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ADG3246BRUZ

ADG3246BRUZ

  • 厂商:

    AD(亚德诺)

  • 封装:

    TSSOP24_7.8X4.4MM

  • 描述:

    IC BUS SWITCH 10 X 1:1 24TSSOP

  • 数据手册
  • 价格&库存
ADG3246BRUZ 数据手册
Data Sheet ADG3246 2.5 V/3.3 V, 10-Bit, 2-Port Level Translating, Bus Switch FEATURES ► ► ► ► ► ► ► ► FUNCTIONAL BLOCK DIAGRAM 225 ps Propagation Delay through the Switch 4.5 Ω Switch Connection between Ports Data Rate 1.244 Gbps 2.5 V/3.3 V Supply Operation Selectable Level Shifting/Translation Small Signal Bandwidth 610 MHz Level Translation ► 3.3 V to 2.5 V ► 3.3 V to 1.8 V ► 2.5 V to 1.8 V 24-Lead LFCSP Package Figure 1. APPLICATIONS ► ► ► ► ► ► ► ► 3.3 V to 1.8 V Voltage Translation 3.3 V to 2.5 V Voltage Translation 2.5 V to 1.8 V Voltage Translation Bus Switching Bus Isolation Hot Swap Hot Plug Analog Signal Switching GENERAL DESCRIPTION The ADG3246 is a 2.5 V or 3.3 V, 10-bit, 2-port digital switch. It is designed on Analog Devices’ low voltage CMOS process, which provides low power dissipation yet gives high switching speed and very low on resistance, allowing inputs to be connected to outputs without additional propagation delay or generating additional ground bounce noise. The switches are enabled by means of the bus enable (BE) input signal. These digital switches allow bidirectional signals to be switched when ON. In the OFF condition, signal levels up to the supplies are blocked. PRODUCT HIGHLIGHTS 1. 2. 3. 4. 5. 3.3 V or 2.5 V supply operation. Extremely low propagation delay through switch. 4.5 Ω switches connect inputs to outputs. Level/voltage translation. 24-lead 4 mm × 4 mm LFCSP package. This device is ideal for applications requiring level translation. When operated from a 3.3 V supply, level translation from 3.3 V inputs to 2.5 V outputs occurs. Similarly, if the device is operated from a 2.5 V supply and 2.5 V inputs are applied, the device will translate the outputs to 1.8 V. In addition to this, the ADG3246 has a level translating select pin (SEL). When SEL is low, VCC is reduced internally, allowing for level translation between 3.3 V inputs and 1.8 V outputs. This makes the device suited to applications requiring level translation between different supplies, such as converter to DSP/microcontroller interfacing. Rev. B DOCUMENT FEEDBACK TECHNICAL SUPPORT Information furnished by Analog Devices is believed to be accurate and reliable "as is". However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. Data Sheet ADG3246 TABLE OF CONTENTS Features................................................................ 1 Applications........................................................... 1 Functional Block Diagram......................................1 General Description...............................................1 Product Highlights................................................. 1 Specifications........................................................ 3 Absolute Maximum Ratings...................................6 Thermal Resistance........................................... 6 Electrostatic Discharge (ESD) Ratings ..............6 ESD Ratings for ADG3246.................................6 ESD Caution.......................................................6 Pin Configuration and Function Descriptions........ 7 Typical Performance Characteristics..................... 8 Test Circuits......................................................... 12 Terminology......................................................... 13 Applications Information...................................... 14 Bus Switch Applications................................... 14 Package and Pinout......................................... 16 Outline Dimensions............................................. 