0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
ADP2165ACPZ-R7

ADP2165ACPZ-R7

  • 厂商:

    AD(亚德诺)

  • 封装:

    WFQFN24

  • 描述:

    IC REG BUCK ADJ 5A 24LFCSP

  • 数据手册
  • 价格&库存
ADP2165ACPZ-R7 数据手册
TYPICAL APPLICATION CIRCUIT Continuous output current ADP2165: 5 A ADP2166: 6 A Integrated MOSFET High-side on resistance: 19 mΩ Low-side on resistance: 15 mΩ Reference voltage: 0.6 V ± 1% over temperature range Input voltage range: 2.7 V to 5.5 V Current mode architecture Switching frequency Fixed frequency: 620 kHz or 1.2 MHz Adjustable frequency: 250 kHz to 1.4 MHz Synchronizes to external clock: 250 kHz to 1.4 MHz Selectable synchronize phase shift: in phase or out of phase External compensation Programmable soft start Startup into a precharged output Voltage tracking input Power-good output and precision enable input Accurate current limit Available in 24-lead, 4 mm × 4 mm LFCSP package Supported by ADIsimPower™ design tool APPLICATIONS BST CBST AVIN CIN VOUT PGOOD RTOP SYNC RRT COUT FB RT CVREG L1 SW EN COMP TRK VREG SS GND PGND CCP CSS RC RBOT CC Figure 1. The ADP2165/ADP2166 are designed to be extremely flexible with the addition of a minimal amount of external components to program soft start and control loop compensation. The ADP2165/ADP2166 are supplied from an input voltage of 2.7 V to 5.5 V. Output voltage options include 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V, or 1.0 V fixed outputs and adjustable options capable of supporting an output voltage range from 0.6 V to 90% of the input voltage. Protection features include undervoltage lockout (UVLO), overvoltage protection (OVP), overcurrent protection (OCP), and thermal shutdown (TSD) for robust performance. The ADP2165/ADP2166 operate over the −40°C to +125°C junction temperature range and are available in a 24-lead LFCSP package. Point of load regulation Communications and networking High end consumer Industrial, instrumentation, and healthcare 100 VPVIN = 3.3V GENERAL DESCRIPTION 95 Key features include precision enable, power-good monitor, and output voltage tracking to facilitate robust sequencing. The switching frequency can be programmed from 250 kHz to 1.4 MHz, or it can be fixed at 620 kHz or 1.2 MHz. The synchronization function allows the switching frequency to synchronize to an external clock, minimizing the electromagnetic interference (EMI) of the system. 90 VPVIN = 5V 85 EFFICIENCY (%) The ADP2165/ADP2166 are high efficiency, current mode control, step-down dc-to-dc regulators with an integrated 19 mΩ high-side FET and a 15 mΩ synchronous rectified FET. The ADP2165/ADP2166 combine a small size, 4 mm × 4 mm LFCSP package with an accurate current limit, resulting in a smaller inductor size and a high power density, point of load solution. Rev. B ADP2165/ ADP2166 PVIN VPVIN 10956-001 FEATURES 80 75 70 65 60 55 VOUT = 1.8V fSW = 600kHz 50 0 1 2 3 4 OUTPUT CURRENT (A) 5 6 10956-002 Data Sheet 5.5 V, 5 A/6 A, High Efficiency, Step-Down DC-to-DC Regulators with Output Tracking ADP2165/ADP2166 Figure 2. Efficiency vs. Output Current Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2014–2017 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADP2165/ADP2166 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Undervoltage Lockout ............................................................... 13 Applications ....................................................................................... 1 Thermal Shutdown .................................................................... 13 General Description ......................................................................... 1 Applications Information .............................................................. 14 Typical Application Circuit ............................................................. 1 ADIsimPower Design Tool ....................................................... 14 Revision History ............................................................................... 2 Input Capacitor Selection .......................................................... 14 Functional Block Diagram .............................................................. 3 Output Voltage Setting .............................................................. 14 Specifications..................................................................................... 4 Voltage Conversion Limitations ............................................... 14 Absolute Maximum Ratings ............................................................ 6 Inductor Selection ...................................................................... 15 Thermal Resistance ...................................................................... 6 Output Capacitor Selection....................................................... 15 ESD Caution .................................................................................. 6 Compensation Design ............................................................... 16 Pin Configuration and Function Descriptions ............................. 7 Design Example .............................................................................. 17 Typical Performance Characteristics ............................................. 8 Output Voltage Setting .............................................................. 17 Theory of Operation ...................................................................... 12 Frequency Setting ....................................................................... 17 Control Scheme .......................................................................... 12 Inductor Selection ...................................................................... 17 PWM Mode ................................................................................. 12 Output Capacitor Selection....................................................... 18 Enable/Shutdown ....................................................................... 12 Compensation Components ..................................................... 18 Internal Regulator (VREG) ....................................................... 