Robust 5 kV RMS Isolated RS-485 Transceiver with
Level 4 DO-160G EMC and Full ±42 V Protection
ADM2795E-EP
Enhanced Product
FEATURES
APPLICATIONS
5 kV rms isolated RS-485 transceiver
±42 V ac/dc peak fault protection on RS-485 bus pins
DO-160G Section 25 ESD protection: ±15 kV air discharge
Fully certified DO-160G EMC protection on RS-485 bus pins
Section 22 lightning protection Waveform 3, Waveform 4/
Waveform 1, Waveform 5A Pin injection, Level 4
protection
RS-485 A, B pins HBM ESD protection: >±30 kV
Safety and regulatory approvals
CSA Component Acceptance Notice 5A, DIN V VDE V 0884-10,
UL 1577, CQC11-471543-2012 (pending)
TIA/EIA RS-485/RS-422 compliant over full supply range
3 V to 5.5 V operating voltage range on VDD2
1.7 V to 5.5 V operating voltage range on VDD1 logic supply
Common-mode input range of −25 V to +25 V
High common-mode transient immunity: >75 kV/μs
Robust noise immunity (tested to the IEC 62132-4 standard)
Passes EN55022 Class B radiated emissions by 6 dBµV/m margin
Receiver short-circuit, open-circuit, and floating input fail-safe
Supports 256 bus nodes (96 kΩ receiver input impedance)
Glitch free power-up/power-down (hot swap)
Military and aerospace (MILA) avionics for sensors,
actuators, and engine control
GENERAL DESCRIPTION
The ADM2795E-EP is a 5 kV rms signal isolated RS-485 transceiver that features up to ±42 V of ac/dc peak bus overvoltage fault
protection on the RS-485 bus pins. The device integrates Analog
Devices, Inc., iCoupler® technology to combine a 3-channel
isolator, RS-485 transceiver, and IEC electromagnetic compatibility (EMC) transient protection in a single package. The
ADM2795E-EP integrates fully certified DO-160G EMC protection on the RS-485 bus pins, with Section 22 lightning protection.
The ADM2795E-EP also provides Section 25 ±15 kV ESD air
discharge protection. For Section 22 lightning, the ADM2795E-EP
provides protection for Waveform 3, Waveform 4/ Waveform 1,
and Waveform 5A to Level 4 using 33 Ω or 47 Ω current
limiting resistors to GND2, or to Level 4 across the isolation
barrier to GND1. This device has an extended common-mode
input range of ±25 V to improve data communication reliability in
noisy environments. The ADM2795E-EP is capable of operating
over wide power supply ranges, with a 1.7 V to 5.5 V VDD1 power
supply range, allowing interfacing to low voltage logic supplies.
The ADM2795E-EP is also fully TIA/EIA RS-485/RS-422
compliant when operated over a 3 V to 5.5 V VDD2 power supply.
The device is fully characterized over an extended operating
temperature range of −55°C to +125°C, and is available in a
16-lead, wide-body SOIC package.
ENHANCED PRODUCT FEATURES
Supports defense and aerospace applications (AQEC
standard)
Military −55°C to +125°C temperature range
Controlled manufacturing baseline
1 assembly/test site
Enhanced product change notification
Qualification data available on request
Additional application and technical information can be found
in the ADM2795E data sheet.
FUNCTIONAL BLOCK DIAGRAM
VDD1
VDD2
DIGITAL ISOLATOR
RS-485
TRANSCEIVER
ADM2795E-EP
RxD
RE
EMC
TRANSIENT
PROTECTION
CIRCUIT
DE
A
B
GND1
GND2
ISOLATION
BARRIER
15664-001
TxD
Figure 1.
Rev. 0
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Tel: 781.329.4700
©2017 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
ADM2795E-EP
Enhanced Product
TABLE OF CONTENTS
Features .............................................................................................. 1
Absolute Maximum Ratings ............................................................7
Enhanced Product Features ............................................................ 1
Thermal Resistance .......................................................................7
Applications ....................................................................................... 1
ESD Caution...................................................................................7
General Description ......................................................................... 1
Pin Configuration and Function Descriptions..............................8
Functional Block Diagram .............................................................. 1
Typical Performance Characteristics ..............................................9
Revision History ............................................................................... 2
Test Circuits ..................................................................................... 13
Specifications..................................................................................... 3
Switching Characteristics .......................................................... 14
Timing Specifications .................................................................. 4
Theory of Operation ...................................................................... 15
Insulation and Safety Related Specifications ............................ 5
RS-485 with Added DO-160G EMC Robustness .................. 15
Package Characteristics ............................................................... 5
Certified DO-160G EMC Protection ...................................... 15
Regulatory Information ............................................................... 5
DO-160G ADM2795E-EP Test Details ................................... 15
DIN V VDE V 0884-10 (VDE V 0884-10) Insulation
Characteristics .............................................................................. 6
Outline Dimensions ....................................................................... 17
Ordering Guide .......................................................................... 17
REVISION HISTORY
7/2017—Revision 0: Initial Version
Rev. 0 | Page 2 of 17
Enhanced Product
ADM2795E-EP
SPECIFICATIONS
1.7 V ≤ VDD1 ≤ 5.5 V, 3 V ≤ VDD2 ≤ 5.5 V, TA = −55°C to +125°C. All min/max specifications apply over the entire recommended
operation range, unless otherwise noted. All typical specifications at TA = 25°C, VDD1 = VDD2 = 5.0 V, unless otherwise noted.
