Data Sheet
AD5593R
8-Channel, 12-Bit, Configurable ADC/DAC with On-Chip Reference, I2C Interface
GENERAL DESCRIPTION
FEATURES
The AD5593R has eight input/output (I/O) pins, which can be independently configured as digital-to-analog converter (DAC) outputs,
analog-to-digital converter (ADC) inputs, digital outputs, or digital
inputs. When an I/O pin is configured as an analog output, it is
driven by a 12-bit DAC. The output range of the DAC is 0 V to VREF
or 0 V to 2 × VREF. When an I/O pin is configured as an analog
input, it is connected to a 12-bit ADC via an analog multiplexer.
The input range of the ADC is 0 V to VREF or 0 V to 2 × VREF.
The I/O pins can also be configured to be general-purpose, digital
input or output (GPIO) pins. The state of the GPIO pins can be set
or read back by accessing the GPIO write data register and GPIO
read configuration registers, respectively, via an I2C write or read
operation.
8-channel, configurable ADC/DAC/GPIO
Configurable as any combination of
► 8 12-bit DAC channels
► 8 12-bit ADC channels
► 8 general-purpose I/O pins
► Integrated temperature sensor
► 16-lead TSSOP and LFCSP and 16-ball WLCSP packages
► I2C interface
►
►
APPLICATIONS
Control and monitoring
► General-purpose analog and digital I/O
►
The AD5593R has an integrated 2.5 V, 20 ppm/°C reference that
is turned off by default and an integrated temperature indicator that
gives an indication of the die temperature. The temperature value is
read back as part of an ADC read sequence.
The AD5593R is available in 16-lead TSSOP and LFCSP, as well
as a 16-ball WLCSP, and operates over a temperature range of
−40°C to +105°C.
Table 1. Related Products
Product
Description
AD5592R
AD5592R-1
AD5593R equivalent with SPI interface
AD5593R equivalent with SPI interface and VLOGIC pin
FUNCTIONAL BLOCK DIAGRAM
Figure 1.
Rev. F
DOCUMENT FEEDBACK
TECHNICAL SUPPORT
Information furnished by Analog Devices is believed to be accurate and reliable "as is". However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to
change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
Data Sheet
AD5593R
TABLE OF CONTENTS
Features................................................................ 1
Applications........................................................... 1
General Description...............................................1
Functional Block Diagram......................................1
Specifications........................................................ 4
Timing Characteristics........................................7
Absolute Maximum Ratings...................................8
Thermal Resistance........................................... 8
Electrostatic Discharge (ESD) Ratings...............8
ESD Caution.......................................................8
Pin Configuration and Function Descriptions........ 9
Typical Performance Characteristics................... 10
Terminology......................................................... 15
Theory of Operation.............................................18
DAC Section.....................................................18
ADC Section.....................................................19
GPIO Section................................................... 19
Internal Reference............................................20
Reset Function................................................. 20
Temperature Indicator...................................... 20
Serial Interface.................................................... 21
Write Operation................................................ 21
Read Operation................................................ 22
Pointer Byte......................................................23
Control Registers..............................................23
General-Purpose Control Register................... 23
Configuring the AD5593R................................ 23
DAC Write Operation........................................25
DAC Readback.................................................25
ADC Operation ................................................ 26
GPIO Operation................................................27
Three-State Pins.............................................. 27
85 kΩ Pull-Down Pins...................................... 27
Power-Down/Reference Control.......................27
Reset Function................................................. 27
Applications Information...................................... 28
Microprocessor Interfacing............................... 28
AD5593R to ADSP-BF537 Interface................ 28
Layout Guidelines.............................................28
Register Map....................................................... 29
Register Summary: AD5593R Pointer Byte
Map ............................................................... 29
Register Summary (Bit-Wise): AD5593R
Pointer Byte Map ...........................................29
Register Summary: AD5593R Control
Register Map.................................................. 29
Register Details: AD5593R Pointer Byte Map..30
Register Details: AD5593R Control Register
Map................................................................ 32
Register Details: AD5593R ADC and DAC
Readback ...................................................... 45
Outline Dimensions............................................. 47
Ordering Guide.................................................48
Evaluation Boards............................................ 48
REVISION HISTORY
8/2022—Rev. E to Rev. F
Changes to Specifications Section and Table 2...............................................................................................4
Changes to Thermal Resistance Section and Table 5..................................................................................... 8
Added Electrostatic Discharge (ESD) Ratings Section....................................................................................8
Added ESD Ratings for AD5593R Section and Table 6; Renumbered Sequentially....................................... 8
Deleted Table 7 and Table 8; Renumbered Sequentially................................................................................. 9
Changes to Table 7.......................................................................................................................................... 9
Changes to Terminology Section................................................................................................................... 15
Changes to DAC Section Section.................................................................................................................. 18
Added DAC Output Range Section, Figure 33, and Figure 34; Renumbered Sequentially...........................18
Changes to ADC Section Section.................................................................................................................. 19
Changes to GPIO Section Section.................................................................................................................19
Changes to Reset Function Section.............................................................................................................. 20
Changes to Temperature Indicator Section....................................................................................................20
Moved Figure 36............................................................................................................................................ 21
Change to Read Operation Section............................................................................................................... 22
Changes to Pointer Byte Section................................................................................................................... 23
Deleted Table 9 and Table 10........................................................................................................................ 23
Changes to Control Registers Section...........................................................................................................23
analog.com
Rev. F | 2 of 48
Data Sheet
AD5593R
TABLE OF CONTENTS
Deleted Table 11 to Table 13..........................................................................................................................23
Deleted Table 14............................................................................................................................................ 23
Changes to LDAC Mode Operation Section.................................................................................................. 25
Deleted Table 15............................................................................................................................................ 25
Changes to DAC Readback Section..............................................................................................................25
Deleted Table 16 and Table 17...................................................................................................................... 25
Changes to ADC Operation Section.............................................................................................................. 26
Deleted Table 18 to Table 20......................................................................................................................... 26
Changes to Setting Pins as Outputs Section................................................................................................. 27
Deleted Table 21 to Table 23......................................................................................................................... 27
Changes to Setting Pins as Inputs Section....................................................................................................27
Changes to Three-State Pins Section............................................................................................................27
Deleted Table 24............................................................................................................................................ 27
Changes to 85 kΩ Pull-Down Pins Section....................................................................................................27
Deleted Table 25............................................................................................................................................ 27
Changes to Power-Down/Reference Control Section....................................................................................27
Changes to Reset Function Section.............................................................................................................. 27
Deleted Table 26 and Table 27...................................................................................................................... 27
Added Register Map Section......................................................................................................................... 29
Added Register Summary: AD5593R Pointer Byte Map Section and Table 8............................................... 29
Added Register Summary (Bit-Wise): AD5593R Pointer Byte Map Section and Table 9.............................. 29
Added Register Summary: AD5593R Control Register Map Section and Table 10.......................................29
Added Register Details: AD5593R Pointer Byte Map Section....................................................................... 30
Added Configuration Mode Register Section and Table 11........................................................................... 30
Added DAC Write Mode Register Section and Table 12................................................................................30
Added ADC Readback Mode Register Section and Table 13........................................................................31
Added DAC Readback Mode Register Section and Table 14........................................................................31
Added GPIO Readback Mode Register Section and Table 15...................................................................... 32
Added Register Readback Mode Section and Table 16................................................................................ 32
Added Register Details: AD5593R Control Register Map Section.................................................................32
Added NOP Register Section and Table 17...................................................................................................32
Added ADC Sequence Register Section and Table 18..................................................................................33
Added ADC Pin Configuration Register Section and Table 20...................................................................... 35
Added DAC Pin Configuration Register Section and Table 21...................................................................... 36
Added Pull-Down Configuration Register Section and Table 22....................................................................37
Added LDAC Mode Register Section and Table 23....................................................................................... 38
Added GPIO Write Configuration Register Section and Table 24..................................................................38
Added GPIO Write Data Register Section and Table 25................................................................................39
Added GPIO Read Configuration Register Section and Table 26..................................................................40
Added Power-Down/Reference Control Register Section and Table 27........................................................41
Added GPIO Open-Drain Configuration Register Section and Table 28........................................................42
Added Three-State Configuration Register Section and Table 29................................................................. 43
Added Software Reset Register Section and Table 30.................................................................................. 44
Added DAC Write Register Section and Table 31..........................................................................................45
Added Register Details: AD5593R ADC and DAC Readback Section.......................................................... 45
Added DAC Data Read Back Register Section and Table 32........................................................................45
Added ADC Conversion Result Register Section and Table 33.....................................................................46
Added Temperature Reading Register Section and Table 34........................................................................ 46
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Rev. F | 3 of 48
Data Sheet
AD5593R
SPECIFICATIONS
VDD = 2.7 V to 5.5 V, VLOGIC = 2.7 V to 5.5 V, VREF = 2.5 V (internal), Temperature Range TA = TMIN to TMAX, unless otherwise noted. Typical
specs are verified by characterization, not production tested.
Table 2.
Parameter
Min
TEMPERATURE RANGE (TA)
Specified Performance
−40
ADC PERFORMANCE
Resolution
Input Range1
Integral Nonlinearity (INL)
Differential Nonlinearity (DNL)
Offset Error
Gain Error
Track Time (tTRACK)2
Conversion Time (tCONV)2
Signal to Noise Ratio (SNR)3
°C
VREF
2 × VREF
+2
+1
±5
0.3
2
69
67
61
69
67
60
−91
−89
−72
91
91
72
15
12
50
−95
8.2
1.6
Aperture Delay2
Aperture Jitter2
Channel-to-Channel Isolation
Full Power Bandwidth
12
0
0
−1
−1
−3
VREF
2 × VREF
+1
+1
+3
8
Zero Code Error
Total Unadjusted Error (TUE)
0.65
±0.03
±0.015
Capacitive Load Stability
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+105
500
Spurious Free Dynamic Range (SFDR)
Resistive Load
Unit
12
0
0
−2
−1
Total Harmonic Distortion (THD)
INL
DNL
Offset Error
Offset Error Drift2
Gain Error
Max
Test Conditions/Comments
fIN = 10 kHz sine wave
Signal-to-Noise + Distortion (SINAD) Ratio
DAC PERFORMANCE4
Resolution
Output Range
Typ
1
±0.2
±0.1
2
±0.25
±0.1
2
10
Bits
V
V
LSB
LSB
mV
% FSR
ns
µs
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
ns
ns
ps
dB
MHz
MHz
Bits
V
V
LSB
LSB
mV
µV/°C
% FSR
% FSR
mV
% FSR
% FSR
nF
nF
kΩ
ADC range select bit = 0
ADC range select bit = 1
VDD = 2.7 V, input range = 0 V to VREF
VDD = 5.5 V, input range = 0 V to VREF
VDD = 5.5 V, input range = 0 V to 2 × VREF
VDD = 2.7 V, input range = 0 V to VREF
VDD = 3.3 V, input range = 0 V to VREF
VDD = 5.5 V, input range = 0 V to 2 × VREF
VDD = 2.7 V, input range = 0 V to VREF
VDD = 3.3 V, input range = 0 V to VREF
VDD = 5.5 V, input range = 0 V to 2 × VREF
VDD = 2.7 V, input range = 0 V to VREF
VDD = 3.3 V, input range = 0 V to VREF
VDD = 5.5 V, input range = 0 V to 2 × VREF
VDD = 3 V
VDD = 5 V
fIN = 5 kHz
At 3 dB
At 0.1 dB
DAC range select bit = 0
DAC range select bit = 1
Output range = 0 V to VREF
Output range = 0 V to 2 × VREF
Output range = 0 V to VREF
Output range = 0 V to 2 × VREF
RLOAD = ∞
RLOAD = 1 kΩ
Rev. F | 4 of 48
Data Sheet
AD5593R
SPECIFICATIONS
Table 2.
