Enhanced system-level ESD performance per IEC 61000-4-x
Low power operation
5 V operation
1.4 mA per channel maximum at 0 Mbps to 2 Mbps
4.3 mA per channel maximum at 10 Mbps
3.3 V operation
0.9 mA per channel maximum at 0 Mbps to 2 Mbps
2.4 mA per channel maximum at 10 Mbps
High common-mode transient immunity: >25 kV/µs
Safety and regulatory approvals
UL recognition: 2500 V rms for 1 minute per UL 1577
CSA Component Acceptance Notice 5A
VDE certificate of conformity
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
VIORM = 560 V peak
ENHANCED FEATURES
Supports defense and aerospace applications (AQEC standard)
Military temperature range (−55°C to +125°C)
Controlled manufacturing baseline
One assembly/test site
One fabrication site
Enhanced product change notification
Qualification data available on request
APPLICATIONS
General-purpose multichannel isolation
SPI/data converter isolation
RS-232/RS-422/RS-485 transceivers
Industrial field bus isolation
GENERAL DESCRIPTION
The ADuM3400-EP/ADuM3401-EP/ADuM3402-EP isolators
provide four independent isolation channels in a variety of
channel configurations and data rates (see the Ordering Guide).
All models operate with the supply voltage on either side ranging
from 3.135 V to 5.5 V, providing compatibility with lower voltage
systems as well as enabling a voltage translation functionality
across the isolation barrier.
Protected by US Patents 5,952,849; 6,873,065; 6,903,578; and 7,075,329.
Rev. A
ADuM3400-EP
16
VDD2
15
GND2
VIA 3
ENCODE
DECODE
14
VOA
VIB 4
ENCODE
DECODE
13
VOB
VIC 5
ENCODE
DECODE
12
VOC
VID 6
ENCODE
DECODE
11
VOD
NC 7
10
VE2
GND1 8
9
GND2
Figure 1. ADuM3400-EP Functional Block Diagram
VDD1 1
ADuM3401-EP
GND1 2
16
VDD2
15
GND2
VIA 3
ENCODE
DECODE
14
VOA
VIB 4
ENCODE
DECODE
13
VOB
VIC 5
ENCODE
DECODE
12
VOC
VOD 6
DECODE
ENCODE
11
VID
VE1 7
10
GND1 8
9
VE2
GND2
Figure 2. ADuM3401-EP Functional Block Diagram
VDD1 1
ADuM3402-EP
GND1 2
16
VDD2
15
GND2
VIA 3
ENCODE
DECODE
14
VOA
VIB 4
ENCODE
DECODE
13
VOB
VOC 5
DECODE
ENCODE
12
VIC
VOD 6
DECODE
ENCODE
11
VID
VE1 7
10
VE2
GND1 8
9
GND2
Figure 3. ADuM3402-EP Functional Block Diagram
The ADuM3400-EP/ADuM3401-EP/ADuM3402-EP1 are
4-channel digital isolators based on the Analog Devices, Inc.,
iCoupler® technology. Combining high speed CMOS and
monolithic air core transformer technology, these isolation
components provide outstanding performance characteristics
superior to alternatives such as optocoupler devices.
1
VDD1 1
GND1 2
13271-001
FUNCTIONAL BLOCK DIAGRAMS
13271-002
FEATURES
13271-003
Enhanced Product
Quad-Channel, Digital Isolators,
Enhanced System-Level ESD Reliability
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
The ADuM3400-EP/ADuM3401-EP/ADuM3402-EP isolators
have a patented refresh feature that ensures dc correctness in the
absence of input logic transitions and during power-up/powerdown conditions.
The ADuM3400-EP/ADuM3401-EP/ADuM3402-EP isolators
contain various circuit and layout changes to provide increased
capability relative to system-level IEC 61000-4-x testing (ESD/
burst/surge). The precise capability in these tests is determined by
the design and layout of the user’s board or module. For more
information, see the AN-793 Application Note, ESD/Latch-Up
Considerations with iCoupler Isolation Products.
Additional application and technical information can be found
in the ADuM3400/ADuM3401/ADuM3402 data sheet.
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2015–2017 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
Enhanced Product
TABLE OF CONTENTS
Features .............................................................................................. 1
Regulatory Information ................................................................9
Enhanced Features............................................................................ 1
Insulation and Safety-Related Specifications .............................9
Applications ....................................................................................... 1
General Description ......................................................................... 1
DIN V VDE V 0884-10 (VDE V 0884-10) Insulation
Characteristics ............................................................................ 10
Functional Block Diagrams ............................................................. 1
Recommended Operating Conditions .................................... 10
Revision History ............................................................................... 2
Absolute Maximum Ratings ......................................................... 11
Specifications..................................................................................... 3
ESD Caution................................................................................ 11
Electrical Characteristics—5 V Operation................................ 3
Pin Configurations and Function Descriptions ......................... 12
Electrical Characteristics—3.3 V Operation ............................ 4
Typical Performance Characteristics ........................................... 15
Electrical Characteristics—Mixed 5 V/3.3 V or 3.3 V/5 V
Operation....................................................................................... 6
Outline Dimensions ....................................................................... 17
Ordering Guide .......................................................................... 17
Package Characteristics ............................................................... 9
REVISION HISTORY
5/2017—Rev. 0 to Rev. A
Change to Features Section ............................................................. 1
Changes to Regulatory Information Section and Table 5 ........... 9
7/2015—Revision 0: Initial Version
Rev. A | Page 2 of 17
Enhanced Product
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS—5 V OPERATION
All voltages are relative to their respective ground. 4.5 V ≤ VDD1 ≤ 5.5 V and 4.5 V ≤ VDD2 ≤ 5.5 V. All minimum/maximum specifications
apply over the entire recommended operation range, unless otherwise noted. All typical specifications are at TA = 25°C, VDD1 = VDD2 = 5 V.
