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ADG1436TRUZ-EP

ADG1436TRUZ-EP

  • 厂商:

    AD(亚德诺)

  • 封装:

    TSSOP-16_5X4.4MM

  • 描述:

    +/-15V QUAD SPST WITH RON MAX =

  • 数据手册
  • 价格&库存
ADG1436TRUZ-EP 数据手册
FEATURES FUNCTIONAL BLOCK DIAGRAM 1.5 Ω on resistance 0.28 Ω on-resistance flatness 0.1 Ω on-resistance match between channels Continuous current per channel up to 260 mA Fully specified at +12 V, ±15 V, and ±5 V No VSS supply required 3 V logic-compatible inputs Rail-to-rail operation 16-lead TSSOP package APPLICATIONS ADG1436-EP S1A D1 S1B IN1 IN2 S2A D2 S2B Automatic test equipment Data acquisition systems Battery-powered systems Sample-and-hold systems Audio signal routing Military communications Aviation SWITCHES SHOWN FOR A ONE-INPUT LOGIC. 17169-001 Enhanced Product 1.5 Ω On Resistance, ±15 V/12 V/±5 V, iCMOS, Dual SPDT Switch ADG1436-EP Figure 1. ENHANCED PRODUCT FEATURES Supports defense and aerospace applications (AQEC standard) Military temperature range (−55°C to +125°C) Controlled manufacturing baseline 1 assembly/test site 1 fabrication site Product change notification Qualification data available on request GENERAL DESCRIPTION The ADG1436-EP is a monolithic complementary metal-oxide semiconductor (CMOS) device containing two independently selectable SPDT switches. Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked. Both switches exhibit break-beforemake switching action for use in multiplexer applications. The ADG1436-EP is designed on an iCMOS® process. iCMOS (industrial CMOS) is a modular manufacturing process combining high voltage CMOS and bipolar technologies. It enables the development of a wide range of high performance analog integrated circuits (ICs) capable of 33 V operation in a Rev. 0 footprint that no previous generation of high voltage parts has been able to achieve. Unlike analog ICs using conventional CMOS processes, iCMOS components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced package size. The on-resistance profile is very flat over the full analog input range, ensuring excellent linearity and low distortion when switching audio signals in military communication. iCMOS construction ensures ultralow power dissipation, making the part ideally suited for avionics and battery-powered instruments. Additional application and technical information can be found in the ADG1436 data sheet. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2018 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADG1436-EP Enhanced Product TABLE OF CONTENTS Features .............................................................................................. 1 5 V Dual Supply .............................................................................5 Applications ....................................................................................... 1 Absolute Maximum Ratings ............................................................6 Enhanced Product Features ............................................................ 