ADG719BRMZ

CMOS 1.8 V to 5.5 V, 2.5 Ω 2:1 Mux/SPDT Switch in SOT-23 ADG719 FEATURES FUNCTIONAL BLOCK DIAGRAM 1.8 V to 5.5 V single supply 4 Ω (max) on resistance 0.75 Ω (typ) on resistance flatness −3 dB bandwidth > 200 MHz Rail-to-rail operation 6-Lead SOT-23 package and 8-Lead MSOP package Fast switching times: tON = 12 ns tOFF = 6 ns Typical power consumption: (< 0.01 μW) TTL/CMOS compatible ADG719 S2 D S1 NOTES 1. SWITCHES SHOWN FOR A LOGIC 1 INPUT. 08708-001 IN Figure 1. APPLICATIONS Battery-powered systems Communication systems Sample-and-hold systems Audio signal routing Video switching Mechanical reed relay replacement GENERAL DESCRIPTION PRODUCT HIGHLIGHTS The ADG719 is a monolithic CMOS SPDT switch. This switch is designed on a submicron process that provides low power dissipation yet gives high switching speed, low on resistance, and low leakage currents. 1. 1.8 V to 5.5 V Single-Supply Operation. The ADG719 offers high performance, including low on resistance and fast switching times, and is fully specified and guaranteed with 3 V and 5 V supply rails. The ADG719 can operate from a single-supply range of 1.8 V to 5.5 V, making it ideal for use in battery-powered instruments and with the new generation of DACs and ADCs from Analog Devices, Inc. 2. Very Low RON (4 Ω Max at 5 V and 10 Ω Max at 3 V). At 1.8 V operation, RON is typically 40 Ω over the temperature range. 3. Automotive Temperature Range: −40°C to +125°C. 4. On Resistance Flatness (RFLAT(ON)) (0.75 Ω typ). 5. −3 dB Bandwidth > 200 MHz. 6. Low Power Dissipation. CMOS construction ensures low power dissipation. 7. Fast tON/tOFF. 8. Tiny, 6-lead SOT-23 and 8-lead MSOP packages. Each switch of the ADG719 conducts equally well in both directions when on. The ADG719 exhibits break-before-make switching action. Because of the advanced submicron process, −3 dB bandwidths of greater than 200 MHz can be achieved. The ADG719 is available in a 6-lead SOT-23 package and an 8-lead MSOP package. Rev. D Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2002–2010 Analog Devices, Inc. All rights reserved. ADG719 TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ..............................................7 Applications ....................................................................................... 1 Test Circuits ........................................................................................9 Functional Block Diagram .............................................................. 1 Terminology .................................................................................... 11 General Description ......................................................................... 1 Applications Information .............................................................. 12 Product Highlights ........................................................................... 1 ADG719 Supply Voltages .......................................................... 12 Revision History ............................................................................... 2 On Response vs. Frequency ...................................................... 12 Specifications..................................................................................... 3 Off Isolation ................................................................................ 12 Absolute Maximum Ratings............................................................ 5 Outline Dimensions ....................................................................... 13 ESD Caution .................................................................................. 5 Ordering Guide .......................................................................... 14 Pin Configuration and Function Descriptions ............................. 6 REVISION HISTORY 3/10—Rev. C to Rev. D Removed B Version Text............................................... Throughout Changes to Figure 1 .......................................................................... 1 Deleted Endnote 1 (Table 1)............................................................ 3 Deleted Endnote 1 (Table 2)............................................................ 4 Changes to Figure 2 .......................................................................... 6 Changes to Ordering Guide .......................................................... 14 12/09—Rev. B to Rev. C Updated Format .................................................................. Universal Changes to Table 3 ............................................................................ 5 Added Table 4.................................................................................... 6 Changes to Terminology Section.................................................. 