AD9250BCPZ-250

FEATURES FUNCTIONAL BLOCK DIAGRAM JESD204B Subclass 0 or Subclass 1 coded serial digital outputs Signal-to-noise ratio (SNR) = 70.6 dBFS at 185 MHz AIN and 250 MSPS Spurious-free dynamic range (SFDR) = 88 dBc at 185 MHz AIN and 250 MSPS Total power consumption: 711 mW at 250 MSPS 1.8 V supply voltages Integer 1-to-8 input clock divider Sample rates of up to 250 MSPS IF sampling frequencies of up to 400 MHz Internal analog-to-digital converter (ADC) voltage reference Flexible analog input range 1.4 V p-p to 2.0 V p-p (1.75 V p-p nominal) ADC clock duty cycle stabilizer (DCS) 95 dB channel isolation/crosstalk Serial port control Energy saving power-down modes APPLICATIONS Diversity radio systems Multimode digital receivers (3G) TD-SCDMA, WiMAX, W-CDMA, CDMA2000, GSM, EDGE, LTE DOCSIS 3.0 CMTS upstream receive paths HFC digital reverse path receivers I/Q demodulation systems Smart antenna systems Electronic test and measurement equipment Radar receivers COMSEC radio architectures IED detection/jamming systems General-purpose software radios Broadband data applications AVDD DRVDD DVDD AGND DGND DRGND AD9250 VIN+A VIN–A PIPELINE 14-BIT ADC VCM VIN+B VIN–B PIPELINE 14-BIT ADC JESD204B INTERFACE SERDOUT0± CML, TX OUTPUTS HIGH SPEED SERIALIZERS SERDOUT1± CONTROL REGISTERS SYSREF± SYNCINB± CLK± RFCLK CLOCK GENERATION CMOS DIGITAL INPUT/OUTPUT RST SDIO SCLK CS FAST DETECT CMOS DIGITAL INPUT PDWN CMOS DIGITAL OUTPUT FDA FDB 10559-001 Data Sheet 14-Bit, 170 MSPS/250 MSPS, JESD204B, Dual Analog-to-Digital Converter AD9250 Figure 1. PRODUCT HIGHLIGHTS 1. Integrated dual, 14-bit, 170 MSPS/250 MSPS ADC. 2. The configurable JESD204B output block supports up to 5 Gbps per lane. 3. An on-chip, phase-locked loop (PLL) allows users to provide a single ADC sampling clock; the PLL multiplies the ADC sampling clock to produce the corresponding JESD204B data rate clock. 4. Support for an optional RF clock input to ease system board design. 5. Proprietary differential input maintains excellent SNR performance for input frequencies of up to 400 MHz. 6. Operation from a single 1.8 V power supply. 7. Standard serial port interface (SPI) that supports various product features and functions such as controlling the clock DCS, power-down, test modes, voltage reference mode, over range fast detection, and serial output configuration. This product may be protected by one or more U.S. or international patents. Rev. E Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2012–2017 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com AD9250 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 JESD204B Overview .................................................................. 25 Applications ....................................................................................... 1 JESD204B Synchronization Details ......................................... 26 Functional Block Diagram .............................................................. 1 Link Setup Parameters ............................................................... 26 Product Highlights ........................................................................... 1 Frame and Lane Alignment Monitoring and Correction ..... 30 Revision History ............................................................................... 3 Digital Outputs and Timing ..................................................... 30 General Description ......................................................................... 4 ADC Overrange and Gain Control.......................................... 32 Specifications..................................................................................... 5 ADC Overrange (OR)................................................................ 32 ADC DC Specifications ............................................................... 5 Gain Switching ............................................................................ 32 ADC AC Specifications ............................................................... 6 DC Correction ................................................................................ 33 Digital Specifications ................................................................... 7 DC Correction Bandwidth........................................................ 33 Switching Specifications .............................................................. 9 DC Correction Readback .......................................................... 33 Timing Specifications ................................................................ 10 DC Correction Freeze ................................................................ 33 Absolute Maximum Ratings .......................................................... 11 DC Correction (DCC) Enable Bits .......................................... 33 Thermal Characteristics ............................................................ 11 Serial Port Interface (SPI) .............................................................. 34 ESD Caution ................................................................................ 11 Configuration Using the SPI ..................................................... 34 Pin Configuration and Function Descriptions ........................... 12 Hardware Interface ..................................................................... 34 Typical Performance Characteristics ........................................... 14 SPI Accessible Features .............................................................. 35 Equivalent Circuits ......................................................................... 18 Memory Map .................................................................................. 36 Theory of Operation ...................................................................... 20 Reading the Memory Map Register Table............................... 36 ADC Architecture ...................................................................... 20 Memory Map Register Table ..................................................... 37 Analog Input Considerations.................................................... 20 Memory Map Register Description ......................................... 41 Voltage Reference ....................................................................... 21 Applications Information .............................................................. 42 Clock Input Considerations ...................................................... 21 Design Guidelines ...................................................................... 42 Power Dissipation and Standby Mode ..................................... 24 SPI Initialization Sequence ....................................................... 42 Digital Outputs ............................................................................... 25 Outline Dimensions ....................................................................... 45 JESD204B Transmit Top Level Description ............................ 25 Ordering Guide .......................................................................... 45 Rev. E | Page 2 of 45 Data Sheet AD9250 REVISION HISTORY 9/2017—Rev. D to Rev. E Changes to Channel-Specific Registers Section ................................. 36 Changes to Table 18 ................................................................................... 37 Changes to Figure 63 and Table 19 ........................................................ 43 5/2017—Rev. C to Rev. D Change to Differential Output Voltage (VOD) Parameter, Table 3 .... 8 Deleted Synchronization Section ..................................................26 Changes to Link Setup Parameters Section .................................26 Deleted Clock Adjustment Register Writes Section ...................27 Added Internal FIFO Timing Optimization Section .................28 Changes to Table 14 ........................................................................30 Changes to Channel-Specific Registers Section ..........................36 Deleted Transfer Register Map Section ........................................37 Changes to Table 18 ........................................................................37 Added SPI Initialization Sequence Section..................................42 Added Figure 63 and Table 19; Renumbered Sequentially ........43 Deleted JESD204B Configuration Section ...................................44 Updated Outline Dimensions ........................................................45 1/2016—Rev. B to Rev. C Moved Revision History Section ..................................................... 3 Changes to Nyquist Clock Input Options ....................................22 Added Synchronization Section ....................................................26 Added Click Adjustment Register Writes Section ......................27 Changes to Link Setup Parameters Section .................................27 Change to Additional Digital Output Configuration Options Section ..............................................................................................29 Added Table 14, Renumbered Sequentially .................................30 Changes to Table 18 ........................................................................38 Added JESD204B Configuration Section ....................................43 12/2013—Rev. A to Rev. B Change to Features Section .............................................................. 1 Change to Functional Block Diagram ............................................ 1 Change to SYNCIN Input (SYNCINB+/SYNCINB−), Logic Compliance Parameter, Table 3 ....................................................... 6 Changes to Data Output Parameters, Table 4 ............................... 8 Changes to Figure 3 .......................................................................... 9 Change to Figure 30, Added Figure 34 through Figure 37; Renumbered Sequentially .............................................................. 17 Changes to Table 9 .......................................................................... 20 Change to Figure 47 ........................................................................ 21 Changes to JESD204B Overview Section .................................... 24 Change to Configure Details Options Section ............................ 26 Change to Check FCHK, Checksum of JESD204B Interface Parameters Section .......................................................................... 27 Changes to Figure 54 ...................................................................... 28 Changes to Figure 57 and Figure 58 ............................................. 29 Changes to Figure 59 and Figure 60 ............................................. 30 Changes to Table 17 ........................................................................ 36 Updated Outline Dimensions........................................................ 42 3/2013—Rev. 0 to Rev. A Changes to High Level Input Current and Low Level Input Current; Table 3 ................................................................................. 6 Changes to Table 4 ............................................................................ 8 Changes to Figure 3 Caption ........................................................... 9 Changes to Digital Inputs Description; Table 8 .......................... 11 Changes to JESD204B Synchronization Details Section ........... 24 Changes to Configure Detailed Options Section........................ 25 Changes to Fast Threshold Detection (FDA and FDB) Section ...30 Deleted Built-In Self-Test (BIST) and Output Test Section ...... 32 Changes to Transfer Register Map Section .................................. 34 Changes to Table 17 ........................................................................ 35 10/2012—Revision 0: Initial Version Rev. E | Page 3 of 45 AD9250 Data Sheet GENERAL DESCRIPTION The AD9250 is a dual, 14-bit ADC with sampling speeds of up to 250 MSPS. The AD9250 is designed to support communications applications where low cost, small size, wide bandwidth, and versatility are desired. The ADC cores feature a multistage, differential pipelined architecture with integrated output error correction logic. The ADC cores feature wide bandwidth inputs supporting a variety of user-selectable input ranges. An integrated voltage reference eases design considerations. A duty cycle stabilizer is provided to compensate for variations in the ADC clock duty cycle, allowing the converters to maintain excellent performance. The JESD204B high speed serial interface reduces board routing requirements and lowers pin count requirements for the receiving device. By default, the ADC output data is routed directly to the two JESD204B serial output lanes. These outputs are at CML voltage levels. Four modes support any combination of M = 1 or 2 (single or dual converters) and L = 1 or 2 (one or two lanes). For dual ADC mode, data can be sent through two lanes at the maximum sampling rate of 250 MSPS. However, if data is sent through one lane, a sampling rate of up to 125 MSPS is supported. Synchronization inputs (SYNCINB± and SYSREF±) are provided. Flexible power-down options allow significant power savings, when desired. Programmable overrange level detection is supported for each channel via the dedicated fast detect pins. Programming for setup and control are accomplished using a 3-wire SPI-compatible serial interface. The AD9250 is available in a 48-lead LFCSP and is specified over the industrial temperature range of −40°C to +85°C. Rev. E | Page 4 of 45 Data Sheet AD9250 SPECIFICATIONS ADC DC SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, DVDD = 1.8 V, maximum sample rate for speed grade, VIN = −1.0 dBFS differential input, 1.75 V p-p full-scale input range, duty cycle stabilizer (DCS) enabled, link parameters used were M = 2 and L = 2, unless otherwise noted. Table 1. Parameter RESOLUTION ACCURACY No Missing Codes Offset Error Gain Error Differential Nonlinearity (DNL) Integral Nonlinearity (INL) 1 MATCHING CHARACTERISTIC Offset Error Gain Error TEMPERATURE DRIFT Offset Error Gain Error INPUT REFERRED NOISE VREF = 1.0 V ANALOG INPUT Input Span Input Capacitance 2 Input Resistance 3 Input Common-Mode Voltage POWER SUPPLIES Supply Voltage AVDD DRVDD DVDD Supply Current IAVDD IDRVDD + IDVDD POWER CONSUMPTION Sine Wave Input Standby Power 4 Power-Down Power Temperature Full Full Full Full Full 25°C Full 25°C Full Full Min 14 AD9250-170 Typ Max Min 14 Guaranteed −16 −6 AD9250-250 Typ Max Guaranteed +16 +2 ±0.75 −16 −6 ±0.25 +16 +2.5 ±0.75 ±0.25 ±2.1 ±3.5 ±1.5 −15 −2 Unit Bits ±1.5 +15 +3.5 −15 −2 +15 +3 mV %FSR LSB LSB LSB LSB mV %FSR Full Full ±2 ±16 ±2 ±44 ppm/°C ppm/°C 25°C 1.49 1.49 LSB rms Full Full Full Full 1.75 2.5 20 0.9 1.75 2.5 20 0.9 V p-p pF kΩ V Full Full Full 1.7 1.7 1.7 1.8 1.8 1.8 1.9 1.9 1.9 Full Full 233 104 260 113 Full Full Full 607 280 9 Measured with a low input frequency, full-scale sine wave. Input capacitance refers to the effective capacitance between one differential input pin and its complement. 