Data Sheet
ADP1706/ADP1707/ADP1708
1 A, Low Dropout, CMOS Linear Regulator
FEATURES
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TYPICAL APPLICATION CIRCUITS
Maximum output current: 1 A
Input voltage range: 2.5 V to 5.5 V
Low shutdown current: 1.8 V,
TJ = −40°C to +125°C
−60
+60
mV
1.8
EN INPUT
EN Input Logic High
VIH
2.5 V ≤ VIN ≤ 5.5 V
EN Input Logic Low
VIL
2.5 V ≤ VIN ≤ 5.5 V
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V
0.4
V
Rev. B | 3 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
SPECIFICATIONS
Table 1.
Parameter
EN Input Leakage Current
Symbol
Test Conditions/Comments
VI-LEAKAGE
EN = IN or GND
Min
Typ
Max
Unit
0.1
1
µA
100
nA
ADJ INPUT BIAS CURRENT (ADP1708)
ADJI-BIAS
30
SENSE INPUT BIAS CURRENT
SNSI-BIAS
4
µA
OUTPUT NOISE
OUTNOISE
POWER SUPPLY REJECTION RATIO
PSRR
10 Hz to 100 kHz, VOUT = 0.75 V
125
µV rms
10 Hz to 100 kHz, VOUT = 3.3 V
450
µV rms
1 kHz, VOUT = 0.75 V
70
dB
1 kHz, VOUT = 3.3 V
56
dB
1
Accuracy when OUT is connected directly to ADJ. When OUT voltage is set by external feedback resistors, absolute accuracy in adjust mode depends on the tolerances of
resistors used.
2
Based on an end-point calculation using 10 mA and 1 A loads. See Figure 11 for typical load regulation performance for loads less than 10 mA.
3
Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to the nominal output voltage. This applies only for output voltages above
2.5 V.
4
Start-up time is defined as the time between the rising edge of EN to OUT being at 95% of its nominal value.
5
Current limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 1.0 V output
voltage is defined as the current that causes the output voltage to drop to 90% of 1.0 V, or 0.9 V.
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Rev. B | 4 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Parameter
Rating
IN to GND
−0.3 V to +6 V
OUT to GND
–0.3 V to IN
EN to GND
–0.3 V to +6 V
SS/ADJ/TRK to GND
–0.3 V to +6 V
SENSE to GND
–0.3 V to +6 V
Storage Temperature Range
–65°C to +150°C
Operating Junction Temperature Range
–40°C to +125°C
Soldering Conditions
JEDEC J-STD-020
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
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θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
Unit
8-Lead SOIC (Exposed Paddle)
58
°C/W
8-Lead 3 mm × 3 mm LFCSP (Exposed Paddle)
66
°C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although
this product features patented or proprietary protection circuitry,
damage may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to avoid
performance degradation or loss of functionality.
Rev. B | 5 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 4. 8-Lead SOIC, ADP1706
Figure 5. 8-Lead LFCSP, ADP1706
Table 4. ADP1706 Pin Function Descriptions
Pin No.
SOIC
LFCSP
Mnemonic
Description
1
1
EN
Enable Input. Drive EN high to turn on the regulator; drive it low to turn off the regulator. For automatic startup, connect EN to IN.
2
2
GND
Ground.
3, 4
3, 4
IN
Regulator Input Supply. Bypass IN to GND with a 4.7 µF or greater capacitor.
5, 6
5, 6
OUT
Regulated Output Voltage. Bypass OUT to GND with a 4.7 µF or greater capacitor.
7
7
SENSE
Sense. Measures the actual output voltage at the load and feeds it to the error amplifier. Connect SENSE as close as possible to the
load to minimize the effect of IR drop between the regulator output and the load.
8
8
SS
Soft Start. A capacitor connected to this pin determines the soft start time.
0
0
EP
Exposed Pad. The exposed pad enhances thermal performance and is electrically connected to GND inside the package. It is
recommended to connect the exposed pad to the ground plane on the board.
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Rev. B | 6 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 6. 8-Lead SOIC, ADP1707
Figure 7. 8-Lead LFCSP, ADP1707
Table 5. ADP1707 Pin Function Descriptions
Pin No.
SOIC
LFCSP
Mnemonic
Description
1
1
EN
Enable Input. Drive EN high to turn on the regulator; drive it low to turn off the regulator. For automatic startup, connect EN to IN.
2
2
GND
Ground.
