AD9650

16-Bit, 25 MSPS/65 MSPS/80 MSPS/105 MSPS, 1.8 V Dual Analog-to-Digital Converter (ADC) AD9650 FEATURES 1.8 V analog supply operation 1.8 V CMOS or LVDS output supply SNR 82 dBFS at 30 MHz input and 105 MSPS data rate 83 dBFS at 9.7 MHz input and 25 MSPS data rate SFDR 90 dBc at 30 MHz input and 105 MSPS data rate 95 dBc at 9.7 MHz input and 25 MSPS data rate Low power 328 mW per channel at 105 MSPS 119 mW per channel at 25 MSPS Integer 1-to-8 input clock divider IF sampling frequencies to 300 MHz Analog input range of 2.7 V p-p Optional on-chip dither Integrated ADC sample-and-hold inputs Differential analog inputs with 500 MHz bandwidth ADC clock duty cycle stabilizer FUNCTIONAL BLOCK DIAGRAM AVDD SDIO/ SCLK/ DCS DFS SPI CSB DRVDD AD9650 PROGRAMMING DATA VIN+A VIN–A ADC CMOS/LVDS OUTPUT BUFFER 16 ORA D15A (MSB) TO D0A (LSB) CLK+ CLK– VREF SENSE REF SELECT DIVIDE 1 TO 8 DUTY CYCLE STABILIZER DCO GENERATION DCOA DCOB ORB VCM RBIAS VIN–B VIN+B ADC MULTICHIP SYNC CMOS/LVDS OUTPUT BUFFER 16 D15B (MSB) TO D0B (LSB) APPLICATIONS Industrial instrumentation X-Ray, MRI, and ultrasound equipment High speed pulse acquisition Chemical and spectrum analysis Direct conversion receivers Multimode digital receivers Smart antenna systems General-purpose software radios Figure 1. Flexible power-down options allow significant power savings, when desired. Programming for setup and control is accomplished using a 3-wire SPI-compatible serial interface. The AD9650 is available in a 64-lead LFCSP and is specified over the industrial temperature range of −40°C to +85°C. GENERAL DESCRIPTION The AD9650 is a dual, 16-bit, 25 MSPS/65 MSPS/80 MSPS/ 105 MSPS analog-to-digital converter (ADC) designed for digitizing high frequency, wide dynamic range signals with input frequencies of up to 300 MHz. The dual ADC core features a multistage, differential pipelined architecture with integrated output error correction logic. Each ADC features wide bandwidth, differential sample-and-hold analog input amplifiers, and shared integrated voltage reference, which eases design considerations. A duty cycle stabilizer is provided to compensate for variations in the ADC clock duty cycle, allowing the converters to maintain excellent performance. The ADC output data can be routed directly to the two external 16-bit output ports or multiplexed on a single 16-bit bus. These outputs can be set to either 1.8 V CMOS or LVDS. PRODUCT HIGHLIGHTS 1. 2. 3. On-chip dither option for improved SFDR performance with low power analog input. Proprietary differential input that maintains excellent SNR performance for input frequencies up to 300 MHz. Operation from a single 1.8 V supply and a separate digital output driver supply accommodating 1.8 V CMOS or LVDS outputs. Standard serial port interface (SPI) that supports various product features and functions, such as data formatting (offset binary, twos complement, or gray coding), enabling the clock DCS, power-down, and test modes. Pin compatible with the AD9268 and other dual families, AD9269, AD9251, AD9231, and AD9204. This allows a simple migration across resolutions and bandwidth. 4. 5. Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2010 Analog Devices, Inc. All rights reserved. 08919-001 AGND SYNC PDWN OEB NOTES 1. PIN NAMES ARE FOR THE CMOS PIN CONFIGURATION ONLY; SEE FIGURE 7 FOR LVDS PIN NAMES. AD9650 TABLE OF CONTENTS Features .............................................................................................. 1 Applications....................................................................................... 1 General Description ......................................................................... 1 Functional Block Diagram .............................................................. 1 Product Highlights ........................................................................... 1 Revision History ............................................................................... 2 Specifications..................................................................................... 3 ADC DC Specifications ............................................................... 3 ADC AC Specifications ................................................................. 4 Digital Specifications ................................................................... 5 Switching Specifications ................................................................ 7 Timing Specifications .................................................................. 8 Absolute Maximum Ratings.......................................................... 10 Thermal Characteristics ................................................................ 10 ESD Caution................................................................................ 10 Pin Configurations and Function Descriptions ......................... 11 Typical Performance Characteristics ........................................... 15 AD9650-25 .................................................................................. 15 AD9650-65 .................................................................................. 18 AD9650-80 .................................................................................. 21 AD9650-105 ................................................................................ 24 Equivalent Circuits ......................................................................... 28 Theory of Operation ...................................................................... 29 ADC Architecture ...................................................................... 29 Analog Input Considerations ................................................... 29 Voltage Reference ....................................................................... 32 Channel/Chip Synchronization................................................ 34 Power Dissipation and Standby Mode .................................... 34 Digital Outputs ........................................................................... 35 Timing ......................................................................................... 35 Built-In Self-Test (BIST) and Output Test .................................. 36 Built-In Self-Test (BIST)............................................................ 36 Output Test Modes..................................................................... 36 Serial Port Interface (SPI).............................................................. 37 Configuration Using the SPI..................................................... 37 Hardware Interface..................................................................... 38 Configuration Without the SPI ................................................ 38 SPI Accessible Features.............................................................. 38 Memory Map .................................................................................. 39 Reading the Memory Map Register Table............................... 39 Memory Map Register Table..................................................... 40 Memory Map Register Descriptions........................................ 42 Applications Information .............................................................. 43 Design Guidelines ...................................................................... 43 Outline Dimensions ....................................................................... 44 Ordering Guide .......................................................................... 44 REVISION HISTORY 7/10—Revision 0: Initial Version Rev. 0 | Page 2 of 44 AD9650 SPECIFICATIONS ADC DC SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.35 V internal reference, DCS disabled, unless otherwise noted. Table 1. Parameter RESOLUTION ACCURACY No Missing Codes Offset Error Gain Error Differential Nonlinearity (DNL) 1 Integral Nonlinearity (INL)1 MATCHING CHARACTERISTIC Offset Error Gain Error TEMPERATURE DRIFT Offset Error Gain Error INTERNAL VOLTAGE REFERENCE Output Voltage Error (1.35 V Mode) Load Regulation at 1.0 mA INPUT REFERRED NOISE VREF = 1.35 V ANALOG INPUT Input Span, VREF = 1.35 V Input Capacitance 2 Input Common-Mode Voltage REFERENCE INPUT RESISTANCE POWER SUPPLIES Supply Voltage AVDD DRVDD Supply Current IAVDD1 IDRVDD1 (1.8 V CMOS) IDRVDD1 (1.8 V LVDS) POWER CONSUMPTION DC Input Sine Wave Input1 (DRVDD = 1.8 V CMOS Output Mode) Sine Wave Input1 (DRVDD = 1.8 V LVDS Output Mode) Standby Power 3 Power-Down Power 1 2 Temp Full Full Full Full Full 25°C Full 25°C Full Full Full Full Full Full 25°C AD9650BCPZ-25 Min Typ Max 16 Guaranteed ±0.2 ±0.5 ±0.4 ±2.5 −1 +1.3 ±0.7 ±3 ±1.6 ±0.1 ±0.5 ±2 ±15 ±7 10 1.5 ±14 ±0.4 ±1.3 AD9650BCPZ-65 Min Typ Max 16 Guaranteed ±0.2 ±0.5 ±0.4 ±2.5 −1 +1.3 ±0.7 ±5 ±2.5 ±0.1 ±0.5 ±2 ±15 ±7 10 1.5 ±14 ±0.4 ±1.3 AD9650BCPZ-80 Min Typ Max 16 Guaranteed ±0.4 ±0.70 ±0.4 ±2.5 +1.3 ±0.7 ±6 ±2.5 ±0.1 ±0.5 ±2 ±15 ±7 10 1.5 ±14 ±0.4 ±1.3 AD9650BCPZ-105 Min Typ Max 16 Guaranteed ±0.4 ±0.7 ±0.4 ±2.5 −1 +1.3 ±0.7 ±6 ±3 ±0.1 ±0.5 ±2 ±15 ±7 10 1.5 ±14 ±0.4 ±1.3 Unit Bits −1 % FSR % FSR LSB LSB LSB LSB % FSR % FSR ppm/°C ppm/°C mV mV LSB rms V p-p pF V kΩ Full Full Full Full 2.7 11 0.9 6 2.7 11 0.9 6 2.7 11 0.9 6 2.7 11 0.9 6 Full Full Full Full Full Full Full Full Full Full 1.7 1.7 1.8 1.8 125 8 72 237 240 355 50 0.25 1.9 1.9 131 1.7 1.7 1.8 1.8 202 23 86 1.9 1.9 209 1.7 1.7 1.8 1.8 267 29 90 1.9 1.9 275 1.7 1.7 1.8 1.8 332 36 100 1.9 1.9 340 V V mA mA mA 254 397 405 520 50 0.25 408 522 533 642 50 0.25 537 656 663 778 50 0.25 675 mW mW mW mW mW 2.5 2.5 2.5 2.5 Measured with a low input frequency, full-scale sine wave, with approximately 5 pF loading on each output bit. Input capacitance refers to the effective capacitance between one differential input pin and AGND. 3 Standby power is measured with a dc input and with the CLK+ and CLK− pins inactive (set to AVDD or AGND). Rev. 0 | Page 3 of 44 AD9650 ADC AC SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.35 V internal reference, DCS disabled, unless otherwise noted. Table 2. Parameter 1 SIGNAL-TO-NOISE RATIO (SNR) fIN = 9.7 MHz fIN = 30 MHz fIN = 70 MHz fIN = 141 MHz 2 SIGNAL-TO-NOISE-AND-DISTORTION (SINAD) fIN = 9.7 MHz fIN = 30 MHz fIN = 70 MHz fIN = 141 MHz2 EFFECTIVE NUMBER OF BITS (ENOB) fIN = 9.7 MHz fIN = 30 MHz fIN = 70 MHz fIN = 141 MHz2 WORST SECOND OR THIRD HARMONIC fIN =9.7 MHz fIN = 30 MHz fIN = 70 MHz fIN = 141 MHz SPURIOUS-FREE DYNAMIC RANGE (SFDR) fIN = 9.7 MHz fIN = 30 MHz fIN = 70 MHz fIN = 141 MHz WORST OTHER (HARMONIC OR SPUR) fIN = 9.7 MHz fIN = 30 MHz fIN = 70 MHz fIN = 141 MHz TWO-TONE SFDR fIN = 7.2 MHz (−7 dBFS ), 8.4 MHz (−7 dBFS) fIN = 25 MHz (−7 dBFS ), 30 MHz (−7 dBFS) fIN = 125 MHz (−7 dBFS ), 128 MHz (−7 dBFS) CROSSTALK 3 ANALOG INPUT BANDWIDTH 1 2 3 Temp 25°C 25°C Full 25°C 25°C AD9650BCPZ-25 Min Typ Max 83 81.5 81.8 79.5 AD9650BCPZ-65 Min Typ Max 83 82 81.5 81 79.5 AD9650BCPZ-80 Min Typ Max 83 82 81.6 81 80 AD9650BCPZ-105 Min Typ Max 82.5 82 80.5 80 80 Unit dBFS dBFS dBFS dBFS dBFS 25°C 25°C Full 25°C 25°C 25°C 25°C 25°C 25°C 25°C 25°C Full 25°C 25°C 25°C 25°C Full 25°C 25°C 25°C 25°C Full 25°C 25°C 25°C 25°C 25°C Full 25°C 82.2 80 81.5 78 81 82 81.2 80.7 79.2 75 13.5 13.2 13.0 12.9 −94 −93 −91.5 −88 −86 −79 94 93 88 87 86 79 −105 −105 −97 −97 −97 −97 82 82 80 78.5 75.1 13.5 13.2 13.0 13.0 −95.5 −92 −87 −86 −79 95.5 92 87 86 79 −105 −105 −97 −97 −97 82 80.4 78.8 75.5 13.3 13.2 13.0 12.3 −91 −90 −87 −92 −80 91 90 92 80 −100 −101 −94 −97 −88 dBFS dBFS dBFS dBFS dBFS Bits Bits Bits Bits dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc 13.5 13.0 12.7 −95 −85 −87 95 85 91.5 87 −110 −102 −97 87 84 90 83 −105 500 −105 500 87 83 −105 500 87 84 −105 500 dBc dBc dBFS MHz See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions. Measurements made with a divide-by-4 clock rate to minimize the effects of clock jitter on the SNR performance. Crosstalk is measured with a 170 MHz tone at −1 dBFS on one channel and no input on the alternate channel. Rev. 0 | Page 4 of 44 AD9650 DIGITAL SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.35 V internal reference, and DCS enabled, unless otherwise noted. Table 3. Parameter DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−) Logic Compliance Internal Common-Mode Bias Differential Input Voltage Input Voltage Range Input Common-Mode Range High Level Input Current Low Level Input Current Input Capacitance Input Resistance SYNC INPUT Logic Compliance Internal Bias Input Voltage Range High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Capacitance Input Resistance LOGIC INPUT (CSB) 1 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance LOGIC INPUT (SCLK/DFS) 2 High Level Input Voltage Low Level Input Voltage High Level Input Current (VIN = 1.8 V) Low Level Input Current Input Resistance Input Capacitance LOGIC INPUT/OUTPUT (SDIO/DCS)1 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance LOGIC INPUTS (OEB, PDWN)2 High Level Input Voltage Low Level Input Voltage High Level Input Current (VIN = 1.8 V) Low Level Input Current Input Resistance Input Capacitance Temperature Min Typ CMOS/LVDS/LVPECL 0.9 0.3 AGND 0.9 −100 −100 8 9 10 CMOS 0.9 AGND 1.2 AGND −100 −100 12 1.22 0 −10 40 26 2 1.22 0 −92 −10 26 2 1.22 0 −10 38 26 5 1.22 0 −90 −10 26 5 2.1 0.6 −134 +10 2.1 0.6 +10 128 2.1 0.6 −135 +10 1 16 AVDD AVDD 0.6 +100 +100 20 2.1 0.6 +10 132 3.6 AVDD 1.4 +100 +100 12 Max Unit Full Full Full Full Full Full Full Full V V p-p V V μA μA pF kΩ Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full V V V V μA μA pF kΩ V V μA μA kΩ pF V V μA μA kΩ pF V V μA μA kΩ pF V V μA μA kΩ pF Rev. 0 | Page 5 of 44 AD9650 Parameter DIGITAL OUTPUTS CMOS Mode—DRVDD = 1.8 V High Level Output Voltage IOH = 50 μA IOH = 0.5 mA Low Level Output Voltage IOL = 1.6 mA IOL = 50 μA LVDS Mode—DRVDD = 1.8 V Differential Output Voltage (VOD), ANSI Mode Output Offset Voltage (VOS), ANSI Mode Differential Output Voltage (VOD), Reduced Swing Mode Output Offset Voltage (VOS), Reduced Swing Mode 1 2 Temperature Min Typ Max Unit Full Full Full Full Full Full Full Full 1.79 1.75 0.2 0.05 290 1.15 160 1.15 345 1.25 200 1.25 400 1.35 230 1.35 V V V V mV V mV V Pull up. Pull down. Rev. 0 | Page 6 of 44 AD9650 SWITCHING SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.35 V internal reference, and DCS enabled, unless otherwise noted. Table 4. Parameter CLOCK INPUT PARAMETERS Input Clock Rate Conversion Rate 1 DCS Enabled DCS Disabled CLK Period—Divide-by-1 Mode (tCLK) CLK Pulse Width High (tCH) Divide-by-1 Mode, DCS Enabled Divide-by-1 Mode, DCS Disabled Divide-by-2 Mode Through Divide-by-8 Mode Aperture Delay (tA) Aperture Uncertainty (Jitter, tJ) DATA OUTPUT PARAMETERS CMOS Mode Data Propagation Delay (tPD) DCO Propagation Delay (tDCO) 2 DCO to Data Skew (tSKEW) LVDS Mode Data Propagation Delay (tPD) DCO Propagation Delay (tDCO)2 DCO to Data Skew (tSKEW) CMOS Mode Pipeline Delay (Latency) LVDS Mode Pipeline Delay (Latency) Channel A/ Channel B Wake-Up Time 3 Out-of-Range Recovery Time 1 2 Temp Full Full Full Full AD9650BCPZ-25 Min Typ Max 200 20 10 40 25 25 AD9650BCPZ-65 Min Typ Max 520 20 10 15.4 65 65 AD9650BCPZ-80 Min Typ Max 640 20 10 12.5 80 80 AD9650BCPZ-105 Min Typ Max 640 20 10 9.5 105 105 Unit MHz MSPS MSPS ns Full Full Full 12 19 0.8 20 20 28 21 4.65 7.33 0.8 7.70 7.70 10.75 8.07 3.75 5.95 0.8 6.25 6.25 8.75 6.55 2.85 4.5 0.8 4.75 4.75 6.65 5.0 ns ns ns Full Full 1.0 0.100 1.0 0.090 1.0 0.080 1.0 0.075 ns ps rms Full Full Full Full Full Full Full Full 2.8 3.5 3.1 4.2 2.8 3.5 3.1 4.2 2.8 3.5 3.1 4.2 2.8 3.5 3.1 4.2 ns ns −0.6 2.9 −0.4 3.7 3.9 0 4.5 −0.6 2.9 −0.4 3.7 3.9 0 4.5 −0.6 2.9 −0.4 3.7 3.9 0 4.5 −0.6 2.9 −0.4 3.7 3.9 0 4.5 ns ns ns −0.1 +0.2 12 12/12.5 +0.5 −0.1 +0.2 12 12/12.5 +0.5 −0.1 +0.2 12 12/12.5 +0.5 −0.1 +0.2 12 12/12.5 +0.5 ns Cycles Cycles Full Full 500 2 500 2 500 2 500 2 μs Cycles Conversion rate is the clock rate after the divider. Additional DCO delay can be added by writing to Bit 0 through Bit 4 in SPI Register 0x17 (see Table 17). 3 Wake-up time is defined as the time required to return to normal operation from power-down mode. Rev. 0 | Page 7 of 44 AD9650 TIMING SPECIFICATIONS Table 5. Parameter SYNC TIMING REQUIREMENTS tSSYNC tHSYNC SPI TIMING REQUIREMENTS 1 tDS tDH tCLK tS tH tHIGH tLOW tEN_SDIO tDIS_SDIO 1 Conditions SYNC to rising edge of CLK+ setup time SYNC to rising edge of CLK+ hold time Setup time between the data and the rising edge of SCLK Hold time between the data and the rising edge of SCLK Period of the SCLK Setup time between CSB and SCLK Hold time between CSB and SCLK SCLK pulse width high SCLK pulse width low Time required for the SDIO pin to switch from an input to an output relative to the SCLK falling edge Time required for the SDIO pin to switch from an output to an input relative to the SCLK rising edge Limit 0.3 0.40 2 2 40 2 2 10 10 10 10 Unit ns typ ns typ ns min ns min ns min ns min ns min ns min ns min ns min ns min See Figure 93. Timing Diagrams N–1 N VIN N+1 N+2 tA N+3 N+4 N+5 tCH CLK+ CLK– tCLK tDCO DCOA/DCOB tSKEW 08919-002 08919-003 CH A/CH B DATA N – 13 N – 12 N – 11 N – 10 N–9 N–8 tPD Figure 2. CMOS Default Output Mode Data Output Timing N–1 N VIN tA N+3 N+1 N+2 N+4 N+5 tCH CLK+ CLK– tCLK tDCO DCOA/DCOB tSKEW tPD CH A/CH B DATA CH A CH B CH A CH B CH A CH B N – 12 N – 12 N – 11 N – 11 N – 10 N – 10 CH A N–9 CH B N–9 CH A N–8 Figure 3. CMOS Interleaved Output Mode Data Output Timing Rev. 0 | Page 8 of 44 AD9650 N–1 N VIN N+1 N+2 tA N+3 N+4 N+5 tCH CLK+ CLK– tCLK tDCO DCOA/DCOB tSKEW CH A/CH B DATA CH A CH B CH A CH B CH A CH B N – 12 N – 12 N – 11 N – 11 N – 10 N – 10 CH A N–9 CH B N–9 CH A N–8 08919-003 tPD Figure 4. LVDS Mode Data Output Timing CLK+ tSSYNC SYNC tHSYNC 08919-004 Figure 5. SYNC Input Timing Requirements Rev. 0 | Page 9 of 44 AD9650 ABSOLUTE MAXIMUM RATINGS Table 6. Parameter Electrical1 AVDD to AGND DRVDD to AGND VIN+A/VIN+B, VIN−A/VIN−B to AGND CLK+, CLK− to AGND SYNC to AGND VREF to AGND SENSE to AGND VCM to AGND RBIAS to AGND CSB to AGND SCLK/DFS to AGND SDIO/DCS to AGND OEB PDWN D0A/D0B Through D15A/D15B to AGND DCOA/DCOB to AGND Environmental Operating Temperature Range (Ambient) Maximum Junction Temperature Under Bias Storage Temperature Range (Ambient) 1 THERMAL CHARACTERISTICS Rating −0.3 V to +2.0 V −0.3 V to +2.0 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −40°C to +85°C 150°C −65°C to +150°C The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the PCB increases the reliability of the solder joints and maximizes the thermal capability of the package. Typical θJA is specified for a 4-layer PCB with a solid ground plane. As shown in Table 7, airflow improves heat dissipation, which reduces θJA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes reduces θJA. Table 7. Thermal Resistance Package Type 64-Lead LFCSP (CP-64-6) Airflow Velocity (m/sec) 0 1.0 2.5 θJA1, 2 18.5 16.1 14.5 θJC1, 3 1.0 θJB1, 4 9.2 Unit °C/W °C/W °C/W 1 2 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board. Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). 3 Per MIL-STD 883, Method 1012.1. 4 Per JEDEC JESD51-8 (still air). ESD CAUTION The inputs and outputs are rated to the supply voltage (AVDD or DRVDD) + 0.2 V but should not exceed 2.1 V. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 10 of 44 AD9650 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 AVDD AVDD VIN+B VIN–B AVDD AVDD RBIAS VCM SENSE VREF AVDD AVDD VIN–A VIN+A AVDD AVDD CLK+ CLK– SYNC D0B D1B D2B D3B D4B D5B DRVDD D6B D7B D8B D9B D10B D11B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PIN 1 INDICATOR AD9650 PARALLEL CMOS TOP VIEW (Not to Scale) 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 PDWN OEB CSB SCLK/DFS SDIO/DCS ORA D15A D14A D13A D12A D11A DRVDD D10A D9A D8A D7A Figure 6. LFCSP Parallel CMOS Pin Configuration (Top View) Table 8. Pin Function Descriptions (Parallel CMOS Mode) Pin No. ADC Power Supplies 10, 19, 28, 37 49, 50, 53, 54, 59, 60, 63, 64 0 Mnemonic DRVDD AVDD AGND, Exposed Pad Type Supply Supply Ground Description Digital Output Driver Supply (1.8 V Nominal). Analog Power Supply (1.8 V Nominal). The exposed thermal pad on the bottom of the package provides the analog ground for the part. This exposed pad must be connected to ground for proper operation. Differential Analog Input Pin (+) for Channel A. Differential Analog Input Pin (−) for Channel A. Differential Analog Input Pin (+) for Channel B. Differential Analog Input Pin (−) for Channel B. Voltage Reference Input/Output. Voltage Reference Mode Select. See Table 11 for details. External Reference Bias Resistor. Common-Mode Level Bias Output for Analog Inputs. ADC Clock Input—True. ADC Clock Input—Complement. Digital Synchronization Pin. Slave mode only. Channel A CMOS Output Data (LSB). Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Rev. 0 | Page 11 of 44 ADC Analog 51 52 62 61 55 56 58 57 1 2 Digital Input 3 Digital Outputs 25 26 27 29 30 31 32 VIN+A VIN−A VIN+B VIN−B VREF SENSE RBIAS VCM CLK+ CLK− SYNC D0A D1A D2A D3A D4A D5A D6A Input Input Input Input Input/output Input Input/output Output Input Input Input Output Output Output Output Output Output Output 08919-005 NOTES 1. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE PACKAGE PROVIDES THE ANALOG GROUND FOR THE PART. THIS EXPOSED PAD MUST BE CONNECTED TO GROUND FOR PROPER OPERATION. D12B D13B DRVDD D14B D15B ORB DCOB DCOA D0A D1A D2A DRVDD D3A D4A D5A D6A 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 AD9650 Pin No. 33 34 35 36 38 39 40 41 42 43 4 5 6 7 8 9 11 12 13 14 15 16 17 18 20 21 22 24 23 SPI Control 45 44 46 ADC Configuration 47 48 Mnemonic D7A D8A D9A D10A D11A D12A D13A D14A D15A ORA D0B D1B D2B D3B D4B D5B D6B D7B D8B D9B D10B D11B D12B D13B D14B D15B ORB DCOA DCOB SCLK/DFS SDIO/DCS CSB OEB PDWN Type Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Input Input/output Input Input Input Description Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data (MSB). Channel A Overrange Output. Channel B CMOS Output Data (LSB). Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data (MSB). Channel B Overrange Output Channel A Data Clock Output. Channel B Data Clock Output. SPI Serial Clock/Data Format Select Pin in External Pin Mode. SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode. SPI Chip Select (Active Low). Output Enable Input (Active Low) in External Pin Mode. Power-Down Input in External Pin Mode. In SPI mode, this input can be configured as power-down or standby. Rev. 0 | Page 12 of 44 AD9650 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 AVDD AVDD VIN+B VIN–B AVDD AVDD RBIAS VCM SENSE VREF AVDD AVDD VIN–A VIN+A AVDD AVDD CLK+ CLK– SYNC D0– D0+ D1– D1+ D2– D2+ DRVDD D3– D3+ D4– D4+ D5– D5+ 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PIN 1 INDICATOR AD9650 PARALLEL LVDS TOP VIEW (Not to Scale) 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 PDWN OEB CSB SCLK/DFS SDIO/DCS OR+ OR– D15+ D15– D14+ D14– DRVDD D13+ D13– D12+ D12– Figure 7. LFCSP Interleaved Parallel LVDS Pin Configuration (Top View) Table 9. Pin Function Descriptions (Interleaved Parallel LVDS Mode) Pin No. ADC Power Supplies 10, 19, 28, 37 49, 50, 53, 54, 59, 60, 63, 64 0 Mnemonic DRVDD AVDD AGND, Exposed Pad Type Supply Supply Ground Description Digital Output Driver Supply (1.8 V Nominal). Analog Power Supply (1.8 V Nominal). The exposed thermal pad on the bottom of the package provides the analog ground for the part. This exposed pad must be connected to ground for proper operation. Differential Analog Input Pin (+) for Channel A. Differential Analog Input Pin (−) for Channel A. Differential Analog Input Pin (+) for Channel B. Differential Analog Input Pin (−) for Channel B. Voltage Reference Input/Output. Voltage Reference Mode Select. See Table 11 for details. External Reference Bias Resistor. Common-Mode Level Bias Output for Analog Inputs. ADC Clock Input—True. ADC Clock Input—Complement. Digital Synchronization Pin. Slave mode only. Channel A/Channel B LVDS Output Data 0—True (LSB). Channel A/Channel B LVDS Output Data 0—Complement (LSB). Channel A/Channel B LVDS Output Data 1—True. Channel A/Channel B LVDS Output Data 1—Complement. Channel A/Channel B LVDS Output Data 2—True. Channel A/Channel B LVDS Output Data 2—Complement. Channel A/Channel B LVDS Output Data 3—True. ADC Analog 51 52 62 61 55 56 58 57 1 2 Digital Input 3 Digital Outputs 5 4 7 6 9 8 12 VIN+A VIN−A VIN+B VIN−B VREF SENSE RBIAS VCM CLK+ CLK− SYNC D0+ D0− D1+ D1− D2+ D2− D3+ Input Input Input Input Input/output Input Input/output Output Input Input Input Output Output Output Output Output Output Output Rev. 0 | Page 13 of 44 08919-006 NOTES 1. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE PACKAGE PROVIDES THE ANALOG GROUND FOR THE PART. THIS EXPOSED PAD MUST BE CONNECTED TO GROUND FOR PROPER OPERATION. D6– D6+ DRVDD D7– D7+ D8– D8+ DCO– DCO+ D9– D9+ DRVDD D10– D10+ D11– D11+ 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 AD9650 Pin No. 11 14 13 16 15 18 17 21 20 23 22 27 26 30 29 32 31 34 33 36 35 39 38 41 40 43 42 25 24 SPI Control 45 44 46 ADC Configuration 47 48 Mnemonic D3− D4+ D4− D5+ D5− D6+ D6− D7+ D7− D8+ D8− D9+ D9− D10+ D10− D11+ D11− D12+ D12− D13+ D13− D14+ D14− D15+ D15− OR+ OR− DCO+ DCO− SCLK/DFS SDIO/DCS CSB OEB PDWN Type Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Input Input/output Input Input Input Description Channel A/Channel B LVDS Output Data 3—Complement. Channel A/Channel B LVDS Output Data 4—True. Channel A/Channel B LVDS Output Data 4—Complement. Channel A/Channel B LVDS Output Data 5—True. Channel A/Channel B LVDS Output Data 5—Complement. Channel A/Channel B LVDS Output Data 6—True. Channel A/Channel B LVDS Output Data 6—Complement. Channel A/Channel B LVDS Output Data 7—True. Channel A/Channel B LVDS Output Data 7—Complement. Channel A/Channel B LVDS Output Data 8—True. Channel A/Channel B LVDS Output Data 8—Complement. Channel A/Channel B LVDS Output Data 9—True. Channel A/Channel B LVDS Output Data 9—Complement. Channel A/Channel B LVDS Output Data 10—True. Channel A/Channel B LVDS Output Data 10—Complement. Channel A/Channel B LVDS Output Data 11—True. Channel A/Channel B LVDS Output Data 11—Complement. Channel A/Channel B LVDS Output Data 12—True. Channel A/Channel B LVDS Output Data 12—Complement. Channel A/Channel B LVDS Output Data 13—True. Channel A/Channel B LVDS Output Data 13—Complement. Channel A/Channel B LVDS Output Data 14—True. Channel A/Channel B LVDS Output Data 14—Complement. Channel A/Channel B LVDS Output Data 15—True (MSB). Channel A/Channel B LVDS Output Data 15—Complement (MSB). Channel A/Channel B LVDS Overrange Output—True. Channel A/Channel B LVDS Overrange Output—Complement. Channel A/Channel B LVDS Data Clock Output—True. Channel A/Channel B LVDS Data Clock Output—Complement. SPI Serial Clock/Data Format Select Pin in External Pin Mode. SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode. SPI Chip Select (Active Low). Output Enable Input (Active Low) in External Pin Mode. Power-Down Input in External Pin Mode. In SPI mode, this input can be configured as power-down or standby. Rev. 0 | Page 14 of 44 AD9650 TYPICAL PERFORMANCE CHARACTERISTICS AVDD = 1.8 V, DRVDD = 1.8 V, rated sample rate, DCS disabled, 1.35 V internal reference, 2.7 V p-p differential input, VIN = −1.0 dBFS, and 32k sample, TA = 25°C, unless otherwise noted. AD9650-25 0 –20 –40 –60 –80 –100 –120 –140 25MSPS 9.7MHz @ –1dBFS SNR = 82.4dB (83.4dBFS) SFDR = 95.8dBc AMPLITUDE (dBFS) 08919-108 25MSPS 9.7MHz @ –6dBFS –20 SNR = 77.9dB (83.9dBFS) SFDR = 99dBc –40 –60 –80 –100 –120 –140 0 AMPLITUDE (dBFS) 0 2 4 6 8 10 12 0 2 4 6 8 10 12 FREQUENCY (MHz) FREQUENCY (MHz) Figure 8. AD9650-25 Single-Tone FFT with fIN = 9.7 MHz 0 –20 –40 –60 –80 –100 –120 –140 Figure 11. AD9650-25 Single-Tone FFT with fIN = 9.7 MHz at −6 dBFS with Dither Disabled 25MSPS 9.7MHz @ –6dBFS –20 SNR = 77.4dB (83.4dBFS) SFDR = 101.3dBc AMPLITUDE (dBFS) 25MSPS 30.3MHz @ –1dBFS SNR = 80.6dB (81.6dBFS) SFDR = 84.6dBc 0 AMPLITUDE (dBFS) –40 –60 –80 –100 –120 –140 08919-109 0 2 4 6 8 10 12 0 2 4 6 8 10 12 FREQUENCY (MHz) FREQUENCY (MHz) Figure 9. AD9650-25 Single-Tone FFT with fIN = 30.3 MHz 0 –20 –40 Figure 12. AD9650-25 Single-Tone FFT with fIN = 9.7 MHz at −6 dBFS with Dither Enabled 120 SFDR (dBFS) 100 SNR (dBFS) 80 25MSPS 70.1MHz @ –1dBFS SNR = 78.5dB (79.5dBFS) SFDR = 87.2dBFS AMPLITUDE (dBFS) –60 –80 –100 –120 –140 SNR/SFDR 60 SFDR (dBc) 40 20 SNR (dB) 08919-110 0 2 4 6 8 10 12 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 FREQUENCY (MHz) INPUT AMPLITUDE (dBFS) Figure 10. AD9650-25 Single-Tone FFT with fIN = 70.1 MHz Figure 13. AD9650-25 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 9.7 MHz Rev. 0 | Page 15 of 44 08919-113 0 –100 08919-112 08919-111 AD9650 120 SFDR (dBFS) DITHER ON 115 110 1200000 1000000 1400000 SNR/SFDR (dBFS) 100 95 90 85 80 75 SFDR (dBFS) DITHER OFF NUMBER OF HITS 105 800000 600000 400000 SNR (dBFS) DITHER OFF SNR (dBFS) DITHER ON 200000 0 N+7 N+6 N+5 N+4 N+3 N+2 N+1 N–1 N–2 N–3 N–4 N–5 N–6 INPUT AMPLITUDE (dBFS) OUTPUT CODE Figure 14. AD9650-25 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 9.7 MHz with and Without Dither Enabled 100 95 90 85 60 80 75 70 65 SNR (–40°C) SNR (+25°C) SNR (+85°C) SFDR (–40°C) SFDR (+25°C) SFDR (+85°C) 0 50 100 150 200 INPUT FREQUENCY (MHz) 40 SNR 20 120 Figure 17. AD9650-25 Grounded Input Histogram 6 DITHER DISABLED DITHER ENABLED 100 4 INL ERROR (LSB) SFDR 80 2 SNR (dBFS) SFDR (dBc) 0 –2 –4 08919-115 250 0 10000 20000 30000 40000 50000 60000 OUTPUT CODE Figure 15. AD9650-25 Single-Tone SNR/SFDR vs. Input Frequency (fIN) with 2.7 V p-p Full Scale 105 Figure 18. AD9650-25 INL with fIN = 9.7 MHz 2.0 1.5 1.0 100 SNR (dBFS), SFDR (dBc) DNL ERROR (LSB) 95 SFDR (dBc) 90 0.5 0 –0.5 –1.0 –1.5 85 SNR (dBFS) 80 08919-216 15 20 25 30 35 40 45 50 0 10000 20000 30000 40000 50000 60000 SAMPLE RATE (MSPS) OUTPUT CODE Figure 16. AD9650-25 Single-Tone SNR/SFDR vs. Sample Rate (fS) with fIN = 9.7 MHz Figure 19. AD9650-25 DNL with fIN = 9.7 MHz Rev. 0 | Page 16 of 44 08919-120 75 10 –2.0 08919-119 0 300 –6 08919-118 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 08919-114 N–7 70 –100 N AD9650 450 TOTAL POWER (mW), CURRENT (mA) 400 350 300 250 200 150 100 50 0 10 LVDS AND CMOS IAVDD (mA) LVDS IDRVDD (mA) CMOS IDRVDD (mA) 15 20 25 30 35 40 45 50 08919-121 TOTAL POWER LVDS (mW) TOTAL POWER CMOS (mW) SAMPLE RATE (MSPS) Figure 20. AD9650-25 Power and Current vs. Sample Rate Rev. 0 | Page 17 of 44 AD9650 AD9650-65 0 –20 –40 –60 –80 –100 –120 –140 65MSPS 9.7MHz @ –1dBFS SNR = 82.1dB (83.1dBFS) SFDR = 98.7dBc 0 –20 –40 –60 –80 –100 –120 –140 65MSPS 141MHz @ –1dBFS SNR = 78.5dB (79.5dBFS) SFDR = 79.2dBc AMPLITUDE (dBFS) 08919-122 AMPLITUDE (dBFS) 0 5 10 15 20 25 30 0 5 10 15 20 25 30 FREQUENCY (MHz) FREQUENCY (MHz) Figure 21. AD9650-65 Single-Tone FFT with fIN = 9.7 MHz 0 –20 –40 –60 –80 –100 –120 –140 65MSPS 30.3MHz @ –1dBFS SNR = 81.5dB (82.5dBFS) SFDR = 93.5dBc Figure 24. AD9650-65 Single-Tone FFT with fIN = 141 MHz 0 –20 –40 –60 –80 –100 –120 –140 65MSPS 30.3MHz @ –6dBFS SNR = 77.3dB (83.3dBFS) SFDR = 96.2dBc AMPLITUDE (dBFS) AMPLITUDE (dBFS) 08919-123 0 5 10 15 20 25 30 0 5 10 15 20 25 30 FREQUENCY (MHz) FREQUENCY (MHz) Figure 22. AD9650-65 Single-Tone FFT with fIN = 30.3 MHz Figure 25. AD9650-65 Single-Tone FFT with fIN = 30.3 MHz at −6 dBFS with Dither Disabled 0 –20 –40 –60 –80 –100 –120 –140 65MSPS 30.3MHz @ –6dBFS SNR = 76.9dB (82.9dBFS) SFDR = 100dBc 0 –20 –40 –60 –80 –100 –120 –140 65MSPS 70.1MHz @ –1dBFS SNR = 80.4dB (81.4dBFS) SFDR = 86dBc AMPLITUDE (dBFS) 08919-124 AMPLITUDE (dBFS) 0 5 10 15 20 25 30 0 5 10 15 20 25 30 FREQUENCY (MHz) FREQUENCY (MHz) Figure 23. AD9650-65 Single-Tone FFT with fIN = 70.1 MHz Figure 26. AD9650-65 Single-Tone FFT with fIN = 30.3 MHz @ −6 dBFS with Dither Enabled Rev. 0 | Page 18 of 44 08919-127 08919-126 08919-125 AD9650 120 SFDR (dBFS) 105 100 100 SNR (dBFS), SFDR (dBc) SNR (dBFS) 80 95 SFDR 90 SNR/SFDR 60 SFDR (dBc) SNR (dB) 40 85 SNR 20 80 08919-128 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 50 55 60 65 70 75 80 85 INPUT AMPLITUDE (dBFS) SAMPLE RATE (MSPS) Figure 27. AD9650-65 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN =30.3 MHz 120 115 110 SFDR (dBFS) DITHER ON Figure 30. AD9650-65 Single-Tone SNR/SFDR vs. Sample Rate (fS) with fIN = 30 MHz 1400000 1200000 1000000 NUMBER OF HITS SNR/SFDR (dBFS) 105 100 95 90 85 80 75 SNR (dBFS) DITHER OFF SNR (dBFS) DITHER ON SFDR (dBFS) DITHER OFF 800000 600000 400000 200000 0 N+7 N+6 N+5 N+4 N+3 N+2 N+1 N–1 N–2 N–3 N–4 N–5 N–6 INPUT AMPLITUDE (dBFS) OUTPUT CODE Figure 28. AD9650-65 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 30.3 MHz with and Without Dither Enabled 100 95 90 100 90 SFDR 80 INL ERROR (LSB) 4 6 Figure 31. AD9650-65 Grounded Input Histogram DITHER DISABLED DITHER ENABLED 70 2 SNR (dBFS) 85 80 75 70 65 SNR (–40°C) SFDR (–40°C) SNR (+25°C) SFDR (+25°C) SNR (+85°C) SFDR (+85°C) 0 50 100 150 200 SFDR (dBc) 60 50 40 SNR 30 20 10 0 –2 –4 08919-130 250 0 10000 20000 30000 40000 50000 60000 INPUT FREQUENCY (MHz) OUTPUT CODE Figure 29. AD9650-65 Single-Tone SNR/SFDR vs. Input Frequency (fIN) with 2.7 V p-p Full Scale Figure 32. AD9650-65 INL with fIN = 9.7 MHz Rev. 0 | Page 19 of 44 08919-134 0 300 –6 08919-133 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 08919-129 N–7 70 –100 N 08919-230 0 –100 75 45 AD9650 2.0 TOTAL POWER (mW)/CURRENT (mA) 700 600 500 400 300 LVDS AND CMOS IAVDD (mA) 200 100 0 25 LVDS IDRVDD (mA) CMOS IDRVDD (mA) TOTAL POWER LVDS (mW) 1.5 1.0 DNL ERROR (LSB) 0.5 0 –0.5 –1.0 –1.5 08919-135 TOTAL POWER CMOS (mW) 0 10000 20000 30000 40000 50000 60000 35 45 55 65 75 85 95 105 OUTPUT CODE SAMPLE RATE (MSPS) Figure 33. AD9650-65 DNL with fIN = 9.7 MHz Figure 34. AD9650-65 Power and Current vs. Sample Rate Rev. 0 | Page 20 of 44 08919-234 –2.0 AD9650 AD9650-80 0 –20 –40 –60 –80 –100 –120 –140 80MSPS 9.7MHz @ –1dBFS SNR = 82.2dB (83.2dBFS) SFDR = 95.8dBc AMPLITUDE (dBFS) 0 –20 –40 –60 –80 –100 –120 –140 80MSPS 141MHz @ –1dBFS SNR = 79.3dB (80.3dBFS) SFDR = 79.2dBc AMPLITUDE (dBFS) 08919-137 0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40 FREQUENCY (MHz) FREQUENCY (MHz) Figure 35. AD9650-80 Single-Tone FFT with fIN = 9.7 MHz 0 –20 –40 –60 –80 –100 –120 –140 Figure 38. AD9650-80 Single-Tone FFT with fIN = 141 MHz 0 –20 –40 –60 –80 –100 –120 –140 80MSPS 30.3MHz @ –1dBFS SNR = 81.8dB (82.8dBFS) SFDR = 94.5dBc 