ADP3301AR-5-REEL

a High Accuracy anyCAP™* 100 mA Low Dropout Linear Regulator ADP3301 FEATURES High Accuracy (Over Line and Load Regulations at +258C): 60.8% Ultralow Dropout Voltage: 100 mV Typical @ 100 mA Requires Only CO = 0.47 mF for Stability anyCAP™* = Stable with All Types of Capacitors Current and Thermal Limiting Low Noise Dropout Detector Low Shutdown Current: 1 mA Several Fixed Voltage Options 3.0 V to 12 V Supply Range –208C to +858C Ambient Temperature Range Thermally Enhanced SO-8 Package Excellent Line and Load Regulations APPLICATIONS Cellular Telephones Notebook, Palmtop Computers Battery Powered Systems Portable Instruments Post Regulator for Switching Supplies Bar Code Scanners GENERAL DESCRIPTION The ADP3301 is a member of the ADP330x family of precision low dropout anyCAP™* voltage regulators. The ADP3301 stands out from the conventional LDOs with a novel architecture, an enhanced process and a new package. Its patented design includes a noninverting wideband driver and a stage that permits the use of an internal “pole splitting” capacitor to stabilize the feedback loop with a single output capacitor as small as 0.47 µF. This device is stable with any type of capacitor regardless of its ESR (Equivalent Serial Resistance) value, including ceramic types (MLCC) for space restricted applications. The ADP3301 achieves exceptional accuracy of ± 0.8% at room temperature and ± 1.4% overall accuracy over temperature, line and load regulations. The dropout voltage of the ADP3301 is only 100 mV (typical) at 100 mA. FUNCTIONAL BLOCK DIAGRAM THERMAL PROTECTION ERR OUT R1 CC Q2 DRIVER Gm SD R2 BANDGAP REF GND The ADP3301 operates with a wide input voltage range from 3 V to 12 V and delivers a load current in excess of 100 mA. It features an error flag that signals when the device is about to lose regulation or when the short circuit or thermal overload protection is activated. Other features include shutdown and optional noise reduction capabilities. The ADP330x anyCAP™* LDO family offers a wide range of output voltages and output current levels from 50 mA to 200 mA: ADP3300 (50 mA, SOT-23) ADP3303 (200 mA) NR 3 ADP3301-5.0 VIN 7 1 IN OUT 8 2 C1 0.47µF ERR 6 VOUT = +5V R1 330kΩ C2 0.47µF EOUT 4 5 In addition to the new architecture and process, ADI’s new proprietary thermally enhanced package (Thermal Coastline) can handle 1 W of power dissipation without external heat sink or large copper surface on the PC board. This keeps PC board real estate to a minimum and makes the ADP3301 very attractive for use in portable equipment. ADP3301 Q1 IN ON OFF GND Figure 1. Typical Application Circuit *anyCAP is a trademark of Analog Devices Inc. REV. A Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 World Wide Web Site: http://www.analog.com © Analog Devices, Inc., 1997–2014 Fax: 781.461.3113 ADP3301–xx–SPECIFICATIONS ELECTRICAL CHARACTERISTICS (@ T = –208C to +858C, V A IN = 7 V, CIN = 0.47 mF, COUT = 0.47 mF, unless otherwise noted)1 Parameter Symbol Conditions Min OUTPUT VOLTAGE ACCURACY VOUT VIN = Nom VOUT +0.3 V to 12 V IL = 0.1 mA to 100 mA TA = +25°C VIN = Nom VOUT +0.3 V to 12 V IL = 0.1 mA to 100 mA Typ Max Units –0.8 +0.8 % –1.4 +1.4 % ∆VO ∆VIN VIN = Nom VOUT +0.3 V to 12 V TA = +25°C 0.024 mV/V ∆VO ∆IL IL = 0.1 mA to 100 mA TA = +25°C 0.014 mV/mA GROUND CURRENT IGND IL = 100 mA IL = 0.1 mA 0.85 0.18 2 0.3 mA mA GROUND CURRENT IN DROPOUT IGND VIN = 2.5 V IL = 0.1 mA 0.6 1.2 mA DROPOUT VOLTAGE VDROP VOUT = 98% of VO Nominal IL = 100 mA IL = 10 mA IL = 1 mA 0.1 0.02 0.003 0.2 0.07 0.03 V V V 0.9 0.9 0.3 V V 1 22 µA µA 1 µA 5 µA LINE REGULATION LOAD REGULATION SHUTDOWN THRESHOLD VTHSD ON OFF 2.0 SHUTDOWN PIN INPUT CURRENT ISDIN 0 < VSD < 5 V 5 ≤ VSD ≤ 12 V @ VIN = 12 V GROUND CURRENT IN SHUTDOWN MODE IQ VSD = 0, VIN = 12 V TA = +25°C VSD = 0, VIN = 12 V TA = +85°C IOSD TA = +25°C @ VIN = 12 V TA = +85°C @ VIN = 12 V 2 4 µA µA ERROR PIN OUTPUT LEAKAGE IEL VEO = 5 V 13 µA ERROR PIN OUTPUT “LOW” VOLTAGE VEOL ISINK = 400 µA 0.13 0.3 V PEAK LOAD CURRENT ILDPK VIN = Nom VOUT + 1 V 200 mA THERMAL REGULATION ∆VO VO VIN = 12 V, IL = 100 mA T = 10 ms 0.015 %/W VNOISE f = 10 Hz–100 kHz CNR = 0 CNR = 10 nF, CL = 10 µF 100 30 µV rms µV rms OUTPUT CURRENT IN SHUTDOWN MODE OUTPUT NOISE @ 5 V OUTPUT NOTES 1 Ambient temperature of +85°C corresponds to a typical junction temperature of +125°C under typical full load test conditions. Specifications subject to change without notice. –2– REV. A ADP3301 ABSOLUTE MAXIMUM RATINGS* PIN FUNCTION DESCRIPTIONS Input Supply Voltage . . . . . . . . . . . . . . . . . . . –0.3 V to +16 V Shutdown Input Voltage . . . . . . . . . . . . . . . . –0.3 V to +16 V Error Flag Output Voltage . . . . . . . . . . . . . . . –0.3 V to +16 V Noise Bypass Pin Voltage . . . . . . . . . . . . . . . . –0.3 V to +5 V Power Dissipation . . . . . . . . . . . . . . . . . . . Internally Limited Operating Ambient Temperature Range . . . –55°C to +125°C Operating Junction Temperature Range . . . –55°C to +125°C θJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W θJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C/W Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300°C Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215°C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C Pin Mnemonic Function 1&2 OUT Output of the Regulator, fixed 2.7, 3.0, 3.2, 3.3 or 5 volts output voltage. Bypass to ground with a 0.47 µF or larger capacitor. Pins 1 and 2 must be connected together for proper operation. 3 NR Noise Reduction Pin. Used for further reduction of the output noise. (See text for details.) No connection if not used. 4 GND Ground Pin. 5 SD Active Low Shutdown Pin. Connect to ground to disable the regulator output. When shutdown is not used, this pin should be connected to the input pin. 6 ERR Open Collector Output which goes low to indicate that the output is about to go out of regulation. 7&8 IN Regulator Input. Pins 7 and 8 must be connected together for proper operation. *This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operation section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PIN CONFIGURATION 8 IN OUT 1 Other Members of anyCAP™* Family OUT 2 1 ADP3301 7 IN TOP VIEW 6 ERR (Not to Scale) 5 SD GND 4 NR 3 Model Output Current Package Option2 Comments ADP3300 50 mA SOT-23 High Accuracy ADP3303 200 mA SO-8 High Accuracy PIN FOR 5V DEVICE NOTES 1 See individual data sheets for detailed ordering information. 2 SO = Small Outline, SOT = Surface Mount. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADP3301 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. REV. A –3– WARNING! ESD SENSITIVE DEVICE ADP3301–Typical Performance Characteristics 4.9997 IL = 50mA 4.9994 4.9991 IL = 100mA 4.9988 4.9985 VOUT = 5V 4.99925 4.99850 4.99775 4.99700 4.9982 4.99625 4.9979 5.2 6 4.99550 7 8 9 10 11 12 13 14 15 16 INPUT VOLTAGE – Volts Figure 2. Line Regulation: Output Voltage vs. Input Voltage 40 Figure 3. Output Voltage vs. Load Current Up to 200 mA 170 0 10 20 30 40 50 60 70 80 90 100 OUTPUT LOAD – mA Figure 5. Quiescent Current vs. Load Current IL = 0 –0.1 –0.2 –0.4 –45 –25 –5 15 35 55 75 0 0 20 40 60 80 100 120 140 160 180 200 OUTPUT LOAD – mA Figure 8. Dropout Voltage vs. Output Current 600 400 IL = 0 TEMPERATURE – °C Figure 6. Output Voltage Variation % vs. Temperature 8.0 VIN 4 3 2 RL = 33Ω 1 0 5 25 45 65 85 105 125 TEMPERATURE – °C Figure 7. Quiescent