Quad, 16-/12-Bit nanoDAC+
with I2C Interface
AD5696/AD5694
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
VDD
GND
VREF
AD5696/AD5694
VLOGIC
INPUT
REGISTER
DAC
REGISTER
STRING
DAC A
SCL
VOUTA
BUFFER
INTERFACE LOGIC
SDA
A1
A0
INPUT
REGISTER
DAC
REGISTER
STRING
DAC B
VOUTB
BUFFER
INPUT
REGISTER
DAC
REGISTER
STRING
DAC C
VOUTC
BUFFER
INPUT
REGISTER
DAC
REGISTER
STRING
DAC D
VOUTD
BUFFER
LDAC RESET
APPLICATIONS
POWER-ON
RESET
GAIN =
×1/×2
RSTSEL
GAIN
POWERDOWN
LOGIC
Figure 1.
Digital gain and offset adjustment
Programmable attenuators
Process control (PLC I/O cards)
Industrial automation
Data acquisition systems
GENERAL DESCRIPTION
The AD5696 and AD5694, members of the nanoDAC+™ family,
are low power, quad, 16-/12-bit buffered voltage output DACs.
The devices include a gain select pin giving a full-scale output
of 2.5 V (gain = 1) or 5 V (gain = 2). The devices operate from
a single 2.7 V to 5.5 V supply, are guaranteed monotonic by
design, and exhibit less than 0.1% FSR gain error and 1.5 mV
offset error performance. The devices are available in a 3 mm ×
3 mm LFCSP package and in a TSSOP package.
Table 1. Quad nanoDAC+ Devices
The AD5696/AD5694 incorporate a power-on reset circuit and a
RSTSEL pin; the RSTSEL pin ensures that the DAC outputs power
up to zero scale or midscale and remain at that level until a
valid write takes place. The parts contain a per-channel powerdown feature that reduces the current consumption of the
device in power-down mode to 4 μA at 3 V.
1.
The AD5696/AD5694 use a versatile 2-wire serial interface that
operates at clock rates up to 400 kHz and include a VLOGIC pin
intended for 1.8 V/3 V/5 V logic.
Rev. C
Interface
SPI
I2C
Reference
Internal
External
Internal
External
16-Bit
AD5686R
AD5686
AD5696R
AD5696
14-Bit
AD5685R
AD5695R
12-Bit
AD5684R
AD5684
AD5694R
AD5694
PRODUCT HIGHLIGHTS
2.
3.
High Relative Accuracy (INL).
AD5696 (16-bit): ±2 LSB maximum
AD5694 (12-bit): ±1 LSB maximum
Excellent DC Performance.
Total unadjusted error: ±0.1% of FSR maximum
Offset error: ±1.5 mV maximum
Gain error: ±0.1% of FSR maximum
Two Package Options.
3 mm × 3 mm, 16-lead LFCSP
16-lead TSSOP
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice.
No license is granted by implication or otherwise under any patent or patent rights of Analog
Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2012–2020 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
10799-001
High relative accuracy (INL): ±2 LSB maximum at 16 bits
Tiny package: 3 mm × 3 mm, 16-lead LFCSP
Total unadjusted error (TUE): ±0.1% of FSR maximum
Offset error: ±1.5 mV maximum
Gain error: ±0.1% of FSR maximum
High drive capability: 20 mA, 0.5 V from supply rails
User-selectable gain of 1 or 2 (GAIN pin)
Reset to zero scale or midscale (RSTSEL pin)
1.8 V logic compatibility
400 kHz I2C-compatible serial interface
4 I2C addresses available
Low glitch: 0.5 nV-sec
Low power: 1.8 mW at 3 V
2.7 V to 5.5 V power supply
−40°C to +105°C temperature range
AD5696/AD5694
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Write and Update Commands ................................................. 18
Applications ...................................................................................... 1
I2C Slave Address ....................................................................... 18
Functional Block Diagram .............................................................. 1
Serial Operation.......................................................................... 18
General Description ......................................................................... 1
Write Operation ......................................................................... 18
Product Highlights ........................................................................... 1
Read Operation .......................................................................... 19
Revision History ............................................................................... 2
Multiple DAC Readback Sequence.......................................... 19
Specifications .................................................................................... 3
Power-Down Operation............................................................ 20
AC Characteristics ....................................................................... 5
Load DAC (Hardware LDAC Pin) .......................................... 20
Timing Characteristics ................................................................ 6
LDAC Mask Register ................................................................. 21
Absolute Maximum Ratings ........................................................... 7
Hardware Reset Pin (RESET) ................................................... 21
Thermal Resistance ...................................................................... 7
Reset Select Pin (RSTSEL) ........................................................ 21
ESD Caution.................................................................................. 7
Applications Information ............................................................. 22
Pin Configurations and Function Descriptions ........................... 8
Microprocessor Interfacing ...................................................... 22
Typical Performance Characteristics ............................................. 9
AD5696/AD5694 to ADSP-BF531 Interface .......................... 22
Terminology .................................................................................... 14
Layout Guidelines ...................................................................... 22
Theory of Operation ...................................................................... 16
Galvanically Isolated Interface ................................................. 22
Digital-to-Analog Converter .................................................... 16
Outline Dimensions ....................................................................... 23
Transfer Function ...................................................................... 16
Ordering Guide .......................................................................... 24
DAC Architecture ...................................................................... 16
Serial Interface ............................................................................ 17
REVISION HISTORY
8/2020—Rev. B to Rev. C
Changes to Figure 2.......................................................................... 6
Updated Outline Dimensions ....................................................... 23
Changes to Ordering Guide .......................................................... 24
11/2016—Rev. A to Rev. B
Changes to Features Section ........................................................... 1
Changes to Specifications Section .................................................. 3
Changes to VLOGIC Parameter, Table 1 ........................................... 4
Changes to AC Characteristics Section ......................................... 5
Changes to Timing Characteristics Section .................................. 6
