ADN8833CB-EVALZ/ADN8833CP-EVALZ
UG-857
One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com
Evaluating the ADN8833 Ultracompact 1 A
Thermoelectric Cooler (TEC) Controller Driver
FEATURES
ADN8833CB-EVALZ AND ADN8833CP-EVALZ
EVALUATION BOARDS
13313-001
Evaluation boards for the ADN8833
1.0 A TEC driver for digital control systems
Operating voltage range: VIN = 2.7 V to 5.5 V
TEC voltage and current operation monitoring
Independent TEC heating and cooling current limit settings
Programmable maximum TEC voltage
External synchronization from 1.85 MHz to 3.25 MHz
Output for TEC module wires
2.5 V reference output
Disable jumper
40 mm × 25 mm WLCSP evaluation board size
45 mm × 25 mm LFCSP evaluation board size
Figure 1. ADN8833CB-EVALZ WLCSP Evaluation Board
DOCUMENTS NEEDED
13313-002
ADN8833 data sheet
Figure 2. ADN8833CP-EVALZ LFCSP Evaluation Board
GENERAL DESCRIPTION
The ADN8833CB-EVALZ and ADN8833CP-EVALZ are
configurable evaluation boards designed to work with various
TEC modules. The ADN8833 on the evaluation board delivers
bidirectional current through the TEC controller using two
pairs of the complementary integrated MOSFETs in an H-bridge
configuration.
PLEASE SEE THE LAST PAGE FOR AN IMPORTANT
WARNING AND LEGAL TERMS AND CONDITIONS.
The voltage across the TEC is proportional to the voltage of the
control signal applied to the CONT input pin.
With the on-board passive components and TEC cooling and
heating current limits set to 1 A, the maximum TEC voltage is
programmed to 3 V. To modify the cooling and heating TEC
current limits and maximum TEC voltage setting, change the
values of the corresponding components.
Rev. 0 | Page 1 of 11
UG-857
ADN8833CB-EVALZ/ADN8833CP-EVALZ
TABLE OF CONTENTS
Features .............................................................................................. 1
Cooling and Heating TEC current Limits .................................4
Documents Needed .......................................................................... 1
PWM Operation Frequency ........................................................4
ADN8833CB-EVALZ and ADN8833CP-EVALZ Evaluation
Boards................................................................................................. 1
Read the TEC Voltage ...................................................................5
General Description ......................................................................... 1
TEC Driver Control ......................................................................5
Revision History ............................................................................... 2
Evaluation Board Schematics and Artwork ...................................6
Using the Evaluation Board............................................................. 3
Ordering Information .................................................................... 10
Board Connection ........................................................................ 3
Bill of Materials ........................................................................... 10
Read the TEC Current ..................................................................5
Maximum TEC Voltage ............................................................... 3
REVISION HISTORY
10/15—Revision 0: Initial Version
Rev. 0 | Page 2 of 11
ADN8833CB-EVALZ/ADN8833CP-EVALZ
UG-857
USING THE EVALUATION BOARD
where VREF = 2.5 V.
Apply a power source to the VIN (ADN8833CB-EVALZ)/VIN+
(ADN8833CP-EVALZ) and GND terminals. Connect the TEC
module to TEC+ and TEC−. The power source voltage must
not exceed 5.5 V, the maximum operation input voltage of the
ADN8833. Apply the TEC driver control signal to the CONT
terminal and AGND. Remove the shunt from the VLIM/SD
jumper to enable the controller.
VVLIM_HEATING = VVLIM_COOLING − ISINK_VLIM × RV1||RV2
where ISINK_VLIM = 10 μA.
VTEC_MAX_COOLING = VVLIM_COOLING × AVLIM
where AVLIM = 2 V/V.
VTEC_MAX_HEATING = VVLIM_HEATING × AVLIM
MAXIMUM TEC VOLTAGE
CLK
The maximum TEC cooling voltage is set to 3 V by the values of
RV1 = 6.65 kΩ and RV2 = 10 kΩ.
TEC VOLTAGE
LIMIT AND
INTERNAL
SOFT START
HEATING
To change the setting, modify the value of RV1 using the
equations provided in the Using a Resistor Divider to Set the
TEC Voltage Limit section (for more information, refer to the
ADN8833 data sheet) or following the recommended values in
Table 1.