Parameter
Short-Circuit Current
DC Crosstalk2
DC Output Impedance
DC Power Supply Rejection Ratio (PSRR)2
Load Impedance at Rails5
Load Regulation
Min
REFERENCE OUTPUT
VREF Output Voltage
VREF Temperature Coefficient
Capacitive Load Stability
Output Impedance
analog.com
0.2
0.15
25
200
200
7
1.25
6
2
1
0.1
1
0.1
240
200
V/µs
µs
nV-sec
nV-sec
nV-sec
nV-sec
nV-sec
kHz
nV/√Hz
81
77
74
−76
dB
dB
dB
dB
+4
1
−1
Test Conditions/Comments
Single channel, full-scale output change
DAC code = midscale, VDD = 3 V ± 10% or 5 V ± 10%
VDD = 5 V ± 10%, DAC code = midscale, −10 mA ≤ IOUT ≤ +10 mA
VDD = 3 V ± 10%, DAC code = midscale, −10 mA ≤ IOUT ≤ +10 mA
Exiting power-down mode, VDD = 5 V
DAC code = full scale, output range = 0 V to 2 × VREF
DAC code = midscale, output range = 0 V to 2 × VREF, measured
at 10 kHz
VDD
+1
V
µA
kΩ
kΩ
No I/Ox pins configured as DACs
DAC output range = 0 V to 2 × VREF
DAC output range = 0 V to VREF
2.505
V
ppm/°C
μF
Ω
Ω
µV p-p
nV/√Hz
µV/V
µV/V
RLOAD = 2 kΩ
VDD = 2.7 V
VDD = 5 V
0.1 Hz to 10 Hz
At ambient, f = 1 kHz, CL = 10 nF
At ambient, sweeping VDD from 2.7 V to 5.5 V
At ambient, sweeping VDD from 2.7 V to 3.3 V
210
120
±5
µV/mA
µV/mA
mA
At ambient, −5 mA ≤ load current ≤ +5 mA
At ambient, −5 mA ≤ load current ≤ +5 mA
VDD ≥ 3 V
1.6
mA
12
24
2.495
Unit
mA
µV
Ω
mV/V
Ω
µV/mA
µV/mA
µs
−4
Output Voltage Noise
Output Voltage Noise Density
Line Regulation
Load Regulation
Sourcing
Sinking
Output Current Load Capability
GPIO OUTPUT
ISOURCE and ISINK
Output Voltage
High, VOH
Low, VOL
GPIO INPUT
Input Voltage
Max
25
Power-Up Time
DAC AC SPECIFICATIONS
Slew Rate
Settling Time
DAC Glitch Impulse
DAC to DAC Crosstalk
Digital Crosstalk
Analog Crosstalk
Digital Feedthrough
Multiplying Bandwidth
Output Voltage Noise Spectral Density
SNR
SFDR
SINAD
Total Harmonic Distortion
REFERENCE INPUT
VREF Input Voltage
DC Leakage Current
VREF Input Impedance
Typ
2.5
20
5
0.15
0.7
10
240
20
10
VDD − 0.2
0.4
V
V
ISOURCE = 1 mA
ISINK = 1 mA
Rev. F | 5 of 48
Data Sheet
AD5593R
SPECIFICATIONS
Table 2.
Parameter
Min
High, VIH
Low, VIL
Input Capacitance
Hysteresis
Input Current
LOGIC INPUTS
Input Voltage
High, VINH
Low, VINL
Input Current, IIN
Input Capacitance, CIN
LOGIC OUTPUT (SDA)
Output High Voltage, VOH
Output Low Voltage, VOL
Floating-State Output Capacitance
TEMPERATURE SENSOR2
Resolution
Operating Range
Accuracy
Track Time
VDD × 0.7
POWER REQUIREMENTS
VDD
IDD
Power-Down Mode
Normal Mode
VDD = 5 V
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Max
VDD × 0.3
20
0.2
±1
0.7 × VLOGIC
−1
+0.01
0.3 × VLOGIC
+1
10
VLOGIC − 0.2
0.4
10
12
−40
2.7
Unit
Test Conditions/Comments
V
V
pF
V
µA
V
V
µA
pF
V
V
pF
5
20
Bits
°C
°C
µs
µs
5.5
V
3.5
µA
+105
±3
ISOURCE = 200 µA; VLOGIC = 2.7 V to 5.5 V
ISINK = 200 µA
ADC buffer enabled
ADC buffer disabled
Digital inputs = 0 V or VLOGIC
VDD = 3 V
VLOGIC
ILOGIC
Typ
1.8
1.6
1
2.4
mA
mA
mA
1.1
mA
1
0.75
0.5
0.5
1.1
1
1.1
mA
mA
mA
mA
mA
mA
mA
0.78
mA
0.75
0.5
0.45
0.45
mA
mA
mA
mA
V
μA
VDD
3.5
I/O0 to I/O7 are DACs, internal reference, gain = 2
I/O0 to I/O7 are DACs, external reference, gain = 2
I/O0 to I/O7 are DACs and sampled by the ADC, internal
reference, gain = 2
I/O0 to I/O7 are DACs and sampled by the ADC, external
reference, gain = 2
I/O0 to I/O7 are ADCs, internal reference, gain = 2
I/O0 to I/O7 are ADCs, external reference, gain = 2
I/O0 to I/O7 are general-purpose outputs
I/O0 to I/O7 are general-purpose inputs
I/O0 to I/O7 are DACs, internal reference, gain = 1
I/O0 to I/O7 are DACs, external reference, gain = 1
I/O0 to I/O7 are DACs and sampled by the ADC, internal
reference, gain = 1
I/O0 to I/O7 are DACs and sampled by the ADC, external
reference, gain = 1
I/O0 to I/O7 are ADCs, internal reference, gain = 1
I/O0 to I/O7 are ADCs, external reference, gain = 1
I/O0 to I/O7 are general-purpose outputs
I/O0 to I/O7 are general-purpose inputs
Rev. F | 6 of 48
Data Sheet
AD5593R
SPECIFICATIONS
1
When using the internal ADC buffer, there is a dead band of 0 V to 5 mV.
2
Guaranteed by design and characterization; not production tested.
3
All specifications expressed in decibels are referred to full-scale input, FSR, and tested with an input signal at 0.5 dB below full scale, unless otherwise specified.
4
DC specifications tested with the outputs unloaded, unless otherwise noted. Linearity calculated using a reduced code range of 8 to 4085. An upper dead band of 10 mV
exists when VREF = VDD.
5
When drawing a load current at either rail, the output voltage headroom with respect to that rail is limited by the 25 Ω typical channel resistance of the output devices. For
example, when sinking 1 mA, the minimum output voltage = 25 Ω × 1 mA = 25 mV (see Figure 26 and Figure 27).
TIMING CHARACTERISTICS
All input signals are specified with tR = tF = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2; VDD = 2.7 V to 5.5 V, 1.8
V ≤ VLOGIC ≤ VDD; 2.5 V ≤ VREF ≤ VDD; all specifications TMIN to TMAX, unless otherwise noted.
Table 3.
Parameter1
Min
t1
t2
t3
t4
t5
t 62
t7
t8
t9
t10
2.5
0.6
1.3
0.6
100
Typ
Max
0.9
0.6
0.6
1.3
300
0
t11
250
0
300
20 + 0.1 × CB3
CB3
400
Unit
Conditions/Comments
µs
µs
µs
µs
ns
µs
µs
µs
µs
ns
ns
ns
ns
ns
ns
pF
SCL cycle time
tHIGH, SCL high time
tLOW, SCL low time
tHD,STA, start/repeated start condition hold time
tSU,DAT, data setup time
tHD,DAT, data hold time
tSU,STA, setup time for repeated start
tSU,STO, stop condition setup time
tBUF, bus free time between a stop and a start condition
tR, rise time of SCL and SDA when receiving
tR, rise time of SCL and SDA when receiving (CMOS compatible)
tF, fall time of SDA when transmitting
tF, fall time of SDA when receiving (CMOS compatible)
tF, fall time of SCL and SDA when receiving
tF, fall time of SCL and SDA when transmitting
Capacitive load for each bus line
1
Guaranteed by design and characterization; not production tested.
2
A master device must provide a hold time of at least 300 ns for the SDA signal (referred to the VIH min of the SCL signal) to bridge the undefined region of the falling edge
of SCL.
3
CB is the total capacitance of one bus line in pF. tR and tF are measured between 0.3 VLOGIC and 0.7 VLOGIC.
Timing Diagram
Figure 2. 2-Wire Serial Interface Timing Diagram
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Rev. F | 7 of 48
Data Sheet
AD5593R
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to 100
mA do not cause SCR latch-up.
measurement points. The thermal resistances are directly dependent on the PCB design and environment.
Table 4.
If direct measurement of the package is required, the ΨJT and ΨJB
values must be used because they more accurately reflect the true
thermal dissipation paths.
Parameter
Rating
VDD to GND
VLOGIC to GND
I/Ox to GND
Digital Inputs to GND
Digital Outputs to GND
VREF to GND
Operating Temperature Range
Storage Temperature Range
Junction Temperature (TJ max)
Lead Temperature
Soldering
−0.3 V to +7 V
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to VLOGIC + 0.3 V
−0.3 V to VLOGIC +0.3 V
−0.3 V to VDD +0.3 V
−40°C to +105°C
−65°C to +150°C
+150°C
JEDEC industry-standard
J-STD-020
θJC must only be used where an external heat sink is attached
directly to the package.
System level thermal simulation is highly recommended.
For more details about the thermal resistances, refer to JEDEC51-12: Guidelines for Reporting and Using Electronic Package
Thermal Information.
Table 5. Thermal Resistance
Package Type
θJA
θJB
θJC-TOP ΨJT
ΨJB
Unit
CP-16-32
RU-16
CB-16-3
92.4
127
103.2
39.6
60.2
64
48.2
42.2
0
37.4
59.1
78
°C/W
°C/W
°C/W
0.9
2.6
0
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
ELECTROSTATIC DISCHARGE (ESD) RATINGS
THERMAL RESISTANCE
Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to PCB
thermal design is required.
Field induced charged device model (FICDM) and charged device
model (CDM) per ANSI/ESDA/JEDEC JS-002.
Thermal characteristics are specified for the worst-case conditions,
that is, a device soldered in a circuit board for surface-mount packages. Thermal resistance values specified in Table 5 are simulated
based on JEDEC specifications using a 2S2P thermal test board
(see JEDEC JESD51), except for θJC-TOP, which uses a JEDEC 1S
test board.
ESD Ratings for AD5593R
θJA is the junction to ambient thermal resistance, measured in a
JEDEC natural convection environment.
ESD CAUTION
θJC is the junction to case thermal resistance, measured at the centre of the package top surface, with an infinite heat sink attached to
the package surface.
θJB is the junction to board thermal resistance, measured at a point
on the board 1mm from the package edge, along the package
centre line, measured in a JEDEC θJB environment.
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.
