ADM239LAR

a FEATURES Single 5 V Power Supply Meets All EIA-232-E and V.28 Specifications 120 kB/s Data Rate On-Board DC-DC Converters 9 V Output Swing with +5 V Supply Small 1 F Capacitors Low Power Shutdown ≤1 A Receivers Active in Shutdown (ADM223) ESD > 2 kV 30 V Receiver Input Levels Latch-Up FREE Plug-In Upgrade for MAX223/230-241 Plug-In Upgrade for AD230–AD241 APPLICATIONS Computers Peripherals Modems Printers Instruments GENERAL DESCRIPTION +5 V Powered CMOS RS-232 Drivers/Receivers ADM223/ADM230L–ADM241L ADM232L TYPICAL OPERATING CIRCUIT +5V INPUT 1 C1+ 3 C1– +5V TO +10V VOLTAGE DOUBLER VCC 16 V+ 2 V– 6 1µF 6.3V 1µF 16V 1µF 6.3V 1µF 6.3V 4 C2+ +10V TO –10V VOLTAGE INVERTER 5 C2– 11 10 12 9 GND 15 T1 T2 R1 R2 1µF 16V T1OUT T2OUT R1IN R2IN TTL/CMOS INPUTS* T1IN T2IN 14 7 13 8 RS-232 OUTPUTS TTL/CMOS OUTPUTS R1OUT R2OUT RS-232 INPUTS** ADM232L *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT The ADM2xx family of line drivers/receivers is intended for all EIA-232-E and V.28 communications interfaces, especially in applications where ± 12 V is not available. The ADM223, ADM230L, ADM235L, ADM236L and ADM241L feature a low power shutdown mode that reduces power dissipation to less than 5 µW, making them ideally suited for battery powered equipment. Two receivers remain enabled during shutdown on the ADM223. The ADM233L and ADM235L do not require any external components and are particularly useful in applications where printed circuit board space is critical. All members of the ADM230L family, except the ADM231L and the ADM239L, include two internal charge pump voltage converters that allow operation from a single +5 V supply. These converters convert the +5 V input power to the ± 10 V required for RS-232 output levels. The ADM231L and ADM239L are designed to operate from +5 V and +12 V supplies. An internal +12 V to –12 V charge pump voltage converter generates the –12 V supply. The ADM2xxL is an enhanced upgrade for the AD2xx family featuring lower power consumption, faster slew rate and operation with smaller (1 µF) capacitors. Table I. Selection Table Part Number ADM223 ADM230L ADM231L ADM232L ADM233L ADM234L ADM235L ADM236L ADM237L ADM238L ADM239L ADM241L R EV. 0 Power Supply Voltage +5 V +5 V +5 V & +7.5 V to +13.2 V +5 V +5 V +5 V +5 V +5 V +5 V +5 V +5 V & +7.5 V to +13.2 V +5 V No. of RS-232 Drivers 4 5 2 2 2 4 5 4 5 4 3 4 No. of RS-232 Receivers 5 0 2 2 2 0 5 3 3 4 5 5 External Capacitors 4 4 2 4 None 4 None 4 4 4 2 4 Low Power Shutdown (SD) Yes (SD) Yes No No No No Yes Yes No No No Yes TTL Three-State EN Yes (EN) No No No No No Yes Yes No No Yes Yes No. of Pins 28 20 14 16 20 16 24 24 24 24 24 28 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 World Wide Web Site: http://www.analog.com Fax: 617/326-8703 © Analog Devices, Inc., 1997 VCC = +5 V 10% (ADM223, 31L, 32L, 34L, 36L, 38L, 39L, 41L); VCC = +5 V 5% (ADM230L, 33L, 35L, 37L); V+ = 7.5 V to 13.2 V (ADM231L & ADM239L); C1–C4 = 1.0 F Ceramic. All Specifications TMIN to TMAX unless otherwise noted.) ADM223/ADM230L–ADM241L–SPECIFICATIONS Min ±5 Typ ±9 2 3.5 0.4 1.5 1 10 –30 0.8 0.2 3 3.5 0.05 250 50 0.5 25 5 300 ± 10 30 1.2 1.7 0.5 5 Max Units Volts 3.0 mA 6 mA 1 mA 4 mA 5 µA 0.8 V V 25 µA +30 V V 2.4 V 1.0 V 7 kΩ 0.4 V V ±5 µA ns ns µs V/µs V/µs Ω mA Parameter Output Voltage Swing VCC Power Supply Current V+ Power Supply Current Shutdown Supply Current Input Logic Threshold Low, VINL Input Logic Threshold High, VINH Logic Pull-Up Current RS-232 Input Voltage Range RS-232 Input Threshold Low RS-232 Input Threshold High RS-232 Input Hysteresis RS-232 Input Resistance TTL/CMOS Output Voltage Low, VOL TTL/CMOS Output Voltage High, VOH TTL/CMOS Output Leakage Current Output Enable Time (TEN) Output Disable Time (TDIS) Propagation Delay Instantaneous Slew Rate1 Transition Region Slew Rate Output Resistance RS-232 Output Short Circuit Current NOTE 1 Sample tested to ensure compliance. Specifications subject to change without notice. Test Conditions/Comments All Transmitter Outputs Loaded with 3 kΩ to Ground No Load, All TINS = VCC (Except ADM223) No Load, All TINS = GND ADM231L, ADM239L No Load, V+ = 12 V ADM231L & ADM239L Only TIN, EN, SD, EN, SD TIN, EN, SD, EN, SD TIN = 0 V 2.0 IOUT = –1.0 mA EN = VCC, 0 V ≤ ROUT ≤ VCC ADM223, ADM235L, ADM236L, ADM239L, ADM241L (Figure 25. CL = 150 pF) ADM223, ADM235L, ADM236L, ADM239L, ADM241L (Figure 25. RL = 1 kΩ) RS-232 to TTL CL = 10 pF, RL = 3-7 kΩ, TA = +25°C RL = 3 kΩ, CL = 2500 pF Measured from +3 V to –3 V or –3 V to +3 V VCC = V+ = V– = 0 V, VOUT = ± 2 V ABSOLUTE MAXIMUM RATINGS* (TA = 25°C unless otherwise noted) VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VCC – 0.3 V) to +14 V V– . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –14 V Input Voltages TIN . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to (VCC + 0.3 V) RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 30 V Output Voltages TOUT . . . . . . . . . . . . . . . . . . (V+, + 0.3 V) to (V–, – 0.3 V) ROUT . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to (VCC + 0.3 V) Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Power Dissipation N-14 DIP (Derate 10 mW/°C above +70°C) . . . . . 800 mW N-16 DIP (Derate 10.5 mW/°C above +70°C) . . . 840 mW N-20 DIP (Derate 11 mW/°C above +70°C) . . . . . 890 mW N-24 DIP (Derate 13.5 mW/°C above +70°C) . . 1000 mW N-24A DIP (Derate 13.5 mW/°C above +70°C) . . 500 mW R-16 SOIC (Derate 9 mW/°C above +70°C) . . . . . 760 mW R-20 SOIC (Derate 9.5 mW/°C above +70°C) . . . 800 mW R-24 SOIC (Derate 12 mW/°C above +70°C) . . . . 850 mW R-28 SOIC (Derate 12.5 mW/°C above +70°C) . . 900 mW RS-28 SSOP (Derate 10 mW/°C above +70°C) . . . 900 mW Q-14 Cerdip (Derate 10 mW/°C above +70°C) . . . 720 mW Q-16 Cerdip (Derate 10 mW/°C above +70°C) . . . 800 mW Q-20 Cerdip (Derate 11.2 mW/°C above +70°C) . . . 890 mW Q-24 Cerdip (Derate 12.5 mW/°C above +70°C) . . 1000 mW D-24 Ceramic (Derate 20 mW/°C above +70°C) . . 1000 mW Thermal Impedance, θJA N-14 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140°C/W N-16 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135°C/W N-20 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125°C/W N-24 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W N-24A DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110°C/W R-16 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105°C/W R-20 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105°C/W R-24 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W R-28 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W RS-28 SSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100°C/W Q-14 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105°C/W Q-16 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100°C/W Q-20 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100°C/W Q-24 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C/W D-24 Ceramic . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50°C/W Operating Temperature Range Commercial (J Version) . . . . . . . . . . . . . . . . . . . 0 to +70°C Industrial (A Version) . . . . . . . . . . . . . . . . –40°C to +85°C Storage Temperature Range . . . . . . . . . . . –65°C to + 150°C Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . +300°C Vapour Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >2000 V *This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. –2– REV. 0 ADM223/ADM230L–ADM241L ORDERING GUIDE Model ADM223 ADM223AR ADM223ARS Temperature Range –40°C to +85°C –40°C to +85°C Package Option* R-28 RS-28 Model ADM230L ADM230LJN ADM230LJR ADM230LAN ADM230LAR ADM230LAQ ADM233L ADM233LJN ADM233LAN Temperature Range 0°C to +70°C 0°C to +70°C –40°C to +85°C –40°C to +85°C –40°C to +85°C 0°C to +70°C –40°C to +85°C Package Option* N-20 R-20 N-20 R-20 Q-20 N-20 N-20 Model ADM231L ADM231LJN ADM231LJR ADM231LAN ADM231LAR ADM231LAQ ADM234L ADM234LJN ADM234LJR ADM234LAN ADM234LAR ADM234LAQ ADM237L ADM237LJN ADM237LJR ADM237LAN ADM237LAR ADM237LAQ ADM241L ADM241LJR ADM241LAR ADM241LJRS ADM241LARS Temperature Range 0°C to +70°C 0°C to +70°C –40°C to +85°C –40°C to +85°C –40°C to +85°C 0°C to +70°C 0°C to +70°C –40°C to +85°C –40°C to +85°C –40°C to +85°C 0°C to +70°C 0°C to +70°C –40°C to +85°C –40°C to +85°C –40°C to +85°C 0°C to +70°C –40°C to +85°C 0°C to +70°C –40°C to +85°C Package Option* N-14 R-16 N-14 R-16 Q-14 N-16 R-16 N-16 R-16 Q-16 N-24 R-24 N-24 R-24 Q-24 R-28 R-28 RS-28 RS-28 ADM232L ADM232LJN ADM232LJR ADM232LAN ADM232LAR ADM232LAQ 0°C to +70°C 0°C to +70°C –40°C to +85°C –40°C to +85°C –40°C to +85°C N-16 R-16 N-16 