AD9265BCPZRL7-105

16-Bit, 125 MSPS/105 MSPS/80 MSPS, 1.8 V Analog-to-Digital Converter AD9265 FEATURES SNR = 79.0 dBFS @ 70 MHz and 125 MSPS SFDR = 93 dBc @ 70 MHz and 125 MSPS Low power: 373 mW @ 125 MSPS 1.8 V analog supply operation 1.8 V CMOS or LVDS output supply Integer 1-to-8 input clock divider IF sampling frequencies to 300 MHz −154.3 dBm/Hz small signal input noise with 200 Ω input impedance @ 70 MHz and 125 MSPS Optional on-chip dither Programmable internal ADC voltage reference Integrated ADC sample-and-hold inputs Flexible analog input range: 1 V p-p to 2 V p-p Differential analog inputs with 650 MHz bandwidth ADC clock duty cycle stabilizer Serial port control User-configurable, built-in self-test (BIST) capability Energy-saving power-down modes PRODUCT HIGHLIGHTS 1. 2. 3. On-chip dither option for improved SFDR performance with low power analog input. Proprietary differential input that maintains excellent SNR performance for input frequencies up to 300 MHz. Operation from a single 1.8 V supply and a separate digital output driver supply accommodating 1.8 V CMOS or LVDS outputs. Standard serial port interface (SPI) that supports various product features and functions, such as data formatting (offset binary, twos complement, or gray coding), enabling the clock duty cycle stabilizer, DCS, power-down, test modes, and voltage reference mode. Pin compatibility with the AD9255, allowing a simple migration from 16 bits down to 14 bits. 4. 5. APPLICATIONS Communications Multimode digital receivers (3G) GSM, EDGE, W-CDMA, LTE, CDMA2000, WiMAX, and TD-SCDMA Smart antenna systems General-purpose software radios Broadband data applications Ultrasound equipment FUNCTIONAL BLOCK DIAGRAM SENSE RBIAS PDWN AGND AVDD (1.8V) LVDS LVDS_RS VREF VCM VIN+ VIN– DITHER CLK+ CLK– SYNC REFERENCE AD9265 DRVDD (1.8V) TRACK-AND-HOLD ADC 16-BIT CORE CLOCK MANAGEMENT 16 OUTPUT STAGING 16 CMOS OR LVDS (DDR) D15 TO D0 OR SERIAL PORT DCO SVDD SCLK/ SDIO/ CSB DFS DCS 08502-001 Figure 1. Rev. A Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2009–2010 Analog Devices, Inc. All rights reserved. AD9265 TABLE OF CONTENTS Features .............................................................................................. 1  Applications ....................................................................................... 1  Product Highlights ........................................................................... 1  Functional Block Diagram .............................................................. 1  Revision History ............................................................................... 2  General Description ......................................................................... 3  Specifications..................................................................................... 4  ADC DC Specifications ............................................................... 4  ADC AC Specifications ................................................................. 5  Digital Specifications ................................................................... 6  Switching Specifications ................................................................ 8  Timing Specifications .................................................................. 9  Absolute Maximum Ratings.......................................................... 10  Thermal Characteristics ............................................................ 10  ESD Caution ................................................................................ 10  Pin Configurations and Function Descriptions ......................... 11  Typical Performance Characteristics ........................................... 15  Equivalent Circuits ......................................................................... 23  Theory of Operation ...................................................................... 25  ADC Architecture ...................................................................... 25  Analog Input Considerations.................................................... 25  Voltage Reference ....................................................................... 28  Clock Input Considerations ...................................................... 29  Power Dissipation and Standby Mode .................................... 31  Digital Outputs ........................................................................... 32  Timing ......................................................................................... 32  Built-In Self-Test (BIST) and Output Test .................................. 33  Built-In Self-Test (BIST) ............................................................ 33  Output Test Modes ..................................................................... 33  Serial Port Interface (SPI) .............................................................. 34  Configuration Using the SPI ..................................................... 34  Hardware Interface..................................................................... 34  Configuration Without the SPI ................................................ 35  SPI Accessible Features .............................................................. 35  Memory Map .................................................................................. 36  Reading the Memory Map Register Table............................... 36  Memory Map Register Table ..................................................... 37  Memory Map Register Descriptions ........................................ 39  Applications Information .............................................................. 40  Design Guidelines ...................................................................... 40  Outline Dimensions ....................................................................... 41  Ordering Guide .......................................................................... 41  REVISION HISTORY 1/10—Rev. 0 to Rev. A Changes to Worst Other (Harmonic or Spur) Parameter, Table 2 ................................................................................................ 5 Changes to Figure 77 ...................................................................... 29 Changes to Input Clock Divider Section ..................................... 30 Changes to Table 17 ........................................................................ 37 Updated Outline Dimensions ....................................................... 41 10/09—Revision 0: Initial Version Rev. A | Page 2 of 44 AD9265 GENERAL DESCRIPTION The AD9265 is a 16-bit, 125 MSPS analog-to-digital converter (ADC). The AD9265 is designed to support communications applications where high performance combined with low cost, small size, and versatility is desired. The ADC core features a multistage, differential pipelined architecture with integrated output error correction logic to provide 16-bit accuracy at 125 MSPS data rates and guarantees no missing codes over the full operating temperature range. The ADC features a wide bandwidth differential sample-andhold analog input amplifier supporting a variety of user-selectable input ranges. It is suitable for multiplexed systems that switch full-scale voltage levels in successive channels and for sampling single-channel inputs at frequencies well beyond the Nyquist rate. Combined with power and cost savings over previously available ADCs, the AD9265 is suitable for applications in communications, instrumentation and medical imaging. A differential clock input controls all internal conversion cycles. A duty cycle stabilizer provides the means to compensate for variations in the ADC clock duty cycle, allowing the converters to maintain excellent performance over a wide range of input clock duty cycles. An integrated voltage reference eases design considerations. The ADC output data format is either parallel 1.8 V CMOS or LVDS (DDR). A data output clock is provided to ensure proper latch timing with receiving logic. Programming for setup and control is accomplished using a 3-wire SPI-compatible serial interface. Flexible power-down options allow significant power savings, when desired. An optional onchip dither function is available to improve SFDR performance with low power analog input signals. The AD9265 is available in a Pb-free, 48-lead LFCSP and is specified over the industrial temperature range of −40°C to +85°C. Rev. A | Page 3 of 44 AD9265 SPECIFICATIONS ADC DC SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, SVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS enabled, unless otherwise noted. Table 1. Parameter RESOLUTION ACCURACY No Missing Codes Offset Error Gain Error Differential Nonlinearity (DNL)2 Integral Nonlinearity (INL)2 TEMPERATURE DRIFT Offset Error Gain Error INTERNAL VOLTAGE REFERENCE Output Voltage Error (1 V Mode) Load Regulation @ 1.0 mA INPUT REFERRED NOISE VREF = 1.0 V ANALOG INPUT Input Span, VREF = 1.0 V Input Capacitance3 Input Common-Mode Voltage REFERENCE INPUT RESISTANCE POWER SUPPLIES Supply Voltage AVDD DRVDD SVDD Supply Current IAVDD2 IDRVDD2 1.8 V CMOS 1.8 V LVDS POWER CONSUMPTION DC Input Sine Wave Input2 DRVDD = 1.8 V CMOS Output Mode LVDS Output Mode Standby Power4 Power-Down Power 1 2 Temp Full Full Full Full Full 25°C Full 25°C Full Full Full Full 25°C Full Full Full Full AD9265BCPZ-801 Min Typ Max 16 Guaranteed ±0.05 ±0.25 ±0.2 ±2.5 −1.0 +1.25 ±0.6 ±2.5 ±1.5 ±2 ±15 +8 3 2.17 2 8 0.9 6 ±12 AD9265BCPZ-1051 Min Typ Max 16 Guaranteed ±0.05 ±0.25 ±0.2 ±2.5 −1.0 +1.25 ±0.65 ±3.5 ±2.0 ±2 ±15 +8 3 2.26 2 8 0.9 6 ±12 AD9265BCPZ-1251 Min Typ Max 16 Guaranteed ±0.05 ±0.25 ±0.4 ±2.5 −1.0 +1.25 ±0.7 ±4.5 ±3.0 ±2 ±15 +8 3 2.17 2 8 0.9 6 ±12 Unit Bits % FSR % FSR LSB LSB LSB LSB ppm/°C ppm/°C mV mV LSB rms V p-p pF V kΩ Full Full Full Full Full Full Full 1.7 1.7 1.7 1.8 1.8 1.9 1.9 3.5 131 1.7 1.7 1.7 1.8 1.8 1.9 1.9 3.5 176 1.7 1.7 1.7 1.8 1.8 1.9 1.9 3.5 202 V V V mA mA mA 126 14 43 241 169 20 46 194 24 49 258 323 343 373 392 mW Full Full Full Full 254 308 54 0.05 0.15 341 391 54 0.05 0.15 394 439 54 0.05 .015 mW mW mW mW The suffix following the part number refers to the model found in the Ordering Guide section. Measured with a low input frequency, full-scale sine wave, with approximately 5 pF loading on each output bit. 3 Input capacitance refers to the effective capacitance between one differential input pin and AGND. 4 Standby power is measured with a dc input, the CLK pins (CLK+, CLK−) inactive (set to AVDD or AGND). Rev. A | Page 4 of 44 AD9265 ADC AC SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, SVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS enabled, unless otherwise noted. Table 2. Parameter SIGNAL-TO-NOISE-RATIO (SNR) fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 200 MHz SIGNAL-TO-NOISE-AND DISTORTION (SINAD) fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 200 MHz EFFECTIVE NUMBER OF BITS (ENOB) fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 200 MHz WORST SECOND OR THIRD HARMONIC fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 200 MHz SPURIOUS-FREE DYNAMIC RANGE (SFDR) fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 