1 Thermal Resistance .......................................................................6 Functional Block Diagram .............................................................. 1 ESD Caution...................................................................................6 General Description ......................................................................... 1 Pin Configurations and Function Descriptions ............................7 Revision History ............................................................................... 2 Truth Table For Switches ..............................................................7 Specifications..................................................................................... 3 Typical Performance Characteristics ..............................................8 15 V Dual Supply .......................................................................... 3 Outline Dimensions ....................................................................... 10 12 V Single Supply ........................................................................ 4 Ordering Guide .......................................................................... 10 REVISION HISTORY 8/2018—Revision 0: Initial Version Rev. 0 | Page 2 of 10 Enhanced Product ADG1436-EP SPECIFICATIONS 15 V DUAL SUPPLY VDD = 15 V ± 10%, VSS = −15 V ± 10%, GND = 0 V, unless otherwise noted. Table 1. Parameter ANALOG SWITCH Analog Signal Range On Resistance, RON On-Resistance Match Between Channels, ∆RON On-Resistance Flatness, RFLAT(ON) Continuous Current Per Channel1 LEAKAGE CURRENTS Source Off Leakage, IS (Off) Drain Off Leakage, ID (Off) Channel On Leakage, ID, IS (On) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH 25°C 1.5 1.8 0.1 0.18 0.28 0.36 260 ±0.04 ±0.55 ±0.04 ±0.55 ±0.1 ±2 −55°C to +125°C Unit VDD to VSS V Ω typ Ω max Ω typ Ω max Ω typ Ω max mA max 2.6 0.21 0.45 100 ±12.5 ±12.5 ±35 2.0 0.8 0.005 ±0.1 Digital Input Capacitance, CIN DYNAMIC CHARACTERISTICS1 Transition Time, tTRANSITION Break-Before-Make Time Delay, tBBM 3.5 125 170 20 245 10 Charge Injection Off Isolation Channel-to-Channel Crosstalk Total Harmonic Distortion + Noise −3 dB Bandwidth Insertion Loss CS (Off) CD (Off) CD, CS (On) POWER REQUIREMENTS IDD −20 −80 −80 0.011 110 −0.18 23 50 120 0.001 1 IDD 170 285 ISS VDD/VSS 1 0.001 1.0 ±4.5/±16.5 Guaranteed by design, not subject to production test. Rev. 0 | Page 3 of 10 nA typ nA max nA typ nA max nA typ nA max V min V max µA typ µA max pF typ ns typ ns max ns typ ns min pC typ dB typ dB typ % typ MHz typ dB typ pF typ pF typ pF typ µA typ µA max µA typ µA max µA typ µA max V min/max Test Conditions/Comments VS = ±10 V, IS = −10 mA VDD = +13.5 V, VSS = −13.5 V VS = ±10 V, IS = −10 mA VS = ±10 V, IS = −10 mA VDD = +13.5 V, VSS = −13.5 V VDD = +16.5 V, VSS = −16.5 V VS = ±10 V, VS = ±10 V VS = ±10 V, VS = ±10 V VS = VD = ±10 V VIN = VGND or VDD RL = 300 Ω, CL = 35 pF VS = 10 V RL = 300 Ω, CL = 35 pF VS1 = VS2 = +10 V VS = 0 V, RS = 0 Ω, CL = 1 nF RL = 50 Ω, CL = 5 pF, f = 100 