12 Soft Start Time Program ........................................................... 18 Bootstrap Circuitry .................................................................... 12 Input Capacitor Selection .......................................................... 18 Oscillator and Synchronization ................................................ 12 Recommended External Components .................................... 19 Soft Start ...................................................................................... 13 Printed Circuit Board Layout Recommendations ..................... 20 Tracking ....................................................................................... 13 Reference Designs .......................................................................... 21 Power-Good (PGOOD) ............................................................. 13 Outline Dimensions ....................................................................... 23 Peak Current-Limit and Short-Circuit Protection................. 13 Ordering Guide .......................................................................... 23 Overvoltage Protection .............................................................. 13 REVISION HISTORY 8/2017—Rev. A to Rev. B Changed LFCSP_WQ to LFCSP ..........................................Throughout Updated Outline Dimensions ................................................................. 23 Changes to Ordering Guide..................................................................... 23 9/2016—Rev. 0 to Rev. A Change to Compensation Components Section ........................ 18 Change to Table 8 ........................................................................... 19 8/2014—Revision 0: Initial Version Rev. B | Page 2 of 23 Data Sheet ADP2165/ADP2166 FUNCTIONAL BLOCK DIAGRAM EN EN_BUF UVLO 1.2V PVIN ACS SLOPE RAMP Σ + OCP – IMAX HICCUP MODE VPVIN BST COMP ISS 0.6V + SS + TRK + FB – AMP 0.66V – DRIVER SW CLK 0.7V 0.54V NFET1 + CMP – – OVP CONTROL LOGIC VPVIN NFET2 + DRIVER – PGND + NEG CURRENT + CMP – + INEG PGOOD AVIN DEGLITCH EN_BUF CLK OSC RT VREG GND SLOPE RAMP 10956-018 SYNC 3.3V REGULATOR Figure 3. ADP2165/ADP2166 Functional Block Diagram Rev. B | Page 3 of 23 ADP2165/ADP2166 Data Sheet SPECIFICATIONS VPVIN = VAVIN = 5 V, TJ = −40°C to +125°C for minimum/maximum specifications, and TA = 25°C for typical specifications, unless otherwise noted. Table 1. Parameter PVIN AND AVIN VPVIN Voltage Range VAVIN Voltage Range Quiescent Current Shutdown Current VAVIN Undervoltage Lockout Threshold FB FB Regulation Voltage Fixed Output Version FB Bias Current ERROR AMPLIFIER (EA) Transconductance EA Source Current EA Sink Current INTERNAL REGULATOR (VREG) VREG Voltage Dropout Voltage Regulator Current Limit SW High-Side On Resistance 1 Symbol VPVIN VAVIN IQ ISHDN UVLO VFB VOUT IFB No switching, fSW = 600 kHz EN = 0 V VAVIN rising VAVIN falling VPVIN = 2.7 V to 5.5 V 2.35 0.594 −1 VBST − VSW = 5 V VBST − VSW = 3.3 V VPVIN = 5 V VPVIN = 3.3 V ADP2165 ADP2166 2 25 2.6 2.5 0.6 RT pin floating RT pin connected to VREG RRT = 95.3 kΩ Rev. B | Page 4 of 23 5.5 5.5 10 150 2.7 V V mA µA V V 0.606 +1 0.1 V % µA 570 µS µA µA 3.1 3.3 140 50 3.5 V mV mA 19 22 15 16 8 9 2.4 100 100 29 34 23 26 9.5 10.5 mΩ mΩ mΩ mΩ A A A ns ns 620 1.2 590 715 1.32 680 1400 kHz MHz kHz kHz 1400 0.4 kHz ns ns V V 4.3 µA 600 +9 100 mV mV nA 6.5 7.5 525 1.08 500 250 2.7 TRK = 300 mV to 500 mV Unit 500 75 85 250 100 100 1.3 ISS Max 430 tOFF_MIN tON_MIN fSW Typ 0.01 IVREG = 10 mA High-Side Peak Current Limit Switching Frequency Range SYNC Synchronization Range SYNC Minimum Pulse Width SYNC Minimum Off Time SYNC Input High Voltage SYNC Input Low Voltage SOFT START (SS) SS Pull-Up Current TRK TRK Input Voltage Range TRK-to-FB Offset Voltage TRK Input Bias Current Min 2.7 2.7 gm ISOURCE ISINK Low-Side On Resistance1 Low-Side Negative Current Limit SW Minimum Off Time 2 SW Minimum On Time2 OSCILLATOR (RT) Switching Frequency Test Conditions/Comments 0 −9 3.5 Data Sheet Parameter PGOOD Power-Good Range Power-Good Deglitch Time PGOOD Leakage Current PGOOD Output Low Voltage EN EN Threshold EN Hysteresis EN Pull-Down Resistor THERMAL Thermal Shutdown Threshold Thermal Shutdown Hysteresis 1 2 ADP2165/ADP2166 Symbol Test Conditions/Comments Min Typ Max Unit FB rising threshold FB rising hysteresis FB falling threshold FB falling hysteresis From FB to PGOOD VPGOOD = 5 V IPGOOD = 1 mA 107 111 3 90.5 3 16 0.1 27 115 % % % % Clock cycles µA mV 1.2 100 1 1.28 87 1.12 150 25 Pin-to-pin measurement. Guaranteed by design. Rev. B | Page 5 of 23 94.5 1 45 V mV MΩ °C °C ADP2165/ADP2166 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter PVIN, AVIN, EN, PGOOD, FB SW BST SS, COMP, TRK, VREG, SYNC, RT PGND to GND Operating Junction Temperature Range Storage Temperature Range Soldering Conditions Rating −0.3 V to +6 V −1 V to +6 V SW + 6 V −0.3 V to +6 V −0.3 V to +0.3 V −40°C to +125°C −65°C to +150°C JEDEC J-STD-020 θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board (4-layer, JEDEC standard board) for surface-mount packages. Table 3. Thermal Resistance Package Type 24-Lead LFCSP ESD CAUTION Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 6 of 23 θJA 38.3 Unit °C/W Data Sheet ADP2165/ADP2166 20 PVIN 19 PVIN 22 AVIN 21 PVIN 24 VREG 23 EN PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 18 PVIN SYNC 1 RT 2 TRK 3 ADP2165/ ADP2166 SS 4 TOP VIEW (Not to Scale) COMP 5 17 SW 16 SW 15 SW 14 SW FB 6 NOTES 1. EXPOSED PAD. SOLDER THE EXPOSED PAD TO AN EXTERNAL GROUND PLANE UNDERNEATH THE IC FOR THERMAL DISSIPATION. 10956-003 PGND 11 PGND 12 9 BST PGND 10 7 8 GND PGOOD 13 PGND Figure 4. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1 Mnemonic SYNC 2 RT 3 TRK 4 5 6 7 8 9 10, 11, 12, 13 14, 15, 16, 17 18, 19, 20, 21 22 SS COMP FB GND PGOOD BST PGND Description Synchronization Input. Connect this pin to an external clock between 250 kHz and 1.4 MHz to synchronize the switching frequency to the external clock. RT can be used to program the phase shift when synchronizing the external clock. Frequency Setting. Connect a resistor between the RT and GND pins to program the switching frequency between 250 kHz to 1.4 MHz. When the RT pin is floating, the frequency is set to 620 kHz, and when the RT pin is connected to VREG, the frequency is set to 1.2 MHz. Tracking Input. This pin can be used for tracking and sequencing. If the tracking function is not used, connect TRK to VREG. Soft Start Control. Connect a capacitor from the SS pin to the GND pin to program the soft start time. Error Amplifier Output. Connect a compensation network from the COMP pin to the GND pin. Feedback Voltage Sense Input. Connect to a resistor divider from VOUT. Analog Ground. Connect to the ground plane. Power-Good Output (Open-Drain). A pull-up resistor of 100 kΩ is recommended. Supply Rail for the High-Side MOSFET Gate Drive. Place a 0.1 µF capacitor between the SW pin and the BST pin. Power Ground. Connect this pin to the ground plane and to the output return side of the output capacitor. SW Switching Node. PVIN 23 EN 24 VREG Power Input. Connect this pin to the input power source and connect a bypass capacitor between this pin and ground. Bias Voltage Input Pin. Connect a bypass capacitor between this pin and GND and a small (10 Ω) resistor between this pin and PVIN. Precision Enable Input Pin. An external resistor divider can be used to set the turn-on threshold. To enable the device automatically, connect the EN pin to PVIN. This pin has a 1 MΩ pull-down resistor to GND. Internal Bias Regulator Output. It supplies the regulated voltage to the internal circuitry. Bypass the VREG pin to the GND pin with a high quality, low ESR 1 µF ceramic capacitor. Exposed Pad. Solder the exposed pad to an external ground plane underneath the IC for thermal dissipation. AVIN EPAD Rev. B | Page 7 of 23 ADP2165/ADP2166 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, VPVIN = VAVIN = 5 V, VOUT = 1.2 V, L = 1 µH, CIN = 47 µF, COUT = 100 µF, fSW = 600 kHz, unless otherwise noted. 100 100 VOUT = 2.5V 90 VOUT = 1.5V VOUT = 1.8V V OUT = 1.5V 85 VOUT = 1.2V EFFICIENCY (%) VOUT = 1.0V 80 75 70 VOUT = 1.2V 80 VOUT = 1.0V 75 70 65 65 60 60 55 55 1 2 3 4 5 6 OUTPUT CURRENT (A) 50 10956-104 0 0 1 2 3 4 5 6 OUTPUT CURRENT (A) Figure 5. Efficiency (fSW = 600 kHz, VPVIN = 3.3 V) vs. Output Current 10956-107 INDUCTOR: WÜRTH ELEKTRONIK 744311100 INDUCTOR: WÜRTH ELEKTRONIK 744311100 50 Figure 8. Efficiency (fSW = 600 kHz, VPVIN = 5 V) vs. Output Current 100 100 95 90 90 VOUT = 2.5V VOUT = 3.3V VOUT = 2.5V 95 85 VOUT = 1.8V VOUT = 1.5V 80 EFFICIENCY (%) 85 VOUT = 1.2V VOUT = 1.0V 75 70 VOUT = 1.5V 80 VOUT = 1.2V VOUT = 1.8V VOUT = 1.0V 75 70 65 65 60 60 55 55 INDUCTOR: WÜRTH ELEKTRONIK 744314047 INDUCTOR: WÜRTH ELEKTRONIK 744314047 0 1 2 3 4 5 6 OUTPUT CURRENT (A) 50 10956-105 50 0 1 2 3 4 5 6 OUTPUT CURRENT (A) Figure 6. Efficiency (fSW = 1.2 MHz, VPVIN = 3.3 V) vs. Output Current 10956-108 EFFICIENCY (%) 90 VOUT = 1.8V 85 EFFICIENCY (%) VOUT = 2.5V VOUT = 3.3V 95 95 Figure 9. Efficiency (fSW = 1.2 MHz, VPVIN = 5 V) vs. Output Current 40 2.3 2.2 SHUTDOWN CURRENT (µA) 2.1 +125ºC 2.0 +25ºC 1.9 –40ºC 1.8 1.7 +125ºC 30 25 +25ºC 20 –40ºC 15 1.5 2.7 3.1 3.5 3.9 4.3 4.7 5.1 VPVIN (V) 5.5 10 2.7 3.1 3.5 3.9 4.3 4.7 VPVIN (V) Figure 10. Shutdown Current vs. VPVIN Figure 7. Quiescent Current vs. VPVIN (No Switching) Rev. B | Page 8 of 23 5.1 5.5 10956-109 1.6 10956-106 QUIESCENT CURRENT (mA) 35 ADP2165/ADP2166 30 35 25 +125ºC 30 +25ºC 25 –40ºC 20 15 3.1 3.5 3.9 4.3 4.7 5.1 5.5 VPVIN (V) Figure 11. High-Side NFET Resistor vs. VPVIN (Pin-to-Pin Measurements) –40ºC 10 5 0 2.7 3.5 3.9 4.3 4.7 5.1 5.5 Figure 14. Low-Side NFET Resistor vs. VPVIN (Pin-to-Pin Measurements) 610 604 600 SWITCHING FREQUENCY (kHz) 603 602 601 600 599 598 597 +125ºC 590 +25ºC 580 570 –40ºC 560 550 540 596 –40 0 25 85 530 2.7 10956-111 595 125 TEMPERATURE (°C) 3.1 3.5 3.9 4.3 4.7 5.1 5.5 VPVIN (V) Figure 12. Feedback Voltage vs. Temperature, VPVIN = 5 V Figure 15. Switching Frequency vs. VPVIN (RRT = 95.3 kΩ) 1300 660 650 1250 640 SWITCHING FREQUENCY (kHz) 1275 +125ºC 1225 +25ºC 1200 –40°C 1175 1150 1125 +125ºC 630 620 +25ºC 610 –40ºC 600 590 580 3.1 3.5 3.9 4.3 4.7 5.1 5.5 VPVIN (V) Figure 13. Switching Frequency vs. VPVIN at 1.2 MHz (RT = VREG) 560 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 VPVIN (V) Figure 16. Switching Frequency vs. VPVIN at 620 kHz (RT Floating) Rev. B | Page 9 of 23 10956-115 570 1100 2.7 10956-112 SWITCHING FREQUENCY (kHz) 3.1 VPVIN (V) 605 FEEDBACK VOLTAGE (mV) +25ºC 15 10956-114 10 2.7 +125ºC 20 10956-113 LOW-SIDE NFET RESISTOR (mΩ) 40 10956-110 HIGH-SIDE NFET RESISTOR (mΩ) Data Sheet Data Sheet 9.0 10.0 8.8 9.8 8.6 9.6 +125ºC 8.2 +25ºC 8.0 7.8 –40ºC 7.6 9.2 8.8 –40ºC 8.6 8.4 7.2 8.2 3.5 3.9 4.3 4.7 5.1 5.5 VPVIN (V) 8.0 2.7 10956-116 3.1 +25ºC 9.0 7.4 7.0 2.7 +125ºC 9.4 3.1 3.9 4.3 4.7 5.1 5.5 VPVIN (V) Figure 17. ADP2165 Peak Current Limit vs. VPVIN Figure 20. ADP2166 Peak Current Limit vs. VPVIN T 2 3.5 T EN 2 EN VOUT VOUT 1 1 3 4 CH1 500mV BW CH2 5.00V BW M1.00ms A CH2 CH3 5.00V BW CH4 5.00A Ω BW T 10.00% 3.80V 10956-006 4 IL PGOOD IL CH1 500mV BW CH3 5.00V BW Figure 18. Soft Start with Full Load (600 kHz, VPVIN = 5 V) CH2 5.0V BW M1.00ms A CH2 CH4 2.00A Ω BW T 10.00% 3.80V 10956-009 3 PGOOD Figure 21. Soft Start with Precharge (600 kHz, VPVIN = 5 V) T T VOUT (AC) VOUT (AC) 1 1 IOUT IOUT 4 B W M200µs A CH4 CH4 2.00A Ω BW T 30.20% 2.80A CH1 50.0mV B W M200µs A CH4 CH4 5.00A Ω BW T 20.60% 4.60A Figure 22. Load Transient (1.2 MHz, 0.5 A to 5.5 A Load Step) Figure 19. Load Transient (600 kHz, 1.5 A to 4.5 A Load Step) Rev. B | Page 10 of 23 10956-033 CH1 50.0mV 10956-016 4 10956-119 8.4 PEAK CURRENT LIMIT (A) PEAK CURRENT LIMIT (A) ADP2165/ADP2166 Data Sheet ADP2165/ADP2166 T T 1 VOUT (AC) TRK 2 SW FB 2 3 IL CH4 5.00A Ω M1.00µs T 40.20% A CH2 4.00V CH2 500mV CH3 500mV Figure 23. Steady Waveform M2.00ms T 20.20% A CH3 300mV 10956-017 B W CH2 5.00V CH1 5.00mV 10956-010 4 Figure 26. Tracing Function T T VOUT 2 VOUT 2 SW 1 SW 1 IL IL 4 A CH2 600mV CH2 500mV BW CH4 5.00A Ω CH1 5.00V Figure 24. Output Short M10.0ms T 80.40% A CH2 600mV 10956-014 M10.0ms T 20.40% 400mV 10956-015 CH2 500mV BW CH4 5.00A Ω CH1 5.00V 10956-011 4 Figure 27. Output Short Recovery T T 3 SYNC 3 SYNC SW SW 2 CH2 2.00V CH3 