1000 MHz to 3100 MHz Rx Mixer with
Integrated Fractional-N PLL and VCO
ADRF6602
Data Sheet
FEATURES
The PLL can support input reference frequencies from 12 MHz
to 160 MHz. The PFD output controls a charge pump whose
output drives an off-chip loop filter.
Rx mixer with integrated fractional-N PLL
RF input frequency range: 1000 MHz to 3100 MHz
Internal LO frequency range: 1550 MHz to 2150 MHz
Input P1dB: 14.8 dBm
Input IP3: 30 dBm
IIP3 optimization via external pin
SSB noise figure
IP3SET pin open: 13.8 dB
IP3SET pin at 3.3 V: 15 dB
Voltage conversion gain: 6.5 dB
Matched 200 Ω IF output impedance
IF 3 dB bandwidth: 500 MHz
Programmable via 3-wire SPI interface
40-lead, 6 mm × 6 mm LFCSP
The loop filter output is then applied to an integrated VCO. The
VCO output at 2× fLO is applied to an LO divider, as well as to a
programmable PLL divider. The programmable PLL divider is
controlled by a Σ-Δ modulator (SDM). The modulus of the SDM
can be programmed from 1 to 2047.
The active mixer converts the single-ended 50 Ω RF input to
a 200 Ω differential IF output. The IF output can operate up
to 500 MHz.
The ADRF6602 is fabricated using an advanced silicon-germanium
BiCMOS process. It is available in a 40-lead, RoHS-compliant,
6 mm × 6 mm LFCSP with an exposed paddle. Performance is
specified over the −40°C to +85°C temperature range.
APPLICATIONS
Table 1.
Cellular base stations
GENERAL DESCRIPTION
Part No.
ADRF6601
The ADRF6602 is a high dynamic range active mixer with
integrated phase-locked loop (PLL) and voltage controlled
oscillator (VCO). The PLL/synthesizer uses a fractional-N
PLL to generate a fLO input to the mixer. The reference input
can be divided or multiplied and then applied to the PLL phase
frequency detector (PFD).
ADRF6602
ADRF6603
ADRF6604
Internal LO
Range
750 MHz
1160 MHz
1550 MHz
2150 MHz
2100 MHz
2600 MHz
2500 MHz
2900 MHz
±3 dB RFIN
Balun Range
300 MHz
2500 MHz
1000 MHz
3100 MHz
1100 MHz
3200 MHz
1200 MHz
3600 MHz
±1 dB RFIN
Balun Range
450 MHz
1600 MHz
1350 MHz
2750 MHz
1450 MHz
2850 MHz
1600 MHz
3200 MHz
FUNCTIONAL BLOCK DIAGRAM
VCC1
VCC2
VCC_LO
VCC_MIX
VCC_V2I
VCC_LO
1
10
17
22
27
34
NC NC
32
INTERNAL LO RANGE
1550MHz TO 2150MHz
LON 37
BUFFER
LOP 38
BUFFER
PLL_EN 16
FRACTION MODULUS
REG
SPI
INTERFACE
LE 14
REF_IN 6
÷2
÷4
N COUNTER
21 TO 123
MUX
TEMP
SENSOR
7
DECL3P3
2.5V
LDO
9
DECL2P5
VCO
LDO
40 DECLVCO
VCO
CORE
PRESCALER
÷2
29 IP3SET
CHARGE PUMP
250µA,
500µA (DEFAULT),
750µA,
1000µA
–
PHASE
+ FREQUENCY
DETECTOR
8
4
DIV
BY
2, 1
2
26 RF
IN
THIRD-ORDER
FRACTIONAL
INTERPOLATOR
×2
MUXOUT
2:1
MUX
INTEGER
REG
3.3V
LDO
11 15 20 21 23 24 25 28 30 31 35
5
RSET
GND
3
39
18 19
CP VTUNE IFP IFN
08545-001
DATA 12
CLK 13
33
ADRF6602
LODRV_EN 36
Figure 1.
Rev. D
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Technical Support
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ADRF6602
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
RF Specifications .......................................................................... 3
Synthesizer/PLL Specifications ................................................... 4
Register 3—Σ-Δ Modulator Dither Control (Default:
0x10000B) .................................................................................... 17
Register 4—PLL Charge Pump, PFD, and Reference Path
Control (Default: 0x0AA7E4)................................................... 18
Register 5—PLL Enable and LO Path Control (Default:
0x0000E5) .................................................................................... 19
Register 6—VCO Control and VCO Enable (Default:
0x1E2106) .................................................................................... 19
Logic Input and Power Specifications ....................................... 4
Register 7—Mixer Bias Enable and External VCO Enable
(Default: 0x000007).................................................................... 19
Timing Characteristics ................................................................ 5
Theory of Operation ...................................................................... 20
Absolute Maximum Ratings............................................................ 6
Programming the ADRF6602................................................... 20
ESD Caution .................................................................................. 6
Initialization Sequence .............................................................. 20
Pin Configuration and Function Descriptions ............................. 7
LO Selection Logic ..................................................................... 21
Typical Performance Characteristics ............................................. 9
Applications Information .............................................................. 22
RF Frequency Sweep .................................................................... 9
Basic Connections for Operation ............................................. 22
IF Frequency Sweep ................................................................... 10
AC Test Fixture ............................................................................... 23
Spurious Performance................................................................ 15
Evaluation Board ............................................................................ 24
Register Structure ........................................................................... 16
Evaluation Board Control Software ......................................... 24
Register 0—Integer Divide Control (Default: 0x0001C0)..... 16
Schematic and Artwork ............................................................. 26
Register 1—Modulus Divide Control (Default: 0x003001) .. 16
Evaluation Board Configuration Options ............................... 28
Register 2—Fractional Divide Control (Default: 0x001802) 17
Outline Dimensions ....................................................................... 29
Ordering Guide .......................................................................... 29
REVISION HISTORY
10/13—Rev. C to Rev. D
Changed “1550 MHz to 2150 MHz” to “1000 MHz to
3100 MHz” in Product Title ............................................................ 1
Updated Outline Dimensions ....................................................... 29
Changes to Figure 20...................................................................... 14
Changes to Figure 21...................................................................... 17
Changes to Figure 22...................................................................... 18
Changes to Figure 23...................................................................... 19
9/10—Rev. B to Rev. C
Changes to Features Section............................................................ 1
Changes to Table 2 ............................................................................ 3
Changes to Table 3 and Table 4 ....................................................... 4
Changes to Table 6 ............................................................................ 6
Changes to Typical Performance Characteristics Section ........... 9
Added Spurious Performance Section ......................................... 15
Changes to Programming the ADRF6602 Section .................... 20
Added AC Test Fixture Section and Figure 47 ........................... 23
Changes to Evaluation Board Control Software Section........... 24
4/10—Rev. 0 to Rev. A
Added Table 1 ....................................................................................1
Changes to Figure 1 ...........................................................................1
Change to Synthesizer/PLL Specifications Section .......................4
Change to Table 3 ..............................................................................4
Changes to Initializing Sequence Section ................................... 15
Changes to Figure 16...................................................................... 12
Changes to Figure 17...................................................................... 13
Changes to Figure 19...................................................................... 14
Changes to Figure 21...................................................................... 17
Changes to Figure 24...................................................................... 20
7/10—Rev. A to Rev. B
Changes to Table 1 ............................................................................ 1
Changes to Table 6 ............................................................................ 6
1/10—Revision 0: Initial Version
Rev. D | Page 2 of 32
Data Sheet
ADRF6602
SPECIFICATIONS
RF SPECIFICATIONS
VS = 5 V; ambient temperature (TA) = 25°C; fREF = 153.6 MHz; fPFD = 38.4 MHz; high-side LO injection; fIF = 140 MHz; IIP3 optimized
using CDAC (0x0) and IP3SET (3.3 V), unless otherwise noted.
