Signal and Power Isolated CAN Transceiver
with Integrated Isolated DC-to-DC Converter
ADM3053
Data Sheet
FEATURES
GENERAL DESCRIPTION
2.5 kV rms signal and power isolated CAN transceiver
isoPower integrated isolated dc-to-dc converter
5 V operation on VCC
5 V or 3.3 V operation on VIO
Complies with ISO 11898 standard
High speed data rates of up to 1 Mbps
Unpowered nodes do not disturb the bus
Connect 110 or more nodes on the bus
Slope control for reduced EMI
Thermal shutdown protection
High common-mode transient immunity: >25 kV/μs
Safety and regulatory approvals
UL recognition
2500 V rms for 1 minute per UL 1577
CSA Component Acceptance Notice 5A
VDE Certificate of Conformity
DIN EN 60747-5-2 (VDE 0884 Part 2): 2003-01
VIORM = 560 V peak
Industrial operating temperature range (−40°C to +85°C)
Available in wide-body, 20-lead SOIC package
The ADM3053 is an isolated controller area network (CAN)
physical layer transceiver with an integrated isolated dc-to-dc
converter. The ADM3053 complies with the ISO 11898 standard.
The device employs Analog Devices, Inc., iCoupler® technology
to combine a 2-channel isolator, a CAN transceiver, and Analog
Devices isoPower® dc-to-dc converter into a single SOIC surface
mount package. An on-chip oscillator outputs a pair of square
waveforms that drive an internal transformer to provide isolated
power. The device is powered by a single 5 V supply realizing a
fully isolated CAN solution.
The ADM3053 creates a fully isolated interface between the
CAN protocol controller and the physical layer bus. It is capable
of running at data rates of up to 1 Mbps.
The device has current limiting and thermal shutdown features
to protect against output short circuits. The part is fully specified
over the industrial temperature range and is available in a
20-lead, wide-body SOIC package.
The ADM3053 contains isoPower technology that uses high
frequency switching elements to transfer power through the
transformer. Special care must be taken during printed circuit
board (PCB) layout to meet emissions standards. Refer to the
AN-0971 Application Note, Recommendations for Control of
Radiated Emissions with isoPower Devices, for details on board
layout considerations.
APPLICATIONS
CAN data buses
Industrial field networks
FUNCTIONAL BLOCK DIAGRAM
VCC
isoPower DC-TO-DC CONVERTER
ADM3053
VISOOUT
OSCILLATOR
RECTIFIER
VISOIN
REGULATOR
VIO
VCC
PROTECTION
TxD
RS
DIGITAL ISOLATION iCoupler
RS
ENCODE
TxD
DECODE
DECODE
SLOPE/
STANDBY
RxD
VREF
RxD
DRIVER
ENCODE
CANH
CANL
RECEIVER
REFERENCE
VOLTAGE
CAN TRANSCEIVER
VREF
GND1
LOGIC SIDE
ISOLATION
BARRIER
GND2
PIN 11, PIN 13
GND2
PIN 16, PIN 20
BUS SIDE
09293-001
GND2
Figure 1.
Rev. E
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ADM3053
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Circuit Description......................................................................... 13
Applications ....................................................................................... 1
CAN Transceiver Operation ..................................................... 13
General Description ......................................................................... 1
Signal Isolation ........................................................................... 13
Functional Block Diagram .............................................................. 1
Power Isolation ........................................................................... 13
Revision History ............................................................................... 2
Truth Tables................................................................................. 13
Specifications..................................................................................... 3
Thermal Shutdown .................................................................... 13
Timing Specifications .................................................................. 4
DC Correctness and Magnetic Field Immunity........................... 14
Switching Characteristics ............................................................ 4
Applications Information .............................................................. 15
Regulatory Information ............................................................... 5
PCB Layout ................................................................................. 15
Insulation and Safety-Related Specifications ............................ 5
EMI Considerations ................................................................... 15
VDE 0884 Insulation Characteristics ........................................ 6
RS Pin............................................................................................ 16
Absolute Maximum Ratings............................................................ 7
Insulation Lifetime ..................................................................... 16
ESD Caution .................................................................................. 7
Typical Applications ....................................................................... 17
Pin Configuration and Function Descriptions ............................. 8
Outline Dimensions ....................................................................... 18
Typical Performance Characteristics ............................................. 9
Ordering Guide .......................................................................... 18
Test Circuits ..................................................................................... 12
REVISION HISTORY
12/2017—Rev. D to Rev. E
Changes to Logic Side isoPower Current, Dominant State
Parameter and TxD/RxD Data Rate 1 Mbps Parameter,
Table 1 ................................................................................................ 3
Moved Figure 3 ................................................................................. 4
Change to TJ Junction Temperature, Table 6 ................................ 7
Changes to Figure 28 ...................................................................... 15
7/2017—Rev. C to Rev. D
Moved Figure 1 ................................................................................. 3
Changes to Figure 1 .......................................................................... 3
Change to Tracking Resistance (Comparative Tracking
Index) Parameter, Table 4 ................................................................ 6
Changes to Table 8 ............................................................................ 9
Changes to Power Isolation Section ............................................. 14
Changes to PCB Layout Section and Figure 28 .......................... 16
Added RS Pin Section ..................................................................... 17
Changes to Figure 32 ...................................................................... 18
11/2016—Rev. B to Rev. C
Change to Table 4 ..............................................................................5
Changes to Figure 11 Caption ...................................................... 10
Changes to Ordering Guide .......................................................... 18
2/2013—Rev. A to Rev. B
Changes to Features Section ............................................................1
Changes to Table 3.............................................................................5
Changes to Table 7.............................................................................7
3/2012—Rev. 0 to Rev. A
Changes to Features Section ............................................................1
Changes to Table 3.............................................................................5
Changes to VDE 0884 Insulation Characteristics Section ...........6
Changes to Figure 6 ...........................................................................9
Changes to Figure 11...................................................................... 10
Changes to Applications Information Section ........................... 15
5/2011—Revision 0: Initial Version
Rev. E | Page 2 of 18
Data Sheet
ADM3053
SPECIFICATIONS
All voltages are relative to their respective grounds; 4.5 V ≤ VCC ≤ 5.5 V; 3.0 V ≤ VIO ≤ 5.5 V. All minimum/maximum specifications apply
over the entire recommended operation range, unless otherwise noted. All typical specifications are at TA = 25°C, VCC = 5 V, and VIO = 5 V
unless otherwise noted.
