50 dB, Logarithmic Detector,
1 GHz to 23 GHz
HMC1094
Data Sheet
DET
DET
12 VTEMP
11 LOGOUT
DET
GND 3
10 RSV
RSV 4
9
NC 8
GND 7
RSV 5
HMC1094
GND 6
Point-to-point microwave radio
VSAT
Wideband power monitoring
Receiver signal strength indication (RSSI)
Test and measurement
RSV
PACKAGE
BASE
GND
12810-001
RFIN 2
13 VCC
BIAS AND
CONTROL CIRCUIT
GND 1
APPLICATIONS
14 VCC
Wide input bandwidth: 1 to 23 GHz
Wide dynamic range: 50 dB up to 23 GHz
Single positive supply: 3.3 V
Excellent stability over temperature
Fast rise/fall time: 12 ns/65 ns
16-lead 3 mm × 3 mm SMT package: 9 mm²
15 VCC
FUNCTIONAL BLOCK DIAGRAM
16 VCC
FEATURES
Figure 1.
GENERAL DESCRIPTION
The HMC1094 logarithmic detector converts RF signals at its
input to a proportional dc voltage at its output. The HMC1094
employs successive compression topology that delivers high
dynamic range over a wide input frequency range.
As the input power is increased, successive amplifiers move into
saturation one by one, creating an approximation of the logarithm
function. The output of a series of detectors is summed, con-
Rev. A
verted into the voltage domain, and buffered to drive the
LOGOUT output.
The HMC1094 provides a nominal logarithmic slope of 18 mV/dB
and an intercept of −113 dBm at 23 GHz. Ideal as a log detector
for high volume microwave radio and VSAT applications, the
HMC1094 is housed in a compact 3 mm ×3 mm RoHS
compliant SMT plastic package.
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rights of third parties that may result from its use. Specifications subject to change without notice. No
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Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2013–2014 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
HMC1094
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Interface Schematics..........................................................................7
Applications ....................................................................................... 1
Typical Performance Characteristics ..............................................8
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Application and Evaluation Printed Circuit Board (PCB)
Schematic ......................................................................................... 11
Revision History ............................................................................... 2
Evaluation PCB ............................................................................... 12
Specifications..................................................................................... 3
Bill of Materials for Evaluation PCB ........................................ 12
Absolute Maximum Ratings ....................................................... 5
Packaging and Ordering Information ......................................... 13
ESD Caution .................................................................................. 5
Outline Dimensions ................................................................... 13
Pin Configuration and Function Descriptions ............................. 6
Ordering Guide .......................................................................... 14
REVISION HISTORY
11/14—Rev. 00.0813 to Rev. A
This Hittite Microwave Products data sheet has been reformatted
to meet the styles and standards of Analog Devices, Inc.
Updated Format .................................................................. Universal
Changes to Ordering Guide .......................................................... 14
Rev. A | Page 2 of 14
Data Sheet
HMC1094
SPECIFICATIONS
VCC = 3.3 V, TA = 25°C, unless otherwise noted.
Table 1.
Parameter
OVERALL FUNCTION
Input Frequency Range 1
RF INPUT INTERFACE
Nominal Input Impedance
OUTPUT INTERFACE
Output Voltage Range
Rise Time
Fall Time
fIN = 1 GHz
±3 dB Dynamic Range
±3 dB Dynamic Range Center
Deviation vs. Temperature
Logarithmic Slope
Logarithmic Intercept
fIN = 5 GHz
±3 dB Dynamic Range
±3 dB Dynamic Range Center
Deviation vs. Temperature
Logarithmic Slope
Logarithmic Intercept
fIN = 10 GHz
±3 dB Dynamic Range
±3 dB Dynamic Range Center
Deviation vs. Temperature
Logarithmic Slope
Logarithmic Intercept
fIN = 14 GHz
±3 dB Dynamic Range
±3 dB Dynamic Range Center
Deviation vs. Temperature
Logarithmic Slope
Logarithmic Intercept
fIN = 16 GHz
±3 dB Dynamic Range
±3 dB Dynamic Range Center
Deviation vs. Temperature
Logarithmic Slope
Logarithmic Intercept
Test Conditions/Comments
Min
Typ
1
Max
Unit
23
GHz
PIN = RFIN
50
1
f = 10 GHz, PIN = off to 0 dBm, 10% to 90%
f = 10 GHz, PIN = off to 0 dBm, 10% to 90%
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
Rev. A | Page 3 of 14
Ω
12
65
2.1
V
ns
ns
48
−20
±0.8
dB
dBm
dB
20
−96
mV/dB
dBm
48
−22
±0.7
dB
dBm
dB
21
−97
mV/dB
dBm
48
−23
±0.5
dB
dBm
dB
20
−100
mV/dB
dBm
50
−24
±1
dB
dBm
dB
19
−105
mV/dB
dBm
54
−25
±0.7
dB
dBm
dB
19
−108
mV/dB
dBm
HMC1094
Parameter
fIN = 18 GHz
±3 dB Dynamic Range
±3 dB Dynamic Range Center
Deviation vs. Temperature
Logarithmic Slope
Logarithmic Intercept
fIN = 20 GHz
±3 dB Dynamic Range
±3 dB Dynamic Range Center
Deviation vs. Temperature
Logarithmic Slope
Logarithmic Intercept
fIN = 23 GHz
±3 dB Dynamic Range
±3 dB Dynamic Range Center
Deviation vs. Temperature
Logarithmic Slope
Logarithmic Intercept
POWER SUPPLY INTERFACE
Supply Voltage
Supply Current
1
Data Sheet
Test Conditions/Comments
Min
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
Deviation from calculated ideal output at 25°C,
−40°C < TA < +85°C
Calibration at −38 dBm and −2 dBm
Calibration at −38 dBm and −2 dBm (x-intercept)
3.15
70
Video output load should be 1 kΩ or higher.