3 Input resistance refers to the effective resistance between one differential input pin and its complement. 4 Standby power is measured with a dc input and the CLK± pin active. 1 2 Rev. E | Page 5 of 45 1.7 1.7 1.7 1.8 1.8 1.8 1.9 1.9 1.9 V V V 255 140 280 160 mA mA 711 339 9 mW mW mW AD9250 Data Sheet ADC AC SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, DVDD = 1.8 V, maximum sample rate for speed grade, VIN = −1.0 dBFS differential input, 1.75 V p-p full-scale input range, link parameters used were M = 2 and L = 2, unless otherwise noted. Table 2. Parameter 1 SIGNAL-TO-NOISE-RATIO (SNR) fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz fIN = 220 MHz SIGNAL-TO-NOISE AND DISTORTION (SINAD) fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz fIN = 220 MHz EFFECTIVE NUMBER OF BITS (ENOB) fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz fIN = 220 MHz SPURIOUS-FREE DYNAMIC RANGE (SFDR) fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz fIN = 220 MHz WORST SECOND OR THIRD HARMONIC fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz fIN = 220 MHz WORST OTHER (HARMONIC OR SPUR) fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz fIN = 220 MHz Temperature 25°C 25°C Full 25°C 25°C Full 25°C 25°C 25°C Full 25°C 25°C Full 25°C Min AD9250-170 Typ Max Min AD9250-250 Typ Max 72.5 72.0 72.1 71.7 71.4 70.7 71.2 70.6 dBFS dBFS dBFS dBFS dBFS dBFS dBFS 70.7 69.3 70.1 70.0 71.3 70.9 70.7 70.5 70.3 69.6 70.0 69.5 Unit 68.9 68.8 dBFS dBFS dBFS dBFS dBFS dBFS dBFS 25°C 25°C 25°C 25°C 25°C 11.5 11.4 11.3 11.1 10.9 11.5 11.4 11.3 11.2 11.0 Bits Bits Bits Bits Bits 25°C 25°C Full 25°C 25°C Full 25°C 92 95 89 86 91 86 86 88 dBc dBc dBc dBc dBc dBc dBc 25°C 25°C Full 25°C 25°C Full 25°C 25°C 25°C Full 25°C 25°C Full 25°C Rev. E | Page 6 of 45 69.6 68.0 78 80 85 88 −92 −95 −89 −87 −78 −91 −86 −86 −88 −85 −88 −95 −94 −94 −96 −80 −78 −97 −96 −96 −88 −93 −91 −80 dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc Data Sheet Parameter 1 TWO-TONE SFDR fIN = 184.12 MHz (−7 dBFS), 187.12 MHz (−7 dBFS) CROSSTALK 2 FULL POWER BANDWIDTH 3 AD9250 Temperature 25°C Full 25°C Min AD9250-170 Typ Max Min AD9250-250 Typ Max 87 95 1000 Unit 84 95 1000 dBc dB MHz See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation for a complete set of definitions. Crosstalk is measured at 100 MHz with −1.0 dBFS on one channel and no input on the alternate channel. 3 Full power bandwidth is the bandwidth of operation determined by where the spectral power of the fundamental frequency is reduced by 3 dB. 1 2 DIGITAL SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, DVDD = 1.8 V, maximum sample rate for speed grade, VIN = −1.0 dBFS differential input, 1.75 V p-p full-scale input range, DCS enabled, link parameters used were M = 2 and L = 2, unless otherwise noted. Table 3. Parameter DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−) Input CLK± Clock Rate Logic Compliance Internal Common-Mode Bias Differential Input Voltage Input Voltage Range Input Common-Mode Range High Level Input Current Low Level Input Current Input Capacitance Input Resistance RF CLOCK INPUT (RFCLK) Input CLK± Clock Rate Logic Compliance Internal Bias Input Voltage Range Input Voltage Level High Low High Level Input Current Low Level Input Current Input Capacitance Input Resistance (AC-Coupled) SYNCIN INPUT (SYNCINB+/SYNCINB−) Logic Compliance Internal Common-Mode Bias Differential Input Voltage Range Input Voltage Range Input Common-Mode Range High Level Input Current Low Level Input Current Input Capacitance Input Resistance Temperature Min Full 40 Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Rev. E | Page 7 of 45 Typ Max Unit 625 MHz CMOS/LVDS/LVPECL 0.9 12 V V p-p V V µA µA pF kΩ 1500 MHz AGND AVDD V V 1.2 AGND 0 −150 AVDD 0.6 +150 0 0.3 AGND 0.9 0 −60 8 3.6 AVDD 1.4 +60 0 4 10 650 CMOS/LVDS/LVPECL 0.9 8 1 10 12 CMOS/LVDS 0.9 0.3 DGND 0.9 −5 −5 12 3.6 DVDD 1.4 +5 +5 1 16 20 V V µA µA pF kΩ V V p-p V V µA µA pF kΩ AD9250 Parameter SYSREF INPUT (SYSREF±) Logic Compliance Internal Common-Mode Bias Differential Input Voltage Range Input Voltage Range Input Common-Mode Range High Level Input Current Low Level Input Current Input Capacitance Input Resistance LOGIC INPUT (RST, CS) 1 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance LOGIC INPUT (SCLK/PDWN) 2 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance LOGIC INPUTS (SDIO)2 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance DIGITAL OUTPUTS (SERDOUT0±/SERDOUT1±) Logic Compliance Differential Output Voltage (VOD) Output Offset Voltage (VOS) DIGITAL OUTPUTS (SDIO/FDA/FDB) High Level Output Voltage (VOH) IOH = 50 µA IOH = 0.5 mA Low Level Output Voltage (VOL) IOL = 1.6 mA IOL = 50 µA 1 2 Data Sheet Temperature Min Typ Max Unit LVDS Full Full Full Full Full Full Full Full 0.9 0.3 AGND 0.9 −5 −5 8 Full Full Full Full Full Full 1.22 0 −5 −100 Full Full Full Full Full Full 1.22 0 45 −10 Full Full Full Full Full Full 1.22 0 45 −10 Full Full Full Full Full Full Full Full Full Pull-up. Pull-down. Rev. E | Page 8 of 45 3.6 AVDD 1.4 +5 +5 4 10 12 2.1 0.6 +5 −45 V V µA µA kΩ pF 2.1 0.6 100 +10 V V µA µA kΩ pF 2.1 0.6 100 10 V V µA µA kΩ pF 750 1.05 mV p-p V 26 2 26 2 26 5 400 0.75 CML 600 DRVDD/2 V V p-p V V µA µA pF kΩ 1.79 1.75 V V 0.2 0.05 V V Data Sheet AD9250 SWITCHING SPECIFICATIONS Table 4. Parameter CLOCK INPUT PARAMETERS Conversion Rate 1 SYSREF± Setup Time to Rising Edge CLK± 2 SYSREF± Hold Time from Rising Edge CLK±2 SYSREF± Setup Time to Rising Edge RFCLK2 SYSREF± Hold Time from Rising Edge RFCLK2 CLK± Pulse Width High Divide-by-1 Mode, DCS Enabled Divide-by-1 Mode, DCS Disabled Divide-by-2 Mode Through Divide-by-8 Mode Aperture Delay Aperture Uncertainty (Jitter) DATA OUTPUT PARAMETERS Data Output Period or Unit Interval (UI) Data Output Duty Cycle Data Valid Time PLL Lock Time (tLOCK) Wake-Up Time Standby ADC (Power-Down) 3 Output (Power-Down) 4 Subclass 0: SYNCINB± Falling Edge to First Valid K.28 Characters (Delay Required for Rx CGS Start) Subclass 1: SYSREF± Rising Edge to First Valid K.28 Characters (Delay Required for SYNCB± Rising Edge/Rx CGS Start) CGS Phase K.28 Characters Duration Pipeline Delay JESD204B M1, L1 Mode (Latency) JESD204B M1, L2 Mode (Latency) JESD204B M2, L1 Mode (Latency) JESD204B M2, L2 Mode (Latency) Fast Detect (Latency) Data Rate per Lane Uncorrelated Bounded High Probability (UBHP) Jitter Random Jitter At 3.4 Gbps At 5.0 Gbps Output Rise/Fall Time Differential Termination Resistance Out-of-Range Recovery Time AD9250-170 Min Typ Max AD9250-250 Min Typ Max Full Full Full Full Full 40 40 Full Full Full Full Full 2.61 2.76 0.8 Full 25°C 25°C 25°C L/(20 × M × fS) 50 0.84 25 Symbol Temperature fS tREFS tREFH tREFSRF tREFHRF tCH tA tJ 170 0.31 0 0.50 0 2.9 2.9 250 MSPS ns ns ns ns 2.2 2.1 ns ns ns ns ps rms 0.31 0 0.50 0 3.19 3.05 1.8 1.9 0.8 1.0 0.16 2.0 2.0 1.0 0.16 L/(20 × M × fS) 50 0.78 25 10 250 50 Unit Seconds % UI µs 25°C 25°C 25°C Full 5 5 µs µs µs Multiframes Full 6 6 Multiframes Full 1 1 Multiframes Full Full Full Full Full Full 25°C 36 59 25 36 7 3.4 6 Full Full Full 25°C Full 2.3 10 250 50 36 59 25 36 7 2 Rev. E | Page 9 of 45 1.7 60 100 3 ps rms ps rms ps Ω Cycles 5.0 60 100 3 Conversion rate is the clock rate after the divider. Refer to Figure 3 for timing diagram. 3 Wake-up time ADC is defined as the time required for the ADC to return to normal operation from power-down mode. 4 Wake-up time output is defined as the time required for JESD204B output to return to normal operation from power-down mode. 5 Cycles refers to ADC conversion rate cycles. 1 8 Cycles 5 Cycles Cycles Cycles Cycles Gbps ps 5.0 AD9250 Data Sheet TIMING SPECIFICATIONS Table 5. Parameter SPI TIMING REQUIREMENTS (See Figure 62) tDS tDH tCLK tS tH tHIGH tLOW tEN_SDIO tDIS_SDIO tSPI_RST Test Conditions/Comments Min Typ Max Unit Setup time between the data and the rising edge of SCLK Hold time between the data and the rising edge of SCLK Period of the SCLK Setup time between CS and SCLK Hold time between CS and SCLK Minimum period that SCLK should be in a logic high state Minimum period that SCLK should be in a logic low state Time required for the SDIO pin to switch from an input to an output relative to the SCLK falling edge (not shown in figures) Time required for the SDIO pin to switch from an output to an input relative to the SCLK rising edge (not shown in figures) Time required after hard or soft reset until SPI access is available (not shown in figures) 2 2 40 2 2 10 10 10 ns ns ns ns ns ns ns ns 10 ns 500 µs Timing Diagrams SAMPLE N N – 36 N+1 N – 35 ANALOG INPUT SIGNAL N – 34 N–1 N – 33 CLK– CLK+ CLK– CLK+ SERDOUT1± SAMPLE N – 36 ENCODED INTO 2 8b/10b SYMBOLS SAMPLE N – 35 ENCODED INTO 2 8b/10b SYMBOLS SAMPLE N – 34 ENCODED INTO 2 8b/10b SYMBOLS Figure 2. Data Output Timing RFCLK CLK+ SYSREF+ tREFS tREFSRF tREFH SYSREF+ SYSREF– SYSREF– NOTES 1. CLOCK INPUT IS EITHER RFCLK OR CLK±, NOT BOTH. Figure 3. SYSREF± Setup and Hold Timing Rev. E | Page 10 of 45 tREFHRF 10559-003 CLK– 10559-002 SERDOUT0± Data Sheet AD9250 ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS Table 6. Parameter ELECTRICAL AVDD to AGND DRVDD to AGND DVDD to DGND VIN+A/VIN+B, VIN−A/VIN−B to AGND CLK+, CLK− to AGND RFCLK to AGND VCM to AGND CS, PDWN to AGND SCLK to AGND SDIO to AGND RST to DGND FDA, FDB to DGND SERDOUT0+, SERDOUT0−, SERDOUT1+, SERDOUT1− to AGND SYNCINB+, SYNCINB− to DGND SYSREF+, SYSREF− to AGND ENVIRONMENTAL Operating Temperature Range (Ambient) Maximum Junction Temperature Under Bias Storage Temperature Range (Ambient) Rating −0.3 V to +2.0 V −0.3 V to +2.0 V −0.3 V to +2.0 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.3 V −0.3 V to AVDD + 0.3 V −0.3 V to AVDD + 0.3 V −0.3 V to DVDD + 0.3 V −0.3 V to DVDD + 0.3 V −0.3 V to DRVDD + 0.3 V −0.3 V to DVDD + 0.3 V −0.3 V to AVDD + 0.3 V −40°C to +85°C 150°C The exposed paddle must be soldered to the ground plane for the LFCSP package. This increases the reliability of the solder joints, maximizing the thermal capability of the package. Table 7. Thermal Resistance Package Type 48-Lead LFCSP 7 mm × 7 mm (CP-48-13) Airflow Velocity (m/sec) 0 1.0 2.5 θJA1, 2 25 22 20 θJC1, 3 2 θJB1, 4 14 Unit °C/W °C/W °C/W Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board. Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). 3 Per MIL-STD-883, Method 1012.1. 4 Per JEDEC JESD51-8 (still air). 1 2 Typical θJA is specified for a 4-layer printed circuit board (PCB) with a solid ground plane. As shown in Table 7, airflow increases heat dissipation, which reduces θJA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes reduces the θJA. ESD CAUTION −65°C to +125°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. E | Page 11 of 45 AD9250 Data Sheet 48 47 46 45 44 43 42 41 40 39 38 37 AVDD AVDD VIN–B VIN+B AVDD AVDD VCM AVDD AVDD VIN+A VIN–A AVDD PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 36 35 34 33 32 31 30 29 28 27 26 25 AD9250 TOP VIEW (Not to Scale) AVDD DNC PDWN CS SCLK SDIO DVDD DNC DNC FDA FDB DVDD NOTES 1. DNC = DO NOT CONNECT. DO NOT CONNECT TO THIS PIN. 2. THE EXPOSED THERMAL PADDLE ON THE BOTTOM OF THE PACKAGE PROVIDES THE GROUND REFERENCE FOR DRVDD AND AVDD. THIS EXPOSED PADDLE MUST BE CONNECTED TO GROUND FOR PROPER OPERATION. 10559-004 DVDD SYNCINB+ SYNCINB– DVDD DGND SERDOUT1+ SERDOUT1– DRVDD SERDOUT0– SERDOUT0+ DGND DVDD 13 14 15 16 17 18 19 20 21 22 23 24 AVDD 1 RFCLK 2 CLK– 3 CLK+ 4 AVDD 5 SYSREF+ 6 SYSREF– 7 AVDD 8 DVDD 9 RST 10 DVDD 11 DNC 12 Figure 4. Pin Configuration (Top View) Table 8. Pin Function Descriptions Pin No. ADC Power Supplies 1, 5, 8, 36, 37, 40, 41, 43, 44, 47, 48 9, 11, 13, 16, 24, 25, 30 12, 28, 29, 35 17, 23 20 Exposed Paddle ADC Analog 2 3 4 38 39 42 45 46 ADC Fast Detect Outputs 26 27 Digital Inputs 6 7 14 15 Mnemonic Type Description AVDD DVDD DNC DGND DRVDD Supply Supply AGND/DRGND Ground Analog Power Supply (1.8 V Nominal). Digital Power Supply (1.8 V Nominal). Do Not Connect. Ground Reference for DVDD. JESD204B PHY Serial Output Driver Supply (1.8 V Nominal). Note that the DRVDD power is referenced to the AGND Plane. The exposed thermal paddle on the bottom of the package provides the ground reference for DRVDD and AVDD. This exposed paddle must be connected to ground for proper operation. RFCLK CLK− CLK+ VIN−A VIN+A VCM Input Input Input Input Input Output VIN+B VIN−B Input Input ADC RF Clock Input. ADC Nyquist Clock Input—Complement. ADC Nyquist Clock Input—True. Differential Analog Input Pin (−) for Channel A. Differential Analog Input Pin (+) for Channel A. Common-Mode Level Bias Output for Analog Inputs. Decouple this pin to ground using a 0.1 µF capacitor. Differential Analog Input Pin (+) for Channel B. Differential Analog Input Pin (−) for Channel B. FDB FDA Output Output Channel B Fast Detect Indicator (CMOS Levels). Channel A Fast Detect Indicator (CMOS Levels). SYSREF+ SYSREF− SYNCINB+ SYNCINB− Input Input Input Input JESD204B LVDS SYSREF Input—True. JESD204B LVDS SYSREF Input—Complement. JESD204B LVDS SYNC Input—True. JESD204B LVDS SYNC Input—Complement. Supply Rev. E | Page 12 of 45 Data Sheet Pin No. Data Outputs 18 19 21 22 DUT Controls 10 31 32 33 34 AD9250 Mnemonic Type Description SERDOUT1+ SERDOUT1− SERDOUT0− SERDOUT0+ Output Output Output Output Lane B CML Output Data—True. Lane B CML Output Data—Complement. Lane A CML Output Data—Complement. Lane A CML Output Data—True. RST SDIO SCLK CS PDWN Input Input/Output Input Input Input Digital Reset (Active Low). SPI Serial Data I/O. SPI Serial Clock. SPI Chip Select (Active Low). Power-Down Input (Active High). The operation of this pin depends on the SPI mode and can be configured as powerdown or standby (see Table 18). Rev. E | Page 13 of 45 AD9250 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS AVDD = 1.8 V, DRVDD = 1.8 V, DVDD = 1.8 V, sample rate is maximum for speed grade, DCS enabled, 1.75 V p-p differential input, VIN = −1.0 dBFS, 32k sample, TA = 25°C, link parameters used were M = 2 and L = 2, unless otherwise noted. SNR: 71.8dBFS SFDR: 91dBc 100 SNR/SFDR (dBc AND dBFS) –20 –40 –60 –80 –100 0 20 40 60 80 FREQUENCY (MHz) Figure 5. AD9250-170 Single-Tone FFT with fIN = 90.1 MHz 0 –70 –50 –30 –10 Figure 8. AD9250-170 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 185.1 MHz 100 95 SNR: 71.6dBFS SFDR: 86dBc SFDR