Table 6. AD5593R, 16-Ball WLCSP, 16-Ball LFCSP, and 16-Lead TSSOP
ESD Model
Withstand Voltage (V)
Class
HBM
500
1B
FICDM
1250
C3
ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although
this product features patented or proprietary protection circuitry,
damage may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to avoid
performance degradation or loss of functionality.
ΨJB is the junction to board thermal characterization parameter,
measured in a JEDEC natural convection environment.
ΨJT is the junction to package top thermal characterization parameter, measured in a JEDEC natural convection environment.
Do not use θJA, θJC, and θJB thermal resistances to perform direct
calculation/measurement of the die temperature because doing so
results in incorrect values. The thermal resistances assume 100%
of the power that is dissipated along the specified path between the
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Rev. F | 8 of 48
Data Sheet
AD5593R
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 3. 16-Lead TSSOP Pin Configuration
Figure 5. 16-Ball WLCSP Pin Configuration
Figure 4. 16-Lead LFCSP Pin Configuration
Table 7. Pin Function Descriptions
Pin No.
TSSOP
LFCSP WLCSP
Mnemonic
Description
1
15
A3
RESET
2
3
4 to 7,
10 to 13
16
1
2 to 5,
8 to 11
A0
VDD
I/O0 to I/O7
8
6
A4
B4
B3, C4, C3,
C2, D1, D4,
C1, B2
D3
9
14
15
7
12
13
D2
B1
A1
VLOGIC
GND
SDA
16
14
A2
SCL
Asynchronous Reset Pin. Tie this pin high for normal operation. When this pin is brought low, the AD5593R is reset to its
default configuration.
Address Input. Sets the LSB of the 7-bit slave address.
Power Supply Input. The AD5593R can operate from 2.7 V to 5.5 V. Decouple the supply with a 0.1 µF capacitor to GND.
Input/Output 0 Through Input/Output 7. These pins can be independently configured as DACs, ADCs, or general-purpose
digital inputs or outputs. The function of each pin is determined by programming the appropriate bits in the configuration
registers.
Reference Input/Output. When the internal reference is enabled, the 2.5 V reference voltage is available on the VREF pin.
A 0.1 µF capacitor connected from the VREF pin to GND is recommended to achieve the specified performance from the
AD5593R. When the internal reference is disabled, an external reference must be applied to this pin. The voltage range for
the external reference is 1 V to VDD.
Interface Power Supply. The voltage on this pin ranges from 1.8 V to 5.5 V.
Ground Reference Point for All Circuitry.
Serial Data Input. This pin is used with the SCL line to clock data in to or out of the input shift register. SDA is a
bidirectional, open-drain line that must be pulled to the VLOGIC supply with an external pull-up resistor.
Serial Clock Line. This pin is used with the SDA line to clock data in to or out of the 16-bit input register.
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VREF
Rev. F | 9 of 48
Data Sheet
AD5593R
TYPICAL PERFORMANCE CHARACTERISTICS
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Figure 6. ADC INL; VDD = 5.5 V
Figure 9. ADC DNL; VDD = 2.7 V
Figure 7. ADC DNL; VDD = 5.5 V
Figure 10. Histogram of ADC Codes; VDD = 2.7 V
Figure 8. ADC INL; VDD = 2.7 V
Figure 11. Histogram of Codes; VDD = 5.5 V
Rev. F | 10 of 48
Data Sheet
AD5593R
TYPICAL PERFORMANCE CHARACTERISTICS
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Figure 12. ADC Bandwidth
Figure 15. DAC Adjacent Code Glitch
Figure 13. DAC INL
Figure 16. DAC Digital to Analog Glitch (Rising)
Figure 14. DAC DNL
Figure 17. DAC Digital to Analog Glitch (Falling)
Rev. F | 11 of 48
Data Sheet
AD5593R
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 18. DAC Settling Time (100 Code Change, Rising Edge)
Figure 21. DAC Settling Time, Output Range = 0 V to 2 × VREF
Figure 19. DAC Settling Time (100 Code Change, Falling Edge)
Figure 22. DAC Settling Time vs. Capacitive Load
Figure 20. DAC Settling Time, Output Range = 0 V to VREF
Figure 23. DAC 1/f Noise with External Reference
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Rev. F | 12 of 48
Data Sheet
AD5593R
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 24. DAC 1/f Noise with Internal Reference
Figure 27. DAC Output Sink and Source Capability, Output Range = 0 V to 2 ×
VREF
Figure 25. DAC Output Noise Spectral Density
Figure 28. Internal Reference 1/f Noise
Figure 26. DAC Output Sink and Source Capability, Output Range = 0 V to
VREF
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Figure 29. Reference Noise Spectral Density
Rev. F | 13 of 48
Data Sheet
AD5593R
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 30. Reference Line Regulation
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Rev. F | 14 of 48
Data Sheet
AD5593R
TERMINOLOGY
ADC Integral Nonlinearity (INL)
Total Harmonic Distortion (THD)
For the ADC, INL is the maximum deviation from a straight line
passing through the endpoints of the ADC transfer function. The
end points of the transfer function are zero scale, a point that is
1 LSB below the first code transition, and full scale, a point that is 1
LSB above the last code transition.
THD is the ratio of the rms sum of harmonics to the fundamental.
For the AD5593R, it is defined as
ADC Differential Nonlinearity (DNL)
For the ADC, DNL is the difference between the measured and the
ideal 1 LSB change between any two adjacent codes in the ADC.
Offset Error
Offset error is the deviation of the first code transition (00 … 000) to
(00 … 001) from the ideal, that is, AGND + 1 LSB.
Gain Error
Gain error is the deviation of the last code transition (111 … 110) to
(111 … 111) from the ideal (that is, VREF − 1 LSB) after the offset
error has been adjusted out.
Channel-to-Channel Isolation
Channel-to-channel isolation is a measure of the level of crosstalk
between channels. It is measured by applying a full-scale 5 kHz
sine wave signal to all non-selected ADC input channels and determining how much that signal is attenuated in the selected channel.
This specification is the worst case across all ADC channels for the
AD5593R.
Track-and-Hold Acquisition Time
The track-and-hold amplifier goes into track mode when the ADC
sequence register has been written to. The track and hold amplifier goes into hold mode when the conversion starts (see ).
Track-and-hold acquisition time is the minimum time required for
the track-and-hold amplifier to remain in track mode for its output to
reach and settle to within ±1 LSB of the applied input signal, given a
step change to the input signal.
Signal-to-Noise Distortion Ratio SINAD
SINAD is the measured ratio of signal to (noise + distortion) at the
output of the analog-to-digital converter. The signal is the rms amplitude of the fundamental. Noise is the sum of all non-fundamental
signals up to half the sampling frequency (fS/2), excluding dc. The
ratio is dependent on the number of quantization levels in the
digitization process; the more levels, the smaller the quantization
noise. The theoretical SINAD for an ideal N-bit converter with a sine
wave input is given by
Signal-to-(Noise + Distortion) (dB) = 6.02N + 1.76
Thus, for a 12-bit converter, this is 74 dB.
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THD dB = 20 × log
V22 + V32 + V42 + V52 + V62
V1
(1)
where V1 is the rms amplitude of the fundamental and V2, V3, V4,
V5, and V6 are the rms amplitudes of the second through the sixth
harmonics.
Peak Harmonic or Spurious Noise
Peak harmonic or spurious noise is defined as the ratio of the rms
value of the next largest component in the ADC output spectrum
(up to fS/2 and excluding dc) to the rms value of the fundamental.
Normally, the value of this specification is determined by the largest
harmonic in the spectrum, but for ADCs where the harmonics are
buried in the noise floor, it is a noise peak.
DAC Relative Accuracy or Integral Nonlinearity
(INL)
For the DAC, relative accuracy or integral nonlinearity is a measurement of the maximum deviation, in LSBs, from a straight line
passing through the endpoints of the DAC transfer function. A
typical INL vs. code plot is shown in Figure 13.
DAC Differential Nonlinearity (DNL)
For the DAC, differential nonlinearity is the difference between
the measured change and the ideal 1 LSB change between any
two adjacent codes. A specified differential nonlinearity of ±1 LSB
maximum ensures monotonicity. This DAC is guaranteed monotonic
by design. A typical DNL vs. code plot can be seen in Figure 14.
Zero Code Error
Zero code error is a measurement of the output error when zero
code (0x000) is loaded to the DAC register. Ideally, the output is 0
V. The zero code error is always positive in the AD5593R because
the output of the DAC cannot go below 0 V due to a combination
of the offset errors in the DAC and the output amplifier. Zero code
error is expressed in mV.
Gain Error
Gain error is a measure of the span error of the DAC. It is the
deviation in slope of the DAC transfer characteristic from the ideal
expressed as % of FSR.
Offset Error
Offset error is a measure of the difference between VOUT (actual)
and VOUT (ideal) expressed in mV in the linear region of the transfer
function. Offset error can be negative or positive.
Rev. F | 15 of 48
Data Sheet
AD5593R
TERMINOLOGY
Offset Error Drift
Digital Crosstalk
Offset error drift is a measurement of the change in offset error with
a change in temperature. It is expressed in µV/°C.
Digital crosstalk is the glitch impulse transferred to the output of one
DAC at midscale in response to a full-scale code change (all 0s
to all 1s and vice versa) in the input register of another DAC. It is
measured in standalone mode and is expressed in nV-sec.
DAC DC Power Supply Rejection Ratio (PSRR)
For the DAC, PSRR indicates how the output of the DAC is affected
by changes in the supply voltage. PSRR is the ratio of the change
in VOUT to a change in VDD for full-scale output of the DAC. It is
measured in mV/V. VREF is held at 2 V, and VDD is varied by ±10%.
Output Voltage Settling Time
Output voltage settling time is the amount of time it takes for the
output of a DAC to settle to a specified level for a ¼ to ¾ full-scale
input change and is measured from the rising edge of SDA that
generates the stop condition.
Digital-to-Analog Glitch Impulse
Analog Crosstalk
Analog crosstalk is the glitch impulse transferred to the output of
one DAC due to a change in the output of another DAC. It is first
measured by loading one of the input registers with a full-scale
code change (all 0s to all 1s and vice versa). Then it is measured
by executing a software LDAC and monitoring the output of the
DAC whose digital code was not changed. The area of the glitch is
expressed in nV-sec.
DAC-to-DAC Crosstalk
Digital-to-analog glitch impulse is the impulse injected into the
analog output when the input code in the DAC register changes
state. It is normally specified as the area of the glitch in nV-sec, and
is measured when the digital input code is changed by 1 LSB at the
major carry transition (0x7FF to 0x800) (see Figure 16 and Figure
17).
DAC-to-DAC crosstalk is the glitch impulse transferred to the output
of one DAC due to a digital code change and subsequent analog
output change of another DAC. It is measured by loading the attack
channel with a full-scale code change (all 0s to all 1s and vice
versa), using the write to and update commands while monitoring
the output of the victim channel that is at midscale. The energy of
the glitch is expressed in nV-sec.
Digital Feedthrough
Multiplying Bandwidth
Digital feedthrough is a measure of the impulse injected into the
analog output of the DAC from the digital inputs of the DAC, but
is measured when the DAC output is not updated. It is specified in
nV-sec, and measured with a full-scale code change on the data
bus, that is, from all 0s to all 1s and vice versa.
The amplifiers within the DAC have a finite bandwidth. The multiplying bandwidth is a measure of this finite bandwidth. A sine wave on
the reference (with full-scale code loaded to the DAC) appears on
the output. The multiplying bandwidth is the frequency at which the
output amplitude falls to 3 dB below the input.