Table 1.
Parameter
SUPPLY CURRENT
Logic Side isoPower Current
Recessive State
Dominant State
TxD/RxD Data Rate 1 Mbps
Logic Side iCoupler Current
TxD/RxD Data Rate 1 Mbps
DRIVER
Logic Inputs
Input Voltage High
Input Voltage Low
CMOS Logic Input Currents
Differential Outputs
Recessive Bus Voltage
CANH Output Voltage
CANL Output Voltage
Differential Output Voltage
Short-Circuit Current, CANH
Symbol
Min
Typ
Max
Unit
Test Conditions/Comments
ICC
ICC
ICC
29
195
139
36
260
200
mA
mA
mA
RL = 60 Ω, RS = low, see Figure 25
RL = 60 Ω, RS = low, see Figure 25
RL = 60 Ω, RS = low, see Figure 25
IIO
1.6
2.5
mA
0.25 VIO
500
V
V
µA
Output recessive
Output dominant
TxD
200
V
V
V
V
mV
mA
mA
mA
TxD = high, RL = ∞, see Figure 22
TxD = low, see Figure 22
TxD = low, see Figure 22
TxD = low, RL = 45 Ω, see Figure 22
TxD = high, RL = ∞, see Figure 22
VCANH = −5 V
VCANH = −36 V
VCANL = 36 V
−7 V < VCANL, VCANH < +12 V, see Figure 23,
CL = 15 pF
−7 V < VCANL, VCANH < +12 V, see Figure 23,
CL = 15 pF
See Figure 3
VIH
VIL
IIH, IIL
0.7 VIO
VCANL, VCANH
VCANH
VCANL
VOD
VOD
ISCCANH
2.0
2.75
0.5
1.5
−500
3.0
4.5
2.0
3.0
+50
−200
−100
Short-Circuit Current, CANL
RECEIVER
Differential Inputs
Differential Input Voltage Recessive
ISCCANL
VIDR
−1.0
+0.5
V
Differential Input Voltage Dominant
VIDD
0.9
5.0
V
Input Voltage Hysteresis
CANH, CANL Input Resistance
Differential Input Resistance
Logic Outputs
Output Low Voltage
Output High Voltage
Short Circuit Current
VOLTAGE REFERENCE
Reference Output Voltage
COMMON-MODE TRANSIENT IMMUNITY 1
SLOPE CONTROL
Current for Slope Control Mode
Slope Control Mode Voltage
VHYS
RIN
RDIFF
5
20
25
100
mV
kΩ
kΩ
VOL
VOH
IOS
VIO − 0.3
7
1
150
0.2
VIO − 0.2
0.4
85
V
V
mA
IOUT = 1.5 mA
IOUT = −1.5 mA
VOUT = GND1 or VIO
|IREF = 50 µA|
VCM = 1 kV, transient magnitude = 800 V
VREF
2.025
25
3.025
V
kV/µs
ISLOPE
VSLOPE
−10
1.8
−200
3.3
µA
V
CM is the maximum common-mode voltage slew rate that can be sustained while maintaining specification compliant operation. VCM is the common-mode potential
difference between the logic and bus sides. The transient magnitude is the range over which the common mode is slewed. The common-mode voltage slew rates
apply to both rising and falling common-mode voltage edges.
Rev. E | Page 3 of 18
ADM3053
Data Sheet
TIMING SPECIFICATIONS
All voltages are relative to their respective ground; 3.0 V ≤ VIO ≤ 5.5 V; 4.5 V ≤ VCC ≤ 5.5 V. TA = −40°C to +85°C, unless otherwise noted.
Table 2.
Parameter
DRIVER
Maximum Data Rate
Propagation Delay from TxD On to Bus Active
Symbol
Max
Unit
tonTxD
90
Mbps
ns
Propagation Delay from TxD Off to Bus Inactive
toffTxD
120
ns
RECEIVER
Propagation Delay from TxD On to Receiver Active
tonRxD
200
630
250
480
ns
ns
ns
ns
V/µs
Typ
1
Propagation Delay from TxD Off to Receiver Inactive 1
toffRxD
CANH, CANL SLEW RATE
1
Min
|SR|
7
Test Conditions/Comments
RS = 0 Ω; see Figure 2 and Figure 24
RL = 60 Ω, CL = 100 pF
RS = 0 Ω; see Figure 2 and Figure 24
RL = 60 Ω, CL = 100 pF
RS = 0 Ω; see Figure 2
RS = 47 kΩ; see Figure 2
RS = 0 Ω; see Figure 2
RS = 47 kΩ; see Figure 2
RS = 47 kΩ
Guaranteed by design and characterization.