Changes to Table 5 ........................................................................... 7
Changes to VLOGIC Pin Description and RESET Pin Description,
Table 7 .................................................................................................8
Changes to Figure 9 ..........................................................................9
Changes to Figure 11 to Figure 16 ............................................... 10
Changes to Figure 17, Figure 19, and Figure 22 ........................ 11
Changes to Figure 24 ..................................................................... 12
Changes to Figure 29 ..................................................................... 13
Changes to Figure 38 ..................................................................... 19
Changes to Hardware Reset Pin (RESET) Section .................... 21
6/2013—Rev. 0 to Rev. A
Changes to Pin GAIN and Pin RSTSEL Descriptions; Table 7........8
7/2012—Revision 0: Initial Version
Rev. C | Page 2 of 24
Data Sheet
AD5696/AD5694
SPECIFICATIONS
VDD = 2.7 V to 5.5 V; VREF = 2.5 V; 1.62 V ≤ VLOGIC ≤ 5.5 V; RL = 2 kΩ; CL = 200 pF; all specifications TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter
STATIC PERFORMANCE2
AD5696
Resolution
Relative Accuracy
Min
A Grade
Typ
16
Min
B Grade
Typ
Max
Unit
±1
±1
±2
±3
±1
Bits
LSB
LSB
LSB
±1
±1
Bits
LSB
LSB
16
±2
±2
±8
±8
±1
±0.12
±2
±1
±0.12
4
±4
±0.2
±0.2
±0.25
±0.25
0.4
+0.1
+0.01
±0.02
±0.01
Differential Nonlinearity
AD5694
Resolution
Relative Accuracy
Differential Nonlinearity
Max
12
12
Zero-Code Error
Offset Error
Full-Scale Error
Gain Error
Total Unadjusted Error
0.4
+0.1
+0.01
±0.02
±0.01
Offset Error Drift3
Gain Temperature
Coefficient3
DC Power Supply Rejection
Ratio3
DC Crosstalk3
±1
±1
±1
±1
mV
mV
% of FSR
% of FSR
% of FSR
% of FSR
μV/°C
ppm
0.15
0.15
mV/V
±2
±2
μV
±3
±2
±3
±2
μV/mA
μV
OUTPUT CHARACTERISTICS3
Output Voltage Range
0
0
Capacitive Load Stability
Resistive Load4
Load Regulation
VREF
2 × VREF
2
10
1
REFERENCE INPUT
Reference Current
Reference Input Impedance
0
0
2
10
Short-Circuit Current5
Load Impedance at Rails6
Power-Up Time
Reference Input Range
VREF
2 × VREF
1.5
±1.5
±0.1
±0.1
±0.1
±0.2
1
V
V
nF
nF
kΩ
80
80
μV/mA
80
80
μV/mA
40
25
2.5
40
25
2.5
mA
Ω
μs
90
180
90
180
μA
μA
V
V
kΩ
kΩ
1
1
VDD
VDD/2
1
1
16
32
VDD
VDD/2
16
32
Rev. C | Page 3 of 24
Test Conditions/Comments1
Gain = 2
Gain = 1
Guaranteed monotonic by
design
Guaranteed monotonic by
design
All 0s loaded to DAC register
All 1s loaded to DAC register
Gain = 2
Gain = 1
Of FSR/°C
DAC code = midscale; VDD =
5 V ± 10%
Due to single channel, fullscale output change
Due to load current change
Due to power-down (per
channel)
Gain = 1
Gain = 2 (see Figure 20)
RL = ∞
RL = 1 kΩ
DAC code = midscale
5 V ± 10%; −30 mA ≤ IOUT ≤
+30 mA
3 V ± 10%; −20 mA ≤ IOUT ≤
+20 mA
See Figure 20
Coming out of power-down
mode; VDD = 5 V
VREF = VDD = 5.5 V, gain = 1
VREF = VDD = 5.5 V, gain = 2
Gain = 1
Gain = 2
Gain = 2
Gain = 1
AD5696/AD5694
Parameter
LOGIC INPUTS3
Input Current
Input Low Voltage, VINL
Input High Voltage, VINH
Pin Capacitance
LOGIC OUTPUTS (SDA)3
Output Low Voltage, VOL
Output High Voltage, VOH
Floating State Output
Capacitance
POWER REQUIREMENTS
VLOGIC
ILOGIC
VDD
Data Sheet
Min
A Grade
Typ
Max
Min
B Grade
Typ
±2
0.3 × VLOGIC
0.7 × VLOGIC
Max
Unit
Test Conditions/Comments1
±2
0.3 × VLOGIC
μA
V
V
pF
Per pin
0.4
V
V
pF
ISINK = 3 mA
ISOURCE = 3 mA
5.5
3
5.5
5.5
V
μA
V
V
0.7
4
6
mA
μA
μA
0.7 × VLOGIC
2
2
0.4
VLOGIC − 0.4
VLOGIC − 0.4
4
1.62
4
5.5
3
5.5
5.5
2.7
VREF + 1.5
1.62
2.7
VREF + 1.5
IDD
Normal Mode7
All Power-Down Modes8
0.59
1
0.7
4
6
0.59
1
1
Gain = 1
Gain = 2
VIH = VDD, VIL = GND, VDD =
2.7 V to 5.5 V
−40°C to +85°C
−40°C to +105°C
Temperature range is −40°C to +105°C.
DC specifications are tested with the outputs unloaded, unless otherwise noted. Upper dead band (10 mV) exists only when VREF = VDD with gain = 1 or when VREF/2 = VDD
with gain = 2. Linearity calculated using a reduced code range of 256 to 65,280 (AD5696) or 12 to 4080 (AD5694).
3
Guaranteed by design and characterization; not production tested.
4
Channel A and Channel B can have a combined output current of up to 30 mA. Similarly, Channel C and Channel D can have a combined output current of up to 30 mA
up to a junction temperature of 110°C.
5
VDD = 5 V. The device includes current limiting that is intended to protect the device during temporary overload conditions. Junction temperature can be exceeded
during current limit. Operation above the specified maximum junction temperature may impair device reliability.
6
When drawing a load current at either rail, the output voltage headroom with respect to that rail is limited by the 25 Ω typical channel resistance of the output devices.
For example, when sinking 1 mA, the minimum output voltage = 25 Ω × 1 mA = 25 mV (see Figure 20).
7
Interface inactive. All DACs active. DAC outputs unloaded.
8
All DACs powered down.
2
Rev. C | Page 4 of 24
Data Sheet
AD5696/AD5694
AC CHARACTERISTICS
VDD = 2.7 V to 5.5 V; VREF = 2.5 V; 1.62 V ≤ VLOGIC ≤ 5.5 V; RL = 2 kΩ; CL = 200 pF; all specifications TMIN to TMAX, unless otherwise noted.
Table 3.
Parameter1, 2
Output Voltage Settling Time
AD5696
AD5694
Slew Rate
Digital-to-Analog Glitch Impulse
Digital Feedthrough
Multiplying Bandwidth
Digital Crosstalk
Analog Crosstalk
DAC-to-DAC Crosstalk
Total Harmonic Distortion4
Output Noise Spectral Density
Output Noise
Signal-to-Noise Ratio (SNR)
Spurious-Free Dynamic Range (SFDR)
Signal-to-Noise-and-Distortion Ratio
(SINAD)
Min
Typ
Max
Unit
5
5
0.8
0.5
0.13
500
0.1
0.2
0.3
−80
100
6
90
83
80
8
7
μs
μs
V/μs
nV-sec
nV-sec
kHz
nV-sec
nV-sec
nV-sec
dB
nV/√Hz
μV p-p
dB
dB
dB
1
Guaranteed by design and characterization; not production tested.
See the Terminology section.
3
Temperature range is −40°C to +105°C; typical at 25°C.
4
Digitally generated sine wave at 1 kHz.
2
Rev. C | Page 5 of 24
Test Conditions/Comments3
¼ to ¾ scale settling to ±2 LSB
1 LSB change around major carry transition
At TA, BW = 20 kHz, VDD = 5 V, fOUT = 1 kHz
DAC code = midscale, 10 kHz, gain = 2
0.1 Hz to 10 Hz
At TA, BW = 20 kHz, VDD = 5 V, fOUT = 1 kHz
At TA, BW = 20 kHz, VDD = 5 V, fOUT = 1 kHz
At TA, BW = 20 kHz, VDD = 5 V, fOUT = 1 kHz
AD5696/AD5694
Data Sheet
TIMING CHARACTERISTICS
VDD = 2.7 V to 5.5 V; 1.62 V ≤ VLOGIC ≤ 5.5 V; all specifications TMIN to TMAX, unless otherwise noted.
Table 4.
Parameter1, 2
t1
t2
t3
t4
t5
t63
t7
t8
t9
t104
t114, 5
t12
t13
tSP6
CB 5
Min
2.5
0.6
1.3
0.6
100
0
0.6
0.6
1.3
0
20 + 0.1CB
20
400
0
Max
Unit
μs
μs
μs
μs
ns
μs
μs
μs
μs
ns
ns
ns
ns
ns
pF
0.9
300
300
50
400
Description
SCL cycle time
tHIGH, SCL high time
tLOW, SCL low time
tHD,STA, start/repeated start hold time
tSU,DAT, data setup time
tHD,DAT, data hold time
tSU,STA, repeated start setup time
tSU,STO, stop condition setup time
tBUF, bus free time between a stop condition and a start condition
tR, rise time of SCL and SDA when receiving
tF, fall time of SCL and SDA when transmitting/receiving
LDAC pulse width
SCL rising edge to LDAC rising edge
Pulse width of suppressed spike
Capacitive load for each bus line
1
See Figure 2.
Guaranteed by design and characterization; not production tested.