17 Ordering Guide.................................................17 REVISION HISTORY 8/2022—Rev. A to Rev. B Updated Format (Universal).............................................................................................................................1 Changes to Table 1.......................................................................................................................................... 3 Changes to Table 2.......................................................................................................................................... 6 Added Thermal Resistance Section and Table 3; Renumbered Sequentially..................................................6 Added Electrostatic Discharge (ESD) Ratings Section....................................................................................6 Added ESD Ratings for ADG3246 Section and Table 4.................................................................................. 6 Changes to Figure 3 Caption to Figure 8 Caption........................................................................................... 8 Changes to Figure 9 Caption and Figure 10 Caption...................................................................................... 9 Changes to Figure 18 Caption and Figure 19 Caption.................................................................................. 10 Changed Timing Measurement Information Section to Test Circuits Section................................................ 12 Changed High Impedance During Power-Up/Power-Down Section to High Impedance During PowerUp and Power-Down Section.......................................................................................................................16 Updated Outline Dimensions......................................................................................................................... 17 Changes to Ordering Guide........................................................................................................................... 17 analog.com Rev. B | 2 of 17 Data Sheet ADG3246 SPECIFICATIONS VCC = 2.3 V to 3.6 V, GND = 0 V, all specifications TMIN to TMAX, unless otherwise noted. Table 1. Parameter +25°C DC ELECTRICAL CHARACTERISTICS Input High Voltage (VINH) Input Low Voltage (VINL) Input Leakage Current (II) ±0.01 OFF State Leakage Current (IOZ OFF) ±0.01 ON State Leakage Current (IOZ ON) ±0.01 Maximum Pass Voltage (VP) 2.5 −40°C to +85°C −40°C to +105°C 2.0 1.7 0.8 0.7 2.0 1.7 0.8 0.7 ±1 ±1 ±1 ±1 ±1 ±1 2.0 2.9 2.0 2.9 1.5 2.1 1.5 2.1 1.5 2.1 1.5 2.1 1.8 1.8 CAPACITANCE A Port Off Capacitance (CA OFF) B Port Off Capacitance (CB OFF) A, B Port On Capacitance (CA, CB ON) Control Input Capacitance (CIN) SWITCHING CHARACTERISTICS Propagation Delay A to B or B to A1 (tPD) 5 5 10 6 0.225 3.5 0.275 2 Propagation Delay Matching2 (ΔtPD) 22.5 200 37.5 200 Bus Enable Time BE to A or B3 (tPZH, tPZL) 3.2 1 4.8 2.2 0.5 3.3 2.2 0.5 3 Bus Disable Time BE to A or B3 (tPHZ, tPLZ) 3.2 1 4.8 analog.com Unit Test Conditions/Comments V min V min V max V max μA typ μA max μA typ μA max μA typ μA max V typ V min Vmax V typ V min V max V typ V min V max VCC = 2.7 V to 3.6 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 2.3 V to 2.7 V 0 ≤ A, B ≤ VCC 0 ≤ A, B ≤ VCC 0 ≤ A, B ≤ VCC 0 ≤ A, B ≤ VCC VA/VB = VCC = SEL = 3.3 V, IO = –5 μA VA/VB = VCC = SEL = 2.5 V, IO = –5 μA VA/VB = VCC = 3.3 V, SEL = 0 V, IO = –5 μA pF pF pF pF f = 1 MHz f = 1 MHz f = 1 MHz f = 1 MHz ns typ ns max ns typ ns max ps typ ps max ps typ ps max ns typ ns min ns max ns typ ns min ns max ns typ ns min ns max ns typ ns min ns max CL = 50 pF, VCC = 3 V, SEL = 3 V CL = 50 pF, VCC = 3.3 V, SEL = 0 V CL = 50 pF, VCC = 3 V, SEL = 3 V CL = 50 pF, VCC = 3.3 V, SEL = 0 V VCC = 3.0 V to 3.6 V, SEL = VCC VCC = 3.0 V to 3.6 V, SEL = 0 V VCC = 2.3 V to 2.7 V, SEL = VCC VCC = 3.0 V to 3.6 V, SEL = VCC Rev. B | 3 of 17 Data Sheet ADG3246 SPECIFICATIONS Table 1. Parameter +25°C −40°C to +85°C −40°C to +105°C 1.7 0.5 2.9 1.75 0.5 2.6 Maximum Data Rate 1.244 Channel Jitter Operating Frequency—Bus Enable (fBE) 50 0.2 DIGITAL SWITCH On Resistance (RON) 10 4.5 8 15 28 5 9 11 18 5 8 40 5.5 40 14 240 11 40 On Resistance Matching (ΔRON) 0.45 4 0.75 4 0.65 4 0.85 4 POWER REQUIREMENTS Positive Power Supply Voltage (VCC) Quiescent Power Supply Current (ICC) 2.3 3.6 2.3 3.6 0.001 1 2 1.2 1.3 0.65 analog.com Unit Test Conditions/Comments ns typ ns min ns max ns typ ns min ns max Gbps typ Gbps max ps p-p MHz max VCC = 3.0 V to 3.6 V, SEL = 0 V Ω typ Ω max Ω typ Ω max Ω typ Ω max Ω typ Ω max Ω typ Ω max Ω typ Ω max Ω typ Ω max Ω typ Ω max Ω typ Ω max Ω typ Ω max Ω typ Ω max Ω typ Ω max VCC = 3 V, SEL = 3 V, VA = 0 V, IBA = 8 mA V min V max μA typ μA max mA typ mA max VCC = 2.3 V to 2.7 V, SEL = VCC VCC = 3.3 V, SEL = 3.3 V; VA/VB = 2 V VCC = 3.3 V, SEL = 3.3 V; VA/VB = 2 V VCC = 3 V, SEL = 3 V, VA = 1.7 V, IBA = 8 mA VCC = 2.3 V, SEL = 2.3 V, VA = 0 V, IBA = 8 mA VCC = 2.3 V, SEL = 2.3 V, VA = 1 V, IBA = 8 mA VCC = 3 V, SEL = 0 V, VA = 0 V, IBA = 8 mA VCC = 3.3 V, SEL = 0 V, VA = 0 V, IBA = 8 mA VCC = 3 V, SEL= 0 V, VA = 1 V, IBA = 8 mA VCC = 3.3 V, SEL= 0 V, VA = 1 V, IBA = 8 mA VCC = 3 V, SEL = 3 V, VA = 0 V, IBA = 8 mA VCC = 3.3 V, SEL= 0 V, VA = 0 V, IBA = 8 mA VCC = 3 V, SEL = 3 V, VA = 1 V, IBA = 8 mA VCC = 3.3 V, SEL= 0 V, VA = 1 V, IBA = 8 mA Digital Inputs = 0 V or VCC, SEL = VCC Digital Inputs = 0 V or VCC, SEL = 0 V Rev. B | 4 of 17 Data Sheet ADG3246 SPECIFICATIONS Table 1. Parameter Increase in ICC per Input4 (ΔICC) +25°C −40°C to +85°C 130 −40°C to +105°C Unit Test Conditions/Comments μA max VCC = 3.6 V, SEL = 3.6 V, BE = 3.0 V 1 The digital switch contributes no propagation delay other than the RC delay of the typical RON of the switch and the load capacitance when driven by an ideal voltage source. Since the time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagation delay to the system. Propagation delay of the digital switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side. This specification is calculated by using the following equation: tPD = RON × CL, where RON is 4.5 Ω and CL is 50 pF. 2 Propagation delay matching between channels is calculated from the on resistance matching and load capacitance of 50 pF. This specification is calculated by using the following equation: ∆tPD = ∆RON × CL, where RON is 0.45 Ω and CL is 50 pF. 3 See the Test Circuits section. 4 This current applies to the control pin (BE) only. The A and B ports contribute no significant AC or DC currents as they transition. analog.com Rev. B | 5 of 17 Data Sheet ADG3246 ABSOLUTE MAXIMUM RATINGS TA = 25 ℃, unless otherwise noted. ELECTROSTATIC DISCHARGE (ESD) RATINGS Table 2. The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only. Parameter Rating VCC to GND Digital Inputs to GND DC Input Voltage DC Output Current Operating Temperature Range Storage Temperature Range Junction Temperature Reflow Soldering Peak Temperature, Pb-Free –0.5 V to +4.6 V –0.5 V to +4.6 V –0.5 V to +4.6 V 25 mA per channel –40°C to +105°C –65°C to +150°C 150°C As per JEDEC J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. ESD RATINGS FOR ADG3246 Table 4. ADG3246, 24-Lead LFCSP ESD Model Withstand Threshold (kV) Class HBM1 1 Class 1 1 This is the HBM for the input/output port to supplies, the input/output port to input/output port, and for all other pins. ESD CAUTION ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJA is the natural convection junction-to-ambient thermal resistance measured in a one cubic foot sealed enclosure. Table 3. Thermal Resistance Package Type1 θJA Unit CP-24-10 35 ℃/W 1 Test Condition 1: Thermal impedance simulated values are based on JEDEC 2S2P thermal test board with four thermal vias. See the JEDEC JESD-51. analog.com Rev. B | 6 of 17 Data Sheet ADG3246 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS Figure 2. Pin Configuration Table 5. Pin Function Descriptions Pin No. Mnemonic Description 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 EP