SWITCHING CHARACTERISTICS
VIO
0.7VIO
VTxD
0.25VIO
0V
VOD
VDIFF = VCANH – VCANL
VDIFF
0.9V
0.5V
VOR
toffTxD
tonTxD
VIO
VIO – 0.3V
VRxD
tonRxD
0V
09293-002
0.4V
toffRxD
Figure 2. Driver Propagation Delay, Rise/Fall Timing
VRxD
HIGH
LOW
0.9
0.5
Figure 3. Receiver Input Hysteresis
Rev. E | Page 4 of 18
VID (V)
09293-004
VHYS
Data Sheet
ADM3053
REGULATORY INFORMATION
Table 3. ADM3053 Approvals
Organization
UL
VDE
CSA
Approval Type
Recognized under the Component Recognition
Program of Underwriters Laboratories, Inc.
Certified according to DIN EN 60747-5-2 (VDE
0884 Part 2): 2003-01.
Approved under CSA Component Acceptance
Notice 5A. Testing was conducted per CSA
60950-1-07 and IEC 60950-1, 2nd Edition at
2.5 kV rated voltage.
Testing was conducted per CSA 61010-1-04
and IEC 61010-1 2nd Edition at 2.5 kV rated
voltage.
Notes
In accordance with UL 1577, each ADM3053 is proof tested by applying
an insulation test voltage ≥2500 V rms for 1 second. File E214100.
In accordance with VDE 0884-2. File 2471900-4880-0001.
Basic insulation at 760 V rms (1074 V peak) working voltage. Reinforced
insulation at 380 V rms (537 V peak) working voltage.
Basic insulation at 424 V rms (600 V peak) working voltage. Reinforced
insulation at 300 V rms (424 V peak) working voltage.
File 205078.
INSULATION AND SAFETY-RELATED SPECIFICATIONS
Table 4.
Parameter
Rated Dielectric Insulation Voltage
Minimum External Air Gap (Clearance)
Minimum External Tracking (Creepage)
Minimum Internal Gap (Internal
Clearance)
Tracking Resistance (Comparative
Tracking Index)
Isolation Group
Symbol
L(I01)
Value
2500
7.7
Unit
V rms
mm
L(I02)
7.6
mm
0.017 min
mm
Test Conditions/Comments
1-minute duration
Measured from input terminals to output terminals,
shortest distance through air
Measured from input terminals to output terminals,
shortest distance along body
Insulation distance through insulation
>400
V
DIN IEC 112/VDE 0303-1
CTI
II
Material group (DIN VDE 0110: 1989-01, Table 1)
Rev. E | Page 5 of 18
ADM3053
Data Sheet
VDE 0884 INSULATION CHARACTERISTICS
This isolator is suitable for basic electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured by
means of protective circuits.
Table 5.
Description
CLASSIFICATIONS
Installation Classification per DIN VDE 0110 for Rated
Mains Voltage
≤150 V rms
≤300 V rms
≤400 V rms
Climatic Classification
Pollution Degree
VOLTAGE
Maximum Working Insulation Voltage
Input-to-Output Test Voltage
Method b1
Highest Allowable Overvoltage
SAFETY-LIMITING VALUES
Case Temperature
Input Current
Output Current
Insulation Resistance at TS
Test Conditions/Comments
Symbol
VIORM
VPR
VIO = 500 V
Rev. E | Page 6 of 18
Unit
I to IV
I to III
I to II
40/85/21
2
DIN VDE 0110, see Table 3
VIORM × 1.875 = VPR, 100% production tested,
tm = 1 sec, partial discharge < 5 pC
(Transient overvoltage, tTR = 10 sec)
Maximum value allowed in the event of a
failure
Characteristic
560
VPEAK
1050
VPEAK
VTR
4000
VPEAK
TS
IS, INPUT
IS, OUTPUT
RS
150
265
335
>109
°C
mA
mA
Ω
Data Sheet
ADM3053
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. All voltages are relative to
their respective ground.
Table 6.
Parameter
VCC
VIO
Digital Input Voltage, TxD
Digital Output Voltage, RxD
CANH, CANL
VREF
RS
Operating Temperature Range
Storage Temperature Range
ESD (Human Body Model)
Lead Temperature
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
θJA Thermal Impedance
TJ Junction Temperature
Rating
−0.5 V to +6 V
−0.5 V to +6 V
−0.5 V to VIO + 0.5 V
−0.5 V to VIO + 0.5 V
−36 V to +36 V
−0.5 V to +6 V
−0.5 V to +6 V
−40°C to +85°C
−55°C to +150°C
3 kV
Table 7. Maximum Continuous Working Voltage1
Parameter
AC Voltage
Bipolar Waveform
Unipolar Waveform
Basic Insulation
Reinforced Insulation
DC Voltage
Basic Insulation
Reinforced Insulation
300°C
215°C
220°C
53°C/W
150°C
1
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Max
Unit
Reference Standard
424
V peak
50 year minimum
lifetime
1074
V peak
537
V peak
Maximum approved
working voltage per
IEC60950-1
Maximum approved
working voltage per
IEC60950-1
1074
V peak
537
V peak
Maximum approved
working voltage per
IEC60950-1
Maximum approved
working voltage per
IEC60950-1
Refers to continuous voltage magnitude imposed across the isolation
barrier. See the Insulation Lifetime section for more details.
ESD CAUTION
Rev. E | Page 7 of 18
ADM3053
Data Sheet
GND1 1
20
GND2
NC 2
19
VISOIN
GND1 3
18
RS
RxD 4
17
CANH
16
GND2
TxD 5
ADM3053
TOP VIEW
(Not to Scale)
15
CANL
GND1 7
14
VREF
VCC 8
13
GND2
GND1 9
12
VISOOUT
GND1 10
11
GND2
VIO 6
NOTES
1. NC = NO CONNECT. DO NOT
CONNECT TO THIS PIN.
2. PIN 12 AND PIN 19 MUST BE
CONNECTED EXTERNALLY.