3, 4
3, 4
IN
Regulator Input Supply. Bypass IN to GND with a 4.7 µF or greater capacitor.
5, 6
5, 6
OUT
Regulated Output Voltage. Bypass OUT to GND with a 4.7 µF or greater capacitor.
7
7
SENSE
Sense. Measures the actual output voltage at the load and feeds it to the error amplifier. Connect SENSE as close as possible to the
load to minimize the effect of IR drop between the regulator output and the load.
8
8
TRK
Track. The output follows the voltage applied at the TRK pin. See the Theory of Operation section for a more detailed description.
0
0
EP
Exposed Pad. The exposed pad enhances thermal performance and is electrically connected to GND inside the package. It is
recommended to connect the exposed pad to the ground plane on the board.
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Rev. B | 7 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 8. 8-Lead SOIC, ADP1708
Figure 9. 8-Lead LFCSP, ADP1708
Table 6. ADP1708 Pin Function Descriptions
Pin No.
SOIC
LFCSP
Mnemonic
Description
1
1
EN
Enable Input. Drive EN high to turn on the regulator; drive it low to turn off the regulator. For automatic startup, connect EN to IN.
2
2
GND
Ground.
3, 4
3, 4
IN
Regulator Input Supply. Bypass IN to GND with a 4.7 µF or greater capacitor.
5, 6
5, 6
OUT
Regulated Output Voltage. Bypass OUT to GND with a 4.7 µF or greater capacitor.
7
7
SENSE
Sense. Measures the actual output voltage at the load and feeds it to the error amplifier. Connect SENSE as close as possible to the
load to minimize the effect of IR drop between the regulator output and the load.
8
8
ADJ
Adjust. A resistor divider from OUT to ADJ sets the output voltage.
0
0
EP
Exposed Pad. The exposed pad enhances thermal performance and is electrically connected to GND inside the package. It is
recommended to connect the exposed pad to the ground plane on the board.
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Rev. B | 8 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 3.8 V, IOUT = 100 mA, CIN = 4.7 µF, COUT = 4.7 µF, TA = 25°C, unless otherwise noted.
Figure 10. Output Voltage (VOUT) vs. Junction Temperature (TJ)
Figure 13. Ground Current (IGND) vs. Junction Temperature (TJ)
Figure 11. Output Voltage (VOUT) vs. Load Current (ILOAD)
Figure 14. Ground Current (IGND) vs. Load Current (ILOAD)
Figure 12. Output Voltage (VOUT) vs. Input Voltage (VIN)
Figure 15. Ground Current (IGND) vs. Input Voltage (VIN)
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Rev. B | 9 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 16. Dropout Voltage (VDROPOUT) vs. Load Current (ILOAD)
Figure 19. Load Transient Response, CIN = 4.7 µF, COUT = 4.7 µF
Figure 17. Output Voltage (VOUT) vs. Input Voltage (VIN) (in Dropout)
Figure 20. Load Transient Response, CIN = 22 µF, COUT = 22 µF
Figure 18. Ground Current (IGND) vs. Input Voltage (VIN) (in Dropout)
Figure 21. Line Transient Response
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Rev. B | 10 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 22. Output Voltage Ramp-Up Time vs. Soft Start Capacitor Value
Figure 25. ADP1708 Power Supply Rejection Ratio (PSRR) vs. Input Voltage
(VIN)
Figure 23. ADP1706 Power Supply Rejection Ratio (PSRR) vs. Frequency
Figure 26. ADP1708 Power Supply Rejection Ratio (PSRR) vs. Output Voltage
(VOUT)
Figure 24. ADP1708 Power Supply Rejection Ratio (PSRR) vs. Frequency
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Rev. B | 11 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
THEORY OF OPERATION
The ADP1706/ADP1707/ADP1708 are low dropout linear regulators
that use an advanced, proprietary architecture to provide high
power supply rejection ratio (PSRR) and excellent line and load
transient response with a small 4.7 µF ceramic output capacitor. All
devices operate from a 2.5 V to 5.5 V input rail and provide up to
1 A of output current. Supply current in shutdown mode is typically
100 nA.
Figure 27. Internal Block Diagram
where:
TSS is the soft start period.
VREF is the 0.8 V reference voltage.
CSS is the soft start capacitance from SS to GND.
ISS is the current sourced from SS (1.2 µA).
When the ADP1706 is disabled (using EN), the soft start capacitor
is discharged to GND through an internal 100 Ω resistor.