5.00V M400ns T 20.40% A CH3 400mV 10956-012 2 CH2 2.00V CH3 5.00V Figure 25. Synchronized to 1 MHz in Phase M400ns T 20.40% A CH3 Figure 28. Synchronized to 1 MHz 180° Out of Phase Rev. B | Page 11 of 23 ADP2165/ADP2166 Data Sheet THEORY OF OPERATION The ADP2165/ADP2166 are step-down, dc-to-dc regulators. They use a current mode architecture with an integrated high-side and low-side switch. They target high performance applications that require high efficiency and design simplicity. The ADP2165/ADP2166 can operate with an input voltage from 2.7 V to 5.5 V and regulate the output voltage down to 0.6 V. Additional features for flexible design include programmable switching frequency, programmable soft start, external compensation, and enable and power-good pins. The ADP2165/ADP2166 are also available with preset output voltage options of 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V, and 1.0 V. CONTROL SCHEME The ADP2165/ADP2166 use a fixed frequency, current mode PWM control architecture for good line and load transient performance. In fixed frequency PWM mode, adjust the duty cycle of the integrated MOSFET to regulate the output voltage that has a low output ripple voltage. PWM MODE At the start of each oscillator cycle, the high-side NFET (Nchannel MOSFET) switch turns on and transmits a positive voltage across the inductor. Current in the inductor increases until the current sense signal crosses the peak inductor current level set by the voltage on the COMP pin. The high-side NFET then turns off, and the low-side NFET synchronous rectifier then turns on. This puts a negative voltage across the inductor, causing the inductor current to decrease. The synchronous rectifier stays on for the rest of the cycle. INTERNAL REGULATOR (VREG) The internal regulator provides a stable supply for the internal control circuits. It is recommended to place a 1 μF ceramic capacitor between the VREG and GND pins. The internal regulator also includes a current-limit circuit to protect the circuit if the maximum external load is added. The AVIN pin provides the power supply for the internal regulator. When device is enabled, the internal regulator is active. BOOTSTRAP CIRCUITRY The ADP2165/ADP2166 integrate the boot regulator to provide the gate drive voltage for the high-side NFET. A capacitor between the BST and SW pins is charged from the PVIN pin while the low-side NFET is on. Placing an X7R or X5R 0.1 μF ceramic capacitor between the BST and SW pins is recommended. OSCILLATOR AND SYNCHRONIZATION The switching frequency of the ADP2165/ADP2166 can be set by connecting a resistor between the RT pin and the GND pin. Use the following equation to set the switching frequency: RRT (kΩ) = 60,000/[fSW (kHz) + 10] − 5 A 191 kΩ resistor sets the frequency to 300 kHz, and a 93.1 kΩ resistor sets frequency to 600 kHz. Figure 29 shows the typical relationship between RRT and fSW. 1600 1400 ENABLE/SHUTDOWN 1200 FREQUENCY (kHz) The EN input pin has a precision analog threshold of 1.2 V (typical) with 100 mV of hysteresis. When the enable voltage exceeds 1.2 V, the regulator turns on, and when it falls below 1.1 V (typical), the regulator turns off. To force the devices to automatically start when input power is applied, connect the EN pin to the PVIN pin. 1000 800 600 When the ADP2165/ADP2166 are shut down, the soft start capacitor discharges. When the devices are reenabled, a new soft start cycle begins. 200 20 40 60 80 100 120 140 RRT (kΩ) If the EN pin is not externally connected, an internal pull-down resistor (1 MΩ) prevents an accidental enable. 160 180 10956-019 400 Figure 29. Frequency (fSW) vs. RT Resistor To synchronize the ADP2165/ADP2166, drive an external clock at the SYNC pin. The frequency of the external clock can be in the 250 kHz to 1.4 MHz range. During the synchronization, the RT pin can be used to program the phase shift. When the RT pin is connected to the VREG pin, the rising edge of the SW pin is 180° out of phase with the external clock. If the RT pin is floating, the rising edge of the SW pin is in phase with the external clock. Rev. B | Page 12 of 23 Data Sheet ADP2165/ADP2166 SOFT START The SS pin is used to program the soft start time. By connecting a capacitor between the SS and GND pins, the internal current then charges this capacitor and establishes the soft start ramp-up. The soft start time can be calculated by the following equation: t SS = 0.6V × CSS I SS where: CSS is the soft start capacitance. ISS is the soft start pull-up current (3.5 µA). If the output voltage is precharged prior to startup, the ADP2165/ADP2166 prevent reverse inductor current that discharges the output capacitor until the soft start voltage exceeds the voltage on the FB pin. PEAK CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTION The ADP2165/ADP2166 have a peak current-limit protection circuit to prevent current runaway. When the inductor peak current reaches the current-limit value, the high-side NFET turns off, and the low-side NFET turns on until the next cycle, while the overcurrent counter increments. If the overcurrent counter count exceeds 10, the device enters hiccup mode, and the high-side NFET and low-side NFET both turn off. The devices remain in this mode for seven times the soft start time and then attempt to restart from the soft start. If the currentlimit fault clears, the devices resume normal operation. Otherwise, they reenter hiccup mode after counting 10 currentlimit violations. OVERVOLTAGE PROTECTION When the channel is disabled or a current fault happens, the soft start capacitor discharges. TRACKING The ADP2165/ADP2166 have a tracking input feature, TRK, that allows the output voltage to track another voltage (master voltage). It is especially useful in core and I/O voltage tracking for field programmable gate arrays (FPGAs), digital signal processors (DSPs), and application specific integrated circuits (ASICs). The internal error amplifier includes three positive inputs: the internal reference voltage, the soft start voltage, and the TRK voltage. The error amplifier regulates the FB voltage to the lowest of the three voltages. To