3.3 V, 3.2 Gbps,
Limiting Amplifier
ADN2891
Data Sheet
FEATURES
GENERAL DESCRIPTION
Input sensitivity: 4 mV p-p
80 ps rise/fall times
CML outputs: 700 mV p-p differential
Programmable LOS detector: 3.5 mV to 35 mV
Rx signal strength indicator (RSSI)
SFF-8472-compliant average power measurement
Single-supply operation: 3.3 V
Low power dissipation: 145 mW
Available in space-saving 3 mm × 3 mm, 16-lead LFCSP
Extended temperature range: −40°C to +95°C
SFP reference design available
The ADN2891 is a 3.2 Gbps limiting amplifier with integrated
loss-of-signal (LOS) detection circuitry and a received signal
strength indicator (RSSI). This part is optimized for SONET,
Gigabit Ethernet (GbE), and Fibre Channel optoelectronic
conversion applications. The ADN2891 has a differential input
sensitivity of 4 mV p-p and accepts up to a 2.0 V p-p differential
input overload voltage. The ADN2891 supports current mode
logic (CML) outputs with controlled rise and fall times.
By monitoring the bias current through a photodiode, the onchip RSSI detector measures the average power received with
2% typical linearity over the entire valid input range of the
photodiode. The on-chip RSSI detector facilitates SFF-8472compliant optical transceivers by eliminating the need for
external RSSI detector circuitry.
APPLICATIONS
SFP/SFF/GBIC optical transceivers
OC-3/OC-12/OC-48, GbE, Fibre Channel (FC) receivers
10GBASE-LX4 transceivers
WDM transponders
Additional features include a programmable loss-of-signal
(LOS) detector and output squelch.
The ADN2891 is available in a 3 mm × 3 mm, 16-lead LFCSP.
FUNCTIONAL BLOCK DIAGRAM
AVCC
AVEE
DRVCC
DRVEE
DRVCC
ADN2891
50Ω
ADN2880
50Ω
PIN
OUTP
NIN
OUTN
50Ω
+V
50Ω
3kΩ
VREF
LOS
PD_VCC
RSSI/LOS
DETECTOR
10kΩ
RSSI_OUT
ADuC7020
CAZ1
CAZ2
0.01µF
THRADJ SQUELCH
05244-001
PD_CATHODE
Figure 1.
Rev. B
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Tel: 781.329.4700 ©2005–2017 Analog Devices, Inc. All rights reserved.
Technical Support
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ADN2891
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Theory of Operation ...................................................................... 10
Applications ....................................................................................... 1
Limiting Amplifier ..................................................................... 10
General Description ......................................................................... 1
Loss of Signal (LOS) Detector .................................................. 10
Functional Block Diagram .............................................................. 1
Received Signal Strength Indicator (RSSI) ............................. 10
Revision History ........................................................................... 2
Squelch Mode ............................................................................. 10
Specifications..................................................................................... 3
Applications..................................................................................... 11
Absolute Maximum Ratings ............................................................ 5
PCB Design Guidelines ............................................................. 11
Thermal Resistance ...................................................................... 5
Outline Dimensions ....................................................................... 13
ESD Caution .................................................................................. 5
Ordering Guide .......................................................................... 13
Pin Configuration and Function Descriptions ............................. 6
Typical Performance Characteristics ............................................. 7
REVISION HISTORY
3/2017—Rev. A to Rev. B
Changed CP-16-3 to CP-16-27 .................................... Throughout
Changes to Figure 2 .......................................................................... 4
Changes to Figure 20 ...................................................................... 11
Changes to Ordering Guide .......................................................... 13
Updated Outline Dimensions ....................................................... 13
7/2005—Rev. 0 to Rev. A
Changes to Table 1 ............................................................................ 3
Changes to Ordering Guide .......................................................... 13
3/2005—Revision 0: Initial Version
Rev. B | Page 2 of 16
Data Sheet
ADN2891
SPECIFICATIONS
Test Conditions: VCC = 2.9 V to 3.6 V, VEE = 0 V, TA = −40°C to +95°C, unless otherwise noted.
Table 1.