A master device must provide a hold time of at least 300 ns for the SDA signal (referred to the VIH min of the SCL signal) to bridge the undefined region of the SCL
falling edge.
4
tR and tF are measured from 0.3 × VDD to 0.7 × VDD.
5
CB is the total capacitance of one bus line in pF.
6
Input filtering on the SCL and SDA inputs suppresses noise spikes that are less than 50 ns.
2
3
Timing Diagram
START
CONDITION
REPEATED START
CONDITION
STOP
CONDITION
SDA
t9
t10
t11
t4
t1
t3
SCL
t4
t2
t6
t5
t7
t8
t12
t13
LDAC1
t12
LDAC2
10799-002
NOTES
1ASYNCHRONOUS
2SYNCHRONOUS
LDAC UPDATE MODE.
LDAC UPDATE MODE.
Figure 2. 2-Wire Serial Interface Timing Diagram
Rev. C | Page 6 of 24
Data Sheet
AD5696/AD5694
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE
Table 5.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. This
value was measured using a JEDEC standard 4-layer board with
zero airflow. For the LFCSP package, the exposed pad must be
tied to GND.
Parameter
VDD to GND
VLOGIC to GND
VOUT to GND
VREF to GND
Digital Input Voltage to GND1
SDA and SCL to GND
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Reflow Soldering Peak Temperature,
Pb Free (J-STD-020)
1
Rating
−0.3 V to +7 V
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VLOGIC + 0.3 V
−0.3 V to +7 V
−40°C to +105°C
−65°C to +150°C
125°C
260°C
Table 6. Thermal Resistance
Package Type
16-Lead LFCSP
16-Lead TSSOP
ESD CAUTION
Excluding SDA and SCL.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the
operational section of this specification is not implied.
Operation beyond the maximum operating conditions for
extended periods may affect product reliability.
Rev. C | Page 7 of 24
θJA
70
112.6
Unit
°C/W
°C/W
AD5696/AD5694
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
VOUTA 1
12 A1
GAIN 8
LDAC 7
SDA 6
VOUTD 5
A1
13
SCL
12
A0
VOUTC 6
11
VLOGIC
VOUTD 7
10
GAIN
SDA 8
9
LDAC
AD5696/
AD5694
TOP VIEW
(Not to Scale)
10799-006
TOP VIEW
(Not to Scale)
NOTES
1. THE EXPOSED PAD MUST BE TIED TO GND.
RESET
14
VDD 5
9 VLOGIC
VOUTC 4
RSTSEL
15
GND 4
10 A0
VDD 3
16
VOUTA 3
11 SCL
GND 2
VREF 1
VOUTB 2
10799-007
13 RESET
14 RSTSEL
16 VOUTB
15 VREF
AD5696/AD5694
Figure 4. Pin Configuration, 16-Lead TSSOP
Figure 3. Pin Configuration, 16-Lead LFCSP
Table 7. Pin Function Descriptions
LFCSP
1
2
3
Pin No.
TSSOP
3
4
5
Mnemonic
VOUTA
GND
VDD
4
5
6
6
7
8
VOUTC
VOUTD
SDA
7
9
LDAC
8
10
GAIN
9
10
11
11
12
13
VLOGIC
A0
SCL
12
13
14
15
A1
RESET
14
16
RSTSEL
15
16
17
1
2
N/A
VREF
VOUTB
EPAD
Description
Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
Ground Reference Point for All Circuitry on the Part.
Power Supply Input. The parts can be operated from 2.7 V to 5.5 V. The supply should be decoupled
with a 10 μF capacitor in parallel with a 0.1 μF capacitor to GND.
Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation.
Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation.
Serial Data Input. This pin is used in conjunction with the SCL line to clock data into or out of the
24-bit input shift register. SDA is a bidirectional, open-drain data line that should be pulled to the
supply with an external pull-up resistor.
LDAC can be operated in two modes, asynchronous update mode and synchronous update mode.
Pulsing this pin low allows any or all DAC registers to be updated if the input registers have new
data; all DAC outputs are simultaneously updated. This pin can also be tied permanently low.
Gain Select Pin. When this pin is tied to GND, all four DAC outputs have a span of 0 V to VREF.
When this pin is tied to VLOGIC, all four DAC outputs have a span of 0 V to 2 × VREF.
Digital Power Supply. Voltage ranges from 1.62 V to 5.5 V.
Address Input. Sets the first LSB of the 7-bit slave address.
Serial Clock Line. This pin is used in conjunction with the SDA line to clock data into or out of the
24-bit input shift register.
Address Input. Sets the second LSB of the 7-bit slave address.
Asynchronous Reset Input. The RESET input is falling edge sensitive. When RESET is activated
(low), the input register and the DAC register are updated with zero scale or midscale,
depending on the state of the RSTSEL pin. When RESET is low, all LDAC pulses are ignored. If the
pin is forced low at power-up, the POR circuit does not initialize correctly until the pin is released.
Power-On Reset Pin. When this pin is tied to GND, all four DACs are powered up to zero scale.
When this pin is tied to VLOGIC, all four DACs are powered up to midscale.
Reference Input Voltage.
Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
Exposed Pad. The exposed pad must be tied to GND.
Rev. C | Page 8 of 24
Data Sheet
AD5696/AD5694
1.0
8
0.8
6
0.6
4
0.4
2
0.2
0
–2
0
–0.2
–4
–0.4
–6
–0.6
V = 5V
–8 DD
TA = 25°C
REFERENCE = 2.5V
–10
0
10000
20000
VDD = 5V
TA = 25°C
REFERENCE = 2.5V
–0.8
30000
40000
50000
60000
CODE
–1.0
0
625
2500
3125
3750 4096
Figure 8. AD5694 DNL
10
10
8
8
6
6
4
4
ERROR (LSB)
2
0
–2
–4
2
INL
0
DNL
–2
–4
–6
–6
VDD = 5V
TA = 25°C
REFERENCE = 2.5V
0
625
1250
1875
2500
3125
3750 4096
CODE
VDD = 5V
REFERENCE = 2.5V
–10
–40
10
Figure 9. INL Error and DNL Error vs. Temperature
10
0.8
8
0.6
6
0.4
4
ERROR (LSB)
1.0
0.2
0
–0.2
2
–4
–6
50000
60000
–8 VDD = 5V
TA = 25°C
–10
0
0.5
1.0
10799-121
40000
DNL
–2
–0.6
CODE
INL
0
–0.4
30000
110
TEMPERATURE (°C)
Figure 6. AD5694 INL
V = 5V
–0.8 DD
TA = 25°C
REFERENCE = 2.5V
–1.0
0
10000
20000
60
10799-124
–10
–8
10799-120
–8
1.5
2.0
