ADG799ABCPZ-REEL

I2C®-Compatible, Wide Bandwidth, Triple 2 × 2 Crosspoint Switch ADG799A/ADG799G Bandwidth: 230 MHz Low insertion loss and on resistance: 2.6 Ω typical On resistance flatness: 0.3 Ω typical Single 3 V/5 V supply operation 3.3 V analog signal range (5 V supply, 75 Ω load) Low quiescent supply current: 1 nA typical Fast switching times: tON =184 ns, tOFF = 180 ns I2C-compatible interface Compact 24-lead LFCSP Two I2C-controllable logic outputs (ADG799G only) ESD protection 4 kV human body model 200 V machine model 1 kV field-induced charged device model FUNCTIONAL BLOCK DIAGRAMS VDD VDD GND ADG799G ADG799A S1A S1B S2A S2B S3A 2×2 CROSSPOINT D1A S1A D1B S1B 2×2 CROSSPOINT D2A S2A D2B S2B D3A S3A D3B S3B 2×2 CROSSPOINT S3B I2C SERIAL INTERFACE A0 A1 GND D1A 2×2 CROSSPOINT D2A 2×2 CROSSPOINT D3A I2C SERIAL INTERFACE GPO1 A2 SDA SCL 2×2 CROSSPOINT A0 A1 D1B D2B D3B GPO2 A2 SDA SCL 06038-001 FEATURES Figure 1. ADG799A and ADG799G APPLICATIONS RGB/YPbPr video switches HDTV Projection TV DVD-R/RW AV receivers GENERAL DESCRIPTION The ADG799A/ADG799G are monolithic CMOS devices comprising three 2 × 2 crosspoint switches controllable via a standard I2C serial interface. The CMOS process provides ultralow power dissipation, yet offers high switching speed and low on resistance. The on resistance profile is very flat over the full analog input range and wide bandwidth ensures excellent linearity and low distortion. These features, combined with a wide input signal range, make the ADG799A/ADG799G the ideal switching solution for a wide range of TV applications including RGB and YPbPr video switches for picture-in picture applications. The switches conduct equally well in both directions when on. In the off condition, signal levels up to the supplies are blocked. The ADG799A/ADG799G switches exhibit break-before-make switching action. The ADG799G has two general-purpose logic output pins controlled by the I2C interface that can also be used to control other non-I2C-compatible devices such as video filters. The integrated I2C interface provides a large degree of flexibility in the system design. It has three user-adjustable I2C address pins that allow up to eight devices on the same bus. This allows the user to expand the capability of the device by increasing the size of the switching array. The ADG799A/ADG799G operate from single 3 V or 5 V supply voltages and are available in a compact, 4 mm × 4 mm body, 24-lead, Pb-free LFCSP. PRODUCT HIGHLIGHTS 1. Wide bandwidth: 230 MHz. 2. Ultralow power dissipation. 3. Extended input signal range. 4. Integrated I2C serial interface. 5. Compact 4 mm × 4 mm, 24-lead, Pb-free LFCSP. 6. ESD protection tested as per ESD Association standards: • • • 4 kV HBM (ANSI/ESD STM5.1-2001) 200 V MM (ANSI/ESD STM5.2-1999) 1 kV FICDM (ANSI/ESD STM5.3.1-1999) Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved. ADG799A/ADG799G TABLE OF CONTENTS Features .............................................................................................. 1 Terminology .................................................................................... 16 Applications....................................................................................... 1 Theory of Operation ...................................................................... 17 Functional Block Diagrams............................................................. 1 I2C Serial Interface ..................................................................... 17 General Description ......................................................................... 1 I2C Address.................................................................................. 17 Product Highlights ........................................................................... 1 Write Operation.......................................................................... 17 Revision History ............................................................................... 2 LDSW Bit..................................................................................... 19 Specifications..................................................................................... 3 Power On/Software Reset.......................................................... 19 I2C Timing Specifications............................................................ 