22 μA, RRIO, CMOS,18 V
Operational Amplifiers
AD8657/AD8659
Data Sheet
PIN CONNECTION DIAGRAMS
Micropower at high voltage (18 V): 22 μA maximum
Low offset voltage: 350 μV maximum
Low input bias current: 20 pA maximum
Gain bandwidth product: 230 kHz at AV = 100 typical
Unity-gain crossover: 230 kHz
−3 dB closed-loop bandwidth: 305 kHz
Single-supply operation: 2.7 V to 18 V
Dual-supply operation: ±1.35 V to ±9 V
Unity-gain stable
Excellent electromagnetic interference immunity
OUT A 1
AD8657
+IN A 3
TOP VIEW
(Not to Scale)
V– 4
8
V+
7
OUT B
6
–IN B
5
+IN B
Figure 1. AD8657 Pin Configuration, 8-Lead MSOP
OUT A 1
8 V+
AD8657
–IN A 2
7 OUT B
TOP VIEW
(Not to Scale)
+IN A 3
6 –IN B
5 +IN B
V– 4
08804-061
NOTES
1. CONNECT THE EXPOSED PAD TO V– OR
LEAVE IT UNCONNECTED.
APPLICATIONS
Portable operating systems
Current monitors
4 mA to 20 mA loop drivers
Buffer/level shifting
Multipole filters
Remote/wireless sensors
Low power transimpedance amplifiers
–IN A 2
08804-001
FEATURES
Figure 2. AD8657 Pin Configuration, 8-Lead LFCSP
Note: For AD8659 pin connections and for more information
about the pin connections for these products, see the Pin
Configurations and Function Descriptions section.
60
50
GENERAL DESCRIPTION
ISY PER AMP (µA)
VSY = 2.7V
VSY = 18V
The AD8657/AD8659 are dual and quad micropower, precision,
rail-to-rail input/output amplifiers optimized for low power and
wide operating supply voltage range applications.
The AD8657/AD8659 operate from 2.7 V to 18 V with a typical
quiescent supply current of 18 μA. The devices use the Analog
Devices, Inc., patented DigiTrim® trimming technique, which
achieves low offset voltage. The AD8657/AD8659 also have
high immunity to electromagnetic interference.
The combination of low supply current, low offset voltage, very
low input bias current, wide supply range, and rail-to-rail input
and output make the AD8657/AD8659 ideal for current
monitoring in process and motor control applications. The
combination of precision specifications makes these devices
ideal for dc gain and buffering of sensor front ends or high
impedance input sources in wireless or remote sensors or
transmitters.
The AD8657/AD8659 are specified over the extended industrial
temperature range (−40°C to +125°C). The AD8657 is available in
an 8-lead MSOP package and an 8-lead LFCSP package; the
AD8659 is available in a 14-lead SOIC package and 16-lead
LFCSP package.
40
30
20
0
–50
–25
0
25
50
TEMPERATURE (°C)
75
100
125
08804-023
10
Figure 3. AD8657, Supply Current vs. Temperature
Table 1. Precision Micropower Op Amps (> RSENSE, the current through the load resistor at the
receiver side is almost equivalent to ISENSE.
Figure 78 is designed for a full-scale input voltage of 5 V. At 0 V
of input, loop current is 3.5 mA; and at a full scale of 5 V, the
loop current is 21 mA. This allows software calibration to fine
tune the current loop to the 4 mA to 20 mA range.
The AD8657 and ADR3550 both consume only 160 μA quiescent
current, making 3.34 mA current available to power additional
signal conditioning circuitry or to power a bridge circuit.