SEL A5 A6 A7 A8 A9 GND B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 BE VCC A0 A1 A2 A3 A4 EPAD Level Translation Select (Active Low). Port A5. This pin can be an input or output. Port A6. This pin can be an input or output. Port A7. This pin can be an input or output. Port A8. This pin can be an input or output. Port A9. This pin can be an input or output. Ground (0 V) Reference. Port B9. This pin can be an input or output. Port B8. This pin can be an input or output. Port B7. This pin can be an input or output. Port B6. This pin can be an input or output. Port B5. This pin can be an input or output. Port B4. This pin can be an input or output. Port B3. This pin can be an input or output. Port B2. This pin can be an input or output. Port B1. This pin can be an input or output. Port B0. This pin can be an input or output. Bus Enable (Active Low). Positive Power Supply Potential. Port A0. This pin can be an input or output. Port A1. This pin can be an input or output. Port A2. This pin can be an input or output. Port A3. This pin can be an input or output. Port A4. This pin can be an input or output. Exposed Pad. It is recommended that the exposed pad be thermally connected to a copper plane enhanced thermal performance. The pad should be grounded as well. Table 6. Truth Table BE SEL1 Function L L H L H X A = B, 3.3 V to 1.8 V level shifting. A = B, 3.3 V to 2.5 V/2.5 V to 1.8 V level shifting. Disconnect. 1 SEL = 0 only when VCC = 3.3 V ± 10%. analog.com Rev. B | 7 of 17 Data Sheet ADG3246 TYPICAL PERFORMANCE CHARACTERISTICS Figure 3. On Resistance vs. Input Voltage, VCC = 3 V, 3.3 V, and 3.6 V Figure 4. On Resistance vs. Input Voltage, VCC = 2.3 V, 2.5 V, and 2.7 V Figure 6. On Resistance vs. Input Voltage for Different Temperatures, VCC = 3.3 V Figure 7. On Resistance vs. Input Voltage for Different Temperatures, VCC = 2.5 V Figure 5. On Resistance vs. Input Voltage, SEL = 0 V Figure 8. Pass Voltage vs. VCC, VCC = 3 V, 3.3 V, and 3.6 V analog.com Rev. B | 8 of 17 Data Sheet ADG3246 TYPICAL PERFORMANCE CHARACTERISTICS Figure 9. Pass Voltage vs. VCC, VCC = 2.3 V, 2.5 V, and 2.7 V Figure 12. Output Low Characteristic Figure 10. Pass Voltage vs. VCC, SEL = 0 V Figure 13. Output High Characteristic Figure 11. ICC vs. Enable Frequency Figure 14. Charge Injection vs. Source Voltage analog.com Rev. B | 9 of 17 Data Sheet ADG3246 TYPICAL PERFORMANCE CHARACTERISTICS analog.com Figure 15. Bandwidth vs. Frequency Figure 18. Enable/Disable Time vs. Temperature, VCC = 3.3 V Figure 16. Crosstalk vs. Frequency Figure 19. Enable/Disable Time vs. Temperature, VCC = 2.5 V Figure 17. Off Isolation vs. Frequency Figure 20. Jitter vs. Data Rate; PRBS 31 Rev. B | 10 of 17 Data Sheet ADG3246 TYPICAL PERFORMANCE CHARACTERISTICS Figure 21. Eye Width vs. Data Rate; PRBS 31 Figure 24. Jitter at 1.244 Gbps, PRBS 31 Figure 22. Eye Pattern; 1.244 Gbps, VCC = 3.3 V, PRBS 31 Figure 23. Eye Pattern; 1 Gbps, VCC = 2.5 V, PRBS 31 analog.com Rev. B | 11 of 17 Data Sheet ADG3246 TEST CIRCUITS For the following load circuit and waveforms, the notation that is used is VIN and VOUT, where VIN = VA and VOUT = VB or VIN = VB and VOUT = VA. For VCC = 3.3 V ± 0.3 V (SEL = VCC), RL = 500 Ω, VA = 300 mV, CL = 50 pF, and VT = 1.5 V. For VCC = 2.5 V ± 0.2 V (SEL = VCC), RL = 500 Ω, VA = 150 mV, CL = 30 pF, and VT = 0.9 V. Figure 27. Enable and Disable Time Figure 25. Load Circuit Table 7. Switch Position Test S1 tPLZ, tPZL 2 × VCC tPHZ, tPZH GND Figure 26. Propagation Delay analog.com Rev. B | 12 of 17 Data Sheet ADG3246 TERMINOLOGY VCC ΔICC Positive Power Supply Voltage. Extra power supply current component for the BE control input when the input is not driven at the supplies. GND Ground (0 V) Reference. tPLH, tPHL Minimum Input Voltage for Logic 1. Data Propagation Delay through the Switch in the ON State. Propagation delay is related to the RC time constant RON × CL, where CLL is the load