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AD9864BCPZ

AD9864BCPZ

  • 厂商:

    AD(亚德诺)

  • 封装:

    LFCSP48_7X7MM_EP

  • 描述:

    中频数字化子系统48LFCSP

  • 数据手册
  • 价格&库存
AD9864BCPZ 数据手册
IF Digitizing Subsystem AD9864 Data Sheet FEATURES GENERAL DESCRIPTION 10 MHz to 300 MHz input frequency 6.8 kHz to 270 kHz output signal bandwidth 7.5 dB single sideband noise figure (SSB NF) −7.0 dBm input third-order intercept (IIP3) AGC free range up to −34 dBm 12 dB continuous AGC range 16 dB front-end attenuator Baseband I/Q 16-bit (or 24-bit) serial digital output LO and sampling clock synthesizers Programmable decimation factor, output format, AGC, and synthesizer settings 370 Ω input impedance 2.7 V to 3.6 V supply voltage Low current consumption: 17 mA 48-lead LFCSP package The AD98641 is a general-purpose IF subsystem that digitizes a low level, 10 MHz to 300 MHz IF input with a signal bandwidth ranging from 6.8 kHz to 270 kHz. The signal chain of the AD9864 consists of a low noise amplifier (LNA), a mixer, a band-pass Σ-∆ analog-to-digital converter (ADC), and a decimation filter with programmable decimation factor. An automatic gain control (AGC) circuit gives the AD9864 12 dB of continuous gain adjustment. Auxiliary blocks include both clock and local oscillator (LO) synthesizers. The high dynamic range of the AD9864 and inherent antialiasing provided by the band-pass Σ-∆ converter allow the device to cope with blocking signals up to 95 dB stronger than the desired signal. This attribute often reduces the cost of a radio by reducing IF filtering requirements. Also, it enables multimode radios of varying channel bandwidths, allowing the IF filter to be specified for the largest channel bandwidth. APPLICATIONS The SPI port programs numerous parameters of the AD9864, allowing the device to be optimized for any given application. Programmable parameters include synthesizer divide ratios, AGC attenuation and attack/decay time, received signal strength level, decimation factor, output data format, 16 dB attenuator, and the selected bias currents. Multimode narrow-band radio products Analog/digital UHF/VHF FDMA receivers TETRA, APCO25, GSM/EDGE Portable and mobile radio products SATCOM terminals The AD9864 is available in a 48-lead LFCSP package and operates from a single 2.7 V to 3.6 V supply. The total power consumption is typically 56 mW and a power-down mode is provided via serial interfacing. FUNCTIONAL BLOCK DIAGRAM MXOP MXON IF2P IF2N GCP GCN DAC AD9864 AGC –16dB IFIN LNA DECIMATION FILTER Σ-Δ ADC FORMATTING/SSI DOUTA DOUTB FS CLKOUT FREF CONTROL LOGIC LO SYN LOP LON LO VCO AND LOOP FILTER IOUTC CLKP CLKN VREFP VCM VREFN SPI PC PD PE SYNCB 04319-0-001 IOUTL VOLTAGE REFERENCE CLK SYN LOOP FILTER Figure 1. 1 Protected by U.S. Patent No. 5,969,657; other patents pending. Rev. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2003–2016 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com AD9864 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1  SSI Control Registers ................................................................. 21  Applications ....................................................................................... 1  Synchronization Using SYNCB ................................................ 24  General Description ......................................................................... 1  Interfacing to DSPs .................................................................... 24  Functional Block Diagram .............................................................. 1  Power Control ............................................................................. 24  Revision History ............................................................................... 2  LO Synthesizer ............................................................................ 25  Specifications..................................................................................... 3  Clock Synthesizer ....................................................................... 26  Digital Specifications ................................................................... 5  IF LNA/Mixer ............................................................................. 28  Absolute Maximum Ratings............................................................ 6  Band-Pass Σ-Δ ADC .................................................................. 29  Thermal Resistance ...................................................................... 6  Decimation Filter ....................................................................... 32  ESD Caution .................................................................................. 6  Pin Configuration and Functional Descriptions .......................... 7  Variable Gain Amplifier Operation with Automatic Gain Control ............................................................................... 33  Typical Performance Characteristics ............................................. 9  Applications Considerations ..................................................... 38  Terminology .................................................................................... 14  External Passive Component Requirements .......................... 40  Serial Peripheral Interface (SPI) ................................................... 15  Applications ................................................................................ 40  Theory of Operation ...................................................................... 17  Layout Example, Evaluation Board, and Software ................. 45  Introduction ................................................................................ 17  SPI Initialization Example ......................................................... 45  Serial Port Interface (SPI) .......................................................... 18  Device SPI Initialization ............................................................ 46  Power-On Reset .......................................................................... 19  Outline Dimensions ....................................................................... 47  Synchronous Serial Interface (SSI) ........................................... 19  Ordering Guide .......................................................................... 47 REVISION HISTORY 2/16—Rev. 0 to Rev. A Changes to Figure 2 .......................................................................... 7 Changes to Typical Performance Characteristics Section ........... 9 Changes to Figure 19 ...................................................................... 11 Changes to Table 6 .......................................................................... 16 Changed General Description Section to Introduction Section ... 17 Changes to Serial Port Interface (SPI) Section ........................... 18 Added Figure 31; Renumbered Sequentially .............................. 19 Added Power-On Reset Section ................................................... 19 Deleted Table 9; Renumbered Sequentially ................................ 19 Added SSI Control Registers Section and Table 8 to Table 13 .... 21 Changes to Synchronization Using SYNCB Section and Figure 38 .......................................................................................... 24 Changes to Clock Synthesizer Section ......................................... 26 Changes to Band-Pass Σ-Δ ADC Section and Table 20 ............ 30 Changes to Table 21 ....................................................................... 31 Changes to Variable Gain Control Section ................................. 34 Deleted Table 17 ............................................................................. 34 Added Figure 64 ............................................................................. 36 Changes to Figure 72...................................................................... 40 Changes to Layout Example, Evaluation Board, and Software Section ............................................................................. 45 Added Figure 77 and SPI Initialization Example Section ......... 45 Added Device SPI Initialization Section and Table 24 .............. 46 Updated Outline Dimensions ....................................................... 47 Changes to Ordering Guide .......................................................... 