Table 1.
Parameter
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent
Output Supply Current per Channel, Quiescent
ADuM3400-EP, Total Supply Current1
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps
VDD1 Supply Current
VDD2 Supply Current
ADuM3401-EP, Total Supply Current1
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps
VDD1 Supply Current
VDD2 Supply Current
ADuM3402-EP, Total Supply Current1
DC to 2 Mbps
VDD1 or VDD2 Supply Current
10 Mbps
VDD1 or VDD2 Supply Current
For All Models
Input Leakage per Channel
VEx Input Pull-Up Current
Tristate Leakage Current per Channel
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
Symbol
Typ
Max Unit
IDDI (Q)
IDDO (Q)
0.57
0.29
0.83 mA
0.35 mA
IDD1 (Q)
IDD2 (Q)
2.9
1.2
3.5
1.9
IDD1 (10)
IDD2 (10)
9.0
3.0
11.6 mA
5.5 mA
5 MHz logic signal frequency
5 MHz logic signal frequency
IDD1 (Q)
IDD2 (Q)
2.5
1.6
3.2
2.4
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
IDD1 (10)
IDD2 (10)
7.4
4.4
10.6 mA
6.5 mA
5 MHz logic signal frequency
5 MHz logic signal frequency
IDD1 (Q), IDD2 (Q)
2.0
2.8
mA
DC to 1 MHz logic signal frequency
IDD1 (10), IDD2 (10)
6.0
7.5
mA
5 MHz logic signal frequency
II
IPU
IOZ
VIH, VEH
VIL, VEL
VOAH, VOBH
VOCH, VODH
Logic Low Output Voltages
SWITCHING SPECIFICATIONS
Minimum Pulse Width
Maximum Data Rate
Propagation Delay
Pulse Width Distortion, |tPLH − tPHL|
Change vs. Temperature
Propagation Delay Skew
Channel to Channel Matching
Codirectional Channels
Opposing Directional Channels
Min
−10
−10
−10
2.0
(VDD1 or VDD2) −
0.1
(VDD1 or VDD2) −
0.4
VOAL, VOBL
VOCL, VODL
mA
mA
mA
mA
IOx2 = −20 µA, VIx = VIxH3
4.8
V
IOx2 = −4 mA, VIx = VIxH3
0.1
0.1
0.4
V
V
V
IOx2 = 20 µA, VIx = VIxL4
IOx2 = 400 µA, VIx = VIxL4
IOx2 = 4 mA, VIx = VIxL4
100
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
PW
tPSK
15
ns
Mbps
ns
ns
ps/°C
ns
tPSKCD
tPSKOD
3
6
ns
ns
tPHL, tPLH
PWD
32
50
3
5
Rev. A | Page 3 of 17
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
+0.01 +10 µA
−3
+0.01 +10 µA
V
0.8 V
5.0
V
0.0
0.04
0.2
10
20
Test Conditions/Comments
0 V ≤ VIx ≤ VDDx
VEx = 0 V
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
Parameter
For All Models
Output Propagation Delay
Disable (High/Low to High Impedance)
Enable (High Impedance to High/Low)
Output Rise/Fall Time (10% to 90%)
Common-Mode Transient Immunity
Logic High Output5
Logic Low Output5
Refresh Rate
Dynamic Supply Current per Channel6
Input
Output
Symbol
Min
tPHZ, tPLH
tPZH, tPZL
tR/tF
Enhanced Product
Typ
Max Unit
Test Conditions/Comments
6
6
2.5
8
8
ns
ns
ns
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
VIx = VDD1/VDD2, VCM = 1000 V,
transient magnitude = 800 V
VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V
|CMH|
25
35
kV/µs
|CML|
25
35
kV/µs
fr
1.2
Mbps
IDDI (D)
IDDO (D)
0.20
0.05
mA/Mbps
mA/Mbps
1
The supply current values for all four channels are combined when running at identical data rates. Output supply current values are specified with no output load
present. See Figure 8 through Figure 10 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 11
through Figure 15 for total VDD1 and VDD2 supply currents as a function of data rate for ADuM3400-EP/ADuM3401-EP/ADuM3402-EP channel configurations.
2
IOx is the Channel x output current, where x = A, B, C, or D.
3
VIxH is the input side logic high.
4
VIxL is the input side logic low.
5
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining the output voltage (VOUT) > 0.8 VDD2. CML is the maximum commonmode voltage slew rate that can be sustained while maintaining VOUT < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode
voltage edges. The transient magnitude is the range over which the common mode is slewed.
6
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 8 through Figure 10 for information
on per-channel supply current for unloaded and loaded conditions.
ELECTRICAL CHARACTERISTICS—3.3 V OPERATION
All voltages are relative to their respective ground. 3.135 V ≤ VDD1 ≤ 3.6 V and 3.135 V ≤ VDD2 ≤ 3.6 V. All minimum/maximum specifications
apply over the entire recommended operation range, unless otherwise noted. All typical specifications are at TA = 25°C, VDD1 = VDD2 = 3.3 V.