Reference Feedthrough
DAC Total Harmonic Distortion (THD)
Reference feedthrough is the ratio of the amplitude of the signal at
the DAC output to the reference input when the DAC output is not
being updated. It is expressed in dB.
For the DAC, THD is the difference between an ideal sine wave
and its attenuated version using the DAC. The sine wave is used as
the reference for the DAC, and the THD is a measurement of the
harmonics present on the DAC output. It is measured in dB.
Noise Spectral Density (NSD)
NSD is a measurement of the internally generated random noise.
Random noise is characterized as a spectral density (nV/√Hz). It is
measured by loading the DAC to midscale and measuring noise at
the output. It is measured in nV/√Hz. A plot of noise spectral density
is shown in Figure 25.
DC Crosstalk
DC crosstalk is the dc change in the output level of one DAC in
response to a change in the output of another DAC. It is measured
with a full-scale output change on one DAC (or soft power-down
and power-up) while monitoring another DAC kept at midscale. It is
expressed in μV.
DC crosstalk due to load current change is a measure of the impact
that a change in load current on one DAC has to another DAC kept
at midscale. It is expressed in μV/mA.
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Voltage Reference Temperature Coefficient
(TC)
Voltage reference TC is a measure of the change in the reference
output voltage with a change in temperature. The voltage reference
TC is calculated using the box method, which defines the TC as the
maximum change in the reference output over a given temperature
range expressed in ppm/°C, as follows:
TC =
VREF(MAX) − VREF(MIN)
VREF(NOM) × Temp Range
× 106
(2)
where:
VREF(MAX) is the maximum reference output measured over the total
temperature range.
VREF(MIN) is the minimum reference output measured over the total
temperature range.
Rev. F | 16 of 48
Data Sheet
AD5593R
TERMINOLOGY
VREF(NOM) is the nominal reference output voltage, 2.5 V.
Temp Range is the specified temperature range of −40°C to
+105°C.
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Rev. F | 17 of 48
Data Sheet
AD5593R
THEORY OF OPERATION
The AD5593R is an 8-channel, configurable analog and digital
I/O port. The AD5593R has eight pins that can be independently
configured as a 12-bit DAC output channel, a 12-bit ADC input
channel, a digital input pin, or a digital output pin.
The function of each pin is determined by programming the ADC,
DAC, or GPIO configuration registers as appropriate.
DAC SECTION
The AD5593R contains eight 12-bit DACs. Each DAC consists of a
string of resistors followed by an output buffer amplifier. Figure 31
shows a block diagram of the DAC architecture.
Figure 32. Resistor String
DAC Output Buffer
Figure 31. DAC Channel Architecture Block Diagram
The DAC channels share a single DAC range bit (in the GeneralPurpose Control Register section, see Bit 4 in Table 19) that sets
the output range to 0 V to VREF or 0 V to 2 × VREF. Because the
range bit is shared by all channels, it is not possible to set different
output ranges on a per channel basis. The input coding to the DAC
is straight binary. Therefore, the ideal output voltage is given by
VOUT = G × VREF ×
D
2N
(3)
where:
G = 1 for an output range of 0 V to VREF or G = 2 for an output
range of 0 V to 2 × VREF.
VREF is the voltage on the VREF pin.
D is the decimal equivalent of the binary code (0 to 4095) that is
loaded to the DAC register.
N = 12.
The output buffer is designed as an input/output rail-to-rail buffer.
The output buffer can drive 2 nF capacitance with a 1 kΩ resistor
in parallel. The slew rate is 1.25 V/µs with a ¼ to ¾ scale settling
time of 6 µs. By default, the DAC outputs update directly after data
has been written to the input register. The LDAC register delays the
updates until additional channels have been written to if required.
See the LDAC Mode Operation section for more information.
DAC Output Range
The DAC output voltage range can be configured to 0 V to VREF
(gain = 1) or 0 V to 2 × VREF (gain = 2) using DAC range bit of the
general-purpose control register, as shown in Figure 33 and Figure
34, respectively. When VREF = VDD, the 0 V to 2 × VREF range does
not allow the DAC to swing the output beyond VDD.
Resistor String
The simplified segmented resistor string DAC structure is shown
in Figure 32. The code loaded to the DAC register determines the
switch on the string that is connected to the output buffer.
Because each resistance in the string has the same value, R, the
string DAC is guaranteed monotonic.
Figure 33. Output Voltage Range of the DAC with Gain = 1 (Unloaded
Condition)
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Rev. F | 18 of 48
Data Sheet
AD5593R
THEORY OF OPERATION
input structure. When a new channel is selected for conversion,
5.8 pF must be charged to or discharged from the voltage that on
the previously selected channel. The time required for the charge
or discharge depends on the voltage difference between the two
channels. This dependence affects the input impedance of the
multiplexer and, therefore, the input current flowing into the I/Ox
pins.
Figure 34. Output Voltage Range of the DAC with Gain = 2 (Unloaded
Condition)
When VREF = VDD for gain = 1 or VREF = 0.5 × VDD for gain = 2,
there is an upper dead band of 10 mV at the DAC channel output
in unloaded conditions. Additionally, there is a lower dead band of
~4.88 mV at the DAC channel output in unloaded conditions. When
drawing a load current at either rail, the output voltage headroom
with respect to that rail is limited by the 25 Ω typical channel
resistance of the DAC channel. For example, when sinking 1 mA,
the minimum output voltage = 25 Ω × 1 mA = 25 mV.
ADC SECTION
The ADC section is a fast, 12-bit, single-supply ADC with a conversion time of 2 µs. The ADC is preceded by a multiplexer that
switches selected I/O pins to the ADC. A sequencer is included
to switch the multiplexer to the next selected channel automatically. Channels are selected for conversion by writing to the ADC
sequence register. When the write to the ADC sequence register
has completed, the first channel in the conversion sequence is
put into track mode. Each channel can track the input signal for a
minimum of 500 ns. The conversion is initiated on the rising edge
of the clock for the acknowledge (ACK) that occurs after the slave
address (see Figure 39).
Each conversion takes 2 µs. The ADC has a range bit (ADC range
select in the general-purpose control register, see Bit 5 in Table 19)
that sets the input range as 0 V to VREF or 0 V to 2 × VREF. All input
channels share the same range. The output coding of the ADC is
straight binary. It is possible to set each I/Ox pin as both a DAC and
an ADC. In this case, the primary function is that of the DAC. If the
pin is selected for inclusion in an ADC conversion sequence, the
voltage on the pin is converted and made available via the serial
interface. This allows the DAC voltage to be monitored.
Calculating ADC Input Current
The current flowing into the I/Ox pins configured as ADC inputs
varies with sampling rate (fS), the voltage difference between
successive channels (VDIFF), and whether buffered or unbuffered
mode is used. Figure 35 shows a simplified version of the ADC
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In buffered mode, Switch S1 is open and Switch S2 is closed. In
buffered mode, the U1 buffer directly drives the 23.1 pF capacitor
and the charging time of the capacitors is negligible. In unbuffered
mode, Switch S1 is closed and Switch S2 is closed. In unbuffered
mode, the 23.1 pF capacitor must be charged from the I/Ox pins;
this charging contributes to the input current. For applications
where the ADC input current is too high, an external input buffer
may be required. The choice of buffer is a function of the particular
application.
Calculate the input current for buffered mode as follows:
fS × C × VDIFF + 1 nA
where:
fS is the ADC sample rate in Hz.
C is the sampling capacitance in farads.
VDIFF is the voltage change between successive channels.
Calculate the input current for buffered mode as follows:
fS × C × VDIFF
where 1 nA is the dc leakage current associated with unbuffered
mode.
The input current for the ADC in buffered mode, where I/O0 = 0.5 V,
I/O1 = 2 V, and fS = 10 kHz, is as follows:
(10,000 × 5.8 × 10−12 × 1.5) + 1 nA = 88 nA
Under the same conditions, the ADC input current in unbuffered
mode is as follows:
(10,000 × 28.9 × 10−12 × 1.5) = 433.5 nA
Figure 35. ADC Input Structure
GPIO SECTION
Each of the eight I/Ox pins can be configured as a general-purpose
digital input by programming the GPIO read configuration register
or output pin by programming the GPIO write configuration register.
When an I/Ox pin is configured as an output, the pin can be set
high or low by programming the GPIO write data register. Logic
levels for general-purpose outputs are relative to VDD and GND.
When an I/Ox pin is configured as an input, its status can be
Rev. F | 19 of 48
Data Sheet
AD5593R
THEORY OF OPERATION
determined by setting the pointer byte to 0b01100000 . When an
I/Ox pin is set as an output, it is possible to read its status by also
setting it as an input pin. When reading the status of the I/Ox pins
set as inputs the status of an I/Ox pin set as both and input and
output pin is also returned.
INTERNAL REFERENCE
The AD5593R contains an on-chip 2.5 V reference. The reference
is powered down by default and is enabled by setting Bit 9 in the
power-down/reference control register to 1. When the on-chip reference is powered up, the reference voltage appears on the VREF pin
and may be used as a reference source for other components.
When the internal reference is used, it is recommended to decouple
VREF to GND using a 100 nF capacitor. It is recommended that
the internal reference be buffered before using it elsewhere in
the system. When the reference is powered down, an external
reference must be connected to VREF. Suitable external reference
sources for the AD5593R include the AD780, AD1582, ADR431,
REF193, and ADR391.
Temperature (°C) =
25 +
ADC Code − 0.5 / 2 × VREF
1.327 × 2.5 / VREF
× 4095
The range of codes returned by the ADC when reading from the
temperature indicator is approximately 645 to 1035, (for ADC gain
= 1) corresponding to a temperature between −40°C and +105°C.
The accuracy of the temperature indicator is typically 3°C when
averaged over five samples.
RESET FUNCTION
The AD5593R has an asynchronous RESET pin. For normal operation, RESET is tied high. A falling edge on RESET resets all
registers to their default values and reconfigures the I/O pins to
their default values (85 kΩ pull-down resistor to GND). The reset
function takes 250 µs maximum; do not write new data to the
AD5593R during this time. The AD5593R has a software reset that
performs the same function as the RESET pin. The reset function is
activated by writing 0x0F to the pointer byte and 0x0D and 0xAC to
the most significant and least significant bytes of the software reset
register, respectively.
TEMPERATURE INDICATOR
The AD5593R contains an integrated temperature indicator that
can be read to provide an estimation of the die temperature. This
can be used in fault detection where a sudden rise in die temperature may indicate a fault condition, such as a shorted output.
Temperature readback is enabled by setting Bit 8 in the ADC
sequence register. The temperature result is then added to the ADC
sequence. The temperature result has an address of 0b1000 (see
Table 34) and care must be taken that this result is not confused
with the readback from DAC0 (see Table 32). The temperature
conversion takes 5 µs with the ADC buffer enabled and 20 µs when
the buffer is disabled. Calculate the temperature using the following
formulae:
For ADC gain = 1,
Temperature (°C) = 25 +
For ADC gain = 2,
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ADC Code − 0.5 / VREF × 4095
2.654 × 2.5 / VREF
Rev. F | 20 of 48
Data Sheet
AD5593R
SERIAL INTERFACE
The AD5593R has a 2-wire, I2C-compatible serial interface (refer
to The I2C -Bus Specification, Version 2.1, January 2000). The
AD5593R is connected to an I2C bus as a slave device under the
control of a master device. See Figure 2 for a timing diagram of
a typical write sequence. The AD5593R supports standard mode
(100 kHz) and fast mode (400 kHz). Support is not provided for
10-bit addressing and general call addressing. The AD5593R has a
7-bit slave address; its six MSBs are set to 001000. The LSB is set
by the state of the A0 address pin, which determines the state of
the A0 bit. The facility to change the logic level of the A0 pin before
a read or write operation allows the user to incorporate multiple
AD5593R devices on one bus.
