FEATURES
FUNCTIONAL BLOCK DIAGRAM
TIA/EIA RS-485 compliant over full supply range
3.0 V to 5.5 V operating voltage range on VCC
ESD protection on the bus pins
IEC 61000-4-2 ≥ ±12 kV contact discharge
IEC 61000-4-2 ≥ ±12 kV air discharge
HBM ≥ ±30 kV
Full hot swap support (glitch free power-up/power-down)
High speed 50 Mbps data rate
Full receiver short circuit, open circuit, and bus idle failsafe
Extended temperature range up to 125°C
Profibus compliant at VCC ≥ 4.5 V
Half-duplex
Allows connection of up to 128 nodes onto the bus
Space-saving package options
8-lead 3 mm × 3 mm MSOP package
8-lead narrow body SOIC_N package
VCC
ADM3065E
R
RO
A
RE
DE
B
DI
D
GND
14666-001
Data Sheet
3.0 V to 5.5 V, ±12 kV IEC ESD Protected,
50 Mbps RS-485 Transceiver
ADM3065E
Figure 1.
Table 1. Summary of the ADM3065E Half-Duplex Operating
Conditions—Data Rate Capability Across Temperature,
Power Supply, and Package
Maximum
Data Rate Maximum Maximum
VCC (V)
Temperature Package Description
(Mbps) 1
50
5.5
−40°C to
8-Lead SOIC_N and 8-Lead
+105°C
MSOP
50
3.6
−40°C to
8-Lead SOIC_N and 8-Lead
+125°C
MSOP
APPLICATIONS
Industrial fieldbuses
Process control
Building automation
Profibus networks
Motor control servo drives and encoders
1
The ADM3065E data input (DI) is transmitting 50 Mbps clock data, and the
ADM3065E driver enable (DE) is enabled for 50% of the DI transmit time.
GENERAL DESCRIPTION
The ADM3065E is a 3.0 V to 5.5 V, IEC electrostatic discharge
(ESD) protected RS-485 transceiver, allowing the device to
withstand ±12 kV contact discharges on the transceiver bus
pins without latch-up or damage.
The ADM3065E is suitable for high speed 50 Mbps
bidirectional data communication on multipoint bus
transmission lines. The ADM3065E has a ¼ unit load input
impedance, which allows up to 128 transceivers on a bus.
The ADM3065E is a half-duplex RS-485 transceiver, fully
compliant to the Profibus® standard with increased 2.1 V bus
differential voltage at VCC ≥ 4.5 V.
This RS-485 transceiver is available in two space-saving
packages: the 8-lead 3 mm × 3 mm MSOP package and the 8lead narrow body SOIC package.
Rev. 0
Models with operating temperature ranges of −40°C to +125°C
and −40°C to +85°C are available.
Excessive power dissipation caused by bus contention or by
output shorting is prevented by a thermal shutdown circuit. If,
during fault conditions, a significant temperature increase is
detected in the internal driver circuitry, this feature forces the
driver output into a high impedance state.
The ADM3065E guarantees a logic high receiver output when
the receiver inputs are shorted, open, or connected to a
terminated transmission line with all drivers disabled.
Table 1 presents an overview of the ADM3065E data rate
capability across temperature and power supply in 8-lead
SOIC_N and 8-lead MSOP packages. Refer to the Ordering
Guide for model numbering.