2.5
3.0
3.5
4.0
VREF (V)
Figure 7. AD5696 DNL
Figure 10. INL Error and DNL Error vs. VREF
Rev. C | Page 9 of 24
4.5
5.0
10799-125
INL (LSB)
1875
CODE
Figure 5. AD5696 INL
DNL (LSB)
1250
10799-123
DNL (LSB)
10
10799-118
INL (LSB)
TYPICAL PERFORMANCE CHARACTERISTICS
Data Sheet
10
0.10
8
0.08
6
0.06
4
0.04
ERROR (% of FSR)
2
INL
0
DNL
–2
–4
–6
0.02
GAIN ERROR
0
FULL-SCALE ERROR
–0.02
–0.04
–0.06
–8
TA = 25°C
REFERENCE = 2.5V
–10
2.7
3.2
3.7
–0.08
4.7
10799-126
4.2
TA = 25°C
REFERENCE = 2.5V
–0.10
2.7
3.2
3.7
5.2
SUPPLY VOLTAGE (V)
4.2
4.7
10799-129
ERROR (LSB)
AD5696/AD5694
5.2
SUPPLY VOLTAGE (V)
Figure 11. INL Error and DNL Error vs. Supply Voltage
Figure 14. Gain Error and Full-Scale Error vs. Supply Voltage
0.10
1.5
0.08
1.0
0.04
0.5
FULL-SCALE ERROR
0.02
0
ERROR (mV)
GAIN ERROR
–0.02
–0.06
OFFSET ERROR
0
20
40
60
80
100
120
TEMPERATURE (°C)
10799-127
–20
TA = 25°C
REFERENCE = 2.5V
–1.5
2.7
3.2
3.7
0.10
TOTAL UNADJUSTED ERROR (% of FSR)
1.2
1.0
0.8
0.6
ZERO-CODE ERROR
0.2
0
20
40
60
80
100
120
TEMPERATURE (°C)
10799-128
OFFSET ERROR
–20
5.2
Figure 15. Zero-Code Error and Offset Error vs. Supply Voltage
VDD = 5V
1.4 REFERENCE = 2.5V
0
–40
4.7
SUPPLY VOLTAGE (V)
Figure 12. Gain Error and Full-Scale Error vs. Temperature
0.4
4.2
10799-130
–1.0
VDD = 5V
REFERENCE = 2.5V
–0.10
–40
ERROR (mV)
0
–0.5
–0.04
–0.08
ZERO-CODE ERROR
VDD = 5V
0.09 REFERENCE = 2.5V
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
–40
–20
0
20
40
60
80
TEMPERATURE (°C)
Figure 16. TUE vs. Temperature
Figure 13. Zero-Code Error and Offset Error vs. Temperature
Rev. C | Page 10 of 24
100
120
10799-131
ERROR (% of FSR)
0.06
AD5696/AD5694
0.10
1.0
0.08
0.8
0.06
0.6
0.04
0.4
0.02
0.2
0
–0.02
–0.2
–0.04
–0.4
–0.06
–0.6
3.2
SOURCING, 2.7V
–0.8
TA = 25°C
REFERENCE = 2.5V
–0.10
2.7
SOURCING, 5V
3.7
4.2
4.7
5.2
–1.0
SUPPLY VOLTAGE (V)
0
5
25
30
7
VDD = 5V
6 TA = 25°C
REFERENCE = 2.5V
GAIN = 2
5
–0.01
–0.02
–0.03
0xFFFF
4
VOUT (V)
–0.04
–0.05
–0.06
0xC000
3
0x8000
2
0x4000
1
–0.07
0x0000
0
–0.08
–1
30000
40000
50000
–2
–0.06
10799-133
VDD = 5V
–0.09 T = 25°C
A
REFERENCE = 2.5V
–0.10
0
10000
20000
60000 65535
CODE
–0.04
–0.02
0
0.02
0.04
0.06
LOAD CURRENT (A)
Figure 21. Source and Sink Capability at 5 V
Figure 18. TUE vs. Code, AD5696
5
VDD = 5V
TA = 25°C
REFERENCE = 2.5V
4
20
3
VOUT (V)
15
VDD = 3V
TA = 25°C
GAIN = 1
EXTERNAL
REFERENCE = 2.5V
0xFFFF
0xC000
2
0x8000
1
0x4000
10
0x0000
0
5
0
540
560
580
600
IDD (µA)
620
640
Figure 19. IDD Histogram at 5 V
–2
–60
–40
–20
0
20
40
IOUT (mA)
Figure 22. Source and Sink Capability at 3 V
Rev. C | Page 11 of 24
60
10799-139
–1
10799-135
TOTAL UNADJUSTED ERROR (% of FSR)
20
Figure 20. Headroom/Footroom vs. Load Current
0
HITS
15
LOAD CURRENT (mA)
Figure 17. TUE vs. Supply Voltage, Gain = 1
25
10
10799-138
–0.08
SINKING, 5V
0
10799-200
ΔVOUT (V)
SINKING, 2.7V
10799-132
TOTAL UNADJUSTED ERROR (% of FSR)
Data Sheet
AD5696/AD5694
Data Sheet
3
1.4
VOUTA
VOUTB
VOUTC
VOUTD
1.2
2
VOUT (V)
0.8
FULL-SCALE
0.6
GAIN = 1
1
0.4
0.2
10
60
0
–5
10799-140
0
–40
110
TEMPERATURE (°C)
3.5
3.0
0
5
10
TIME (µs)
Figure 26. Exiting Power-Down to Midscale
Figure 23. Supply Current vs. Temperature
4.0
VDD = 5V
TA = 25°C
REFERENCE = 2.5V
10799-143
CURRENT (mA)
1.0
GAIN = 2
2.5008
VOUTA
VOUTB
VOUTC
VOUTD
2.5003
VOUT (V)
VOUT (V)
2.5
2.0
2.4998
1.5
CHANNEL B
TA = 25°C
VDD = 5.25V
REFERENCE = 2.5V
CODE = 0x7FFF TO 0x8000
ENERGY = 0.227206nV-sec
2.4993
40
80
160
2.4988
10799-141
VDD = 5V
0.5 TA = 25°C
REFERENCE = 2.5V
¼ TO ¾ SCALE
0
0
20
320
TIME (µs)
0
6
8
10
12
Figure 27. Digital-to-Analog Glitch Impulse
0.003
6
VOUTA
VOUTB
VOUTC
VOUTD
VDD
VOUTB
VOUTC
VOUTD
5
0.03
3
0.02
2
0.01
1
0
0
VDD (V)
4
VOUT AC-COUPLED (V)
0.002
0.04
0.001
0
TA = 25°C
REFERENCE = 2.5V
–0.01
–10
–5
0
5
10
TIME (µs)
–1
15
–0.002
0
5
10
15
TIME (µs)
Figure 28. Analog Crosstalk, VOUTA
Figure 25. Power-On Reset to 0 V
Rev. C | Page 12 of 24
20
25
10799-145
–0.001
10799-142
VOUT (V)
0.05
4
TIME (µs)
Figure 24. Settling Time
0.06
2
10799-144
1.0
Data Sheet
AD5696/AD5694
4.0
T
0nF
0.1nF
0.22nF
4.7nF
10nF
3.9
3.8
VDD = 5V
TA = 25°C
REFERENCE = 2.5V
VOUT (V)
3.7
1
3.6
3.5
3.4
3.3
3.2
VDD = 5V
TA = 25°C
REFERENCE = 2.5V
802mV
3.0
1.590
BANDWIDTH (dB)
–80
–100
–120
–140
FREQUENCY (Hz)
1.620
1.625
1.630
–20
–30
–40
–50
–160
10799-149
THD (dBV)
–60
2000 4000 6000 8000 10000 12000 14000 16000 18000 20000
1.615
–10
–40
0
1.610
0
–20
–180
1.605
Figure 31. Settling Time vs. Capacitive Load
VDD = 5V
TA = 25°C
REFERENCE = 2.5V
0
1.600
TIME (ms)
Figure 29. 0.1 Hz to 10 Hz Output Noise Plot
20
1.595
10799-150
A CH1
Figure 30. Total Harmonic Distortion at 1 kHz
VDD = 5V
TA = 25°C
REFERENCE = 2.5V, ±0.1V p-p
–60
10k
100k
1M
FREQUENCY (Hz)
Figure 32. Multiplying Bandwidth
Rev. C | Page 13 of 24
10M
10799-151
M1.0s
10799-146
CH1 2µV
3.1
AD5696/AD5694
Data Sheet
TERMINOLOGY
Relative Accuracy or Integral Nonlinearity (INL)
Relative accuracy or integral nonlinearity is a measurement of
the maximum deviation, in LSBs, from a straight line passing
through the endpoints of the DAC transfer function. Figure 5
and Figure 6 show typical INL vs. code plots.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between the measured
change and the ideal 1 LSB change between any two adjacent
codes. A specified differential nonlinearity of ±1 LSB maximum
ensures monotonicity. The AD5696/AD5694 are guaranteed
monotonic by design. Figure 7 and Figure 8 show typical DNL
vs. code plots.