Rev. A | Page 4 of 14
Typ
Max
Unit
54
−26
±0.7
dB
dBm
dB
18
−111
mV/dB
dBm
55
−27
±0.8
dB
dBm
dB
18
−113
mV/dB
dBm
57
−24
±1.1
dB
dBm
dB
18
−113
mV/dB
dBm
3.30
85
3.45
95
V
mA
Data Sheet
HMC1094
ABSOLUTE MAXIMUM RATINGS
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Table 2.
Parameter
Supply Voltage, VCC
RF Input Power, RFIN
RF DC Level
Maximum Junction Temperature (TJ)
Continuous Power Dissipation (PDISS) at TA =
85°C (Derate 65.4 mW/°C Above 85°C)
Thermal Resistance (RTH) (Junction to
Ground Paddle)
Storage Temperature
Operating Temperature
ESD Sensitivity Level (HBM)
Rating
3.6 V
13 dBm
1.1 V
125°C
2.62 W
ESD CAUTION
15.29°C/W
−65°C to +150°C
−40°C to +85°C
Class 1B
Rev. A | Page 5 of 14
HMC1094
Data Sheet
13 VCC
14 VCC
16 VCC
15 VCC
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
GND 1
12 VTEMP
RFIN 2
HMC1094
11 LOGOUT
GND 3
TOP VIEW
(Not to Scale)
10 RSV
9
RSV
NOTES
1. NO CONNECTION NECESSARY. THIS PIN
MAY BE CONNECTED TO RF/DC GROUND
WITHOUT AFFECTING PERFORMANCE.
2. EXPOSED PAD. CONNECT THE EXPOSED
PAD TO A HIGH QUALITY RF/DC GROUND.
12810-017
NC 8
GND 7
RSV 5
GND 6
RSV 4
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
1
2
Mnemonic
GND
RFIN
3
4
5
6
7
8
GND
RSV
RSV
GND
GND
NC
9
10
11
12
13
14
15
16
RSV
RSV
LOGOUT
VTEMP
VCC
VCC
VCC
VCC
EP
Description
Ground. This pin must be connected to a high quality RF/dc ground.
RF Input. The dc voltage level of the RF input should be 0 V. If the RF input has a dc level different than 0 V, use a
dc block capacitor.
Ground. This pin must be connected to a high quality RF/dc ground.
Reserved. This pin is reserved for internal use; leave this pin floating.
Reserved. This pin is reserved for internal use; leave this pin floating.
Ground. This pin must be connected to a high quality RF/dc ground.
Ground. This pin must be connected to a high quality RF/dc ground.
No Connect. No connection is necessary for this pin; this pin may be connected to RF/dc ground without
affecting performance.
Reserved. This pin is reserved for internal use; leave this pin floating.
Reserved. This pin is reserved for internal use; leave this pin floating.
Log Out. The log out load should be at least 1 kΩ or higher.
Temperature Sensor Output. This pin requires a minimum 10 kΩ resistance or higher.
Bias Supply. Connect a supply voltage to this pin with appropriate filtering.
Bias Supply. Connect a supply voltage to this pin with appropriate filtering.
Bias Supply. Connect a supply voltage to this pin with appropriate filtering.
Bias Supply. Connect a supply voltage to this pin with appropriate filtering.
Exposed Pad. Connect the exposed pad to a high quality RF/dc ground.
