FEATURES
FUNCTIONAL BLOCK DIAGRAMS
VCC
ADM4850/ADM4851/
ADM4852/ADM4853
RO
A
RE
B
DE
D
DI
GND
Figure 1. ADM4850/ADM4851/ADM4852/ADM4853 Functional Block Diagram
VCC
ADM4854/ADM4855/
ADM4856/ADM4857
A
RO
R
B
APPLICATIONS
Z
DI
D
Y
Low power RS-485 applications
EMI sensitive systems
DTE to DCE interfaces
Industrial control
Packet switching
Local area networks
Level translators
GND
Figure 2. ADM4854/ADM4855/ADM4856/ADM4857 Functional Block Diagram
GENERAL DESCRIPTION
The ADM4850/ADM4851/ADM4852/ADM4853/ADM4854/
ADM4855/ADM4856/ADM4857 are differential line transceivers
suitable for high speed, half-duplex and full duplex data
communication on multipoint bus transmission lines. They
are designed for balanced data transmission and comply with
EIA Standards RS-485 and RS-422. The ADM4850/ADM4851/
ADM4852/ADM4853 are half-duplex transceivers that share
differential lines and have separate enable inputs for the driver
and receiver. The full duplex ADM4854/ADM4855/ADM4856/
ADM4857 transceivers have dedicated differential line driver
outputs and receiver inputs.
The devices have a 1/8-unit load receiver input impedance,
which allows up to 256 transceivers on one bus. Because only one
driver must be enabled at any time, the output of a disabled or
powered down driver is three-stated to avoid overloading the bus.
The receiver inputs have a true fail-safe feature, which ensures a
logic high output level when the inputs are open or shorted.
Rev. F
R
04931-001
Electronics industries alliance (EIA) RS-485/RS-422 compliant
Data rate options
ADM4850/ADM4854: 115 kbps
ADM4851/ADM4855: 500 kbps
ADM4852/ADM4856: 2.5 Mbps
ADM4853/ADM4857: 10 Mbps
Half-duplex and full duplex options
Reduced slew rates for low electromagnetic interference (EMI)
True fail-safe receiver inputs
5 µA (maximum) supply current in shutdown mode
Up to 256 transceivers on one bus
Outputs high-Z when disabled or powered off
−7 V to +12 V bus common-mode range
Thermal shutdown and short-circuit protection
Pin-compatible with the MAX308x
Specified over the −40°C to +85°C temperature range
Available in 8-lead SOIC, 8-lead LFCSP, and 8-lead MSOP
Qualified for automotive applications
04931-028
Data Sheet
5 V, Slew Rate Limited, Half-Duplex and
Full Duplex RS-485/RS-422 Transceivers
ADM4850 to ADM4857
This guarantees that the receiver outputs are in a known state
before communication begins and when communication ends.
The driver outputs are slew rate limited to reduce EMI and data
errors caused by reflections from improperly terminated buses.
Excessive power dissipation caused by bus contention or by
output shorting is prevented with a thermal shutdown circuit.
The devices are fully specified over the commercial and industrial
temperature ranges and are available in 8-lead SOIC (ADM4850
through ADM4857), 8-lead LFCSP (ADM4850/ADM4852/
ADM4853), and 8-lead MSOP (ADM4850 only) packages.
Table 1. Selection Table
Device No.
ADM4850
ADM4851
ADM4852
ADM4853
ADM4854
ADM4855
ADM4856
ADM4857
Half-Duplex/Full Duplex
Half
Half
Half
Half
Full
Full
Full
Full
Data Rate
115 kbps
500 kbps
2.5 Mbps
10 Mbps
115 kbps
500 kbps
2.5 Mbps
10 Mbps
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ADM4850 to ADM4857
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Test Circuits..................................................................................... 11
Applications ....................................................................................... 1
Switching Characteristics .............................................................. 12
General Description ......................................................................... 1
Theory of Operation ...................................................................... 13
Functional Block Diagrams ............................................................. 1
Slew Rate Control ....................................................................... 13
Revision History ............................................................................... 2
Receiver Input Filtering ............................................................. 13
Specifications..................................................................................... 3
Half-Duplex/Full Duplex Operation ....................................... 13
ADM4850/ADM4854 Timing Specifications ........................... 4
High Receiver Input Impedance .............................................. 14
ADM4851/ADM4855 Timing Specifications ........................... 4
Three-State Bus Connection ..................................................... 14
ADM4852/ADM4856 Timing Specifications ........................... 5
Shutdown Mode ......................................................................... 14
ADM4853/ADM4857 Timing Specifications ........................... 5
Fail-Safe Operation .................................................................... 14
Absolute Maximum Ratings ............................................................ 6
Current Limit and Thermal Shutdown ................................... 14
ESD Caution .................................................................................. 6
Outline Dimensions ....................................................................... 15
Pin Configurations and Function Descriptions ........................... 7
Ordering Guide .......................................................................... 16