SNR/SFDR (dBc AND dBFS) –40 –60 –80 90 85 80 75 SNR 70 65 20 40 60 80 FREQUENCY (MHz) Figure 6. AD9250-170 Single-Tone FFT with fIN = 185.1 MHz 0 60 10559-006 0 50 100 150 200 250 300 FREQUENCY (MHz) Figure 9. AD9250-170 Single-Tone SNR/SFDR vs. Input Frequency (fIN) 0 fIN: 305.1MHz fS: 170MSPS SNR: 69.4dBFS SFDR: 85dBc –20 SFDR/IMD (dBc AND dBFS) –20 0 10559-009 AMPLITUDE (dBFS) SNR SNRFS SFDR SFDR dBc INPUT AMPLITUDE (dBFS) –100 –40 –60 –80 SFDR (dBc) –40 IMD (dBc) –60 –80 SFDR (dBFS) –100 –100 –120 –120 –90 IMD (dBFS) 0 20 40 60 80 FREQUENCY (MHz) Figure 7. AD9250-170 Single-Tone FFT with fIN = 305.1 MHz 10559-007 AMPLITUDE (dBFS) 40 0 –90 fIN: 185.1MHz fS: 170MSPS –20 –120 60 20 10559-005 –120 80 –70 –50 –30 INPUT AMPLITUDE (dBFS) –10 10559-010 AMPLITUDE (dBFS) 120 fIN: 90.1MHz fS: 170MSPS 10559-008 0 Figure 10. AD9250-170 Two-Tone SFDR/IMD vs. Input Amplitude (AIN) with fIN1 = 89.12 MHz, fIN2 = 92.12 MHz, fS = 170 MSPS Rev. E | Page 14 of 45 Data Sheet AD9250 0 100 –20 95 SNR/SFDR (dBc AND dBFS) –40 SFDR (dBc) IMD (dBc) –60 –80 SFDR (dBFS) –100 90 SFDR_B (dBc) 85 80 75 SNRFS_A (dBFS) IMD (dBFS) –50 –70 –30 –10 INPUT AMPLITUDE (dBFS) 600,000 2,096,064 TOTAL HITS 1.4925 LSB rms 555924 498226 500,000 –40 NUMBER OF HITS AMPLITUDE (dBFS) 140 Figure 14. AD9250-170 Single-Tone SNR/SFDR vs. Sample Rate (fS) with fIN = 90.1 MHz 170 MSPS 89.12MHz AT –7dBFS 92.12MHz AT –7dBFS SFDR: 91dBc –20 90 SAMPLE RATE (MHz) Figure 11. AD9250-170 Two-Tone SFDR/IMD vs. Input Amplitude (AIN) with fIN1 = 184.12 MHz, fIN2 = 187.12 MHz, fS = 170 MSPS 0 SNRFS_B (dBFS) 70 40 10559-011 –120 –90 10559-014 SFDR/IMD (dBc AND dBFS) SFDR_A (dBc) –60 –80 400,000 387659 300,000 281445 200,000 177569 109722 –100 100,000 47521 20 40 60 80 FREQUENCY (MHz) N–6 24220 8529 N–4 3479 N–2 N N+2 N+4 450 N+6 OUTPUT CODE 0 0 170 MSPS 184.12MHz AT –7dBFS 187.12MHz AT –7dBFS SFDR: 86dBc fIN: 90.1MHz fS: 250MSPS AMPLITUDE (dBFS) SNR: 71.8dBFS –20 SFDR: 85dBc –40 –60 –80 –100 –40 –60 –80 –120 0 20 40 60 80 FREQUENCY (MHz) –120 0 50 FREQUENCY (MHz) 100 125 Figure 16. AD9250-250 Single-Tone FFT with fIN = 90.1 MHz Figure 13. AD9250-170 Two-Tone FFT with fIN1 = 184.12 MHz, fIN2 = 187.12 MHz, fS = 170 MSPS Rev. E | Page 15 of 45 10559-016 –100 10559-013 AMPLITUDE (dBFS) 1184 Figure 15. AD9250-170 Grounded Input Histogram Figure 12. AD9250-170 Two-Tone FFT with fIN1 = 89.12 MHz, fIN2 = 92.12 MHz, fS = 170 MSPS –20 136 10559-015 0 0 10559-012 –120 AD9250 0 100 fIN: 185.1MHz fS: 250MSPS SFDR (dBFS) SNR: 70.7dBFS SFDR: 85dBc SNR/SFDR (dBc AND dBFS) –20 AMPLITUDE (dBFS) Data Sheet –40 –60 –80 90 80 SNR (dBc) 70 0 50 60 10559-017 –120 100 FREQUENCY (MHz) 100 200 300 FREQUENCY (MHz) Figure 20. AD9250-250 Single-Tone SNR/SFDR vs. Input Frequency (fIN) Figure 17. AD9250-250 Single-Tone FFT with fIN = 185.1 MHz 0 0 fIN: 305.1MHz fS: 250MSPS SNR: 69.1dBFS SFDR: 82dBc –20 SFDR/IMD (dBc and dBFS) –20 AMPLITUDE (dBFS) 0 10559-020 –100 –40 –60 –80 SFDR (dBc) –40 IMD (dBc) –60 –80 SFDR (dBFS) –100 –100 –120 –120 –100 50 100 FREQUENCY (MHz) –80 –60 –40 –20 0 AIN (dBFS) 10559-021 0 10559-018 IMD (dBFS) Figure 21. AD9250-250 Two-Tone SFDR/IMD vs. Input Amplitude (AIN) with fIN1 = 89.12 MHz, fIN2 = 92.12 MHz, fS = 250 MSPS Figure 18. AD9250-250 Single-Tone FFT with fIN = 305.1 MHz 0 120 SFDR (dBFS) –20 80 SFDR/IMD (dBc and dBFS) SNR/SFDR (dBc and dBFS) 100 SNR (dBFS) 60 SFDR (dBc) 40 SNR (dBc) SFDR (dBc) –40 IMD (dBc) –60 –80 SFDR (dBFS) –100 20 –60 –40 AIN (dBFS) –20 0 10559-019 –80 –120 –100 –80 –60 –40 INPUT AMPLITUDE (dBFS) Figure 19. AD9250-250 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 185.1 MHz –20 0 10559-022 IMD (dBFS) 0 –100 Figure 22. AD9250-250 Two-Tone SFDR/IMD vs. Input Amplitude (AIN) with fIN1 = 184.12 MHz, fIN2 = 187.12 MHz, fS = 250 MSPS Rev. E | Page 16 of 45 Data Sheet AD9250 100 0 250MSPS 89.12MHz AT –7dBFS 92.12MHz AT –7dBFS SFDR: 86.4dBc 95 SNR/SFDR (dBc AND dBFS) –40 –60 –80 90 85 SFDR_B (dBc) 80 75 SNR_B (dBc) SNR_A (dBc) 0 50 FREQUENCY (MHz) 100 70 40 50 10559-023 –120 2,095,578 TOTAL HITS 1.4535 LSB rms NUMBER OF HITS –60 –80 250 570587 498242 500k 400k 380706 300k 276088 200k 163389 109133 –100 100k 52008 26647 –120 0 50 100 FREQUENCY (MHz) 10559-024 AMPLITUDE (dBFS) 600k –40 200 Figure 25. AD9250-250 Single-Tone SNR/SFDR vs. Sample Rate (fS) with fIN = 90.1 MHz 250MSPS 184.12MHz AT –7dBFS 187.12MHz AT –7dBFS SFDR: 84dBc –20 150 SAMPLE RATE (MSPS) Figure 23. AD9250-250 Two-Tone FFT with fIN1 = 89.12 MHz, fIN2 = 92.12 MHz, fS = 250 MSPS 0 100 10559-025 –100 Figure 24. AD9250-250 Two-Tone FFT with fIN1 = 184.12 MHz, fIN2 = 187.12 MHz, fS = 250 MSPS 0 418 N–6 2142 10549 N–4 4856 N–2 N N+2 N+4 OUTPUT CODE Figure 26. AD9250-250 Grounded Input Histogram Rev. E | Page 17 of 45 913 N+6 10559-026 AMPLITUDE (dBFS) –20 SFDR_A (dBc) AD9250 Data Sheet EQUIVALENT CIRCUITS AVDD AVDD VIN 400Ω SDIO 10559-226 10559-027 31kΩ Figure 31. Equivalent SDIO Circuit Figure 27. Equivalent Analog Input Circuit AVDD AVDD AVDD AVDD 0.9V 15kΩ 15kΩ CLK+ CLK– 400Ω SCLK/PWDN 10559-028 10559-225 31kΩ Figure 32. Equivalent SCLK or PDWN Input Circuit Figure 28. Equivalent Clock lnput Circuit 0.5pF AVDD AVDD AVDD INTERNAL CLOCK DRIVER RFCLK 28kΩ 400Ω CS BIAS CONTROL 10559-224 10559-029 10kΩ Figure 29. Equivalent RF Clock lnput Circuit Figure 33. Equivalent CS Input Circuit AVDD DRVDD DRVDD 3mA DRVDD RTERM AVDD 3mA AVDD 0.9V 17kΩ VCM SERDOUTx+ 17kΩ SYSREF+ SYSREF– 3mA Figure 30. Digital CML Output Circuit 10559-134 10559-030 3mA SERDOUTx– Figure 34. Equivalent SYSREF± Input Circuit Rev. E | Page 18 of 45 Data Sheet AD9250 DVDD DVDD DVDD 400Ω DVDD 0.9V SYNCINB+ 17kΩ 17kΩ SYNCINB– 10559-122 10559-333 RST DVDD 28kΩ Figure 37. SYNCINB± Circuit Figure 35. Equivalent RST Input Circuit AVDD 10559-136 400 Ω VCM Figure 36. Equivalent VCM Circuit Rev. E | Page 19 of 45 AD9250 Data Sheet THEORY OF OPERATION The AD9250 has two analog input channels and two JESD204B output lanes. The signal passes through several stages before appearing at the output port(s). The dual ADC design can be used for diversity reception of signals, where the ADCs operate identically on the same carrier but from two separate antennae. The ADCs can also be operated with independent analog inputs. The user can sample frequencies from dc to 300 MHz using appropriate low-pass or band-pass filtering at the ADC inputs with little loss in ADC performance. Operation to 400 MHz analog input is permitted but occurs at the expense of increased ADC noise and distortion. A synchronization capability is provided to allow synchronized timing between multiple devices. Programming and control of the AD9250 are accomplished using a 3-pin, SPI-compatible serial interface. A small resistor in series with each input can help reduce the peak transient current required from the output stage of the driving source. A shunt capacitor can be placed across the inputs to provide dynamic charging currents. This passive network creates a low-pass filter at the ADC input; therefore, the precise values are dependent on the application. In intermediate frequency (IF) undersampling applications, reduce the shunt capacitors. In combination with the driving source impedance, the shunt capacitors limit the input bandwidth. Refer to the AN-742 Application Note, Frequency Domain Response of Switched-Capacitor ADCs; the AN-827 Application Note, A Resonant Approach to Interfacing Amplifiers to SwitchedCapacitor ADCs; and the Analog Dialogue article, “TransformerCoupled Front-End for Wideband A/D Converters,” for more information on this subject. BIAS ADC ARCHITECTURE S The AD9250 architecture consists of a dual, front-end, sampleand-hold circuit, followed by a pipelined switched capacitor ADC. The quantized outputs from each stage are combined into a final 14-bit result in the digital correction logic. The pipelined architecture permits the first stage to operate on a new input sample and the remaining stages to operate on the preceding samples. Sampling occurs on the rising edge of the clock. Each stage of the pipeline, excluding the last, consists of a low resolution flash ADC connected to a switched capacitor digitalto-analog converter (DAC) and an interstage residue amplifier (MDAC). The MDAC magnifies the difference between the reconstructed DAC output and the flash input for the next stage in the pipeline. One bit of redundancy is used in each stage to facilitate digital correction of flash errors. The last stage simply consists of a flash ADC. The input stage of each channel contains a differential sampling circuit that can be ac- or dc-coupled in differential or singleended modes. The output staging block aligns the data, corrects errors, and passes the data to the output buffers. The output buffers are powered from a separate supply, allowing digital output noise to be separated from the analog core. ANALOG INPUT CONSIDERATIONS The analog input to the AD9250 is a differential, switched capacitor circuit that has been designed for optimum performance while processing a differential input signal. The clock signal alternatively switches the input between sample mode and hold mode (see the configuration shown in Figure 38). When the input is switched into sample mode, the signal source must be capable of charging the sampling capacitors and settling within 1/2 clock cycle. S CFB CS VIN+ CPAR1 CPAR2 H S S CS CPAR1 CPAR2 S CFB S BIAS 10559-034 VIN– Figure 38. Switched-Capacitor Input For best dynamic performance, match the source impedances driving VIN+ and VIN− and differentially balance the inputs. Input Common Mode The analog inputs of the AD9250 are not internally dc biased. In ac-coupled applications, the user must provide this bias externally. Setting the device so that VCM = 0.5 × AVDD (or 0.9 V) is recommended for optimum performance. An on-board common-mode voltage reference is included in the design and is available from the VCM pin. Using the VCM output to set the input common mode is recommended. Optimum performance is achieved when the common-mode voltage of the analog input is set by the VCM pin voltage (typically 0.5 × AVDD). Decouple the VCM pin to ground by using a 0.1 µF capacitor, as described in the Applications Information section. Place this decoupling capacitor close to the pin to minimize the series resistance and inductance between the part and this capacitor. Differential Input Configurations Optimum performance is achieved while driving the AD9250 in a differential input configuration. For baseband applications, the AD8138, ADA4937-2, ADA4938-2, and ADA4930-2 differential drivers provide excellent performance and a flexible interface to the ADC. Rev. E | Page 20 of 45 Data Sheet AD9250 The output common-mode voltage of the ADA4930-2 is easily set with the VCM pin of the AD9250 (see Figure 39), and the driver can be configured in a Sallen-Key filter topology to provide band-limiting of the input signal. In the double balun and transformer configurations, the value of the input capacitors and resistors is dependent on the input frequency and source impedance. Based on these parameters, the value of the input resistors and capacitors may need to be adjusted or some components may need to be removed. Table 9 displays recommended values to set the RC network for different input frequency ranges. However, these values are dependent on the input signal and bandwidth and should be used only as a starting guide. Note that the values given in Table 9 are for each R1, R2, C1, C2, and R3 components shown in Figure 40 and Figure 41. 15pF 200Ω 33Ω 90Ω 15Ω VIN– AVDD 5pF ADA4930-2 0.1µF ADC 33Ω 15Ω VCM VIN+ 120Ω 15pF 200Ω Table 9. Example RC Network 0.1µF Frequency Range (MHz) 0 to 100 100 to 400 >400 10559-035 33Ω Figure 39. Differential Input Configuration Using the ADA4930-2 For baseband applications where SNR is a key parameter, differential transformer coupling is the recommended input configuration. An example is shown in Figure 40. To bias the analog input, the VCM voltage can be connected to the center tap of the secondary winding of the transformer. R2 VIN+ R1 49.9Ω C1 R2 R1 0.1µF 1000pF ADC VIN– VCM AD8376 33Ω R3 0.1µF C2 1µH R2 S P 0.1µF 33Ω 0.1µF VIN+ ADC C1 R1 R2 R3 VIN– 33Ω C2 Figure 41. Differential Double Balun Input Configuration 301Ω VCM 165Ω 1nF 20kΩ║2.5pF 68nH CLOCK INPUT CONSIDERATIONS VCM 0.1µF 10559-037 S 1nF ADC 3.9pF A stable and accurate voltage reference is built into the AD9250. The full-scale input range can be adjusted by varying the reference voltage via the SPI. The input span of the ADC tracks the reference voltage changes linearly. 33Ω PA 5.1pF 15pF VOLTAGE REFERENCE C2 R3 R1 165Ω VPOS Figure 42. Differential Input Configuration Using the AD8376 At input frequencies in the second Nyquist zone and above, the noise performance of most amplifiers is not adequate to achieve the true SNR performance of the AD9250. For applications where SNR is a key parameter, differential double balun coupling is the recommended input configuration (see Figure 41). In this configuration, the input is ac-coupled and the VCM voltage is provided to each input through a 33 Ω resistor. These resistors compensate for losses in the input baluns to provide a 50 Ω impedance to the driver. 2V p-p R3 Shunt (Ω) 24.9 24.9 24.9 1000pF NOTES 1. ALL INDUCTORS ARE COILCRAFT® 0603CS COMPONENTS WITH THE EXCEPTION OF THE 1µH CHOKE INDUCTORS (COILCRAFT 0603LS). 2. FILTER VALUES SHOWN ARE FOR A 20MHz BANDWIDTH FILTER CENTERED AT 140MHz. Consider the signal characteristics when selecting a transformer. Most RF transformers saturate at frequencies below a few megahertz. Excessive signal power can also cause core saturation, which leads to distortion. 