Table 2.
Parameter
INTERNAL LO FREQUENCY RANGE
RF INPUT FREQUENCY RANGE
RF INPUT AT 1410 MHz
Input Return Loss
Input P1dB
Second-Order Intercept (IIP2)
Third-Order Intercept (IIP3)
Single-Side Band Noise Figure
LO-to-IF Leakage
RF INPUT AT 1760 MHz
Input Return Loss
Input P1dB
Second-Order Intercept (IIP2)
Third-Order Intercept (IIP3)
Single-Side Band Noise Figure
LO-to-IF Leakage
RF INPUT AT 2010 MHz
Input Return Loss
Input P1dB
Second-Order Intercept (IIP2)
Third-Order Intercept (IIP3)
Single-Side Band Noise Figure
LO-to-IF Leakage
IF OUTPUT
Voltage Conversion Gain
IF Bandwidth
Output Common-Mode Voltage
Gain Flatness
Gain Variation
Output Swing
Differential Output Return Loss
LO INPUT/OUTPUT (LOP, LON)
Frequency Range
Output Level (LO as Output)
Input Level (LO as Input)
Input Impedance
Test Conditions/Comments
±3 dB RF input range
Min
1550
1000
Relative to 50 Ω (can be improved with external match)
−5 dBm each tone (10 MHz spacing between tones)
−5 dBm each tone (10 MHz spacing between tones)
IP3SET = 3.3 V
IP3SET = open
At 1× LO frequency, 50 Ω termination at the RF port
Relative to 50 Ω (can be improved with external match)
−5 dBm each tone (10 MHz spacing between tones)
−5 dBm each tone (10 MHz spacing between tones)
IP3SET = 3.3 V
IP3SET = open
At 1× LO frequency, 50 Ω termination at the RF port
Relative to 50 Ω (can be improved with external match)
−5 dBm each tone (10 MHz spacing between tones)
−5 dBm each tone (10 MHz spacing between tones)
IP3SET = 3.3 V
IP3SET = open
At 1× LO frequency, 50 Ω termination at the RF port
Differential 200 Ω load
Small signal 3 dB bandwidth
External pull-up balun or inductors required
Over frequency range, any 5 MHz/50 MHz
Over full temperature range
Differential 200 Ω load
Measured through 4:1 balun
Externally applied 1× LO input, internal PLL disabled
Typ
−6
Rev. D | Page 3 of 32
Unit
MHz
MHz
−9
15.5
54.0
33.5
15.2
14.1
−45
dB
dBm
dBm
dBm
dB
dB
dBm
−15
15
53.5
30.8
14.9
13.5
−43
dB
dBm
dBm
dBm
dB
dB
dBm
fPFD
fLO = 1550 MHz to 2150 MHz, fPFD = 38.4 MHz
1 kHz to 10 kHz offset
100 kHz offset
500 kHz offset
1 MHz offset
5 MHz offset
10 MHz offset
20 MHz offset
1 kHz to 40 MHz integration bandwidth
Min
Typ
Max
Unit
2150
−220.5
MHz
dBc/Hz
−105
−80
−80
dBc
dBc
dBc
−92
−103
−122
−128
−140
−147
−150
0.3
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
°rms
MHz
1550
20
40
REF_IN, MUXOUT pins
12
160
4
VOL (lock detect output selected)
VOH (lock detect output selected)
0.25
2.7
50
Programmable to 250 µA, 500 µA, 750 µA, 1 mA
500
1
MHz
pF
V
V
%
µA
V
2.8
The figure of merit (FOM) is computed as phase noise (dBc/Hz) – 10Log10(fPFD) – 20Log10(fLO/fPFD). The FOM was measured across the full LO range, with fREF = 80 MHz,
fREF power = 10 dBm (500 V/µs slew rate) with a 40 MHz fPFD. The FOM was computed at 50 kHz offset.
LOGIC INPUT AND POWER SPECIFICATIONS
VS = 5 V; ambient temperature (TA) = 25°C; fREF = 153.6 MHz; fPFD = 38.4 MHz; high-side LO injection; fIF = 140 MHz; IIP3 optimized
using CDAC (0x0) and IP3SET (3.3 V), unless otherwise noted.
Table 4.
Parameter
LOGIC INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINH/IINL
Input Capacitance, CIN
POWER SUPPLIES
Voltage Range
Supply Current
Test Conditions/Comments
CLK, DATA, LE
Min
Typ
1.4
0
Max
Unit
3.3
0.7
V
V
µA
pF
5.25
V
mA
mA
mA
mA
mA
0.1
5
VCC1, VCC2, VCC_LO, VCC_MIX, and VCC_V2I pins
4.75
PLL only
External LO mode (internal PLL disabled, LO output buffer off, IP3SET pin = 3.3 V)
Internal LO mode (internal PLL enabled, IP3SET pin = 3.3 V, LO output buffer on)
Internal LO mode (internal PLL enabled, IP3SET pin = 3.3 V, LO output buffer off)
Power-down mode
Rev. D | Page 4 of 32
5
97
168
277
263
30
Data Sheet
ADRF6602
TIMING CHARACTERISTICS
VCC2 = 5 V ± 5%.
Table 5.
Parameter
t1
t2
t3
t4
t5
t6
t7
Limit
20
10
10
25
25
10
20
Unit
ns min
ns min
ns min
ns min
ns min
ns min
ns min
Description
LE setup time
DATA-to-CLK setup time
DATA-to-CLK hold time
CLK high duration
CLK low duration
CLK-to-LE setup time
LE pulse width
Timing Diagram
t4
t5
CLK
t2
DATA
DB23 (MSB)
t3
DB22
DB2
(CONTROL BIT C3)
DB1
(CONTROL BIT C2)
t1
DB0 (LSB)
(CONTROL BIT C1)
t7
08545-002
t6
LE
Figure 2. Timing Diagram
Rev. D | Page 5 of 32
ADRF6602
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Supply Voltage, VCC1, VCC2, VCC_LO,
VCC_MIX, VCC_V2I
Digital I/O, CLK, DATA, LE
IFP, IFN
RFIN
LOP, LON
θJA (Exposed Paddle Soldered Down)
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
Rating
−0.5 V to +5.5 V
−0.3 V to +3.6 V
−0.3 V to VCC_V2I + 0.3 V
16 dBm
13 dBm
35°C/W
150°C
−40°C to +85°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. D | Page 6 of 32
Data Sheet
ADRF6602
40
39
38
37
36
35
34
33
32
31
DECLVCO
VTUNE
LOP
LON
LODRV_EN
GND
VCC_LO
NC
NC
GND
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
PIN 1
INDICATOR
ADRF6602
TOP VIEW
(Not to Scale)
30
29
28
27
26
25
24
23
22
21
GND
IP3SET
GND
VCC_V2I
RFIN
GND
GND
GND
VCC_MIX
GND
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PADDLE SHOULD BE SOLDERED TO A
LOW IMPEDANCE GROUND PLANE.