Table 1.
Parameter
SUPPLY CURRENT
Power Supply Current
Logic Side
TxD/RxD Data Rate = 2.5 Mbps
Bus Side
TxD/RxD Data Rate = 2.5 Mbps
Supply Current in Shutdown Mode
DRIVER
Differential Outputs
Differential Output Voltage
Symbol
Input Capacitance (A, B)
Line Input Resistance
Typ
IDD1
IDD2
Max
Unit
Test Conditions/Comments
10
10
12
90
130
mA
mA
mA
mA
mA
Unloaded output, DE = VDD1, RE = 0 V
Unloaded output, DE = VDD1, RE = 0 V
Unloaded output, DE = VDD1, RE = 0 V
Unloaded output, DE = VDD1, RE = 0 V
DE = VDD1, RE = 0 V, VDD2 = 5.5 V,
R = 27 Ω, see Figure 27
DE = VDD1, RE = 0 V, VDD2 = 5.5 V,
R = 27 Ω, see Figure 27
DE = VDD1, RE = 0 V, VDD2 = 3.0 V,
R = 27 Ω, see Figure 27
DE = 0 V, RE = VDD1
94
mA
46
mA
ISHDN
10
mA
1.5
5.0
V
2.1
5.0
V
1.5
5.0
V
2.1
5.0
V
∆|VOD|
0.2
V
VDD2 ≥ 3.0 V, R = 27 Ω or 50 Ω,
see Figure 27
VDD2 ≥ 4.5 V, R = 27 Ω or 50 Ω,
see Figure 27
VDD2 ≥ 3.0 V, VCM = −25 V to +25 V,
see Figure 28
VDD2 ≥ 4.5 V, VCM = −25 V to +25 V,
see Figure 28
R = 27 Ω or 50 Ω, see Figure 27
VOC
∆|VOC|
3.0
0.2
V
V
R = 27 Ω or 50 Ω, see Figure 27
R = 27 Ω or 50 Ω, see Figure 27
+250
+250
mA
mA
−42 V ≤ VSC ≤ +42 V1
−42 V ≤ VSC ≤ +42 V1
0.33 × VDD1
V
V
µA
1.7 V ≤ VDD1 ≤ 5.5 V
1.7 V ≤ VDD1 ≤ 5.5 V
0 V ≤ VIN ≤ VDD1
mV
mV
mA
mA
pF
kΩ
−25 V ≤ VCM ≤ +25 V
−25 V ≤ VCM ≤ +25 V
DE = 0 V, VDD2 = 0 V/5 V, VIN = ±25 V
DE = 0 V, VDD2 = 0 V/5 V, VIN = ±42 V
TA = 25°C, see Figure 17
−25 V ≤ VCM ≤ +25 V, up to
256 nodes supported
|VOD|
|VOD3|
Change in Differential Output
Voltage for Complementary
Output States
Common-Mode Output Voltage
Change in Common-Mode Output
Voltage for Complementary
Output States
Short-Circuit Output Current
VOUT = Low
VOUT = High
Logic Inputs (DE, RE, TxD)
Input Threshold Low
Input Threshold High
Input Current
RECEIVER
Differential Inputs
Differential Input Threshold Voltage
Input Voltage Hysteresis
Input Current (A, B)
Min
IOSL
IOSH
−250
−250
VIL
VIH
ITxD
0.7 VDD1
VTH
VHYS
II
CAB
RIN
+1
−200
−125
30
−1.0
−1.0
−30
+1.0
+1.0
150
96
Rev. 0 | Page 3 of 17
ADM2795E-EP
Enhanced Product
Parameter
Logic Outputs
Output Voltage Low
Output Voltage High
Short-Circuit Current
Three-State Output Leakage Current
Symbol
Min
VOLRxD
VOHRxD
VDD1 − 0.2
2
Max
Unit
Test Conditions/Comments
0.2
V
V
mA
µA
IORxD = 3.0 mA, VA − VB = −0.2 V
IORxD = −3.0 mA, VA − VB = 0.2 V
VOUT = GND or VDD1, RE = 0 V
RE = VDD1, RxD = 0 V or VDD1
kV/µs
VCM ≥1 kV, transient magnitude
≥800 V
100
±2
IOZR
COMMON-MODE TRANSIENT IMMUNITY2
1
Typ
75
125
VSC is the short-circuit voltage at the RS-485 A or B bus pin.
Common-mode transient immunity is the maximum common-mode voltage slew rate that can be sustained while maintaining specification compliant
operation. VCM is the common-mode potential difference between the logic and bus sides. The transient magnitude is the range over which the common mode
is slewed. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.
TIMING SPECIFICATIONS
VDD1 = 1.7 V to 5.5 V, VDD2 = 3.0 V to 5.5 V, TA = TMIN to TMAX (−55°C to +125°C), unless otherwise noted.
Table 2.