Table 2.
Parameter
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent
Output Supply Current per Channel, Quiescent
ADuM3400-EP, Total Supply Current1
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps
VDD1 Supply Current
VDD2 Supply Current
ADuM3401-EP, Total Supply Current1
DC to 2 Mbps
VDD1 Supply Current
VDD2 Supply Current
10 Mbps
VDD1 Supply Current
VDD2 Supply Current
ADuM3402-EP, Total Supply Current1
DC to 2 Mbps
VDD1 or VDD2 Supply Current
10 Mbps
VDD1 or VDD2 Supply Current
Symbol
Min
Typ
Max Unit
IDDI (Q)
IDDO (Q)
0.31
0.19
0.49 mA
0.27 mA
IDD1 (Q)
IDD2 (Q)
1.6
0.7
2.1
1.2
mA
mA
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
IDD1 (10)
IDD2 (10)
4.8
1.8
7.1
2.3
mA
mA
5 MHz logic signal frequency
5 MHz logic signal frequency
IDD1 (Q)
IDD2 (Q)
1.4
0.9
1.9
1.5
mA
mA
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
IDD1 (10)
IDD2 (10)
4.1
2.5
5.6
3.3
mA
mA
5 MHz logic signal frequency
5 MHz logic signal frequency
IDD1 (Q), IDD2 (Q)
1.2
1.7
mA
DC to 1 MHz logic signal frequency
IDD1 (10), IDD2 (10)
3.3
4.4
mA
5 MHz logic signal frequency
Rev. A | Page 4 of 17
Test Conditions/Comments
Enhanced Product
Parameter
For All Models
Input Leakage per Channel
VEx Input Pull-Up Current
Tristate Leakage Current per Channel
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
Symbol
Min
Typ
II
IPU
IOZ
VIH, VEH
VIL, VEL
VOAH, VOBH
−10
−10
−10
1.6
+0.01 +10
−3
+0.01 +10
(VDD1 or VDD2) −
0.1
(VDD1 or VDD2) −
0.4
VOCH, VODH
Logic Low Output Voltages
SWITCHING SPECIFICATIONS
Minimum Pulse Width
Maximum Data Rate
Propagation Delay
Pulse Width Distortion, |tPLH − tPHL|
Change vs. Temperature
Propagation Delay Skew
Channel to Channel Matching
Codirectional Channels
Opposing Directional Channels
For All Models
Output Propagation Delay
Disable (High/Low to High Impedance)
Enable (High Impedance to High/Low)
Output Rise/Fall Time (10% to 90%)
Common-Mode Transient Immunity5
Logic High Output
Logic Low Output
Refresh Rate
Dynamic Supply Current per Channel6
Input
Output
Max Unit
0 V ≤ VIx ≤ VDDx
VEx = 0 V
3.3
µA
V
V
V
IOx2 = −20 µA, VIx = VIxH3
2.8
V
IOx2 = −4 mA, VIx = VIxH3
0.1
0.1
0.4
V
V
V
IOx2 = 20 µA, VIx = VIxL4
IOx2 = 400 µA, VIx = VIxL4
IOx2 = 4 mA, VIx = VIxL4
100
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
0.4
VOAL, VOBL
VOCL, VODL
µA
Test Conditions/Comments
0.0
0.04
0.2
PW
tPSK
22
ns
Mbps
ns
ns
ps/°C
ns
tPSKCD
tPSKOD
3
6
ns
ns
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
8
8
ns
ns
ns
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
VIx = VDD1/VDD2, VCM = 1000 V,
transient magnitude = 800 V
VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V
tPHL, tPLH
PWD
10
20
38
50
3
5
tPHZ, tPLH
tPZH, tPZL
tR/tF
6
6
3
|CMH|
25
35
kV/µs
|CML|
25
35
kV/µs
fr
1.1
Mbps
IDDI (D)
IDDO (D)
0.10
0.03
mA/Mbps
mA/Mbps
1
The supply current values for all four channels are combined when running at identical data rates. Output supply current values are specified with no output load
present. section. See Figure 8 through Figure 10 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See
Figure 11 through Figure 15 for total VDD1 and VDD2 supply currents as a function of data rate for ADuM3400-EP/ADuM3401-EP/ADuM3402-EP channel configurations.
2
IOx is the Channel x output current, where x = A, B, C, or D.
3
VIxH is the input side logic high.
4
VIxL is the input side logic low.
5
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VOUT > 0.8 VDD2. CML is the maximum common-mode voltage slew rate
that can be sustained while maintaining VOUT < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The
transient magnitude is the range over which the common mode is slewed.
6
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 8 through Figure 10 for information
on per channel supply current for unloaded and loaded conditions.
Rev. A | Page 5 of 17
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
Enhanced Product
ELECTRICAL CHARACTERISTICS—MIXED 5 V/3.3 V OR 3.3 V/5 V OPERATION
All voltages are relative to their respective ground. For 5 V/3.3 V operation, 4.5 V ≤ VDD1 ≤ 5.5 V and 3.135 V ≤ VDD2 ≤ 3.6 V, and for 3.3 V/5 V
operation, 3.135 V ≤ VDD1 ≤ 3.6 V and 4.5 V ≤ VDD2 ≤ 5.5 V. All minimum/maximum specifications apply over the entire recommended
operation range, unless otherwise noted. All typical specifications are at TA = 25°C; VDD1 = 3.3 V, VDD2 = 5 V or VDD1 = 5 V, VDD2 = 3.3 V.
