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AD8659ACPZ-RL

AD8659ACPZ-RL

  • 厂商:

    AD(亚德诺)

  • 封装:

    LFCSP16_4X4MM_EP

  • 描述:

    IC OPAMP GP 200KHZ RRO 16LFCSP

  • 数据手册
  • 价格&库存
AD8659ACPZ-RL 数据手册
22 μA, RRIO, CMOS,18 V Operational Amplifiers AD8657/AD8659 Data Sheet PIN CONNECTION DIAGRAMS Micropower at high voltage (18 V): 22 μA maximum Low offset voltage: 350 μV maximum Low input bias current: 20 pA maximum Gain bandwidth product: 230 kHz at AV = 100 typical Unity-gain crossover: 230 kHz −3 dB closed-loop bandwidth: 305 kHz Single-supply operation: 2.7 V to 18 V Dual-supply operation: ±1.35 V to ±9 V Unity-gain stable Excellent electromagnetic interference immunity OUT A 1 AD8657 +IN A 3 TOP VIEW (Not to Scale) V– 4 8 V+ 7 OUT B 6 –IN B 5 +IN B Figure 1. AD8657 Pin Configuration, 8-Lead MSOP OUT A 1 8 V+ AD8657 –IN A 2 7 OUT B TOP VIEW (Not to Scale) +IN A 3 6 –IN B 5 +IN B V– 4 08804-061 NOTES 1. CONNECT THE EXPOSED PAD TO V– OR LEAVE IT UNCONNECTED. APPLICATIONS Portable operating systems Current monitors 4 mA to 20 mA loop drivers Buffer/level shifting Multipole filters Remote/wireless sensors Low power transimpedance amplifiers –IN A 2 08804-001 FEATURES Figure 2. AD8657 Pin Configuration, 8-Lead LFCSP Note: For AD8659 pin connections and for more information about the pin connections for these products, see the Pin Configurations and Function Descriptions section. 60 50 GENERAL DESCRIPTION ISY PER AMP (µA) VSY = 2.7V VSY = 18V The AD8657/AD8659 are dual and quad micropower, precision, rail-to-rail input/output amplifiers optimized for low power and wide operating supply voltage range applications. The AD8657/AD8659 operate from 2.7 V to 18 V with a typical quiescent supply current of 18 μA. The devices use the Analog Devices, Inc., patented DigiTrim® trimming technique, which achieves low offset voltage. The AD8657/AD8659 also have high immunity to electromagnetic interference. The combination of low supply current, low offset voltage, very low input bias current, wide supply range, and rail-to-rail input and output make the AD8657/AD8659 ideal for current monitoring in process and motor control applications. The combination of precision specifications makes these devices ideal for dc gain and buffering of sensor front ends or high impedance input sources in wireless or remote sensors or transmitters. The AD8657/AD8659 are specified over the extended industrial temperature range (−40°C to +125°C). The AD8657 is available in an 8-lead MSOP package and an 8-lead LFCSP package; the AD8659 is available in a 14-lead SOIC package and 16-lead LFCSP package. 40 30 20 0 –50 –25 0 25 50 TEMPERATURE (°C) 75 100 125 08804-023 10 Figure 3. AD8657, Supply Current vs. Temperature Table 1. Precision Micropower Op Amps (> RSENSE, the current through the load resistor at the receiver side is almost equivalent to ISENSE. Figure 78 is designed for a full-scale input voltage of 5 V. At 0 V of input, loop current is 3.5 mA; and at a full scale of 5 V, the loop current is 21 mA. This allows software calibration to fine tune the current loop to the 4 mA to 20 mA range. The AD8657 and ADR3550 both consume only 160 μA quiescent current, making 3.34 mA current available to power additional signal conditioning circuitry or to power a bridge circuit. EMIRR (dB) RNULL 1MΩ 1% 80 60 20 10M VIN 0V TO 5V VIN = 100mV PEAK VSY = 2.7V TO 18V 100M 1G 10G FREQUENCY (Hz) R2 2kΩ 1% Figure 77. EMIRR vs. Frequency 4 mA TO 20 mA PROCESS CONTROL CURRENT LOOP TRANSMITTER—AD8657 VOUT C2 C3 10µF 0.1µF RSPAN 200kΩ 1% R1 68kΩ 1% 08804-071 40 ADR3550 VREF 100 VIN GND C4 C5 0.1µF 10µF 1/2 AD8657 Q1 R4 3.3kΩ R3 1.2kΩ VDD 18V D1 C1 390pF 4mA TO 20mA RSENSE 100Ω 1% NOTES 1. R1 + R2 = R´. The 2-wire current transmitters are often used in distributed control systems and process control applications to transmit analog signals between sensors and process controllers. Figure 78 shows a 4 mA to 20 mA current loop transmitter. Rev. C | Page 22 of 24 Figure 78. 