Parameter
DRIVER1
Maximum Data Rate
Propagation Delay, tDPLH, tDPHL
Differential Skew, tSKEW
Rise/Fall Times, tR, tF
Enable Time, tZH, tZL
Disable Time, tHZ, tLZ
RECEIVER2
Propagation Delay, tPLH, tPHL
Skew, tSKEW
Enable Time
Disable Time
RxD Pulse Width Distortion
1
2
Min
Typ
Max
Unit
Test Conditions/Comments
30
10
40
500
500
500
50
130
2500
2500
Mbps
ns
ns
ns
ns
ns
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 29 and Figure 33
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 29 and Figure 33
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 29 and Figure 33
RL = 110 Ω, CL = 50 pF, see Figure 30 and Figure 35
RL = 110 Ω, CL = 50 pF, see Figure 30 and Figure 35
120
140
4
10
10
200
220
40
50
50
40
ns
ns
ns
ns
ns
ns
CL = 15 pF, see Figure 31 and Figure 34, 10, VID ≥ ±1.5 V
CL = 15 pF, see Figure 31 and Figure 34, VID ≥ ±600 mV
CL = 15 pF, see Figure 31 and Figure 34, VID ≥ ±1.5 V
RL = 1 kΩ, CL = 15 pF, see Figure 32 and Figure 36
RL = 1 kΩ, CL = 15 pF, see Figure 32 and Figure 36
CL = 15 pF, see Figure 31 and Figure 34, VID ≥ ±1.5 V
2.5
See Figure 29 for the definition of RLDIFF.
Receiver propagation delay, skew, and pulse width distortion specifications are tested with a receiver differential input voltage (VID) of ≥±600 mV or ≥±1.5 V, as noted.
Rev. 0 | Page 4 of 17
Enhanced Product
ADM2795E-EP
INSULATION AND SAFETY RELATED SPECIFICATIONS
For additional information, see www.analog.com/icouplersafety.
Table 3.
Parameter
Rated Dielectric Insulation Voltage
Minimum External Air Gap (Clearance)
Symbol
L(I01)
Value
5000
7.8
Unit
V rms
mm min
Minimum External Tracking (Creepage)
L(I02)
7.8
mm min
Minimum Clearance in the Plane of the Printed
Circuit Board (PCB Clearance)
L(PCB)
8.3
mm min
CTI
25.5
>400
II
µm min
V
Minimum Internal Gap (Internal Clearance)
Tracking Resistance (Comparative Tracking Index)
Material Group
Conditions
1 minute duration
Measured from input terminals to output terminals,
shortest distance through air
Measured from input terminals to output terminals,
shortest distance along body
Measured from input terminals to output terminals,
shortest distance through air, line of sight, in the PCB
mounting plane
Minimum distance through insulation
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89)
PACKAGE CHARACTERISTICS
Table 4.
Parameter
Resistance (Input to Output)1
Capacitance (Input to Output)1
Input Capacitance2
Input Capacitance, A and B Pins
IC Junction to Ambient Thermal Resistance
1
2
Symbol
RI-O
CI-O
CI
CAB
θJA
Min
Typ
1013
2.2
4.0
150
59.7
Max
Unit
Ω
pF
pF
pF
°C/W
Test Conditions/Comments
f = 1 MHz
TA = 25°C, see Figure 17
Thermocouple located at center of package underside
The device is considered a 2-terminal device: Pin 1 through Pin 8 are shorted together, and Pin 9 through Pin 16 are shorted together.
Input capacitance is from any digital input pin to ground.
REGULATORY INFORMATION
See Table 8 and the ADM2795E data sheet for details regarding recommended maximum working voltages for specific cross isolation
waveforms and insulation levels.
The ADM2795E-EP is approved or pending approval by the organizations listed in Table 5.
Table 5. ADM2795E-EP Approvals
UL
Recognized Under UL 1577
Component Recognition
Program1
Single Protection, 5000 V rms
Isolation Voltage
File E214100
1
2
CSA
Approved under CSA Component
Acceptance Notice 5A
VDE
Certified according to DIN V VDE V 088410 (VDE V 0884-10):2006-122
CSA 60950-1-07+A1+A2 and IEC 60950-1
second edition +A1+A2:
Basic insulation at 780 V rms
(1103 V peak)
Reinforced insulation at 390 V rms
(552 V peak)
IEC 60601-1 Edition 3.1: basic insulation
(two means of patient protection
(MOPP)), 250 V rms (353 V peak)
CSA 61010-1-12 and IEC 61010-1 third
edition:
Basic insulation at 300 V rms mains, 780 V
secondary (1103 V peak)
Reinforced insulation at 300 V rms mains,
390 V secondary (552 V peak)
File 70078455
Reinforced insulation, VIORM = 849 V peak,
VIOSM = 8000 V peak
File 40011599
In accordance with UL 1577, each ADM2795E-EP is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 sec.
In accordance with DIN V VDE V 0884-10, each ADM2795E-EP is proof tested by applying an insulation test voltage ≥1592 V peak for 1 sec.
Rev. 0 | Page 5 of 17
CQC (Pending)
Certified by
CQC11-471543-2012,
GB4943.1-2011
Basic insulation at
780 V rms (1103 V peak)
Reinforced insulation at
389 V rms (552 V peak)
File (pending)
ADM2795E-EP
Enhanced Product
DIN V VDE V 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS
This isolator is suitable for reinforced electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured
by means of protective circuits.
