ADG799A

I2C®-Compatible, Wide Bandwidth, Triple 2 × 2 Crosspoint Switch ADG799A/ADG799G FEATURES Bandwidth: 230 MHz Low insertion loss and on resistance: 2.6 Ω typical On resistance flatness: 0.3 Ω typical Single 3 V/5 V supply operation 3.3 V analog signal range (5 V supply, 75 Ω load) Low quiescent supply current: 1 nA typical Fast switching times: tON =184 ns, tOFF = 180 ns I2C-compatible interface Compact 24-lead LFCSP Two I2C-controllable logic outputs (ADG799G only) ESD protection 4 kV human body model 200 V machine model 1 kV field-induced charged device model FUNCTIONAL BLOCK DIAGRAMS VDD GND VDD GND ADG799A S1A S1B S2A S2B S3A S3B 2×2 CROSSPOINT 2×2 CROSSPOINT 2×2 CROSSPOINT D1A D1B D2A D2B D3A D3B S1A S1B S2A S2B S3A S3B ADG799G 2×2 CROSSPOINT 2×2 CROSSPOINT 2×2 CROSSPOINT D1A D1B D2A D2B D3A D3B I2C SERIAL INTERFACE GPO1 I2C SERIAL INTERFACE GPO2 06038-001 A0 A1 A2 SDA SCL A0 A1 A2 SDA SCL Figure 1. ADG799A and ADG799G APPLICATIONS RGB/YPbPr video switches HDTV Projection TV DVD-R/RW AV receivers GENERAL DESCRIPTION The ADG799A/ADG799G are monolithic CMOS devices comprising three 2 × 2 crosspoint switches controllable via a standard I2C serial interface. The CMOS process provides ultralow power dissipation, yet offers high switching speed and low on resistance. The on resistance profile is very flat over the full analog input range and wide bandwidth ensures excellent linearity and low distortion. These features, combined with a wide input signal range, make the ADG799A/ADG799G the ideal switching solution for a wide range of TV applications including RGB and YPbPr video switches for picture-in picture applications. The switches conduct equally well in both directions when on. In the off condition, signal levels up to the supplies are blocked. The ADG799A/ADG799G switches exhibit break-before-make switching action. The ADG799G has two general-purpose logic output pins controlled by the I2C interface that can also be used to control other non-I2C-compatible devices such as video filters. The integrated I2C interface provides a large degree of flexibility in the system design. It has three user-adjustable I2C address Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. pins that allow up to eight devices on the same bus. This allows the user to expand the capability of the device by increasing the size of the switching array. The ADG799A/ADG799G operate from single 3 V or 5 V supply voltages and are available in a compact, 4 mm × 4 mm body, 24-lead, Pb-free LFCSP. PRODUCT HIGHLIGHTS 1. 2. 3. 4. 5. 6. Wide bandwidth: 230 MHz. Ultralow power dissipation. Extended input signal range. Integrated I2C serial interface. Compact 4 mm × 4 mm, 24-lead, Pb-free LFCSP. ESD protection tested as per ESD Association standards: • • • 4 kV HBM (ANSI/ESD STM5.1-2001) 200 V MM (ANSI/ESD STM5.2-1999) 1 kV FICDM (ANSI/ESD STM5.3.1-1999) One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved. ADG799A/ADG799G TABLE OF CONTENTS Features .............................................................................................. 1 Applications....................................................................................... 1 Functional Block Diagrams............................................................. 1 General Description ......................................................................... 1 Product Highlights ........................................................................... 1 Revision History ............................................................................... 2 Specifications..................................................................................... 3 I2C Timing Specifications............................................................ 7 Absolute Maximum Ratings............................................................ 9 ESD Caution.................................................................................. 9 Pin Configurations and Function Descriptions ......................... 10 Typical Performance Characteristics ........................................... 11 Test Circuits..................................................................................... 14 Terminology .................................................................................... 16 Theory of Operation ...................................................................... 