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ADP5075CB-EVALZ

ADP5075CB-EVALZ

  • 厂商:

    AD(亚德诺)

  • 封装:

    -

  • 描述:

    EVALBOARDFORADP5075

  • 数据手册
  • 价格&库存
ADP5075CB-EVALZ 数据手册
800 mA, DC-to-DC Inverting Regulator ADP5075 Data Sheet FEATURES TYPICAL APPLICATION CIRCUIT AVIN VIN VREF PVIN CIN OFF ON RFB ADP5075 RC CVREG FB RFT EN D1 SW SS CC CVREF L1 COMP VOUT COUT SLEW SYNC/FREQ VREG GND APPLICATIONS 12819-001 Wide input voltage range: 2.85 V to 15 V Adjustable negative output to VIN − 39 V Integrated 800 mA main switch 1.2 MHz/2.4 MHz switching frequency with optional external frequency synchronization from 1.0 MHz to 2.6 MHz Resistor programmable soft start timer Slew rate control for lower system noise Precision enable control UVLO, OCP, OVP, and TSD protection 1.61 mm × 2.18 mm, 12-ball WLCSP −40°C to +125°C junction temperature range Supported by the ADIsimPower tool set Figure 1. Bipolar amplifiers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), and multiplexers Charge coupled device (CCD) bias supplies Optical module supplies Radio frequency (RF) power amplifier (PA) bias GENERAL DESCRIPTION The ADP5075 is a high performance dc-to-dc inverting regulator used to generate negative supply rails. The input voltage range of 2.85 V to 15 V supports a wide variety of applications. The integrated main switch enables the generation of an adjustable negative output voltage down to 39 V below the input voltage. The ADP5075 operates at a pin selected 1.2 MHz/2.4 MHz switching frequency. The ADP5075 can synchronize with an external oscillator from 1.0 MHz to 2.6 MHz to ease noise filtering in sensitive applications. The regulator implements programmable slew rate control circuitry for the MOSFET driver stage to reduce electromagnetic interference (EMI). The ADP5075 includes a fixed internal or resistor programmable soft start timer to prevent inrush current at power-up. During shutdown, the regulator completely disconnects the load from the input supply to provide a true shutdown. Rev. B Other key safety features in the ADP5075 include overcurrent protection (OCP), overvoltage protection (OVP), thermal shutdown (TSD), and input undervoltage lockout (UVLO). The ADP5075 is available in a 12-ball WLCSP and is rated for a −40°C to +125°C junction temperature range. Table 1. Related Devices Device ADP5070 Boost Switch (A) 1.0 Inverter Switch (A) 0.6 ADP5071 2.0 1.2 ADP5075 Not applicable 0.8 Package 20-lead LFCSP (4 mm × 4 mm) and 20-lead TSSOP 20-lead LFCSP (4 mm × 4 mm) and 20-lead TSSOP 12-ball WLCSP (1.61 mm × 2.18 mm) Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2015–2017 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADP5075 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Internal Regulators ..................................................................... 11 Applications ....................................................................................... 1 Precision Enabling...................................................................... 11 Typical Application Circuit ............................................................. 1 Soft Start ...................................................................................... 12 General Description ......................................................................... 1 Slew Rate Control ....................................................................... 12 Revision History ............................................................................... 2 Current-Limit Protection ............................................................ 12 Specifications..................................................................................... 3 Overvoltage Protection .............................................................. 12 Absolute Maximum Ratings ............................................................ 5 Thermal Shutdown .................................................................... 12 Thermal Resistance ...................................................................... 5 Applications Information .............................................................. 13 ESD Caution .................................................................................. 5 ADIsimPower Design Tool ....................................................... 13 Pin Configuration and Function Descriptions ............................. 6 Component Selection ................................................................ 13 Typical Performance Characteristics ............................................. 7 Common Applications .............................................................. 16 Theory of Operation ...................................................................... 11 Layout Considerations ............................................................... 