Rev. A | Page 6 of 14
Data Sheet
HMC1094
INTERFACE SCHEMATICS
VCC
GND
VTEMP
Figure 3. GND Interface
Figure 6. VTEMP Interface
RFIN
VCC
ESD
Figure 4. RFIN Interface
ESD
VCC
LOGOUT
Figure 7. VCC Interface
Figure 5. LOGOUT Interface
Rev. A | Page 7 of 14
HMC1094
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
2.25
3
2.00
2
2.00
2
1.75
1
1.75
1
1.50
0
1.50
0
1.25
–1
1.25
–1
–2
1.00
–40
–30
–20
–10
0
ERROR (dB)
–3
10
0.75
–60
INPUT POWER (dBm)
–30
–20
–10
–3
10
0
Figure 11. LOGOUT and Error vs. Input Power, fIN = 14 GHz
2.25
3
2.00
2
2.00
2
1.75
1
1.75
1
1.50
0
1.50
0
1.25
–1
1.25
–1
IDEAL
TA = +85°C
TA = +25°C
TA = –40°C
–50
–40
–30
–20
–10
0
–3
10
INPUT POWER (dBm)
0.75
–60
–50
–40
–30
–20
–10
0
–2
–3
10
INPUT POWER (dBm)
Figure 12. LOGOUT and Error vs. Input Power, fIN = 16 GHz
Figure 9. LOGOUT and Error vs. Input Power, fIN = 5 GHz
3
2.25
3
2.00
2
2.00
2
1.75
1
1.75
1
1.50
0
1.50
0
1.25
–1
1.25
–1
–2
1.00
0.75
–60
–50
–40
–30
–20
–10
0
–3
10
INPUT POWER (dBm)
ERROR (dB)
12810-004
IDEAL
TA = +85°C
TA = +25°C
TA = –40°C
1.00
LOGOUT (V)
2.25
0.75
–60
IDEAL
TA = +85°C
TA = +25°C
TA = –40°C
–50
–40
–30
–20
–10
0
–2
–3
10
INPUT POWER (dBm)
Figure 13. LOGOUT and Error vs. Input Power, fIN = 18 GHz
Figure 10. LOGOUT and Error vs. Input Power, fIN = 10 GHz
Rev. A | Page 8 of 14
ERROR (dB)
0.75
–60
IDEAL
TA = +85°C
TA = +25°C
TA = –40°C
1.00
–2
12810-003
1.00
ERROR (dB)
3
LOGOUT (V)
2.25
ERROR (dB)
LOGOUT (V)
–40
INPUT POWER (dBm)
Figure 8. LOGOUT and Error vs. Input Power, fIN = 1 GHz
LOGOUT (V)
–50
12810-005
–50
–2
12810-006
0.75
–60
IDEAL
TA = +85°C
TA = +25°C
TA = –40°C
12810-007
IDEAL
TA = +85°C
TA = +25°C
TA = –40°C
1.00
ERROR (dB)
3
LOGOUT (V)
2.25
12810-002
LOGOUT (V)
VCC = 3.3 V, TA = 25°C, unless otherwise noted.
HMC1094
3
2.25
2.00
2
2.00
1.75
1
1.75
1.50
0
1.25
–1
1.25
–2
1.00
0.75
–60
–50
–40
–30
–20
–10
0
ERROR (dB)
–3
10
INPUT POWER (dBm)
1.50
1GHz
5GHz
10GHz
14GHz
16GHz
18GHz
20GHz
23GHz
0.75
–60
–50
–30
–20
–10
0
Figure 16. LOGOUT vs. Frequency
2.1
3
2GHz
10GHz
18GHz
2.0
2.00
2
1.75
1
1.50
0
10
INPUT POWER (dBm)
Figure 14. LOGOUT and Error vs. Input Power, fIN = 20 GHz
2.25
–40
12810-010
IDEAL
TA = +85°C
TA = +25°C
TA = –40°C
1.00
LOGOUT (V)
2.25
12810-008
LOGOUT (V)
Data Sheet
1.9
1.25
LOGOUT (V)
ERROR (dB)
–1
1.7
1.6
1.5
1.4
1.3
0.75
–60
–50
–40
–30
–20
–10
0
1.2
–2
1.1
–3
10
INPUT POWER (dBm)
Figure 15. LOGOUT and Error vs. Input Power, fIN = 23 GHz
1.0
0
25
50
75
100
125
150
175
200
225
250
TIME (ns)
Figure 17. Fall Time for Various Frequencies at PIN = 0 dBm
Rev. A | Page 9 of 14
12810-011
IDEAL
TA = +85°C
TA = +25°C
TA = –40°C
1.00
12810-009
LOGOUT (V)
1.8
HMC1094
Data Sheet
2.0
1.4
1.3
1.8
VTEMP (V)
LOGOUT (V)
1.2
1.6
1.4
1.1
1.0
1.2
0
5
10
15
20
25
30
35
40
45
50
55
60
TIME (ns)
12810-012
1.0
Figure 18. Rise Time for Various Frequencies at PIN = 0 dBm
–10
–15
–20
TA = +85°C
TA = +25°C
TA = –40°C
5
10
15
20
25
FREQUENCY (GHz)
30
12810-013
RETURN LOSS (dB)
–5
0
25
TEMPERATURE (°C)