track a master voltage, tie the TRK pin to a resistor divider from the master voltage. If the TRK function is not used, connect the TRK pin to the VREG. POWER-GOOD (PGOOD) The PGOOD pin is an active high, open-drain output that requires a pull-up resistor. A logic high on the PGOOD pin indicates that the voltage on the FB pin (and, therefore, the output voltage) is within ±10% of the desired value. In addition, there is a 16-cycle waiting period after the FB pin is detected as being within the ±10% range. A logic low on the PGOOD pin indicates that the voltage on the FB pin is not within ±10% of the desired value. Similarly, there is a 16-cycle delay to deassert PGOOD. The ADP2165/ADP2166 provide an overvoltage protection feature that protects the system from an output short to a higher voltage supply or from a strong unload transient. If the feedback voltage increases to 0.7 V, the internal high-side NFET turns off and the low-side NFET turns on until the current through the low-side NFET reaches the negative current limit. Thereafter, both the high-side and low-side NFET are held in the off state until the voltage at FB decreases to 0.63 V, and the devices resume normal operation. UNDERVOLTAGE LOCKOUT Undervoltage lockout circuitry is integrated in the ADP2165/ ADP2166. If AVIN drops below 2.5 V, the devices turn off. When the AVIN voltage rises above 2.6 V, the soft start period initiates, and the devices are enabled. THERMAL SHUTDOWN In the event that the junction temperatures of the ADP2165/ ADP2166 rise above 150°C, the thermal shutdown circuit turns the regulator off. Extreme junction temperatures can be the result of high current operation, poor circuit board design, and/or high ambient temperature. A 25°C hysteresis is included so that when thermal shutdown occurs, the ADP2165/ADP2166 do not return to operation until the on-chip temperature drops below 125°C. When coming out of thermal shutdown, soft start initiates. Rev. B | Page 13 of 23 ADP2165/ADP2166 Data Sheet APPLICATIONS INFORMATION ADIsimPOWER DESIGN TOOL VOLTAGE CONVERSION LIMITATIONS The ADP2165/ADP2166 are supported by the ADIsimPower design tool set. ADIsimPower is a collection of tools that produce complete power designs optimized to a specific design goal. The tools allow the user to generate a full schematic, bill of materials, and calculate performance in minutes. ADIsimPower can optimize designs for cost, area, efficiency, and parts count while taking into consideration the operating conditions and limitations of the IC and all real external components. The ADIsimPower tool can be found at www.analog.com/ADIsimPower, and the user can request an unpopulated board through the tool. The minimum output voltage for a given input voltage and switching frequency is constrained by the minimum on time. The minimum on time of the ADP2165/ADP2166 is typically 100 ns. The minimum output voltage at a given input voltage and frequency can be calculated using the following equation: INPUT CAPACITOR SELECTION The input capacitor reduces the input voltage ripple caused by the switch current on the PVIN pin. Place the input capacitor as close as possible to the PVIN pin. A ceramic capacitor in the 10 µF to 47 µF range is recommended. The loop that is composed of this input capacitor, the high-side NFET, and the low-side NFET must be kept as small as possible. The voltage rating of the input capacitor must be greater than the maximum input voltage. The rms current rating of the input capacitor must be larger than the value calculated by the following equation: I C IN_RMS = I OUT × D × (1 − D) OUTPUT VOLTAGE SETTING To limit the output voltage accuracy degradation due to FB bias current (0.1 µA maximum) to less than 0.5% (maximum), ensure that RBOT < 30 kΩ. Table 5 lists the recommended resistor divider for various output voltages. VOUT (V) 1.0 1.2 1.5 1.8 2.5 3.3 RTOP ± 1% (kΩ) 10 10 15 20 47.5 10 RBOT ± 1% (kΩ) 15 10 10 10 15 2.21 The maximum output voltage for a given input voltage and switching frequency is constrained by the minimum off time and the maximum duty cycle. The minimum off time is typically 100 ns, and the maximum duty cycle of the ADP2165/ADP2166 is typically 90%. The maximum output voltage, limited by the minimum off time at a given input voltage and frequency, can be calculated using the following equation: where: VOUT_MAX is the maximum output voltage. tOFF_MIN is the minimum off time. IOUT_MAX is the maximum output current.     Table 5. Resistor Divider for Various Output Voltages where: VOUT_MIN is the minimum output voltage. tON_MIN is the minimum on time. IOUT_MIN is the minimum output current. fSW is the switching frequency. RDSON_HS is the high-side MOSFET on resistance. RDSON_LS is the low-side MOSFET on resistance. RL is the series resistance of the output inductor. VOUT_MAX = VPVIN × (1 − tOFF_MIN × fSW) − (RDSON_HS − RDSON_LS) × IOUT_MAX × (1 − tOFF_MIN × fSW) − (RDSON_LS + RL) × IOUT_MAX (2) The output voltage of the ADP2165/ADP2166 is set by an external resistive divider. The resistor values are calculated using the following equation:  R VOUT = 0.6 × 1 + TOP  R BOT  VOUT_MIN = VPVIN × tON_MIN × fSW − (RDSON_HS − RDSON_LS) × IOUT_MIN × tON_MIN × fSW − (RDSON_LS + RL) × IOUT_MIN (1) The maximum output voltage, limited by the maximum duty cycle at a given input voltage, can be calculated using the following equation: VOUT_MAX = DMAX × VPVIN where DMAX is the maximum duty cycle. As Equation 1 to Equation 3 show, reducing the switching frequency alleviates the minimum on time and minimum off time limitation. Rev. B | Page 14 of 23 (3) Data Sheet ADP2165/ADP2166 INDUCTOR SELECTION The inductor value is determined by the operating frequency, input voltage, output voltage, and inductor ripple current. Using a small inductor leads to a faster transient response; however, it degrades efficiency due to a larger inductor ripple current. Conversely, using a large inductor value leads to a smaller ripple current and better efficiency; however, it results in a slower transient response. Shielded ferrite core materials are recommended for low core loss and low EMI. Table 6 