The 2-wire serial bus protocol operates as follows: the master
initiates data transfer by establishing a start condition when a
high-to-low transition on the SDA line occurs while SCL is high.
The following byte is the address byte, which consists of the 7-bit
slave address. The slave address corresponding to the transmitted
address responds by pulling SDA low during the ninth clock pulse
(this is termed the acknowledge bit). At this stage, all other devices
on the bus remain idle while the selected device waits for data to be
written to or read from its shift register.
tions on the SDA line must occur during the low period of SCL and
remain stable during the high period of SCL. When all data bits
have been read or written, a stop condition is established.
In write mode, the master pulls the SDA line high during the 10th
clock pulse to establish a stop condition. In read mode, the master
issues a no acknowledge for the ninth clock pulse (that is, the
SDA line remains high). The master brings the SDA line low before
the 10th clock pulse and then high during the 10th clock pulse to
establish a stop condition.
WRITE OPERATION
When writing to the AD5593R, the user must begin with a start
command followed by an address byte R/W = 0), after which the
AD5593R acknowledges that it is prepared to receive data by
pulling SDA low. The AD5593R requires three bytes of data. The
first byte is the pointer byte. This byte contains information defining
the type of operation that is required of the AD5593R, such as
configuring the I/O pins and writing to a DAC. The pointer byte is
followed by the most significant byte and the least significant byte,
as shown in Figure 36. After these data bytes are acknowledged by
the AD5593R, a stop condition follows.
Data is transmitted over the serial bus in sequences of nine clock
pulses (eight data bits followed by an acknowledge bit). The transi-
Figure 36. 4-Byte I2C Write
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Rev. F | 21 of 48
Data Sheet
AD5593R
SERIAL INTERFACE
READ OPERATION
When reading data back from the AD5593R, the user begins with a
start command followed by an address byte (R/W = 0), after which
the AD5593R acknowledges that it is prepared to transmit data by
pulling SDA low. The pointer byte is then written to select what is
to be read back. A repeat start or a new I2C transmission can then
follow to read two bytes of data from the AD5593R. Both bytes are
acknowledged by the master, as shown in Figure 37.
It is also possible to perform consecutive readbacks without having
to provide interim start and stop conditions or slave addresses. This
method can be used to read blocks of conversions from the ADC,
as shown in Figure 39.
Figure 37. Read One 16-Bit Word
Figure 38. Read One 16-Bit Word, Maintain Control of the Bus
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Rev. F | 22 of 48
Data Sheet
AD5593R
SERIAL INTERFACE
Figure 39. I2C Block Read
POINTER BYTE
GENERAL-PURPOSE CONTROL REGISTER
The pointer byte contains eight bits. Bits[7:4] are mode bits that
select the operation to be executed. The data contained in Bits[3:0]
depend on the operation required. Table 8 and Table 9 show
the configuration of the pointer byte. When Bits[7:4] are 0b0000,
the mode dependent bits (Bits[3:0]) select a control register (see
Table 10) to write data to. The data written to a control register is
contained in the MSB and LSB as shown in Figure 36. The mode
dependent data bits also select which DAC is updated during a
DAC write operation and which register is selected for readback.
The general-purpose control register enables or disables certain
functions associated with the DAC, ADC, and I/O pin configuration
(see Table 19). The register sets the output range of the DAC
and input range of the ADC, which sets their transfer functions, enables/disables the ADC buffer, and enables the precharge function
(see the ADC Section section for more details). The register is also
used to lock the I/O pin configuration to prevent accidental change.
When Bit 7 is set to 1, writes to the configuration registers are
ignored.
CONTROL REGISTERS
CONFIGURING THE AD5593R
Table 11 shows the control register map for the AD5593R. The
control registers configure the I/O pins and set various operating
parameters in the AD5593R, such as enabling the reference, selecting the LDAC mode function, or selecting power-down modes.
The control registers are written to using the 4-byte I2C write sequence shown in Figure 36. To write to a control register, the mode
bits (Bits[7:4]) of the pointer byte are zeros. The mode dependent
data bits (Bits[3:0]) of the pointer byte select which control register
is to be accessed. The data to be written to the control register is
contained in the most significant and least significant data bytes.
These contain a total of 16 bits and are shown as Bits[15:0] in
the Register Details: AD5593R Control Register Map section. The
contents of the control registers can be read back using the read
sequence shown in Figure 37 or Figure 38.
The AD5593R I/O pins are configured by writing to a series of pin
configuration registers. The control registers are accessed when
Bits[7:4] of the pointer byte are 0b0000. Bits[3:0] determine which
register is accessed as shown in Table 11.
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On power-up, the I/O pins are configured as 85 kΩ resistors
connected to GND. The I/O channels of the AD5593R can be
configured to operate as DAC outputs, ADC inputs, digital outputs,
digital inputs, three-state, or connected to GND with 85 kΩ pulldown resistors. When configured as digital outputs, the pins have
the additional option of being configured as push/pull or open-drain.
The I/O channels are configured by writing to the appropriate
configuration registers, as shown in Table 11. To assign a particular
function for an I/O channel, write to the appropriate register and
Rev. F | 23 of 48
Data Sheet
AD5593R
SERIAL INTERFACE
set the corresponding bit to 1. For example, setting Bit 0 in the
DAC pin configuration register configures I/O0 as a DAC. In the
event that the bit for an I/O channel is set in multiple configuration
registers, the I/O channel adopts the function dictated by the last
write operation.
The exceptions to this rule are that an I/Ox pin can be set as both
a DAC and ADC or as a digital input and output. When an I/Ox pin
is configured as a DAC and ADC, the primary function is as a DAC
and the ADC can be used to measure the voltage being provided
by the DAC. This feature can be used to monitor the output voltage
to detect short circuits or overload conditions. Figure 40 shows
an example of how to configure I/O1 and I/O7 as DACs. When
a pin is configured as both a general-purpose input and output,
the primary function is as an output pin. This configuration allows
the status of the output pin to be determined by programming the
GPIO read configuration register and then setting the pointer byte
to 0b01100000 .
The general-purpose control register contains a lock configuration
bit. When the lock configuration bit is set to 1, any writes to the pin
configuration registers are ignored, thus preventing the function of
the I/O pins from being changed.
The I/O pins can be reconfigured any time when the AD5593R is in
an idle state, that is, no ADC conversions are taking place and no
registers are being read back. The lock configuration bit must also
be set to 0.
Figure 40. Configuring I/O1 and I/O7 as DACs
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Rev. F | 24 of 48
Data Sheet
AD5593R
SERIAL INTERFACE
DAC WRITE OPERATION
Data is written to a DAC when the mode bits (Bits[7:4]) of the
pointer byte are 0b0001 (see Table 8). Bits[2:0] determine which
DAC is addressed (see Table 12). Data to be written to the DAC
is contained in the MSB and LSB, as shown in Table 31. Data is
written to the selected DAC input register. Data written to the input
register can be automatically copied to the DAC register, if required.
Data is transferred to the DAC register based on the setting of the
LDAC mode register (see Table 23).
LDAC Mode Operation
The transfer of data from an input register to a DAC register is
controlled by Bits[1:0] of the LDAC mode register (pointer byte
= 0b00000111). When the LDAC mode bits (Bits[1:0]) are set to
00, new data is automatically transferred from the input register to
the DAC register and the analog output updates. When the LDAC
mode bits are set to 01, data remains in the input register. This
allows writes to input registers without affecting the analog outputs.
After loading the input registers with the desired values and setting
the LDAC mode bits to 10, the values in the input registers transfer
to the DAC registers and the analog outputs update simultaneously.
The LDAC mode bits then revert to 01.
DAC READBACK
The input register of each DAC can be read back via the I2C interface. This can be useful to confirm that the data was received correctly before writing to the LDAC mode register or simply checking
what value was last loaded to a DAC. Data can be read back from
a DAC only when no ADC conversion sequence is taking place. A
DAC input register can be read back using the sequence shown in
Figure 37 or Figure 38. The mode dependent bits, Bits[3:0], of the
DAC readback mode register (pointer byte = 0b0101XXXX), select
which DAC input register is to be read back (see Table 14). When
the DAC register is read back as shown in Table 32, the MSB of the
most significant data byte is a 1 to indicate that the result is a DAC
register. The next three bits (Bits[14:12]) contain the DAC register
address (see Table 32) and Bits[11:0] contain the DAC register
value. Figure 41 shows an example of reading the input register of
DAC2.
Figure 41. DAC Input Register Readback
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Rev. F | 25 of 48
Data Sheet
AD5593R
SERIAL INTERFACE
ADC OPERATION
The ADC channels of the AD5593R operate as a traditional multichannel ADC, where each serial transfer selects the next channel
for conversion. The user must write to the ADC pin configuration
register (see Table 20) to select the input channels as ADC inputs
to be included in the conversion sequence before initiating any
conversions. This is done using the I2C write sequence shown in
Figure 36. When writing to the ADC sequence register (see Table
18), select which channels are to be converted in sequence. The
user can also set the REP bit to have the ADC repeat conversions
in the sequence.
When the sequence register has been written to, the ADC begins
to track the first channel in the sequence. ADC data can be read
from the AD5593R using any of the three read operations shown in
Figure 37, Figure 38, and Figure 39, with the I2C block read (Figure
39) being the most efficient.
If more than one channel is selected in the ADC sequence register,
the ADC converts all selected channels sequentially in ascending
order. Conversion is started by the rising edge of SCL at the
acknowledge (ACK) preceding the MSB (see Figure 39).
sequence. If the REP bit is clear, the ADC clocks out the last result
on subsequent I2C reads. When ADC data is clocked out by the
serial interface, Bit 15 = 0 to indicate that the result is ADC data.
Bits[14:12] contain a 3-bit address to indicate which ADC the data
is coming from, and Bits[11:0] contain the 12-bit ADC result (see
Table 33).
Figure 42 shows how to configure the AD5593R to perform ADC
conversions. In Step 1, I/O7 and I/O0 are configured as ADCs.
Step 2 writes to the ADC sequence register, sets the REP bit, and
selects ADC7 and ADC0 for inclusion in the conversion sequence.
Step 3 selects the ADCs for reading and Step 4 begins reading the
ADC results (see Table 33). The conversions are repeated until a
stop condition is given by the controller.
The ADC sequence can be changed by writing the new sequence
to the ADC sequence register when conversions are not taking
place. When a new sequence is written, any channels remaining to
be converted from the earlier sequence are ignored and the ADC
starts converting the first channel of the new sequence.
To stop the ADC conversion sequence, clear the REP, TEMP, and
ADC7 to ADC0 bits in the ADC sequence register to 0.
If the REP bit is set after all of the selected channels in the
sequence register have been converted, the ADC repeats the
Figure 42. Configuring the ADC for Conversion
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Rev. F | 26 of 48
Data Sheet
AD5593R
SERIAL INTERFACE
GPIO OPERATION
Each of the I/Ox pins of the AD5593R can be configured to operate
as a general-purpose, digital input or output pin. The function of
the pins is determined by writing to the appropriate bit in the GPIO
read configuration register and the GPIO write configuration register
using the 4-byte I2C write shown in Figure 36.