Parameter
QUANTIZER DC CHARACTERISTICS
Input Voltage Range
Input Common Mode
Differential Input Range
Differential Input Sensitivity
Input Offset Voltage
Input RMS Noise
Input Resistance
Input Capacitance
QUANTIZER AC CHARACTERISTICS
Input Data Rate
Small Signal Gain
S11
S22
Random Jitter
Deterministic Jitter
Low Frequency Cutoff
Min
1.8
2.1
5.2
Electrical Hysteresis
LOS Assert Time
LOS De-Assert Time
RSSI
Input Current Range
RSSI Output Linearity
Gain
Offset
Compliance Voltage
POWER SUPPLIES
VCC
ICC
OPERATING TEMPERATURE RANGE
CML OUTPUT CHARACTERISTICS
Output Impedance
Output Voltage Swing
Output Rise and Fall Time
Unit
Test Conditions/Comments
2.8
2.7
2.0
V p-p
V
V p-p
mV p-p
µV
µV rms
Ω
pF
At PIN or NIN, dc-coupled
DC-coupled
AC-coupled
3.2 Gbps, PRBS 223 − 1, BER ≤ 10−10
3200
50
−10
−10
4.0
9.0
30
1.0
45
1.9
19
2.4
2.75
Max
3.5
100
235
50
0.65
155
Power Supply Rejection Ratio
LOSS OF SIGNAL DETECTOR (LOS)
LOS Assert Level
Typ
3.5
35
5.0
5.0
950
62
5
Mb/s
dB
dB
dB
ps rms
ps p-p
kHz
kHz
dB
Differential
Differential, f < 3.2 GHz
Differential, f < 3.2 GHz
Input ≥ 10 mV p-p, OC-48, PRBS 223 − 1
Input ≥ 10 mV p-p, OC-48, PRBS 223 − 1
CAZ = Open
CAZ = 0.0 1 µF
f < 10 MHz
5.6
53
mV p-p
mV p-p
dB
dB
ns
ns
RTHRADJ = 100 kΩ
RTHRADJ = 1 kΩ
OC-3, PRBS 223 − 1
OC-48, PRBS 223 − 1
DC-coupled
DC-coupled
1000
µA
%
mA/mA
nA
6.4
34
2
1.0
145
VCC − 0.9
2.9
−40
600
3.3
45
+25
50
660
80
Single-ended
5 µA < IIN ≤ 1000 µA
IRSSI/IPD
Difference between measured RSSI output
and PD_CATHODE (input) current of 5 µA
Measured at PD_CATHODE, with I = 5 µA
or I = 1 mA
VCC − 0.4
V
3.6
49
+95
V
mA
°C
TMIN to TMAX
850
130
Ω
mV p-p
ps
Single-ended
Differential
20% to 80%
Rev. B | Page 3 of 16
ADN2891
Parameter
LOGIC INPUTS (SQUELCH)
VIH, Input High Voltage
VIL, Input Low Voltage
Input Current
LOGIC OUTPUTS (LOS)
VOH, Output High Voltage
VOL, Output Low Voltage
Data Sheet
Min
Typ
Max
Unit
Test Conditions/Comments
0.8
40
6
V
V
µA
µA
IINH, VIN = 2.4 V, 100 kΩ pull-down resistor on-chip
IINL, VIN = 0.4 V, 100 kΩ pull-down resistor on-chip
2.0
2.4
V
0.4
V
Rev. B | Page 4 of 16
Open drain output, 4.7 kΩ to 10 kΩ
pull-up resistor to VCC
Open drain output, 4.7 kΩ to 10 kΩ
pull-up resistor to VCC
Data Sheet
ADN2891
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Power Supply Voltage
Minimum Voltage
(All Inputs and Outputs)
Maximum Voltage
(All Inputs and Outputs)
Storage Temperature
Operating Temperature Range
Production Soldering Temperature
Junction Temperature
Rating
4.2 V
VEE − 0.4 V
VCC + 0.4 V
−65°C to +150°C
−40°C to +95°C
J-STD-20
125°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θJA is specified for 4-layer PCB with exposed paddle soldered
to GND.
Table 3.