80MSPS 30.3MHz @ –6dBFS SNR = 77.3dB (83.3dBFS) SFDR = 94.3dBc AMPLITUDE (dBFS) 08919-138 AMPLITUDE (dBFS) 0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40 FREQUENCY (MHz) FREQUENCY (MHz) Figure 36. AD9650-80 Single-Tone FFT with fIN = 30.3 MHz 0 –20 –40 –60 –80 –100 –120 –140 Figure 39. AD9650-80 Single-Tone FFT with fIN = 30.3 MHz at −6 dBFS with Dither Disabled 0 –20 –40 –60 –80 –100 –120 –140 80MSPS 30.3MHz @ –6dBFS SNR = 77dB (83dBFS) SFDR = 98.4dBc 80MSPS 70.1MHz @ –1dBFS SNR = 80dB (81dBFS) SFDR = 86.4dBc AMPLITUDE (dBFS) 08919-139 AMPLITUDE (dBFS) 0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40 FREQUENCY (MHz) FREQUENCY (MHz) Figure 37. AD9650-80 Single-Tone FFT with fIN = 70.1 MHz Figure 40. AD9650-80 Single-Tone FFT with fIN = 30.3 MHz at −6 dBFS with Dither Enabled Rev. 0 | Page 21 of 44 08919-142 08919-141 08919-140 AD9650 120 SFDR (dBFS) 105 100 SNR (dBFS), SFDR (dBc) 100 SNR (dBFS) 80 95 SNR/SFDR SFDR 60 SFDR (dBc) SNR (dB) 40 90 85 SNR 20 80 08919-143 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 65 70 75 80 85 90 95 100 INPUT AMPLITUDE (dBFS) SAMPLE RATE (MSPS) Figure 41. AD9650-80 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 30.3 MHz 120 SFDR (dBFS) DITHER ON 100 Figure 44. AD9650-80 Single-Tone SNR/SFDR vs. Sample Rate (fS) with fIN = 30 MHz 1400000 1200000 1000000 SNR/SFDR (dBFS) 80 SFDR (dBFS) DITHER OFF 60 NUMBER OF HITS 800000 900000 600000 200000 0 40 SNR (dBFS) DITHER OFF SNR (dBFS) DITHER ON 20 N+7 N+6 N+5 N+4 N+3 N+2 N+1 N–1 N–2 N–3 N–4 N–5 N–6 INPUT AMPLITUDE (dBFS) OUTPUT CODE Figure 42. AD9650-80 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 30.3 MHz with and Without Dither Enabled 100 95 90 120 Figure 45. AD9650-80 Grounded Input Histogram 6 DITHER DISABLED DITHER ENABLED 100 4 85 60 80 75 70 65 0 50 100 150 200 250 INPUT FREQUENCY (MHz) SNR (–40°C) SFDR (–40°C) SNR (+25°C) SFDR (+25°C) SNR (+85°C) SFDR (+85°C) SNR 40 INL ERROR (LSB) SFDR 80 2 SNR (dBFS) SFDR (dBc) 0 –2 20 –4 08919-145 0 10000 20000 30000 40000 50000 60000 OUTPUT CODE Figure 43. AD9650-80 Single-Tone SNR/SFDR vs. Input Frequency (fIN) Figure 46. AD9650-80 INL with fIN = 9.7 MHz Rev. 0 | Page 22 of 44 08919-149 0 300 –6 08919-148 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 08919-144 N–7 0 –100 N 08919-146 0 –100 75 60 AD9650 2.0 800 TOTAL POWER (mW)/CURRENT (mA) TOTAL POWER LVDS (mW) 1.5 1.0 DNL ERROR (LSB) 700 600 500 400 LVDS AND CMOS IAVDD (mA) 300 200 100 0 25 CMOS IDRVDD (mA) LVDS IDRVDD (mA) TOTAL POWER CMOS (mW) 0.5 0 –0.5 –1.0 –1.5 08919-150 35 45 55 65 75 85 95 105 115 125 OUTPUT CODE SAMPLE RATE (MSPS) Figure 47. AD9650-80 DNL with fIN = 9.7 MHz Figure 48. AD9650-80 Power and Current vs. Sample Rate Rev. 0 | Page 23 of 44 08919-248 –2.0 0 10000 20000 30000 40000 50000 60000 AD9650 AD9650-105 0 –20 –40 –60 –80 –100 –120 –140 105MSPS 9.7MHz @ –1dBFS SNR = 81.7dB (82.7dBFS) SFDR = 90.7dBc AMPLITUDE (dBFS) 0 –20 –40 –60 –80 –100 –120 –140 105MSPS 141MHz @ –1dBFS SNR = 79dB (80dBFS) SFDR = 81.1dBc AMPLITUDE (dBFS) 08919-152 0 10 20 30 40 50 0 10 20 30 40 50 FREQUENCY (MHz) FREQUENCY (MHz) Figure 49. AD9650-105 Single-Tone FFT with fIN = 9.7 MHz 0 –20 –40 –60 –80 –100 –120 –140 Figure 52. AD9650-105 Single-Tone FFT with fIN = 141 MHz 0 –20 –40 –60 –80 –100 –120 –140 105MSPS 30.3MHz @ –1dBFS SNR = 81.2dB (82.2dBFS) SFDR = 90.3dBc AMPLITUDE (dBFS) 105MSPS 30.3MHz @ –6dBFS SNR = 77.3dB (83.3dBFS) SFDR = 94dBc AMPLITUDE (dBFS) 08919-153 0 10 20 30 40 50 0 10 20 30 40 50 FREQUENCY (MHz) FREQUENCY (MHz) Figure 50. AD9650-105 Single-Tone FFT with fIN = 30.3 MHz Figure 53. AD9650-105 Single-Tone FFT with fIN = 30.3 MHz @ −6 dBFS with Dither Disabled 0 –20 –40 –60 –80 –100 –120 –140 105MSPS 30.3MHz @ –6dBFS SNR = 75.7dB (81.7dBFS) SFDR = 96.2dBc 0 –20 –40 –60 –80 –100 –120 –140 105MSPS 70.1MHz @ –1dBFS SNR = 79.2dB (80.2dBFS) SFDR = 92.2dBc AMPLITUDE (dBFS) AMPLITUDE (dBFS) 08919-154 0 10 20 30 40 50 0 10 20 30 40 50 FREQUENCY (MHz) FREQUENCY (MHz) Figure 51. AD9650-105 Single-Tone FFT with fIN = 70.1 MHz Figure 54. AD9650-105 Single-Tone FFT with fIN = 30.3 MHz @ −6 dBFS with Dither Enabled Rev. 0 | Page 24 of 44 08919-157 08919-156 08919-155 AD9650 120 SFDR (dBFS) 100 SNR (dBFS), SFDR (dBc) 100 105 SNR (dBFS) 80 SNR/SFDR 95 SFDR 90 60 SFDR (dBc) SNR (dB) 40 85 SNR 20 80 08919-158 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 90 95 100 105 110 115 120 125 INPUT AMPLITUDE (dBFS) SAMPLE RATE (MSPS) Figure 55. AD9650-105 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 30.3 MHz 120 115 110 SFDR (dBFS) DITHER ON Figure 58. AD9650-105 Single-Tone SNR/SFDR vs. Sample Rate (fS) with fIN = 30 MHz 0 –20 –40 –60 –80 –100 –120 –140 105MSPS 30.8MHz @ –7dBFS 25.4MHz @ –7dBFS SFDR = 86.6dBc (93.6dBFS) SNR/SFDR (dBFS) 105 100 SFDR (dBFS) DITHER OFF 95 90 85 80 75 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 08919-159 SNR (dBFS) DITHER OFF SNR (dBFS) DITHER ON AMPLITUDE (dBFS) 70 –100 0 10 20 30 40 50 INPUT AMPLITUDE (dBFS) FREQUENCY (MHz) Figure 56. AD9650-105 Single Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 30.3 MHz with and Without Dither Enabled 100 95 SFDR 90 SNR (dBFS) Figure 59. AD9650-105 Two-Tone FFT with fIN1 = 25.4 MHz and fIN2 = 30.8 MHz 0 –20 SFDR (dBc) –40 100 90 80 70 SFDR (dBc) SFDR/IMD3 85 80 75 70 65 SNR (–40°C) SFDR (–40°C) SNR (+25°C) SFDR (+25°C) SNR (+85°C) SFDR (+85°C) 0 50 100 150 200 60 50 40 30 SNR 20 IMD3 (dBc) –60 –80 –100 –120 SFDR (dBFS) 10 08919-160 IMD3 (dBFS) –80 –70 –60 –50 –40 –30 –20 –10 08919-163 250 0 300 –140 –90 INPUT FREQUENCY (MHz) INPUT AMPLITUDE (dBFS) Figure 57. AD9650-105 Single-Tone SNR/SFDR vs. Input Frequency (fIN) Figure 60. AD9650-105 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 25.4 MHz, fIN2 = 30.8 MHz, fS = 105 MSPS Rev. 0 | Page 25 of 44 08919-162 08919-258 0 –100 75 85 AD9650 0 –20 –40 –60 –80 –100 –120 –140 200000 105MSPS 124.8MHz @ –7dBFS 128.3MHz @ –7dBFS SFDR = 83.8dBc 1200000 1000000 AMPLITUDE (dBFS) NUMBER OF HITS 800000 600000 400000 08919-164 N+8 N+7 N+6 N+5 N+4 N+3 N+2 N+1 N N–1 N–2 N–3 N–4 N–5 N–6 N–7 FREQUENCY (MHz) OUTPUT CODE Figure 61. AD9650-105 Two-Tone FFT with fIN1 = 124.8 MHz and fIN2 = 128.3 MHz Figure 64. AD9650-105 Grounded Input Histogram 0 –20 SFDR (dBc) –40 SFDR/IMD3 INL ERROR (LSB) 6 DITHER DISABLED DITHER ENABLED 4 IMD3 (dBc) –60 –80 –100 –120 IMD3 (dBFS) –80 –70 –60 –50 –40 –30 –20 –10 –140 –90 SFDR (dBFS) 2 0 –2 –4 0 10000 20000 30000 40000 50000 60000 INPUT AMPLITUDE (dBFS) OUTPUT CODE Figure 62. AD9650-105 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 128.3 MHz, fIN2 = 124.8 MHz, fs = 105 MSPS 900 TOTAL POWER LVDS (mW) TOTAL POWER (mW)/CURRENT (mA) 2.0 1.5 1.0 Figure 65. AD9650-105 INL with fIN = 9.7 MHz 800 TOTAL POWER CMOS (mW) 700 DNL ERROR (LSB) 600 500 400 300 200 CMOS IDRVDD (mA) 100 0 25 LVDS IDRVDD (mA) LVDS AND CMOS IAVDD (mA) 0.5 0 –0.5 –1.0 –1.5 08919-170 08919-263 –2.0 45 65 85 105 125 145 0 10000 20000 30000 40000 50000 60000 SAMPLE RATE (MSPS) OUTPUT CODE Figure 63. AD9650-105 Power and Current vs. Sample Rate Figure 66. AD9650-105 DNL with fIN = 9.7 MHz Rev. 0 | Page 26 of 44 08919-169 08919-165 –6 08919-168 0 10 20 30 40 50 N–8 0 AD9650 100 TYPICAL VCM SNR (dBFS) 90 SFDR (dBc) 80 SNR/SFDR 70 60 50 0.85 0.90 0.95 1.00 1.05 1.10 1.15 1.20 COMMON-MODE VOLTAGE (V) Figure 67. SNR/SFDR vs. Input Common Mode (VCM) with fIN = 30.3 MHz Rev. 0 | Page 27 of 44 08919-171 40 0.80 AD9650 EQUIVALENT CIRCUITS AVDD VIN±x SENSE 350Ω 08919-007 Figure 68. Equivalent Analog Input Circuit AVDD Figure 73. Equivalent SENSE Circuit DRVDD 0.9V CLK+ 10kΩ 10kΩ CLK– CSB 350Ω 26kΩ 08919-012 Figure 69. Equivalent Clock Input Circuit 08919-008 Figure 74. Equivalent CSB Input Circuit DRVDD AVDD PAD VREF 6kΩ 08919-009 Figure 70. Digital Output Figure 75. Equivalent VREF Circuit DRVDD 26kΩ SDIO/DCS 350Ω PDWN 350Ω 26kΩ 08919-010 08919-015 Figure 71. Equivalent SDIO/DCS Circuit DRVDD Figure 76. Equivalent PDWN Input Circuit SCLK/DFS OR OEB 350Ω 26kΩ 08919-011 Figure 72. Equivalent SCLK/DFS or OEB Input Circuit Rev. 0 | Page 28 of 44 08919-014 08919-013 AD9650 THEORY OF OPERATION The AD9650 dual-core analog-to-digital converter (ADC) is used for digitizing high frequency, wide dynamic range signals with input frequencies of up to 300 MHz. The user can sample any fS/2 frequency segment from dc to 300 MHz using appropriate lowpass or band-pass filtering at the ADC inputs with little loss in ADC performance. The ADCs can also be operated with independent analog inputs. In quadrature applications, the AD9650 can be used as a baseband or direct down-conversion receiver, in which one ADC is used for I input data, and the other is used for Q input data. Synchronization capability is provided to allow synchronized timing between multiple devices. Programming and control of the AD9650 are accomplished using a 3-wire, SPI-compatible serial interface. A small resistor in series with each input can help reduce the peak transient current required from the output stage of the driving source. A shunt capacitor can be placed across the inputs to provide dynamic charging currents. This passive network creates a low-pass filter at the ADC input; therefore, the precise values are dependent on the application. In intermediate frequency (IF) undersampling applications, any shunt capacitors should be reduced. In combination with the driving source impedance, the shunt capacitors limit the input bandwidth. Refer to the AN-742 Application Note, Frequency Domain Response of Switched-Capacitor ADCs; the AN-827 Application Note, A Resonant Approach to Interfacing Amplifiers to Switched-Capacitor ADCs; and the Analog Dialogue article, “Transformer-Coupled Front-End for Wideband A/D Converters,” for more information on this subject (visit www.analog.com). BIAS S CS VIN+x CPAR1 CPAR2 H CS VIN–x S 08919-034 ADC ARCHITECTURE The AD9650 architecture consists of a dual front-end sampleand-hold circuit, followed by a pipelined, switched-capacitor ADC. The quantized outputs from each stage are combined into a final 16-bit result in the digital correction logic. The pipelined architecture permits the first stage to operate on a new input sample and the remaining stages to operate on the preceding samples. Sampling occurs on the rising edge of the clock. Each stage of the pipeline, excluding the last, consists of a low resolution flash ADC connected to a switched-capacitor digitalto-analog converter (DAC) and an interstage residue amplifier (MDAC). The MDAC magnifies the difference between the reconstructed DAC output and the flash input for the next stage in the pipeline. One bit of redundancy is used in each stage to facilitate digital correction of flash errors. The last stage simply consists of a flash ADC. The input stage of each channel contains a differential sampling circuit that can be ac- or dc-coupled in differential or singleended modes. The output staging block aligns the data, corrects errors, and passes the data to the output buffers. The output buffers are powered from a separate supply, allowing digital output noise to be separated from the analog core. During power-down, the output buffers go into a high impedance state. S CFB S S CPAR1 CPAR2 BIAS S CFB Figure 77. Switched-Capacitor Input For best dynamic performance, the source impedances driving VIN+x and VIN−x should be matched, and the inputs should be differentially balanced. An internal differential reference buffer creates positive and negative reference voltages that define the