±1°C Remote and Local System
Temperature Monitor
ADM1032
S
FEATURES
GENERAL DESCRIPTION
On-chip and remote temperature sensing
Offset registers for system calibration
0.125°C resolution/1°C accuracy on remote channel
1°C resolution/3°C accuracy on local channel
Fast (up to 64 measurements per second)
2-wire SMBus serial interface
Supports SMBus alert
Programmable under/overtemperature limits
Programmable fault queue
Overtemperature fail-safe THERM output
Programmable THERM limits
Programmable THERM hysteresis
170 μA operating current
5.5 μA standby current
3 V to 5.5 V supply
Small 8-lead SOIC and MSOP packages
The ADM1032 1 is a dual-channel digital thermometer and
under/overtemperature alarm intended for use in PCs and
thermal management systems. The device can measure the
temperature of a remote thermal diode, which can be located
on the processor die or can be a discrete device (2N3904/06),
accurate to 1°C. A novel measurement technique cancels out
the absolute value of the transistor’s base emitter voltage so that
no calibration is required. The ADM1032 also measures its
ambient temperature.
The ADM1032 communicates over a 2-wire serial interface
compatible with system management bus (SMBus) standards.
Under/overtemperature limits can be programmed into the
device over the SMBus, and an ALERT output signals when the
on-chip or remote temperature measurement is out of range.
This output can be used as an interrupt or as a SMBus alert. The
THERM output is a comparator output that allows CPU clock
throttling or on/off control of a cooling fan. An ADM1032-1 and
ADM1032-2 are available. The difference between the
ADM1032 and theADM1032-1 is the default value of the
external THERM limit. The ADM1032-2 has a different
SMBus address. The SMBus address of theADM1032-2 is 0x4D.
APPLICATIONS
Desktop and notebook computers
Smart batteries
Industrial controllers
Telecommunications equipment
Instrumentation
Embedded systems
1
Patents 5,982,221; 6,097,239; 6,133,753; 6,169,442; 5,867,012.
FUNCTIONAL BLOCK DIAGRAM
ADDRESS POINTER
REGISTER
D–
ANALOG
MUX
A/D
CONVERTER
BUSY
RUN/STANDBY
LOCAL TEMPERATURE
LOW LIMIT REGISTER
LIMIT
COMPARATOR
REMOTE TEMPERATURE
VALUE REGISTER
DIGITAL MUX
D+
LOCAL TEMPERATURE
VALUE REGISTER
DIGITAL MUX
CONVERSION RATE
REGISTER
ON-CHIP
TEMPERATURE
SENSOR
LOCAL TEMPERATURE
HIGH LIMIT REGISTER
REMOTE TEMPERATURE
LOW LIMIT REGISTER
REMOTE TEMPERATURE
HIGH LIMIT REGISTER
LOCAL THERM LIMIT
REGISTER
REMOTE OFFSET
REGISTER
EXTERNAL THERM LIMIT
REGISTER
CONFIGURATION
REGISTER
EXTERNAL DIODE OPEN-CIRCUIT
INTERRUPT
MASKING
STATUS REGISTER
VDD
ALERT
SMBUS INTERFACE
GND
SDATA
01906-001
THERM
ADM1032
SCLK
Figure 1.
Rev. E
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rights of third parties that may result from its use. Specifications subject to change without notice. No
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Fax: 781.461.3113
© 2005 Analog Devices, Inc. All rights reserved.
ADM1032
TABLE OF CONTENTS
Features .............................................................................................. 1
Serial Bus Interface..................................................................... 11
Applications....................................................................................... 1
Addressing the Device ............................................................... 12
General Description ......................................................................... 1
ALERT Output............................................................................ 14
Functional Block Diagram .............................................................. 1
Low Power Standby Mode......................................................... 14
Revision History ............................................................................... 2
The ADM1032 Interrupt System ............................................. 14
Specifications..................................................................................... 3
Sensor Fault Detection .............................................................. 15
Absolute Maximum Ratings............................................................ 4
Applications Information—Factors Affecting Accuracy .......... 16
Thermal Characterisitics ............................................................. 4
Remote Sensing Diode .............................................................. 16
ESD Caution.................................................................................. 4
Thermal Inertia and Self-Heating............................................ 16
Pin Configuration and Function Descriptions............................. 5
Layout Considerations............................................................... 17
Typical Performance Characteristics ............................................. 6
Application Circuit..................................................................... 17
Functional Description .................................................................... 8
Outline Dimensions ....................................................................... 18
Measurement Method.................................................................. 8
Ordering Guide .......................................................................... 19
Temperature Data Format ........................................................... 9
ADM1032 Registers ..................................................................... 9
REVISION HISTORY
11/05—Rev. D to Rev. E
Updated Format..................................................................Universal
Changes to General Description .................................................... 1
Changes to Thermal Characteristics.............................................. 4
Changes to Table 3............................................................................ 5
Changes to Measurement Method Section ................................... 8
Changes to Limit Registers Section.............................................. 10
Changes to Serial Bus Interface Section ...................................... 11
Changes to Ordering Guide .......................................................... 19
3/03—Rev. B to Rev. C
Edits to Specifications .......................................................................2
10/02—Rev. A to Rev. B
Edits to the General Description.....................................................1
Edits to the Ordering Guide.............................................................3
Edits to Table VIII .............................................................................8
Outline Dimensions Updated....................................................... 12
10/04—Rev. C to Rev. D
Changes to Product Description .................................................... 1
Changes to Absolute Maximum Ratings ....................................... 3
Changes to Ordering Guide ............................................................ 3
Changes to Addressing the Device Section................................... 8
Updated Outline Dimensions ....................................................... 14
Rev. E | Page 2 of 20
ADM1032
SPECIFICATIONS
Table 1.
