1800 MHz to 2700 MHz,
1 W RF Driver Amplifier
ADL5606
Data Sheet
14 NC
15 NC
Operation from 1800 MHz to 2700 MHz
Gain of 24.3 dB at 2140 MHz
OIP3 of 45.5 dBm at 2140 MHz
P1dB of 30.8 dBm at 2140 MHz
Noise figure of 4.7 dB at 2140 MHz
Power supply: 5 V
Power supply current: 362 mA typical
Internal active biasing
Fast power-up/power-down function
Compact 4 mm × 4 mm, 16-lead LFCSP
ESD rating of ±1 kV (Class 1C)
Pin-compatible with the ADL5605 (700 MHz to 1000 MHz)
13 NC
FUNCTIONAL BLOCK DIAGRAM
16 NC
FEATURES
RFIN 1
12 RFOUT
PWDN
DISABLE 2
VCC 3
11 RFOUT
10 RFOUT
VBIAS
VBIAS 4
9
09968-001
RFOUT
NC 8
NC 7
NC 6
NC 5
ADL5606
Figure 1.
APPLICATIONS
Wireless infrastructure
Automated test equipment
ISM/AMR applications
0
–10
The ADL5606 is a broadband, two-stage, 1 W RF driver
amplifier that operates over a frequency range of 1800 MHz
to 2700 MHz. The device can be used in a wide variety of
wired and wireless applications, including ISM, MC-GSM,
W-CDMA, TD-SCDMA, and LTE.
–20
The ADL5606 is fabricated on a GaAs HBT process and is
packaged in a compact 4 mm × 4 mm, 16-lead LFCSP that
uses an exposed paddle for excellent thermal impedance. The
ADL5606 operates from −40°C to +85°C. A fully populated
evaluation board tuned to 2140 MHz is also available.
Rev. C
–30
–40
–50
–60
2140 MHz
–70
–80
0
2
4
6
8
10
12
14
16
18
20
22
POUT (dBm)
09968-002
The ADL5606 operates on a 5 V supply voltage and a supply
current of 362 mA. The driver also incorporates a fast powerup/power-down function for TDD applications, applications
that require a power saving mode, and applications that
intermittently transmit data.
ACPR (dBc)
GENERAL DESCRIPTION
Figure 2. ACPR vs. Output Power, 3GPP, TM1-64, at 2140 MHz
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ADL5606
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
2630 MHz Frequency Tuning Band ........................................ 10
Applications ...................................................................................... 1
General......................................................................................... 11
General Description ......................................................................... 1
Applications Information ............................................................. 13
Functional Block Diagram .............................................................. 1
Basic Layout Connections ......................................................... 13
Revision History ............................................................................... 2
ADL5606 Matching ................................................................... 14
Specifications .................................................................................... 3
ACPR and EVM ......................................................................... 15
Typical Scattering Parameters .................................................... 4
Thermal Considerations ........................................................... 15
Absolute Maximum Ratings ........................................................... 6
Thermal Resistance ...................................................................... 6
Soldering Information and Recommended PCB Land Pattern
....................................................................................................... 15
ESD Caution.................................................................................. 6
Evaluation Board ............................................................................ 16
Pin Configuration and Function Descriptions ............................ 7
Outline Dimensions ....................................................................... 18
Typical Performance Characteristics ............................................. 8
Ordering Guide .......................................................................... 18
1960 MHz Frequency Tuning Band .......................................... 8
2140 MHz Frequency Tuning Band .......................................... 9
REVISION HISTORY
5/2020—Rev. B to Rev. C
Changes to Figure 35 ..................................................................... 14
9/2017—Rev. A to Rev. B
Changed CP-16-10 to CP-16-20 ................................. Throughout
Changes to Figure 1.......................................................................... 1
Changes to Figure 3.......................................................................... 7
Updated Outline Dimensions ....................................................... 18
Changes to Ordering Guide .......................................................... 18
9/2013—Rev. 0 to Rev. A
Added Figure 29; Renumbered Sequentially .............................. 12
Updated Outline Dimensions ...................................................... 18
7/2011—Revision 0: Initial Version
Rev. C | Page 2 of 18
Data Sheet
ADL5606
SPECIFICATIONS
VCC1 = 5 V and TA = 25°C, unless otherwise noted.1
Table 1.
