DS1308U-33+T

DS1308 Low-Current I2C RTC with 56-Byte NV RAM General Description The DS1308 serial real-time clock (RTC) is a low-power, full binary-coded decimal (BCD) clock/calendar plus 56 bytes of NV RAM. Address and data are transferred serially through an I2C interface. The clock/calendar provides seconds, minutes, hours, day, date, month, and year information. The end of the month date is automatically adjusted for months with fewer than 31 days, including corrections for leap year. The clock operates in either the 24-hour or 12-hour format with an AM/PM indicator. The DS1308 has a built-in power-sense circuit that detects power failures and automatically switches to the backup supply, maintaining time and date operation. Applications Handhelds (GPS, POS Terminal) Consumer Electronics (Set-Top Box, Digital Recording, Network Appliance) Office Equipment (Fax/Printer, Copier) Medical (Glucometer, Medicine Dispenser) Telecommunications (Router, Switcher, Server) Other (Utility Meter, Vending Machine, Thermostat, Modem) Benefits and Features ●● Compatible with Crystal ESR Up to 100kΩ Allows a Crystal to be Optimized for Cost and Space ●● Low-Power Operation Extends Battery Backup Run Time • Low Timekeeping Current of 250nA (typ) • Automatic Power-Fail Detect and Switch Circuitry ●● Completely Manages All Timekeeping Functions • Real-Time Clock Counts Seconds, Minutes, Hours, Date of the Month, Month, Day of the Week, and Year with Leap-Year Compensation Valid Up to 2400 • External Clock Source for Synchronization Clock Reference (e.g., 32kHz, 50Hz/60Hz Powerline, GPS 1PPS) • 56-Byte, Battery-Backed, General-Purpose RAM with Unlimited Writes • Programmable Square-Wave Output Signal ●● Simple Serial Port Interfaces with Most Microcontrollers • I2C Serial Interface ●● Industrial Temperature Range: -40ºC to +85ºC Supports Operation in a Wide Range of Applications ●● Underwriters Laboratories (UL®) Recognized Typical Operating Circuit VCC VCC RPU RPU RPU SCL VCC X1 SDA SQW/CLKIN CPU DS1308 GND Ordering Information appears at end of data sheet. UL is a registered trademark of Underwriters Laboratories Inc. 19-6353; Rev 3; 4/15 X2 VBAT Low-Current I2C RTC with 56-Byte NV RAM DS1308 Absolute Maximum Ratings (All voltages relative to ground.) Voltage Range on VCC or VBAT............................-0.3V to +6.0V Voltage on Any Non-Power Pin................. -0.3V to (VCC + 0.3V) Operating Temperature Range........................... -40NC to +85NC Junction Temperature Maximum......................................+150NC Storage Temperature Range............................. -55NC to +125NC Lead Temperature (soldering, 10s).................................+300NC Soldering Temperature (reflow).......................................+260NC Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) FSOP Junction-to-Ambient Thermal Resistance (BJA)......206.3NC/W Junction-to-Case Thermal Resistance (BJC)................42NC/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Recommended Operating Conditions (TA = -40NC to +85NC, unless otherwise noted.) (Note 2) PARAMETER Operating Voltage Range Battery Voltage SYMBOL VCC CONDITIONS MIN TYP MAX DS1308-18 1.71 1.8 5.5 DS1308-3 2.7 3.0 5.5 DS1308-33 3.0 3.3 5.5 UNITS V VBAT 1.3 5.5 V Logic 1 Input VIH 0.7 x VCC VCC + 0.3 V Logic 0 Input VIL -0.3 0.3 x VCC V MAX UNITS fSCL = 400kHz 325 FA -33: VCC = 3.63V 125 -3: VCC = 3.3V 125 -18: VCC = 1.89V 100 DC Electrical Characteristics (VCC = VCCMIN to VCCMAX, VBAT = VBATMIN to VBATMAX, TA = -40NC to +85NC, unless otherwise noted.) (Note 2) PARAMETER Power-Supply Active Current (Note 3) Power-Supply Standby Current (Note 4) SYMBOL ICCA ICCS CONDITIONS MIN TYP VCC = VCCMAX Battery Leakage Current Input Leakage (SCL) IBATLKG 200 VCC R VPF VIN = 0V to VCC -100 25 +100 nA -0.1 +0.1 FA I/O Leakage (SDA, SQW/CLKIN) IIO I2C bus inactive, ECLK = 1 -0.1 +0.1 FA Output Logic 0 (SDA, SQW/ CLKIN), VOL = 0.4V IOL VCC R VCCMIN VBAT R 1.3V R VCC + 0.2V 3.0 250 -33 2.70 2.82 3.00 -3 2.45 2.55 2.70 -18 1.45 1.62 1.70 Power-Fail Trip Point www.maximintegrated.com II FA VPF mA FA V Maxim Integrated │  2 Low-Current I2C RTC with 56-Byte NV RAM DS1308 DC Electrical Characteristics (VCC = 0V, VBAT = VBATMIN to VBATMAX, TA = -40NC to +85NC, unless otherwise noted.) (Note 2) PARAMETER SYMBOL Switchover Voltage VSW Battery Current, SQW Off (Note 5) IBAT1 Battery Current, SQW On (Note 6) IBAT2 Data-Retention Current (Note 7) IBATDAT CONDITIONS MIN TYP MAX VBAT > VPF VBAT < VPF VPF VBAT > VCC