Zero-Code Error
Zero-code error is a measurement of the output error when
zero code (0x0000) is loaded to the DAC register. Ideally, the
output should be 0 V. The zero-code error is always positive in
the AD5696/AD5694 because the output of the DAC cannot go
below 0 V due to a combination of the offset errors in the DAC
and the output amplifier. Zero-code error is expressed in mV.
Figure 13 shows a plot of zero-code error vs. temperature.
Full-Scale Error
Full-scale error is a measurement of the output error when fullscale code (0xFFFF) is loaded to the DAC register. Ideally, the
output should be VDD − 1 LSB. Full-scale error is expressed as a
percentage of the full-scale range (% of FSR). Figure 12 shows a
plot of full-scale error vs. temperature.
Gain Error
Gain error is a measurement of the span error of the DAC. It is
the deviation in slope of the DAC transfer characteristic from
the ideal expressed in % of FSR.
Gain Temperature Coefficient
Gain temperature coefficient is a measurement of the change in
gain error with changes in temperature. It is expressed in ppm
of FSR/°C.
Offset Error
Offset error is a measurement of the difference between VOUT
(actual) and VOUT (ideal) expressed in mV in the linear region
of the transfer function. It can be negative or positive.
Offset Error Drift
Offset error drift is a measurement of the change in offset error
with changes in temperature. It is expressed in μV/°C.
DC Power Supply Rejection Ratio (PSRR)
DC PSRR indicates how the output of the DAC is affected by
changes in the supply voltage. PSRR is the ratio of the change in
VOUT to a change in VDD for midscale output of the DAC. It is measured in mV/V. VREF is held at 2.5 V, and VDD is varied by
±10%.
Output Voltage Settling Time
The output voltage settling time is the amount of time it takes
for the output of a DAC to settle to a specified level for a ¼ to ¾
full-scale input change.
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the
analog output when the input code in the DAC register changes
state. It is normally specified as the area of the glitch in nV-sec
and is measured when the digital input code is changed by 1 LSB
at the major carry transition (0x7FFF to 0x8000) (see Figure 27).
Digital Feedthrough
Digital feedthrough is a measurement of the impulse injected
into the analog output of the DAC from the digital inputs of the
DAC, but is measured when the DAC output is not updated. It
is specified in nV-sec and measured with a full-scale code
change on the data bus, that is, from all 0s to all 1s and vice
versa.
Noise Spectral Density (NSD)
Noise spectral density is a measurement of the internally generated random noise. Random noise is characterized as a spectral
density (nV/√Hz) and is measured by loading the DAC to midscale and measuring noise at the output. It is measured in nV/√Hz.
DC Crosstalk
DC crosstalk is the dc change in the output level of one DAC
in response to a change in the output of another DAC. It is
measured with a full-scale output change on one DAC (or soft
power-down and power-up) while monitoring another DAC
kept at midscale. It is expressed in μV.
DC crosstalk due to load current change is a measurement
of the impact that a change in load current on one DAC has
on another DAC kept at midscale. It is expressed in μV/mA.
Digital Crosstalk
Digital crosstalk is the glitch impulse transferred to the output of
one DAC at midscale in response to a full-scale code change (all
0s to all 1s and vice versa) in the input register of another DAC.
It is expressed in nV-sec.
Analog Crosstalk
Analog crosstalk is the glitch impulse transferred to the output
of one DAC in response to a change in the output of another DAC.
To measure analog crosstalk, load one of the input registers with a
full-scale code change (all 0s to all 1s and vice versa), and then
execute a software LDAC and monitor the output of the DAC
whose digital code was not changed. The area of the glitch is
expressed in nV-sec.
Rev. C | Page 14 of 24
Data Sheet
AD5696/AD5694
DAC-to-DAC Crosstalk
DAC-to-DAC crosstalk is the glitch impulse transferred to the
output of one DAC in response to a digital code change and
subsequent analog output change of another DAC. It is measured
by loading one channel with a full-scale code change (all 0s to all
1s and vice versa) using the write to and update commands
while monitoring the output of another channel that is at midscale. The energy of the glitch is expressed in nV-sec.
Total Harmonic Distortion (THD)
THD is the difference between an ideal sine wave and its
attenuated version using the DAC. The sine wave is used as the
reference for the DAC; THD is a measurement of the
harmonics present on the DAC output. It is measured in dB.
Multiplying Bandwidth
The amplifiers within the DAC have a finite bandwidth. The
multiplying bandwidth is a measure of this. A sine wave on the
reference (with full-scale code loaded to the DAC) appears on
the output. The multiplying bandwidth is the frequency at
which the output amplitude falls to 3 dB below the input.
Rev. C | Page 15 of 24
AD5696/AD5694
Data Sheet
THEORY OF OPERATION
DIGITAL-TO-ANALOG CONVERTER
The AD5696/AD5694 are quad, 16-/12-bit, serial input, voltage
output DACs that operate from supply voltages of 2.7 V to 5.5
V. Data is written to the AD5696/AD5694 in a 24-bit word
format via a 2-wire serial interface. The AD5696/AD5694
incorporate a power-on reset circuit to ensure that the DAC
output powers up to a known output state. The devices also have
a software power-down mode that reduces the current
consumption to 4 μA.
The resistor string structure is shown in Figure 34. Each
resistor in the string has a value R. The code loaded to the DAC
register determines the node on the string from which the
voltage is tapped off and fed into the output amplifier. The
voltage is tapped off by closing one of the switches that connect
the string to the amplifier. Because the AD5696/AD5694 are a
string of resistors, they are guaranteed monotonic.
VREF
R
TRANSFER FUNCTION
Because the input coding to the DAC is straight binary, the
ideal output voltage is given by
R
D
VOUT VREF Gain N
2
R
DAC ARCHITECTURE
The DAC architecture consists of a string DAC followed by an
output amplifier. Figure 33 shows a block diagram of the DAC
architecture.
VREF
R
R
10799-053
where:
VREF is the value of the external reference.
Gain is the gain of the output amplifier and is set to 1 by
default. The gain can be set to 1 or 2 using the gain select pin.
When the GAIN pin is tied to GND, all four DAC outputs have
a span of 0 V to VREF. When this pin is tied to VDD, all four DAC
outputs have a span of 0 V to 2 × VREF.
D is the decimal equivalent of the binary code that is loaded to
the DAC register as follows: 0 to 4095 for the 12-bit AD5694,
and 0 to 65,535 for the 16-bit AD5696.
N is the DAC resolution (12 bits or 16 bits).
Figure 34. Resistor String Structure
Output Amplifiers
The output buffer amplifier can generate rail-to-rail voltages on
its output for an output range of 0 V to VDD. The actual range
depends on the value of VREF, the GAIN pin, the offset error,
and the gain error. The GAIN pin selects the gain of the output.
REF (+)
DAC
REGISTER
RESISTOR
STRING
REF (–)
GND
VOUTX
GAIN
(GAIN = 1 OR 2)
10799-052
INPUT
REGISTER
TO OUTPUT
AMPLIFIER
When this pin is tied to GND, all four outputs have a gain
of 1, and the output range is from 0 V to VREF.
When this pin is tied to VDD, all four outputs have a gain
of 2, and the output range is from 0 V to 2 × VREF.
The output amplifiers are capable of driving a load of 1 kΩ in
parallel with 2 nF to GND. The slew rate is 0.8 V/μs with a ¼
to ¾ scale settling time of 5 μs.
