±15 kV ESD-Protected, 3.3 V,12 Mbps,
EIA RS-485/RS-422 Transceiver
ADM3485E
FEATURES
TIA/EIA RS-485/RS-422 compliant
±15 kV ESD protection on RS-485 input/output pins
12 Mbps data rate
Half-duplex transceiver
Up to 32 nodes on the bus
Receiver open-circuit, fail-safe design
Low power shutdown current
Outputs high-Z when disabled or powered off
Common-mode input range: −7 V to +12 V
Thermal shutdown and short-circuit protection
Industry-standard 75176 pinout
8-lead narrow SOIC package
FUNCTIONAL BLOCK DIAGRAM
ADM3485E
RO
R
B
RE
A
DE
DI
D
Power/energy metering
Telecommunications
EMI-sensitive systems
Industrial control
Local area networks
03338-001
APPLICATIONS
Figure 1.
GENERAL DESCRIPTION
The ADM3485E is a 3.3 V, low power data transceiver with
±15 kV ESD protection, suitable for half-duplex communication on multipoint bus transmission lines. The ADM3485E
is designed for balanced data transmission and complies with
TIA/EIA standards RS485 and RS-422. The ADM3485E is a
half-duplex transceiver that shares differential lines and has
separate enable inputs for the driver and the receiver.
The devices have a 12 kΩ receiver input impedance, which
allows up to 32 transceivers on a bus. Because only one driver
should be enabled at any time, the output of a disabled or
powered-down driver is tristated to avoid overloading the bus.
The receiver has a fail-safe feature that ensures a logic high
output when the inputs are floating. Excessive power dissipation
caused by bus contention or by output shorting is prevented
with a thermal shutdown circuit.
The part is fully specified over the industrial temperature range
and is available in an 8-lead narrow SOIC package.
Rev. D
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
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Fax: 781.461.3113 ©2000-2010 Analog Devices, Inc. All rights reserved.
ADM3485E
TABLE OF CONTENTS
Features .............................................................................................. 1
Test Circuits and Switching Characteristics...................................7
Applications ....................................................................................... 1
Typical Performance Characteristics ..............................................9
Functional Block Diagram .............................................................. 1
Standards and Testing .................................................................... 11
General Description ......................................................................... 1
ESD Testing ................................................................................. 11
Revision History ............................................................................... 2
Applications Information .............................................................. 12
Specifications..................................................................................... 3
Differential Data Transmission ................................................ 12
Timing Specifications....................................................................... 4
Cable and Data Rate ................................................................... 12
Absolute Maximum Ratings............................................................ 5
Receiver Open-Circuit Fail-Safe............................................... 12
Thermal Resistance ...................................................................... 5
Outline Dimensions ....................................................................... 13
ESD Caution .................................................................................. 5
Ordering Guide .......................................................................... 13
Pin Configuration and Pin Function Descriptions ...................... 6
REVISION HISTORY
8/10—Rev. C to Rev. D
Changes to Table 1, Driver, Logic Inputs ...................................... 3
12/06—Rev. B to Rev. C
Updated Format .................................................................. Universal
Removed PDIP Model ....................................................... Universal
Changes to Features, Applications, and General Description .... 1
Changes to Specifications ................................................................ 3
Changes to Timing Specifications .................................................. 4
Changes to Absolute Maximum Ratings ....................................... 5
Reorganized Test Circuits and Switching
Characteristics Section..................................................................... 7
Replaced Figure 3 to Figure 11 ....................................................... 7
Deleted Figure 12 to Figure 14 ........................................................ 8
Changes to Figure 15 to Figure 20 .................................................. 9
Changes to Figure 21 and Figure 22 ............................................. 10
Changes to Table 9 .......................................................................... 11
Deleted Figure 24 ............................................................................ 11
Removed Fast Transient Burst Immunity
(IEC1000-4-4) Section ................................................................... 12
Updated Outline Dimensions ....................................................... 13
Changes to Ordering Guide .......................................................... 13
10/04—Rev. A to Rev. B
Updated Format .................................................................. Universal
Changes to Power-Supply Current, Table 1 .................................. 3
Updated Outline Dimensions ....................................................... 14
Changes to Ordering Guide .......................................................... 14
5/00—Rev. 0 to Rev. A
Rev. D | Page 2 of 16
ADM3485E
SPECIFICATIONS
VCC = +3.3 V ± 0.3 V. All specifications TMIN to TMAX, unless otherwise noted.