input span of the ADC core. The span of the ADC core is set by this buffer to 2 × VREF. Input Common Mode The analog inputs of the AD9650 are not internally dc biased. In ac-coupled applications, the user must provide this bias externally. Setting the device so that VCM = 0.5 × AVDD (or 0.9 V) is recommended for optimum performance, but the device functions over a wider range with reasonable performance (see Figure 67). An on-chip, common-mode voltage reference is included in the design and is available from the VCM pin. Optimum performance is achieved when the common-mode voltage of the analog input is set by the VCM pin voltage (typically 0.5 × AVDD). The VCM pin must be decoupled to ground by a 0.1 μF capacitor, as described in the Applications Information section. ANALOG INPUT CONSIDERATIONS The analog input to the AD9650 is a differential switchedcapacitor circuit that has been designed for optimum performance while processing a differential input signal. The clock signal alternatively switches the input between sample mode and hold mode (see Figure 77). When the input is switched into sample mode, the signal source must be capable of charging the sample capacitors and settling within ½ of a clock cycle. Rev. 0 | Page 29 of 44 AD9650 Common-Mode Voltage Servo In applications where there may be a voltage loss between the VCM output of the AD9650 and the analog inputs, the common-mode voltage servo can be enabled. When the inputs are ac-coupled and a resistance of >100 Ω is placed between the VCM output and the analog inputs, a significant voltage drop can occur and the common-mode voltage servo should be enabled. Setting Bit 0 in Register 0x0F to a logic high enables the VCM servo mode. In this mode, the AD9650 monitors the common-mode input level at the analog inputs and adjusts the VCM output level to keep the common-mode input voltage at an optimal level. If both channels are operational, Channel A is monitored. However, if Channel A is in power-down or standby mode, the Channel B input is monitored. typically at very low levels and do not limit SFDR when the ADC is quantizing large-signal inputs, dithering converts these tones to noise and produces a whiter noise floor. Small-Signal FFT For small-signal inputs, the front-end sampling circuit typically contributes very little distortion, and, therefore, the SFDR is likely to be limited by tones caused by DNL errors due to random component mismatches. Therefore, for small-signal inputs (typically, those below −6 dBFS), dithering can significantly improve SFDR by converting these DNL tones to white noise. Static Linearity Dithering also removes sharp local discontinuities in the INL transfer function of the ADC and reduces the overall peak-topeak INL. In receiver applications, utilizing dither helps to reduce DNL errors that cause small-signal gain errors. Often this issue is overcome by setting the input noise 5 dB to 10 dB above the converter noise. By using dither within the converter to correct the DNL errors, the input noise requirement can be reduced. Dither The AD9650 has an optional dither mode that can be selected for one or both channels. Dithering is the act of injecting a known but random amount of white noise, commonly referred to as dither, into the input of the ADC. Dithering has the effect of improving the local linearity at various points along the ADC transfer function. Dithering can significantly improve the SFDR when quantizing small-signal inputs, typically when the input level is below −6 dBFS. As shown in Figure 78, the dither that is added to the input of the ADC through the dither DAC is precisely subtracted out digitally to minimize SNR degradation. When dithering is enabled, the dither DAC is driven by a pseudorandom number generator (PN gen). In the AD9650, the dither DAC is precisely calibrated to result in only a very small degradation in SNR and SINAD. AD9650 VIN ADC CORE DOUT Differential Input Configurations Optimum performance is achieved while driving the AD9650 in a differential input configuration. For baseband applications, the AD8138, ADA4937-2, and ADA4938-2 differential drivers provide excellent performance and a flexible interface to the ADC. The output common-mode voltage of the ADA4938-2 is easily set with the VCM pin of the AD9650 (see Figure 79), and the driver can be configured in a Sallen-Key filter topology to provide band limiting of the input signal. 15pF 200Ω VIN 76.8Ω 90Ω 33Ω 5pF 15Ω VIN–x AVDD ADA4938-2 DITHER DAC AD9650 15Ω VIN+x VCM 08919-035 0.1µF 120Ω 08919-058 33Ω 15pF 200Ω PN GEN DITHER ENABLE Figure 79. Differential Input Configuration Using the ADA4938-2 Figure 78. Dither Block Diagram Large-Signal FFT In most cases, dithering does not improve SFDR for large-signal inputs close to full scale, for example, with a −1 dBFS input. For large-signal inputs, the SFDR is typically limited by front-end sampling distortion, which dithering cannot improve. However, even for such large-signal inputs, dithering may be useful for certain applications because it makes the noise floor whiter. As is common in pipeline ADCs, the AD9650 contains small DNL errors caused by random component mismatches that produce spurs or tones that make the noise floor somewhat randomly colored part-to-part. Although these tones are For baseband applications in which SNR is a key parameter, differential transformer coupling is the recommended input configuration. An example is shown in Figure 80. To bias the analog input, the VCM voltage can be connected to the center tap of the secondary winding of the transformer. C2 R2 R1 2V p-p 49.9Ω C1 R1 0.1µF R2 VIN+x AD9650 VIN–x VCM 08919-036 C2 Figure 80. Differential Transformer-Coupled Configuration Rev. 0 | Page 30 of 44 AD9650 The signal characteristics must be considered when selecting a transformer. Most RF transformers saturate at frequencies below a few megahertz (MHz). Excessive signal power can also cause core saturation, which leads to distortion. At input frequencies in the second Nyquist zone and above, the noise performance of most amplifiers is not adequate to achieve the true SNR performance of the AD9650. For applications in which SNR is a key parameter, differential double balun coupling is the recommended input configuration (see Figure 81). In this configuration, the input is ac-coupled, and the CML is provided to each input through a 33 Ω resistor. These resistors compensate for losses in the input baluns to provide a 50 Ω impedance to the driver. In the double balun and transformer configurations, the value of the input capacitors and resistors is dependent on the input frequency and source impedance and may need to be reduced or removed. Table 10 displays recommended values to set the RC network. At higher input frequencies, good performance can be 0.1µF 2V p-p PA S S P 0.1µF 33Ω 0.1µF 33Ω 0.1µF C1 R1 R2 achieved by using a ferrite bead in series with a resistor and removing the capacitors. However, these values are dependent on the input signal and should be used only as a starting guide. Table 10. Example RC Network Frequency Range (MHz) 0 to 100 100 to 200 100 to 300 1 R1 Series (Ω Each) 33 10 101 C1 Differential (pF) 5 5 Remove R2 Series (Ω Each) 15 10 66 C2 Shunt (pF Each) 15 10 Remove In this configuration, R1 is a ferrite bead with a value of 10 Ω at 100 MHz. An alternative to using a transformer-coupled input at frequencies in the second Nyquist zone is to use the AD8352 differential driver. An example is shown in Figure 82. See the AD8352 data sheet for more information. C2 R1 R2 VIN+x AD9650 VIN–x VCM 08919-038 C2 Figure 81. Differential Double Balun Input Configuration VCC 0.1µF ANALOG INPUT 0Ω 16 1 2 CD RD RG 3 4 ANALOG INPUT 0.1µF 5 0Ω 14 0.1µF 0.1µF 8, 13 11 0.1µF 0.1µF R 200Ω VIN+x C 0.1µF 200Ω R AD8352 10 AD9650 VIN–x VCM 08919-039 Figure 82. Differential Input Configuration Using the AD8352 Rev. 0 | Page 31 of 44 AD9650 VOLTAGE REFERENCE REFERENCE VOLTAGE ERROR (%) 0 The AD9650 can be configured for a stable 1.35 V internal reference or a user-applied external reference. The input range of the ADC always equals twice the voltage at the reference pin (VREF) for either an internal or an external reference. Table 11 shows a summary of the internal and external reference connections. –0.5 –1.0 –1.5 Internal Reference Connection A stable and accurate 1.35 V reference is built into the AD9650, allowing a 2.7 V p-p full-scale input. To configure the AD9650 for an internal reference, the SENSE pin must be tied low. In addition, to achieve optimal noise performance, it is recommended that the VREF pin be decoupled by 1.0 μF and 0.1 μF capacitors close to the pin. Figure 83 shows the configuration for the internal reference connection. VIN+A/VIN+B VIN–A/VIN–B –2.0 –2.5 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 LOAD CURRENT (mA) Figure 84. Reference Voltage Error vs. Load Current External Reference Operation The use of an external reference may be necessary to enhance the gain accuracy of the ADC or improve thermal drift characteristics. Figure 85 shows the typical drift characteristics of the internal reference in 1.35 V mode. When the SENSE pin is tied to AVDD, the internal reference is disabled, allowing the use of an external reference. An internal reference buffer loads the external reference with an equivalent 6 kΩ load (see Figure 75). The internal buffer generates the positive and negative full-scale references for the ADC core. Therefore, the external reference must be limited to a maximum of 1.35 V. ADC CORE VREF 1.0µF 0.1µF SELECT LOGIC SENSE VSELECT AD9650 Figure 83. Internal Reference Configuration 08919-040 0 REFERENCE VOLTAGE ERROR (mV) –1 If the internal reference of the AD9650 is used to drive multiple converters to improve gain matching, the loading of the reference by the other converters must be considered. Figure 84 shows how the internal reference voltage is affected by loading. –2 –3 –4 –5 –30 –10 10 30 50 70 90 TEMPERATURE (°C) Figure 85. Typical VREF Drift Table 11. Reference Configuration Summary Selected Mode Internal Reference External Reference SENSE Voltage (V) AGND to 0.2 AVDD Resulting VREF (V) 1.35 N/A Resulting Differential Span (V p-p) 2.7 2 × external reference Rev. 0 | Page 32 of 44 08919-189 –6 –50 08919-188 –3.0 AD9650 Clock Input Considerations For optimum performance, the AD9650 sample clock inputs, CLK+ and CLK−, should be clocked with a differential signal. The signal is typically ac-coupled into the CLK+ and CLK− pins via a transformer or capacitors. These pins are biased internally (see Figure 86) and require no external bias. If the inputs are floated, the CLK− pin is pulled low to prevent spurious clocking. AVDD If a low jitter clock source is not available, another option is to ac couple a differential PECL signal to the sample clock input pins, as shown in Figure 89. The AD9510/AD9511/AD9512/ AD9513/AD9514/AD9515/AD9516/AD9517/AD9518 clock drivers offer excellent jitter performance. 