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©2017 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
Data Sheet
ADM3065E
TABLE OF CONTENTS
Features .............................................................................................. 1
Theory of Operation ...................................................................... 12
Applications ....................................................................................... 1
High Speed IEC ESD Protected RS-485 .................................. 12
Functional Block Diagram .............................................................. 1
High Driver Differential Output Voltage ................................ 12
General Description ......................................................................... 1
±12 kV IEC 61000-4-2 ESD Protection ................................... 12
Revision History ............................................................................... 2
Truth Tables................................................................................. 13
Specifications..................................................................................... 3
Receiver Fail-Safe ....................................................................... 13
Timing Specifications .................................................................. 4
Hot-Swap Capability .................................................................. 13
Timing Diagrams.......................................................................... 5
128 Transceivers on the Bus ...................................................... 13
Absolute Maximum Ratings ............................................................ 6
Driver Output Protection .......................................................... 13
Thermal Resistance ...................................................................... 6
Applications Information .............................................................. 14
ESD Caution .................................................................................. 6
Isolated High Speed RS-485 Node ........................................... 15
Pin Configuration and Function Descriptions ............................. 7
Outline Dimensions ....................................................................... 17
Test Circuits ....................................................................................... 8
Ordering Guide .......................................................................... 17
Typical Performance Characteristics ............................................. 9
REVISION HISTORY
3/2017—Revision 0: Initial Version
Rev. 0 | Page 2 of 17
Data Sheet
ADM3065E
SPECIFICATIONS
VCC = 3.0 V to 5.5 V, TA = TMIN (−40°C) to TMAX (+125°C), unless otherwise noted. All typical specifications are at TA = 25°C, VCC = 3.3 V
unless otherwise noted.
Table 2.
Parameter
POWER SUPPLY
Supply Current
Symbol
Min
ICC
Typ
Max
Unit
Test Conditions/Comments
2
7.5
7.5
4.5
172
75
450
mA
mA
mA
mA
mA
µA
No load, DE = VCC, RE = 0 V
No load, DE = VCC, RE = VCC
No load, DE = 0 V, RE = 0 V
50 Mbps, RL = 54 Ω, DE = VCC, RE = 0 V
50 Mbps, RL = 54 Ω, DE = VCC, RE = 0 V (VCC = 3.0 V)
DE = 0 V, RE = VCC
VCC
VCC
VCC
VCC
VCC
VCC
0.2
V
V
V
V
V
V
VCC ≥ 3.0 V, R = 50 Ω, see Figure 7
VCC ≥ 3.0 V, R = 27 Ω (RS-485), see Figure 7
VCC ≥ 4.5 V, R = 50 Ω, see Figure 7
VCC ≥ 4.5 V, R = 27 Ω (RS-485), see Figure 7
VCC ≥ 3.0 V, −7 V ≤ VCM ≤ +12 V, see Figure 8
VCC ≥ 4.5 V, −7 V ≤ VCM ≤ +12 V, see Figure 8
R = 27 Ω or 50 Ω, see Figure 7
3.0
0.2
V
V
R = 27 Ω or 50 Ω, see Figure 7
R = 27 Ω or 50 Ω, see Figure 7
mA
−7 V < VOUT < +12 V
67
Supply Current in Shutdown Mode
DRIVER
Differential Outputs
Output Voltage, Loaded
∆|VOD| for Complementary Output
States
Common-Mode Output Voltage
∆|VOC| for Complementary Output
States
Output Short-Circuit Current
Logic Inputs (DE, RE, DI)
Input Voltage
Low
High
Input Current
RECEIVER
Differential Inputs
Differential Input Threshold Voltage
Input Voltage Hysteresis
Input Current (A, B)
Line Input Resistance
Logic Outputs
Output Voltage
Low
High
Short-Circuit Current
Three-State Output Leakage
ISHDN
|VOD2|
|VOD2|
|VOD2|
|VOD2|
|VOD3|
|VOD3|
∆|VOD|
2.0
1.5
2.1
2.1
1.5
2.1
VOC
∆|VOC|
IOS
−250
250
VIL
VIH
II
0.67 × VCC
−2
0.33 × VCC V
V
+2
µA
DE, RE, DI, 3.0 V ≤ VCC ≤ 5.5 V
DE, RE, DI, 3.0 V ≤ VCC ≤ 5.5 V
DE, RE, DI, 3.0 V ≤ VCC ≤ 5.5 V, 0 V ≤ VIN ≤ VCC
−30
mV
mV
mA
mA
kΩ
−7 V < VCM < +12 V
−7 V < VCM < +12 V
DE = 0 V, VCC = powered/unpowered, VIN = 12 V
DE = 0 V, VCC = powered/unpowered, VIN = −7 V
−7 V ≤ VTST ≤ +12 V
V
V
mA
µA
IOUT = +2 mA, VID ≤ −0.2 V
IOUT = −2 mA, VID ≥ +0.2 V
VOUT = GND or VCC
RO = 0 V or VCC
VTH
VHYS
II
−200
0.25
RIN
−0.20
48
VOL
VOH
2.4
IOZR
−125
30
0.4
85
±2
Rev. 0 | Page 3 of 17
Data Sheet
ADM3065E
TIMING SPECIFICATIONS
VCC = 3.0 V to 5.5 V, TA = TMIN (−40°C) to TMAX (+125°C), unless otherwise noted. All typical specifications are at TA = 25°C, VCC = 3.3 V,
unless otherwise noted.