Table 1.
Parameter
DRIVER
Differential Outputs
Differential Output Voltage
∆|VOD| for Complementary Output States 1
Common-Mode Output Voltage
∆|VOC| for Complementary Output States1
Short-Circuit Output Current
Symbol
Min
VOD
2.0
1.5
1.5
∆VOD
VOC
∆VOC
IOSD
Typ
Max
Unit
Test Conditions/Comments
V
V
V
V
V
V
mA
mA
RL = 100 Ω (RS-422) (see Figure 3)
RL = 54 Ω (RS-485) (see Figure 3)
RL = 60 Ω (RS-485) (see Figure 4)
RL = 54 Ω or 100 Ω (see Figure 3)
RL = 54 Ω or 100 Ω ( see Figure 3)
RL = 54 Ω or 100 Ω (see Figure 3)
VOUT = –7 V
VOUT = 12 V
V
V
µA
DE, DI, RE
DE, DI, RE
DE, DI, RE
V
mV
kΩ
mA
mA
–7 V < VCM < +12 V
VCM = 0 V
–7 V < VCM < +12 V
DE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V
DE = 0 V, VCC = 0 V or 3.6 V, VIN = –7 V
0.4
±60
±1
V
V
mA
µA
IOUT = –1.5 mA, VID = 200 mV (see Figure 5)
IOUT = 2.5 mA, VID = 200 mV (see Figure 5)
0 V < VRO < VCC
VCC = 3.6 V, 0 V < VOUT < VCC
1.1
3.6
2.2
V
mA
0.95
1.9
mA
0.002
1
µA
No load, DI = 0 V or VCC, DE = VCC,
RE = 0 V or VCC
No load, DI = 0 V or VCC, DE = 0 V,
RE = 0 V
DE = 0 V, RE = VCC, DI = 0 V or VCC
kV
kV
Human body model
Human body model
0.2
3
0.2
–250
250
Logic Inputs
Input Low Voltage
Input High Voltage
Logic Input Current
RECEIVER
Differential Inputs
Differential Input Threshold Voltage
Input Voltage Hysteresis
Input Resistance (A, B)
Input Current (A, B)
VIL
VIH
IIN1
VTH
∆VTH
RIN
IIN2
0.8
2.0
±2
–0.2
+0.2
50
12
1.0
–0.8
RO Logic Output
Output Voltage High
Output Voltage Low
Short-Circuit Output Current
Tristate Output Leakage Current
POWER SUPPLY CURRENT
Voltage Range
Supply Current
Shutdown Current
ESD PROTECTION
A, B Pins
All Pins Except A, B
1
VOH
VOL
IOSR
IOZR
VCC – 0.4 V
VCC
ICC
3.0
ISHDN
±8
±15
±4
Δ|VOD| and Δ|VOC| are the changes in VOD and VOC, respectively, when DI input changes state.
Rev. D | Page 3 of 16
ADM3485E
TIMING SPECIFICATIONS
VCC = 3.3 V, TA = 25°C.
Table 2.