Current vs. Temperature INPUT-OUTPUT VOLTAGE – Volts INPUT-OUTPUT VOLTAGE – Volts INPUT-OUTPUT VOLTAGE – mV 40 IL = 100mA 800 0 –45 –25 –15 95 115 135 VOUT = 3.3V 80 1000 200 5 120 1.2 2.4 3.6 4.8 6 7.2 8.4 9.6 10.8 12 INPUT VOLTAGE – Volts 1200 0.0 200 160 0.2 1400 –0.3 270 0.4 0.3 Figure 4. Quiescent Current vs. Supply Voltage GROUND CURRENT – µA IL = 0 TO 100mA 370 OUTPUT VOLTAGE – % GROUND CURRENT – µA 470 0.5 0 0.1 570 0.6 60 80 100 120 140 160 180 200 OUTPUT LOAD – mA 870 670 0.7 0 20 0.2 770 0.8 0.1 0 970 VOUT = 5V IL = 0 0.9 VOUT = 5V VIN = 7V 5.00000 IL = 10mA OUTPUT VOLTAGE – Volts OUTPUT VOLTAGE – Volts 5.0000 1.0 5.00075 IL = 0mA GROUND CURRENT – mA 5.0003 7.0 6.0 5.0 4.0 1 2 3 4 3 2 INPUT VOLTAGE – Volts 1 0 Figure 9. Power-Up/Power-Down –4– SD = VIN OR 3V RL = 33Ω ÷ 3.3kΩ CL = 0.47µF VOUT = 3.3V 2.0 1.0 0 0 VOUT 3.0 0 20 40 60 80 100 120 140 160 180 200 TIME – µs Figure 10. Power-Up Overshoot REV. A ADP3301 5.02 5.02 VOUT = 5V VOUT = 5V VOUT = 5V 5.01 5.01 0.02 5.00 5.00 5.01 4.99 50Ω, 0.47µF LOAD Volts 4.98 VIN I(VOUT) VIN 100 1 7.0 0 20 40 60 80 100 120 140 160 180 200 TIME – µs Figure 11. Line Transient Response CL = 10µF VOUT = 3.3V 0 40 0 80 120 160 200 240 280 320 360 400 TIME – µs Figure 12. Line Transient Response 3.3V 3.5 8 400 4 3.298 300 mA IOUT 0 100 100 5 10 0 0 mA 400 Figure 14. Load Transient for 10 mA to 100 mA Pulse 4 5 0 C = 0.47µF R = 33Ω ON 3.3V OUTPUT VOUT = 3.3V –10 RIPPLE REJECTION – dB 3 2 VOUT 1 0 5 0 5 10 15 20 25 30 35 40 45 TIME – µs Figure 17. Turn-Off –20 –30 VOUT = 3.3V a. 0.47µF, RL = 33kΩ b. 0.47µF, RL = 33Ω c. 10µF, RL = 33kΩ d. 10µF, RL = 33Ω b –40 –50 d a –60 –70 c b d –80 –90 VSD REV. A 2 3 TIME – sec 50 5.0V CL = 10µF, RL = 5kΩ 0 40 Figure 15. Short Circuit Current 4 0 1 0 500 CL = 0.47µF, RL = 5kΩ 2 200 I(VOUT) Volts Volts 3.300 200 300 TIME – µs 1000 800 VOUT 6 100 400 600 TIME – µs Figure 13. Load Transient for 1 mA to 100 mA Pulse 0 3.302 0 200 VOUT = 5V Volts 3.304 Volts 4.99 4.98 7.5 7.0 5.00 mA 7.5 5kΩ, 0.47µF LOAD –100 10 a c 100 1k 10k 100k FREQUENCY – Hz 1M 10M Figure 18. Power Supply Ripple Rejection –5– 80 120 TIME – µs 160 200 Figure 16. Turn-On VOLTAGE NOISE SPECTRAL DENSITY – µV/ Hz Volts 4.99 Volts CL = 0.47µF 10 0.47µF BYPASS PIN 7, 8 TO PIN 3 VOUT = 5V, CL = 0.47µF, IL = 1mA, CNR = 0 1 VOUT = 3.3V, CL = 0.47µF, IL = 1mA, CNR = 0 0.1 0.01 100 VOUT = 2.7-5.0V, CL = 10µF, IL = 1mA, CNR = 10nF 1k 10k FREQUENCY – Hz 100k Figure 19. Output Noise Density ADP3301 APPLICATION INFORMATION Thermal Overload Protection anyCAP™* The ADP3301 is very easy to use. The only external component required for stability is a small 0.47 µF bypass capacitor on the output. Unlike the conventional LDO designs, the ADP3301 is stable with virtually any type of capacitors (anyCAP™*) independent of the capacitor’s ESR (Effective Series Resistance) value. In a typical application, if the shutdown feature is not used, the shutdown pin (Pin 5) should be tied to the input pin. Pins 7 and 8 must be tied together, as well as Pins 1 and 2, for proper operation. The ADP3301 is protected against damage due to excessive power dissipation by its thermal overload protection circuit, which limits the die temperature to a maximum of 165°C. Under extreme conditions (i.e., high ambient temperature and high power dissipation) where die temperature starts to rise above 165°C, the output current is reduced until die temperature has dropped to a safe level. Output current is restored when the die temperature is reduced. Current and thermal limit protections are intended to protect the device against accidental overload conditions. For normal operation, device power dissipation should be externally limited so that junction