VBAT = 3V 250 VBAT = VBATMAX V 600 VBAT = 3V 550 VBAT = VBATMAX VBAT = 3V UNITS 1100 nA nA 25 100 nA TYP MAX UNITS 400 kHz AC Electrical Characteristics (VCC = VCCMIN to VCCMAX, TA = -40NC to +85NC, unless otherwise noted.) (Note 2) PARAMETER SYMBOL SCL Clock Frequency fSCL Bus Free Time Between a STOP and START Condition tBUF Hold Time (Repeated) START Condition tHD:STA CONDITIONS (Note 8) (Note 9) MIN 0.03 1.3 Fs 0.6 Fs Low Period of SCL Clock tLOW 1.3 Fs High Period of SCL Clock tHIGH 0.6 Fs Data Hold Time tHD:DAT (Notes 10, 11) Data Setup Time tSU:DAT (Note 12) Setup Time for a Repeated START Condition tSU:STA 0 0.9 Fs 100 ns 0.6 Fs Rise Time of Both SDA and SCL Signals tR (Note 13) 20 + 0.1CB 300 ns Fall Time of Both SDA and SCL Signals tF (Note 13) 20 + 0.1CB 300 ns Setup Time for STOP Condition tSU:STO Capacitive Load for each Bus Line CB SCL Spike Suppression tSP Oscillator Stop Flag (OSF) Delay Timeout Interval www.maximintegrated.com 0.6 Fs (Note 13) tOSF (Note 14) tTIMEOUT (Note 15) 400 25 pF 60 ns 100 ms 35 ms Maxim Integrated │  3 Low-Current I2C RTC with 56-Byte NV RAM DS1308 Power-Up/Down Characteristics (TA = -40NC to +85NC, unless otherwise noted.) (Notes 2, 16) PARAMETER SYMBOL MIN TYP 1 MAX UNITS Recovery at Power-Up tREC 2 ms VCC Slew Rate (VPF to 0V) tVCCF 1/50 V/Fs VCC Slew Rate (0V to VPF) tVCCR 1/1 V/Fs MAX UNITS Capacitance (TA = +25NC, unless otherwise noted.) (Note 16) PARAMETER SYMBOL MIN TYP Input Capacitance CI 10 pF I/O Capacitance CO 10 pF Warning: Negative undershoots below -0.3V while the part is in battery-backed mode may cause loss of data. Note 2: Limits are 100% production tested at TA = +25NC and TA = +85NC. Limits over the operating temperature range and relevant supply voltage are guaranteed by design and characterization. Typical values are not guaranteed. Note 3: SCL clocking at max frequency. VSCL = 0V to VCC. Note 4: Specified with I2C bus inactive. Timekeeping and square-wave functions operational. Note 5: CH = ECLK = SQWE = 0. Note 6: CH = ECLK = 0, SQWE = RS1 = RS0 = 1, IOUT = 0mA. Note 7: CH = 1. ECLK = SQWE = 0. Note 8: The minimum SCL clock frequency is limited by the bus timeout feature, which resets the serial bus interface if SCL is held low for tTIMEOUT. Note 9: After this period, the first clock pulse is generated. Note 10: A device must internally provide a hold time of at least 300ns for the SDA signal (referenced to the VIHMIN of the SCL signal) to bridge the undefined region of the falling edge of SCL. Note 11: The maximum tHD:DAT has only to be met if the device does not stretch the low period (tLOW) of the SCL signal. Note 12: A fast-mode device can be used in a standard-mode system, but the requirement tSU:DAT R to 250ns must then be met. This is automatically the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must output the next data bit to the SDA line tRMAX + tSU:DAT = 1000 + 250 = 1250ns before the SCL line is released. Note 13: CB is the total capacitance of one bus line, including all connected devices, in pF. Note 14: The parameter tOSF is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage range of 2.4V P VCC P VCCMAX. Note 15: The DS1308 can detect any single SCL clock held low longer than tTIMEOUTMIN. The device’s I2C interface is in reset state and can receive a new START condition when SCL is held low for at least tTIMEOUTMAX. Once the part detects this condition the SDA output is released. The oscillator must be running for this function to work. Note 16: Guaranteed by design and not 100% production tested. www.maximintegrated.com Maxim Integrated │  4 Low-Current I2C RTC with 56-Byte NV RAM DS1308 SDA tBUF tF tLOW tSP tHD:STA SCL tHD:STA tHIGH tR tHD:DAT STOP tSU:STA tSU:STO tSU:DAT START REPEATED START NOTE: TIMING IS REFERENCED TO VILMAX AND VIHMIN. Figure 1. Data Transfer on I2C Serial Bus VCC VPF tREC tVCCF tVCCR SCL RECOGNIZED DON’T CARE RECOGNIZED SDA VALID HIGH IMPEDANCE VALID Figure 2. Power-Up/Power-Down Timing www.maximintegrated.com Maxim Integrated │  5 Low-Current I2C RTC with 56-Byte NV RAM DS1308 Typical Operating Characteristics (VCC = +3.3V, TA = +25NC, unless otherwise specified.) +85°C 120 110 +25°C 90 -40°C 80 +85°C 300 250 200 +25°C 3.5 4.0 4.5 5.0 5.5 3.5 4.5 DS1308 toc03 -40°C 2.5 BATTERY VOLTAGE (V) DS1308 toc04 TA = +25°C, OUT = ECLK = SQWE = 0 3.5 4.5 5.5 BATTERY VOLTAGE (V) POWER-SUPPLY CURRENT vs. SCL FREQUENCY 0.3 VCC = 1.3V 0.2 VCC = 3.0V VCC = 5.0V 200 POWER-SUPPLY CURRENT (µA) OUTPUT VOLTAGE (V) +25°C 400 1.5 5.5 SQW/CLKIN