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AD8185ARU-REEL7

AD8185ARU-REEL7

  • 厂商:

    AD(亚德诺)

  • 封装:

    TSSOP24_7.8X4.4MM

  • 描述:

    IC MULTIPLEXER TRPL 2X1 24TSSOP

  • 数据手册
  • 价格&库存
AD8185ARU-REEL7 数据手册
a 380 MHz, 25 mA, Triple 2:1 Multiplexers AD8183/AD8185 FEATURES Fully Buffered Inputs and Outputs Fast Channel-to-Channel Switching: 15 ns High Speed 380 MHz Bandwidth (–3 dB) 200 mV p-p 310 MHz Bandwidth (–3 dB) 2 V p-p 1000 V/␮s Slew Rate G = +1, 2 V Step 1150 V/␮s Slew Rate G = +2, 2 V Step Fast Settling Time of 15 ns to 0.1% Low Power: 25 mA Excellent Video Specifications (RL = 150 ⍀) Gain Flatness of 0.1 dB to 90 MHz 0.01% Differential Gain Error 0.02ⴗ Differential Phase Error Low All-Hostile Crosstalk –84 dB @ 5 MHz –54 dB @ 50 MHz Low Channel-to-Channel Crosstalk –56 dB @ 100 MHz High “OFF” Isolation of –100 dB @ 10 MHz Low Cost Fast High Impedance Output Disable Feature for Connecting Multiple Devices APPLICATIONS Pixel Switching for “Picture-In-Picture” Switching RGB in LCD and Plasma Displays RGB Video Switchers and Routers PRODUCT DESCRIPTION The AD8183 (G = +1) and AD8185 (G = +2) are high speed triple 2:1 multiplexers. They offer –3 dB signal bandwidth up to 380 MHz, along with slew rate of 1000 V/μs. With better than –90 dB of channel-to-channel crosstalk and isolation at 10 MHz, they are useful in many high-speed applications. The differential gain and differential phase errors of 0.01% and 0.02° respectively, along with 0.1 dB flatness to 90 MHz make the AD8183 and AD8185 ideal for professional video and RGB multiplexing. They offer 15 ns channel-to-channel switching time, making them an excellent choice for switching video signals, while consuming less than 25 mA on ± 5 V supply voltages. Both devices offer a high speed disable feature that can set the output into a high impedance state. This allows the building of larger input arrays while minimizing “OFF” channel output loading. They operate on voltage supplies of ± 5 V and are offered in a 24-lead TSSOP package. Rev. A FUNCTIONAL BLOCK DIAGRAM AD8183/AD8185 IN0A 1 DGND 2 SELECT 24 VCC 23 OE 22 SEL A/B IN1A 3 DISABLE GND 4 IN2A 5 0 VCC 6 21 VCC 20 OUT0 19 VEE VEE 7 1 18 OUT1 17 VCC IN2B 8 GND 9 2 16 OUT2 IN1B 10 15 VEE GND 11 14 DVCC IN0B 12 13 VCC Table I. Truth Table SEL A/B OE OUT 0 1 0 1 0 0 1 1 INA INB High Z High Z VO = 1.4V STEP 1.4V RL = 150⍀ 1.2V 1.0V 0.8V 0.6V 0.4V 0.2V 0.0V 200mV 2ns Figure 1. AD8185 Pulse Response; RL = 150 Ω Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©1999–2016 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com AD8183/AD8185–SPECIFICATIONS (T = 25ⴗC, V = ⴞ5 V, R = 1 k⍀ unless otherwise noted) A Parameter DYNAMIC PERFORMANCE –3 dB Bandwidth (Small Signal) –3 dB Bandwidth (Small Signal) –3 dB Bandwidth (Large Signal) –3 dB Bandwidth (Large Si 0.1 dB Bandwidth Slew Rate Settling Time to 0.1% NOISE/DISTORTION PERFORMANCE Differential Gain Differential Phase All-Hostile Crosstalk, RTI Channel-to-Channel Crosstalk, RTI OFF Isolation Voltage Noise, RTI DC PERFORMANCE Voltage Gain Error Input Offset Voltage, RTI Input Offset Voltage Matching, RTI Input Offset Drift, RTI Input Bias Current INPUT CHARACTERISTICS Input Resistance Input Capacitance S L Condition Min Typ VOUT = 200 mV p-p VOUT = 200 mV p-p, R L = 150 Ω VOUT = 2 V p-p VOUT = 2 V p-p, RL = 150 Ω VOUT = 200 mV p-p VOUT = 200 mV p-p, R L = 150 Ω 2 V