lists some recommended inductors. Table 6. Recommended Inductors Vendor Würth Elektronik As a guideline, the inductor ripple current, ΔIL, is typically set to one-third of the maximum load current. The inductor value is calculated using the following equation: L= (VPVIN − VOUT ) × D Coilcraft ∆I L × f SW where: VPVIN is the input voltage. VOUT is the output voltage. ΔIL is the inductor ripple current. fSW is the switching frequency. D is the duty cycle, D = VOUT/VPVIN. The ADP2165/ADP2166 use adaptive slope compensation in the current loop to prevent subharmonic oscillations when the duty cycle is larger than 50%. The internal slope compensation limits the minimum inductor value. For a duty cycle that is larger than 50%, the minimum inductor value is determined by using the following equation: L (Minimum) = VOUT × (1 − D) 4 × f SW The saturation current of the inductor must be larger than the peak inductor current. For ferrite core inductors with a quick saturation characteristic, the saturation current rating of the inductor must be higher than the current limit threshold of the switch. This prevents the inductor from reaching saturation. The rms current of the inductor is calculated from the following equation: IRMS = I OUT 2 + ∆I L 2 12 L (µH) 0.22 0.47 0.76 1.0 1.5 2.2 3.3 0.27 0.33 0.47 0.68 1.0 1.5 2.2 ISAT (A) 32 20 15 19 14 12.5 8.5 30 28 24.3 22.3 16.4 23.5 18 IRMS (A) 21 18 15.5 15 11 16.5 14 21 20 17 13 11 15 12.9 DCR (mΩ) 1.10 1.35 2.25 4.6 6.6 4.4 6.5 2.9 4.0 4.75 7.9 9.8 7.6 13.7 OUTPUT CAPACITOR SELECTION The output capacitor selection affects the output ripple voltage load step transient and the loop stability of the regulator. For example, during a load step transient where the load is suddenly increased, the output capacitor supplies the load until the control loop can ramp up the inductor current. The delay caused by the control loop causes the output to undershoot. The output capacitance that is required to satisfy the voltage droop requirement can be calculated by using the following equation: The peak inductor current is calculated by using the following equation: ∆I L IPEAK = IOUT + 2 Part No. 744311022 744314047 744314076 744311100 744311150 7443340220 7443340330 XAL7020-271ME XAL7020-331ME XAL7020-471ME XAL7020-681ME XAL7020-102ME XAL7030-152ME XAL7030-222ME COUT_UV = K UV × ∆I STEP 2 × L 2 × (VPVIN − VOUT ) × ∆VOUT _UV where: KUV is a factor, with a typical setting of KUV = 2. ΔISTEP is the load step. ΔVOUT_UV is the allowable undershoot on the output voltage. Another example occurs when a load is suddenly removed from the output, and the energy stored in the inductor rushes into the output capacitor, causing the output to overshoot. The output capacitance that is required to meet the overshoot requirement can be calculated using the following equation: COUT_OV = K OV × ∆I STEP 2 × L (VOUT + ∆VOUT _ OV )2 − VOUT 2 where: KOV is a factor, with a typical setting of KOV = 2. ΔVOUT_OV is the allowable overshoot on the output voltage. Rev. B | Page 15 of 23 ADP2165/ADP2166 Data Sheet The ESR and the value of the capacitance determine the output ripple. Use the following equation to select a capacitor that can meet the output ripple requirements: ∆I L COUT_RIPPLE = 8 × f SW × ∆VOUT _ RIPPLE RESR = TV (S) = The following design guideline shows how to select the RC, CC, and CCP compensation components for the ceramic output capacitor applications: 1. The selected output capacitor voltage rating must be greater than the output voltage. The rms current rating of the output capacitor must be larger than the value calculated by ∆I ICOUT_RMS = L 12 2. 3. For peak current mode control, the power stage can be simplified as a voltage controlled current source supplying current to the output capacitor and load resistor. It is composed of one domain pole and a zero that is contributed by the output capacitor ESR. The control to output transfer function is based on the following: s 1+ 2× π× fZ V (s ) GVD (S) = OUT = AVI × R × s VCOMP (s) 1+ 2× π× fP 4. 2 × π × RESR × COUT VOUT R ESR × COUT RC The fixed output version IC must consider the feedforward capacitance of feedback resistor (RTOP) to calculate CCP. The total internal feedback resistance is 1 MΩ. f FBZ = AVI 1 2π × C F × ( 1 R R RESR 10956-020 CC Figure 30. Simplified Peak Current Mode Control, Small Signal Circuit Rev. B | Page 16 of 23 + 1R ) BOT 1 2π × RTOP × C F ( C C × min f P , f FBP × f FBZ ( ) RC × C C − C C × min f P , f FBP × f FBZ where CF = 8.14 pF. COUT f FBP × f FBZ . Then, determine CCP by C CP = RTOP – CCP = TOP VOUT CCP RC CCP is optional. It can be used to cancel the zero caused by the ESR of the output capacitor. f FBP = The ADP2165/ADP2166 use a transconductance amplifier for the error amplifier, which compensates for the system loop. Figure 30 shows the simplified, peak current mode control, small signal circuit. RC (R + R ESR ) × COUT between the domain pole, fP, and where: AVI = 10 A/V. R is the load resistance. COUT is the output capacitance. RESR is the equivalent series resistance of the output capacitor. RBOT 0.6 V × g m × AVI First, place the compensation pole at the minimum value 1 2 × π × (R + RESR ) × COUT + 2 × π × VOUT × COUT × f C Place the compensation zero at the domain pole, fP; then determine CC by using the following equation: CC = 1 VCOMP Determine the cross frequency, fC. Generally, fC is between fSW/12 and fSW/6. Calculate RC by using the following equation: RC = COMPENSATION DESIGN – gm + RBOT −gm × × RBOT + RTOP CC + CCP 1 + RC × CC × s × GVD ( s ) R × CC × CCP s × (1 + C × s) CC + CCP Select the largest output capacitance given by COUT_UV, COUT_OV, and COUT_RIPPLE to meet both the load transient and the output ripple performance. fP = The loop gain transfer equation is as follows: ∆VOUT _ RIPPLE ∆I L where: ΔVOUT_RIPPLE is the allowable output ripple voltage. RESR is the equivalent series resistance of the output capacitor in ohms (Ω). fZ = The compensation components, RC and CC, contribute a zero, and the optional CCP and RC contribute an optional pole. ) Data Sheet ADP2165/ADP2166 DESIGN EXAMPLE ADP2166 CIN 47µF 16V BST PVIN CBST 0.1µF