capacitance. VINL tPZH, tPZL Minimum Input Voltage for Logic 0. II Bus Enable Times. These are times taken to cross the VT voltage at the switch output when the switch turns on in response to the control signal, BE. Input Leakage Current at the Control Inputs. tPHZ, tPLZ IOZ Bus Disable Times. This is the time taken to place the switch in the high impedance OFF state in response to the control signal. It is measured as the time taken for the output voltage to change by V∆ from the original quiescent level, with reference to the logic level transition at the control input. (Refer to Figure 27 for enable and disable times.) VINH OFF State Leakage Current. It is the maximum leakage current at the switch pin in the OFF state. IOL ON State Leakage Current. It is the maximum leakage current at the switch pin in the ON state. Max Data Rate VP Maximum Rate at which Data Can be Passed through the Switch. Maximum Pass Voltage. The maximum pass voltage relates to the clipped output voltage of an NMOS device when the switch input voltage is equal to the supply voltage. Channel Jitter RON Ohmic Resistance Offered by a Switch in the ON State. It is measured at a given voltage by forcing a specified amount of current through the switch. Peak-to-Peak Value of the Sum of the Deterministic and Random Jitter of the Switch Channel. fBE Operating Frequency of Bus Enable. This is the maximum frequency at which bus enable (BE) can be toggled. ΔRON On Resistance Match between Any Two Channels, that is, RON Max – RON Min. CX OFF OFF Switch Capacitance. CX ON ON Switch Capacitance. CIN Control Input Capacitance. This consists of BE and SEL. ICC Quiescent Power Supply Current. It is measured when all control inputs are at a logic HIGH or LOW level and the switches are OFF. analog.com Rev. B | 13 of 17 Data Sheet ADG3246 APPLICATIONS INFORMATION BUS SWITCH APPLICATIONS Bus switches can used to provide an ideal solution for interfacing between mixed voltage systems. The ADG3246 is suitable for applications where voltage translation from 3.3 V technology to a lower voltage technology is needed. This device can translate from 3.3 V to 1.8 V, from 2.5 V to 1.8 V, or from 3.3 V directly to 2.5 V. Figure 28 shows a block diagram of a typical application in which a user needs to interface between a 3.3 V ADC and a 2.5 V microprocessor. The microprocessor may not have 3.3 V tolerant inputs, therefore placing the ADG3246 between the two devices allows the devices to communicate easily. The bus switch directly connects the two blocks, thus introducing minimal propagation delay, timing skew, or noise. Figure 30. 3.3 V to 2.5 V Voltage Translation, SEL = VCC This device can be used for translation from 2.5 V to 3.3 V devices and also between two 3.3 V devices. 2.5 V to 1.8 V Translation Figure 28. Level Translation Between a 3.3 V ADC and a 2.5 V Microprocessor When VCC is 2.5 V (SEL = VCC) and the input signal range is 0 V to VCC, the maximum output signal will, as before, be clamped to within a voltage threshold below the VCC supply. Mixed Voltage Operation, Level Translation 3.3 V to 2.5 V Translation When VCC is 3.3 V (SEL = VCC) and the input signal range is 0 V to VCC, the maximum output signal will be clamped to within a voltage threshold below the VCC supply. Figure 31. 2.5 V to 1.8 V Voltage Translation, SEL = VCC In this case, the output is limited to approximately 1.8 V, as shown in Figure 32. Figure 29. 3.3 V to 2.5 V Voltage Translation, SEL = VCC In this case, the output will be limited to 2.5 V, as shown in Figure 30. Figure 32. 