R-16 Q-16 N-24A N-24A D-24 ADM235L ADM235LJN 0°C to +70°C ADM235LAN –40°C to +85°C ADM235LAQ –40°C to +85°C ADM236L ADM236LJN ADM236LJR ADM236LAN ADM236LAR ADM236LAQ ADM239L ADM239LJN ADM239LJR ADM239LAN ADM239LAR ADM239LAQ 0°C to +70°C 0°C to +70°C –40°C to +85°C –40°C to +85°C –40°C to +85°C 0°C to +70°C 0°C to +70°C –40°C to +85°C –40°C to +85°C –40°C to +85°C N-24 R-24 N-24 R-24 Q-24 N-24 R-24 N-24 R-24 Q-24 ADM238L ADM238LJN ADM238LJR ADM238LAN ADM238LAR ADM238LAQ 0°C to +70°C 0°C to +70°C –40°C to +85°C –40°C to +85°C –40°C to +85°C N-24 R-24 N-24 R-24 Q-24 *D = Ceramic DIP; N = Plastic DIP; Q = Cerdip; R = Small Outline IC (SOIC); RS = Small Shrink Outline Package (SSOP). CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADM223/ADM230L–ADM241L features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE REV. 0 –3– ADM223/ADM230L–ADM241L +5V INPUT T3OUT T1OUT T2OUT T2IN T1IN GND VCC C1+ V+ C1– 1 2 3 4 5 6 7 8 9 10 NC = NO CONNECT 20 T4OUT 19 T5IN 1µF 6.3V 8 C1+ +5V TO +10V VOLTAGE DOUBLER +10V TO –10V VOLTAGE INVERTER VCC 7 V+ 9 1µF 6.3V 1µF 18 NC 17 SD 10 C1– 11 C2+ 12 C2– 5 ADM230L TOP VIEW (Not to Scale) 16 15 14 13 12 11 T5OUT T4IN T3IN V– C2– C2+ TTL/CMOS INPUTS* 1µF 16V V– 13 1µF 16V T1IN T2IN T1 2 T1OUT T2OUT T3OUT T4OUT RS-232 OUTPUTS 4 T2 3 T3IN T4IN 14 T3 1 15 T4 20 Figure 1. ADM230L DIP/SOIC Pin Configuration T5IN NC 19 18 GND 6 T5 16 17 T5OUT SD ADM230L *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT DIP Figure 2. ADM230L Typical Operating Circuit C1+ C1– V– T2OUT R2IN R2OUT T2IN 1 2 3 14 V+ 13 VCC ADM231L 4 5 6 7 TOP VIEW (Not to Scale) 12 GND 11 10 9 8 T1OUT R1IN R1OUT T1IN 1µF 16V 2 C– 1 C+ 13 VCC +12V TO –12V VOLTAGE CONVERTER V+ 14 V– 3 +7.5V TO 13.2V 1µF 16V +5V INPUT 1µF SOIC T1IN 8 T1 11 C1+ C1– V– T2OUT R2IN R2OUT T2IN NC 1 2 3 4 5 6 7 8 NC = NO CONNECT 16 15 14 V+ VCC GND T1OUT TTL/CMOS INPUTS* T2IN 7 T2 4 T1OUT T2OUT R1IN RS-232 OUTPUTS R1OUT TTL/CMOS OUTPUTS R2OUT 9 R1 10 ADM231L TOP VIEW (Not to Scale) 13 RS-232 INPUTS** 6 GND 12 R2 5 R2IN 12 R1IN 11 10 9 R1OUT T1IN NC ADM231L *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 4. ADM231L Typical Operating Circuit (DIP Pinout) Figure 3. ADM231L DIP & SOIC Pin Configurations –4– REV. 0 ADM223/ADM230L–ADM241L +5V INPUT C1+ V+ C1– C2+ C2– V– T2OUT R2IN 1 2 3 4 5 6 7 8 16 VCC 15 14 GND T1OUT R1IN R1OUT T1IN T2IN R2OUT 1µF 6.3V 1 C1+ 3 C1– +5V TO +10V VOLTAGE DOUBLER VCC 16 V+ 2 1µF 6.3V 1µF 6.3V 1µF 16V 4 C2+ 5 C2– +10V TO –10V VOLTAGE INVERTER V– 6 1µF 16V ADM232L TOP VIEW (Not to Scale) 13 12 11 10 9 T1IN TTL/CMOS INPUTS* T2IN 11 T1 14 T1OUT T2OUT R1IN RS-232 OUTPUTS 10 T2 7 R1OUT TTL/CMOS OUTPUTS R2OUT 12 9 GND 15 R1 13 RS-232 INPUTS** R2 8 R2IN ADM232L Figure 5. ADM232L DIP/SOIC Pin Configuration *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 6. ADM232L Typical Operating Circuit +5V INPUT 7 VCC T2IN T1IN R1OUT R1IN T1OUT GND VCC C1+ GND C2– 1 2 3 4 5 6 7 8 9 10 20 19 18 17 R2OUT R2IN T2OUT V– C2– C2+ V+ C1– V– C2+ T1IN TTL/CMOS INPUTS* T2IN 2 T1 5 T1OUT T2OUT R1IN RS-232 OUTPUTS 1 T2 18 R1OUT TTL/CMOS OUTPUTS R2OUT DO NOT MAKE CONNECTIONS TO THESE PINS INTERNAL –10V POWER SUPPLY INTERNAL +10V POWER SUPPLY 3 20 8 C1+ 13 C1– 12 V– 17 V– 14 V+ R1 4 ADM233L TOP VIEW (Not to Scale) 16 15 14 13 12 11 RS-232 INPUTS** R2 19 R2IN C2+ 11 C2+ 15 C2– 10 C2– 16 GND 6 GND 9 ADM233L Figure 7. ADM233L DIP Pin Configuration *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 8. ADM233L Typical Operating Circuit REV. 0 –5– ADM223/ADM230L–ADM241L +5V INPUT 1µF 6.3V 7 C1+ 9 C1– 10 C2+ 11 C2– 4 3 +5V TO +10V VOLTAGE DOUBLER +10V TO –10V VOLTAGE INVERTER VCC V+ 6 8 1µF 6.3V 1µF T1OUT T2OUT T2IN T1IN GND VCC C1+ V+ 1 2 3 4 5 6 7 8 16 15 14 T3OUT T4OUT T4IN T3IN V– C2– C2+ C1– T4IN TTL/CMOS INPUTS* T2IN 1µF 16V V– 12 1µF 16V ADM234L TOP VIEW (Not to Scale) 13 12 11 10 9 T1IN T1 1 T1OUT T2OUT RS-232 OUTPUTS T3OUT T4OUT T2 T3 2 T3IN 13 16 15 14 GND 5 T4 ADM234L *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT Figure 9. ADM234L DIP/SOIC Pin Configuration Figure 10. ADM234L Typical Operating Circuit +5V INPUT 1µF 12 VCC T1IN 8 T1 T2 3 T1OUT T2OUT T3OUT T4OUT RS-232 OUTPUTS T4OUT T3OUT T1OUT T2OUT R2IN R2OUT T2IN T1IN R1OUT 1 2 3 4 5 6 7 8 9 24 23 22 R3IN R3OUT T5IN TTL/CMOS INPUTS* T2IN T3IN T4IN 7 4 2 1 15 16 T3 21 SD 20 EN