kHz RL = 50 Ω, CL = 5 pF, f = 100 kHz RL = 110 Ω, 15 V p-p, f = 20 Hz to 20 kHz RL = 50 Ω, CL = 5 pF RL = 50 Ω, CL = 5 pF, f = 1 MHz f = 1 MHz, VS = 0 V f = 1 MHz, VS = 0 V f = 1 MHz, VS = 0 V VDD = +16.5 V, VSS = −16.5 V Digital inputs = 0 V or VDD Digital input = 5 V Digital inputs = 0 V, 5 V, or VDD GND = 0 V ADG1436-EP Enhanced Product 12 V SINGLE SUPPLY VDD = 12 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted. Table 2. Parameter ANALOG SWITCH Analog Signal Range On Resistance, RON On-Resistance Match Between Channels, ∆RON On-Resistance Flatness, RFLAT(ON) Continuous Current Per Channel1 LEAKAGE CURRENTS Source Off Leakage, IS (Off ) Drain Off Leakage, ID (Off ) Channel On Leakage, ID, IS (On) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH 25°C 2.8 3.5 0.13 0.21 0.6 1.1 240 ±0.04 ±0.55 ±0.04 ±0.55 ±0.1 ±1 −55°C to +125°C Unit 0 V to VDD V Ω typ Ω max Ω typ Ω max Ω typ Ω max mA max 4.8 0.25 1.3 100 ±12.5 ±12.5 ±35 2.0 0.8 0.001 ±0.1 Digital Input Capacitance, CIN DYNAMIC CHARACTERISTICS1 Transition Time, tTRANSITION Break-Before-Make Time Delay, tBBM 3.5 200 270 70 350 10 Charge Injection Off Isolation Channel-to-Channel Crosstalk −3 dB Bandwidth Insertion Loss CS (Off ) CD (Off ) CD, CS (On) POWER REQUIREMENTS IDD 30 −80 −80 78 −0.3 40 80 140 0.001 1.0 IDD VDD 1 170 285 5/16.5 Guaranteed by design, not subject to production test. Rev. 0 | Page 4 of 10 nA typ nA max nA typ nA max nA typ nA max V min V max µA typ µA max pF typ ns typ ns max ns typ ns min pC typ dB typ dB typ MHz typ dB typ pF typ pF typ pF typ µA typ µA max µA typ µA max V min/max Test Conditions/Comments VS = 0 V to 10 V, IS = −10 mA VDD = 10.8 V, VSS = 0 V VS = 0 V to 10 V, IS = −10 mA VS = 0 V to 10 V, IS = −10 mA VDD = 10.8 V, VSS = 0 V VDD = 13.2 V, VSS = 0 V VS = 1 V/10 V, VD = 10 V/1 V VS = 1 V/10 V, VD = 10 V/1 V VS = VD = 1 V or 10 V VIN = VGND or VDD RL = 300 Ω, CL = 35 pF VS = 8 V RL = 300 Ω, CL = 35 pF VS1 = VS2 = 8 V VS = 6 V, RS = 0 Ω, CL = 1 nF RL = 50 Ω, CL = 5 pF, f = 100 kHz RL = 50 Ω, CL = 5 pF, f = 100 kHz RL = 50 Ω, CL = 5 pF RL = 50 Ω, CL = 5 pF, f = 1 MHz f = 1 MHz, VS = 6 V f = 1 MHz, VS = 6 V f = 1 MHz, VS = 6 V VDD = 13.2 V Digital inputs = 0 V or VDD Digital inputs = 5 V GND = 0 V, VSS = 0 V Enhanced Product ADG1436-EP 5 V DUAL SUPPLY VDD = 5 V ± 10%, VSS = −5 V ± 10%, GND = 0 V, unless otherwise noted. Table 3. Parameter ANALOG SWITCH Analog Signal Range On Resistance, RON On-Resistance Match Between Channels, ∆RON On-Resistance Flatness, RFLAT(ON) Continuous Current Per Channel1 LEAKAGE CURRENTS Source Off Leakage, IS (Off ) Drain Off Leakage, ID (Off ) Channel On Leakage, ID, IS (On) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH 25°C 3.3 4 0.13 0.22 0.9 1.1 240 −55°C to +125°C Unit VDD to VSS V Ω typ Ω max Ω typ Ω max Ω typ Ω max mA max 5.4 0.25 1.31 100 ±0.03 nA typ ±0.2 ±0.03 ±12.5 ±0.2 ±0.05 ±0.25 ±12.5 ±35 2.0 0.8 0.001 ±0.1 Digital Input Capacitance, CIN DYNAMIC CHARACTERISTICS1 Transition Time, tTRANSITION Break-Before-Make Time Delay, tBBM 3.5 310 445 80 