Parameter
POWER SUPPLY
Supply Voltage, VDD
Average Operating Supply Current, ICC
Undervoltage Lockout Threshold
Power-On Reset Threshold
TEMPERATURE-TO-DIGITAL CONVERTER
Local Sensor Accuracy
Resolution
Remote Diode Sensor Accuracy
Min
Typ
Max
Unit
Test Conditions/Comments
3.0
3.30
170
5.5
2.55
5.5
215
10
2.8
2.4
V
μA
μA
V
V
0.0625 conversions/sec rate 1
Standby mode
VDD input, disables ADC, rising edge
±1
1
±3
2.35
1
35.7
142.8
°C
°C
°C
°C
°C
μA
μA
ms
5.7
22.8
ms
0.4
1
V
μA
IOUT = −6.0 mA2
VOUT = VDD2
V
VDD = 3 V to 5.5 V
V
mV
VDD = 3 V to 5.5 V
mA
mA
μA
pF
kHz
ms
μs
μs
ns
ns
ns
ns
ns
μs
ns
ns
SDATA forced to 0.6 V
ALERT forced to 0.4 V
±1
±3
Resolution
Remote Sensor Source Current
Conversion Time
OPEN-DRAIN DIGITAL OUTPUTS (THERM, ALERT)
Output Low Voltage, VOL
High Level Output Leakage Current, IOH
SERIAL BUS TIMING2
Logic Input High Voltage, VIH
SCLK, SDATA
Logic Input Low Voltage, VIL
Hysteresis
SCLK, SDATA
SDATA Output Low Sink Current
ALERT Output Low Sink Current
Logic Input Current, IIH, IIL
Input Capacitance, SCLK, SDATA
Clock Frequency
SMBus Timeout 3
SCLK Clock Low Time, tLOW
SCLK Clock High Time, tHIGH
Start Condition Setup Time, tSU:STA
Start Condition Hold Time, tHD:STA
Stop Condition Setup Time, tSU:STO
Data Valid to SCLK Rising Edge Time, tSU:DAT
Data Hold Time, tHD:DAT
Bus Free Time, tBUF
SCLK, SDATA Rise Time, tR
SCLK, SDATA Fall Time, tF
0.125
230
13
0.1
2.1
0.8
500
6
1
−1
+1
5
25
400
64
1.3
0.6
600
600
600
100
300
1.3
300
300
1
0 ≤ TA ≤ 100°C, VCC = 3 V to 3.6 V
60°C ≤ TD ≤ 100°C, VCC = 3 V to 3.6 V
0°C ≤ TD ≤ 120°C
High level 2
Low level2
From stop bit to conversion complete
Both channels: one-shot mode with averaging switched on
One-shot mode with averaging off (that is, conversion
rate = 32 or 64 conversions per second)
tLOW between 10% points
tHIGH between 90% points
Time from 10% of SDATA to 90% of SCLK
Time from 90% of SCLK to 10% of SDATA
Time for 10% or 90% of SDATA to 10% of SCLK
Between start/stop condition
See Table 9 for information on other conversion rates.
Guaranteed by design, not production tested.
3
The SMBus timeout is a programmable feature. By default, it is not enabled. Details on how to enable it are available in the Serial Bus Interface section.
2
Rev. E | Page 3 of 20
ADM1032
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Positive Supply Voltage (VDD) to GND
D+
D− to GND
SCLK, SDATA, ALERT
THERM
Input Current, SDATA, THERM
Input Current, D−
ESD Rating, All Pins (Human Body Model)
Maximum Junction Temperature (TJ Max)
Storage Temperature Range
IR Reflow Peak Temperature
IR Reflow Peak Temperature for Pb-Free
Lead Temperature (Soldering 10 sec)
tLOW
Rating
−0.3 V, +5.5 V
−0.3 V to VDD + 0.3 V
−0.3 V to +0.6 V
−0.3 V to +5.5 V
−0.3 V to VDD + 0.3 V
−1 mA, +50 mA
±1 mA
>1000 V
150°C
−65°C to +150°C
220°C
260°C
300°C
tR
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISITICS
8-Lead SOIC Package:
θJA = 121°C
8-Lead MSOP Package:
θJA = 142°C
tF
tHD:STA
SCLK
tHD:STA
tHD:DAT
tHIGH
tSU:STA
tSU:DAT
tSU:STO
tBUF
P
S
S
Figure 2. Diagram for Serial Bus Timing
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. E | Page 4 of 20
P
01906-002
SDATA
ADM1032
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
8 SCLK
D+ 2
ADM1032
7
SDATA
TOP VIEW 6 ALERT
(Not to Scale)
5 GND
THERM 4
D– 3
01906-003
VDD 1
Figure 3. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
1
2
3
4
Mnemonic
VDD
D+
D−
THERM
5
6
7
8
GND
ALERT
SDATA
SCLK
Description
Positive Supply, 3 V to 5.5 V.
Positive Connection to Remote Temperature Sensor.
Negative Connection to Remote Temperature Sensor.
THERM is an open-drain output that can be used to turn a fan on/off or throttle a CPU clock in the event of an
overtemperature condition. Requires pull-up to VDD, the same supply as the ADM1032
Supply Ground Connection.
Open-Drain Logic Output Used as Interrupt or SMBus Alert.
Logic Input/Output, SMBus Serial Data. Open-drain output. Requires pull-up resistor.
Logic Input, SMBus Serial Clock. Requires pull-up resistor.