Table 3.
Parameter
DRIVER
Maximum Data Rate 1
Propagation Delay
Skew
Rise/Fall Times
Enable to Output High
Enable to Output Low
Disable Time from Low
Disable Time from High
Enable Time from Shutdown to High
Enable Time from Shutdown to Low
RECEIVER
Maximum Data Rate
Propagation Delay
Skew/Pulse Width Distortion
Enable to Output High
Enable to Output Low
Disable Time from Low
Disable Time from High
Enable from Shutdown to High
Enable from Shutdown to Low
TIME TO SHUTDOWN
1
Symbol
Min
Typ
Max
Unit
Test Conditions/Comments
9
1
4
10
10
10
10
15
2
6.7
30
30
30
30
2000
2000
Mbps
ns
ns
ns
ns
ns
ns
ns
ns
ns
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 9
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 9
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 9
RL = 110 Ω, CL = 50 pF, see Figure 10
RL = 110 Ω, CL = 50 pF, see Figure 10
RL = 110 Ω, CL = 50 pF, see Figure 10
RL = 110 Ω, CL = 50 pF, see Figure 10
RL = 110 Ω, CL = 50 pF, see Figure 10
RL = 110 Ω, CL = 50 pF, see Figure 10
Mbps
ns
ns
ns
50
tDPLH, tDPHL
tDSKEW
tDR, tDF
tDZH
tDZL
tDLZ
tDHZ
tDZH(SHDN)
tDZL(SHDN)
50
tRPLH, tRPHL
tRSKEW
tRZH
10
35
3
35
tRZL
10
35
ns
tRLZ
tRHZ
tRZH(SHDN)
tRZL(SHDN)
tSHDN
10
10
35
35
2000
2000
ns
ns
ns
ns
ns
40
Maximum data rate assumes a ratio of tDR:tBIT:tDF equal to 1:1:1.
Rev. 0 | Page 4 of 17
CL = 15 pF, |VID| ≥ 1.5 V, see Figure 11
CL = 15 pF, |VID| ≥ 1.5 V, VCM = 1.5 V, see Figure 11
RL = 1 kΩ, CL = 15 pF, |VID| ≥ 1.5 V, DE high,
see Figure 13
RL = 1 kΩ, CL = 15 pF, |VID| ≥ 1.5 V, DE high,
see Figure 13
RL = 1 kΩ, CL = 15 pF, |VID| ≥ 1.5 V, see Figure 13
RL = 1 kΩ, CL = 15 pF, |VID| ≥ 1.5 V, see Figure 13
RL = 1 kΩ, CL = 15 pF, |VID| ≥ 1.5 V, see Figure 12
RL = 1 kΩ, CL = 15 pF, |VID| ≥ 1.5 V, see Figure 12
Data Sheet
ADM3065E
TIMING DIAGRAMS
VCC
0.5VCC
A–B
0.5VCC
0V
0V
tRPLH
tRPHL
0V
tDPHL
tDPLH
B
1/2VOD
A
90% POINT
VOD
–VOD
0.5VCC
tRSKEW = |tRPLH – tRPHL |
VOD = V(A) – V(B)
Figure 4. Receiver Propagation Delay Timing Diagram
10% POINT
10% POINT
0.7VCC
tDF
tDR
RE
14666-009
NOTES
1. VOD IS THE DIFFERENCE BETWEEN A AND B,
WITH +VODD BEING THE MAXIMUM POINT OF VOD,
AND –VOD BEING THE MINIMUM POINT OF VOD.