T4 ADM235L TOP VIEW (Not to Scale) T5IN 22 9 T5 R1 19 10 T5OUT R1IN R2IN R3IN R4IN RS-232 INPUTS** 19 18 17 16 15 14 13 T5OUT R4IN R4OUT T4IN T3IN R5OUT R5IN TTL/CMOS OUTPUTS R1OUT R2OUT R3OUT R4OUT 6 R2 5 R1IN 10 GND 11 VCC 12 23 17 R3 R4 24 18 R5OUT 14 R5 13 21 R5IN EN 20 GND 11 ADM235L SD Figure 11. ADM235L DIP Pin Configuration *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 12. ADM235L Typical Operating Circuit –6– REV. 0 ADM223/ADM230L–ADM241L +5V INPUT 10 C1+ 12 C1– 13 C2+ 14 C2– 7 VCC 9 V+ 11 1µF 6.3V +5V TO +10V VOLTAGE DOUBLER +10V TO –10V VOLTAGE INVERTER 1µF 6.3V 1µF T3OUT T1OUT T2OUT R1IN R1OUT T2IN T1IN GND VCC C1+ 1 2 3 4 5 6 7 8 9 10 24 T4OUT 23 R2IN 22 R2OUT 1µF 16V V– 15 1µF 16V T1OUT T2OUT RS-232 OUTPUTS 21 SD 20 EN T4IN TTL/CMOS INPUTS* T1IN T2IN T3IN T4IN R1OUT TTL/CMOS OUTPUTS R2OUT T1 2 6 T2 3 1 ADM236L TOP VIEW (Not to Scale) 19 18 T3 T4 R1 R2 T3OUT T4OUT R1IN R2IN RS-232 INPUTS** 18 T3IN 17 R3OUT 19 5 24 4 23 16 21 16 R3IN 15 14 13 V– C2– C2+ 22 17 20 V+ 11 C1– 12 R3OUT EN R3 R3IN SD GND 8 ADM236L Figure 13. ADM236L DIP/SOIC Pin Configuration *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 14. ADM236L Typical Operating Circuit +5V INPUT 10 C1+ 12 C1– 13 C2+ 14 C2– 1µF 6.3V +5V TO +10V VOLTAGE DOUBLER +10V TO –10V VOLTAGE INVERTER VCC 9 V+ 11 1µF 6.3V 1µF T3OUT T1OUT T2OUT R1IN R1OUT T2IN T1IN GND VCC C1+ 1 2 3 4 5 6 7 8 9 10 24 T4OUT 1µF 16V V– 15 23 R2IN 22 21 20 R2OUT T5IN T5OUT T4IN TTL/CMOS INPUTS* T2IN T3IN T4IN T1IN 1µF 16V T1OUT T2OUT RS-232 OUTPUTS 7 T1 T2 2 3 6 ADM237L TOP VIEW (Not to Scale) 19 18 19 T3 1 24 T3OUT T4OUT T5OUT R1IN R2IN 18 T3IN 17 R3OUT T5IN R1OUT TTL/CMOS OUTPUTS R2OUT T4 16 R3IN 15 14 13 V– C2– C2+ 21 T5 R1 R2 20 5 4 23 16 V+ 11 C1– 12 22 17 GND 8 RS-232 INPUTS** R3OUT R3 R3IN ADM237L Figure 15. ADM237L DIP/SOIC Pin Configuration *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 16. ADM237L Typical Operating Circuit REV. 0 –7– ADM223/ADM230L–ADM241L +5V INPUT 1µF 6.3V 10 C1+ 12 C1– 13 C2+ 14 C2– 5 +5V TO +10V VOLTAGE DOUBLER +10V TO –10V VOLTAGE INVERTER VCC 9 V+ 11 1µF 6.3V 1µF T2OUT T1OUT R2IN R2OUT T1IN R1OUT R1IN GND VCC C1+ 1 2 3 4 5 6 7 8 9 10 24 T3OUT 23 R3IN 22 21 20 R3OUT 1µF 16V V– 15 1µF 16V T1OUT T2OUT RS-232 OUTPUTS T1IN T1 2 T4IN T4OUT T3IN TTL/CMOS INPUTS* T2IN T3IN T4IN R1OUT R2OUT 18 T2 1 24 ADM238L TOP VIEW (Not to Scale) 19 19 T3 T4 R1 R2 T3OUT T4OUT R1IN R2IN RS-232 INPUTS** 18 T2IN 17 R4OUT 21 6 4 20 7 3 16 R4IN 15 14 13 V– C2– C2+ TTL/CMOS OUTPUTS V+ 11 C1– 12 R3OUT R4OUT 22 17 GND 8 R3 R4 23 R3IN R4IN 16 ADM238L Figure 17. ADM238L DIP/SOIC Pin Configuration *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 18. ADM238L Typical Operating Circuit +5V INPUT 1µF VCC 4 V+ 5 V– 8 1µF 16V T1IN TTL/CMOS INPUTS* T2IN T3IN R1OUT R2OUT TTL/CMOS OUTPUTS 24 23 T1 19 20 13 T1OUT T2OUT RS-232 OUTPUTS +7.5V TO +13.2V INPUT R1OUT R1IN GND VCC V+ C+ C– V– R5IN R5OUT R4OUT 1 2 3 4 5 6 7 8 9 10 11 24 T1IN 1µF 16V 6 7 C1+ C1– +12V TO –12V VOLTAGE INVERTER 23 T2IN 22 21 20 R2OUT R2IN T2OUT T1OUT R3IN R3OUT T3IN 22 R2 21 T2 ADM239L TOP VIEW (Not to Scale) 19 18 17 16 16 T3 R1 T3OUT R1IN R2IN RS-232 INPUTS** 1 2 15 NC 14 13 EN T3OUT R3OUT R4OUT 17 11 R3 R4 18 R3IN R4IN R4IN 12 NC = NO CONNECT 12 R5OUT EN 10 14 R5 9 15 R5IN NC GND 3 ADM239L Figure 19. ADM239L DIP/SOIC Pin Configuration *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 20. ADM239L Typical Operating Circuit –8– REV. 0 ADM223/ADM230L–ADM241L +5V INPUT 1µF 16V 12 C1+ 14 C1– 15 C2+ 16 C2– +5V TO +10V VOLTAGE DOUBLER +10V TO –10V VOLTAGE INVERTER V CC 11 V+ 13 V– 17 1µF 6.3V 1µF T3OUT T1OUT T2OUT R2IN R2OUT T2IN T1IN R1OUT R1IN 1 2 3 4 5 6 7 8 9 28 T4OUT 27 R3IN 26 R3OUT T1IN T2IN T3IN T4IN R1 OUT R2 OUT 1µF 16V 1µF 16V 25 SD 24 EN 23 R4IN TTL/CMOS INPUTS * 7 T1 2 T1 OUT T2 OUT 6 T2 3 RS-232 OUTPUTS 20 T3 ADM241L TOP VIEW (Not to Scale) 1 22 21 20 19 R4OUT T4IN T3IN R5OUT T3 OUT T4 OUT R1 IN R2 IN RS-232 INPUTS ** 21 T4 28 8 R1 9 GND 10 VCC 11 C1+ 12 V+ 13 C1– 14 5 R2 4 18 R5IN 17 V– TTL/CMOS OUTPUTS R3 OUT R4 OUT 26 R3 27 R3 IN R4 IN 16 C2– 15 C2+ 22 R4 23 R5 OUT EN 19 24 R5 18 25 R5 IN SD GND 10 ADM241L Figure 21. ADM241L SOIC/SSOP Pin Configuration *INTERNAL 400k Ω PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5k Ω PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 