Figure 28. OUT Ramp-Up with External Soft Start Capacitor
Internally, the ADP1706/ADP1707/ADP1708 consist of a reference,
an error amplifier, a feedback voltage divider, and a PMOS pass
transistor. Output current is delivered via the PMOS pass device,
which is controlled by the error amplifier. The error amplifier compares the reference voltage with the feedback voltage from the
output and amplifies the difference. If the feedback voltage is
lower than the reference voltage, the gate of the PMOS device
is pulled lower, allowing more current to pass and increasing the
output voltage. If the feedback voltage is higher than the reference
voltage, the gate of the PMOS device is pulled higher, allowing less
current to pass and decreasing the output voltage.
The ADP1707 and ADP1708 have no pins for soft start; therefore,
the function is switched to an internal soft start capacitor, which sets
the soft start ramp-up period to approximately 48 µs. Note that the
ramp-up period is the time it takes OUT to go from 0% to 90% of
the nominal value and is different from the start-up time in Table
1, which is the time between the rising edge of EN to OUT being
at 90% of the nominal value. For the worst-case output voltage
of 5 V, using the suggested 4.7 µF output capacitor, the resulting
input inrush current is approximately 490 mA, which is less than the
maximum 1 A load current.
The ADP1706/ADP1707 are available in 16 fixed output voltage
options between 0.75 V and 3.3 V. The ADP1706 allows for
connection of an external soft start capacitor, which controls the
output voltage ramp during startup. The ADP1707 features a TRK
pin that allows the output voltage to follow the voltage at this pin.
The ADP1708 is available in an adjustable version with an output
voltage that can be set to between 0.8 V and 5.0 V by an external
voltage divider. All devices are controlled by an enable pin (EN).
SOFT START FUNCTION (ADP1706)
For applications that require a controlled startup, the ADP1706
provides a programmable soft start function. The programmable
soft start is useful for reducing inrush current upon startup and for
providing voltage sequencing. To implement a soft start, connect a
small ceramic capacitor from SS to GND. Upon startup, a 1.2 µA
current source charges this capacitor. The ADP1706 start-up output
voltage is limited by the voltage at SS, providing a smooth ramp-up
to the nominal output voltage. The soft start time is calculated by
The ADP1708 can have its output voltage set over a 0.8 V to 5.0 V
range. The output voltage is set by connecting a resistive voltage
divider from OUT to ADJ. The output voltage is calculated by
TSS = VREF × (CSS/ISS)
VOUT = 0.8 V (1 + R1/R2)
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(1)
Figure 29. OUT Ramp-Up with Internal Soft Start
ADJUSTABLE OUTPUT VOLTAGE (ADP1708)
(2)
Rev. B | 12 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
THEORY OF OPERATION
where:
R1 is the resistor from OUT to ADJ.
R2 is the resistor from ADJ to GND.
The maximum bias current into ADJ is 100 nA, so for less than
0.5% error due to the bias current, use values less than 60 kΩ for
R2.
TRACK MODE (ADP1707)
The ADP1707 includes a tracking mode feature. As shown in Figure 30, if the voltage applied at the TRK pin is less than the nominal
output voltage, OUT is equal to the voltage at TRK. Otherwise,
OUT regulates to its nominal output value.
Figure 31. ADP1706 Typical EN Pin Operation
As shown in Figure 31, the EN pin has hysteresis built in. This
prevents on/off oscillations that can occur due to noise on the EN
pin as it passes through the threshold points.
The EN pin active/inactive thresholds are derived from the IN
voltage. Therefore, these thresholds vary when changing the input
voltage. Figure 32 shows typical EN active/inactive thresholds when
the input voltage varies from 2.5 V to 5.5 V.
Figure 30. ADP1707 Output Voltage vs. Tracking Voltage
For example, consider an ADP1707 with a nominal output voltage
of 3.3 V. If the voltage applied to its TRK pin is greater than 3.3
V, OUT maintains a nominal output voltage of 3.3 V. If the voltage
applied to TRK is reduced below 3.3 V, OUT tracks this voltage.
OUT can track the TRK pin voltage from the nominal value all the
way down to 0 V. A voltage divider is present from TRK to the error
amplifier input with a divider ratio equal to the divider from OUT
to the error amplifier, which sets the output voltage equal to the
tracking voltage. Both divider ratios are set by postpackage trim,
depending on the desired output voltage.