Rev. E | Page 5 of 20
ADM1032
TYPICAL PERFORMANCE CHARACTERISTICS
12
20
16
10
TEMPERATURE ERROR (°C)
8
4
D+ TO GND
0
–4
D+ TO VDD
–8
VIN = 250mV p-p
8
6
4
VIN = 100mV p-p
2
01906-004
–12
–16
0
10
LEAKAGE RESISTANCE (MΩ)
0
100
01906-007
TEMPERATURE ERROR (°C)
12
10
1M
FREQUENCY (Hz)
Figure 7. Temperature Error vs. Power Supply Noise Frequency
Figure 4. Temperature Error vs. Leakage Resistance
18
1.0
0
–0.5
0
20
40
60
80
100
14
12
10
8
6
4
01906-008
TEMPERATURE ERROR (°C)
0.5
01906-005
TEMPERATURE ERROR (°C)
16
2
0
120
1
6
11
TEMPERATURE (°C)
Figure 5. Temperature Error vs. Actual Temperature Using 2N3906
16
21
CAPACITANCE (nF)
26
31
36
Figure 8. Temperature Error vs. Capacitance Between D+ and D−
13
2.0
7
5
VIN = 40mV p-p
3
1
VIN = 10mV p-p
–1
100k
1M
10M
FREQUENCY (Hz)
100M
Figure 6. Temperature Error vs. Differential Mode Noise Frequency
1.5
1.0
VDD = 5V
0.5
VDD = 3V
0
0.01
0.1
1
CONVERSION RATE (Hz)
10
Figure 9. Operating Supply Current vs. Conversion Rate
Rev. E | Page 6 of 20
01906-009
SUPPLY CURRENT (μA)
9
01906-006
TEMPERATURE ERROR (°C)
11
100
ADM1032
12
40
35
VIN = 100mV p-p
8
6
4
VIN = 50mV p-p
01906-010
2
VIN = 25mV p-p
0
100k
1M
10M
FREQUENCY (Hz)
100M
Figure 10. Temperature Error vs. Common-Mode Noise Frequency
60
50
VDD = 5V
40
30
20
0
1
5
10
25
50
75
100 250
SCLK FREQUENCY (kHz)
500
750
01906-011
SUPPLY CURRENT (μA)
70
VDD = 3.3V
25
20
15
10
5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
SUPPLY VOLTAGE (V)
4.0
Figure 12. Standby Supply Current vs. Supply Voltage
80
10
30
01906-012
STANDBY SUPPLY CURRENT (μA)
TEMPERATURE ERROR (°C)
10
1000
Figure 11. Standby Supply Current vs. Clock Frequency
Rev. E | Page 7 of 20
4.5
5.0
ADM1032
FUNCTIONAL DESCRIPTION
This is given by
The ADM1032 is a local and remote temperature sensor and
overtemperature alarm. When the ADM1032 is operating
normally, the on-board A/D converter operates in a free
running mode. The analog input multiplexer alternately selects
either the on-chip temperature sensor to measure its local
temperature or the remote temperature sensor. These signals are
digitized by the ADC, and the results are stored in the local and
remote temperature value registers.
ΔVBE = (n f )
where:
K is Boltzmann’s constant (1.38 × 10–23).
q is the charge on the electron (1.6 × 10–19 Coulombs).
T is the absolute temperature in Kelvins.
The measurement results are compared with local and remote,
high, low, and THERM temperature limits stored in nine onchip registers. Out-of-limit comparisons generate flags that are
stored in the status register, and one or more out-of-limit results
cause the ALERT output to pull low. Exceeding THERM
temperature limits causes the THERM output to assert low.
N is the ratio of the two currents.
nf is the ideality factor of the thermal diode.
The ADM1032 is trimmed for an ideality factor of 1.008.
Figure 13 shows the input signal conditioning used to measure
the output of an external temperature sensor. Figure 13 shows
the external sensor as a substrate transistor, provided for
temperature monitoring on some microprocessors, but it could
equally well be a discrete transistor. If a discrete transistor is
used, the collector is not grounded and should be linked to the
base. To prevent ground noise interfering with the measurement,
the more negative terminal of the sensor is not referenced to
ground but is biased above ground by an internal diode at the
D− input. If the sensor is operating in a noisy environment, C1
can optionally be added as a noise filter. Its value should be no
more than 1000 pF. See the Layout Considerations section for
more information on C1.
The limit registers can be programmed, and the device
controlled and configured, via the serial SMBus. The contents
of any register can also be read back via the SMBus.
Control and configuration functions consist of:
•
Switching the device between normal operation and
standby mode.
•
Masking or enabling the ALERT output.
•
Selecting the conversion rate.
KT
× In(N )
q
MEASUREMENT METHOD
To measure ΔVBE, the sensor is switched between the operating
currents of I and N × I. The resulting waveform is passed
through a 65 kHz low-pass filter to remove noise, and then to a
chopper-stabilized amplifier that performs the functions of
amplification and rectification of the waveform to produce a dc
voltage proportional to ΔVBE. This voltage is measured by the
ADC to give a temperature output in twos complement format.
To further reduce the effects of noise, digital filtering is
performed by averaging the results of 16 measurement cycles.
A simple method of measuring temperature is to exploit the
negative temperature coefficient of a diode, or the base-emitter
voltage of a transistor, operated at constant current. Unfortunately,
this technique requires calibration to null out the effect of the
absolute value of VBE, which varies from device to device.
The technique used in the ADM1032 is to measure the change
in VBE when the device is operated at two different currents.
Signal conditioning and measurement of the internal
temperature sensor is performed in a similar manner.
VDD
N×I
IBIAS
D+
REMOTE
SENSING
TRANSISTOR
VOUT+
C11
D–
TO ADC
BIAS
DIODE
LOW-PASS FILTER
fC = 65kHz
VOUT–
1CAPACITOR C1 IS OPTIONAL AND IT SHOULD ONLY BE USED IN VERY NOISY ENVIRONMENTS.
C1 = 1000pF MAX.
Figure 13. Input Signal Conditioning
Rev. E | Page 8 of 20
01906-013
I
ADM1032
TEMPERATURE DATA FORMAT
Value Registers
One LSB of the ADC corresponds to 0.125°C, so the ADC can
measure from 0°C to 127.875°C. The temperature data format is
shown in Table 4 and Table 5.
The ADM1032 has three registers to store the results of local
and remote temperature measurements. These registers are
written to by the ADC only and can be read over the SMBus.
The results of the local and remote temperature measurements
are stored in the local and remote temperature value registers
and are compared with limits programmed into the local and
remote high and low limit registers.
Table 4. Temperature Data Format (Local Temperature and
Remote Temperature High Byte
Temperature
0°C
1°C
10°C
25°C
50°C
75°C
100°C
125°C
127°C
Digital Output
0 000 0000
0 000 0001
0 000 1010
0 001 1001
0 011 0010
0 100 1011
0 110 0100
0 111 1101
0 111 1111
Series resistance on the D+ and D− lines in processor packages
and clock noise can introduce offset errors into the remote
temperature measurement. To achieve the specified accuracy on
this channel, these offsets must be removed.
The offset value is stored as an 11-bit, twos complement value
in Register 11h (high byte) and Register 12h (low byte, left
justified). The value of the offset is negative if the MSB of
Register 11h is 1 and positive if the MSB of Register 12h is 0.
The value is added to the measured value of the remote
temperature.