An asterisk (*) on a package denotes VDE 0884 approval for a 849 V peak working voltage.
Table 6.
Description
Installation Classification per DIN VDE 0110 for
Rated Mains Voltage
≤150 V rms
≤300 V rms
≤400 V rms
Climatic Classification
Pollution Degree (DIN VDE 0110, see Table 3)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b1
Input to Output Test Voltage, Method a
After Environmental Tests, Subgroup 1
After Input and/or Safety Test,
Subgroup 2/Subgroup 3
Highest Allowable Overvoltage
Reinforced Surge Isolation Voltage
Safety Limiting Values
Total Power Dissipation at TA = 25°C
Insulation Resistance at TS
Test Conditions/Comments
VIORM × 1.875 = VPR, 100% production tested, tm =
1 sec, partial discharge < 5 pC
Transient overvoltage, tTR = 10 sec
VPEAK = 12.8 kV, 1.2 µs rise time, 50 µs, 50% fall time
Maximum value allowed in the event of a failure,
see Figure 2
VIO = 500 V
SAFE LIMITING POWER (W)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
50
100
150
15664-002
0.2
AMBIENT TEMPERATURE (°C)
Unit
VIORM
VPR
I to IV
I to IV
I to III
40/125/21
2
849
1592
V peak
V peak
1274
1019
V peak
V peak
VIOTM
VIOSM
TS
7000
8000
150
V peak
V peak
°C
PS
RS
1.80
>109
W
Ω
VPR
1.8
0
Characteristic
VIORM × 1.5 = VPR, tm = 60 sec, partial discharge < 5 pC
VIORM × 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC
2.0
0
Symbol
Figure 2. Thermal Derating Curve for RW-16 Wide Body [SOIC_W] Package,
Dependence of Safety Limiting Values with Ambient Temperature per
DIN V VDE V 0884-10
Rev. 0 | Page 6 of 17
Enhanced Product
ADM2795E-EP
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 8. Maximum Continuous Working Voltage1
Table 7.
Parameter
AC Voltage
Bipolar Waveform
Basic Insulation
Parameter
VDD1
VDD2
Digital Input/Output Voltage (DE, RE,
TxD, RxD)
Driver Output/Receiver Input Voltage
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Continuous Total Power Dissipation
Lead Temperature
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
ESD (A, B Pins Tested to GND2)
IEC 61000-4-2 Contact Discharge
IEC 62000-4-2 Air Discharge
EFT (A, B Pins Tested to GND2)
IEC 61000-4-4 Level 4 EFT Protection
Surge (A, B Pins Tested to GND2)
IEC 61000-4-5 Level 4 Surge
Protection
EMC Performance from A, B Bus Pins
Across the Isolation Barrier to GND1
ESD
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air Discharge
EFT
IEC 61000-4-4
Surge
IEC 61000-4-5
Human Body Model (HBM) ESD
Protection (A, B Pins Tested to GND2)
HBM ESD Protection (All Pins)
DO-160G Section 25 ESD Protection Air
Discharge
Field Induced Charged Device Model
ESD (FICDM)
Rating
−0.5 V to +7 V
−0.5 V to +7 V
−0.3 V to VDD1 + 0.3 V
Reinforced
Insulation
±48 V
−55°C to +125°C
−65°C to +150°C
150°C
405 mW
Unipolar Waveform
Basic Insulation
Reinforced
Insulation
300°C
215°C
220°C
±8 kV
±15 kV
DC Voltage
Basic Insulation
Max
Unit
Reference Standard2
849
V peak
768
V peak
50-year minimum
insulation lifetime
Lifetime limited by
package creepage
maximum approved
working voltage per
IEC 60950-1
1698
V peak
885
V peak
1092
V peak
543
V peak
±2 kV
±4 kV
Reinforced
Insulation
±9 kV
±8 kV
50-year minimum
insulation lifetime
Lifetime limited by
package creepage
maximum approved
working voltage per
IEC 60950-1
Lifetime limited by
package creepage
maximum approved
working voltage per
IEC 60950-1
Lifetime limited by
package creepage
maximum approved
working voltage per
IEC 60950-1
The maximum continuous working voltage refers to the continuous voltage
magnitude imposed across the isolation barrier. See the ADM2795E data
sheet for more details.
2
Insulation lifetime for the specified test condition is greater than 50 years.
1
±2 kV
THERMAL RESISTANCE
±4 kV
>±30 kV
Thermal performance is directly linked to PCB design and
operating environment. Careful attention to PCB thermal
design is required.
±6 kV
±15 kV
θJA is the natural convection junction to ambient thermal resistance
measured in a one cubic foot sealed enclosure. θJC is the junction to
case thermal resistance.
±1.25 kV
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Table 9. Thermal Resistance
Package Type
RW-16
1
θJA1
59.7
θJC1
28.3
Unit
°C/W
Thermal impedance simulated values are based on a JEDEC 2S2P thermal
test board with no vias. See JEDEC JESD51.