Figure 32. Typical EN Pin Thresholds vs. Input Voltage
ENABLE FEATURE
The ADP1706/ADP1707/ADP1708 use the EN pin to enable and
disable the OUT pin under normal operating conditions. As shown
in Figure 31, when a rising voltage on EN crosses the active
threshold, OUT turns on. When a falling voltage on EN crosses the
inactive threshold, OUT turns off.
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Rev. B | 13 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
APPLICATIONS INFORMATION
CAPACITOR SELECTION
Output Capacitor
The ADP1706/ADP1707/ADP1708 are designed for operation with
small, space-saving ceramic capacitors, but they function with most
commonly used capacitors as long as care is taken with the
effective series resistance (ESR) value. The ESR of the output
capacitor affects stability of the LDO control loop. A minimum of 4.7
µF capacitance with an ESR of 500 mΩ or less is recommended
to ensure stability of the ADP1706/ADP1707/ADP1708. Transient
response to changes in load current is also affected by output
capacitance. Using a larger value of output capacitance improves
the transient response of the ADP1706/ADP1707/ADP1708 to large
changes in load current. Figure 33 and Figure 34 show the transient
responses for output capacitance values of 4.7 µF and 22 µF,
respectively.
Input and Output Capacitor Properties
Any good quality ceramic capacitors can be used with the
ADP1706/ADP1707/ADP1708, as long as they meet the minimum
capacitance and maximum ESR requirements. Ceramic capacitors
are manufactured with a variety of dielectrics, each with different
behavior over temperature and applied voltage. Capacitors must
have a dielectric adequate to ensure the minimum capacitance
over the necessary temperature range and dc bias conditions. X5R
or X7R dielectrics with a voltage rating of 6.3 V or 10 V are
recommended. Y5V and Z5U dielectrics are not recommended, due
to their poor temperature and dc bias characteristics.
VOLTAGE TRACKING APPLICATIONS
Figure 35. Voltage Tracking Feature Using the ADP1707
Figure 33. Output Transient Response, COUT = 4.7 µF
Figure 35 shows an application where the ADP1707 tracking feature is used. An ADP1706 powers the input/output of a microprocessor and an ADP1707 powers the core. At startup, the output of
the ADP1706 ramps to 2.5 V, which is divided down via a voltage
divider (R1 and R2) to a lower voltage at the TRK pin of the
ADP1707. The output of the ADP1707 thus follows the TRK pin and
ramps up steadily to 1.2 V. This implementation ensures that the
core of the processor powers up after the input/output.
CURRENT LIMIT AND THERMAL OVERLOAD
PROTECTION
Figure 34. Output Transient Response, COUT = 22 µF
Input Bypass Capacitor
Connecting a 4.7 µF capacitor from the IN pin to GND reduces the
circuit sensitivity to the printed circuit board (PCB) layout, especially
when long input traces, or high source impedance, is encountered.
If greater than 4.7 µF of output capacitance is required, it is
recommended that the input capacitor be increased to match it.
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The ADP1706/ADP1707/ADP1708 are protected against damage
due to excessive power dissipation by current and thermal overload
protection circuits. The ADP1706/ADP1707/ADP1708 are designed
to reach current limit when the output load reaches 1.5 A (typical).
When the output load exceeds 1.5 A, the output voltage is reduced
to maintain a constant current limit.
Thermal overload protection is included, which limits the junction
temperature to a maximum of 150°C (typical). Under extreme
conditions (that is, high ambient temperature and power dissipation)
when the junction temperature starts to rise above 150°C, the
output is turned off, reducing the output current to zero. When
the junction temperature drops below 135°C (typical), the output is
turned on again and output current is restored to its nominal value.
Rev. B | 14 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
APPLICATIONS INFORMATION
Consider the case where a hard short from OUT to ground occurs.
At first, the ADP1706/ADP1707/ADP1708 reach current limit so
that only 1.5 A is conducted into the short. If self-heating of the
junction becomes great enough to cause its temperature to rise
above 150°C, thermal shutdown activates, turning off the output
and reducing the output current to zero. As the junction temperature
cools and drops below 135°C, the output turns on and conducts
1.5 A into the short, again causing the junction temperature to rise
above 150°C. This thermal oscillation between 135°C and 150°C
causes a current oscillation between 1.5 A and 0 A that continues
as long as the short remains at the output.
Current and thermal limit protections are intended to protect the device against accidental overload conditions. For reliable operation,
device power dissipation should be externally limited so junction
temperatures do not exceed 125°C.