11 Updated Outline Dimensions ....................................................... 13 Changes to Ordering Guide .......................................................... 14 7/02—Rev. A to Rev. B. Changes to Product Name ............................................................... 1 Changes to Features.......................................................................... 1 Additions to Product Highlights .................................................... 1 Changes to Specifications ................................................................ 2 Edits to Absolute Maximum Ratings ............................................. 4 Changes to Terminology.................................................................. 4 Edits to Ordering Guide .................................................................. 4 Added New TPCs 4 and 5 ............................................................... 5 Replaced TPC 10............................................................................... 6 Test Circuits 6, 7, and 8 Replaced ................................................... 7 Updated RM-8 and RT-6 Package Outlines ................................. 9 Rev. D | Page 2 of 16 ADG719 SPECIFICATIONS VDD = 5 V ± 10%, GND = 0 V. Table 1. Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) +25°C 2.5 4 On Resistance Match Between Channels (ΔRON) On Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS IS (Off ) Source Off Leakage Channel On Leakage ID, IS (On) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH DYNAMIC CHARACTERISTICS 1 tON −40°C to +85°C −40°C to +125°C Unit 0 V to VDD V 5 7 Ω typ Ω max 0.1 0.4 0.4 1.2 1.5 0.75 ±0.01 ±0.25 ±0.01 ±0.25 VS = 0 V to VDD, IS = −10 mA VDD = 5.5 V VS = 4.5 V/1 V, VD = 1 V/4.5 V; See Figure 15 VS = VD = 1 V or VS = VD = 4.5 V; See Figure 16 1 ±0.35 5 2.4 0.8 V min V max μA typ μA max VIN = VINL or VINH ±0.1 RL = 300 Ω, CL = 35 pF VS = 3 V; See Figure 17 RL = 300 Ω, CL = 35 pF VS = 3 V; See Figure 17 RL = 300 Ω, CL = 35 pF, VS1 = VS2 = 3 V; See Figure 18 RL = 50 Ω, CL = 5 pF, f = 10 MHz RL = 50 Ω, CL = 5 pF, f = 1 MHz; See Figure 19 RL = 50 Ω, CL = 5 pF, f = 10 MHz RL = 50 Ω, CL = 5 pF, f = 1 MHz; See Figure 20 RL = 50 Ω, CL = 5 pF; See Figure 21 0.005 tOFF 3 Break-Before-Make Time Delay, tD 8 7 Off Isolation −67 −87 Channel-to-Channel Crosstalk −62 −82 dB typ dB typ 200 7 27 MHz typ pF typ pF typ 6 1 IDD VS = 0 V to VDD, IS = −10 mA ±0.35 ns typ ns max ns typ ns max ns typ ns min dB typ dB typ Bandwidth −3 dB CS (Off ) CD, CS (On) POWER REQUIREMENTS VS = 0 V to VDD, IS = −10 mA; See Figure 14 nA typ nA max nA typ nA max 12 VDD = 5.5 V Digital inputs = 0 V or 5.5 V 0.001 1.0 1 Ω typ Ω max Ω typ Ω max Test Conditions/Comments Guaranteed by design, not subject to production test. Rev. D | Page 3 of 16 μA typ μA max ADG719 VDD = 3 V ± 10%, GND = 0 V. Table 2. Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) +25°C −40°C to +85°C 6 7 10 On Resistance Match Between Channels (ΔRON) On Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source Off Leakage IS (Off ) Channel On Leakage ID, IS (On) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH DYNAMIC CHARACTERISTICS 1 tON ±0.01 ±0.25 ±0.01 ±0.25 −40°C to +125°C 0 V to VDD Unit V Test Conditions/Comments 12 Ω typ Ω max VS = 0 V to VDD, IS = −10 mA; See Figure 14 Ω typ Ω max Ω typ VS = 0 V to VDD, IS = −10 mA 0.1 0.4 2.5 0.4 ±0.35 1 ±0.35 5 nA typ nA max nA typ nA max 2.0 0.8 V min V max μA typ μA max VIN = VINL or VINH ±0.1 RL = 300 Ω, CL = 35 pF VS = 2 V; See Figure 17 RL = 300 Ω, CL = 35 pF VS = 2 V; See Figure 17 RL = 300 Ω, CL = 35 pF VS1 = VS2 = 2 V; See Figure 18 RL = 50 Ω, CL = 5 pF, f = 10 MHz RL = 50 Ω, CL = 5 pF, f = 1 MHz; See Figure 19 RL = 50 Ω, CL = 5 pF, f = 10 MHz RL = 50 Ω, CL = 5 pF, f = 1 MHz; See Figure 20 RL = 50 Ω, CL = 5 pF; See Figure 21 0.005 10 Break-Before-Make Time Delay, tD 8 Off Isolation −67 −87 ns typ ns max ns typ ns max ns typ ns min dB typ dB typ Channel-to-Channel Crosstalk −62 −82 dB typ dB typ Bandwidth −3 dB CS (Off ) CD, CS (On) 200 7 27 MHz typ pF typ pF typ 15 tOFF 4 8 1 POWER REQUIREMENTS IDD 1 VS = 0 V to VDD, IS = −10 mA VDD = 3.3 V VS = 3 V/1 V, VD = 1 V/3 V; See Figure 15 VS = VD = 1 V or VS = VD = 3 V; See Figure 16 VDD = 3.3 V Digital inputs = 0 V or 3.3 V 0.001 1.0 μA typ μA max Guaranteed by design, not subject to production test. Rev. D | Page 4 of 16 ADG719 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 3. Parameter VDD to GND Analog, Digital Inputs1 Peak Current, S or D Continuous Current, S or D Operating Temperature Range Storage Temperature Range Junction Temperature MSOP Package, Power Dissipation θJA Thermal Impedance θJC Thermal Impedance SOT-23 Package, Power Dissipation θJA Thermal Impedance θJC Thermal Impedance Lead Soldering Lead Temperature, Soldering (10 sec) IR Reflow, Peak Temperature (