OUTPUT-VOLTAGE LOW vs. OUTPUT CURRENT 0.1 500 200 2.5 1.5 SUPPLY VOLTAGE (V) 0.4 +85°C 600 300 100 3.0 700 -40°C 150 70 RS1 = RS0 = SQWE = 1, IOUT = 0mA 800 DS1308 toc05 100 SQWE = 0, IOUT = 0mA 350 BATTERY CURRENT (nA) SUPPLY CURRENT (µA) 130 BATTERY CURRENT (SQW ON) vs. BATTERY VOLTAGE BATTERY CURRENT (nA) SQWE = 1, IOUT = 0mA 140 400 DS1308 toc01 150 BATTERY CURRENT (SQW OFF) vs. BATTERY VOLTAGE DS1308 toc02 SUPPLY CURRENT vs. SUPPLY VOLTAGE TA = +25°C, IOUT = 0mA 150 5.0V 100 3.0V 50 0 0 1 2 3 OUTPUT CURRENT (mA) www.maximintegrated.com 4 0 100 200 300 400 SCL FREQUENCY (kHz) Maxim Integrated │  6 Low-Current I2C RTC with 56-Byte NV RAM DS1308 Pin Configuration TOP VIEW X1 1 X2 2 VBAT 3 GND 4 + 8 DS1308 VCC 7 SQW/CLKIN 6 SCL 5 SDA µSOP Pin Description PIN NAME 1 X1 2 X2 FUNCTION 32.768kHz Crystal Connections. The internal oscillator circuitry is designed for use with a crystal having a specified load capacitance (CL) of 6pF. Note: For more information about crystal selection and crystal layout considerations, refer to Application Note 58: Crystal Considerations with Maxim Real-Time Clocks (RTCs). 3 VBAT Battery Supply Input for Lithium Cell or Other Energy Source. Battery voltage must be held between the minimum and maximum limits for proper operation. Diodes placed in series between the backup source and the VBAT pin can prevent proper operation. If a backup supply is not required, VBAT must be grounded. UL recognized to ensure against reverse charging when used with a lithium cell. 4 GND Ground 5 SDA Serial Data Input/Output for the I2C serial interface. It is an open-drain output and requires an external pullup resistor. The pullup voltage can be up to 5.5V, regardless of the voltage on VCC. 6 SCL Serial Clock Input for the I2C serial interface. Used to synchronize data movement on the serial interface. The pullup voltage can be up to 5.5V, regardless of the voltage on VCC. 7 8 Square-Wave Output/Clock Input. This I/O pin is used to output one of four square-wave frequencies (1Hz, 4kHz, 8kHz, 32kHz) or accept an external clock input to drive the RTC counter. SQW/CLKIN In the output mode (ECLK = 0), it is open drain and requires an external pullup resistor. The square-wave operates on VCC, or on VBAT with BBCLK = 1. The pullup voltage can be up to 5.5V, regardless of the voltage on VCC. If not used, this pin may be left unconnected. VCC www.maximintegrated.com Primary Power Supply. Decouple the power supply with a 0.1FF capacitor to ground. Maxim Integrated │  7 Low-Current I2C RTC with 56-Byte NV RAM DS1308 Functional Diagram 32.768kHz 8.192kHz 4.096kHz X1 /4 /2 /32 128Hz EXTSYNC OSC-1Hz MUX/ BUFFER EXT-1Hz DIVIDER X2 SQW/CLKIN N VCC POWER CONTROL VBAT SCL SDA N CONTROL LOGIC SERIAL BUS INTERFACE AND ADDRESS REGISTER RAM OSC-1Hz Detailed Description The DS1308 serial RTC is a low-power, full BCD clock/ calendar plus 56 bytes of NV SRAM. Address and data are transferred serially through an I2C interface. The clock/calendar provides seconds, minutes, hours, day, date, month, and year information. The end of the month date is automatically adjusted for months with fewer than 31 days, including corrections for leap year. The clock operates in either the 24-hour or 12-hour format with an AM/PM indicator. The DS1308 has a built-in power-sense circuit that detects power failures and automatically switches to the VBAT supply. Operation The DS1308 operates as a slave device on the serial bus. Access is obtained by implementing a START condition and providing a device identification code, followed by data. Subsequent registers can be accessed sequentially until a STOP condition is executed. The device is fully accessible and data can be written and read when VCC is greater than VPF. However, when VCC falls below www.maximintegrated.com CLOCK AND CALENDAR REGISTERS DS1308 VPF, the internal clock registers are blocked from any access. If VBAT is greater than VCC, the device power is switched from VCC to VBAT when VCC drops below VPF. If VBAT is less than VPF, the device power is switched from VCC to VBAT when VCC drops below VBAT. The oscillator and timekeeping functions are maintained from the VBAT source until VCC returns above VPF, read and write access is allowed after tREC. The Functional Diagram shows the main elements of the DS1308. An enable bit in the seconds register (CH) controls the oscillator. Oscillator startup times are highly dependent upon crystal characteristics, PCB leakage, and layout. High ESR and excessive capacitive