Typical Performance Characteristics ............................................. 9
Automotive Product................................................................... 16
REVISION HISTORY
5/16—Rev. E to Rev. F
Changes to Figure 1 .......................................................................... 1
Reformatted and Changes to Pin Configuration and Function
Descriptions Section ........................................................................ 7
Added Figure 6, Renumbered Sequentially .................................. 8
2/16—Rev. D to Rev. E
Changes to Figure 1 and General Description Section ............... 1
Changes to Table 2 ............................................................................ 3
Changes to Table 3 and Table 4 ....................................................... 4
Changes to Table 5 and Table 6 ....................................................... 5
Changes to Figure 3, Figure 4, and Table 8 Caption .................... 7
Added Table 9; Renumbered Sequentially .................................... 7
Changes to Figure 5 and Table 10 Caption ................................... 8
Changes to Figure 6 Caption ........................................................... 9
Changes to Figure 14 Caption and Figure 15 Caption .............. 10
Changes to Figure 21 Caption and Figure 23 Caption .............. 11
Changed Circuit Description Section to Theory of Operation
Section .............................................................................................. 13
Changes to Figure 28 ...................................................................... 13
Changes to the Three-State Bus Connection Section and the
Shutdown Mode Section ................................................................ 14
Updated Outline Dimensions ....................................................... 15
Changes to Ordering Guide .......................................................... 16
1/12—Rev. C to Rev. D
Change to Features Section ..............................................................1
Changes to Ordering Guide .......................................................... 15
Added Automotive Products Section .......................................... 15
1/11—Rev. B to Rev. C
Change to Table 8, Pin 3 Description .............................................7
Changes to Figure 29...................................................................... 12
Changes to Ordering Guide .......................................................... 15
7/09—Rev. A to Rev. B
Added MSOP Package ....................................................... Universal
Changes to Table 2.............................................................................3
Changes to Table 7.............................................................................6
Inserted Figure 4; Renumbered Sequentially ................................7
Moved Typical Performance Characteristics Section ...................8
Changes to Figure 24 and Figure 27 ............................................ 11
Changes to Figure 29...................................................................... 12
Change to Shutdown Mode Section............................................. 13
Updated Outline Dimensions ....................................................... 14
Changes to Ordering Guide .......................................................... 15
4/09—Rev. 0 to Rev. A
Changes to Ordering Guide .......................................................... 15
10/04—Revision 0: Initial Version
Rev. F | Page 2 of 16
Data Sheet
ADM4850 to ADM4857
SPECIFICATIONS
VCC = 5 V ± 5%, TA = TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter
DRIVER
Differential Output Voltage
Differential Output Voltage over CommonMode Range
Δ|VOD| for Complementary Output States
Common-Mode Output Voltage
Δ|VOC| for Complementary Output States
Output Short-Circuit Current
VOUT = High
VOUT = Low
DRIVER INPUT LOGIC
CMOS Input Logic Threshold
Low
High
CMOS Logic Input Current (DI)
DE Input Resistance to GND
RECEIVER
Differential Input Threshold Voltage
Input Hysteresis
Input Resistance (A, B)
Input Current (A, B)
CMOS Logic Input Current (RE)
CMOS Output Voltage
Low
High
Output Short-Circuit Current
Three-State Output Leakage Current
POWER SUPPLY CURRENT
115 kbps Options (ADM4850/ADM4854)
Min
Typ
VOD
|VOD3|
2.0
1.5
1.5
VOC
−200
−200
Unit
Test Conditions/Comments
VCC
5
5
5
V
V
V
V
R = ∞, see Figure 19 1
R = 50 Ω (RS-422), see Figure 19
R = 27 Ω (RS-485), see Figure 19
VTST = −7 V to +12 V, see Figure 20
0.2
3
0.2
V
V
V
R = 27 Ω or 50 Ω, see Figure 19
R = 27 Ω or 50 Ω, see Figure 19
R = 27 Ω or 50 Ω, see Figure 19
−7 V < VOUT < +12 V
+200
+200
mA
mA
0.8
V
V
µA
kΩ
2.0
±1
220
VTH
−200
96
−125
20
150
−30
mV
mV
kΩ
mA
mA
µA
−7 V < VOC < +12 V
−7 V < VOC < +12 V
−7 V < VOC < +12 V
VIN = 12 V
VIN = −7 V
85
±2
V
V
mA
µA
IOUT = 4 mA
IOUT = −4 mA
VOUT = GND or VCC
0.4 V ≤ VOUT ≤ 2.4 V
5
60
160
5
120
200
5
400
500
5
400
500
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
DE = 0 V, RE = VCC (shutdown)
DE = 0 V, RE = 0 V
DE = VCC
DE = 0 V, RE = VCC (shutdown)
DE = 0 V, RE = 0 V
DE = VCC
DE = 0 V, RE = VCC (shutdown)
DE = 0 V, RE = 0 V
DE = VCC
DE = 0 V, RE = VCC (shutdown)
DE = 0 V, RE = 0 V
DE = VCC
0.125
−0.1
±1
0.4
4.0
7
36
100
500 kbps Options (ADM4855)
80
120
2.5 Mbps Options (ADM4852/ADM4856)
250
320
10 Mbps Options (ADM4853/ADM4857)
250
320
1
Max
Guaranteed by design.
