PCI-Express Clock Generator IC, PLL Core, Dividers, Two Outputs AD9573
FEATURES
Fully integrated VCO/PLL core 0.54 ps rms jitter from 12 kHz to 20 MHz Input crystal frequency of 25 MHz Preset divide ratios for 100 MHz, 33.33 MHz LVDS/LVCMOS output format Integrated loop filter Space saving 4.4 mm × 5.0 mm TSSOP 0.235 W power dissipation 3.3 V operation
GENERAL DESCRIPTION
The AD9573 provides a highly integrated, dual output clock generator function including an on-chip PLL core that is optimized for PCI-e applications. The integer-N PLL design is based on the Analog Devices, Inc., proven portfolio of high performance, low jitter frequency synthesizers to maximize line card performance. Other applications with demanding phase noise and jitter requirements also benefit from this part. The PLL section consists of a low noise phase frequency detector (PFD), a precision charge pump, a low phase noise voltage controlled oscillator (VCO), and a preprogrammed feedback divider and output divider. By connecting an external 25 MHz crystal, output frequencies of 100 MHz and 33.33 MHz can be locked to the input reference. The output divider and feedback divider ratios are preprogrammed for the required output rates. No external loop filter components are required, thus conserving valuable design time and board space. The AD9573 is available in a 16-lead 4.4 mm × 5.0 mm TSSOP and can be operated from a single 3.3 V supply. The temperature range is −40°C to +85°C.
APPLICATIONS
Line cards, switches, and routers CPU/PCIe applications Low jitter, low phase noise clock generation
FUNCTIONAL BLOCK DIAGRAM
VDD × 5 LDO
3RD ORDER LPF DIVIDERS PFD/CP
LVDS 100MHz LVCMOS 33.33MHz
XTAL OSC
VCO
AD9573
GND × 5 OE
07500-001
Figure 1.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
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AD9573 TABLE OF CONTENTS
Features .............................................................................................. 1 Applications ....................................................................................... 1 General Description ......................................................................... 1 Functional Block Diagram .............................................................. 1 Revision History ............................................................................... 2 Specifications..................................................................................... 3 PLL Characteristics ...................................................................... 3 Clock Output Jitter ....................................................................... 3 Clock Outputs ............................................................................... 3 Timing Characteristics ................................................................ 4 Control Pins .................................................................................. 4 Power .............................................................................................. 4 Crystal Oscillator .......................................................................... 4 Timing Diagrams.......................................................................... 4 Absolute Maximum Ratings............................................................ 5 Thermal Resistance ...................................................................... 5 ESD Caution...................................................................................5 Pin Configuration and Function Descriptions..............................6 Typical Performance Characteristics ..............................................7 Terminology .......................................................................................8 Theory of Operation .........................................................................9 Outputs ...........................................................................................9 Phase Frequency Detector (PFD) and Charge Pump ..........9 Power Supply..................................................................................9 LVDS Clock Distribution .......................................................... 10 CMOS Clock Distribution ........................................................ 10 Power and Grounding Considerations and Power Supply Rejection ...................................................................................... 10 Outline Dimensions ....................................................................... 11 Ordering Guide .......................................................................... 11
REVISION HISTORY
7/09—Revision 0: Initial Version
Rev. 0 | Page 2 of 12
AD9573 SPECIFICATIONS
Typical (typ) is given for VDD = 3.3 V ± 10%, TA = 25°C, unless otherwise noted. Minimum (min) and maximum (max) values are given over full VDD and TA (−40°C to +85°C) variation.
PLL CHARACTERISTICS
Table 1.
Parameter NOISE CHARACTERISTICS PLL Noise (100 MHz Output) @ 1 kHz @ 10 kHz @ 100 kHz @ 1 MHz @ 10 MHz @ 30 MHz PLL Noise (33.33 MHz Output) @ 1 kHz @ 10 kHz @ 100 kHz @ 1 MHz @ 5 MHz Spurious Content PLL Figure of Merit Min Typ Max Unit Test Conditions/Comments
−121 −128 −131 −144 −150 −151 −131 −137 −140 −150 −151 −70 −217.5
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc dBc/Hz
CLOCK OUTPUT JITTER
Table 2.
Parameter LVDS OUTPUT ABSOLUTE TIME JITTER RMS Jitter (100 MHz Output) Min Typ 540 Max Unit fsec Test Conditions/Comments 12 kHz to 20 MHz
CLOCK OUTPUTS
Table 3.