0.1µF 0.1µF CLK+ CLOCK INPUT AD951x 0.9V CLK+ 9pF 9pF 08919-044 50kΩ 50kΩ 240Ω 240Ω CLK– Figure 89. Differential PECL Sample Clock (Up to 625 MHz) Figure 86. Equivalent Clock Input Circuit Clock Input Options The AD9650 has a very flexible clock input structure. Clock input can be a CMOS, LVDS, LVPECL, or sine wave signal. Regardless of the type of signal being used, clock source jitter is of the most concern, as described in the Jitter Considerations section. Figure 87 and Figure 88 show two preferred methods for clocking the AD9650 (at clock rates up to 625 MHz). A low jitter clock source is converted from a single-ended signal to a differential signal using either an RF balun or an RF transformer. The RF balun configuration is recommended for clock frequencies between 125 MHz and 625 MHz, and the RF transformer is recommended for clock frequencies from 10 MHz to 200 MHz. The back-to-back Schottky diodes across the transformer/balun’s secondary windings limit the clock excursions into the AD9650 to approximately 0.8 V p-p differential. This limit helps prevent the large voltage swings of the clock from feeding through to other portions of the AD9650 while preserving the fast rise and fall times of the signal that are critical to a low jitter performance. Mini-Circuits® ADT1-1WT, 1:1Z 0.1µF XFMR 100Ω 0.1µF CLK– 0.1µF 08919-045 A third option is to ac couple a differential LVDS signal to the sample clock input pins, as shown in Figure 90. The AD9510/ AD9511/AD9512/AD9513/AD9514/AD9515/AD9516/AD9517/ AD9518 clock drivers offer excellent jitter performance. 0.1µF CLOCK INPUT 0.1µF CLK+ AD951x 0.1µF CLOCK INPUT 50kΩ 50kΩ LVDS DRIVER 100Ω 0.1µF ADC AD9650 CLK– 08919-048 Figure 90. Differential LVDS Sample Clock (Up to 625 MHz) In some applications, it may be acceptable to drive the sample clock inputs with a single-ended CMOS signal. In such applications, the CLK+ pin should be driven directly from a CMOS gate, and the CLK− pin should be bypassed to ground with a 0.1 μF capacitor (see Figure 91). VCC CLOCK INPUT 0.1µF 50Ω1 1kΩ 1kΩ OPTIONAL 0.1µF 100Ω AD951x CMOS DRIVER CLK+ ADC AD9650 CLK– 08919-049 0.1µF 150Ω RESISTOR IS OPTIONAL. ADC CLOCK INPUT 0.1µF 50Ω AD9650 CLK+ Figure 91. Single-Ended 1.8 V CMOS Input Clock (Up to 200 MHz) Input Clock Divider The AD9650 contains an input clock divider with the ability to divide the input clock by integer values between 1 and 8. For divide ratios of 1, 2, 4, or 8, the duty cycle stabilizer (DCS) is optional. For other divide ratios, divide-by-3, -5, -6, and -7, the duty cycle stabilizer must be enabled for proper part operation. The AD9650 clock divider can be synchronized using the external SYNC input. Bit 0 to Bit 2 of Register 0x100 allow the clock divider to be resynchronized on every SYNC signal or only on the first SYNC signal after the register is written. A valid SYNC causes the clock divider to reset to its initial state. This synchronization feature allows multiple parts to have their clock dividers aligned to guarantee simultaneous input sampling. SCHOTTKY DIODES: HSMS2822 Figure 87. Transformer-Coupled Differential Clock (Up to 200 MHz) ADC CLOCK INPUT 1nF 50Ω 1nF SCHOTTKY DIODES: HSMS2822 0.1µF AD9650 CLK+ 0.1µF CLK– 08919-046 Figure 88. Balun-Coupled Differential Clock (Up to 625 MHz) Rev. 0 | Page 33 of 44 08919-047 CLOCK INPUT 0.1µF PECL DRIVER 100Ω 0.1µF ADC AD9650 CLK– AD9650 Clock Duty Cycle Typical high speed ADCs use both clock edges to generate a variety of internal timing signals and, as a result, may be sensitive to clock duty cycle. The AD9650 requires a tight tolerance on the clock duty cycle to maintain dynamic performance characteristics. The AD9650 contains a duty cycle stabilizer (DCS) that retimes the nonsampling (falling) edge, providing an internal clock signal with a nominal 50% duty cycle. This allows the user to provide a wide range of clock input duty cycles without affecting the performance of the AD9650. Noise and distortion performance are nearly flat for a wide range of duty cycles with the DCS enabled. Jitter in the rising edge of the input is still of paramount concern and is not easily reduced by the internal stabilization circuit. The duty cycle control loop does not function for clock rates of less than 20 MHz, nominally. The loop has a time constant associated with it that must be considered in applications in which the clock rate can change dynamically. A wait time of 1.5 μs to 5 μs is required after a dynamic clock frequency increase or decrease before the DCS loop is relocked to the input signal. During the time period that the loop is not locked, the DCS loop is bypassed, and internal device timing is dependent on the duty cycle of the input clock signal. In such applications, it may be appropriate to disable the duty cycle stabilizer. In all other applications, enabling the DCS circuit is recommended to maximize ac performance. 82 80 2V p-p CLK AMPLITUDE 78 SNR (dBFS) 76 1V p-p CLK AMPLITUDE 74 72 1 2 CLK DIVIDE RATIO 3 4 Figure 92. SNR vs. CLK Divide Ratio for fIN = 141 MHz and a Sample Rate of 105 MSPS The clock input should be treated as an analog signal in cases in which aperture jitter may affect the dynamic range of the AD9650. Power supplies for clock drivers should be separated from the ADC output driver supplies to avoid modulating the clock signal with digital noise. Low jitter, crystal-controlled oscillators make the best clock sources. Refer to the AN-501 Application Note and the AN-756 Application Note (visit www.analog.com) for more information about jitter performance as it relates to ADCs. Jitter Considerations High speed, high resolution ADCs are sensitive to the quality of the clock input. For inputs near full scale, the degradation in SNR from the low frequency SNR (SNRLF) at a given input frequency (fINPUT) due to jitter (tJRMS) can be calculated by SNRHF = −10 log[(2π × fINPUT × tJRMS)2 + 10 ( − SNRLF /10) ] In the equation, the rms aperture jitter represents the clock input jitter specification. Improvements in SNR can be achieved for IF undersampling applications by minimizing the effects of aperture jitter. This can be accomplished by applying a high frequency clock input and using the integrated clock divider to achieve the desired sample rate of the ADC core. Inherently, the jitter performance of the AD9650 improves as the frequency of the clock increases. This is a result of the slew rate of the clock affecting the noise performance of the ADC, where fast transition edges result in the best performance. Figure 92 shows the improvement in SNR for the different clock divide ratios for the 1 V p-p and 2 V p-p sinusoidal clock inputs. Measurements in Figure 92 were taken for the AD9650BCPZ-105 where the input frequency was 141 MHz. The same analysis can be performed for the various speed grades of the AD9650 family of parts. CHANNEL/CHIP SYNCHRONIZATION The AD9650 has a SYNC input that offers the user flexible synchronization options for synchronizing the clock divider. The clock divider sync feature is useful for guaranteeing synchronized sample clocks across multiple ADCs. The input clock divider can be enabled to synchronize on a single occurrence of the SYNC signal or on every occurrence. The SYNC input is internally synchronized to the sample clock; however, to ensure that there is no timing uncertainty between multiple parts, the SYNC input signal should be externally synchronized to the input clock signal, meeting the setup and hold times shown in Table 5. The SYNC input should be driven using a single-ended CMOS-type signal. POWER DISSIPATION AND STANDBY MODE The power dissipated by the AD9650 varies with its sample rate. In CMOS output mode, the digital power dissipation is determined primarily by the strength of the digital drivers and the load on each output bit. The maximum DRVDD current (IDRVDD) can be calculated as IDRVDD = VDRVDD × CLOAD × fCLK × N where N is the number of output bits (32 plus two DCO outputs in the case of the AD9650). This maximum current occurs when every output bit switches on every clock cycle, that is, a full-scale square wave at the Nyquist frequency of fCLK/2. In practice, the DRVDD current is established by the average number of output bits switching, which is Rev. 0 | Page 34 of 44 08919-293 70 AD9650 determined by the sample rate and the characteristics of the analog input signal. Reducing the capacitive load presented to the output drivers reduces digital power consumption. By asserting PDWN (either through the SPI port or by asserting the PDWN pin high), the AD9650 is placed in power-down mode. In this state, the ADC typically dissipates 3.3 mW. During power-down, the output drivers are placed in a high impedance state. Asserting the PDWN pin low returns the AD9650 to its normal operating mode. Low power dissipation in power-down mode is achieved by shutting down the reference, reference buffer, biasing networks, and clock. Internal capacitors are discharged when entering powerdown mode and must be recharged when returning to normal operation. When using the SPI port interface, the user can place the ADC in power-down mode or standby mode. Standby mode allows the user to keep the internal reference circuitry powered when faster wake-up times are required. As detailed in the AN-877 Application Note, Interfacing to High Speed ADCs via SPI, the data format can be selected for offset binary, twos complement, or gray code when using the SPI control. Table 12. SCLK/DFS Mode Selection (External Pin Mode) Voltage at Pin AGND AVDD SCLK/DFS Offset binary (default) Twos complement SDIO/DCS DCS disabled DCS enabled (default) Digital Output Enable Function (OEB) The AD9650 has a flexible three-state ability for the digital output pins. The three-state mode is enabled using the OEB pin or through the SPI. If the OEB pin is low, the output data drivers and DCOs are enabled. If the OEB pin is high, the output data drivers and DCOs are placed in a high impedance state. This OEB function is not intended for rapid access to the data bus. Note that OEB is referenced to the digital output driver supply (DRVDD) and should not exceed that supply voltage. When using the SPI, the data outputs and DCO of each channel can be independently three-stated by using the output enable bar bit (Bit 4) in Register 0x14. DIGITAL OUTPUTS The AD9650 output drivers can be configured to interface with 1.8 V CMOS logic families. The AD9650 can also be configured for LVDS outputs (standard ANSI or reduced output swing mode) using a DRVDD supply voltage of 1.8 V. In CMOS output mode, the output drivers are sized to provide sufficient output current to drive a wide variety of logic families. However, large drive currents tend to cause current glitches on the supplies that may affect converter performance. Applications requiring the ADC to drive large capacitive loads or large fanouts may require external buffers or latches. The default output mode is CMOS, with each channel output on a separate bus, as shown in Figure 2. The output can also be configured for interleaved CMOS via the SPI port. In interleaved CMOS mode, the data for both channels is output through the Channel A output pins, and the Channel B output is placed into high impedance mode. The timing diagram for interleaved CMOS output mode is shown in Figure 3. The output data format can be selected for either offset binary or twos complement by setting the SCLK/DFS pin when operating in the external pin mode (see Table 12). TIMING The AD9650 provides latched data with a pipeline delay of 12 clock cycles. Data outputs are available one propagation delay (tPD) after the rising edge of the clock signal. The length of the output data lines and loads placed on them should be minimized to reduce transients within the AD9650. These transients can degrade converter dynamic performance. The lowest typical conversion rate of the AD9650 is 10 MSPS. At clock rates