Rev. F | Page 3 of 16
ADM4850 to ADM4857
Data Sheet
ADM4850/ADM4854 TIMING SPECIFICATIONS
VCC = 5 V ± 5%, TA = TMIN to TMAX, unless otherwise noted.
Table 3.
Parameter
DRIVER
Maximum Data Rate
Propagation Delay
Skew
Rise/Fall Times
Enable Time
Disable Time
Enable Time from Shutdown
RECEIVER
Propagation Delay
Differential Skew
Enable Time
Disable Time
Enable Time from Shutdown
Time to Shutdown
1
Symbol
tPLH, tPHL
tSKEW
tR, tF
tZH, tZL
tLZ, tHZ
Min
Typ
115
600
600
Max
Unit
Test Conditions/Comments
2500
70
2400
2000
2000
kbps
ns
ns
ns
ns
ns
ns
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 21 and Figure 25
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 21 and Figure 25
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 21 and Figure 25
RL = 500 Ω, CL = 100 pF, see Figure 22 and Figure 27 (ADM4850 only)
RL = 500 Ω, CL = 15 pF, see Figure 22 and Figure 27 (ADM4850 only)
RL = 500 Ω, CL = 100 pF, see Figure 22 (ADM4850 only)
ns
ns
ns
ns
ns
ns
CL = 15 pF, see Figure 23 and Figure 26
CL = 15 pF, see Figure 23 and Figure 26
RL = 1 kΩ, CL = 15 pF, see Figure 24 and Figure 28 (ADM4850 only)
RL = 1 kΩ, CL = 15 pF, see Figure 24 and Figure 28 (ADM4850 only)
RL = 1 kΩ, CL = 15 pF, see Figure 24 (ADM4850 only)
ADM4850 only 1
4000
tPLH, tPHL
tSKEW
tZH, tZL
tLZ, tHZ
400
50
1000
255
50
50
5
20
4000
330
3000
The half-duplex device is put into shutdown mode by driving RE high and DE low. If these inputs are in this state for less than 50 ns, the device is guaranteed not to
enter shutdown mode. If the enable inputs are in this state for at least 3000 ns, the device is guaranteed to enter shutdown mode.
ADM4851/ADM4855 TIMING SPECIFICATIONS
VCC = 5 V ± 5%, TA = TMIN to TMAX, unless otherwise noted.
Table 4.
Parameter
DRIVER
Maximum Data Rate
Propagation Delay
Skew
Rise/Fall Times
Enable Time
Disable Time
Enable Time from Shutdown
RECEIVER
Propagation Delay
Differential Skew
Enable Time
Disable Time
Enable Time from Shutdown
Time to Shutdown
1
Symbol
tPLH, tPHL
tSKEW
tR , tF
tZH, tZL
tLZ, tHZ
Min
Typ
500
250
200
Max
Unit
Test Conditions/Comments
600
40
600
1000
1000
kbps
ns
ns
ns
ns
ns
ns
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 21 and Figure 25
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 21 and Figure 25
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 21 and Figure 25
RL = 500 Ω, CL = 100 pF, see Figure 22 and Figure 27 (ADM4851 only)
RL = 500 Ω, CL = 100 pF, see Figure 22 and Figure 27 (ADM4851 only)
RL = 500 Ω, CL = 100 pF, see Figure 22 (ADM4851 only)
ns
ns
ns
ns
ns
ns
CL = 15 pF, see Figure 23 and Figure 26
CL = 15 pF, see Figure 23 and Figure 26
RL = 1 kΩ, CL = 15 pF, see Figure 24 and Figure 28 (ADM4851 only)
RL = 1 kΩ, CL = 15 pF, see Figure 24 and Figure 28 (ADM4851 only)
RL = 1 kΩ, CL = 15 pF, see Figure 24 (ADM4851 only)
ADM4851 only 1
4000
tPLH, tPHL
tSKEW
tZH, tZL
tLZ, tHZ
400
50
5
20
4000
330
1000
250
50
50
3000
The half-duplex device is put into shutdown mode by driving RE high and DE low. If these inputs are in this state for less than 50 ns, the device is guaranteed not to
enter shutdown mode. If the enable inputs are in this state for at least 3000 ns, the device is guaranteed to enter shutdown mode.
Rev. F | Page 4 of 16
Data Sheet
ADM4850 to ADM4857
ADM4852/ADM4856 TIMING SPECIFICATIONS
VCC = 5 V ± 5%, TA = TMIN to TMAX, unless otherwise noted.
Table 5.