Setting Pins as Outputs
To set a pin as a general-purpose output, set the appropriate bit in
the GPIO write configuration register (pointer byte = 0b00001000)
to 1. For example, setting Bit 0 to 1 enables I/O0 as a general-purpose output.
The outputs can be independently configured as push/pull or opendrain outputs. When in push/pull configuration, the output is driven
to VDD or GND as determined by the data in the GPIO write
data register (pointer byte = 0b00001001). When in open-drain
configuration (pointer byte = 0b00001100), the output is driven to
GND when a data bit in the GPIO write data register sets the pin
low. When the pin is set high, the output is not driven and must be
pulled high by an external resistor. This allows multiple output pins
to be tied together. If all the pins are normally high, it allows one pin
to pull down the others. This is commonly used where multiple pins
are used to trigger an alarm or interrupt pin. The state of the output
pin is controlled by setting or clearing the bits in the GPIO write
data register (pointer byte = 0b00001001). A data bit is ignored if it
is written to a location that is not configured as an output.
any channels set as DACs to be placed in a power-down state
individually. When in power-down, the DAC outputs are three-stated. When a DAC channel is returned into normal mode, the DAC
output returns to its previous value. The internal reference and its
buffer are powered down by default and are enabled by setting
the EN_REF bit in the power-down/reference control register. The
internal reference voltage then appears at the VREF pin.
There is no dedicated power-down function for the ADC, but the
ADC is automatically powered down if none of the I/Ox pins are
selected as ADCs. The ADC powers up if a read of the temperature indicator is initiated. The PD_ALL bit powers down all the
DACs, the reference, its buffer, and the ADC. The PD_ALL bit also
overrides the settings of Bits[9:0]. Table 27 shows the power-down
register.
RESET FUNCTION
The AD5593R can be reset to its default conditions by writing
0x0DAC to the software reset register (pointer byte = 0b00001111).
This resets all registers to their default values and reconfigures the
I/Ox pins to their default values (85 kΩ pull-down to GND). The
reset function is triggered on the SCL falling edge of the eighth bit
of the least significant byte (Bit 0 of Frame 4 in Figure 36), and the
AD5593R does not generate an ACK signal for this byte of data.
The AD5593R has a RESET pin that performs the same function.
For normal operation, RESET is tied high. A falling edge on RESET
triggers the reset function. Both the hardware and the software
reset functions take 100 µs maximum and there must be no activity
on the SCL pin of the AD5593R during this time.
Setting Pins as Inputs
To set an I/Ox pin as a general-purpose input, set the appropriate bit in the GPIO read configuration register (pointer byte =
0b00001010) to 1. For example, setting Bit 0 to 1 enables I/O0 as a
general-purpose input. To read the state of general-purpose inputs,
set the pointer byte to 0b01100000 (see Table 9) using any of the
read operations shown in Figure 37, Figure 38, and Figure 39. The
status of any I/O pin set as a general-purpose input appears in the
appropriate bit location in the least significant data byte.
THREE-STATE PINS
The I/Ox pins can be set to three-state by writing to the three-state
configuration register (pointer byte = 0b00001101) as shown in
Table 29.
85 KΩ PULL-DOWN PINS
The I/Ox pins can be connected to GND via a pull-down resistor
(85 kΩ) by setting the appropriate bits in the pull-down configuration
register (pointer byte = 0b00000110) as shown in Table 22.
POWER-DOWN/REFERENCE CONTROL
The AD5593R has a power-down/reference control register (pointer
byte = 0b00001011) that reduces the power consumption when
certain functions are not needed. The power-down register allows
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Rev. F | 27 of 48
Data Sheet
AD5593R
APPLICATIONS INFORMATION
MICROPROCESSOR INTERFACING
Microprocessor interfacing to the AD5593R is via a serial bus using
a standard I2C protocol. The communications channel requires a
2-wire interface consisting of a clock signal and a data signal.
AD5593R TO ADSP-BF537 INTERFACE
The I2C interface of the AD5593R is designed to be easily connected to industry-standard DSPs and microcontrollers. Figure 43
shows the AD5593R connected to the Analog Devices Blackfin®
DSP. The Blackfin has an integrated I2C port that can be connected
directly to the I2C pins of the AD5593R.
Figure 43. ADSP-BF537 Interface
LAYOUT GUIDELINES
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure the
rated performance. The printed circuit board (PCB) on which the
AD5593R is mounted must be designed so that the AD5593R lies
on the analog plane.
The AD5593R must have ample supply bypassing of 10 µF in
parallel with 0.1 µF on each supply, located as close to the package as possible, ideally right up against the device. The 10 µF
capacitors are the tantalum bead type. The 0.1 µF capacitor must
have low effective series resistance (ESR) and low effective series
inductance (ESI) such as the common ceramic types, which provide
a low impedance path to ground at high frequencies to handle
transient currents due to internal logic switching.
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Rev. F | 28 of 48
Data Sheet
AD5593R
REGISTER MAP
The AD5593R has programmable user configuration registers that
are used to configure the device. Table 8 shows a complete list of
the pointer byte registers that select the operation to be executed.
See Table 9 and the Register Details: AD5593R Pointer Byte Map
section for details about the functions of each of the bits.
See the Register Details: AD5593R Control Register Map section
for details about the functions of each of the bits.
The Register Details: AD5593R ADC and DAC Readback section
provides data formats for the ADC and the DAC readback.
Table 10 shows a complete list of the control registers that configure the I/O pins and various operating parameters in the AD5593R.
REGISTER SUMMARY: AD5593R POINTER BYTE MAP
Table 8. POINTER_BYTE Register Summary
Pointer Byte Bits[7:4]
Name
Description
0x0
CONFIG_MODE_POINTER
Configuration mode.
0x1
DAC_WR_POINTER
DAC write mode.
0x2
ADC_RD_POINTER
ADC readback mode.
0x3
DAC_RD_POINTER
DAC readback mode.
0x4
GPIO_RD_POINTER
GPIO readback mode.
0x5
REG_RD_POINTER
Register readback mode.
REGISTER SUMMARY (BIT-WISE): AD5593R POINTER BYTE MAP
Table 9. AD5593R_POINTER MAP Register Summary
Mode Bits
Mode Dependent Data Bits
Mode Bits
Bits[7:4]
Name
Bits
0x0
CONFIG_MODE_POINTER
[7:0]
CONFIG_MODE_SEL
CONFIG_MODE_BITS
0x1
DAC_WR_POINTER
[7:0]
DAC_WR_SEL
DAC_CH_SEL_WR
0x2
ADC_RD_POINTER
[7:0]
ADC_RD_SEL
RESERVED
0x3
DAC_RD_POINTER
[7:0]
DAC_RD_SEL
DAC_CH_SEL_RD
0x4
GPIO_RD_POINTER
[7:0]
GPIO_RD_SEL
RESERVED
0x5
REG_RD_POINTER
[7:0]
REG_RD_SEL
REG_SEL_RD
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
REGISTER SUMMARY: AD5593R CONTROL REGISTER MAP
Table 10. AD5593R_CORE Register Summary
Pointer Byte Bits[7:0]
Name
Description
Reset Data Bits[15:0]
0x00
NOP
NOP.
0x0000
0x02
ADC_SEQ
ADC Sequence Register.
0x0000
0x03
GEN_CTRL_REG
General-Purpose Control Register.
0x0000
0x04
ADC_CONFIG
ADC Pin Configuration Register.
0x0000
0x05
DAC_CONFIG
DAC Pin Configuration Register.
0x0000
0x06
PULLDWN_CONFIG
Pull-Down Configuration Register.
0x00FF
0x07
LDAC_MODE
LDAC Mode Register.
0x0000
0x08
GPIO_CONFIG
GPIO Write Configuration Register.
0x0000
0x09
GPIO_OUTPUT
GPIO Write Data Register.
0x0000
0x0A
GPIO_INPUT
GPIO Read Configuration Register.
0x0000
0x0B
PD_REF_CTRL
Power-Down/Reference Control Register.
0x0000
0x0C
GPIO_OPENDRAIN_CONFIG
GPIO Open-Drain Configuration Register.
0x0000
0x0D
IO_TS_CONFIG
Three-State Configuration Register.
0x0000
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Rev. F | 29 of 48
Data Sheet
AD5593R
REGISTER MAP
Table 10. AD5593R_CORE Register Summary
Pointer Byte Bits[7:0]
Name
Description
Reset Data Bits[15:0]
0x0F
SW_RESET
Software Reset.
0x0000
0x10
DAC_WR
DAC Write Register.
0x0000
REGISTER DETAILS: AD5593R POINTER BYTE MAP
Configuration Mode Register
Reset: 0x00, Name: CONFIG_MODE_POINTER
Pointer byte configuration register.
Table 11. Bit Descriptions for CONFIG_MODE_POINTER
Bits
Bit Name
Description
Reset
Access
[7:4]
CONFIG_MODE_SEL
Configuration mode address.
0x0
W
[3:0]
CONFIG_MODE_BITS
Configuration mode dependent data bits.
0x0
W
0000: NOP. No operation.
0010: ADC sequence register. Selects ADCs for conversion.
0011: General-purpose control register. DAC and ADC control register.
0100: ADC pin configuration. Selects which pins are ADC inputs.
0101: DAC pin configuration. Selects which pins are DAC outputs.
0110: Pull-down configuration. Selects which pins have an 85 kΩ pull-down resistor to GND.
0111: LDAC mode. Selects the operation of the load DAC.
1000: GPIO write configuration. Selects which pins are general-purpose outputs.
1001: GPIO write data. Writes data to general-purpose outputs.
1010: GPIO read configuration. Selects which pins are general-purpose inputs.
1011: Power-down/reference control. Powers down the DACs and enables/disables the reference.
1100: Open-drain configuration. Selects open-drain or push-pull for general-purpose outputs.
1101: Three-state pins. Selects which pins are three-stated.
1111: Software reset. Resets the AD5593R.
DAC Write Mode Register
Reset: 0x10, Name: DAC_WR_POINTER
Table 12. Bit Descriptions for DAC_WR_POINTER
Bits
Bit Name
Description
Reset
Access
[7:4]
DAC_WR_SEL
DAC write mode address.
0x1
W
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Rev. F | 30 of 48
Data Sheet
AD5593R
REGISTER MAP
Table 12. Bit Descriptions for DAC_WR_POINTER
Bits
Bit Name
Description
Reset
Access
[3:0]
DAC_CH_SEL_WR
Select DAC channel for input register write.
0x0
W
000: DAC0.
001: DAC1.
010: DAC2.
011: DAC3.
100: DAC4.
101: DAC5.
110: DAC6.
111: DAC7.
ADC Readback Mode Register
Reset: 0x40, Name: ADC_RD_POINTER
Table 13. Bit Descriptions for ADC_RD_POINTER
Bits
Bit Name
Description
Reset
Access
[7:4]
ADC_RD_SEL
ADC readback mode address.
0x4
W
[3:0]
RESERVED
Reserved.
0x0
R
DAC Readback Mode Register
Reset: 0x50, Name: DAC_RD_POINTER
Table 14. Bit Descriptions for DAC_RD_POINTER
Bits
Bit Name
Description
Reset
Access
[7:4]
DAC_RD_SEL
DAC readback mode address.
0x5
W
[3:0]
DAC_CH_SEL_RD
Select DAC channel for input register readback.
0x0
W
000: DAC0.
001: DAC1.
