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ADL5531-EVALZ

ADL5531-EVALZ

  • 厂商:

    AD(亚德诺)

  • 封装:

    -

  • 描述:

    EVAL BOARD ADL5531

  • 数据手册
  • 价格&库存
ADL5531-EVALZ 数据手册
20 MHz to 500 MHz IF Gain Block ADL5531 Data Sheet FUNCTIONAL BLOCK DIAGRAM Fixed gain of 20 dB Operation up to 500 MHz Input/output internally matched to 50 Ω Integrated bias control circuit Output IP3 41 dBm at 70 MHz 39 dBm at 190 MHz Output 1 dB compression: 20.6 dB at 190 MHz Noise figure: 2.5 dB at 190 MHz Single 5 V power supply Small footprint 8-lead LFCSP ADL5534 20 dB gain dual-channel version ±2 kV ESD (Class 2) ADL5531 8 NC NC 1 RFIN 2 NC 3 NC 4 7 RFOUT BIAS CONTROL LINEARIZER 6 NC 5 CLIN 06833-001 FEATURES NC = NO CONNECT Figure 1. GENERAL DESCRIPTION The ADL5531 is a broadband, fixed-gain, linear amplifier that operates at frequencies up to 500 MHz. The device can be used in a wide variety of equipment, including cellular, satellite, broadband, and instrumentation equipment. The ADL5531 is fabricated on a GaAs HBT process and has an ESD rating of ±2 kV (Class 2). The device is packaged in an 8-lead 3 mm × 3 mm LFCSP that uses an exposed paddle for excellent thermal impedance. The ADL5531 provides a gain of 20 dB, which is stable over frequency, temperature, power supply, and from device to device. This amplifier is single ended and internally matched to 50 Ω. Only input/output ac coupling capacitors, power supply decoupling capacitors, and external inductors are required for operation. The ADL5531 consumes 100 mA on a single 5 V supply and is fully specified for operation from −40°C to +85°C. Rev. C The dual-channel 20 dB gain version, ADL5534, is also available from Analog Devices, Inc. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2007–2017 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADL5531 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ..............................................7 Functional Block Diagram .............................................................. 1 Basic Connections .............................................................................9 General Description ......................................................................... 1 Revision History ............................................................................... 2 Soldering Information and Recommended PCB Land Pattern .............................................................................................9 Specifications..................................................................................... 3 Evaluation Board ............................................................................ 10 Typical Scattering Parameters..................................................... 4 Outline Dimensions ....................................................................... 11 Absolute Maximum Ratings ............................................................ 5 Ordering Guide .......................................................................... 11 ESD Caution .................................................................................. 5 Pin Configuration and Function Descriptions ............................. 6 REVISION HISTORY 8/2017—Rev. B to Rev. C Changed CP-8-2 to CP-8-13 ........................................ Throughout Updated Outline Dimensions ....................................................... 