Parameter
DRIVER
Maximum Data Rate
Propagation Delay
Skew
Rise/Fall Times
Enable Time
Disable Time
Enable Time from Shutdown
RECEIVER
Propagation Delay
Differential Skew
Enable Time
Disable Time
Enable Time from Shutdown
Time to Shutdown
1
Symbol
tPLH, tPHL
tSKEW
tR , tF
tZH, tZL
Min
Typ
2.5
50
tLZ, tHZ
Max
Unit
180
50
140
180
Mbps
ns
ns
ns
ns
180
ns
4000
tPLH, tPHL
tSKEW
tZH, tZL
tLZ, tHZ
55
50
5
20
4000
330
190
50
50
50
3000
Test Conditions/Comments
ns
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 21 and Figure 25
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 21 and Figure 25
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 21 and Figure 25
RL = 500 Ω, CL = 100 pF, see Figure 22 and Figure 27 (ADM4852
only)
RL = 500 Ω, CL = 100 pF, see Figure 22 and Figure 27 (ADM4852
only)
RL = 500 Ω, CL = 100 pF, see Figure 22 (ADM4852 only)
ns
ns
ns
ns
ns
ns
CL = 15 pF, see Figure 23 and Figure 26
CL = 15 pF, see Figure 23 and Figure 26
RL = 1 kΩ, CL = 15 pF, see Figure 24 and Figure 28 (ADM4852 only)
RL = 1 kΩ, CL = 15 pF, see Figure 24 and Figure 28 (ADM4852 only)
RL = 1 kΩ, CL = 15 pF, see Figure 24 (ADM4852 only)
ADM4852 only 1
The half-duplex device is put into shutdown mode by driving RE high and DE low. If these inputs are in this state for less than 50 ns, the device is guaranteed not to
enter shutdown mode. If the enable inputs are in this state for at least 3000 ns, the device is guaranteed to enter shutdown mode.
ADM4853/ADM4857 TIMING SPECIFICATIONS
VCC = 5 V ± 5%, TA = TMIN to TMAX, unless otherwise noted.
Table 6.
Parameter
DRIVER
Maximum Data Rate
Propagation Delay
Skew
Rise/Fall Times
Enable Time
Disable Time
Enable Time from Shutdown
RECEIVER
Propagation Delay
Differential Skew
Enable Time
Disable Time
Enable Time from Shutdown
Time to Shutdown
1
Symbol
tPLH, tPHL
tSKEW
tR , tF
tZH, tZL
tLZ, tHZ
Min
Typ
10
0
Max
Unit
Test Conditions/Comments
30
10
30
35
35
Mbps
ns
ns
ns
ns
ns
ns
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 21 and Figure 25
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 21 and Figure 25
RLDIFF = 54 Ω, CL1 = CL2 = 100 pF, see Figure 21 and Figure 25
RL = 500 Ω, CL = 100 pF, see Figure 22 and Figure 27 (ADM4853 only)
RL = 500 Ω, CL = 100 pF, see Figure 22 and Figure 27 (ADM4853 only)
RL = 500 Ω, CL = 100 pF, see Figure 22 (ADM4853 only)
ns
ns
ns
ns
ns
ns
CL = 15 pF, see Figure 23 and Figure 26
CL = 15 pF, see Figure 23 and Figure 26
RL = 1 kΩ, CL = 15 pF, see Figure 24 and Figure 28 (ADM4853 only)
RL = 1 kΩ, CL = 15 pF, see Figure 24 and Figure 28 (ADM4853 only)
RL = 1 kΩ, CL = 15 pF, see Figure 24 (ADM4853 only)
ADM4853 only 1
4000
tPLH, tPHL
tSKEW
tZH, tZL
tLZ, tHZ
55
50
5
20
4000
330
190
30
50
50
3000
The half-duplex device is put into shutdown mode by driving RE high and DE low. If these inputs are in this state for less than 50 ns, the device is guaranteed not to
enter shutdown mode. If the enable inputs are in this state for at least 3000 ns, the device is guaranteed to enter shutdown mode.
Rev. F | Page 5 of 16
ADM4850 to ADM4857
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
VCC to GND
Digital Input/Output Voltage (DE, RE, DI, RO)
Driver Output/Receiver Input Voltage
Operating Temperature Range
Storage Temperature Range
θJA Thermal Impedance
8-Lead SOIC
8-Lead LFCSP
8-Lead MSOP
Lead Temperature
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
Rating
6V
−0.3 V to VCC + 0.3 V
−9 V to +14 V
−40°C to +85°C
−65°C to +125°C
110°C/W
62°C/W
133.1°C/W
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
300°C
215°C
220°C
Rev. F | Page 6 of 16
Data Sheet
ADM4850 to ADM4857
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
VCC
B
RE 2
ADM4850
7
DE 3
TOP VIEW
(Not to Scale)
6
A
5
GND
DI 4
ADM4850/
ADM4851/
ADM4852/
ADM4853
RO 1
RE 2
DE 3
DI 4
Figure 3. ADM4850, 8-Lead MSOP, Pin Configuration
8
VCC
B
TOP VIEW
(Not to Scale) 6 A
7
5
GND
04931-104
8
04931-002
RO 1
Figure 4. ADM4850/ADM4851/ADM4852/ADM4853, 8-Lead SOIC,
Pin Configuration
Table 8. ADM4850/ADM4851/ADM4852/ADM4853, 8-Lead MSOP and 8-Lead SOIC, Pin Function Descriptions
Pin No.