The offset register powers up with a default value of 0°C and has
no effect if nothing is written to them.
Table 6. Sample Offset Register Codes
Offset Value
−4°C
−1°C
−0.125°C
0°C
+0.125°C
+1°C
+4°C
Table 5. Extended Temperature Resolution (Remote
Temperature Low Byte
Extended Resolution
0.000°C
0.125°C
0.250°C
0.375°C
0.500°C
0.625°C
0.750°C
0.875°C
Offset Register
Remote Temperature Low Byte
0 000 0000
0 010 0000
0 100 0000
0 110 0000
1 000 0000
1 010 0000
1 100 0000
1 110 0000
11h
1 111 1100
1 111 1111
1 111 1111
0 000 0000
0 000 0000
0 000 0001
0 000 0100
12h
0 000 0000
0 000 0000
1 110 0000
0 000 0000
0 010 0000
0 000 0000
0 000 0000
Status Register
Bit 7 of the status register indicates that the ADC is busy
converting when it is high. Bit 6 to Bit 3, Bit 1, and Bit 0 are
flags that indicate the results of the limit comparisons. Bit 2 is
set when the remote sensor is open circuit.
ADM1032 REGISTERS
The ADM1032 contains registers that are used to store the
results of remote and local temperature measurements and high
and low temperature limits and to configure and control the
device. A description of these registers follows, and further
details are given in Table 6 to Table 10.
Address Pointer Register
The address pointer register itself does not have, or require, an
address because it is the register the first data byte of every write
operation is written to automatically. This data byte is an
address pointer that sets up one of the other registers for the
second byte of the write operation or for a subsequent read
operation.
The power-on default value of the address pointer register is
00h. Therefore, if a read operation is performed immediately
after power-on without first writing to the address pointer, the
value of the local temperature is returned because its register
address is 00h.
If the local and/or remote temperature measurement is above
the corresponding high temperature limit, or below or equal to
the corresponding low temperature limit, one or more of these
flags is set. These five flags (Bit 6 to Bit 2) are NOR’ed together,
so that if any of them are high, the ALERT interrupt latch is set
and the ALERT output goes low. Reading the status register
clears the five flag bits, provided that the error conditions that
caused the flags to be set have gone away. While a limit
comparator is tripped due to a value register containing an outof-limit measurement, or the sensor is open circuit, the
corresponding flag bit cannot be reset. A flag bit can only be
reset if the corresponding value register contains an in-limit
measurement or the sensor is good.
The ALERT interrupt latch is not reset by reading the status
register but is reset when the ALERT output is serviced by the
master reading the device address, provided the error condition
has gone away and the status register flag bits are reset.
Rev. E | Page 9 of 20
ADM1032
When Flag 1 and Flag 0 are set, the THERM output goes low to
indicate that the temperature measurements are outside the
programmed limits. THERM output does not need to be reset,
unlike the ALERT output. Once the measurements are within
the limits, the corresponding status register bits are reset and
the THERM output goes high.
Table 7. Status Register Bit Assignments
Bit
7
6
5
4
3
2
1
0
1
Name
BUSY
LHIGH1
LLOW1
RHIGH1
RLOW1
OPEN1
RTHRM
LTHRM1
Function
1 When ADC Converting
1 When Local High Temp Limit Tripped
1 When Local Low Temp Limit Tripped
1 When Remote High Temp Limit Tripped
1 When Remote Low Temp Limit Tripped
1 When Remote Sensor Open-Circuit
1 When Remote THERM Limit Tripped
1 When Local THERM Limit Tripped
Configuration Register
Two bits of the configuration register are used. If Bit 6 is 0,
which is the power-on default, the device is in operating mode
with the ADC converting. If Bit 6 is set to 1, the device is in
standby mode and the ADC does not convert. The SMBus does,
however, remain active in standby mode so values can be read
from or written to the SMBus. The ALERT and THERM O/Ps
are also active in standby mode.
Bit 7 of the configuration register is used to mask the alert
output. If Bit 7 is 0, which is the power-on default, the output is
enabled. If Bit 7 is set to 1, the output is disabled.
6
RUN/STOP
5 to 0
Function
0 = ALERT Enabled
1 = ALERT Masked
0 = Run
1 = Standby
Reserved
Conversion/Sec
0.0625
0.125
0.25
0.5
1
2
4
8
16
32
64
Reserved
Average Supply Current
mA Typ at VDD = 5.5 V
0.17
0.20
0.21
0.24
0.29
0.40
0.61
1.1
1.9
0.73
1.23
The ADM1032 has nine limit registers to store local and
remote, high, low, and THERM temperature limits. These
registers can be written to and read back over the SMBus.
The high limit registers perform a > comparison, while the low
limit registers perform a < or = to comparison. For example, if
the high limit register is programmed with 80°C, measuring
81°C results in an alarm condition. If the low limit register is
programmed with 0°C, measuring 0°C or lower results in an
alarm condition. Exceeding either the local or remote THERM
limit asserts THERM low. A default hysteresis value of 10°C is
provided, which applies to both channels. This hysteresis can be
reprogrammed to any value after power up (Reg 0x21h).
One-Shot Register
Table 8. Configuration Register Bit Assignments
Name
MASK1
Data
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0B to FFh
Limit Registers
These flags stay high until the status register is read, or they are reset by POR.
Bit
7
Table 9. Conversion Rate Register Codes
Power-On Default
0
0
0
Conversion Rate Register
The lowest four bits of this register are used to program the
conversion rate by dividing the internal oscillator clock by 1, 2,
4, 8, 16, 32, 64, 128, 256, 512, or 1024 to give conversion times
from 15.5 ms (Code 0Ah) to 16 seconds (Code 00h). This
register can be written to and read back over the SMBus. The
higher four bits of this register are unused and must be set to 0.
Use of slower conversion times greatly reduces the device power
consumption, as shown in Table 9.
The one-shot register is used to initiate a single conversion and
comparison cycle when the ADM1032 is in standby mode, after
which the device returns to standby. This is not a data register
as such, and it is the write operation that causes the one-shot
conversion. The data written to this address is irrelevant and is
not stored. The conversion time on a single shot is 96 ms when
the conversion rate is 16 conversions per second or less. At 32
conversions per second, the conversion time is 15.3 ms. This is
because averaging is disabled at the faster conversion rates (32
and 64 conversions per second).