11 Changes to Ordering Guide .......................................................... 11 11/2013—Rev. A to Rev. B Changes to Figure 2 .......................................................................... 6 Added Figure 14, Renumbered Sequentially ................................ 8 8/2008—Rev. 0 to Rev. A Changes to Features Section and General Description Section ................................................................................................ 1 Added Exposed Pad Notation to Outline Dimensions ............. 11 8/2007—Revision 0: Initial Version Rev. C | Page 2 of 12 Data Sheet ADL5531 SPECIFICATIONS VPOS = 5 V and TA = 25°C, unless otherwise noted. Table 1. Parameter OVERALL FUNCTION Frequency Range Gain (S21) Input Return Loss (S11) Output Return Loss (S22) Reverse Isolation (S12) FREQUENCY = 70 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 190 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 380 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure POWER INTERFACE Supply Voltage Supply Current vs. Temperature Power Dissipation Conditions Min Typ Max Unit 500 20.3 −19.5 −26.5 −23.0 MHz dB dB dB dB 20.9 ±0.03 ±0.22 ±0.19 20.4 41.0 2.5 dB dB dB dB dBm dBm dB 20 190 MHz 190 MHz 190 MHz 190 MHz ± 5 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V Δf = 1 MHz, output power (POUT) = 0 dBm per tone 19.7 20.3 ±0.12 ±0.22 ±0.17 20.6 39.0 2.5 21.0 dB dB dB dB dBm dBm dB 19.2 19.7 ±0.15 ±0.24 ±0.15 20.4 36.0 3.0 20.5 dB dB dB dB dBm dBm dB 4.75 5 100 ±15 0.5 5.25 110 V mA mA W ± 50 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V Δf = 1 MHz, output power (POUT) = 0 dBm per tone ± 50 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V Δf = 1 MHz, output power (POUT) = 0 dBm per tone Pin RFOUT −40°C ≤ TA ≤ +85°C VPOS = 5 V Rev. C | Page 3 of 12 ADL5531 Data Sheet TYPICAL SCATTERING PARAMETERS VPOS = 5 V and TA = 25°C. The effects of the test fixture have been de-embedded up to the pins of the device. Table 2. Frequency (MHz) 20 50 100 150 200 250 300 350 400 450 500 S11 S21 S12 S22 Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) −19.9933 −19.6622 −17.9244 −18.4041 −18.6386 −19.2303 −19.4456 −20.1783 −20.2409 −20.7266 −20.6064 −132.614 −151.093 −166.031 −177.116 +179.6269 +175.3384 +175.0622 +173.422 +174.1593 +175.6233 +175.853 21.99753 21.20511 20.83152 20.67117 20.56097 20.45422 20.34563 20.21365 20.07116 19.90932 19.72779 173.7349 170.3258 167.5595 164.1871 160.4721 156.5272 152.4398 148.3008 144.2311 140.0789 135.9952 −24.2574 −23.4894 −23.22 −23.0914 −22.9921 −22.9219 −22.8475 −22.7662 −22.665 −22.5569 −22.4519 4.854191 5.603544 6.119636 6.631844 7.784913 8.763143 9.908631 11.21706 12.36953 13.57857 14.73385 −19.1444 −21.4752 −23.0386 −23.335 −22.8555 −21.6619 −20.2707 −18.7007 −17.1242 −15.726 −14.41 −46.7161 −89.9497 −115.741 −119.722 −115.855 −111.307 −106.681 −104.369 −103.565 −103.863 −105.079 Rev. C | Page 4 of 12 Data Sheet ADL5531 ABSOLUTE MAXIMUM RATINGS ESD CAUTION Table 3. Parameter Supply Voltage on RFOUT Input Power on RFIN Internal Power Dissipation (Paddle Soldered) θJA (Junction to Air) Maximum Junction Temperature Operating Temperature Range Storage Temperature Range ESD Rating—Human Body Model Rating 5.5 V 10 dBm 600 mW 103°C/W 150°C −40°C to +85°C −65°C to +150°C ±2 kV Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. C | Page 5 of 12 ADL5531 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS NC 1 NC 3 NC 4 8 NC ADL5531 TOP VIEW (Not to Scale) 7 RFOUT 6 NC 5 CLIN NOTES 1. NC = NO CONNECT. 