loads are the major contributors to long startup times. A circuit using a crystal with the recommended characteristics and proper layout usually starts within 1 second. On the first application of power to the device, the time and date registers are reset to 01/01/00 01 00:00:00 (DD/ MM/YY DOW HH:MM:SS), and CH bit in the seconds register is set to 0. Maxim Integrated │  8 Low-Current I2C RTC with 56-Byte NV RAM DS1308 Freshness Seal Mode Clock Accuracy When a battery is first attached to the device, the device does not immediately provide battery-backup power to the RTC or internal circuitry. After VCC exceeds VPF, the devices leave the freshness seal mode and provide battery-backup power whenever VCC subsequently falls below VBAT. This mode allows attachment of the battery during product manufacturing, but no battery capacity is consumed until after the system has been activated for the first time. As a result, minimum battery energy is used during storage and shipping. The accuracy of the clock is dependent upon the accuracy of the crystal and the accuracy of the match between the capacitive load of the oscillator circuit and the capacitive load for which the crystal was trimmed. Crystal frequency drift caused by temperature shifts creates additional error. External circuit noise coupled into the oscillator circuit can result in the clock running fast. Figure 3 shows a typical PCB layout for isolating the crystal and oscillator from noise. Refer to Application Note 58: Crystal Considerations with Maxim Real-Time Clocks (RTCs) for detailed information. Oscillator Circuit The DS1308 uses an external 6pF 32.768kHz crystal. The oscillator circuit does not require any external resistors or capacitors to operate. See Table 2 for the external crystal parameters. The Functional Diagram shows a simplified schematic of the oscillator circuit. The startup time is usually less than 1 second when using a crystal with the specified characteristics. LOCAL GROUND PLANE (LAYER 2) X1 CRYSTAL X2 Whenever VCC > VPF, a 5Fs glitch filter at the output of the crystal oscillator is enabled. Table 1. Power Control GND SUPPLY CONDITION READ/WRITE ACCESS POWERED BY VCC < VPF, VCC < VBAT No VBAT VCC < VPF, VCC > VBAT No VCC VCC > VPF, VCC < VBAT VCC > VPF, VCC > VBAT Yes VCC Yes VCC NOTE: AVOID ROUTING SIGNALS IN THE CROSSHATCHED AREA (UPPER LEFT-HAND QUADRANT) OF THE PACKAGE UNLESS THERE IS A GROUND PLANE BETWEEN THE SIGNAL LINE AND THE PACKAGE. Figure 3. Typical PCB Layout for Crystal Table 2. Crystal Specifications PARAMETER Nominal Frequency SYMBOL fO Series Resistance ESR Load Capacitance CL MIN TYP MAX 32.768 kHz 100 6 UNITS kI pF Note: The crystal, traces, and crystal input pins should be isolated from RF generating signals. Refer to Application Note 58: Crystal Considerations for Maxim Real-Time Clocks (RTCs) for additional specifications. www.maximintegrated.com Maxim Integrated │  9 Low-Current I2C RTC with 56-Byte NV RAM DS1308 RTC and RAM Address Map Table 3 shows the address map for the RTC and RAM registers. The RTC registers and control register are located in address locations 00h–07h. The RAM registers are located in address locations 08h–3Fh. During a multibyte access, when the register pointer reaches 3Fh (the end of RAM space) it wraps around to location 00h (the beginning of the clock space). On an I2C START, or register pointer incrementing to location 00h, the current time and date is transferred to a second set of registers. The time and date in the secondary registers are read in a multibyte data transfer, while the clock continues to run. This eliminates the need to re-read the registers in case of an update of the main registers during a read. Clock and Calendar The time and calendar information is obtained by reading the appropriate register bytes. The time and calendar are set or initialized by writing the appropriate register bytes. The contents of the time and calendar registers are in the BCD format. Bit 7 of Register 0 is the clock halt (CH) bit. When this bit is set to 1, the oscillator is disabled. When cleared to 0, the oscillator is enabled. The clock can be halted whenever the timekeeping functions are not required, which minimizes VBAT current (IBATDAT) when VCC is not applied. The day-of-week register increments at midnight. Values that correspond to the day of week are user-defined but must be sequential (i.e., if 1 equals Sunday, then 2 equals Monday, and so on). Illogical time and date entries result in undefined