22. ADM241L Typical Operating Circuit +5V INPUT T3OUT T1OUT T2OUT R2IN R2OUT T2IN T1IN R1OUT R1IN 1 2 3 4 5 6 7 8 9 28 T4OUT 27 R3IN 26 R3OUT 1µF 16V 12 C1+ 14 C1– 15 C2+ 16 C2– +5V TO +10V VOLTAGE DOUBLER +10V TO –10V VOLTAGE INVERTER V CC 11 V+ 13 V– 17 1µF 6.3V 1µF 1µF 16V 1µF 16V 25 SD 24 EN 23 R4IN T1IN T2IN T3IN T4IN R1 OUT R2 OUT TTL/CMOS OUTPUTS 7 T1 2 T1 OUT T2 OUT 6 T2 3 ADM223 TOP VIEW (Not to Scale) 22 21 20 19 R4OUT T4IN TTL/CMOS INPUTS * RS-232 OUTPUTS 20 T3 1 T3 OUT T4 OUT R1IN R2IN RS-232 INPUTS ** 21 T4 28 T3IN R5OUT GND 10 VCC 11 C1+ 12 V+ 13 C1– 14 8 R1 9 18 R5IN 17 V– 5 R2 4 16 C2– 15 C2+ R3 OUT R4 OUT 26 R3 27 R3IN R4IN 22 R4 23 R5 OUT EN 19 24 R5 18 25 R5IN SD GND 10 ADM223 Figure 23. ADM223 SOIC/SSOP Pin Configuration *INTERNAL 400k Ω PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5k Ω PULL-DOWN RESISTOR ON EACH RS-232 INPUT NOTE: RECEIVERS R4 AND R5 REMAIN ACTIVE IN SHUTDOWN. Figure 24. ADM223 Typical Operating Circuit REV. 0 –9– ADM223/ADM230L–ADM241L PIN FUNCTION DESCRIPTION Mnemonic VCC V+ V– GND C+ C– C1+ Function Power Supply Input 5 V ± 10% (+5 V ± 5% ADM233L, ADM235L). Internally generated positive supply (+10 V nominal) on all parts except ADM231L and ADM239L. ADM231L, ADM239L requires external 7.5 V to 13.2 V supply. Internally generated negative supply (–10 V nominal). Ground pin. Must be connected to 0 V. (ADM231L and ADM239L only). External capacitor (+ terminal) is connected to this pin. (ADM231L and ADM239L only). External capacitor (– terminal) is connected to this pin. (ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (+ terminal) is connected to this pin. (ADM233L) The capacitor is connected internally and no external connection to this pin is required. (ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (– terminal) is connected to this pin. (ADM233L) The capacitor is connected internally and no external connection to this pin is required. (ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (+ terminal) is connected to this pin. (ADM233L) Internal capacitor connections, Pins 11 and 15 must be connected together. (ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (– terminal) is connected to this pin. (ADM233L) Internal capacitor connections, Pins 10 and 16 must be connected together. Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. An internal 400 kΩ pull-up resistor to VCC is connected on each input. Transmitter (Driver) Outputs. These are RS-232 levels (typically ± 10 V). Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 kΩ pull-down resistor to GND is connected on each input. Receiver Outputs. These are TTL/CMOS levels. Enable Input. Active low on ADM235L, ADM236L, ADM239L, ADM241L. Active high ADM223. This input is used to enable/disable the receiver outputs. With EN = low (EN = high ADM223), the receiver outputs are enabled. With EN = high (EN = low ADM223), the outputs are placed in a high impedance state. This facility is useful for connecting to microprocessor systems. Shutdown Input. Active high on ADM235L, ADM236L, ADM241L. Active low on ADM223. With SD = high on the ADM235L, ADM236L, ADM241L, the charge pump is disabled, the receiver outputs are placed in a high impedance state and the driver outputs are turned off. With SD low on the ADM223, the charge pump is disabled, the driver outputs are turned off and all receivers except R4 and R5 are placed in a high impedance state. In shutdown, the power consumption reduces to 5 µW. No Connect. No connections are required to this pin. C1– C2+ C2– TIN TOUT RIN ROUT EN/EN SD/SD NC Table I. ADM235L, ADM236L, ADM241L Truth Table Table II. ADM223 Truth Table SD 0 0 1 EN 0 1 0 Status Normal Operation Normal Operation Shutdown Transmitters T1–T5 Enabled Enabled Disabled Receivers R1–R5 Enabled Disabled Disabled SD EN Status 0 0 1 1 0 1 0 1 Shutdown Shutdown Normal Operation Normal Operation Transmitters Receivers T1–T4 R1–R3 R4, R5 Disabled Disabled Enabled Enabled Disabled Disabled Disabled Enabled Disabled Enabled Disabled Enabled –10– REV. 0 ADM223/ADM230L–ADM241L 10 10 8 V+ | V– | VOUT (1 O/P LOADED) VOUT – V VOUT – V 6 8 4 VOUT (ALL O/Ps LOADED) 6 2 0 0 10 20 IOUT — mA 30 40 4 3.0 4.0 VCC – V 5.0 Figure 25. Charge Pump V+, V– vs. Current Figure 27. Transmitter Output Voltage vs. VCC 