Step 2 V Step, RL = 150 Ω 250/300 200/250 250/300 200/250 590/360 380/320 530/350 310/300 90/60 100/160 1000/1150 15 MHz MHz MHz MHz MHz MHz V/μs ns NTSC or PAL, 150 Ω NTSC or PAL, 150 Ω ƒ = 5 MHz, AD8185: RL = 150 Ω ƒ = 50 MHz, AD8185: RL = 150 Ω ƒ = 100 MHz, AD8185: RL = 150 Ω ƒ =  MHz, RL = 150 Ω ƒ = 10 kHz to 30 MHz 0.01 0.02 –84/–72 –54/–50 –56/–54 –10 28/15 % Degrees dB dB dB dB nV/√Hz No Load 0.20 5 10 1 15 6/10 TMIN to TMAX Channel-to-Channel Short Circuit Current Output Resistance Output Capacitance POWER SUPPLY Operating Range Power Supply Rejection Ratio Power Supply Rejection Ratio Quiescent Current SWITCHING CHARACTERISTICS Switch Time 50% Logic to 50% Output Settling ENABLE to Channel ON Time 50% Logic to 50% Output Settling ENABLE to Channel OFF Time 50% Logic to 50% Output Settling Channel Switching Transient (Glitch) 0.25/0.85 25/40 25/40 10/15 Unit % mV mV mV μV/°C μA 4/1 8/5 1 1.5 ± 3.0/± 1.5 MΩ pF pF V RL = 1 kΩ RL = 150 Ω ± 2.90 ± 2.65 Enabled Disabled Disabled 4/1 ± 3.25 ± 2.95 60 0.3 8/3 4/6.5 V V mA Ω MΩ pF Channel Enabled Channel Disabled Input Voltage Range OUTPUT CHARACTERISTICS Output Voltage Swing Max +PSRR +V S = +4.5 V to +5.5 V, –V S = –5 V –PSRR –VS = –4.5 V to –5.5 V, +VS = +5 V All Channels “ON” All Channels “OFF” TMIN to TMAX ; All Channels “ON” ± 4.5 58/62 52/60 ± 5.5 66/72 56/68 25 3/7 25 30 5/10 V dB dB mA mA mA Channel-to-Channel IN0 = +1 V, IN1 = –1 V 15 ns INPUT = 1 V 20 ns INPUT = 1 V All Inputs Grounded 45 50/70 ns mV DIGITAL INPUTS Logic “1” Voltage Logic “0” Voltage Logic “1” Input Current Logic “0” Input Current SEL A/B and OE Inputs SEL A/B and OE Inputs SEL A/B and OE = 4 V SEL A/B and OE = 0.4 V 2.0 OPERATING TEMPERATURE RANGE Temperature Range θJA θJC Operating (Still Air) Operating (Still Air) Operating –40 0.8 10 0.5 +85 128 42 V V nA μA °C °C/W °C/W Specifications subject to change without notice. –2– 5(9$ AD8183/AD8185 ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.0 V DVCC to VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 0.2 V Internal Power Dissipation2, 3 AD8183/AD8185 24-Lead TSSOP (RU) . . . . . . . . . . . . . 1 W Input Voltage IN0A, IN0B, IN1A, IN1B, IN2A, IN2B . . . . . VEE ≤ VIN ≤ V CC SELECT A/B, OE . . . . . . . . . . . . . . . . . . DGND ≤ VIN ≤ VCC Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . Indefinite3 Storage Temperature Range . . . . . . . . . . . . . . . –65°C to +150°C Lead Temperature Range (Soldering 10 sec) . . . . . . . . . . . 300°C MAXIMUM POWER DISSIPATION – Watts 2.0 NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2 Specification is for device in free air (T A = 25°C). 3 24-lead plastic TSSOP; θ JA = 128°C/W. Maximum internal power dissipation (P D) should be derated for ambient temperature (T A) such that PD < (150°C–T A)/θJA. TJ = 150ⴗC 1.5 1.0 0.5 0 –50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 AMBIENT TEMPERATURE – ⴗC 80 90 Figure 2. Maximum Power Dissipation vs. Temperature PIN CONFIGURATION MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8183/ AD8185 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure. IN0A 1 24 VCC DGND 2 23 OE IN1A 3 22 SEL A/B GND 4 21 VCC 20 OUT0 IN2A 5 VCC 6 19 IN2B 8 17 GND 9 16 OUT2 IN1B 10 15 VEE GND 11 14 DVCC IN0B 12 13 VCC VEE TOP VIEW VEE 7 (Not to Scale) 18 OUT1 While the AD8183/AD8185 is internally short circuit protected, this may not be sufficient to guarantee that the maximum junction temperature (150°C) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves shown in Figure 2. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8183/AD8185 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. 5(9$ AD8183/ AD8185 –3– VCC WARNING! ESD SENSITIVE DEVICE AD8183/AD8185 1 1 GAIN GAIN 0 200mV p-p –1 –3 0 –4 –0.1 –0.2 –5 200mV p-p 2V p-p VO AS SHOWN RL = 150⍀ –0.3 –7 –0.4 –8 –9 0.1 1 10 FREQUENCY – MHz 100 1k 0 0 –4 –0.1 –0.2 –5 –6 VO AS SHOWN RL = 150⍀ –8 –0.5 –0.6 –9 0.1 1 10 FREQUENCY – MHz 2 200mV p-p 0.3 1 GAIN 0.2 –2 0.1 0 –4 –0.1 –0.2 2V p-p –0.3 FLATNESS – dB GAIN – dB FLATNESS –3 200mV p-p 2V p-p 0.1 –1 FLATNESS 0 –2 –3 –0.1 200mV p-p 2V p-p –0.2 –4 –5 VO AS SHOWN RL = 1k⍀ –0.3 –7 –0.4 –6 –0.4 –8 –0.5 –7 –0.5 –9 0.1 1 10 FREQUENCY – MHz –0.6 1k 100 –8 0.1 VO = 200mV p-p RL = 1k⍀ CL = 5pF TEMPERATURE AS SHOWN 3 2 NORMALIZED GAIN – dB 3 +25 C 2 +85 C 1 0 –40 C –1 –2 –0.6 1k 100 –2 –3 –5 100 –6 0.1 1k –40 C –1 –4 10 FREQUENCY – MHz +25 C +85 C 0 –4 1 VO = 200mV p-p RL = 150⍀ CL = 5pF TEMPERATURE AS SHOWN 1 –3 –5 0.1 10 FREQUENCY – MHz 4 5 4 1 Figure 7. AD8185 Frequency Response; RL = 1 kΩ Figure 4. AD8183 Frequency Response; RL = 1 k Ω GAIN – dB 0.2 0 NORMALIZED GAIN – dB –1 –6 –0.6 1k 100 Figure 6. AD8185 Frequency Response; RL = 150 Ω 2V p-p VO AS SHOWN RL = 1k⍀ –0.3 –0.5 0.3 –5 200mV p-p 2V p-p –0.4 200mV p-p GAIN –3 –7 Figure 3. AD8183 Frequency Response; RL = 150 Ω 1 0.1 FLATNESS NORMALIZED FLATNESS – dB 2V p-p 2V p-p –2 NORMALIZED FLATNESS – dB FLATNESS FLATNESS – dB 0.1 –2 GAIN – dB NORMALIZED GAIN – dB –1 –6 200mV p-p 0 1 10 FREQUENCY – MHz 100 1k Figure 8. AD8185 Frequency Response vs. Temperature Figure 5. AD8183 Frequency Response vs. Temperature –4– 5(9$ AD8183/AD8185 –10 –10 RL = 1k⍀ RT = 37.5⍀ –30 –30 –40 –40 –50 ALL-HOSTILE –60 ADJACENT –70 –90 –100 –100 10 100 FREQUENCY – MHz 1 –110 1k ADJACENT CHANNEL-TO-CHANNEL CROSSTALK – dB –40 –50 –60 DRIVE B, LISTEN A –70 –80 DRIVE A, LISTEN B –90 –100 10 100 FREQUENCY – MHz 1 RL = 150⍀ RT = 37.5⍀ RTI MEASURED –20 –30 –40 –50 –60 DRIVE A, LISTEN B –70 –80 DRIVE B, LISTEN A –90 –100 –110 1k Figure 10. AD8183 Channel-to-Channel Crosstalk vs. Frequency 10 100 FREQUENCY – MHz 1 1k Figure 13. AD8185 Channel-to-Channel Crosstalk vs. Frequency 0 0 VO = 2V p-p RL = 150⍀ –10 VO = 2V p-p RL = 150⍀ –10 –20 –30 –30 DISTORTION – dBc –20 –40 –50 SECOND HARMONIC –60 –70 –40 –50 SECOND HARMONIC –60 –70 THIRD HARMONIC THIRD HARMONIC –80 –80 –90 –90 1 10 FUNDAMENTAL FREQUENCY – MHz –100 100 1 10 FUNDAMENTAL FREQUENCY – MHz 100 Figure 14. AD8185 Distortion vs. Frequency Figure 11. AD8183 Distortion vs. Frequency 5(9$ 1k –10 –30 –100 10 100 FREQUENCY – MHz 1 Figure 12. AD8185 Crosstalk vs. Frequency RL = 1k⍀ RT = 37.5⍀ –20 –110 ALL-HOSTILE –70 –80 –10 CHANNEL-TO-CHANNELCROSSTALK – dB –60 –90 Figure 9. AD8183 Crosstalk vs. Frequency DISTORTION – dBc –50 –80 –110 RL = 150⍀ RT = 37.5⍀ RTI MEASURED –20 CROSSTALK – dB CROSSTALK – dB –20 –5– 0 1M 1M 1M INPUT IMPEDANCE – ⍀ INPUT IMPEDANCE – ⍀ AD8183/AD8185 100k 10k 1k 100k 1k 100 100 0.1 10k 1 10 FREQUENCY – MHz 100 0.1 1k 1 10 FREQUENCY – MHz 100 1k Figure 18. AD8185 Input Impedance vs. Frequency Figure 15. AD8183 Input Impedance vs. Frequency 1k 1k 100 OUTPUT IMPEDANCE – ⍀ OUTPUT IMPEDANCE – ⍀ 1k 10 1 0.1 0.1 10 1 0.1 1 10 FREQUENCY – MHz 100 0.1 1k 1M 100k 100k OUTPUT IMPEDANCE – ⍀ 1M 10k 1k 100 10 0.1 1 10 FREQUENCY – MHz 100 1k Figure 19. AD8185 Output Impedance vs. Frequency; Enabled Figure 16. AD8183 Output Impedance vs. Frequency; Enabled OUTPUT IMPEDANCE – ⍀ 100 10k 1k 100 1 10 FREQUENCY – MHz 100 10 0.1 1k Figure 17. AD8183 Output Impedance, vs. Frequency; Disabled 1 10 FREQUENCY – MHz 100 1k Figure 20. AD8185 Output Impedance vs. Frequency; Disabled –6– 5(9$ –40 –40 –50 –50 –60 –60 –70 –70 OFF ISOLATION – dB OFF ISOLATION – dB AD8183/AD8185 –80 –90 –100 –110 –80 –90 –100 –110 –120 –120 –130 –130 –140 0.1 1 10 FREQUENCY – MHz 100 –140 0.1 500 10 FREQUENCY – MHz 100 500 Figure 24. AD8185 Off Isolation, Input–Output Figure 21. AD8183 Off Isolation, Input–Output –10 0 0 10 10 20 20 PSRR – dB –10 PSRR – dB 1 30 –PSRR 40 –PSRR 30 40 +PSRR 50 50 +PSRR 60 60 70 70 80 0.1 1 10 FREQUENCY – MHz 80 0.1 100 170 150 150 VOLTAGE NOISE – nV/ Hz VOLTAGE NOISE – nV/ Hz 170 130 110 90 70 50 100 130 110 90 70 50 30 30 10 10 100 1k 10k 100k FREQUENCY – Hz 1M 10M 10 100 1k 10k 100k FREQUENCY – Hz 1M 10M Figure 26. AD8185 RTI Voltage Noise vs. Frequency Figure 23. AD8183 Voltage Noise vs. Frequency 5(9$ 10 FREQUENCY – MHz Figure 25. AD8185 PSRR vs. Frequency Figure 22. AD8183 PSRR vs. Frequency 10 1 –7– AD8183/AD8185 VO = 2V STEP RL = 150⍀ 0.1%/DIV 0.1%/DIV VO = 2V STEP RL = 150⍀ 0 5 10 15 20 25 30 5ns/DIV 0 35 40 +1.8V SEL A/B +1.0V +1.0V IN0A AT +0.5V IN0A AT +1V +1.0V +1.0V V OUT V OUT 10 0V IN0B AT –1V 0% 0V IN0B AT –0.5V –1.0V –1.0V 10ns 10ns Figure 31. AD8185 Channel-to-Channel Switching Time Figure 28. AD8183 Channel-to-Channel Switching Time 100 35 40 90 SEL A/B 0% 15 20 25 30 5ns/DIV 100 +1.8V 90 10 10 Figure 30. AD8185 0.1% Settling Time Figure 27. AD8183 0.1% Settling Time 100 5 +1.8V SEL A/B 100 +1.0V 90 +1.8V SEL A/B +1.0V 90 +0.05V +0.05V 0V 0V –0.05V 10 –0.05V 10 0% 0% 10ns 10ns Figure 32. AD8185 Channel-to-Channel Switching Transient (Glitch) Figure 29. AD8183 Channel-to-Channel Switching Transient (Glitch) –8– 5(9$ AD8183/AD8185 VO = 200mV STEP 0.1V R = 150⍀ L VO = 200mV STEP 0.10V R = 1k⍀ L 0.05V 0.05V 0.0V 0.0V –0.05V –0.05V –0.10V –0.1V 25mV 2ns VO = 0.7V STEP 0.7V R = 1k⍀ L VO = 1.4V STEP 1.4V R = 150⍀ L 0.6V 1.2V 0.5V 1.0V 0.4V 0.8V 0.3V 0.6V 0.2V 0.4V 0.1V 0.2V 0.0V 0.0V 100mV 200mV 2ns 2ns Figure 37. AD8185 Video Amplitude Pulse Response; RL = 150 Ω Figure 34. AD8183 Video Amplitude Pulse Response; RL = 1 kΩ VO = 2V STEP 1.0V R = 1k⍀ L VO = 2V STEP 1.0V R = 150⍀ L 0.5V 0.5V 0.0V 0.0V –0.5V –0.5V –1.0V 2ns Figure 36. AD8185 Small Signal Pulse Response; RL = 150 Ω Figure 33. AD8183 Small Signal Pulse Response; RL = 1 kΩ –1.0V 250mV 250mV 2ns 2ns Figure 38. AD8185 Large Signal Pulse Response; RL = 150 Ω Figure 35. AD8183 Large Signal Pulse Response; RL = 1 kΩ 5(9$ 25mV –9– AD8183/AD8185 THEORY OF OPERATION The AD8183 (G = +1) and AD8185 (G = +2) are triple-output, 2:1 multiplexers with TTL-compatible global input switching and output enable control. Optimized for selecting between two RGB (red, green, blue) video sources, the devices have high peak slew rates, maintaining their bandwidth for large signals. Additionally, the multiplexers are compensated for high phase margin, minimizing overshoot for good pixel resolution. The multiplexers also have video specifications that are suitable for switching NTSC or PAL composite signals. RS = 0⍀, CL = 5pF 0.0V RS = 15⍀, CL = 20pF 250mV 5ns Figure 39. Pulse Responses Driving Capacitive Loads Power