operation. When reading or writing the time and date registers, secondary (user) buffers are used to prevent errors when the internal registers update. When reading the time and date registers, the user buffers are synchronized to the internal registers on any START and when the register pointer rolls over to zero. The countdown chain is reset whenever the seconds register is written. Write transfers occur on the acknowledge from the DS1308. Once the countdown chain is reset, to avoid rollover issues the remaining time and date registers must be written within 1 second. The 1Hz square-wave output, if enabled, transitions high 500ms after the seconds data transfer, provided the oscillator is already running. The DS1308 runs in either 12-hour or 24-hour mode. Bit 6 of the hours register is defined as the 12-hour or 24-hour mode-select bit. When high, the 12-hour mode is selected. In the 12-hour mode, bit 5 is the AM/PM bit, with logic high being PM. In the 24-hour mode, bit 5 is the 20-hour bit (20–23 hours). If the 12/24-hour mode select is changed, the hours register must be re-initialized to the new format. Table 3. RTC and RAM Address Map ADDRESS BIT 7 FUNCTION RANGE 00h CH BIT 6 10 Seconds Seconds Seconds 00–59 01h 0 10 Minutes Minutes Minutes 00–59 Hours 1–12 + AM/ PM 00–23 Day 1–7 Date Date 01–31 Month Month 01–12 Year Year 00–99 02h 0 12/24 03h 0 0 04h 0 0 05h 0 0 06h 07h BIT 5 AM/PM 20 Hour BIT 4 BIT 3 10 Hour 0 0 0 10 Month 10 Year OUT ECLK OSF 08h–3Fh SQWE BIT 1 BIT 0 Hour 10 Date 0 BIT 2 LOS Day BBCLK RS1 RS0 Control RAM 56 x 8 00h–FFh Note: Bits listed as “0” always read as a 0. www.maximintegrated.com Maxim Integrated │  10 Low-Current I2C RTC with 56-Byte NV RAM DS1308 Control Register (07h) The control register controls the operation of the SQW/CLKIN pin and provides oscillator status. Bit # BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Name OUT ECLK OSF SQWE LOS BBCLK RS1 RS0 1 0 1 1 1 1 1 1 POR Bit 7: Output Control (OUT). Controls the output level of the SQW/CLKIN pin when the square-wave output is disabled and VCC>VPF. If SQWE = 0, the logic level on the SQW/CLKIN pin is 1 if OUT = 1; it is 0 if OUT = 0. See Table 4. Bit 6: Enable Clock Input (ECLK). This bit controls the direction of the SQW/CLKIN pin (see Table 4). When ECLK =  1, the SQW/CLKIN pin is an input, with the expected input rate defined by the states of RS1 and RS0. When ECLK = 0, the SQW/CLKIN pin is an output, with the square-wave frequency defined by the states of RS1 and RS0. Bit 5: Oscillator Stop Flag (OSF). A logic 1 in this bit indicates that the oscillator has stopped or was stopped for some time period and can be used to judge the validity of the clock and calendar data. This bit is edge triggered, and is set to logic 1 when the internal circuitry senses the oscillator has transitioned from a normal run state to a STOP condition. The following are examples of conditions that may cause the OSF bit to be set: The first time power is applied. The voltage present on VCC and VBAT are insufficient to support oscillation. The CH bit is set to 1, disabling the oscillator. External influences on the crystal (i.e., noise, leakage, etc.). This bit remains at logic 1 until written to logic 0. This bit can only be written to logic 0. Attempting to write OSF to logic 1 leaves the value unchanged. Bit 4: Square-Wave Enable (SQWE). When set to logic 1, this bit enables the oscillator output to operate with either VCC or VBAT applied. The frequency of the square-wave output depends upon the value of the RS0 and RS1 bits. Bit 3: Loss of Signal (LOS). This status bit indicates the state of the CLKIN pin. The LOS bit is set to 1 when the RTC counter is no longer conditioned by the external clock. This occurs when 1) ECLK = 0, or 2) when the CLKIN input signal stops toggling, or 3) when the CLKIN frequency differs by more than Q0.8% from the selected input frequency. This bit remains a 1 until written to 0. Attempting to write LOS = 1 leaves the value unchanged. Clearing the LOS flag when the CLKIN frequency is invalid inhibits subsequent detections of the input frequency deviation. Bit 2: Battery Backup Clock (BBCLK). When set to logic 1, this bit enables the SQW/CLKIN I/O while the part is powered by VBAT. When set to logic 0, this bit disables the SQW/CLKIN I/O while the part is powered by VBAT. Bits 1 and 0: Rate Select (RS1 and RS0). These bits control the frequency of the SQW/CLKIN output when the squarewave has been enabled (SQWE = 1). Table 4 lists the square-wave