Figure 33. Single DAC Channel Architecture Block Diagram
Rev. C | Page 16 of 24
Data Sheet
AD5696/AD5694
Table 8. Command Definitions
SERIAL INTERFACE
The AD5696/AD5694 have a 2-wire, I2C-compatible serial
interface (see the I2C-Bus Specification, Version 2.1, January
2000, available from Philips Semiconductor). See Figure 2 for a
timing diagram of a typical write sequence. The AD5696/AD5694
can be connected to an I2C bus as slave devices, under the control
of a master device. The AD5696/AD5694 support standard
(100 kHz) and fast (400 kHz) data transfer modes. Support is
not provided for 10-bit addressing or general call addressing.
C3
0
0
Input Shift Register
The input shift register of the AD5696/AD5694 is 24 bits wide.
Data is loaded into the device, MSB first, as a 24-bit word under
the control of the serial clock input, SCL. The first eight MSBs
make up the command byte (see Figure 35 and Figure 36).
0
1
0
0
0
0
0
0
1
0
1
1
1
1
X1
1
0
0
1
1
X1
1
0
1
0
1
X1
1
The first four bits of the command byte are the command
bits (C3, C2, C1, and C0), which control the mode of operation of the device (see Table 8).
The last four bits of the command byte are the address bits
(DAC D, DAC C, DAC B, and DAC A), which select the
DAC that is operated on by the command (see Table 9).
X = don’t care.
Table 9. Address Bits and Selected DACs
DAC D
0
0
0
0
0
0
0
1
1
…
1
The 8-bit command byte is followed by two data bytes, which
contain the data-word. For the AD5696, the data-word comprises
the 16-bit input code (see Figure 35); for the AD5694, the dataword comprises the 12-bit input code followed by four don’t care
bits (see Figure 36). The data bits are transferred to the input
shift register on the 24 falling edges of SCL.
Commands can be executed on one DAC channel, any two or
three DAC channels, or on all four DAC channels, depending
on the address bits selected (see Table 9).
1
C2
C1
C0
COMMAND
DAC D DAC C DAC B DAC A D15
D14
D13
DAC ADDRESS
COMMAND BYTE
D12
D11
DAC A
1
0
1
0
1
0
1
0
1
…
1
Selected DAC Channels1
DAC A
DAC B
DAC A and DAC B
DAC C
DAC A and DAC C
DAC B and DAC C
DAC A, DAC B, and DAC C
DAC D
DAC A and DAC D
…
All DACs
Any combination of DAC channels can be selected using the address bits.
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10
C3
Address Bits
DAC C DAC B
0
0
0
1
0
1
1
0
1
0
1
1
1
1
0
0
0
0
…
…
1
1
D10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
DAC DATA
DAC DATA
DATA HIGH BYTE
DATA LOW BYTE
10799-302
0
Command
No operation
Write to Input Register n (dependent
on LDAC)
Update DAC Register n with contents
of Input Register n
Write to and update DAC Channel n
Power down/power up DAC
Hardware LDAC mask register
Software reset (power-on reset)
Reserved
Reserved
Figure 35. Input Shift Register Contents, AD5696
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10
C3
C2
C1
COMMAND
C0
DAC D DAC C DAC B DAC A D11
DAC ADDRESS
COMMAND BYTE
D10
D9
D8
D7
D6
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
D5
D4
D3
D2
D1
D0
X
X
X
X
DAC DATA
DAC DATA
DATA HIGH BYTE
DATA LOW BYTE
Figure 36. Input Shift Register Contents, AD5694
Rev. C | Page 17 of 24
10799-300
Command Bits
C2
C1
C0
0
0
0
0
0
1
AD5696/AD5694
Data Sheet
1.
WRITE AND UPDATE COMMANDS
For more information about the LDAC function, see the Load
DAC (Hardware LDAC Pin) section.
Write to Input Register n (Dependent on LDAC)
2.
Command 0001 allows the user to write to each DAC’s
dedicated input register individually. When LDAC is low, the
input register is transparent (if not controlled by the LDAC
mask register).
3.
Update DAC Register n with Contents of Input Register n
Command 0010 loads the DAC registers/outputs with the
contents of the input registers selected by the address bits
(see Table 9) and updates the DAC outputs directly.
4.
Write to and Update DAC Channel n (Independent of LDAC)
Command 0011 allows the user to write to the DAC registers
and update the DAC outputs directly, independent of the state
of the LDAC pin.
I2C SLAVE ADDRESS
The AD5696/AD5694 have a 7-bit I2C slave address. The five
MSBs are 00011, and the two LSBs (A1 and A0) are set by the
state of the A1 and A0 address pins. The ability to make hardwired changes to A1 and A0 allows the user to incorporate up
to four AD5696/AD5694 devices on one bus (see Table 10).
WRITE OPERATION
When writing to the AD5696/AD5694, the user must begin with
a start command followed by an address byte (R/W = 0), after
which the DAC acknowledges that it is prepared to receive data
by pulling SDA low. The AD5696/AD5694 require two bytes of
data for the DAC and a command byte that controls various
DAC functions. Three bytes of data must, therefore, be written
to the DAC with the command byte followed by the most
significant data byte and the least significant data byte, as shown in
Figure 37. All these data bytes are acknowledged by the
AD5696/AD5694. A stop condition follows.
Table 10. Device Address Selection
A1 Pin Connection
GND
GND
VLOGIC
VLOGIC
A0 Pin Connection
GND
VLOGIC
GND
VLOGIC
A1 Bit
0
0
1
1
The master initiates a data transfer by establishing a start
condition when a high-to-low transition on the SDA line
occurs while SCL is high. The following byte is the address
byte, which consists of the 7-bit slave address.
The slave device with the transmitted address responds by
pulling SDA low during the 9th clock pulse (this is called
the acknowledge bit). At this stage, all other devices on the
bus remain idle while the selected device waits for data to
be written to, or read from, its input shift register.
Data is transmitted over the serial bus in sequences of nine
clock pulses (eight data bits followed by an acknowledge
bit). Transitions on the SDA line must occur during the low
period of SCL; SDA must remain stable during the high period
of SCL.
After all data bits are read or written, a stop condition is
established. In write mode, the master pulls the SDA line high
during the 10th clock pulse to establish a stop condition. In
read mode, the master issues a no acknowledge for the 9th
clock pulse (that is, the SDA line remains high). The master
then brings the SDA line low before the 10th clock pulse and
then high again during the 10th clock pulse to establish a
stop condition.
A0 Bit
0
1
0
1
SERIAL OPERATION
The 2-wire I2C serial bus protocol operates as follows:
1
9
1
9
SCL
0
SDA
0
0
1
1
A1
A0
DB23
R/W
DB22 DB21 DB20 DB19 DB18
DB17
ACK BY
AD5696/AD5694
START BY
MASTER
DB16
ACK BY
AD5696/AD5694
FRAME 1
SLAVE ADDRESS
FRAME 2
COMMAND BYTE
1
9
1
9
SCL
(CONTINUED)
DB15 DB14
DB13 DB12
DB11 DB10
FRAME 3
MOST SIGNIFICANT
DATA BYTE
DB9
DB8
DB7
DB6
ACK BY
AD5696/AD5694
Figure 37. I2C Write Operation
Rev. C | Page 18 of 24
DB5
DB4
DB3
DB2
FRAME 4
LEAST SIGNIFICANT
DATA BYTE
DB1
DB0
STOP BY
ACK BY
AD5696/AD5694 MASTER
10799-303
SDA
(CONTINUED)
Data Sheet
AD5696/AD5694
READ OPERATION
MULTIPLE DAC READBACK SEQUENCE
When reading data back from the AD5696/AD5694, the user
must begin with a start command followed by an address byte
(R/W = 0), after which the DAC acknowledges that it is prepared
to receive data by pulling SDA low. The address byte must be
followed by the command byte, which determines both the read
command that is to follow and the pointer address to read
from; the command byte is also acknowledged by the DAC.
The user configures the channel to read back the contents of
one or more DAC registers and sets the readback command to
active using the command byte.