47 8/03—Revision 0: Initial Version Rev. A | Page 2 of 47 Data Sheet AD9864 SPECIFICATIONS VDDI = VDDF = VDDA = VDDC = VDDL = VDDH = 2.7 V to 3.6 V, VDDQ = VDDP = 2.7 V to 5.5 V, fCLK = 18 MSPS, fIF = 109.65 MHz, fLO = 107.4 MHz, fREF = 16.8 MHz, unless otherwise noted. Standard operating mode: VGA at minimum attenuation setting, synthesizers in normal (not fast acquire) mode, decimation factor = 900, 16-bit digital output, and 10 pF load on SSI output pins. Table 1. Parameter SYSTEM DYNAMIC PERFORMANCE1 SSB Noise Figure at Minimum VGA Attenuation2, 3 SSB Noise Figure at Maximum VGA Attenuation2, 3 Dynamic Range with AGC Enabled2, 3 IF Input Clip Point at Maximum VGA Attenuation3 IF Input Clip Point at Minimum VGA Attenuation3 Input Third-Order Intercept (IIP3) Gain Variation over Temperature LNA + MIXER Maximum RF and LO Frequency Range LNA Input Impedance Mixer LO Input Resistance LO SYNTHESIZER LO Input Frequency LO Input Amplitude FREF Frequency (for Sinusoidal Input Only) FREF Input Amplitude FREF Slew Rate Minimum Charge Pump Current at 5 V4 Maximum Charge Pump Current at 5 V4 Charge Pump Output Compliance5 Synthesizer Resolution CLOCK SYNTHESIZER CLK Input Frequency CLK Input Amplitude Minimum Charge Pump Output Current4 Maximum Charge Pump Output Current4 Charge Pump Output Compliance5 Synthesizer Resolution Σ-∆ ADC Resolution Clock Frequency (fCLK) Center Frequency Pass-Band Gain Variation Alias Attenuation GAIN CONTROL Programmable Gain Step AGC Gain Range GCP Output Resistance Temperature Test Level Full Full Full Full Full Full Full IV IV IV IV IV IV IV Full 25°C 25°C IV V V 300 Full Full Full Full Full Full Full Full Full IV IV IV IV IV VI VI VI IV 7.75 0.3 8 0.3 7.5 0.4 6.25 VDDP − 0.4 Full Full Full Full Full Full IV IV VI VI VI VI 13 0.3 26 VDDC 0.4 2.2 VDDQ − 0.4 Full Full Full Full Full IV IV V IV IV 16 13 24 26 Full Full Full V V IV Rev. A | Page 3 of 47 Min 91 −20 −32 −12 Typ Max Unit 7.5 13 95 −19 −31 −7.0 0.7 9.5 dB dB dB dBm dBm dBm dB 2 500 370||1.4 1 MHz Ω||pF kΩ 300 2.0 26 3 0.67 5.3 0.67 5.3 fCLK/8 1.0 80 50 16 12 72.5 95 MHz V p-p MHz V p-p V/µs mA mA V kHz MHz V p-p mA mA V kHz Bits MHz MHz dB dB dB dB kΩ AD9864 Parameter OVERALL Analog Supply Voltage (VDDA, VDDF, VDDI) Digital Supply Voltage (VDDD, VDDC, VDDL) Interface Supply Voltage (VDDH)6 Charge Pump Supply Voltage (VDDP, VDDQ) Total Current Operation Mode7 Standby OPERATING TEMPERATURE RANGE Data Sheet Temperature Test Level Min Typ Max Unit Full Full Full Full VI VI VI VI 2.7 2.7 1.8 2.7 3.0 3.0 3.6 3.6 3.6 5.5 V V V V Full Full VI VI +85 mA mA °C 5.0 17 0.01 −40 This includes 0.9 dB loss of matching network. AGC with DVGA enabled. 3 Measured in 10 kHz bandwidth. 4 Programmable in 0.67 mA steps. 5 Voltage span in which LO (or CLK) charge pump output current is maintained within 5% of nominal value of VDDP/2 (or VDDQ/2). 6 VDDH must be less than VDDD + 0.5 V. 7 Clock VCO off and additional 0.7 mA with VGA at maximum attenuation. 1 2 Rev. A | Page 4 of 47 Data Sheet AD9864 DIGITAL SPECIFICATIONS VDDI = VDDF = VDDA = VDDC = VDDL = VDDH = 2.7 V to 3.6 V, VDDQ = VDDP = 2.7 V to 5.5 V, fCLK = 18 MSPS, fIF = 109.65 MHz, fLO = 107.4 MHz, fREF = 16.8 MHz, unless otherwise noted. Standard operating mode: VGA at minimum attenuation setting, synthesizers in normal (not fast acquire) mode, decimation factor = 900, 16-bit digital output, and 10 pF load on SSI output pins. Table 2. Parameter DECIMATOR Decimation Factor1 Pass-Band Width Pass-Band Gain Variation Alias Attenuation SPI READ OPERATION (See Figure 30) PC Clock Frequency PC Clock Period (tCLK) PC Clock High (tHI) PC Clock Low (tLOW) PC to PD Setup Time (tDS) PC to PD Hold Time (tDH) PE to PC Setup Time (tS) PC to PE Hold Time (tH) SPI WRITE OPERATION2 (See Figure 29) PC Clock Frequency PC Clock Period (tCLK) PC Clock High (tHI) PC Clock Low (tLOW) PC to PD Setup Time (tDS) PC to PD Hold Time (tDH) PC to PD (or DOUTB) Data Valid Time (tDV) PE to PD Output Valid to High-Z (tEZ) SSI2 (See Figure 33) CLKOUT Frequency CLKOUT Period (tCLK) CLKOUT Duty Cycle (tHI, tLOW) CLKOUT to FS Valid Time (tV) CLKOUT to DOUT Data Valid Time (tDV) CMOS LOGIC INPUTS3 Logic 1 Voltage (VIH) Logic 0 Voltage (VIL) Logic 1 Current (IIH) Logic 0 Current (IIL) Input Capacitance CMOS LOGIC OUTPUTS2, 3, 4 Logic 1 Voltage (VOH) Logic 0 Voltage (VOL) Temperature Test Level Min Full Full Full Full IV V IV IV 48 Full Full Full Full Full Full Full Full IV IV IV IV IV IV IV IV Full Full Full Full Full Full Full Full IV IV IV IV IV IV IV IV 100 45 45 2 2 3 Full Full Full Full Full IV IV IV IV IV 0.867 38.4 33 −1 −1 Full Full Full Full Full IV IV IV IV IV 0.7 × VDDH Full Full IV IV VDDH − 0.2 Programmable in steps of 48 or 60. CMOS output mode with CLOAD = 10 pF and drive strength = 7. 3 Absolute maximum and minimum input/output levels are VDDH + 0.3 V and −0.3 V. 4 IOL = 1 mA; specification is also dependent on drive strength setting. 1 2 Rev. A | Page 5 of 47 Typ Max Unit 960 50% 1.2 88 10 MHz ns ns ns ns ns ns ns 10 MHz ns ns ns ns ns ns ns 26 1153 67 +1 +1 MHz ns ns ns ns 100 45 45 2 2 5 5 8 50 fCLKOUT dB dBm 0.3 × VDDH 10 10 3 0.2 V V µA µA pF V V AD9864 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 3. AD9864 Absolute Maximum Ratings Parameter VDDF, VDDA, VDDC, VDDD, VDDH, VDDL, VDDI VDDF, VDDA, VDDC, VDDD, VDDH, VDDL, VDDI VDDP, VDDQ GNDF, GNDA, GNDC, GNDD, GNDH, GNDL, GNDI, GNDQ, GNDP, GNDS MXOP, MXON, LOP, LON, IFIN, CXIF, CXVL, CXVM PC, PD, PE, CLKOUT, DOUTA, DOUTB, FS, SYNCB IF2N, IF2P, GCP, GCN With Respect To GNDF, GNDA, GNDC, GNDD, GNDH, GNDL, GNDI, GNDS VDDR, VDDA, VDDC, VDDD, VDDH, VDDL, VDDI GNDP, GNDQ GNDF, GNDA, GNDC, GNDD, GNDH, GNDL, GNDI, GNDQ, GNDP, GNDS GNDH VFEFP, VREGN, RREF GNDA IOUTC GNDQ IOUTL GNDP CLKP, CLKN GNDC FREF GNDL Maximum Junction Temperature Storage Temperature Maximum Lead Temperature GNDH GNDF Rating −0.3 to +4.0 −4.0 V to +4.0 V −0.3 V to +6.0 V −0.3 V to +0.3 V −0.3 V to VDDI + 0.3 V −0.3 V to VDDH + 0.3 V Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, θJA is specified for device soldered in circuit board for surface-mount packages. Table 4. Thermal Resistance Package Type 48-Lead LFCSP −0.3 V to VDDF + 0.3 V −0.3 V to VDDA + 0.3 V −0.3 V to VDDQ + 0.3 V −0.3 V to VDDP + 0.3 V −0.3 V to VDDC + 0.3 V −0.3 V to VDDL + 0.3 V 150°C ESD CAUTION −65°C to +150°C 300°C Rev. A | Page 6 of 47 θJA 29.5 Unit °C/W Data Sheet AD9864 GNDP IOUTL VDDP VDDL CXVM LOP LON GNDI CXVL IFIN CXIF VDDI PIN CONFIGURATION AND FUNCTIONAL DESCRIPTIONS 48 47 46 45 44 43 42 41 40 39 38 37 MXOP 1 36 GNDL PIN 1 IDENTIFIER MXON 2 35 FREF GNDF 3 34 GNDS IF2N 4 33 SYNCB IF2P 5 VDDF 6 32 GNDH AD9864 31 FS TOP VIEW (Not to Scale) GCP 7 GCN 8 30 DOUTB 29 DOUTA VDDA 9 GNDA 10 28 CLKOUT 27 VDDH VREFP 11 VREFN 12 26 VDDD 25 PE NOTES 1. EXPOSED PAD. THE BACKSIDE PADDLE CONTACT IS NOT CONNECTED TO GROUND. A PCB GROUND PAD IS OPTIONAL. Figure 2. 48-Lead LFCSP Pin Configuration Table 5. 48-Lead Lead Frame Chip Scale Package (LFCSP) Pin Function Descriptions Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Mnemonic MXOP MXON GNDF IF2N IF2P VDDF GCP GCN VDDA GNDA VREFP VREFN RREF VDDQ IOUTC GNDQ VDDC GNDC CLKP CLKN GNDS GNDD PC PD PE VDDD VDDH CLKOUT DOUTA DOUTB FS Description Mixer Output, Positive. Mixer Output, Negative. Ground for Front End of ADC. Second IF Input (to ADC), Negative. Second IF Input (to ADC), Positive. Positive Supply for Front End of ADC. Filter Capacitor for ADC Full-Scale Control. Full-Scale Control Ground. Positive Supply for ADC Back End. Ground for ADC Back End. Voltage Reference, Positive. Voltage Reference, Negative. Reference Resistor: Requires 100 kΩ to GNDA. Positive Supply for Clock Synthesizer. Clock Synth Charge Pump Out Current. Ground for Clock Synthesizer Charge Pump. Positive Supply for Clock Synthesizer. Ground for Clock Synthesizer. Sampling Clock Input/Clock VCO Tank, Positive. Sampling Clock Input/Clock VCO Tank, Negative. Substrate Ground. Ground for Digital Functions. Clock Input for SPI Port. Data I/O for SPI Port. Enable Input for SPI Port. Positive Supply for Internal Digital. Positive Supply for Digital Interface. Clock Output for SSI Port. Data Output for SSI Port. Data Output for SSI Port (Inverted) or SPI Port. Frame Sync for SSI Port. Rev. A | Page 7 of 47 04319-0-002 PD PC GNDD CLKN GNDS CLKP GNDC VDDC GNDQ IOUTC RREF VDDQ 13 14 15 16 17 18 19 20 21 22 23 24 AD9864 Pin No. 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 Data Sheet Mnemonic GNDH SYNCB GNDS FREF GNDL GNDP IOUTL VDDP VDDL CXVM LON LOP CXVL GNDI CXIF IFIN VDDI EPAD Description Ground for Digital Interface. Resets SSI and Decimator Counters; Active Low. Connect to VDDH if unused. Substrate Ground. Reference Frequency Input for Both Synthesizers. Ground for LO Synthesizer. Ground for LO Synthesizer Charge Pump. LO Synthesizer Charge Pump Out Current. Positive Supply for LO Synthesizer Charge Pump. Positive Supply for LO Synthesizer. External Filter Capacitor; DC Output of LNA. LO Input to Mixer and LO Synthesizer, Negative. LO Input to Mixer and LO Synthesizer, Positive. External Bypass Capacitor for LNA Power Supply. Ground for Mixer and LNA. External Capacitor for Mixer V-I Converter Bias. First IF Input (to LNA). Positive Supply for LNA and Mixer. Exposed Pad. The backside paddle contact is not connected to ground. A PCB ground pad is optional. Rev. A | Page 8 of 47 Data Sheet AD9864 TYPICAL PERFORMANCE CHARACTERISTICS VDDI = VDDF = VDDA = VDDC = VDDL = VDDH = VDDx , VDDQ = VDDP = 2.7 V to 5.5 V, fCLK = 18 MSPS, fIF = 109.65 MHz, fLO = 107.4 MHz, fREF = 16.8 MHz, TA=25 Co, LO and CLK synthesizer disabled, 16-bit data with AGC and DVGA enabled, unless otherwise noted. 