Parameter LVDS CLOCK OUTPUT Output Frequency Differential Output Voltage (VOD) Delta VOD Output Offset Voltage (VOS) Delta VOS Short-Circuit Current (ISA, ISB) Duty Cycle LVCMOS CLOCK OUTPUT Output Frequency Output High Voltage (VOH) Output Low Voltage (VOL) Duty Cycle Min Typ Max 100 700 25 1.375 25 24 55 33.33 VS − 0.1 45 0.1 55 Unit MHz mV mV V mV mA % MHz V V % Test Conditions/Comments Termination = 100 Ω differential
500 1.125
640 1.25 14
Output shorted to GND
45
Sourcing 1.0 mA current Sinking 1.0 mA current
Rev. 0 | Page 3 of 12
AD9573
TIMING CHARACTERISTICS
Table 4.
Parameter LVDS Output Rise Time, tRL Output Fall Time, tFL LVCMOS Output Rise Time, tRC Output Fall Time, tFC Min 140 140 0.25 0.25 Typ 200 200 0.60 0.80 Max 260 260 2.5 2.5 Unit ps ps ns ns Test Conditions/Comments Termination = 100 Ω differential; CLOAD = 0 pF 20% to 80%, measured differentially 80% to 20%, measured differentially Termination = open 20% to 80%; CLOAD = 5 pF 80% to 20%; CLOAD = 5 pF
CONTROL PINS
Table 5.
Parameter INPUT CHARACTERISTICS OE Pin Logic 1 Voltage Logic 0 Voltage Logic 1 Current Logic 0 Current Min Typ Max Unit Test Conditions/Comments OE has a 50 kΩ pull-down resistor. 2.5 0.8 120 1.0 V V μA μA
POWER
Table 6.
Parameter Power Supply Power Dissipation Min 3.0 Typ 3.3 235 Max 3.6 285 Unit V mW Test Conditions/Comments
CRYSTAL OSCILLATOR
Table 7.
Parameter CRYSTAL SPECIFICATION Frequency ESR Load Capacitance Phase Noise Stability Min Typ 25 40 18 −138 −30 +30 Max Unit MHz Ω pF dBc/Hz ppm Test Conditions/Comments Parallel resonant/fundamental mode
@ 1 kHz offset
TIMING DIAGRAMS
DIFFERENTIAL SIGNAL 80% 50% 20%
07500-003
SINGLE-ENDED 80%
VOD
CMOS 5pF LOAD 20%
tRL
tFL
tRC
tFC
Figure 2. LVDS Timing, Differential
Figure 3. LVCMOS Timing
Rev. 0 | Page 4 of 12
07500-004
AD9573 ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter VDD, VDDA, VDDX, and VDD33 to GND XO1, XO2 to GND 100M, 100M, 33M to GND Junction Temperature1 Storage Temperature Range Lead Temperature (10 sec)
1
THERMAL RESISTANCE
Rating −0.3 V to +3.6 V −0.3 V to VS + 0.3 V −0.3 V to VS + 0.3 V 150°C −65°C to +150°C 300°C
θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Thermal impedance measurements were taken on a 4-layer board in still air in accordance with EIA/JESD51-7. Table 9. Thermal Resistance
Package Type 16-Lead TSSOP θJA 90.3 Unit °C/W
See Table 9 for θJA.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ESD CAUTION
AD9573
1 0.1µF VS VS Cx 4 0.1µF 5 Cx 6 7 VS CRYSTAL: KYOCERA CX-49G Cx = 33pF 0.1µF 8 XO2 GNDX GNDA VDDA VDD VDD33 33M GND33 1nF 2 3 VDDA VDDX XO1 GND 100M 100M 15 14 0.1µF 13 12 11 10 9
07500-002
GNDA
OE
16
50Ω 50Ω VS VS 0.1µF
RT = 100Ω
Figure 4. Typical Application
Rev. 0 | Page 5 of 12
AD9573 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
GNDA 1 VDDA VDDX 2 3 16 OE 15 GND
AD9573
TOP VIEW (Not to Scale)
14 100M 13 100M 12 VDD 11 VDD33 10 33M 9 GND33
07500-005
XO1 4 XO2 GNDX GNDA VDDA 5 6 7 8
Figure 5. Pin Configuration
Table 10. Pin Function Descriptions
Pin No. 1, 7 2, 8 3 4, 5 6 9 10 11 12 13 14 15 16 Mnemonic GNDA VDDA VDDX XO1, XO2 GNDX GND33 33M VDD33 VDD 100M 100M GND OE Description Analog Ground. Analog Power Supply (3.3 V). Crystal Oscillator Power Supply. External 25 MHz Crystal. Crystal Oscillator Ground. Ground for LVCMOS Output. LVCMOS Output at 33.33 MHz. Power Supply for LVCMOS Output. Power Supply for LVDS Output. Complementary LVDS Output at 100 MHz. LVDS Output at 100 MHz. Ground for LVDS Output. Output Enable (Active Low). Places both outputs in a high impedance state when high. This pin has a 50 kΩ internal pull-down resistor.