09293-005
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 4. Pin Configuration
Table 8. Pin Function Descriptions
Pin No.
1, 3, 7, 9, 10
2
4
5
6
Mnemonic
GND1
NC
RxD
TxD
VIO
8
VCC
11, 13
GND2
12
VISOOUT
14
15
16, 20
17
18
VREF
CANL
GND2
CANH
RS
19
VISOIN
Description
Ground, Logic Side.
No Connect. Do not connect to this pin.
Receiver Output Data.
Driver Input Data.
iCoupler Power Supply. It is recommended that a 0.1 μF and a 0.01 μF decoupling capacitor be fitted
between Pin 6 and GND1. See Figure 28 for layout recommendations.
isoPower Power Supply. It is recommended that a 0.1 μF and a 10 μF decoupling capacitor be fitted
between Pin 8 and Pin 9.
Ground for Isolated DC-to-DC Converter. It is recommended to connect Pin 11 and Pin 13 together through
one ferrite bead to the PCB ground.
Isolated Power Supply Output. This pin must be connected externally to VISOIN. It is recommended that a ferrite
bead reservoir capacitor of 10 μF and a decoupling capacitor of 0.1 μF be fitted between Pin 12 and Pin 11.
Reference Voltage Output. It is recommended not to connect to this pin.
Low-Level CAN Voltage Input/Output.
Ground, Bus Side.
High-Level CAN Voltage Input/Output.
Slope Control Pin. Short this pin to GND2 (Pin 16 or Pin 20) for full speed operation. Use a weak pull-down for
slope control. An input high places the transceiver in standby. This pin must not be left floating.
Isolated Power Supply Input. This pin must be connected externally to VISOOUT. It is recommended this pin
have a 0.1 μF capacitor to GND2 (Pin13 or Pin 11). Connect this pin through a ferrite bead and short trace
length to VISOIN for operation.
Rev. E | Page 8 of 18
Data Sheet
ADM3053
TYPICAL PERFORMANCE CHARACTERISTICS
180
VCC = 5V, VIO = 5V
80
60
40
0
100
1000
DATA RATE (kbps)
165
160
VCC = 5V, VIO = 5V
155
PROPAGATION DELAY TxD ON TO BUS ACTIVE,
tonTxD (ns)
45
SLEW RATE (V/µs)
40
35
30
25
20
15
10
20
30
40
50
60
70
80
RESISTANCE, RS (kΩ)
09293-101
5
10
60
85
85
53
52
51
VCC = 5V, VIO = 3.3V
50
49
VCC = 5V, VIO = 5V
48
47
–40
–15
10
35
60
TEMPERATURE (°C)
96
PROPAGATION DELAY TxD OFF TO BUS
INACTIVE, toffTxD (ns)
5.5
4.5
3.5
2.5
VIO = 5V
VIO = 3.3V
0.5
100
1000
DATA RATE (kbps)
Figure 7. Supply Current, IIO vs. Data Rate
94
92
VCC = 5V, VIO = 3.3V
90
88
86
VCC = 5V, VIO = 5V
84
82
80
78
–40
09293-102
SUPPLY CURRENT, IIO (mA)
35
Figure 9. Propagation Delay from TxD On to Bus Active vs. Temperature
Figure 6. Driver Slew Rate vs. Resistance, RS
1.5
10
Figure 8. Receiver Input Hysteresis vs. Temperature
50
0
–15
TEMPERATURE (°C)
Figure 5. Supply Current, ICC vs. Data Rate
0
VCC = 5V, VIO = 3.3V
150
–40
09293-100
20
170
09293-103
VCC = 5.5V, VIO = 5V
100
175
09293-104
VCC = 4.5V, VIO = 5V
120
–15
10
35
TEMPERATURE (°C)
60
85
09293-105
SUPPLY CURRENT, ICC (mA)
140
RECEIVER INPUT HYSTERESIS (mV)
160
Figure 10. Propagation Delay from TxD Off to Bus Inactive vs. Temperature
Rev. E | Page 9 of 18
ADM3053
Data Sheet
VCC = 5V, VIO = 3.3V, RS = 0Ω
144
142
140
VCC = 5V, VIO = 5V, RS = 0Ω
138
136
134
–40
–15
10
35
60
85
TEMPERATURE (°C)
DIFFERENTIAL OUTPUT VOLTAGE DOMINANT,
VOD (V)
VCC = 5V, VIO = 3.3V, RS = 47kΩ
VCC = 5V, VIO = 5V, RS = 47kΩ
400
300
200
100
0
–40
–15
10
35
60
85
TEMPERATURE (°C)
DIFFERENTIAL OUTPUT VOLTAGE DOMINANT,
VOD (V)
200
VCC = 5V, VIO = 5V, RS = 0Ω
100
50
10
35
60
85
TEMPERATURE (°C)
Figure 13. Propagation Delay from TxD Off to Receiver Inactive vs.
Temperature
09293-108
PROPAGATION DELAY TxD OFF TO RECEIVER
INACTIVE, toffRxD (ns)
VCC = 5V, VIO = 3.3V, RS = 0Ω
–15
VCC = 5V, VIO = 3.3V, RS = 47kΩ
300
295
290
285
280
275
–40
VCC = 5V, VIO = 5V, RS = 47kΩ
–15
10
35
60
85
2.55
2.50
2.45
VCC
VCC
VCC
VCC
2.40
= 5V,
= 5V,
= 5V,
= 5V,
VIO = 5V, RL = 60Ω
VIO = 3.3V, RL = 60Ω
VIO = 5V, RL = 45Ω
VIO = 3.3V, RL = 45Ω
2.35
2.30
2.25
–40
–15
10
35
60
85
Figure 15. Differential Output Voltage Dominant vs. Temperature
250
0
–40
305
TEMPERATURE (°C)
Figure 12. Propagation Delay from TxD On to Receiver Active vs.