0 9.5 9.0 –2 +85°C –4 IIP3 (dBm) 8.0 +25°C 7.5 +85°C –6 +25°C –8 –40°C –40°C –10 6.5 3.0 3.3 3.6 VDDx (V) –12 04319-0-003 6.0 2.7 3.0 2.7 Figure 6. IIP3 vs. Supply 98 –17.5 97 –18.0 DR (dB) INPUT CLIP POINT (dBm) +25°C 96 –40°C 95 +85°C –18.5 +85°C –19.0 +25°C –19.5 –40°C –20.0 93 3.0 3.3 3.6 VDDx (V) –20.5 2.7 04319-0-004 92 2.7 3.6 VDDx (V) Figure 3. SSB Noise Figure vs. Supply 94 3.3 04319-0-006 7.0 3.0 3.3 3.6 VDDx (V) Figure 4. Dynamic Range (DR) vs. Supply Figure 7. Maximum VGA Attenuation Clip Point vs. Supply –29.5 0.1 0 GAIN VARIATION (dB) –0.1 –30.5 +85°C +25°C 3.3 VDDx (V) –0.4 –0.5 –0.7 –40°C 3.0 –0.3 –0.6 –31.5 –32.0 2.7 –0.2 3.6 Figure 5. Minimum VGA Attenuation Clip Point vs. Supply –0.8 –20 –17 –14 –11 –8 –5 LO DRIVE (dBm) Figure 8. Normalized Gain Variation vs. LO Drive (VDDx = 3.0 V) Rev. A | Page 9 of 47 04319-0-008 –31.0 04319-0-005 INPUT CLIP POINT (dBm) –30.0 04319-0-007 NF (dB) 8.5 AD9864 Data Sheet VDDI = VDDF = VDDA = VDDC = VDDL = VDDH = 3.0 V , VDDQ = VDDP = 2.7 V to 5.5 V, fCLK = 18 MSPS, fIF = 109.65 MHz, fLO = 107.4 MHz, fREF = 16.8 MHz, TA=25 Co, LO and CLK synthesizer disabled, unless otherwise noted. –10 –15 –40 7.8 –50 IMD 7.6 –60 7.4 7.2 –10 –15 0 –5 5 –33 –80 –36 –36 –33 –30 –27 –24 –21 –18 –15 –12 Figure 9. Noise Figure and IMD vs. LO Drive (VDDx = 3.0 V) –61 2.7V 2.7V –27 3.0V –85 –30 3.3V –91 –97 –33 –36 3.6V –39 –42 –28 –26 –24 –22 –20 –18 –16 –14 04319-0-010 –109 IFIN (dBm) –115 –51 –48 –45 –42 –39 –36 –33 –45 –30 IFIN (dBm) Figure 10. Gain Compression vs. IFIN Figure 13. IMD vs. IFIN 10.0 10.0 16-BIT I/Q DATA 9.5 NOISE FIGURE (dB) 16-BIT I/Q DATA WITH DVGA ENABLED 9.0 8.5 16-BIT DATA 9.0 16-BIT DATA WITH DVGA ENABLED 8.5 8.0 24-BIT I/Q DATA 24-BIT DATA 100 CHANNEL BANDWIDTH (kHz) 1000 04319-0-011 7.5 10 –24 –103 –12 8.0 –21 –79 IMD (dBm) 3.0V –18 PIN –73 –10 9.5 –0 –15 –67 –6 –14 –30 –3 –55 3.3V –8 –6 Figure 12. Gain Compression vs. IFIN with 16 dB LNA Attenuator Enabled 3.6V –4 –9 IFIN (dBm) ADC DOES NOT GO INTO HARD COMPRESSION –2 dBFS –30 –70 LO DRIVE (dBm) 0 –27 Figure 11. Noise Figure vs. Bandwidth (Minimum Attenuation, fCLK = 13 MSPS) 7.5 10 100 CHANNEL BANDWIDTH (kHz) Figure 14. Noise Figure vs. Bandwidth (Minimum Attenuation, fCLK = 18 MSPS) Rev. A | Page 10 of 47 1000 04319-0-014 7.0 –20 –24 04319 0 013 8.0 –21 04319-0-012 NF PIN (dBFS) –30 8.2 –18 dBm –20 8.4 NOISE FIGURE (dB) NOISE FIGURE (dBc) 8.6 –12 IMD WITH IFIN = –36 dBm (dBc) 8.8 0 04319-0-009 9.0 Data Sheet AD9864 VDDI = VDDF = VDDA = VDDC = VDDL = VDDH = 3.0 V , VDDQ = VDDP = 2.7 V to 5.5 V, fCLK = 18 MSPS, fIF = 109.65 MHz, fLO = 107.4 MHz, fREF = 16.8 MHz, TA=25 Co, LO and CLK Synthesizer Disabled, unless otherwise noted. 11.5 10.0 16-BIT DATA WITH DVGA ENABLED 11.0 10.5 24-BIT DATA 16-BIT DATA 9.0 NOISE FIGURE (dB) NOISE FIGURE (dB) 9.5 8.5 BW = 27.08kHz (K = 0, M = 3) 10.0 BW = 12.04kHz (K = 0, M = 8) 9.5 9.0 BW = 6.78kHz (K = 0, M = 15) 8.5 8.0 8.0 100 1000 CHANNEL BANDWIDTH (kHz) 7.0 04319-0-015 7.5 10 14 13 BW = 75kHz (K = 0, M = 1) 12 BW = 50kHz (K = 0, M = 2) 11 NOISE FIGURE (dB) BW = 15kHz (K = 0, M = 9) 10 9 BW = 90.28kHz (K = 1, M = 2) 12 BW = 135.42kHz (K = 1, M = 1) 11 10 BW = 27.08kHz (K = 1, M = 9) 9 8 6 12 9 VGA ATTENUATION (dB) 7 –40 –50 –5 –30 –10 –40 –25 –90 –30 –100 IMD (dBFS) –80 –39 –36 –33 –30 –27 IFIN (dB) –24 –45 IMD –80 –25 –90 –30 –35 –40 –120 04319-0-017 –42 –20 –70 –110 –40 –120 –15 PIN –100 –35 –110 –10 –60 PIN (dBFS) IMD –5 –50 –20 –70 12 Figure 19. Noise Figure vs. VGA Attenuation (fCLK = 26 MSPS) –15 PIN –60 9 6 VGA ATTENUATION (dB) Figure 16. Noise Figure vs. VGA Attenuation (fCLK = 18 MSPS) –30 3 0 –130 –45 Figure 17. IMD vs. IFIN (fCLK = 13 MSPS) –42 –39 –36 –33 –30 –27 IFIN (dBm) Figure 20. IMD vs. IFIN (fCLK = 18 MSPS) Rev. A | Page 11 of 47 PIN (dBFS) 3 04319-0-016 0 04319-0-019 8 –24 –45 04319-0-020 NOISE FIGURE (dB) 13 IMD (dBFS) 12 Figure 18. Noise Figure vs. VGA Attenuation (fCLK = 13 MSPS) 14 –130 –45 9 6 VGA ATTENUATION (dB) Figure 15. Noise Figure vs. Bandwidth (Minimum Attenuation, fCLK = 26 MSPS) 7 3 0 04319-0-018 7.5 AD9864 Data Sheet VDDI = VDDF = VDDA = VDDC = VDDL = VDDH = 3.0 V , VDDQ = VDDP = 2.7 V to 5.5 V, fCLK = 18 MSPS, fIF = 109.65 MHz, fLO = 107.4 MHz, fREF = 16.8 MHz, TA=25 Co, LO and CLK synthesizer disabled, 16-bit data with AGC and DVGA enabled, unless otherwise noted. –40 PIN –10 12 16-BIT WITH DVGA –15 IMD –80 –25 –90 –30 –100 PIN (dBFS) –20 –70 11 10 9 –130 –45 –42 –39 –36 –33 –30 –27 –24 –40 7 –45 6 04319-0-021 –120 IFIN (dBm) 24-BIT 8 –35 –110 0 50 100 150 200 250 300 350 400 450 500 FREQUENCY (MHz) Figure 21. IMD vs. IFIN (fCLK = 26 MSPS) Figure 24. Noise Figure vs. Frequency (Minimum Attenuation, fCLK = 18 MSPS, BW = 10 kHz) 13 0 16-BIT WITH DVGA 12 11 10 9 –4 IIP3 (dBm) 24-BIT –6 8 0 50 100 150 200 250 300 350 400 450 500 FREQUENCY (MHz) –10 04319-0-022 50 0 100 150 200 250 300 350 400 450 Figure 25. Input IIP3 vs. Frequency (fCLK = 18 MSPS) Figure 22. Noise Figure vs. Frequency (Minimum Attenuation, fCLK = 26 MSPS, BW = 10 kHz) 0 20.0 128 18.5 112 AGC NOISE FIGURE (dBc) –2 –4 –6 17.0 96 15.5 80 14.0 64 12.5 48 NOISE FIGURE 11.0 –8 32 0 50 100 150 200 250 300 350 400 450 FREQUENCY (MHz) 500 04319-0-023 9.5 –10 500 FREQUENCY (MHz) Figure 23. Input IIP3 vs. Frequency (fCLK = 26 MSPS) 8.0 –55 16 –50 –45 –40 –35 –30 –25 –20 –15 –10 –5 INTERFERER LEVEL (dBm) Figure 26. Noise Figure vs. Interferer Level (16-Bit Data, BW = 12.5 kHz, AGCR = 1, fINTERFERER = fIF + 110 kHz) Rev. A | Page 12 of 47 MEAN AGC ATTN VALUE 6 04319-0-025 –8 7 0 04319-0-026 NOISE FIGURE (dB) –2 IIP3 (dBm) IMD (dBFS) –60 13 NOISE FIGURE (dB) –50 –5 04319-0-024 –30 Data Sheet AD9864 VDDI = VDDF = VDDA = VDDC = VDDL = VDDH = 3.0 V , VDDQ = VDDP = 2.7 V to 5.5 V, fCLK = 18 MSPS, fIF = 109.65 MHz, fLO = 107.4 MHz, fREF = 16.8 MHz, TA=25 Co, LO and CLK Synthesizer Disabled, AGC enabled, unless otherwise noted. 224 15 14 192 14 13 160 NOISE FIGURE 11 96 10 64 9 32 8 –50 –45 –40 –35 –30 –25 –20 –15 0 –10 INTERFERER LEVEL (dBm) AGC ATTN 96 13 64 12 11 NOISE FIGURE 10 32 9 8 –65 –55 –45 –35 –25 –15 –5 0 INTERFERER LEVEL (dBm) Figure 28. Noise Figure vs. Interferer Level (24-Bit Data, BW = 12.5 kHz, AGCR = 1, fINTERFERER = fIF + 110 kHz) Figure 27. Noise Figure vs. Interferer Level (16-Bit Data with DVGA, BW = 12.5 kHz, AGCR = 1, fINTERFERER = fIF + 110 kHz) Rev. A | Page 13 of 47 04319-0-028 128 12 NOISE FIGURE (dBc) AGC ATTN 04319-0-027 NOISE FIGURE (dBc) 15 128 MEAN AGC ATTN VALUE 16 MEAN AGC ATTN VALUE 256 16 AD9864 Data Sheet TERMINOLOGY Single Sideband Noise Figure (SSB NF) Noise figure (NF) is defined as the degradation in SNR performance (in dB) of an IF input signal after it passes through a component or system. It can be expressed with the equation Noise Figure = 10 × log(SNRIN/SNROUT) The term SSB is applicable for heterodyne systems containing a mixer. It indicates that the desired signal spectrum resides on only one side of the LO frequency (that is, single sideband); therefore, a noiseless mixer has a noise figure of 3 dB. The SSB noise figure of the AD9864 is determined by the equation SSB NF = PIN − [10 × log(BW)] − (−174 dBm/Hz) − SNR where: PIN is the input power of an unmodulated carrier. BW is the noise measurement bandwidth. −174 dBm/Hz is the thermal noise floor at 293 K. SNR is the measured signal-to-noise ratio in dB of the AD9864. Note that PIN is set to −85 dBm to minimize any degradation in measured SNR due to phase noise from the RF and LO signal generators. The IF frequency, CLK frequency, and decimation factors are selected to minimize any spurious components falling within the measurement bandwidth. Note also that a bandwidth of 10 kHz is used for the data sheet specification. All references to noise figures within this data sheet imply single sideband noise figure. Input Third-Order Intercept (IIP3) IIP3 is a figure of merit used to determine the susceptibility of a component or system to intermodulation distortion (IMD) from its third-order nonlinearities. Two unmodulated carriers at a specified frequency relationship (f1 and f2) are injected into a nonlinear system exhibiting third-order nonlinearities producing IMD components at 2f1 − f2 and 2f2 − f1. IIP3 graphically represents the extrapolated intersection of the carrier’s input power with the third-order IMD component when plotted in dB. The difference in power (D in dBc) between the two carriers, and the resulting third-order IMD components can be determined from the equation Dynamic Range (DR) Dynamic range is the measure of a small target input signal (PTARGET) in the presence of a large unwanted interferer signal (PINTER). Typically, the large signal causes some unwanted characteristic of the component or system to degrade, thus making it unable to detect the smaller target signal correctly. For the AD9864, it is often a degradation in noise figure at increased VGA attenuation settings that limits its dynamic range. The test method for the AD9864 is as follows. The small target signal (an unmodulated carrier) is input at the center of the IF frequency, and its power level (PTARGET) is adjusted to achieve an SNRTARGET of 6 dB. The power of the signal is then increased by 3 dB prior to injecting the interferer signal. The offset frequency of the interferer signal is selected so that aliases produced by the response of the decimation filter, as well as phase noise from the LO (due to reciprocal mixing), do not fall back within the measurement bandwidth. For this reason, an offset of 110 kHz was selected. The interferer signal (also an unmodulated