200 MHz SPURIOUS-FREE DYNAMIC RANGE (SFDR) Without Dither (AIN @ −23 dBFS) fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 200 MHz With On-Chip Dither (AIN @ −23 dBFS) fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 200 MHz 1 Temp 25°C 25°C Full 25°C 25°C 25°C 25°C Full 25°C 25°C 25°C 25°C 25°C 25°C 25°C 25°C Full 25°C 25°C 25°C 25°C Full 25°C 25°C AD9265BCPZ-802 Min Typ Max 80.2 79.7 78.7 78.4 77.1 79.6 79.6 78.6 77.3 76.0 12.9 12.9 12.5 12.3 −88 −94 −92 −82 −81 88 94 92 82 81 AD9265BCPZ-1052 Min Typ Max 79.7 79.2 78.2 78.3 76.9 79.4 78.8 77.9 77.5 75.7 12.9 12.8 12.6 12.3 −90 −89 −88 −86 −81 90 89 88 86 81 AD9265BCPZ-1252 Min Typ Max 79.0 79.0 77.3 77.5 75.6 78.7 78.7 77.0 77.0 74.4 12.8 12.8 12.5 12.1 −88 −93 −85 −89 −80 88 93 85 89 80 Unit dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS Bits Bits Bits Bits dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc 25°C 25°C 25°C 25°C 25°C 25°C 25°C 25°C 103 103 104 102 110 110 110 110 98 96 96 101 108 109 109 109 96 98 98 97 108 110 109 109 dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS Rev. A | Page 5 of 44 AD9265 Parameter WORST OTHER (HARMONIC OR SPUR) Without Dither fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 200 MHz With On-Chip Dither fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 200 MHz TWO-TONE SFDR Without Dither fIN = 29 MHz (−7 dBFS ), 32 MHz (−7 dBFS ) fIN = 169 MHz (−7 dBFS ), 172 MHz (−7 dBFS ) ANALOG INPUT BANDWIDTH 1 2 1 Temp AD9265BCPZ-802 Min Typ Max AD9265BCPZ-1052 Min Typ Max AD9265BCPZ-1252 Min Typ Max Unit 25°C 25°C Full 25°C 25°C 25°C 25°C Full 25°C 25°C −106 −106 −97 −104 −102 −106 −106 −97 −104 −101 −105 −104 −95 −103 −103 −105 −105 −99 −103 −101 −101 −103 −92 −104 −100 −102 −103 −98 −104 −100 dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc 25°C 25°C 25°C 93 80 650 90 78 650 95 79 650 dBc dBc MHz See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions. The suffix following the part number refers to the model found in the Ordering Guide section. DIGITAL SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, SVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, and DCS enabled, unless otherwise noted. Table 3. Parameter DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−) Logic Compliance Internal Common-Mode Bias Differential Input Voltage Input Voltage Range Input Common-Mode Range High Level Input Current Low Level Input Current Input Capacitance Input Resistance SYNC INPUT Logic Compliance Internal Bias Input Voltage Range High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Capacitance Input Resistance Temperature Min Typ Max Unit Full Full Full Full Full Full Full Full CMOS/LVDS/LVPECL 0.9 0.3 3.6 AGND AVDD 0.9 1.4 −100 +100 −100 +100 4 8 10 12 CMOS 0.9 AGND 1.2 AGND −100 −100 12 1 16 AVDD AVDD 0.6 +100 +100 20 V V p-p V V μA μA pF kΩ Full Full Full Full Full Full Full Full V V V V μA μA pF kΩ Rev. A | Page 6 of 44 AD9265 Parameter LOGIC INPUT (CSB)1 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance LOGIC INPUT (SCLK/DFS)2 High Level Input Voltage Low Level Input Voltage High Level Input Current (VIN = 1.8 V) Low Level Input Current Input Resistance Input Capacitance LOGIC INPUT/OUTPUT (SDIO/DCS)1 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance High Level Output Voltage Low Level Output Voltage LOGIC INPUTS (OEB, PDWN, DITHER, LVDS, LVDS_RS)2 High Level Input Voltage Low Level Input Voltage High Level Input Current (VIN = 1.8 V) Low Level Input Current Input Resistance Input Capacitance DIGITAL OUTPUTS (DRVDD = 1.8 V) CMOS Mode High Level Output Voltage IOH = 50 μA IOH = 0.5 mA Low Level Output Voltage IOL = 1.6 mA IOL = 50 μA LVDS Mode ANSI Mode Differential Output Voltage (VOD) Output Offset Voltage (VOS) Reduced Swing Mode Differential Output Voltage (VOD) Output Offset Voltage (VOS) 1 2 Temperature Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Min 1.22 0 −10 40 Typ Max SVDD 0.6 +10 132 Unit V V μA μA kΩ pF V V μA μA kΩ pF V V μA μA kΩ pF V V V V μA μA kΩ pF 26 2 1.22 0 −92 −10 26 2 1.22 0 −10 38 26 5 1.70 0.2 1.22 0 −90 −10 26 5 2.1 0.6 −134 +10 SVDD 0.6 +10 128 SVDD 0.6 −135 +10 Full Full Full Full 1.79 1.75 0.2 0.05 V V V V Full Full Full Full 290 1.15 160 1.15 345 1.25 200 1.25 400 1.35 230 1.35 mV V mV V Pull-up. Pull-down. Rev. A | Page 7 of 44 AD9265 SWITCHING SPECIFICATIONS −1.0 dBFS differential input, 1.0 V internal reference, and DCS enabled, unless otherwise noted. Table 4. Parameter CLOCK INPUT PARAMETERS Input Clock Rate Conversion Rate2 DCS Enabled DCS Disabled CLK Period—Divide-by-1 Mode (tCLK) CLK Pulse Width High (tCH) Divide-by-1 Mode, DCS Enabled Divide-by-1 Mode, DCS Disabled Divide-by-3 Mode, Divide-by-5 Mode, and Divide-by-7 Mode, DCS Enabled3 Divide-by-2 Mode, Divide-by-4 Mode, Divideby-6 Mode and Divide-by-8 Mode, DCS Enabled or DCS Disabled3 Aperture Delay(tA) Aperture Uncertainty (Jitter, tJ) DATA OUTPUT PARAMETERS CMOS Mode Data Propagation Delay (tPD) DCO Propagation Delay (tDCO)4 DCO to Data Skew (tSKEW) Pipeline Delay (Latency) LVDS Mode Data Propagation Delay (tPD) DCO Propagation Delay (tDCO)4 DCO to Data Skew (tSKEW) Pipeline Delay (Latency) Wake-Up Time5 OUT-OF-RANGE RECOVERY TIME 1 2 3 Temp Full Full Full Full Full Full Full AD9265BCPZ-801 Min Typ Max 625 20 10 12.5 3.75 5.9 0.8 0.8 6.25 6.25 80 80 AD9265BCPZ-1051 Min Typ Max 625 20 10 9.5 2.85 4.5 0.8 0.8 4.75 4.75 105 105 AD9265BCPZ-1251 Min Typ Max 625 20 10 8 2.4 3.8 0.8 0.8 4 4 125 125 Unit MHz MSPS MSPS ns ns ns ns ns 8.75 6.6 6.65 5.0 5.6 4.2 Full Full 1.0 0.07 1.0 0.07 1.0 0.07 ns ps rms Full Full Full Full Full Full Full Full Full Full 2.4 2.7 0.3 2.8 3.4 0.6 12 3.4 3.8 0.4 12.5 500 2 3.4 4.2 0.9 2.4 2.7 0.3 2.8 3.4 0.6 12 3.4 3.8 0.4 12.5 500 2 3.4 4.2 0.9 2.4 2.7 0.3 2.8 3.4 0.6 12 3.4 3.8 0.4 12.5 500 2 3.4 4.2 0.9 ns ns ns Cycles ns ns ns Cycles μs Cycles 2.6 3.3 −0.3 4.2 4.3 1.2 2.6 3.3 −0.3 4.2 4.3 1.2 2.6 3.3 −0.3 4.2 4.3 1.2 The suffix following the part number refers to the model found in the Ordering Guide section. Conversion rate is the clock rate after the divider. See the Input Clock Divider section for additional information on using the DCS with the input clock divider. 4 Additional DCO delay can be added by writing to Bit 0 through Bit 4 in SPI Register 0x17 (see Table 17). 5 Wake-up time is defined as the time required to return to normal operation from power-down mode. Rev. A | Page 8 of 44 AD9265 TIMING SPECIFICATIONS Table 5. Parameter SYNC TIMING REQUIREMENTS tSSYNC tHSYNC SPI TIMING REQUIREMENTS tDS tDH tCLK tS tH tHIGH tLOW tEN_SDIO tDIS_SDIO Conditions SYNC to rising edge of CLK setup time SYNC to rising edge of CLK hold time Setup time between the data and the rising edge of SCLK Hold time between the data and the rising edge of SCLK Period of the SCLK Setup time between CSB and SCLK Hold time between CSB and SCLK SCLK pulse width high SCLK pulse width low Time required for the SDIO pin to switch from an input to an output relative to the SCLK falling edge Time required for the SDIO pin to switch from an output to an input relative to the SCLK rising edge 2 2 40 2 2 10 10 10 10 Min Typ 0.30 0.40 Max Unit ns ns ns ns ns ns ns ns ns ns ns Timing Diagrams N–1 N VIN N+1 N+2 tA N+3 N+4 N+5 tCH CLK+ CLK– DCO/DCO+ DCO– tCL tCLK tDCO LVDS (DDR) MODE D0/1+ TO D14/D15+ D0/1– TO D14/D15– tPD tSKEW DEx – 12 DOx – 12 DEx – 11 DOx – 11 DEx – 10 DOx – 10 DEx –9 DOx –9 DEx –8 DOx –8 CMOS MODE D0 TO D15 NOTES 1. DEx DENOTES EVEN BIT. 2. DOx DENOTES ODD BIT. Dx – 12 Dx – 11 Dx – 10 Dx – 9 Dx – 8 08502-002 Figure 2. LVDS (DDR) and CMOS Output Mode Data Output Timing CLK+ tSSYNC SYNC tHSYNC 08502-104 Figure 3. SYNC Input Timing Requirements Rev. A | Page 9 of 44 AD9265 ABSOLUTE MAXIMUM RATINGS Table 6. Parameter Electrical AVDD to AGND DRVDD to AGND SVDD to AGND VIN+, VIN− to AGND CLK+, CLK− to AGND SYNC to AGND VREF to AGND SENSE to AGND VCM to AGND RBIAS to AGND CSB to AGND SCLK/DFS to AGND SDIO/DCS to AGND OEB to AGND PDWN to AGND LVDS to AGND LVDS_RS to AGND DITHER to AGND D0 through D15 to AGND DCO to AGND Environmental Operating Temperature Range (Ambient) Maximum Junction Temperature Under Bias Storage Temperature Range (Ambient) Rating −0.3 V to +2.0 V −0.3 V to +2.0V −0.3 V to +3.6 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to SVDD +0.3 V −0.3 V to SVDD +0.3 V −0.3V to SVDD + 0.3 V −0.3 V to DRVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −40°C to +85°C 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL CHARACTERISTICS The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the customer board increases the reliability of the solder joints and maximizes the thermal capability of the package. Typical θJA is specified for a 4-layer PCB with a solid ground plane. As shown, airflow improves heat dissipation, which reduces θJA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes, reduces the θJA. Table 7. Thermal Resistance Airflow Velocity (m/s) 0 1.0 2.5 Package Type 48-Lead LFCSP (CP-48-8) θJA1, 2 24.5 21.4 19.2 θJC1, 3 1.3 θJB1, 4 12.7 Unit °C/W °C/W °C/W 150°C −65°C to +150°C Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board. Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). Per MIL-Std 883, Method 1012.1. 4 Per JEDEC JESD51-8 (still air). 2 3 ESD CAUTION Rev. A | Page 10 of 44 AD9265 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 48 47 46 45 44 43 42 41 40 39 38 37 PDWN RBIAS VCM AVDD LVDS VIN– VIN+ LVDS_RS DNC DNC VREF SENSE SYNC CLK+ 1 2 PIN 1 INDICATOR CLK– 3 AVDD 4 AVDD 5 OEB 6 DNC 7 DCO 8 D0 (LSB) 9 D1 10 D2 11 D3 12 AD9265 PARALLEL CMOS TOP VIEW (Not to Scale) 36 35 34 33 32 31 30 29 28 27 26 25 AVDD DITHER AVDD SVDD CSB SCLK/DFS SDIO/DCS DRVDD DNC OR D15 (MSB) D14 Figure 4. LFCSP Parallel CMOS Pin Configuration (Top View) Table 8. Pin Function Descriptions (Parallel CMOS Mode) Pin No. Mnemonic ADC Power Supplies 13, 20, 29 DRVDD 4, 5, 34, 36, 45 AVDD 33 SVDD 7, 28, 39, 40 DNC 0 AGND Type Supply Supply Supply Ground Description Digital Output Driver Supply (1.8 V Nominal). Analog Power Supply (1.8 V Nominal). SPI Input/Output Voltage. Do Not Connect. Analog Ground. The exposed thermal pad on the bottom of the package provides the analog ground for the input. This exposed pad must be connected to ground for proper operation. Differential Analog Input Pin (+). Differential Analog Input Pin (−). Voltage Reference Input/Output. Voltage Reference Mode Select. See Table 11 for details. External Reference Bias Resistor. Common-Mode Level Bias Output for Analog Inputs. ADC Clock Input—True. ADC Clock Input—Complement. Digital Synchronization Pin. Slave mode only. CMOS Output Data. CMOS Output Data. CMOS Output Data. CMOS Output Data. CMOS Output Data. CMOS Output Data. CMOS Output Data. CMOS Output Data. CMOS Output Data. Rev. A | Page 11 of 44 ADC Analog 42 43 38 37 47 46 2 3 Digital Input 1 Digital Outputs 9 10 11 12 14 15 16 17 18 VIN+ VIN− VREF SENSE RBIAS VCM CLK+ CLK− SYNC D0 (LSB) D1 D2 D3 D4 D5 D6 D7 D8 Input Input Input/output Input Input/output Output Input Input Input Output Output Output Output Output Output Output Output Output 08502-003 NOTES 1. DNC = DO NOT CONNECT. 2. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE PACKAGE PROVIDES THE ANALOG GROUND FOR THE INPUT. THIS EXPOSED PAD MUST BE CONNECTED TO GROUND FOR PROPER OPERATION. DRVDD D4 D5 D6 D7 D8 D9 DRVDD D10 D11 D12 D13 13 14 15 16 17 18 19 20 21 22 23 24 AD9265 Pin No. Mnemonic 19 D9 21 D10 22 D11 23 D12 24 D13 25 D14 26 D15 (MSB) 27 OR 8 DCO SPI Control 31 SCLK/DFS 30 SDIO/DCS 32 CSB ADC Configuration 6 OEB 35 DITHER 41 44 48 LVDS_RS LVDS PDWN Type Output Output Output Output Output Output Output Output Output Input Input/output Input Input Input Input Input Input Description CMOS Output Data. CMOS Output Data. CMOS Output Data. CMOS Output Data. CMOS Output Data. CMOS Output Data. CMOS Output Data. Overrange Output. Data Clock Output. SPI Serial Clock/Data Format Select Pin in External Pin Mode. SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode. SPI Chip Select (Active Low). Output Enable Input (Active Low). In external pin mode, this pin sets dither to on (active high). Pull low for control via SPI in SPI mode. In external pin mode, this pin sets LVDS reduced swing output mode (active high). Pull low for control via SPI in SPI mode. In external pin mode, this pin sets LVDS output mode (active high). Pull low for control via SPI in SPI mode. Power-Down Input in External Pin Mode. In SPI mode, this input can be configured as power-down or standby. Rev. A | Page 12 of 44 AD9265 PDWN RBIAS VCM AVDD LVDS VIN– VIN+ LVDS_RS DNC DNC VREF SENSE 48 47 46 45 44 43 42 41 40 39 38 37 SYNC CLK+ 1 2 PIN 1 INDICATOR CLK– 3 AVDD 4 AVDD 5 OEB 6 DCO– 7 DCO+ 8 D0/1– 9 D0/1+ 10 D2/3– 11 D2/3+ 12 AD9265 INTERLEAVED LVDS TOP VIEW (Not to Scale) 36 35 34 33 32 31 30 29 28 27 26 25 AVDD DITHER AVDD SVDD CSB SCLK/DFS SDIO/DCS DRVDD OR+ OR– D14/15+ D14/15– Figure 5. LFCSP Interleaved Parallel LVDS Pin Configuration (Top View) Table 9. Pin Function Descriptions (Interleaved Parallel LVDS Mode) Pin No. Mnemonic ADC Power Supplies 13, 20, 29 DRVDD 4, 5, 34, 36, 45 AVDD 33 SVDD 39, 40 DNC 0 AGND Type Supply Supply Supply Ground Description Digital Output Driver Supply (1.8 V Nominal). Analog Power Supply (1.8 V Nominal). SPI Input/Output Voltage. Do Not Connect. Analog Ground. The exposed thermal pad on the bottom of the package provides the analog ground for the input. This exposed pad must be connected to ground for proper operation. Differential Analog Input Pin (+). Differential Analog Input Pin (−). Voltage Reference Input/Output. Voltage Reference Mode Select. See Table 11 for details. External Reference Bias Resistor. Common-Mode Level Bias Output for Analog Inputs. ADC Clock Input—True. ADC Clock Input—Complement. Digital Synchronization Pin. Slave mode only. LVDS Output Data Bit 0/Bit 1 (LSB)—True. LVDS Output Data Bit 0/Bit 1 (LSB)—Complement. LVDS Output Data Bit 2/Bit 3—True. LVDS Output Data Bit 2/Bit 3—Complement. LVDS Output Data Bit 4/Bit 5—True. LVDS Output Data Bit 4/Bit 5—Complement. LVDS Output Data Bit 6/Bit 7—True. LVDS Output Data Bit 6/Bit 7—Complement. LVDS Output Data Bit 8/Bit 9 —True. LVDS Output Data Bit 8/Bit 9—Complement. Rev. A | Page 13 of 44 ADC Analog 42 43 38 37 47 46 2 3 Digital Input 1 Digital Outputs 10 9 12 11 15 14 17 16 19 18 VIN+ VIN− VREF SENSE RBIAS VCM CLK+ CLK− SYNC D0/1+ D0/1− D2/3+ D2/3− D4/5+ D4/5− D6/7+ D6/7− D8/9+ D8/9− Input Input Input/output Input Input/output Output Input Input Input Output Output Output Output Output Output Output Output Output Output 08502-004 NOTES 1. DNC = DO NOT CONNECT. 2. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE PACKAGE PROVIDES THE ANALOG GROUND FOR THE PART. THIS EXPOSED PAD MUST BE CONNECTED TO GROUND FOR PROPER OPERATION. DRVDD D4/5– D4/5+ D6/7– D6/7+ D8/9– D8/9+ DRVDD D10/11– D10/11+ D12/13– D12/13+ 13 14 15 16 17 18 19 20 21 22 23 24 AD9265 Pin No. Mnemonic 22 D10/11+ 21 D10/11− 24 D12/13+ 23 D12/13− 26 D14/15+ 25 D14/15− 28 OR+ 27 OR− 8 DCO+ 7 DCO− SPI Control 31 SCLK/DFS 30 SDIO/DCS 32 CSB ADC Configuration 6 OEB 35 DITHER 41 44 48 LVDS_RS LVDS PDWN Type Output Output Output Output Output Output Output Output Output Output Input Input/output Input Input Input Input Input Input Description LVDS Output Data Bit 10/Bit 11—True. LVDS Output Data Bit 10/Bit 11—Complement. LVDS Output Data Bit 12/Bit 13—True. LVDS Output Data Bit 12/Bit 13—Complement. LVDS Output Data Bit 14/Bit 15 (MSB)—True. LVDS Output Data Bit 14/Bit 15 (MSB)—Complement. LVDS Overrange Output—True. LVDS Overrange Output—Complement. LVDS Data Clock Output—True. LVDS Data Clock Output—Complement. SPI Serial Clock/Data Format Select Pin in External Pin Mode. SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode. SPI Chip Select (Active Low). Output Enable Input (Active Low). In external pin mode, this pin sets dither to on (active high). Pull low for control via SPI in SPI mode. In external pin mode, this pin sets LVDS reduced swing output mode (active high). Pull low for control via SPI in SPI mode. In external pin mode, this pin sets LVDS output mode (active high). Pull low for control via SPI in SPI mode. Power-Down Input in External Pin Mode. In SPI mode, this input can be configured as power-down or standby. Rev. A | Page 14 of 44 AD9265 TYPICAL PERFORMANCE CHARACTERISTICS AVDD = 1.8 V, DRVDD = 1.8 V, SVDD = 1.8 V, sample rate = 125 MSPS, DCS enabled, 1.0 V internal reference, 2 V p-p differential input, VIN = −1.0 dBFS, and 32k sample, TA = 25°C, unless otherwise noted. 0 –20 –40 –60 –80 –100 –120 –140 80MSPS 2.4MHz @ –1dBFS SNR = 79.2dB (80.2dBFS) SFDR = 88.2dBc AMPLITUDE (dBFS) 0 –20 –40 –60 –80 –100 –120 –140 80MSPS 200.3MHz @ –1dBFS SNR = 76.5dB (77.5dBFS) SFDR = 81.2dBc AMPLITUDE (dBFS) SECOND HARMONIC THIRD HARMONIC SECOND HARMONIC THIRD HARMONIC 08502-106 0 10 20 FREQUENCY (MHz) 30 40 0 10 20 FREQUENCY (MHz) 30 40 Figure 6. AD9265-80 Single-Tone FFT with fIN = 2.4 MHz 0 –20 –40 –60 –80 –100 –120 –140 SECOND HARMONIC THIRD HARMONIC Figure 9. AD9265-80 Single-Tone FFT with fIN = 200.3 MHz 0 –20 –40 –60 –80 –100 –120 –140 SECOND HARMONIC THIRD HARMONIC 80MSPS 70.1MHz @ –1dBFS SNR = 78.7dB (79.7dBFS) SFDR = 93.8dBc AMPLITUDE (dBFS) 80MSPS 70.1MHz @ –6dBFS SNR = 74.0dB (80.0dBFS) SFDR = 100dBc AMPLITUDE (dBFS) 08502-107 0 10 20 FREQUENCY (MHz) 30 40 0 10 20 FREQUENCY (MHz) 30 40 Figure 7. AD9265-80 Single-Tone FFT with fIN = 70.1 MHz 0 –20 –40 –60 –80 –100 –120 –140 THIRD HARMONIC SECOND HARMONIC Figure 10. AD9265-80 Single-Tone FFT with fIN = 70.1 MHz @ −6 dBFS with Dither Enabled 120 SFDR (dBFS) 100 SNR/SFDR (dBc AND dBFS) 80MSPS 140.1MHz @ –1dBFS SNR = 77.7dB (78.7dBFS) SFDR = 82.2dBc SNR (dBFS) 80 AMPLITUDE (dBFS) 60 SFDR (dBc) 40 SNR (dBc) 20 08502-108 0 10 20 FREQUENCY (MHz) 30 40 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 INPUT AMPLITUDE (dBFS) Figure 8. AD9265-80 Single-Tone FFT with fIN = 140.1 MHz Figure 11. AD9265-80 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 98.12 MHz Rev. A | Page 15 of 44 08502-111 0 –100 08502-110 08502-109 AD9265 120 SFDRFS (DITHER ON) 110 SNR/SFDR (dBFS) 450,000 400,000 350,000 2.17 LSB RMS 100 SFDRFS (DITHER OFF) 90 SNRFS (DITHER OFF) 80 SNRFS (DITHER ON) NUMBER OF HITS 300,000 250,000 200,000 150,000 100,000 50,000 N – 11 N – 10 N–9 N–8 N –7 N–6 N–5 N–4 N–3 N–2 N–1 N N+1 N+2 N+3 N+4 N+5 N+6 N+7 N+8 N +9 N + 10 N + 11 OUTPUT CODE INPUT AMPLITUDE (dBFS) Figure 12. AD9265-80 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 30 MHz With and Without Dither Enabled 100 95 90 INL ERROR (LSB) 4 Figure 15. AD9265-80 Grounded Input Histogram SFDR @ +25°C SFDR @ +85°C 3 2 1 0 –1 –2 –3 08502-113 INL WITHOUT DITHER INL WITH DITHER SNR/SFDR (dBFS/dBc) 85 80 75 70 65 SNR @ –40°C SFDR @ –40°C SNR @ +25°C SNR @ +85°C 0 50 100 150 200 250 300 0 10,000 20,000 INPUT FREQUENCY (MHz) 30,000 40,000 OUTPUT CODE 50,000 60,000 Figure 13. AD9265-80 Single-Tone SNR/SFDR vs. Input Frequency (fIN) and Temperature with 2 V p-p Full Scale 105 1.00 0.75 0.50 Figure 16. AD9265-80 INL with fIN = 12.5 MHz 100 SNR/SFDR (dBFS/dBc) DNL ERROR (LSB) 95 SFDR 0.25 0 –0.25 –0.50 90 85 SNR 80 –0.75 08502-114 30 35 40 45 50 55 60 65 70 75 80 0 10,000 20,000 SAMPLE RATE (MSPS) 30,000 40,000 OUTPUT CODE 50,000 60,000 Figure 14. AD9265-80 Single-Tone SNR/SFDR vs. Sample Rate (fS) with fIN = 70.1 MHz Figure 17. AD9265-80 DNL with fIN = 12.5 MHz Rev. A | Page 16 of 44 08502-117 75 25 –1.00 08502-116 –4 08502-115 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 08502-112 70 –100 0 AD9265 0 –20 –40 –60 –80 –100 –120 –140 SECOND HARMONIC THIRD HARMONIC 105MSPS 2.4MHz @ –1dBFS SNR = 78.8dB (79.8dBFS) SFDR = 91dBc 0 –20 –40 –60 –80 –100 –120 –140 SECOND HARMONIC THIRD HARMONIC 105MSPS 200.3MHz @ –1dBFS SNR = 75.9dB (76.9dBFS) SFDR = 82dBc AMPLITUDE (dBFS) 08502-118 AMPLITUDE (dBFS) 0 10 20 30 40 50 0 10 20 30 40 50 FREQUENCY (MHz) FREQUENCY (MHz) Figure 18. AD9265-105 Single-Tone FFT with fIN = 2.4 MHz 0 –20 –40 –60 –80 –100 –120 –140 THIRD HARMONIC SECOND HARMONIC Figure 21. AD9265-105 Single-Tone FFT with fIN = 200.3 MHz 0 –20 –40 –60 –80 –100 –120 –140 THIRD HARMONIC SECOND HARMONIC 105MSPS 70.1MHz @ –1dBFS SNR = 78.3dB (79.3dBFS) SFDR = 89dBc 105MSPS 70.1MHz @ –6dBFS SNR = 73.7dB (79.7dBFS) SFDR = 92dBc AMPLITUDE (dBFS) 08502-119 AMPLITUDE (dBFS) 0 10 20 30 40 50 0 10 20 30 40 50 FREQUENCY (MHz) FREQUENCY (MHz) Figure 19. AD9265-105 Single-Tone FFT with fIN = 70.1 MHz Figure 22. AD9265-105 Single-Tone FFT with fIN = 70.1 MHz @ −6dBFS with Dither Enabled 120 SFDR (dBFS) 100 0 –20 –40 –60 –80 –100 –120 –140 SNR/SFDR (dBc AND dBFS) 105MSPS 140.1MHz @ –1dBFS SNR = 77.3dB (78.3dBFS) SFDR = 86dBc SNR (dBFS) 80 AMPLITUDE (dBFS) THIRD HARMONIC SECOND HARMONIC 60 SFDR (dBc) 40 SNR (dBc) 20 08502-120 0 10 20 30 40 50 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 FREQUENCY (MHz) INPUT AMPLITUDE (dBFS) Figure 20. AD9265-105 Single-Tone FFT with fIN = 140.1 MHz Figure 23. AD9265-105 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 98.12 MHz Rev. A | Page 17 of 44 08502-123 0 –100 08502-122 08502-121 AD9265 120 SFDRFS (DITHER ON) 400,000 350,000 110 300,000 2.28 LSB RMS SNR/SFDR (dBFS) NUMBER OF HITS 100 SFDRFS (DITHER OFF) 90 SNRFS (DITHER OFF) 80 SNRFS (DITHER ON) 250,000 200,000 150,000 100,000 50,000 0 N – 11 N – 10 N–9 N–8 N –7 N–6 N–5 N–4 N–3 N–2 N–1 N N+1 N+2 N+3 N+4 N+5 N+6 N+7 N+8 N +9 N + 10 N + 11 OUTPUT CODE INPUT AMPLITUDE (dBFS) Figure 24. AD9265-105 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 30 MHz with and without Dither Enabled 100 SFDR @ –40°C 95 SFDR @ +85°C 90 INL ERROR (LSB) 85 80 75 70 65 SNR @ +25°C SNR @ +85°C SNR @ –40°C SFDR @ +25°C 4 3 2 1 0 –1 –2 –3 08502-125 Figure 27. AD9265-105 Grounded Input Histogram INL WITHOUT DITHER INL WITH DITHER SNR/SFDR (dBFS/dBc) 0 50 100 150 200 250 300 0 10,000 20,000 INPUT FREQUENCY (MHz) 30,000 40,000 OUTPUT CODE 50,000 60,000 Figure 25. AD9265-105 Single-Tone SNR/SFDR vs. Input Frequency (fIN) and Temperature with 2 V p-p Full Scale 105 1.00 0.75 0.50 Figure 28. AD9265-105 INL with fIN = 12.5 MHz 100 SNR/SFDR (dBFS/dBc) DNL ERROR (LSB) 95 SFDR 0.25 0 –0.25 –0.50 90 85 SNR 80 –0.75 08502-126 0 10,000 20,000 SAMPLE RATE (MSPS) 30,000 40,000 OUTPUT CODE 50,000 60,000 Figure 26. AD9265-105 Single-Tone SNR/SFDR vs. Sample Rate (fS) with fIN = 70.1 MHz Figure 29. AD9265-105 DNL with fIN = 12.5 MHz Rev. A | Page 