7 Read Operation........................................................................... 19 Absolute Maximum Ratings............................................................ 9 Evaluation Board ............................................................................ 20 ESD Caution.................................................................................. 9 Using the ADG799G Evaluation Board .................................. 20 Pin Configurations and Function Descriptions ......................... 10 Outline Dimensions ....................................................................... 23 Typical Performance Characteristics ........................................... 11 Ordering Guide .......................................................................... 23 Test Circuits..................................................................................... 14 REVISION HISTORY 7/06—Revision 0: Initial Version Rev. 0 | Page 2 of 24 ADG799A/ADG799G SPECIFICATIONS VDD = 5 V ± 10%, GND = 0 V, TA = −40°C to +85°C, unless otherwise noted. Table 1. Parameter ANALOG SWITCH Analog Signal Range 2 On Resistance, RON On Resistance Matching Between Channels, ∆RON On Resistance Flatness, RFLAT(ON) LEAKAGE CURRENTS Source Off Leakage (IS(OFF)) Drain Off Leakage (ID(OFF)) Channel On Leakage (ID(ON), IS(ON)) DYNAMIC CHARACTERISTICS 3 tON, tENABLE tOFF, tDISABLE Break-Before-Make Time Delay, tD I2C to GPO Propagation Delay, tH, tL (ADG799G only) Off Isolation Channel-to-Channel Crosstalk Same Crosspoint Switch Different Crosspoint Switch −3 dB Bandwidth THD + N Charge Injection CS(OFF) CD(OFF) CD(ON), CS(ON) Power Supply Rejection Ratio, PSRR Differential Gain Error Differential Phase Error LOGIC INPUTS3 A0, A1, A2 Pins Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH Input Capacitance, CIN SCL, SDA Pins Input High Voltage, VINH Input Low Voltage, VINL Input Leakage Current, IIN Input Hysteresis Input Capacitance, CIN LOGIC OUTPUTS SDA Pin3 Output Low Voltage, VOL Conditions Min VS = VDD, RL = 1 MΩ VS =VDD, RL = 75 Ω VD = 0 V, IDS = −10 mA, see Figure 22 VD = 0 V to 1 V, IDS = −10 mA, see Figure 22 VD = 0 V, IDS = −10 mA VD = 1 V, IDS = −10 mA VD = 0 V to 1 V, IDS = −10 mA 0 0 Typ 1 2.6 0.15 0.3 VD = 4 V/1 V, VS = 1 V/4 V, see Figure 23 VD = 4 V/1 V, VS = 1 V/4 V, see Figure 23 VD = VS = 4 V/1 V, see Figure 24 ±0.25 ±0.25 ±0.25 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS1 = VS2 = 2 V, see Figure 29 184 180 3 1 f = 10 MHz, RL = 50 Ω, see Figure 26 f = 10 MHz, RL = 50 Ω, see Figure 27 RL = 50 Ω, see Figure 15 RL = 100 Ω CL = 1 nF, VS = 0 V, see Figure 30 f = 20 kHz CCIR330 test signal CCIR330 test signal Max Unit 4 3.3 5 5.5 1.85 1.85 0.55 V V Ω Ω Ω Ω Ω nA nA nA 240 235 ns ns ns 130 −60 ns dB −50 −80 230 0.14 4 13 17 35 70 0.56 0.79 dB dB MHz % pC pF pF pF dB % Degrees 2.0 VIN = 0 V to VDD 0.005 3 0.7 × VDD −0.3 VIN = 0 V to VDD ISINK = 3 mA ISINK = 6 mA Floating State Leakage Current Floating State Output Capacitance Rev. 0 | Page 3 of 24 +0.005 0.05 × VDD 3 0.8 ±1 V V μA pF VDD + 0.3 +0.3 × VDD ±1 V V μA V pF 0.4 0.6 ±1 10 V V μA pF ADG799A/ADG799G Parameter GPO1 and GPO2 Pins Output Low Voltage, VOL Output High Voltage, VOH POWER REQUIREMENTS IDD Conditions Min ILOAD = 2 mA ILOAD = −2 mA 2.0 Digital inputs = 0 V or VDD, I2C interface inactive I2C interface active, fSCL = 400 kHz I2C interface active, fSCL = 3.4 MHz 1 All typical values are at TA = +25°C, unless otherwise stated. Guaranteed by initial characterization, not subject to production test. 3 Guaranteed by design, not subject to production test. 2 Rev. 0 | Page 4 of 24 Typ 1 0.001 Max Unit 0.4 V V 1 μA 0.2 0.7 mA mA ADG799A/ADG799G VDD = 3 V ± 10%, GND = 0 V, TA = −40°C to +85°C, unless otherwise noted. Table 2. Parameter ANALOG SWITCH Analog Signal Range 2 On Resistance, RON On Resistance Matching Between Channels, ∆RON On Resistance Flatness, RFLAT(ON) LEAKAGE CURRENTS Source Off Leakage (IS(OFF)) Drain Off Leakage (ID(OFF)) Channel On Leakage (ID(ON), IS(ON)) DYNAMIC CHARACTERISTICS 3 tON, tENABLE tOFF, tDISABLE Break-Before-Make Time Delay, tD I2C to GPO Propagation Delay, tH, tL (ADG799G only) Off Isolation Channel-to-Channel Crosstalk Same Crosspoint Switch Different Crosspoint Switch −3 dB Bandwidth THD + N Charge Injection CS(OFF) CD(OFF) CD(ON), CS(ON) Power Supply Rejection Ratio, PSRR Differential Gain Error Differential Phase Error