1
Mnemonic
RO
2
RE
3
DE
4
DI
5
6
7
8
GND
A
B
VCC
Description
Receiver Output. When RO is enabled and (A − B) ≥ −30 mV, RO is high. When RO is enabled and (A − B) ≤ −200 mV,
RO is low.
Receiver Output Enable. A low level on RE enables the receiver output (RO). A high level on RE places RO into a high
impedance state.
Driver Output Enable. A high level on DE enables the driver differential outputs (A and B). A low level on DE places
the driver differential outputs into a high impedance state.
Driver Input. When the driver is enabled, a logic low on DI forces A low and B high, whereas a logic high on DI
forces A high and B low.
Ground.
Noninverting Receiver Input A/Noninverting Driver Output A.
Inverting Receiver Input B/Inverting Driver Output B.
5 V Power Supply.
Rev. F | Page 7 of 16
ADM4850 to ADM4857
Data Sheet
ADM4850/ADM4852/ADM4853
8 VCC
RO 1
RE 2
TOP VIEW
(Not to Scale)
DE 3
7 B
6 A
NOTES
1. THE EXPOSED PADDLE ON THE UNDERSIDE
OF THE PACKAGE SHOULD BE SOLDERED
TO THE GROUND PLANE TO INCREASE THE
RELIABILITY OF THE SOLDER JOINTS AND
TO MAXIMIZE THE THERMAL CAPABILITY OF
THE PACKAGE.
04931-029
5 GND
DI 4
Figure 5. ADM4850/ADM4852/ADM4853, 8-Lead LFCSP, Pin Configuration
Table 9. ADM4850/ADM4852/ADM4853, 8-Lead LFCSP, Pin Function Descriptions
Pin No.
1
Mnemonic
RO
2
RE
3
DE
4
DI
5
6
7
8
GND
A
B
VCC
EPAD
Description
Receiver Output. When RO is enabled and (A − B) ≥ −30 mV, RO is high. When RO is enabled and (A − B) ≤ −200 mV,
RO is low.
Receiver Output Enable. A low level on RE enables the receiver output (RO). A high level on RE places RO into a high
impedance state.
Driver Output Enable. A high level on DE enables the driver differential outputs (A and B). A low level places the
driver differential outputs into a high impedance state.
Driver Input. When the driver is enabled, a logic low on DI forces A low and B high, whereas a logic high on DI
forces A high and B low.
Ground.
Noninverting Receiver Input A/Noninverting Driver Output A.
Inverting Receiver Input B/Inverting Driver Output B.
5 V Power Supply.
Exposed Pad. The exposed paddle on the underside of the package must be soldered to the ground plane to
increase the reliability of the solder joints and to maximize the thermal capability of the package.
ADM4854/
ADM4855/
ADM4856/
ADM4857
VCC 1
8
A
7 B
TOP VIEW
DI 3 (Not to Scale) 6 Z
GND 4
5
Y
04931-106
RO
2
Figure 6. ADM4854/ADM4855/ADM4856/ADM4857, 8-Lead SOIC, Pin Configuration
Table 10. ADM4854/ADM4855/ADM4856/ADM4857, 8-Lead SOIC, Pin Function Descriptions
Pin No.
1
2
Mnemonic
VCC
RO
3
DI
4
5
6
7
8
GND
Y
Z
B
A
Description
5 V Power Supply.
Receiver Output. When RO is enabled and (A − B) ≥ −30 mV, RO is high. When RO is enabled and (A − B) ≤ −200 mV,
RO is low.
Driver Input. When the driver is enabled, a logic low on DI forces Y low and Z high, whereas a logic high on DI forces
Y high and Z low.
Ground.
Noninverting Driver Output.
Inverting Driver Output.
Inverting Receiver Input.
Noninverting Receiver Input.