08545-003
GND
DATA
CLK
LE
GND
PLL_EN
VCC_LO
IFP
IFN
GND
11
12
13
14
15
16
17
18
19
20
VCC1 1
DECL3P3 2
CP 3
GND 4
RSET 5
REF_IN 6
GND 7
MUXOUT 8
DECL2P5 9
VCC2 10
Figure 3. Pin Configuration
Table 7. Pin Function Descriptions
Pin No.
1
Mnemonic
VCC1
2
3
4, 7, 11, 15, 20,
21, 23, 24, 25,
28, 30, 31, 35
5
DECL3P3
CP
GND
RSET
Description
Power Supply for the 3.3 V LDO. Power supply voltage range is 4.75 V to 5.25 V. Each power supply pin
should be decoupled with a 100 pF capacitor and a 0.1 µF capacitor located close to the pin.
Decoupling Node for 3.3 V LDO. Connect a 0.1 µF capacitor between this pin and ground.
Charge Pump Output Pin. Connect to VTUNE through loop filter.
Ground. Connect these pins to a low impedance ground plane.
Charge Pump Current. The nominal charge pump current can be set to 250 µA, 500 µA, 750 µA, or 1 mA using
Bit DB11 and Bit DB10 in Register 4 and by setting Bit DB18 in Register 4 to 0 (internal reference current). In
this mode, no external RSET is required. If Bit DB18 is set to 1, the four nominal charge pump currents (INOMINAL)
can be externally adjusted according to the following equation:
217.4 × I CP
R SET =
I NOMINAL
6
8
REF_IN
MUXOUT
9
10
DECL2P5
VCC2
12
13
DATA
CLK
14
LE
16
PLL_EN
17, 34
VCC_LO
18, 19
IFP, IFN
− 37.8 Ω
Reference Input. Nominal input level is 1 V p-p. Input range is 12 MHz to 160 MHz.
Multiplexer Output. This output can be programmed to provide the reference output signal or the lock detect
signal. The output is selected by programming the appropriate register.
Decoupling Node for 2.5 V LDO. Connect a 0.1 µF capacitor between this pin and ground.
Power Supply for the 2.5 V LDO. Power supply voltage range is 4.75 V to 5.25 V. Each power supply pin
should be decoupled with a 100 pF capacitor and a 0.1 µF capacitor located close to the pin.
Serial Data Input. The serial data input is loaded MSB first; the three LSBs are the control bits.
Serial Clock Input. The serial clock input is used to clock in the serial data to the registers. The data is latched
into the 24-bit shift register on the CLK rising edge. Maximum clock frequency is 20 MHz.
Load Enable. When the LE input pin goes high, the data stored in the shift registers is loaded into one of the
eight registers. The relevant latch is selected by the three control bits of the 24-bit word.
PLL Enable. Switch between internal PLL and external LO input. When this pin is logic high, the mixer LO is
automatically switched to the internal PLL and the internal PLL is powered up. When this pin is logic low, the
internal PLL is powered down and the external LO input is routed to the mixer LO inputs. The SPI can also be
used to switch modes.
Power Supply. Power supply voltage range is 4.75 V to 5.25 V. Each power supply pin should be decoupled
with a 100 pF capacitor and a 0.1 µF capacitor located close to the pin.
Mixer IF Outputs. These outputs should be pulled to VCC with RF chokes.
Rev. D | Page 7 of 32
ADRF6602
Data Sheet
Pin No.
22
Mnemonic
VCC_MIX
26
27
RFIN
VCC_V2I
29
32, 33
36
IP3SET
NC
LODRV_EN
37, 38
LON, LOP
39
VTUNE
40
DECLVCO
EPAD
Description
Power Supply. Power supply voltage range is 4.75 V to 5.25 V. Each power supply pin should be decoupled
with a 100 pF capacitor and a 0.1 µF capacitor located close to the pin.
RF Input (Single-Ended, 50 Ω).
Power Supply. Power supply voltage range is 4.75 V to 5.25 V. Each power supply pin should be decoupled
with a 100 pF capacitor and a 0.1 µF capacitor located close to the pin.
Connect a resistor from this pin to a 5 V supply to adjust IIP3. Normally leave open.
No Connection.
LO Driver Enable. Together with Pin 16 (PLL_EN), this digital input pin determines whether the LOP and LON
pins operate as inputs or outputs. LOP and LON become inputs if the PLL_EN pin is low or if the PLL_EN pin
is set high with the PLEN bit (DB6 in Register 5) set to 0. LOP and LON become outputs if either the LODRV_EN
pin or the LDRV bit (DB3 in Register 5) is set to 1 while the PLL_EN pin is set high. External LO drive frequency
must be 1× LO. This pin should not be left floating.
Local Oscillator Input/Output. The internally generated 1× LO is available on these pins. When internal LO
generation is disabled, an external 1× LO can be applied to these pins.
VCO Control Voltage Input. This pin is driven by the output of the loop filter. Nominal input voltage range on
this pin is 1.5 V to 2.5 V.
Decoupling Node for VCO LDO. Connect a 100 pF capacitor and a 10 µF capacitor between this pin and ground.
Exposed Paddle. The exposed paddle should be soldered to a low impedance ground plane.
Rev. D | Page 8 of 32
Data Sheet
ADRF6602
TYPICAL PERFORMANCE CHARACTERISTICS
RF FREQUENCY SWEEP
CDAC = 0x0, internally generated high-side LO, RFIN = −5 dBm, fIF = 140 MHz, unless otherwise noted.
5
4
45
IP3SET = OPEN
IP3SET = 3.3V
TA = +85°C
TA = +25°C
TA = –40°C
3
IP3SET = OPEN
IP3SET = 3.3V
TA = +85°C
TA = +25°C
TA = –40°C
40
INPUT IP3 (dBm)
GAIN (dB)
2
1
0
–1
35
30
–2
25
–3
1510
1610
1710
1810
1910
2010
RF FREQUENCY (MHz)
20
1410
08545-104
–5
1410
TA = +85°C
TA = +25°C
TA = –40°C
19
1810
1910
2010
IP3SET = OPEN
IP3SET = 3.3V
TA = +85°C
TA = +25°C
TA = –40°C
18
INPUT P1dB (dBm)
INPUT IP2 (dBm)
80
1710
Figure 7. Input IP3 vs. RF Frequency
20
IP3SET = OPEN
IP3SET = 3.3V
1610
RF FREQUENCY (MHz)
Figure 4. Gain vs. RF Frequency
90
1510
08545-107
–4
70
60
50
17
16
15
14
13
12
40
1610
1710
1810
1910
2010
RF FREQUENCY (MHz)
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
1410
IP3SET = OPEN
IP3SET = 3.3V
TA = +85°C
TA = +25°C
TA = –40°C
1510
1610
1710
1810
1510
1610
1710
1810
1910
RF FREQUENCY (MHz)
Figure 8. Input P1dB vs. RF Frequency
1910
RF FREQUENCY (MHz)
2010
08545-106
NOISE FIGURE (dB)
Figure 5. Input IP2 vs. RF Frequency
10
1410
Figure 6. Noise Figure vs. RF Frequency
Rev. D | Page 9 of 32
2010
08545-108
1510
08545-105
11
30
1410
ADRF6602
Data Sheet
IF FREQUENCY SWEEP
CDAC = 0x0, internally generated swept low-side LO, fRF = 1960 MHz, RFIN = −5 dBm, unless otherwise noted.
