EV1HMC219BMS8G

2.5 GHz to 7.0 GHz GaAs, MMIC Fundamental Mixer HMC219B Data Sheet FUNCTIONAL BLOCK DIAGRAM Conversion loss: 9 dB typical LO to RF isolation: 40 dB typical LO to IF isolation: 35 dB typical RF to IF isolation: 22 dB typical Input IP3: 18 dBm typical Input P1dB: 11 dBm typical Input IP2: 55 dBm typical Passive double balanced topology 8-lead, 3 mm × 3 mm, MINI_SO_EP GND 1 HMC219B 8 GND LO 2 7 RF GND 3 6 GND NIC 4 5 IF 15452-001 FEATURES Figure 1. APPLICATIONS Microwave radios High performance radio local area network (HiperLAN) and unlicensed national information infrastructure (U-NII) Industrial, scientific, and medical (ISM) GENERAL DESCRIPTION The HMC219B is an ultraminiature, general-purpose, double balanced mixer in an 8-lead plastic surface mini small outline package with exposed pad (MINI_SO_EP). This passive monolithic microwave integrated circuit (MMIC) mixer is fabricated in a gallium arsenide (GaAs) metal semiconductor field effect transistor (MESFET) process and requires no external components or matching circuitry. The device can be used as an upconverter, downconverter, biphase demodulator, or phase comparator from 2.5 GHz to 7.0 GHz. Rev. A The HMC219B provides excellent local oscillator (LO) to radio frequency (RF) isolation and LO to intermediate frequency (IF) isolation due to optimized balun structures. The RoHS compliant HMC219B eliminates the need for wire bonding and is compatible with high volume surface-mount manufacturing techniques. The consistent MMIC performance improves system operation and assures regulatory compliance with HiperLAN, U-NII, and ISM. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibilityis assumedby Analog Devices for its use, nor for anyinfringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2017 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com HMC219B Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ..............................................6 Applications ....................................................................................... 1 Downconverter Performance ......................................................6 Functional Block Diagram .............................................................. 1 Upconverter Performance ......................................................... 18 General Description ......................................................................... 1 Spurious and Harmonics Performance ................................... 24 Revision History ............................................................................... 2 Theory of Operation ...................................................................... 25 Specifications..................................................................................... 3 Applications Information .............................................................. 26 Absolute Maximum Ratings ............................................................ 4 Typical Application Circuit ....................................................... 26 Thermal Resistance ...................................................................... 4 Evaluation PCB Information .................................................... 26 ESD Caution .................................................................................. 4 Outline Dimensions ....................................................................... 27 Pin Configuration and Function Descriptions ............................. 5 Ordering Guide .......................................................................... 27 Interface Schematics..................................................................... 5 REVISION HISTORY 10/2017—Rev. 0 to Rev. A Changes to Figure 16 ........................................................................ 7 Changes to M × N Spurious Outputs, IF = 100 MHz Section and M × N Spurious Outputs, IF = 1000 MHz Section ............ 