18 of 44 08502-129 75 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 –1.00 08502-128 –4 08502-127 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 08502-124 70 –100 AD9265 0 –20 –40 –60 –80 –100 –120 –140 125MSPS 2.4MHz @ –1dBFS SNR = 78.0dB (79.0dBFS) SFDR = 88dBc 0 –20 –40 –60 –80 –100 –120 –140 SECOND HARMONIC THIRD HARMONIC 125MSPS 140.1MHz @ –1dBFS SNR = 76.6dB (77.6dBFS) SFDR = 89dBc AMPLITUDE (dBFS) SECOND HARMONIC THIRD HARMONIC 08502-130 AMPLITUDE (dBFS) 0 10 20 30 40 50 60 0 10 20 30 40 50 60 FREQUENCY (MHz) FREQUENCY (MHz) Figure 30. AD9265-125 Single-Tone FFT with fIN = 2.4 MHz 0 –20 –40 –60 THIRD HARMONIC –80 –100 –120 –140 SECOND HARMONIC Figure 33. AD9265-125 Single-Tone FFT with fIN = 140.1 MHz 0 –20 –40 –60 –80 –100 –120 –140 THIRD HARMONIC SECOND HARMONIC 125MSPS 30.3MHz @ –1dBFS SNR = 78.6dB (79.6dBFS) SFDR = 95dBc 125MSPS 200.3MHz @ –1dBFS SNR = 74.7dB (75.7dBFS) SFDR = 80dBc AMPLITUDE (dBFS) 08502-131 AMPLITUDE (dBFS) 0 10 20 30 40 50 60 0 10 20 30 40 50 60 FREQUENCY (MHz) FREQUENCY (MHz) Figure 31. AD9265-125 Single-Tone FFT with fIN = 30.3 MHz 0 –20 –40 –60 –80 –100 –120 –140 SECOND HARMONIC THIRD HARMONIC Figure 34. AD9265-125 Single-Tone FFT with fIN = 200.3 MHz 0 –20 –40 –60 –80 –100 –120 –140 THIRD HARMONIC 125MSPS 70.1MHz @ –1dBFS SNR = 78.0dB (79.0dBFS) SFDR = 94dBc 125MSPS 220.1MHz @ –1dBFS SNR = 74.3dB (75.3dBFS) SFDR = 80dBc AMPLITUDE (dBFS) AMPLITUDE (dBFS) SECOND HARMONIC 08502-132 0 10 20 30 40 50 60 0 10 20 30 40 50 60 FREQUENCY (MHz) FREQUENCY (MHz) Figure 32. AD9265-125 Single-Tone FFT with fIN = 70.1 MHz Figure 35. AD9265-125 Single-Tone FFT with fIN = 220.1 MHz Rev. A | Page 19 of 44 08502-135 08502-134 08502-133 AD9265 0 –20 –40 –60 –80 –100 –120 –140 125MSPS 70.1MHz @ –6dBFS SNR = 73.5dB (79.5dBFS) SFDR = 98dBc 120 SFDR (dBFS) 100 SNR/SFDR (dBc AND dBFS) AMPLITUDE (dBFS) SNR (dBFS) 80 60 SFDR (dBc) 40 SNR (dBc) 20 SECOND HARMONIC THIRD HARMONIC 08502-136 0 10 20 30 40 50 60 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 FREQUENCY (MHz) INPUT AMPLITUDE (dBFS) Figure 36. AD9265-125 Single-Tone FFT with fIN = 70.1 MHz @ −6 dBFS with Dither Enabled 0 –15 –30 125MSPS 70.1MHz @ –23dBFS SNR = 57.3dBc (80.3dBFS) SFDR = 75.1dBc Figure 39. AD9265-125 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 2.4 MHz 120 SFDR (dBFS) 100 SNR/SFDR (dBc AND dBFS) AMPLITUDE (dBFS) –45 –60 –75 –90 –105 –120 –135 + 4 2 80 SNR (dBFS) 60 SFDR (dBc) 5 3 6 40 SNR (dBc) 20 FREQUENCY (MHz) –90 –80 –70 –60 –50 –40 –30 –20 –10 0 INPUT AMPLITUDE (dBFS) Figure 37. AD9265-125 Single-Tone FFT with fIN = 70.1 MHz @ −23 dBFS with Dither Disabled, 1M Sample 0 –15 –30 125MSPS 70.1MHz @ –23dBFS SNR = 56.8dBc (79.8dBFS) SFDR = 86.8dBc Figure 40. AD9265-125 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 98.12 MHz 120 SFDRFS (DITHER ON) 110 AMPLITUDE (dBFS) SNR/SFDR (dBFS) –45 –60 –75 –90 –105 –120 –135 6 12 18 24 30 36 42 48 54 60 08502-138 100 SFDRFS (DITHER OFF) 90 SNRFS (DITHER OFF) 80 SNRFS (DITHER ON) + 2 5 4 3 6 FREQUENCY (MHz) –90 –80 –70 –60 –50 –40 –30 –20 –10 0 INPUT AMPLITUDE (dBFS) Figure 38. AD9265-125 Single-Tone FFT with fIN = 70.1 MHz @ −23 dBFS with Dither Enabled, 1M Sample Figure 41. AD9265-125 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 30 MHz With and Without Dither Enabled Rev. A | Page 20 of 44 08502-141 70 –100 08502-140 6 12 18 24 30 36 42 48 54 60 08502-137 0 –100 08502-139 0 –100 AD9265 100 SFDR @ –40°C 95 90 SFDR @ +85°C 85 80 75 70 65 SNR @ –40°C –20 SFDR (dBc) 0 SFDR/IMD3 (dBc AND dBFS) SFDR @ +25°C SNR/SFDR (dBFS/dBc) –40 IMD3 (dBc) –60 –80 SFDR (dBFS) –100 –120 IMD3 (dBFS) –140 –90 SNR @ +25°C SNR @ +85°C 08502-142 0 50 100 150 200 250 300 –78 –66 –54 –42 –30 –18 –6 INPUT FREQUENCY (MHz) INPUT AMPLITUDE (dBFS) Figure 42. AD9265-125 Single-Tone SNR/SFDR vs. Input Frequency (fIN) and Temperature with 2 V p-p Full Scale 100 95 SFDR 90 85 80 75 70 65 SNR Figure 45. AD9265-125 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 169.1 MHz, fIN2 = 172.1 MHz, fS = 125 MSPS 0 –20 –40 –60 –80 –100 –120 –140 125MSPS 29.1MHz @ –7dBFS 32.1MHz @ –7dBFS SFDR = 94.9dBc (101.9dBFS) SNR/SFDR (dBFS/dBc) 08502-143 AMPLITUDE (dBFS) 0 50 100 150 200 250 300 0 10 20 30 40 50 60 INPUT FREQUENCY (MHz) FREQUENCY (MHz) Figure 43. AD9265-125 Single-Tone SNR/SFDR vs. Input Frequency (fIN) with 1 V p-p Full Scale 0 –20 SFDR (dBc) Figure 46. AD9265-125 Two-Tone FFT with fIN1 = 29.1 MHz and fIN2 = 32.1 MHz 0 –20 –40 –60 –80 –100 –120 SFDR/IMD3 (dBc AND dBFS) 125MSPS 169.1MHz @ –7dBFS 172.1MHz @ –7dBFS SFDR = 79.4dBc (86.4dBFS) –40 IMD3 (dBc) –60 –80 –100 –120 IMD3 (dBFS) 08502-144 SFDR (dBFS) –78 –66 –54 –42 –30 –18 –6 0 10 20 30 40 50 60 INPUT AMPLITUDE (dBFS) FREQUENCY (MHz) Figure 44. AD9265-125 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 29.1 MHz, fIN2 = 32.1 MHz, fS = 125 MSPS Figure 47. AD9265-125 Two-Tone FFT with fIN1 = 169.1 MHz and fIN2 = 172.1 MHz Rev. A | Page 21 of 44 08502-147 –140 –90 AMPLITUDE (dBFS) –140 08502-146 08502-145 AD9265 105 1.00 0.75 0.50 100 SNR/SFDR (dBFS/dBc) SFDR DNL ERROR (LSB) 95 0.25 0 –0.25 –0.50 90 85 SNR 80 –0.75 –1.00 0 10,000 20,000 30,000 40,000 OUTPUT CODE 50,000 60,000 35 45 55 65 75 85 95 105 115 125 SAMPLE RATE (MSPS) 08502-148 Figure 48. AD9265-125 Single-Tone SNR/SFDR vs. Sample Rate (fS) with fIN = 70.1 MHz 450,000 400,000 SNR/SFDR (dBFS AND dBc) Figure 51. AD9265-125 DNL with fIN = 9.7 MHz 2.13 LSB RMS 100 SFDR 350,000 90 SNR NUMBER OF HITS 300,000 250,000 200,000 150,000 100,000 50,000 0 80 70 60 50 08502-149 0.80 0.85 0.90 0.95 1.00 1.05 1.10 1.15 1.20 INPUT COMMON-MODE VOLTAGE (V) OUTPUT CODE Figure 49. AD9265-125 Grounded Input Histogram 4 3 2 INL ERROR (LSB) 1 0 –1 –2 –3 –4 0 10,000 20,000 30,000 40,000 OUTPUT CODE 50,000 60,000 INL WITHOUT DITHER INL WITH DITHER Figure 52. AD9265-125 SNR/SFDR vs. Input Common Mode (VCM) with fIN = 30 MHz Figure 50. AD9265-125 INL with fIN = 9.7 MHz 08502-150 Rev. A | Page 22 of 44 08502-152 N – 11 N – 10 N–9 N–8 N –7 N–6 N–5 N–4 N–3 N–2 N–1 N N+1 N+2 N+3 N+4 N+5 N+6 N+7 N+8 N +9 N + 10 N + 11 40 0.75 08502-151 75 25 AD9265 EQUIVALENT CIRCUITS AVDD VIN+ OR VIN– VREF 6kΩ 08502-005 Figure 53. Equivalent Analog Input Circuit AVDD Figure 57. Equivalent VREF Circuit SVDD 0.9V CLK+ 10kΩ 10kΩ CLK– SDIO/DCS 350Ω 26kΩ 08502-012 08502-006 Figure 54. Equivalent Clock Input Circuit DRVDD Figure 58. Equivalent SDIO/DCS Circuit SVDD PAD SCLK/DFS 350Ω 26kΩ 08502-007 Figure 55. Digital Output AVDD Figure 59. Equivalent SCLK/DFS Input Circuit SVDD 26kΩ SENSE 350Ω CSB 350Ω 08502-010 Figure 56. Equivalent SENSE Circuit Figure 60. Equivalent CSB Input Circuit Rev. A | Page 23 of 44 08502-011 08502-009 08502-008 AD9265 AVDD PDWN 350Ω 26kΩ 08502-061 DITHER, LVDS OR LVDS_RS 350Ω 26kΩ 08502-063 Figure 61. Equivalent PDWN Circuit Figure 63. Equivalent DITHER, LVDS, and LVDS_RS Input Circuit DRVDD 26kΩ OEB 350Ω Figure 62. Equivalent OEB Input Circuit 08502-062 Rev. A | Page 24 of 44 AD9265 THEORY OF OPERATION With the AD9265, the user can sample any fS/2 frequency segment from dc to 200 MHz, using appropriate low-pass or band-pass filtering at the ADC inputs with little loss in ADC performance. Operation to 300 MHz analog input is permitted, but it occurs at the expense of increased ADC noise and distortion. Synchronization capability is provided to allow synchronized timing between multiple devices. Programming and control of the AD9265 are accomplished using a 3-wire SPI-compatible serial interface. A small resistor in series with each input can help reduce the peak transient current required from the output stage of the driving source. A shunt capacitor can be placed across the inputs to provide dynamic charging currents. This passive network creates a low-pass filter at the ADC input; therefore, the precise values are dependent on the application. In intermediate frequency (IF) undersampling applications, any shunt capacitors should be reduced. In combination with the driving source impedance, the shunt capacitors limit the input bandwidth. Refer to AN-742 Application Note, Frequency Domain Response of Switched-Capacitor ADCs; AN-827 Application Note, A Resonant Approach to Interfacing Amplifiers to SwitchedCapacitor ADCs; and the Analog Dialogue article, “TransformerCoupled Front-End for Wideband A/D Converters,” for more information on this subject (see www.analog.com). BIAS S CS VIN+ CPAR1 CPAR2 H CS VIN– S 08502-037 ADC ARCHITECTURE The AD9265 architecture consists of a front-end sample-andhold input network, followed by a pipelined, switched-capacitor ADC. The quantized outputs from each stage combine into a final 16-bit result in the digital correction logic. The pipelined architecture permits the first stage to operate on a new input sample and the remaining stages to operate on the preceding samples. Sampling occurs on the rising edge of the clock. Each stage of the pipeline, excluding the last, consists of a low resolution flash ADC connected to a switched-capacitor digitalto-analog converter (DAC) and an interstage residue amplifier (MDAC). The residue amplifier magnifies the difference between the reconstructed DAC output and the flash input for the next stage in the pipeline. One bit of redundancy is used in each stage to facilitate digital correction of flash errors. The last stage simply consists of a flash ADC. The input stage can be ac- or dc-coupled in differential or single-ended modes. The output staging block aligns the data, corrects errors, and passes the data to the output buffers. The output buffers are powered from a separate supply, allowing adjustment of the output voltage swing. During power-down, the output buffers go into a high impedance state. S CFB S S CPAR1 CPAR2 BIAS S CFB Figure 64. Switched Capacitor Input For best dynamic performance, the source impedances driving VIN+ and VIN− should be matched, and the inputs should be differentially balanced. An internal differential reference buffer creates positive and negative reference voltages that define the input span of the ADC core. The span of the ADC core is set by this buffer to 2 × VREF. ANALOG INPUT CONSIDERATIONS The analog input to the AD9265 is a differential switchedcapacitor network that has been designed to give optimum performance while processing a differential input signal. The clock signal alternatively switches between sample mode and hold mode (see Figure 64). When the input is switched into sample mode, the signal source must be capable of charging the sample capacitors and settling within 1/2 of a clock cycle. Input Common Mode The analog inputs of the AD9265 are not internally dc biased. In ac-coupled applications, the user must provide this bias externally. Setting the device so that VCM = 0.5 × AVDD is recommended for optimum performance, but the device functions over a wider range with reasonable performance (see Figure 52). An on-board common-mode voltage reference is included in the design and is available from the VCM pin. Optimum performance is achieved when the common-mode voltage of the analog input is set by the VCM pin voltage (typically 0.5 × AVDD). The VCM pin must be decoupled to ground by a 0.1 μF capacitor, as described in the Applications Information