Parameter
DRIVER
Maximum Data Rate
Differential Output Delay
Differential Output Transition Time
Propagation Delay
From Low to High Level
From High to Low Level
|tPLH − tPHL| Propagation Delay Skew
Enable/Disable Timing
Enable Time to Low Level
Enable Time to High Level
Disable Time from Low Level
Disable Time from High Level
Enable Time from Shutdown to Low Level
Enable Time from Shutdown to High Level
RECEIVER
Propagation Delay
From Low to High Level
From High to Low Level
|tRPLH − tRPHL| Propagation Delay Skew
Enable/Disable Timing
Enable Time to Low Level
Enable Time to High Level
Disable Time from Low Level
Disable Time from High Level
Enable Time from Shutdown to Low Level
Enable Time from Shutdown to High Level
Time to Shutdown1
1
Symbol
Min
Typ
Max
Unit
Test Conditions/Comments
tDD
tTD
12
1
3
15
22
11
35
25
ns
ns
RL = 60 Ω, CL1 = CL2 = 15 pF (see Figure 6)
RL = 60 Ω, CL1 = CL2 = 15 pF (see Figure 6)
7
7
23
23
–1.4
35
35
±8
ns
ns
ns
RL = 27 Ω (see Figure 7)
RL = 27 Ω (see Figure 7)
RL = 27 Ω (see Figure 7)
42
42
35
35
650
650
90
90
80
80
900
900
ns
ns
ns
ns
ns
ns
RL = 110 Ω (see Figure 9)
RL = 110 Ω (see Figure 8)
RL = 110 Ω (see Figure 9)
RL = 110 Ω (see Figure 8)
RL = 110 Ω (see Figure 9)
RL = 110 Ω (see Figure 8)
62
62
6
90
90
±10
ns
ns
ns
VID = 0 V to 3.0 V, CL = 15 pF (see Figure 10)
VID = 0 V to 3.0 V, CL = 15 pF (see Figure 10)
VID = 0 V to 3.0 V, CL = 15 pF (see Figure 10)
25
25
25
25
720
720
190
50
50
45
45
1400
1400
300
ns
ns
ns
ns
ns
ns
ns
CL = 15 pF (see Figure 11)
CL = 15 pF (see Figure 11)
CL = 15 pF (see Figure 11)
CL = 15 pF (see Figure 11)
CL = 15 pF (see Figure 11)
CL = 15 pF (see Figure 11)
tPLH
tPHL
tPDS
tPZL
tPZH
tPLZ
tPHZ
tPSL
tPSH
tRPLH
tRPHL
tRPDS
tRPZL
tRPZH
tRPLZ
tRPHZ
tRPSL
tRPSH
tSHDN
25
25
80
The transceivers are put into shutdown mode by bringing the RE high and the DE low. If the inputs are in this state for less than 80 ns, the parts are guaranteed not to
enter shutdown. If the parts are in this state for 300 ns or more, the parts are guaranteed to enter shutdown.
Rev. D | Page 4 of 16
ADM3485E
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE
Table 3.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Parameter
VCC to GND
Digital Input/Output Voltage (DE, RE, DI)
Receiver Output Voltage (RO)
Driver Output (A, B)/
Receiver Input (A, B) Voltage
Driver Output Current
Power Dissipation (8-Lead SOIC_N)
Operating Temperature Range
Storage Temperature Range
Lead Temperature, Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
ESD Rating
Human Body Model (A, B)
Values
–0.3 V to +6 V
–0.3 V to +6 V
–0.3 V to (VCC + 0.3 V)
−8 V to +13 V
±250 mA
650 mW
–40°C to +85°C
–65°C to +150°C
300°C
215°C
220°C
Table 4. Thermal Resistance
Package Type
8-Lead SOIC_N
ESD CAUTION
±15 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. D | Page 5 of 16
θJA
158
Unit
°C/W
ADM3485E
8
VCC
RE 2
ADM3485E
7
B
DE 3
TOP VIEW
(Not to Scale)
6
A
5
GND
RO 1
DI 4
03338-002
PIN CONFIGURATION AND PIN FUNCTION DESCRIPTIONS
Figure 2. SOIC_N Pin Configuration (R-8)
Table 5. Pin Function Descriptions
Mnemonic
RO
RE
Pin
Number
1
2
DE
3
DI
4
GND
A
B
VCC
5
6
7
8
Description
Receiver Output. When enabled, if A > B by 200 mV, then RO = high. If A < B by 200 mV, then RO = low.
Receiver Output Enable. With RE low, the receiver output (RO) is enabled. With RE high, the output goes into a
high impedance state. If RE is high and DE is low, the ADM3485E enters a shutdown state.