Package Type
3 mm × 3 mm, 16-lead LFCSP
ESD CAUTION
Rev. B | Page 5 of 16
θJA
28
Unit
°C/W
ADN2891
Data Sheet
13 SQUELCH
14 RSSI_OUT
15 PD_VCC
16 PD_CATHODE
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
AVCC 1
12 DRVCC
PIN 2
ADN2891
11 OUTP
NIN 3
TOP VIEW
(Not to Scale)
10 OUTN
9
DRVEE
LOS 8
CAZ2 7
CAZ1 6
THRADJ 5
AVEE 4
NOTES
1. THE LFCSP HAS AN EXPOSED PAD ON THE BOTTOM. TO
IMPROVE HEAT DISSIPATION, THE EXPOSED PAD MUST
BE SOLDERED TO THE GND PLANE WITH FILLED VIAS.
Figure 2. Pin Configuration
Note that the LFCSP has an exposed pad on the bottom. To improve heat dissipation, the exposed pad must be soldered to the GND plane
with filled vias.
Table 4. Pin Function Descriptions
Pin No.
1
2
3
4
5
6
Mnemonic
AVCC
PIN
NIN
AVEE
THRADJ
CAZ1
I/O Type 1
P
AI
AI
P
AO
AI
Descriptions
Analog Power Supply.
Differential Data Input, Positive Port, 50 Ω On-Chip Termination.
Differential Data Input, Negative Port, 50 Ω On-Chip Termination.
Analog Ground.
LOS Threshold Adjust Resistor.
If needed, one capacitor can connect between the CAZ1 and CAZ2 pin for
input offset correction.
7
CAZ2
AI
If needed, one capacitor can connect between the CAZ1 and CAZ2 pin for
input offset correction.
8
9
10
11
12
13
14
15
16
Exposed
Pad
LOS
DRVEE
OUTN
OUTP
DRVCC
SQUELCH
RSSI_OUT
PD_VCC
PD_CATHODE
Pad
DO
P
DO
DO
P
DI
AO
P
AO
P
LOS Detector Output, Open Collector.
Output Buffer Ground.
Differential Data Output, CML, Negative Port, 50 Ω On-Chip Termination.
Differential Data Output, CML, Positive Port, 50 Ω On-Chip Termination.
Output Buffer Power Supply.
Disable Outputs, 100 kΩ On-Chip Pull-Down Resistor.
Average Current Output.
Power Input for RSSI Measurement.
Photodiode Bias Voltage.
Connect to Ground.
1
P = power; DI = digital input; DO = digital output; AI = analog input; and AO = analog output.
Rev. B | Page 6 of 16
Data Sheet
ADN2891
05244-020
05244-015
100mV/DIV
100mV/DIV
TYPICAL PERFORMANCE CHARACTERISTICS
50ps/DIV
50ps/DIV
Figure 6. Eye of ADN2891 @ 95°C, 3.2 Gbps, and 500 mV Input
05244-017
05244-019
100mV/DIV
100mV/DIV
Figure 3. Eye of ADN2891 @ 25°C, 3.2 Gbps, and 10 mV Input
50ps/DIV
1ns/DIV
Figure 7. Eye of ADN2891 @ 25°C, 155 Mbps, and 10 mV Input
05244-027
100mV/DIV
Figure 4. Eye of ADN2891 @ 25°C, 3.2 Gbps, and 500 mV Input
50ps/DIV
Figure 5. Eye of ADN2891 @ 95°C, 3.2 Gbps, and 10 mV Input
Rev. B | Page 7 of 16
ADN2891
Data Sheet
70
5.0
4.5
–40°C
4.0
+95°C
50
RANDOM JITTER (ps)
+25°C
40
+95°C
30
+25°C
DEASSERTION
20
3.5
3.0
2.5
2.0
1.5
–40°C
05244-011
ASSERTION
0
1k
10k
RTH (Ω)
05244-010
1.0
10
0.5
0
100k
0
0.5
Figure 8. LOS Trip and Release vs. RTH at OC48
2.5
3.0
3.5
3.0
3.5
14
OC48
DETERMINISTIC JITTER (ps)
12
6
OC3
4
2
10k
8
6
4
05244-013
0
1k
10
2
05244-012
LOS ELECTRICAL HYSTERESIS (dB)
1.5
2.0
DATA RATE (Gbps)
Figure 11. Random Jitter vs. Data Rate
8
0
100k
0
0.5
RTH (Ω)
1.0
1.5
2.0
DATA RATE (Gbps)
2.5