section. Rev. A | Page 25 of 44 AD9265 Dither The AD9265 has an optional dither mode that can be selected either through the SPI bus or by using the DITHER pin. Dithering is the act of injecting a known but random amount of white noise, commonly referred to as dither, into the input of the ADC. Dithering has the effect of improving the local linearity at various points along the ADC transfer function. Dithering can significantly improve the SFDR when quantizing small signal inputs, typically when the input level is below −6 dBFS. As shown in Figure 65, the dither that is added to the input of the ADC through the dither DAC is precisely subtracted out digitally to minimize SNR degradation. When dithering is enabled, the dither DAC is driven by a pseudorandom number generator (PN gen). In the AD9265, the dither DAC is precisely calibrated to result in only a very small degradation in SNR and SINAD. The typical SNR and SINAD degradation values, with dithering enabled, are only 1 dB and 0.8 dB, respectively. Static Linearity Dithering also removes sharp local discontinuities in the INL transfer function of the ADC and reduces the overall peak-topeak INL. In receiver applications, utilizing dither helps to reduce DNL errors that cause small signal gain errors. Often this issue is overcome by setting the input noise 5 dB to 10 dB above the converter noise. By utilizing dither within the converter to correct the DNL errors, the input noise requirement can be reduced. Differential Input Configurations Optimum performance is achieved while driving the AD9265 in a differential input configuration. For baseband applications, the AD8138, ADA4937-2, and ADA4938-2 differential drivers provide excellent performance and a flexible interface to the ADC. The output common-mode voltage of the ADA4938 is easily set with the VCM pin of the AD9265 (see Figure 66), and the driver can be configured in the filter topology shown to provide band limiting of the input signal. 15pF 200Ω VIN ADC CORE DOUT DITHER DAC VIN 76.8Ω 90Ω 33Ω 5pF 15Ω VIN– AVDD ADC ADA4938-2 08502-038 PN GEN 0.1µF 120Ω 200Ω DITHER ENABLE 33Ω 15pF 15Ω VIN+ VCM 08502-039 Figure 65. Dither Block Diagram Large Signal FFT In most cases, dithering does not improve SFDR for large signal inputs close to full scale, for example, with a −1 dBFS input. For large signal inputs, the SFDR is typically limited by front-end sampling distortion, which dithering cannot improve. However, even for such large signal inputs, dithering may be useful for certain applications because it makes the noise floor whiter. As is common in pipeline ADCs, the AD9265 contains small DNL errors caused by random component mismatches that produce spurs or tones that make the noise floor somewhat randomly colored part-to-part. Although these tones are typically at very low levels and do not limit SFDR when the ADC is quantizing large signal inputs, dithering converts these tones to noise and produces a whiter noise floor. Small Signal FFT For small signal inputs, the front-end sampling circuit typically contributes very little distortion, and, therefore, the SFDR is likely to be limited by tones caused by DNL errors due to random component mismatches. Therefore, for small signal inputs (typically, those below −6 dBFS), dithering can significantly improve SFDR by converting these DNL tones to white noise. Figure 66. Differential Input Configuration Using the ADA4938-2 For baseband applications where SNR is a key parameter, differential transformer coupling is the recommended input configuration. An example is shown in Figure 67. To bias the analog input, the VCM voltage can be connected to the center tap of the secondary winding of the transformer. C2 R2 R1 2V p-p 49.9Ω C1 R1 0.1µF R2 VIN– ADC VCM 08502-040 VIN+ C2 Figure 67. Differential Transformer-Coupled Configuration The signal characteristics must be considered when selecting a transformer. Most RF transformers saturate at frequencies below a few megahertz (MHz). Excessive signal power can also cause core saturation, which leads to distortion. At input frequencies in the second Nyquist zone and above, the noise performance of most amplifiers is not adequate to achieve the true SNR performance of the AD9265. For applications in Rev. A | Page 26 of 44 AD9265 which SNR is a key parameter, differential double balun coupling is the recommended input configuration (see Figure 68). In this configuration, the input is ac-coupled and the CML is provided to each input through a 33 Ω resistor. These resistors compensate for losses in the input baluns to provide a 50 Ω impedance to the driver. In the double balun and transformer configurations, the value of the input capacitors and resistors is dependent on the input frequency and source impedance and may need to be reduced or removed. Table 10 displays recommended values to set the RC network. However, these values are dependent on the input signal and should be used only as a starting guide. Table 10. Example RC Network Frequency Range (MHz) 0 to 100 100 to 300 R1 Series (Ω Each) 15 10 C1 Differential (pF) 18 10 R2 Series (Ω Each) 15 10 C2 Shunt (pF Each) Open 10 An alternative to using a transformer-coupled input at frequencies in the second Nyquist zone and higher is to use the ADL5562 differential driver. The ADL5562 provides three selectable gain options up to 15.5 dB. An example circuit is shown in Figure 69; additional filtering between the ADL5562 output and the AD9265 input may be required to reduce out-ofband noise. See the ADL5562 data sheet for more information. C2 R1 33Ω R2 0.1µF 2V p-p PA S S P 0.1µF VIN+ ADC 0.1µF 33Ω 0.1µF C1 R1 R2 VIN– VCM 08502-041 C2 Figure 68. Differential Double Balun Input Configuration VCC 0.1µF ANALOG INPUT 0Ω 2 1 5, 6, 7, 8 0.1µF 11 20Ω 0.1µF 10pF 15Ω 100Ω 15Ω VIN+ ADL5562 4 ANALOG INPUT 3 0.1µF 0Ω 9 0.1µF 10 20Ω 0.1µF 5pF 100Ω 15Ω 15Ω AD9265 VIN– VCM 08502-042 0.1µF 10pF Figure 69. Differential Input Configuration Using the ADL5562 Rev. A | Page 27 of 44 AD9265 VOLTAGE REFERENCE A stable and accurate voltage reference is built into the AD9265. The input range can be adjusted by varying the reference voltage applied to the AD9265, using either the internal reference or an externally applied reference voltage. The input span of the ADC tracks reference voltage changes linearly. The various reference modes are summarized in the sections that follow. The Reference Decoupling section describes the best practices PCB layout of the reference. the reference amplifier in a noninverting mode with the VREF output defined as follows: R2  VREF  0.5  1    R1   The input range of the ADC always equals twice the voltage at the reference pin for either an internal or an external reference. VIN+ VIN– Internal Reference Connection A comparator within the AD9265 detects the potential at the SENSE pin and configures the reference into four possible modes, which are summarized in Table 11. If SENSE is grounded, the reference amplifier switch is connected to the internal resistor divider (see Figure 70), setting VREF to 1.0 V for a 2.0 V p-p fullscale input. In this mode, with SENSE grounded, the full scale can also be adjusted through the SPI port by adjusting Bit 6 and Bit 7 of Register 0x18. These bits can be used to change the full scale to 1.25 V p-p, 1.5 V p-p, 1.75 V p-p, or to the default of 2.0 V p-p, as shown in Table 17. Connecting the SENSE pin to the VREF pin switches the reference amplifier output to the SENSE pin, completing the loop and providing a 0.5 V reference output for a 1 V p-p full-scale input. VIN+ VIN– ADC CORE VREF 1.0µF 0.1µF R2 SENSE SELECT LOGIC R1 0.5V 08502-044 ADC Figure 71. Programmable Reference Configuration If the internal reference of the AD9265 is used to drive multiple converters to improve gain matching, the loading of the reference by the other converters must be considered. Figure 72 shows how the internal reference voltage is affected by loading. 0 ADC CORE REFERENCE VOLTAGE ERROR (%) –0.5 VREF = 0.5V –1.0 VREF = 1V –1.5 VREF 1.0µF 0.1µF SELECT LOGIC SENSE 0.5V 08502-043 –2.0 ADC –2.5 Figure 70. Internal Reference Configuration If a resistor divider is connected external to the chip, as shown in Figure 71, the switch again sets to the SENSE pin. This puts Table 11. Reference Configuration Summary Selected Mode External Reference Internal Fixed Reference Programmable Reference Internal Fixed Reference SENSE Voltage AVDD VREF 0.2 V to VREF AGND to 0.2 V Resulting VREF (V) N/A 0.5 0.4 0.6 0.8 1.0 1.2 1.4 LOAD CURRENT (mA) 1.6 1.8 2.0 Figure 72. VREF Accuracy vs. Load Resulting Differential Span (V p-p) 2 × external reference 1.0 2 × VREF 2.0 R2   0.5   1   (see Figure 71) R1   1.0 Rev. A | Page 28 of 44 08502-045 –3.0 0.2 AD9265 External Reference Operation The use of an external reference may be necessary to enhance the gain accuracy of the ADC or improve thermal drift characteristics. Figure 73 shows the typical drift characteristics of the internal reference in 1.0 V mode. 2.0 1.5 VREF = 1.0V 1.0 0.5 0 –0.5 –1.0 0.1µF CLOCK INPUT 0.1µF 50Ω The RF balun configuration is recommended for clock frequencies at 625 MHz and the RF transformer is recommended for clock frequencies from 10 MHz to 200 MHz. The back-to-back Schottky diodes across the transformer/balun secondary limit clock excursions into the AD9265 to approximately 0.8 V p-p differential. This limit helps prevent the large voltage swings of the clock from feeding through to other portions of the AD9265 while preserving the fast rise and fall times of the signal that are critical to low jitter performance. Mini-Circuits® ADT1-1WT, 1:1Z 0.1µF XFMR 100Ω 0.1µF CLK– 08502-048 REFERENCE VOLTAGE ERROR (mV) ADC AD9265 CLK+ –1.5 –2.0 –40 SCHOTTKY DIODES: HSMS2822 Figure 75. Transformer-Coupled Differential Clock (Up to 200 MHz) –20 0 20 40 TEMPERATURE (°C) 60 80 08502-046 Figure 73. Typical VREF Drift Update Figure ADC CLOCK INPUT 1nF 50Ω 1nF SCHOTTKY DIODES: HSMS2822 0.1µF When the SENSE pin is tied to AVDD, the internal reference is disabled, allowing the use of an external reference. An internal reference buffer loads the external reference with an equivalent 6 kΩ load (see Figure 57). The internal buffer generates the positive and negative full-scale references for the ADC core. Therefore, the external reference must be limited to a maximum of 1.0 V. AD9265 CLK+ 0.1µF CLK– 08502-049 Figure 76. Balun-Coupled Differential Clock (625 MHz) CLOCK INPUT CONSIDERATIONS For optimum performance, the AD9265 sample clock inputs, CLK+ and CLK−, should be clocked with a differential signal. The signal is typically ac-coupled into the CLK+ and CLK− pins via a transformer or capacitors. These pins are biased internally (see Figure 74) and require no external bias. AVDD If a low jitter clock source is not available, another option is to ac couple a differential PECL signal to the sample clock input pins, as shown in Figure 77. The AD9510/AD9511/AD9512/ AD9513/AD9514/AD9515/AD9516/AD9517/AD9518/AD9520/ AD9522 clock drivers offer excellent jitter performance. 