010: DAC2.
011: DAC3.
100: DAC4.
101: DAC5.
110: DAC6.
111: DAC7.
analog.com
Rev. F | 31 of 48
Data Sheet
AD5593R
REGISTER MAP
GPIO Readback Mode Register
Reset: 0x60, Name: GPIO_RD_POINTER
Table 15. Bit Descriptions for GPIO_RD_POINTER
Bits
Bit Name
Description
Reset
Access
[7:4]
GPIO_RD_SEL
GPIO readback mode address.
0x6
W
[3:0]
RESERVED
Reserved.
0x0
R
Register Readback Mode
Reset: 0x70, Name: REG_RD_POINTER
Table 16. Bit Descriptions for REG_RD_POINTER
Bits
Bit Name
Description
Reset
Access
[7:4]
REG_RD_SEL
Register readback mode address.
0x7
W
[3:0]
REG_SEL_RD
Select control register for register readback.
0x0
W
0000: NOP.
0010: ADC sequence register.
0011: General-purpose control register.
0100: ADC pin configuration.
0101: DAC pin configuration.
0110: Pull-down configuration.
0111: LDAC mode.
1000: GPIO write configuration.
1001: GPIO write data.
1010: GPIO read configuration.
1011: Power-down/reference control.
1100: Open-drain configuration.
1101: Three-state pins.
REGISTER DETAILS: AD5593R CONTROL REGISTER MAP
NOP Register
Reset: 0x0000, Name: NOP
No operation.
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Rev. F | 32 of 48
Data Sheet
AD5593R
REGISTER MAP
Table 17. Bit Descriptions for NOP
Bits
Bit Name
Description
Reset
Access
[15:11]
RESERVED
Reserved.
0x0
R
[10:0]
NOP
No operation.
0x0
R/W
ADC Sequence Register
Reset: 0x0000, Name: ADC_SEQ
Selects ADCs for conversion.
Table 18. Bit Descriptions for ADC_SEQ
Bits
Bit Name
Description
Reset
Access
[15:10]
RESERVED
Reserved.
0x0
R
9
REP
ADC sequence repetition.
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0: Sequence repetition disabled.
1: Sequence repetition enabled.
8
TEMP
Include temperature indicator in ADC sequence.
0: Disable temperature indicator readback.
1: Enable temperature indicator readback.
7
ADC7
Include the ADC7 channel in conversion sequence.
0: The selected ADC channel is not included in the conversion sequence.
1: Include the selected ADC channel in the conversion sequence.
6
ADC6
Include the ADC6 channel in conversion sequence.
0: The selected ADC channel is not included in the conversion sequence.
1: Include the selected ADC channel in the conversion sequence.
5
ADC5
Include the ADC5 channel in conversion sequence.
0: The selected ADC channel is not included in the conversion sequence.
analog.com
Rev. F | 33 of 48
Data Sheet
AD5593R
REGISTER MAP
Table 18. Bit Descriptions for ADC_SEQ
Bits
Bit Name
Description
Reset
Access
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
1: Include the selected ADC channel in the conversion sequence.
4
ADC4
Include the ADC4 channel in conversion sequence.
0: The selected ADC channel is not included in the conversion sequence.
1: Include the selected ADC channel in the conversion sequence.
3
ADC3
Include the ADC3 channel in conversion sequence.
0: The selected ADC channel is not included in the conversion sequence.
1: Include the selected ADC channel in the conversion sequence.
2
ADC2
Include the ADC2 channel in conversion sequence.
0: The selected ADC channel is not included in the conversion sequence.
1: Include the selected ADC channel in the conversion sequence.
1
ADC1
Include the ADC1 channel in conversion sequence.
0: The selected ADC channel is not included in the conversion sequence.
1: Include the selected ADC channel in the conversion sequence.
0
ADC0
Include the ADC0 channel in conversion sequence.
0: The selected ADC channel is not included in the conversion sequence.
1: Include the selected ADC channel in the conversion sequence.
General-Purpose Control Register
Reset: 0x0000, Name: GEN_CTRL_REG
DAC and ADC control register.
Table 19. Bit Descriptions for GEN_CTRL_REG
Bits
Bit Name
Description
Reset
Access
[15:10]
RESERVED
Reserved.
0x0
R
9
ADC_BUF_PRECH
ADC buffer precharge.
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0: ADC buffer is not used to precharge the ADC. If the ADC buffer is enabled, it is always powered up.
1: ADC buffer is used to precharge the ADC. If the ADC buffer is enabled, it is powered up while the
conversion takes place and then powered down until the next conversion takes place.
8
ADC_BUF_EN
ADC buffer enable.
0: ADC buffer is disabled.
1: ADC buffer is enabled.
7
IO_LOCK
Lock configuration.
0: The contents of the I/Ox pin configuration register can be changed.
1: The contents of the I/Ox pin configuration register cannot be changed.
6
ALL_DAC
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Write all DACs.
Rev. F | 34 of 48
Data Sheet
AD5593R
REGISTER MAP
Table 19. Bit Descriptions for GEN_CTRL_REG
Bits
Bit Name
Description
Reset
Access
0x0
R/W
0x0
R/W
0x0
R
0: For future DAC writes, the DAC address bits determine which DAC is written to.
1: For future DAC writes, the DAC address bits are ignored, and all channels configured as DACs are
updated with the same data.
5
ADC_RANGE
ADC input range select.
0: ADC gain is 0 V to VREF.
1: ADC gain is 0 V to 2 × VREF.
4
DAC_RANGE
DAC output range select.
0: DAC output range is 0 V to VREF.
1: DAC output range is 0 V to 2 × VREF.
[3:0]
RESERVED
Reserved.
ADC Pin Configuration Register
Reset: 0x0000, Name: ADC_CONFIG
Selects which pins are ADC inputs.
Table 20. Bit Descriptions for ADC_CONFIG
Bits
Bit Name
Description
Reset
Access
[15:8]
RESERVED
Reserved.
0x0
R
7
ADC7
Select the I/O7 pin as ADC input.
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is an ADC input.
6
ADC6
Select the I/O6 pin as ADC input.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is an ADC input.
5
ADC5
Select the I/O5 pin as ADC input.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is an ADC input.
4
ADC4
Select the I/O4 pin as ADC input.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is an ADC input.
3
ADC3
Select the I/O3 pin as ADC input.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is an ADC input.
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Rev. F | 35 of 48
Data Sheet
AD5593R
REGISTER MAP
Table 20. Bit Descriptions for ADC_CONFIG
Bits
Bit Name
Description
Reset
Access
2
ADC2
Select the I/O2 pin as ADC input.
0x0
R/W
0x0
R/W
0x0
R/W
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is an ADC input.
1
ADC1
Select the I/O1 pin as ADC input.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is an ADC input.
0
ADC0
Select the I/O0 pin as ADC input.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is an ADC input.
DAC Pin Configuration Register
Reset: 0x0000, Name: DAC_CONFIG
Selects which pins are DAC outputs.
Table 21. Bit Descriptions for DAC_CONFIG
Bits
Bit Name
Description
Reset
Access
[15:8]
RESERVED
Reserved.
0x0
R
7
DAC7
Select the I/O7 pin as DAC output.
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a DAC output.
6
DAC6
Select the I/O6 pin as DAC output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a DAC output.
5
DAC5
Select the I/O5 pin as DAC output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a DAC output.
4
DAC4
Select the I/O4 pin as DAC output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a DAC output.
3
DAC3
Select the I/O3 pin as DAC output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a DAC output.
2
DAC2
analog.com
Select the I/O2 pin as DAC output.
Rev. F | 36 of 48
Data Sheet
AD5593R
REGISTER MAP
Table 21. Bit Descriptions for DAC_CONFIG
Bits
Bit Name
Description
Reset
Access
0x0
R/W
0x0
R/W
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a DAC output.
1
DAC1
Select the I/O1 pin as DAC output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a DAC output.
0
DAC0
Select the I/O0 pin as DAC output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a DAC output.
Pull-Down Configuration Register
Reset: 0x00FF, Name: PULLDWN_CONFIG
Selects which pins have a 85 kΩ pull-down resistor to GND.
Table 22. Bit Descriptions for PULLDWN_CONFIG
Bits
Bit Name
Description
Reset
Access
[15:8]
RESERVED
Reserved.
0x0
R
7
PULL_DWN_7
Set the I/O7 pin as weak pull-down output.
0x1
R/W
0x1
R/W
0x1
R/W
0x1
R/W
0x1
R/W
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is connected to GND via an 85 kΩ pull-down resistor.
6
PULL_DWN_6
Set the I/O6 pin as weak pull-down output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is connected to GND via an 85 kΩ pull-down resistor.
5
PULL_DWN_5
Set the I/O5 pin as weak pull-down output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is connected to GND via an 85 kΩ pull-down resistor.
4
PULL_DWN_4
Set the I/O4 pin as weak pull-down output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is connected to GND via an 85 kΩ pull-down resistor.
3
PULL_DWN_3
Set the I/O3 pin as weak pull-down output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is connected to GND via an 85 kΩ pull-down resistor.
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Rev. F | 37 of 48
Data Sheet
AD5593R
REGISTER MAP
Table 22. Bit Descriptions for PULLDWN_CONFIG
Bits
Bit Name
Description
Reset
Access
2
PULL_DWN_2
Set the I/O2 pin as weak pull-down output.
0x1
R/W
0x1
R/W
0x1
R/W
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is connected to GND via an 85 kΩ pull-down resistor.
1
PULL_DWN_1
Set the I/O1 pin as weak pull-down output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is connected to GND via an 85 kΩ pull-down resistor.
0
PULL_DWN_0
Set the I/O0 pin as weak pull-down output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is connected to GND via an 85 kΩ pull-down resistor.
LDAC Mode Register
Reset: 0x0000, Name: LDAC_MODE
Selects the operation of the load DAC (LDAC) function.
Table 23. Bit Descriptions for LDAC_MODE
Bits
Bit Name
Description
Reset
Access
[15:2]
RESERVED
Reserved.
0x0
R
[1:0]
LDAC_MODE
Determines how data written to an input register of a DAC is handled.
0x0
R/W
00: Data written to an input register is immediately copied to a DAC register, and the DAC output updates.
01: Data written to an input register is not copied to a DAC register. The DAC output is not updated.
10: Data in the input registers is copied to the corresponding DAC registers. When the data has been
transferred, the DAC outputs are updated simultaneously.
GPIO Write Configuration Register
Reset: 0x0000, Name: GPIO_CONFIG
Selects which pins are general-purpose outputs.
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Rev. F | 38 of 48
Data Sheet
AD5593R
REGISTER MAP
Table 24. Bit Descriptions for GPIO_CONFIG
Bits
Bit Name
Description
Reset
Access
[15:8]
RESERVED
Reserved.
0x0
R
7
GPIO7
Select the I/O7 pin as GPIO output.
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose output pin.
6
GPIO6
Select the I/O6 pin as GPIO output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose output pin.
5
GPIO5
Select the I/O5 pin as GPIO output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose output pin.
4
GPIO4
Select the I/O4 pin as GPIO output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose output pin.
3
GPIO3
Select the I/O3 pin as GPIO output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose output pin.
2
GPIO2
Select the I/O2 pin as GPIO output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose output pin.
1
GPIO1
Select the I/O1 pin as GPIO output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose output pin.
0
GPIO0
Select the I/O0 pin as GPIO output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose output pin.
