1.8 V to 5.5 V single supply
4 Ω (max) on resistance
Low on resistance flatness
−3 dB bandwidth >200 MHz
Tiny package options
8-lead MSOP
3 mm × 2 mm LFCSP (A grade)
Fast switching times
tON, 20 ns
tOFF, 10 ns
Low power consumption (200 MHz.
Low power dissipation. CMOS construction ensures low
power dissipation.
8-lead MSOP and 3 mm × 2 mm LFCSP.
Rev. E
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2004-2011 Analog Devices, Inc. All rights reserved.
ADG721/ADG722/ADG723
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Terminology .......................................................................................7
Applications ....................................................................................... 1
Typical Performance Characteristics ..............................................8
Functional Block Diagrams ............................................................. 1
Test Circuits ..................................................................................... 10
General Description ......................................................................... 1
Applications..................................................................................... 12
Product Highlights ........................................................................... 1
ADG721/ADG722/ADG723 Supply Voltages ....................... 12
Revision History ............................................................................... 2
On Response vs. Frequency ...................................................... 12
Specifications..................................................................................... 3
Off Isolation ................................................................................ 12
Absolute Maximum Ratings............................................................ 5
Outline Dimensions ....................................................................... 13
ESD Caution .................................................................................. 5
Ordering Guide .......................................................................... 14
Pin Configuration and Pin Descriptions ....................................... 6
REVISION HISTORY
10/11—Rev. D to Rev. E
Changes to Ordering Guide ...............................................................
4/11—Rev. C to Rev. D
Changes to Ordering Guide .......................................................... 14
1/11—Rev. B to Rev. C
Changes to Table 4 ............................................................................ 6
Changes to Ordering Guide .......................................................... 14
2/07—Rev. A to Rev. B
Updated Format .................................................................. Universal
Changes to Specifications ................................................................ 3
Changes to Absolute Maximum Ratings ....................................... 5
Change to Figure 4 ........................................................................... 6
Updated Outline Dimensions ....................................................... 13
Changes to Ordering Guide .......................................................... 13
3/04—Rev. 0 to Rev. A
Additions to Applications ................................................................ 1
Changes to Ordering Guide ............................................................ 4
Updated Outline Dimensions ....................................................... 10
Rev. E | Page 2 of 16
Data Sheet
ADG721/ADG722/ADG723
SPECIFICATIONS
VDD = 5 V ± 10%, GND = 0 V. All specifications −40°C to +85°C, unless otherwise noted.
Table 1.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance, RON
A, B Grade 1
+25°C
−40°C to +85°C
0 to VDD
On Resistance Match Between Channels, ∆RON
2.5
4
0.3
On Resistance Flatness, RFLAT(ON)
0.85
5
1.0
1.5
LEAKAGE CURRENTS – A Grade
Source off Leakage, IS (OFF)
Drain off Leakage, ID (OFF)
Channel on Leakage, ID, IS (ON)
LEAKAGE CURRENTS – B Grade
Source off Leakage, IS (OFF)
Drain off Leakage, ID (OFF)
Channel on Leakage, ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
DYNAMIC CHARACTERISTICS 2
tON
±0.01
±0.01
±0.01
±0.01
±0.25
±0.01
±0.25
±0.01
±0.25
7
Charge Injection
Off Isolation
2
−60
−80
−77
−97
200
7
7
18
μA typ
μA max
VIN = VINL or VINH
±0.1
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
dB typ
dB typ
dB typ
dB typ
MHz typ
pF typ
pF typ
pF typ
RL = 300 Ω, CL = 35 pF
VS = 3 V, see Figure 15
RL = 300 Ω, CL = 35 pF
VS = 3 V, see Figure 15
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 3 V, see Figure 16
VS = 2 V, RS = 0 Ω, CL = 1 nF, see Figure 17
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 18
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 19
RL = 50 Ω, CL = 5 pF, see Figure 20
0.001
1.0
1
2
VDD = 5.5 V
VS = 4.5 V/1 V, VD = 1 V/4.5 V, see Figure 13
VS = 4.5 V/1 V, VD = 1 V/4.5 V, see Figure 13
VS = VD = 1 V or VS = VD = 4.5 V, see Figure 14
VDD = 5.5 V
VS = 4.5 V/1 V, VD = 1 V/4.5 V
Test Circuit 2
VS = 4.5 V/1 V, VD = 1 V/4.5 V
See Figure 13
VS = VD = 1 V or VS = VD = 4.5 V
See Figure 14
V min
V max
1
Bandwidth −3 dB
CS (OFF)
CD (OFF)
CD, CS (ON)
POWER REQUIREMENTS
IDD
VS = 0 V to VDD, IS = −10 mA
2.4
0.8
10
Channel-to-Channel Crosstalk
VS = 0 V to VDD, IS = −10 mA
See Figure 12
VS = 0 V to VDD, IS = −10 mA
±0.35
±0.35
20
Break-Before-Make Time Delay, tD (ADG723 Only)
Test Conditions/Comments
nA typ
nA max
nA typ
nA max
nA typ
nA max
±0.35
14
6
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
nA typ
nA typ
nA typ
0.005
tOFF
Unit
μA typ
μA max
Temperature range: A, B grades, −40°C to +85°C. All specifications apply to both grades unless otherwise stated.