ESD CAUTION
Rev. 0 | Page 7 of 17
ADM2795E-EP
Enhanced Product
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
ADM2795E-EP
VDD1 1
16 VDD2
15 GND2
2
TxD 3
DE 4
RE 5
RxD 6
NIC 7
GND1 8
14 B
TOP VIEW
(Not to Scale)
13 VDD2
12 GND2
11 A
10 GND2
9
GND2
NOTES
1. NIC = NOT INTERNALLY CONNECTED.
15664-003
GND1
Figure 3. Pin Configuration
Table 10. Pin Function Descriptions
Pin No.
1
2
3
4
Mnemonic
VDD1
GND1
TxD
DE
5
RE
6
7
8
9
10
11
RxD
NIC
GND1
GND2
GND2
A
12
13
14
GND2
VDD2
B
15
16
GND2
VDD2
Description
1.7 V to 5.5 V Flexible Logic Interface Supply.
Ground 1, Logic Side.
Transmit Data Input. Data to be transmitted by the driver is applied to this input.
Driver Output Enable. A high level on this pin enables the driver differential outputs, A and B. A low level places
them into a high impedance state.
Receiver Enable Input. This pin is an active low input. Driving this input low enables the receiver, and driving it high
disables the receiver.
Receiver Output Data. This output is high when (A – B) > −30 mV and low when (A – B) < –200 mV.
Not Internally Connected. This pin is not internally connected.
Ground 1, Logic Side.
Isolated Ground 2, Bus Side.
Isolated Ground 2, Bus Side.
Noninverting Driver Output/Receiver Input. When the driver is disabled, or when VDD1 or VDD2 is powered down,
Pin A is put into a high impedance state to avoid overloading the bus.
Isolated Ground 2, Bus Side.
3 V to 5.5 V Power Supply. Pin 13 must be connected externally to Pin 16.
Inverting Driver Output/Receiver Input. When the driver is disabled, or when VDD1 or VDD2 is powered down, Pin B is
put into a high impedance state to avoid overloading the bus.
Isolated Ground 2, Bus Side.
3 V to 5.5 V Power Supply. Pin 16 must be connected externally to Pin 13.
Rev. 0 | Page 8 of 17
Enhanced Product
ADM2795E-EP
TYPICAL PERFORMANCE CHARACTERISTICS
100
4.5
90
IDD2 54Ω LOAD
70
IDD2 120Ω LOAD
60
50
40
IDD2 NO LOAD
30
20
IDD1
0
–55
–5
45
95
TEMPERATURE (°C)
3.0
2.5
2.0
1.5
1.0
0.5
0
–55
15664-004
10
3.5
45
95
TEMPERATURE (°C)
Figure 4. Supply Current (ICC) vs. Temperature at RL = 54 Ω, 120 Ω, and No
Load; Data Rate = 2.5 Mbps, VDD1 = 5.5 V, VDD2 = 5.5 V
Figure 7. Driver Differential Output Voltage vs. Temperature
60
0
VDD1 = 1.7V, VDD2 = 3.0V
–0.02
DRIVER OUTPUT CURRENT (A)
50
IDD2 54Ω LOAD
40
IDD2 120Ω LOAD
30
20
IDD2 NO LOAD
IDD1
–5
45
–0.06
–0.08
–0.10
–0.12
–0.14
95
–0.16
TEMPERATURE (°C)
–25
–24
–23
–22
–21
–20
–19
–18
–17
–16
–15
–14
–13
–12
–11
–10
–9
–8
–7
–6
–5
–4
–3
–2
–1
0
1
2
3
4
5
6
0
–55
VDD1 = 1.7V, VDD2 = 3.0V
PIN A
VDD1 = 1.7V, VDD2 = 3.0V
PIN B
VDD1 = 5.5V, VDD2 = 5.5V
PIN A
VDD1 = 5.5V, VDD2 = 5.5V
PIN B
–0.04
DRIVER OUTPUT HIGH VOLTAGE (V)
Figure 5. Supply Current (ICC) vs. Temperature at RL = 54 Ω, 120 Ω, and No
Load; Data Rate = 2.5 Mbps, VDD1 = 1.7 V, VDD2 = 3.0 V
Figure 8. Driver Output Current vs. Driver Output High Voltage
0.01
0.14
VDD1 = 1.7V,
VDD2 = 3.0V
0.12
DRIVER OUTPUT CURRENT (A)
–0.04
–0.09
–0.14
VDD1 = 4.5V,
VDD2 = 4.5V
–0.19
VDD1 = 5.5V,
VDD2 = 5.5V
–0.24
–0.29
0.10
VDD1 = 1.7V,
PIN A
VDD1 = 1.7V,
PIN B
VDD1 = 5.5V,
PIN A
VDD1 = 5.5V,
PIN B
0.08
0.06
0.04
VDD2 = 3.0V
VDD2 = 3.0V
VDD2 = 5.5V
VDD2 = 5.5V
0.02
–0.34
–0.39
0
1
2
3
4
5
DIFFERENTIAL OUTPUT VOLTAGE (V)
6
15664-006
DRIVER OUTPUT CURRENT (A)
15664-008
10
15664-005
SUPPLY CURRENT (mA)
–5
Figure 6. Driver Output Current vs. Differential Output Voltage
0
0
5
10
15
20
25
DRIVER OUTPUT LOW VOLTAGE (V)
Figure 9. Driver Output Current vs. Driver Output Low Voltage
Rev. 0 | Page 9 of 17
15664-009
SUPPLY CURRENT (mA)
80
VDD1 = VDD2 = 5.5V
4.0
15664-007
DRIVER DIFFERENTIAL OUTPUT VOLTAGE (V)
VDD1 = VDD2 = 5.5V
Enhanced Product
45
36
VDD1 = VDD2 = 5.5V
V DD1 = VDD2 = 5V
35
RECEIVER OUTPUT CURRENT (mA)