Power dissipation due to ground current is quite small and can be
ignored. Therefore, the junction temperature equation simplifies to
the following:
TJ = TA + (((VIN – VOUT) × ILOAD) × θJA)
(5)
As shown in Equation 5, for a given ambient temperature, input-tooutput voltage differential, and continuous load current, a minimum
copper size requirement exists for the PCB to ensure the junction
temperature does not rise above 125°C. Figure 36 to Figure 41
show junction temperature calculations for different ambient temperatures, load currents, VIN to VOUT differentials, and areas of PCB
copper.
THERMAL CONSIDERATIONS
To guarantee reliable operation, the junction temperature of the
ADP1706/ADP1707/ADP1708 must not exceed 125°C. To ensure
that the junction temperature stays below this maximum value,
the user needs to be aware of the parameters that contribute to
junction temperature changes. These parameters include ambient
temperature, power dissipation in the power device, and thermal
resistance between the junction and ambient air (θJA). The θJA
value is dependent on the package assembly compounds used and
the amount of copper to which the GND pins of the package are
soldered on the PCB. Table 7 shows typical θJA values of the 8-lead
SOIC and 8-lead LFCSP for various PCB copper sizes.
Figure 36. 500 mm2 of PCB Copper, TA = 25°C, SOIC
Table 7. Typical θJA Values
Copper Size (mm2)
θJA (°C/W), SOIC
θJA (°C/W), LFCSP
01
57.6
65.9
50
53.1
62.3
100
52.3
61.2
300
51.3
59.7
500
51.3
59.4
1
Device soldered to minimum size pin traces.
The junction temperature of the ADP1706/ADP1707/ADP1708 can
be calculated by
TJ = TA + (PD × θJA)
Figure 37. 100 mm2 of PCB Copper, TA = 25°C, SOIC
(3)
where:
TA is the ambient temperature.
PD is the power dissipation in the die, given by
PD = ((VIN – VOUT) × ILOAD) + (VIN × IGND)
(4)
where:
ILOAD is the load current.
IGND is the ground current.
VIN and VOUT are the input and output voltages, respectively.
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Rev. B | 15 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
APPLICATIONS INFORMATION
Figure 38. 0 mm2 of PCB Copper, TA = 25°C, SOIC
Figure 41. 0 mm2 of PCB Copper, TA = 25°C, LFCSP
PCB LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP1706/
ADP1707/ADP1708. However, as can be seen from Table 7, a
point of diminishing returns is eventually reached, beyond which
an increase in the copper size does not yield significant heat
dissipation benefits.
Figure 39. 500 mm2 of PCB Copper, TA = 25°C, LFCSP
The ADP1706/ADP1707/ADP1708 feature an exposed pad on the
bottom of both the SOIC and LFCSP packages to improve thermal
performance. Because the exposed pad is electrically connected
to GND inside the package, it is recommended that it also be
connected to the ground plane on the PCB with a sufficient amount
of copper.
Here are a few general tips when designing PCBs:
Place the input capacitor as close as possible to the IN and GND
pins.
► Place the output capacitor as close as possible to the OUT and
GND pins.
► For the ADP1706, place the soft start capacitor as close as
possible to the SS pin.
► Connect the load as close as possible to the OUT and SENSE
pins.
►
Use of 0402 or 0603 size capacitors and resistors achieves the
smallest possible footprint solution on boards where area is limited.
Figure 40. 100 mm2 of PCB Copper, TA = 25°C, LFCSP
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Rev. B | 16 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
APPLICATIONS INFORMATION
Figure 42. Example PCB Layout
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Rev. B | 17 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
OUTLINE DIMENSIONS
Figure 43. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]
Narrow Body
(RD-8-1)
Dimensions shown in millimeters
Figure 44. 8-Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-8-13)
Dimensions shown in millimeters
Updated: June 23, 2022
ORDERING GUIDE
Table 8.
Model1
Temperature Range
Package Description
Packing Quantity
Package
Option
ADP1706ACPZ-1.05R7
ADP1706ACPZ-1.2-R7
ADP1706ACPZ-1.3-R7
ADP1706ACPZ-1.5-R7
ADP1706ACPZ-2.5-R7
ADP1706ACPZ-3.3-R7
ADP1706ARDZ-1.15R7
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
8-Lead LFCSP (3mm x 3mm w/ EP)
8-Lead LFCSP (3mm x 3mm w/ EP)
8-Lead LFCSP (3mm x 3mm w/ EP)
8-Lead LFCSP (3mm x 3mm w/ EP)
8-Lead LFCSP (3mm x 3mm w/ EP)
8-Lead LFCSP (3mm x 3mm w/ EP)
8-Lead SOIC w/ EP
Reel, 1500
Reel, 1500
Reel, 1500
Reel, 1500
Reel, 1500
Reel, 1500
Reel, 1000
CP-8-13
CP-8-13
CP-8-13
CP-8-13
CP-8-13
CP-8-13
RD-8-1
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Marking Code
L67
L6A
L6C
L6D
L6E
L6G
Rev. B | 18 of 19
Data Sheet
ADP1706/ADP1707/ADP1708
OUTLINE DIMENSIONS
Table 8.