Guaranteed by design; not subject to production test.
Rev. E | Page 3 of 16
VDD = 5.5 V
Digital inputs = 0 V or 5 V
ADG721/ADG722/ADG723
Data Sheet
VDD = 3 V ± 10%, GND = 0 V. All specifications −40°C to +85°C, unless otherwise noted.
Table 2.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance, RON
A, B Grades 1
+25°C
−40°C to +85°C
0 to VDD
3.5
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
±0.01
±0.01
±0.01
nA typ
nA typ
nA typ
6.5
10
On Resistance Match Between Channels, ∆RON
0.3
1.0
On Resistance Flatness, RFLAT(ON)
LEAKAGE CURRENTS – A Grade
Source off Leakage, IS (OFF)
Drain off Leakage, ID (OFF)
Channel on Leakage, ID, IS (ON)
LEAKAGE CURRENTS – B Grade
Source off Leakage, IS (OFF)
Drain off Leakage, ID (OFF)
Channel on Leakage, ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
DYNAMIC CHARACTERISTICS 2
tON
±0.01
±0.25
±0.01
±0.25
±0.01
±0.25
Break-Before-Make Time Delay, tD (ADG723 Only)
7
Charge Injection
Off Isolation
2
−60
−80
−77
−97
200
7
7
18
V min
V max
μA typ
μA max
VIN = VINL or VINH
±0.1
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
dB typ
dB typ
dB typ
dB typ
MHz typ
pF typ
pF typ
pF typ
RL = 300 Ω, CL = 35 pF
VS = 2 V, see Figure 15
RL = 300 Ω, CL = 35 pF
VS = 2 V, see Figure 15
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 2 V, see Figure 16
VS = 1.5 V, RS = 0 Ω, CL = 1 nF, see Figure 17
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 18
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 19
RL = 50 Ω, CL = 5 pF, see Figure 20
11
1
Bandwidth −3 dB
CS (OFF)
CD (OFF)
CD, CS (ON)
POWER REQUIREMENTS
IDD
0.001
1.0
1
2
VS = 0 V to VDD, IS = −10 mA
VDD = 3.3 V
VS = 3 V/1 V, VD = 1 V/3 V, see Figure 13
VS = 3 V/1 V, VD = 1 V/3 V, see Figure 13
VS = VD = 1 V or 3 V, Figure 14
VDD = 3.3 V
VS = 3 V/1 V, VD = 1 V/3 V
See Figure 13
VS = 3 V/1 V, VD = 1 V/3 V
See Figure 13
VS = VD = 1 V or 3 V
See Figure 14
2.0
0.4
16
7
VS = 0 V to VDD, IS = −10 mA
See Figure 12
VS = 0 V to VDD, IS = −10 mA
±0.35
±0.35
0.005
tOFF
Test Conditions/Comments
nA typ
nA max
nA typ
nA max
nA typ
nA max
±0.35
24
Channel-to-Channel Crosstalk
Unit
μA typ
μA max
Temperature range: A, B Grades, −40°C to +85°C. All specifications apply to both grades unless otherwise stated.
Guaranteed by design; not subject to production test.
Rev. E | Page 4 of 16
VDD = 3.3 V
Digital inputs = 0 V or 3 V
Data Sheet
ADG721/ADG722/ADG723
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted.
Table 3.
Parameter
VDD to GND
Analog, Digital Inputs1
Continuous Current, S or D
Operating Temperature Range
Industrial (A, B Grade)
Storage Temperature Range
Junction Temperature
8-Lead MSOP
θJA Thermal Impedance
θJC Thermal Impedance
8-Lead LFCSP (4-Layer Board)
θJA Thermal Impedance1
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
Lead-Free Temperature,
Soldering
IR Reflow, Peak Temperature
Time at Peak Temperature
ESD
Rating
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V or 30 mA,
whichever occurs first
30 mA
−40°C to +85°C
−65°C to +150°C
+150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
206°C/W
44°C/W
50.8°C/W
215°C
220°C
260°C (+0/−5°C)
10 sec to 40 sec
2 kV
Assumes exposed paddle is tied to ground.