Driver Output Enable. A high level enables the driver differential outputs A and B. A low level places it in a high
impedance state.
Driver Input. When the driver is enabled, a logic low on DI forces A low and B high, while a logic high on DI
forces A high and B low.
Ground Connection, 0 V.
Noninverting Receiver Input A/Driver Output A.
Inverting Receiver Input B/Driver Output B.
Power Supply, 3.3 V ± 0.3 V.
Rev. D | Page 6 of 16
ADM3485E
TEST CIRCUITS AND SWITCHING CHARACTERISTICS
VOM
A
RL = 27Ω
RL/2
S1
VOD
B
OUT
D
03338-037
VOC
RL/2
GENERATOR1
CL = 15pF2
50Ω
VCC
Figure 3. Driver Differential Output Voltage and
Common-Mode Output Voltage
VOM =
VOH + VOL
2
≈ 1.5V
375Ω
1PPR = 250kHz, 50% DUTY CYCLE, t ≤ 6.0ns, Z = 50Ω.
O
R
2C INCLUDES PROBE AND STRAY CAPACITANCE.
L
VCM =
–7V TO +12V
RL
VOD
VCC
3V
03338-038
D
375Ω
IN
1.5V
1.5V
0V
Figure 4. Driver Differential Output Voltage with
Varying Common-Mode Voltage
tPLH
tPHL
VOH
A
OUT
VOM
VOM
VOL
VID
tPHL
R
tPLH
VOH
IOH
(–)
(+)
03338-039
IOL
VOL
B
OUT
VOM
VOM
VOL
Figure 7. Driver Propagation Delays
Figure 5. Receiver Output Voltage High and Output Voltage Low
S1
CL
0V OR 3V
RL =
OUT
60Ω
D
GENERATOR1
03338-041
VOH
0
OUT
D
CL = 50pF2
RL = 110Ω
50Ω
VCC
GENERATOR1
CL = 15pF2
50Ω
VOM =
1PPR = 250kHz, 50% DUTY CYCLE, t ≤ 6.0ns, Z = 50Ω.
R
O
2C INCLUDES PROBE AND STRAY CAPACITANCE.
L
VOH + VOL
2
≈ 1.5V
1PPR = 250kHz, 50% DUTY CYCLE, t ≤ 6.0ns, Z = 50Ω.
R
O
2C INCLUDES PROBE AND STRAY CAPACITANCE.
L
+3V
+1.5V
+1.5V
3V
0V
90%
tTD
1.5V
90%
0V
≈ +2V
50%
10%
tTD
≈ –2V
tPZH
OUT
03338-040
50%
10%
1.5V
tDD
tDD
OUT
IN
tPHZ
0.25V
VOH
VOM
0V
Figure 6. Driver Differential Output Delay and Transition Times
Figure 8. Driver Enable and Disable Times (tPZH, tPSH, tPHZ)
Rev. D | Page 7 of 16
03338-042
IN
ADM3485E
VCC
RL = 110Ω
S1
0V OR 3V
OUT
D
VID
GENERATOR1
CL = 50pF2
OUT
50Ω
CL = 15pF2
50Ω
1.5V
VOM =
0V
1PPR = 250kHz, 50% DUTY CYCLE, t ≤ 6.0ns, Z = 50Ω.
R
O
2C INCLUDES PROBE AND STRAY CAPACITANCE.
L
1.5V
3V
1.5V
1.5V
IN
1.5V
0V
0V
tPLZ
tPSL
tRPLH
VCC
OUT
tRPHL
VCC
0.25V
03338-043
VOM
VOL
VOM
OUT
Figure 10. Receiver Propagation Delays
S1
S3
+1.5V
VOM
0V
Figure 9. Driver Enable and Disable Times (tPZL, tPSL, tPLZ)
VID
–1.5V
VCC
1kΩ
R
S2
CL2
GENERATOR1
50Ω
1PPR = 250kHz, 50% DUTY CYCLE, t ≤ 6.0ns, Z = 50Ω.