12 18 16 10 TOUT HIGH 14 SLEW RATE – V/µs 8 12 TOUT – V 6 TOUT LOW 4 10 8 2 6 4 0 500 1000 1500 2000 2500 CAPACITIVE LOAD – pF 0 0 2 4 IOUT – mA 6 8 Figure 26. Transmitter Slew Rate vs. Load Capacitance Figure 28. Transmitter Output Voltage vs. Current 300 V– (UNLOADED) V+, V– IMPEDANCE – Ω 200 V– (LOADED) V+ (UNLOADED) 100 V+ (LOADED) 0 3 4 VCC – V 5 Figure 29. Charge Pump Impedance vs. VCC REV. 0 –11– ADM223/ADM230L–ADM241L A3 100 90 0.8 V 100 90 A3 0.8 V 10 0% 10 0% 5V 5V B Lw 5 1ms H O 5V B Lw 5 5µs H O Figure 30. Charge Pump, V+, V– Exiting Shutdown Figure 31. Transmitter Output Loaded Slew Rate A3 100 90 0.8 V 10 0% 5V B Lw 5 1µs H O Figure 32. Transmitter Output Unloaded Slew Rate GENERAL INFORMATION CIRCUIT DESCRIPTION The ADM223/ADM230L–ADM241L family of RS-232 drivers/ receivers are designed to solve interface problems by meeting the EIA-232-E specifications while using a single digital +5 V supply. The EIA-232-E standard requires transmitters which will deliver ± 5 V minimum on the transmission channel and receivers which can accept signal levels down to ± 3 V. The ADM223/ADM230L–ADM241L meet these requirements by integrating step up voltage converters and level shifting transmitters and receivers onto the same chip. CMOS technology is used to keep the power dissipation to an absolute minimum. A comprehensive range of transmitter/receiver combinations is available to cover most communications needs. The ADM223, ADM230L, ADM235L, ADM236L and ADM241L are particularly useful in battery powered systems as they feature a low power shutdown mode which reduces power dissipation to less than 5 µW. The ADM233L and ADM235L are designed for applications where space saving is important as the charge pump capacitors are molded into the package. The ADM231L and ADM239L include only a negative charge pump converter and are intended for applications where a positive 12 V is available. To facilitate sharing a common line or for connection to a microprocessor data bus the ADM235L, ADM236L, ADM239L and ADM241L feature an enable (EN, EN) function. When disabled, the receiver outputs are placed in a high impedance state. The internal circuitry in the ADM230L–ADM241L consists of three main sections. These are: (a) A charge pump voltage converter (b) RS-232 to TTL/CMOS receivers (c) TTL/CMOS to RS-232 transmitters Charge Pump DC-DC Voltage Converter The charge pump voltage converter consists of an oscillator and a switching matrix. The converter generates a ± 10 V supply from the input 5 V level. This is done in two stages using a switched capacitor technique as illustrated in Figures 33 and 34. First, the 5 V input supply is doubled to 10 V using capacitor C1 as the charge storage element. The 10 V level is then inverted to generate –10 V using C2 as the storage element. S1 VCC C1 GND S2 S4 VCC C3 S3 V+ = 2VCC INTERNAL OSCILLATOR Figure 33. Charge-Pump Voltage Doubler –12– REV. 0 ADM223/ADM230L–ADM241L S1 V+ FROM VOLTAGE DOUBLER GND C2 S2 S4 V– = – (V+) C4 S3 GND INTERNAL OSCILLATOR Figure 34. Charge-Pump Voltage Inverter Capacitors C3 and C4 are used to reduce the output ripple. Their values are not critical and can be reduced if higher levels of ripple are acceptable. The charge pump capacitors C1 and C2 may also be reduced at the expense of higher output impedance on the V+ and V– supplies. The V+ and V– supplies may also be used to power external circuitry if the current requirements are small. Transmitter (Driver) Section Enable Input The ADM235, ADM239, ADM241L and ADM223 feature an enable input used to enable or disable the receiver outputs. The enable input is active low on the ADM235L, ADM239L, ADM241L and active high on the ADM223. Refer to Tables I and II. When disabled, all receiver outputs are placed in a high impedance state. This function allows the outputs to be connected directly to a microprocessor data bus. It can also be used to allow receivers from different devices to share a common data line. The timing diagram for the enable function is shown in Figure 35. 