Figure 12. Deterministic Jitter vs. Data Rate
Figure 9. LOS Electrical Hysteresis vs. RTH at 25°C
70
POWER SUPPLY-NOISE REJECTION (dB)
18
16
14
12
10
8
6
4
2
0
6.0
6.3
6.6 6.9 7.2 7.5 7.8 8.1 8.4
ELECTRICAL HYSTERESIS (dB)
8.7
60
50
40
30
20
10
0
100k
05244-022
SAMPLE
1.0
05244-005
LOS TRIP AND RELEASE (mV)
60
1M
SUPPLY-NOISE FREQUENCY (Hz)
9.0
Figure 10. Sample Lot Distribution—Worst-Case Condition:
Conditions = 155 Mbps, 100 kΩ @ 95°C, 3.6 V
Figure 13. PSRR vs. Supply-Noise Frequency
Rev. B | Page 8 of 16
10M
Data Sheet
ADN2891
1200
900
800
5µA REFERRED OFFSET (nA)
RSSI OUTPUT CURRENT (µA)
1000
800
600
400
700
600
500
400
300
200
100
05244-018
0
0
05244-025
200
0
–40
1200
200
400
600
800
1000
PD_CATHODE CURRENT (PHOTODIODE CURRENT) (µA)
–20
0
20
40
TEMPERATURE (°C)
60
80
100
Figure 17. RSSI Offset is the Difference Between Measured RSSI
Output and PD_CATHODE (Input) Current of 5 µA
Figure 14. RSSI Output vs. Average Photodiode Current
60
5.0
4.5
4.0
RSSI LINEARITY (%)
40
30
20
3.5
3.0
2.5
+30°C
1.5
05244-028
0
0.5
–40°C
0
200
0
60
10
20
30
40
50
PD_CATHODE CURRENT (PHOTODIODE CURRENT) (µA)
0
05244-029
1.0
10
400
600
PD_CATHODE CURRENT (µA)
1000
800
Figure 18. RSSI Linearity % vs. PD_CATHODE Current
Figure 15. RSSI Output vs. Average Photodiode Current (Zoomed)
–0.15
44.5
–0.20
44.0
–0.25
–0.30
43.5
ICC (mA)
–0.35
–0.40
–0.45
43.0
42.5
–0.50
42.0
–0.55
–0.60
41.5
05244-023
COMPLIANCE VOLTAGE REFERRED TO VCC (V)
+100°C
2.0
–0.65
–0.70
0
100
200
300 400 500 600 700
INPUT CURRENT (µA)
800
900
41.0
–60
1000
05244-024
RSSI OUTPUT CURRENT (µA)
50
–40
–20
20
40
60
0
TEMPERATURE (°C)
80
100
Figure 19. ADN2891 ICC Current vs. Temperature
Figure 16. PD_CATHODE Compliance Voltage vs.
Input Current RSSI (Refer to VCC)
Rev. B | Page 9 of 16
120
ADN2891
Data Sheet
THEORY OF OPERATION
LIMITING AMPLIFIER
LOSS OF SIGNAL (LOS) DETECTOR
Input Buffer
The on-chip LOS circuit drives LOS to logic high when the
input signal level falls below a user-programmable threshold.
The threshold level can be set to anywhere from 3.5 mV p-p to
35 mV p-p, typical, and is set by a resistor connected between
the THRADJ pin and VEE. See Figure 8 and Figure 9 for the
LOS threshold vs. THRADJ. The ADN2891 LOS circuit has an
electrical hysteresis greater than 2.5 dB to prevent chatter at the
LOS signal. The LOS output is an open-collector output that
must be pulled up externally with a 4.7 kΩ to 10 kΩ resistor.
The ADN2891 limiting amplifier provides differential inputs
(PIN/NIN), each having single-ended, on-chip, 50 Ω termination. The amplifier can accept either dc-coupled or ac-coupled
signals; however, an ac-coupled signal is recommended. Using a
dc-coupled signal, the amplifier needs a correct input commonmode voltage and enough headroom to handle the dynamic
input signal strength. Additionally, TIA output offset drifts may
degrade receiver performance.
