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ADM3076EARZ

ADM3076EARZ

  • 厂商:

    AD(亚德诺)

  • 封装:

    SOICN-14_8.65X3.9MM

  • 描述:

    3.3V, +/- 15KV ESD-PROTECTED, HA

  • 详情介绍
  • 数据手册
  • 价格&库存
ADM3076EARZ 数据手册
3.3 V, ±15 kV ESD-Protected, Half- and Full-Duplex, RS-485/RS-422 Transceivers ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E FUNCTIONAL BLOCK DIAGRAMS VCC ADM3070E/ ADM3073E/ ADM3076E R RO B RE DE DI Z D Y GND Figure 1. VCC ADM3071E/ ADM3074E/ ADM3077E R RO APPLICATIONS DI Power/energy metering Industrial control Lighting systems Telecommunications Security systems Instrumentation A 06285-001 TIA/EIA RS-485/RS-422 compliant ±15 kV ESD protection on RS-485 input/output pins Data rates ADM3070E/ADM3071E/ADM3072E: 250 kbps ADM3073E/ADM3074E/ADM3075E: 500 kbps ADM3076E/ADM3077E/ADM3078E: 16 Mbps Half- and full-duplex options True fail-safe receiver inputs Up to 256 nodes on the bus −40°C to +125°C temperature option Hot-swap input structure on DE and RE pins Reduced slew rates for low EMI Low power shutdown current (all except ADM3071E/ ADM3074E/ADM3077E) Outputs high-Z when disabled or powered off Common-mode input range: −7 V to +12 V Thermal shutdown and short-circuit protection 8-lead and 14-lead narrow SOIC packages D A B Z Y 06285-002 FEATURES GND Figure 2. VCC ADM3072E/ ADM3075E/ ADM3078E The ADM307xE are 3.3 V, low power data transceivers with ±15 kV ESD protection suitable for full- and half-duplex communication on multipoint bus transmission lines. They are designed for balanced data transmission, and they comply with TIA/EIA standards: RS-485 and RS-422. The devices have a ⅛ unit load receiver input impedance, which allows up to 256 transceivers on a bus. Because only one driver should be enabled at any time, the output of a disabled or powereddown driver is tristated to avoid overloading the bus. R RO RE A DE DI B D GND 06285-003 GENERAL DESCRIPTION Figure 3. The receiver inputs have a true fail-safe feature, which eliminates the need for external bias resistors and ensures a logic high output level when the inputs are open or shorted. This guarantees that the receiver outputs are in a known state before communication begins and when communication ceases. Rev. F Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2006–2019 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ........................................... 12 Applications ....................................................................................... 1 Circuit Description......................................................................... 15 General Description ......................................................................... 1 Function Tables........................................................................... 15 Functional Block Diagrams ............................................................. 1 Receiver Fail-Safe ....................................................................... 15 Revision History ............................................................................... 2 Hot-Swap Capability .................................................................. 16 Specifications..................................................................................... 4 Line Length vs. Data Rate ......................................................... 16 Timing Specifications— ADM3070E/ADM3071E/ADM3072E....................................... 5 ±15 kV ESD Protection ............................................................. 16 Timing Specifications— ADM3073E/ADM3074E/ADM3075E....................................... 6 256 Transceivers on the Bus ...................................................... 16 Timing Specifications— ADM3076E/ADM3077E/ADM3078E....................................... 7 Low Power Shutdown Mode ..................................................... 17 Absolute Maximum Ratings............................................................ 8 ESD Caution .................................................................................. 8 Pin Configurations and Function Descriptions ........................... 9 Test Circuits and Switching Characteristics ................................ 10 Human Body Model .................................................................. 16 Reduced EMI and Reflections .................................................. 16 Driver Output Protection .......................................................... 17 Typical Applications ................................................................... 17 Outline Dimensions ....................................................................... 19 Ordering Guide .......................................................................... 20 REVISION HISTORY 9/2019—Rev. E to Rev. F Changes to Table 6 ............................................................................ 8 8/2009—Rev. D to Rev. E Changes to Ordering Guide .......................................................... 20 4/2009—Rev. C to Rev. D Changes to Ordering Guide .......................................................... 20 1/2009—Rev. B to Rev. C Changes to Ordering Guide .......................................................... 