1
Rev. E | Page 5 of 16
ADG721/ADG722/ADG723
Data Sheet
PIN CONFIGURATION AND PIN DESCRIPTIONS
S1 1
D1 2
IN2 3
ADG721/
ADG722/
ADG723
8
VDD
7
IN1
NOTES
1. EXPOSED PADDLE OF LFCSP
SHOULD BE TIED TO GROUND.
00045-004
TOP VIEW 6 D2
GND 4 (Not to Scale) 5 S2
Figure 4. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
1
2
3
4
5
6
7
8
Mnemonic
S1
D1
IN2
GND
S2
D2
IN1
VDD
Descriptions
Source Pin 1. May be an input or an output.
Drain Pin 1. May be an input or an output.
Logic Control Input for Switch S2D2.
Ground (0 V) Reference.
Source Pin 2. May be an input or an output.
Drain Pin 2. May be an input or an output.
Logic Control Input for Switch S1D1.
Positive Power Supply Input.
Table 5. Truth Table (ADG721/ADG722)
Table 6. Truth Table (ADG723)
ADG721 In
0
1
Logic
0
1
ADG722 In
1
0
Switch Condition
Off
On
Rev. E | Page 6 of 16
Switch 1
Off
On
Switch 2
On
Off
Data Sheet
ADG721/ADG722/ADG723
TERMINOLOGY
VDD
Most positive power supply potential.
VD (VS)
Analog voltage on the D and S terminals.
GND
Ground (0 V) reference.
CS (OFF)
Off switch source capacitance.
S
Source terminal. May be an input or output.
CD (OFF)
Off switch drain capacitance.
D
Drain terminal. May be an input or output.
CD, CS (ON)
On switch capacitance.
IN
Logic control input.
tON
Delay between applying the digital control input and the output
switching on.
RON
Ohmic resistance between D and S.
tOFF
Delay between applying the digital control input and the output
switching off.
∆RON
On resistance match between any two channels, that is,
RON max − RON min.
RFLAT(ON)
Flatness is defined as the difference between the maximum and
minimum value of on resistance as measured over the specified
analog signal range.
tD
Off time or on time measured between the 90% points of both
switches, when switching from one address state to another
(ADG723 only).
IS (OFF)
Source leakage current with the switch off.
Crosstalk
A measure of unwanted signal that is the result of parasitic
capacitance.
ID (OFF)
Drain leakage current with the switch off.
Off Isolation
A measure of unwanted signal coupling through an off switch.
ID, IS (ON)
Channel leakage current with the switch on.
Charge Injection
A measure of the glitch impulse transferred during switching.
Rev. E | Page 7 of 16
ADG721/ADG722/ADG723
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
1m
6.0
TA = 25°C
5.5
VDD = 5V
VDD = 2.7V
5.0
100µ
4.5
VDD = 4.5V
4.0
10µ
RON (Ω)
ISUPPLY (A)
VDD = 3.0V
3.5
3.0
2.5
VDD = 5.0V
2.0
1µ
100n
1.5
10n
1.0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VD OR VS – DRAIN OR SOURCE VOLTAGE (V)
1n
10
00045-005
0
10k
100k
FREQUENCY (Hz)
1M
10M
–30
6
VDD = 3V
+85°C
VDD = 3V, 5V
–40
OFF ISOLATION (dB)
5
4
+25°C
3
–40°C
2
1
–50
–60
–70
–80
–90
–100
10k
0
0.5
1.0
1.5
2.0
2.5
3.0
VD OR VS – DRAIN OR SOURCE VOLTAGE (V)
00045-006
0
Figure 6. On Resistance as a Function of a VD (VS) for Different Temperatures,
VDD = 3 V
100k
1M
10M
FREQUENCY (Hz)
100M
00045-009
RON (Ω)
1k
Figure 8. Supply Current vs. Input Switching Frequency
Figure 5. On Resistance as a Function of VD (VS), Single Supplies
Figure 9. Off Isolation vs. Frequency
6.0
–30
VDD = 3V, 5V
VDD = 5V
5.5
–40
5.0
4.5
+25°C
CROSSTALK (dB)
–50
4.0
RON (Ω)
100
00045-008
0.5
+85°C
3.5
3.0
2.5
2.0
–40°C
1.5
–60
–70
–80
–90
1.0
–100
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
VD OR VS – DRAIN OR SOURCE VOLTAGE (V)
4.5
5.0
–110
10k
00045-007
0
Figure 7. On Resistance as a Function of VD (VS) for Different Temperatures,
