 0.22 0.17 VIEW A ROTATED 90° CCW COMPLIANT TO JEDEC STANDARDS MS-026-ADD-HU Figure 58. 80-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP] SV-80-2 Dimensions shown in millimeters Rev. A | Page 59 of 60 071808-A 071808-A AD5522 ORDERING GUIDE Model AD5522JSVDZ 2 AD5522JSVUZ2 EVAL-AD5522EBDZ2 EVAL-AD5522EBUZ2 1 2 Temperature Range (TJ) 25°C to 90°C 25°C to 90°C Package Description 1 80-Lead TQFP_EP with exposed pad on bottom 80-Lead TQFP_EP with exposed pad on top Evaluation Board with exposed pad on bottom Evaluation Board with exposed pad on top Package Option SV-80-3 SV-80-2 Exposed pad is electrically connected internally to AVSS. Z = RoHS Compliant Part. ©2008 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06197-0-10/08(A) Rev. A | Page 60 of 60