4 mA to 20 mA Current Loop Transmitter RL 100Ω 08804-060 120 Data Sheet AD8657/AD8659 OUTLINE DIMENSIONS 3.20 3.00 2.80 8 3.20 3.00 2.80 1 5.15 4.90 4.65 5 4 PIN 1 IDENTIFIER 0.65 BSC 0.95 0.85 0.75 15° MAX 1.10 MAX 0.40 0.25 6° 0° 0.80 0.55 0.40 0.23 0.09 10-07-2009-B 0.15 0.05 COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MO-187-AA Figure 79. 8-Lead Mini Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters DETAIL A (JEDEC 95) 2.44 2.34 2.24 3.10 3.00 SQ 2.90 0.50 BSC 8 5 PIN 1 INDEX AREA TOP VIEW PKG-005136 SEATING PLANE SIDE VIEW 0.30 0.25 0.20 4 1 0.20 MIN BOTTOM VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.203 REF FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET COMPLIANT TO JEDEC STANDARDS MO-229-W3030D-4 Figure 80. 8-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body and 0.75 mm Package Height (CP-8-11) Dimensions shown in millimeters Rev. C | Page 23 of 24 PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) 02-10-2017-C 0.50 0.40 0.30 0.80 0.75 0.70 1.70 1.60 1.50 EXPOSED PAD AD8657/AD8659 Data Sheet 8.75 (0.3445) 8.55 (0.3366) 4.00 (0.1575) 3.80 (0.1496) 8 14 1 7 1.27 (0.0500) BSC 0.25 (0.0098) 0.10 (0.0039) COPLANARITY 0.10 0.51 (0.0201) 0.31 (0.0122) 6.20 (0.2441) 5.80 (0.2283) 0.50 (0.0197) 0.25 (0.0098) 1.75 (0.0689) 1.35 (0.0531) SEATING PLANE 45° 8° 0° 1.27 (0.0500) 0.40 (0.0157) 0.25 (0.0098) 0.17 (0.0067) 060606-A COMPLIANT TO JEDEC STANDARDS MS-012-AB CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. Figure 81. 14-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-14) Dimensions shown in millimeters and (inches) DETAIL A (JEDEC 95) PIN 1 INDICATOR 4.10 4.00 SQ 3.90 0.35 0.30 0.25 0.65 BSC 16 13 PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) 12 1 2.70 2.60 SQ 2.50 EXPOSED PAD 4 9 0.80 0.75 0.70 SIDE VIEW PKG-004828 SEATING PLANE 0.45 0.40 0.35 5 8 BOTTOM VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF 0.20 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-WGGC. 02-22-2017-C TOP VIEW Figure 82. 16-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body and 0.75 mm Package Height (CP-16-17) Dimensions shown in millimeters ORDERING GUIDE Model1 AD8657ARMZ AD8657ARMZ-R7 AD8657ARMZ-RL AD8657ACPZ-R7 AD8657ACPZ-RL AD8659ARZ AD8659ARZ-R7 AD8659ARZ-RL AD8659ACPZ-R7 AD8659ACPZ-RL 1 Temperature Range −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C Package Description 8-Lead Mini Small Outline Package [MSOP] 8-Lead Mini Small Outline Package [MSOP] 8-Lead Mini Small Outline Package [MSOP] 8-Lead Lead Frame Chip Scale Package [LFCSP] 8-Lead Lead Frame Chip Scale Package [LFCSP] 14-Lead Standard Small Outline Package [SOIC_N] 14-Lead Standard Small Outline Package [SOIC_N] 14-Lead Standard Small Outline Package [SOIC_N] 16-Lead Lead Frame Chip Scale Package [LFCSP] 16-Lead Lead Frame Chip Scale Package [LFCSP] Z = RoHS Compliant Part. ©2011–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08804-0-6/17(C) Rev. C | Page 24 of 24 Package Option RM-8 RM-8 RM-8 CP-8-11 CP-8-11 R-14 R-14 R-14 CP-16-17 CP-16-17 Branding A2N A2N A2N A2N A2N
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