carrier) is then injected into the input and its power level is increased to the point (PINTER) where the target signal SNR is reduced to 6 dB. The dynamic range is determined with the equation DR = PINTER − PTARGET + SNRTARGET Note that the AGC of the AD9864 is enabled for this test. IF Input Clip Point The IF input clip point is defined as the input power that results in a digital output level 2 dB below full scale. Unlike other linear components that typically exhibit a soft compression (characterized by its 1 dB compression point), an ADC exhibits a hard compression when its input signal exceeds its rated maximum input signal range. For the AD9864, which contains a Σ-∆ ADC, hard compression must be avoided because it causes severe SNR degradation. D = 2 × (IIP3 − PIN) Rev. A | Page 14 of 47 Data Sheet AD9864 SERIAL PERIPHERAL INTERFACE (SPI) The SPI is a bidirectional serial port. It is used to load the configuration information into the registers listed in Table 6, as well as to read back their contents. Table 6 provides a list of the registers that can be programmed through the SPI port. Addresses and default values are given in hexadecimal form. Table 6. SPI Address Map Address (Hex) Bit(s) Power Control Registers 0x00 [7:0] 0x01 0x02 AGC 0x03 0x04 0x05 0x06 Width Default Value Name Description 8 0xFF STBY [3:2] [1:0] [7:0] 2 2 8 0x00 0x00 0x00 CKOB ADCB TEST Standby control bits (REF, LO, CKO, CK, GC, LNAMX, unused, and ADC). Default is power-up condition of standby. CK oscillator bias (0 = 0.25 mA, 1 = 0.35 mA, 2 = 0.40 mA, 3 = 0.65 mA). Do not use. Factory test mode. Do not use. 7 [6:0] [7:0] [7:4] [3:0] 7 [6:4] 3 [2:0] 1 7 8 4 4 1 3 1 3 0 0x00 0x00 0x00 0x00 0 0x00 0 0x00 ATTEN AGCG [14:8] AGCG [7:0] AGCA AGCD AGCV AGCO AGCF AGCR 3 1 4 0 0x04 Unused K M 6 8 0x00 0x38 LOR [13:8] LOR [7:0] Decimation Factor 0x07 [7:5] 4 [3:0] LO Synthesizer 0x08 [5:0] 0x09 [7:0] Decimation factor = 60 × (M + 1), if K = 0; 48 × (M + 1), if K = 1. Default is decimate-by-300. 0x0A [7:5] [4:0] 3 5 0x05 0x00 LOA LOB [12:8] 0x0B 0x0C [7:0] 6 5 [4:2] [1:0] 8 1 1 3 2 0x1D 0 0 0x00 0x03 LOB [7:0] LOF LOINV LOI LOTM 0x0D [5:0] 0x0E [7:0] Clock Synthesizer 0x10 [5:0] 0x11 [7:0] 6 8 0x00 0x04 LOFA [13:8] LOFA [7:0] 6 8 0x00 0x38 CKR [13:8] CKR [7:0] 0x12 0x13 5 8 0x00 0x3C CKN [12:8] CKN [7:0] [4:0] [7:0] Apply 16 dB attenuation in the front end. AGC attenuation setting (7 MSBs of a 15-bit unsigned word). AGC attenuation setting (8 LSBs of a 15-bit unsigned word). AGC attack bandwidth setting. Default yields 50 Hz loop bandwidth. AGC decay time setting. Default is decay time = attack time. Enable digital VGA to increase AGC range by 12 dB. AGC overload update setting. Default is slowest update. Fast AGC (minimizes resistance seen between GCP and GCN). AGC enable/reference level (disabled, 3 dB, 6 dB, 9 dB, 12 dB, 15 dB below clip). Reference frequency divider (6 MSBs of a 14-bit word). Reference frequency divisor (8 LSBs of a 14-bit word). Default (56) yields 300 kHz from fREF = 16.8 MHz. A counter (prescaler control counter). B counter MSB (5 MSB of a 13-bit word). Default LOA and LOB values yield 300 kHz from 73.35 MHz to 2.25 MHz. B counter LSB (8 LSB of a 13-bit word). Enable fast acquire. Invert charge pump (0 = source current to increase VCO frequency). Charge pump current in normal operation. IPUMP = (LOI +1) × 0.625 mA. Manual control of LO charge pump (0 = off, 1 = up, 2 = down, and 3 = normal). LO fast acquire time unit (6 MSBs of a 14-bit word). LO fast acquire time unit (8 LSBs of a 14-bit word). Reference frequency divisor (6 MSBs of a 14-bit word). Reference frequency divisor (8 LSBs of a 14-bit word). Default yields 300 kHz from fREF = 16.8 MHz; minimum = 3, maximum = 16383. Synthesized frequency divisor (5 MSBs of a 13-bit word). Synthesized frequency divisor (8 LSBs of a 13-bit word). Default yields 300 kHz from 18 MHz; minimum = 3, maximum = 8191. Rev. A | Page 15 of 47 AD9864 Address (Hex) 0x14 Data Sheet Width 1 1 3 2 Default Value 0 0 0x00 0x03 Name CKF CKINV CKI CKTM 0x15 [5:0] 0x16 [7:0] SSI Control 0x18 [7:0] 6 8 0x00 0x04 CKFA [13:8] CKFA [7:0] 8 0x12 SSICRA 0x19 8 0x07 SSICRB Bit(s) 6 5 [4:2] [1:0] [7:0] 0x1A [3:0] 4 0x01 ADC Tuning 0x1C 1 1 0 0 1 0 0x1D [3:0] 3 0x00 0x1E [5:0] 6 0x00 0x1F [7:0] 8 0x00 Test Registers and SPI Port Read Enable 0x37 [7:0] 8 0x00 0x38 [7:1] 7 0x00 0 1 0 0x39 [7:0] 8 0x00 0x3A [7:4] 4 0x00 3 1 0 [2:0] 3 0x00 0x3B [7:4] 4 0x00 3 1 0 [2:0] 3 0x00 0x3C to [7:0] 8 0x00 0x3D 0x3E 7 1 0 6 1 0 [5:3] 3 0 2 2 0 1 1 0 0 1 0 0x3F [7:0] 8 Subject to change Description Enable fast acquire. Invert charge pump (0 = source current to increase VCO frequency). Charge pump current in normal operation. IPUMP = (CKI + 1) × 0.625 mA. Manual control of CLK charge pump (0 = off, 1 = up, 2 = down, and 3 = normal). CK fast acquire time unit (6 LSBs of a 14-bit word). CK fast acquire time unit (8 LSBs of a 14-bit word). SSIORD SSI Control Register A. See the SSI Control Registers section. Default is FS and CLKOUT three-stated. SSI Control Register B. See the SSI Control Registers section (16-bit data, maximum drive strength). Output rate divisor. fCLKOUT = fCLK/SSIORD. TUNE_LC TUNE_RC CAPL1 [2:0] CAPL0 [5:0] CAPR Perform tuning on LC portion of the ADC (cleared when done). Perform tuning on RC portion of the ADC (cleared when done). Coarse capacitance setting of LC tank (LSB is 25 pF, differential). Fine capacitance setting of LC tank (LSB is 0.4 pF, differential). Capacitance setting for RC resonator (64 LSB of fixed capacitance). TEST TEST DACCR DACDATA TEST SPIREN TEST TEST TRI TEST TEST Factory test mode. Do not use. Factory test mode. Do not use. Manual feedback DAC control Feedback DAC data setting in manual mode. Factory test mode. Do not use. Enable read from SPI port. Factory test mode. Do not use. Factory test mode. Do not use. Three-state DOUTB. Factory test mode. Do not use. Factory test mode. Do not use. TEST OVL TEST RC_Q RC_BYP SC_BYP ID Factory test mode. Do not use. ADC overload detector. Factory test mode. Do not use. RC Q enhancement. Bypass RC resonator. Bypass SC resonators. Revision ID (read-only). A write of 0x99 to this register is equivalent to a power-on reset. Rev. A | Page 16 of 47 Data Sheet AD9864 THEORY OF OPERATION INTRODUCTION The AD9864 is a general-purpose, narrow-band IF subsystem that digitizes a low level, 10 MHz to 300 MHz IF input with a signal bandwidth ranging from 6.8 kHz to 270 kHz. The signal chain of the AD9864 consists of an LNA, a mixer, a band-pass Σ-∆ ADC, and a decimation filter with programmable decimation factor. The input LNA is a fixed gain block with an input impedance of approximately 370 Ω||1.4 pF. The LNA input is single-ended and self biasing, allowing the input IF to be ac-coupled. The LNA can be disabled through the serial interface, providing a fixed 16 dB attenuation to the input signal. The LNA drives the input port of a Gilbert-type active mixer. The mixer LO port is driven by the on-chip LO buffer, which can be driven externally, single-ended, or differential. The LO buffer inputs are self biasing and allow the LO input to be ac-coupled. The open-collector outputs of the mixer drive an external resonant tank consisting of a differential LC network tuned to the IF of the band-pass Σ-∆ ADC. The external differential LC tank forms the resonator for the first stage of the band-pass Σ-∆ ADC. The tank LC values must be selected for a center frequency of fCLK/8, where fCLK is the sample rate of the ADC. The fCLK/8 frequency is the IF digitized by the band-pass Σ-∆ ADC. On-chip calibration allows standard tolerance inductor and capacitor values. The calibration is typically performed once at power-up. The ADC contains a sixth-order, multibit band-pass Σ-∆ modulator that achieves very high instantaneous dynamic range over a narrow frequency band centered at fCLK/8. The modulator output is quadrature mixed to baseband and filtered by three cascaded linear phase FIR filters to remove out-of-band noise. The first FIR filter is a fixed, decimate by 12, using a fourthorder comb filter. The second FIR filter also uses a fourth-order comb filter with programmable decimation from 1 to 16. The third FIR stage is programmable for decimation of either 4 or 5. The cascaded decimation factor is programmable from 48 to 960. The decimation filter data is output via the synchronous serial interface (SSI) of the chip. Additional functionality built into the AD9864 includes LO and clock synthesizers, programmable AGC, and a flexible synchronous serial interface for output data. The LO synthesizer is a programmable phase-locked loop (PLL) consisting of a low noise phase frequency detector (PFD), a variable output current charge pump (CP), a 14-bit reference divider, A and B counters, and a dual modulus prescaler. The user only needs to add an appropriate loop filter and VCO for complete operation. The clock synthesizer is equivalent to the LO synthesizer with the following differences: • • It does not include the prescaler or A counter. It includes a negative resistance core used for VCO generation. The AD9864 contains both a variable gain amplifier (VGA) and a digital VGA (DVGA). Both of these