Rev. F | Page 8 of 16
Data Sheet
ADM4850 to ADM4857
TYPICAL PERFORMANCE CHARACTERISTICS
400
0.40
ADM4853: DE = V CC
OUTPUT LOW VOLTAGE (V)
0.35
ADM4853: DE = GND
250
200
ADM4850: DE = V CC
150
100
0.30
0.25
0.20
ADM4850: DE = GND
50
0
–50
–25
0
25
50
75
TEMPERATURE (°C)
100
0.15
–50
125
Figure 7. Unloaded Supply Current vs. Temperature (ADM4850/ADM4853)
04931-017
300
04931-014
UNLOADED SUPPLY CURRENT (μA)
350
–25
0
25
50
TEMPERATURE (°C)
75
100
125
Figure 10. Receiver Output Low Voltage vs. Temperature
50
4.6
4.5
OUTPUT HIGH VOLTAGE (V)
40
35
30
25
20
15
10
4.4
4.3
4.2
5
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
RECEIVER OUTPUT LOW VOLTAGE (V)
1.8
4.0
–50
2.0
Figure 8. Receiver Output Current vs. Receiver Output Low Voltage
04931-018
4.1
04931-015
RECEIVER OUTPUT CURRENT (mA)
45
–25
0
25
50
75
TEMPERATURE (°C)
100
125
Figure 11. Receiver Output High Voltage vs. Temperature
80
0
–5
–10
–15
–20
3.5
4.0
4.5
5.0
RECEIVER OUTPUT HIGH VOLTAGE (V)
70
60
50
40
30
20
04931-019
DRIVER OUTPUT CURRENT (mA)
5
04931-016
RECEIVER OUTPUT CURRENT (mA)
90
10
0
5.5
0
Figure 9. Receiver Output Current vs. Receiver Output High Voltage
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
DIFFERENTIAL OUTPUT VOLTAGE (V)
4.5
5.0
Figure 12. Driver Output Current vs. Differential Output Voltage
Rev. F | Page 9 of 16
ADM4850 to ADM4857
Data Sheet
800
120
700
ADM4855
PROPAGATION DELAY (ns)
80
60
40
600
500
400
300
200
ADM4853
20
04931-020
100
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
OUTPUT VOLTAGE (V)
4.0
4.5
04931-023
OUTPUT CURRENT (mA)
100
0
–50
5.0
Figure 13. Output Current vs. Driver Output Low Voltage
–25
0
25
50
75
TEMPERATURE (°C)
100
125
Figure 16. Receiver Propagation Delay vs. Temperature (ADM4853/ADM4855)
–30
3
–50
–70
–90
04931-021
2
–110
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
OUTPUT VOLTAGE (V)
4.0
4.5
04931-024
OUTPUT CURRENT (mA)
–10
4
CH1 1.00VΩ BW
CH3 2.00VΩ BW
5.0
Figure 14. Output Current vs. Driver Output High Voltage
CH2 1.00VΩ BW
CH4 5.00VΩ
M 400ns
CH3
2.00V
Figure 17. Driver/Receiver Propagation Delay (ADM4855, 500 kbps)
450
PROPAGATION DELAY (ns)
400
350
1
ADM4855
300
250
200
150
100
ADM4853
0
–50
–25
0
25
50
75
TEMPERATURE (°C)
100
04931-025
04931-022
2
50
4
CH1 2.00VΩ BW
CH3 1.00VΩ BW
125
Figure 15. Driver Propagation Delay vs. Temperature (ADM4853/ADM4855)
Rev. F | Page 10 of 16
CH2 1.00VΩ
CH4 5.00VΩ
M 50.0ns
CH1
480mV
Figure 18. Driver/Receiver Propagation Delay (ADM4857, 4 Mbps)
Data Sheet
ADM4850 to ADM4857
TEST CIRCUITS
VCC
A
VOD
0V OR 3V
VOC
04931-004
R
DE
CL
S2
VOUT
DE IN
375Ω
VTST
B
VOUT
RE
CL
375Ω
04931-008
A
04931-005
60Ω
B
Figure 22. Driver Enable/Disable (ADM4850/ADM4852/ADM4853)
Figure 19. Driver Voltage Measurement
VOD3
RL
S1
04931-007
R
Figure 23. Receiver Propagation Delay
Figure 20. Driver Voltage Measurement over Common-Mode Voltage Range
+1.5V
CL2
S1
RL
–1.5V
04931-006
RLDIFF
B
VCC
CL1
RE
CL
RE IN
VOUT
S2
04931-009
A
Figure 24. Receiver Enable/Disable (ADM4850/ADM4852/ADM4853)
Figure 21. Driver Propagation Delay
Rev. F | Page 11 of 16
ADM4850 to ADM4857
Data Sheet
SWITCHING CHARACTERISTICS
3V
3V
1.5V
0V
1.5V
1.5V
0V
tPHL
tPLH
1.5V
tLZ
tZL
1/2VOD
VOD
2.3V
A, B
VOL + 0.5V
A
VOL
tSKEW = |tPLH – tPHL|
5V
tZH
VOH
90% POINT
90% POINT
A, B
10% POINT
10% POINT
tR
tF
VOH – 0.5V
2.3V
04931-010
0V
tHZ
0V
04931-012
B
DE
Figure 27. Driver Enable/Disable Timing
Figure 25. Driver Propagation Delay, Rise/Fall Timing
3V
A, B
0V
RE
0V
1.5V
1.5V
0V
tLZ
tZL
tPLH
tPHL
tSKEW = |tPLH – tPHL|
1.5V
VOL
RO
VOL
tHZ
tZH
OUTPUT HIGH
1.5V
VOH
VOH – 0.5V
0V
Figure 26. Receiver Propagation Delay
Figure 28. Receiver Enable/Disable Timing
Rev. F | Page 12 of 16
04931-013
1.5V
VOL + 0.5V
OUTPUT LOW
04931-011
RO
1.5V
RO
VOH
Data Sheet
ADM4850 to ADM4857
THEORY OF OPERATION
RECEIVER INPUT FILTERING
The ADM4850/ADM4851/ADM4852/ADM4853/ADM4854/
ADM4855/ADM4856/ADM4857 are high speed RS-485/RS-422
transceivers offering enhanced performance over industrystandard devices. All devices in the family contain one driver
and one receiver but offer a choice of performance options. The
devices feature true fail-safe operation, which guarantees a logic
high receiver output when the receiver inputs are open circuit
or short-circuit, or when they are connected to a terminated
transmission line with all drivers disabled (see the Fail-Safe
Operation section).