Figure 2. Driver Propagation Delay Rise and Fall Timing Diagram
0.5VCC
0.5VCC
tDZL
OUTPUT LOW
tRZH
0V
RO
VCC
0V
tDLZ
VOL
VOH
0.5VOH
0V
14666-010
VOH – 0.5V
A OR B
0.3VCC
VOL + 0.5V
tRHZ
OUTPUT HIGH
0.5VCC
VOL
VOH
VOH – 0.5V
Figure 5. Receiver Enable and Disable Timing Diagram
VOL + 0.5V
tDHZ
tDZH
tRLZ
0.5VCC
RO
0.5VCC
0.5 (VCC – VOL)
A OR B
0.5VCC
tRZL
VCC
DE
VOL
90% POINT
Figure 3. Driver Enable and Disable Timing Diagram
Rev. 0 | Page 5 of 17
14666-012
+VOD
0.5VCC
RO
14666-011
VOH
VOD
Data Sheet
ADM3065E
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 4.
Parameter
VCC to GND
Digital Input/Output Voltage (DE, RE,
DI, and RO)
Driver Output/Receiver Input Voltage
Operating Temperature Range
Storage Temperature Range
Continuous Total Power Dissipation
8-Lead SOIC_N
8-Lead MSOP
Maximum Junction Temperature
Lead Temperature
Soldering (10 Sec)
Vapor Phase (60 Sec)
Infrared (15 Sec)
ESD on the Bus Pins (A and B)
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air Discharge
Ten Positive and Ten Negative
Discharges
Three Positive or Negative
Discharges
ESD Human Body Model (HBM)
On the Bus Pins (A and B)
All Other Pins
Rating
6V
−0.3 V to VCC + 0.3 V
θJA is specified for the worst-case conditions, that is, a device
soldered on a circuit board for surface-mount packages.
−9 V to +14 V
−40°C to +125°C
−65°C to + 150°C
Package Type
8-Lead SOIC_N
8-Lead MSOP
0.225 W
0.151 W
150°C
ESD CAUTION
Table 5. Thermal Resistance
300°C
215°C
220°C
±12 kV
±12 kV
±15 kV
>±30 kV
±8 kV
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. 0 | Page 6 of 17
θJA
110.88
165.69
θJC
58.63
49.61
Unit
°C/W
°C/W
Data Sheet
ADM3065E
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
RO 1
DE 3
DI 4
8
VCC
ADM3065E
7 B
TOP VIEW
(Not to Scale) 6 A
5
GND
14666-002
RE 2
Figure 6. ADM3065E 8-Lead Narrow Body SOIC_N and 8-Lead MSOP
Table 6. Pin Function Descriptions
Pin Number
1
Mnemonic
RO
2
RE
3
DE
4
5
6
DI
GND
A
7
B
8
VCC
Description
Receiver Output Data. This output is high when (A − B) > −30 mV and low when (A − B) < −200 mV. This
output is tristated when the receiver is disabled, that is, when RE is driven high.
Receiver Enable Input. This is an active low input. Driving this input low enables the receiver, and driving it
high disables the receiver.
Driver Output Enable. A logic high level on this pin enables the driver differential outputs, A and B. A logic
low level places the driver output into a high impedance state.
Transmit Data Input. Data to be transmitted by the driver is applied to this input.
Ground.
Noninverting Driver Output/Receiver Input. When the driver is disabled, or when VCC is powered down, Pin A
is put into a high impedance state to avoid overloading the bus.
Inverting Driver Output/Receiver Input. When the driver is disabled, or when VCC is powered down, Pin B is
put into a high impedance state to avoid overloading the bus.