Parameter
OVERALL FUNCTION
Frequency Range
FREQUENCY = 1960 MHz ± 30 MHz
Gain
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point (P1dB)
vs. Frequency
vs. Temperature
vs. Supply
Adjacent Channel Power Ratio (ACPR)
Output Third-Order Intercept (OIP3)
vs. Frequency
vs. Temperature
vs. Supply
Noise Figure
FREQUENCY = 2140 MHz ± 30 MHz
Gain
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point (P1dB)
vs. Frequency
vs. Temperature
vs. Supply
Adjacent Channel Power Ratio (ACPR)
Output Third-Order Intercept (OIP3)
vs. Frequency
vs. Temperature
vs. Supply
Noise Figure
FREQUENCY = 2630 MHz ± 60 MHz
Gain
vs. Frequency
vs. Temperature
vs. Supply
Output 1 dB Compression Point (P1dB)
vs. Frequency
vs. Temperature
vs. Supply
Output Third-Order Intercept (OIP3)
vs. Frequency
vs. Temperature
vs. Supply
Noise Figure
Test Conditions/Comments
Min
Typ
1800
±30 MHz
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
±30 MHz
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
POUT = 18 dBm, one-carrier W-CDMA, 64 DPCH
∆f = 1 MHz, POUT = 14 dBm per tone
±30 MHz
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
±30 MHz
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
±30 MHz
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
POUT = 18 dBm, one-carrier W-CDMA, 64 DPCH
∆f = 1 MHz, POUT = 14 dBm per tone
±30 MHz
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
±60 MHz
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
±60 MHz
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
∆f = 1 MHz, POUT = 14 dBm per tone
±60 MHz
−40°C ≤ TA ≤ +85°C
4.75 V to 5.25 V
Rev. C | Page 3 of 18
Max
Unit
2700
MHz
24.7
±0.5
±0.9
±0.05
30.2
+0.2/−0.6
±0.5
±0.5
52
45.6
+0.8/−0.2
+0.0/−2.2
±0.5
5.1
dB
dB
dB
dB
dBm
dB
dB
dB
dBc
dBm
dB
dB
dB
dB
24.3
+0.4/−0.1
±0.9
±0.06
30.8
±0.5
±0.8
±0.4
51
45.5
+2.3/−0.8
+0.0/−2.5
+0.6/−0.3
4.7
dB
dB
dB
dB
dBm
dB
dB
dB
dBc
dBm
dB
dB
dB
dB
20.6
+0.7/−1.8
±1.0
±0.09
28.9
+0.5/−1.7
+1.2/−2.0
±0.2
43.2
±3.0
+0.3/−4.0
±1.9
5.1
dB
dB
dB
dB
dBm
dB
dB
dB
dBm
dB
dB
dB
dB
ADL5606
Data Sheet
Parameter
POWER-DOWN INTERFACE
Logic Level to Enable
Logic Level to Disable
DISABLE Pin Current
VCC1 Pin Current1
Enable Time
Disable Time
POWER INTERFACE
Supply Voltage
Supply Current
vs. Temperature
1
Test Conditions/Comments
DISABLE pin
VDISABLE decreasing
VDISABLE increasing
VDISABLE = 5 V
VDISABLE = 5 V
10% of control pulse to 90% of RFOUT
10% of control pulse to 90% of RFOUT
RFOUT pin
Min
1.4
4.75
−40°C ≤ TA ≤ +85°C
Typ
Max
Unit
0
5
1.4
4.2
75
20
1.1
V
V
mA
mA
ns
ns
5
362
+0/−25
5.25
390
V
mA
mA
VCC1 is the supply to the DUT through the RFOUT pins.
TYPICAL SCATTERING PARAMETERS
VCC1 = 5 V and TA = 25C; the effects of the test fixture have been de-embedded up to the pins of the device.1
Table 2.
Frequency
(MHz)
1000
1050
1100
1150
1200
1250
1300
1350
1400
1450
1500
1550
1600
1650
1700
1750
1800
1850
1900
1950
2000
2050
2100
2150
2200
2250
2300
2350
2400
2450
2500
2550
S11
Magnitude (dB)
−5.94
−7.09
−7.74
−7.94
−7.82
−7.46
−7.06
−6.70
−6.38
−6.08
−5.76
−5.47
−5.24
−5.02
−4.76
−4.58
−4.42
−4.25
−4.11
−3.97
−3.82
−3.72
−3.61
−3.50
−3.42
−3.36
−3.28
−3.23
−3.23
−3.19
−3.15
−3.17
Angle (°)
1.63
−24.39
−48.66
−69.86
−87.28
−100.72
−111.67
−120.51
−126.95
−133.47
−138.12
−142.70
−146.61
−150.10
−153.11
−155.89
−158.41
−160.75
−162.84
−164.79
−166.56
−168.58
−170.35
−172.01
−173.71
−175.63
−177.44
−179.05
179.33
177.86
176.27
174.60
S21
Magnitude (dB)
25.77
25.28
24.68
23.97
23.32
22.71
22.14
21.64
21.16
20.75
20.33
19.98
19.67
19.36
19.07
18.79
18.52
18.28
18.01
17.78
17.56
17.34
17.13