below 10 MSPS, dynamic performance can degrade. Data Clock Output (DCO) The AD9650 provides two data clock output (DCO) signals intended for capturing the data in an external register. In CMOS output mode, the data outputs are valid on the rising edge of DCO, unless the DCO clock polarity has been changed via the SPI. In LVDS output mode, the DCO and data output switching edges are closely aligned. Additional delay can be added to the DCO output using SPI Register 0x17 to increase the data setup time. In this case, the Channel A output data is valid on the rising edge of DCO, and the Channel B output data is valid on the falling edge of DCO. See Figure 2, Figure 3, and Figure 4 for a graphical timing description of the output modes. Table 13. Output Data Format Input (V) VIN+ − VIN− VIN+ − VIN− VIN+ − VIN− VIN+ − VIN− VIN+ − VIN− Condition (V) < −VREF − 0.5 LSB = −VREF =0V = +VREF − 1.0 LSB > +VREF − 0.5 LSB Offset Binary Output Mode 0000 0000 0000 0000 0000 0000 0000 0000 1000 0000 0000 0000 1111 1111 1111 1111 1111 1111 1111 1111 Twos Complement Mode 1000 0000 0000 0000 1000 0000 0000 0000 0000 0000 0000 0000 0111 1111 1111 1111 0111 1111 1111 1111 ORx 1 0 0 0 1 Rev. 0 | Page 35 of 44 AD9650 BUILT-IN SELF-TEST (BIST) AND OUTPUT TEST The AD9650 includes built-in test features designed to enable verification of the integrity of each channel as well as facilitate board level debugging. A BIST (built-in self-test) feature is included that verifies the integrity of the digital datapath of the AD9650. Various output test options are also provided to place predictable values on the outputs of the AD9650. The outputs are not disconnected during this test; therefore, the PN sequence can be observed as it runs. The PN sequence can be continued from its last value or reset from the beginning, based on the value programmed in Register 0x0E, Bit 2. The BIST signature result varies based on the channel configuration. OUTPUT TEST MODES The output test modes are shown in Table 17. When an output test mode is enabled, the analog section of the ADC is disconnected from the digital back end blocks and the test pattern is run through the output formatting block. Some of the test patterns are subject to output formatting, and some are not. The seed value for the PN sequence tests can be forced if the PN reset bits are used to hold the generator in reset mode by setting Bit 4 or Bit 5 of Register 0x0D. These tests can be performed with or without an analog signal (if present, the analog signal is ignored), but they do require an encode clock. For more information, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. BUILT-IN SELF-TEST (BIST) The BIST is a thorough test of the digital portion of the selected AD9650 signal path. When enabled, the test runs from an internal pseudorandom noise (PN) source through the digital datapath starting at the ADC block output. The BIST sequence runs for 512 cycles and stops. The BIST signature value for Channel A or Channel B is placed in Register 0x24 and Register 0x25. If one channel is chosen, its BIST signature is written to the two registers. If both channels are chosen, the results from Channel A are placed in the BIST signature registers. Rev. 0 | Page 36 of 44 AD9650 SERIAL PORT INTERFACE (SPI) The AD9650 serial port interface (SPI) allows the user to configure the converter for specific functions or operations through a structured register space provided inside the ADC. The SPI gives the user added flexibility and customization, depending on the application. Addresses are accessed via the serial port and can be written to or read from via the port. Memory is organized into bytes that can be further divided into fields, which are documented in the Memory Map section. For detailed operational information, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. The falling edge of the CSB, in conjunction with the rising edge of the SCLK, determines the start of the framing. An example of the serial timing and its definitions can be found in Figure 93 and Table 5. Other modes involving the CSB are available. When the CSB is held low indefinitely, which permanently enables the device, this is called streaming. The CSB can stall high between bytes to allow for additional external timing. When CSB is tied high, SPI functions are placed in high impedance mode. This mode turns on any SPI secondary pin functions. During an instruction phase, a 16-bit instruction is transmitted. Data follows the instruction phase, and its length is determined by the W0 and W1 bits. In addition to word length, the instruction phase determines whether the serial frame is a read or write operation, allowing the serial port to be used both to program the chip and to read the contents of the on-chip memory. The first bit of the first byte in a multibyte serial data transfer frame indicates whether a read command or a write command is issued. If the instruction is a readback operation, performing a readback causes the serial data input/output (SDIO) pin to change direction from an input to an output at the appropriate point in the serial frame. All data is composed of 8-bit words. Data can be sent in MSB-first mode or in LSB-first mode. MSB first is the default on power-up and can be changed via the SPI port configuration register. For more information about this and other features, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. CONFIGURATION USING THE SPI Three pins define the SPI of this ADC: the SCLK/DFS pin, the SDIO/DCS pin, and the CSB pin (see Table 14). The SCLK/DFS (a serial clock) is used to synchronize the read and write data presented from and to the ADC. The SDIO/DCS (serial data input/output) is a dual-purpose pin that allows data to be sent to and read from the internal ADC memory map registers. The CSB (chip select bar) is an active-low control that enables or disables the read and write cycles. Table 14. Serial Port Interface Pins Pin SCLK SDIO Function Serial clock. The serial shift clock input, which is used to synchronize serial interface reads and writes. Serial data input/output. A dual-purpose pin that typically serves as an input or an output, depending on the instruction being sent and the relative position in the timing frame. Chip select bar. An active-low control that gates the read and write cycles. CSB tDS tS CSB tHIGH tDH tLOW tCLK tH SCLK DON’T CARE DON’T CARE SDIO DON’T CARE R/W W1 W0 A12 A11 A10 A9 A8 A7 D5 D4 D3 D2 D1 D0 DON’T CARE Figure 93. Serial Port Interface Timing Diagram Rev. 0 | Page 37 of 44 08919-052 AD9650 HARDWARE INTERFACE The pins described in Table 14 comprise the physical interface between the user programming device and the serial port of the AD9650. The SCLK pin and the CSB pin function as inputs when using the SPI. The SDIO pin is bidirectional, functioning as an input during write phases and as an output during readback. The SPI is flexible enough to be controlled by either FPGAs or microcontrollers. One method for SPI configuration is described in detail in the AN-812 Application Note, Microcontroller-Based Serial Port Interface (SPI) Boot Circuit. The SPI port should not be active during periods when the full dynamic performance of the converter is required. Because the SCLK signal, the CSB signal, and the SDIO signal are typically asynchronous to the ADC clock, noise from these signals can degrade converter performance. If the on-board SPI bus is used for other devices, it may be necessary to provide buffers between this bus and the AD9650 to prevent these signals from transitioning at the converter inputs during critical sampling periods. Some pins serve a dual function when the SPI is not being used. When the pins are strapped to AVDD or ground during device power-on, they are associated with a specific function. The Digital Outputs section describes the strappable functions supported on the AD9650. When the device is in SPI mode, the PDWN and OEB pins remain active. For SPI control of output enable and power-down, the OEB and PDWN pins should be set to their default states. Table 15. Mode Selection Pin SDIO/DCS SCLK/DFS OEB PDWN External Voltage AVDD (default) AGND AVDD AGND (default) AVDD AGND (default) AVDD AGND (default) Configuration Duty cycle stabilizer enabled Duty cycle stabilizer disabled Twos complement enabled Offset binary enabled Outputs in high impedance Outputs enabled Chip in power-down or standby Normal operation SPI ACCESSIBLE FEATURES Table 16 provides a brief description of the general features that are accessible via the SPI. These features are described in detail in the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. The AD9650 part-specific features are described in detail following Table 17, the external memory map register table. Table 16. Features Accessible Using the SPI Feature Name Mode Clock Description Allows the user to set either power-down mode or standby mode Allows the user to access the DCS, set the clock divider, set the clock divider phase, and enable the sync Allows the user to digitally adjust the converter offset Allows the user to set test modes to have known data on output bits Allows the user to set the output mode, including LVDS Allows the user to set the output clock polarity Allows the user to vary the DCO delay Allows the user to set the reference voltage CONFIGURATION WITHOUT THE SPI In applications that do not interface to the SPI control registers, the SDIO/DCS pin, the SCLK/DFS pin, the OEB pin, and the PDWN pin serve as standalone CMOS-compatible control pins. When the device is powered up, it is assumed that the user intends to use the pins as static control lines for the duty cycle stabilizer, output data format, output enable, and power-down feature control. In this mode, the CSB chip select bar should be connected to AVDD, which disables the serial port interface. Offset Test I/O Output Mode Output Phase Output Delay VREF Rev. 0 | Page 38 of 44 AD9650 MEMORY MAP READING THE MEMORY MAP REGISTER TABLE Each row in the memory map register table has eight bit locations. The memory map is roughly divided into four sections: the chip configuration registers (Address 0x00 to Address 0x02); the channel index and transfer registers (Address 0x05 and Address 0xFF); the ADC functions registers, including setup, control, and test (Address 0x08 to Address 0x30); and the digital feature control register (Address 0x100). The memory map register table (see Table 17) documents the default hexadecimal value for each hexadecimal address shown. The column with the heading Bit 7 (MSB) is the start of the default hexadecimal value given. For more information on this function and others, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. This application note details the functions controlled by Register 0x00 to Register 0xFF. The remaining register, Register 0x100, is documented in the Memory Map Register Table section. • • “Bit is set” is synonymous with “bit is set to Logic 1” or “writing Logic 1 for the bit.” “Clear a bit” is synonymous with “bit is set to Logic 0” or “writing Logic 0 for the bit.” Transfer Register Map Address 0x08 through Address 0x18 and Address 0x30 are shadowed. Writes to these addresses do not affect part operation until a transfer command is issued by writing 0x01 to Address 0xFF, setting the transfer bit. This allows these registers to be updated internally and simultaneously when the transfer bit is set. The internal update takes