3.0 V to 5.5 V Power Supply. It is recommended adding a 0.1 µF decoupling capacitor between Pin VCC and Pin GND.
Rev. 0 | Page 7 of 17
Data Sheet
ADM3065E
TEST CIRCUITS
A
R
INPUT
GENERATOR
R
VOC
VOUT
RE
CL
B
14666-007
DI
VIN
14666-003
VOD
RE = 0V
Figure 11. Receiver Propagation Delay/Skew
+1.5V
375Ω
VCM
60Ω
375Ω
RL
–1.5V
14666-004
VOD3
DI
VIO
S1
RE
CL
S2
VOUT
14666-008
Figure 7. Driver Voltage Measurements
RE IN
Figure 12. Receiver Enable/Disable from Shutdown
Figure 8. Driver Voltage Measurements over Common-Mode Range
VCC
VCC
DI
S1
CL1
D
VCC
A
14666-005
RLDIFF
CL2
RL VOUT
S2
CL
R
B
RE
RE IN
Figure 13. Receiver Enable/Disable
Figure 9. Driver Propagation Delay
VCC
RL
S1
DE
CL
DE IN
S2
14666-006
0V OR VCC
Figure 10. Driver Enable/Disable
Rev. 0 | Page 8 of 17
14666-113
DI
DE
Data Sheet
ADM3065E
TYPICAL PERFORMANCE CHARACTERISTICS
350
VCC = 5.5V
VCC = 4.5V
VCC = 3.3V
300
250
200
150
100
0
–40
14666-013
50
–25
–10
5
20
35
50
65
TEMPERATURE (°C)
80
95
110
12
11
10
9
8
7
5
4
–40
125
Figure 14. Shutdown Current (ISHDN) vs. Temperature
tDPHL , VCC = 3.0V
tDPLH , VCC = 3.0V
tDPHL , VCC = 5.5V
tDPLH , VCC = 5.5V
6
–25
–10
5
20
35
50
65
TEMPERATURE (°C)
80
95
14666-016
DRIVER DIFFERENTIAL PROPAGATION DELAY (ns)
SHUTDOWN CURRENT (I SHDN ) (µA)
400
110
125
Figure 17. Driver Differential Propagation Delay vs. Temperature, 50 Mbps
0.07
RL = 54Ω
0.06
RL = 120Ω
DI
1
0.05
NO LOAD
0.04
VOD
0.03
0.02
0
–40
2
14666-014
0.01
–25
–10
5
65
20
35
50
TEMPERATURE (°C)
80
95
110
14666-017
SUPPLY CURRENT (ICC) (A)
0.08
C1 1.0V/DIV
C2 2.0V/DIV
125
Figure 15. Supply Current (ICC) vs. Temperature, Data Rate = 50 Mbps, VCC = 3.3 V
50Ω BW: 1.5G
50Ω BW: 1.5G
20ns/DIV
5.0GS/s
200ps/pt
A C1
1.34V
Figure 18. Driver Propagation Delay at 50 Mbps
0.12
0.04
RL = 54Ω
0.02
DRIVER OUTPUT CURRENT (A)
RL = 120Ω
0.08
NO LOAD
0.06
0.04
0
–0.02
–0.04
–0.06
–0.08
0.02
–0.10
14666-015
0
–40
–25
–10
5
20
35
50
65
TEMPERATURE (°C)
80
95
110
VCC = 5.5V
VCC = 4.5V
VCC = 3.0V
14666-018
SUPPLY CURRENT (ICC) (A)
0.10
–0.12
125
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
DRIVER DIFFERENTIAL OUTPUT VOLTAGE (V)
Figure 16. Supply Current (ICC) vs. Temperature, Data Rate = 50 Mbps, VCC = 5.0 V
Figure 19. Driver Output Current vs. Driver Differential Output Voltage
Rev. 0 | Page 9 of 17
Data Sheet
ADM3065E
3.0
VID
VCC = 4.5V
2.8
1
2.6
2.4
2.2
ROUT
VCC = 3.0V
2.0
1.6
1.4
–40
–25
–10
5
20
35
50
65
TEMPERATURE (°C)
80
95
110
2
C1 1.0V/DIV
C2 1.0V/DIV
125
20ns/DIV
5.0GS/s
200ps/pt
A C1
0.0V
28
0.02
0
–0.02
–0.04