VDD = 5 V
Rev. E | Page 8 of 16
100k
1M
FREQUENCY (Hz)
10M
Figure 10. Crosstalk vs. Frequency
100M
00045-010
0.5
Data Sheet
ADG721/ADG722/ADG723
–6
VDD = 5V
–8
–9
–10
–11
–12
100
1k
10k
100k
1M
FREQUENCY (Hz)
10M
100M
00045-011
ON RESPONSE (dB)
–7
Figure 11. On Response vs. Frequency
Rev. E | Page 9 of 16
ADG721/ADG722/ADG723
Data Sheet
TEST CIRCUITS
IDS
V1
RON = V1/IDS
D
ID (OFF)
ID (ON)
S
A
VS
VD
Figure 12. On Resistance
D
A
VS
VD
Figure 13. Off Leakage
Figure 14. On Leakage
VDD
0.1µF
VIN ADG721
50%
50%
VIN
50%
50%
VDD
S
VS
VOUT
D
CL
35pF
RL
300Ω
IN
ADG722
90%
90%
VOUT
tON
tOFF
00045-015
GND
Figure 15. Switching Times
VDD
0.1µF
VIN
VDD
S2
D2
VOUT1
VOUT2
RL2
300Ω
IN1, IN2
50%
RL1
300Ω
VOUT1
CL1
35pF
90%
90%
0V
CL2
35pF
GND
VIN
50%
0V
90%
VOUT2
90%
00045-016
VS2
D1
0V
tD
tD
Figure 16. Break-Before-Make Time Delay, tD (ADG723 Only)
VDD
SW ON
SW OFF
VDD
RS
S
D
VOUT
VIN
CL
1nF
VS
IN
VOUT
ΔVOUT
GND
QINJ = CL × ΔVOUT
Figure 17. Charge Injection
Rev. E | Page 10 of 16
00045-017
VS1
S1
00045-014
S
A
00045-013
VS
IS (OFF)
D
00045-012
S
Data Sheet
ADG721/ADG722/ADG723
VDD
VDD
0.1µF
0.1µF
VDD
VDD
D
S
VOUT
D
RL
50Ω
IN
VS
GND
VIN
IN
GND
Figure 19. Channel-to-Channel Crosstalk
Figure 18. Off Isolation
VDD
0.1µF
VDD
S
VS
NC
50Ω
D
VIN1
VIN2
S
D
GND
CHANNEL-TO-CHANNEL
CROSSTALK
= 20 × log |VS/VOUT|
Figure 20. Bandwidth
Rev. E | Page 11 of 16
VOUT
RL
50Ω
00045-020
VIN
00045-018
VS
VOUT
RL
50Ω
00045-019
S
ADG721/ADG722/ADG723
Data Sheet
APPLICATIONS
The ADG721/ADG722/ADG723 belong to a new family of
Analog Devices CMOS switches. This series of general-purpose
switches has improved switching times, lower on resistance, higher
bandwidths, low power consumption, and low leakage currents.
ADG721/ADG722/ADG723 SUPPLY VOLTAGES
Functionality of the ADG721/ADG722/ADG723 extends from
a 1.8 V to a 5.5 V single supply, which makes it ideal for batterypowered instruments, where important design parameters are
power efficiency and performance.
It is important to note that the supply voltage affects the input
signal range, the on resistance, and the switching times of the part.
The typical performance characteristics and the specifications
clearly show the effects of the power supplies.
The signal transfer characteristic is dependent on the switch
channel capacitance, CDS. This capacitance creates a frequency
zero in the numerator of the transfer function A(s). Because the
switch on resistance is small, this zero usually occurs at high
frequencies. The bandwidth is a function of the switch output
capacitance combined with CDS and the load capacitance. The
frequency pole corresponding to these capacitances appears in
the denominator of A(s).
The dominant effect of the output capacitance, CD, causes the
pole breakpoint frequency to occur first. Therefore, in order to
maximize bandwidth, a switch must have a low input and
output capacitance and low on resistance (see Figure 11).
OFF ISOLATION
Off isolation is a measure of the input signal coupled through
an off switch to the switch output. The capacitance, CDS, couples
the input signal to the output load, when the switch is off, as
shown in Figure 22.
ON RESPONSE VS. FREQUENCY
Figure 21 illustrates the parasitic components that affect the ac
performance of CMOS switches (the switch is shown surrounded
by a box). Additional external capacitances further degrade some
aspects of performance. These capacitances affect feedthrough,
crosstalk, and system bandwidth.