Table 3.
Parameter
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent
5 V/3.3 V Operation
3.3 V/5 V Operation
Output Supply Current per Channel, Quiescent
5 V/3.3 V Operation
3.3 V/5 V Operation
ADuM3400-EP, Total Supply Current1
DC to 2 Mbps
VDD1 Supply Current
5 V/3.3 V Operation
3.3 V/5 V Operation
VDD2 Supply Current
5 V/3.3 V Operation
3.3 V/5 V Operation
10 Mbps
VDD1 Supply Current
5 V/3.3 V Operation
3.3 V/5 V Operation
VDD2 Supply Current
5 V/3.3 V Operation
3.3 V/5 V Operation
ADuM3401-EP, Total Supply Current1
DC to 2 Mbps
VDD1 Supply Current
5 V/3.3 V Operation
3.3 V/5 V Operation
VDD2 Supply Current
5 V/3.3 V Operation
3.3 V/5 V Operation
10 Mbps
VDD1 Supply Current
5 V/3.3 V Operation
3.3 V/5 V Operation
VDD2 Supply Current
5 V/3.3 V Operation
3.3 V/5 V Operation
ADuM3402-EP, Total Supply Current1
DC to 2 Mbps
VDD1 Supply Current
5 V/3.3 V Operation
3.3 V/5 V Operation
VDD2 Supply Current
5 V/3.3 V Operation
3.3 V/5 V Operation
Symbol
Min
Typ
Max Unit
Test Conditions/Comments
0.57
0.31
0.83 mA
0.49 mA
0.29
0.19
0.27 mA
0.35 mA
2.9
1.6
3.5
2.1
mA
mA
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
0.7
1.2
1.2
1.9
mA
mA
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
9.0
4.8
11.6 mA
7.1 mA
5 MHz logic signal frequency
5 MHz logic signal frequency
1.8
3.0
2.3
5.5
mA
mA
5 MHz logic signal frequency
5 MHz logic signal frequency
2.5
1.4
3.2
1.9
mA
mA
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
0.9
1.6
1.5
2.4
mA
mA
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
7.4
4.1
10.6 mA
5.6 mA
5 MHz logic signal frequency
5 MHz logic signal frequency
2.5
4.4
3.3
6.5
mA
mA
5 MHz logic signal frequency
5 MHz logic signal frequency
2.0
1.2
2.8
1.7
mA
mA
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
1.2
2.0
1.7
2.8
mA
mA
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
IDDI (Q)
IDDO (Q)
IDD1 (Q)
IDD2 (Q)
IDD1 (10)
IDD2 (10)
IDD1 (Q)
IDD2 (Q)
IDD1 (10)
IDD2 (10)
IDD1 (Q)
IDD2 (Q)
Rev. A | Page 6 of 17
Enhanced Product
Parameter
10 Mbps
VDD1 Supply Current
5 V/3.3 V Operation
3.3 V/5 V Operation
VDD2 Supply Current
5 V/3.3 V Operation
3.3 V/5 V Operation
For All Models
Input Leakage per Channel
VEx Input Pull-Up Current
Tristate Leakage Current per Channel
Logic High Input Threshold
5 V/3.3 V Operation
3.3 V/5 V Operation
Logic Low Input Threshold
5 V/3.3 V Operation
3.3 V/5 V Operation
Logic High Output Voltages
Logic Low Output Voltages
SWITCHING SPECIFICATIONS
Minimum Pulse Width
Maximum Data Rate
Propagation Delay
Pulse Width Distortion, |tPLH − tPHL|
Change vs. Temperature
Propagation Delay Skew
Channel to Channel Matching
Codirectional Channels
Opposing Directional Channels
For All Models
Output Propagation Delay
Disable (High/Low-to-High Impedance)
Enable (High Impedance-to-High/Low)
Output Rise/Fall Time (10% to 90%)
5 V/3.3 V Operation
3.3 V/5 V Operation
Common-Mode Transient Immunity
Logic High Output5
Logic Low Output5
Refresh Rate
5 V/3.3 V Operation
3.3 V/5 V Operation
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
Symbol
Min
Typ
Max Unit
Test Conditions/Comments
6.0
3.3
7.5
4.4
mA
mA
5 MHz logic signal frequency
5 MHz logic signal frequency
3.3
6.0
4.4
7.5
mA
mA
5 MHz logic signal frequency
5 MHz logic signal frequency
+0.01
−3
+0.01
+10 µA
IDD1 (10)
IDD2 (10)
II
IPU
IOZ
VIH, VEH
−10
−10
−10
0 V ≤ VIx ≤ VDDx
VEx = 0 V
+10 µA
2.0
1.6
V
V
VIL, VEL
0.8
0.4
VOAH, VOBH (VDD1 or VDD2) −
0.1
VOCH, VODH (VDD1 or VDD2) −
0.4
VOAL, VOBL
VOCL, VODL
(VDD1 or VDD2)
(VDD1 or VDD2) −
0.2
0.0
0.1
0.04
0.1
0.2
0.4
PW
IOx2 = −20 µA, VIx = VIxH3
V
IOx2 = −4 mA, VIx = VIxH3
V
V
V
IOx2 = 20 µA, VIx = VIxL4
IOx2 = 400 µA, VIx = VIxL4
IOx2 = 4 mA, VIx = VIxL4
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
tPSK
22
ns
Mbps
ns
ns
ps/°C
ns
tPSKCD
tPSKOD
3
6
ns
ns
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
8
8
ns
ns
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
CL = 15 pF, CMOS signal levels
tPHL, tPLH
PWD
100
V
V
V
10
15
35
50
3
5
tPHZ, tPLH
tPZH, tPZL
tR/tf
6
6
3.0
2.5
ns
ns
|CMH|
25
35
kV/µs
|CML|
25
35
kV/µs
1.2
1.1
Mbps
Mbps
fr
Rev. A | Page 7 of 17
VIx = VDD1/VDD2, VCM = 1000 V,
transient magnitude = 800 V
VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
Parameter
Dynamic Supply Current per Channel6
Input
5 V/3.3 V Operation
3.3 V/5 V Operation
Output
5 V/3.3 V Operation
3.3 V/5 V Operation
Symbol
IDDI (D)
Min
Enhanced Product
Typ
Max Unit
0.20
0.10
mA/Mbps
mA/Mbps
0.03
0.05
mA/Mbps
mA/Mbps
Test Conditions/Comments
IDDO (D)
1
The supply current values for all four channels are combined when running at identical data rates. Output supply current values are specified with no output load
present. See Figure 8 through Figure 10 for information on per channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 11
through Figure 15 for total VDD1 and VDD2 supply currents as a function of data rate for ADuM3400-EP/ADuM3401-EP/ADuM3402-EP channel configurations.
