Logic Controlled,
High-Side Power Switch
ADP194
Data Sheet
FEATURES
TYPICAL APPLICATIONS CIRCUIT
ADP194
REVERSE
POLARITY
PROTECTION
VOUT
VIN
+
–
GND
EN
ON
LEVEL SHIFT
AND SLEW
RATE CONTROL
LOAD
08629-001
Low RDSON of 80 mΩ at 1.8 V
Low input voltage range: 1.1 V to 3.6 V
500 mA continuous operating current
Built-in level shift for control logic that can be operated
by 1.2 V logic
Low 2 μA (maximum) ground current
Ultralow shutdown current VIH, ILOAD = 100 mA, TA = 25°C, unless otherwise noted.
0.12
4.0
3.5
0.10
3.0
ILOAD = 20mA
ILOAD = 50mA
ILOAD = 100mA
ILOAD = 200mA
ILOAD = 500mA
0.06
0.04
2.5
2.0
1.5
1.0
0.02
0.5
–40
–5
25
65
0
08629-004
0
VEN
VIN = 1.5V
VIN = 1.8V
VIN = 2.5V
VIN = 3.6V
85
TEMPERATURE (°C)
0
20
40
60
100
80
TIME (µs)
Figure 4. RDSON vs. Temperature
08629-007
VOLTAGE (V)
RDSON (Ω)
0.08
Figure 7. Start-Up and Turn-On Delay vs. Input Voltage
0.30
2.0
1.8
0.25
ILOAD = 10mA
ILOAD = 20mA
ILOAD = 50mA
ILOAD = 100mA
ILOAD = 200mA
ILOAD = 500mA
0.20
RDS ON (Ω)
GROUND CURRENT (µA)
1.6
0.15
0.10
1.4
ILOAD = 20mA
ILOAD = 50mA
ILOAD = 100mA
ILOAD = 200mA
ILOAD = 500mA
1.2
1.0
0.8
0.6
0.4
0.05
2.2
2.6
3.0
3.4
VIN (V)
0
120
6
GROUND CURRENT (µA)
7
VIN = 1.1V
VIN = 1.3V
VIN = 1.5V
VIN = 1.8V
VIN = 2.1V
VIN = 2.4V
VIN = 2.7V
VIN = 3.0V
VIN = 3.3V
VIN = 3.6V
20
0
10
65
85
5
4
3
ILOAD = 10mA
ILOAD = 20mA
ILOAD = 50mA
ILOAD = 100mA
ILOAD = 200mA
ILOAD = 500mA
2
1
100
ILOAD (mA)
1000
0
1.0
08629-006
DIFFERENCE (V)
100
40
25
Figure 8. Ground Current vs. Temperature
140
60
–5
TEMPERATURE (°C)
Figure 5. RDSON vs. Input Voltage, VIN
80
–40
1.4
1.8
2.2
2.6
3.0
VIN (V)
Figure 9. Ground Current vs. Input Voltage, VIN
Figure 6. Voltage Drop vs. Load Current
Rev. A | Page 6 of 12
3.4
08629-009
1.8
08629-005
1.4
08629-008
0.2
0
1.0
Data Sheet
ADP194
5.0
10
IGND SHUTDOWN CURRENT (µA)
IGND SHUTDOWN CURRENT (µA)
4.5
4.0
3.5
VIN = 1.1V
VIN = 1.5V
VIN = 1.8V
3.0
2.5
VIN = 2.4V
VIN = 2.7V
VIN = 3.3V
VIN = 3.6V
2.0
1.5
1.0
VIN = 3.3V
VIN = 3.6V
VIN = 2.4V
VIN = 2.7V
VIN = 1.8V
1
VIN = 1.5V
VIN = 1.1V
–20
0
20
40
60
80
100
TEMPERATURE (°C)
0.1
–40
08629-010
0
–40
–20
0
20
40
60
80
100
TEMPERATURE (°C)
08629-013
0.5
Figure 13. Reverse Shutdown Current vs. Temperature, VOUT = 0 V
Figure 10. Shutdown Current vs. Temperature, VOUT Open
0.50
10
IOUT SHUTDOWN CURRENT (µA)
1
0.1
VIN = 2.7V
VIN = 3.3V
VIN = 3.6V
0.01
–40
–20
0
20
40
60
80
100
TEMPERATURE (°C)
0.35
0.30
VIN = 1.1V
VIN = 1.5V
VIN = 1.8V
VIN = 2.4V
VIN = 2.7V
VIN = 3.3V
VIN = 3.6V
0.05
0
–40
–20
0
20
40
60
TEMPERATURE (°C)
80
100
08629-012
IOUT SHUTDOWN CURRENT (µA)
0.40
0.10
VIN = 1.1V
VIN = 1.5V
VIN = 1.8V
VIN = 2.4V
VIN = 2.7V
VIN = 3.3V