The receivers of all the devices incorporate input hysteresis. In
addition, the receivers of the 115 kbps ADM4850 and ADM4854
and the 500 kbps ADM4851 and ADM4855 incorporate input
filtering, which enhances noise immunity with differential
signals that have very slow rise and fall times. However, it
causes the propagation delay to increase by 20%.
HALF-DUPLEX/FULL DUPLEX OPERATION
Half-duplex operation implies that the transceiver can transmit and
receive, but it can do only one of these at any given time. However,
with full duplex operation, the transceiver can transmit and
receive simultaneously. The ADM4850/ADM4851/ADM4852/
ADM4853 are half-duplex devices in which the driver and the
receiver share differential bus terminals. The ADM4854/
ADM4855/ADM4856/ADM4857 are full duplex devices that
have dedicated driver output and receiver input pins. Figure 29
and Figure 30 show typical half-duplex and full duplex topologies.
SLEW RATE CONTROL
The ADM4850 and ADM4854 feature a controlled slew rate
driver that minimizes EMI and reduces reflections caused by
incorrectly terminated cables, allowing error free data transmission
rates up to 115 kbps. The ADM4851 and ADM4855 offer a higher
limit on driver output slew rate, allowing data transmission
rates up to 500 kbps. The driver slew rates of the ADM4852/
ADM4856 and the ADM4853/ADM4857 are not limited,
offering data transmission rates up to 2.5 Mbps and 10 Mbps,
respectively.
ADM4850
ADM4852/ADM4853
RO
R
ADM4850/
ADM4852/ADM4853
R
A
A
RO
RE
RE
DE
ADM4850/
ADM4852/ADM4853
A
B
R
D
RO RE DE
DI
A
D
DI
B
R
D
RO RE DE
DI
MAXIMUM NUMBER OF TRANSCEIVERS ON BUS: 256
NOTES
1. THE ADM4851 IS A HALF-DUPLEX RS-485 TRANSCEIVER, BUT IT DOES NOT HAVE THE DRIVER ENABLE (DE) AND THE RECEIVER ENABLE (RE) PINS.
Figure 29. Typical Half-Duplex RS-485 Network Topology
VCC
ADM4854/ADM4855/
ADM4856/ADM4857
ADM4854/ADM4855/
ADM4856/ADM4857
RO
DI
A
Y
B
Z
Z
B
Y
A
D
R
R
D
GND
GND
Figure 30. Typical Full Duplex Point-to-Point RS-485 Network Topology
Rev. F | Page 13 of 16
DI
RO
04931-027
VCC
04931-026
D
B
ADM4850/
ADM4852/ADM4853
DI
DE
B
ADM4850 to ADM4857
Data Sheet
HIGH RECEIVER INPUT IMPEDANCE
FAIL-SAFE OPERATION
The input impedance of the ADM4850/ADM4851/ADM4852/
ADM4853/ADM4854/ADM4855/ADM4856/ADM4857 receivers
is 96 kΩ, which is eight times higher than the standard RS-485 unit
load of 12 kΩ. This 96 kΩ impedance enables a standard driver
to drive 32 unit loads or to be connected to 256 ADM4850/
ADM4851/ADM4852/ADM4853/ADM4854/ADM4855/
ADM4856/ADM4857 receivers. An RS-485 bus, driven by a
single standard driver, can be connected to a combination of
ADM4850/ADM4851/ADM4852/ADM4853/ADM4854/
ADM4855/ADM4856/ADM4857 devices and standard unit
load receivers, up to an equivalent of 32 standard unit loads.
The ADM4850/ADM4851/ADM4852/ADM4853/ADM4854/
ADM4855/ADM4856/ADM4857 offer true fail-safe operation
while remaining fully compliant with the ±200 mV EIA/TIA-485
standard. A logic high receiver output generates when the
receiver inputs are shorted together or open circuit, or when
they are connected to a terminated transmission line with all
drivers disabled. This logic high is done by setting the receiver
threshold between −30 mV and −200 mV. If the differential
receiver input voltage (A − B) is greater than or equal to
−30 mV, RO is logic high. If (A − B) is less than or equal to
−200 mV, RO is logic low. In the case of a terminated bus
with all transmitters disabled, the differential input voltage
of the receiver is pulled to 0 V by the internal circuitry of
the ADM4850/ADM4851/ADM4852/ADM4853/ADM4854/
ADM4855/ADM4856/ADM4857, which results in a logic high
with 30 mV minimum noise margin.