24 1/2017—Revision 0: Initial Version Rev. A | Page 2 of 27 Data Sheet HMC219B SPECIFICATIONS TA = 25°C, IF = 100 MHz, LO power = 13 dBm, and all measurements performed as downconverter with lower sideband selected, unless otherwise noted. Table 1. Parameter FREQUENCY RANGE RF LO IF LO DRIVE LEVEL PERFORMANCE Conversion Loss Single-Sideband (SSB) Noise Figure Input Third-Order Intercept (IP3) Input Second-Order Intercept (IP2) LO to RF Isolation LO to IF Isolation RF to IF Isolation Input 1 dB Compression Point (P1dB) RF Return Loss LO Return Loss IF Return Loss Min Typ 2.5 2.5 DC Max Unit 7.0 7.0 3 GHz GHz GHz dBm 11 dB dB dBm dBm dB dB dB dBm dB dB dB 13 15 34 29 Rev. A | Page 3 of 27 9 8 18 55 40 35 22 11 10 25 12 HMC219B Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter RF Input Power LO Input Power IF Input Power IF Source and Sink Current Continuous Power Dissipation, PDISS (TA = 85°C, Derate 10.81 mW/°C Above 85°C) Maximum Junction Temperature Maximum Peak Reflow Temperature (MSL1)1 Operating Temperature Range Storage Temperature Range Electrostatic Discharge (ESD) Sensitivity Human Body Model (HBM) Field Induced Charged Device Model (FICDM) 1 Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. Rating 25 dBm 27dBm 25 dBm 6 mA 972 mW Table 3. Thermal Resistance Package Type RM-8 175°C 260°C −40°C to +85°C −65°C to +125°C 1 θJA 194.9 θJC 92.5 Unit °C/W See JEDEC standard JESD51-2 for additional information on optimizing the thermal impedance (PCB with 3 × 3 vias). ESD CAUTION 1500 V (Class 1C) 750 V (Class C4) See the Ordering Guide. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 4 of 27 Data Sheet HMC219B GND 1 LO 2 GND 3 NIC 4 HMC219B TOP VIEW (Not to Scale) 8 GND 7 RF 6 GND 5 IF NOTES 1. NIC = NOT INTERNALLY CONNECTED. LEAVE THIS PIN FLOATING. 2. EXPOSED PAD. EXPOSED PAD MUST BE CONNECTED TO RF/DC GROUND. 15452-002 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS Figure 2. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1, 3, 6, 8 2 4 5 Mnemonic GND LO NIC IF 7 RF Description Ground. Connect the package bottom to RF/dc ground. See Figure 3 for the GND interface schematic. Local Oscillator. This pin is dc-coupled and matched to 50 Ω. See Figure 4 for the LO interface schematic. Not Internally Connected. Leave this pin floating. Intermediate Frequency. This pin is dc-coupled. For applications not requiring operation to dc, externally block this pin using a series capacitor with a value chosen to pass the necessary IF frequency range. For operation to dc, this pin must not source or sink more than 6 mA of current or device nonfunction and possible device failure results. See Figure 5 for the IF interface schematic. Radio Frequency. This pin is dc-coupled and matched to 50 Ω. See Figure 6 for the RF interface schematic. INTERFACE SCHEMATICS 15452-005 IF 15452-003 GND Figure 5. IF Interface Schematic Figure 3. GND Interface Schematic LO 15452-004 15452-006 RF Figure 6. RF Interface Schematic Figure 4. LO Interface Schematic Rev. A | Page 5 of 27 HMC219B Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS DOWNCONVERTER PERFORMANCE Data taken as downconverter, lower sideband, TA = 25°C, IF = 100 MHz, and LO power = 13 dBm, unless otherwise noted. –2 50 –6 45 ISOLATION (dB) –4 –8 –10 –12 40 35 30 –14 25 –16 20 –18 15 –20 2.5 3.0 3.5 LO TO IF LO TO RF RF TO IF 55 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 10 2.5 15452-007 CONVERSION GAIN (dB) 60 +85°C +25°C –40°C 3.0 20 5.0 5.5 6.0 6.5 7.0 6.5 7.0 +85°C +25°C –40°C 18 16 20 INPUT P1dB (dBm) INPUT IP3 (dBm) 4.5 Figure 10. Isolation vs. RF Frequency +85°C +25°C –40°C 25 4.0 RF FREQUENCY (GHz) Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures 30 3.5 15452-010 0 15 10 14 12 10 8 6 4 5 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 0 2.5 –2 CONVERSION GAIN (dB) –4 –6 –8 –10 –12 –14 –6 1.5 2.0 2.5 3.0 3.5 4.0 IF FREQUENCY (GHz) 6.0 Figure 9. Conversion Gain and IF Return Loss vs. IF Frequency 9dBm 11dBm 13dBm 15dBm 17dBm –14 –18 1.0 5.5 –12 –16 0.5 5.0 –10 –18 0 4.5 –8 –16 15452-009 CONVERSION GAIN AND IF RETURN LOSS (dB) 0 –4 –20 4.0 Figure 11. Input P1dB vs. RF Frequency at Various Temperatures IF RETURN LOSS CONVERSION GAIN –2 3.5 RF FREQUENCY (GHz) Figure 