I2C-Compatible, Wide Bandwidth, Quad, 2:1 Multiplexer ADG791A/ADG791G
FEATURES
Bandwidth: 325 MHz Low insertion loss and on resistance: 2.6 Ω typical On resistance flatness: 0.3 Ω typical Single 3 V/5 V supply operation 3.3 V analog signal range (5 V supply, 75 Ω load) Low quiescent supply current: 1 nA typical Fast switching times: tON = 186 ns, tOFF = 177 ns I2C®-compatible interface Compact 24-lead LFCSP ESD protection 4 kV human body model (HBM) 200 V machine model (MM) 1 kV field-induced charged device model (FICDM)
VDD
FUNCTIONAL BLOCK DIAGRAM
GND VDD GND
ADG791A
S1A D1 S1B S2A D2 S2B S3A D3 S3B S4A D4 S4B I2C SERIAL INTERFACE S4B S3B S4A S2B S3A S1B S2A S1A
ADG791G
D1
D2
D3
D4
I2C SERIAL INTERFACE
GPO1
06033-001
APPLICATIONS
S-video RGB/YPbPr video switches HDTVs Projection TVs DVD-R/RW AV receivers
A0 A1 A2 SDA SCL A0 A1 A2 SDA SCL
Figure 1.
GENERAL DESCRIPTION
The ADG791A/ADG791G are monolithic CMOS devices comprising four 2:1 multiplexers/demultiplexers controllable via a standard I2C serial interface. The CMOS process provides ultralow power dissipation yet gives high switching speed and low on resistance. The on-resistance profile is very flat over the full analog input range and wide bandwidth ensures excellent linearity and low distortion. These features, combined with a wide input signal range make the ADG791A/ADG791G the ideal switching solution for a wide range of TV applications including S-video, RGB, and YPbPr video switches. The switches conduct equally well in both directions when on. In the off condition, signal levels up to the supplies are blocked. The ADG791A/ADG791G switches exhibit break-before-make switching action. The ADG791G has one general-purpose logic output pin controlled by the I2C interface that can also be used to control other non-I2C-compatible devices such as video filters. The integrated I2C interface provides a large degree of flexibility in the system design. It has three configurable I2C address pins that allow up to eight devices on the same bus. This allows the user to expand the capability of the device by increasing the size of the switching array. The ADG791A/ADG791G operate from a single 3 V or 5 V supply voltage and is available in a compact 4 mm × 4 mm body, 24-lead LFCSP.
PRODUCT HIGHLIGHTS
1. 2. 3. 4. 5. 6. Wide bandwidth: 325 MHz. Ultralow power dissipation. Extended input signal range. Integrated I2C serial interface. Compact 4 mm × 4 mm, 24-lead, Pb-free LFCSP. ESD protection tested as per ESD association standards: 4 kV HBM (ANSI/ESD STM5.1-2001) 200 V MM (ANSI/ESD STM5.2-1999) 1 kV FICDM (ANSI/ESDSTM5.3.1-1999)
Rev. 0
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ADG791A/ADG791G TABLE OF CONTENTS
Features .............................................................................................. 1 Applications....................................................................................... 1 Functional Block Diagram .............................................................. 1 General Description ......................................................................... 1 Product Highlights ........................................................................... 1 Revision History ............................................................................... 2 Specifications..................................................................................... 3 I2C Timing Specifications............................................................ 7 Timing Diagram ........................................................................... 8 Absolute Maximum Ratings............................................................ 9 ESD Caution.................................................................................. 9 Pin Configurations and Function Descriptions ......................... 10 Typical Performance Characteristics ........................................... 11 Test Circuits..................................................................................... 14 Terminology .................................................................................... 16 Theory of Operation ...................................................................... 17 I2C Serial Interface ..................................................................... 17 I2C Address.................................................................................. 17 Write Operation.......................................................................... 17 LDSW Bit..................................................................................... 19 Power On/Software Reset.......................................................... 19 Read Operation........................................................................... 19 Evaluation Board ............................................................................ 20 Using the ADG791G Evaluation Board .................................. 20 Outline Dimensions ....................................................................... 23 Ordering Guide .......................................................................... 23
REVISION HISTORY
7/06—Revision 0: Initial Version
Rev. 0 | Page 2 of 24
ADG791A/ADG791G SPECIFICATIONS
VDD = 5 V ± 10%, GND = 0 V, TA = −40°C to +85°C, unless otherwise noted. Table 1.