Supply and Layout Considerations The AD8183 and AD8185 are very high performance muxes that require attention to several important design details to realize their specified performance. Good high-frequency layout rules must be carefully observed. A good design will start with a solid ground plane. All the GND pins of the part(s) should be directly connected to it. In addition, bypass capacitors should be connected from each supply pin (VCC and VEE) to the ground plane. It is suggested to use 0.01 μF surface-mount chip capacitors as close to the IC as possible to provide high-frequency bypassing. For lower frequency bypassing, higher value tantalum capacitors— at least 10 μF—should be provided from both VCC and VEE to ground. These do not have to be as close to the IC pins, because parasitic inductance is not as big a factor at low frequencies. Crosstalk In normal operation the AD8183 and AD8185 will have signals at some of the input pins that are not switched to appear at the output. In addition, several signal paths will in general be active at one time. In any system that has high-frequency signals that are brought together in close proximity, there will be inevitable crosstalk, whereby some fraction of the undesired signals will appear at the outputs. This can result, for example, in ghost images in an RGB monitor muxing application. Note that full power bandwidth for an undistorted sinusoidal signal is often calculated using peak slew rate from the equation: Peak slew rate is not the same as average slew rate (25% to 75%) as typically specified. For a natural response, peak slew rate may be 2.7 times larger than average slew rate. Therefore, calculating a full power bandwidth with a specified average slew rate will give a pessimistic result. 1k⍀ RS = 20⍀, CL = 20pF One logic pin OE controls whether the three outputs are enabled, or disabled to a high-impedance state. The high impedance disable allows larger matrices to be built when busing the outputs together. Also, when not in use the outputs can be disabled to reduce power consumption. In the case of the AD8185 (G = +2), a feedback isolation scheme is used so that the impedance of the gain-of-two feedback network does not load the output. (2 × π × Sinusoid Amplitude) VOUT CL –0.5V The transconductance stages, NPN differential pairs, source signal current into the folded cascode output stages. Each output stage contains a compensating network and emitter follower output buffer. Internal voltage feedback sets the gain with the AD8183 being configured as a unity gain follower, and the AD8185 as a gain-of-two amplifier with a feedback network. This architecture provides drive for a reverse-terminated video load (150 Ω) with low differential gain and phase error for relatively low power consumption. Careful chip design and layout allow excellent crosstalk isolation between channels. Peak Slew Rate RS 0.5V The multiplexers are organized as three independent channels, each with two input transconductance stages and one output transimpedance stage. The appropriate input transconductance stages are selected via one logic pin (SELECT A/B), such that all three outputs switch input connections simultaneously. The unused input stages are disabled with a “t-switch” scheme to provide excellent crosstalk isolation between “on” and “off” inputs. No additional input buffering is necessary, resulting