VIN = 3.6V
0.25
0.20
0.15
0.10
–20
0
20
40
60
TEMPERATURE (°C)
80
Figure 14. IOUT Reverse Current vs. Temperature, VOUT = 0 V
0.45
0.15
0.30
0
–40
0.50
0.20
0.35
0.05
Figure 11. Shutdown Current vs. Temperature, VOUT = 0 V
0.25
0.40
Figure 12. IOUT Shutdown Current vs. Temperature, VOUT = 0 V
Rev. A | Page 7 of 12
100
08629-114
VIN = 1.1V
VIN = 1.5V
VIN = 1.8V
VIN = 2.4V
08629-011
IGND SHUTDOWN CURRENT (µA)
0.45
ADP194
Data Sheet
THEORY OF OPERATION
The reverse current protection circuitry prevents current flow
backwards through the ADP194 when the output voltage is
greater than the input voltage. A comparator senses the difference between the input and output voltages. When the difference
between the input voltage and output voltage exceeds 50 mV,
the body of the PFET is switched to VOUT and turned off or
opened. In other words, the gate is connected to VOUT.
The package is a space-saving 0.8 mm × 0.8 mm, 4-ball WLCSP.
Rev. A | Page 8 of 12
ADP194
REVERSE
POLARITY
PROTECTION
VOUT
VIN
GND
EN
LEVEL SHIFT
AND SLEW
RATE CONTROL
08629-115
The ADP194 is a high-side PMOS load switch. It is designed to
operate from a supply range from 1.1 V to 3.6 V. The PMOS load
switch is designed for low on resistance, 80 mΩ at VIN = 1.8 V,
and supports 500 mA of continuous output current. The ADP194
is a low ground current device with a nominal 4 MΩ pull-down
resistor on its enable pin.
Figure 15. Functional Block Diagram
Data Sheet
ADP194
APPLICATIONS INFORMATION
GROUND CURRENT
ENABLE FEATURE
The major source for ground current in the ADP194 is the 4 MΩ
pull-down resistor on the enable (EN) pin. Figure 16 shows
typical ground current when VEN = VIN and VIN varies from
1.1 V to 3.6 V.
The ADP194 uses the EN pin to enable and disable the VOUT
pin under normal operating conditions. As shown in Figure 18,
when a rising voltage on EN crosses the active threshold, VOUT
turns on. When a falling voltage on EN crosses the inactive
threshold, VOUT turns off.
7
2.0
VIN = 3.6V
1.8
1.6
5
VIN = 3.0V
3
1.4
VIN = 2.7V
VOUT (V)
4
VIN = 2.4V
VIN = 2.1V
2
1
0
10
VIN = 1.8V
1.2
1.0
0.8
0.6
VIN = 1.5V
0.4
VIN = 1.1V
0.2
VIN = 1.3V
100
08629-116
GROUND CURRENT (µA)
VIN = 3.3V
1000
ILOAD (mA)
0
0
0.1
0.2
0.3
0.4
0.5
Figure 16. Ground Current vs. Load Current, Different Input Voltages
0.6 0.7
VEN (V)
0.8
0.9
1.0
1.1
1.2
08629-015
6
Figure 18. Typical EN Operation, VIN = 1.8 V
As shown in Figure 17, an increase in ground current can occur
when VEN ≠ VIN. This is caused by the CMOS logic nature of the
level shift circuitry as it translates an EN signal ≥ 1.1 V to
a logic high. This increase is a function of the VIN − VEN delta.