Temperature
150
310
Figure 14. Propagation Delay from TxD Off to Receiver Inactive vs.
Temperature
09293-107
PROPAGATION DELAY TxD ON TO RECEIVER
ACTIVE, tonRxD (ns)
500
315
TEMPERATURE (°C)
Figure 11. Propagation Delay from TxD On to Receiver Active vs.
Temperature
600
320
09293-110
146
325
2.55
VIO = 5V, TA = 25°C, RL = 60Ω
2.50
2.45
2.40
2.35
VIO = 5V, TA = 25°C, RL = 45Ω
2.30
2.25
4.5
4.7
4.9
5.1
SUPPLY VOLTAGE, VCC (V)
5.3
5.5
09293-111
148
330
09293-109
PROPAGATION DELAY TxD OFF TO RECEIVER
INACTIVE, toffRxD (ns)
150
09293-106
PROPAGATION DELAY TxD ON TO RECEIVER
ACTIVE, tonRxD (ns)
152
Figure 16. Differential Output Voltage Dominant vs. Supply Voltage, VCC
Rev. E | Page 10 of 18
Data Sheet
ADM3053
2.80
VCC = 5V, VIO = 5V, IREF = +50µA
2.70
VCC = 5V, VIO =5V, IREF = +5µA
2.65
VCC = 5V, VIO = 5V, IREF = –5µA
2.60
VCC = 5V, VIO = 5V, IREF = –50µA
2.55
2.50
2.40
–40
–15
10
35
60
85
TEMPERATURE (°C)
RECEIVER OUTPUT LOW VOLTAGE, VOL (mV)
SUPPLY CURRENT, ICC (mA)
120
100
80
60
40
10
35
85
60
TEMPERATURE (°C)
09293-113
20
Figure 18. Supply Current ICC vs. Temperature
140
134
132
130
128
126
124
122
120
4.8
4.9
5.0
5.1
5.2
5.3
5.4
SUPPLY VOLTAGE, VCC (V)
5.5
09293-114
SUPPLY CURRENT, ICC (mA)
136
4.7
4.865
4.860
–15
10
35
60
85
85
100
80
60
40
20
0
–40
–15
10
35
60
TEMPERATURE (°C)
Figure 21. Receiver Output Low Voltage vs. Temperature
VIO = 5V
TA = 25°C
DATA RATE = 1Mbps
138
4.6
4.870
120
VCC = 5V
VIO = 5V
140 DATA RATE = 1Mbps
RL = 60Ω
118
4.5
4.875
Figure 20. Receiver Output High Voltage vs. Temperature
160
–15
VCC = 5V, VIO = 5V, IOUT = –1.5mA
4.880
TEMPERATURE (°C)
Figure 17. Reference Voltage vs. Temperature
0
–40
4.885
4.855
–40
09293-112
2.45
4.890
09293-115
REFERENCE VOLTAGE, VREF (V)
2.75
09293-116
RECEIVER OUTPUT HIGH VOLTAGE, VOH (V)
4.895
Figure 19. Supply Current, ICC vs. Supply Voltage VCC
Rev. E | Page 11 of 18
ADM3053
Data Sheet
TEST CIRCUITS
VOD
VCANH
RL
2
TxD
RL
VOC
CL
CANL
09293-006
VCANH
RxD
09293-008
TxD
CANH
RL
2
15pF
Figure 22. Driver Voltage Measurement
Figure 24. Switching Characteristics Measurements
VID
RxD
CL
CANL
09293-007
CANH
Figure 23. Receiver Voltage Measurements
100nF
10µF
100nF
10µF
VCC
VISOOUT
isoPower DC-TO-DC CONVERTER
OSCILLATOR
RECTIFIER
REGULATOR
VIO
10µF
10µF
100nF
VCC
DIGITAL ISOLATION iCoupler
PROTECTION
TxD
ENCODE
TxD
RS
DECODE
RxD
CANH
RL
CANL
RECEIVER
REFERENCE
VOLTAGE
CAN TRANSCEIVER
ADM3053
LOGIC SIDE
RS
DRIVER
SLOPE/
STANDBY
RxD
ENCODE
VREF
GND1
RS
DECODE
VREF
GND2
ISOLATION
BARRIER
GND2
BUS SIDE
Figure 25. Supply Current Measurement Test Circuit
Rev. E | Page 12 of 18
09293-009
100nF
VISOIN
Data Sheet
ADM3053
CIRCUIT DESCRIPTION
CAN TRANSCEIVER OPERATION
A CAN bus has two states called dominant and recessive. A
dominant state is present on the bus when the differential voltage
between CANH and CANL is greater than 0.9 V. A recessive state
is present on the bus when the differential voltage between CANH
and CANL is less than 0.5 V. During a dominant bus state, the
CANH pin is high, and the CANL pin is low. During a recessive
bus state, both the CANH and CANL pins are in the high
impedance state.
Pin 18 (RS) allows two different modes of operation to be selected:
high-speed and slope control. For high-speed operation, the
transmitter output transistors are simply switched on and off as
fast as possible. In this mode, no measures are taken to limit the
rise and fall slopes. A shielded cable is recommended to avoid
electromagnetic interference (EMI) problems. High-speed mode
is selected by connecting Pin 18 to ground.
Slope control mode allows the use of an unshielded twisted pair
or a parallel pair of wires as bus lines. To reduce EMI, the rise
and fall slopes must be limited. The rise and fall slopes can be
programmed with a resistor connected from Pin 18 to ground.