frequencies that can be selected with the RS bits. Table 4. SQW/CLKIN Pin Functions OUT X X X X 0 1 X X X X ECLK 0 0 0 0 0 0 1 1 1 1 SQWE 1 1 1 1 0 0 X X X X RS1 0 0 1 1 X X 0 0 1 1 RS0 0 1 0 1 X X 0 1 0 1 SQW/CLKIN 1Hz output 4.096kHz output 8.192kHz output 32.768kHz output 0 1 1Hz input 50Hz input 60Hz input 32.768kHz input X = Don’t care. www.maximintegrated.com Maxim Integrated │  11 Low-Current I2C RTC with 56-Byte NV RAM DS1308 External Synchronization When an external clock reference is used, the input from SQW/CLKIN is divided down to 1Hz. The 1Hz from the divider (Ext-1Hz, see Functional Diagram) is used to correct the 1Hz that is derived from the 32.768kHz oscillator (Osc-1Hz). As Osc-1Hz drifts in relation to Ext-1Hz, Osc-1Hz is digitally adjusted. As shown in the Functional Diagram, the three highest frequencies driving the SQW/CLKIN pin are derived from the uncorrected oscillator, while the 1Hz output is derived from the adjusted Osc-1Hz signal. Conceptually, the circuit can be thought of as two 1Hz signals, one derived from the internal oscillator and the other from the external reference clock, with the oscillator-derived 1Hz signal being locked to the 1Hz signal derived from the external reference clock. The edges of the 1Hz signals do not need to be aligned with each other. While the external clock source is present and within tolerance, the Ext-1Hz and Osc-1Hz maintain their existing lock, regardless of their edge alignment, with periodic correction of the Osc‑1Hz signal. If the external signal is lost and then regained sometime later, the signals re-lock with whatever new alignment exists (Figure 4). The Ext-1Hz is used by the device as long as it is within tolerance, which is about 0.8% of Osc-1Hz. While Ext-1Hz is within tolerance, the skew between the two signals may shift until a change of about 7.8ms accumulates, after which Osc-1Hz signal is adjusted (Figure 5). The adjustment is accomplished by digitally adjusting the 32kHz oscillator divider chain. OSC-1Hz FROM OSCILLATOR SKEW SKEW EXT-1Hz FROM EXTERNAL REFERENCE BREAK IN EXTERNAL REFERENCE SIGNAL Figure 4. Loss and Reacquisition of External Reference Clock OSC-1Hz FROM OSCILLATOR CURRENT LOCK DRIFT AFTER N CYCLES SHIFTED BACK TO CURRENT LOCK EXT-1Hz FROM EXTERNAL REFERENCE Figure 5. Drift Adjustment of Internal 1Hz to External Reference Clock www.maximintegrated.com Maxim Integrated │  12 Low-Current I2C RTC with 56-Byte NV RAM DS1308 If the difference between Ext-1Hz and Osc-1Hz is greater than about 0.8%, Osc-1Hz runs unadjusted (see Figure 4) and the loss of signal (LOS) is set, provided the enable external clock input bit (ECLK) is set. transfer to indicate that it immediately initiates a new data transfer following the current one. Repeated STARTs are commonly used during read operations to identify a specific memory address to begin a data transfer. A repeated START condition is issued identically to a normal START condition. See Figure 1 for applicable timing. I2C Serial Port Operation I2C Slave Address The DS1308’s slave address byte is D0h. The first byte sent to the device includes the device identifier and the R/W bit (Figure 6). The device address sent by the I2C master must match the address assigned to the device. LSB MSB 1 1 0 1 DEVICE IDENTIFIER 0 0 0 Bit Write: Transitions of SDA must occur during the low state of SCL. The data on SDA must remain valid and unchanged during the entire high pulse of SCL plus the setup and hold time requirements (Figure 1). Data is shifted into the device during the rising edge of the SCL. Bit Read: At the end a write operation, the master must release the SDA bus line for the proper amount of setup time before the next rising edge of SCL during a bit read (Figure 1). The device shifts out each bit of data on SDA at the falling edge of the previous SCL pulse and the data bit is valid at the rising edge of the current SCL pulse. Remember that the master generates all SCL clock pulses including when it is reading bits from the slave. Acknowledge (ACK and NACK): An acknowledge (ACK) or not-acknowledge (NACK) is always the 9th bit transmitted during a byte transfer. The device receiving data (the master during a read or the slave during a write operation) performs an ACK by transmitting a zero during the 9th bit. A device performs a NACK by transmitting a one during the 9th bit. Timing for the ACK and NACK is identical to all other bit writes. An ACK is the acknowledgment that the device is properly receiving