2. EXPOSED PAD. SOLDER THIS PAD TO A LOW IMPEDANCE GROUND PLANE. 06833-002 RFIN 2 Figure 2. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1, 3, 4, 6, 8 2 5 7 Mnemonic NC RFIN CLIN RFOUT EP Exposed Pad Description No Connect. RF Input. Requires a 10 nF dc blocking capacitor. A 1 nF capacitor connected between Pin 5 and ground provides decoupling for the on-board linearizer. RF Output and Bias. DC bias is provided to this pin through a 470 nH inductor (Coilcraft 1008CS-471XJLC or equivalent). The RF path requires a 10 nF dc blocking capacitor. GND. Solder this pad to a low impedance ground plane. Rev. C | Page 6 of 12 Data Sheet ADL5531 TYPICAL PERFORMANCE CHARACTERISTICS 30 10 27 24 P1dB 6 21 NOISE FIGURE 0 100 50 150 200 250 300 350 400 450 36 21.0 +85°C 12 500 FREQUENCY (MHz) 32 20.5 –40°C 20.0 19.0 28 0 42 150 200 250 300 350 400 26 500 450 70MHz 20MHz 40 21.0 38 20.8 –40°C 20.4 20.2 +25°C 20.0 19.8 380MHz 34 500MHz 32 30 +85°C 19.6 190MHz 36 OIP3 (dBm) 20.6 28 19.4 26 19.2 50 100 150 200 250 300 350 400 450 500 FREQUENCY (MHz) 24 –8 06833-004 0 –6 –4 –2 0 2 4 6 8 10 12 14 16 18 20 06833-007 GAIN (dB) 100 Figure 6. P1dB and OIP3 vs. Frequency and Temperature 21.2 500 POUT PER TONE (dBm) Figure 4. Gain vs. Frequency and Temperature Figure 7. OIP3 vs. Output Power (POUT) and Frequency 0 5.0 –5 4.5 NOISE FIGURE (dB) –10 S11 (dB) –15 S12 (dB) –20 –25 –30 4.0 3.5 +85°C 3.0 +25°C 2.5 –40°C 2.0 –35 S22 (dB) 0 50 100 150 200 250 300 350 400 450 500 FREQUENCY (MHz) 1.5 06833-005 S-PARAMETERS (dB) 50 FREQUENCY (MHz) 21.4 –40 30 19.5 Figure 3. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency 19.0 34 +25°C 06833-008 0 21.5 18 15 2 38 +85°C 06833-006 8 P1dB (dBm) 33 12 40 –40°C 22.0 36 14 4 22.5 39 OIP3 16 42 +25°C OIP3 (dBm) 42 06833-003 NOISE FIGURE, GAIN (dB) 18 23.0 45 GAIN 20 P1dB, OIP3 (dBm) 22 0 50 100 150 200 250 300 350 400 450 FREQUENCY (MHz) Figure 5. Input Return Loss (S11), Reverse Isolation (S12), and Output Return Loss (S22) vs. Frequency Figure 8. Noise Figure vs. Frequency and Temperature Rev. C | Page 7 of 12 ADL5531 Data Sheet 45 5.0 40 4.5 4.0 NOISE FIGURE (dB) 30 25 20 15 3.5 3.0 2.5 2.0 10 1.5 5 37.9 38.3 38.7 39.1 39.5 39.9 1.0 06833-009 0 37.5 40.3 OIP3 (dBm) 0 50 100 150 Figure 9. OIP3 Distribution at 190 MHz 250 300 350 400 450 500 Figure 12. Noise Figure vs. Frequency at 25°C, Multiple Devices Shown 60 150 140 50 SUPPLY CURRENT (mA) 130 PERCENTAGE (%) 200 FREQUENCY (MHz) 06833-012 PERCENTAGE (%) 35 40 30 20 10 5.25V 120 110 100 5V 90 80 4.75V 70 20.4 20.6 20.8 21.0 21.2 21.4 P1dB (dBm) 50 –40 –30 –20 –10 06833-010 20.2 20 30 40 50 60 70 80 90 Figure 13. Supply Current vs. Supply Voltage and Temperature 115 50 +85°C 110 45 105 35 30 25 20 15 100 90 85 80 70 5 60 19.8 20.1 20.0 20.3 20.2 20.5 20.4 20.7 20.6 20.9 20.8 GAIN (dB) 21.0 06833-011 65 19.9 –40°C 75 10 19.7 +25°C 95 55 –6 –4 –2 0 2 4 6 8 10 12 14 16 18 20 POUT (dBm) Figure 14. Supply Current vs. POUT and Temperature Figure 11. Gain Distribution at 190 MHz Rev. C | Page 8 of 12 22 06833-100 SUPPLY CURRENT (mA) 40 PERCENTAGE (%) 10 TEMPERATURE (°C) Figure 10. P1dB Distribution at 190 MHz 0 0 06833-013 60 0 20.0 Data Sheet ADL5531 BASIC CONNECTIONS 2.03mm 8 SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN 1.78mm 0.5mm 1.85mm 1 4 5 1.53mm 0.71mm Figure 15 shows the recommended