5
4
IP3SET = OPEN
IP3SET = 3.3V
45
TA = +85°C
TA = +25°C
TA = –40°C
40
IP3SET = OPEN
IP3SET = 3.3V
TA = +85°C
TA = +25°C
TA = –40°C
3
35
INPUT IP3 (dBm)
GAIN (dB)
2
1
0
–1
30
25
20
–2
15
–3
IF FREQUENCY (MHz)
5
25 50 75 100 125 150 175 200 225 250 275 300 325 350 375 400
08545-110
–5
25 50 75 100 125 150 175 200 225 250 275 300 325 350 375 400
IF FREQUENCY (MHz)
Figure 9. Gain vs. IF Frequency
90
IP3SET = OPEN
IP3SET = 3.3V
Figure 12. Input IP3 vs. IF Frequency, RFIN = −5 dBm
20
TA = +85°C
TA = +25°C
TA = –40°C
18
IP3SET = OPEN
IP3SET = 3.3V
TA = +85°C
TA = +25°C
TA = –40°C
16
INPUT P1dB (dBm)
INPUT IP2 (dBm)
80
08545-113
10
–4
70
60
50
14
12
10
8
6
4
40
Figure 10. Input IP2 vs. IF Frequency, RFIN = −5 dBm
20
18
14
12
10
8
6
4
TA = +85°C
TA = +25°C
TA = –40°C
IF FREQUENCY (MHz)
08545-112
NOISE FIGURE (dB)
16
0
25 50 75 100 125 150 175 200 225 250 275 300 325 350 375 400
IF FREQUENCY (MHz)
Figure 13. Input P1dB vs. IF Frequency
IP3SET = OPEN
IP3SET = 3.3V
2
0
25 50 75 100 125 150 175 200 225 250 275 300 325 350 375 400
Figure 11. Noise Figure vs. IF Frequency
Rev. D | Page 10 of 32
08545-114
IF FREQUENCY (MHz)
08545-111
2
30
25 50 75 100 125 150 175 200 225 250 275 300 325 350 375 400
Data Sheet
0
0
IP3SET = OPEN
IP3SET = 3.3V
–5
TA = +85°C
TA = +25°C
TA = –40°C
–10
–2
–4
–15
RETURN LOSS (dB)
–20
–25
–30
–35
–40
–10
–12
–14
–45
–16
–50
1750
1850
1950
2050
2150
LO FREQUENCY (MHz)
Figure 14. LO-to-IF Feedthrough vs. LO Frequency,
LO Output Turned Off, CDAC = 0x0
–30
–20
1400
1500
1600
TA = +85°C
TA = +25°C
TA = –40°C
2000
2100
2200
2300
3.5
300
3.0
RESISTANCE
250
RESISTANCE (Ω)
–60
–70
1950
2050
2150
LO FREQUENCY (MHz)
Figure 15. LO-to-RF Leakage vs. LO Frequency, LO Output Turned Off
2.0
150
1.5
CAPACITANCE
100
1.0
50
0.5
0
50
08545-109
1850
2.5
200
–80
1750
1900
Figure 17. LO Input Return Loss vs. LO Frequency (Including TC1-1-13 Balun)
–50
1650
1800
LO FREQUENCY (MHz)
350
IP3SET = OPEN
IP3SET = 3.3V
–40
–90
1550
1700
100
150
200
250
300
350
400
450
CAPACITANCE (pF)
1650
08545-115
–60
1550
08545-117
–18
–55
LO-TO-RF LEAKAGE (dBm)
–6
–8
0
500
08545-118
LO-TO-IF FEEDTHROUGH (dBm)
ADRF6602
IF FREQUENCY (MHz)
Figure 18. IF Differential Output Impedance (R Parallel C Equivalent)
0
35
–10
IP3SET = OPEN
IP3SET = 3.3V
30
NOISE FIGURE (dB)
–30
–40
–50
25
20
–60
15
–80
1400
1500
1600
1700
1800
1900
2000
2100
2200
RF FREQUENCY (MHz)
2300
Figure 16. RF Input Return Loss vs. RF Frequency
10
–60
–50
–40
–30
–20
–10
CW BLOCKER LEVEL (dBm)
Figure 19. SSB Noise Figure vs. 5 MHz Offset Blocker Level,
LO Frequency = 2105 MHz, RF Frequency = 1965 MHz
Rev. D | Page 11 of 32
0
08545-200
–70
08545-116
RETURN LOSS (dB)
–20
ADRF6602
0
Data Sheet
5.0
IP3SET = OPEN
IP3SET = 3.3V
–5
TA = +85°C
TA = +25°C
TA = –40°C
4.0
–15
VTUNE VOLTAGE (V)
–20
–25
–30
–35
–40
3.5
3.0
2.5
2.0
1.5
–45
1.0
–50
0.5
–55
1500
1700
1900
2100
2300
RF FREQUENCY (MHz)
0
1550
08545-119
–60
1300
1650
TA = +85°C
TA = +25°C
TA = –40°C
2050
2150
IP3SET = OPEN
IP3SET = 3.3V
TA = +85°C
TA = +25°C
TA = –40°C
300
–2
SUPPLY CURRENT (mA)
LO OUTPUT AMPLITUDE (dBm)
–1
1950
Figure 23. VTUNE vs. LO Frequency
350
IP3SET = OPEN
IP3SET = 3.3V
1850
LO FREQUENCY (MHz)
Figure 20. RF-to-IF Leakage vs. RF Frequency, High-Side LO, IF = 140 MHz,
LO Output Turned Off
0
1750
08545-122
RF-TO-IF ISOLATION (dBc)
–10
TA = +85°C
TA = +25°C
TA = –40°C
4.5
–3
–4
–5
–6
–7
250
200
150
–8
1750
1850
1950
2050
2150
LO FREQUENCY (MHz)
100
1550
08545-120
1650
1750
1850
1950
2050
2150
LO FREQUENCY (MHz)
Figure 21. LO Output Amplitude vs. LO Frequency
Figure 24. Supply Current vs. LO Frequency
20
2.0
1.9
15
IP3SET = OPEN
IP3SET = 3.3V
1.8
VPTAT VOLTAGE (V)
10
5
0
–5
1.7
1.6
1.5
1.4
1.3
–10
1.2
–15
0
50
100
150
200
TIME (ns)
Figure 22. Frequency Deviation from LO Frequency at
LO = 1.97 GHz to 1.96 GHz vs. Lock Time
250
1.0
–55
–35
–15
5
25
45
TEMPERATURE (°C)
65
85
105
08545-124
1.1
–20
08545-222
FREQUENCY DEVIATION FROM 1960MHz (MHz)
1650
08545-123
–9
–10
1550
Figure 25. VPTAT Voltage vs. Temperature (IP3SET = Optimized, Open)
Rev. D | Page 12 of 32
Data Sheet
ADRF6602
Complementary cumulative distribution function (CCDF), fRF = 1960 MHz, fIF = 140 MHz.