The EN input active/inactive thresholds derive from the VIN
voltage; therefore, these thresholds vary with changing input
voltage. Figure 19 shows typical EN active/inactive thresholds
when the input voltage varies from 1.1 V to 3.6 V.
14
12
10
VOUT = 3.6V
1.15
0.65
EN INACTIVE
0.55
VIN (V)
Figure 19. Typical EN Pin Thresholds vs. Input Voltage, VIN
Rev. A | Page 9 of 12
3.60
08629-016
3.45
3.30
3.15
3.00
2.85
2.70
2.55
2.25
2.40
2.10
0.35
1.95
0.45
Figure 17. Typical Ground Current when VEN ≠ VIN
1.80
0
0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5
VEN (V)
0.75
1.65
VOUT = 1.8V
EN ACTIVE
0.85
1.20
2
0.95
1.50
4
1.05
1.35
6
TYPICAL EN THRESHOLDS (V)
8
08629-014
GROUND CURRENT (µA)
The EN input has built-in hysteresis, as shown in Figure 18.
The hysteresis prevents on/off oscillations that can occur due to
noise on the EN pin as VEN passes through the threshold points.
ADP194
Data Sheet
TIMING
VEN
Turn-on delay is defined as the delta between the time that EN
reaches >1.1 V until VOUT rises to ~10% of its final value. The
ADP194 includes circuitry to set the typical 1.5 μs turn-on delay
at 3.6 V VIN to limit the VIN inrush current. As shown in Figure 20,
the turn-on delay is dependent on the input voltage.
VOUT
3
LOAD CURRENT
4.0
1
3.5
089629-022
2
2.5
CH1 1.00V BW
CH3 1.00V BW
2.0
400mV
VEN
VIN = 1.5V
VIN = 1.8V
VIN = 2.5V
VIN = 3.6V
0.5
0
20
40
60
100
80
TIME (µs)
The fall time or turn-off time of VOUT is defined as the time
delta between the 90% and 10% points of VOUT as it transitions to its final value. The turn-off time is also dependent on
the RC time constant.
Figure 20. Typical Turn-On Delay Time with Varying Input Voltage
VEN
3
The rise time of VOUT is defined as the time delta between the
10% and 90% points of VOUT as it transitions to its final value.
It is dependent on the RC time constant where C = load capacitance (CLOAD) and R = RDSON||RLOAD. Because RDSON is usually
smaller than RLOAD, an adequate approximation for RC is RDSON ×
CLOAD. The ADP194 does not need any input or load capacitor,
but capacitors can be used to suppress noise on the board. If
significant load capacitance is connected, inrush current may
be a concern.
VOUT
1
LOAD CURRENT
2
089629-023
1.0
0
CH2 200mA Ω BW M4.00µs A CH3
T 10.00%
Figure 22. Typical Rise Time and Inrush Current with VIN = 3.6 V, CLOAD = 1 μF
1.5
08629-020
VOLTAGE (V)
3.0
CH1 500mV BW CH2 200mA Ω BW M2.00µs A CH3
T 10.00%
CH3 1.00V BW
VEN
3
400mV
Figure 23. Typical Turn-Off Time, VIN = 1.8 V, RLOAD = 3.6 Ω
VOUT
VEN
3
1
VOUT
LOAD CURRENT
089629-021
2
1
400mV
Figure 21. Typical Rise Time and Inrush Current with VIN = 1.8 V, CLOAD = 1 μF
LOAD CURRENT
2
089629-024
CH1 500mV BW CH2 200mA Ω BW M20.0µs A CH3
T 10.00%
CH3 1.00V BW
CH1 1.00V BW CH2 200mA Ω BW M2.00µs A CH3
T 10.00%
CH3 1.00V BW
400mV
Figure 24. Typical Turn-Off Time, VIN = 3.6 V, RLOAD = 7.5 Ω
Rev. A | Page 10 of 12
Data Sheet
ADP194
THERMAL CONSIDERATIONS
In most applications, the ADP194 does not dissipate much heat
due to its low on-channel resistance. However, in applications
with high ambient temperature and high load current, the heat
dissipated in the package can cause the junction temperature of
the die to exceed the maximum junction temperature of 125°C.