20 8/2008—Rev. A to Rev. B Changes to Table 3.............................................................................5 Changes to Figure 36...................................................................... 18 Updated Outline Dimensions ....................................................... 19 Changes to Ordering Guide .......................................................... 20 10/2006—Rev. 0 to Rev. A Added ADM3077E and ADM3078E ............................... Universal Changes to Figure 2 and Figure 3 ....................................................1 Changes to Figure 5 and Figure 6 ....................................................9 Changes to Figure 34 and Figure 35............................................. 17 Updated Outline Dimensions ....................................................... 19 Changes to Ordering Guide .......................................................... 20 8/06—Revision 0: Initial Version Rev. F | Page 2 of 20 ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E The driver outputs of the 250 kbps and 500 kbps devices are slew rate limited to reduce EMI and data errors caused by reflections from improperly terminated buses. Excessive power dissipation caused by bus contention or by output shorting is prevented with a thermal shutdown circuit. The parts are fully specified over the industrial temperature ranges and are available in 8-lead and 14-lead narrow SOIC packages. Table 1. Selection Table Part No. ADM3070E ADM3071E ADM3072E ADM3073E ADM3074E ADM3075E ADM3076E ADM3077E ADM3078E Half/Full Duplex Full Full Half Full Full Half Full Full Half Data Rate (Mbps) 0.25 0.25 0.25 0.5 0.5 0.5 16 16 16 Slew Rate Limited Yes Yes Yes Yes Yes Yes No No No Driver/Receiver Enable Yes No Yes Yes No Yes Yes No Yes Rev. F | Page 3 of 20 Low Power Shutdown Yes No Yes Yes No Yes Yes No Yes Nodes on Bus 256 256 256 256 256 256 256 256 256 ±15 kV ESD on Bus Pins Yes Yes Yes Yes Yes Yes Yes Yes Yes Pin Count 14 8 8 14 8 8 14 8 8 ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E SPECIFICATIONS VCC = 3.3 V ± 10%, TA = TMIN to TMAX, unless otherwise noted. Table 2. ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E Parameter DRIVER Differential Outputs Differential Output Voltage Symbol Min VOD 2.0 1.5 Δ|VOD| for Complementary Output States 1 Common-Mode Output Voltage Δ|VOC| for Complementary Output States1 Short-Circuit Output Current ΔVOD VOC ΔVOC IOSD Short-Circuit Foldback Output Current IOSDF Output Leakage (Y, Z) Full Duplex Typ VCC/2 40 −250 20 Max Unit Test Conditions/Comments VCC VCC VCC 0.2 3 0.2 250 −40 V V V V V V mA mA mA mA µA µA RL = 100 Ω (RS-422) (see Figure 7) RL = 54 Ω (RS-485) (see Figure 7) No load RL = 54 Ω or 100 Ω (see Figure 7) RL = 54 Ω or 100 Ω (see Figure 7) RL = 54 Ω or 100 Ω (see Figure 7) 0 V < VOUT < 12 V −7 V < VOUT < VCC (VCC − 1 V) < VOUT < 12 V −7 V < VOUT < +1 V DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V V V mV µA kΩ °C °C DE, DI, RE DE, DI, RE DE, DI, RE DE, DI, RE DE mV mV kΩ µA µA −7 V < VCM < +12 V VA + VB = 0 V −7 V < VCM < +12 V DE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V DE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V 0.4 ±80 ±1 V V mA µA IOUT = −1 mA IOUT = 1 mA 0 V < VRO < VCC VCC = 3.6 V, 0 V < VOUT < VCC 1.5 1.5 1.5 10 mA mA mA µA No load, DE = VCC, RE = 0 V No load, DE = VCC, RE = VCC No load, DE = 0 V, RE = 0 V DE = 0 V, RE = VCC kV kV Human body model Human body model −20 125 IO −100 Logic Inputs Input High Voltage Input Low Voltage Input Hysteresis Logic Input Current Input Impedance First Transition Thermal Shutdown Threshold Thermal Shutdown Hysteresis RECEIVER Differential Inputs Differential Input Threshold Voltage Input Hysteresis Input Resistance (A, B) Input Current (A, B) VIH VIL VHYS IIN 2.0 0.8 100 ±1 10 1 TTS TTSH VTH ΔVTH RIN IA, IB 175 15 −200 −125 15 −50 96 125 −100 RO Logic Output Output High Voltage Output Low Voltage Short-Circuit Output Current Tristate Output Leakage Current POWER SUPPLY Supply Current Shutdown Current ESD PROTECTION A, B, Y, Z Pins All Pins Except A, B, Y, Z Pins 1 VOH VOL IOSR IOZR ICC ISHDN VCC − 0.6 0.8 0.8 0.8 0.05 ±15 ±4 Δ|VOD| and Δ|VOC| are the changes in VOD and VOC, respectively, when the DI input changes state. Rev. F | Page 4 of 20 ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E TIMING SPECIFICATIONS—ADM3070E/ADM3071E/ADM3072E VCC = 3.3 V ± 10%, TA = TMIN to TMAX, unless otherwise noted. Table 3. Parameter DRIVER Maximum Data Rate Propagation Delay, Low-to-High Level Propagation Delay, High-to-Low Level Rise Time/Fall Time |tDPLH − tDPHL| Differential Driver Output Skew Enable to Output High Enable to Output Low Disable Time from Low Disable Time from High Enable Time from Shutdown to High Enable Time from Shutdown to Low RECEIVER Maximum Data Rate Propagation Delay, Low-to-High Level Propagation Delay, High-to-Low Level |tRPLH − tRPHL| Output Skew Enable to Output High Enable to Output Low Disable Time from Low Disable Time from High Enable Time from Shutdown to High Enable Time from Shutdown to Low TIME TO SHUTDOWN 1 Symbol tDPLH tDPHL tDR/tDF tDSKEW tDZH tDZL tDLZ tDHZ tDZH(SHDN) tDZL(SHDN) Min Typ 250 250 250 350 Max Unit Test Conditions/Comments 1500 1500 1600 200 2500 2500 100 100 5500 5500 kbps ns ns ns ns ns ns ns ns ns ns CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9) CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9) CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9) CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9) 1 See Figure 10 See Figure 11 See Figure 11 See Figure 10 See Figure 10 See Figure 11 200 200 30 50 50 50 50 4000 4000 600 kbps ns ns ns ns ns ns ns ns ns ns 250 tRPLH tRPHL tRSKEW tRZH tRZL tRLZ tRHZ tRZH(SHDN) tRZL(SHDN) tSHDN 50 200 VCC = 3.3 V. Rev. F | Page 5 of 20 CL = 15 pF (see Figure 12 and Figure 13) CL = 15 pF (see Figure 12 and Figure 13) CL = 15 pF (see Figure 12 and Figure 13) See Figure 14 See Figure 14 See Figure 14 See Figure 14 See Figure 14 See Figure 14 ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E TIMING SPECIFICATIONS—ADM3073E/ADM3074E/ADM3075E VCC = 3.3 V ± 10%, TA = TMIN to TMAX, unless otherwise noted. Table 4. Parameter DRIVER Maximum Data Rate Propagation Delay, Low-to-High Level Propagation Delay, High-to-Low Level Rise Time/Fall Time |tDPLH − tDPHL| Differential Driver Output Skew Enable to Output High Enable to Output Low Disable Time from Low Disable Time from High Enable Time from Shutdown to High Enable Time from Shutdown to Low RECEIVER Maximum Data Rate Propagation Delay, Low-to-High Level Propagation Delay, High-to-Low Level |tRPLH − tRPHL| Output Skew Enable to Output High Enable to Output Low Disable Time from Low Disable Time from High Enable Time from Shutdown to High Enable Time from Shutdown to Low TIME TO SHUTDOWN Symbol tDPLH tDPHL tDR/tDF tDSKEW tDZH tDZL tDLZ tDHZ tDZH(SHDN) tDZL(SHDN) Min Typ 500 180 180 200 Max Unit Test Conditions/Comments 800 800 800 100 2500 2500 100 100 4500 4500 kbps ns ns ns ns ns ns ns ns ns ns CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9) CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9) CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9) CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9) See Figure 10 See Figure 11 See Figure 11 See Figure 10 See Figure 10 See Figure 11 200 200 30 50 50 50 50 4000 4000 600 kbps ns ns ns ns ns ns ns ns ns ns 500 tRPLH tRPHL tRSKEW tRZH tRZL tRLZ tRHZ tRZH(SHDN) tRZL(SHDN) tSHDN 50 200 Rev. F | Page 6 of 20 CL = 15 pF (see Figure 12 and Figure 13) CL = 15 pF (see Figure 12 and Figure 13) CL = 15 pF (see Figure 12 and Figure 13) See Figure 14 See Figure 14 See Figure 14 See Figure 14 See Figure 14 See Figure 14 ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E TIMING SPECIFICATIONS—ADM3076E/ADM3077E/ADM3078E VCC = 3.3 V ± 10%, TA = TMIN to TMAX, unless otherwise noted. Table 5. Parameter DRIVER Maximum Data Rate Propagation Delay, Low-to-High Level Propagation Delay, High-to-Low Level Rise Time/Fall Time |tDPLH − tDPHL| Differential Driver Output Skew Enable to Output High Enable to Output Low Disable Time from Low Disable Time from High Enable Time from Shutdown to High Enable Time from Shutdown to Low RECEIVER Maximum Data Rate Propagation Delay, Low-to-High Level Propagation Delay, High-to-Low Level |tRPLH − tRPHL| Output Skew Enable to Output High Enable to Output Low Disable Time from Low Disable Time from High Enable Time from Shutdown to High Enable Time from Shutdown to Low TIME TO SHUTDOWN Symbol Min Typ Max Unit Test Conditions/Comments 1250 1250 50 50 15 8 150 150 100 100 1800 1800 Mbps ns ns ns ns ns ns ns ns ns ns CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9) CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9) CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9) CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9) See Figure 10 See Figure 11 See Figure 11 See Figure 10 See Figure 10 See Figure 11 75 75 8 50 50 50 50 1800 1800 600 Mbps ns ns ns ns ns ns ns ns ns ns 16 tDPLH tDPHL tDR/tDF tDSKEW tDZH tDZL tDLZ tDHZ tDZH(SHDN) tDZL(SHDN) 16 tRPLH tRPHL tRSKEW tRZH tRZL tRLZ tRHZ tRZH(SHDN) tRZL(SHDN) tSHDN 40 40 50 200 Rev. F | Page 7 of 20 CL = 15 pF (see Figure 12 and Figure 13) CL = 15 pF (see Figure 12 and Figure 13) CL = 15 pF (see Figure 12 and Figure 13) See Figure 14 See Figure 14 See Figure 14 See Figure 14 See Figure 14 See Figure 14 ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 6. Parameter VCC to GND Digital Input/Output Voltage (DE, RE, DI) Receiver Output Voltage (RO) Driver Output (A, B, Y, Z)/Receiver Input (A, B) Voltage Driver Output Current Operating Temperature Range ADM307xEA ADM307xEY Storage Temperature Range θJA Thermal Impedance 8-Lead SOIC_N 14-Lead SOIC_N Lead Temperature Soldering (10 sec) Vapor Phase (10 sec) Infrared (15 sec) Rating −0.3 V to +6 V −0.3 V to +6 V −0.3 V to (VCC + 0.3 V) −8 V to +13 V Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. ESD CAUTION ±250 mA −40°C to +85°C −40°C to +125°C −65°C to +150°C 158°C/W 120°C/W 300°C 215°C 220°C Rev. F | Page 8 of 20 ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 14 VCC DI 5 GND 6 TOP VIEW (Not to Scale) 12 A 11 B 9 GND 7 VCC 1 10 Z 8 RO 2 Y NC NC = NO CONNECT DI 3 GND 4 Figure 4. ADM3070E/ADM3073E/ADM3076E Pin Configuration ADM3071E/ ADM3074E/ ADM3077E TOP VIEW (Not to Scale) 8 A RO 1 7 B RE 2 6 Z DE 3 5 Y Figure 5. ADM3071E/ADM3074E/ADM3077E Pin Configuration DI 4 ADM3072E/ ADM3075E/ ADM3078E TOP VIEW (Not to Scale) 8 VCC 7 B 6 A 5 GND 06285-006 DE 4 13 NC 06285-005 RE 3 ADM3070E/ ADM3073E/ ADM3076E 06285-004 NC 1 RO 2 Figure 