Figure 20. VTEMP vs. Temperature
0
–25
0.8
–45
Figure 19. Input Return Loss vs. Frequency
Rev. A | Page 10 of 14
95
12810-014
0.9
2GHz
10GHz
18GHz
Data Sheet
HMC1094
APPLICATION AND EVALUATION PRINTED CIRCUIT BOARD (PCB) SCHEMATIC
VCC
TP1
C1
4.7µF
GND 1
RFIN
J2
13 VCC
14 VCC
15 VCC
C3
10nF
16 VCC
C2
10nF
+
BIAS AND
CONTROL CIRCUIT
VTEMP
TP3
11 LOGOUT
RFIN 2
R7
0Ω
12 VTEMP
DET
DET
DET
10 RSV
GND 3
9
RSV 4
LOGOUT
J5
RSV
PACKAGE
BASE
GND
NOTES
1. LOG OUTPUT LOAD SHOULD BE 1kΩ OR HIGHER.
GND
TP2
12810-015
NC 8
GND 7
GND 6
RSV 5
HMC1094
Figure 21. Application and Evaluation PCB Schematic
Table 4.
Component
R7
C1
C2, C3
Description
Bypass resistor; used to make the RFIN line connection on the board
Power supply decoupling
Power supply decoupling
Rev. A | Page 11 of 14
Default Value
R7 = 0 Ω (Size 0402)
C1 = 4.7 μF (size tantalum)
C2 and C3 = 10 nF (Size 0402)
HMC1094
Data Sheet
EVALUATION PCB
TP1
VTEMP
TP2
GND
VCC
TP3
C1
C2
C3
R7
J2
RFIN
LOGOUT
J5
H1094
XXXX
600-00733-00-2
12810-016
U1
Figure 22. Evaluation PCB Layout, Top Side
BILL OF MATERIALS FOR EVALUATION PCB
Table 5. Bill of Materials
Item
J2
J5
TP1, TP2, TP3
C2, C3
C1
R7
U1
PCB 1
1
Description
K-type connector
SMA connector
DC pin
10 nF capacitor, 0402 package
4.7 µF tantalum capacitor
0 Ω resistor, 0402 package
HMC1094 log detector
600-00733-00 evaluation PCB
The circuit board used in the application uses RF circuit design
techniques. Signal lines should have 50 Ω impedance whereas
the package ground leads and exposed paddle should be
connected directly to the ground plane similar to that shown in
Figure 21. Use a sufficient number of via holes to connect the
top and bottom ground planes.
Circuit board material: Rogers 4350B or Arlon 25 FR.
Rev. A | Page 12 of 14
Data Sheet
HMC1094
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
BOT TOM VIEW
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA
AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.
3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
6. CHARACTERS TO BE HELVETICA MEDIUM, .018 HIGH, WHITE INK, OR LASER MARK
LOCATED APPROX. AS SHOWN.
7. PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.05mm.
8. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.
Figure 23. 16-Lead Quad Flat No-Lead Package [QFN]
3 mm × 3 mm Body, Very Thin Quad
Dimensions shown in inches and [millimeters]
Figure 24. Tape and Reel Outline Dimensions
Dimensions shown in millimeters
Rev. A | Page 13 of 14
11-03-2014-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
11-03-2014-A
TOP VIEW
HMC1094
Data Sheet
ORDERING GUIDE
Model 1
HMC1094LP3E
Temperature
Range
−40°C to +85°C
Lead Finish
100% matte Sn
MSL
Rating 2
MSL1
HMC1094LP3ETR
−40°C to +85°C
100% matte Sn
MSL1
EV1HMC1094LP3
Package Description
16-Lead Low Stress Injection
Molded Plastic
16-Lead Low Stress Injection
Molded Plastic, 7” Tape and Reel
Package
Option
Qty.
H1094
XXXX
QFN
500
HMC1094 Evaluation Board
E = RoHS Compliant Part.
Maximum peak reflow temperature of 260°C for HMC1094LP3E and HMC1094LP3ETR.
3
Four-digit lot number represented by XXXX.
1
2
©2013–2014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D12810-0-11/14(A)
www.analog.com/HMC1094
Rev. A | Page 14 of 14
Branding 3
H1094
XXXX
工商网监
湘ICP备2023018690号