18 PWM Mode ................................................................................. 11 Outline Dimensions ....................................................................... 19 PSM Mode ................................................................................... 11 Ordering Guide .......................................................................... 19 Undervoltage Lockout (UVLO) ............................................... 11 Oscillator and Synchronization ................................................ 11 REVISION HISTORY 9/2017—Rev. A to Rev. B Changes to Table 9 .......................................................................... 17 8/2015—Rev. 0 to Rev. A Changes to General Description Section and Figure 1 ............... 1 Change to Figure 23 ....................................................................... 11 7/2015—Revision 0: Initial Version Rev. B | Page 2 of 19 Data Sheet ADP5075 SPECIFICATIONS PVIN = AVIN = 2.85 V to 15 V, VNEG = −15 V, fSW = 1200 kHz, TJ = −40°C to +125°C for minimum/maximum specifications, and TA = 25°C for typical specifications, unless otherwise noted. Table 2. Parameter INPUT SUPPLY VOLTAGE RANGE QUIESCENT CURRENT Operating Quiescent Current PVIN, AVIN (Total) Symbol VIN Shutdown Current UVLO System UVLO Threshold Rising Falling Hysteresis OSCILLATOR CIRCUIT Switching Frequency SYNC/FREQ Input Input Clock Range Input Clock Minimum On Pulse Width Input Clock Minimum Off Pulse Width Input Clock High Logic Input Clock Low Logic PRECISION ENABLING (EN) High Level Threshold Low Level Threshold Shutdown Mode Pull-Down Resistance INTERNAL REGULATOR VREG Output Voltage INVERTING REGULATOR Reference Voltage Accuracy Typ Max 15 Unit V Test Conditions/Comments PVIN, AVIN IQ 1.8 4.0 mA ISHDN 5 10 µA No switching, EN = high, PVIN = AVIN = 5V No switching, EN = low, PVIN = AVIN = 5 V VUVLO_RISING VUVLO_FALLING VHYS 2.85 2.5 2.8 2.55 0.25 V V V fSW 1.130 2.240 1.200 2.400 1.270 2.560 MHz MHz fSYNC tSYNC_MIN_ON tSYNC_MIN_OFF VH (SYNC) VL (SYNC) 1.000 100 100 2.600 MHz ns ns V V VTH_H VTH_L VTH_S REN 1.125 1.025 0.4 AVIN 1.48 VREG 4.25 V VREF 1.60 0.74 0.0004 V % % V % % µA V %/mA 1.15 1.05 0.003 %/V −0.5 −1.5 VREF − VFB Feedback Bias Current Overvoltage Protection Threshold Load Regulation IFB VOV ∆(VREF − VFB)/ ILOAD ∆(VREF − VFB)/ VPVIN gM RDS (ON) VDS (MAX) ILIM EA Transconductance Power FET On Resistance Power FET Maximum Drain Source Voltage Current-Limit Threshold Minimum On Time Minimum Off Time 1.3 0.4 V V V MΩ Feedback Voltage Accuracy Line Regulation Min 2.85 1.175 1.075 +0.5 +1.5 0.8 −0.5 −1.5 270 800 +0.5 +1.5 0.1 300 330 39 880 60 50 Rev. B | Page 3 of 19 330 960 µA/V mΩ V mA ns ns SYNC/FREQ = low SYNC/FREQ = high (connect to VREG) Internal circuitry disabled to achieve ISHDN TJ = 25°C TJ = −40°C to +125°C TJ = 25°C TJ = −40°C to +125°C At the FB pin after soft start is complete ILOAD = 5 mA to 75 mA VPVIN = 2.85 V to 14.5 V, ILOAD = 15 mA ADP5075 Data Sheet Parameter SOFT START Soft Start Timer Symbol Unit Test Conditions/Comments ms ms ms SS = open SS resistor = 50 kΩ to GND tHICCUP 4 32 8 × tSS Hiccup Time THERMAL SHUTDOWN Threshold Hysteresis TSHDN THYS 150 15 °C °C tSS Min Typ Rev. B | Page 4 of 19 Max Data Sheet ADP5075 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter PVIN, AVIN SW GND VREG EN, FB, SYNC/FREQ COMP, SLEW, SS, VREF Operating Junction Temperature Range Storage Temperature Range Soldering Conditions Rating −0.3 V to +18 V PVIN − 40 V to PVIN + 0.3 V −0.3 V to +0.3 V −0.3 V to lower of AVIN + 0.3 V or +6 V −0.3 V to +6 V −0.3 V to VREG + 0.3 V −40°C to +125°C −65°C to +150°C θJA is based on a 4-layer printed circuit board (PCB) (two signals and two power planes) as recommended in the Layout Considerations section. θJC is measured at the top of the package and is independent of the PCB. Table 4. Thermal Resistance Package Type 12-Ball WLCSP ESD CAUTION JEDEC J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 5 of 19 θJA 68.3 θJC 1.2 Unit °C/W ADP5075 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS BALL A1 INDICATOR 1 2 3 AVIN PVIN SW VREG SLEW SS A B C VREF FB COMP 12819-002 GND SYNC/FREQ EN D TOP VIEW (BALL SIDE DOWN) Not to Scale Figure 2. Pin Configuration Table 5. Pin Function Descriptions Pin No. A1 A2 A3 B1 B2 Mnemonic AVIN PVIN SW VREG SLEW B3 SS C1 C2 GND SYNC/FREQ C3 EN D1 D2 VREF FB D3 COMP Description System Power Supply for the ADP5075. Power Input for the Inverting Regulator. Switching Node for the Inverting Regulator. Internal Regulator Output. Connect a 1.0 μF ceramic filter capacitor between the VREG pin and GND. Driver Stage Slew Rate Control. The SLEW pin sets the slew rate for the FET driving the SW pin. For the fastest slew rate (best efficiency), leave the SLEW pin open. For a normal