The slope is proportional to the current output at Pin 18.
SIGNAL ISOLATION
The ADM3053 signal isolation is implemented on the logic side of
the interface. The part achieves signal isolation by having a digital
isolation section and a transceiver section (see Figure 1). Data
applied to the TxD pin referenced to logic ground (GND1) are
coupled across an isolation barrier to appear at the transceiver
section referenced to isolated ground (GND2). Similarly, the singleended receiver output signal, referenced to isolated ground in
the transceiver section, is coupled across the isolation barrier to
appear at the RxD pin referenced to logic ground (GND1). The
signal isolation is powered by the VIO pin and allows the digital
interface to 3.3 V or 5 V logic.
POWER ISOLATION
The ADM3053 power isolation is implemented using an isoPower
integrated isolated dc-to-dc converter. The dc-to-dc converter
section of the ADM3053 works on principles that are common to
most modern power supplies. It is a secondary side controller
architecture with isolated pulse-width modulation (PWM)
feedback. VCC power is supplied to an oscillating circuit that
switches current into a chip-scale air core transformer. Power
transferred to the secondary side is rectified and regulated to 5 V.
The secondary (VISO) side controller regulates the output by
creating a PWM control signal that is sent to the primary (VCC)
side by a dedicated iCoupler data channel. The PWM modulates
the oscillator circuit to control the power being sent to the
secondary side. Feedback allows for significantly higher power
and efficiency.
The ADM3053 integrated dc-to-dc converter is designed as a
self contained solution and must not drive an external load. To
meet additional isolated power needs, isoPower isolated dc-todc converters are available in a variety of power or power plus
standard data channel options.
TRUTH TABLES
The truth tables in this section use the abbreviations found in
Table 9.
Table 9. Truth Table Abbreviations
Letter
H
L
X
Z
I
NC
Description
High level
Low level
Don’t care
High impedance (off )
Indeterminate
Not connected
Table 10. Transmitting
Supply Status
VIO
VCC
On
On
On
On
On
On
Off
On
On
Off
Input
TxD
L
H
Floating
X
L
Outputs
Bus State
CANH
Dominant
H
Recessive
Z
Recessive
Z
Recessive
Z
Indeterminate
I
CANL
L
Z
Z
Z
I
Table 11. Receiving
Supply Status
VIO
VCC
On
On
On
On
On
On
On
On
Off
On
On
Off
1
Inputs
VID = CANH − CANL
≥ 0.9 V
≤ 0.5 V
0.5 V < VID < 0.9 V
Inputs open
X1
X1
Bus State
Dominant
Recessive
X1
Recessive
X1
X1
Output
RxD
L
H
I
H
I
H
X means don’t care.
THERMAL SHUTDOWN
The ADM3053 contains thermal shutdown circuitry that protects
the part from excessive power dissipation during fault conditions.
Shorting the driver outputs to a low impedance source can result in
high driver currents. The thermal sensing circuitry detects the
increase in die temperature under this condition and disables the
driver outputs. This circuitry is designed to disable the driver
outputs when a die temperature of 150°C is reached. As the
device cools, the drivers are reenabled at a temperature of 140°C.
Rev. E | Page 13 of 18
ADM3053
Data Sheet
This situation must occur in the ADM3053 devices only during
power-up and power-down operations. The limitation on the
ADM3053 magnetic field immunity is set by the condition in
which induced voltage in the transformer receiving coil is
sufficiently large to either falsely set or reset the decoder. The
following analysis defines the conditions under which this
can occur.
The 3.3 V operating condition of the ADM3053 is examined
because it represents the most susceptible mode of operation. The
pulses at the transformer output have an amplitude of >1.0 V. The
decoder has a sensing threshold of about 0.5 V, thus establishing a
0.5 V margin in which induced voltages can be tolerated. The
voltage induced across the receiving coil is given by
V = (−dβ/dt)Σπrn2; n = 1, 2, … , N
where:
β is magnetic flux density (gauss).
N is the number of turns in the receiving coil.
rn is the radius of the nth turn in the receiving coil (cm).
Given the geometry of the receiving coil in the ADM3053 and
an imposed requirement that the induced voltage be, at most,
50% of the 0.5 V margin at the decoder, a maximum allowable
magnetic field is calculated as shown in Figure 26.
1
0.1
0.01
0.001
1k
10k
100k
1M
10M
MAGNETIC FIELD FREQUENCY (Hz)
100M
09293-010
Positive and negative logic transitions at the isolator input cause
narrow (~1 ns) pulses to be sent to the decoder via the transformer.
The decoder is bistable and is, therefore, either set or reset by the
pulses, indicating input logic transitions. In the absence of logic
transitions at the input for more than 1 µs, periodic sets of refresh
pulses indicative of the correct input state are sent to ensure dc
correctness at the output. If the decoder receives no internal pulses
of more than approximately 5 μs, the input side is assumed to be
unpowered or nonfunctional, in which case, the isolator output
is forced to a default state by the watchdog timer circuit.
10
Figure 26. Maximum Allowable External Magnetic Flux Density
For example, at a magnetic field frequency of 1 MHz, the
maximum allowable magnetic field of 0.2 kgauss induces a voltage
of 0.25 V at the receiving coil. This is about 50% of the sensing
threshold and does not cause a faulty output transition. Similarly,
if such an event occurs during a transmitted pulse (and is of the
worst-case polarity), it reduces the received pulse from >1.0 V to
0.75 V, which is still well above the 0.5 V sensing threshold of
the decoder.