RV1
Using a Resistor Divider to Set the TEC Voltage Limit
RV2
VREF
DISABLE
10µA
VLIM/SD
Calculate the cooling and heating limits using the following
equations:
SW OPEN = VVLIM_COOLING
SW CLOSED = VVLIM_HEATING
13313-003
BOARD CONNECTION
Figure 3. Programming the Maximum TEC Voltage
VVLIM_COOLING = VREF × RV2/(RV1 + RV2)
Table 1. Setting the Maximum TEC Voltage (RV2 = 10 kΩ)
VTEC_MAX_COOLING (V)1
4.750
4.500
4.250
4.000
3.750
3.500
3.250
3.000
2.750
2.500
2.250
2.000
1.750
1.500
1.250
1.000
0.750
0.500
0.250
VVLIM_COOLING (V)2
2.375
2.250
2.125
2.000
1.875
1.750
1.625
1.500
1.375
1.250
1.125
1.000
0.875
0.750
0.625
0.500
0.375
0.250
0.125
RV1 (kΩ)3
0.53
1.11
1.76
2.50
3.33
4.29
5.38
6.67
8.18
10.00
12.22
15.00
18.57
23.33
30.00
40.00
56.67
90.00
190.00
VTEC_COOLING (V)4
2.438
2.375
2.313
2.250
2.188
2.125
2.063
2.000
1.938
1.875
1.813
1.750
1.688
1.625
1.563
1.500
1.438
1.375
1.313
RV1||RV2
(kΩ)3
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
1
VVLIM_HEATING (V)5
2.370
2.240
2.110
1.980
1.850
1.720
1.590
1.460
1.330
1.200
1.070
0.940
0.810
0.680
0.550
0.420
0.290
0.160
0.030
VTEC_MAX_COOLING is the maximum target TEC voltage when the ADN8833 operates in cooling mode.
VVLIM_COOLING is the voltage set at the VLIM/SD input pin for cooling.
3
RV1 is the required value of Resistor R1. RV2 is the required value of Resistor R2.
4
VTEC_COOLING is the voltage at the VTEC output when the TEC voltage reaches the maximum in cooling mode.
5
VVLIM_HEATING is the voltage set at the VLIM/SD input pin for heating.
6
VTEC_MAX_HEATING is the maximum TEC voltage set when the ADN8833 operates in heating mode.
7
VTEC_HEATING is the voltage at the VTEC output when the TEC voltage reaches the maximum in heating mode.
2
Rev. 0 | Page 3 of 11
VTEC_MAX_HEATING (V)6
4.740
4.480
4.220
3.960
3.700
3.440
3.180
2.920
2.660
2.400
2.140
1.880
1.620
1.360
1.100
0.840
0.580
0.320
0.060
VTEC_HEATING (V)7
0.065
0.130
0.195
0.260
0.325
0.390
0.455
0.520
0.585
0.650
0.715
0.780
0.845
0.910
0.975
1.040
1.105
1.170
1.235
UG-857
ADN8833CB-EVALZ/ADN8833CP-EVALZ
COOLING AND HEATING TEC CURRENT LIMITS
VDD
The maximum TEC cooling and heating current limits are both
set to 1 A by the values of RC1 = 90.9 kΩ and RC2 = 37.4 kΩ. To
change the settings, use the equations provided in Using a
Resistor Divider to Set the TEC Current Limit section (for more
information, refer to the ADN8833 the data sheet) or use the
values recommended in Table 3.
40µA
VREF
VILIM_HEATING = VREF × RC2/(RC1 + RC2)
where VREF = 2.5 V.
VILIM_COOLING = VILIM_HEATING + ISINK_ILIM × RC1||RC2
where ISINK_ILIM = 40 µA.
ITEC _ MAX _ COOLING =
VILIM _ COOLING − 1.25 V
RCS
where RCS = 0.525 V/A.
ITEC _ MAX _ HEATING =
1.25 V − VILIM _ HEATING
RCS
–
RC1
ITEC
ILIM
RC2
+
TEC
CURRENT
LIMIT
SW OPEN = VILIM_HEATING
SW CLOSED = VILIM_COOLING
13313-004
Using a Resistor Divider to Set the TEC Current Limit
The internal current sink circuitry connected to ILIM draws a
40 µA current when the ADN8833 drives the TEC in a cooling
direction, which allows a high cooling current. Use the
following equations to calculate the maximum TEC currents:
COOLING
Figure 4. Programming the TEC Current Cooling and Heating Limits
PWM OPERATION FREQUENCY
The frequency of the PWM TEC driver stage can be configured
at the 3-pin jumper, J1. Apply the external synchronization
clock signal to the middle pin of the jumper.