in low input capacitance and high input impedance without additional signal degradation. Full Power Bandwidth = VIN 75⍀ The AD8183 and AD8185 are capable of excellent lowcrosstalk performance. However, in order to realize the best possible crosstalk performance, certain design details should be followed. Most of the low-crosstalk specification is inherent in the part and will result from observing the power supply and layout consideration discussed above. This is because each of the input and output pins are separated by at least either a supply pin or a ground pin. APPLICATIONS Driving Capacitive Loads This package architecture helps the crosstalk performance in at least three ways. First, the supply and ground pins provide extra physical separation between the input- and output-signal pins. Physical separation is a very effective technique for reducing crosstalk. When driving a large capacitive load, most amplifiers will exhibit peaking/ringing in pulse response. To minimize peaking, and to ensure stability for larger values of capacitive loads, a small resistor, RS, can be added between the output and the load capacitor, CL. This is shown in Figure 39. Second, the supply and ground pins are at ac ground, and therefore provide a degree of shielding between the signals. This works for both capacitive crosstalk, which is due to voltages on the signals, and inductive crosstalk, which is due to currents that flow through the signal paths. –10– 5(9$ AD8183/AD8185 Third, the additional power and ground pins also yield lower impedance on the power and ground lines, and therefore minimize the effects of shared impedances on crosstalk. A delay circuit is provided for each device to ensure that the outputs of one device are disabled before the outputs of the other are enabled. Signal routing is also important for keeping crosstalk low. Shielding and separation should be used for signals that must run parallel over some length on the PC board. If signals must cross, the trace widths should be kept narrow, and the signals should cross at right angles to minimize the capacitance between the traces. If the RGB signals contain the sync information, such as a syncon-Green, this circuit is all that is necessary for the full 4:1 RGB mux. However, if sync is carried on separate signals, such as in PCs, the sync signals can be multiplexed through a digital multiplexer that operates from the same SEL signals. 4:1 RGB Multiplexer For selecting among four RGB sources to drive a monitor, two AD8185s can be combined to make a 4:1 RGB multiplexer. A circuit for this is shown in Figure 40. Each RGB source is connected to either the three “A” or “B” inputs of one of the AD8185s. In addition, all R signals are tied to “0” inputs, all G signals are tied to “1” inputs, and all B signals are tied to “2” inputs. All of these input signals should be terminated with the standard 75 Ω to ground very close to the IC pins. The RC in the OE circuit is to ensure “Break-Before-Make” operation. Using the values shown, a 20 ns time constant is created. This will delay the enabling of the outputs of the new selection until after the other devices’ outputs are disabled. This time can be shortened or eliminated if the system can tolerate the glitches caused by simultaneously enabled outputs. Each of the outputs of the AD8185 has a series 75 Ω resistor to provide a back termination for the monitor load. Whichever device is selected will drive the output signal through its three termination resistors. When terminated by the monitor, the voltage of these signals will be attenuated by a factor of two. This is normalized by the gain-of-two of the AD8185. Unlike many gain-of-two circuits, the impedance of the AD8185 is very high when it is disabled. This is due to a proprietary circuit that disconnects the feedback network from a low impedance when the part is disabled. 