CDS
S
VOUT
VIN
S
D
VOUT
CD
CLOAD
RLOAD
00045-021
VIN
CD
CLOAD
RLOAD
Figure 22. Off Isolation Is Affected by External Load
Resistance and Capacitance
CDS
RON
D
00045-022
For VDD = 1.8 V, on resistance is typically 40 Ω over the
temperature range.
Figure 21. Switch Represented by Equivalent Parasitic Components
The transfer function that describes the equivalent diagram of
the switch (Figure 21) is of the form (A)s, as shown in the
following equation:
s (RON CDS ) + 1
A(s) = RT
s (RON CT RT ) + 1
The larger the value of CDS, the larger the value of feedthrough
produced. Figure 9 illustrates the drop in off isolation as a
function of frequency. From dc to roughly 1 MHz, the switch
shows better than −80 dB isolation. Up to frequencies of 10
MHz, the off isolation remains better than −60 dB. As the
frequency increases, more and more of the input signal is
coupled through to the output. Off isolation can be maximized
by choosing a switch with the smallest CDS possible. The values
of load resistance and capacitance also affect off isolation
because they contribute to the coefficients of the poles and
zeros in the transfer function of the switch when open.
s (RLOAD CDS )
A(s) =
s (RLOAD ) (CLOAD + CD + CDS ) + 1
where:
CT = CLOAD + CD + CDS
RT = RLOAD/(RLOAD + RON)
Rev. E | Page 12 of 16
Data Sheet
ADG721/ADG722/ADG723
OUTLINE DIMENSIONS
3.20
3.00
2.80
8
3.20
3.00
2.80
5.15
4.90
4.65
5
1
4
PIN 1
IDENTIFIER
0.65 BSC
0.95
0.85
0.75
15° MAX
1.10 MAX
6°
0°
0.40
0.25
0.80
0.55
0.40
0.23
0.09
10-07-2009-B
0.15
0.05
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 23. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
1.75
1.65
1.50
2.00 BSC
5
3.00 BSC
8
1.90
1.80
1.65
EXPOSED
PAD
0.20 MIN
4
INDEX
AREA
0.50
0.40
0.30
TOP VIEW
0.80
0.75
0.70
0.50
0.30
0.25
0.20
COPLANARITY
0.08
0.05 MAX
0.02 NOM
PIN 1
INDICATOR
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
081806-A
SEATING
PLANE
0.15 REF
SIDE VIEW
1
Figure 24. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 2 mm Body, Very Very Thin, Dual Lead
(CP-8-4)
Dimensions shown in millimeters
Rev. E | Page 13 of 16
ADG721/ADG722/ADG723
Data Sheet
ORDERING GUIDE
Model 1
ADG721BRM
ADG721BRM-REEL
ADG721BRM-REEL7
ADG721BRMZ
ADG721BRMZ-REEL
ADG721BRMZ-REEL7
ADG721ACPZ-REEL
ADG721ACPZ-REEL7
ADG722BRM
ADG722BRM-REEL7
ADG722BRMZ
ADG722BRMZ-REEL
ADG722BRMZ-REEL7
ADG722ACPZ-REEL
ADG722ACPZ-REEL7
ADG723BRM
ADG723BRM-REEL
ADG723BRM-REEL7
ADG723BRMZ
ADG723BRMZ-REEL
ADG723BRMZ-REEL7
ADG723ACPZ-REEL
ADG723ACPZ-REEL7
1
2
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead LFCSP_WD
8-Lead LFCSP_WD
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead LFCSP_WD
8-Lead LFCSP_WD
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead LFCSP_WD
8-Lead LFCSP_WD
Z = RoHS Compliant Part; # denotes lead-free product may be top or bottom marked.
Branding = due to package size limitations, these three characters represent the part number.
Rev. E | Page 14 of 16
Package Option
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
CP-8-4
CP-8-4
RM-8
RM-8
RM-8
RM-8
RM-8
CP-8-4
CP-8-4
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
CP-8-4
CP-8-4
Branding 2
S6B
S6B
S6B
#S6B
#S6B
#S6B
17
17
S7B
S7B
#S7B
#S7B
#S7B
0U
0U
S8B
S8B
S8B
#S8B
#S8B
#S8B
S2N
S2N
Data Sheet
ADG721/ADG722/ADG723
NOTES
Rev. E | Page 15 of 16
ADG721/ADG722/ADG723
Data Sheet
NOTES
©2004-2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00045-0-10/11(E)
Rev. E | Page 16 of 16
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