Table 2. PWM Frequency Selection
EN/SY Pin
Low (2.1 V)
External Clock Signal (High > 2.1 V,
Low < 0.8 V)
PWM Operation
Frequency
Shutdown
Shutdown
2 MHz
From 1.85 MHz to
3.25 MHz
Table 3. Values of the Resistor Divider for ILIM Settings
ITEC_MAX_COOLING (A)1
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
VILIM_COOLING (V)2
1.828
1.775
1.723
1.670
1.618
1.565
1.513
1.460
1.408
1.355
1.303
ITEC_MAX_HEATING (A)3
−1.1
−1.0
−0.9
−0.8
−0.7
−0.6
−0.5
−0.4
−0.3
−0.2
−0.1
VILIM_HEATING (V)4
0.673
0.725
0.778
0.830
0.883
0.935
0.988
1.040
1.093
1.145
1.198
1
ITEC_MAX_COOLING is the maximum target TEC current when the ADN8833 operates in cooling mode
VILIM_COOLING is the voltage set at the ILIM pin when the ADN8833 operates in cooling mode.
ITEC_MAX_HEATING is the maximum target TEC current when the ADN8833 operates in heating mode.
4
VILIM_HEATING is the voltage set at the ILIM pin when the ADN8833 operates in heating mode.
5
RC1 is the required value of Resistor R3. RC2 is the required value of Resistor R4.
2
3
Rev. 0 | Page 4 of 11
RC1 (kΩ)5
107.3
90.5
76.0
63.3
52.1
42.1
33.2
25.2
18.0
11.5
5.5
RC2 (kΩ)5
39.5
37.0
34.3
31.4
28.4
25.2
21.7
18.0
14.0
9.7
5.0
RC1||RC2 (kΩ)5
28.875
26.250
23.625
21.000
18.375
15.750
13.125
10.500
7.875
5.250
2.625
ADN8833CB-EVALZ/ADN8833CP-EVALZ
UG-857
READ THE TEC VOLTAGE
TEC DRIVER CONTROL
The voltage on the VTEC output pin is proportional to the
voltage across the TEC and is measured at Connector J5/Pin 1
(ADN8833CB-EVALZ, the WLCSP evaluation board) or
J6/Pin 11 (ADN8833CP-EVALZ, the LFCSP evaluation board).
The relationship between the voltage on the VTEC output and
the voltage across the TEC is as follows:
The TEC driver has a linear driver LDR and a PWM driver with
an SW output and a voltage feedback input pin, SFB. It is
controlled by the voltage signal at the CONT pin. The equations
for the linear and PWM driver outputs, respectively, are as follows:
VTEC = VLDR – VSFB = 4 × (VVTEC – 0.5 × VREF)
VLDR = VB − 40(VCONT − 1.25 V)
VSFB = VLDR + 5(VCONT − 1.25 V)
where:
VCONT is the voltage at the CONT pin.
VB is determined by the voltage at the VDD pin as
where:
VTEC is the voltage across the TEC.
VLDR is the voltage measured at the LDR pin.
VSFB is the voltage measured at the SFB pin.
VVTEC is the voltage measured at the VTEC pin.
VREF is the reference voltage, 2.5 V.
VB = 1.5 V (VVDD < 4.0 V)
VB = 2.5 V (VVDD > 4.0 V)
The VLDR and VSFB voltages are limited by the power supply
voltage with the upper limit of VVDD and the lower limit of 0 V.
READ THE TEC CURRENT
The voltage on the ITEC output pin is proportional to the TEC
current, and is measured at Connector J5/Pin 2 (ADN8833CBEVALZ) or J6/Pin 12 (ADN8833CP-EVALZ). Calculate the TEC
current from the ITEC pin voltage as follows:
ITEC =
VITEC − 0.5 × VREF
RCS
where:
ITEC is the TEC current; defined as the current flowing into the
TEC positive terminal TEC+ and out of the TEC negative
terminal, TEC−.
VITEC is the voltage measured at the ITEC pin.
VREF is the reference voltage, 2.5 V.
RCS is the current sense gain, 0.525 V/A.