can operate manually or automatically. In manual mode, the gain for each is programmed through the SPI. In automatic gain control mode, the gains are adjusted automatically to ensure that the ADC does not clip and that the rms output level of the ADC is equal to a programmable reference level. The VGA has 12 dB of attenuation range and is implemented by adjusting the ADC full-scale reference level. The DVGA gain is implemented by scaling the output of the decimation filter. The DVGA is most useful in extending the dynamic range in narrowband applications requiring 16-bit I and Q data format. The SSI provides a programmable frame structure, allowing 24-bit or 16-bit I and Q data and flexibility by including attenuation and RSSI data if required. Rev. A | Page 17 of 47 AD9864 Data Sheet SERIAL PORT INTERFACE (SPI) register are shifted into the data pin (PD) on the rising edges of the next eight clock cycles. PE stays low during the operation and goes high at the end of the transfer. If PE rises before the eight clock cycles have passed, the operation is aborted. If PE stays low for an additional eight clock cycles, the destination address is incremented and another eight bits of data are shifted in. Again, if PE rises early, the current byte is ignored. By using this implicit addressing mode, the chip can be configured with a single write operation. Registers identified as being subject to frequent updates, namely those associated with power control and AGC operation, have been assigned adjacent addresses to minimize the time required to update them. Note that multibyte registers are big endian (the most significant byte has the lower address) and are updated when a write to the least significant byte occurs. The serial port of the AD9864 has 3-wire or 4-wire SPI capability, allowing read/write access to all registers that configure the internal parameters of the device. The default 3-wire serial communication port consists of a clock (PC), peripheral enable (PE), and bidirectional data (PD) signal. The inputs to PC, PE, and PD contain a Schmitt trigger with a nominal hysteresis of 0.4 V centered about the digital interface supply, that is, VDDH/2. A 4-wire SPI interface can be enabled by setting the MSB of the SSICRB register (Register 0x19, Bit 7) and setting Register 0x3A to 0x00, resulting in the output data appearing on only the DOUTB pin with the PD pin functioning as an input pin only. Note that because the default power-up state sets DOUTB low, bus contention is possible for systems sharing the SPI output line. To avoid any bus contention, the DOUTB pin can be threestated by setting the fourth control bit in the three-state bit (Register 0x3B, Bit 3). This bit can then be toggled to gain access to the shared SPI output line. Figure 30 and Figure 31 illustrates the timing for 3-wire and 4-wire SPI read operations. Although the AD9864 does not require read access for proper operation, it is often useful in the product development phase or for system authentication. Note that the readback enable bit (Register 0x3A, Bit 3) must be set for a read operation with a 3-wire SPI interface. For 4-wire SPI operation, this bit remains low (Register 0x3A = 0x00) but DOUTB is enabled via the SSICRB register (Register 0x19, Bit 7). Note that for the 4-wire SPI interface, the eight data bits appear on the DOUTB pin with the same timing relationship as those appearing at PD for 3-wire SPI interface case. An 8-bit instruction header must accompany each read and write SPI operation. Only the write operation supports an autoincrement mode, which allows the entire chip to be configured in a single write operation. The instruction header is shown in Table 7. It includes a read/not-write indicator bit, six address bits, and a Don’t Care bit. The data bits immediately follow the instruction header for both read and write operations. Note that the address and data are always given MSB first. After the peripheral enable (PE) signal goes low, data (PD) pertaining to the instruction header is read on the rising edges of the clock (PC). A read operation occurs if the read/not-write indicator is set high. After the address bits of the instruction header are read, the eight data bits pertaining to the specified register are shifted out of the data pin (PD) on the falling edges of the next eight clock cycles. After the last data bit is shifted out, the user must return PE high, causing PD to become threestated (for 3-wire case) and return to its normal status as an input pin. Since the auto-increment mode is not supported for read operations, an instruction header is required for each register read operation and PE must return high before initiating the next read operation. Table 7. Instruction Header Information 1 I6 A5 I5 A4 I4 A3 I3 A2 I2 A1 LSB I0 X1 I1 A0 X = don’t care. Figure 29 illustrates the timing requirements for a write operation to the SPI port. After the peripheral enable (PE) signal goes low, data (PD) pertaining to the instruction header is read on the rising edges of the clock (PC). To initiate a write operation, the read/not-write bit is set low. After the instruction header is read, the eight data bits pertaining to the specified tS PE tCLK tHI tH tLOW PC tDS PD tDH R/W A5 A4 A0 DON'T CARE D7 Figure 29. SPI Write Operation Timing Rev. A | Page 18 of 47 D6 D1 D0 04319-0-029 MSB I7 R/W Data Sheet AD9864 tCLK tS PE tHI tLOW PC tDV tDH R/W PD A5 A1 A0 tEZ DON'T CARE D7 D6 D1 04319-0-130 tDS D0 Figure 30. 3-Wire SPI Read Operation Timing tS PE tCLK tHI tLOW PC PD DOUTB DON'T T CARE tDV tDH R/W A5 DON'T CARE DON'T CARE A1 A0 DON'T CARE DON'T CARE DON'T CARE D7 D6 D1 D0 DON'T CARE 04319-0-030 tDS Figure 31. 4-Wire SPI Read Operation Timing POWER-ON RESET The SPI registers are automatically set to their default settings upon power-up when the VDDD supply crosses a threshold. This ensures that the AD9864 is in a known state and placed in standby for minimal power consumption. In the unlikely event that the SPI registers were not reset to their default settings, an equivalent software reset by writing 0x99 to Register 0x3F can be used as the first SPI write command to provide additional assurance. SYNCHRONOUS SERIAL INTERFACE (SSI) The AD9864 provides a high degree of programmability of its SSI output data format, control signals, and timing parameters to accommodate various digital interfaces. In a 3-wire digital interface, the AD9864 provides a frame sync signal (FS), a clock output (CLKOUT), and a serial data stream (DOUTA) signal to the host device. In a 2-wire interface, the frame sync information is embedded into the data stream, thus only CLKOUT and DOUTA output signals are provided to the host device. The SSI control registers are SSICRA, SSICRB, and SSIORD. Table 8 to Table 13 show the bit fields associated with these registers. The primary output of the AD9864 is the converted I and Q demodulated signal available from the SSI port as a serial bit stream contained within a frame. The output frame rate is equal to the modulator clock frequency (fCLK) divided by the digital filter’s decimation factor that is programmed in the Decimator Register (0x07). The bit stream consists of an I word followed by a Q word, where each word is either 24 bits or 16 bits long and is given MSB first in twos complement form. Two optional bytes may also be included within the SSI frame following the Q word. One byte contains the AGC attenuation and the other byte contains both a count of modulator reset events and an estimate of the received signal amplitude (relative to full scale of the AD9864 ADC). Figure 32 illustrates the structure of the SSI data frames in a number of SSI modes. The two optional bytes are output if the EAGC bit of SSICRA is set. The first byte contains the 8-bit attenuation setting (0 = no attenuation, 255 = 24 dB of attenuation), whereas the second byte contains a 2-bit reset field and 6-bit received signal strength field. The reset field contains the number of modulator reset events since the last report, saturating at 3. The received signal strength (RSSI) field is a linear estimate of the signal strength at the output of the first decimation stage; 60 corresponds to a full-scale signal. The two optional bytes follow the I and Q data as a 16-bit word provided that the AAGC bit of SSICRA is not set. If the AAGC bit is set, the two bytes follow the I and Q data in an alternating fashion. In this alternate AGC data mode, the LSB of the byte containing the AGC attenuation is a 0, whereas the LSB of the byte containing reset and RSSI information is always a 1. In a 2-wire interface, the embedded frame sync bit (EFS) within the SSICRA register is set to 1. In this mode, the framing information is embedded in the data stream, with each eight bits of data surrounded by a start bit (low) and a stop bit (high), and each frame ends with at least 10 high bits. FS remains either low or three-stated (default), depending on the state of the SFST bit. Other control bits can be used to invert the frame sync (SFSI), to delay the frame sync pulse by one clock period (SLFS), to invert the clock (SCKI), or to three-state the clock (SCKT). Note that if EFS is set, SLFS