Rev. 0 | Page 6 of 12
AD9573 TYPICAL PERFORMANCE CHARACTERISTICS
–115 –120 –125 –130 –135 –140 –145 –150 –155 1k –160 1k –130 –120
PHASE NOISE (dBc/Hz)
PHASE NOISE (dBc/Hz)
07500-006
–140
–150
10k
100k
1M
10M
100M
10k
100k
1M
10M
100M
FREQUENCY OFFSET (Hz)
FREQUENCY OFFSET (Hz)
Figure 6. 100 MHz Phase Noise
Figure 7. 33.33 MHz Phase Noise
Rev. 0 | Page 7 of 12
07500-007
AD9573 TERMINOLOGY
Phase Jitter An ideal sine wave can be thought of as having a continuous and even progression of phase with time from 0 degrees to 360 degrees for each cycle. Actual signals, however, display a certain amount of variation from ideal phase progression over time. This phenomenon is called phase jitter. Although many causes can contribute to phase jitter, one major cause is random noise, which is characterized statistically as gaussian (normal) in distribution. This phase jitter leads to a spreading out of the energy of the sine wave in the frequency domain, producing a continuous power spectrum. This power spectrum is usually reported as a series of values whose units are dBc/Hz at a given offset in frequency from the sine wave (carrier). The value is a ratio (expressed in dB) of the power contained within a 1 Hz bandwidth with respect to the power at the carrier frequency. For each measurement, the offset from the carrier frequency is also given. Phase Noise When the total power contained within some interval of offset frequencies (for example, 12 kHz to 20 MHz) is integrated, it is called the integrated phase noise over that frequency offset interval, and it can be readily related to the time jitter due to the phase noise within that offset frequency interval. Phase noise has a detrimental effect on error rate performance by increasing eye closure at the transmitter output and reducing the jitter tolerance/sensitivity of the receiver. Time Jitter Phase noise is a frequency domain phenomenon. In the time domain, the same effect is exhibited as time jitter. When observing a sine wave, the time of successive zero crossings is seen to vary. In a square wave, the time jitter is seen as a displacement of the edges from their ideal (regular) times of occurrence. In both cases, the variations in timing from the ideal are the time jitter. Because these variations are random in nature, the time jitter is specified in units of seconds root mean square (rms) or 1 sigma of the gaussian distribution. Additive Phase Noise Additive phase noise is the amount of phase noise that is attributable to the device or subsystem being measured. The phase noise of any external oscillators or clock sources has been subtracted. This makes it possible to predict the degree to which the device impacts the total system phase noise when used in conjunction with the various oscillators and clock sources, each of which contributes its own phase noise to the total. In many cases, the phase noise of one element dominates the system phase noise. Additive Time Jitter Additive time jitter is the amount of time jitter that is attributable to the device or subsystem being measured. The time jitter of any external oscillators or clock sources has been subtracted. This makes it possible to predict the degree to which the device impacts the total system time jitter when used in conjunction with the various oscillators and clock sources, each of which contributes its own time jitter to the total. In many cases, the time jitter of the external oscillators and clock sources dominates the system time jitter.
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AD9573 THEORY OF OPERATION
VDDA GNDA VDDA GNDA VDD, GND, VDD33 GND33 CMOS 33.33MHz DIVIDE BY 4 LDO OE CHARGE PUMP 2.5GHz VCO VLDO DIVIDE BY 25 LVDS 100MHz
07500-011
XTAL OSC
PHASE FREQUENCY DETECTOR
DIVIDE BY 3
33M
100M 100M
AD9573
Figure 8. Detailed Block Diagram
Figure 8 shows a block diagram of the AD9573. The chip features a PLL core, which is configured to generate the specific clock frequencies required for PCI-express, without any user programming. This PLL is based on proven Analog Devices synthesizer technology, noted for its exceptional phase noise performance. The AD9573 is highly integrated and includes the loop filter, a regulator for supply noise immunity, all the necessary dividers, output buffers, and a crystal oscillator. A user need only supply a 25 MHz external crystal to implement an entire PCIe clocking solution, which does not require any processor intervention.
Table 12. Output Enable Pin Function
OE State 0 1 Output State Enabled High impedance
Phase Frequency Detector (PFD) and Charge Pump
The PFD takes inputs from the reference clock and feedback divider to produce an output proportional to the phase and frequency difference between them. Figure 10 shows a simplified schematic.
3.3V CHARGE PUMP
OUTPUTS
Table 11 provides a summary of the outputs available. Table 11. Output Formats
Frequency 100 MHz 33.33 MHz Format LVDS LVCMOS Copies 1 1
HIGH FEEDBACK DIVIDER CLR2 DOWN D2 Q2 HIGH REFCLK D1 Q1 CLR1 UP
CP
The simplified equivalent circuit of the LVDS output is shown in Figure 9. The 100 MHz output is described as LVDS because it uses an LVDS driver topology. However, the levels are HCSL compatible, and therefore do not meet the LVDS standard. The output current has been increased to provide a larger output swing than standard LVDS.