2
IOx is the Channel x output current, where x = A, B, C, or D.
3
VIxH is the input side logic high.
4
VIxL is the input side logic low.
5
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VOUT > 0.8 VDD2. CML is the maximum common-mode voltage slew rate
that can be sustained while maintaining VOUT < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The
transient magnitude is the range over which the common mode is slewed.
6
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 8 through Figure 10 for information
on per-channel supply current for unloaded and loaded conditions.
Rev. A | Page 8 of 17
Enhanced Product
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
PACKAGE CHARACTERISTICS
Table 4.
Parameter
Resistance (Input to Output)1
Capacitance (Input to Output)1
Input Capacitance2
IC Junction to Case Thermal Resistance
Side 1
Side 2
1
2
Symbol
RIO
CIO
CI
Min
θJCI
θJCO
Typ
1012
2.2
4.0
Max
33
28
Unit
Ω
pF
pF
°C/W
°C/W
Test Conditions/Comments
f = 1 MHz
Thermocouple located at center of package underside
Thermocouple located at center of package underside
Device considered a 2-terminal device; Pin 1 to Pin 8 are shorted together, and Pin 9 to Pin 16 are shorted together.
Input capacitance is from any input data pin to ground.
REGULATORY INFORMATION
The ADuM3400-EP/ADuM3401-EP/ADuM3402-EP are approved by the organizations listed in Table 5.
Table 5.
UL
Recognized under 1577 Component
Recognition Program1
Single Protection, 2500 V rms
Isolation Voltage
File E214100
CSA
Approved under CSA Component Acceptance Notice 5A
Basic insulation per CSA 60950-1-03 and IEC 60950-1,
780 V rms (1103 V peak) maximum working voltage
Reinforced insulation per CSA 60950-1-03 and IEC 60950-1,
390 V rms (551 V peak) maximum working voltage
Basic insulation under IEC62020-1, 300 V rms (566 V peak)
maximum working voltage
File 205078
VDE
Certified according to DIN V VDE V
0884-10 (VDE V 0884-10):2006-122
Reinforced insulation, 560 V peak
File 2471900-4880-0001
1
In accordance with UL 1577, each ADuM3400-EP/ADuM3401-EP/ADuM3402-EP is proof tested by applying an insulation test voltage ≥3000 V rms for 1 sec (current
leakage detection limit = 5 µA).
2
In accordance with DIN V VDE V 0884-10, each ADuM3400-EP/ADuM3401-EP/ADuM3402-EP is proof tested by applying an insulation test voltage ≥1050 V peak for
1 sec (partial discharge detection limit = 5 pC). The * marking branded on the component designates DIN V VDE V 0884-10 approval.
INSULATION AND SAFETY-RELATED SPECIFICATIONS
Table 6.
Parameter
Rated Dielectric Insulation Voltage
Minimum External Air Gap (Clearance)
Symbol Value
2500
L(I01)
7.8 min
Minimum External Tracking (Creepage)
L(I02)
Minimum Clearance in the Plane of the
Printed Circuit Board (PCB Clearance)
L(PCB)
Minimum Internal Gap (Internal Clearance)
Tracking Resistance (Comparative Tracking Index)
Isolation Group
CTI
Unit Test Conditions/Comments
V rms 1 minute duration
mm Measured from input terminals to output terminals,
shortest distance through air
7.8 min
mm Measured from input terminals to output terminals,
shortest distance path along body
8.1 min
mm Measured from input terminals to output terminals,
shortest distance through air, line of sight, in the PCB
mounting plane
0.017 min mm Insulation distance through insulation
>400
V
DIN IEC 112/VDE 0303 Part 1
II
Material Group (DIN VDE 0110, 1/89, Table 1)
Rev. A | Page 9 of 17
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
Enhanced Product
DIN V VDE V 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS
These isolators are suitable for reinforced electrical isolation only within the safety limit data. Maintenance of the safety data is ensured by
protective circuits. The * marking on packages denotes DIN V VDE V 0884-10 approval.