16.90
16.68
16.47
16.27
16.02
15.79
15.58
15.37
15.15
Angle (°)
42.78
25.40
10.90
−1.40
−12.01
−21.44
−29.87
−37.10
−44.03
−50.61
−56.84
−62.62
−68.33
−73.72
−79.01
−83.92
−88.97
−93.94
−98.66
−103.29
−107.86
−112.42
−116.91
−121.14
−125.59
−129.80
−134.15
−138.14
−142.35
−146.40
−150.40
−154.46
Rev. C | Page 4 of 18
S12
Magnitude (dB)
−64.90
−63.13
−58.63
−58.57
−59.58
−55.02
−52.50
−54.05
−53.01
−51.79
−53.89
−53.41
−53.37
−51.35
−50.65
−50.70
−51.02
−50.59
−50.81
−50.52
−52.43
−49.77
−50.35
−49.72
−50.21
−47.59
−47.62
−48.93
−49.37
−48.09
−47.72
−47.40
Angle (°)
91.56
114.08
108.53
98.35
114.37
106.02
102.74
91.45
111.40
83.98
111.28
117.99
76.10
87.47
92.39
83.18
92.52
93.13
82.49
90.57
75.32
80.61
81.31
83.35
87.74
82.95
88.25
79.29
83.50
75.23
78.72
76.72
S22
Magnitude (dB)
−1.68
−1.63
−1.54
−1.53
−1.53
−1.46
−1.45
−1.43
−1.39
−1.35
−1.38
−1.35
−1.34
−1.30
−1.26
−1.24
−1.23
−1.23
−1.21
−1.18
−1.19
−1.17
−1.16
−1.16
−1.16
−1.17
−1.14
−1.16
−1.18
−1.18
−1.16
−1.18
Angle (°)
179.86
179.29
178.87
178.32
177.95
177.27
176.60
176.34
175.90
175.36
174.93
174.51
174.16
173.84
173.35
173.01
172.59
172.28
171.75
171.61
171.19
170.99
170.70
170.44
170.09
169.84
169.46
169.27
169.01
168.72
168.34
168.15
Data Sheet
Frequency
(MHz)
2600
2650
2700
2750
2800
2850
2900
2950
3000
3050
3100
3150
3200
3250
3300
3350
3400
3450
3500
3550
3600
3650
3700
3750
3800
3850
3900
3950
4000
1
S11
Magnitude (dB)
−3.14
−3.14
−3.12
−3.14
−3.16
−3.15
−3.15
−3.15
−3.14
−3.13
−3.08
−3.01
−3.08
−3.06
−3.05
−3.03
−2.94
−2.95
−2.85
−2.83
−2.79
−2.74
−2.78
−2.80
−2.87
−3.03
−3.24
−3.63
−4.24
ADL5606
Angle (°)
172.86
171.24
169.74
167.93
166.21
164.65
162.67
160.86
159.03
157.22
155.39
152.90
150.72
149.25
147.28
145.53
143.76
141.94
140.04
138.58
136.47
134.67
132.80
130.85
128.85
126.98
125.26
123.34
122.71
S21
Magnitude (dB)
14.92
14.70
14.48
14.24
13.98
13.78
13.53
13.27
13.04
12.79
12.57
12.32
12.04
11.78
11.53
11.20
10.95
10.65
10.39
10.10
9.83
9.55
9.25
8.94
8.63
8.30
7.90
7.59
7.15
Angle (°)
−158.40
−162.27
−166.06
−169.97
−173.76
−177.32
178.93
175.30
171.76
168.32
165.01
161.32
157.39
153.80
150.59
147.57
144.00
141.12
137.78
134.68
131.38
128.32
125.07
121.74
119.06
115.71
113.11
110.08
108.11
VCC1 is the supply to the DUT through the RFOUT pins.
Rev. C | Page 5 of 18
S12
Magnitude (dB)
−46.51
−47.66
−47.77
−45.35
−45.43
−46.35
−46.92
−45.88
−45.94
−45.60
−44.06
−45.54
−46.51
−43.87
−44.31
−44.17
−43.67
−44.65
−44.52
−44.22
−43.79
−42.04
−43.97
−42.96
−43.01
−41.84
−41.50
−42.15
−41.81
Angle (°)
77.12
73.90
71.80
73.70
76.05
71.78
73.31
70.64
66.79
73.37
61.32
58.34
60.72
61.02
68.64
62.82
64.76
72.58
53.43
63.44
46.56
50.76
57.92
49.24
51.05
45.82
36.66
39.82
41.17
S22
Magnitude (dB)
−1.20
−1.20
−1.22
−1.22
−1.24
−1.25
−1.26
−1.30
−1.29
−1.33
−1.35
−1.36
−1.36
−1.35
−1.36
−1.39
−1.39
−1.39
−1.38
−1.35
−1.36
−1.31
−1.33
−1.30
−1.30
−1.24
−1.26
−1.20
−1.21
Angle (°)
167.77
167.47
167.16
166.68
166.34
166.25
165.90
165.58
165.35
165.06
164.76
164.32
163.65
163.38
162.94
162.61
162.08
161.92
161.39
161.11
160.74
160.48
160.24
159.79
159.68
159.28
159.17
159.15
159.19
ADL5606
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 3.
Parameter
Supply Voltage, VCC11
Input Power (50 Ω Impedance)
Internal Power Dissipation (Paddle
Soldered)
Maximum Junction Temperature
Lead Temperature (Soldering 60 sec)
Operating Temperature Range
Storage Temperature Range
1
Rating
6.5 V
18 dBm
3.5 W
Table 4 lists the junction-to-air thermal resistance (θJA) and the
junction-to-paddle thermal resistance (θJC) for the ADL5606.