R
O
2C INCLUDES PROBE AND STRAY CAPACITANCE.
L
+3V
+1.5V
IN
0V
tRPZH
tRPSH
OUT
S1 OPEN
S2 CLOSED
S3 = +1.5V
+3V
IN
+1.5V
VOH
+1.5V
VOL
+3V
+3V
0V
S1 CLOSED
S2 OPEN
S3 = –1.5V
VCC
OUT
+1.5V
+1.5V
S1 OPEN
S2 CLOSED
S3 = +1.5V
+1.5V
IN
0V
tRPHZ
S1 CLOSED
S2 OPEN
S3 = –1.5V
tRPLZ
VCC
VOH
OUT
0V
tRPZL
tRPSL
0V
IN
VOL
0V
+0.25V
Figure 11. Receiver Enable and Disable Times
Rev. D | Page 8 of 16
03338-045
OUT
+0.25V
2
1PPR = 250kHz, 50% DUTY CYCLE, t ≤ 6.0ns, Z = 50Ω.
R
O
2C INCLUDES PROBE AND STRAY CAPACITANCE.
L
3V
IN
VCC
03338-044
GENERATOR1
R
ADM3485E
TYPICAL PERFORMANCE CHARACTERISTICS
25
0.8
IRO = 2.5mA
0.7
OUTPUT LOW VOLTAGE (V)
OUTPUT CURRENT (mA)
20
15
10
5
0.6
0.5
0.4
0.3
0.2
0
0.5
1.0
1.5
2.0
2.5
3.5
3.0
OUTPUT LOW VOLTAGE (V)
0
–40
03338-051
0
Figure 12. Output Current vs. Receiver Output Low Voltage
–18
100
–16
90
85
80
OUTPUT CURRENT (mA)
–12
–10
–8
–6
–4
70
60
50
40
30
20
–2
0
0.5
1.0
1.5
2.0
2.5
3.5
3.0
OUTPUT HIGH VOLTAGE (V)
0
03338-052
0
0
0.5
1.0
1.5
2.0
2.5
3.0
Figure 13. Output Current vs. Receiver Output High Voltage
Figure 16. Driver Output Current vs. Differential Output Voltage
2.6
3.30
3.5
DIFFERENTIAL OUTPUT VOLTAGE (V)
03338-055
10
RL = 54Ω
DIFFERENTIAL OUTPUT VOLTAGE (V)
IRO = –1.5mA
3.25
3.20
3.15
3.10
3.05
2.5
2.4
2.3
2.2
2.1
2.0
1.9
1.8
1.7
–25
0
25
50
75
TEMPERATURE (°C)
1.6
–50
03338-053
3.00
–50
–25
0
25
50
75
TEMPERATURE (°C)
Figure 14. Receiver Output High Voltage vs. Temperature
Figure 17. Driver Differential Output Voltage vs. Temperature
Rev. D | Page 9 of 16
03338-056
OUTPUT CURRENT (mA)
60
Figure 15. Receiver Output Low Voltage vs. Temperature
–14
OUTPUT HIGH VOLTAGE (V)
10
TEMPERATURE (°C)
03338-054
0.1
ADM3485E
0.9
120
0.8
0.7
SHUTDOWN CURRENT (µA)
OUTPUT CURRENT (mA)
100
80
60
40
0.6
0.5
0.4
0.3
0.2
20
0
2
4
6
8
10
12
OUTPUT LOW VOLTAGE (V)
0
–50
03338-057
0
–25
0
25
50
03338-060
0.1
75
TEMPERATURE (°C)
Figure 18. Output Current vs. Driver Output Low Voltage
Figure 21. Shutdown Current vs. Temperature
120
DI
80
3
60
A
40
20
–6
–5
–4
–3
–2
–1
0
1
2
3
4
OUTPUT HIGH VOLTAGE (V)
B
CH1 1.0V Ω
CH3 2.0V Ω
03338-058
0
–7
CH1
CH2
Figure 19. Output Current vs. Driver Output High Voltage
CH2 1.0V Ω
IT 400ps/pt A CH3
M20ns 1.25GS/s
1.44V
03338-061
OUTPUT CURRENT (mA)
100
Figure 22. Driver Propagation Delay
1.2
V A – VB
1.0
M1
0.9
0.8
0.7
RO
0.6
–10
20
50
TEMPERATURE (°C)
80
Figure 20. Supply Current vs. Temperature
CH3 2.0V Ω M200ns 250MS/s
MATH1 2.01V 200ns
4ns/pt
A CH2
Figure 23. Receiver Propagation Delay,
Driven by External RS-485 Device
Rev. D | Page 10 of 16
1.24V
03338-062
3
0.5
–40
03338-059
SUPPLY CURRENT (mA)
1.1
ADM3485E
STANDARDS AND TESTING
Table 6 compares RS-422 and RS-485 interface standards, and
Table 7 and Table 8 show transmitting and receiving truth tables.