6. ADM3072E/ADM3075E/ADM3078E Pin Configuration Table 7. Pin Function Descriptions ADM3070E/ ADM3073E/ ADM3076E Pin No. 2 ADM3071E/ ADM3074E/ ADM3077E Pin No. 2 ADM3072E/ ADM3075E/ ADM3078E Pin No. 1 Mnemonic RO 3 N/A 2 RE 4 N/A 3 DE 5 3 4 DI 6, 7 9 N/A 12 10 N/A 11 14 1, 8, 13 4 5 N/A 8 6 N/A 7 1 N/A 5 N/A 6 N/A N/A 7 N/A 8 N/A GND Y A A Z B B VCC NC Description Receiver Output. When enabled, if (A − B) ≥ −50 mV, RO is high. If (A − B) ≤ −200 mV, RO is low. Receiver Output Enable. A low level enables the receiver output. A high level places it in a high impedance state. If RE is high and DE is low, the device enters a low power shutdown mode. Driver Output Enable. A high level enables the driver differential A and B outputs. A low level places it in a high impedance state. If RE is high and DE is low, the device enters a low power shutdown mode. Driver Input. With a half-duplex part when the driver is enabled, a logic low on DI forces A low and B high; a logic high on DI forces A high and B low. With a full-duplex part when the driver is enabled, a logic low on DI forces Y low and Z high; a logic high on DI forces Y high and Z low. Ground. Noninverting Driver Output. Noninverting Receiver Input A and Noninverting Driver Output A. Noninverting Receiver Input A. Inverting Driver Output. Inverting Receiver Input B and Inverting Driver Output B. Inverting Receiver Input B. Power Supply, 3.3 V ± 10%. Bypass VCC to GND with a 0.1 µF capacitor. No Connect. Not internally connected; can be connected to GND. Rev. F | Page 9 of 20 ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E TEST CIRCUITS AND SWITCHING CHARACTERISTICS VCC RL 500Ω S1 Y 0V OR 3V RL/2 D 06285-007 VOC RL/2 Z GENERATOR OUT + CL 50pF VOD 50Ω Figure 7. Driver DC Test Load VCC 3V DE VCC/2 tDZL, tDZL(SHDN) DE 0V tDLZ Y CL RL VCC VOM = (VOL + VCC)/2 OUT VOL 06285-008 Z 06285-011 VOD DI 0.25V Figure 11. Driver Enable and Disable Times (tDZL, tDLZ, tDZL(SHDN)) Figure 8. Driver Timing Test Circuit VCC DI VCC/2 0V tDPLH tDPHL 1/2VO Z VO Y 1/2VO 90% 10% ATE 10% tDF VID tDSKEW = |tDPLH – tDPHL | R A 06285-009 tDR RECEIVER OUTPUT B 90% 06285-012 VDIFF = V (Y) – V (Z) +VO VDIFF 0V –VO Figure 12. Receiver Propagation Delay Test Circuit Figure 9. Driver Propagation Delays S1 0V OR 3V GENERATOR D + CL 50pF OUT RL 500Ω 50Ω +1V A VCC B VCC/2 tDZH, tDZH(SHDN) VOH RO 0V 06285-010 VOM = (0 + VOH)/2 tDHZ tRPHL VOH 0.25V OUT –1V tRPLH 0V VOL 1.5V NOTES 1. THE RISE TIME AND FALL TIME OF INPUT A AND INPUT B < 4ns. Figure 13. Receiver Propagation Delays Figure 10. Driver Enable and Disable Times (tDHZ, tDZH, tDZH(SHDN)) Rev. F | Page 10 of 20 06285-013 DE ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E +1.5V S3 –1.5V S1 VCC 1kΩ VID + CL 15pF GENERATOR S1 OPEN S2 CLOSED S3 = +1.5V S2 50Ω S1 CLOSED S2 OPEN S3 = –1.5V 3V 3V 1.5V RE RE 0V 0V tRZL, tRZL(SHDN) VOH VOH/2 RO VCC RO (VOL + VCC)/2 VOL 0V S1 OPEN S2 CLOSED S3 = +1.5V S1 CLOSED S2 OPEN S3 = –1.5V 3V RE 3V RE 1.5V 1.5V 0V 0V tRLZ tRHZ VCC VOH RO 0.25V RO VOL 0V 0.25V Figure 14. Receiver Enable and Disable Times Rev. F | Page 11 of 20 06285-014 tRZH, tRZH(SHDN) ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E TYPICAL PERFORMANCE CHARACTERISTICS 1.2 3.30 IRO = –1mA 3.25 OUTPUT HIGH VOLTAGE (V) 1.0 0.9 0.8 0.7 3.20 3.15 3.10 3.05 0.6 –10 20 50 80 3.00 –50 06285-020 0.5 –40 110 TEMPERATURE (°C) –25 0 25 50 75 100 125 TEMPERATURE (°C) Figure 15. Supply Current vs. Temperature 06285-023 SUPPLY CURRENT (mA) 1.1 Figure 18. Receiver Output High Voltage vs. Temperature 0.7 –18 IRO = 1mA –16 0.6 OUTPUT LOW VOLTAGE (V) –12 –10 –8 –6 –4 0.5 0.4 0.3 0.2 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 OUTPUT HIGH VOLTAGE (V) 0 –50 06285-021 0 –25 0 25 50 75 100 125 06285-024 0.1 –2 3.5 06285-025 OUTPUT CURRENT (mA) –14 TEMPERATURE (°C) Figure 16. Output Current vs. Receiver Output High Voltage Figure 19. Receiver Output Low Voltage vs. Temperature 25 100 90 80 OUTPUT CURRENT (mA) 15 10 70 60 50 40 30 20 5 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 OUTPUT LOW VOLTAGE (V) 06285-022 OUTPUT CURRENT (mA) 20 Figure 17. Output Current vs. Receiver Output Low Voltage 0 0 0.5 1.0 1.5 2.0 2.5 3.0 DIFFERENTIAL OUTPUT VOLTAGE (V) Figure 20. Driver Output Current vs. Differential Output Voltage Rev. F | Page 12 of 20 ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E 0.9 RL = 54Ω 2.5 0.8 2.4 SHUTDOWN CURRENT (µA) 2.3 2.2 2.1 2.0 1.9 1.8 0.7 0.6 0.5 0.4 0.3 0.2 –25 0 25 50 75 100 125 TEMPERATURE (°C) 0 –50 06285-026 1.6 –50 25 50 75 100 125 Figure 24. Shutdown Current vs. Temperature 120 1200 100 1000 PROPAGATION DELAY (ns) 80 60 40 tDPHL 800 tDPLH 600 400 200 20 –6 –5 –4 –3 –2 –1 0 1 2 3 4 OUTPUT HIGH VOLTAGE (V) 0 06285-027 0 –7 –40 25 125 TEMPERATURE (°C) 06285-030 OUTPUT CURRENT (mA) 0 TEMPERATURE (°C) Figure 21. Driver Differential Output Voltage vs. Temperature Figure 25. ADM3070E/ADM3071E/ADM3072E Driver Propagation Delay vs. Temperature (250 kbps) Figure 22. Output Current vs. Driver Output High Voltage 700 120 600 PROPAGATION DELAY (ns) 100 80 60 40 20 tDPHL 500 tDPLH 400 300 200 100 0 0 2 4 6 8 10 OUTPUT LOW VOLTAGE (V) 12 06285-028 OUTPUT CURRENT (mA) –25 06285-029 0.1 1.7 0 –40 25 125 TEMPERATURE (°C) Figure 26. ADM3073E/ADM3074E/ADM3075E Driver Propagation Delay vs. Temperature (500 kbps) Figure 