For more information, see the Thermal Considerations section.
150°C
240°C
−40°C to +85°C
−65°C to +150°C
Package Type
16-Lead LFCSP (CP-16-20)
Table 4. Thermal Resistance
VCC1 is the supply to the DUT through the RFOUT pins.
ESD CAUTION
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the
operational section of this specification is not implied.
Operation beyond the maximum operating conditions for
extended periods may affect product reliability.
Rev. C | Page 6 of 18
θJA
52.9
θJC
12.9
Unit
°C/W
Data Sheet
ADL5606
13 NC
14 NC
16 NC
15 NC
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
RFIN 1
VCC 3
12 RFOUT
ADL5606
TOP VIEW
(Not to Scale)
11 RFOUT
10 RFOUT
9
NC 7
RFOUT
NC 8
NC 5
NC 6
VBIAS 4
NOTES
1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN.
2. THE EXPOSED PADDLE SHOULD BE SOLDERED TO
A LOW IMPEDANCE ELECTRICAL AND THERMAL
GROUND PLANE.
09968-003
DISABLE 2
Figure 3. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
1
2
Mnemonic
RFIN
DISABLE
3
VCC
4
5, 6, 7, 8, 13,
14, 15, 16
9, 10, 11, 12
VBIAS
NC
RFOUT
EP
Description
RF Input. Requires a dc blocking capacitor.
Connect this pin to 5 V to disable the part. In the disabled state, the part draws approximately 4 mA
of current from the power supply and 1.4 mA from the DISABLE pin.
Under normal operation, this pin is connected to the power supply and draws a combined 362 mA
of current. When this pin is grounded along with the VBIAS pin, the device is disabled and draws
approximately 1.4 mA from the DISABLE pin.
Applying 5 V to this pin enables the bias circuit. When this pin is grounded, the device is disabled.
No Connect. Do not connect to this pin.
RF Output. DC bias is provided to this pin through an inductor that is connected to the 5 V power
supply. The RF path requires a dc blocking capacitor.
The exposed paddle should be soldered to a low impedance electrical and thermal ground plane.
Rev. C | Page 7 of 18
ADL5606
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
1960 MHZ FREQUENCY TUNING BAND
45
44
40
42
+25°C
46
40
+85°C
44
38
–40°C
42
GAIN (dB)
25
20
36
40
34
38
32
15
+25°C
34
NF (dB)
5
+85°C
28
1940
1950
1960
1970
1980
1990
FREQUENCY (MHz)
26
1930
1940
1950
32
1960
1970
1980
30
1990
FREQUENCY (MHz)
Figure 4. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency
(OIP3 at POUT = 14 dBm per Tone)
Figure 7. P1dB and OIP3 vs. Frequency and Temperature
(OIP3 at POUT = 14 dBm per Tone)
26.5
48
26.0
47
–40°C
1930MHz
1960MHz
1990MHz
46
25.0
OIP3 (dBm)
+25°C
24.5
24.0
+85°C
45
44
43
23.5
42
23.0
41
1950
1960
1970
1980
1990
FREQUENCY (MHz)
40
–5
09968-005
1940
0
5
10
15
20
POUT PER TONE (dBm)
09968-008
25.5
22.5
1930
36
–40°C
30
10
OIP3 (dBm)
P1dB (dBm)
P1dB (dBm)
30
48
09968-007
35
0
1930
GAIN (dB)
50
46
OIP3 (dBm)
09968-004
NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm)
50
Figure 8. OIP3 vs. POUT and Frequency
Figure 5. Gain vs. Frequency and Temperature
7
0
S22
–10
NOISE FIGURE (dB)
–30
S12
+25°C
5
–40°C
4
–60
1930
1940
1950
1960
1970
1980
1990
FREQUENCY (MHz)
3
1930
1940
1950
1960
1970
1980
FREQUENCY (MHz)
Figure 9. Noise Figure vs. Frequency and Temperature
Figure 6. Input Return Loss (S11), Output Return Loss (S22),
and Reverse Isolation (S12) vs. Frequency
Rev. C | Page 8 of 18
1990
09968-009
–50
09968-006
S-PARAMETERS (dB)
–20
–40
+85°C
6
S11
Data Sheet
ADL5606
2140 MHZ FREQUENCY TUNING BAND
44
50
OIP3 (dBm)
46
–40°C
40
40
44
GAIN (dB)
38
42
36
40
34
20
38
+25°C
32
–40°C
36
34
30
10
NF (dB)
2120
2130
2140
+85°C
28
2150
2170
2160
FREQUENCY (MHz)
OIP3 (dBm)
P1dB (dBm)
26
2110
2120
2130
2140
2150
2160
32
30
2170
09968-013
P1dB (dBm)
+85°C
30
0
2110
48
+25°C
42
09968-010
NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm)
50
46
60
FREQUENCY (MHz)
Figure 10. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency
(OIP3 at POUT = 14 dBm per Tone)
Figure 13. P1dB and OIP3 vs. Frequency and Temperature
(OIP3 at POUT = 14 dBm per Tone)
50
28
2110MHz
2140MHz
2170MHz
48
27
46
26
44
GAIN (dB)
OIP3 (dBm)
–40°C
25
+25°C
24
+85°C
23
42
40
38
36
22
34
21
2130
2140
2150
2160
2170
FREQUENCY (MHz)
30
–5
0
5
10
15
20
POUT PER TONE (dBm)
09968-014
2120
09968-011
20
2110
32
Figure 14. OIP3 vs. POUT and Frequency
Figure 11. Gain vs. Frequency and Temperature
7
0
S22
–10
NOISE FIGURE (dB)
6
–20
–30
–40
+85°C
5
+25°C
–40°C
4
S12
–60
2110
2120
2130
2140
2150
2160
2170
FREQUENCY (MHz)
3
2110
2120
2130
2140
2150
2160
FREQUENCY (MHz)
Figure 15. Noise Figure vs. Frequency and Temperature
Figure 12. Input Return Loss (S11), Output Return Loss (S22),
and Reverse Isolation (S12) vs. Frequency
Rev. C | Page 9 of 18
2170
09968-015
–50
09968-012
S-PARAMETERS (dB)
S11
ADL5606
Data Sheet
2630 MHZ FREQUENCY TUNING BAND
51
48
–40°C
43
P1dB (dBm)
30
GAIN (dB)
20
45
+25°C
40
39
34
36
–40°C
31
28
10
NF (dB)
2590
2610
2630
2670
2690
33
30
+25°C
+85°C
25
2650
42
+85°C
37
22
2570
2590
OIP3 (dBm)
P1dB (dBm)
40
FREQUENCY (MHz)
27
2610
2630
2650
2670
24
2690
FREQUENCY (MHz)
Figure 19. P1dB and OIP3 vs. Frequency and Temperature
(OIP3 at POUT = 14 dBm per Tone)
Figure 16. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency
(OIP3 at POUT = 14 dBm per Tone)
49
23.0
22.5
47
22.0
–40°C
21.5
45
21.0
+25°C
OIP3 (dBm)
GAIN (dB)
54
49
46
OIP3 (dBm)
0
2570
52
09968-019
50
09968-016
NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm)
60
20.5
20.0
+85°C
19.5
19.0
43
41
39
18.5
37
2570MHz
2630MHz
2690MHz
17.5
2590
2610
2630
2650
2670
2690
FREQUENCY (MHz)
35
–5
09968-017
17.0
2570
0
5
10
15
20
POUT PER TONE (dBm)
09968-020
18.0
Figure 20. OIP3 vs. POUT and Frequency
Figure 17. Gain vs. Frequency and Temperature
7
0
S22
S11
NOISE FIGURE (dB)
6
–20
–30
–40
S12
+85°C
+25°C
5
–40°C
4
–60
2570
2590
2610
2630
2650
2670
2690
FREQUENCY (MHz)
Figure 18. Input Return Loss (S11), Output Return Loss (S22),
and Reverse Isolation (S12) vs. Frequency
Rev. C | Page 10 of 18
3
2570
2590
2610
2630
2650
2670
FREQUENCY (MHz)
Figure 21. Noise Figure vs. Frequency and Temperature
2690
09968-021
–50
09968-018
S-PARAMETERS (dB)
–10
Data Sheet
ADL5606
GENERAL
35
30
30
25
PERCENTAGE (%)
PERCENTAGE (%)
25
20
15
20
15
10
10
43.0
43.5
44.0
44.5
45.0
45.5
46.0
46.5
47.0
47.5
OIP3 (dBm)
0
09968-022
4.66
0
30
–10
4.76
4.78
4.80
4.82
–30
ACPR (dBc)
20
15
–40
–50
10
2140MHz
–60
5
1960MHz
–70
30.0
30.2
30.4
30.6
30.8
31.0
31.2
31.4
31.6
P1dB (dBm)
–80
09968-023
29.8
30
3.0
25
2.5
20
2.0
EVM (%)
3.5
15
5
0.5
24.2
24.4
24.6
24.8
GAIN (dB)
25.0
09968-024
1.0
24.0
6
8
10
12
14
16
18
20
22
1960MHz
2140MHz
1.5
10
23.8
4
Figure 26. ACPR vs. POUT, 3GPP, TM1-64, at 1960 MHz and 2140 MHz
35
23.6
2
POUT (dBm)
Figure 23. P1dB Distribution at 2140 MHz
23.4
0
09968-026
PERCENTAGE (%)
4.74
–20
25
PERCENTAGE (%)
4.72
Figure 25. Noise Figure Distribution at 2140 MHz
35
0
4.70
NOISE FIGURE (dB)
Figure 22. OIP3 Distribution at 2140 MHz, 14 dBm per Tone
0
4.68
0
–10
–5
0
5
10
POUT (dBm)
15
20
25
09968-027
0
09968-025
5
5
Figure 27. EVM vs. POUT, 3GPP, TM1-64, at 1960 MHz and 2140 MHz
Figure 24. Gain Distribution at 2140 MHz
Rev. C | Page 11 of 18
ADL5606
Data Sheet
375
5.25V
5V
365
4.75V
360
355
3
350
–20
0
20
40
60
80
TEMPERATURE (°C)
09968-028
340
–40
640
620
600
580
560
540
520
500
480
460
440
420
400
380
360
340
320
300
CH2 1V Ω
M20ns 10GS/s
A CH2
2.5V
IT 4ps/pt
Figure 30. Turn-Off Time, 10% of Control Pulse to 90% of RFOUT
3
+25°C