EMIRR (dB)
RNULL
1MΩ
1%
80
60
20
10M
VIN
0V TO 5V
VIN = 100mV PEAK
VSY = 2.7V TO 18V
100M
1G
10G
FREQUENCY (Hz)
R2
2kΩ
1%
Figure 77. EMIRR vs. Frequency
4 mA TO 20 mA PROCESS CONTROL CURRENT
LOOP TRANSMITTER—AD8657
VOUT
C2
C3
10µF 0.1µF
RSPAN
200kΩ
1%
R1
68kΩ
1%
08804-071
40
ADR3550
VREF
100
VIN
GND
C4
C5
0.1µF 10µF
1/2
AD8657
Q1
R4
3.3kΩ
R3
1.2kΩ
VDD
18V
D1
C1
390pF
4mA
TO
20mA
RSENSE
100Ω
1%
NOTES
1. R1 + R2 = R´.
The 2-wire current transmitters are often used in distributed
control systems and process control applications to transmit
analog signals between sensors and process controllers. Figure 78
shows a 4 mA to 20 mA current loop transmitter.
Rev. C | Page 22 of 24
Figure 78. 4 mA to 20 mA Current Loop Transmitter
RL
100Ω
08804-060
120
Data Sheet
AD8657/AD8659
OUTLINE DIMENSIONS
3.20
3.00
2.80
8
3.20
3.00
2.80
1
5.15
4.90
4.65
5
4
PIN 1
IDENTIFIER
0.65 BSC
0.95
0.85
0.75
15° MAX
1.10 MAX
0.40
0.25
6°
0°
0.80
0.55
0.40
0.23
0.09
10-07-2009-B
0.15
0.05
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 79. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
DETAIL A
(JEDEC 95)
2.44
2.34
2.24
3.10
3.00 SQ
2.90
0.50 BSC
8
5
PIN 1 INDEX
AREA
TOP VIEW
PKG-005136
SEATING
PLANE
SIDE VIEW
0.30
0.25
0.20
4
1
0.20 MIN
BOTTOM VIEW
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.203 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET
COMPLIANT TO JEDEC STANDARDS MO-229-W3030D-4
Figure 80. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-8-11)
Dimensions shown in millimeters
Rev. C | Page 23 of 24
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
02-10-2017-C
0.50
0.40
0.30
0.80
0.75
0.70
1.70
1.60
1.50
EXPOSED
PAD
AD8657/AD8659
Data Sheet
8.75 (0.3445)
8.55 (0.3366)
4.00 (0.1575)
3.80 (0.1496)
8
14
1
7
1.27 (0.0500)
BSC
0.25 (0.0098)
0.10 (0.0039)
COPLANARITY
0.10
0.51 (0.0201)
0.31 (0.0122)
6.20 (0.2441)
5.80 (0.2283)
0.50 (0.0197)
0.25 (0.0098)
1.75 (0.0689)
1.35 (0.0531)
SEATING
PLANE
45°
8°
0°
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
060606-A
COMPLIANT TO JEDEC STANDARDS MS-012-AB
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 81. 14-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-14)
Dimensions shown in millimeters and (inches)
DETAIL A
(JEDEC 95)
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
0.35
0.30
0.25
0.65
BSC
16
13
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
12
1
2.70
2.60 SQ
2.50
EXPOSED
PAD
4
9
0.80
0.75
0.70
SIDE VIEW
PKG-004828
SEATING
PLANE
0.45
0.40
0.35
5
8
BOTTOM VIEW
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
0.20 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.
02-22-2017-C
TOP VIEW
Figure 82. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-16-17)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD8657ARMZ
AD8657ARMZ-R7
AD8657ARMZ-RL
AD8657ACPZ-R7
AD8657ACPZ-RL
AD8659ARZ
AD8659ARZ-R7
AD8659ARZ-RL
AD8659ACPZ-R7
AD8659ACPZ-RL
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Lead Frame Chip Scale Package [LFCSP]
8-Lead Lead Frame Chip Scale Package [LFCSP]
14-Lead Standard Small Outline Package [SOIC_N]
14-Lead Standard Small Outline Package [SOIC_N]
14-Lead Standard Small Outline Package [SOIC_N]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
Z = RoHS Compliant Part.
©2011–2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08804-0-6/17(C)
Rev. C | Page 24 of 24
Package Option
RM-8
RM-8
RM-8
CP-8-11
CP-8-11
R-14
R-14
R-14
CP-16-17
CP-16-17
Branding
A2N
A2N
A2N
A2N
A2N
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