data. A NACK is used to terminate a read sequence or as an indication that the device is not receiving data. Byte Write: A byte write consists of 8 bits of information transferred from the master to the slave (most significant bit first) plus a 1-bit acknowledgment from the slave to the master. The 8 bits transmitted by the master are done according to the bit write definition and the acknowledgment is read using the bit read definition. Byte Read: A byte read is an 8-bit information transfer from the slave to the master plus a 1-bit ACK or NACK from the master to the slave. The 8 bits of information that are transferred (most significant bit first) from the slave to the master are read by the master using the bit read definition, and the master transmits an ACK using the bit write definition to receive additional data R/W READ/ WRITE BIT Figure 6. Slave Address Byte I2C Definitions The following terminology is commonly used to describe I2C data transfers. Master Device: The master device controls the slave devices on the bus. The master device generates SCL clock pulses and START and STOP conditions. Slave Devices: Slave devices send and receive data at the master’s request. Bus Idle or Not Busy: Time between STOP and START conditions when both SDA and SCL are inactive and in their logic-high states. When the bus is idle it often initiates a low-power mode for slave devices. START Condition: A START condition is generated by the master to initiate a new data transfer with a slave. Transitioning SDA from high to low while SCL remains high generates a START condition. See Figure 1 for applicable timing. STOP Condition: A STOP condition is generated by the master to end a data transfer with a slave. Transitioning SDA from low to high while SCL remains high generates a STOP condition. See Figure 1 for applicable timing. Repeated START Condition: The master can use a repeated START condition at the end of one data www.maximintegrated.com Maxim Integrated │  13 Low-Current I2C RTC with 56-Byte NV RAM DS1308 I2C Communication bytes. The master must NACK the last byte read to terminate communication so the slave returns control of SDA to the master. Slave Address Byte: Each slave on the I2C bus responds to a slave address byte sent immediately following a START condition. The slave address byte contains the slave address in the most significant 7 bits and the R/W bit in the least significant bit. The slave address is D0h and cannot be modified by the user. When the R/W bit is 0 (such as in D0h), the master is indicating it writes data to the slave. If R/W = 1, (D1h in this case), the master is indicating it wants to read from the slave. If an incorrect slave address is written, the DS1308 assumes the master is communicating with another I2C device and ignores the communication until the next START condition is sent. Writing a Single Byte to a Slave: The master must generate a START condition, write the slave address byte (R/W = 0), write the memory address, write the byte of data, and generate a STOP condition. Remember the master must read the slave’s acknowledgment during all byte write operations. Writing Multiple Bytes to a Slave: To write multiple bytes to a slave, the master generates a START condition, writes the slave address byte (R/W = 0), writes the starting memory address, writes multiple data bytes, and generates a STOP condition. Reading a Single Byte from a Slave: Unlike the write operation that uses the specified memory address byte to define where the data is to be written, the read operation occurs at the present value of the memory address counter. To read a single byte from the slave, the master generates a START condition, writes the slave address byte with R/W  = 1, reads the data byte with a NACK to indicate the end of the transfer, and generates a STOP condition. However, since requiring the master to keep track of the memory address counter is Memory Address: During an I2C write operation, the master must transmit a memory address to identify the memory location where the slave is to store the data. The memory address is always the second byte transmitted during a write operation following the slave address byte. TYPICAL I2C WRITE TRANSACTION MSB START 1 LSB 1 0 1 0 0 0 R/W MSB SLAVE ACK b7 LSB b6 READ/ WRITE SLAVE ADDRESS b5 b4 b3 b2 b1 b0 MSB SLAVE ACK b7 LSB b6 b5 b4 REGISTER ADDRESS b3 b2 b1 b0 SLAVE ACK STOP DATA EXAMPLE I2C TRANSACTIONS D0h A) SINGLE BYTE WRITE -WRITE CONTROL REGISTER TO BFh START 11010000 07h SLAVE 