slew rate, connect the SLEW pin to VREG. For the slowest slew rate (best noise performance), connect the SLEW pin to ground. Soft Start Programming. Leave the SS pin open to obtain the fastest soft start time. To program a slower soft start time, connect a resistor between the SS pin and GND. Ground. Frequency Setting and Synchronization Input. To set the switching frequency to 2.4 MHz, pull the SYNC/FREQ pin high. To set the switching frequency to 1.2 MHz, pull the SYNC/FREQ pin low. To synchronize the switching frequency, connect the SYNC/FREQ pin to an external clock. Inverting Regulator Precision Enable. The EN pin is compared to an internal precision reference to enable the inverting regulator output. Inverting Regulator Reference Output. Connect a 1.0 μF ceramic filter capacitor between the VREF pin and ground. Feedback Input for the Inverting Regulator. Connect a resistor divider between the negative side of the inverting regulator output capacitor and VREF to program the output voltage. Error Amplifier Compensation for the Inverting Regulator. Connect the compensation network between this pin and GND. Rev. B | Page 6 of 19 Data Sheet ADP5075 TYPICAL PERFORMANCE CHARACTERISTICS Typical performance characteristics are generated using the standard bill of materials for each input/output combination listed in Table 9. 90 500 200 150 30 50 10 –30 –25 –20 –15 –10 –5 0 0.001 0 VOUT (V) 450 400 350 300 90 80 60 50 40 150 30 100 20 12819-004 50 –30 –25 –20 –15 –10 –5 10 0 0.001 0 VOUT (V) 0.01 0.1 1 CURRENT LOAD (A) Figure 4. Maximum Output Current, fSW = 2.4 MHz, TA = 25°C, Based on Target of 70% ILIM Figure 7. Efficiency vs. Current Load, VIN = 12 V, VNEG = −15 V, TA = 25°C 90 80 80 70 70 60 EFFICIENCY (%) 1.2MHz 2.4MHz 60 50 40 30 50 1.2MHz 2.4MHz 40 30 20 20 10 12819-005 10 0 0.001 1.2MHz 2.4MHz 70 200 –35 1 100 VIN = 3.3V, L = 3.3µH, DIODE = DFLS240L VIN = 3.3V, L = 5.6µH, DIODE = DFLS240 VIN = 5.0V, L = 4.7µH, DIODE = DFLS240L VIN = 5.0V, L = 6.8µH, DIODE = DFLS240 VIN = 12.0V, L = 8.2µH, DIODE = DFLS240L VIN = 12.0V, L = 15.0µH, DIODE = DFLS240 VIN = 15.0V, L = 10.0µH, DIODE = DFLS240L VIN = 15.0V, L = 15.0µH, DIODE = DFLS240 250 0 –40 0.1 Figure 6. Efficiency vs. Current Load, VNEG = −5 V, TA = 25°C EFFICIENCY (%) 500 0.01 CURRENT LOAD (A) Figure 3. Maximum Output Current, fSW = 1.2 MHz, TA = 25°C, Based on Target of 70% ILIM MAXIMUM OUTPUT CURRENT (mA) 40 20 –35 VIN = 3.3V, 1.2MHz VIN = 3.3V, 2.4MHz VIN = 12.0V, 1.2MHz VIN = 12.3V, 2.4MHz 50 100 0 –40 EFFICIENCY (%) 60 12819-006 250 70 12819-007 300 80 0.01 0.1 0 0.001 1 CURRENT LOAD (A) 12819-008 350 VIN = 3.3V, L = 6.8µH, DIODE = DFLS240L VIN = 3.3V, L = 10µH, DIODE = DFLS240 VIN = 5.0V, L = 10µH, DIODE = DFLS240 VIN = 5.0V, L = 15µH, DIODE = DFLS240 VIN = 12.0V, L = 15µH, DIODE = DFLS240L VIN = 12.0V, L = 22µH, DIODE = DFLS240 VIN = 15.0V, L = 22µH, DIODE = DFLS240L VIN = 15.0V, L = 22µH, DIODE = DFLS240 EFFICIENCY (%) 400 12819-003 MAXIMUM OUTPUT CURRENT (mA) 450 0.01 0.1 CURRENT LOAD (A) Figure 5. Efficiency vs. Current Load, VIN = 3.3 V, VNEG = −3.3 V, TA = 25°C Rev. B | Page 7 of 19 Figure 8. Efficiency vs. Current Load, VIN = 5 V, VNEG = −30 V, TA = 25°C ADP5075 Data Sheet 90 VARIATION FROM AVERAGE (VREF – VFB) (%) 0.50 60 1.2MHz 2.4MHz 50 40 30 20 12819-009 10 0 0.001 0.30 0.10 –0.10 –0.30 –0.50 0.1 0.01 CURRENT LOAD (A) 80 0.94 INDUCTOR CURRENT LIMIT (A) 0.96 60 50 40 –40°C +25°C +125°C 20 0.30 0.35 0.88 0.86 0.84 0 2 4 6 8 10 12 OSCILLATOR FREQUENCY (MHz) 0.30 0.10 –0.10 12819-011 –0.30 6 8 10 14 16 Figure 13. Inductor Current Limit (ILIMIT) vs. Input Voltage (VIN) for Various Temperatures 2.54 4 0.50 VIN (V) 0.50 2 0.45 –40°C +25°C +125°C 0.90 0.80 1 0.1 Figure 10. Efficiency vs. Current Load for Various Temperatures, VIN = 5 V, VNEG = −15 V, fSW = 1.2 MHz 0 0.40 0.92 CURRENT LOAD (A) VARIATION FROM AVERAGE (VREF – VFB) (%) 0.25 0.82 12819-010 10 –0.50 0.20 0.15 12819-013 EFFICIENCY (%) 70 0.01 0.10 Figure 12. Load Regulation, VIN = 12 V, VNEG = −5 V, fSW = 1.2 MHz, TA = 25°C 90 0 0.001 0.05 OUTPUT CURRENT (A) Figure 9. Efficiency vs. Current Load, VIN = 5 V, VNEG = −34 V, TA = 25°C 30 0 12 14 16 VIN (V) TA = +125°C TA = +25°C TA = –40°C 2.49 2.44 2.39 2.34 2.29 2.24 0 2 4 6 8 10 12 14 16 VIN (V) Figure 11. Line Regulation, VNEG = −5 V, fSW = 1.2 MHz, 15 mA Load, TA = 25°C Rev. B | Page 8 of 19 Figure 14. Oscillator Frequency vs. Input Voltage (VIN) for Various Temperatures, SYNC/FREQ Pin = High 12819-014 EFFICIENCY (%) 70 12819-012 80 Data Sheet ADP5075 1.27 TA = +125°C TA = +25°C TA = –40°C OSCILLATOR FREQUENCY (MHz) 1.25 VIN 1.23 1.21 VOUT 3 1.19 1 VFB 1.17 2 0 2 4 6 8 10 12 14 CH1 1.00V BW CH2 10.0mV CH3 100mV BW 12819-015 1.13 16 VIN (V) Figure 15. Oscillator Frequency vs. Input Voltage (VIN) for Various Temperatures, SYNC/FREQ Pin = Low B W 4.00ms T CH1 5.06V 12.4800ms 