565 10 Charge Injection Off Isolation Channel-to-Channel Crosstalk Total Harmonic Distortion + Noise −3 dB Bandwidth Insertion Loss CS (Off ) CD (Off ) CD, CS (On) POWER REQUIREMENTS IDD 30 −80 −80 0.03 85 −0.28 33 65 145 0.001 1.0 ISS VDD/VSS 1 0.001 1.0 ±4.5/±16.5 Guaranteed by design, not subject to production test. Rev. 0 | Page 5 of 10 nA max nA typ Test Conditions/Comments VS = ±4.5 V, IS = −10 mA VDD = +4.5 V, VSS = −4.5 V VS = ±4.5 V, IS = −10 mA VS = ±4.5 V, IS = −10 mA VDD = +4.5 V, VSS = −4. 5 V VDD = +5.5 V, VSS = −5.5 V VS = ±4.5 V, VD = ∓4.5 V VS = ±4.5 V, VD = ∓4.5 V nA max nA typ nA max VS = VD = ±4.5 V V min V max µA typ µA max pF typ VIN = VGND or VDD ns typ ns max ns typ ns min pC typ dB typ dB typ % typ MHz typ dB typ pF typ pF typ pF typ µA typ µA max µA typ µA max V min/max RL = 300 Ω, CL = 35 pF VS = 3 V RL = 300 Ω, CL = 35 pF VS1 = VS2 = 3 V VS = 0 V, RS = 0 Ω, CL = 1 nF RL = 50 Ω, CL = 5 pF, f = 100 kHz RL = 50 Ω, CL = 5 pF, f = 100 kHz RL = 110 Ω, 2.5 V pp, f = 20 Hz to 20 kHz RL = 50 Ω, CL = 5 pF RL = 50 Ω, CL = 5 pF, f = 1 MHz VS = 0 V, f = 1 MHz VS = 0 V, f = 1 MHz VS = 0 V, f = 1 MHz VDD = +5.5 V, VSS = −5.5 V Digital inputs = 0 V or VDD Digital inputs = 0 V or VDD GND = 0 V ADG1436-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. THERMAL RESISTANCE Table 4. Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. Peak Current, S or D Continuous Power Dissipation2 Operating Temperature Range Storage Temperature Range Junction Temperature Reflow Soldering Peak Temperature, Pb-Free Overvoltages at IN, S, and D are clamped by internal diodes. Current must be limited to the maximum ratings given. 2 Calculated based on Table 3 model. 1 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. Table 5. Thermal Resistance Package Type1 RU-16 1 θJA 112 Unit °C/W Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board. See JEDEC JESD-51. 1.2 1.0 0.8 0.6 0.4 0.2 0 –55 –35 –15 5 25 45 65 85 105 125 AMBIENT TEMPERATURE (°C) Figure 2. Maximum Power Dissipation vs. Ambient Temperature ESD CAUTION Rev. 0 | Page 6 of 10 17169-202 Digital Inputs1 Ratings 35 V −0.3 V to +25 V +0.3 V to −25 V VSS − 0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first GND − 0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first 600 mA (pulsed at 1 ms, 10% duty cycle maximum) See Figure 2 −55°C to +125°C −65°C to +150°C 150°C 260(+0/−5)°C MAXIMUM POWER DISSIPATION (W) Parameter VDD to VSS VDD to GND VSS to GND Analog Inputs1 Enhanced Product ADG1436-EP PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS IN1 1 16 NC S1A 2 15 NC D1 3 14 NC S1B 4 ADG1436-EP VSS 5 TOP VIEW (Not to Scale) 12 S2B 11 D2 NC 7 10 S2A NC 8 9 IN2 NC = NO CONNECT 17169-003 GND 6 13 VDD Figure 3. Pin Configuration Table 6. Pin Function Descriptions Pin No. 1 2 3 4 5 6 7, 8, 14 to 16 9 10 11 12 13 Mnemonic IN1 S1A D1 S1B VSS GND NC IN2 S2A D2 S2B VDD Function Logic Control Input. Source Terminal. Can be an input or output. Drain Terminal. Can be an input or output. Source Terminal. Can be an input or