00000111 ACK BFh SLAVE 10111111 ACK D0h B) SINGLE BYTE READ -READ CONTROL REGISTER 07h SLAVE SLAVE START 1 1 0 1 0 0 0 0 00000111 ACK ACK D0h C) MULTIBYTE WRITE -WRITE DATE REGISTER TO "02" AND MONTH REGISTER TO "11" D) MULTIBYTE READ -READ HOURS AND DAY REGISTER VALUES START 1 1 0 1 0 0 0 0 04h SLAVE ACK 00000100 SLAVE ACK 00000010 D0h START 1 1 0 1 0 0 0 0 SLAVE ACK STOP D1h REPEATED START DATA SLAVE 11010001 ACK 00000010 SLAVE ACK REPEATED START SLAVE ACK 00010001 SLAVE ACK SLAVE ACK VALUE D1h 02h MASTER NACK STOP 11h 02h SLAVE ACK VALUE 11010001 STOP DATA DATA MASTER ACK VALUE MASTER NACK STOP Figure 7. I2C Transactions www.maximintegrated.com Maxim Integrated │  14 DS1308 Low-Current I2C RTC with 56-Byte NV RAM impractical, the following method should be used to perform reads from a specified memory location. Manipulating the Address Counter for Reads: A dummy write cycle can be used to force the address counter to a particular value. To do this the master generates a START condition, writes the slave address byte (R/W = 0), writes the memory address where it desires to read, generates a repeated START condition, writes the slave address byte (R/W = 1), reads data with ACK or NACK as applicable, and generates a STOP condition. See Figure 7 for a read example using the repeated START condition to specify the starting memory location. Reading Multiple Bytes From a Slave: The read operation can be used to read multiple bytes with a single transfer. When reading bytes from the slave, the master simply ACKs the data byte if it desires to read another byte before terminating the transaction. After the master reads the last byte it must NACK to indicate the end of the transfer and then it generates a STOP condition. Bus Timeout To avoid an unintended I2C interface timeout, SCL should not be held low longer than tTIMEOUTMIN. The I2C interface is in the reset state and can receive a new START condition when SCL is held low for at least tTIMEOUTMAX. When the part detects this condition, SDA is released and allowed to float. For the timeout function to work, the oscillator must be enabled and running. Applications Information Power-Supply Decoupling To achieve the best results when using the DS1308, decouple the VCC power supply with a 0.01FF and/or 0.1FF capacitor. Use a high-quality, ceramic, surfacemount capacitor if possible. Surface-mount components minimize lead inductance, which improves performance, and ceramic capacitors tend to have adequate highfrequency response for decoupling applications. Using Open-Drain Outputs The SQW/CLKIN output is open drain and therefore requires an external pullup resistor to realize a logic-high output level. SDA and SCL Pullup Resistors Because the DS1308 does not use clock cycle stretching, a master using either an open-drain output with a pullup resistor or CMOS output driver (push-pull) could be used for SCL. Battery Charge Protection The DS1308 contains Maxim’s redundant battery-charge protection circuit to prevent any charging of an external battery. The DS1308 is recognized by Underwriters Laboratories (UL) under file E141114. Handling, PCB Layout, and Assembly Avoid running signal traces under the package, unless a ground plane is placed between the package and the signal line. The lead(Pb)-free/RoHS package can be soldered using a reflow profile that complies with JEDEC J-STD-020. Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for moisture-sensitive device (MSD) classifications. Chip Information PROCESS: CMOS SUBSTRATE CONNECTED TO GROUND Ordering Information PART TEMP RANGE PIN-PACKAGE DS1308U-18+ -40NC to +85NC 8 FSOP DS1308U-3+* -40NC to +85NC 8 FSOP DS1308U-33+ -40NC to +85NC 8 FSOP +Denotes a lead(Pb)-free/RoHS-compliant package. *Future product—contact factory for availability. Package Information For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 8 µSOP U8+1 21-0036 90-0092 SDA is an open-drain output and requires an external pullup resistor to realize a logic-high output level. www.maximintegrated.com Maxim Integrated │  15 Low-Current I2C RTC with 56-Byte NV RAM DS1308 Revision History REVISION NUMBER REVISION DATE 0 5/12 Initial release 1 4/13 Added -18 ordering variant and UL certification number 2 7/14 Added missing specs for 3.0V version 2 3 4/15 Revised Benefits and Features section 1 DESCRIPTION PAGES CHANGED — 2, 15 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com. Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. ©  2015 Maxim Integrated Products, Inc. │  16