The ADN2891 limiting amplifier is a high gain device. It is
susceptible to dc offsets in the signal path. The pulse width
distortion presented in the NRZ data or a distortion generated
by the TIA may appear as dc offset or a corrupted signal to the
ADN2891 inputs. An internal offset correction loop can
compensate for certain levels of offset. To compensate for more
offset, an external capacitor connected between the CAZ1 and
CAZ2 pins maybe necessary. For GbE and FC applications, no
external capacitor is necessary; however, for SONET applications, a 0.01 µF capacitor helps the input signal offset
compensation and provides a 3 dB cutoff frequency at 1 kHz.
CML Output Buffer
The ADN2891 provides differential CML outputs, OUTP and
OUTN. Each output has an internal 50 Ω termination to VCC.
RECEIVED SIGNAL STRENGTH INDICATOR (RSSI)
The ADN2891 has an on-chip, RSSI circuit. By monitoring the
current supplied to the photodiode, the RSSI circuit provides an
accurate, average power measurement. The output of the RSSI is
a current that is directly proportional to the average amount of
PIN photodiode current. Placing a resistor between the
RSSI_OUT pin and GND converts the current to a GND
referenced voltage. This function eliminates the need for
external RSSI circuitry for SFF-8472-compliant optical
receivers. For more information, see Figure 14 to Figure 18.
SQUELCH MODE
Driving the SQUELCH input to logic high disables the limiting
amplifier outputs. Using LOS output to drive the SQUELCH
input, the limiting amplifier outputs stop toggling anytime a
signal input level to the limiting amplifier drops below the
programmed LOS threshold.
The SQUELCH pin has a 100 kΩ, internal, pull-down resistor.
Rev. B | Page 10 of 16
Data Sheet
ADN2891
APPLICATIONS
The exposed pad should connect to the GND plane using filled
vias so that solder does not leak through the vias during reflow.
Using filled vias in parallel under the package greatly reduces
the thermal resistance and enhances the reliability of the
connectivity of the exposed pad to the GND plane during
reflow.
PCB DESIGN GUIDELINES
Proper RF PCB design techniques must be used to ensure
optimal performance.
Output Buffer Power Supply and Ground Planes
Pin 9 (DRVEE) and Pin 12 (DRVCC) are the power supply and
ground pins that provide current to the differential output
buffer. To reduce possible series inductance, Pin 9, which is the
ground return of the output buffer, should connect to ground
directly. If the ground plane is an internal plane and
connections to the ground plane are vias, multiple vias in
parallel to ground can reduce series inductance.
To reduce power noise, a 10 μF electrolytic decoupling capacitor
between power and ground should be close to where the 3.3 V
supply enters the PCB. The other 0.1 μF and 1 nF ceramic chip
decoupling capacitors should be close to the VCC and VEE pins
to provide better decouple filtering and a shorter current return
loop.
Similarly, to reduce the possible series inductance, Pin 12,
which supplies power to the high speed differential
OUTP/OUTN output buffer, should connect to the power plane
directly. If the power plane is an internal plane and connections
to the power plane are vias, multiple vias in parallel can reduce
the series inductance, especially on Pin 12. See Figure 20 for the
recommended connections.
VCC
16
PIN
C2
NIN
AVEE
2
CONNECT
EXPOSED
PAD TO
GND
11
10
4
9
CAZ1
6
7
C11
C12
VCC
12
5
R2
RSSI MEASUREMENT
TO ADC
C7
ADN2891
3
C10
13
1
THRADJ
ADN2880
C1
14
C8
DRVCC
OUTP
C3
OUTN C4
TO HOST
BOARD
DRVEE
8
LOS
AVCC
15
R1
C1–C4, C11: 0.01µF X5R/X7R DIELECTRIC, 0201 CASE
C5, C7, C9, C10, C12: 0.1µF X5R/X7R DIELECTRIC, 0402 CASE
C6, C8: 1nF X5R/X7R DIELECTRIC, 0201 CASE
R3
4.7kΩ TO 10kΩ
ON HOST BOARD
VCC
Figure 20. Typical Applications Circuit (Example of Using PIN PD and On-Chip RSSI Detector)
Rev. B | Page 11 of 16
05244-008
C6
CAZ2
C5
SQUELCH
VCC
PD_VCC
PD_CATHODE
0.1µF
RSSI_OUT
C9
VCC
ADN2891
Data Sheet
PCB Layout
As with any high speed, mixed-signal design, keep all high
speed digital traces away from sensitive analog nodes.