Rev. 0 | Page 5 of 11
UG-857
ADN8833CB-EVALZ/ADN8833CP-EVALZ
EVALUATION BOARD SCHEMATICS AND ARTWORK
13313-005
Figure 5. ADN8833CB-EVALZ WLCSP Evaluation Board Schematic
Rev. 0 | Page 6 of 11
ADN8833CB-EVALZ/ADN8833CP-EVALZ
UG-857
13313-006
Figure 6. ADN8833CP-EVALZ LFCSP Evaluation Board Schematic
Rev. 0 | Page 7 of 11
13313-009
ADN8833CB-EVALZ/ADN8833CP-EVALZ
13313-007
UG-857
13313-010
Figure 9. ADN8833CB-EVALZ Evaluation Board Second Layer
13313-008
Figure 7. ADN8833CB-EVALZ Evaluation Board Top Layer
Figure 8. ADN8833CB-EVALZ Evaluation Board Third Layer
Figure 10. ADN8833CB-EVALZ Evaluation Board Bottom Layer
Rev. 0 | Page 8 of 11
UG-857
13313-012
13313-011
ADN8833CB-EVALZ/ADN8833CP-EVALZ
Figure 12. ADN8833CP-EVALZ Evaluation Board Second Layer
13313-014
13313-013
Figure 11. ADN8833CP-EVALZ Evaluation Board Top Layer
Figure 14. ADN8833CP-EVALZ Evaluation Board Bottom Layer
Figure 13. ADN8833CP-EVALZ Evaluation Board Third Layer
Rev. 0 | Page 9 of 11
UG-857
ADN8833CB-EVALZ/ADN8833CP-EVALZ
ORDERING INFORMATION
BILL OF MATERIALS
Table 4. ADN8833CB-EVALZ WLCSP Evaluation Board
Quantity
2
4
1
1
1
2
1
1
1
1
1
1
1
8
1
Reference
C1, C2
C3, C4, C5, C9
C10
J1
J2
J4, J5
L1
R1
R2
R3
R4
R5
R19
TP1, TP4, TP9, TP11, TP15,
TP17, TP18, TP19
U1
Description
Ceramic capacitor, 10 µF, 10 V, 10%, X7R, 0805
Ceramic capacitor, 0.1 µF, 10 V, 10%, X7R, 0603
Tantalum capacitor, 100 µF, 6.3 V, 20%, 1411
Jumper, 3-pin
Jumper, 2-pin
Connector, double row, male, 12-pin
Inductor, 1 µH
Resistor, 6.65 kΩ, 1/10 W, 1%, 0603, SMD
Resistor, 10 kΩ, 1/10 W, 1%, 0603, SMD
Resistor, 90.9 kΩ, 1/10 W, 1%, 0603, SMD
Resistor, 37.4 kΩ, 1/10 W, 1%, 0603, SMD
Resistor, 10.0 Ω, 1/10 W, 1%, 0603, SMD
Resistor, 49.9 Ω, 1/10 W, 1%, 0603, SMD
Test point
Manufacturer
Taiyo Yuden
Kemet
Vishay
Samtec
Samtec
Samtec
TOKO
Vishay
Vishay
Vishay
Vishay
Vishay
Vishay
Samtec
Part Number
LMK212B7106KG-TD
C0603C104K8RACTU
293D107X96R3B2TE3
TSW-103-08-G-S
TSW-103-08-G-S
TSW-112-08-G-D
1286AS-H-1R0M
CRCW06036K65FKEA
ERJ-3EKF1002V
CRCW060390K9FKEA
CRCW060337K4FKEA
CRCW060310R0FKEA
CRCW060349R9FKEA
TSW-103-08-G-S
Ultracompact, 1 A, TEC driver, WLCSP package
Analog Devices, Inc.