0.1µF C2 Shunt (pF) 15 8.2 ≤3.9 180nH 220nH Figure 40. Differential Transformer-Coupled Configuration 0.1µF R2 Series (Ω) 0 0 0 180nH 220nH 1µH 10559-036 2V p-p C1 Differential (pF) 8.2 8.2 ≤3.9 An alternative to using a transformer-coupled input at frequencies in the second Nyquist zone is to use an amplifier with variable gain. The AD8375 or AD8376 digital variable gain amplifier (DVGAs) provides good performance for driving the AD9250. Figure 42 shows an example of the AD8376 driving the AD9250 through a band-pass antialiasing filter. C2 R3 R1 Series (Ω) 33 15 15 10559-038 76.8Ω VIN The AD9250 has two options for deriving the input sampling clock, a differential Nyquist sampling clock input or an RF clock input (which is internally divided by 4). The clock input is selected in Register 0x09 and by default is configured for the Nyquist clock input. For optimum performance, clock the AD9250 Nyquist sample clock input, CLK+ and CLK−, with a differential signal. The signal is typically ac-coupled into the CLK+ and CLK− pins via a transformer or via capacitors. These pins are biased internally (see Figure 43) and require no external bias. If the clock inputs are floated, CLK− is pulled slightly lower than CLK+ to prevent spurious clocking. Rev. E | Page 21 of 45 AD9250 Data Sheet The AD9250 Nyquist clock input supports a differential clock between 40 MHz to 625 MHz. The clock input structure supports differential input voltages from 0.3 V to 3.6 V and is therefore compatible with various logic family inputs, such as CMOS, LVDS, and LVPECL. A sine wave input is also accepted, but higher slew rates typically provide optimal performance. Clock source jitter is a critical parameter that can affect performance, as described in the Jitter Considerations section. If the inputs are floated, pull the CLK− pin low to prevent spurious clocking. The Nyquist clock input pins, CLK+ and CLK−, are internally biased to 0.9 V and have a typical input impedance of 4 pF in parallel with 10 kΩ (see Figure 43). The input clock is typically ac-coupled to CLK+ and CLK−. Some typical clock drive circuits are presented in Figure 44 through Figure 47 for reference. AVDD AD9517-4 device family, AD9518-0 through AD9518-4 device family, AD9520-0 through AD9520-5 device family, AD9522-0 through AD9522-5 device family, AD9523, AD9524, and ADCLK905/ADCLK907/ADCLK925 0.1µF ADC 0.1µF CLOCK INPUT CLK+ AD95xx 0.1µF CLOCK INPUT 100Ω PECL DRIVER 0.1µF CLK– 50kΩ 240Ω 240Ω 50kΩ 10559-042 Nyquist Clock Input Options Figure 46. Differential PECL Sample Clock (Up to 625 MHz) Analog Devices also offers LVDS clock drivers with excellent jitter performance. A typical circuit is shown in Figure 47 and uses LVDS drivers such as the AD9510, AD9511, AD9512, AD9513, AD9514, AD9515, AD9516-0 through AD9516-5 device family, AD9517-0 through AD9517-4 device family, AD9518-0 through AD9518-4 device family, AD9520-0 through AD9520-5 device family, AD9522-0 through AD9522-5 device family, AD9523, and AD9524. 0.9V 0.1µF CLK– AD95xx 0.1µF 50Ω The AD9250 RF clock input supports a single-ended clock between 625 GHz to 1.5 GHz. The equivalent RF clock input circuit is shown in Figure 48. The input is self biased to 0.9 V and is typically ac-coupled. The input has a typical input impedance of 10 kΩ in parallel with 1 pF at the RFCLK pin. 1pF 10kΩ BIAS CONTROL ADC CLK+ Figure 48. Equivalent RF Clock Input Circuit 10559-040 CLK– SCHOTTKY DIODES: HSMS2822 Figure 44. Transformer-Coupled Differential Clock (Up to 200 MHz) 25Ω ADC 390pF CLK+ 390pF 1nF SCHOTTKY DIODES: HSMS2822 10559-041 CLK– 25Ω INTERNAL CLOCK DRIVER RFCLK 100Ω 390pF 10559-043 Figure 47. Differential LVDS Sample Clock (Up to 625 MHz) RF Clock Input Options 390pF CLOCK INPUT 50kΩ Figure 45. Balun-Coupled Differential Clock (Up to 625 MHz) In some cases, it is desirable to buffer or generate multiple clocks from a single source. In those cases, Analog Devices, Inc., offers clock drivers with excellent jitter performance. Figure 46 shows a typical PECL driver circuit that uses PECL drivers such as the AD9510, AD9511, AD9512, AD9513, AD9514, AD9515, AD9516-0 through AD9516-5 device family, AD9517-0 through It is recommended to drive the RF clock input of the AD9250 with a PECL or sine wave signal with a minimum signal amplitude of 600 mV peak to peak. Regardless of the type of signal being used, clock source jitter is of the most concern, as described in the Jitter Considerations section. Figure 49 shows the preferred method of clocking when using the RF clock input on the AD9250. It is recommended to use a 50 Ω transmission line to route the clock signal to the RF clock input of the AD9250 due to the high frequency nature of the signal and terminate the transmission line close to the RF clock input. Rev. E | Page 22 of 45 ADC RF CLOCK INPUT 50Ω Tx LINE 0.1µF RFCLK 50Ω 10559-045 390pF 0.1µF CLK– 50kΩ For applications where a single-ended low jitter clock between 40 MHz to 200 MHz is available, an RF transformer is recommended. An example using an RF transformer in the clock network is shown in Figure 44. At frequencies above 200 MHz, an RF balun is recommended, as seen in Figure 45. The back-to-back Schottky diodes across the transformer secondary limit clock excursions into the AD9250 to approximately 0.8 V p-p differential. This limit helps prevent the large voltage swings of the clock from feeding through to other portions of the AD9250, yet preserves the fast rise and fall times of the clock, which are critical to low jitter performance. Mini-Circuits® ADT1-1WT, 1:1Z 390pF XFMR 100Ω LVDS DRIVER CLOCK INPUT Figure 43. Equivalent Nyquist Clock Input Circuit CLOCK INPUT CLK+ 4pF 10559-039 4pF ADC 0.1µF CLOCK INPUT 10559-044 CLK+ Figure 49. Typical RF Clock Input Circuit Data Sheet AD9250 VDD 127Ω 0.1µF ADC 127Ω 50Ω Tx LINE 0.1µF 0.1µF RFCLK CLOCK INPUT AD9515 0.1µF 50Ω LVPECL DRIVER 0.1µF CLOCK INPUT 82.5Ω 10559-046 82.5Ω Figure 50. Differential PECL RF Clock Input Circuit Figure 50 shows the RF clock input of the AD9250 being driven from the LVPECL outputs of the AD9515. The differential LVPECL output signal from the AD9515 is converted to a singleended signal using an RF balun or RF transformer. The RF balun configuration is recommended for clock frequencies associated with the RF clock input. Input Clock Divider The AD9250 contains an input clock divider with the ability to divide the Nyquist input clock by integer values between 1 and 8. The RF clock input uses an on-chip predivider to divide the clock input by four before it reaches the 1 to 8 divider. This allows higher input frequencies to be achieved on the RF clock input. The divide ratios can be selected using Register 0x09 and Register 0x0B. Register 0x09 is used to set the RF clock input, and Register 0x0B can be used to set the divide ratio of the 1-to-8 divider for both the RF clock input and the Nyquist clock input. For divide ratios other than 1, the duty-cycle stabilizer is automatically enabled. Jitter on the rising edge of the input clock is still of paramount concern and is not reduced by the duty cycle stabilizer. The duty cycle control loop does not function for clock rates less than 40 MHz nominally. The loop has a time constant associated with it that must be considered when the clock rate can change dynamically. A wait time of 1.5 μs to 5 μs is required after a dynamic clock frequency increase or decrease before the DCS loop is relocked to the input signal. During the time that the loop is not locked, the DCS loop is bypassed, and the internal device timing is dependent on the duty cycle of the input clock signal. In such applications, it may be appropriate to disable the duty cycle stabilizer. In all other applications, enabling the DCS circuit is recommended to maximize ac performance. Jitter Considerations High speed, high resolution ADCs are sensitive to the quality of the clock input. The degradation in SNR at a given input frequency (fIN) due to jitter (tJ) can be calculated by SNRHF = −10 log[(2π × fIN × tJRMS)2 + 10 (  SNR LF /10 ) ] ÷4 NYQUIST CLOCK Figure 51. AD9250 Clock Divider Circuit The AD9250 clock divider can be synchronized using the external SYSREF input. Bit 1 and Bit 2 of Register 0x3A allow the clock divider to be resynchronized on every SYSREF signal or only on the first signal after the register is written. A valid SYSREF causes the clock divider to reset to its initial state. This synchronization feature allows multiple parts to have their clock dividers aligned to guarantee simultaneous input sampling. Clock Duty Cycle In the equation, the rms aperture jitter represents the root-meansquare of all jitter sources, which include the clock input, the analog input signal, and the ADC aperture jitter specification. IF undersampling applications are particularly sensitive to jitter, as shown in Figure 52. 80 75 70 Typical high speed ADCs use both clock edges to generate a variety of internal timing signals and, as a result, may be sensitive to clock duty cycle. Commonly, a ±5% tolerance is required on the clock duty cycle to maintain dynamic performance characteristics. The AD9250 contains a DCS that retimes the nonsampling (falling) edge, providing an internal clock signal with a nominal 50% duty cycle. This allows the user to provide a wide range of clock input duty cycles without affecting the performance of the AD9250. Rev. E | Page 23 of 45 65 60 0.05ps 0.2ps 0.5ps 1ps 1.5ps MEASURED 55 50 1 10 100 INPUT FREQUENCY (MHz) 1000 Figure 52. AD9250-250 SNR vs. Input Frequency and Jitter 10559-048 10559-047 ÷1 TO ÷8 DIVIDER SNR (dBc) RFCLK AD9250 Data Sheet Treat the clock input as an analog signal in cases where aperture jitter may affect the dynamic range of the AD9250. Separate the power supplies for the clock drivers from the ADC output driver supplies to avoid modulating the clock signal with digital noise. Low jitter, crystal controlled oscillators make the best clock sources. If the clock is generated from another type of source (by gating, dividing, or another method), retime it by the original clock at the last step. Refer to the AN-501 Application Note, Aperture Uncertainty and ADC System Performance and the AN-756 Application Note, Sampled Systems and the Effects of Clock Phase Noise and Jitter for more information about jitter performance as it relates to ADCs. POWER DISSIPATION AND STANDBY MODE As shown in Figure 53, the power dissipated by the AD9250 is proportional to its sample rate. The data in Figure 53 was taken using the same operating conditions as those used for the Typical Performance Characteristics section. By asserting PDWN (either through the SPI port or by asserting the PDWN pin high), the AD9250 is placed in power-down mode. In this state, the ADC typically dissipates about 9 mW. Asserting the PDWN pin low returns the AD9250 to its normal operating mode. Low power dissipation in power-down mode is achieved by shutting down the reference, reference buffer, biasing networks, and clock. Internal capacitors are discharged when entering powerdown mode and then must be recharged when returning to normal operation. As a result, wake-up time is related to the time spent in power-down mode, and shorter power-down cycles result in proportionally shorter wake-up times. When using the SPI port interface, the user can place the ADC in power-down mode or standby mode. Standby mode allows the user to keep the internal reference circuitry powered when faster wake-up times are required. See the Memory Map Register Description section and the AN-877 Application Note, Interfacing to High Speed ADCs via SPI, for additional details. 0.8 0.7 TOTAL POWER 0.5 POWER (AVDD) 0.4 0.3 POWER (DVDD) 0.2 0.1 0 40 90 140 190 ENCODE FREQUENCY (MSPS) 240 10559-149 TOTAL POWER (W) 0.6 Figure 53. AD9250-250 Power vs. Encode Rate Rev. E | Page 24 of 45 Data Sheet AD9250 DIGITAL OUTPUTS JESD204B TRANSMIT TOP LEVEL DESCRIPTION The AD9250 digital output uses the JEDEC Standard No. JESD204B, Serial Interface for Data Converters. JESD204B is a protocol to link the AD9250 to a digital processing device over a serial interface of up to 5 Gbps link speeds (3.5 Gbps, 14-bit ADC data rate). The benefits of the JESD204B interface include a reduction in required board area for data interface routing and the enabling of smaller packages for converter and logic devices. The AD9250 supports single or dual lane interfaces. JESD204B OVERVIEW The JESD204B data transmit block assembles the parallel data from the ADC into frames and uses 8b/10b encoding as well as optional scrambling to form serial output data. Lane synchronization is supported using special characters during the initial establishment of the link, and additional synchronization is embedded in the data stream thereafter. A matching external receiver is required to lock onto the serial data stream and recover the data and clock. For additional details on the JESD204B interface, refer to the JESD204B standard. The AD9250 JESD204B transmit block maps the output of the two ADCs over a link. A link can be configured to use either single or dual serial differential outputs that are called lanes. The JESD204B specification refers to a number of parameters to define the link, and these parameters must match between the JESD204B transmitter (AD9250 output) and receiver. The JESD204B link is described according to the following parameters: • • • • • • • • • • • • • • S = samples transmitted/single converter/frame cycle (AD9250 value = 1) M = number of converters/converter device (AD9250 value = 2 by default, or can be set to 1) L = number of lanes/converter device (AD9250 value = 1 or 2) N = converter resolution (AD9250 value = 14) N’ = total number of bits per sample (AD9250 value = 16) CF = number of control words/frame clock cycle/converter device (AD9250 value = 0) CS = number of control bits/conversion sample (configurable on the AD9250 up to 2 bits) K = number of frames per multiframe (configurable on the AD9250) HD = high density mode (AD9250 value = 0) F = octets/frame (AD9250 value = 2 or 4, dependent upon L = 2 or 1) C = control bit (overrange, overflow, underflow; available on the AD9250) T = tail bit (available on the AD9250) SCR = scrambler enable/disable (configurable on the AD9250) FCHK = checksum for the JESD204B parameters (automatically calculated and stored in register map) Figure 54 shows a simplified block diagram of the AD9250 JESD204B link. By default, the AD9250 is configured to use two converters and two lanes. Converter A data is output to SERDOUT0+/SERDOUT0−, and Converter B is output to SERDOUT1+/SERDOUT1−. The AD9250 allows for other configurations such as combining the outputs of both converters onto a single lane or changing the mapping of the A and B digital output paths. These modes are setup through a quick configuration register in the SPI register map, along with additional customizable options. By default in the AD9250, the 14-bit converter word from each converter is broken into two octets (8 bits of data). Bit 13 (MSB) through Bit 6 are in the first octet. The second octet contains Bit 5 through Bit 0 (LSB), and two tail bits are added to fill the second octet. The tail bits can be configured as zeros, pseudorandom number sequence or control bits indicating overrange, underrange, or valid data conditions. The two resulting octets can be scrambled. Scrambling is optional; however, it is available to avoid spectral peaks when transmitting similar digital data patterns. The scrambler uses a self synchronizing, polynomial-based algorithm defined by the equation 1 + x14 + x15. The descrambler in the receiver should be a self-synchronizing version of the scrambler polynomial. The two octets are then encoded with an 8b/10b encoder. The 