17 I2C Serial Interface ..................................................................... 17 I2C Address.................................................................................. 17 Write Operation.......................................................................... 17 LDSW Bit..................................................................................... 19 Power On/Software Reset.......................................................... 19 Read Operation........................................................................... 19 Evaluation Board ............................................................................ 20 Using the ADG799G Evaluation Board .................................. 20 Outline Dimensions ....................................................................... 23 Ordering Guide .......................................................................... 23 REVISION HISTORY 7/06—Revision 0: Initial Version Rev. 0 | Page 2 of 24 ADG799A/ADG799G SPECIFICATIONS VDD = 5 V ± 10%, GND = 0 V, TA = −40°C to +85°C, unless otherwise noted. Table 1. Parameter ANALOG SWITCH Analog Signal Range 2 On Resistance, RON On Resistance Matching Between Channels, ∆RON On Resistance Flatness, RFLAT(ON) LEAKAGE CURRENTS Source Off Leakage (IS(OFF)) Drain Off Leakage (ID(OFF)) Channel On Leakage (ID(ON), IS(ON)) DYNAMIC CHARACTERISTICS 3 tON, tENABLE tOFF, tDISABLE Break-Before-Make Time Delay, tD I2C to GPO Propagation Delay, tH, tL (ADG799G only) Off Isolation Channel-to-Channel Crosstalk Same Crosspoint Switch Different Crosspoint Switch −3 dB Bandwidth THD + N Charge Injection CS(OFF) CD(OFF) CD(ON), CS(ON) Power Supply Rejection Ratio, PSRR Differential Gain Error Differential Phase Error LOGIC INPUTS3 A0, A1, A2 Pins Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH Input Capacitance, CIN SCL, SDA Pins Input High Voltage, VINH Input Low Voltage, VINL Input Leakage Current, IIN Input Hysteresis Input Capacitance, CIN LOGIC OUTPUTS SDA Pin3 Output Low Voltage, VOL Floating State Leakage Current Floating State Output Capacitance Rev. 0 | Page 3 of 24 Conditions VS = VDD, RL = 1 MΩ VS =VDD, RL = 75 Ω VD = 0 V, IDS = −10 mA, see Figure 22 VD = 0 V to 1 V, IDS = −10 mA, see Figure 22 VD = 0 V, IDS = −10 mA VD = 1 V, IDS = −10 mA VD = 0 V to 1 V, IDS = −10 mA VD = 4 V/1 V, VS = 1 V/4 V, see Figure 23 VD = 4 V/1 V, VS = 1 V/4 V, see Figure 23 VD = VS = 4 V/1 V, see Figure 24 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS1 = VS2 = 2 V, see Figure 29 f = 10 MHz, RL = 50 Ω, see Figure 26 f = 10 MHz, RL = 50 Ω, see Figure 27 Min 0 0 Typ 1 Max 4 3.3 5 5.5 1.85 1.85 0.55 Unit V V Ω Ω Ω Ω Ω nA nA nA 2.6 0.15 0.3 ±0.25 ±0.25 ±0.25 184 180 3 240 235 1 ns ns ns ns dB dB dB MHz % pC pF pF pF dB % Degrees 130 −60 −50 −80 230 0.14 4 13 17 35 70 0.56 0.79 RL = 50 Ω, see Figure 15 RL = 100 Ω CL = 1 nF, VS = 0 V, see Figure 30 f = 20 kHz CCIR330 test signal CCIR330 test signal 2.0 VIN = 0 V to VDD 0.005 3 0.7 × VDD −0.3 VIN = 0 V to VDD +0.005 0.05 × VDD 3 0.8 ±1 V V μA pF V V μA V pF VDD + 0.3 +0.3 × VDD ±1 ISINK = 3 mA ISINK = 6 mA 0.4 0.6 ±1 10 V V μA pF ADG799A/ADG799G Parameter GPO1 and GPO2 Pins Output Low Voltage, VOL Output High Voltage, VOH POWER REQUIREMENTS IDD Conditions ILOAD = 2 mA ILOAD = −2 mA Digital inputs = 0 V or VDD, I2C interface inactive I2C interface active, fSCL = 400 kHz I2C interface active, fSCL = 3.4 MHz Min Typ 1 Max 0.4 2.0 0.001 1 0.2 0.7 Unit V V μA mA mA 1 2 All typical values are at TA = +25°C, unless otherwise stated. Guaranteed by initial characterization, not subject to production test. 3 Guaranteed by design, not subject to production test. Rev. 0 | Page 4 of 24 ADG799A/ADG799G VDD = 3 V ± 10%, GND = 0 V, TA = −40°C to +85°C, unless otherwise noted. Table 2. Parameter ANALOG SWITCH Analog Signal Range 2 On Resistance, RON On Resistance Matching Between Channels, ∆RON On Resistance Flatness, RFLAT(ON) LEAKAGE CURRENTS Source Off Leakage (IS(OFF)) Drain Off Leakage (ID(OFF)) Channel On Leakage (ID(ON), IS(ON)) DYNAMIC CHARACTERISTICS 3 tON, tENABLE tOFF, tDISABLE Break-Before-Make Time Delay, tD I2C to GPO Propagation Delay, tH, tL (ADG799G only) Off Isolation Channel-to-Channel Crosstalk Same Crosspoint Switch Different Crosspoint Switch −3 dB Bandwidth THD + N Charge Injection CS(OFF) CD(OFF) CD(ON), CS(ON) Power Supply Rejection Ratio, PSRR Differential Gain Error Differential