70
60
50
40
30
20
TA = +85°C
TA = +25°C
TA = –40°C
–0.5
0
0.5
1.0
1.5
2.0
60
50
40
30
20
TA = +85°C
TA = +25°C
TA = –40°C
2.5
GAIN (dB)
0
20
22
24
DISTRIBUTION PERCENTAGE (%)
70
60
50
40
30
20
TA = +85°C
TA = +25°C
TA = –40°C
10
45
50
55
60
65
70
75
80
70
60
50
40
30
20
TA = +85°C
TA = +25°C
TA = –40°C
0
9
10
11
100
DISTRIBUTION PERCENTAGE (%)
70
60
50
40
30
20
TA = +85°C
TA = +25°C
TA = –40°C
10
NOISE FIGURE (dB)
15
16
17
18
16
17
80
70
60
50
40
30
20
TA = +85°C
TA = +25°C
TA = –40°C
10
18
08545-127
DISTRIBUTION PERCENTAGE (%)
80
15
14
IP3SET = OPEN
IP3SET = 3.3V
90
14
13
Figure 30. Input P1dB
IP3SET = OPEN
13
12
INPUT P1dB (dBm)
90
12
36
80
Figure 27. Input IP2
0
11
34
10
INPUT IP2 (dBm)
100
32
IP3SET = OPEN
IP3SET = 3.3V
90
08545-126
DISTRIBUTION PERCENTAGE (%)
100
80
0
40
30
Figure 29. Input IP3
IP3SET = OPEN
IP3SET = 3.3V
90
28
INPUT IP3 (dBm)
Figure 26. Gain
100
26
08545-129
–1.0
70
10
08545-125
10
80
08545-128
80
0
–1.5
IP3SET = OPEN
IP3SET = 3.3V
90
DISTRIBUTION PERCENTAGE (%)
90
DISTRIBUTION PERCENTAGE (%)
100
IP3SET = OPEN
IP3SET = 3.3V
Figure 28. Noise Figure
0
–55
–53
–51
–49
–47
–45
–43
–41
–39
–37
LO FEEDTHROUGH (dBm)
Figure 31. LO Feedthrough to IF, LO Output Turned Off
Rev. D | Page 13 of 32
–35
08545-130
100
ADRF6602
Data Sheet
Measured at IF output, CDAC = 0x0, IP3SET = open, internally generated high-side LO, fREF = 153.6 MHz, fPFD = 38.4 MHz,
RFIN = −5 dBm, fIF = 140 MHz, unless otherwise noted. Phase noise measurements made at LO output, unless otherwise noted.
1.0
LO FREQUENCY = 2134.4MHz
TA = +85°C
TA = +25°C
TA = –40°C
–100
–110
–120
LO FREQUENCY = 1558.4MHz
–130
–140
–150
0.8
0.7
0.6
0.5
0.4
0.3
0.2
10k
100k
1M
10M
100M
OFFSET FREQUENCY (Hz)
0
1550
TA = +85°C
TA = +25°C
TA = –40°C
PHASE NOISE (dBc/Hz)
2150
–100
–100
OFFSET = 1kHz
–110
–120
OFFSET = 100kHz
–130
–140
OFFSET = 5MHz
–150
1750
1850
1950
2050
2150
LO FREQUENCY (MHz)
–160
1550
08545-132
1650
Figure 33. PLL Reference Spurs vs. LO Frequency (2× PFD and 4× PFD)
1850
1950
2050
2150
Figure 36. Phase Noise vs. LO Frequency (1 kHz, 100 kHz, and 5 MHz Steps)
–80
TA = +85°C
TA = +25°C
TA = –40°C
–90
PHASE NOISE (dBc/Hz)
–80
1750
LO FREQUENCY (MHz)
TA = +85°C
TA = +25°C
TA = –40°C
3× PFD FREQUENCY
1× PFD FREQUENCY
1650
08545-134
SPURRS LEVEL (dBc)
–95
–105
SPURRS LEVEL (dBc)
2050
TA = +85°C
TA = +25°C
TA = –40°C
–90
–90
–85
–90
–95
–100
–100
–110
OFFSET = 10kHz
–120
–130
–140
0.25× PFD FREQUENCY
OFFSET = 1MHz
–105
–150
1650
1750
1850
1950
LO FREQUENCY (MHz)
2050
2150
08545-232
–110
1550
1950
Figure 35. Integrated Phase Noise vs. LO Frequency
–85
–75
1850
–80
2× PFD FREQUENCY
4× PFD FREQUENCY
–80
–110
1550
1750
LO FREQUENCY (MHz)
Figure 32. Phase Noise vs. Offset Frequency
–75
1650
08545-133
0.1
08545-131
–160
1k
TA = +85°C
TA = +25°C
TA = –40°C
0.9
Figure 34. PLL Reference Spurs vs. LO Frequency (0.25× PFD, 1× PFD, and 3× PFD)
Rev. D | Page 14 of 32
–160
1550
1650
1750
1850
1950
2050
2150
LO FREQUENCY (MHz)
Figure 37. Phase Noise vs. LO Frequency (10 kHz, 1 MHz Steps)
08545-135
PHASE NOISE (dBc/Hz)
–90
INTEGRATED PHASE NOISE (°rms)
–80
Data Sheet
ADRF6602
SPURIOUS PERFORMANCE
(N × fRF) − (M × fLO) spur measurements were made using the standard evaluation board (see the Evaluation Board section). Mixer spurious
products were measured in dB relative to the carrier (dBc) from the IF output power level. All spurious components greater than −125 dBc
are shown.
LO = 1550 MHz, RF = 1410 MHz (horizontal axis is m, vertical axis is n), and RFIN power = −10 dBm.
N
0
−95.78
−27.96
−80.82
−105.61
−120.72
0
1
2
3
4
5
6
7
1
−36.11
0.00
−84.22
−93.37
−121.95
−122.11
M
2
−38.06
−75.14
−70.69
−112.15
−123.15
−122.03
−122.02
3
−43.03
−44.01
−83.52
−84.67
−120.95
−122.97
−121.46
−122.03
4
−81.04
−90.50
−121.89
−123.77
−123.53
−122.62
−121.44
LO = 1900 MHz, RF = 1760 MHz (horizontal axis is m, vertical axis is n), and RFIN power = −10 dBm.
N
0
−96.17
−23.66
−69.90
−105.85
0
1
2
3
4
5
6
7
1
−35.62
0.00
−80.06
−107.79
−122.72
M
2
−23.14
−63.13
−71.05
−104.24
−121.39
−122.78
3
−51.42
−40.94
−86.55
−78.66
−122.69
−122.48
−122.39
4
−68.37
−95.26
−121.43
−124.20
−117.55
−123.67
−119.57
LO = 2150 MHz, RF = 2010 MHz (horizontal axis is m, vertical axis is n), and RFIN power = −10 dBm.
N
0
1
2
3
4
5
6
7
0
−94.96
−21.91
−76.22
1
−36.89
0.00
−77.24
−97.36
−122.66
M
2
−22.24
−69.83
−75.74
−101.06
−122.37
−122.76
Rev. D | Page 15 of 32
3
+9.56
−31.34
−80.30
−76.16
−120.59
−121.11
−122.63
4
+9.56
+9.56
−87.09
−121.60
−125.16
−124.51
−122.41
−122.93
ADRF6602
Data Sheet
REGISTER STRUCTURE
This section provides the register maps for the ADRF6602. The three LSBs determine the register that is programmed.