is a don’t care bit. Rev. A | Page 19 of 47 AD9864 Data Sheet the pass band of the target signal. Users must verify that the output bit rate is sufficient to accommodate the required number of bits per frame for a selected word size and decimation factor. Idle (high) bits are used to fill out each frame. The SSIORD register controls the output bit rate (fCLKOUT) of the serial bit stream. fCLKOUT can be set equal to the modulator clock frequency (fCLK) or an integer fraction of it. It is equal to fCLK divided by the contents of the SSIORD register. Note that fCLKOUT must be chosen such that it does not introduce harmful spurs within 24-BIT I AND Q, EAGC = 0, AAGC = X:48 DATA BITS I(23:0) Q(23:0) 24-BIT I AND Q, EAGC = 1, AAGC = 0:64 DATA BITS I(23:0) ATTN(7:0) Q(23:0) SSI(5:0) RESET COUNT 16-BIT I AND Q, EAGC = 0, AAGC = X:32 DATA BITS I(15:0) Q(15:0) 16-BIT I AND Q, EAGC = 0, AAGC = 0:32 DATA BITS I(15:0) Q(15:0) ATTN(7:0) SSI(5:0) I(15:0) Q(15:0) ATTN(7:1) 0 I(15:0) Q(15:0) SSI(5:1) 1 RESET COUNT Figure 32. SSI Frame Structure Rev. A | Page 20 of 47 04319-0-031 16-BIT I AND Q, EAGC = 1, AAGC = 1:40 DATA BITS Data Sheet AD9864 SSI CONTROL REGISTERS SSICRA (Address 0x18) Table 8. SSICRA Bitmap Bit 7 AAGC Bit 6 EAGC Bit 5 EFS Bit 4 SFST Bit 3 SFSI Bit 2 SLFS Bit 1 SCKT Bit 0 SCKI Bit 1 DS_1 Bit 0 DS_0 Table 9. SSICRA Bit Descriptions Bit(s) 7 6 5 4 3 2 1 0 Name AAGC EAGC EFS SFST SFSI SLFS SCKT SCKI Width 1 1 1 1 1 1 1 1 Default 0 0 0 1 0 0 1 0 Description Alternate AGC data bytes. Embed AGC data. Embed frame sync. Three-state frame sync. Invert frame sync. Late frame sync (1 = late, 0 = early). Three-state CLKOUT. Invert CLKOUT. SSICRB (Address 0x19) Table 10. SSICRB Bitmap Bit 7 4_SPI Bit 6 Reserved Bit 5 Reserved Bit 4 Reserved Bit 3 DW Bit 2 DS_2 Table 11. SSICRB Bit Descriptions Bit(s) 7 [6:4] 3 [2:0] Name 4_SPI Reserved DW DS Width 1 3 1 3 Default 0 0 0 7 Description Enable 4-wire SPI interface for SPI read operation via DOUTB. Reserved. I/Q data-word width (0 = 16 bit, 1 = 24 bit). Automatically 16-bit when AGCV = 1. FS, CLKOUT, and DOUT drive strength Level 0 to Level 7, with 7 being the highest level. SSIORD (Address 0x1A) Table 12. SSIORD Bitmap Bit 7 Reserved Bit 6 Reserved Bit 5 Reserved Bit 4 Reserved Bit 3 DIV_3 Bit 2 DIV_2 Bit 1 DIV_1 Table 13. SSIORD Bit Descriptions Bit(s) [7:4] [3:0] Name Reserved SSIORD Width 4 4 Default 0 1 Description Reserved. Output bit rate divisor setting fCLKOUT = fCLK/SSIORD where SSIORD = 1 to 15. Rev. A | Page 21 of 47 Bit 0 DIV_0 AD9864 Data Sheet CLKOUT FS DOUT I15 I0 Q15 Q14 Q0 SCKI = 0, SCKT = 0, SLFS = 0, SFSI = 0, EFS = 0, SFST = 0, EAGC = 0 CLKOUT FS DOUT I15 I0 Q15 Q14 Q0 SCKI = 0, SCKT = 0, SLFS = 1, SFSI = 0, EFS = 0, SFST = 0, EAGC = 0 CLKOUT FS DOUT I15 I0 Q15 Q14 Q0 ATTN7 ATTEN6 RSSI0 SCKI = 0, SCKT = 0, SLFS = 0, SFSI = 0, EFS = 0, SFST = 0, EAGC = 1, AAGC CLKOUT FS START START STOP BIT I7 I0 STOP BIT BIT BIT SCKI = 0, SCKT = 0, SLFS = X, SFSI = X, EFS = 1, SFST = 1, EAGC = 0 SCKI = 0, SCKT = 0, SLFS = X, SFSI = X, EFS = 1, SFST = 0, EAGC = 0; AS ABOVE, BUT FS IS LOW I15 IDLE (HIGH) BITS I8 Q15 04319-0-032 HI-Z DOUT Figure 33. SSI Timing for Several SSICRA Settings with 16-Bit I/Q Data Table 14. Number of Bits per Frame for Different SSICR Settings DW 0 (16 Bits) 1 (24 Bits) EAGC 0 0 1 1 1 1 0 0 1 1 1 1 EFS 0 1 0 0 1 1 0 1 0 0 1 1 AAGC N/A N/A 0 1 0 1 N/A N/A 0 1 0 1 Number of Bits per Frame 32 491 48 40 691 591 48 691 64 56 891 791 The number of bits per frame with embedded frame sync (EFS = 1); assume at least 10 idle bits are desired. 2 N/A means not applicable. 1 The maximum SSIORD setting can be determined by the following equation: SSIORD < TRUNC[(Decimation Factor)/(Number of Bits per Frame)] where TRUNC is the truncated integer value. (1) If SSIORD = (decimation factor)/(number of bits per frame), the last bit in the SSI frame is not clocked out prior to FS returning high. Table 14 lists the number of bits within a frame for 16-bit and 24-bit output data formats for all of the different SSICR settings. The decimation factor is determined by the contents of Register 0x07. An example helps illustrate how the maximum SSIORD setting is determined. Suppose a user selects a decimation factor of 600 (Register 0x07, K = 0, M = 9) and prefers a 3-wire interface with a dedicated frame sync (EFS = 0) containing 24-bit data (DW = 1) with nonalternating embedded AGC data included (EAGC = 1, AAGC = 0). Referring to Table 14, each frame consists of 64 data bits. Using Equation 1, the maximum SSIORD setting is 9 (= TRUNC(600/64)). Therefore, the user can select any SSIORD setting between 1 and 9. Figure 33 illustrates the output timing of the SSI port for several SSI control register settings with 16-bit I/Q data, and Figure 34 shows the associated timing parameters. Note that the same timing relationship holds for 24-bit I/Q data, with the exception that I and Q word lengths now become 24 bits. In the default mode of operation, data is shifted out on rising edges of CLKOUT after a pulse equal to a clock period is output from the frame sync (FS) pin. As described above, the output data consists of a 16-bit or 24-bit I sample followed by a 16-bit or 24-bit Q sample, plus two optional bytes containing AGC and status information. Rev. A | Page 22 of 47 Data Sheet AD9864 tCLK tHI tLOW 14 tV 12 13 DOUT I15 I14 Figure 34. SSI Timing Parameters for SSI Timing In Figure 34, the timing parameters also apply to inverted CLKOUT or FS modes, with tDV relative to the falling edge of the CLK and/or FS. The AD9864 also provides the means for controlling the switching characteristics of the digital output signals via the drive strength (DS) field of the SSICRB. This feature is useful in limiting switching transients and noise from the digital output that may ultimately couple back into the analog signal path, potentially degrading the sensitivity performance of the AD9864. Figure 35 and Figure 36 show how the NF can vary as a function of the SSI setting for an IF frequency of 109.65 MHz. The following two observations can be made from these figures: 10.0 9.8 9.6 16-BIT I/O DATA DS 0 1 2 3 4 5 6 7 8.6 8.4 1 2 4 3 5 6 SSI OUTPUT DRIVE STRENGTH SETTING 7 1 3 5 6 2 4 SSI OUTPUT DRIVE STRENGTH SETTING Table 15. Typical Rise/Fall Times (±25%) with a 10 pF Capacitive Load for Each DS Setting 24-BIT I/O DATA 16-BIT I/0 DATA w/ DVGA ENABLED 9 7 Table 15 lists the typical output rise/fall times as a function of DS for a 10 pF load. Rise/fall times for other capacitor loads can be determined by multiplying the typical values presented by a scaling factor equal to the desired capacitive load divided by 10 pF. 9.0 8.0 16-BIT I/O DATA Figure 36. NF vs. SSI Output Drive Strength (VDDx = 3.0 V, fCLK = 18 MSPS, BW = 75 kHz) 9.2 8.2 10 7 9.4 8.8 16-BIT I/O DATA w/DVGA ENABLED 11 8 04319-0-034 2. The NF becomes more sensitive to the SSI output drive strength level at higher signal bandwidth settings. The NF is dependent on the number of bits within an SSI frame that become more sensitive to the SSI output drive strength level as the number of bits is increased. Therefore, select the lowest possible SSI drive strength setting that still meets the SSI timing requirements. NOISE FIGURE (dB) 1. 24-BIT I/O DATA 04319-0-035 tDV 04319-0-033 FS NOISE FIGURE (dB) CLKOUT Figure 35. NF vs. SSI Output Drive Strength (VDDx = 3.0 V, fCLK = 18 MSPS, BW = 10 kHz) Rev. A | Page 23 of 47 Typ (ns) 13.5 7.2 50 3.7 3.2 2.8 2.3 2.0 AD9864 Data Sheet SYNCHRONIZATION USING SYNCB INTERFACING TO DSPS Many applications require the ability to synchronize one or more AD9864 devices in a way that causes the output data to be precisely aligned to an external asynchronous signal. For example, receiver applications employing diversity often require synchronization of the digital outputs of multiple AD9864 devices. Satellite communication applications using TDMA methods may require synchronization between payload bursts to compensate for reference frequency drift and Doppler effects. The AD9864 connects directly to an Analog Devices programmable digital signal processor (DSP). Figure 38 illustrates an example with the Blackfin® series processors, such as the ADSP-BF609. The Blackfin DSP series of 16-bit products is optimized for low power telecommunications applications with its dynamic power management feature, making it well suited for portable radio products. The code compatible family members share the fundamental core attributes of high performance, low power consumption, and the ease-of-use advantages of a microcontroller instruction set. Figure 37 shows the timing relationship between SYNCB and the CLKOUT and FS signals of the SSI port. When the clock synthesizer is enabled to generate the input ADC clock, SYNCB is considered an asynchronous active-low signal that must remain low for at least half an input clock period, that is, 1/(2 × fCLK). CLKOUT remains high while FS remains low upon SYNCB going low. CLKOUT becomes active within one to two output clock periods upon SYNCB returning high. If an external ADC clock input is supplied along with a synchronous SYNCB signal, it is recommended that SYNCB go low and returns high on the falling edges of the CLKIN