The junction temperature of the die is the sum of the ambient
temperature of the environment and the temperature rise of the
package due to the power dissipation, as shown in Equation 1.
To guarantee reliable operation, the junction temperature of
the ADP194 must not exceed 125°C. To ensure that the junction
temperature stays below this maximum value, the user must be
aware of the parameters that contribute to junction temperature
changes. These parameters include ambient temperature, power
dissipation in the device, and thermal resistances between the
junction and ambient air (θJA). The θJA value is dependent on
the package assembly compounds that are used and the amount
of copper used to solder the package GND pin to the PCB.
Table 5 shows typical θJA values of the 4-ball WLCSP for various
PCB copper sizes. Table 6 shows the typical ΨJB value of the
4-ball WLCSP.
Power dissipation due to ground current is quite small and
can be ignored. Therefore, the junction temperature equation
simplifies to the following:
TJ = TA + {[(VIN − VOUT) × ILOAD] × θJA}
(3)
In cases where the board temperature is known, use the thermal
characterization parameter, ΨJB, to estimate the junction temperature rise. Maximum junction temperature (TJ) is calculated
from the board temperature (TB) and power dissipation (PD)
using the formula
TJ = TB + (PD × ΨJB)
(4)
PCB LAYOUT CONSIDERATIONS
The heat dissipation capability of the package can be improved
by increasing the amount of copper attached to the pins of the
ADP194. However, as listed in Table 5, a point of diminishing
returns is eventually reached, beyond which an increase in the
copper size does not yield significant heat dissipation benefits.
It is critical to keep the input and output traces as wide and as
short as possible to minimize the circuit board trace resistance.
Table 5. Typical θJA Values for WLCSP
Copper Size (mm2)
01
50
100
300
500
1
θJA (°C/W)
260
159
157
153
151
Device soldered to minimum size pin traces.
Table 6. Typical ΨJB Values
ΨJB
58.4
Unit
°C/W
The junction temperature of the ADP194 is calculated from the
following equation:
TJ = TA + (PD × θJA)
(1)
where:
TA is the ambient temperature.
PD is the power dissipation in the die, given by
PD = [(VIN − VOUT) × ILOAD] + (VIN × IGND)
(2)
where:
ILOAD is the load current.
IGND is the ground current.
VIN and VOUT are the input and output voltages, respectively.
Rev. A | Page 11 of 12
08629-025
Package
4-Ball WLCSP
Figure 25. ADP194 PCB Layout
ADP194
Data Sheet
OUTLINE DIMENSIONS
0.800
0.740 SQ
0.720
2
1
A
BALL A1
IDENTIFIER
B
0.40
REF
TOP VIEW
BOTTOM VIEW
(BALL SIDE DOWN)
0.560
0.500
0.440
END VIEW
(BALL SIDE UP)
0.330
0.300
0.270
SEATING
PLANE
0.300
0.260
0.220
0.230
0.200
0.170
10-08-2010-A
COPLANARITY
0.03
Figure 26. 4-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-4-5)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
ADP194ACBZ-R7
ADP194CB-EVALZ
1
Temperature Range
−40°C to +85°C
Package Description
4-Ball Wafer Level Chip Scale Package [WLCSP]
Evaluation Board
Z = RoHS Compliant Part.
©2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08629-0-9/11(A)
Rev. A | Page 12 of 12
Package Option
CB-4-5
Branding
76