–0.06
–0.10
–7
14666-020
–0.08
–6
–5
–4
–3
–2
–1
0
1
2
3
4
26
tRPHL
24
tRPLH
22
20
18
16
–40
5
14666-023
RECEIVER PROPAGATION DELAY (ns)
0.04
–25
–10
DRIVER OUTPUT HIGH VOLTAGE (V)
5
20
35
50
65
TEMPERATURE (°C)
80
95
110
125
Figure 24. Receiver Propagation Delay vs. Temperature, 50 Mbps
Figure 21. Driver Output Current vs. Driver Output High Voltage
0.035
0.10
VCC = 3.3V
RECEIVER OUTPUT CURRENT (A)
0.09
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
0
2
4
6
8
10
0.025
0.020
0.015
0.010
0.005
0
0
12
DRIVER OUTPUT LOW VOLTAGE (V)
Figure 22. Driver Output Current vs. Driver Output Low Voltage
0.030
14666-024
0.08
14666-021
DRIVER OUTPUT CURRENT (A)
50Ω BW: 1.5G
50Ω BW: 1.5G
Figure 23. Receiver Propagation Delay at 50 Mbps, |VID| ≥ 1.5 V
Figure 20. Driver Differential Output Voltage vs. Temperature
DRIVER OUTPUT CURRENT (A)
14666-022
1.8
14666-019
DRIVER DIFFERENTIAL OUTPUT VOLTAGE (V)
3.2
0.5
1.0
1.5
2.0
2.5
3.0
RECEIVER OUTPUT LOW VOLTAGE (V)
3.5
Figure 25. Receiver Output Current vs. Receiver Output Low Voltage (VCC = 3.3 V)
Rev. 0 | Page 10 of 17
Data Sheet
ADM3065E
0
0.12
VCC = 3.3V
0.10
SUPPLY CURRENT (ICC) (A)
–0.010
–0.015
–0.020
–0.025
–0.030
0.06
VCC = 3.3V
0.04
0
0.5
1.0
1.5
2.0
2.5
3.0
RECEIVER OUTPUT HIGH VOLTAGE (V)
14666-100
14666-025
–0.040
0
3.5
0
5
10
15
20
25
30
35
40
45
50
DATA RATE (Mbps)
Figure 26. Receiver Output Current vs. Receiver Output High Voltage (VCC = 3.3 V)
Figure 29. Supply Current (ICC) vs. Data Rate with 54 Ω Load Resistance
0.08
6.0
0.07
SUPPLY CURRENT (ICC) (A)
5.8
5.6
5.4
0.06
0.05
VCC = 5.5V
0.04
VCC = 5.0V
0.03
0.02
VCC = 3.3V
5.2
5.0
–40
0.01
14666-026
RECEIVER OUTPUT HIGH VOLTAGE (V)
VCC = 5.0V
0.02
–0.035
–25
–10
5
20
35
50
65
TEMPERATURE (°C)
80
95
110
0
125
0
0.20
0.15
0.10
14666-027
0.05
–25
–10
5
20
35
50
65
TEMPERATURE (°C)
10
15
20
25
30
35
40
45
50
Figure 30. Supply Current (ICC) vs. Data Rate with No Load Resistance
0.25
0
–40
5
DATA RATE (Mbps)
Figure 27. Receiver Output High Voltage vs. Temperature
RECEIVER OUTPUT LOW VOLTAGE (V)
VCC = 5.5V
0.08
14666-101
RECEIVER OUTPUT CURRENT (A)
–0.005
80
95
110
125
Figure 28. Receiver Output Low Voltage vs. Temperature
Rev. 0 | Page 11 of 17
Data Sheet
ADM3065E
THEORY OF OPERATION
HIGH SPEED IEC ESD PROTECTED RS-485
IPEAK
The ADM3065E is a 3.0 V to 5.5 V, 50 Mbps RS-485 transceiver
with IEC 61000-4-2 Level 4 ESD protection on the bus pins.
Tthe ADM3065E can withstand up to ±12 kV contact discharge
on transceiver bus pins (A and B) without latch-up or damage.