AVIN L1 0.47µH SYNC COUT2 100µF 6.3V FB RT COMP CCP 4.7pF TRK CVREG 1µF COUT1 100µF 6.3V RTOP 10kΩ PGOOD VREG GND VOUT = 1.2V SW EN SS CSS 22nF PGND RC RBOT 36kΩ 10kΩ CC 680pF 10956-021 VPVIN = 5V Figure 31. Schematic for Design Example This section describes the procedures for selecting the external components based on the example specifications listed in Table 7. See Figure 31 for the schematic of this design example. Table 7. Step-Down DC-to-DC Regulator Requirements Parameter Input Voltage Output Voltage Output Current Output Voltage Ripple Load Transient Switching Frequency Specification VPVIN = 5.0 V ± 10% VOUT = 1.2 V IOUT = 6 A ∆VOUT_RIPPLE = 12 mV ±5%, 1 A to 5 A, 2 A/µs fSW = 1.2 MHz This calculation results in L = 0.422 µH. Choose the standard inductor value of 0.47 µH. The peak-to-peak inductor ripple current can be calculated by using the following equation: ΔIL = Use the following equation to calculate the peak inductor current: IPEAK = IOUT + Choose a 10 kΩ resistor as the top feedback resistor (RTOP) and calculate the bottom feedback resistor (RBOT) by using the following equation: ∆I L 2 This calculation results in IPEAK = 6.809 A. Use the following equation to calculate the rms current flowing through the inductor:   0. 6  RBOT = RTOP ×  V   OUT − 0.6  IRMS = IOUT 2 + ∆I L 2 12 This calculation results in IRMS = 6.018 A. To set the output voltage to 1.2 V, the resistor values are as follows: RTOP = 10 kΩ and RBOT = 10 kΩ. FREQUENCY SETTING To use the fixed 1.2 MHz switching frequency, connect the RT pin to the VREG pin. INDUCTOR SELECTION The peak-to-peak inductor ripple current, ∆IL, is set to 30% of the maximum output current. Use the following equation to estimate the inductor value: (VPVIN − VOUT ) × D L × f SW This calculation results in ∆IL = 1.617 A. OUTPUT VOLTAGE SETTING L= (VIN − VOUT ) × D Based on the calculated current value, select an inductor with a minimum rms current rating of 6.03 A and a minimum saturation current rating of 6.9 A. However, to protect the inductor from reaching its saturation point under the current-limit condition, use an inductor that is rated for at least a 9 A saturation current for reliable operation. Based on the requirements described previously, select a 0.47 µH inductor, such as the 744314047 from Würth, which has a 1.35 mΩ DCR and a 20 A saturation current. ∆I L × f SW where: VPVIN = 5 V. VOUT = 1.2 V. D = 0.24. ∆IL = 1.8 A. fSW = 1.2 MHz. Rev. B | Page 17 of 23 ADP2165/ADP2166 Data Sheet OUTPUT CAPACITOR SELECTION COMPENSATION COMPONENTS The output capacitor is required to meet both the output voltage ripple and load transient response requirements. For better load transient and stability performance, set the cross frequency, fC, to fSW/10. In this case, fSW is running at 1200 kHz; therefore, the fC is set to 120 kHz. To meet the output voltage ripple requirement, use the following equation to calculate the ESR and capacitance value of the output capacitor: COUT_RIPPLE = RESR = The 100 µF and 47 µF ceramic output capacitors have a derated value of 62 µF and 32 µF. ∆I L 8 × f S × ∆VOUT _ RIPPLE RC = ∆VOUT _ RIPPLE CC = ∆I L This calculation results in COUT_RIPPLE = 14 µF and RESR = 7.4 mΩ. To meet the ±5% overshoot and undershoot transient requirements, use the following equations to calculate the capacitance: COUT_OV = COUT_UV = CCP = 2 × π × 1.2 V × 94 μF × 120 kHz 0.6 V × 500 μs × 10 A/V (0.2 Ω + 0.002 Ω) × 94 μF 28.35 kΩ 0.002 Ω × 94 μF 28.35 kΩ = 28.35 kΩ = 669.8 pF = 6.63 pF Choose standard components as follows: RC = 27 kΩ, CC = 680 pF, and CCP = 4.7 pF. K OV × ∆I STEP 2 × L SOFT START TIME PROGRAM (VOUT + ∆VOUT _ OV )2 − VOUT 2 The soft start feature allows the output voltage to ramp up in a controlled manner, eliminating output voltage overshoot during soft start and limiting the inrush current. Set the soft start time to 4 ms. K UV × ∆I STEP 2 × L 2 × (VPVIN − VOUT ) × ∆VOUT _UV where: KOV = KUV = 2, the coefficients for estimation purposes. ∆ISTEP = 4 A, the load transient step. ∆VOUT_OV = 5% × VOUT, the overshoot voltage. ∆VOUT_UV = 5% × VOUT, the undershoot voltage. CSS = t SS _ EXT × I SS _ UP 0. 6 = 4 ms × 3.5 μA 0. 6 V = 23.3 nF Choose a standard component value as follows: CSS = 22 nF. This calculation results in COUT_OV = 100 µF and COUT_UV = 33 µF. According to the calculation, the output capacitance must be greater than 100 µF, and the ESR of the output capacitor must be smaller than 7.4 mΩ. It is recommended that one 100 µF, X5R, 6.3 V ceramic capacitor and one 47 µF, X5R, 6.3 V ceramic capacitor be used, such as the GRM32ER60J107ME20 and GRM32ER60J476ME20 from Murata, with an ESR of 2 mΩ. INPUT CAPACITOR SELECTION A minimum 22 µF ceramic capacitor must be placed near the PVIN pin. In this application, it is recommended that one 47 µF, X5R, 16 V ceramic capacitor be used. Rev. B | Page 18 of 23 Data Sheet ADP2165/ADP2166 RECOMMENDED EXTERNAL COMPONENTS Table 8. Recommended External Components for Typical Applications with 6 A Output Current fSW (kHz) 300 600 1200 1 VPVIN (V) 3.3 3.3 3.3 3.3 3.3 5 5 5 5 5 5 3.3 3.3 3.3 3.3 3.3 5 5 5 5 5 5 3.3 3.3 3.3 3.3 3.3 5 5 5 5 5 5 VOUT (V) 1 1.2 1.5 1.8 2.5 1 1.2 1.5 1.8 2.5 3.3 1 1.2 1.5 1.8 2.5 1 1.2 1.5 1.8 2.5 3.3 1 1.2 1.5 1.8 2.5 1 1.2 1.5 1.8 2.5 3.3 L (µH) 1.5 1.5 2.2 2.2 1.5 1.5 2.2 2.2 2.2 3.3 2.2 0.6 0.82 0.82 0.82 0.6 0.82 0.82 1 1 1.5 1 0.33 0.47 0.47 0.47 0.33 0.47 0.47 0.47 0.6 0.6 0.6 COUT (µF) 1 680 + 330 680 + 47 680 470 + 100 470 + 47 680 + 330 680 + 470 680 470 330 + 47 3 × 100 330 + 47 330 + 47 2 × 100 + 47 2 × 100 2 × 100 470 + 100 330 + 47 330 2 × 100 100 + 47 100 2 × 100 2 × 100 100 + 47 100 100 330 2 × 100 100 + 47 100 100 100 RTOP (kΩ) 10 10 15 20 47.5 10 10 15 20 47.5 10 10 10 15 20 47.5 10 10 15 20 47.5 10 10 10 15 20 47.5 10 10 15 20 47.5 10 RBOT (kΩ) 15 10 10 10 15 15 10 10 10 15 2.21 15 10 10 10 15 15 10 10 10 15 2.21 15 10 10 10 15 15 10 10 10 15 2.21 RC (kΩ) 52.9 44.7 53.4 50.1 65.7 52.9 72.3 53.4 44.3 47.4 32.1 45.5 54.6 29.4 28.0 39.0 66.9 54.6 62.2 28.0 39.0 25.7 31.2 37.4 35.4 28.0 39.0 82.9 37.4 35.4 28.0 19.6 51.4 CC (pF) 3300 3300 3300 3300 3300 3300 3300 3300 3300 3300 3300 1600 1500 1300 