Parameter ANALOG SWITCH Analog Signal Range 2 On Resistance, RON On-Resistance Matching Between Channels, ∆RON On-Resistance Flatness, RFLAT (ON) LEAKAGE CURRENTS Source OFF Leakage (IS (OFF)) Drain OFF Leakage (ID (OFF)) Channel ON Leakage (ID (ON), IS (ON)) DYNAMIC CHARACTERISTICS 3 tON, tENABLE tOFF, tDISABLE Break-Before-Make Time Delay, tD I2C to GPO Propagation Delay, tH, tL Off Isolation Channel-to-Channel Crosstalk Same Multiplexer Different Multiplexer −3 dB Bandwidth THD + N Charge Injection CS (OFF) CD (OFF) CD (ON), CS (ON) Power Supply Rejection Ratio, PSRR Differential Gain Error Differential Phase Error LOGIC INPUTS3 A0, A1, A2 Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH Input Capacitance, CIN SCL, SDA Input High Voltage, VINH Input Low Voltage, VINL Input Leakage Current, IIN Input Hysteresis Input Capacitance, CIN Conditions VS = VDD, RL = 1 MΩ VS = VDD, RL = 75 Ω VD = 0 V, IDS = −10 mA, see Figure 22 VD = 0 V to 1 V, IDS = −10 mA, see Figure 22 VD = 0 V, IDS = −10 mA VD = 1 V, IDS = −10 mA VD = 0 V to 1 V, IDS = −10 mA VD = 4 V/1 V, VS = 1 V/4 V, see Figure 23 VD = 4 V/1 V, VS = 1 V/4 V, see Figure 23 VD = VS = 4 V/1 V, see Figure 24 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS1 = VS2 = 2 V, see Figure 29 (ADG791G only) f = 10 MHz, RL = 50 Ω, see Figure 26 f = 10 MHz, RL = 50 Ω, see Figure 27 Min 0 0 2.6 Typ 1 Max 4 3.3 3.5 4 0.5 0.6 0.55 Unit V V Ω Ω Ω Ω Ω nA nA nA 250 240 130 −60 −55 −70 325 0.14 5 10 13 27 70 0.32 0.44 ns ns ns ns dB dB dB MHz % pC pF pF pF dB % Degrees
0.15 0.3 ±0.25 ±0.25 ±0.25 186 177 3
1
RL = 50 Ω, see Figure 25 RL = 100 Ω CL = 1 nF, VS = 0 V, see Figure 30
f = 20 kHz CCIR330 test signal CCIR330 test signal
2.0 VIN = 0 V to VDD 0.005 3 0.7 × VDD −0.3 VIN = 0 V to VDD 0.005 0.05 × VDD 3 0.8 ±1
V V μA pF V V μA V pF
VDD + 0.3 +0.3 × VDD ±1
Rev. 0 | Page 3 of 24
ADG791A/ADG791G
Parameter LOGIC OUTPUTS3 SDA Pin Output Low Voltage, VOL Floating-State Leakage Current Floating-State Output Capacitance GPO1 Pin and GPO2 Pin Output Low Voltage, VOL Output High Voltage, VOH POWER REQUIREMENTS IDD Conditions Min Typ 1 Max Unit
ISINK = 3 mA ISINK = 6 mA
0.4 0.6 ±1 10 0.4 2.0 0.001 1 0.2 0.7
V V μA pF V V μA mA mA
ILOAD = +2 mA ILOAD = −2 mA Digital inputs = 0 V or VDD, I2C interface inactive I2C interface active, fSCL = 400 kHz I2C interface active, fSCL = 3.4 MHz
1 2
All typical values are at TA = 25°C, unless otherwise stated. Guaranteed by initial characterization, not subject to production test. 3 Guaranteed by design, not subject to production test.
Rev. 0 | Page 4 of 24
ADG791A/ADG791G
VDD = 3 V ± 10%, GND = 0 V, TA = −40°C to +85°C, unless otherwise noted. Table 2.
Parameter ANALOG SWITCH Analog Signal Range 2 On Resistance, RON On-Resistance Matching Between Channels, ∆RON On-Resistance Flatness, RFLAT (ON) LEAKAGE CURRENTS Source Off Leakage (IS (OFF)) Drain Off Leakage (ID (OFF)) Channel On Leakage (ID (ON), IS (ON)) DYNAMIC CHARACTERISTICS 3 tON, tENABLE tOFF, tDISABLE Break-Before-Make Time Delay, tD I2C to GPO Propagation Delay, tH, tL (ADG791G only) Off Isolation Channel-to-Channel Crosstalk Same Multiplexer Different Multiplexer −3 dB Bandwidth THD + N Charge Injection CS (OFF) CD (OFF) CD (ON), CS (ON) Power Supply Rejection Ratio, PSRR Differential Gain Error Differential Phase Error LOGIC INPUTS3 A0, A1, A2 Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH Input Capacitance, CIN SCL, SDA Input High Voltage, VINH Input Low Voltage, VINL Input Leakage Current, IIN Input Hysteresis Input Capacitance, CIN Conditions VS = VDD, RL = 1 MΩ VS = VDD, RL = 75 Ω VD = 0 V, IDS = −10 mA, see Figure 22 VD = 0 V to 1 V, IDS = −10 mA, see Figure 22 VD = 0 V, IDS = −10 mA VD = 1 V, IDS = −10 mA VD = 0 V to 1 V, IDS = −10 mA VD = 2 V/1 V, VS = 1 V/2 V, see Figure 23 VD = 2 V/1 V, VS = 1 V/2 V, see Figure 23 VD = VS = 2 V/1 V, see Figure 24 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS1 = VS2 = 2 V, see Figure 29 Min 0 0 3 Typ 1 Max 2.2 1.7 4 6 0.6 1.1 2.8 Unit V V Ω Ω Ω Ω Ω nA nA nA 270 260 121 f = 10 MHz, RL = 50 Ω, see Figure 26 f = 10 MHz, RL = 50 Ω, see Figure 27 −60 −55 −70 310 0.14 2.5 10 13 27 70 0.28 0.28 ns ns ns ns dB dB dB MHz % pC pF pF pF dB % Degrees