signal to ensure consistent CLKOUT delay relative to rising edge of SYNCB. FS reappears several output cycles later, depending on the decimation factor of the digital filter and the SSIORD setting. Note that for any decimation factor and SSIORD setting, this delay is fixed and repeatable. To verify proper synchronization, monitor the FS signals of the multiple AD9864 devices. As shown in Figure 38, the synchronous serial interface (SSI) of the AD9864 links the receive data stream to the serial port (SPORT) of the DSP. For AD9864 setup and register programming, the device connects directly to the SPI port of the DSP. Dedicated select lines (SEL) allow the DSP to program and read back registers of multiple devices using only one SPI port. The DSP driver code pertaining to this interface is available on the AD9864 product page. SSI CLKOUT FS DOUTA SPI1_CLK SPI1_MOSI SPI1_MISO SPI1_SSEL7 SPI SPORT0_ACLK SPORT0_AFS SPORT0_AD0 SPORT SYNCB PE0 DGND GND DGND GND POWER CONTROL To allow power consumption to be minimized, the AD9864 possesses numerous SPI programmable power-down and bias control bits. The AD9864 powers up with all of its functional blocks placed into a standby state, that is, STBY register default is 0xFF. Each major block can then be powered up by writing a 0 to the appropriate bit of the STBY register. This scheme provides the greatest flexibility for configuring the IC to a specific application as well as for tailoring the power-down and wake-up characteristics of the IC. Table 16 summarizes the function of each of the STBY bits. Note that when all the blocks are in standby, the master reference circuit is also put into standby, and therefore the current is reduced further by 0.4 mA. 04319-0-036 FS SPI PC PD DOUTB PE Figure 38. Example of AD9864 and ADSP-BF609 Interface SYNCB CLKOUT ADSP-BF609 AD9864 04319-0-037 SYNCB can be used for this purpose. It is an active-low signal that clears the clock counters in both the decimation filter and the SSI port. The counters in the clock synthesizers are not reset because it is presumed that the CLK signals of multiple chips would be connected. SYNCB also resets the modulator, resulting in a large-scale impulse that must propagate through the digital filter and SSI data formatting circuitry of the AD9864 before recovering valid output data. As a result, data samples unaffected by this SYNCB induced impulse can be recovered 12 output data samples after SYNCB goes high (independent of the decimation factor). Because SYNCB also resets the modulator, apply SYNCB only after the tuning of the band-pass Σ-Δ ADC has been completed during the initialization phase. For applications that may be performing a periodic SYNCB signal that is synchronous to FS, it is recommended that SYNCB assertion be applied after the rising edge of FS and three CLKOUT cycles before the arrival of the next FS pulse to avoid a possible runt FS pulse that could disrupt the host DSP/FPGA. Lastly, SYNCB must be tied high if unused because it does not include an internal pull-up resistor. Figure 37. SYNCB Timing Rev. A | Page 24 of 47 Data Sheet AD9864 STBY Bit 7: REF 6: LO 5: CKO 4: CK 3: GC 2: LNAMX 1: Unused 0: ADC Effect Voltage reference off; all biasing shut down. LO synthesizer off, IOUTL three-state. Clock oscillator off. Clock synthesizer off, IOUTC three-state. Clock buffer off if ADC is off. Gain control DAC OFF. GCP and GCN threestate. LNA and mixer off. CXVM, CXVL, and CXIF three-state. ADC off; clock buffer off if CLK synthesizer off; VCM three-state; clock to the digital filter halted; digital outputs static. Current Reduction (mA)1 0.6 1.2 fREF Wake-Up Time (ms) 1/{2 × (LOSC × (CVARACTOR ||COSC))1/2} The bias, IBIAS, of the negative-resistance core has four programmable settings. The lower equivalent Q of the LC tank circuit may require a higher bias setting of the negative resistance core to ensure proper oscillation. Select RBIAS so that the common-mode voltage at CLKP and CLKN is approximately 1.6 V. The synthesizer may be disabled via the CK standby bit to allow the user to employ an external synthesizer and/or VCO in place of those resident on the IC. Note that if an external CLK source or VCO is used, the clock oscillator must be disabled via the CKO standby bit. The phase noise performance of the clock synthesizer is dependent on several factors, including the CLK oscillator IBIAS setting, charge pump setting, loop filter component values, and internal fREF setting. Figure 42 and Figure 43 show how the measured phase noise attributed to the clock synthesizer varies (relative to an external fCLK) as a function of the IBIAS setting and charge pump setting for a −31 dBm IFIN signal at 73.35 MHz with an external LO signal at 71.1 MHz. Figure 42 shows that the optimum phase noise is achieved with the highest IBIAS (CKO) setting, while Figure 43 shows that the higher charge pump values provide the optimum performance for the given loop filter configuration. The AD9864 clock synthesizer and oscillator were set up to provide an fCLK of 18 MHz from an external fREF of 16.8 MHz. The following external component –50 –60 –70 –80 CKO = 2 –90 CK0 = 0 –100 CKO = 3 CKO = 1 –110 EXT CLK –120 –130 Figure 41. External Loop Filter, Varactor, and LC Tank Required to Realize a Complete Clock Synthesizer –140 –25 –20 –15 –10 –5 0 5 10 15 20 25 FREQUENCY OFFSET (kHz) Figure 42. CLK Phase Noise vs. IBIAS Setting (CKO); IF = 73.35 MHz, IF = 71.1 MHz, IFIN = −31 dBm, fCLK = 18 MHz, fREF = 16.8 MHz; CLK SYN Settings: CKI = 7, CLR = 56, and CLN = 60 with fREF = 300 kHz 0 –10 –20 –30 PHASE NOISE (dBc/Hz) The AD9864 clock synthesizer circuitry includes a negative resistance core so that only an external LC tank circuit with a varactor is needed to realize a voltage controlled clock oscillator (VCO). Figure 41 shows the external components required to complete the clock synthesizer along with the equivalent input circuitry of the CLK input. The resonant frequency of the VCO is approximately determined by LOSC and the series equivalent capacitance of COSC and CVAR. As a result, LOSC, COSC, and CVAR must be selected to provide a sufficient tuning range to ensure both proper start-up oscillation and locking of the clock synthesizer. Both the COSC and LOSC values must have ±5% tolerance along with LOSC having a Q > 20 at the desired clock frequency. –40 04319-0-041 AD9864 20 –40 –50 –60 –70 –80 CP = 0 –90 CP = 2 –100 –110 CP = 4 CP = 6 EXT CLK –120 –130 –140 –25 –20 –15 –10 5 0 5 10 FREQUENCY OFFSET (kHz) 15 20 25 04319-0-042 IOUTC 19 PHASE NOISE (dBc/Hz) –30 15 Figure 43. CLK Phase Noise vs. IBIAS Setting (CKO); IF = 73.35 MHz, IF = 71.1 MHz, IFIN = −31 dBm, fCLK = 18 MHz, fREF = 16.8 MHz; CLK SYN Settings: CKO Bias = 3, CKR = 56, and CKN = 60 with fREF = 300 kHz Table 18. SPI Registers Associated with CLK Synthesizer Address (Hex) 0x00 0x01 0x10 0x11 0x12 0x13 0x14 0x15 0x16 Rev. A | Page 27 of 47 Bit(s) [7:0] [3:2] [5:0] [7:0] [4:0] [7:0] 6 5 [4:2] [1:0] [3:0] [7:0] Width 8 2 6 8 5 8 1 1 3 1 4 8 Default Value 0xFF 0x00 0x00 0x38 0x00 0x3C 0 0 0x00 0x00 0x00 0x04 Name STBY CKOB CKR [13:8] CKR [7:0] CKN [12:8] CKN [7:0] CKF CKINV CKI CKTM CKFA [13:8] CKFA [7:0] AD9864 Data Sheet 2.5 IF LNA/MIXER 2.0 CAPACITANCE (pF) 0 RBIAS L MXON CXVL LO INPUT = 0.3V p-p TO 1.0V p-p RGAIN MULTI-TANH V–I STAGE RF CXIF CXVM 04319-0-043 IFIN DC SERVO LOOP Figure 44. Simplified Schematic of AD9864 LNA/Mixer 600 RESISTANCE (Ω) 100 200 150 250 FREQUENCY (MHz) 300 350 The external differential LC tank forms the resonant element for the first resonator of the band-pass Σ-∆ modulator, and so must be tuned to the fCLK/8 center frequency of the modulator. The inductors must be chosen such that their impedance at fCLK/8 is approximately 140, that is, L = 180/fCLK. An accuracy of 20% is considered to be adequate. For example, at fCLK = 18 MHz, L = 10 µH is a good choice. Once the inductors have been selected, the required tank capacitance may be calculated using the relation fCLK / 8 = 1/[2 × π × (2L × C ) ] 550 500 450 400 0 50 100 150 200 250 FREQUENCY (MHz) 300 350 04319-0-044 350 300 50 The differential LO port of the mixer is driven by the LO buffer stage shown in Figure 44, which can be driven single-ended or differential. Because it is self biasing, the LO signal level can be ac-coupled and range from 0.3 V p-p to 1.0 V p-p with negligible effect on performance. The open-collector outputs of the mixer, MXOP and MXON, drive an external resonant tank consisting of a differential LC network tuned to the IF of the band-pass Σ-∆ ADC, that is, fIF2_ADC = fCLK/8. The two inductors provide a dc bias path for the mixer core via a series resistor of 50 Ω, which is included to dampen the common-mode response. The output of the mixer must be ac-coupled to the input of the band-pass Σ-∆ ADC, IF2P, and IF2N via two 100 pF capacitors to ensure proper tuning of the LC center frequency. C MXOP 0 Figure 46. Shunt Capacitance vs. Frequency of AD9864 IF1 Input 50Ω VDDI 1.0 0.5 2.7V TO 3.6V L 1.5 04319-0-045 The AD9864 contains a single-ended LNA followed by a Gilbert type active mixer, shown in Figure 44 with the required external components. The LNA uses negative shunt feedback to