REGISTER 0—INTEGER DIVIDE CONTROL (DEFAULT: 0x0001C0)
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11
0
0
0
0
0
0
0
0
0
0
0
0
0
INTEGER DIVIDE RATIO
CONTROL BITS
DB10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DM
ID6
ID5
ID4
ID3
ID2
ID1
ID0
C3(0) C2(0) C1(0)
DM
DIVIDE MODE
0
FRACTIONAL (DEFAULT)
1
INTEGER
DB1
ID6
ID5
ID4
ID3
ID2
ID1
ID0
INTEGER DIVIDE RATIO
0
0
1
0
1
0
1
21 (INTEGER MODE ONLY)
0
0
1
0
1
1
0
22 (INTEGER MODE ONLY)
0
0
1
0
1
1
1
23 (INTEGER MODE ONLY)
0
0
1
1
0
0
0
24
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
DB0
0
1
1
1
0
0
0
56 (DEFAULT)
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
1
1
1
0
1
1
1
119
1
1
1
1
0
0
0
120 (INTEGER MODE ONLY)
1
1
1
1
0
0
1
121 (INTEGER MODE ONLY)
1
1
1
1
0
1
0
122 (INTEGER MODE ONLY)
1
1
1
1
0
1
1
123 (INTEGER MODE ONLY)
08545-004
DIVIDE
MODE
RESERVED
Figure 38. Register 0—Integer Divide Control Register Map
RESERVED
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14
0
0
0
0
0
0
0
0
0
0
DB13
DB12 DB11 DB10
MODULUS VALUE
DB9 DB8 DB7
DB6
DB5
DB4
DB3
CONTROL BITS
DB2 DB1 DB0
MD10
MD9
MD6
MD3
MD2
MD1
MD0
C3(0) C2(0) C1(1)
MD10
0
0
...
...
1
...
...
1
MD9
0
0
...
...
1
...
...
1
MD8
MD8
0
0
...
...
0
...
...
1
MD7
MD7
0
0
...
...
0
...
...
1
MD6
0
0
...
...
0
...
...
1
MD5
MD5
0
0
...
...
0
...
...
1
MD4
MD4
0
0
...
...
0
...
...
1
Figure 39. Register 1—Modulus Divide Control Register Map
Rev. D | Page 16 of 32
MD3
0
0
...
...
0
...
...
1
MD2
0
0
...
...
0
...
...
1
MD1
0
1
...
...
0
...
...
1
MD0
1
0
...
...
0
...
...
1
MODULUS VALUE
1
2
...
...
1536 (DEFAULT)
...
...
2047
08545-005
REGISTER 1—MODULUS DIVIDE CONTROL (DEFAULT: 0x003001)
Data Sheet
ADRF6602
REGISTER 2—FRACTIONAL DIVIDE CONTROL (DEFAULT: 0x001802)
0
0
0
0
0
CONTROL BITS
FRACTIONAL VALUE
0
0
0
0
DB12 DB11 DB10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
FD0
DB2
DB1
DB0
0
FD10
FD9
FD8
FD7
FD6
FD5
FD4
FD3
FD2
FD1
C3(0) C2(1) C1(0)
FD10
FD9
FD8
FD7
FD6
FD5
FD4
FD3
FD2
FD1
FD0
FRACTIONAL VALUE
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
0
1
1
0
0
0
0
0
0
0
0
768 (DEFAULT)
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
100 ms, set the PLEN bit to 1 (Register 5,
Bit DB6).
After this procedure is followed, the other registers should be
programmed in this order: Register 7, Register 6, Register 4,
Register 3, Register 2, Register 1. Then, after a delay of >100 ms,
Register 0 should be programmed.
Rev. D | Page 20 of 32
Data Sheet
ADRF6602
LO SELECTION LOGIC
The downconverting mixer in the ADRF6602 can be used
without the internal PLL by applying an external differential
LO to Pin 37 and Pin 38 (LON and LOP). In addition, when
using an LO generated by the internal PLL, the LO signal can
be accessed directly at these same pins. This function can be
used for debugging purposes, or the internally generated LO
can be used as the LO for a separate mixer.
The operation of the LO generation and whether LOP and LON
are inputs or outputs are determined by the logic levels applied
at Pin 16 (PLL_EN) and Pin 36 (LODRV_EN), as well as Bit DB3
(LDRV) and Bit DB6 (PLEN) in Register 5. The combination of
externally applied logic and internal bits required for particular
LO functions is given in Table 9.
Table 9. LO Selection Logic
Pin 16 (PLL_EN)
0
0
1
1
1
1
1
Pins 1
Pin 36 (LODRV_EN)
X
X
X
0
X
1
Register 5 Bits1
Bit DB6 (PLEN)
Bit DB3 (LDRV)
0
X
1
X
0
X
1
0
1
1
1
X
X = don’t care.
Rev. D | Page 21 of 32
Output Buffer
Disabled
Disabled
Disabled
Disabled
Enabled
Enabled
Outputs
LO
External
External
External
Internal
Internal
Internal
ADRF6602
Data Sheet
APPLICATIONS INFORMATION
BASIC CONNECTIONS FOR OPERATION
be ac-coupled and terminated with a 50 Ω resistor as shown in
Figure 46. The reference signal, or a divided-down version of
the reference signal, can be brought back off chip at the multiplexer
output pin (MUXOUT). A lock detect signal and a voltage
proportional to the ambient temperature can also be selected
on the multiplexer output pin.
Figure 46 shows the schematic for the ADRF6602 evaluation
board. The six power supply pins should be individually decoupled
using 100 pF and 0.1 µF capacitors located as close as possible
to the device. In addition, the internal decoupling nodes
(DECL3P3, DECL2P5, and DECLVCO) should be decoupled
with the capacitor values shown in Figure 46.
The loop filter is connected between the CP and VTUNE pins.
When connected in this way, the internal VCO is operational.
For information about the loop filter components, see the
Evaluation Board Configuration Options section.
The RF input is internally ac-coupled and needs no external
bias. The IF outputs are open collector, and a bias inductor is
required from these outputs to VCC.
Operation with an external VCO is also possible. In this case,
the loop filter components should be referred to ground. The
output of the loop filter is connected to the input voltage pin of
the external VCO. The output of the VCO is brought back into
the device on the LOP and LON pins, using a balun if necessary.