THREE-STATE BUS CONNECTION
The half-duplex devices (ADM4850/ADM4852/ADM4853)
have a driver enable pin (DE) that enables the driver outputs
when taken high, or puts the driver outputs into a high
impedance state when taken low. Similarly, the half-duplex devices
have an active low receiver enable pin (RE). Taking this pin low
enables the receiver, whereas taking it high puts the receiver
outputs into a high impedance state, which allows several driver
outputs to be connected to an RS-485 bus. Note that only one
driver must be enabled at a time, but that many receivers can be
enabled.
SHUTDOWN MODE
The ADM4850/ADM4852/ADM4853 have a low power
shutdown mode, which is enabled by taking RE high and DE
low. If shutdown mode is not used, the fact that DE is active
high and RE is active low offers a convenient way of switching the
device between transmit and receive by tying DE and RE together.
CURRENT LIMIT AND THERMAL SHUTDOWN
The ADM4850/ADM4851/ADM4852/ADM4853/ADM4854/
ADM4855/ADM4856/ADM4857 incorporate two protection
mechanisms to guard the drivers against short circuits, bus
contention, or other fault conditions. The first is a current limiting
output stage, which protects the driver against short circuits
over the entire common-mode voltage range by limiting the
output current to approximately 70 mA. Under extreme fault
conditions where the current limit is not effective, a thermal
shutdown circuit puts the driver outputs into a high impedance
state if the die temperature exceeds 150°C, and does not turn
them back on until the temperature falls to 130°C.
If DE is driven low and RE is driven high for less than 50 ns, the
devices are guaranteed not to enter shutdown mode. If DE is
driven low and RE is driven high for at least 3000 ns, the devices
are guaranteed to enter shutdown mode.
Rev. F | Page 14 of 16
Data Sheet
ADM4850 to ADM4857
OUTLINE DIMENSIONS
5.00 (0.1968)
4.80 (0.1890)
5
4
1.27 (0.0500)
BSC
0.25 (0.0098)
0.10 (0.0040)
COPLANARITY
0.10
SEATING
PLANE
6.20 (0.2441)
5.80 (0.2284)
1.75 (0.0688)
1.35 (0.0532)
0.51 (0.0201)
0.31 (0.0122)
8
3.20
3.00
2.80
0.50 (0.0196)
0.25 (0.0099)
45°
5.15
4.90
4.65
5
1
4
PIN 1
IDENTIFIER
8°
0°
0.65 BSC
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.95
0.85
0.75
15° MAX
1.10 MAX
0.15
0.05
COPLANARITY
0.10
0.40
0.25
0.23
0.09
6°
0°
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 31. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
Figure 32. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
1.84
1.74
1.64
3.10
3.00 SQ
2.90
1.55
1.45
1.35
EXPOSED
PAD
0.50
0.40
0.30
0.80
0.75
0.70
0.30
0.25
0.20
1
4
BOTTOM VIEW
TOP VIEW
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.203 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-229-WEED
Figure 33. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-8-13)
Dimensions shown in millimeters
Rev. F | Page 15 of 16
PIN 1
INDICATOR
(R 0.15)
12-07-2010-A
PIN 1 INDEX
AREA
SEATING
PLANE
0.50 BSC
8
5
0.80
0.55
0.40
10-07-2009-B
1
012407-A
8
4.00 (0.1574)
3.80 (0.1497)
3.20
3.00
2.80
ADM4850 to ADM4857
Data Sheet
ORDERING GUIDE
Model1, 2
ADM4850ACPZ-REEL7
ADM4850ARZ
ADM4850ARZ-REEL7
ADM4850ARMZ
ADM4850ARMZ-REEL7
ADM4851ARZ
ADM4851ARZ-REEL7
ADM4852ACPZ-REEL7
ADM4852ARZ
ADM4852ARZ-REEL7
ADM4853ACPZ-REEL7
ADM4853ARZ
ADM4853ARZ-REEL7
ADM4853WARZ-RL7
ADM4854ARZ
ADM4855ARZ
ADM4856ARZ
ADM4856ARZ-REEL7
ADM4857ARZ
ADM4857ARZ-REEL7
1
2
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
8-Lead Lead Frame Chip Scale Package [LFCSP]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Lead Frame Chip Scale Package [LFCSP]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Lead Frame Chip Scale Package [LFCSP]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
Package Option
CP-8-13
R-8
R-8
RM-8
RM-8
R-8
R-8
CP-8-13
R-8
R-8
CP-8-13
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
Branding
M8Q
M8Q
M8Q
M9M
F0B
Z = RoHS Compliant Part.
W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCT
The ADM4853WARZ-RL7 model is available with controlled manufacturing to support the quality and reliability requirements of
automotive applications. Note that this automotive model may have specifications that differ from the commercial models; therefore,
designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for
use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and
to obtain the specific Automotive Reliability reports for this model.
©2004–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04931-0-5/16(F)
Rev. F | Page 16 of 16
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