GPIO Write Data Register
Reset: 0x0000, Name: GPIO_OUTPUT
Writes data to the general-purpose outputs.
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Rev. F | 39 of 48
Data Sheet
AD5593R
REGISTER MAP
Table 25. Bit Descriptions for GPIO_OUTPUT
Bits
Bit Name
Description
Reset
Access
[15:8]
RESERVED
Reserved.
0x0
R
7
GPIO7
Set the GPIO7 output pin as logic high or low.
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0: The I/O pin is a Logic 0 output.
1: The I/O pin is a Logic 1 output.
6
GPIO6
Set the GPIO6 output pin as logic high or low.
0: The I/O pin is a Logic 0 output.
1: The I/O pin is a Logic 1 output.
5
GPIO5
Set the GPIO5 output pin as logic high or low.
0: The I/O pin is a Logic 0 output.
1: The I/O pin is a Logic 1 output.
4
GPIO4
Set the GPIO4 output pin as logic high or low.
0: The I/O pin is a Logic 0 output.
1: The I/O pin is a Logic 1 output.
3
GPIO3
Set the GPIO3 output pin as logic high or low.
0: The I/O pin is a Logic 0 output.
1: The I/O pin is a Logic 1 output.
2
GPIO2
Set the GPIO2 output pin as logic high or low.
0: The I/O pin is a Logic 0 output.
1: The I/O pin is a Logic 1 output.
1
GPIO1
Set the GPIO1 output pin as logic high or low.
0: The I/O pin is a Logic 0 output.
1: The I/O pin is a Logic 1 output.
0
GPIO0
Set the GPIO0 output pin as logic high or low.
0: The I/O pin is a Logic 0 output.
1: The I/O pin is a Logic 1 output.
GPIO Read Configuration Register
Reset: 0x0000, Name: GPIO_INPUT
Selects which pins are general-purpose inputs.
Table 26. Bit Descriptions for GPIO_INPUT
Bits
Bit Name
Description
Reset
Access
[15:8]
RESERVED
Reserved.
0x0
R
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Rev. F | 40 of 48
Data Sheet
AD5593R
REGISTER MAP
Table 26. Bit Descriptions for GPIO_INPUT
Bits
Bit Name
Description
Reset
Access
7
GPIO7
Set the I/O7 pin as GPIO input.
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose input pin.
6
GPIO6
Set the I/O6 pin as GPIO input.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose input pin.
5
GPIO5
Set the I/O5 pin as GPIO input.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose input pin.
4
GPIO4
Set the I/O4 pin as GPIO input.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose input pin.
3
GPIO3
Set the I/O3 pin as GPIO input.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose input pin.
2
GPIO2
Set the I/O2 pin as GPIO input.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose input pin.
1
GPIO1
Set the I/O1 pin as GPIO input.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose input pin.
0
GPIO0
Set the I/O0 pin as GPIO input.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a general-purpose input pin.
Power-Down/Reference Control Register
Reset: 0x0000, Name: PD_REF_CTRL
Powers down DACs and enables/disables the reference.
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Rev. F | 41 of 48
Data Sheet
AD5593R
REGISTER MAP
Table 27. Bit Descriptions for PD_REF_CTRL
Bits
Bit Name
Description
Reset
Access
[15:11]
RESERVED
Reserved.
0x0
R
10
PD_ALL
Power down DACs and Internal Reference.
0x0
R/W
0x0
R/W
0: The reference and DACs power-down states are determined by EN_REF and PD7 to PD0 bits.
1: The reference, DACs and ADC are powered down.
9
EN_REF
Enable internal reference. Set this bit to 0 if an external reference is used.
0: The reference and its buffer are powered down.
1: The reference and its buffer are powered up. The reference is available on the VREF pin.
8
RESERVED
Reserved.
0x0
R
7
PD7
Power down the DAC7 channel.
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0: The channel is in normal operating mode.
1: The channel is powered down if it is configured as a DAC.
6
PD6
Power down the DAC6 channel.
0: The channel is in normal operating mode.
1: The channel is powered down if it is configured as a DAC.
5
PD5
Power down the DAC5 channel.
0: The channel is in normal operating mode.
1: The channel is powered down if it is configured as a DAC.
4
PD4
Power down the DAC4 channel.
0: The channel is in normal operating mode.
1: The channel is powered down if it is configured as a DAC.
3
PD3
Power down the DAC3 channel.
0: The channel is in normal operating mode.
1: The channel is powered down if it is configured as a DAC.
2
PD2
Power down the DAC2 channel.
0: The channel is in normal operating mode.
1: The channel is powered down if it is configured as a DAC.
1
PD1
Power down the DAC1 channel.
0: The channel is in normal operating mode.
1: The channel is powered down if it is configured as a DAC.
0
PD0
Power down the DAC0 channel.
0: The channel is in normal operating mode.
1: The channel is powered down if it is configured as a DAC.
GPIO Open-Drain Configuration Register
Reset: 0x0000, Name: GPIO_OPENDRAIN_CONFIG
Selects open-drain or push/pull for general-purpose outputs. The selected I/Ox pin must be set as digital output pin in the GPIO_CONFIG
register.
analog.com
Rev. F | 42 of 48
Data Sheet
AD5593R
REGISTER MAP
Table 28. Bit Descriptions for GPIO_OPENDRAIN_CONFIG
Bits
Bit Name
Description
Reset
Access
[15:8]
RESERVED
Reserved.
0x0
R
7
GPIO7
Set the I/O7 pin as open-drain.
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0: The I/O pin is a push/pull output pin.
1: The I/O pin is an open-drain output pin.
6
GPIO6
Set the I/O6 pin as open-drain.
0: The I/O pin is a push/pull output pin.
1: The I/O pin is an open-drain output pin.
5
GPIO5
Set the I/O5 pin as open-drain.
0: The I/O pin is a push/pull output pin.
1: The I/O pin is an open-drain output pin.
4
GPIO4
Set the I/O4 pin as open-drain.
0: The I/O pin is a push/pull output pin.
1: The I/O pin is an open-drain output pin.
3
GPIO3
Set the I/O3 pin as open-drain.
0: The I/O pin is a push/pull output pin.
1: The I/O pin is an open-drain output pin.
2
GPIO2
Set the I/O2 pin as open-drain.
0: The I/O pin is a push/pull output pin.
1: The I/O pin is an open-drain output pin.
1
GPIO1
Set the I/O1 pin as open-drain.
0: The I/O pin is a push/pull output pin.
1: The I/O pin is an open-drain output pin.
0
GPIO0
Set the I/O0 pin as open-drain.
0: The I/O pin is a push/pull output pin.
1: The I/O pin is an open-drain output pin.
Three-State Configuration Register
Reset: 0x0000, Name: IO_TS_CONFIG
Selects which pins are three-state.
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Rev. F | 43 of 48
Data Sheet
AD5593R
REGISTER MAP
Table 29. Bit Descriptions for IO_TS_CONFIG
Bits
Bit Name
Description
Reset
Access
[15:8]
RESERVED
Reserved.
0x0
R
7
TS7
Set the I/O7 pin as three-state output.
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0x0
R/W
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a three-state output pin.
6
TS6
Set the I/O6 pin as three-state output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a three-state output pin.
5
TS5
Set the I/O5 pin as three-state output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a three-state output pin.
4
TS4
Set the I/O4 pin as three-state output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a three-state output pin.
3
TS3
Set the I/O3 pin as three-state output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a three-state output pin.
2
TS2
Set the I/O2 pin as three-state output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a three-state output pin.
1
TS1
Set the I/O1 pin as three-state output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a three-state output pin.
0
TS0
Set the I/O0 pin as three-state output.
0: The I/O pin function is determined by the pin configuration registers.
1: The I/O pin is a three-state output pin.
Software Reset Register
Reset: 0x0000, Name: SW_RESET
Resets the AD5593R.
analog.com
Rev. F | 44 of 48
Data Sheet
AD5593R
REGISTER MAP
Table 30. Bit Descriptions for SW_RESET
Bits
Bit Name
Description
Reset
Access
[15:11]
RESERVED
Reserved.
0x0
R
[10:0]
SW_RESET
Write to RESET register.
0x0
R/W
10110101100: Reset the AD5593R.
DAC Write Register
Reset: 0x0000, Name: DAC_WR
Writes to addressed DAC register.
Table 31. Bit Descriptions for DAC_WR
Bits
Bit Name
Description
Reset
Access
[15:12]
[11:0]
RESERVED
DAC_DATA_WR
Reserved.
12-bit DAC data.
0x0
0x0
R
R/W
REGISTER DETAILS: AD5593R ADC AND DAC READBACK
DAC Data Readback Register
Name: DAC_DATA_RD
Read back the 12-bit DAC input register data.
Table 32. Bit Descriptions for DAC_DATA_RD
Bits
Bit Name
Description
Reset
15
MSB
MSB.
0x1
[14:12]
DAC_ADDR
DAC Address.
0x0
000: DAC0.
001: DAC1.
010: DAC2.
011: DAC3.
100: DAC4.
101: DAC5.
110: DAC6.
111: DAC7.
[11:0]
DAC_DATA
analog.com
12-bit DAC Input Register Data.
0x0
Rev. F | 45 of 48
Data Sheet
AD5593R
REGISTER MAP
ADC Conversion Result Register
Name: ADC_RESULT
ADC conversion result.
Table 33. Bit Descriptions for ADC_RESULT
Bits
Bit Name
Description
Reset
15
MSB
MSB.
0x0
[14:12]
ADC_ADDR
ADC address.
0x0
000: ADC0.
001: ADC1.
010: ADC2.
011: ADC3.
100: ADC4.
101: ADC5.
110: ADC6.
111: ADC7.
[11:0]
ADC_DATA
12-bit ADC result.
0x0
Temperature Reading Register
Name: TMP_SENSE_RESULT
Temperature reading.
Table 34. Bit Descriptions for TMP_SENSE_RESULT
Bits
Bit Name
Description
Reset
[15:12]
TMPSENSE_ADDR
Temperature Indicator Address.
0x8
[11:0]
ADC_DATA
12-bit ADC Result.
0x0
analog.com
Rev. F | 46 of 48
Data Sheet
AD5593R
OUTLINE DIMENSIONS
Figure 44. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
Figure 45. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-16-32)
Dimensions shown in millimeters
Figure 46. 16-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-16-3)
Dimensions shown in millimeters
analog.com
Rev. F | 47 of 48
Data Sheet
AD5593R
OUTLINE DIMENSIONS
Updated: August 18, 2022
ORDERING GUIDE
Model1
Temperature Range
Package Description
Packing Quantity
AD5593RBCBZ-RL7
AD5593RBCPZ-RL7
AD5593RBRUZ
AD5593RBRUZ-RL7
-40°C to +105°C
-40°C to +105°C
-40°C to +105°C
-40°C to +105°C
16-Ball WLCSP (1.96mm x 1.96mm)
16-Lead LFCSP (3mm x 3mm x 0.75mm)
16-Lead TSSOP
16-Lead TSSOP
Reel, 3000
Reel, 1500
1
Reel, 1000
Package
Option
CB-16-3
CP-16-32
RU-16
RU-16
Marking Code
DM6
Z = RoHS Compliant Part.
EVALUATION BOARDS
Model1
Description
EVAL-AD5593RSDZ
EVAL-SDP-CB1Z
Evaluation Board
Controller Board
1
Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2014-2022 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
One Analog Way, Wilmington, MA 01887-2356, U.S.A.
Rev. F | 48 of 48