temperatures will not exceed 125°C. Capacitor Selection Output Capacitors: as with any micropower device, output transient response is a function of the output capacitance. The ADP3301 is stable with a wide range of capacitor values, types and ESR (anyCAP™*). A capacitor as low as 0.47 µF is all that is needed for stability. However, larger capacitors can be used if high output current surges are anticipated. The ADP3301 is stable with extremely low ESR capacitors (ESR ≈ 0), such as multilayer ceramic capacitors (MLCC) or OSCON. Calculating Junction Temperature Device power dissipation is calculated as follows : PD = (VIN – VOUT) ILOAD + (VIN) IGND Where ILOAD and IGND are load current and ground current, VIN and VOUT are input and output voltages respectively. Input Bypass Capacitor: an input bypass capacitor is not required; however, for applications where the input source is high impedance or far from the input pins, a bypass capacitor is recommended. Connecting a 0.47 µF capacitor from the input pins (Pins 7 and 8) to ground reduces the circuit’s sensitivity to PC board layout. If a bigger output capacitor is used, the input capacitor should be 1 µF minimum. Assuming ILOAD = 100 mA, IGND = 2 mA, VIN = 9 V and VOUT = 5.0 V, device power dissipation is: Low ESR capacitors offer better performance on a noisy supply; however, for less demanding requirements a standard tantalum or aluminum electrolythic capacitor is adequate. Junction temperature above ambient temperature will be approximately equal to : Noise Reduction To limit the maximum junction temperature to 125°C, maximum ambient temperature must be lower than: PD = (9 V – 5 V) 100 mA + (9 V) 2 mA = 418 mW The proprietary package used in ADP3301 has a thermal resistance of 96°C/W, significantly lower than a standard 8-pin SOIC package at 170°C/W. 0.418 W × 96°C/W = 40.1°C A noise reduction capacitor (CNR) can be used to further reduce the noise by 6 dB–10 dB (Figure 20). Low leakage capacitors in the 10 nF–100 nF range provide the best performance. Since the noise reduction pin (NR) is internally connected to a high impedance node, any connection to this node should be carefully done to avoid noise pickup from external sources. The pad connected to this pin should be as small as possible. Long PC board traces are not recommended. TA(MAX) = 125°C – 40.1°C = 84.9°C Printed Circuit Board Layout Consideration All surface mount packages rely on the traces of the PC board to conduct heat away from the package. In standard packages the dominant component of the heat resistance path is the plastic between the die attach pad and the individual leads. In typical thermally enhanced packages, one or more of the leads are fused to the die attach pad, significantly decreasing this component. However, to make the improvement meaningful, a significant copper area on the PCB has to be attached to these fused pins. NR 3 CNR 10nF ADP3301-5.0 1 7 OUT IN VIN C1 + 8 1µF ERR 2 6 VOUT = 5V R1 + 330kΩ EOUT C2 10µF The ADP3301’s patented thermal coastline lead frame design uniformly minimizes the value of the dominant portion of the thermal resistance. It ensures that heat is conducted away by all pins of the package. This yields a very low 96°C/W thermal resistance for an SO-8 package, without any special board layout requirements, relying on the normal traces connected to the leads. The thermal resistance can be decreased by approximately an additional 10% by attaching a few square cm of copper area to the VIN pin of the ADP3301 package. 