Table 6.
Specification
Transmission Type
Maximum Data Rate
Maximum Cable Length
Minimum Driver Output Voltage
Driver Load Impedance
Receiver Input Resistance
Receiver Input Sensitivity
Receiver Input Voltage Range
Number of Drivers/Receivers per Line
RS-422
Differential
10 Mbps
4000 ft
±2 V
100 Ω
4 kΩ min
±200 mV
−7 V to +7 V
1/10
RS-485
Differential
10 Mbps
4000 ft
±1.5 V
54 Ω
12 kΩ min
±200 mV
−7 V to +12 V
32/32
Table 7. Transmitting Truth Table
RE
X1
X1
0
1
1
2
Transmitting Inputs
DE
DI
1
1
0
0
1
0
X1
X1
B
Transmitting Outputs
A
0
1
High-Z2
High-Z2
1
0
High-Z2
High-Z2
1
2
X1
X1
X1
X1
ESD Test Method
Human Body Model
Receiving Outputs
A–B
RO
> +0.2 V
< –0.2 V
Inputs open
X1
1
0
1
High-Z2
I/O Pins
±15 kV
100%
90%
IPEAK
0
0
0
1
I/O lines are particularly vulnerable to ESD damage. Simply
touching or plugging in an I/O cable can result in a static
discharge that can damage or completely destroy the interface
product connected to the I/O port. It is extremely important,
therefore, to have high levels of ESD protection on the I/O lines.
Table 9. ESD Test Results
Table 8. Receiving Truth Table
RE
Although very little energy is contained within an ESD pulse,
the extremely fast rise time, coupled with high voltages, can
cause failures in unprotected semiconductors. Catastrophic
destruction can occur immediately as a result of arcing or
heating. Even if catastrophic failure does not occur immediately,
the device can suffer from parametric degradation, which can
result in degraded performance. The cumulative effects of
continuous exposure can eventually lead to complete failure.
The ESD discharge could induce latch-up in the device under
test, so it is important that ESD testing on the I/O pins be
carried out while device power is applied. This type of testing is
more representative of a real-world I/O discharge, where the
equipment is operating normally when the discharge occurs.
X = don't care.
High-Z = high impedance.
Receiving Inputs
DE
influenced by humidity, temperature, barometric pressure,
distance, and rate of closure of the discharge gun. The contact
discharge method, while less realistic, is more repeatable and is
gaining acceptance and preference over the air-gap method.
X = don't care.
High-Z = high impedance.
ESD TESTING
Rev. D | Page 11 of 16
36.8%
10%
tRL
tDL
TIME t
Figure 24. Human Body Model Current Waveform
03338-023
Two coupling methods are used for ESD testing, contact
discharge and air-gap discharge. Contact discharge calls for a
direct connection to the unit being tested. Air-gap discharge
uses a higher test voltage but does not make direct contact with
the unit under test. With air-gap discharge, the discharge gun is
moved toward the unit under test, developing an arc across the
air gap, hence the term air-gap discharge. This method is
ADM3485E
APPLICATIONS INFORMATION
DIFFERENTIAL DATA TRANSMISSION
Differential data transmission is used to reliably transmit data
at high rates over long distances and through noisy environments. Differential transmission nullifies the effects of ground
shifts and noise signals that appear as common-mode voltages
on the line.