12819-018 1.15 Figure 18. Line Transient Showing VIN, VOUT, and VFB, VIN = 4.5 V to 5.5 V Step, VNEG = −12 V, RLOAD = 300 Ω, fSW = 1.2 MHz, TA = 25°C ILOAD 12 10 VOUT 8 3 6 4 VFB 4 0 TA = +125°C TA = +25°C TA = –40°C 0 2 4 6 8 10 12 14 16 VIN (V) CH3 50.0mV Figure 16. Shutdown Quiescent Current vs. Input Voltage (VIN) for Various Temperatures, EN Pin Below Shutdown Threshold B W CH2 10.0mV BW CH4 10.0mA BW 4.00ms T CH4 41.2mA 11.9600ms 12819-019 2 2 12819-016 SHUTDOWN QUIESCENT CURRENT (µA) 14 Figure 19. Load Transient Showing ILOAD, VOUT, and VFB, VIN = 5 V, VNEG = −12 V, ILOAD = 35 mA to 45 mA Step, fSW = 1.2 MHz, TA = 25°C 2.5 2.0 IINDUCTOR 1.5 –40°C +25°C +125°C 1.0 SW 2 VNEG 0.5 12819-017 0 3 0 2 4 6 8 10 12 14 16 CH3 20.0mV VIN (V) Figure 17. Operating Quiescent Current vs. Input Voltage (VIN) for Various Temperatures, EN Pin On B W CH2 5.00V BW CH4 50.0mA BW 4.00µs T CH2 401.600µs 3.10V 12819-020 CURRENT (mA) 4 Figure 20. Skip Mode Operation Showing Inductor Current (IINDUCTOR), Switch Node Voltage, and Output Ripple, VIN = 5 V, VNEG = −5 V, ILOAD = 0.5 mA, fSW = 1.2 MHz, TA = 25°C Rev. B | Page 9 of 19 ADP5075 Data Sheet IINDUCTOR IINDUCTOR 4 4 2 2 SW SW VNEG VNEG B W B W CH4 50.0mA BW 200ns T CH2 0.00000s 3.10V 12819-021 CH2 5.00V CH3 20.0mV CH3 20.0mV Figure 21. Discontinuous Conduction Mode Operation Showing Inductor Current (IINDUCTOR), Switch Node Voltage, and Output Ripple, VIN = 5 V, VNEG = −5 V, ILOAD = 10 mA, fSW = 1.2 MHz, TA = 25°C B W CH2 5.00V BW CH4 50.0mA BW 200ns T CH2 0.00000s 2.10V 12819-022 3 3 Figure 22. Continuous Conduction Mode Operation Showing Inductor Current (IINDUCTOR), Switch Node Voltage, and Output Ripple, VIN = 5 V, VNEG = −5 V, ILOAD = 50 mA, fSW = 1.2 MHz, TA = 25°C Rev. B | Page 10 of 19 Data Sheet ADP5075 THEORY OF OPERATION VIN CIN CVREG AVIN VREG PVIN CURRENT SENSE HV REGULATOR EN INVERTER PWM CONTROL HV BAND GAP SLEW SLEW PLL L1 RFT REF FB INVERTER_ENABLE CONTROL REF_1.6V VREG THERMAL SHUTDOWN START-UP TIMERS OVP RFB VREF COMP 4µA UVLO FB COUT ERROR AMP OSCILLATOR EN D1 SW REFERENCE GENERATOR SS REF REF_1.6V GND CVREF RC CC 12819-023 SYNC/FREQ RSS (OPTIONAL) Figure 23. Functional Block Diagram PWM MODE Table 6. SYNC/FREQ Pin Options The inverting regulator in the ADP5075 operates at a fixed frequency set by an internal oscillator. At the start of each oscillator cycle, the MOSFET switch turns on, applying a positive voltage across the inductor. The inductor current (IINDUCTOR) increases until the current sense signal crosses the peak inductor current threshold that turns off the MOSFET switch; this threshold is set by the error amplifier output. During the MOSFET off time, the inductor current declines through the external diode until the next oscillator clock pulse starts a new cycle. The ADP5075 regulates the output voltage by adjusting the peak inductor current threshold. SYNC/FREQ Pin High Low External Clock PSM MODE During light load operation, the regulators can skip pulses to maintain output voltage regulation. Skipping pulses increases the device efficiency. UNDERVOLTAGE LOCKOUT (UVLO) The undervoltage lockout circuitry monitors the AVIN pin voltage level. If the input voltage drops below the VUVLO_FALLING threshold, the regulator turns off. After the AVIN pin voltage rises above the VUVLO_RISING threshold, the soft start period initiates, and the regulator is enabled. OSCILLATOR AND SYNCHRONIZATION A phase-locked loop (PLL)-based oscillator generates the internal clock and offers a choice of two internally generated frequency options or external clock synchronization. The switching frequency is configured using the SYNC/FREQ pin options shown in Table 6. Switching Frequency 2.4 MHz 1.2 MHz 1× clock frequency INTERNAL REGULATORS The internal VREG regulator in the ADP5075 provides a stable power supply for the internal circuitry. The VREG supply provides a high signal for device configuration pins but must not be used to supply external circuitry. The VREF regulator provides a reference voltage for the inverting regulator feedback network to ensure a positive feedback voltage on the FB pin. A current-limit circuit is included for both internal regulators to protect the circuit from accidental loading. PRECISION ENABLING The ADP5075 has an enable pin that features a precision enable circuit with an accurate reference voltage. This reference allows the ADP5075 to be sequenced easily from other supplies. It can also be used as a programmable UVLO input by using a resistor divider. The enable pin has an internal pull-down resistor that defaults to off when the pin is floating. When the voltage at the enable pin is greater than the VTH_H reference level, the regulator is enabled. For external synchronization, connect the SYNC/FREQ pin to a suitable clock source. The PLL locks to an input