Consecutive ALERT Register
This value written to this register determines how many out-of
limit measurements must occur before an ALERT is generated.
The default value is that one out-of-limit measurement generates
an ALERT. The maximum value that can be chosen is four.
The purpose of this register is to allow the user to perform
some filtering of the output. This is particularly useful at the
faster two conversion rates where no averaging takes place.
Rev. E | Page 10 of 20
ADM1032
Table 10. Consecutive ALERT Register Codes
Register Value
yxxx 000x
yxxx 001x
yxxx 011x
yxxx 111x
SERIAL BUS INTERFACE
Number of Out-of-Limit
Measurements Required
1
2
3
4
Control of the ADM1032 is carried out via the serial bus. The
ADM1032 is connected to this bus as a slave device, under the
control of a master device.
There is a programmable SMBus timeout. When this is enabled,
the SMBus times out after typically 25 ms of no activity. However,
this feature is not enabled by default. To enable it, set Bit 7 of
the consecutive alert register (Address = 22h).
Note that x = don’t care bits, and y = SMBus timeout bit.
Default = 0. See SMBus section for more information.
Table 11. List of ADM1032 Registers
Read Address (Hex)
Not Applicable
00
01
02
03
04
05
06
07
08
Not Applicable
10
11
12
13
14
19
Write Address (Hex)
Not Applicable
Not Applicable
Not Applicable
Not Applicable
09
0A
0B
0C
0D
0E
0F
Not Applicable
11
12
13
14
19
Name
Address Pointer
Local Temperature Value
External Temperature Value High Byte
Status
Configuration
Conversion Rate
Local Temperature High Limit
Local Temperature Low Limit
External Temperature High Limit High Byte
External Temperature Low Limit High Byte
One-Shot
External Temperature Value Low Byte
External Temperature Offset High Byte
External Temperature Offset Low Byte
External Temperature High Limit Low Byte
External Temperature Low Limit Low Byte
External THERM Limit
20
21
22
FE
FF
20
21
22
Not Applicable
Not Applicable
Local THERM Limit
THERM Hysteresis
Consecutive ALERT
Manufacturer ID
Die Revision Code
Power-On Default
Undefined
0000 0000 (00h)
0000 0000 (00h)
Undefined
0000 0000 (00h)
0000 1000 (08h)
0101 0101 (55h) (85°C)
0000 0000 (00h) (0°C)
0101 0101 (55h) (85°C)
0000 0000 (00h) (0°C)
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0101 0101 (55h) (85°C) (ADM1032)
0110 1100 (6Ch) (108°C) (ADM1032-1)
0101 0101 (55h) (85°C)
0000 1010 (0Ah) (10°C)
0000 0001 (01h)
0100 0001 (41h)
Undefined
Writing to Address 0F causes the ADM1032 to perform a single measurement. It is not a data register as such and it does not matter what data is written to it.
Rev. E | Page 11 of 20
ADM1032
ADDRESSING THE DEVICE
In general, every SMBus device has a 7-bit device address
(except for some devices that have extended, 10-bit addresses).
When the master device sends a device address over the bus,
the slave device with that address responds. The ADM1032 and
the ADM1032-1 are available with one SMBUS address, which
is Hex 4C (1001 100). The ADM1032-2 is also available with one
SMBUS address; however, that address is Hex 4D (1001 101).
The serial bus protocol operates as follows:
1. The master initiates data transfer by establishing a START
condition, defined as a high-to-low transition on the serial
data line SDATA, while the serial clock line SCLK remains
high. This indicates that an address/data stream follows. All
slave peripherals connected to the serial bus respond to the
START condition and shift in the next eight bits, consisting
of a 7-bit address (MSB first) plus an R/W bit, which
determines the direction of the data transfer, that is, whether
data is written to or read from the slave device.
The peripheral whose address corresponds to the transmitted
address responds by pulling the data line low during the low
period before the ninth clock pulse, known as the acknowledge
bit. All other devices on the bus now remain idle while the
selected device waits for data to be read from or written to it.
If the R/W bit is a 0, the master writes to the slave device. If
the R/W bit is a 1, the master reads from the slave device.
2. Data is sent over the serial bus in sequences of nine clock
pulses, eight bits of data followed by an acknowledge bit from
the slave device. Transitions on the data line must occur
during the low period of the clock signal and remain stable
during the high period, since a low-to-high transition when
the clock is high can be interpreted as a STOP signal. The
number of data bytes that can be transmitted over the serial
bus in a single read or write operation is limited only by what
the master and slave devices can handle.
3. When all data bytes are read or written, stop conditions are
established. In write mode, the master pulls the data line high
during the 10th clock pulse to assert a STOP condition. In
read mode, the master device overrides the acknowledge bit
by pulling the data line high during the low period before the
ninth clock pulse. This is known as no acknowledge. The
master then takes the data line low during the low period
before the 10th clock pulse, and high during the 10th clock
pulse to assert a STOP condition.
Any number of bytes of data can be transferred over the serial
bus in one operation, but it is not possible to mix read and write
in one operation because the type of operation is determined at
the beginning and cannot subsequently be changed without
starting a new operation.
In the case of the ADM1032, write operations contain either
one or two bytes, while read operations contain one byte and
perform the following functions.
To write data to one of the device data registers or read data
from it, the address pointer register must first be set so that the
correct data register is addressed. The first byte of a write
operation always contains a valid address that is stored in the
address pointer register. If data is written to the device, the write
operation contains a second data byte that is written to the
register selected by the address pointer register.
This is illustrated in Figure 14. The device address is sent over
the bus followed by R/W set to 0. This is followed by two data
bytes. The first data byte is the address of the internal data
register to be written to, which is stored in the address pointer
register. The second data byte is the data to be written to the
internal data register.
When reading data from a register, there are two possibilities:
• If the address pointer register value is unknown or not the
desired value, it is first necessary to set it to the correct value
before data can be read from the desired data register. This is
done by performing a write to the ADM1032 as before, but
only the data byte containing the register read address is sent
because data is not to be written to the register. This is shown
in Figure 15.