0.15 0.8 ±0.25 ±0.25 ±0.25 198 195 3
1
RL = 50 Ω, see Figure 25 RL = 100 Ω CL = 1 nF, VS = 0 V, see Figure 30
f = 20 kHz CCIR330 test signal CCIR330 test signal
2.0 VIN = 0 V to VDD 0.005 3 0.7 × VDD −0.3 VIN = 0 V to VDD 0.005 0.05 × VDD 3 0.8 ±1
V V μA pF V V μA V pF
VDD + 0.3 +0.3 × VDD ±1
Rev. 0 | Page 5 of 24
ADG791A/ADG791G
Parameter LOGIC OUTPUTS3 SDA Pin Output Low Voltage, VOL Floating-State Leakage Current Floating-State Output Capacitance GPO1 Pin and GPO2 Pin Output Low Voltage, VOL Output High Voltage, VOH POWER REQUIREMENTS IDD Conditions Min Typ 1 Max Unit
ISINK = 3 mA ISINK = 6 mA 3 ILOAD = +2 mA ILOAD = −2 mA Digital inputs = 0 V or VDD, I2C interface inactive I2C interface active, fSCL = 400 kHz I2C interface active, fSCL = 3.4 MHz
0.4 0.6 ±1
V V μA pF V V μA mA mA
0.4 2.0 0.001 1 0.1 0.2
1 2
All typical values are at TA = 25°C, unless otherwise stated. Guaranteed by initial characterization, not subject to production test. 3 Guaranteed by design, not subject to production test.
Rev. 0 | Page 6 of 24
ADG791A/ADG791G
I2C TIMING SPECIFICATIONS
VDD = 2.7 V to 5.5 V; GND = 0 V; TA = −40°C to +85°C, unless otherwise noted. See Figure 2 for timing diagram. Table 3.
Parameter 1 fSCL Conditions Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode Standard mode Fast mode High speed mode Standard mode Fast mode Standard mode Fast mode High speed mode Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Min Max 100 400 3.4 1.7 4 0.6 60 120 4.7 1.3 160 320 250 100 10 0 0 0 0 4.7 0.6 160 4 0.6 160 4.7 1.3 4 0.6 160 20 + 0.1 CB
B
Unit kHz kHz MHz MHz μs μs ns ns μs μs ns ns ns ns ns μs μs ns ns μs μs ns μs μs ns μs μs μs μs ns ns ns ns ns ns ns ns ns ns ns ns ns
Rev. 0 | Page 7 of 24
Description Serial clock frequency
t1
tHIGH, SCL high time
t2
tLOW, SCL low time
t3
tSU;DAT, data setup time
t4 2
3.45 0.9 703 150
tHD;DAT, data hold time
t5
tSU;STA, setup time for a repeated start condition
t6
tHD;STA, hold time (repeated) start condition
t7 t8
tBUF, bus free time between a stop and a start condition tSU;STO, setup time for stop condition
t9
1000 300 80 160 300 300 80 160 1000 300 40 80
tRDA, rise time of SDA signal
10 20 20 + 0.1 CB
B
t10
tFDA, fall time of SDA signal
10 20 20 + 0.1 CB
B
t11
tRCL, rise time of SCL signal
10 20
ADG791A/ADG791G
Parameter 1 t11A Conditions Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Fast mode High speed mode Min Max 1000
B
Unit ns ns ns ns ns ns ns ns ns ns
Description tRCL1, rise time of SCL signal after a repeated start condition and after an acknowledge bit.
20 + 0.1 CB 10 20 20 + 0.1 CB
B
300 80 160 300 300 40 80 50 10
t12
tFCL, fall time of SCL signal
tSP
10 20 0 0
Pulse width of suppressed spike
1 2
Guaranteed by initial characterization. CB refers to capacitive load on the bus line, tr and tf measured between 0.3 VDD and 0.7 VDD. A device must provide a data hold time for SDA to bridge the undefined region of the SCL falling edge.
TIMING DIAGRAM
t11
SCL
t12
t2 t6 t4 t1 t3 t5 t10
t6
t8 t9
06033-002
SDA
t7
P S S P
Figure 2. Timing Diagram for 2-Wire Serial Interface
Rev. 0 | Page 8 of 24
ADG791A/ADG791G ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Table 4.
Parameter VDD to GND Analog, Digital Inputs Continuous Current, S or D Peak Current, S or D Operating Temperature Range Industrial (B Version) Storage Temperature Range Junction Temperature θJA Thermal Impedance 24-Lead LFCSP Lead Temperature, Soldering (10 sec) IR Reflow, Peak Temperature (