0.1µF 0.1µF CLK+ CLOCK INPUT AD95xx 0.9V CLK+ 4pF 4pF 08502-047 50kΩ 50kΩ 240Ω 240Ω CLK– Figure 77. Differential PECL Sample Clock (Up To Rated Sample Rate) Figure 74. Equivalent Clock Input Circuit Clock Input Options The AD9265 has a very flexible clock input structure. Clock input can be a CMOS, LVDS, LVPECL, or sine wave signal. Regardless of the type of signal being used, clock source jitter is of the most concern, as described in the Jitter Considerations section. Figure 75 and Figure 76 show two preferred methods for clocking the AD9265. A low jitter clock source is converted from a singleended signal to a differential signal using either an RF transformer or an RF balun. A third option is to ac-couple a differential LVDS signal to the sample clock input pins, as shown in Figure 78. The AD9510/ AD9511/AD9512/AD9513/AD9514/AD9515/AD9516/AD9517/ AD9518/AD9520/AD9522 clock drivers offer excellent jitter performance. Rev. A | Page 29 of 44 08502-050 CLOCK INPUT 0.1µF PECL DRIVER 100Ω 0.1µF ADC AD9265 CLK– AD9265 0.1µF CLOCK INPUT 0.1µF CLK+ AD95xx 0.1µF CLOCK INPUT 50kΩ 50kΩ LVDS DRIVER 100Ω 0.1µF ADC AD9265 CLK– 08502-051 The DCS is enabled by setting the SDIO/DCS pin high when operating in the external pin mode (see Table 12). If the SPI mode is enabled, the DCS is enabled by default and can be disabled by writing a 0x00 to Address 0x09. Input Clock Divider The AD9265 contains an input clock divider with the ability to divide the input clock by integer values between 2 and 8. For clock divide ratios of 2, 4, 6, or 8, the duty cycle stabilizer (DCS) is not required because the output of the divider inherently produces a 50% duty cycle. Enabling the DCS with the clock divider in these divide modes may cause a slight degradation in SNR; therefore, disabling the DCS is recommended. For other divide ratios, divide-by-3, divide-by-5, and divide-by-7, the duty cycle output from the clock divider is related to the input clock’s duty cycle. In these modes, if the input clock has a 50% duty cycle, the DCS is again not required. However, if a 50% duty cycle input clock is not available, the DCS must be enabled for proper part operation. The AD9265 clock divider can be synchronized using an external sync signal applied to the SYNC pin input. Bit 1 and Bit 2 of Register 0x100 allow the clock divider to be resynchronized on every SYNC signal or only on the first SYNC signal after the register is written. A valid signal at the SYNC pin causes the clock divider to reset to its initial state. This synchronization feature allows multiple parts to have their clock dividers aligned to guarantee simultaneous input sampling. If the SYNC pin is not used, it should be tied to AGND. Figure 78. Differential LVDS Sample Clock (Up to Rated Sample Rate) In some applications, it may be acceptable to drive the sample clock inputs with a single-ended CMOS signal. In such applications, drive the CLK+ pin directly from a CMOS gate, and bypass the CLK− pin to ground with a 0.1 μF capacitor (see Figure 79). VCC CLOCK INPUT 0.1µF 50Ω1 1kΩ 1kΩ OPTIONAL 0.1µF 100Ω AD95xx CMOS DRIVER CLK+ ADC AD9265 CLK– 08502-052 0.1µF 150Ω RESISTOR IS OPTIONAL. Figure 79. Single-Ended 1.8 V CMOS Input Clock (Up to 200 MHz) Clock Duty Cycle Typical high speed ADCs use both clock edges to generate a variety of internal timing signals and, as a result, may be sensitive to clock duty cycle. Commonly, a ±5% tolerance is required on the clock duty cycle to maintain dynamic performance characteristics. The AD9265 contains a duty cycle stabilizer (DCS) that retimes the nonsampling (falling) edge, providing an internal clock signal with a nominal 50% duty cycle. This allows the user to provide a wide range of clock input duty cycles without affecting the performance of the AD9265. Noise and distortion performance are nearly flat for a wide range of duty cycles with the DCS enabled. Jitter in the rising edge of the input is still of paramount concern and is not easily reduced by the internal stabilization circuit. The duty cycle control loop does not function for clock rates less than 20 MHz nominally. The loop has a time constant associated with it that must be considered in applications in which the clock rate can change dynamically. A wait time of 1.5 μs to 5 μs is required after a dynamic clock frequency increase or decrease before the DCS loop is relocked to the input signal. During the time period that the loop is not locked, the DCS loop is bypassed, and the internal device timing is dependent on the duty cycle of the input clock signal. In such applications, it may be appropriate to disable the duty cycle stabilizer. The DCS can also be disabled in some cases when using the input clock divider circuit, see the Input Clock Divider section for additional information. In all other applications, enabling the DCS circuit is recommended to maximize ac performance. Jitter Considerations High speed, high resolution ADCs are sensitive to the quality of the clock input. The degradation in SNR from the low frequency SNR (SNRLF) at a given input frequency (fINPUT) due to jitter (tJRMS) can be calculated by SNRHF = −10 log[(2π × fINPUT × tJRMS)2 + 10 (  SNRLF /10) ] In the equation, the rms aperture jitter represents the clock input jitter specification. IF undersampling applications are particularly sensitive to jitter, as illustrated in Figure 80. 80 0.05ps MEASURED 70 75 SNR (dBc) 0.20ps 65 0.50ps 60 55 1.00ps 1.50ps 1 10 100 INPUT FREQUENCY (MHz) 1k 08502-053 50 Figure 80. SNR vs. Input Frequency and Jitter Rev. A | Page 30 of 44 AD9265 Treat the clock input as an analog signal in cases in which aperture jitter may affect the dynamic range of the AD9265. To avoid modulating the clock signal with digital noise, separate power supplies for clock drivers from the ADC output driver supplies. Low jitter, crystal controlled oscillators make the best clock sources. If the clock is generated from another type of source (by gating, dividing, or another method), the output clock should be retimed by the original clock at the last step. Refer to AN-501 Application Note, Aperture Uncertainty and ADC System Performance, and AN-756 Application Note, Sampled Systems and the Effects of Clock Phase Noise and Jitter (see www.analog.com) for more information about jitter performance as it relates to ADCs. 0.5 0.20 0.4 TOTAL POWER (W) 0.16 IAVDD SUPPLY CURRENT (A) 0.3 TOTAL POWER 0.2 0.12 0.08 0.1 IDRVDD 35 45 55 65 75 85 95 0.04 CLOCK FREQUENCY (MSPS) POWER DISSIPATION AND STANDBY MODE As shown in Figure 81, the power dissipated by the AD9265 is proportional to its sample rate. In CMOS output mode, the digital power dissipation is determined primarily by the strength of the digital drivers and the load on each output bit. The maximum DRVDD current (IDRVDD) can be approximately calculated as IDRVDD = VDRVDD × CLOAD × fCLK × N where N is the number of output bits (16 data bits plus 1 DCO, in the case of the AD9265). This maximum current occurs when every output bit switches on every clock cycle, that is, a full-scale square wave at the Nyquist frequency of fCLK/2. In practice, the DRVDD current is established by the average number of output bits switching, which is determined by the sample rate and the characteristics of the analog input signal. Reducing the capacitive load presented to the output drivers can minimize digital power consumption. The data shown in Figure 81, Figure 82, and Figure 83 were taken using a 70 MHz analog input signal with a 5 pF load on each output driver. 0.5 IAVDD 0.4 TOTAL POWER (W) Figure 82. AD9265-105 Power and Current vs. Sample Rate 0.5 0.15 0.4 TOTAL POWER (W) IAVDD 0.3 TOTAL POWER 0.2 0.12 SUPPLY CURRENT (A) 08502-181 0.09 0.06 0.1 IDRVDD 0 25 0.03 35 45 55 65 75 0 ENCODE FREQUENCY (MSPS) Figure 83. AD9265-80 Power and Current vs. Sample Rate 0.20 By asserting PDWN (either through the SPI port or by asserting the PDWN pin high), the AD9265 is placed in power-down mode. In this state, the ADC typically dissipates 0.05 mW. During powerdown, the output drivers are placed in a high impedance state. Asserting the PDWN pin low returns the AD9265 to its normal operating mode. Low power dissipation in power-down mode is achieved by shutting down the reference, reference buffer, biasing networks, and clock. Internal capacitors are discharged when entering powerdown mode and then must be recharged when returning to normal operation. When using the SPI port interface, the user can place the ADC in power-down mode or standby mode. Standby mode allows the user to keep the internal reference circuitry powered when faster wake-up times are required. In addition, when using the SPI mode, the user can change the function of the external PDWN pin to either place the part in power-down or standby mode. See the Memory Map Register Description section for more details. 0.16 SUPPLY CURRENT (A) 0.3 TOTAL POWER 0.12 0.2 0.08 0.1 IDRVDD 50 75 100 0.04 CLOCK FREQUENCY (MSPS) Figure 81. AD9265-125 Power and Current vs. Sample Rate Rev. A | Page 31 of 44 08502-179 0 25 0 125 08502-180 0 25 0 105 AD9265 DIGITAL OUTPUTS The AD9265 output drivers can be configured to interface with 1.8 V CMOS logic families. The AD9265 can also be configured for LVDS outputs using a DRVDD supply voltage of 1.8 V. The AD9265 defaults to CMOS output mode but can be placed into LVDS mode either by setting the LVDS pin high or by using the SPI port to place the part into LVDS mode. Because most users do not toggle between CMOS and LVDS mode during operation, use of the LVDS pin is recommended to avoid any power-up loading issues on the CMOS configured outputs. In CMOS output mode, the output drivers are sized to provide sufficient output current to drive a wide variety of logic families. However, large drive currents tend to cause current glitches on the supplies, which may affect converter performance. Applications requiring the ADC to drive large capacitive loads or large fanouts may require external buffers or latches. In LVDS output mode two output drive levels can be selected, either ANSI LVDS or reduced swing LVDS mode. Using the reduced swing LVDS mode lowers the DRVDD current and reduces power consumption. The reduced swing LVDS mode can be selected by asserting the LVDS_RS pin or by selecting this mode via the SPI port. The output data format is selected for either offset binary or twos complement by setting the SCLK/DFS pin when operating in the external pin mode (see Table 12). As detailed in AN-877 Application Note, Interfacing to High Speed ADCs via SPI, the data format can be selected for offset binary, twos complement, or gray code when using the SPI control. Table 12. SCLK/DFS Mode Selection (External Pin Mode) Voltage at Pin AGND SVDD SCLK/DFS Offset binary (default) Twos complement SDIO/DCS DCS disabled DCS enabled (default) Digital Output Enable Function (OEB) The AD9265 has a flexible three-state ability for the digital output pins. The three-state mode is enabled using the OEB pin or through the SPI interface. If the OEB pin is low, the output data drivers and DCOs are enabled. If the OEB pin is high, the output data drivers and DCOs are placed in a high impedance state. This OEB function is not intended for rapid access to the data bus. Note that OEB is referenced to the output driver supply (DRVDD) and should not exceed that supply voltage. When using the SPI interface, the data and DCO outputs can be three-stated by using the output enable bar bit in Register 0x14. TIMING The AD9265 provides latched data with a pipeline delay of 12 clock cycles (12.5 clock cycles in LVDS mode). Data outputs are available one propagation delay (tPD) after the rising edge of the clock signal. Minimize the length of the output data lines and loads placed on them to reduce transients within the AD9265. These transients can degrade converter dynamic performance. The lowest typical conversion rate of the AD9265 is 10 MSPS. At clock rates below 10 MSPS, dynamic performance can degrade. Data Clock Output (DCO) The AD9265 provides a single data clock output (DCO) pin in CMOS output mode and two differential data clock output (DCO) pins in LVDS mode intended for capturing the data in an external register. In CMOS output mode, the data outputs are valid on the rising edge of DCO, unless the DCO clock polarity has been changed via the SPI. In LVDS output mode, data is output as double data rate with the even numbered output bits transitioning near the rising edge of DCO and the odd numbered output bits transitioning near the falling edge of DCO. See Figure 2 for a graphical timing description. Table 13. Output Data Format Input (V) VIN+ − VIN− VIN+ − VIN− VIN+ − VIN− VIN+ − VIN− VIN+ − VIN− Condition (V) < −VREF − 0.5 LSB = −VREF =0 = +VREF − 1.0 LSB > +VREF − 0.5 LSB Offset Binary Output Mode 0000 0000 0000 0000 0000 0000 0000 0000 1000 0000 0000 0000 1111 1111 1111 1111 1111 1111 1111 1111 Twos Complement Mode 1000 0000 0000 0000 1000 0000 0000 0000 0000 0000 0000 0000 0111 1111 1111 1111 0111 1111 1111 1111 OR 1 0 0 0 1 Rev. A | Page 32 of 44 AD9265 BUILT-IN SELF-TEST (BIST) AND OUTPUT TEST The AD9265 includes built-in test features designed to enable verification of the integrity of the part as well as facilitate board level debugging. A BIST (built-in self-test) feature is included that verifies the integrity of the digital datapath of the AD9265. Various output test options are also provided to place predictable values on the outputs of the AD9265. The outputs are not disconnected during this test, so the PN sequence can be observed as it runs. The PN sequence can be continued from its last value or reset from the beginning, based on the value programmed in Register 0x0E, Bit 2. The BIST signature result varies based on the part configuration. OUTPUT TEST MODES The output test options are shown in Table 17. When an output test mode is enabled, the analog section of the ADC is disconnected from the digital back end blocks and the test pattern is run through the output formatting block. Some of the test patterns are subject to output formatting, and some are not. The seed value for the PN sequence tests can be forced if the PN reset bits are used to hold the generator in reset mode by setting Bit 4 or Bit 5 of Register 0x0D. These tests can be performed with or without an analog signal (if present, the analog signal is ignored), but they do require an encode clock. For more information, see AN-877 Application Note, Interfacing to High Speed ADCs via SPI. BUILT-IN SELF-TEST (BIST) The BIST is a thorough test of the digital portion of the selected AD9265 signal path. When enabled, the test runs from an internal pseudorandom noise (PN) source through the digital datapath starting at the ADC block output. The BIST sequence runs for 512 cycles and stops. The BIST signature value is placed in Register 0x24 and Register 0x25. Rev. A | Page 33 of 44 AD9265 SERIAL PORT INTERFACE (SPI) The AD9265 serial port interface (SPI) allows the user to configure the converter for specific functions or operations through a structured register space provided inside the ADC. The SPI gives the user added flexibility and customization, depending on the application. Addresses are accessed via the serial port and can be written to or read from via the port. Memory is organized into bytes that can be further divided into fields, which are documented in the Memory Map section. For detailed operational information, see AN-877 Application Note, Interfacing to High Speed ADCs via SPI. All data is composed of 8-bit words. The first bit of the first byte in a multibyte serial data transfer frame indicates whether a read command or a write command is issued. This allows the serial data input/output (SDIO) pin to change direction from an input to an output. In addition to word length, the instruction phase determines whether the serial frame is a read or write operation, allowing the serial port to be used both to program the chip and to read the contents of the on-chip memory. If the instruction is a readback operation, performing a readback causes the serial data input/ output (SDIO) pin to change direction from an input to an output at the appropriate point in the serial frame. Data can be sent in MSB-first mode or in LSB-first mode. MSB first is the default on power-up and can be changed via the SPI port configuration register. For more information about this and other features, see AN-877 Application Note, Interfacing to High Speed ADCs via SPI. CONFIGURATION USING THE SPI Three pins define the SPI of this ADC: the SCLK/DFS pin, the SDIO/DCS pin, and the CSB pin (see Table 14). The SCLK/DFS (a serial clock) is used to synchronize the read and write data presented from and to the ADC. The SDIO/DCS (serial data input/output) is a dual-purpose pin that allows data to be sent and read from the internal ADC memory map registers. The CSB (chip select bar) is an active low control that enables or disables the read and write cycles. Table 14. Serial Port Interface Pins Pin Mnemonic SCLK/DFS Function Serial clock. The SCLK function of the pin is for the serial shift clock input, which is used to synchronize serial interface reads and writes. SDIO is the serial data input/output function of the pin. A dual-purpose pin that typically serves as an input or an output, depending on the instruction being sent and the relative position in the timing frame. Chip select bar. An active low control that gates the read and write cycles. HARDWARE INTERFACE The pins described in Table 14 comprise the physical interface between the user programming device and the serial port of the AD9265. The SCLK pin and the CSB pin function as inputs when using the SPI interface. The SDIO pin is bidirectional, functioning as an input during write phases and as an output during readback. The AD9265 has a separate supply pin for the SPI interface, SVDD. The SVDD pin can be set at any level between 1.8 V and 3.3 V to enable operation with a SPI bus at these voltages without requiring level translation. If the SPI port is not used, SVDD can be tied to the DRVDD voltage. The SPI interface is flexible enough to be controlled by either FPGAs or microcontrollers. One method for SPI configuration is described in detail in AN-812 Application Note, MicrocontrollerBased Serial Port Interface (SPI) Boot Circuit. The SPI port should not be active during periods when the full dynamic performance of the converter is required. Because the SCLK signal, the CSB signal, and the SDIO signal are typically asynchronous to the ADC clock, noise from these signals can degrade converter performance. If the on-board SPI bus is used for other devices, it may be necessary to provide buffers between this bus and the AD9265 to prevent these signals from transitioning at the converter inputs during critical sampling periods. Some pins serve a dual function when the SPI interface is not being used. When the pins are tied to AVDD or ground during device power-on, they are associated with a specific function. The Digital Outputs section describes those alternate functions that are supported on the AD9265. SDIO/DCS CSB The falling edge of the CSB, in conjunction with the rising edge of the SCLK, determines the start of the framing. See Figure 84 and Table 5 for an example of the serial timing and its definitions. Other modes involving the CSB are available. The CSB can be held low indefinitely, which permanently enables the device; this is called streaming. The CSB can stall high between bytes to allow for additional external timing. When CSB is tied high at power-up, SPI functions are placed in high impedance mode. This mode turns on any SPI pin secondary functions. When CSB is toggled low after power-up, the part remains in SPI mode and does not revert back to pin mode. During an instruction phase, a 16-bit instruction is transmitted. Data follows the instruction phase, and its length is determined by the W0 and W1 bits. Rev. A | Page 34 of 44 AD9265 CONFIGURATION WITHOUT THE SPI In applications that do not interface to the SPI control registers, the SDIO/DCS pin and the SCLK/DFS pin serve as standalone CMOS-compatible control pins. When the device is powered up, it is assumed that the user intends to use the pins as static control lines for the duty cycle stabilizer and output data format feature control. In this mode, connect the CSB chip select to AVDD, which disables the serial port interface. The OEB pin, the DITHER pin, the LVDS pin, the LVDS_RS pin, and the PDWN pin are active control lines in both external pin mode and SPI mode. The input from these pins or the SPI register setting is used to determine the mode of operation for the part. Table 15. Mode Selection Pin SDIO/DCS SCLK/DFS OEB PDWN External Voltage SVDD (default) AGND SVDD AGND (default) DRVDD AGND (default) AVDD AGND (default) AGND (default) AVDD AGND (default) AVDD AGND (default) AVDD Configuration Duty cycle stabilizer enabled Duty cycle stabilizer disabled Twos complement enabled Offset binary enabled Outputs in high impedance Outputs enabled Chip in power-down or standby mode Normal operation CMOS output mode LVDS output mode ANSI LVDS output levels Reduced swing LVDS output levels Dither disabled Dither enabled SPI ACCESSIBLE FEATURES Table 16 provides a brief description of the general features that are accessible via the SPI. These features are described in detail in AN-877 Application Note, Interfacing to High Speed ADCs via SPI. The AD9265 part-specific features are described in detail following Table 17, the external memory map register table. Table 16. Features Accessible Using the SPI Feature Name Mode Clock Description Allows the user to set either power-down mode or standby mode Allows the user to access the DCS, set the clock divider, set the clock divider phase, and enable the SYNC input Allows the user to digitally adjust the converter offset Allows the user to set test modes to have known data on output bits Allows the user to set the output mode Allows the user to set the output clock polarity Allows the user to vary the DCO delay Allows the user to set the reference voltage Offset Test I/O Output Mode Output Phase Output Delay VREF LVDS LVDS_RS DITHER tDS tS CSB tHIGH tDH tLOW tCLK tH SCLK DON’T CARE DON’T CARE SDIO DON’T CARE R/W W1 W0 A12 A11 A10 A9 A8 A7 D5 D4 D3 D2 D1 D0 DON’T CARE 08502-055 Figure 84. Serial Port Interface Timing Diagram Rev. A | Page 35 of 44 AD9265 MEMORY MAP READING THE MEMORY MAP REGISTER