2
+85°C
–40°C
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32
POUT (dBm)
09968-129
SUPPLY CURRENT (mA)
Figure 28. Supply Current vs. Temperature and Supply Voltage at 2140 MHz
CH3 1V Ω
09968-029
2
345
Figure 29. Supply Current vs. POUT and Temperature at 2140 MHz, VCC = 5 V
Rev. C | Page 12 of 18
CH3 1V Ω
CH2 1V Ω
M20ns 10GS/s
A CH2
2.5V
IT 4ps/pt
09968-030
SUPPLY CURRENT (mA)
370
Figure 31. Turn-On Time, 10% of Control Pulse to 90% of RFOUT
Data Sheet
ADL5606
APPLICATIONS INFORMATION
For complete information about component values and spacing
for the different frequency tuning bands, see the ADL5606
Matching section.
BASIC LAYOUT CONNECTIONS
The basic connections for operating the ADL5606 are shown
in Figure 32. The RF matching components correspond to the
2140 MHz frequency tuning band.
RF Output Interface
Pin 9 to Pin 12 are the RF output pins. The RF output requires
only one shunt capacitor and a microstrip line used as an inductor
to match to 50 Ω. For complete information about component
values and spacing for the different frequency tuning bands, see
the ADL5606 Matching section.
Power Supply
The voltage supply for the ADL5606, which ranges from 4.75 V
to 5.25 V, should be connected to the VCC1 test pin. The dc bias
to the output stage is supplied through L1 and is connected to
the RFOUT pin. Three decoupling capacitors (C7, C8, and C9)
are used to prevent RF signals from propagating on the dc lines.
The VBIAS and VCC pins can be directly connected to the main
supply voltage. Additional decoupling capacitors (C5, C6, and
C11) are required on the VCC pin.
Power-Down
The ADL5606 can be disabled by connecting the DISABLE pin
to 5 V. When disabled, the ADL5606 draws approximately
4 mA of current from the power supply and 1.4 mA from the
DISABLE pin. Decoupling Capacitor C3 is recommended to
prevent the propagation of RF signals. To completely shut
down the device, connect the VCC pin, the VBIAS pin, and the
VCC1 test pin to ground. In this state, the part draws
approximately 1.4 mA from the DISABLE pin.
RF Input Interface
Pin 1 is the RF input pin for the ADL5606. The RF input is easily
matched with one capacitor, in a series or shunt configuration,
and a microstrip line used as an inductor. For the 1960 MHz and
2140 MHz frequency tuning bands, a shunt capacitor is used to
match the input to 50 Ω; for the 2630 MHz frequency tuning
band, a series capacitor is used.
C1
20pF
CIN
1.3pF
C3
10pF
DISABLE
VCC
C11
10µF
C6
0.01µF
C5
100pF
16
15
14
13
NC
NC
NC
NC
1
RFIN
RFOUT 12
2
DISABLE
RFOUT 11
3
VCC
RFOUT 10
4
VBIAS
COUT
3.9pF
C2
20pF
RFOUT
ADL5606
RFOUT 9
NC
NC
NC
NC
5
6
7
8
L1
18nH
C7
100pF
C8
0.01µF
C9
10µF
VCC1
Figure 32. Basic Connections
Rev. C | Page 13 of 18
09968-031
RFIN
ADL5606
Data Sheet
ADL5606 MATCHING
Table 6. Recommended Components for Basic Connections
The RF input and output of the ADL5606 can be easily
matched to 50 Ω with at most one external component and the
microstrip line used as an inductor. Table 6 lists the required
matching component values. Capacitors CIN and COUT are Murata
GRM155 series (0402 size).
Frequency (MHz)
1930 to 1990
2110 to 2170
2570 to 2690
For all frequency tuning bands, the placement of CIN and COUT
is critical. Table 7 lists the recommended component spacing
for the various frequency tuning bands. The component
spacing is referenced from the center of the component to the
edge of the package.
CIN (pF)
2.0
1.3
2.0
COUT (pF)
3.6
3.9
3.3
Table 7. Matching Component Spacing
Frequency (MHz)
1930 to 1990
2110 to 2170
2570 to 2690
λ1 (mils)
394
268
382
λ2 (mils)
197
138
83
Figure 33 to Figure 35 show the matching networks.