set its input impedance at the IFIN pin, thus making it dependent on the input frequency. It can be modeled as approximately 370 Ω||1.4 pF (±20%) below 100 MHz. Figure 45 and Figure 46 show the equivalent input impedance vs. frequency characteristics of the AD9864. The increase in shunt resistance vs. frequency can be attributed to the reduction in bandwidth, thus the amount of negative feedback of the LNA. Note that the input signal into IFIN must be ac-coupled via a 10 nF capacitor because the LNA input is self biasing. Figure 45. Shunt Input Resistance vs. Frequency of AD9864 IF1 Input For example, at fCLK = 18 MHz and L = 10 µH, a capacitance of 250 pF is needed. However, to accommodate an inductor tolerance of ±10%, the tank capacitance must be adjustable from 227 pF to 278 pF. Selecting an external capacitor of 180 pF ensures that even with a 10% tolerance and stray capacitances as high as 30 pF, the total capacitance is less than the minimum value needed by the tank. Extra capacitance is supplied by the AD9864 on-chip programmable capacitor array. Because the programming range of the capacitor array is at least 160 pF, the AD9864 has plenty of range to make up for the tolerances of low cost external components. Note that if fCLK is increased by a factor of 1.44 MHz to 26 MHz so that fCLK/8 becomes 3.25 MHz, reducing L and C by approximately the same factor (L = 6.9 µH and C = 120 pF) satisfies the requirements stated previously. Rev. A | Page 28 of 47 Data Sheet AD9864 Table 19. SPI Registers Associated with LNA/Mixer Address (Hex) 0x00 0x03 Bit(s) [7:0] 7 Width 8 1 Default Value 0xFF 0 Name STBY ATTEN Figure 48 shows the measured power spectral density measured at the output of the undecimated band-pass Σ-Δ modulator. Note that the wide dynamic range achieved at the center frequency, fCLK/8, is achieved once the LC and RC resonators of the Σ-Δ modulator have been successfully tuned. The out-ofband noise is removed by the decimation filters following quadrature mixer. 0 –2dBFS OUTPUT –10 fCLK = 18MHz NBW = 3.3kHz –20 FFT OUTPUT (dBFS/NBW) A 16 dB step attenuator is also included within the LNA/mixer circuitry to prevent large signals (that is, > −18 dBm) from overdriving the Σ-Δ modulator. In such instances, the Σ-Δ modulator becomes unstable, thus severely desensitizing the receiver. The 16 dB step attenuator can be invoked by setting the ATTEN bit (Register 0x03, Bit 7), causing the mixer gain to be reduced by 16 dB. The 16 dB step attenuator can be used in applications where a potential target or blocker signal could exceed the IF input clip point. Although the LNA is driven into compression, it may still be possible to recover the desired signal if it is FM. See Table 19 for the gain compression characteristics of the LNA and mixer with the 16 dB attenuator enabled. –30 –40 –50 –60 –70 –80 BAND-PASS Σ-∆ ADC The ADC of the AD9864 is shown in Figure 47. The ADC contains a sixth-order, multibit band-pass Σ-Δ modulator that achieves very high instantaneous dynamic range over a narrow frequency band. The loop filter of the band-pass Σ-Δ modulator consists of two continuous-time resonators followed by a discrete time resonator, with each resonator stage contributing a pair of complex poles. The first resonator is an external LC tank, while the second is an on-chip active RC filter. The output of the LC resonator is ac-coupled to the second resonator input via 100 pF capacitors. The center frequencies of these two continuous-time resonators must be tuned to fCLK/8 for the ADC to function properly. The center frequency of the discrete time resonator automatically scales with fCLK, thus no tuning is required. EXTERNAL LC IF2P fCLK = 13 MSPS TO 26 MSPS RC RESONATOR IF2N MXOP SC RESONATOR NINELEVEL FLASH –100 1 2 3 4 5 6 7 8 9 FREQUENCY (MHz) Figure 48. Measured Undecimated Spectral Output of Σ-∆ Modulator ADC with fCLK = 18 MSPS and Noise Bandwidth of 3.3 kHz The signal transfer function of the AD9864 possesses inherent anti-alias filtering by virtue of the continuous time portions of the loop filter in the band-pass Σ-Δ modulator. Figure 49 illustrates this property by plotting the nominal signal transfer function of the ADC for frequencies up to 2fCLK. The notches that naturally occur for all frequencies that alias to the fCLK/8 pass band are clearly visible. Even at the widest bandwidth setting, the notches are deep enough to provide greater than 80 dB of alias protection. Thus, the wideband IF filtering requirements preceding the AD9864 are determined mostly by the image band of the mixer, which is offset from the desired IF input frequency by fCLK/4 (that is, 2 × fCLK/8) rather than any aliasing associated with the ADC. 0 MXON GAIN CONTROL Figure 47. Equivalent Circuit of Sixth-Order Band-Pass Σ-∆ Modulator –20 –30 NOTCH AT ALL ALIAS FREQUENCIES –40 –50 –60 –70 –80 0 0.5 1.0 1.5 NORMALIZED FREQUENCY (RELATIVE TO fOUT) Figure 49. Signal Transfer Function of the Band-Pass Σ-∆ Modulator from 0 fCLK to 2fCLK Rev. A | Page 29 of 47 2.0 04319-0-049 TO DIGITAL FILTER 04319-0-047 ESL SIGNAL TRANSFER FUNCTION (dB) –10 DAC1 MIXER OUTPUT 0 04319-0-048 –90 AD9864 Data Sheet Figure 50 shows the nominal signal transfer function magnitude for frequencies near the fCLK/8 pass band. The width of the pass band determines the transfer function droop, but even at the lowest oversampling ratio (48) where the pass band edges are at ±fCLK/192 (±0.005 fCLK), the gain variation is less than 0.5 dB. Also consider the amount of attenuation offered by the signal transfer function near fCLK/8 when determining the narrow-band IF filtering requirements preceding the AD9864. The following mechanisms prevent the tuning procedure from finishing (that is, Register 0x1C does not clear): • 0 –5 –10 • • –15 –20 –0.10 –0.05 0 0.05 NORMALIZED FREQUENCY (RELATIVE TO fCLK) 0.10 04319-0-050 SIGNAL TRANSFER FUNCTION (dB) • Figure 50. Magnitude of the Signal Transfer Function of the ADC near fCLK/8 Tuning of the Σ-∆ modulator’s two continuous-time resonators is essential in realizing the full dynamic range of the ADC, and must be performed upon system startup. To facilitate tuning of the LC tank, a capacitor array is internally connected to the MXOP and MXON pins. The capacitance of this array is programmable from 0 pF to 200 pF ± 20% and can be programmed either automatically or manually via the SPI port. The capacitors of the active RC resonator are similarly programmable. Note that the AD9864 can be placed in and out of its standby mode without retuning since the tuning codes are stored in the SPI registers. When tuning the LC tank, the sampling clock frequency must be stable and the LNA/mixer, LO synthesizer, and ADC must all be placed in standby. Because large LO and IF signals (>−40 dBm) present at the inputs of the AD9864 can corrupt the calibration, these signals must be minimized or disabled during the calibration sequence. Tuning is triggered when the ADC is taken out of standby if the TUNE_LC bit of Register 0x1C has been set. This bit clears when the tuning operation is complete (less than 6 ms). The tuning codes can be read from the 3-bit CAPL1 (0x1D) and the 6-bit CAPL0 (0x1E) registers. In a similar manner, tuning of the RC resonator is activated if the TUNE_RC bit of Register 0x1C is set when the ADC is taken out of standby. This bit clears when tuning is complete. The tuning code can be read from the CAPR (0x1F) register. Setting both the TUNE_LC and TUNE_RC bits tunes the LC tank and the active RC resonator in succession. During tuning, the ADC is not operational and neither data nor a clock is available from the SSI port. CLK signal is not present or scaled/biased properly into CLKP (and/or CLKN) pin such that internal clock receiver does not square-up the input clock signal. To determine if the CLK input signal is being received correctly, a clock signal appears at the CLKOUT when the ADC is not in standby mode (Register 0x00), and the CLKOUT buffer is not three-stated (Register 0x18). LC resonator fails to resonate during tune operation. Check to see proper values are used for LC tank and that it is connected to MXOP/MXON pins. Also check if 100 pF capacitors are connected between MXOP (MXON) and IF2P (IF2N) pins. SYCNB pin is low. Capacitor value (between the MXOP/MXON and IF2P/IF2N pins) is larger than 100 pF. Table 20 lists the recommended sequence of the SPI commands for tuning the ADC, and Table 21 lists all of the SPI registers associated with band-pass Σ-∆ ADC. Note that the recommended sequence includes additional steps for robustness. These steps are additional measures to prevent the back-end ADC from generating an internal unstable signal that locks the state machine, thus preventing resonator tuning. It also allows five attempts to calibrate the resonators. As a further safeguard, the user can save the settings for Register 0x1D, Register 0x1E, and Register 0x1F determined during factory test and reload these settings after five attempts. Note that that the occurrence of this tuning issue is extremely rare among devices shipped to date, and the occurrence among any suspect devices being quite low (
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