23. Output Current vs. Driver Output Low Voltage Rev. F | Page 13 of 20 06285-031 DIFFERENTIAL OUTPUT VOLTAGE (V) 2.6 ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E 35 tDPLH PROPAGATION DELAY (ns) 30 DI tDPHL 3 25 20 M1 15 VY – VZ 10 –25 0 25 50 75 125 100 TEMPERATURE (°C) 06285-032 0 –50 06285-036 5 CH3 2.0V M400s 125MS/s MATH1 2.01V 400ns Figure 27. ADM3076E/ADM3077E/ADM3078E Driver Propagation Delay vs. Temperature (16 Mbps) 8ns/pt A CH2 1.24V Figure 30. ADM3073E/ADM3074E/ADM3075E Driver Propagation Delay (500 kbps) 70 tDPLH PROPAGATION DELAY (ns) 60 tDPHL 50 M1 VY – VZ 40 30 20 0 –50 –25 0 25 50 75 125 100 TEMPERATURE (°C) 06285-033 3 DI 06285-037 10 CH3 2.0V Ω MATH1 1.0V M20ns 1.25GS/s 20ns IT 400ps/pt A CH3 1.64V Figure 31. ADM3076E/ADM3077E/ADM3078E Driver Propagation Delay (16 Mbps) Figure 28. Receiver Propagation Delay vs. Temperature DI 3 VA – VB M1 M1 VY – VZ CH3 2.0V M1.0µs 50MS/s MATH1 2.01V 1.0µs 20ns/pt A CH2 06285-035 06285-034 RO 3 1.24V CH3 2.0V Ω M200ns 250MS/s MATH1 2.01V 200ns 4ns/pt A CH2 Figure 32. Receiver Propagation Delay Figure 29. ADM3070E/ADM3071E/ADM3072E Driver Propagation Delay (250 kbps) Rev. F | Page 14 of 20 1.24V ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E CIRCUIT DESCRIPTION The ADM307xE series are high speed transceivers for RS­485 and RS-422 communications. Each device contains one driver and one receiver. All devices feature fail-safe circuitry, which guarantees a logic high receiver output when the receiver inputs are open or shorted or when they are connected to a terminated transmission line with all drivers disabled (see the Receiver FailSafe section). The ADM307xE also feature a hot-swap capability, allowing line insertion without erroneous data transfer (see the Hot-Swap Capability section). The ADM3070E/ADM3071E/ ADM3072E feature reduced slew rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing for error-free data transmission at rates up to 250 kbps. The ADM3073E/ADM3074E/ADM3075E also offer slew rate limits, allowing transmit speeds up to 500 kbps. The ADM3076E/ ADM3077E/ADM3078E driver slew rates are not limited, making possible transmit speeds of up to 16 Mbps. The ADM3072E/ ADM3075E/ADM3078E are half-duplex transceivers; the ADM3070E/ADM3071E/ADM3073E/ADM3074E/ADM3076E/ ADM3077E are each full-duplex transceivers. All devices operate from a single 3.3 V supply. Drivers are output short-circuit current limited, and thermal shutdown circuitry protects drivers against excessive power dissipation. When activated, the thermal shutdown circuitry places the driver outputs into a high impedance state. FUNCTION TABLES X1 X1 0 1 1 1 0 0 1 0 X1 X1 Transmitting Input DI 1 0 Receiving Input A−B ≥ −50 mV ≤ −200 mV Open/shorted 2 Transmitting Outputs Y Z 1 0 High-Z2 Shutdown 0 1 High-Z2 Shutdown X = don't care. High-Z = high impedance. RE 0 0 0 1 1 1 2 X1 X1 X1 1 0 X = don't care. High-Z = high impedance. Receiving Output RO 1 0 1 Table 12. Transmitting Truth Table RE X1 X1 0 1 1 2 Transmitting Inputs DE DI 1 1 1 0 0 X1 0 X1 Transmitting Outputs A, Y B, Z 1 0 0 1 High-Z2 High-Z2 Shutdown Shutdown X = don't care. High-Z = high impedance. 0 0 0 1 1 1 Receiving Inputs DE A−B 0 ≥ −50 mV 0 ≤ −200 mV 0 Open/shorted 1 X1 0 X1 Receiving Output RO 1 0 1 High-Z2 Shutdown X = don't care. High-Z = high impedance. RECEIVER FAIL-SAFE Table 9. Receiving Truth Table Receiving Inputs DE Transmitting Outputs Z 0 1 ADM3072E/ADM3075E/ADM3078E 2 1 Y 1 0 Table 11. Receiving Truth Table RE Table 8. Transmitting Truth Table Transmitting Inputs DE DI Table 10. Transmitting Truth Table Table 13. Receiving Truth Table ADM3070E/ADM3073E/ADM3076E RE ADM3071E/ADM3074E/ADM3077E Receiving Outputs A−B RO ≥ −50 mV ≤ −200 mV Open/shorted X1 X1 1 0 1 High-Z2 Shutdown The ADM307xE family guarantees a logic high receiver output when the receiver inputs are shorted, open, or connected to a terminated transmission line with all drivers disabled. This is done by setting the receiver input threshold between −50 mV and −200 mV. If the differential receiver input voltage (A − B) is greater than or equal to −50 mV, RO is logic high. If A − B is less than or equal to −200 mV, RO is logic low. In the case of a terminated bus with all transmitters disabled, the receiver differential input voltage is pulled to 0 V by the termination. With the receiver thresholds of the ADM307xE family, this results in a logic high with a 50 mV minimum noise margin. Rev. F | Page 15 of 20 ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E HOT-SWAP CAPABILITY (ALL EXCEPT ADM3071E/ADM3074E/ADM3077E) Hot-Swap Inputs When a circuit board is inserted into a hot (or powered) backplane, differential disturbances to the data bus can lead to data errors. During this period, processor logic output drivers are high impedance and are unable to drive the DE and RE inputs of the RS-485 transceivers to a defined logic level. Leakage currents up to ±10 µA from the high impedance state of the processor logic drivers can cause standard CMOS enable inputs of a transceiver to drift to an incorrect logic level. Additionally, parasitic circuit board capacitance can cause coupling of VCC or GND to the enable inputs. Without the hot-swap capability, these factors can improperly enable the driver or receiver of