LOGIC INPUTS A0, A1, A2 Pins3 Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH Input Capacitance, CIN SCL, SDA Pins3 Input High Voltage, VINH Input Low Voltage, VINL Input Leakage Current, IIN Input Hysteresis Input Capacitance, CIN LOGIC OUTPUTS3 SDA Pin Output Low Voltage, VOL Conditions Min VS = VDD, RL = 1 MΩ VS = VDD, RL = 75 Ω VD = 0 V, IDS = −10 mA, see Figure 22 VD = 0 V to 1 V, IDS = −10 mA, see Figure 22 VD = 0 V, IDS = −10 mA VD = 1 V, IDS = −10 mA VD = 0 V to 1 V, IDS = −10 mA 0 0 Typ 1 3 0.15 0.3 VD = 2 V/1 V, VS = 1 V/2 V, see Figure 23 VD = 2 V/1 V, VS = 1 V/2 V, see Figure 23 VD = VS = 2 V/1 V, see Figure 24 ±0.25 ±0.25 ±0.25 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS1 = VS2 = 2 V, see Figure 29 203 200 3 1 f = 10 MHz, RL = 50 Ω, see Figure 26 f = 10 MHz, RL = 50 Ω, see Figure 27 RL = 50 Ω, see Figure 15 RL = 100 Ω CL = 1 nF, VS = 0 V, see Figure 30 f = 20 kHz CCIR330 test signal CCIR330 test signal Max Unit 2.2 1.7 5.5 8 1.8 2.1 2.8 V V Ω Ω Ω Ω Ω nA nA nA 266 260 ns ns ns 121 ns −60 dB −50 −80 210 0.14 2 13 17 35 70 0.66 1 dB dB MHz % pC pF pF pF dB % Degrees 2.0 VIN = 0 V to VDD +0.005 3 0.7 × VDD −0.3 VIN = 0 V to VDD 0.005 0.05 × VDD 3 ISINK = 3 mA ISINK = 6 mA Floating State Leakage Current Floating State Output Capacitance 3 Rev. 0 | Page 5 of 24 0.8 ±1 V V μA pF VDD + 0.3 +0.3 × VDD ±1 V V μA V pF 0.4 0.6 ±1 V V μA pF ADG799A/ADG799G Parameter GPO1 and GPO2 Pins Output Low Voltage, VOL Output High Voltage, VOH POWER REQUIREMENTS IDD Conditions Min ILOAD = 2 mA ILOAD = −2 mA 2.0 Digital inputs = 0 V or VDD, I2C interface inactive I2C interface active, fSCL = 400 kHz I2C interface active, fSCL = 3.4 MHz 1 All typical values are at TA = +25°C, unless otherwise stated. Guaranteed by initial characterization, not subject to production test. 3 Guaranteed by design, not subject to production test. 2 Rev. 0 | Page 6 of 24 Typ 1 0.001 Max Unit 0.4 V V 1 μA 0.1 0.2 mA mA ADG799A/ADG799G I2C TIMING SPECIFICATIONS VDD = 2.7 V to 5.5 V; GND = 0 V; TA = −40°C to +85°C, unless otherwise noted (see Figure 2 for timing diagram). Table 3. Parameter 1 fSCL t1 Conditions Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode Standard mode Fast mode High speed mode Standard mode Fast mode Standard mode Fast mode High speed mode Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max B B t2 t3 t4 2 t5 t6 t7 t8 t9 t10 t11 Min Max 100 400 Unit kHz kHz 3.4 1.7 4 0.6 MHz MHz μs μs 60 120 4.7 1.3 ns ns μs μs 160 320 250 100 10 0 0 ns ns ns ns ns μs μs 3.45 0.9 0 0 4.7 0.6 160 4 0.6 160 4.7 1.3 4 0.6 160 703 150 1000 300 ns ns μs μs ns μs μs ns μs μs μs μs ns ns ns 80 160 300 300 ns ns ns ns 20 + 0.1 CB 80 160 1000 300 ns ns ns ns 10 20 40 80 ns ns 20 + 0.1 CB B 10 20 20 + 0.1 CB B 10 20 B Description Serial clock frequency tHIGH, SCL high time tLOW, SCL low time tSU;DAT, data setup time tHD;DAT, data hold time tSU;STA, setup time for a repeated start condition tHD;STA, hold time (repeated) start condition tBUF, bus free time between a stop and a start condition tSU;STO, setup time for stop condition tRDA, rise time of SDA signal tFDA, fall time of SDA signal tRCL, rise time of SCL signal Rev. 0 | Page 7 of 24 ADG799A/ADG799G Parameter 1 t11A t12 tSP 1 2 Conditions Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Fast mode High speed mode Min Max 1000 300 Unit ns ns 20 + 0.1 CB 80 160 300 300 ns ns ns ns 10 20 0 0 40 80 50 10 ns ns ns ns 20 + 0.1 CB B 10 20 B Description tRCL1, rise time of SCL signal after a repeated start condition and after an acknowledge bit. tFCL, fall time of SCL signal Pulse width of suppressed spike Guaranteed by initial characterization. CB refers to capacitive load on the bus line, tr and tf measured between 0.3 VDD and 0.7 VDD. A device must provide a data hold time for SDA in order to bridge the undefined region of the SCL falling edge. Timing Diagram t11 t12 t6 t2 SCL t1 t6 t4 t5 t3 t8 t10 t9 t7 P S S Figure 2. Timing Diagram for 2-Wire Serial Interface Rev. 0 | Page 8 of 24 P 06038-002 SDA ADG799A/ADG799G ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 4. Parameter VDD to GND Analog, Digital Inputs Continuous Current, S or D Pins Peak Current, S or D Pins Operating Temperature Range Industrial (B Version) Storage Temperature Range Junction Temperature θJA Thermal Impedance 24-Lead LFCSP Lead Temperature, Soldering (10 sec) IR Reflow, Peak Temperature (