8b/10b encoder works by taking eight bits of data (an octet) and encoding them into a 10-bit symbol. Figure 55 shows how the 14-bit data is taken from the ADC, the tail bits are added, the two octets are scrambled, and how the octets are encoded into two 10-bit symbols. Figure 55 illustrates the default data format. At the data link layer, in addition to the 8b/10b encoding, the character replacement is used to allow the receiver to monitor frame alignment. The character replacement process occurs on the frame and multiframe boundaries, and implementation depends on which boundary is occurring, and if scrambling is enabled. If scrambling is disabled, the following applies. If the last scrambled octet of the last frame of the multiframe equals the last octet of the previous frame, the transmitter replaces the last octet with the control character /A/ = /K28.3/. On other frames within the multiframe, if the last octet in the frame equals the last octet of the previous frame, the transmitter replaces the last octet with the control character /F/= /K28.7/. If scrambling is enabled, the following applies. If the last octet of the last frame of the multiframe equals 0x7C, the transmitter replaces the last octet with the control character /A/ = /K28.3/. On other frames within the multiframe, if the last octet equals 0xFC, the transmitter replaces the last octet with the control character /F/ = /K28.7/. Refer to JEDEC Standard No. 204B-July 2011 for additional information about the JESD204B interface. Section 5.1 covers the transport layer and data format details and Section 5.2 covers scrambling and descrambling. Rev. E | Page 25 of 45 AD9250 Data Sheet JESD204B SYNCHRONIZATION DETAILS Data Transmission Phase The AD9250 supports JESD204B Subclass 0 and Subclass 1 and establishes synchronization of the link through one or two control signals, SYNC and Subclass 1 also use SYSREF, and a common device clock. SYSREF and SYNC are common to all converter devices for alignment purposes at the system level. In the data transmission phase, frame alignment is monitored with control characters. Character replacement is used at the end of frames. Character replacement in the transmitter occurs in the following instances: The synchronization process is accomplished over three phases: code group synchronization (CGS), initial lane alignment sequence (ILAS), and data transmission. If scrambling is enabled, scrambling begins with the first data byte following the last alignment character of the ILAS. CGS and ILAS phases are not scrambled. CGS Phase In the CGS phase, the JESD204B transmit block transmits /K28.5/ characters. The receiver (external logic device) must locate K28.5 characters in its input data stream using clock and data recovery (CDR) techniques. When in Subclass 1 mode, the receiver locks onto the K28.5 characters. Once detected, the receiver initiates a SYSREF edge so that the AD9250 transmit data establishes a local multiframe clock (LMFC) internally. The SYSREF edge also resets any sampling edges within the ADC to align sampling instances to the LMFC. This is important to maintain synchronization across multiple devices. If Subclass 0: at the next receiver’s internal clock; if Subclass 1: at the next receiver’s LMFC boundary, the receiver or logic device de-asserts the SYNC~ signal (SYNCINB± goes high), and the transmitter block begins the ILAS phase. ILAS Phase In the ILAS phase, the transmitter sends out a known pattern, and the receiver aligns all lanes of the link and verifies the parameters of the link. The ILAS phase begins after SYNC~ has been de-asserted (goes high). If Subclass 0: the transmitter begins ILAS at the next transmitter’s internal clock; if Subclass 1: at the next transmitter’s internal LMFC boundary, the transmit block begins to transmit four multiframes. Dummy samples are inserted between the required characters so that full multiframes are transmitted. The four multiframes include the following: • • • • • • If scrambling is disabled and the last octet of the frame or multiframe equals the octet value of the previous frame. If scrambling is enabled and the last octet of the multiframe is equal to 0x7C, or the last octet of a frame is equal to 0xFC. Table 10. Fourteen Configuration Octets of the ILAS Phase No. 0 1 2 3 4 5 6 7 8 9 10 11 12 13 Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 DID[7:0] Bit 2 Bit 1 Bit 0 (LSB) BID[3:0] LID[4:0] L[4:0] SCR F[7:0] K[4:0] M[7:0] CS[1:0] SUBCLASS[2:0] JESDV[2:0] HD N[4:0] N’[4:0] S[4:0] CF[4:0] Reserved, Don’t Care Reserved, Don’t Care FCHK[7:0] LINK SETUP PARAMETERS The following demonstrates how to configure the AD9250 JESD204B interface paremeters. These details are a subset of the SPI initialization sequence shown in Figure 63 and Table 19. The steps to configure the output include the following: 1. 2. 3. 4. 5. 6. Disable lanes before changing the configuration. Select the quick configuration option. Configure the detailed options. Check FCHK, checksum of JESD204B interface parameters. Set the additional digital output configuration options. Re-enable lane(s). Disable Lanes Before Changing Configuration Multiframe 1: Begins with an /R/ character [K28.0] and ends with an /A/ character [K28.3]. Multiframe 2: Begins with an /R/ character followed by a /Q/ [K28.4] character, followed by link configuration parameters over 14 configuration octets (see Table 10), and ends with an /A/ character. Many of the parameters values are of the notation of the value − 1. Multiframe 3: Is the same as Multiframe 1. Multiframe 4: Is the same as Multiframe 1. Before modifying the JESD204B link parameters, disable the link and hold it in reset. This is accomplished by writing Logic 1 to Register 0x5F, Bit 0. Select Quick Configuration Option Write to Register 0x5E, the 204B quick configuration register to select the configuration options. See Table 13 for configuration options and resulting JESD204B parameter values. • • • • Rev. E | Page 26 of 45 0x11 = one converter, one lane 0x12 = one converter, two lanes 0x21 = two converters, one lane 0x22 = two converters, two lanes Data Sheet AD9250 Configure Detailed Options Select lane synchronization options. Configure the tail bits and control bits. Most of the synchronization features of the JESD204B interface are enabled by default for typical applications. In some cases, these features can be disabled or modified as follows: • • • With N’ = 16 and N = 14, there are two bits available per sample for transmitting additional information over the JESD204B link. The options are tail bits or control bits. By default, tail bits of 0b00 value are used. Tail bits are dummy bits sent over the link to complete the two octets and do not convey any information about the input signal. Tail bits can be fixed zeros (default) or psuedo random numbers (Register 0x5F, Bit 6). One or two control bits can be used instead of the tail bits through Register 0x72, Bits[7:6]. The tail bits can be set using Register 0x14, Bits[7:5], and can be enabled using Address 0x5F, Bit 6. Set lane identification values. • JESD204B allows parameters to identify the device and lane. These parameters are transmitted during the ILAS phase, and they are accessible in the internal registers. There are three identification values: device identification (DID), bank identification (BID), and lane identification (LID). DID and BID are device specific; therefore, they can be used for link identification. • ILAS enabling is controlled in Register 0x5F, Bits[3:2] and by default is enabled. Optionally, to support some unique instances of the interfaces (such as NMCDA-SL), the JESD204B interface can be programmed to either disable the ILAS sequence or continually repeat the ILAS sequence. The AD9250 has fixed values of some of the JESD204B interface parameters, and they are as follows: • • • [N] = 14: number of bits per converter is 14, in Register 0x72, Bits[4:0]; Register 0x72 represents a value of N − 1. [N’] = 16: number of bits per sample is 16, in Register 0x73, Bits[4:0]; Register 0x73 represents a value of N’ − 1. [CF] = 0: number of control words/ frame clock cycle/converter is 0, in Register 0x75, Bits[4:0]. Set number of frames per multiframe, K Verify read only values: lanes per link (L), octets per frame (F), number of converters (M), and samples per converter per frame (S). The AD9250 calculates values for some JESD204B parameters based on other settings, particularly the quick configuration register selection. The read only values here are available in the register map for verification. • • • • Per the JESD204B specification, a multiframe is defined as a group of K successive frames, where K is between 1 and 32, and it requires that the number of octets be between 17 and 1024. The K value is set to 32 by default in Register 0x70, Bits[7:0]. Note that Register 0x70 represents a value of K − 1. The K value can be changed; however, it must comply with a few conditions. The AD9250 uses a fixed value for octets per frame [F] based on the JESD204B quick configuration setting. K must also be a multiple of 4 and conform to the following equation. 32 ≥ K ≥ Ceil (17/F) • Table 11. JESD204B Configurable Identification Values Register, Bits 0x66, [4:0] 0x67, [4:0] 0x64, [7:0] 0x65, [3:0] Value Range 0…31 0…31 0…255 0…15 Scramble, SCR. • • • • Check FCHK, Checksum of JESD204B Interface Parameters The JESD204B specification also calls for the number of octets per multiframe (K × F) to be between 17 and 1024. The F value is fixed through the quick configuration setting to ensure this relationship is true. DID Value LID (Lane 0) LID (Lane 1) DID BID • [L] = lanes per link can be 1 or 2, read the values from Register 0x6E, Bit 0 [F] = octets per frame can be 1, 2, or 4, read the value from Register 0x6F, Bits[7:0] [HD] = high density mode can be 0 or 1, read the value from Register 0x75, Bit 7 [M] = number of converters per link can be 1 or 2, read the value from Register 0x71, Bits[7:0] [S] = samples per converter per frame can be 1 or 2, read the value from Register 0x74, Bits[4:0] Scrambling can be enabled or disabled by setting Register 0x6E, Bit 7. By default, scrambling is enabled. Per the JESD204B protocol, scrambling is only functional after the lane synchronization has completed. The JESD204B parameters can be verified through the checksum value [FCHK] of the JESD204B interface parameters. Each lane has a FCHK value associated with it. The FCHK value is transmitted during the ILAS second multiframe and can be read from the internal registers. The checksum value is the modulo 256 sum of the parameters listed in the No. column of Table 12. The checksum is calculated by adding the parameter fields before they are packed into the octets shown in Table 12. The FCHK for the lane configuration for data coming out of Lane 0 can be read from Register 0x78. Similarly, the FCHK for the lane configuration for data coming out of Lane 1 can be read from Register 0x79. Rev. E | Page 27 of 45 AD9250 Data Sheet Re-Enable Lanes After Configuration Table 12. JESD204B Configuration Table Used in ILAS and CHKSUM Calculation No. 0 1 2 3 4 5 6 7 8 9 10 Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 DID[7:0] Bit 2 Bit 1 After modifying the JESD204B link parameters, enable the link so that the synchronization process can begin. This is accomplished by writing Logic 0 to Register 0x5F, Bit 0. Bit 0 (LSB) Internal FIFO Timing Optimization BID[3:0] LID[4:0] L[4:0] SCR Each lane of the of the AD9250 JESD204B digital path includes an internal FIFO situated between the framer and serializer, which operate from two different clock domains, the ADC sample clock and JESD204B PLL domains. To optimize the write and read pointers against possible FIFO overflow (or underflow) under extreme temperature changes and inconsistent power-up conditions, additional steps are required to increase the timing margin. The procedures described in Step 15 of Table 19 adjust the write clock phase (via Register 0xEE and Register 0xEF) with respect to the read clock to optimize the timing margin. F[7:0] K[4:0] M[7:0] CS[1:0] SUBCLASS[2:0] JESDV[2:0] N[4:0] N’[4:0] S[4:0] CF[4:0] Additional Digital Output Configuration Options Other data format controls include the following:     Invert polarity of serial output data: Register 0x60, Bit 1. ADC data format (offset binary or twos complement): Register 0x14, Bits[1:0]. Options for interpreting single on SYSREF± and SYNCINB±: Register 0x3A. See Table 14 for additional descriptions of Register 0x3A controls. Option to remap converter and lane assignments, Register 0x82 and Register 0x83. See Figure 54 for simplified block diagram. AD9250 DUAL ADC CONVERTER A INPUT CONVERTER A CONVERTER A SAMPLE A PRIMARY CONVERTER INPUT [0] PRIMARY LANE OUTPUT [0] SERDOUT0 LANE 0 JESD204B LANE CONTROL (M = 1, 2; L = 1, 2) B SECONDARY CONVERTER INPUT [1] SECONDARY LANE OUTPUT [1] LANE 1 LANE MUX (SPI REGISTER MAPPING: 0x82,0x83) A CONVERTER B INPUT SECONDARY CONVERTER INPUT [1] SECONDARY LANE OUTPUT [1] LANE 1 JESD204B LANE CONTROL (M = 1, 2; L = 1, 2) CONVERTER B CONVERTER B SAMPLE B PRIMARY CONVERTER INPUT [0] PRIMARY LANE OUTPUT [0] LANE 0 10559-049 SYSREF SERDOUT1 SYNCINB Figure 54. AD9250 Transmit Link Simplified Block Diagram Rev. E | Page 28 of 45 Data Sheet VINA– A PATH (LSB) JESD204B TEST PATTERN 10-BIT 8B/10B ENCODER/ CHARACTER REPLACEMENT OPTIONAL SCRAMBLER 1 + x14 + x15 A6 A7 A8 A9 A10 A11 A12 A13 C0 C1 A0 A1 A2 A3 A4 A5 S8 S9 S10 S11 S12 S13 S14 S15 S0 S1 S2 S3 S4 S5 S6 S7 SERIALIZER E10 E11 E12 E13 E14 E15 E16 E17 E18 E19 E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 SERDOUT± E19 . . . E9 E8 E7 E6 E5 E4 E3 E2 E1 E0 ~SYNC t SYSREF 10559-050 ADC JESD204B TEST PATTERN 8-BIT OCTET1 VINA+ A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 ADC TEST PATTERN 16-BIT OCTET0 (MSB) AD9250 Figure 55. AD9250 Digital Processing of JESD204B Lanes Table 13. AD9250 JESD204B Typical Configurations M (No. of Converters), Register 0x71, Bits[7:0] 1 1 2 2 DATA FROM ADC L (No. of Lanes), Register 0x6E, Bit 0 1 2 1 2 FRAME ASSEMBLER (ADD TAIL BITS) F (Octets/Frame), Register 0x6F, Bits[7:0], Read Only 2 1 4 2 OPTIONAL SCRAMBLER 1 + x14 + x15 S (Samples/ADC/Frame), Register 0x74, Bits[4:0], Read Only 1 1 1 1 8B/10B ENCODER Figure 56. AD9250 ADC Output Data Path Rev. E | Page 29 of 45 TO RECEIVER HD (High Density Mode), Register 0x75, Bit 7, Read Only 0 1 0 0 10559-052 JESD204B Configure Setting 0x11 0x12 0x21 0x22 (Default) AD9250 Data Sheet Table 14. AD9250 JESD204B Configuration, Register 0x3A Bit No. 0 Register Description Enable internal SYSREF buffer 1 SYSREF± enable 2 SYSREF± mode 3 Realign on SYSREF; forSubclass 