clock within the range specified by fSYNC. Rev. B | Page 11 of 19 ADP5075 Data Sheet SOFT START CURRENT-LIMIT PROTECTION The regulator in the ADP5075 includes soft start circuitry that ramps the output voltage in a controlled manner during startup, thereby limiting the inrush current. The soft start time is internally set to the fastest rate when the SS pin is open. The inverting regulator in the ADP5075 includes current-limit protection circuitry to limit the amount of forward current through the MOSFET switch. Connecting a resistor between SS and ground allows the adjustment of the soft start delay. SLEW RATE CONTROL The ADP5075 uses programmable output driver slew rate control circuitry. This circuitry reduces the slew rate of the switching node as shown in Figure 24, resulting in reduced ringing and lower EMI. To program the slew rate, connect the SLEW pin to the VREG pin for normal mode, to the GND pin for slow mode, or leave it open for fast mode. This configuration allows the use of an open-drain output from a noise sensitive device to switch the slew rate from fast to slow, for example, during ADC sampling. Note that slew rate control causes a trade-off between efficiency and low EMI. FASTEST OVERVOLTAGE PROTECTION An overvoltage protection mechanism is present on the FB pin for the inverting regulator. When the voltage on the FB pin drops below the VOV threshold, the switching stops until the voltage rises above the threshold. This functionality is enabled after the soft start period has elapsed. THERMAL SHUTDOWN In the event that the ADP5075 junction temperature rises above TSHDN, the thermal shutdown circuit turns off the IC. Extreme junction temperatures can be the result of prolonged high current operation, poor circuit board design, and/or high ambient temperature. Hysteresis is included so that when thermal shutdown occurs, the ADP5075 does not return to operation until the onchip temperature drops below TSHDN minus THYS. When resuming from thermal shutdown, a soft start is performed. 12819-024 SLOWEST When the peak inductor current exceeds the overcurrent limit threshold for a number of clock cycles during an overload or short-circuit condition, the regulator enters hiccup mode. The regulator stops switching and then restarts with a new soft start cycle after tHICCUP and repeats until the overcurrent condition is removed. Figure 24. Switching Node at Various Slew Rate Settings Rev. B | Page 12 of 19 Data Sheet ADP5075 APPLICATIONS INFORMATION ADIsimPOWER DESIGN TOOL Output Capacitor The ADP5075 is supported by the ADIsimPower™ design tool set. ADIsimPower is a collection of tools that produce complete power designs optimized to a specific design goal. These tools allow the user to generate a full schematic, bill of materials, and calculate performance in minutes. ADIsimPower can optimize designs for cost, area, efficiency, and device count while taking into consideration the operating conditions and limitations of the IC and all real external components. The ADIsimPower tool can be found at www.analog.com/adisimpower, and the user can request an unpopulated board through the tool. Higher output capacitor values reduce the output voltage ripple and improve load transient response. When choosing this value, it is also important to account for the loss of capacitance due to the output voltage dc bias. COMPONENT SELECTION Feedback Resistors The ADP5075 provides an adjustable output voltage. An external resistor divider sets the output voltage, where the divider output must equal the feedback reference voltage, VFB. To limit the output voltage accuracy degradation due to feedback bias current, ensure that the current through the divider is at least 10 × IFB. Ceramic capacitors are manufactured with a variety of dielectrics, each with a different behavior over temperature and applied voltage. Capacitors must have a dielectric adequate to ensure the minimum capacitance over the necessary temperature range and dc bias conditions. X5R or X7R dielectrics with a voltage rating of 25 V or 50 V (depending on output) are recommended for best performance. Y5V and Z5U dielectrics are not recommended for use with any dc-to-dc converter because of their poor temperature and dc bias characteristics. Calculate the worst case capacitance accounting for capacitor variation over temperature, component tolerance, and voltage using the following equation: CEFFECTIVE = CNOMINAL × (1 − TEMPCO) × (1 − DCBIASCO) × (1 − Tolerance) Set the negative output for the inverting regulator by VNEG = VFB − where: CEFFECTIVE is the effective capacitance at the operating voltage. CNOMINAL is the nominal data sheet capacitance. TEMPCO is the worst case capacitor temperature coefficient. DCBIASCO is the dc bias derating at the output voltage. Tolerance is the worst case