A read operation is then performed consisting of the serial
bus address, R/W bit set to 1, followed by the data byte read
from the data register. This is shown in Figure 16.
• If the address pointer register is known to be at the desired
address already, data can be read from the corresponding
data register without first writing to the address pointer
register and Figure 15 can be omitted.
Notes
Although it is possible to read a data byte from a data register
without first writing to the address pointer register, if the
address pointer register is already at the correct value, it is not
possible to write data to a register without writing to the
address pointer register. The first data byte of a write is always
written to the address pointer register.
Don’t forget that some of the ADM1032 registers have different
addresses for read and write operations. The write address of a
register must be written to the address pointer if data is to be
written to that register, but it is not possible to read data from
that address. The read address of a register must be written to
the address pointer before data can be read from that register.
Rev. E | Page 12 of 20
ADM1032
1
9
1
9
SCLK
A6
SDATA
A5
A4
A3
A2
A1
A0
R/W
D6
D7
D5
D4
D3
D2
D1
D0
ACK. BY
ADM1032
START BY
MASTER
ACK. BY
ADM1032
FRAME 2
ADDRESS POINTER REGISTER BYTE
FRAME 1
SERIAL BUS ADDRESS BYTE
1
9
SCLK (CONTINUED)
D6
D5
D4
D2
D3
D1
D0
ACK. BY
ADM1032
STOP BY
MASTER
FRAME 3
DATA BYTE
01906-014
D7
SDATA (CONTINUED)
Figure 14. Writing a Register Address to the Address Pointer Register, then Writing Data to the Selected Register
1
9
1
9
SCLK
A6
A5
A4
A3
A2
A1
A0
R/W
D7
D6
D5
D4
D3
D2
D1
ACK. BY
ADM1032
D0
ACK. BY
ADM1032
FRAME 1
SERIAL BUS ADDRESS BYTE
STOP BY
MASTER
FRAME 2
ADDRESS POINTER REGISTER BYTE
01906-015
SDATA
START BY
MASTER
Figure 15. Writing to the Address Pointer Register Only
19
1
9
SCLK
A6
A5
A4
A3
A2
A1
A0
R/W
D7
D6
D5
D4
D3
D2
D1
ACK. BY
ADM1032
START BY
MASTER
FRAME 1
SERIAL BUS ADDRESS BYTE
ACK. BY
ADM1032
FRAME 2
DATA BYTE FROM ADM1032
Figure 16. Reading Data from a Previously Selected Register
Rev. E | Page 13 of 20
D0
STOP BY
MASTER
01906-016
SDATA
ADM1032
ALERT OUTPUT
LOW POWER STANDBY MODE
The ALERT output goes low whenever an out-of-limit
measurement is detected, or if the remote temperature sensor is
open-circuit. It is an open drain and requires a pull-up to VDD.
Several ALERT outputs can be wire-OR’ed together so that the
common line goes low if one or more of the ALERT outputs
goes low.
The ADM1032 can be put into a low power standby mode by
setting Bit 6 of the configuration register. When Bit 6 is low, the
ADM1032 operates normally. When Bit 6 is high, the ADC is
inhibited and any conversion in progress is terminated without
writing the result to the corresponding value register.
The ALERT output can be used as an interrupt signal to a
processor, or it can be used as an SMBALERT. Slave devices on
the SMBus can not normally signal to the master that they want
to talk, but the SMBALERT function allows them to do so.
One or more ALERT outputs can be connected to a common
SMBALERT line connected to the master. When the
SMBALERT line is pulled low by one of the devices, the
following procedure occurs (see Figure 17).
MASTER
RECEIVES
SMBALERT
When the device is in standby mode, it is still possible to initiate
a one-shot conversion of both channels by writing XXh to the
one-shot register (Address 0Fh), after which the device returns
to standby. It is also possible to write new values to the limit
register while it is in standby. If the values stored in the
temperature value registers are now outside the new limits, an
ALERT is generated even though the ADM1032 is still in
standby.
THE ADM1032 INTERRUPT SYSTEM
ALERT RESPONSE ADDRESS
MASTER SENDS
ARA AND READ
COMMAND
RD
ACK
DEVICE ADDRESS
NO
ACK
STOP
01906-017
START
The SMBus is still enabled. Power consumption in the standby
mode is reduced to less than 10 μA if there is no SMBus activity,
or 100 μA if there are clock and data signals on the bus.
DEVICE SENDS
ITS ADDRESS
Figure 17. Use of SMBALERT
1. SMBALERT is pulled low.
2. Master initiates a read operation and sends the alert response
address (ARA = 0001 100). This is a general call address that
must not be used as a specific device address.
3. The device whose ALERT output is low responds to the alert
response address and the master reads its device address.
Since the device address is seven bits, an LSB of 1 is added.
The address of the device is now known, and it can be
interrogated in the usual way.
4. If more than one device’s ALERT output is low, the one with
the lowest device address has priority in accordance with
normal SMBus arbitration.
5. Once the ADM1032 has responded to the alert response
address, it resets its ALERT output, provided that the error
condition that caused the ALERT no longer exists. If the
SMBALERT line remains low, the master sends ARA again,
and so on until all devices whose ALERT outputs were low
have responded.
The ADM1032 has two interrupt outputs, ALERT and THERM.
These have different functions. ALERT responds to violations of
software-programmed temperature limits and is maskable.
THERM is intended as a fail-safe interrupt output that cannot
be masked.
If the temperature goes equal to or below the lower temperature
limit, the ALERT pin is asserted low to indicate an out-of-limit
condition. If the temperature is within the programmed low
and high temperature limits, no interrupt is generated.
If the temperature exceeds the high temperature limit, the
ALERT pin is asserted low to indicate an overtemperature
condition. A local and remote THERM limit can be
programmed into the device to set the temperature limit above
which the overtemperature THERM pin is asserted low. This
temperature limit should be equal to or greater than the high
temperature limit programmed.
The behavior of the high limit and THERM limit is as follows:
1. If either temperature measured exceeds the high temperature
limit, the ALERT output is asserted low.
2. If the local or remote temperature continues to increase and
either one exceeds the THERM limit, the THERM output
asserts low. This can be used to throttle the CPU clock or
switch on a fan.