Table 7.
Description
Installation Classification per DIN VDE 0110
For Rated Mains Voltage ≤ 150 V rms
For Rated Mains Voltage ≤ 300 V rms
For Rated Mains Voltage ≤ 400 V rms
Climatic Classification
Pollution Degree per DIN VDE 0110, Table 1
Maximum Working Insulation Voltage
Input-to-Output Test Voltage, Method B1
Test Conditions/Comments
VIORM × 1.875 = VPR, 100% production test,
tm = 1 sec, partial discharge < 5 pC
VIORM × 1.6 = VPR, tm = 60 sec, partial
discharge < 5 pC
Input-to-Output Test Voltage, Method A
After Environmental Tests Subgroup 1
After Input and/or Safety Test Subgroup 2 and Subgroup 3
Highest Allowable Overvoltage
Safety-Limiting Values
VIO = 500 V
Characteristic
Unit
VIORM
VPR
I to IV
I to III
I to II
40/105/21
2
560
1050
V peak
V peak
896
672
V peak
V peak
VTR
4000
V peak
TS
IS1
IS2
RS
150
265
335
>109
°C
mA
mA
Ω
VPR
350
RECOMMENDED OPERATING CONDITIONS
300
Table 8.
Parameter
Operating Temperature Range (TA)
Supply Voltages (VDD1, VDD2)1
Input Signal Rise and Fall Times
250
SIDE 2
200
150
SIDE 1
1
All voltages are relative to their respective ground.
100
50
0
0
50
100
150
CASE TEMPERATURE (°C)
200
13271-004
SAFETY LIMITING CURRENT (mA)
Case Temperature
Side 1 Current
Side 2 Current
Insulation Resistance at TS
VIORM × 1.2 = VPR, tm = 60 sec, partial
discharge < 5 pC
Transient overvoltage, tTR = 10 seconds
Maximum value allowed in the event of
a failure (see Figure 4)
Symbol
Figure 4. Thermal Derating Curve, Dependence of Safety Limiting Values
with Case Temperature per DIN V VDE V 0884-10
Rev. A | Page 10 of 17
Rating
−55°C to +125°C
3.135 V to 5.5 V
1.0 ms
Enhanced Product
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
ABSOLUTE MAXIMUM RATINGS
Ambient temperature = 25°C, unless otherwise noted.
Table 9.
Parameter
Storage Temperature Range (TST)
Ambient Operating Temperature Range (TA)
Supply Voltages (VDD1, VDD2)1
Input Voltage (VIA, VIB, VIC, VID, VE1, VE2)1, 2
Output Voltage (VOA, VOB, VOC, VOD)1, 2
Average Output Current per Pin3
Side 1 (IO1)
Side 2 (IO2)
Common-Mode Transients (CMH, CML)4
Rating
−65°C to +150°C
−55°C to +125°C
−0.5 V to +7.0 V
−0.5 V to VDD1 + 0.5 V
−0.5 V to VDDO + 0.5 V
−18 mA to +18 mA
−22 mA to +22 mA
−100 kV/µs to
+100 kV/µs
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
1
All voltages are relative to their respective ground.
VDDI and VDDO refer to the supply voltages on the input and output sides of a
given channel, respectively.
3
See Figure 4 for maximum rated current values for various temperatures.
4
Refers to common-mode transients across the insulation barrier. Commonmode transients exceeding the Absolute Maximum Ratings can cause latchup or permanent damage.
2
Table 10. Maximum Continuous Working Voltage1
Parameter
AC Voltage
Bipolar Waveform
Unipolar Waveform
Basic Insulation
Reinforced Insulation
DC Voltage
Basic Insulation
Reinforced Insulation
1
Max
Unit
Constraint
565
V peak
50-year minimum lifetime
1131
560
V peak
V peak
Maximum approved working voltage per IEC 60950-1
Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10
1131
560
V peak
V peak
Maximum approved working voltage per IEC 60950-1
Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10
Refers to continuous voltage magnitude imposed across the isolation barrier.
Table 11. Truth Table (Positive Logic)
VIx Input1, 2
H
L
X
X
X
X
VEx Input3, 2
H or NC
H or NC
L
H or NC
L
X
VDDI State1
Powered
Powered
Powered
Unpowered
Unpowered
Powered
VDDO State1
Powered
Powered
Powered
Powered
Powered
Unpowered
VOX Output1 Notes
H
L
Z
H
Outputs return to the input state within 1 µs of VDDI power restoration.
Z
Indeterminate Outputs return to the input state within 1 µs of VDDO power
restoration if VEx state is H or NC. Outputs return to high impedance
state within 8 ns of VDDO power restoration if VEx state is L.
1
VIx and VOx refer to the input and output signals of a given channel (A, B, C, or D). VEx refers to the output enable signal on the same side as the VOx outputs. VDDI and
VDDO refer to the supply voltages on the input and output sides of the given channel, respectively.
H is high, L is low, X is don’t care, and NC is no connect.
3
In noisy environments, connecting VEx to an external logic high or low is recommended.