TABLE Each row in the memory map register table has eight bit locations. The memory map is roughly divided into four sections: the chip configuration registers (Address 0x00 to Address 0x02); the transfer register (Address 0xFF); the ADC functions registers, including setup, control, and test (Address 0x08 to Address 0x30); and the digital feature control register (Address 0x100). The memory map register table (see Table 17) documents the default hexadecimal value for each hexadecimal address shown. The column with the heading, Bit 7 (MSB), is the start of the default hexadecimal value given. For example, Address 0x18, the VREF select register, has a hexadecimal default value of 0xC0. This means that Bit 7 = 1, Bit 6 = 1, and the remaining bits are 0s. This setting is the default reference selection setting. The default value uses a 2.0 V p-p reference. For more information on this function and others, see AN-877 Application Note, Interfacing to High Speed ADCs via SPI. This document details the functions controlled by Register 0x00 to Register 0xFF. The remaining register, Register 0x100, is documented in the Memory Map Register Description section. open (for example, Address 0x18). If the entire address location is open (for example, Address 0x13), this address location should not be written. Default Values After the AD9265 is reset, critical registers are loaded with default values. The default values for the registers are given in the memory map register table, Table 17. Logic Levels An explanation of logic level terminology follows:   “Bit is set” is synonymous with “bit is set to Logic 1” or “writing Logic 1 for the bit.” “Clear a bit” is synonymous with “bit is set to Logic 0” or “writing Logic 0 for the bit.” Transfer Register Map Address 0x08 to Address 0x18 are shadowed. Writes to these addresses do not affect part operation until a transfer command is issued by writing 0x01 to Address 0xFF, setting the transfer bit. This allows these registers to be updated internally and simultaneously when the transfer bit is set. The internal update takes place when the transfer bit is set, and the bit autoclears. Open Locations All address and bit locations that are not included in Table 17 are not currently supported for this device. Unused bits of a valid address location should be written with 0s. Writing to these locations is required only when part of an address location is Rev. A | Page 36 of 44 AD9265 MEMORY MAP REGISTER TABLE All address and bit locations that are not included in Table 17 are not currently supported for this device. Table 17. Memory Map Registers Addr. Register (Hex) Name Bit 7 (MSB) Chip Configuration Registers 0x00 SPI port 0 configuration Bit 6 LSB first Bit 5 Soft reset Bit 4 1 Bit 3 1 Bit 2 Soft reset Bit 1 LSB first Bit 0 (LSB) 0 Default Value (Hex) 0x18 Default Notes/ Comments The nibbles are mirrored so LSB-first mode or MSB-first mode registers correctly, regardless of shift mode Read only Speed grade ID used to differentiate devices; read only Synchronously transfers data from the master shift register to the slave Determines various generic modes of chip operation 0x01 0x02 Chip ID Chip grade Open Open 8-bit Chip ID[7:0], AD9265 = 0x64 (default) Speed grade ID Open Open 01 = 125 MSPS 10 = 105 MSPS 11 = 80 MSPS Open Open Open Open 0x64 Open Open Transfer Register 0xFF Transfer Open Open Open Transfer 0x00 ADC Functions Registers 0x08 Power 1 modes Open External power-down pin function 0 = powerdown 1 = standby Open Open 0x09 Global clock Open Open Open Open Open 0x0D Test mode Open Open Reset PN23 generator Reset PN9 generator Open 0x0E BIST enable Open Open Open Open Open Internal power-down mode 00 = normal operation 01 = full powerdown 10 = standby 11 = normal operation Open Open Duty cycle stabilizer (default) Output test mode 000 = off (default) 001 = midscale short 010 = positive FS 011 = negative FS 100 = alternating checkerboard 101 = PN 23 sequence 110 = PN 9 sequence 111 = one/zero word toggle Reset BIST Open BIST sequence enable Open 0x80 0x01 0x00 When this register is set, the test data is placed on the output pins in place of normal data 0x04 Rev. A | Page 37 of 44 AD9265 Addr. (Hex) 0x14 Register Name Output mode Bit 7 (MSB) Drive strength 0 = ANSI LVDS 1 = reduced LVDS Bit 6 Output type 0 = CMOS 1 = LVDS Bit 5 Open Bit 4 Output enable bar Bit 3 Open Bit 2 Output invert Bit 1 Bit 0 (LSB) Output format 00 = offset binary 01 = twos complement 01 = gray code 11 = offset binary Default Value (Hex) 0x00 Default Notes/ Comments Configures the outputs and the format of the data 0x16 Clock phase control Invert DCO clock Open Open Open 0x17 DCO output delay Open Open Open 0x18 VREF select Reference voltage selection 00 = 1.25 V p-p 01 = 1.5 V p-p 10 = 1.75 V p-p 11 = 2.0 V p-p (default) Open Open Input clock divider phase adjust 000 = no delay 001 = 1 input clock cycle 010 = 2 input clock cycles 011 = 3 input clock cycles 100 = 4 input clock cycles 101 = 5 input clock cycles 110 = 6 input clock cycles 111 = 7 input clock cycles DCO clock delay (delay = 2500 ps × register value/31) 00000 = 0 ps 00001 = 81 ps 00010 = 161 ps … 11110 = 2419 ps 11111 = 2500 ps Open Open Open Open Open 0x00 Allows selection of clock delays into the input clock divider 0x00 0xC0 0x24 BIST signature LSB 0x25 BIST signature MSB 0x30 Dither Open enable Digital Feature Control Register 0x100 Sync control Open BIST Signature[7:0] BIST Signature[15:8] 0x00 0x00 Read only Read only Open Open Dither enable Open Open Open Open Open 0x00 Open Open Open Clock divider next sync only Clock divider sync enable Master sync enable 0x00 Rev. A | Page 38 of 44 AD9265 MEMORY MAP REGISTER DESCRIPTIONS For additional information about functions controlled in Register 0x00 to Register 0xFF, see AN-877 Application Note, Interfacing to High Speed ADCs via SPI. and to ignore the rest. The clock divider sync enable bit (Address 0x100, Bit 1) resets after it syncs. Bit 1—Clock Divider Sync Enable Bit 1 gates the sync pulse to the clock divider. The sync signal is enabled when Bit 1 is high and Bit 0 is high. This is continuous sync mode. Bit 0—Master Sync Enable Bit 0 must be high to enable any of the sync functions. If the sync capability is not used, this bit should remain low to conserve power. Sync Control (Register 0x100) Bits[7:3]—Reserved These bits are reserved. Bit 2—Clock Divider Next Sync Only If the master sync enable bit (Address 0x100, Bit 0) and the clock divider sync enable bit (Address 0x100, Bit 1) are high, Bit 2 allows the clock divider to sync to the first sync pulse it receives Rev. A | Page 39 of 44 AD9265 APPLICATIONS INFORMATION DESIGN GUIDELINES Before starting design and layout of the AD9265 as a system, it is recommended that the designer become familiar with these guidelines, which discuss the special circuit connections and layout requirements that are needed for certain pins. The copper plane should have several vias to achieve the lowest possible resistive thermal path for heat dissipation to flow through the bottom of the PCB. Fill or plug these vias with nonconductive epoxy. To maximize the coverage and adhesion between the ADC and the PCB, overlay a silkscreen to partition the continuous plane on the PCB into several uniform sections. This provides several tie points between the ADC and the PCB during the reflow process. Using one continuous plane with no partitions guarantees only one tie point between the ADC and the PCB. For detailed information about packaging and PCB layout of chip scale packages, see AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP), at www.analog.com. Power and Ground Recommendations When connecting power to the AD9265, it is recommended that two separate 1.8 V supplies be used. Use one supply for analog (AVDD); use a separate supply for the digital outputs (DRVDD). Several different decoupling capacitors can be used to cover both high and low frequencies. Locate these capacitors close to the point of entry at the PCB level and close to the pins of the part, with minimal trace length. The power supply for the SPI port, SVDD, should not contain excessive noise and should also be bypassed close to the part. A single PCB ground plane should be sufficient when using the AD9265. With proper decoupling and smart partitioning of the PCB analog, digital, and clock sections, optimum performance is easily achieved. VCM Decouple the VCM pin to ground with a 0.1 μF capacitor, as shown in Figure 67. RBIAS The AD9265 requires that a 10 kΩ resistor be placed between the RBIAS pin and ground. This resistor sets the master current reference of the ADC core and should have at least a 1% tolerance. LVDS Operation The AD9265 can be configured for CMOS or LVDS output mode on power-up using the LVDS pin, Pin 44. If LVDS operation is desired, connect Pin 44 to AVDD. LVDS operation can also be enabled through the SPI port. If CMOS operation is desired, connect Pin 44 to AGND. Reference Decoupling Decouple the VREF pin externally to ground with a low ESR, 1.0 μF capacitor in parallel with a low ESR, 0.1 μF ceramic capacitor. Exposed Paddle Thermal Heat Slug Recommendations It is mandatory that the exposed paddle on the underside of the ADC be connected to the analog ground (AGND) to achieve the best electrical and thermal performance. A continuous, exposed (no solder mask) copper plane on the PCB should mate to the AD9265 exposed paddle, Pin 0. SPI Port The SPI port should not be active during periods when the full dynamic performance of the converter is required. Because the SCLK, CSB, and SDIO signals are typically asynchronous to the ADC clock, noise from these signals can degrade converter performance. If the on-board SPI bus is used for other devices, it may be necessary to provide buffers between this bus and the AD9265 to keep these signals from transitioning at the converter inputs during critical sampling periods. Rev. A | Page 40 of 44 AD9265 OUTLINE DIMENSIONS 7.10 7.00 SQ 6.90 0.60 MAX 0.60 MAX 37 36 0.30 0.23 0.18 48 1 PIN 1 INDICATOR PIN 1 INDICATOR 6.85 6.75 SQ 6.65 0.50 REF (BOTTOM VIEW) EXPOSED PAD *5.65 5.50 SQ 5.35 25 24 13 12 TOP VIEW 1.00 0.85 0.80 SEATING PLANE 12° MAX 0.80 MAX 0.65 TYP 0.50 0.40 0.30 0.25 MIN 5.50 REF FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF *COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2 WITH EXCEPTION TO EXPOSED PAD DIMENSION. Figure 85. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 7 mm × 7 mm Body, Very Thin Quad (CP-48-8) Dimensions shown in millimeters ORDERING GUIDE Model1 AD9265BCPZ-125 AD9265BCPZRL7-125 AD9265BCPZ-105 AD9265BCPZRL7-105 AD9265BCPZ-80 AD9265BCPZRL7-80 AD9265-125EBZ AD9265-105EBZ AD9265-80EBZ 1 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Description 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Evaluation Board Evaluation Board Evaluation Board Package Option CP-48-8 CP-48-8 CP-48-8 CP-48-8 CP-48-8 CP-48-8 Z = RoHS Compliant Part. Rev. A | Page 41 of 44 120109-B AD9265 NOTES Rev. A | Page 42 of 44 AD9265 NOTES Rev. A | Page 43 of 44 AD9265 NOTES ©2009–2010 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08502-0-1/10(A) Rev. A | Page 44 of 44