A THERM hysteresis value is provided to prevent a cooling
fan cycling on and off. The power-on default value is 10°C, but
this can be reprogrammed to any value after power-up. This
hysteresis value applies to both the local and remote channels.
Rev. E | Page 14 of 20
ADM1032
Using these two limits in this way, allows the user to gain
maximum performance from the system by only slowing it
down should it be at a critical temperature.
SENSOR FAULT DETECTION
The THERM signal is open drain and requires a pull-up to VDD.
The THERM signal must always be pulled up to the same power
supply as the ADM1032, unlike the SMBus signals (SDATA,
SCLK, and ALERT) that can be pulled to a different power rail,
usually that of the SMBus controller.
100°C
90°C
80°C
LOCAL THERM
LIMIT
70°C
60°C
LOCAL THERM LIMIT
–HYSTERESIS
TEMPERATURE
50°C
THERM
Figure 18. Operation of the THERM Output
Table 12. THERM Hysteresis Sample Values
THERM Hysteresis
Binary Representation
0°C
1°C
10°C
0 000 0000
0 000 0001
0 000 1010
01906-018
40°C
At the D+ input, the ADM1032 has a fault detector that detects
if the external sensor diode is open circuit. This is a simple
voltage comparator that trips if the voltage at D+ exceeds
VDD − 1 V (typical). The output of this comparator is checked
when a conversion is initiated and sets Bit 2 of the status
register if a fault is detected.
If the remote sensor voltage falls below the normal measuring
range, for example, due to the diode being short-circuited, the
ADC outputs −128 (1000 0000). Since the normal operating
temperature range of the device only extends down to 0°C, this
output code should never be seen in normal operation, so it can
be interpreted as a fault condition. Since it is outside the poweron default low temperature limit (0°C) and any low limit that
would normally be programmed, a short-circuit sensor causes
an SMBus alert.
In this respect, the ADM1032 differs from and improves upon
competitive devices that output zero if the external sensor goes
short-circuit. These devices can misinterpret a genuine 0°C
measurement as a fault condition.
When the D+ and D− lines are shorted together, an ALERT is
always generated. This is because the remote value register
reports a temperature value of −128°C. Since the ADM1032
performs a less-than or equal-to comparison with the low limit,
an ALERT is generated even when the low limit is set to its
minimum of −128°C.
Rev. E | Page 15 of 20
ADM1032
APPLICATIONS INFORMATION—FACTORS AFFECTING ACCURACY
REMOTE SENSING DIODE
The ADM1032 is designed to work with substrate transistors
built into processors’ CPUs or with discrete transistors.
Substrate transistors are generally PNP types with the collector
connected to the substrate. Discrete types can be either a PNP
or an NPN transistor connected as a diode (base shorted to
collector). If an NPN transistor is used, the collector and base
are connected to D+ and the emitter to D−. If a PNP transistor
is used, the collector and base are connected to D− and the
emitter to D+. Substrate transistors are found in a number of
CPUs. To reduce the error due to variations in these substrate
and discrete transistors, a number of factors should be taken
into consideration:
1. The ideality factor, nf, of the transistor. The ideality factor is a
measure of the deviation of the thermal diode from the ideal
behavior. The ADM1032 is trimmed for an nf value of 1.008.
The following equation can be used to calculate the error
introduced at a temperature T°C when using a transistor
whose nf does not equal 1.008. Consult the processor data
sheet for nf values.
ΔT =
(nnatural − 1.008) × (273.15 Kelvin + T )
1.008
This value can be written to the offset register and is
automatically added to or subtracted from the temperature
measurement.
Transistors such as 2N3904, 2N3906, or equivalents in SOT-23
packages are suitable devices to use.
THERMAL INERTIA AND SELF-HEATING
Accuracy depends on the temperature of the remote-sensing
diode and/or the internal temperature sensor being at the same
temperature as that being measured, and a number of factors
can affect this. Ideally, the sensor should be in good thermal
contact with the part of the system being measured, for
example, the processor. If it is not, the thermal inertia caused by
the mass of the sensor causes a lag in the response of the sensor
to a temperature change. In the case of the remote sensor, this
should not be a problem, since it is either a substrate transistor
in the processor or a small package device, such as the SOT-23,
placed in close proximity to it.
The on-chip sensor, however, is often remote from the
processor and is only monitoring the general ambient
temperature around the package. The thermal time constant
of the SOIC-8 package in still air is about 140 seconds, and if
the ambient air temperature quickly changed by 100°, it would
take about 12 minutes (five time constants) for the junction
temperature of the ADM1032 to settle within 1° of this. In
practice, the ADM1032 package is in electrical and therefore
thermal contact with a printed circuit board and can also be in
a forced airflow. How accurately the temperature of the board
and/or the forced airflow reflect the temperature to be
measured also affects the accuracy.
2. Some CPU manufacturers specify the high and low current
levels of the substrate transistors. The high current level of
the ADM1032, IHIGH, is 230 μA and the low level current,
ILOW, is 13 μA. If the ADM1032 current levels do not match
the levels of the CPU manufacturers, then it can become
necessary to remove an offset. The CPU’s data sheet advises
whether this offset needs to be removed and how to calculate
it. This offset can be programmed to the offset register. It is
important to note that if accounting for two or more offsets is
needed, then the algebraic sum of these offsets must be
programmed to the offset register.
Self-heating due to the power dissipated in the ADM1032 or
the remote sensor causes the chip temperature of the device or
remote sensor to rise above ambient. However, the current
forced through the remote sensor is so small that self-heating
is negligible. In the case of the ADM1032, the worst-case
condition occurs when the device is converting at 16 conversions
per second while sinking the maximum current of 1 mA at the
ALERT and THERM output. In this case, the total power
dissipation in the device is about 11 mW. The thermal
resistance, θJA, of the SOIC-8 package is about 121°C/W.
If a discrete transistor is being used with the ADM1032, the
best accuracy is obtained by choosing devices according to the
following criteria:
In practice, the package has electrical and therefore thermal
connection to the printed circuit board, so the temperature rise
due to self-heating is negligible.
• Base-emitter voltage greater than 0.25 V at 6 mA, at the
highest operating temperature.
• Base-emitter voltage less than 0.95 V at 100 mA, at the lowest
operating temperature.