the transceiver. When VCC rises, an internal pull-down circuit holds DE low and RE high. After the initial power-up sequence, the pull-down circuit becomes transparent, resetting the hot-swap tolerable input. carried out while device power is applied. This type of testing is more representative of a real-world input/output discharge, which occurs when equipment is operating normally. The transmitter outputs and receiver inputs of the ADM307xE family are characterized for protection to a ±15 kV limit using the human body model. HUMAN BODY MODEL Figure 33 shows the human body model and the current waveform it generates when discharged into low impedance. This model consists of a 100 pF capacitor charged to the ESD voltage of interest, which is then discharged into the test device through a 1.5 kΩ resistor. HIGH VOLTAGE GENERATOR R2 R1 DEVICE UNDER TEST C1 LINE LENGTH vs. DATA RATE The RS-485/RS-422 standard covers line lengths up to 4000 feet. For line lengths greater than 4000 feet, Figure 37 illustrates an example line repeater. ESD TEST METHOD R2 C1 HUMAN BODY MODEL ESD ASSOC. STD 55.1 1.5kΩ 100pF 100% ±15 kV ESD PROTECTION 90% Although very little energy is contained within an ESD pulse, the extremely fast rise time, coupled with high voltages, can cause failures in unprotected semiconductors. Catastrophic destruction can occur immediately as a result of arcing or heating. Even if catastrophic failure does not occur immediately, the device can suffer from parametric degradation that can result in degraded performance. The cumulative effects of continuous exposure can eventually lead to complete failure. Input/output lines are particularly vulnerable to ESD damage. Simply touching or connecting an input/output cable can result in a static discharge that damages or completely destroys the interface product connected to the input/output port. It is extremely important, therefore, to have high levels of ESD protection on the input/output lines. The ESD discharge can induce latch-up in the device under test, so it is important that ESD testing on the input/output pins be IPEAK Two coupling methods are used for ESD testing: contact discharge and air-gap discharge. Contact discharge calls for a direct connection to the unit being tested. Air-gap discharge uses a higher test voltage but does not make direct contact with the test unit. With air-gap discharge, the discharge gun is moved toward the unit under test, developing an arc across the air gap, thus the term air-gap discharge. This method is influenced by humidity, temperature, barometric pressure, distance, and rate of closure of the discharge gun. The contact discharge method, while less realistic, is more repeatable and is gaining acceptance and preference over the air-gap method. 36.8% tRL tDL TIME t 06285-015 10% Figure 33. Human Body Model and Current Waveform 256 TRANSCEIVERS ON THE BUS The standard RS-485 receiver input impedance is 12 kΩ (1 unit load), and the standard driver can drive up to 32 unit loads. The ADM307xE family of transceivers has a ⅛ unit load receiver input impedance (96 kΩ), allowing up to 256 transceivers to be connected in parallel on one communication line. Any combination of these devices and other RS-485 transceivers with a total of 32 unit loads or fewer can be connected to the line. REDUCED EMI AND REFLECTIONS The ADM3070E/ADM3071E/ADM3072E feature reduced slew rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing for errorfree data transmission at rates up to 250 kbps. The ADM3073E/ ADM3074E/ADM3075E offer higher driver output slew rate limits, allowing for transmit speeds of up to 500 kbps. Rev. F | Page 16 of 20 ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E LOW POWER SHUTDOWN MODE (ALL EXCEPT ADM3071E/ADM3074E/ADM3077E) Low power shutdown mode is initiated by bringing both RE high and DE low. In shutdown mode, the device draws less than 1 µA of supply current. RE and DE can be driven simultaneously, but the parts are guaranteed not to enter shutdown if RE is high and DE is low for fewer than 50 ns. If the inputs are in this state for 600 ns or more, the parts are guaranteed to enter shutdown. Enable times tZH and tZL assume that the part was not originally in a low power shutdown state (see the Test Circuits and Switching Characteristics section). Enable times (tZH(SHDN) and tZL(SHDN)) assume that the part was originally shut down. It takes drivers and receivers longer to become enabled from low power shutdown mode (tZH(SHDN), tZL(SHDN)) than from driver/ receiver disable mode (tZH, tZL). DRIVER OUTPUT PROTECTION The ADM307xE family features two methods to prevent excessive output current and power dissipation caused by faults or by bus contention. Current limit protection on the output stage provides immediate protection against short circuits over the whole common-mode voltage range (see Figure 22 and Figure 23). In addition, a thermal shutdown circuit forces the driver outputs into a high impedance state if the die temperature rises excessively. TYPICAL APPLICATIONS The ADM3072E/ADM3075E/ADM3078E transceivers are designed for bidirectional data communications on multipoint bus transmission lines. Figure 34 shows a typical network applications circuit. The ADM3071E/ADM3074E/ADM3077E transceivers are designed for point-to-point transmission lines (see Figure 35). The ADM3070E/ADM3073E/ADM3076E transceivers are designed for full-duplex RS-485 networks (see Figure 36). To minimize reflections, terminate the line at both ends with a termination resistor (the value of the termination resistor should be equal to the characteristic impedance of the cable used) and keep stub lengths off the main line as short as possible. ADM3072E/ ADM3075E/ ADM3078E R RO ADM3072E/ ADM3075E/ ADM3078E A A R RO RE RE RT RT DE DE DI D B B A A B ADM3072E/ ADM3075E/ ADM3078E R R D RE DE D RO DI RE DI DE 06285-016 RO NOTES 1. MAXIMUM NUMBER OF NODES: 256. 