component tolerance. RFT (VREF − VFB ) RFB where: VNEG is the negative output voltage. VFB is the FB reference voltage. RFT is the feedback resistor from VNEG to FB. RFB is the feedback resistor from FB to VREF. VREF is the VREF pin reference voltage. Table 7 shows recommended values for common output voltages using standard resistor values. Table 7. Recommended Feedback Resistor Values Desired Output Voltage (V) −1.8 −3 −3.3 −4.2 −5 −9 −12 −13 −15 −18 −20 −24 −30 −35 RFT (MΩ) 0.332 0.475 0.523 0.715 1.15 1.62 1.15 2.8 2.32 2.67 2.94 3.16 4.12 5.11 RFB (kΩ) 102 100 102 115 158 133 71.5 162 118 113 113 102 107 115 Actual Output Voltage (V) −1.804 −3.000 −3.302 −4.174 −5.023 −8.944 −12.067 −13.027 −14.929 −18.103 −20.014 −23.984 −30.004 −34.748 To guarantee the performance of the device, it is imperative that the effects of dc bias, temperature, and tolerances on the behavior of the capacitors be evaluated for each application. Capacitors with lower effective series resistance (ESR) and effective series inductance (ESL) are preferred to minimize output voltage ripple. Note that the use of large output capacitors may require a slower soft start to prevent current limit during startup. A 10 µF capacitor is suggested as a good balance between performance and size. Input Capacitor Higher value input capacitors help reduce the input voltage ripple and improve transient response. To minimize supply noise, place the input capacitor as close as possible to the AVIN and PVIN pins. A low ESR capacitor is recommended. The effective capacitance needed for stability is a minimum of 10 µF. If the power pins are individually decoupled, it is recommended to use an effective minimum of a 5.6 µF capacitor on the PVIN pin and a 3.3 µF capacitor on the AVIN pin. The minimum values specified exclude dc bias, temperature, and tolerance effects that are application dependent and must be taken into consideration. Rev. B | Page 13 of 19 ADP5075 Data Sheet VREG Capacitor For the inductor ripple current in continuous conduction mode (CCM) operation, the input (VIN) and output (VNEG) voltages determine the switch duty cycle (Duty) by the following equation: A 1.0 µF ceramic capacitor (CVREG) is required between the VREG pin and GND.  | VNEG | + VDIODE   Duty =   V + |V | + V  NEG DIODE   IN VREF Capacitor A 1.0 µF ceramic capacitor (CVREF) is required between the VREF pin and GND. where VDIODE is the forward voltage drop of the Schottky diode (D1). Soft Start Resistor A resistor can be connected between the SS pin and the GND pin to increase the soft start time. The soft start time can be set using this resistor between 4 ms (268 kΩ) and 32 ms (50 kΩ). Leaving the SS pin open selects the fastest time of 4 ms. Figure 25 shows the behavior of this operation. Calculate the soft start time using the following formula: tSS = 38.4 × 10−3 − 1.28 × 10−7 × RSS (Ω) The dc current in the inductor in CCM (IL1) can be determined using the following equation: I L1 = I OUT (1 − Duty ) Using the duty cycle (Duty) and switching frequency (fSW), determine the on time (tON) using the following equation: where 50 kΩ ≤ RSS ≤ 268 kΩ. t ON = SOFT START TIMER Duty f SW The inductor ripple current (∆IL1) in steady state is calculated by 32ms ∆I L1 = VIN × t ON L1 Solve for the inductance value (L1) using the following equation: SS PIN OPEN R2 R1 SOFT START RESISTOR L1 = 12819-025 4ms Figure 25. Soft Start Behavior VIN × t ON ∆I L1 Assuming an inductor ripple current of 30% of the maximum dc current in the inductor results in Diodes A Schottky diode with low junction capacitance is recommended for D1. At higher output voltages and especially at higher switching frequencies, the junction capacitance is a significant contributor to efficiency. Higher capacitance diodes also generate more switching noise. As a guide, a diode with less than 40 pF junction capacitance is preferred when the output voltage is greater than −5 V. Inductor Selection The inductor stores energy during the on time of the power switch, and transfers that energy to the output through the output rectifier during the off time. To balance the tradeoffs between small inductor current ripple and efficiency, inductance values in the range of 1 µH to 22 µH are recommended. In general, lower inductance values have higher saturation current and lower series resistance for a given physical size. However, lower inductance results in a higher peak current that can lead to reduced efficiency and greater input and/or output ripple and noise. A peak-to-peak inductor ripple current close to 30% of the maximum dc current in the inductor typically yields an optimal compromise. L1 = VIN × t ON × (1 − Duty ) 0.3 × I OUT Ensure that the peak inductor current (the maximum input current plus half the inductor ripple current) is below the rated saturation