The reference frequency for the PLL should be from 12 MHz to
160 MHz and should be applied to the REF_IN pin, which should
1
2
3
VCC
R54
10kΩ
(0402)
S2
LO IN/OUT
LON
4
3
C5
1nF LOP
1 (0402)
5
REF_IN
R70
49.9Ω
(0402)
C34
OPEN
(0402)
R52
OPEN
(0402)
C19
0.1µF
(0402)
C9
0.1µF
(0402)
C33
OPEN
(0402)
R51
OPEN
(0402)
R6
0Ω
(0402)
C8
100pF
(0402)
R26
0Ω
(0402)
C24
100pF
(0402)
R25
0Ω
(0402)
C22
100pF
(0402)
R25
0Ω
(0402)
C21
100pF
(0402)
R17
0Ω
(0402)
C18
100pF
(0402)
R7
0Ω
(0402)
C10
100pF
(0402)
C32
OPEN
(0402)
R50
OPEN
(0402)
VCC_MIX
VCC_LO
22
27
VCC2
17
VCC1
10
1
LE
VCC_V2I
DATA
C20
0.1µF
(0402)
CLK
C23
0.1µF
(0402)
13 12 14
16
DECL2P5
9
SPI
INTERFACE
37
DIVIDER
÷2
BUFFER
38
BUFFER
ADRF6602
×2
6
N COUNTER
21 TO 123
TEMP
SENSOR
CHARGE PUMP
250µA,
500µA (DEFAULT),
750µA,
1000µA
–
PHASE
+ FREQUENCY
DETECTOR
8
4
7
11 15 20 21 23 24 25 28 30 31 35
RSET
R2
R37 OPEN
0Ω (0402)
(0402)
CP
TEST
POINT
(ORANGE)
R38
0Ω
(0402)
C14
22pF
(0603)
29
3
39
CP
C2
OPEN
(0402)
40
18
VTUNE DECLVCO
C13
6.8pF
(0603)
R1
0Ω
(0402)
C11
0.1µF
(0402)
C41
OPEN
(0603)
IP3SET
C40
22pF
(0603)
IFN
VCC
+5V
VTUNE
R63
OPEN
(0402)
RFIN
C27
0.1µF
(0402)
19
IFP
R62
0Ω
(0402)
R10
3.0kΩ
(0603)
C15
2.7nF
(1206)
C12
R8
100pF 0Ω
(0402) (0402)
R27
0Ω
(0402)
R9 10kΩ R65 10kΩ
(0402)
(0402)
R11
OPEN
(0402)
C43
10µF
(0603)
5
C42
10µF
(0603)
R28
0Ω
(0402)
VCO
CORE
PRESCALER
÷2
MUX
C17
0.1µF
(0402)
RFIN
26
THIRD-ORDER
FRACTIONAL
INTERPOLATOR
C16
R18
100pF 0Ω
(0402) (0402)
DECL3P3
2
DIV
BY
2, 1
2:1
MUX
FRACTION MODULUS INTEGER
REG
REG
÷2
MUXOUT
R16
0Ω
(0402)
P1
9-PIN
DSUB
9
C25
0.1µF
(0402)
÷4
REFOUT
8
R36
0Ω
R30
R35
(0402)
0Ω
0Ω
(0402) (0402) R57
0Ω
(0402)
R19
0Ω
R20 (0402)
0Ω
(0402)
36
T8
TC1-1-13+ C6
1nF
(0402)
C31
1nF
(0402) REF_IN
7
C7
0.1µF
(0402)
34
LODRV_EN
6
PLL_EN
VCC_LO
R56
0Ω
(0402)
5
R53
10kΩ
(0402)
VCC
RED
+5V
VCC1
RED
R55
OPEN
(0402)
S1
OPEN
4
1
4
2
R59
0Ω
(0402)
3
5
R43
0Ω
(0402)
RFOUT
C29
0.1µF
(0402)
R12
0Ω
(0402)
C1
100pF
(0402)
Figure 46. Basic Connections for Operation of the ADRF6602
Rev. D | Page 22 of 32
08545-024
A peak-to-peak differential swing on RFIN of 1 V (0.353 V rms
for a sine wave input) results in an IF output power of 3.8 dBm.
Data Sheet
ADRF6602
AC TEST FIXTURE
the signal generation and measurement equipment. Figure 47
shows the typical AC test set up used in the characterization of
the ADRF6602.
Characterization data for the ADRF6602 was taken under very
strict test conditions. All possible techniques were used to
achieve optimum accuracy and to remove degrading effects of
ADRF6602 CHARACTERIZATION RACK DIAGRAM.
ALL INSTRUMENTS ARE CONTROLLED BY A LAB
COMPUTER VIA A USB TO GPIB CONTROLLER, DAISY
CHAINED TO EACH INDIVIDUAL INSTRUMENT.
RF1 AGILENT N5181A
HP 11636A
POWER DIVIDER
RF2 AGILENT N5181A
REF_IN AGILENT N5181A
RFIN
REF_IN
ADRF6602
EVALUATION BOARD
9-PIN CONTROLLER DSUB AND
10-PIN DC HEADER
IF_OUT
ROHDE & SCHWARTZ
FSEA30
AGILENT 34401A SET TO IDC
(SET FOR SUPPLY CURRENT)
GND VIA
10-PIN DC HEADER
5V dc VIA
10-PIN DC HEADER
3.3V dc VIA
10-PIN DC HEADER
AGILENT 34980A WITH THREE 34921 MODULES
AND ONE 34950 MODULE
AGILENT E3631A 25V SET TO
3.3V, 6V SET TO 5V.
RETURNS ARE
JUMPERED TOGETHER
Figure 47. ADRF6602 AC Test Set Up
Rev. D | Page 23 of 32
08545-047
5V dc MEASURED FOR SUPPLY CURRENT
ADRF6602
Data Sheet
EVALUATION BOARD
Figure 50 shows the schematic of the RoHS-compliant evaluation
board for the ADRF6602. This board has four layers and was
designed using Rogers 4350 hybrid material to minimize high
frequency losses. FR4 material is also adequate if the design can
accept the slightly higher trace loss of this material.
The evaluation board is designed to operate using the internal
VCO of the device (the default configuration) or with an external
VCO. To use an external VCO, R62 and R12 should be removed.
Place 0 Ω resistors in R63 and R11. The input of the external
VCO should be connected to the VTUNE SMA connector, and
the external VCO output should be connected to the LO IN/OUT
SMA connector. In addition to these hardware changes, internal
register settings must also be changed to enable operation with
an external VCO (see the Register 6—VCO Control and VCO
Enable (Default: 0x1E2106) section).
To connect the evaluation board to a USB port, a USB adapter board
(EVAL-ADF4XXXZ-USB) must be purchased from Analog Devices.
This board connects to the PC using a standard USB cable with a
USB mini-connector at one end. An additional 25-pin male to 9-pin
female adapter is required to mate the ADF4XXXZ-USB board
to the 9-pin D-Sub connector on the ADRF6602 evaluation board.
Additional configuration options for the evaluation board are
described in Table 10.
EVALUATION BOARD CONTROL SOFTWARE
The evaluation board can be connected to the PC using a PC
parallel port or a USB port. These options are selectable from the
opening menu of the software interface (see Figure 48). The
evaluation board is shipped with a 25-pin parallel port cable
for connection to the PC parallel port.
08545-025
Software to program the ADRF6602 is available for download
on the ADRF6602 product page under the Evaluation Boards &
Development Kits section. To install the software
1. Download and extract the zip file:
ADRF6x0x_3p0p0_XP_install.exe file.
2. Follow the instructions in the read me file.
Figure 48. Control Software Opening Menu
Figure 49 shows the main menu of the control software with the
default settings displayed.