4 5 ON OFF SD GND Figure 20. Noise Reduction Circuit –6– REV. A ADP3301 It is not recommended to use solder mask or silkscreen on the PCB traces adjacent to the ADP3301’s pins since it will increase the junction to ambient thermal resistance of the package. VIN = 5.5V TO 12V IN VOUT = 5V/3.3V OUT ADP3301-5.0 Shutdown Mode OUTPUT SELECT 5V 0V Applying a TTL high signal to the shutdown pin, or tying it to the input pin, will turn the output ON. Pulling the shutdown pin low, or tying it to ground, will turn the output OFF. In shutdown mode, quiescent current is reduced to less than 1 µA. SD GND IN Error Flag Dropout Detector C1 + 1.0µF The ADP3301 will maintain its output voltage over a wide range of load, input voltage and temperature conditions. If, for example, regulation is lost by reducing the supply voltage below the combined regulated output and dropout voltages, the ERRor flag will be activated. The ERR output is an open collector, which will be driven low. OUT ADP3301-3.3 + C2 0.47µF SD GND Figure 21. Crossover Switch Once set, the ERRor flag’s hysteresis will keep the output low until a small margin of operating range is restored either by raising the supply voltage or reducing the load. MJE253* VIN = 6V TO 8V VOUT = 5V @ 1A R1 50Ω C1 47µF APPLICATION CIRCUITS Crossover Switch IN The circuit in Figure 21 shows that two ADP3301s can be used to form a mixed supply voltage system. The output switches between two different levels selected by an external digital input. Output voltages can be any combination of voltages from the Ordering Guide. OUT C2 10µF ADP3301-5 SD ERR GND Higher Output Current *AAVID531002 HEAT SINK IS USED The ADP3301 can source up to 100 mA without any heatsink or pass transistor. If higher current is needed, an appropriate pass transistor can be used, as in Figure 22, to increase the output current to 1 A. Figure 22. High Output Current Linear Regulator Step-Up/Step-Down Post Regulator The circuit in Figure 23 provides a high precision, low dropout regulated output voltage. It significantly reduces the ripple from a switching regulator. The ADP3000 used in this circuit is a switching regulator in the step-up configuration. L1 6.8µH VIN = 2.5V TO 3.5V D1 1N5817 ADP3301-3.3 IN C1 100µF 10V R1 120Ω ILIM C2 100µF 10V VIN R2 19.6kΩ 1% OUT GND SW1 C3 2.2µF ADP3000-ADJ GND SW2 FB R3 10kΩ 1% Figure 23. Step-Up/Step-Down Post Regulator REV. A 3.3V @ 100mA –7– ADP3301 OUTLINE DIMENSIONS 5.00 (0.1968) 4.80 (0.1890) 1 5 4 6.20 (0.2441) 5.80 (0.2284) 1.27 (0.0500) BSC 1.75 (0.0688) 1.35 (0.0532) 0.25 (0.0098) 0.10 (0.0040) COPLANARITY 0.10 SEATING PLANE 0.51 (0.0201) 0.31 (0.0122) 0.50 (0.0196) 0.25 (0.0099) 45° 8° 0° 0.25 (0.0098) 0.17 (0.0067) 1.27 (0.0500) 0.40 (0.0157) COMPLIANT TO JEDEC STANDARDS MS-012-AA CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 012407-A 8 4.00 (0.1574) 3.80 (0.1497) Figure 24. 8-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-8) Dimensions shown in millimeters and (inches) ORDERING GUIDE Model1 ADP3301AR-5-REEL ADP3301ARZ-2.7 ADP3301ARZ-3 ADP3301ARZ-3-REEL ADP3301ARZ-3.2 ADP3301ARZ-3.3 ADP3301ARZ-3.3-RL ADP3301ARZ-5 ADP3301ARZ-5-REEL 1 Temperature Range –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C Output Voltage (V) 5 2.7 3 3 3.2 3.3 3.3 5 5 Z = RoHS Compliant Part. REVISION HISTORY 2/14—Rev. 0 to Rev. A Removed ADP3302, ADP3304, ADP3306 (Throughout) ........... 1 Updated Outline Dimensions .......................................................... 9 Changes to Ordering Guide ............................................................. 9 2/97—Revision 0: Initial Version ©1997–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12205-0-2/14(A) Rev. A | Page 8 Package Option R-8 R-8 R-8 R-8 R-8 R-8 R-8 R-8 R-8 Package Description 8-Lead SOIC_N 8-Lead SOIC_N 8-Lead SOIC_N 8-Lead SOIC_N 8-Lead SOIC_N 8-Lead SOIC_N 8-Lead SOIC_N 8-Lead SOIC_N 8-Lead SOIC_N