land pattern for ADL5531. To minimize thermal impedance, the exposed pad on the package underside is soldered down to a ground plane. If multiple ground layers exist, they are stitched together using vias (a minimum of five vias is recommended). Pin 1, Pin 3, Pin 4, Pin 6, and Pin 8 can be left unconnected or can be connected to ground. Connecting these pins to ground slightly enhances thermal impedance. For more information on land pattern design and layout, refer to AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). Figure 15. Recommended Land Pattern VPOS C6 1µF C5 10nF L1 470nH (TESTLOOP RED) W1 GND C1 10nF 1 NC ADL5531 2 RFIN NC 8 RFOUT 7 3 NC NC 6 4 NC CLIN 5 C2 RFOUT 10nF C3 1nF 06833-014 RFIN (TESTLOOP BLACK) NC = NO CONNECT Figure 16. Basic Connections Rev. C | Page 9 of 12 06833-015 The basic connections for operating the ADL5531 are shown in Figure 16. The input and output are ac-coupled with 10 nF (0402) capacitors. DC bias is provided to the amplifier via an inductor (Coilcraft 1008CS-471XJLC or equivalent) connected to the RFOUT pin. The bias voltage should be decoupled using 10 nF and 1 μF capacitors. ADL5531 Data Sheet EVALUATION BOARD Figure 19 shows the schematic for the ADL5531 evaluation board. The board is powered by a single 5 V supply. 06833-017 The components used on the board are listed in Table 5. Power can be applied to the board through clip-on leads or through Jumper W1. Note that C4, C7, C8, L3, L4, L5, R1, and R2 have no function. 06833-016 Figure 18. Evaluation Board Layout (Top) Figure 17. Evaluation Board Layout (Bottom) L5 OPEN C4 OPEN C1 10nF C8 OPEN R1 OPEN 2 RFIN RFOUT 7 3 NC NC 6 4 NC CLIN 5 L3 OPEN C7 OPEN Z1 W1 (TESTLOOP BLACK) NC 8 1 NC (TESTLOOP RED) GND ADL5531 L2 0Ω C6 1µF C2 R2 OPEN L4 OPEN RFOUT 10nF C3 1nF 06833-018 RFIN VPOS C5 10nF L1 470nH NC = NO CONNECT Figure 19. Evaluation Board Schematic Table 5. Evaluation Board Configuration Options Component Z1 C1, C2 C3 C5 C6 C4, C7, C8 R1, R2 L1 L2 L3, L4, L5 VPOS, GND W1 RFIN, RFOUT Function DUT AC coupling capacitors Linearizer capacitor Power supply decoupling capacitor Power supply decoupling capacitor DC bias inductor Clip-on terminals for power supply 2-pin jumper for connection of ground and supply via cable 50 Ω SMA female connectors Rev. C | Page 10 of 12 Default Value ADL5531 10 nF, 0402 1 nF, 0603 10 nF, 0603 1 µF, 0603 Open Open 470 nH, 1008 (Coilcraft 1008CS-471XJLC or equivalent) 0 Ω, 0402 Open VPOS, GND W1 RFIN, RFOUT Data Sheet ADL5531 OUTLINE DIMENSIONS 0.50 BSC 8 5 PIN 1 INDEX AREA TOP VIEW 0.80 0.75 0.70 PKG-003886 1.55 1.45 1.35 EXPOSED PAD 0.50 0.40 0.30 SEATING PLANE DETAIL A (JEDEC 95) 1.84 1.74 1.64 SIDE VIEW 0.30 0.25 0.20 4 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.203 REF BOTTOM VIEW 1 PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-229-WEED-4 02-10-2017-A 3.10 3.00 SQ 2.90 Figure 20. 8-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body and 0.75 mm Package Height CP-8-13 Dimensions shown in millimeters ORDERING GUIDE Model 1 ADL5531ACPZ-R7 ADL5531-EVALZ 1 Temperature Range −40°C to +85°C Package Description 8-Lead LFCSP, 7” Tape and Reel Evaluation Board Z = RoHS Compliant Part. Rev. C | Page 11 of 12 Package Option CP-8-13 Branding Q16 ADL5531 Data Sheet NOTES ©2007–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06833-0-8/17(C) Rev. C | Page 12 of 12
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