1300 1300 1300 1500 1500 1300 1300 1300 680 680 680 680 680 680 680 680 680 680 680 CCP (pF) 134 111 89 85 61 668 64 89 85 267 12 279 232 11 9 6 64 232 186 9 6 5 8 7 5 4 3 139 7 5 4 3 2 680 µF: 2.5 V, KEMET T520D687M2R5ATE010; 470 µF: 2.5 V, KEMET T520D477M2R5ATE006; 330 µF: 2.5 V, KEMET T520D337M2R5ATE006; 220 µF: 2.5 V, KEMET T520D227M2R5ATE007; 330 µF: 4 V, KEMET T520D337M004ATE006; 100 µF: 6.3 V, X5R, Murata GRM32ER60J107ME20; 47 µF: 6.3 V, X5R, Murata GRM32ER60J476ME20. VOUT is higher than 1.5 V, and COUT must use a 4 V tantalum capacitor. Rev. B | Page 19 of 23 ADP2165/ADP2166 Data Sheet PRINTED CIRCUIT BOARD LAYOUT RECOMMENDATIONS • Good circuit board layout is essential for obtaining the best performance from the ADP2165/ADP2166. Poor printed circuit board (PCB) layout degrades the output regulation as well as the electromagnetic interface (EMI) and electromagnetic compatibility (EMC) performance. Figure 32 shows a PCB layout example. For optimum layout, use the following guidelines: ANALOG GROUND PLANE VIA CCS CC BOTTOM LAYER TRACE GND SYNC RT TRK SS COMP FB RTOP PULL-UP CVREG COPPER PLANE RC CCP POWER GROUND PLANE VREG EN GND PGOOD PVIN PGND PVIN PGND PVIN SW PVIN OUTPUT CAPACITOR SW AVIN SW POWER GROUND PLANE BST CBST PGND SW SW PGND INPUT BYPASS CAPACITOR INPUT BULK CAPACITOR PVIN SW INDUCTOR 10956-022 • Place the feedback resistor divider network as close as possible to the FB pin to prevent noise pickup. Try to minimize the length of the trace that connects the top of the feedback resistor divider to the output while keeping the trace away from the high current traces and the switching node to avoid noise pickup. To further reduce noise pickup, place an analog ground plane on either side of the FB trace and ensure that the trace is as short as possible to reduce parasitic capacitance pickup. Use separate analog ground and power ground planes. Connect the ground reference of sensitive analog circuitry, such as output voltage divider components, to analog ground. In addition, connect the ground reference of power components, such as input and output capacitors, to power ground. Connect both ground planes to the exposed pad of the ADP2165/ADP2166. Place the input capacitor, inductor, and output capacitor as close to the IC as possible and use short traces. Ensure that the high current loop traces are as short and as wide as possible. Make the high current path from the input capacitor through the inductor, the output capacitor, and the power ground plane back to the input capacitor as short as possible. To accomplish this, ensure that the input and output capacitors share a common power ground plane. RBOT • Connect the exposed pad of the ADP2165/ADP2166 to a large copper plane to maximize its power dissipation capability for better thermal dissipation. VOUT Figure 32. Recommended PCB Layout Rev. B | Page 20 of 23 Data Sheet ADP2165/ADP2166 REFERENCE DESIGNS See Figure 33 through Figure 36 for the detailed reference designs. ADP2165/ ADP2166 PVIN CIN 47µF 16V BST CBST 0.1µF AVIN L1 0.82µH COUT 470µF 6.3V RTOP 10kΩ PGOOD RT FB SYNC COMP TRK CVREG 1µF VOUT = 1.2V SW EN RC RBOT 33kΩ 10kΩ CC 1.5nF CCP 33pF SS VREG GND CSS 22nF PGND 10956-023 VPVIN = 5V Figure 33. 1.2 V, 5 A/6 A, 620 kHz by Floating the RT Pin Step-Down Regulator Application ADP2165/ ADP2166 PVIN CIN 47µF 16V BST CBST 0.1µF AVIN L1 0.6µH SYNC FB RT COMP TRK CVREG 1µF COUT 100µF 6.3V RTOP 20kΩ PGOOD 1.2MHz EXT CLOCK VOUT = 1.8V SW EN CCP 3.3pF SS VREG GND CSS 22nF PGND RC RBOT 27kΩ 10kΩ CC 680pF 10956-024 VPVIN = 5V Figure 34. 1.8 V, 5 A/6 A Step-Down Regulator Application, Synchronized to 1.2 MHz, 180° Out of Phase with the External Clock CIN 47µF 16V PVIN BST AVIN CBST 0.1µF EN RTRKT 10kΩ SYNC TRK RTRKB 2.21kΩ RT CVREG 1µF VREG GND VOUT = 3.3V RTOP 10kΩ PGOOD VMASTER L1 0.82µH SW COUT 100µF 6.3V FB COMP SS PGND CCP 1.8pF CSS 22nF RC RBOT 51kΩ 2.21kΩ CC 680pF Figure 35. 3.3 V, 5 A/6 A, 1.2 MHz Step-Down Regulator Application, Tracking Mode Rev. B | Page 21 of 23 10956-025 VPVIN = 5V ADP2165/ ADP2166 ADP2165/ADP2166 Data Sheet CIN 47µF 16V PVIN BST AVIN CBST 0.1µF L1 0.47µH SW EN COUT1 100µF 6.3V PGOOD SYNC RT RT 43.5kΩ CVREG 1µF COUT2 100µF 6.3V FB COMP TRK VREG GND VOUT = 1.2V SS PGND CCP 4.7pF CSS 22nF RC 36kΩ CC 680pF Figure 36. Fixed Output 1.2 V, 5 A/6 A, 1.2 MHz Step-Down Regulator Application Rev. B | Page 22 of 23 10956-026 VPVIN = 5V ADP2165/ ADP2166 Data Sheet ADP2165/ADP2166 OUTLINE DIMENSIONS DETAIL A (JEDEC 95) 4.10 4.00 SQ 3.90 1 0.50 BSC 2.70 2.60 SQ 2.50 EXPOSED PAD 13 0.50 0.40 0.30 TOP VIEW 0.80 0.75 0.70 6 12 7 BOTTOM VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF PKG-004273/5069 SEATING PLANE PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) 24 19 18 0.20 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-8 03-02-2017-A PIN 1 INDICATOR 0.30 0.25 0.18 Figure 37. 24-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body and 0.75 mm Package Height (CP-24-15) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADP2165ACPZ-R7 ADP2165ACPZ-1.0-R7 ADP2165ACPZ-1.2-R7 ADP2165ACPZ-1.5-R7 ADP2165ACPZ-1.8-R7 ADP2165ACPZ-2.5-R7 ADP2165ACPZ-3.3-R7 ADP2165-EVALZ ADP2166ACPZ-R7 ADP2166ACPZ-1.0-R7 ADP2166ACPZ-1.2-R7 ADP2166ACPZ-1.5-R7 ADP2166ACPZ-1.8-R7 ADP2166ACPZ-2.5-R7 ADP2166ACPZ-3.3-R7 ADP2166-EVALZ 1 Output Current (A) 5 5 5 5 5 5 5 Temperature Range −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C Output Voltage ADJ 1.0 V 1.2 V 1.5V 1.8 V 2.5 V 3.3 V 6 6 6 6 6 6 6 −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C ADJ 1.0 V 1.2 V 1.5 V 1.8 V 2.5 V 3.3 V Z = RoHS Compliant Part. ©2014–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10956-0-8/17(B) Rev. B | Page 23 of 23 Package Description 24-Lead LFCSP 24-Lead LFCSP 24-Lead LFCSP 24-Lead LFCSP 24-Lead LFCSP 24-Lead LFCSP 24-Lead LFCSP Evaluation Board 24-Lead LFCSP 24-Lead LFCSP 24-Lead LFCSP 24-Lead LFCSP 24-Lead LFCSP 24-Lead LFCSP 24-Lead LFCSP Evaluation Board Package Option CP-24-15 CP-24-15 CP-24-15 CP-24-15 CP-24-15 CP-24-15 CP-24-15 CP-24-15 CP-24-15 CP-24-15 CP-24-15 CP-24-15 CP-24-15 CP-24-15
ADP2165ACPZ-R7 价格&库存

很抱歉,暂时无法提供与“ADP2165ACPZ-R7”相匹配的价格&库存,您可以联系我们找货

免费人工找货