2
Rev. A | Page 11 of 17
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
Enhanced Product
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
VDD1 1
16
VDD2
*GND1 2
15
GND2*
VIA 3
ADuM3400-EP
14
VOA
VIB 4
TOP VIEW
(Not to Scale)
13
VOB
12
VOC
VID 6
11
VOD
NC 7
10
VE2
*GND1 8
9
GND2*
VIC 5
*PIN 2 AND PIN 8 ARE INTERNALLY CONNECTED AND CONNECTING BOTH TO GND1
IS RECOMMENDED. PIN 9 AND PIN 15 ARE INTERNALLY CONNECTED AND
CONNECTING BOTH TO GND2 IS RECOMMENDED. IN NOISY ENVIRONMENTS,
CONNECTING OUTPUT ENABLES (PIN 7 FOR ADuM3401-EP/ADuM3402-EP AND PIN 10
FOR ALL MODELS) TO AN EXTERNAL LOGIC HIGH OR LOW IS RECOMMENDED.
13271-005
NC = NO CONNECT
Figure 5. ADuM3400-EP Pin Configuration
Table 12. ADuM3400-EP Pin Function Descriptions
Pin No.
1
2, 8
3
4
5
6
7
9, 15
10
Mnemonic
VDD1
GND1
VIA
VIB
VIC
VID
NC
GND2
VE2
11
12
13
14
16
VOD
VOC
VOB
VOA
VDD2
Description
Supply Voltage for Isolator Side 1, 3.135 V to 5.5 V.
Ground 1. Ground reference for Isolator Side 1.
Logic Input A.
Logic Input B.
Logic Input C.
Logic Input D.
No Connect.
Ground 2. Ground reference for Isolator Side 2.
Output Enable 2. Active high logic input. VOA, VOB, VOC, and VOD outputs are enabled when VE2 is high or disconnected.
VOA, VOB, VOC, and VOD outputs are disabled when VE2 is low. In noisy environments, connecting VE2 to an external logic
high or low is recommended.
Logic Output D.
Logic Output C.
Logic Output B.
Logic Output A.
Supply Voltage for Isolator Side 2, 3.135 V to 5.5 V.
Rev. A | Page 12 of 17
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
VDD1 1
16
VDD2
*GND1 2
15
GND2*
VIA 3
ADuM3401-EP
14
VOA
VIB 4
TOP VIEW
(Not to Scale)
13
VOB
12
VOC
VOD 6
11
VID
VE1 7
10
VE2
*GND1 8
9
GND2*
VIC 5
*PIN 2 AND PIN 8 ARE INTERNALLY CONNECTED AND CONNECTING BOTH TO GND1
IS RECOMMENDED. PIN 9 AND PIN 15 ARE INTERNALLY CONNECTED AND
CONNECTING BOTH TO GND2 IS RECOMMENDED. IN NOISY ENVIRONMENTS,
CONNECTING OUTPUT ENABLES (PIN 7 FOR ADuM3401-EP/ADuM3402-EP AND PIN 10
FOR ALL MODELS) TO AN EXTERNAL LOGIC HIGH OR LOW IS RECOMMENDED.
13271-006
Enhanced Product
Figure 6. ADuM3401-EP Pin Configuration
Table 13. ADuM3401-EP Pin Function Descriptions
Pin No.
1
2, 8
3
4
5
6
7
Mnemonic
VDD1
GND1
VIA
VIB
VIC
VOD
VE1
9, 15
10
GND2
VE2
11
12
13
14
16
VID
VOC
VOB
VOA
VDD2
Description
Supply Voltage for Isolator Side 1, 3.135 V to 5.5 V.
Ground 1. Ground reference for Isolator Side 1.
Logic Input A.
Logic Input B.
Logic Input C.
Logic Output D.
Output Enable 1. Active high logic input. VOD output is enabled when VE1 is high or disconnected. VOD is disabled when
VE1 is low. In noisy environments, connecting VE1 to an external logic high or low is recommended.
Ground 2. Ground reference for Isolator Side 2.
Output Enable 2. Active high logic input. VOA, VOB, and VOC outputs are enabled when VE2 is high or disconnected.
VOA, VOB, and VOC outputs are disabled when VE2 is low. In noisy environments, connecting VE2 to an external logic high
or low is recommended.
Logic Input D.
Logic Output C.
Logic Output B.
Logic Output A.
Supply Voltage for Isolator Side 1, 3.135 V to 5.5 V.
Rev. A | Page 13 of 17
Enhanced Product
VDD1 1
16
VDD2
*GND1 2
15
GND2*
VIA 3
ADuM3402-EP
14
VOA
VIB 4
TOP VIEW
(Not to Scale)
13
VOB
12
VIC
VOD 6
11
VID
VE1 7
10
VE2
*GND1 8
9
GND2*
VOC 5
*PIN 2 AND PIN 8 ARE INTERNALLY CONNECTED AND CONNECTING BOTH TO GND1
IS RECOMMENDED. PIN 9 AND PIN 15 ARE INTERNALLY CONNECTED AND
CONNECTING BOTH TO GND2 IS RECOMMENDED. IN NOISY ENVIRONMENTS,
CONNECTING OUTPUT ENABLES (PIN 7 FOR ADuM3401-EP/ADuM3402-EP AND PIN 10
FOR ALL MODELS) TO AN EXTERNAL LOGIC HIGH OR LOW IS RECOMMENDED.
13271-007
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
Figure 7. ADuM3402-EP Pin Configuration
Table 14. ADuM3402-EP Pin Function Descriptions
Pin No.