Figure 21 shows the recommended PCB layout. The 50 Ω
transmission lines are the traces that bring the high frequency
input and output signals (PIN, NIN, OUTP, and OUTN) to the
SMA connectors with minimum reflection. To avoid a signal
skew between the differential traces, each differential PIN/NIN
and OUTP/OUTN pair should have matched trace lengths from
the signal pins to the corresponding SMA connectors. C1, C2,
C3, and C4 are ac coupling capacitors in series with the high
speed, signal input/output paths. To minimize the possible
mismatch, the ac coupling capacitor pads should be the same
width as the 50 Ω transmission line trace width. To reduce
supply noise, a 1 nF decoupling capacitor should be placed on
the same layer as close as possible to the VCC pins. A 0.1 µF
decoupling capacitor can be placed on the bottom of the PCB
directly underneath the 1 nF capacitor. All high speed, CML
outputs have internal 50 Ω resistor termination between the
output pin and VCC. The high speed inputs, PIN and NIN, also
have the internal 50 Ω termination to an internal reference
voltage.
Soldering Guidelines for the LFCSP
The lands on the 16-lead LFCSP are rectangular. The PCB pad
for these should be 0.1 mm longer than the package land length
and 0.05 mm wider than the package land width. The land
should be centered on the pad. This ensures that the solder joint
size is maximized. The bottom of the LFCSP has a central
exposed pad. The pad on the printed circuit board should be at
least as large as the exposed pad. Users must connect the
exposed pad to VEE using filled vias so that solder does not
leak through the vias during reflow. This ensures a solid
connection from the exposed pad to VEE.
R1, C9, C10 ON BOTTOM
TO ROSA
DOUBLE-VIAS TO REDUCE
INDUCTANCE TO SUPPLY
AND GND
PLACE C5 ON
BOTTOM OF BOARD
UNDERNEATH C6
C1
1
PLACE C7 ON
BOTTOM OF BOARD
UNDERNEATH C8
EXPOSED PAD
C6
C8
C3
PIN
NIN
OUTN
C2
C4
DOUBLE-VIA TO GND
TO REDUCE INDUCTANCE
VIA TO C12, R2
ON BOTTOM
C11
VIA TO BOTTOM
Figure 21. Recommended PCB Layout (Top View)
Rev. B | Page 12 of 16
05244-009
∼4mm
OUTP
VIAS TO
GND
Data Sheet
ADN2891
OUTLINE DIMENSIONS
DETAIL A
(JEDEC 95)
0.30
0.25
0.20
0.50
BSC
13
16
12
1
1.65
1.50 SQ
1.45
EXPOSED
PAD
9
TOP VIEW
0.80
0.75
0.70
TOP VIEW
4
8
5
BOTTOM VIEW
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
PKG-004395
0.50
0.40
0.30
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
0.20 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.
02-06-2017-A
PIN 1
INDICATOR
3.10
3.00 SQ
2.90
Figure 22. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-16-27)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADN2891ACPZ-500RL7
ADN2891ACPZ-RL7
ADN2891ACPZ-RL
EVAL-ADN2891EBZ
1
Temperature Range
–40°C to +95°C
–40°C to +95°C
–40°C to +95°C
Package Description
16-Lead LFCSP, 500 pieces
16-Lead LFCSP, 1,500 pieces
16-Lead LFCSP, 5,000 pieces
Evaluation Board
Z = RoHS Compliant Part.
Rev. B | Page 13 of 16
Package Option
CP-16-27
CP-16-27
CP-16-27
Branding
F04
F04
F04
ADN2891
Data Sheet
NOTES
Rev. B | Page 14 of 16
Data Sheet
ADN2891
NOTES
Rev. B | Page 15 of 16
ADN2891
Data Sheet
NOTES
©2005–2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05244–0–3/17(B)
Rev. B | Page 16 of 16
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