RFIN
C1
20pF
CIN
2pF
λ1
16
15
14
13
NC
NC
NC
NC
1
RFIN
RFOUT 12
2
DISABLE
RFOUT 11
ADL5606
COUT
3.6pF
λ2
C2
20pF
RFOUT 10
L1
18nH
9
09968-032
RFOUT
RFOUT
Figure 33. ADL5606 Match Parameters, 1960 MHz Frequency Tuning Band
RFIN
C1
20pF
CIN
1.3pF
λ1
16
15
14
13
NC
NC
NC
NC
1
RFIN
RFOUT 12
2
DISABLE
RFOUT 11
ADL5606
COUT
3.9pF
λ2
C2
20pF
RFOUT 10
L1
18nH
9
09968-033
RFOUT
RFOUT
Figure 34. ADL5606 Match Parameters, 2140 MHz Frequency Tuning Band
C1
20pF
CIN
2pF
λ1
16
15
14
13
NC
NC
NC
NC
1
RFIN
RFOUT 12
2
DISABLE
RFOUT 11
ADL5606
COUT
3.3pF
λ2
C2
20pF
RFOUT 10
RFOUT
9
RFOUT
L1
18nH
09968-034
RFIN
Figure 35. ADL5606 Match Parameters, 2630 MHz Frequency Tuning Band
Rev. C | Page 14 of 18
Data Sheet
ADL5606
ACPR AND EVM
All adjacent channel power ratio (ACPR) and error vector
magnitude (EVM) measurements were made using a single
W-CDMA carrier and Test Model 1-64.
The signal is generated by a very low ACPR source and is
measured at the output by a high dynamic range spectrum
analyzer. For ACPR measurements, the filter setting was chosen
for low ACPR; for EVM measurements, the low EVM setting was
selected. The spectrum analyzer incorporates an instrument noise
correction function, and highly linear amplifiers were used to
boost the power levels for ACPR measurements.
Figure 26 shows ACPR vs. POUT at 1960 MHz and 2140 MHz.
For power levels up to 18 dBm, an ACPR of 50 dBc or better
can be achieved at 1960 MHz and 2140 MHz.
Figure 27 shows EVM vs. POUT at 1960 MHz and 2140 MHz.
The EVM measured is 0.5% for power levels up to 18 dBm at
1960 MHz and 2140 MHz. The baseline composite EVM for
the signal source was approximately 0.5%. When operated in
the linear region, there is little or no contribution to EVM by
the amplifier.
For optimal performance, it is recommended that the thermal
vias be filled with a conductive paste of the equivalent thermal
conductivity specified earlier in this section; alternatively, an
external heat sink can be used to dissipate heat quickly without
affecting the die junction temperature. It is also recommended
that the ground pattern be extended above and below the
device to improve thermal efficiency (see Figure 36).
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
Figure 36 shows the recommended land pattern for the ADL5606.
To minimize thermal impedance, the exposed paddle on the
4 mm × 4 mm LFCSP is soldered to a ground plane along with
Pin 5 to Pin 8 and Pin 13 to Pin 16. To improve thermal dissipation, 25 thermal vias are arranged in a 5 × 5 array under the
exposed paddle. Areas above and below the paddle are tied with
regular vias. If multiple ground layers exist, they should be tied
together using vias. For more information about land pattern
design and layout, see the AN-772 Application Note, A Design
and Manufacturing Guide for the Lead Frame Chip Scale
Package (LFCSP).
THERMAL CONSIDERATIONS
For the best thermal performance, it is recommended that as
many thermal vias as possible be added under the exposed pad
of the LFCSP. The thermal resistance values assume a
minimum of 25 thermal vias arranged in a 5 × 5 array with a via
diameter of 8 mils, via pad of 16 mils, and a pitch of 20 mils.
The vias are plated with copper, and the drill hole is filled with
a conductive copper paste.
Rev. C | Page 15 of 18
16
13
RFIN
RFOUT
16 MIL VIA PAD
WITH 8 MIL VIA
5
8
09968-035
The ADL5606 is packaged in a thermally efficient 4 mm ×
4 mm, 16-lead LFCSP. The thermal resistance from junction
to air (θJA) is 52.9°C/W. The thermal resistance for the product
was extracted assuming a standard 4-layer JEDEC board with
25 copper plated thermal vias. The thermal vias are filled with
conductive copper paste (AE3030 with thermal conductivity of
7.8 W/mK and thermal expansion α1 of 4 × 10−5/°C and α2 of
8.6 × 10−5/°C). The thermal resistance from junction to case (θJC)
is 12.9°C/W, where the case is the exposed pad of the lead
frame package.
Figure 36. Recommended Land Pattern
ADL5606
Data Sheet
EVALUATION BOARD
The evaluation board has a short, non-50 Ω line on its output
to accommodate the four output pins and to allow for easier
low inductance output matching. The pads for Pin 9 to Pin 12
are included on this microstrip line and are included in all
matches. The evaluation board uses numbers as identifiers to
aid in the placement of matching components at both the RF
input and RF output of the device. Figure 38 and Figure 39
show images
of the board layout.