Phase Error LOGIC INPUTS A0, A1, A2 Pins3 Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH Input Capacitance, CIN SCL, SDA Pins3 Input High Voltage, VINH Input Low Voltage, VINL Input Leakage Current, IIN Input Hysteresis Input Capacitance, CIN LOGIC OUTPUTS3 SDA Pin Output Low Voltage, VOL Floating State Leakage Current Floating State Output Capacitance Rev. 0 | Page 5 of 24 Conditions VS = VDD, RL = 1 MΩ VS = VDD, RL = 75 Ω VD = 0 V, IDS = −10 mA, see Figure 22 VD = 0 V to 1 V, IDS = −10 mA, see Figure 22 VD = 0 V, IDS = −10 mA VD = 1 V, IDS = −10 mA VD = 0 V to 1 V, IDS = −10 mA VD = 2 V/1 V, VS = 1 V/2 V, see Figure 23 VD = 2 V/1 V, VS = 1 V/2 V, see Figure 23 VD = VS = 2 V/1 V, see Figure 24 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS1 = VS2 = 2 V, see Figure 29 Min 0 0 Typ 1 Max 2.2 1.7 5.5 8 1.8 2.1 2.8 Unit V V Ω Ω Ω Ω Ω nA nA nA 3 0.15 0.3 ±0.25 ±0.25 ±0.25 203 200 3 266 260 1 ns ns ns ns dB dB dB MHz % pC pF pF pF dB % Degrees 121 f = 10 MHz, RL = 50 Ω, see Figure 26 f = 10 MHz, RL = 50 Ω, see Figure 27 −60 −50 −80 210 0.14 2 13 17 35 70 0.66 1 RL = 50 Ω, see Figure 15 RL = 100 Ω CL = 1 nF, VS = 0 V, see Figure 30 f = 20 kHz CCIR330 test signal CCIR330 test signal 2.0 VIN = 0 V to VDD +0.005 3 0.7 × VDD −0.3 VIN = 0 V to VDD 0.005 0.05 × VDD 3 0.8 ±1 V V μA pF V V μA V pF VDD + 0.3 +0.3 × VDD ±1 ISINK = 3 mA ISINK = 6 mA 3 0.4 0.6 ±1 V V μA pF ADG799A/ADG799G Parameter GPO1 and GPO2 Pins Output Low Voltage, VOL Output High Voltage, VOH POWER REQUIREMENTS IDD Conditions ILOAD = 2 mA ILOAD = −2 mA Digital inputs = 0 V or VDD, I2C interface inactive I2C interface active, fSCL = 400 kHz I2C interface active, fSCL = 3.4 MHz Min Typ 1 Max 0.4 2.0 0.001 1 0.1 0.2 Unit V V μA mA mA 1 2 All typical values are at TA = +25°C, unless otherwise stated. Guaranteed by initial characterization, not subject to production test. 3 Guaranteed by design, not subject to production test. Rev. 0 | Page 6 of 24 ADG799A/ADG799G I2C TIMING SPECIFICATIONS VDD = 2.7 V to 5.5 V; GND = 0 V; TA = −40°C to +85°C, unless otherwise noted (see Figure 2 for timing diagram). Table 3. Parameter 1 fSCL Conditions Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode Standard mode Fast mode High speed mode Standard mode Fast mode Standard mode Fast mode High speed mode Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max B B Min Max 100 400 3.4 1.7 Unit kHz kHz MHz MHz μs μs ns ns μs μs ns ns ns ns ns μs μs ns ns μs μs ns μs μs ns μs μs μs μs ns ns ns ns ns ns ns ns ns ns ns ns ns Description Serial clock frequency t1 4 0.6 60 120 4.7 1.3 160 320 250 100 10 0 0 0 0 4.7 0.6 160 4 0.6 160 4.7 1.3 4 0.6 160 20 + 0.1 CB B tHIGH, SCL high time t2 tLOW, SCL low time t3 tSU;DAT, data setup time t4 2 3.45 0.9 703 150 tHD;DAT, data hold time t5 tSU;STA, setup time for a repeated start condition t6 tHD;STA, hold time (repeated) start condition t7 t8 tBUF, bus free time between a stop and a start condition tSU;STO, setup time for stop condition t9 1000 300 80 160 300 300 80 160 1000 300 40 80 tRDA, rise time of SDA signal 10 20 20 + 0.1 CB B t10 tFDA, fall time of SDA signal 10 20 20 + 0.1 CB B t11 tRCL, rise time of SCL signal 10 20 Rev. 0 | Page 7 of 24 ADG799A/ADG799G Parameter 1 t11A Conditions Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Fast mode High speed mode Min 20 + 0.1 CB B Max 1000 300 80 160 300 300 40 80 50 10 Unit ns ns ns ns ns ns ns ns ns ns Description tRCL1, rise time of SCL signal after a repeated start condition and after an acknowledge bit. 10 20 20 + 0.1 CB B t12 tFCL, fall time of SCL signal tSP 10 20 0 0 Pulse width of suppressed spike 1 2 Guaranteed by initial characterization. CB refers to capacitive load on the bus line, tr and tf measured between 0.3 VDD and 0.7 VDD. A device must provide a data hold time for SDA in order to bridge the undefined region of the SCL falling edge. Timing Diagram t11 SCL t12 t2 t6 t4 t1 t3 t5 t10 t6 t8 t9 06038-002 SDA t7 P S S P Figure 2. Timing Diagram for 2-Wire Serial Interface Rev. 0 | Page 8 of 24 ADG799A/ADG799G ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 4. Parameter VDD to GND Analog, Digital Inputs Continuous Current, S or D Pins Peak Current, S or D Pins Operating Temperature Range Industrial (B Version) Storage Temperature Range Junction Temperature θJA Thermal Impedance 24-Lead LFCSP Lead Temperature, Soldering (10 sec) IR Reflow, Peak Temperature (