1 only 4 Realign on SYNCB; for Subclass 1 only Functional Description This bit controls the on-chip buffer for the SYSREF singal. By default, this bit is 0, which disables the buffer. If the AD9250 is configured for JESD204B Subclass 1 operation, SYSREF is required to align the JESD204B link and this bit must be set to 1. To avoid a false trigger as a result of transients caused when enabling the buffer (particularly for one-shot SYSREF configuration), set this bit first and then in a consecutive SPI register write, configure all remaining bits in Register 0x3A to the desired JESD204B link configuration, including keeping this bit at 1. A setting of 0 (default) gates the SYSREF signal such that the internal logic is not affected by an external SYSREF. Set this bit to 0 when in Subclass 0, that is, when SYSREF is not used. If using Subclass 1 with one-shot SYSREF mode, enable the buffer while the SYSREF is established, but then disable it during normal operation. If using Subclass 1 with continuous SYSREF mode, the buffer must remain enabled for normal operation. This bit enables the circuitry that uses the SYSREF input signal and must be on to enable Subclass 1 operation. Set this bit to 1 when using JESD204B Subclass 1 operation. This bit is self clearing after a valid SYSREF occurs when SYSREF± mode (Register 0x3A, Bit 2) is set to 1 (configured for one-shot SYSREF operation). Note that SYSREF is still used in some digital circuitry even if this bit is 0; to disable the SYSREF signal internally, Register 0x3A Bit 0 must be set to 0. This bit is used in Subclass 1 operation to define one shot or continuous SYSREF mode. To configure continuous (or gapped periodic) SYSREF, this bit is set to 0. For one-shot operation, this bit is set to 1. In one-shot mode, it is recommended that the SYSREF buffer be disabled after SYSREF has occurred by setting Register 0x3A, Bit 0 to 0. When this bit is set to 1, the internal clock alignment for the JESD204B timing is forced when an active SYSREF occurs. This is recommended only for one-shot mode and must only be done prior to initially establishing a link. This resets the JESD204B link on active SYSREF. For continuous SYSREF mode, this bit must be set to 0 during normal operation. When this bit is set to 1, the internal clock alignment for the JESD204B timing is forced when an active SYNC occurs. An active SYNC requires the SYNCINB input to be logic low for at least four consecutive LMFCs. Table 15. AD9250 JESD204B Frame Alignment Monitoring and Correction Replacement Characters Scrambling Off Off Off On On On Lane Synchronization On On Off On On Off Character to be Replaced Last octet in frame repeated from previous frame Last octet in frame repeated from previous frame Last octet in frame repeated from previous frame Last octet in frame equals D28.7 Last octet in frame equals D28.3 Last octet in frame equals D28.7 Last Octet in Multiframe No Yes Not applicable No Yes Not applicable Replacement Character K28.7 K28.3 K28.7 K28.7 K28.3 K28.7 FRAME AND LANE ALIGNMENT MONITORING AND CORRECTION each output equal to a nominal 4 mA. Each output presents a 100 Ω dynamic internal termination to reduce unwanted reflections. Frame alignment monitoring and correction is part of the JESD204B specification. The 14-bit word requires two octets to transmit all the data. The two octets (MSB and LSB), where F = 2, make up a frame. During normal operating conditions, frame alignment is monitored via alignment characters, which are inserted under certain conditions at the end of a frame. Table 15 summarizes the conditions for character insertion along with the expected characters under the various operation modes. If lane synchronization is enabled, the replacement character value depends on whether the octet is at the end of a frame or at the end of a multiframe. Place a 100 Ω differential termination resistor at each receiver input to result in a nominal 300 mV peak-to-peak swing at the receiver (see Figure 57). Alternatively, single-ended 50 Ω termination can be used. When single-ended termination is used, the termination voltage should be DRVDD/2; otherwise, ac coupling capacitors can be used to terminate to any single-ended voltage. DRVDD 100Ω DIFFERENTIAL 0.1µF TRACE PAIR SERDOUTx+ 100Ω The AD9250 has differential digital outputs that power up by default. The driver current is derived on-chip and sets the output current at Rev. E | Page 30 of 45 RECEIVER 0.1µF OUTPUT SWING = VOD (SEE TABLE 3) DIGITAL OUTPUTS AND TIMING OR SERDOUTx– VCM = Rx VCM Figure 57. AC-Coupled Digital Output Termination Example 10559-053 Based on the operating mode, the receiver can ensure that it is still synchronized to the frame boundary by correctly receiving the replacement characters. VRXCM Data Sheet AD9250 The AD9250 digital outputs can interface with custom ASICs and FPGA receivers, providing superior switching performance in noisy environments. Single point-to-point network topologies are recommended with a single differential 100 Ω termination resistor placed as close to the receiver logic as possible. The common mode of the digital output automatically biases itself to half the supply of the receiver (that is, the common-mode voltage is 0.9 V for a receiver supply of 1.8 V) if dc-coupled connecting is used (see Figure 58). For receiver logic that is not within the bounds of the DRVDD supply, use an ac-coupled connection. Simply place a 0.1 µF capacitor on each output pin and derive a 100 Ω differential termination close to the receiver side. If there is no far-end receiver termination, or if there is poor differential trace routing, timing errors may result. To avoid such timing errors, it is recommended that the trace length be less than six inches, and that the differential output traces be close together and at equal lengths. Figure 59 shows an example of the digital output (default) data eye and time interval error (TIE) jitter histogram and bathtub curve for the AD9250 lane running at 5 Gbps. Additional SPI options allow the user to further increase the output driver voltage swing of all four outputs to drive longer trace lengths (see Register 0x15 in Table 18). The power dissipation of the DRVDD supply increases when this option is used. See the Memory Map section for more details. 100Ω DIFFERENTIAL TRACE PAIR DRVDD The format of the output data is twos complement by default. To change the output data format to offset binary, see the Memory Map section (Register 0x14 in Table 18). SERDOUTx+ 100Ω RECEIVER OUTPUT SWING = VOD (SEE TABLE 3) VCM = DRVDD/2 10559-054 SERDOUTx– Figure 58. DC-Coupled Digital Output Termination Example HEIGHT1: EYE DIAGRAM 400 1 3 – 6000 200 – 1–2 1–4 5000 100 4000 BER HITS 1–6 0 1–8 3000 –100 1–10 2000 –300 1–12 1000 EYE: TRANSITION BITS OFFSET: –0.0072 UIs: 8000; 999992 TOTAL: 8000.999992 –200 –100 0 TIME (ps) 100 0 200 1–14 –10 0 TIME (ps) 1–16 –0.5 10 0.78 UI 0 UIs 10559-056 –200 –400 TJ@BER1: BATHTUB 2 – 300 VOLTAGE (mV) PERIOD1: HISTOGRAM 7000 1 0.5 Figure 59. AD9250 Digital Outputs Data Eye, Histogram and Bathtub, External 100 Ω Terminations at 5 Gbps HEIGHT1: EYE DIAGRAM 400 – 300 1 3 – 1–4 3000 1–6 2500 BER HITS 0 – 1–2 3500 100 TJ@BER1: BATHTUB 2 4000 200 2000 –100 1–8 1–10 1500 –200 1–12 1000 –300 1–14 500 EYE: TRANSITION BITS OFFSET: 0 –400 UIs: 8000; 679999 TOTAL: 8000; 679999 0 –250 –150 –50 0 50 TIME (ps) 150 250 –10 0 TIME (ps) 10 1–16 –0.5 0.84 UI 0 UIs Figure 60. AD9250 Digital Outputs Data Eye, Histogram and Bathtub, External 100 Ω Terminations at 3.4 Gbps Rev. E | Page 31 of 45 0.5 10559-156 VOLTAGE (mV) PERIOD1: HISTOGRAM 4500 1 AD9250 Data Sheet ADC OVERRANGE AND GAIN CONTROL Fast Threshold Detection (FDA and FDB) In receiver applications, it is desirable to have a mechanism to reliably determine when the converter is about to be clipped. The standard overflow indicator provides delayed information on the state of the analog input that is of limited value in preventing clipping. Therefore, it is helpful to have a programmable threshold below full scale that allows time to reduce the gain before the clip occurs. In addition, because input signals can have significant slew rates, latency of this function is of concern. The FD indicator is asserted if the input magnitude exceeds the value programmed in the fast detect upper threshold registers, located in Register 0x47 and Register 0x48. The selected threshold register is compared with the signal magnitude at the output of the ADC. The fast upper threshold detection has a latency of 7 clock cycles. The approximate upper threshold magnitude is defined by Upper Threshold Magnitude (dBFS) = 20 log (Threshold Magnitude/213) Using the SPI port, the user can provide a threshold above which the FD output is active. Bit 0 of Register 0x45 enables the fast detect feature. Register 0x47 to Register 0x4A allow the user to set the threshold levels. As long as the signal is below the selected threshold, the FD output remains low. In this mode, the magnitude of the data is considered in the calculation of the condition, but the sign of the data is not considered. The threshold detection responds identically to positive and negative signals outside the desired range (magnitude). Or, alternatively, the register value can be calculated by the target threshold using the following equation: Value = 10(Threshold Magnitude [dBFS]/20) × 213 The FD indicators are not cleared until the signal drops below the lower threshold for the programmed dwell time. The lower threshold is programmed in the fast detect lower threshold registers, located at Register 0x49 and Register 0x4A. The fast detect lower threshold register is a 13-bit register that is compared with the signal magnitude at the output of the ADC. This comparison is subject to the ADC pipeline latency but is accurate in terms of converter resolution. The lower threshold magnitude is defined by ADC OVERRANGE (OR) The ADC overrange indicator is asserted when an overrange is detected on the input of the ADC. The overrange condition is determined at the output of the ADC pipeline and, therefore, is subject to a latency of 36 ADC clock cycles. An overrange at the input is indicated by this bit 36 clock cycles after it occurs. Lower Threshold Magnitude (dBFS) = 20 log (Threshold Magnitude/213) GAIN SWITCHING For example, to set an upper threshold of −6 dBFS, write 0x0FFF to those registers; and to set a lower threshold of −10 dBFS, write 0x0A1D to those registers. The AD9250 includes circuitry that is useful in applications either where large dynamic ranges exist, or where gain ranging amplifiers are employed. This circuitry allows digital thresholds to be set such that an upper threshold and a lower threshold can be programmed. The dwell time can be programmed from 1 to 65,535 sample clock cycles by placing the desired value in the fast detect dwell time registers, located in Register 0x4B and Register 0x4C. One such use is to detect when an ADC is about to reach full scale with a particular input condition. The result is to provide an indicator that can be used to quickly insert an attenuator that prevents ADC overdrive. The operation of the upper threshold and lower threshold registers, along with the dwell time registers, is shown in Figure 61. UPPER THRESHOLD DWELL TIME LOWER THRESHOLD DWELL TIME FDA OR FDB Figure 61. Threshold Settings for FDA and FDB Signals Rev. E | Page 32 of 45 TIMER COMPLETES BEFORE SIGNAL RISES ABOVE LT 10559-057 MIDSCALE TIMER RESET BY RISE ABOVE LT Data Sheet AD9250 DC CORRECTION Because the dc offset of the ADC may be significantly larger than the signal being measured, a dc correction circuit is included to null the dc offset before measuring the power. The dc correction circuit can also be switched into the main signal path; however, this may not be appropriate if the ADC is digitizing a time-varying signal with significant dc content, such as GSM. DC CORRECTION READBACK DC CORRECTION BANDWIDTH Setting Bit 6 of Register 0x40 freezes the dc correction at its current state and continues to use the last updated value as the dc correction value. Clearing this bit restarts dc correction and adds the currently calculated value to the data. The dc correction circuit is a high-pass filter with a programmable bandwidth (ranging between 0.29 Hz and 2.387 kHz at 245.76 MSPS). The bandwidth is controlled by writing to the 4-bit dc correction bandwidth select register, located at Register 0x40, Bits[5:2]. The following equation can be used to compute the bandwidth value for the dc correction circuit: The current dc correction value can be read back in Register 0x41 and Register 0x42 for each channel. The dc correction value is a 16-bit value that can span the entire input range of the ADC. DC CORRECTION FREEZE DC CORRECTION (DCC) ENABLE BITS Setting Bit 1 of Register 0x40 enables dc correction for use in the output data signal path. DC_Corr_BW = 2−k−14 × fCLK/(2 × π) where: k is the 4-bit value programmed in Bits[5:2] of Register 0x40 (values between 0 and 13 are valid for k). fCLK is the AD9250 ADC sample rate in hertz. Rev. E | Page 33 of 45 AD9250 Data Sheet SERIAL PORT INTERFACE (SPI) The AD9250 SPI allows the user to configure the converter for specific functions or operations through a structured register space provided inside the ADC. The SPI gives the user added flexibility and customization, depending on the application. Addresses are accessed via the serial port and can be written to or read from via the port. Memory is organized into bytes that can be further divided into fields. These fields are documented in the Memory Map section. For detailed operational information, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. CONFIGURATION USING THE SPI Three pins define the SPI of this ADC: the SCLK pin, the SDIO pin, and the CS pin (see Table 16). The SCLK (serial clock) pin is used to synchronize the read and write data presented from/to the ADC. The SDIO (serial data input/output) pin is a dual-purpose pin that allows data to be sent and read from the internal ADC memory map registers. The CS (chip select bar) pin is an active low control that enables or disables the read and write cycles. Table 16. Serial Port Interface Pins Pin SCLK SDIO CS Function Serial Clock. The serial shift clock input, which is used to synchronize serial interface, reads and writes. Serial Data Input/Output. A dual-purpose pin that typically serves as an input or an output, depending on the instruction being sent and the relative position in the timing frame. Chip Select Bar. An active low control that gates the read and write cycles. The falling edge of CS, in conjunction with the rising edge of