40
34
33
tDPLH
32
tDPHL
31
30
29
28
35
30
25
20
15
10
26
–55
–5
45
95
0
TEMPERATURE (°C)
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
RECEIVER OUTPUT LOW VOLTAGE (V)
Figure 10. Driver Differential Propagation Delay vs. Temperature
15664-013
5
27
15664-010
DRIVER DIFFERENTIAL PROPAGATION DELAY (ns)
ADM2795E-EP
Figure 13. Receiver Output Current vs. Receiver Output Low Voltage
6
C1
VOD
C1 2.0V/DIV 1MΩ BW: 500M
M1 2.00V
100ns
A CH1
2.12V
15664-011
M1
VDD1 = 5.0V,
VDD2 = 5.0V
5
IRxD = –1mA
4
3
2
VDD1 = 1.8V,
VDD2 = 3.3V
1
0
–55
Figure 11. Driver Propagation Delay (Oscilloscope)
–25
5
35
65
TEMPERATURE (°C)
125
Figure 14. Receiver Output High Voltage vs. Temperature
–70
60
IRO = 1mA
VDD1 = VDD2 = 5V
–60
–50
–40
–30
–20
40
30
20
10
–10
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
RECEIVER OUTPUT HIGH VOLTAGE (V)
4.5
5.0
Figure 12. Receiver Output Current vs. Receiver Output High Voltage
Rev. 0 | Page 10 of 17
0
125
VDD1
VDD2
VDD1
VDD2
= 1.8V,
= 3.3V
= 5V,
= 5V
95
65
35
5
–25
–55
TEMPERATURE (°C)
Figure 15. Receiver Output Low Voltage vs. Temperature
15664-015
OUTPUT LOW VOLTAGE (mV)
50
15664-012
RECEIVER OUTPUT CURRENT (mA)
95
15664-014
RECEIVER OUTPUT HIGH VOLTAGE (V)
TxD
Enhanced Product
ADM2795E-EP
140
tPLH
B
2
VOD
M1
RxD
3
2.0V/DIV
2.0V/DIV
2.0V/DIV
1.4V
1MΩ BW: 500M
1MΩ BW: 500M
1MΩ BW: 500M
100ns
A CH3
2.56V
100ns/DIV
1.0ns/pt
tPHL
100
80
60
40
20
0
–55
–25
15664-016
C1
C2
C3
M1
120
95
125
Figure 19. Receiver Propagation Delay vs. Temperature
Figure 16. Receiver Propagation Delay (Oscilloscope)
250
INPUT CAPACITANCE (A, B) (pF)
5
35
65
TEMPERATURE (°C)
15664-019
RECEIVER PROPAGATION DELAY (ns)
A
A
2
B
PIN B
200
PIN A
VOD
150
M1
100
RxD
50
15
35
55
75
95
115 125 130 140
JUNCTION TEMPERATURE (°C)
0.14
70
0.12
SHORT-CIRCUIT CURRENT (A)
80
60
50
EN55022
40
EN55022B
30
20
0.08
0.06
0.04
VDD1 = 1.7V, VDD2 = 3.0V
PIN A
VDD1 = 1.7V, VDD2 = 3.0V
PIN B
VDD1 = 5.5V, VDD2 = 5.5V
PIN A
VDD1 = 5.5V, VDD2 = 5.5V
PIN B
0
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
1G
15664-018
100M
FREQUENCY (Hz)
1MΩ BW: 500M OFFSET: 25.0V A CH3
2.56V
100ns/DIV
1MΩ BW: 500M OFFSET: 25.0V
1.0ns/pt
B
1MΩ W: 500M
100ns
0.10
0.02
10
0
30M
1.0V
1.0V
2.0V/DIV
600mV
Figure 20. Receiver Performance with Input Common-Mode Voltage of 25 V
Figure 17. Input Capacitance (A, B) vs. Junction Temperature
QUASI PEAK LEVEL (dBµV/m)
C1
C2
C3
M1
15664-020
–5
PIN VOLTAGE (V)
Figure 18. Radiated Emissions Profile with 120 pF Capacitor to GND1 on the
RxD Pin (Horizontal Scan, Data Rate = 2.5 Mbps, VDD1 = VDD2 = 5.0 V)
Rev. 0 | Page 11 of 17
Figure 21. Short-Circuit Current over Fault Voltage Range
15664-021
0
–55 –40 –25
15664-017
3
Enhanced Product
40
30
25
20
15
10
0
100k
1M
10M
DPI FREQUENCY (Hz)
100M
1G
15664-022
5
RECEIVER OUTPUT (RxD) RISE/FALL TIME (ns)
POWER (dBm)
35
30
25
20
15
10
1G
15664-023
5
100M
Figure 23. DPI IEC 62132-4 Noise Immunity with 100 nF Decoupling on VDD1
POWER (dBm)
25
20
15
10
15664-024
5
1G
0.25
0.50
1.00
2.00
2.50
60
50
FALL TIME
40
RISE TIME
30
20
10
100
1000
Figure 26. Receiver Output (RxD) Rise/Fall Time vs. Load Capacitance
30
100M
0
LOAD CAPACITANCE (pF)
35
10M
DPI FREQUENCY (Hz)
100
10
40
1M
200
0
45
0
100k
300
Figure 25. Receiver Input Differential Voltage (VID) vs. Signaling Rate
40
10M
DPI FREQUENCY (Hz)
400
SIGNALING RATE (Mbps)
45
1M
500
0
Figure 22. DPI IEC 62132-4 Noise Immunity with 100 nF and 10 µF
Decoupling on VDD1
0
100k
600
15664-126
POWER (dBm)
35
700
15664-025
45
RECEIVER INPUT DIFFERENTIAL VOLTAGE (±mV)
ADM2795E-EP
Figure 24. DPI IEC 62132-4 Noise Immunity with 100 nF and Decoupling on VDD2
Rev. 0 | Page 12 of 17
Enhanced Product
ADM2795E-EP
TEST CIRCUITS
VDD2
VOUT
A
VOD
TxD
VOC
15664-026
R
S2
CL
50pF
B