75⍀ R IN0A IN0B G 75⍀ OE OUT0 OE OUT1 OE OUT2 OE OUT0 OE OUT1 OE OUT2 RED 75⍀ B 75⍀ SOURCE 0 IN1A IN1B 75⍀ 75⍀ GREEN TO MONITOR R 75⍀ G IN2A IN2B B 75⍀ 75⍀ BLUE SEL A/B SOURCE 1 OE 200⍀ 100pF 75⍀ R IN0A IN0B G 75⍀ 75⍀ B SOURCE 2 75⍀ IN1A IN1B 75⍀ 75⍀ R 75⍀ G IN2A IN2B B 75⍀ SOURCE 3 75⍀ SEL A/B OE SEL 0 SEL 1 200⍀ 100pF Figure 40. 4:1 RGB Multiplexer Two control bits are required to select the input source for the RGB signals. One is applied to each of the SEL A/B inputs of each device to select between the two input sources for that device. The other bit controls the OE inputs of the two devices. 5(9$ –11– AD8183/AD8185 OUTLINE DIMENSIONS 7.90 7.80 7.70 24 13 4.50 4.40 4.30 6.40 BSC 1 12 PIN 1 0.65 BSC 0.15 0.05 0.30 0.19 1.20 MAX SEATING PLANE 0.20 0.09 8° 0° 0.75 0.60 0.45 0.10 COPLANARITY COMPLIANT TO JEDEC STANDARDS MO-153-AD Figure 41. 24-Lead Thin Shrink Small Outline Package [TSSOP] (RU-24) Dimensions shown in millimeters ORDERING GUIDE Model 1 AD8183ARUZ AD8183ARUZ-REEL AD8183ARUZ-REEL7 AD8185ARU-REEL7 AD8185ARUZ AD8185ARUZ-REEL AD8185ARUZ-REEL7 1 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Description 24-Lead Thin Shrink Small Outline Package [TSSOP] 24-Lead Thin Shrink Small Outline Package [TSSOP] 24-Lead Thin Shrink Small Outline Package [TSSOP] 24-Lead Thin Shrink Small Outline Package [TSSOP] 24-Lead Thin Shrink Small Outline Package [TSSOP] 24-Lead Thin Shrink Small Outline Package [TSSOP] 24-Lead Thin Shrink Small Outline Package [TSSOP] Package Option RU-24 RU-24 RU-24 RU-24 RU-24 RU-24 RU-24 Z = RoHS-Compliant Part. REVISION HISTORY 5/16—Rev. 0 to Rev. A Changes to General Description ..................................................... 1 Changes to OFF Isolation Parameter.............................................. 2 Changes to Power Supply and Layout Considerations Section ...... 10 Deleted Evaluation Board Section, Power and Ground Section, Inputs and Outputs Section and Figure 41; Renumbered Sequentially ......................................................................................11 Deleted SEL A/B AND OE Section and Figure 42 .....................12 Moved Outline Dimensions, Ordering Guide, and Revision History ..............................................................................................12 Updated Outline Dimensions........................................................ 12 Changes to Ordering Guide ........................................................... 12 Deleted Figure 43 and Figure 44 ................................................... 13 Deleted Figure 45 and Figure 46 ................................................... 14 Deleted Figure 47 and Figure 48 ................................................... 15 10/99—Revision 0: Initial Version ©1999–2016 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. C3689-0-5/16(A) –± 5(9$
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