SCLK, determines the start of the framing. An example of the serial timing and its definitions can be found in Figure 62 and Table 5. Other modes involving the CS are available. The CS can be held low indefinitely, which permanently enables the device; this is called streaming. The CS can stall high between bytes to allow for additional external timing. When CS is tied high, SPI functions are placed in a high impedance mode. This mode turns on any SPI pin secondary functions. All data is composed of 8-bit words. The first bit of each individual byte of serial data indicates whether a read or write command is issued. This allows the SDIO pin to change direction from an input to an output. In addition to word length, the instruction phase determines whether the serial frame is a read or write operation, allowing the serial port to be used both to program the chip and to read the contents of the on-chip memory. If the instruction is a readback operation, performing a readback causes the SDIO pin to change direction from an input to an output at the appropriate point in the serial frame. Data can be sent in MSB first mode or in LSB first mode. MSB first is the default on power-up and can be changed via the SPI port configuration register. For more information about this and other features, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. HARDWARE INTERFACE The pins described in Table 16 comprise the physical interface between the user programming device and the serial port of the AD9250. The SCLK pin and the CS pin function as inputs when using the SPI interface. The SDIO pin is bidirectional, functioning as an input during write phases and as an output during readback. The SPI interface is flexible enough to be controlled by either FPGAs or microcontrollers. One method for SPI configuration is described in detail in the AN-812 Application Note, Microcontroller-Based Serial Port Interface (SPI) Boot Circuit. Do not activate the SPI port during periods when the full dynamic performance of the converter is required. Because the SCLK signal, the CS signal, and the SDIO signal are typically asynchronous to the ADC clock, noise from these signals can degrade converter performance. If the on-board SPI bus is used for other devices, it may be necessary to provide buffers between this bus and the AD9250 to prevent these signals from transitioning at the converter inputs during critical sampling periods. During an instruction phase, a 16-bit instruction is transmitted. Data follows the instruction phase, and its length is determined by the W0 and the W1 bits. Rev. E | Page 34 of 45 Data Sheet AD9250 SPI ACCESSIBLE FEATURES Table 17 provides a brief description of the general features that are accessible via the SPI. These features are described in detail in the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. The AD9250 part-specific features are described in the Memory Map Register Description section. Table 17. Features Accessible Using the SPI Feature Name Mode Clock Offset Test I/O Output Mode Output Phase Output Delay VREF Description Allows the user to set either power-down mode or standby mode Allows the user to access the DCS via the SPI Allows the user to digitally adjust the converter offset Allows the user to set test modes to have known data on output bits Allows the user to set up outputs Allows the user to set the output clock polarity Allows the user to vary the DCO delay Allows the user to set the reference voltage tDS tS tHIGH tCLK tDH tH tLOW CS SDIO DON’T CARE R/W W1 W0 A12 A11 A10 A9 A8 A7 D5 Figure 62. Serial Port Interface Timing Diagram Rev. E | Page 35 of 45 D4 D3 D2 D1 D0 DON’T CARE 10559-058 DON’T CARE SCLK DON’T CARE AD9250 Data Sheet MEMORY MAP READING THE MEMORY MAP REGISTER TABLE Logic Levels Each row in the memory map register table has eight bit locations. The memory map is roughly divided into three sections: the chip configuration registers (Address 0x00 to Address 0x02); the channel index and transfer registers (Address 0x05 and Address 0xFF); and the ADC functions registers, including setup, control, and test (Address 0x08 to Address 0xA8). An explanation of logic level terminology follows: The memory map register table (see Table 18) documents the default hexadecimal value for each hexadecimal address shown. The column with the heading Bit 7 (MSB) is the start of the default hexadecimal value given. For example, Address 0x14, the output mode register, has a hexadecimal default value of 0x01. This means that Bit 0 = 1, and the remaining bits are 0s. This setting is the default output format value, which is twos complement. For more information on this function and others, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. This document details the functions controlled by Register 0x00 to Register 0x25. The remaining registers, Register 0x3A and Register 0x59, are documented in the Memory Map Register Description section. Open and Reserved Locations All address and bit locations that are not included in Table 18 are not currently supported for this device. Unused bits of a valid address location should be written with 0s. Writing to these locations is required only when part of an address location is open (for example, Address 0x18). If the entire address location is open (for example, Address 0x13), do not write to this address location. Default Values • • “Bit is set” is synonymous with “bit is set to Logic 1” or “writing Logic 1 for the bit.” “Clear a bit” is synonymous with “bit is set to Logic 0” or “writing Logic 0 for the bit.” Channel-Specific Registers Some channel setup functions, such as dc offset adjust or ouput data format, can be programmed to a different value for each channel. In these cases, channel address locations are internally duplicated or shadowed for each channel. These registers and bits are designated as local in Table 18. Note that all other listed registers are considered as global; write operations to these registers affect the entire device upon completion of the write operation. Local registers and bits can be accessed by setting the appropriate Channel A or Channel B bits in Register 0x05. If both bits are set, the subsequent write affects the registers of both channels. In a read cycle, set only Channel A or Channel B to read one of the two registers. If both bits are set during an SPI read cycle, the device returns the value for Channel A. To write to a specific channel, the following three steps must occur: 1. 2. 3. After the AD9250 is reset, critical registers are loaded with default values. The default values for the registers are given in the memory map register table, Table 18. Rev. E | Page 36 of 45 Select the desired channel(s) for SPI write operation via Register 0x05. Perform the specific write operation to desired local SPI register. Transfer of the write operation contents to the target local register occurs by setting the self clearing transfer bit of Register 0xFF. Writing 0x01 allows the target local channel register(s) to be updated internally and simultaneously when the transfer bit is set. The internal update takes place when the transfer bit is set and then the bit automatically clears. Data Sheet AD9250 MEMORY MAP REGISTER TABLE All address and bit locations that are not included in Table 18 are not currently supported for this device. Table 18. Memory Map Registers Reg Addr (Hex) 0x00 0x01 Register Name Global SPI config CHIP ID Bit 7 (MSB) 0 0x02 Chip info 0x05 Channel index 0x08 PDWN modes 0x09 Global clock (local) Reserved 0x0A PLL status PLL locked status 0x0B Global clock divider (local) 0x0D Test control reg (local) Bit 6 LSB first Bit 5 Soft reset Bit 4 1 Bit 3 1 Bit 2 Soft reset Bit 1 LSB first Bit 0 (LSB) 0 AD9250 8-bit chip ID is 0xB9 Reserved for chip die revision currently 0x0 Speed grade 00 = 250 MSPS 11 = 170 MSPS External PDWN mode; 0= PDWN is full power down; 1= PDWN puts device in standby User test mode cycle; 00 = repeat pattern (user pattern 1, 2, 3, 4, 1, 2, 3, 4, 1, …); 10 = single pattern (user pattern 1, 2, 3, 4, then all zeros) JTX in standby; 0= JESD204B core is unaffected in standby; 1= JESD204B core is powered down except for PLL during standby JESD204B power modes; 00 = normal mode (power up); 01 = power-down mode: PLL off, serializer off, clocks stopped, digital held in reset; 10 = standby mode: PLL on, serializer off, clocks stopped, digital held in reset Clock selection: 00 = Nyquist clock 10 = RF clock divide by 4 11 = clock off SPI write to SPI write ADC A path to ADC B path Chip power modes; 00 = normal mode (power up); 01 = power-down mode, digital datapath clocks disabled, digital datapath held in reset; most analog paths powered off; 10 = standby mode; digital datapath clocks disabled, digital datapath held in reset, some analog paths powered off (Local) Clock duty cycle stabilizer (DCS) enable JESD204B link is ready Clock divider ratio of the divide by 1 to Clock divider phase output of the divide by 8 divider circuit to generate internal divide by 1 to divide by 8 the encode clock; divider circuit, clock cycles are relative 0x00 = divide by 1; to the input clock to this block; 0x01 = divide by 2; 0x0 = 0 input clock cycles delayed; 0x02 = divide by 3; 0x1 = 1 input clock cycles delayed; … 0x2 = 2 input clock cycles delayed; 0x7 = divide by 8; … using a CLKDIV_DIVIDE_RATIO > 0 0x7 = 7 input clock cycles delayed (Divide Ratio > 1) causes the DCS to be Note that the RF clock divider phase is automatically enabled not selectable Data output test generation mode; Short Long 0000 = off (normal mode); psuedo psuedo 0001 = midscale short; random random 0010 = positive full scale; number number 0011 = negative full scale; generator generator 0100 = alternating checkerboard; reset; reset; 0101 = PN23 sequence long; 0 = short 0 = long 0110 = PN9 sequence short; PRN PRN 0111 = one-/zero-word toggle; enabled; enabled; 1000 = user test mode (use with Register 0x0D, Bit 7 1 = short 1 = long and user pattern 1, 2, 3, 4); PRN held in PRN held 1001 to 1110 = unused; reset in reset 1111 = ramp output Rev. E | Page 37 of 45 Default 0x18 Notes 0xB9 Read only 0x00 or 0x30 0x03 0x00 0x01 Local, DCS enabled if clock divider enabled Read only 0x00 Local 0x00 Local AD9250 Reg Addr (Hex) 0x10 Register Name Customer offset (local) 0x14 Output mode (local) 0x15 CML output adjust 0x18 ADC VREF 0x19 User Test Pattern 1 L User Test Pattern 1 M User Test Pattern 2 L User Test Pattern 2 M User Test Pattern 3 L User Test Pattern 3 M User Test Pattern 4 L User Test Pattern 4 M PLL low encode 0x1A 0x1B 0x1C 0x1D 0x1E 0x1F 0x20 0x21 Data Sheet Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (LSB) Offset adjust in LSBs from +31 to −32 (twos complement format); 01 1111 = adjust output by +31; 01 1110 = adjust output by +30; … 00 0001 = adjust output by +1; 00 0000 = adjust output by 0 (default); … 10 0001 = adjust output by −31; 10 0000 = adjust output by −32 Digital datapath output Invert ADC Disable JTX CS bits assignment (in data format select (DFS) data; output conjunction with Register 0x72) (local); 0 = normal from ADC 000 = (overrange||underrange, valid) 00 = offset binary; (default); 001 = (overrange||underrange) 01 = twos complement 1= 010 = (overrange||underrange, blank) inverted 011 = (blank, valid) 100 = (blank, blank) All others = (overrange||underrange, valid) JESD204B CML differential output drive level adjustment; 000 = 81% of nominal (that is, 478 mV); 001 = 89% of nominal (that is, 526 mV); 010 = 98% of nominal (that is, 574 mV); 011 = nominal (default) (that is, 588 mV); 110 = 126% of nominal (that is, 738 mV) Main reference full-scale VREF adjustment; 0 1111 = internal 2.087 V p-p; … 0 0001 = internal 1.772 V p-p; 0 0000 = internal 1.75 V p-p (default); 1 1111 = internal 1.727 V p-p; … 1 0000 = internal 1.383 V p-p User Test Pattern 1 LSB; use in conjunction with Register 0x0D and Register 0x61 Default 0x00 Notes Local 0x01 Local 0x03 0x00 0x00 User Test Pattern 1 MSB 0x00 User Test Pattern 2 LSB 0x00 User Test Pattern 2 MSB 0x00 User Test Pattern 3 LSB 0x00 User Test Pattern 3 MSB 0x00 User Test Pattern 4 LSB 0x00 User Test Pattern 4 MSB 0x00 00 = for lane speeds > 2 Gbps; 01 = for lane speeds < 2 Gbps 0x00 Rev. E | Page 38 of 45 Local Data Sheet Reg Addr (Hex) 0x3A Register Name SYNCINB±/ SYSREF± CTRL (local) 0x40 DCC CTRL (local) 0x41 DCC value LSB (local) DCC value MSB (local) Fast detect control (local) 0x42 0x45 0x47 0x48 0x49 0x4A 0x4B 0x4C 0x5E FD upper threshold (local) FD upper threshold (local) FD lower threshold (local) FD lower threshold (local) FD dwell time (local) FD dwell time (local) 204B quick config AD9250 Bit 7 (MSB) Bit 6 Freeze dc correction; 0= calculate; 1= freezeval Bit 5 Bit 4 SYNCINB± OPERATION 0 = normal mode; 1 = realign lanes on every active SYNCINB± Bit 3 Bit 2 SYSREF± For mode; Subclass 0= 1 Only: continuous 0= reset clock normal dividers; mode; 1 = sync on 1= next realign SYSREF± lanes on rising edge every only active SYSREF±; use with single shot SYSREF in Subclass 1 mode DC correction bandwidth select; correction bandwidth is 2387.32 Hz/reg val; there are 14 possible values; 0000 = 2387.32 Hz; 0001 = 1193.66 Hz; 1101 = 0.29 Hz DC Correction Value[7:0] Bit 1 SYSREF± enable; 0= disabled; 1= enabled. NOTE: This bit self-clears after SYSREF if SYSREF± mode = 1 Bit 0 (LSB) Enable internal SYSREF± buffer; 0 = buffer disabled, external SYSREF± pin ignored; 1 = buffer enabled, use external SYSREF± pin Enable DCC Default 0x00 Notes Local See Table 14 for more details 0x00 Local 0x00 Local 0x00 Local 0x00 Local 0x00 Local 0x00 Local 0x00 Local 0x00 Local Fast Detect Dwell Time[7:0] 0x00 Local Fast Detect Dwell Time[15:8] 0x00 Local Quick configuration register, always reads back 0x00; 0x11 = M = 1, L = 1; one converter, one lane; second converter is not automatically powered down; 0x12 = M = 1, L = 2; one converter, two lanes; second converter is not automatically powered down; 0x21 = M = 2, L = 1; two converters, one lane; 0x22 = M = 2, L = 2; two converters, two lanes 0x00 Always reads back 0x00 DC Correction Value[15:8] Force value of FDA/FDB pins if force pins is true, this value is output on FD pins Fast Detect Upper Threshold[7:0] Pin function; 0 = fast detect; 1= overrange Force FDA/FDB pins; 0= normal function; 1 = force to value Enable fast detect output Fast Detect Upper Threshold[14:8] Fast Detect Lower Threshold[7:0] Fast Detect Lower Threshold[14:8] Rev. E | Page 39 of 45 AD9250 Reg Addr (Hex) 0x5F Data Sheet Register Name 204B Link CTRL 1 Bit 7 (MSB) 0x60 204B Link CTRL 2 Reserved; set to 0 Bit 6 Tail bits: If CS bits are not enabled; 0 = extra bits are 0; 1 = extra bits are 9bit PN Reserved; set