current of the inductor. Likewise, ensure that the maximum rated rms current of the inductor is greater than the maximum dc input current to the regulator. When the ADP5075 inverting regulator is operated in CCM at duty cycles greater than 50%, slope compensation is required to stabilize the current mode loop. For stable current mode operation, ensure that the selected inductance is equal to or greater than the minimum calculated inductance, LMIN, for the application parameters in the following equation:  0.27  L1 > L MIN = VIN ×  − 0.33  (µH)  (1 − Duty )    Table 9 suggests a series of inductors to use with the ADP5075 inverting regulator. For the smallest solution size, inductors with a saturation current below ILIM may be used when the output current in the application is such that the inductor current stays below the saturated region. Rev. B | Page 14 of 19 Data Sheet ADP5075 Loop Compensation The ADP5075 uses external components to compensate the regulator loop, allowing the optimization of the loop dynamics for a given application. It is recommended to use the ADIsimPower tool to calculate compensation components. The inverting converter, produces an undesirable right half plane zero in the regulation feedback loop. This feedback loop requires compensating the regulator such that the crossover frequency occurs well below the frequency of the right half plane zero. The right half plane zero frequency is determined by the following equation: VIN VFB × × GM × |VNEG| (VIN + 2 × | VNEG|) 1 RC × GCS × =1 2π × f C × COUT AVL = where fC is the crossover frequency. To solve for RC, use the following equation: RC = VFB × VIN × G M × GCS where GCS = 6.25 A/V. 2π × L1 × Duty Using typical values for VFB and GM results in where: fZ(RHP) is the right half plane zero frequency. RLOAD is the equivalent load resistance or the output voltage divided by the load current. RC = 4188 × f C × COUT × | VNEG| × (VIN + (2 × | VNEG|) VIN For better accuracy, it is recommended to use the value of output capacitance (COUT) that takes into account the capacitance reduction from dc bias in the calculation for RC.   |VNEG| + VDIODE  Duty =    V + |V | + V NEG DIODE   IN where VDIODE is the forward voltage drop of the Schottky diode (D1). To stabilize the regulator, ensure that the regulator crossover frequency is less than or equal to one-tenth of the right half plane zero frequency. After the compensation resistor is known, set the zero formed by CC and RC to one-fourth of the crossover frequency, or CC = 2 π × f C × RC where CC is the compensation capacitor. The regulator loop gain is AVL = 2π × f C × COUT × |VNEG| × (VIN + (2 × | VNEG|) FB VIN VFB × × GM × |VNEG| (VIN + 2 × | VNEG|) ERROR AMPLIFIER REF gM COMP RC CC ROUT || Z COMP × GCS × Z OUT where: AVL is the regulator loop gain. VFB is the feedback regulation voltage. VNEG is the regulated negative output voltage. VIN is the input voltage. GM is the error amplifier transconductance gain. ROUT is the output impedance of the error amplifier and is 33 MΩ. ZCOMP is the impedance of the series RC network from COMP to GND. GCS is the current sense transconductance gain (the inductor current divided by the voltage at COMP), which is internally set by the ADP5075 and is 6.25 A/V. ZOUT is the impedance of the load in parallel with the output capacitor. CB 12819-026 f Z (RHP) = RLOAD(1 − Duty) 2 Therefore, when solving for the crossover frequency, the equation (by definition of the crossover frequency) is simplified to Figure 26. Compensation Components The optional capacitor, CB, is chosen to cancel the zero introduced by the ESR of the output capacitor. For low ESR capacitors such as ceramic chip capacitors, CB can be omitted from the design. Solve for CB as follows: CB = ESR × COUT RC For optimal transient performance, RC and CC may need to be adjusted by observing the load transient response of the ADP5075. For most applications, RC is within the range of 1 kΩ to 200 kΩ, and CC is within the range of 1 nF to 68 nF. To determine the crossover frequency, it is important to note that, at that frequency, the compensation impedance (ZCOMP) is dominated by a resistor, RC, and the output impedance (ZOUT) is dominated by the impedance of the output capacitor (COUT). Rev. B | Page 15 of 19 ADP5075 Data Sheet COMMON APPLICATIONS Table 8. Recommended Common Component Selections Table 8 and Table 9 list a number of common component selections for typical VIN and VNEG conditions. These have been bench tested and provide an off the shelf solution. To optimize components for an application, use the ADIsimPower tool set. Reference CIN CVREG CVREF Value 10 µF 1 µF 1 µF Part Number TMK316B7106KL-TD GRM188R71A105KA61D GRM188R71A105KA61D Figure 27 shows the schematic referenced by Table 8 and Table 9 with example component values