The preceding magnetic flux density values correspond to
specific current magnitudes at given distances from the
ADM3053 transformers. Figure 27 expresses these allowable
current magnitudes as a function of frequency for selected
distances. As shown in Figure 27, the ADM3053 is extremely
immune and can be affected only by extremely large currents
operated at high frequency very close to the component. For the
1 MHz example, a 0.5 kA current must be placed 5 mm away from
the ADM3053 to affect component operation.
1k
DISTANCE = 1m
100
10
DISTANCE = 100mm
1
DISTANCE = 5mm
0.1
0.01
1k
10k
100k
1M
10M
MAGNETIC FIELD FREQUENCY (Hz)
100M
09293-011
Digital inputs are encoded into waveforms that are capable of
exciting the primary transformer winding. At the secondary
winding, the induced waveforms are decoded into the binary
value that was originally transmitted.
MAXIMUM ALLOWABLE MAGNETIC FLUX
DENSITY (kgauss)
The digital signals transmit across the isolation barrier using
iCoupler technology. This technique uses chip-scale transformer
windings to couple the digital signals magnetically from one
side of the barrier to the other.
100
MAXIMUM ALLOWABLE CURRENT (kA)
DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY
Figure 27. Maximum Allowable Current for Various Current-to-ADM3053
Spacings
Note that in combinations of strong magnetic field and high
frequency, any loops formed by the printed circuit board (PCB)
traces can induce error voltages sufficiently large to trigger the
thresholds of succeeding circuitry. Proceed with caution in the
layout of such traces to prevent this from occurring.
Rev. E | Page 14 of 18
Data Sheet
ADM3053
APPLICATIONS INFORMATION
ADM3053
The ADM3053 signal and power isolated CAN transceiver contains
an isoPower integrated dc-to-dc converter, requiring no external
interface circuitry for the logic interfaces. Power supply bypassing
is required at the input and output supply pins (see Figure 28).
The power supply section of the ADM3053 uses a 180 MHz
oscillator frequency to pass power efficiently through its chipscale transformers. In addition, the normal operation of the
data section of the iCoupler introduces switching transients on
the power supply pins.
Bypass capacitors are required for several operating frequencies.
Noise suppression requires a low inductance, high frequency
capacitor, whereas ripple suppression and proper regulation
require a large value capacitor. These capacitors are connected
between GND1 and Pin 6 (VIO) for VIO. It is recommended that
a combination of 100 nF and 10 nF be placed as shown in Figure 28
(C6 and C4). It is recommended that a combination of two
capacitors, with values of 100 nF and 10 µF, are placed between
Pin 8 (VCC) and Pin 9 (GND1) for VCC as shown in Figure 28 (C2
and C1). The VISOIN and VISOOUT capacitors are connected between
Pin 11 (GND2) and Pin 12 (VISOOUT) with recommended values
of 100 nF and 10 µF as shown in Figure 28 (C5 and C8). Two
capacitors are recommended to be fitted Pin 19 (VISOIN) and Pin 20
(GND2) with values of 100nF and 10nF as shown in Figure 28
(C9 and C7). The best practice recommended is to use a very low
inductance ceramic capacitor, or its equivalent, for the smaller
value. The total lead length between both ends of the capacitor
and the input power supply pin must not exceed 10 mm.
The ADM3053 features an internal split paddle, lead frame on the
bus side. For the best noise suppression, filter both the GND2
pins (Pin 11 and Pin13) and VISOOUT signals of the integrated dcto-dc converter for high frequency currents. Use surface-mount
ferrite beads in series with the signals before routing back to the
device. See Figure 28 for the recommended PCB layout.
The impedance of the ferrite bead is chosen to be about 2 kΩ
between the 100 MHz and 1 GHz frequency range, to reduce
the emissions at the 180 MHz primary switching frequency and
the 360 MHz secondary side rectifying frequency and
harmonics.
0.1µF 0.01µF
10µF 0.1µF
1
GND1
GND2 20
VISOIN 19
2
NC
3
GND1
4
RxD
CANH 17
5
TxD
GND2 16
6
VIO
CANL 15
7
GND1
8
VCC
0.01µF 0.1µF
RS 18
VREF 14
GND2 13
9
GND1
VISOOUT 12
10
GND1
GND2 11
0.1µF
10µF
FERRITES
09293-028
PCB LAYOUT
Figure 28. Recommended PCB Layout
In applications involving high common-mode transients, ensure
that board coupling across the isolation barrier is minimized.
Furthermore, design the board layout such that any coupling
that does occur equally affects all pins on a given component side.
Failure to ensure this can cause voltage differentials between pins
exceeding the absolute maximum ratings for the device, thereby
leading to latch-up and/or permanent damage.
The ADM3053 dissipates approximately 650 mW of power when
fully loaded. Because it is not possible to apply a heat sink to an
isolation device, the devices primarily depend on heat dissipation
into the PCB through the GND pins. If the devices are used at
high ambient temperatures, provide a thermal path from the GND
pins to the PCB ground plane. The board layout in Figure 28 shows
enlarged pads for Pin 1, Pin 3, Pin 9, Pin 10, Pin 11, Pin 14, Pin 16,
and Pin 20. Implement multiple vias from the pad to the ground
plane to reduce the temperature inside the chip significantly. The
dimensions of the expanded pads are at the discretion of the
designer and dependent on the available board space.
EMI CONSIDERATIONS
The dc-to-dc converter section of the ADM3053 must, of necessity,
operate at very high frequency to allow efficient power transfer
through the small transformers. This creates high frequency
currents that can propagate in circuit board ground and power
planes, causing edge and dipole radiation. Grounded enclosures
are recommended for applications that use these devices. If
grounded enclosures are not possible, good RF design practices
must be followed in the layout of the PCB. See the AN-0971
Application Note, Recommendations for Control of Radiated
Emissions with isoPower Devices, for more information.