1
2, 8
3
4
5
6
7
Mnemonic
VDD1
GND1
VIA
VIB
VOC
VOD
VE1
9, 15
10
GND2
VE2
11
12
13
14
16
VID
VIC
VOB
VOA
VDD2
Description
Supply Voltage for Isolator Side 1, 3.135 V to 5.5 V.
Ground 1. Ground reference for Isolator Side 1.
Logic Input A.
Logic Input B.
Logic Output C.
Logic Output D.
Output Enable 1. Active high logic input. VOC and VOD outputs are enabled when VE1 is high or disconnected.
VOC and VOD outputs are disabled when VE1 is low. In noisy environments, connecting VE1 to an external logic high or
low is recommended.
Ground 2. Ground reference for Isolator Side 2.
Output Enable 2. Active high logic input. VOA and VOB outputs are enabled when VE2 is high or disconnected.
VOA and VOB outputs are disabled when VE2 is low. In noisy environments, connecting VE2 to an external logic high or
low is recommended.
Logic Input D.
Logic Input C.
Logic Output B.
Logic Output A.
Supply Voltage for Isolator Side 2, 3.135 V to 5.5 V.
Rev. A | Page 14 of 17
Enhanced Product
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
20
80
15
60
CURRENT (mA)
5V
10
3V
5V
3V
20
20
40
60
DATA RATE (Mbps)
80
0
13271-008
0
100
Figure 8. Typical Input Supply Current per Channel vs. Data Rate (No Load)
0
40
60
DATA RATE (Mbps)
15
60
CURRENT (mA)
80
100
40
20
5
5V
5V
20
40
60
DATA RATE (Mbps)
80
13271-009
0
0
100
Figure 9. Typical Output Supply Current per Channel vs. Data Rate (No Load)
0
15
60
CURRENT (mA)
80
5V
40
60
DATA RATE (Mbps)
80
100
Figure 12. Typical ADuM3400-EP VDD2 Supply Current vs. Data Rate for
5 V and 3.3 V Operation
20
10
20
13271-012
3V
3V
0
CURRENT/CHANNEL (mA)
80
Figure 11. Typical ADuM3400-EP VDD1 Supply Current vs. Data Rate for
5 V and 3.3 V Operation
20
10
20
13271-011
5
0
CURRENT/CHANNEL (mA)
40
5
40
5V
20
3V
3V
0
20
40
60
DATA RATE (Mbps)
80
0
13271-010
0
100
Figure 10. Typical Output Supply Current per Channel vs. Data Rate
(15 pF Output Load)
0
20
40
60
DATA RATE (Mbps)
80
100
13271-013
CURRENT/CHANNEL (mA)
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 13. Typical ADuM3401-EP VDD1 Supply Current vs. Data Rate for
5 V and 3.3 V Operation
Rev. A | Page 15 of 17
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
Enhanced Product
40
80
PROPAGATION DELAY (ns)
CURRENT (mA)
60
40
5V
20
3V
35
30
5V
0
20
60
40
DATA RATE (Mbps)
80
100
Figure 14. Typical ADuM3401-EP VDD2 Supply Current vs. Data Rate for
5 V and 3.3 V Operation
80
CURRENT (mA)
60
40
5V
20
0
0
20
40
60
DATA RATE (Mbps)
80
100
13271-015
3V
Figure 15. Typical ADuM3402-EP VDD1 or VDD2 Supply Current vs. Data Rate for
5 V and 3.3 V Operation
Rev. A | Page 16 of 17
25
–50
–25
0
50
25
TEMPERATURE (°C)
75
Figure 16. Propagation Delay vs. Temperature
100
13271-016
0
13271-014
3V
Enhanced Product
ADuM3400-EP/ADuM3401-EP/ADuM3402-EP
OUTLINE DIMENSIONS
10.50 (0.4134)
10.10 (0.3976)
9
16
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
10.00 (0.3937)
8
1.27 (0.0500)
BSC
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10
0.51 (0.0201)
0.31 (0.0122)
0.75 (0.0295)
45°
0.25 (0.0098)
2.65 (0.1043)
2.35 (0.0925)
SEATING
PLANE
8°
0°
1.27 (0.0500)
0.40 (0.0157)
0.33 (0.0130)
0.20 (0.0079)
COMPLIANT TO JEDEC STANDARDS MS-013-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
03-27-2007-B
1
Figure 17. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body (RW-16)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model1
ADUM3400TRWZ-EP
ADUM3400TRWZ-EP-RL
ADUM3401TRWZ-EP
ADUM3401TRWZ-EP-RL
ADUM3402TRWZ-EP
ADUM3402TRWZ-EP-RL
1
Number
of Inputs,
VDD1 Side
4
4
3
3
2
2
Number
of Inputs,
VDD2 Side
0
0
1
1
2
2
Maximum
Data Rate
(Mbps)
10
10
10
10
10
10
Maximum
Propagation
Delay, 5 V (ns)
50
50
50
50
50
50
Z = RoHS Compliant Part.
©2015–2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D13271-0-5/17(A)
Rev. A | Page 17 of 17
Temperature Range
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
Package
Description
16-Lead SOIC_W
16-Lead SOIC_W
16-Lead SOIC_W
16-Lead SOIC_W
16-Lead SOIC_W
16-Lead SOIC_W
Package
Option
RW-16
RW-16
RW-16
RW-16
RW-16
RW-16
工商网监
湘ICP备2023018690号