to 0 0x61 204B Link CTRL 3 Reserved; set to 0 Reserved; set to 0 0x62 204B Link CTRL 4 204B Link CTRL 5 204B DID config 204B BID config 204B LID Config 0 204B LID Config 1 204B parameters SCR/L 0x63 0x64 0x65 0x66 0x67 0x6E 0x6F 0x70 0x71 0x72 204B parameters F 204B parameters K 204B parameters M 204B parameters CS/N Bit 5 JESD204B test sample enabled Bit 4 Reserved; set to 1 Bit 3 Bit 2 ILAS mode; 01 = ILAS normal mode enabled; 11 = ILAS always on, test mode Bit 1 Reserved; set to 0 Bit 0 (LSB) Powerdown JESD204B link; set high while configuring link parameters Reserved; set to 0 Invert logic of JESD204B bits Test data injection point; JESD204B test mode patterns; 01 = 10-bit data at 0000 = normal operation (test mode disabled); 8B/10B output; 0001 = alternating checker board; 10 = 8-bit data at 0010 = 1/0 word toggle; scrambler input 0011 = PN sequence PN23; 0100 = PN sequence PN9; 0101= continuous/repeat user test mode; 0110 = single user test mode; 0111 = reserved; 1000 = modified RPAT test sequence, must be used with JTX_TEST_GEN_SEL = 01 (output of 8b/10b); 1100 = PN sequence PN7; 1101 = PN sequence PN15; other setting are unused Reserved Default 0x14 0x00 0x00 0x00 Reserved 0x00 JESD204B DID value 0x00 JESD204B BID value 0x00 Lane 0 LID value 0x00 Lane 1 LID value 0x01 JESD204B lanes (L); 0 = 1 lane; 1 = 2 lanes JESD204B scrambling (SCR); 0= disabled; 1= enabled 0x81 JESD204B number of octets per frame (F); calculated value (Note that this value is in x − 1 format) 0x01 JESD204B number of frames per multiframe (K); set value of K per JESD204B specifications, but also must be a multiple of 4 octets (Note that this value is in x − 1 format) JESD204B number of converters (M); 0 = 1 converter; 1 = 2 converters ADC converter resolution (N), Number of control bits 0xD = 14-bit converter (N = 14) (CS); (Note that this value is in x − 1 format) 00 = no control bits (CS = 0); 01 = 1 control bit (CS = 1); 10 = 2 control bits (CS = 2) 0x1F Rev. E | Page 40 of 45 Notes 0x01 0x0D Read Only Data Sheet Reg Addr (Hex) 0x73 0x74 0x75 0x76 0x77 0x78 0x79 0x82 Register Name 204B parameters subclass/Np 204B parameters S 204B parameters HD and CF 204B RESV1 204B RESV2 204B CHKSUM0 204B CHKSUM1 204B Lane Assign 1 AD9250 Bit 7 (MSB) Bit 6 Bit 5 JESD204B subclass; 0x0 = Subclass 0; 0x1 = Subclass 1 (default) Reserved; set to 1 JESD204B HD value; read only Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (LSB) JESD204B N’ value; 0xF = N’ = 16 (Note that this value is in x – 1 format) JESD204B samples per converter frame cycle (S); read only (Note that this value is in x − 1 format) JESD204B control words per frame clock cycle per link (CF); read only 204B Lane Assign 2 0x8B 204B LMFC offset 0xA8 204B preemphasis 0xEE Internal digital clock delay Enable internal clock delay 0xEF Internal digital clock delay Enable internal clock delay JESD204B serial checksumvalue for Lane 1 0x43 0xF3 Internal digital clock alignment 0xFF Device update (global) Reserved; set to 0 00 = assign Logical Lane 1 to Physical Lane A; 01 = assign Logical Lane 1 to Physical Lane B (default) Local multiframe clock (LMFC) phase offset value; reset value for LMFC phase counter when SYSREF is asserted; used for deterministic delay applications JESD204B pre-emphasis enable option (consult factory for more detail); set value to 0x04 for pre-emphasis off; set value to 0x14 for pre-emphasis on Use incrementing values from 0 to 7 to increase Set to 0 Set to 0 Set to 0 internal digital clock delay. For internal data latching purposes, this does not affect external timing. Set to 0 0x00 0x00 0x00 0x42 Reserved; set to 1 Set to 0 Set to 0 Use incrementing values from 0 to 7 to increase internal digital clock delay. For internal data latching purposes, this does not affect external timing. Force manual re-align on Lane 1, self clearing Lane 1 Alignment complete Force manual realign on Lane 0, self clearing Lane 0 alignment complete MEMORY MAP REGISTER DESCRIPTION For more information on functions controlled in Register 0x00 to Register 0x25, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. Rev. E | Page 41 of 45 Read Only 0x02 0x31 0x00 0x04 0x00 0x00 0x14 Transfer settings Notes 0x20 Reserved Field Number 1 Reserved Field Number 2 JESD204B serial checksumvalue for Lane 0 00 = assign Logical Lane 0 to Physical Lane A (default); 01 = assign Logical Lane 0 to Physical Lane B Reserved; Reserved; set to 1 set to 1 0x83 Default 0x2F Typically not required See JESD Section for use See JESD Section for use See JESD Section for use AD9250 Data Sheet APPLICATIONS INFORMATION DESIGN GUIDELINES Before starting system level design and layout of the AD9250, it is recommended that the designer become familiar with these guidelines, which discuss the special circuit connections and layout requirements needed for certain pins. Power and Ground Recommendations When connecting power to the AD9250, use two separate 1.8 V power supplies. The power supply for AVDD can be isolated and for DVDD and DRVDD it can be tied together, in which case isolation between DVDD and DRVDD is required. Isolation can be achieved using a ferrite bead or an inductor of approximately 1 µH. An unfiltered switching regulator is not recommended for the DRVDD supply as it impacts the performance of the JESD204B serial transmission lines and may result in link problems. Alternately, the JESD204B PHY power (DRVDD) and analog (AVDD) supplies can be tied together, and a separate supply can be used for the digital outputs (DVDD). The designer can employ several different decoupling capacitors to cover both high and low frequencies. Locate these capacitors close to the point of entry at the PC board level and close to the pins of the part with minimal trace length. Each power supply domain must have local high frequency decoupling capacitors. This is especially important for DRVDD and AVDD to maintain analog performance. When using the AD9250, a single PCB ground plane should be sufficient. With proper decoupling and smart partitioning of the PCB analog, digital, and clock sections, optimum performance is easily achieved. Exposed Paddle Thermal Heat Slug Recommendations It is mandatory that the exposed paddle on the underside of the ADC be connected to analog ground (AGND) to achieve the best electrical and thermal performance. Mate a continuous, exposed (no solder mask) copper plane on the PCB to the AD9250 exposed paddle, Pin 0. The copper plane must have several vias to achieve the lowest possible resistive thermal path for heat dissipation to flow through the bottom of the PCB. Fill or plug these vias with nonconductive epoxy. To maximize the coverage and adhesion between the ADC and the PCB, overlay a silkscreen to partition the continuous plane on the PCB into several uniform sections. This provides several tie points between the ADC and the PCB during the reflow process. Using one continuous plane with no partitions guarantees only one tie point between the ADC and the PCB. See the evaluation board for a PCB layout example. For detailed information about the packaging and PCB layout of chip scale packages, refer to the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). VCM Decouple the VCM pin to ground with a 0.1 µF capacitor, as shown in Figure 40. For optimal channel-to-channel isolation, include a 33 Ω resistor between the AD9250 VCM pin and the Channel A analog input network connection, as well as between the AD9250 VCM pin and the Channel B analog input network connection. SPI Port When the full dynamic performance of the converter is required, do not activate the SPI port during periods. Because the SCLK, CS, and SDIO signals are typically asynchronous to the ADC clock, noise from these signals can degrade converter performance. If the on-board SPI bus is used for other devices, it may be necessary to provide buffers between this bus and the AD9250 to keep these signals from transitioning at the converter input pins during critical sampling periods. SPI INITIALIZATION SEQUENCE On power-up of the AD9250, a host processor is required to initialize and configure the AD9250 via its SPI port. Figure 63 shows a flowchart of the sequential steps required to bring the AD9250 to an operational state. The number of SPI writes and total initialization time is dependent on how many SPI registers need to be changed from the default setting, usage of the clock divider, and whether JESD204B Subclass 1 synchronization is required. Table 19 shows the minimum SPI writes required to enable the AD9250. Note the following in the sequence of steps shown in Table 19: • • Rev. E | Page 42 of 45 Steps that are listed as optional can be ignored if the default SPI settings are sufficient. Steps that are listed as conditional can be ignored if the specific condition is not applicable. Data Sheet AD9250 APPLY POWER AND CLOCK ALLOW TIME TO SETTLE OPTIONAL MODIFY ANY OTHER JESD204B PARAMETERS FROM DEFAULT SETTING ISSUE SOFTWARE RESET THEN WAIT 500µs MIN JESD204B SUBCLASS1 SYNC YES APPLY EXTERNAL SYSREF WAIT >6LMFC CLOCKS DISABLE SYSREF BUFFER (ONE-SHOT MODE ONLY) NO USE CLOCK DIVIDER? DISABLE THE JESD204B TxPHY DURING SET-UP (AS WELL AS JESD204B Rx) YES ISSUE SOFTWARE POWER-UP WAIT 250ms FIFO WRITE/READ CLOCK ADJUSTMENT WAIT >6LMFC CLOCKS NO OPTIONAL CONFIGURE ANY NON-JESD204 REGISTERS FROM DEFAULT SETTING USE CLOCK DIVIDER? YES JESD204B SUBCLASS1 SYNC ISSUE SOFTWARE POWER-DOWN SET DIVIDER VALUE YES ENABLE SYSREF BUFFER CONFIGURE SYSREF MODE NO READBACKPLL LOCK BIT ENABLE PHY TO BEGIN CGS PHASE FORCE FIFO ALIGNMENT WAIT >6LMFC CLOCKS NO 10559-063 SET THE QUICK JESD204 CONFIGURATION MODE (REFER TO TABLE 13) RESET INTERNAL CLOCKS TO MINIMUM SETTING Figure 63. Flowchart Showing Sequence of Steps Required to Initialize the AD9250 Table 19. SPI Initialization Sequence Address Write Value 0x00 0x3C 0x5F 0x15 6 0x0B 0x01 7 8 9 0xFF 0x5E 0xEE 0x21 0x01 0xML 0x80 0x00 0x14 0x15 0x66 0x67 0x6E 0x70 0x82 0x01 0x03 0x00 0x01 0x81 0x1F 0x0D 0xFF 0x01 Step 1 2 3 4 5 10 Comments Apply power to the AD9250 and allow the voltages and clocks to stabilize. Software reset. Wait 500 μs minimum. Disable the JESD204B PHY. Optional: modify any other non-JESD204B register from default setting depending on application requirements. Note, any local register must be followed by a transfer command (0xFF= 0x01) Optional: set the clock divider ratio if using a clock divider. Note that the 0x01 value shown corresponds to a divide-by-2 clock ratio. Transfer command for local Register Set the JESD204B quick configuration register based on the desired M and L values. Enable the internal clock delay block for minimum delay. Conditional: configure the PLL low encode register. Only set to 0x01 if the lane rate is < 2 GBPS. The default setting is 0x00. Optional: modify the JESD204B centric registers from the default setting as follows: Configure the data output with 0x01 being the default (twos complement). Set the JESD204B CML differential drive level with 0x03 being default (588 mV). Set the Lane 0 and Lane 1 LID value (defaults shown). Set the Lane 0 and Lane 1 LID value (defaults shown). Enable the JESD204B scrambling in Bit 7 while keeping desired JESD204B lane value, L, in Bit 0. Default shown. Modify the JESD204B K and CS values. Default shown. Modify the JESD204B K and CS values. Default shown. Modify other JESD204B centric configurations in Register 0x82 to Register 0x8B and Register 0xA8. Transfer command for local Register Rev. E | Page 43 of 45 AD9250 Step 11 Data Sheet Address Write Value 0x3A 0x01 0xFF 0x3A 0xFF 0x01 0x0F or 0x03 0x01 0x0A 0x5F 0xF3 0x14 0xFF 0x3A 0xFF 0x04 0x01 0xEE 0xEF 0xEE 0xEF 0xEE 0xEF 0xEE 0xEF 0xEE 0xEF 0xEE 0xEF 0xEE 0xEF 0x81 0x81 0x82 0x82 0x83 0x83 0x84 0x84 0x85 0x85 0x86 0x86 0x87 0x87 12 13 14 1 Comments Optional: JESD204B Subclass 1 synchronization setup. Enable the SYSREF buffer first to avoid false triggering (especially one-shot operation) before setting the remaining bits in Register 0x3A. Transfer command for local Register Configure the method of SYSREF operation. For one-shot operation, set to 0x0F. For continuous or gapped periodic SYSREF operation, set to 0x03. Transfer command for local Register Begin JESD204B link establishment. Optional: read back Register 0x0A with 0x81 indicating that the JESD204B PLL is locked. Enable the JESD204B PHY. This begins the CGS phase for establishing a link. Force an internal FIFO alignment. Wait at least six LMFC cycles. Note that the JESD204B link must be established at this time before continuing. Optional: When operating in SubClass 1 mode, apply external SYSREF signal for LMFC alignment. Wait at least six LMFC cycles for LMFC alignment between JESD204B Tx and Rx to occur. Conditional: disable the internal SYSREF buffer if configured for one-shot operation. Transfer command for local Register Internal FIFO clock adjustment. Clock adjustment procedure. 1 Clock adjustment procedure.1 Clock adjustment procedure.1 Clock adjustment procedure.1 Clock adjustment procedure.1 Clock adjustment procedure.1 Clock adjustment procedure.1 Clock adjustment procedure.1 Clock adjustment procedure.1 Clock adjustment procedure.1 Clock adjustment procedure.1 Clock adjustment procedure.1 Clock adjustment procedure.1 Clock adjustment procedure.1 Wait at least six LMFC cycles. Following this procedure optimizes write and read clock delays of internal FIFO to avoid possible overflow, overtemperature, and supply variations. Rev. E | Page 44 of 45 Data Sheet AD9250 OUTLINE DIMENSIONS DETAIL A (JEDEC 95) 7.10 7.00 SQ 6.90 0.30 0.25 0.18 37 36 48 1 0.50 BSC 5.70 5.60 SQ 5.50 EXPOSED PAD TOP VIEW 0.80 0.75 0.70 END VIEW PKG-004452 SEATING PLANE 0.50 0.40 0.30 24 13 BOTTOM VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.203 REF PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) 0.20 MIN 5.50 REF FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-WKKD-4. 02-29-2016-A PIN 1 INDICATOR Figure 64. 48-Lead Lead Frame Chip Scale Package [LFCSP] 7 mm × 7 mm Body and 0.75 mm Package Height (CP-48-13) Dimensions shown in millimeters ORDERING GUIDE Model1 AD9250BCPZ-170 AD9250BCPZRL7-170 AD9250-170EBZ AD9250BCPZ-250 AD9250BCPZRL7-250 AD9250-250EBZ 1 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Description 48-Lead Lead Frame Chip Scale Package [LFCSP] 48-Lead Lead Frame Chip Scale Package [LFCSP] Evaluation Board with AD9250-170 48-Lead Lead Frame Chip Scale Package [LFCSP] 48-Lead Lead Frame Chip Scale Package [LFCSP] Evaluation Board with AD9250-250 Z = RoHS Compliant Part. ©2012–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10559-0-9/17(E) Rev. E | Page 45 of 45 Package Option CP-48-13 CP-48-13 CP-48-13 CP-48-13