2.5 V to 1.8 V Voltage Translation, SEL = VCC analog.com Rev. B | 14 of 17 Data Sheet ADG3246 APPLICATIONS INFORMATION 3.3 V to 1.8 V Translation The ADG3246 offers the option of interfacing between a 3.3 V device and a 1.8 V device. This is possible through use of the SEL pin. SEL pin: An active low control pin. SEL activates internal circuitry in the ADG3246 that allows voltage translation between 3.3 V devices and 1.8 V devices. Figure 35. Location of Bus Switch in a Bus Isolation Application Hot Plug and Hot Swap Isolation The ADG3246 is suitable for hot swap and hot plug applications. The output signal of the ADG3246 is limited to a voltage that is below the VCC supply, as shown in Figure 30, Figure 32, and Figure 34. Therefore the switch acts like a buffer to take the impact from hot insertion, protecting vital and expensive chipsets from damage. Figure 33. 3.3 V to 1.8 V Voltage Translation, SEL = 0 V When VCC is 3.3 V and the input signal range is 0 V to VCC, the maximum output signal will be clamped to 1.8 V, as shown in Figure 34. To do this, the SEL pin must be tied to Logic 0. If SEL is unused, it should be tied directly to VCC. In hot-plug applications, the system cannot be shut down when new hardware is being added. To overcome this, a bus switch can be positioned on the backplane between the bus devices and the hot plug connectors. The bus switch is turned off during hot plug. Figure 36 shows a typical example of this type of application. Figure 36. ADG3246 in a Hot Plug Application Figure 34. 3.3 V to 1.8 V Voltage Translation, SEL = 0 V Bus Isolation A common requirement of bus architectures is low capacitance loading of the bus. Such systems require bus bridge devices that extend the number of loads on the bus without exceeding the specifications. Because the ADG3246 is designed specifically for applications that do not need drive yet require simple logic functions, it solves this requirement. The device isolates access to the bus, thus minimizing capacitance loading. analog.com There are many systems that require the ability to handle hot swapping, such as docking stations, PCI boards for servers, and line cards for telecommunications switches. If the bus can be isolated prior to insertion or removal, then there is more control over the hot swap event. This isolation can be achieved using a bus switch. The bus switches are positioned on the hot swap card between the connector and the devices. During hot swap, the ground pin of the hot swap card must connect to the ground pin of the back plane before any other signal or power pins. Analog Switching Bus switches can be used in many analog switching applications, for example, video graphics. Bus switches can have lower on resistance, smaller ON and OFF channel capacitance and thus improved frequency performance than their analog counterparts. The bus switch channel itself consisting solely of an NMOS switch limits the operating voltage (see Figure 3 for a typical plot), but in many cases, this does not present an issue. Rev. B | 15 of 17 Data Sheet ADG3246 APPLICATIONS INFORMATION High Impedance During Power-Up and PowerDown To ensure the high impedance state during power-up or powerdown, BE should be tied to VCC through a pull-up resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. PACKAGE AND PINOUT The ADG3246 is packaged in a tiny 24-lead LFCSP package. The area of the LFCSP option is 16 mm2. This makes the LFCSP option an excellent choice for space-constrained applications. analog.com Rev. B | 16 of 17 Data Sheet ADG3246 OUTLINE DIMENSIONS Figure 37. 24-Lead Lead Frame Chip Scale Package (LFCSP) 4 mm × 4 mm Body and 0.75 mm Package Height (CP-24-10) Dimension shown in millimeters Updated: April 30, 2022 ORDERING GUIDE Model1 Temperature Range Package Description Packing Quantity Package Option ADG3246BCPZ ADG3246BCPZ-REEL7 -40°C to +105°C -40°C to +105°C 24-Lead LFCSP (4mm x 4mm x 0.75mm w/ EP) 24-Lead LFCSP (4mm x 4mm x 0.75mm w/ EP) Reel, 1500 CP-24-10 CP-24-10 1 Z = RoHS Compliant Part. ©2016-2022 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. One Analog Way, Wilmington, MA 01887-2356, U.S.A. Rev. B | 17 of 17
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ADG3246BRUZ
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