output. Most Negative Power Supply Potential. Ground (0 V) Reference. No Connect. Logic Control Input. Source Terminal. Can be an input or output. Drain Terminal. Can be an input or output. Source Terminal. Can be an input or output. Most Positive Power Supply Potential. TRUTH TABLE FOR SWITCHES Table 7. Truth Table INx 0 1 SxA Off On SxB On Off Rev. 0 | Page 7 of 10 ADG1436-EP Enhanced Product TYPICAL PERFORMANCE CHARACTERISTICS 3.0 4.5 4.0 2.5 ON RESISTANCE (Ω) ON RESISTANCE (Ω) 3.5 TA = +125°C 2.0 TA = +85°C TA = +25°C 1.5 TA = –55°C 1.0 TA = +125°C 3.0 TA = +85°C 2.5 TA = +25°C 2.0 TA = –55°C 1.5 1.0 –10 –5 5 0 15 10 VS OR VD (V) 0 0 500 4.5 450 4.0 8 TRANSITION TIME (ns) 3.5 TA = +85°C 3.0 TA = +25°C 2.5 2.0 TA = –55°C 1.5 1.0 –3 12 350 300 VDD = +12V VSS = 0V 250 200 150 100 VDD = +5V VSS = –5V IS = –10mA –4 10 VDD = +5V VSS = –5V 400 TA = +125°C VDD = +15V VSS = –15V 50 –2 –1 0 1 2 3 4 5 VS OR VD (V) 17169-108 ON RESISTANCE (Ω) 6 Figure 6. On Resistance vs. VS or VD for Different Temperatures, Single Supply 5.0 0 –5 4 VS OR VD (V) Figure 4. On Resistance vs. VS or VD for Different Temperatures, 15 V Dual Supply 0.5 2 Figure 5. On Resistance vs. VS or VD for Different Temperatures, 5 V Dual Supply 0 –55 –35 –15 5 25 45 65 85 TEMPERATURE (°C) Figure 7. Transition Time vs. Temperature Rev. 0 | Page 8 of 10 105 125 17169-217 0 –15 VDD = 12V VSS = 0V IS = –10mA 0.5 17169-109 VDD = +15V VSS = –15V IS = –10mA 17169-107 0.5 ADG1436-EP 2 1.0 1 0.5 0 IS (OFF) + – ID (OFF) + – IS (OFF) – + ID (OFF) – + ID, IS (ON) + + ID, IS (ON) – – –0.5 –1.0 –1.5 VDD = +5V VSS = –5V VBIAS = +4.5V/–4.5V –2.0 –2.5 0 20 40 60 80 100 120 IS (OFF) + – ID (OFF) + – IS (OFF) – + ID (OFF) – + ID, IS (ON) + + ID, IS (ON) – – 1 0 VDD = 12V VSS = 0V VBIAS = 1V/10V 20 40 60 80 100 120 TEMPERATURE (°C) 17169-112 LEAKAGE CURRENTS (nA) 5 0 –5 VDD = +15V VSS = –15V VBIAS = +10V/–10V 20 40 60 80 100 120 Figure 10. Leakage Currents vs. Temperature, 15 V Dual Supply 6 –2 –4 TEMPERATURE (°C) 7 –1 –3 0 8 2 IS (OFF) + – ID (OFF) + – IS (OFF) – + ID (OFF) – + ID, IS (ON) + + ID, IS (ON) – – –2 –7 Figure 8. Leakage Currents vs. Temperature, 5 V Dual Supply 3 –1 –6 TEMPERATURE (°C) 4 0 Figure 9. Leakage Currents vs. Temperature, 12 V Single Supply Rev. 0 | Page 9 of 10 17169-111 LEAKAGE CURRENTS (nA) 1.5 17169-113 LEAKAGE CURRENTS (nA) Enhanced Product ADG1436-EP Enhanced Product OUTLINE DIMENSIONS 5.10 5.00 4.90 16 9 4.50 4.40 4.30 6.40 BSC 1 8 PIN 1 1.20 MAX 0.15 0.05 0.20 0.09 0.30 0.19 0.65 BSC COPLANARITY 0.10 SEATING PLANE 8° 0° 0.75 0.60 0.45 COMPLIANT TO JEDEC STANDARDS MO-153-AB Figure 11. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters ORDERING GUIDE Model1 ADG1436TRUZ-EP ADG1436TRUZ-EPR7 1 Temperature Range −55°C to +125°C −55°C to +125°C Package Description 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] Z = RoHS Compliant Part. ©2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D17169-0-8/18(0) Rev. 0 | Page 10 of 10 Package Option RU-16 RU-16
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