The schematic of the ADL5606 evaluation board is shown in
Figure 37. The evaluation board uses 25 mils wide, 50 Ω traces
and is made from IS410 material with a 20 mils gap to ground.
The evaluation board is tuned for operation at 2140 MHz. The
inputs and outputs should be ac-coupled with appropriately
sized capacitors; therefore, for low frequency applications, the
value of C1 and C2 may need to be increased. DC bias is
provided to the output stage via an inductor (L1) connected
to the RFOUT pin. A bias voltage of 5 V is recommended.
C1
20pF
CIN
1.3pF
C10
OPEN
DISABLE
C4
OPEN
C3
10pF
R4
OPEN
C11
10µF
VCC3
R1
0Ω
C6
0.01µF
16
15
14
13
NC
NC
NC
NC
1
RFIN
RFOUT 12
2
DISABLE
RFOUT 11
3
VCC
RFOUT 10
4
VBIAS
C5
100pF
C2
20pF
RFOUT
ADL5606
L1
18nH
RFOUT 9
NC
NC
NC
NC
5
6
7
8
C7
100pF
C8
0.01µF
VCC2
R5
OPEN
COUT
3.9pF
C14
OPEN
C13
OPEN
C12
OPEN
C9
10µF
R2
0Ω
VCC1
09968-036
RFIN
Figure 37. Evaluation Board, 2140 MHz Frequency Tuning Band
Table 8. Evaluation Board Configuration Options, 2140 MHz Frequency Tuning Band
Component
C1, C2
C3, C4, C5, C6, C7,
C8, C9, C10, C11,
C12, C13, C14
CIN
COUT
L1
R1, R2, R4, R5
Exposed Paddle
Function/Notes
Input/output dc blocking capacitors.
Power supply decoupling capacitors. Power supply decoupling capacitors are required to
filter out the high frequency noise on the power supply. The smallest capacitor should be the
closest to the ADL5606. The main bias that goes through RFOUT is the most sensitive to noise
because the bias is connected directly to the RF output. For the 1960 MHz and 2140 MHz
frequency tuning bands, Capacitors C12, C13, and C14 are open; for the 2630 MHz frequency
tuning band, it is recommended that the bypassing capacitors be added as follows:
C12 = 100 pF, C13 = 0.01 μF, and C14 = 10 μF.
Input matching capacitor. To match the ADL5606 at the 2140 MHz frequency tuning band,
Shunt Capacitor CIN is required at a distance of 268 mils. If space is at a premium, an inductor
can take the place of the microstrip line.
Output matching capacitor. COUT is set at a specific distance from the device so that the
micro-strip line can act as inductance for the matching network (see Table 7). If space is at a
premium, an inductor can take the place of the microstrip line. A short length of low
impedance line on the output is embedded in the match.
The main bias for the ADL5606 comes through L1 to the output stage. L1 should be high
impedance for the frequency of operation while providing low resistance for the dc current.
The evaluation board uses a Coilcraft® 0603HP-18NX_LU inductor; this 18 nH inductor provides
some of the match at 2140 MHz.
To provide bias to all stages through just one supply, set R1 and R2 to 0 Ω, and leave R4 and
R5 open. To provide separate bias to stages, set R1 and R2 to open and R4 and R5 to 0 Ω.
The paddle should be connected to both thermal and electrical ground.
Rev. C | Page 16 of 18
Default Value
C1, C2 = 20 pF
C3 = 10 pF
C5, C7 = 100 pF
C6, C8 = 0.01 μF
C9, C11 = 10 μF
C4, C10, C12, C13,
C14 = open
CIN = 1.3 pF HQ
COUT = 3.9 pF HQ
L1 = 18 nH
R1, R2 = 0 Ω
R4, R5 = open
ADL5606
Figure 38. Evaluation Board Layout, Top
09968-038
09968-037
Data Sheet
Figure 39. Evaluation Board Layout, Bottom
Rev. C | Page 17 of 18
ADL5606
Data Sheet
OUTLINE DIMENSIONS
DETAIL A
(JEDEC 95)
4.10
4.00 SQ
3.90
0.65
BSC
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
16
13
1
12
*2.40
EXPOSED
PAD
2.35 SQ
2.30
4
9
TOP VIEW
0.80
0.75
0.70
SIDE VIEW
PKG-004024
SEATING
PLANE
0.50
0.40
0.30
5
8
BOTTOM VIEW
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
*COMPLIANT TO JEDEC STANDARDS MO-220-WGGC-3
WITH EXCEPTION TO THE EXPOSED PAD.
03-30-2017-B
PIN 1
INDICATOR
0.35
0.30
0.25
Figure 40. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-16-20)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADL5606ACPZ-R7
ADL5606-EVALZ
1
Temperature Range
−40°C to +85°C
Package Description
16-Lead Lead Frame Chip Scale Package [LFCSP]
Evaluation Board
Z = RoHS Compliant Part.
©2011–2020 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09968-5/20(C)
Rev. C | Page 18 of 18
Package Option
CP-16-20