place when the transfer bit is set, and the bit autoclears. Channel-Specific Registers Some channel setup functions, such as the signal monitor thresholds, can be programmed differently for each channel. In these cases, channel address locations are internally duplicated for each channel. These registers and bits are designated in Table 17 as local. These local registers and bits can be accessed by setting the appropriate Channel A or Channel B bits in Register 0x05. If both bits are set, the subsequent write affects the registers of both channels. In a read cycle, only Channel A or Channel B should be set to read one of the two registers. If both bits are set during an SPI read cycle, the part returns the value for Channel A. Registers and bits designated as global in Table 17 affect the entire part or the channel features for which independent settings are not allowed between channels. The settings in Register 0x05 do not affect the global registers and bits. Open Locations All address and bit locations that are not included in Table 17 are not currently supported for this device. Unused bits of a valid address location should be written with 0s. Writing to these locations is required only when part of an address location is open (for example, Address 0x17). Default Values After the AD9650 is reset, critical registers are loaded with default values. The default values for the registers are given in the memory map register table, Table 17. Logic Levels An explanation of logic level terminology follows: Rev. 0 | Page 39 of 44 AD9650 MEMORY MAP REGISTER TABLE All address and bit locations that are not included in Table 17 are not currently supported for this device. Table 17. Memory Map Registers Address Register Bit 7 (Hex) Name (MSB) Chip Configuration Registers 0 0x00 SPI port configuration (global) Bit 6 LSB first Bit 5 Soft reset Bit 4 1 Bit 3 1 Bit 2 Soft reset Bit 1 LSB first Bit 0 (LSB) 0 Default Value (Hex) 0x18 Default Notes/ Comments The nibbles are mirrored so that LSBfirst mode or MSB-first mode registers correctly, regardless of shift mode. Read only. Speed grade ID used to differentiate devices; read only. 0x03 Bits are set to determine which device on the chip receives the next write command; applies to local registers only. Synchronously transfers data from the master shift register to the slave. Determines various generic modes of chip operation. 0x01 0x02 Chip ID (global) Chip grade (global) Open 8-bit Chip ID[7:0] (AD9650 = 0x32, default) Speed grade ID Open Open 001 = 105 MSPS 010 = 80 MSPS 011 = 65 MSPS 100 = 25 MSPS Open Open Open Open Open 0x32 Open Open Channel Index and Transfer Registers 0x05 Channel Open index Data Channel B (default) Data Channel A (default) 0xFF Transfer Open Open Open Open Open Open Open Transfer 0x00 ADC Functions 0x08 Power modes (local) 1 Open External powerdown pin function (local) 0 = pdwn 1 = stndby Open Open 0x09 Global clock (global) Open Open Open Open Open 0x0B Clock divide (global) Open Open Open Open Open Internal powerdown mode (local) 00 = normal operation 01 = full powerdown 10 = standby 11 = normal operation Open Open Duty cycle stabilizer (default) Clock divide ratio 000 = divide by 1 001 = divide by 2 010 = divide by 3 011 = divide by 4 100 = divide by 5 101 = divide by 6 110 = divide by 7 111 = divide by 8 Open 0x80 0x01 0x00 Clock divide values other than 000 automatically cause the duty cycle stabilizer to become active. Rev. 0 | Page 40 of 44 AD9650 Address (Hex) 0x0D Register Name Test mode (local) Bit 7 (MSB) Open Bit 6 Open Bit 5 Reset PN long gen Bit 2 Bit 1 Output test mode 000 = off (default) 001 = midscale short 010 = positive FS 011 = negative FS 100 = alternating checkerboard 101 = PN long sequence 110 = PN short sequence 111 = one/zero word toggle Open Open Open Reset BIST Open BIST sequence enable Open Open Open Open Open Commonmode servo enable Offset adjust in LSBs from +127 to −128 (twos complement format) CMOS Output Open Output Output format output enable (must be invert 00 = offset binary written (local) interleave bar 01 = twos (local) low) enable complement (global) 01 = gray code 11 = offset binary (local) Open Open Input clock divider phase adjust 000 = no delay 001 = 1 input clock cycle 010 = 2 input clock cycles 011 = 3 input clock cycles 100 = 4 input clock cycles 101 = 5 input clock cycles 110 = 6 input clock cycles 111 = 7 input clock cycles DCO clock delay (delay = 2500 ps × register value/31) 00000 = 0 ps 00001 = 81 ps 00010 = 161 ps … 11110 = 2419 ps 11111 = 2500 ps BIST signature[7:0] Open Bit 4 Reset PN short gen Bit 3 Open Bit 0 (LSB) Default Value (Hex) 0x00 Default Notes/ Comments When this register is set, the test data is placed on the output pins in place of normal data. 0x0E 0x0F BIST enable (global) ADC input (global) Open Open Open Open 0x04 0x00 0x10 0x14 Offset adjust (local) Output mode 0x00 0x00 Configures the outputs and the format of the data. 0x16 Clock phase control (global) Drive strength 0 = ANSI LVDS; 1= reduced swing LVDS (global) Invert DCO clock Output type 0 = CMOS 1 = LVDS (global) Open 0x00 Allows selection of clock delays into the input clock divider. 0x17 DCO output delay (global) Open Open Open 0x00 0x24 BIST signature LSB (local) 0x25 BIST signature MSB (local) 0x30 Dither enable (local) Digital Feature Control 0x100 SYNC control (global) 0x00 0x00 Read only. Read only. BIST signature[15:8] Open Open Open Dither enable Open Open Open Open Open 0x00 Open Open Open Open Clock divider next SYNC only Clock divider SYNC enable Master SYNC enable 0x00 Rev. 0 | Page 41 of 44 AD9650 MEMORY MAP REGISTER DESCRIPTIONS For additional information about functions controlled in Register 0x00 to Register 0xFF, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. Bit 1—Clock Divider SYNC Enable Bit 1 gates the SYNC pulse to the clock divider. The SYNC signal is enabled when Bit 1 is high and Bit 0 is high. This is continuous SYNC mode. SYNC Control (Register 0x100) Bits[7:3]—Reserved Bit 2—Clock Divider Next SYNC Only If the master SYNC enable bit (Address 0x100, Bit 0) and the clock divider SYNC enable bit (Address 0x100, Bit 1) are high, Bit 2 allows the clock divider to synchronize to the first SYNC pulse it receives and to ignore the rest. The clock divider SYNC enable bit (Address 0x100, Bit 1) resets after it synchronizes. Bit 0—Master SYNC Enable Bit 0 must be high to enable any of the SYNC functions. If the SYNC capability is not used, this bit should remain low to conserve power. Rev. 0 | Page 42 of 44 AD9650 APPLICATIONS INFORMATION DESIGN GUIDELINES Before starting design and layout of the AD9650 as a system, it is recommended that the designer become familiar with these guidelines, which discuss the special circuit connections and layout requirements that are needed for certain pins. The copper plane should have several vias to achieve the lowest possible resistive thermal path for heat dissipation to flow through the bottom of the PCB. These vias should be filled or plugged to prevent solder wicking through the vias, which can compromise the connection. To maximize the coverage and adhesion between the ADC and the PCB, a silkscreen should be overlaid to partition the continuous plane on the PCB into several uniform sections. This provides several tie points between the ADC and the PCB during the reflow process. Using one continuous plane with no partitions guarantees only one tie point between the ADC and the PCB. For detailed information about packaging and PCB layout of chip scale packages, see the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP), at www.analog.com. Power and Ground Recommendations When connecting power to the AD9650, it is recommended that two separate 1.8 V supplies be used. Use one supply for the analog outputs (AVDD); use a separate supply for the digital outputs (DRVDD). For both AVDD and DRVDD, several different decoupling capacitors should be used to cover both high and low frequencies. Place these capacitors close to the point of entry at the PCB level and close to the pins of the part, with minimal trace length. A single PCB ground plane should be sufficient when using the AD9650. With proper decoupling and smart partitioning of the PCB analog, digital, and clock sections, optimum performance is easily achieved. VCM The VCM pin should be decoupled to ground with a 0.1 μF capacitor, as shown in Figure 80. LVDS Operation The AD9650 defaults to CMOS output mode on power-up. If LVDS operation is desired, this mode must be programmed, using the SPI configuration registers after power-up. When the AD9650 powers up in CMOS mode with LVDS termination resistors (100 Ω) on the outputs, the DRVDD current can be higher than the typical value until the part is placed in LVDS mode. This additional DRVDD current does not cause damage to the AD9650, but it should be taken into account when considering the maximum DRVDD current for the part. To avoid this additional DRVDD current, the AD9650 outputs can be disabled at power-up by taking the OEB pin high. After the part is placed in LVDS mode via the SPI port, the OEB pin can be taken low to enable the outputs. RBIAS The AD9650 requires that a 10 kΩ resistor be placed between the RBIAS pin and ground. This resistor sets the master current reference of the ADC core and should have at least a 1% tolerance. Reference Decoupling The VREF pin should be externally decoupled to ground with a low ESR, 1.0 μF capacitor in parallel with a low ESR, 0.1 μF ceramic capacitor. SPI Port The SPI port should not be active during periods when the full dynamic performance of the converter is required. Because the SCLK, CSB, and SDIO signals are typically asynchronous to the ADC clock, noise from these signals can degrade converter performance. If the on-board SPI bus is used for other devices, it may be necessary to provide buffers between this bus and the AD9650 to keep these signals from transitioning at the converter inputs during critical sampling periods. Exposed Paddle Thermal Heat Slug Recommendations It is mandatory that the exposed paddle on the underside of the ADC be connected to analog ground (AGND) to achieve the best electrical and thermal performance. A continuous, exposed (no solder mask) copper plane on the PCB should mate to the AD9650 exposed paddle, Pin 0. Rev. 0 | Page 43 of 44 AD9650 OUTLINE DIMENSIONS 9.00 BSC SQ 0.60 MAX 0.60 MAX 48 PIN 1 INDICATOR 49 64 1 PIN 1 INDICATOR TOP VIEW 8.75 BSC SQ 0.50 BSC EXPOSED PAD (BOTTOM VIEW) 7.65 7.50 SQ 7.35 0.50 0.40 0.30 12° MAX 0.80 MAX 0.65 TYP 0.05 MAX 0.02 NOM 0.30 0.23 0.18 0.20 REF 33 32 16 17 7.50 REF 0.25 MIN 1.00 0.85 0.80 SEATING PLANE FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4 Figure 94. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 9 mm × 9 mm Body, Very Thin Quad (CP-64-6) Dimensions shown in millimeters ORDERING GUIDE Model 1 AD9650BCPZ-25 AD9650BCPZRL7-25 AD9650BCPZ-65 AD9650BCPZRL7-65 AD9650BCPZ-80 AD9650BCPZRL7-80 AD9650BCPZ-105 AD9650BCPZRL7-105 AD9650-25EBZ AD9650-65EBZ AD9650-80EBZ AD9650-105EBZ 1 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Description 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Evaluation Board Evaluation Board Evaluation Board Evaluation Board Z = RoHS Compliant Part. ©2010 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08919-0-7/10(0) Rev. 0 | Page 44 of 44 041509-A Package Option CP-64-6 CP-64-6 CP-64-6 CP-64-6 CP-64-6 CP-64-6 CP-64-6 CP-64-6