ADN8833ACBZ-R7
Table 5. ADN8833CP-EVALZ LFCSP Evaluation Board
Quantity
2
5
1
1
1
2
1
1
1
1
1
1
1
7
2
1
Reference
C2, C12
C3, C4, C5, C9, C11
C10
J1
J2
J4, J6
L1
R1
R2
R3
R4
R5
R19
TP1, TP2, TP4, TP9, TP15, TP17,
TP18
TP2, TP11
U1
Description
Ceramic capacitor, 10 µF, 10 V, 10%, X7R, 0805
Ceramic capacitor, 0.1 µF, 10 V, 10%, X7R, 0603
Tantalum capacitor, 100 µF, 6.3 V, 20%, 1411
Jumper, 3-pin
Jumper, 2-pin
Connector, male, 12-pin
Inductor, 1 µH
Resistor, 6.65 kΩ, 1/10 W, 1%, 0603, SMD
Resistor, 10 kΩ, 1/10 W, 1%, 0603, SMD
Resistor, 90.9 kΩ, 1/10 W, 1%, 0603, SMD
Resistor, 37.4 kΩ, 1/10 W, 1%, 0603, SMD
Resistor, 10.0 Ω, 1/10 W, 1%, 0603, SMD
Resistor, 49.9 Ω, 1/10 W, 1%, 0603, SMD
Test point
Manufacturer
Taiyo Yuden
Kemet
Vishay
Samtec
Samtec
Samtec
Coilcraft
Vishay
Vishay
Vishay
Vishay
Vishay
Vishay
Keystone
Part Number
LMK212B7106KG-TD
C0603C104K8RACTU
293D107X06R3B2T
TSW-103-08-G-S
TSW-103-08-G-S
TSW-112-08-G-D
XFL3012-102ME
CRCW06036K65FKEA
ERJ-3EKF1002V
CRCW060390K9FKEA
CRCW060337K4FKEA
CRCW060310R0FKEA
CRCW060349R9FKEA
5010
Connector
Ultracompact, 1 A, TEC driver, LFCSP package
MILL-MAX
Analog Devices
3102-2-00-21-00-08-0
ADN8833ACPZ-R7
Rev. 0 | Page 10 of 11
ADN8833CB-EVALZ/ADN8833CP-EVALZ
UG-857
NOTES
ESD Caution
ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection
circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality.
Legal Terms and Conditions
By using the evaluation board discussed herein (together with any tools, components documentation or support materials, the “Evaluation Board”), you are agreeing to be bound by the terms and conditions
set forth below (“Agreement”) unless you have purchased the Evaluation Board, in which case the Analog Devices Standard Terms and Conditions of Sale shall govern. Do not use the Evaluation Board until you
have read and agreed to the Agreement. Your use of the Evaluation Board shall signify your acceptance of the Agreement. This Agreement is made by and between you (“Customer”) and Analog Devices, Inc.
(“ADI”), with its principal place of business at One Technology Way, Norwood, MA 02062, USA. Subject to the terms and conditions of the Agreement, ADI hereby grants to Customer a free, limited, personal,
temporary, non-exclusive, non-sublicensable, non-transferable license to use the Evaluation Board FOR EVALUATION PURPOSES ONLY. Customer understands and agrees that the Evaluation Board is provided
for the sole and exclusive purpose referenced above, and agrees not to use the Evaluation Board for any other purpose. Furthermore, the license granted is expressly made subject to the following additional
limitations: Customer shall not (i) rent, lease, display, sell, transfer, assign, sublicense, or distribute the Evaluation Board; and (ii) permit any Third Party to access the Evaluation Board. As used herein, the term
“Third Party” includes any entity other than ADI, Customer, their employees, affiliates and in-house consultants. The Evaluation Board is NOT sold to Customer; all rights not expressly granted herein, including
ownership of the Evaluation Board, are reserved by ADI. CONFIDENTIALITY. This Agreement and the Evaluation Board shall all be considered the confidential and proprietary information of ADI. Customer may
not disclose or transfer any portion of the Evaluation Board to any other party for any reason. Upon discontinuation of use of the Evaluation Board or termination of this Agreement, Customer agrees to
promptly return the Evaluation Board to ADI. ADDITIONAL RESTRICTIONS. Customer may not disassemble, decompile or reverse engineer chips on the Evaluation Board. Customer shall inform ADI of any
occurred damages or any modifications or alterations it makes to the Evaluation Board, including but not limited to soldering or any other activity that affects the material content of the Evaluation Board.
Modifications to the Evaluation Board must comply with applicable law, including but not limited to the RoHS Directive. TERMINATION. ADI may terminate this Agreement at any time upon giving written notice
to Customer. Customer agrees to return to ADI the Evaluation Board at that time. LIMITATION OF LIABILITY. THE EVALUATION BOARD PROVIDED HEREUNDER IS PROVIDED “AS IS” AND ADI MAKES NO
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registered trademarks are the property of their respective owners.
UG13313-0-10/15(0)
Rev. 0 | Page 11 of 11
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