2. RT IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE USED. Figure 34. ADM3072E/ADM3075E/ADM3078E Typical Half-Duplex RS-485 Network MASTER SLAVE ADM3071E/ ADM3074E/ ADM3077E ADM3071E/ ADM3074E/ ADM3077E A Y B Z Z B Y A R D D R DI RO 06285-017 DI DI B ADM3072E/ ADM3075E/ ADM3078E RO D Figure 35. ADM3071E/ADM3074E/ADM3077E Full-Duplex Point-to-Point Applications Rev. F | Page 17 of 20 ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E SLAVE MASTER ADM3070E/ ADM3073E/ ADM3076E R RO A B Y RT Z ADM3070E/ ADM3073E/ ADM3076E D DE DI RE DE DI B Z D RT Y A R RO RE A ADM3070E/ ADM3073E/ ADM3076E B R A Y Z B R D RO RE DE Z DI RO Y SLAVE ADM3070E/ ADM3073E/ ADM3076E D RE DE DI 06285-019 SLAVE NOTES 1. MAXIMUM NUMBER OF NODES: 256. 2. RT IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE USED. Figure 36. ADM3070E/ADM3073E/ADM3076E Full-Duplex RS-485 Network ADM3070E/ ADM3073E/ ADM3076E A R B RO RT DATA IN RT DATA OUT RE DE Z D Y NOTES 1. RT IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE USED. 06285-018 DI Figure 37. Line Repeater for ADM3070E/ADM3073E/ADM3076E Rev. F | Page 18 of 20 ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E OUTLINE DIMENSIONS 5.00 (0.1968) 4.80 (0.1890) 5 1 6.20 (0.2441) 5.80 (0.2284) 4 1.27 (0.0500) BSC 0.25 (0.0098) 0.10 (0.0040) 1.75 (0.0688) 1.35 (0.0532) 0.51 (0.0201) 0.31 (0.0122) COPLANARITY 0.10 SEATING PLANE 0.50 (0.0196) 0.25 (0.0099) 45° 8° 0° 0.25 (0.0098) 0.17 (0.0067) 1.27 (0.0500) 0.40 (0.0157) COMPLIANT TO JEDEC STANDARDS MS-012-A A CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 012407-A 8 4.00 (0.1574) 3.80 (0.1497) Figure 38. 8-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-8) Dimensions shown in millimeters and (inches) 8.75 (0.3445) 8.55 (0.3366) 8 14 1 7 1.27 (0.0500) BSC 0.25 (0.0098) 0.10 (0.0039) COPLANARITY 0.10 0.51 (0.0201) 0.31 (0.0122) 6.20 (0.2441) 5.80 (0.2283) 0.50 (0.0197) 0.25 (0.0098) 1.75 (0.0689) 1.35 (0.0531) SEATING PLANE 45° 8° 0° 0.25 (0.0098) 0.17 (0.0067) 1.27 (0.0500) 0.40 (0.0157) COMPLIANT TO JEDEC STANDARDS MS-012-AB CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. Figure 39. 14-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-14) Dimensions shown in millimeters and (inches) Rev. F | Page 19 of 20 060606-A 4.00 (0.1575) 3.80 (0.1496) ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E ORDERING GUIDE Model1 ADM3070EARZ ADM3070EARZ-REEL7 ADM3070EYRZ ADM3070EYRZ-REEL7 ADM3071EARZ ADM3071EARZ-REEL7 ADM3071EYRZ ADM3071EYRZ-REEL7 ADM3072EARZ ADM3072EARZ-REEL7 ADM3072EYRZ ADM3072EYRZ-REEL7 ADM3073EARZ ADM3073EARZ-REEL7 ADM3073EYRZ ADM3073EYRZ-REEL7 ADM3074EARZ ADM3074EARZ-REEL7 ADM3074EYRZ ADM3074EYRZ-REEL7 ADM3075EARZ ADM3075EARZ-REEL7 ADM3075EWYRZ ADM3075EWYRZ-RL7 ADM3075EYRZ ADM3075EYRZ-REEL7 ADM3076EARZ ADM3076EARZ-REEL7 ADM3076EYRZ ADM3076EYRZ-REEL7 ADM3077EARZ ADM3077EARZ-REEL7 ADM3077EYRZ ADM3077EYRZ-REEL7 ADM3078EARZ ADM3078EARZ-REEL7 ADM3078EYRZ ADM3078EYRZ-REEL7 1 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +125°C −40°C to +125°C −40°C to +85°C −40°C to +85°C −40°C to +125°C −40°C to +125°C −40°C to +85°C −40°C to +85°C −40°C to +125°C −40°C to +125°C −40°C to +85°C −40°C to +85°C −40°C to +125°C −40°C to +125°C −40°C to +85°C −40°C to +85°C −40°C to +125°C −40°C to +125°C −40°C to +85°C −40°C to +85°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +85°C −40°C to +85°C −40°C to +125°C −40°C to +125°C −40°C to +85°C −40°C to +85°C −40°C to +125°C −40°C to +125°C −40°C to +85°C −40°C to +85°C −40°C to +125°C −40°C to +125°C Package Description 14-Lead Standard Small Outline Package (SOIC_N) 14-Lead Standard Small Outline Package (SOIC_N) 14-Lead Standard Small Outline Package (SOIC_N) 14-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 14-Lead Standard Small Outline Package (SOIC_N) 14-Lead Standard Small Outline Package (SOIC_N) 14-Lead Standard Small Outline Package (SOIC_N) 14-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 14-Lead Standard Small Outline Package (SOIC_N) 14-Lead Standard Small Outline Package (SOIC_N) 14-Lead Standard Small Outline Package (SOIC_N) 14-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) 8-Lead Standard Small Outline Package (SOIC_N) Z = RoHS Compliant Part. ©2006–2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06285-0-9/19(F) Rev. F | Page 20 of 20 Package Option R-14 R-14 R-14 R-14 R-8 R-8 R-8 R-8 R-8 R-8 R-8 R-8 R-14 R-14 R-14 R-14 R-8 R-8 R-8 R-8 R-8 R-8 R-8 R-8 R-8 R-8 R-14 R-14 R-14 R-14 R-8 R-8 R-8 R-8 R-8 R-8 R-8 R-8 Ordering Quantity 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000
ADM3076EARZ
物料型号: - ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E