Rev. E | Page 15 of 18
ADM3053
Data Sheet
RS PIN
For high speed mode, the RS pin is connected directly to GND2
(Pin 16 or Pin 20). The transition time of the CAN bus signals
are short as possible, allowing higher speed signaling. A shielded
cable is recommended to avoid EMI problems in high speed mode.
Slope control mode allows the use of unshielded twisted pair
wires or parallel pair wires as bus lines. The signal rise and fall
transition times are slowed to reduce EMI and ringing. The rise
and fall slopes are adjusted with the resistor (RSLOPE) connected
from RS to GND2. See Figure 6 for details.
The RS pin cannot be left floating.
Bipolar ac voltage is the most stringent environment. A 50 year
operating lifetime under the bipolar ac condition determines
the Analog Devices recommended maximum working voltage.
In the case of unipolar ac or dc voltage, the stress on the insulation
is significantly lower. This allows operation at higher working
voltages while still achieving a 50 year service life. The working
voltages listed in Table 5 can be applied while maintaining the
50 year minimum lifetime, provided the voltage conforms to either
the unipolar ac or dc voltage cases. Any cross insulation voltage
waveform that does not conform to Figure 30 or Figure 31 must
be treated as a bipolar ac waveform, and its peak voltage must
be limited to the 50-year lifetime voltage value listed in Table 5.
INSULATION LIFETIME
The insulation lifetime of the ADM3053 depends on the voltage
waveform type imposed across the isolation barrier. The iCoupler
insulation structure degrades at different rates, depending on
whether the waveform is bipolar ac, unipolar ac, or dc. Figure 29,
Figure 30, and Figure 31 illustrate these different isolation voltage
waveforms.
Rev. E | Page 16 of 18
Figure 29. Bipolar AC Waveform
RATED PEAK VOLTAGE
0V
Figure 30. DC Waveform
RATED PEAK VOLTAGE
0V
NOTES
1. THE VOLTAGE IS SHOWN AS SINUSODIAL FOR ILLUSTRATION
PURPOSES ONLY. IT IS MEANT TO REPRESENT ANY VOLTAGE
WAVEFORM VARYING BETWEEN 0 AND SOME LIMITING VALUE.
THE LIMITING VALUE CAN BE POSITIVE OR NEGATIVE, BUT THE
VOLTAGE CANNOT CROSS 0V.
Figure 31. Unipolar AC Waveform
09293-015
Accelerated life testing is performed using voltage levels higher
than the rated continuous working voltage. Acceleration factors for
several operating conditions are determined, allowing calculation
of the time to failure at the working voltage of interest. The values
shown in Table 5 summarize the peak voltages for 50 years of
service life in several operating conditions. In many cases, the
working voltage approved by agency testing is higher than the 50
year service life voltage. Operation at working voltages higher than
the service life voltage listed leads to premature insulation failure.
0V
09293-014
All insulation structures eventually break down when subjected to
voltage stress over a sufficiently long period. The rate of insulation
degradation is dependent on the characteristics of the voltage
waveform applied across the insulation. Analog Devices conducts
an extensive set of evaluations to determine the lifetime of the
insulation structure within the ADM3053.
09293-013
RATED PEAK VOLTAGE
Data Sheet
ADM3053
TYPICAL APPLICATIONS
Figure 32 is an example circuit diagram using the ADM3053.
5V
SUPPLY
100nF
10µF
100nF
VCC
10µF
GND2
PIN 11, PIN 13
VISOOUT
isoPowerDC-TO-DC CONVERTER
OSCILLATOR
RECTIFIER
3.3V/5V
SUPPLY
REGULATOR
VIO
10nF
VISOIN
100nF
100nF
10nF
VCC
DIGITAL ISOLATION iCoupler
ENCODE
DECODE
ENCODE
RT
CANL
RECEIVER
REFERENCE
VOLTAGE
CAN TRANSCEIVER
ADM3053
LOGIC SIDE
CANH
CANH
RxD
VREF
GND1
RS
DRIVER
SLOPE/
STANDBY
VREF
CANL
BUS
CONNECTOR
GND2
GND2
PIN 16, PIN 20
ISOLATION
BARRIER
BUS SIDE
Figure 32. Example Circuit Diagram Using the ADM3053
Rev. E | Page 17 of 18
09293-016
RxD
RS
DECODE
RS
CAN
CONTROLLER
PROTECTION
TxD
TxD
ADM3053
Data Sheet
OUTLINE DIMENSIONS
13.00 (0.5118)
12.60 (0.4961)
11
20
7.60 (0.2992)
7.40 (0.2913)
10
2.65 (0.1043)
2.35 (0.0925)
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10
10.65 (0.4193)
10.00 (0.3937)
1.27
(0.0500)
BSC
0.51 (0.0201)
0.31 (0.0122)
SEATING
PLANE
0.75 (0.0295)
45°
0.25 (0.0098)
8°
0°
0.33 (0.0130)
0.20 (0.0079)
COMPLIANT TO JEDEC STANDARDS MS-013-AC
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
1.27 (0.0500)
0.40 (0.0157)
06-07-2006-A
1
Figure 33. 20-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-20)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model 1
ADM3053BRWZ
ADM3053BRWZ-REEL7
EVAL-ADM3053EBZ
EZLINX-IIIDE-EBZ
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
20-Lead Standard Small Outline Package [SOIC_W]
20-Lead Standard Small Outline Package [SOIC_W]
Evaluation Board
iCoupler Isolated Interface Development Environment Evaluation Board
Z = RoHS Compliant Part.
©2011–2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09293-0-12/17(E)
Rev. E | Page 18 of 18
Package
Option
RW-20
RW-20