When reading data back from multiple AD5696/AD5694 DACs,
the user begins with an address byte (R/W = 0), after which the
DAC acknowledges that it is prepared to receive data by pulling
SDA low. The address byte must be followed by the command
byte, which is also acknowledged by the DAC. The user selects
the first channel to read back using the command byte.
Following this, the master establishes a repeated start
condition, and the address is resent with R/W = 1. This byte is
acknowledged by the DAC, indicating that it is prepared to
transmit data. The first two bytes of data are then read from DAC
Input Register n (selected using the command byte), most
significant byte first, as shown in Figure 38. The next two bytes
read back are the contents of DAC Input Register n + 1, and the
next bytes read back are the contents of DAC Input Register
n + 2. Data is read from the DAC input registers in this autoincremented fashion until a NACK followed by a stop
condition follows. If the contents of DAC Input Register D are
read out, the next two bytes of data that are read are the
contents of DAC Input Register A.
Following this, the master establishes a repeated start
condition, and the address is resent with R/W = 1. This byte is
acknowledged by the DAC, indicating that it is prepared to
transmit data. Two bytes of data are then read from the DAC, as
shown in Figure 38. A NACK condition from the master, followed
by a stop condition, completes the read sequence. If more than
one DAC is selected, Channel A is read back by default.
1
9
1
9
SCL
0
SDA
0
0
1
1
A1
A0
R/W
DB23 DB22 DB21
DB20 DB19 DB18
DB17 DB16
ACK BY
AD5696/AD5694
START BY
MASTER
ACK BY
AD5696/AD5694
FRAME 1
SLAVE ADDRESS
FRAME 2
COMMAND BYTE
1
9
1
9
SCL
0
SDA
0
0
REPEATED START BY
MASTER
1
1
A1
A0
R/W
DB15 DB14
ACK BY
AD5696/AD5694
FRAME 3
SLAVE ADDRESS
1
DB13 DB12 DB11
FRAME 4
MOST SIGNIFICANT
DATA BYTE n
DB10
DB9
DB8
ACK BY
MASTER
9
SCL
(CONTINUED)
DB7
DB6
DB5
DB4
DB3
DB2
FRAME 5
LEAST SIGNIFICANT
DATA BYTE n
DB1
DB0
NACK BY
MASTER
STOP BY
MASTER
Figure 38. I2C Read Operation
Rev. C | Page 19 of 24
10799-304
SDA
(CONTINUED)
AD5696/AD5694
Data Sheet
POWER-DOWN OPERATION
Table 11. Modes of Operation
PDx1
0
PDx0
0
0
1
1
1
0
1
POWER-DOWN
CIRCUITRY
VOUTX
RESISTOR
NETWORK
Figure 39. Output Stage During Power-Down
The bias generator, output amplifier, resistor string, and other
associated linear circuitry are shut down when power-down
mode is activated. However, the contents of the DAC registers
are unaffected in power-down mode, and the DAC registers
can be updated while the device is in power-down mode. The
time required to exit power-down is typically 2.5 μs for VDD =
5 V.
Any or all DACs (DAC A to DAC D) can be powered down
to the selected mode by setting the corresponding bits in the
input shift register. See Table 12 for the contents of the input
shift register during the power-down/power-up operation.
When both Bit PDx1 and Bit PDx0 (where x is the DAC selected)
in the input shift register are set to 0, the parts work normally
with their normal power consumption of 0.59 mA at 5 V.
When Bit PDx1, Bit PDx0, or both Bit PDx1 and Bit PDx0 are
set to 1, the part is in power-down mode. In power-down
mode, the supply current falls to 4 μA at 5 V.
LOAD DAC (HARDWARE LDAC PIN)
The AD5696/AD5694 DACs have double buffered interfaces
consisting of two banks of registers: input registers and DAC
registers. The user can write to any combination of the input
registers (see Table 9). Updates to the DAC registers are controlled by the LDAC pin.
OUTPUT
AMPLIFIER
In power-down mode, the output stage is internally switched
from the output of the amplifier to a resistor network of known
values. In this way, the output impedance of the part is known
when the part is in power-down mode.
VREF
12-/16-BIT
DAC
LDAC
DAC
REGISTER
VOUTX
INPUT
REGISTER
Table 11 lists the three power-down options. The output is
connected internally to GND through either a 1 kΩ or a 100 kΩ
resistor, or it is left open-circuited (three-state). The output stage
is illustrated in Figure 39.
SCL
SDA
INPUT SHIFT
REGISTER
10799-059
Operating Mode
Normal Operation
Power-Down Modes
1 kΩ to GND
100 kΩ to GND
Three-State
AMPLIFIER
DAC
10799-058
Command 0100 is designated for the power-down function. The
AD5696/AD5694 provide three separate power-down modes
(see Table 11). These power-down modes are software programmable by setting Bit DB7 to Bit DB0 in the input shift register
(see Table 12). Two bits are associated with each DAC channel.
Table 11 shows how the state of these two bits corresponds to
the mode of operation of the device.
Figure 40. Simplified Diagram of Input Loading Circuitry for a Single DAC
Table 12. 24-Bit Input Shift Register Contents for Power-Down/Power-Up Operation1
DB23
DB21
DB20
(MSB) DB22
0
1
0
0
Command bits (C3 to C0)
1
DB19 to DB16
X
Address bits
(don’t care)
DB15
to DB8
X
Don’t
care
DB7
DB6
PDD1
PDD0
Power-down
select, DAC D
X = don’t care.
Rev. C | Page 20 of 24
DB5
DB4
PDC1
PDC0
Power-down
select, DAC C
DB3
DB2
PDB1
PDB0
Power-down
select, DAC B
DB0
DB1
(LSB)
PDA1
PDA0
Power-down
select, DAC A
Data Sheet
AD5696/AD5694
Instantaneous DAC Updating (LDAC Held Low)
Table 13. LDAC Overwrite Definition
For instantaneous updating of the DACs, LDAC is held low
while data is clocked into the input register using Command
0001. Both the addressed input register and the DAC register are
updated on the 24th clock, and the output begins to change (see
Table 14).
LDAC Bit
(DB3 to DB0)
0
1
Load LDAC Register
LDAC Pin
LDAC Operation
1 or 0
X1
Determined by the LDAC pin.
DAC channels are updated. (DAC
channels see LDAC pin as 1.)
Deferred DAC Updating (LDAC Pulsed Low)
1
For deferred updating of the DACs, LDAC is held high while
data is clocked into the input register using Command 0001. All
DAC outputs are asynchronously updated by pulling LDAC low
after the 24th clock. The update occurs on the falling edge of
LDAC.
X = don’t care.
HARDWARE RESET PIN (RESET)
RESET is an active low reset that allows the outputs to be cleared
to either zero scale or midscale. The clear code value is user selectable via the reset select pin (RSTSEL). It is necessary to keep
RESET low for a minimum of 30 ns to complete the operation.
LDAC MASK REGISTER
When the RESET signal is returned high, the output remains at
the cleared value until a new value is programmed. The outputs
cannot be updated with a new value while the RESET pin is
low.
Command 0101 is reserved for the software LDAC function.
When this command is executed, the address bits are ignored.
When writing to the DAC using Command 0101, the 4-bit
LDAC mask register (DB3 to DB0) is loaded. Bit DB3 of the
LDAC mask register corresponds to DAC D; Bit DB2
corresponds to DAC C; Bit DB1 corresponds to DAC B; and Bit
DB0 corresponds to DAC A.
There is also a software executable reset function that resets the
DAC to the power-on reset code. Command 0110 is designated
for this software reset function (see Table 8). Any events on
LDAC during a power-on reset are ignored. If the RESET pin is
pulled low at power-up, the device does not initialize correctly
until the pin is released.