器件简介: - 这些是3.3V的低功耗数据收发器,具有±15kV ESD保护,适用于多点总线传输线的全双工和半双工通信。它们设计用于平衡数据传输,并符合TIA/EIA标准:RS-485和RS-422。

引脚分配: - 各型号有不同的引脚分配,例如ADM3070E/ADM3073E/ADM3076E型号有14个引脚,ADM3071E/ADM3074E/ADM3077E型号有8个引脚,ADM3072E/ADM3075E/ADM3078E型号也有8个引脚。

参数特性: - 包括数据速率、ESD保护级别、工作温度范围、封装类型等。例如,数据速率有250kbps、500kbps和16Mbps的选项。

功能详解: - 收发器具备热插拔功能、线路保护、低功耗关闭模式、驱动输出保护等特性。它们还具有差分输出、逻辑输入、接收器输出等功能。

应用信息: - 适用于能源计量、工业控制、照明系统、电信、安全系统和仪器仪表等领域。

封装信息: - 提供8引脚和14引脚的窄体小外形集成电路(SOIC)封装。
ADM3076EARZ 价格&库存

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ADM3076EARZ
    •  国内价格
    • 1+51.92791
    • 10+29.00093
    • 50+25.66454
    • 100+24.12467
    • 200+22.75589

    库存:224