Figure 30. Driver Enable/Disable
375Ω
A
B
VOUT
RE
15664-030
VCM
CL
15664-027
60Ω
S1
DE
Figure 27. Driver Voltage Measurement
VOD3
RL
110Ω
15664-029
R
375Ω
Figure 31. Receiver Propagation Delay
Figure 28. Driver Voltage Measurement over Common-Mode Voltage Range
+1.5V
VDD1
RL
–1.5V
CL2
RE
15664-028
RLDIFF
B
S1
CL1
CL
VOUT
RE IN
Figure 29. Driver Propagation Delay
Figure 32. Receiver Enable/Disable
Rev. 0 | Page 13 of 17
S2
15664-031
A
ADM2795E-EP
Enhanced Product
SWITCHING CHARACTERISTICS
VDD1
VDD1
TxD
0.5VDD1
0V
DE
0.5V DD1
0.5V DD1
0V
tPHL
tPLH
0.5VDD1
tZL
tLZ
B
1/2V OD
VOD
0.5VDD2
A, B
VOL + 0.5V
A
VOL
tSKEW = |tPLH – tPHL|
90% POINT
VOH
90% POINT
A, B
10% POINT
10% POINT
tR
tF
VOH – 0.5V
0.5VDD2
15664-032
VDIFF
–V O
tHZ
0V
15664-034
+VO
tZH
Figure 35. Driver Enable/Disable Timing
Figure 33. Driver Propagation Delay, Rise/Fall Timing
VDD1
RE
0.5V DD1
0.5V DD1
0V
0V
0V
tPLH
tPHL
0.5VDD1
RxD
0.5V DD1
tSKEW = |tPLH – tPHL|
15664-033
0.5V DD1
VOL + 0.5V
OUTPUT LOW
tZH
RxD
tLZ
tZL
RxD
VOL
tHZ
OUTPUT HIGH
0.5VDD1
VOH
VOH – 0.5V
0V
Figure 36. Receiver Enable/Disable Timing
Figure 34. Receiver Propagation Delay
Rev. 0 | Page 14 of 17
15664-035
A, B
Enhanced Product
ADM2795E-EP
THEORY OF OPERATION
Lightning strikes to jet airliners are common, about once every
1000 flight hours. The DO-160G standard, Environmental
Conditions and Test Procedures for Airborne Equipment, is a
standard for the environmental testing of avionics hardware.
Many airplane manufacturers specify DO-160G Section 22,
lightning induced transient susceptibility, as a requirement for
critical systems, like guidance, radars, communications, engine
control, and heat and air controls. Aircraft radome, wing tips,
fin tips, nacelles, and landing gear are areas most likely to be hit
by lightning strikes.
The ADM2795E-EP integrates fully certified DO-160G EMC
protection on the RS-485 bus pins, with Section 22 lightning
protection. The ADM2795E-EP also provides Section 25 ±15 kV
ESD air discharge protection. For Section 22 lightning, the
ADM2795E-EP provides protection against Waveform 3,
Waveform 4/Waveform 1, and Waveform 5A to Level 4 using
33 Ω or 47 Ω current limiting resistors to GND2, or to Level 4
across the isolation barrier to GND1.
CERTIFIED DO-160G EMC PROTECTION
Table 11 details the open circuit voltage (VOC) and short-circuit
current (ISC) as specified in the DO-160G Section 22 lightning
induced transient susceptibility standard for Waveform 3,
Waveform 4/Waveform 1, and Waveform 5A for pin injection
testing. The peak currents for the DO-160G Level 4 tests are
much greater than standard industrial surge IEC 61000-4-5
peak currents. The waveform shape and rise/decay times for the
DO-160G standard are significantly longer than those specified
by the IEC 61000-4-5 standard, as shown in Figure 37. Due to
800
DO-160G SECTION 22
WAVEFORM 5A
700
600
500
400
300
DO-160G SECTION 22
WAVEFORM 1
200
100
0
IEC 61000-4-5 SURGE
0
20
40
60
80
100
120
TIME (µs)
15664-137
The ADM2795E-EP is a 3 V to 5.5 V RS-485 transceiver with
added robustness that reduces system failures when operating
in harsh application environments such as military and aerospace
(MILA) avionics for sensors, actuators, and engine control.
the high amounts of energy associated with the DO-160G
Section 22 lightning standard, the ADM2795E-EP was tested
using external 33 Ω or 47 Ω A pin and B pin bus current
limiting resistors for testing to GND2. These resisters were
required in addition to the ADM2795E-EP integrated EMC
protection circuitry. However, when testing to GND1, no
current limiting resistors are required. The ADM2795E-EP
iCoupler isolation technology protects the device in the
presence of these extreme transients.