for a +5 V input to a −15 V output. Table 8 shows the components common to all VIN and VNEG conditions. ADP5075 AVIN VREF RFB 118kΩ PVIN CIN 10µF FB OFF ON RC 15kΩ CC 68nF CVREG 1µF EN SW SS D1 DFLS240 L1 15µH COMP VREG RFT 2.32MΩ COUT 10µF SYNC/FREQ GND Figure 27. Typical +5 V Input to −15 V Output, 1.2 MHz Application Rev. B | Page 16 of 19 12918-027 VIN +5V CVREF 1µF Manufacturer Taiyo Yuden Murata Murata Data Sheet ADP5075 Table 9. Recommended Inverting Regulator Components VIN (V) 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 5 5 5 5 5 5 5 5 12 12 VNEG (V) −5 −5 −9 −9 −15 −15 −24 −24 −34 −34 −9 −9 −15 −15 −24 −24 −34 −34 −24 −24 Freq. (MHz) 1.2 2.4 1.2 2.4 1.2 2.4 1.2 2.4 1.2 2.4 1.2 2.4 1.2 2.4 1.2 2.4 1.2 2.4 1.2 2.4 L1 (μH) 6.8 4.7 10 4.7 10 4.7 10 6.8 10 10 10 6.8 15 6.8 15 6.8 15 10 22 15 L1, Manufacturer Part Number Wurth Coilcraft® Electronik XAL4030-682ME_ 7443857068 XAL4030-472ME_ 7443857047 XAL4040-103ME_ N/A XAL4030-472ME_ 74438357047 XAL4040-103ME_ N/A XAL4030-472ME_ 74438357047 XAL4040-103ME_ N/A XAL4030-682ME_ 74438357068 XAL4040-103ME_ N/A XAL4040-103ME_ N/A XAL4040-103ME_ N/A XAL4030-682ME_ 7448357068 XAL4040-153ME_ N/A XAL4030-682ME_ 7448357068 XAL4040-153ME_ N/A XAL4030-682ME_ 74438357068 XAL4040-153ME_ N/A XAL4040-103ME_ N/A XAL5050-223ME_ N/A XAL4040-153ME_ N/A COUT (μF) 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 COUT2, Murata Part GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L GRM32ER71H106KA12L Rev. B | Page 17 of 19 D1, Diodes, Inc. Part DFLS240L DFLS240L DFLS240 DFLS240 DFLS240 DFLS240 DFLS240 DFLS240 DFLS240 DFLS240 DFLS240 DFLS240 DFLS240 DFLS240 DFLS240 DFLS240 DFLS240 DFLS240 DFLS240 DFLS240 RFT (MΩ) 1.15 1.15 1.62 1.62 2.32 2.32 3.16 3.16 4.99 4.99 1.62 1.62 2.32 2.32 3.16 3.16 4.99 4.99 3.16 3.16 RFB (kΩ) 158 158 133 133 118 118 102 102 115 115 133 133 118 118 102 102 115 115 102 102 CC (nF) 47 47 47 47 47 47 47 47 47 47 47 47 68 47 47 47 47 47 47 47 RC (kΩ) 4.7 6.8 8.2 8.2 12 18 22 33 47 47 8.2 8.2 15 22 22 22 39 39 10 10 ADP5075 Data Sheet LAYOUT CONSIDERATIONS  Layout is important for all switching regulators but is particularly important for regulators with high switching frequencies. To achieve high efficiency, good regulation, good stability, and low noise, a well designed PCB layout is required. Follow these guidelines when designing PCBs:    Keep the input bypass capacitor, CIN, close to the PVIN pin and the AVIN pin. Route each of these pins individually to the pad of this capacitor to minimize noise coupling between the power inputs, rather than connecting the three pins at the device. A separate capacitor can be used on the AVIN pin for the best noise performance. Keep the high current paths as short as possible. These paths include the connections between CIN, L1, D1, COUT, and GND and their connections to the ADP5075. Keep high current traces as short and wide as possible to minimize parasitic series inductance, which causes spiking and EMI.   D1 COUT1 CIN CVREG L1 RC CVREF CC RFB RFT 12819-028   Avoid routing high impedance traces near any node connected to the SW pin or near inductor L1 to prevent radiated switching noise injection. Place the feedback resistors as close to the FB pin as possible to prevent high frequency switching noise injection. Route a trace to RFT directly from the COUT pad for optimum output voltage sensing. Place the compensation components as close as possible to COMP. Do not share vias to the ground plane with the feedback resistors to avoid coupling high frequency noise into the sensitive COMP pin. Place the CVREF and CVREG capacitors as close to the VREG and VREF pins as possible. Ensure that short traces are used between VREF and RFB. Figure 28. Suggested Layout for 5 mm × 6 mm, +3.3 V Input to −5 V Output Application (Dashed Line Is Connected on the Internal Layer of the PCB; Other Vias Connected to the Ground Plane; SS, EN, SLEW, and SYNC/FREQ Connections Not Shown for Clarity and Are Typically Connected on an Internal Layer) Rev. B | Page 18 of 19 Data Sheet ADP5075 OUTLINE DIMENSIONS 1.65 1.61 1.57 0.360 0.340 0.320 3 2 1 A BALL A1 IDENTIFIER 2.22 2.18 2.14 B 0.50 BSC C D TOP VIEW (BALL SIDE DOWN) 0.660 0.600 0.540 0.390 0.360 0.330 END VIEW 0.325 0.305 0.285 BOTTOM VIEW (BALL SIDE UP) SEATING PLANE PKG-003876 0.360 0.320 0.280 0.270 0.240 0.210 05-21-2014-A COPLANARITY 0.04 Figure 29. 12-Ball Wafer Level Chip Scale Package [WLCSP] (CB-12-11) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADP5075ACBZ-R7 ADP5075CB-EVALZ 1 Temperature Range −40°Cto+125°C Package Description 12-Ball Wafer Level Chip Scale Package [WLCSP] Evaluation Board Z = RoHS Compliant Part. ©2015–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12819-0-9/17(B) Rev. B | Page 19 of 19 Package Option CB-12-11
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