30A
90%
The ADM3065E has characteristics optimized for use in Profibus
applications. When powered at VCC ≥ 4.5 V, the ADM3065E
driver output differential voltage meets or exceeds the Profibus
requirements of 2.1 V with a 54 Ω load.
I30ns 16A
8A
I60ns
10%
IEC 61000-4-2 ESD PROTECTION
30ns
ESD is the sudden transfer of electrostatic charge between bodies
at different potentials caused by near contact or induced by an
electric field. It has the characteristics of high current in a short
time period. The primary purpose of the IEC 61000-4-2 test is
to determine the immunity of systems to external ESD events
outside the system during operation. IEC 61000-4-2 describes
testing using two coupling methods: contact discharge and air
discharge. Contact discharge implies a direct contact between the
discharge gun and the equipment under test (EUT). During air
discharge testing, the charged electrode of the discharge gun is
moved toward the EUT until a discharge occurs as an arc across
the air gap. The discharge gun does not make direct contact
with the EUT. A number of factors affect the results and
repeatability of the air discharge test, including humidity, temperature, barometric pressure, distance, and rate of approach to the
EUT. This method is a better representation of an actual ESD
event but is not as repeatable. Therefore, contact discharge is
the preferred test method.
During testing, the data port is subjected to at least 10 positive
and 10 negative single discharges. Selection of the test voltage is
dependent on the system end environment.
60ns
TIME
tR = 0.7ns TO 1ns
14666-028
HIGH DRIVER DIFFERENTIAL OUTPUT VOLTAGE
Figure 31. IEC 61000-4-2 ESD Waveform (8 kV)
Figure 32 shows the 8 kV contact discharge current waveform
from the IEC 61000-4-2 standard compared to the human body
model (HBM) ESD 8 kV waveform. Figure 32 shows that the
two standards specify a very different waveform shape and peak
current. The peak current associated with a IEC 61000-4-2 8 kV
pulse is 30 A, whereas the corresponding peak current for HBM
ESD is more than five times less, at 5.33 A. The other difference is
the rise time of the initial voltage spike, with the IEC 61000-4-2
ESD waveform having a much faster rise time of 1 ns, compared
to the 10 ns associated with the HBM ESD waveform. The
amount of power associated with an IEC ESD waveform is
much greater than that of a HBM ESD waveform. The HBM
ESD standard requires the EUT to be subjected to 3 positive and 3
negative discharges, while in comparison the IEC ESD Standard
requires 10 positive and 10 negative discharge tests.
The ADM3065E with IEC 61000-4-2 ESD ratings is better suited
for operation in harsh environments compared to other RS-485
transceivers that state varying levels of HBM ESD protection.
IPEAK
Figure 31 shows the 8 kV contact discharge current waveform
as described in the IEC 61000-4-2 specification. Some of the
key waveform parameters are rise times of less than 1 ns and
pulse widths of approximately 60 ns.
30A
90%
IEC 61000-4-2 ESD 8kV
I30ns 16A
I60ns 8A
5.33A
HBM ESD 8kV
10ns
30ns
60ns
TIME
tR = 0.7ns TO 1ns
Figure 32. IEC 61000-4-2 ESD Waveform 8 kV Compared to HBM ESD
Waveform 8 kV
Rev. 0 | Page 12 of 17
14666-029
10%
Data Sheet
ADM3065E
TRUTH TABLES
HOT SWAP CAPABILITY
Hot Swap Inputs
Table 7. Transmitting Truth Table
Transmitting Outputs2
Inputs1
Supply Status (VCC)
On
On
On
On
Off
1
2
RE
X
X
0
1
X
DE
1
1
0
0
X
DI
1
0
X
X
X
A
1
0
High-Z
High-Z
High-Z
B
0
1
High-Z
High-Z
High-Z
X means don't care.
High-Z means high impedance.
Table 8. Receiving Truth Table
Supply
Status (VCC)
On
On
On
On
On
Off
1
2
3
Inputs1
A−B
>−0.03 V
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