• Base resistance less than 100 Ω.
• Small variation in hFE (say 50 to 150) that indicates tight
control of VBE characteristics.
Rev. E | Page 16 of 20
ADM1032
LAYOUT CONSIDERATIONS
Digital boards can be electrically noisy environments, and the
ADM1032 is measuring very small voltages from the remote
sensor, so care must be taken to minimize noise induced at the
sensor inputs. The following precautions should be taken.
1. Place the ADM1032 as close as possible to the remote sensing
diode. Provided that the worst noise sources, that is, clock
generators, data/address buses, and CRTs, are avoided, this
distance can be four to eight inches.
2. Route the D+ and D− tracks close together, in parallel, with
grounded guard tracks on each side. Provide a ground plane
under the tracks if possible.
Because the measurement technique uses switched current
sources, excessive cable and/or filter capacitance can affect the
measurement. When using long cables, the filter capacitor can
be reduced or removed.
APPLICATION CIRCUIT
Figure 20 shows a typical application circuit for the ADM1032,
using a discrete sensor transistor connected via a shielded,
twisted pair cable. The pull-ups on SCLK, SDATA, and ALERT
are required only if they are not already provided elsewhere in
the system.
10MIL
10MIL
D+
7. For really long distances (up to 100 feet), use shielded twisted
pair, such as Belden #8451 microphone cable. Connect the
twisted pair to D+ and D− and the shield to GND close to the
ADM1032. Leave the remote end of the shield unconnected
to avoid ground loops.
Cable resistance can also introduce errors. 1 Ω series resistance
introduces about 1°C error.
3. Use wide tracks to minimize inductance and reduce noise
pickup. 10 mil track minimum width and spacing is
recommended.
GND
6. If the distance to the remote sensor is more than eight inches,
the use of twisted pair cable is recommended. This works up
to about six feet to 12 feet.
10MIL
10MIL
GND
10MIL
The SCLK and SDATA pins of the ADM1032 can be interfaced
directly to the SMBus of an I/O controller, such as the Intel 820
chipset.
0.1μF
VDD
3V TO 3.6V
ADM1032
Figure 19. Arrangement of Signal Tracks
D+
4. Try to minimize the number of copper/solder joints, which
can cause thermocouple effects. Where copper/solder joints
are used, make sure that they are in both the D+ and D− path
and at the same temperature.
D–
2N3906 SHIELD
OR
CPU THERMAL
DIODE
Thermocouple effects should not be a major problem since
1°C corresponds to about 200 μV and thermocouple voltages
are about 3 μV/°C of temperature difference. Unless there
are two thermocouples with a big temperature differential
between them, thermocouple voltages should be much less
than 200 μV.
5. Place a 0.1 μF bypass capacitor close to the VDD pin. In very
noisy environments, place a 1000 pF input filter capacitor
across D+ and D− close to the ADM1032.
Rev. E | Page 17 of 20
TYP 10kΩ
SCLK
SMBUS
CONTROLLER
SDATA
ALERT
VDD
THERM
5V OR 12V
TYP 10kΩ
GND
FAN
ENABLE
FAN
CONTROL
CIRCUIT
Figure 20. Typical Application Circuit
01906-020
10MIL
01906-019
10MIL
D–
ADM1032
OUTLINE DIMENSIONS
5.00 (0.1968)
4.80 (0.1890)
8
5
4.00 (0.1574)
3.80 (0.1497) 1
6.20 (0.2440)
4 5.80 (0.2284)
1.27 (0.0500)
BSC
0.50 (0.0196)
× 45°
0.25 (0.0099)
1.75 (0.0688)
1.35 (0.0532)
0.25 (0.0098)
0.10 (0.0040)
0.51 (0.0201)
COPLANARITY
SEATING 0.31 (0.0122)
0.10
PLANE
8°
0.25 (0.0098) 0° 1.27 (0.0500)
0.40 (0.0157)
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 21. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-8)
Dimensions shown in millimeters and (inches)
3.20
3.00
2.80
8
3.20
3.00
2.80
1
5
5.15
4.90
4.65
4
PIN 1
0.65 BSC
0.95
0.85
0.75
1.10 MAX
0.15
0.00
0.38
0.22
COPLANARITY
0.10
0.23
0.08
8°
0°
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 22. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
Rev. E | Page 18 of 20
0.80
0.60
0.40
ADM1032
ORDERING GUIDE
Model
ADM1032AR
ADM1032AR-REEL
ADM1032AR-REEL7
ADM1032ARZ 1
ADM1032ARZ-REEL1
ADM1032ARZ-REEL71
ADM1032AR-1
ADM1032AR-1REEL
ADM1032AR-1REEL7
ADM1032ARZ-11
ADM1032ARZ-1REEL1
ADM1032ARZ-1REEL71
ADM1032ARM
ADM1032ARM-REEL
ADM1032ARM-REEL7
ADM1032ARMZ1
ADM1032ARMZ-REEL1
ADM1032ARMZ-REEL71
ADM1032ARM-1
ADM1032ARM-1REEL
ADM1032ARM-1REEL7
ADM1032ARMZ-11
ADM1032ARMZ-1REEL1
ADM1032ARMZ-1REEL71
ADM1032ARMZ-21
ADM1032ARMZ-2REEL1
ADM1032ARMZ-2REEL71
1
Temperature
Range
0°C to 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
0°Cto 120°C
Package Description
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
Z = Pb-free part.
Rev. E | Page 19 of 20
Package
Option
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
Branding
T2A
T2A
T2A
T1J
T1J
T1J
T1A
T1A
T1A
T13
T13
T13
T1C
T1C
T1C
SMBus
Addr
4C
4C
4C
4C
4C
4C
4C
4C
4C
4C
4C
4C
4C
4C
4C
4C
4C
4C
4C
4C
4C
4C
4C
4C
4D
4D
4D
External THERM
Default
85°C
85°C
85°C
85°C
85°C
85°C
108°C
108°C
108°C
108°C
108°C
108°C
85°C
85°C
85°C
85°C
85°C
85°C
108°C
108°C
108°C
108°C
108°C
108°C
85°C
85°C
85°C
ADM1032
NOTES
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C01906-0-11/05(E)
Rev. E | Page 20 of 20
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