Rev. D | Page 24 of 32
ADRF6602
08545-026
Data Sheet
Figure 49. Main Screen of the ADRF6602 Evaluation Board Software
Rev. D | Page 25 of 32
3P3V_LDO
AG N D
REFIN
OSC_3P3V
AG N D
AG N D
AG N D
AG N D
R70
49.9
AG N D
1
1000PF
C31
10PF
C3
22000PF
C4
0
R15
100PF
0.1UF
OSC_3P3V
C12
C11
0
R8
C41
1
3P3V1
AG N D
100PF
0.1UF
AG N D
C10
C9
0
R7
10UF
VCC
1
VCC4
0
R37
AG N D
0
DNI
R49
2P5V_LDO
REFOUT
R11
VCO_LDO
22PF
C14
DNI
0
R16
AG N D
1
AG N D
0.1UF
C2
VCO_LDO
R10
0
R1
2.7NF
C15
C42
10UF
AG N D
10K
P1-1
10UF
C43
VCC
R71
R12
AG N D
AG N D
1
C18
100PF
AG N D
C19
0.1UF
AG N D
0
R17
100PF
0.1UF
0
R18
C16
AG N D
C17
VCC2
1
2P5V
AG N D
AG N D
100PF
C1
6.8PF
C13
10K
R65
AG N D
22PF
C40
R2
AMP745781-4
9
8
7
6
5
4
3
2
1
P1
R72
R62
9
8
7
6
5
10
P1-6
P1-1
R50
1
1K DNI
CLK
DNI
4
3
2
1
DNI
R36
R57
R30
0
0
0
11
1
GND
R51
DIG_GND
0
R19
1K DNI
12
38
37
1
LE
14
Z1
AG N D
R53
10K
15
35
AG N D
1
R54
10K
VCC
1
AG N D
3
1
LO_EXTERN
33
R56
10K
17
VCC5
16
34
AG N D
3
AG N D
100PF DNI
C34
AG N D
100PF DNI
C33
DATA
13
36
S2
R52
1K DNI
AG N D
100PF DNI
C32
VCC2
DECL2P5
MUXOUT
GND
REF_IN
RSET
GND
CP
DECL3P3
39
VCC
P3-T7
P4-T7
P3-T7
18
IFP
0
0
VCC1
40
1
VCC1
R55
10K
C5
1NF
C6
1NF
DATA
R9
0
3K
TBD
2
R38
DECLVCO
S1
LE
R63
100K
PLL_EN
P3-T7
VCC_LO
CP
1
Y1
R14
AG N D
VTUNE
3
LODRV_EN
R33
NC
32
0
31
T8
21
22
23
AG N D
C20
1
VCC_LO1
0.1UF
AG N D
VCC_LO
TBD
R60
R25
AG N D
100PF
C27
VCC_LO
VCC_RF
0
R26
C25
VCC_BB
AG N D
0.1UF
1
VCC_RF
VCC_BB
IP3SET
OUTPUT_EN
0
VCC_BB1
AG N D
0.1UF
C24
TBD
R27
AG N D
R31
DNI
R58
VCC
VCC
AG N D
TBD
L2
TBD
AG N D
C23
0.1UF
L1
0
C22
100PF
1
DNI
C36
DNI
C35
0
R48
0
R47
0
AG N D
1
IP3SET
VCC_LO
R29
LO
VCC_BB
R28
C21
0
R24
IP3SET
AG N D
0.1UF
C7
1
VCC_LO
0
R69
0
24
AG N D
AG N D
P1-T7
AG N D
R32
25
26
27
28
0
R6
4
2
5
P4-T7
P4-T7
100PF
AG N D
30
29
E-PAD PAD
GND
VCC_MIX
GND
GND
GND
RF
IN
VCC_V2I
GND
IP3SET
GND
AG N D
AG N D
100PF
C8
NC
4
4A
5A
2A
3
5
2
3A
6A
20
OUTPUT_EN
19
NC
AG N D
IFN
1A
GND
0
AG N D
VCC
1
AG N D
AG N D
C28
IFN
IFP
0
R67
0 DNI
R68
AG N D
RFIN
SNS
SNS1
VCC_SENSE
VCC
AGND
AGND
3P3V_LDO
2P5V_LDO
LO_EXTERN
VCO_LDO
VCC_SENSE
T3
AG N D
OUT
1
1
AG N D
GND1
GND
C29
DNI
R44
AG N D
0.1UF
VCC
0
R59
J1 1
J1 2
J1 3
J1 4
J1 5
J1 6
J1 7
J1 8
J1 9
J1 10
1
GND2
TC4-1W
VCC
VCC_RF
10UF
6
R66
P1-T7
GND
T7
R43
1
2
VTUNE
CLK
1
1
GND
4
1
P1-6
LOP
R35
LON
0
VCC_LO
0
GND
R20
Rev. D | Page 26 of 32
R34
Figure 50. Evaluation Board Schematic
0
6
3
P1-T7
AG N D
ADRF6602
Data Sheet
SCHEMATIC AND ARTWORK
2
08545-023
0
0
ADRF6602
Figure 51. Evaluation Board Layout (Bottom)
08545-012
08545-013
Data Sheet
Figure 52. Evaluation Board Layout (Top)
Rev. D | Page 27 of 32
ADRF6602
Data Sheet
EVALUATION BOARD CONFIGURATION OPTIONS
Table 10.
Component
S1, R55, R56, R33
Description
LO select. Switch and resistors to ground the LODRV_EN pin. The LODRV_EN pin setting, in
combination with internal register settings, determines whether the LOP and LON pins
function as inputs or outputs (see the LO Selection Logic section for more information).
LO IN/OUT
SMA Connector
REFIN
SMA Connector
REFOUT
SMA Connector
LO input/output. An external 1× LO or 2× LO can be applied to this single-ended input
connector.
Reference input. The input reference frequency for the PLL is applied to this connector.
Input impedance is 50 Ω.
Multiplexer output. The REFOUT connector connects directly to the MUXOUT pin. The
on-board multiplexer can be programmed to bring out the following signals: REFIN, 2×
REFIN, REFIN/2, and REFIN/4; temperature sensor output voltage; and lock detect indicator.
Charge pump test point. The unfiltered charge pump signal can be probed at this test
point. Note that the CP pin should not be probed during critical measurements such as
phase noise.
Loop filter. Loop filter components.
CP Test Point
R37, C14, R9, R10,
C15, C13, R65, C40
R11, R12
R62, R63, VTUNE
SMA Connector
R2
RFIN SMA Connector
T3
Loop filter return. When the internal VCO is used, the loop filter components should be
returned to Pin 40 (DECLVCO) by installing a 0 Ω resistor in R12. When an external VCO is used,
the loop filter components can be returned to ground by installing a 0 Ω resistor in R11.
Internal vs. external VCO. When the internal VCO is enabled, the loop filter components are
connected directly to the VTUNE pin (Pin 39) by installing a 0 Ω resistor in R62. To use an
external VCO, R62 should be left open. A 0 Ω resistor should be installed in R63, and the
voltage input of the VCO should be connected to the VTUNE SMA connector. The output of
the VCO is brought back into the PLL via the LO IN/OUT SMA connector.
RSET pin. This pin is unused and should be left open.
RF input. The RF input signal should be applied to the RFIN SMA connector. The RF input of
the ADRF6602 is ac-coupled, so no bias is necessary.
IF output. The differential IF output signals from the ADRF6602 (IFP and IFN) are converted
to a single-ended signal by T3.
Rev. D | Page 28 of 32
Default Condition/
Option Settings
S1 = R55 = open
(not installed),
R56 = R33 = 0 Ω,
LODRV_EN = 0 V
LO input
Lock detect
R12 = 0 Ω (0402),
R11 = open (0402)
R62 = 0 Ω (0402),
R63 = open (0402)
R2 = open (0402)
R3 = R23 = open (0402)
Data Sheet
ADRF6602
OUTLINE DIMENSIONS
6.10
6.00 SQ
5.90
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
31
30
0.50
BSC
10
21
20
TOP VIEW
1.00
0.85
0.80
SEATING
PLANE
12° MAX
0.50
0.40
0.30
0.80 MAX
0.65 TYP
0.30
0.23
0.18
4.25
4.10 SQ
3.95
EXPOSED
PAD
(BOTTOM VIEW)
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
11
0.20 MIN
4.50 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
06-01-2012-D
5.85
5.75 SQ
5.65
PIN 1
INDICATOR
40 1
Figure 53. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6 mm × 6 mm Body, Very Thin Quad
(CP-40-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
ADRF6602ACPZ-R7
ADRF6602-EVALZ
1
Temperature Range
−40°C to +85°C
Package Description
40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Board
Z = RoHS Compliant Part.
Rev. D | Page 29 of 32
Package Option
CP-40-1
ADRF6602
Data Sheet
NOTES
Rev. D | Page 30 of 32
Data Sheet
ADRF6602
NOTES
Rev. D | Page 31 of 32
ADRF6602
Data Sheet
NOTES
©2010–2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08545-0-10/13(D)
Rev. D | Page 32 of 32
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