6.5mA
GND
Figure 10. PFD Simplified Schematic and Timing (in Lock)
POWER SUPPLY
The AD9573 requires a 3.3 V ± 10% power supply for VDD. The tables in the Specifications section give the performance expected from the AD9573 with the power supply voltage within this range. The absolute maximum range of (−0.3 V) − (+3.6 V), with respect to GND, must never be exceeded on the VDD or VDDA pins.
07500-012
OUT OUTB
6.5mA
Figure 9. LVDS Output Simplified Equivalent Circuit
Both outputs can be placed in a high impedance state by connecting the OE pin according to Table 12. This pin has a 50 kΩ pull-down resistor.
Good engineering practice should be followed in the layout of power supply traces and the ground plane of the PCB. The power supply should be bypassed on the PCB with adequate capacitance (>10 μF). The AD9573 should be decoupled with adequate capacitors (0.1 μF) at all power pins as close as possible to these power pins. The layout of the AD9573
Rev. 0 | Page 9 of 12
07500-013
AD9573
evaluation board shows a good example (see the Ordering Guide for information about the evaluation board). outputs are limited in terms of the capacitive load or trace length that they can drive. Typically, trace lengths less than 6 inches are recommended to preserve signal rise/fall times and preserve signal integrity.
CMOS 10Ω 60.4Ω 1.0 INCH MICROSTRIP
07500-016
LVDS CLOCK DISTRIBUTION
Low voltage differential signaling (LVDS) is the differential output for the AD9573. LVDS uses a current mode output stage with a factory programmed current level. The normal value (default) for this current is 6.5 mA, which yields a 650 mV output swing across a 100 Ω resistor. The typical termination circuit for the LVDS outputs is shown in Figure 11.
50Ω
07500-014
5pF GND
Figure 13. Series Termination of CMOS Output
LVDS 50Ω
100Ω
LVDS
Figure 11. LVDS Output Termination
An alternative method of terminating the output to preserve output swing but also minimize reflections is shown in Figure 12.
50Ω
07500-015
Termination at the far end of the PCB trace is a second option. The CMOS output of the AD9573 does not supply enough current to provide a full voltage swing with a low impedance resistive, far end termination, as shown in Figure 14. The far end termination network should match the PCB trace impedance and provide the desired switching point. The reduced signal swing may still meet receiver input requirements in some applications. This can be useful when driving long trace lengths on less critical nets.
VPULLUP = 3.3V 50Ω 100Ω 100Ω 3pF
07500-017
LVDS
200Ω 50Ω
200Ω
LVDS
Figure 12. Alternative LVDS Output Termination
CMOS
10Ω
CMOS CLOCK DISTRIBUTION
The AD9573 provides a 33.33 MHz clock output, which is a dedicated CMOS level. Whenever single-ended CMOS clocking is used, some of the following general guidelines should be followed. Point-to-point nets should be designed such that a driver has one receiver only on the net, if possible. This allows for simple termination schemes and minimizes ringing due to possible mismatched impedances on the net. Series termination at the source is generally required to provide transmission line matching and/or to reduce current transients at the driver. The value of the resistor is dependent on the board design and timing requirements (typically 10 Ω to 100 Ω is used). CMOS
Figure 14. CMOS Output with Far-End Termination
POWER AND GROUNDING CONSIDERATIONS AND POWER SUPPLY REJECTION
Many applications seek high speed and performance under less than ideal operating conditions. In these application circuits, the implementation and construction of the PCB is as important as the circuit design. Proper RF techniques must be used for device selection, placement, and routing, as well as for power supply decoupling and grounding to ensure optimum performance.
Rev. 0 | Page 10 of 12
AD9573 OUTLINE DIMENSIONS
5.10 5.00 4.90
16 9
4.50 4.40 4.30
1 8
6.40 BSC
PIN 1 0.15 0.05 0.65 BSC 0.30 0.19 COPLANARITY 0.10 1.20 MAX
0.20 0.09
SEATING PLANE
8° 0°
0.75 0.60 0.45
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 15. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters
ORDERING GUIDE
Model AD9573ARUZ 1 AD9573-EVALZ1
1
Temperature Range −40°C to +85°C
Package Description 16-Lead Thin Shrink Small Outline Package [TSSOP] Evaluation Board
Package Option RU-16
Z = RoHS Compliant Part.
Rev. 0 | Page 11 of 12
AD9573 NOTES
©2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D07500-0-7/09(0)
Rev. 0 | Page 12 of 12