Model1
Temperature Range
Package Description
Packing Quantity
Package
Option
ADP1706ARDZ-1.2-R7
ADP1706ARDZ-1.3-R7
ADP1706ARDZ-1.5-R7
ADP1706ARDZ-1.8-R7
ADP1706ARDZ-2.5-R7
ADP1706ARDZ-3.0-R7
ADP1706ARDZ-3.3-R7
ADP1707ACPZ-1.8-R7
ADP1707ACPZ-3.3-R7
ADP1707ARDZ-1.2-R7
ADP1707ARDZ-1.5-R7
ADP1707ARDZ-1.8-R7
ADP1707ARDZ-2.5-R7
ADP1707ARDZ-3.3-R7
ADP1708ACPZ-R7
ADP1708ARDZ-R7
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
8-Lead SOIC w/ EP
8-Lead SOIC w/ EP
8-Lead SOIC w/ EP
8-Lead SOIC w/ EP
8-Lead SOIC w/ EP
8-Lead SOIC w/ EP
8-Lead SOIC w/ EP
8-Lead LFCSP (3mm x 3mm w/ EP)
8-Lead LFCSP (3mm x 3mm w/ EP)
8-Lead SOIC w/ EP
8-Lead SOIC w/ EP
8-Lead SOIC w/ EP
8-Lead SOIC w/ EP
8-Lead SOIC w/ EP
8-Lead LFCSP (3mm x 3mm w/ EP)
8-Lead SOIC w/ EP
Reel, 1000
Reel, 1000
Reel, 1000
Reel, 1000
Reel, 1000
Reel, 1000
Reel, 1000
Reel, 1500
Reel, 1500
Reel, 1000
Reel, 1000
Reel, 1000
Reel, 1000
Reel, 1000
Reel, 1500
Reel, 1000
RD-8-1
RD-8-1
RD-8-1
RD-8-1
RD-8-1
RD-8-1
RD-8-1
CP-8-13
CP-8-13
RD-8-1
RD-8-1
RD-8-1
RD-8-1
RD-8-1
CP-8-13
RD-8-1
1
Marking Code
L71
L74
L7P
Z = RoHS Compliant Part.
OUTPUT VOLTAGE OPTIONS
Table 9. Output Voltage Options
Model1
Output Voltage (V)
ADP1706ACPZ-1.05R7
ADP1706ARDZ-1.15R7
ADP1706ARDZ-1.2-R7, ADP1706ACPZ-1.2-R7, ADP1707ARDZ-1.2-R7
ADP1706ARDZ-1.3-R7, ADP1706ACPZ-1.3-R7
ADP1706ARDZ-1.5-R7, ADP1706ACPZ-1.5-R7, ADP1707ARDZ-1.5-R7
ADP1706ARDZ-1.8-R7, ADP1707ARDZ-1.8-R7, ADP1707ACPZ-1.8-R7
ADP1706ARDZ-2.5-R7, ADP1706ACPZ-2.5-R7, ADP1707ARDZ-2.5-R7
ADP1706ARDZ-3.0-R7
ADP1706ARDZ-3.3-R7, ADP1706ACPZ-3.3-R7, ADP1707ARDZ-3.3-R7, ADP1707ACPZ-3.3-R7
ADP1708ARDZ-R7, ADP1708ACPZ-R7
ADP1706-3.3-EVALZ
ADP1707-3.3-EVALZ
ADP1708-EVALZ
1.05
1.15
1.2
1.3
1.5
1.8
2.5
3.0
3.3
0.8 to 5.0
3.3
3.3
Adjustable, but set to 1.6 V
1
Z = RoHS Compliant Part.
EVALUATION BOARDS
Model1
Description
ADP1706-3.3-EVALZ
Evaluation Board
ADP1707-3.3-EVALZ
Evaluation Board
ADP1708-EVALZ
Evaluation Board
1
Z = RoHS Compliant Part.
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