Two main standards that specify the electrical characteristics of
transceivers used in differential data transmission are approved
by the Electronics Industries Association (EIA). The RS-422
standard specifies data rates up to 10 Mbps and line lengths up
to 4000 feet. A single driver can drive a transmission line with
up to 10 receivers. The RS-485 standard was defined to cater to
true multipoint communications. This standard meets or
exceeds all the requirements of RS-422 but also allows multiple
drivers and receivers to be connected to a single bus. An
extended common-mode range of −7 V to +12 V is defined.
The most significant difference between RS-422 and RS-485 is
the fact that under the RS-485 standard the drivers may be
disabled, thereby allowing more than one to be connected to a
single line. Only one driver should be enabled at a time, but the
RS-485 standard contains additional specifications to guarantee
device safety in the event of line contention.
CABLE AND DATA RATE
The transmission line of choice for RS-485 communications is a
twisted pair. Twisted-pair cable tends to cancel common-mode
noise and also causes cancellation of the magnetic fields
generated by the current flowing through each wire, thereby
reducing the effective inductance of the pair.
The ADM3485E is designed for bidirectional data communications on multipoint transmission lines. A typical application
showing a multipoint transmission network is illustrated in
Figure 25. Only one driver can transmit at a particular time,
but multiple receivers may be enabled simultaneously.
As with any transmission line, it is important that reflections are
minimized. This can be achieved by terminating the extreme
ends of the line using resistors equal to the characteristic impedance of the line. Stub lengths off the main line must also be
kept as short as possible. A properly terminated transmission
line appears purely resistive to the driver.
RECEIVER OPEN-CIRCUIT FAIL-SAFE
The receiver input includes a fail-safe feature that guarantees
a logic high on the receiver when the inputs are open circuit
or floating.
Table 10. RS-422 and RS-485 Interface Standards
Specification
Transmission Type
Maximum Cable Length
Minimum Driver Output Voltage
Driver Load Impedance
Receiver Input Resistance
Receiver Input Sensitivity
Receiver Input Voltage Range
R
A
A
R
RO
RE
RE
DE
DE
D
B
B
A
A
B
ADM3485E
R
R
D
RE
DI
B
ADM3485E
RO
D
DE
D
RO
DI
RE
DE
MAXIMUM NUMBER OF TRANSCEIVERS ON BUS: 50
Figure 25. Multipoint Transmission Network
Rev. D | Page 12 of 16
DI
03338-027
DI
RS-485
Differential
4000 ft
±1.5 V
54 Ω
12 kΩ min
±200 mV
−7 V to +12 V
ADM3485E
ADM3485E
RO
RS-422
Differential
4000 ft
±2 V
100 Ω
4 kΩ min
±200 mV
−7 V to +7 V
ADM3485E
OUTLINE DIMENSIONS
5.00 (0.1968)
4.80 (0.1890)
1
5
4
1.27 (0.0500)
BSC
0.25 (0.0098)
0.10 (0.0040)
COPLANARITY
0.10
SEATING
PLANE
6.20 (0.2441)
5.80 (0.2284)
1.75 (0.0688)
1.35 (0.0532)
0.51 (0.0201)
0.31 (0.0122)
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
012407-A
8
4.00 (0.1574)
3.80 (0.1497)
Figure 26. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model1
ADM3485EAR
ADM3485EAR-REEL7
ADM3485EAR-REEL
ADM3485EARZ
ADM3485EARZ-REEL7
ADM3485EARZ-REEL
1
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
Z = RoHS Compliant Part.
Rev. D | Page 13 of 16
Package Option
R-8
R-8
R-8
R-8
R-8
R-8
ADM3485E
NOTES
Rev. D | Page 14 of 16
ADM3485E
NOTES
Rev. D | Page 15 of 16
ADM3485E
NOTES
©2000-2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03338-0-8/10(D)
Rev. D | Page 16 of 16
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