The default value of these bits is 0; that is, the LDAC pin works
normally. Setting any of these bits to 1 forces the selected DAC
channel to ignore transitions on the LDAC pin, regardless of
the state of the hardware LDAC pin. This flexibility is useful in
appli-cations where the user wishes to select which channels
respond to the LDAC pin.
RESET SELECT PIN (RSTSEL)
The AD5696/AD5694 contain a power-on reset circuit that
controls the output voltage during power-up. When the RSTSEL
pin is tied to GND, the outputs power up to zero scale (note that
this is outside the linear region of the DAC). When the RSTSEL
pin is tied to VDD, the outputs power up to midscale. The
outputs remain powered up at the level set by the RSTSEL pin
until a valid write sequence is made to the DAC.
The LDAC mask register allows the user extra flexibility and
control over the hardware LDAC pin (see Table 13). Setting the
LDAC bit (DB3 to DB0) to 0 for a DAC channel allows the hardware LDAC pin to control the updating of that channel.
Table 14. Write Commands and LDAC Pin Truth Table1
Command
0001
Description
Write to Input Register n (dependent on LDAC)
0010
Update DAC Register n with contents of Input
Register n
0011
Write to and update DAC Channel n
Hardware LDAC
Pin State
VLOGIC
GND2
VLOGIC
Input Register
Contents
Data update
Data update
No change
GND
No change
VLOGIC
GND
Data update
Data update
1
DAC Register Contents
No change (no update)
Data update
Updated with input register
contents
Updated with input register
contents
Data update
Data update
A high to low transition on the hardware LDAC pin always updates the contents of the DAC register with the contents of the input register on channels that are not
masked (blocked) by the LDAC mask register.
2
When the LDAC pin is permanently tied low, the LDAC mask bits are ignored.
Rev. C | Page 21 of 24
AD5696/AD5694
Data Sheet
APPLICATIONS INFORMATION
MICROPROCESSOR INTERFACING
Microprocessor interfacing to the AD5696/AD5694 is via a
serial bus that uses a standard protocol that is compatible with DSP
processors and microcontrollers. The communications channel
requires a 2-wire interface consisting of a clock signal and a
data signal.
AD5696/AD5694 TO ADSP-BF531 INTERFACE
For enhanced thermal, electrical, and board level performance,
solder the exposed pad on the bottom of the LFCSP package to
the corresponding thermal land paddle on the PCB. Design
thermal vias into the PCB land paddle area to further improve
heat dissipation.
The GND plane on the device can be increased (as shown in
Figure 42) to provide a natural heat sinking effect.
AD5696/
AD5694
The I2C interface of the AD5696/AD5694 is designed for easy
connection to industry-standard DSPs and microcontrollers.
Figure 41 shows the AD5696/AD5694 connected to the Analog
Devices, Inc., Blackfin® processor. The Blackfin processor has
an integrated I2C port that can be connected directly to the I2C
pins of the AD5696/AD5694.
GND
PLANE
10799-166
AD5696/
AD5694
BOARD
ADSP-BF531
LDAC
RESET
GALVANICALLY ISOLATED INTERFACE
In many process control applications, it is necessary to provide
an isolation barrier between the controller and the unit being
controlled to protect and isolate the controlling circuitry from
any hazardous common-mode voltages that may occur.
Figure 41. AD5696/AD5694 to ADSP-BF531 Interface
LAYOUT GUIDELINES
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure the
rated performance. The PCB on which the AD5696/AD5694 are
mounted should be designed so that the AD5696/AD5694 lie
on the analog plane.
The AD5696/AD5694 should have ample supply bypassing of
10 μF in parallel with 0.1 μF on each supply, located as close to
the package as possible, ideally right up against the device. The
10 μF capacitor is the tantalum bead type. The 0.1 μF capacitor
should have low effective series resistance (ESR) and low effective
series inductance (ESI), such as the common ceramic types; these
capacitors provide a low impedance path to ground at high
frequencies to handle transient currents due to internal logic
switching.
In systems where many devices are on one board, it is often
useful to provide some heat sinking capability to allow the
power to dissipate easily.
The Analog Devices iCoupler® products provide voltage isolation in excess of 2.5 kV. The serial loading structure of the
AD5696/AD5694 makes the part ideal for isolated interfaces
because the number of interface lines is kept to a minimum.
Figure 43 shows a 4-channel isolated interface to the AD5696/
AD5694 using the ADuM1400. For more information, visit
www.analog.com/icouplers.
CONTROLLER
SERIAL
CLOCK IN
SERIAL
DATA OUT
RESET OUT
LOAD DAC
OUT
The AD5696/AD5694 LFCSP models have an exposed pad
beneath the device. Connect this pad to the GND supply for
the part. For optimum performance, use special considerations
to design the motherboard and to mount the package.
Rev. C | Page 22 of 24
ADuM1400
VIA
VIB
VIC
VID
ENCODE
DECODE
ENCODE
DECODE
ENCODE
DECODE
ENCODE
DECODE
Figure 43. Isolated Interface
VOA
VOB
VOC
VOD
TO
SCL
TO
SDA
TO
RESET
TO
LDAC
10799-167
PF9
PF8
Figure 42. Paddle Connection to Board
SCL
SDA
10799-164
GPIO1
GPIO2
Data Sheet
AD5696/AD5694
OUTLINE DIMENSIONS
PIN 1
INDICATOR
AREA
DETAIL A
(JEDEC 95)
0.30
0.23
0.18
0.50
BSC
13
16
12
1
P IN 1
IN D IC ATO R AR E A OP T IO N S
(SEE DETAIL A)
1.75
1.60 SQ
1.45
EXPOSED
PAD
9
0.50
0.40
0.30
TOP VIEW
0.80
0.75
0.70
SIDE VIEW
5
BOTTOM VIEW
0.20 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
PKG-005138
4
8
08-24-2018-E
3.10
3.00 SQ
2.90
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6
Figure 44. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-16-22)
Dimensions shown in millimeters
5.10
5.00
4.90
16
9
4.50
4.40
4.30
6.40
BSC
1
8
PIN 1
1.20
MAX
0.15
0.05
0.65
BSC
0.30
0.19
COPLANARITY
0.10
0.20
0.09
SEATING
PLANE
8°
0°
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 45. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
Rev. C | Page 23 of 24
0.75
0.60
0.45
AD5696/AD5694
Data Sheet
ORDERING GUIDE
Model1
AD5696ACPZ-RL7
AD5696BCPZ-RL7
AD5696ARUZ
AD5696ARUZ-RL7
AD5696BRUZ
AD5696BRUZ-RL7
AD5694BCPZ-RL7
AD5694ARUZ
AD5694ARUZ-RL7
AD5694BRUZ
AD5694BRUZ-RL7
EVAL-AD5696RSDZ
EVAL-AD5694RSDZ
1
Resolution
16 Bits
16 Bits
16 Bits
16 Bits
16 Bits
16 Bits
12 Bits
12 Bits
12 Bits
12 Bits
12 Bits
Temperature Range
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
Accuracy
(INL)
±8 LSB
±2 LSB
±8 LSB
±8 LSB
±2 LSB
±2 LSB
±1 LSB
±2 LSB
±2 LSB
±1 LSB
±1 LSB
Package Description
16-Lead LFCSP
16-Lead LFCSP
16-Lead TSSOP
16-Lead TSSOP
16-Lead TSSOP
16-Lead TSSOP
16-Lead LFCSP
16-Lead TSSOP
16-Lead TSSOP
16-Lead TSSOP
16-Lead TSSOP
AD5696 TSSOP Evaluation Board
AD5694 TSSOP Evaluation Board
Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2012–2020 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10799-8/20(C)
Rev. C | Page 24 of 24
Package
Option
CP-16-22
CP-16-22
RU-16
RU-16
RU-16
RU-16
CP-16-22
RU-16
RU-16
RU-16
RU-16
Branding
DJ8
DJ9
DJQ
工商网监
湘ICP备2023018690号