CURRENT (A)
RS-485 WITH ADDED DO-160G EMC ROBUSTNESS
Figure 37. DO-160G Section 22 Waveform 1 and Waveform 5A, and IEC61000-4-5
Surge Waveform
DO-160G ADM2795E-EP TEST DETAILS
Figure 38 and Figure 39 show the Waveform 3 test setup
coupling/decoupling network (CDN) and the Waveform 5A,
Waveform 4/Waveform 1 CDN, respectively. For testing to
RS-485 bus side, GND2, an additional 33 Ω or 47 Ω current
limiting resistance is added on both A and B bus pins. DO-160G
Section 22 testing is performed on one pin at a time. The test is
not performed in common mode. Table 12 and Table 13 show a
summary of the ADM2795E-EP certified test results.
Table 11. DO-160G Section 22 Pin Injection Level 4 and Level 3 Compared to IEC 61000-4-5 Lightning Level 4 and Level 3
Level
4
3
DO-160G Waveform 3
1500 V, 60 A
600 V, 24 A
DO-160G Waveform 4/Waveform 1
750 V, 150 A
300 V, 60 A
DO-160G Waveform 5A
750 V, 750 A
300 V, 300 A
IEC 61000-4-5
4000 V, 49 A
2000 V, 24.5 A
Table 12. DO-160G Section 22 Pin Injection Level 4 Certified Test Results
Testing to
GNDx
GND1
GND2
Current Limiting
Resistor
None
47 Ω or 33 Ω
DO-160 Waveform 3;
1500 V, 60 A
Pass
Pass with 47 Ω
DO-160 Waveform 4/ Waveform 1;
750 V, 150 A
Pass
Pass with 33 Ω
DO-160 Waveform 5A;
750 V ,750 A
Pass
Pass with 33 Ω
Table 13. DO-160G Section 22 Pin Injection Level 3 Certified Test Results
Testing to
GNDx
GND1
GND2
Current Limiting
Resistor
None
33 Ω
DO-160 Waveform 3;
600 V, 24 A
Pass
Pass
DO-160 Waveform 4/ Waveform 1;
300 V, 60 A
Pass
Pass
Rev. 0 | Page 15 of 17
DO-160 Waveform 5A;
300 V ,300 A
Pass
Pass
ADM2795E-EP
Enhanced Product
VDD2
VDD1
DIGITAL ISOLATOR
RS-485
TRANSCEIVER
ADM2795E-EP
RxD
CDN
RE
EMC
TRANSIENT
PROTECTION
CIRCUIT
DE
A
B
40µF
TxD
GND2
ISOLATION
BARRIER
15664-043
GND1
GND2
GND1
Figure 38. DO-160G Section 22 Waveform 3 Test Setup CDN
VDD1
DIGITAL ISOLATOR
VDD2
RS-485
TRANSCEIVER
ADM2795E-EP
RxD
CDN
RE
EMC
TRANSIENT
PROTECTION
CIRCUIT
DE
A
B
TRANSORB
GND1
ISOLATION
BARRIER
GND2
GND2
GND1
Figure 39. DO-160G Section 22 Waveform 5A, Waveform 4/Waveform 1 Test Setup CDN
Rev. 0 | Page 16 of 17
15664-044
TxD
Enhanced Product
ADM2795E-EP
OUTLINE DIMENSIONS
10.50 (0.4134)
10.10 (0.3976)
9
16
7.60 (0.2992)
7.40 (0.2913)
8
1.27 (0.0500)
BSC
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10
0.51 (0.0201)
0.31 (0.0122)
10.65 (0.4193)
10.00 (0.3937)
0.75 (0.0295)
45°
0.25 (0.0098)
2.65 (0.1043)
2.35 (0.0925)
SEATING
PLANE
8°
0°
0.33 (0.0130)
0.20 (0.0079)
1.27 (0.0500)
0.40 (0.0157)
COMPLIANT TO JEDEC STANDARDS MS-013-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
03-27-2007-B
1
Figure 40. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-16)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model1
ADM2795ETRWZ-EP
ADM2795ETRWZ-EP-R7
EVAL-ADM2795EEPBZ
1
Temperature
Range
−55°C to +125°C
−55°C to +125°C
Package Description
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Standard Small Outline Package [SOIC_W], 7” Reel
Evaluation Board
Z = RoHS Compliant Part.
©2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D15664-0-7/17(0)
Rev. 0 | Page 17 of 17
Package
Option
RW-16
RW-16
Ordering
Quantity
400
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湘ICP备2023018690号