3V EN* 0V TEN 3.5V ROUT 0.8V TDIS VOH – 0.1V VVOL + 0.1V The drivers convert TTL/CMOS input levels into EIA-232-E output levels. With VCC = +5 V and driving a typical EIA-232-E load, the output voltage swing is ± 9 V. Even under worst case conditions the drivers are guaranteed to meet the ± 5 V EIA-232-E minimum requirement. The input threshold levels are both TTL and CMOS compatible with the switching threshold set at VCC/4. With a nominal VCC = 5 V the switching threshold is 1.25 V typical. Unused inputs may be left unconnected, as an internal 400 kΩ pull-up resistor pulls them high forcing the outputs into a low state. As required by the EIA-232-E standard, the slew rate is limited to less than 30 V/µs without the need for an external slew limiting capacitor and the output impedance in the power-off state is greater than 300 Ω. Receiver Section *POLARITY OF EN IS REVERSED FOR ADM223. Figure 35. Enable Timing APPLICATION HINTS Driving Long Cables In accordance with the EIA-232-E standard, long cables are permissible provided that the total load capacitance does not exceed 2500 pF. For longer cables which do exceed this, then it is possible to trade off baud rate vs. cable length. Large load capacitances cause a reduction in slew rate, and hence the maximum transmission baud rate is decreased. The ADM230L-ADM241L are designed so that the slew rate reduction with increasing load capacitance is minimized. For the receivers, it is important that a high level of noise immunity be inbuilt so that slow rise and fall times do not cause multiple output transitions as the signal passes slowly through the transition region. The ADM230L-ADM241L have 0.5 V of hysteresis to guard against this. This ensures that, even in noisy environments, error-free reception can be achieved. High Baud Rate Operation The receivers are inverting level shifters which accept EIA232-E input levels (± 5 V to ± 15 V) and translate them into 5 V TTL/CMOS levels. The inputs have internal 5 kΩ pull-down resistors to ground and are also protected against overvoltages of up to ± 30 V. The guaranteed switching thresholds are 0.8 V minimum and 2.4 V maximum which are well within the ± 3 V EIA-232-E requirement. The low level threshold is deliberately positive as it ensures that an unconnected input will be interpreted as a low level. The receivers have Schmitt trigger inputs with a hysteresis level of 0.5 V. This ensures error-free reception for both noisy inputs and for inputs with slow transition times. Shutdown (SD) The ADM230L-ADM241L feature high slew rates permitting data transmission at rates well in excess of the EIA-232-E specification. The drivers maintain ± 5 V signal levels at data rates up to 100-kB/s under worst-case loading conditions. The ADM223, ADM230L, ADM235L, ADM236L and ADM241L feature a control input that may be used to disable the part and reduce the power consumption to less than 5 µW. This is very useful in battery operated systems. During shutdown the charge pump is turned off, the transmitters are disabled and all receivers except R4 and R5 on the ADM223 are put into a high-impedance disabled state. Receivers R4 and R5 on the ADM223 remain enabled during shutdown. This feature allows monitoring external activity such as ring indicator monitoring while the device is in a low power shutdown mode. The shutdown control input is active high on all parts except the ADM223 where it is active low. Refer to Tables I and II. REV. 0 –13– ADM223/ADM230L–ADM241L OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 14-Lead Plastic DIP (N-14) 14 PIN 1 1 0.795 (20.19) 0.725 (18.42) 0.210 (5.33) 0.200 (5.05) 0.125 (3.18) 0.022 (0.558) 0.014 (0.356) 0.100 (2.54) BSC 0.070 (1.77) 0.045 (1.15) 0.060 (1.52) 0.015 (0.38) 7 1 14-Lead Cerdip (Q-14) 14 PIN 1 7 0.780 (19.81) 0.300 (7.62) REF 0.163 (4.14) 0.133 (3.378) 8 0.271 (6.89) 0.240 (6.09) 8 0.280 (7.11) 0.240 (6.10) 0.325 (8.25) 0.300 (7.62) 0.195 (4.95) 0.115 (2.93) 0.150 (3.81) 0.015 (0.381) 0.008 (0.204) 0.125 (3.17) MIN 0.02 (0.5) 0.016 (0.406) 0.11 (2.79) 0.099 (2.28) 0.06 (1.52) 0.05 (1.27) 0.21 (5.33) 0.15 (3.81) 0.012 (0.305) 0.008 (0.203) 15 ° 0° SEATING PLANE SEATING PLANE 16-Lead Plastic DIP (N-16) 16-Lead Cerdip (Q-16) 16 PIN 1 1 0.840 (21.33) 0.745 (18.93) 0.210 (5.33) 0.200 (5.05) 0.125 (3.18) 0.060 (1.52) 0.015 (0.38) 8 0.325 (8.25) 0.300 (7.62) 0.195 (4.95) 0.115 (2.93) 9 0.280 (7.11) 0.240 (6.10) PIN 1 1 0.780 (19.81) 0.163 (4.14) 0.133 (3.378) 8 0.300 (7.62) REF 16 9 0.271 (6.89) 0.240 (6.09) 0.150 (3.81) 0.015 (0.381) 0.008 (0.204) 0.125 (3.17) MIN 0.02 (0.5) 0.016 (0.406) 0.11 (2.79) 0.099 (2.28) 0.06 (1.52) 0.05 (1.27) 0.21 (5.33) 0.15 (3.81) 0.012 (0.305) 0.008 (0.203) 15 ° 0° 0.022 (0.558) 0.014 (0.356) 0.100 (2.54) BSC 0.070 (1.77) 0.045 (1.15) SEATING PLANE SEATING PLANE 16-Lead SOIC (R-16) 16 9 0.299 (7.60) 0.291 (7.40) 0.419 (10.65) 0.404 (10.26) PIN 1 1 8 0.413 (10.50) 0.348 (10.10) 0.107 (2.72) 0.089 (2.26) 0.364 (9.246) 0.344 (8.738) 0.010 (0.25) 0.004 (0.10) 0.050 (1.27) BSC 0.018 (0.46) 0.014 (0.36) 0.015 (0.38) 0.007 (1.18) 0.045 (1.15) 0.020 (0.50) –14– REV. 0 ADM223/ADM230L–ADM241L 20-Lead Plastic DIP (N-20) 20 PIN 1 1 10 11 0.280 (7.11) 0.240 (6.10) PIN 1 1 10 0.97 (24.64) 0.935 (23.75) 0.32 (8.128) 0.29 (7.366) 0.18 (4.57) 0.125 (3.18) 0.011 (0.28) 0.009 (0.23) SEATING PLANE 15 ° 0° 20 20-Lead Cerdip (Q-20) 11 0.28 (7.11) 0.24 (6.1) 1.060 (26.90) 0.925 (23.50) 0.210 (5.33) 0.200 (5.05) 0.125 (3.18) 0.022 (0.558) 0.014 (0.356) 0.100 (2.54) BSC 0.070 (1.78) 0.045 (1.15) 0.060 (1.52) 0.015 (0.38) 0.150 (3.81) 0.325 (8.25) 0.300 (7.62) 0.195 (4.95) 0.115 (2.93) 0.015 (0.381) 0.008 (0.204) 0.20 (5.0) 0.14 (3.56) 0.15 (3.8) 0.125 (3.18) 0.02 (0.5) 0.016 (0.41) SEATING PLANE 0.11 (2.79) 0.09 (2.28) 0.07 (1.78) 0.05 (1.27) LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH 20-Lead SOIC (R-20) 0.005 (0.13) 24-Lead Ceramic DIP (D-24) 0.098 (2.49) 20 11 0.2992 (7.60) 0.2914 (7.40) PIN 1 24 13 0.610 (15.49) 0.500 (12.70) 1 1.290 (32.77) 12 0.075 (1.91) 0.015 (0.38) 0.620 (15.75) 0.590 (14.99) 0.4193 (10.65) 0.3937 (10.00) PIN 1 1 10 0.5118 (13.00) 0.4961 (12.60) 0.1043 (2.65) 0.0926 (2.35) 0.225 (5.72) 0.0291 (0.74) x 45 ° 0.0098 (0.25) 0.200 (5.08) 0.120 (3.05) 0.023 (0.58) 0.014 (0.36) 0.110 (2.79) 0.090 (2.29) 0.070 (1.78) 0.030 (0.76) 0.150 (3.81) 0.015 (0.38) 0.008 (0.20) 0.0118 (0.30) 0.0040 (0.10) 0.0500 (1.27) BSC 0.0192 (0.49) 0.0138 (0.35) 0.0125 (0.32) 0.0091 (0.23) 8° 0° 0.0500 (1.27) 0.0157 (0.40) SEATING PLANE 24-Lead Plastic DIP (N-24) 24 PIN 1 1 1.228 (31.19) 1.226 (31.14) 0.130 (3.30) 0.128 (3.25) 12 13 0.260 ± 0.001 (6.61 ± 0.03) 24-Lead Plastic DIP (N-24A) 24 13 0.55 (13.97) 0.53 (13.47) 1 1.25 (31.75) 1.24 (31.5) 0.2 (5.08) MAX 0.175 (4.45) 0.12 (3.05) 0.02 (0.508) 0.015 (0.381) 0.16 (4.07) 0.14 (3.56) 12 0.606 (15.4) 0.594 (15.09) PIN 1 0.32 (8.128) 0.30 (7.62) SEATING PLANE 0.02 (0.5) 0.016 (0.41) 0.11 (2.79) 0.09 (2.28) 0.07 (1.78) 0.05 (1.27) 15° 0 0.011 (0.28) 0.009 (0.23) 0.105 (2.67) 0.095 (2.42) 0.065 (1.66) 0.045 (1.15) SEATING PLANE 15° 0° 0.012 (0.305) 0.008 (0.203) NOTES 1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH 2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. REV. 0 –15– 24-Lead Cerdip (Q-24) 24 PIN 1 1 1.290 (32.77) MAX 0.225 (5.715) MAX 0.125 (3.175) MIN 0.180 (4.572) MAX SEATING PLANE 0.070 (1.778) 15° 0.021 (0.533) 0.110 (2.794) 0.065 (1.651) 0.020 (0.508) 0.015 (0.381) 0.090 (2.286) 0.055 (1.397) 0° TYP TYP TYP 1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH. 2. CERDIP LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. 0.012 (0.305) 0.008 (0.203) TYP 12 0.320 (8.128) 0.290 (7.366) 13 0.295 (7.493) MAX 28-Lead SOIC (R-28) 28 15 0.299 (7.6) 0.291 (7.39) PIN 1 1 14 0.708 (18.02) 0.696 (17.67) 0.096 (2.44) 0.089 (2.26) 0.03 (0.76) 0.02 (0.51) 0.01 (0.254) 0.006 (0.15) 0.05 (1.27) BSC 0.019 (0.49) 0.014 (0.35) 0.013 (0.32) 0.009 (0.23) 6° 0° 0.042 (1.067) 0.018 (0.457) 1. LEAD NO. IDENTIFIED BY A DOT. 2. SOICLEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. 24-Lead SOIC (R-24) 28-Lead SSOP (RS-28) 24 13 0.299 (7.6) 0.291 (7.39) 0.414 (10.52) 0.398 (10.10) 28 15 0.212 (5.38) 0.205 (5.207) 0.311 (7.9) 0.301 (7.64) PIN 1 1 12 PIN 1 1 14 0.608 (15.45) 0.596 (15.13) 0.096 (2.44) 0.089 (2.26) 0.03 (0.76) 0.02 (0.51) 0.407 (10.34) 0.397 (10.08) 0.07 (1.78) 0.066 (1.67) 0.01 (0.254) 0.006 (0.15) 0.05 (1.27) BSC 0.019 (0.49) 0.014 (0.35) 0.013 (0.32) 0.009 (0.23) 6° 0° 0.042 (1.067) 0.018 (0.447) 0.008 (0.203) 0.002 (0.050) 0.0256 (0.65) BSC 0.009 (0.229) 0.005 (0.127) 8° 0° 0.037 (0.94) 0.022 (0.559) 1. LEAD NO. 1 IDENTIFIED BY A DOT. 2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS 1. LEAD NO. 1 IDENTIFIED BY A DOT. 2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS –16– PRINTED IN U.S.A. C1900–18–4/94 0.414 (10.52) 0.398 (10.10)