8. Input IP3 vs. RF Frequency at Various Temperatures 0 3.0 –20 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 12. Conversion Gain vs. RF Frequency at Various LO Powers Rev. A | Page 6 of 27 15452-012 3.0 15452-008 0 2.5 15452-011 2 Data Sheet INPUT IP3 (dBm) 25 20 9dBm 11dBm 13dBm 15dBm 17dBm +85°C +25°C –40°C 18 16 NOISE FIGURE (dB) 30 HMC219B 20 15 10 14 12 10 8 6 4 5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 0 2.5 15452-013 5.0 5.5 6.0 6.5 7.0 70 60 50 40 30 50 40 30 20 20 10 10 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 0 2.5 15452-014 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 Figure 17. Input IP2 vs. RF Frequency at Various LO Powers 0 +85°C +25°C –40°C –2 3.0 RF FREQUENCY (GHz) Figure 14. Input IP2 vs. RF Frequency at Various Temperatures 0 9dBm 11dBm 13dBm 15dBm 17dBm 15452-017 INPUT IP2 (dBm) 60 INPUT IP2 (dBm) 4.5 80 +85°C +25°C –40°C 70 +85°C +25°C –40°C –5 LO RETURN LOSS (dB) –4 RF RETURN LOSS (dB) 4.0 Figure 16. Noise Figure vs. RF Frequency at Various Temperatures 80 –6 –8 –10 –12 –14 –16 –10 –15 –20 –25 –30 –35 3.0 3.5 4.0 4.5 5.0 5.5 RF FREQUENCY (GHz) 6.0 6.5 7.0 15452-015 –18 –20 2.5 3.5 RF FREQUENCY (GHz) Figure 13. Input IP3 vs. RF Frequency at Various LO Powers 0 2.5 3.0 Figure 15. RF Return Loss vs. RF Frequency at Various Temperatures, LO Frequency = 4.6 GHz, LO Power = 13 dBm –40 2.5 3.0 3.5 4.0 4.5 5.0 5.5 LO FREQUENCY (GHz) 6.0 6.5 7.0 15452-018 0 2.5 15452-016 2 Figure 18. LO Return Loss vs. LO Frequency at Various Temperatures Rev. A | Page 7 of 27 HMC219B Data Sheet Data taken as downconverter, lower sideband, TA = 25°C, IF = 1000 MHz, and LO power = 13 dBm, unless otherwise noted. 0 +85°C +25°C –40°C –2 –2 CONVERSION GAIN (dB) –4 –6 –8 –10 –12 –14 –12 –14 –16 –18 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) –20 2.5 30 30 25 INPUT IP3 (dBm) 20 15 10 4.5 5.0 5.5 6.0 6.5 7.0 9dBm 11dBm 13dBm 15dBm 17dBm 20 15 10 5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 0 2.5 4.0 4.5 5.0 5.5 6.0 80 INPUT IP2 (dBm) 60 50 40 30 50 40 30 20 10 10 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 15452-021 20 3.5 7.0 9dBm 11dBm 13dBm 15dBm 17dBm 70 60 3.0 6.5 Figure 23. Input IP3 vs. RF Frequency at Various LO Powers +85°C +25°C –40°C 70 3.5 RF FREQUENCY (GHz) Figure 20. Input IP3 vs. RF Frequency at Various Temperatures 80 3.0 Figure 21. Input IP2 vs. RF Frequency at Various Temperatures 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 24. Input IP2 vs. RF Frequency at Various LO Powers Rev. A | Page 8 of 27 15452-024 3.5 15452-020 3.0 RF FREQUENCY (GHz) 0 2.5 4.0 15452-023 5 0 2.5 3.5 Figure 22. Conversion Gain vs. RF Frequency at Various LO Powers +85°C +25°C –40°C 25 3.0 RF FREQUENCY (GHz) Figure 19. Conversion Gain vs. RF Frequency at Various Temperatures INPUT IP3 (dBm) –8 –10 –18 –20 2.5 INPUT IP2 (dBm) –6 –16 15452-019 CONVERSION GAIN (dB) –4 9dBm 11dBm 13dBm 15dBm 17dBm 15452-022 0 Data Sheet 18 16 14 14 NOISE FIGURE (dB) 16 12 10 8 6 12 10 8 6 4 4 2 2 0 2.5 3.0 3.5 +85°C +25°C –40°C 18 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 15452-025 INPUT P1dB (dBm) 20 +85°C +25°C –40°C Figure 25. Input P1dB vs. RF Frequency at Various Temperatures 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 26. Noise Figure vs. RF Frequency at Various Temperatures Rev. A | Page 9 of 27 15452-026 20 HMC219B HMC219B Data Sheet Data taken as downconverter, lower sideband, TA = 25°C, IF = 2000 MHz, and LO power = 13 dBm, unless otherwise noted. 0 +85°C +25°C –40°C –2 –2 CONVERSION GAIN (dB) –4 –6 –8 –10 –12 –14 –12 –14 –16 –18 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) –20 2.5 30 30 25 INPUT IP3 (dBm) 20 15 10 4.5 5.0 5.5 6.0 6.5 7.0 9dBm 11dBm 13dBm 15dBm 17dBm 20 15 10 5 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 0 2.5 15452-028 3.0 RF FREQUENCY (GHz) 80 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 Figure 31. Input IP3 vs. RF Frequency at Various LO Powers 80 +85°C +25°C –40°C 70 3.0 RF FREQUENCY (GHz) Figure 28. Input IP3 vs. RF Frequency at Various Temperatures 70 60 50 40 30 50 40 30 20 10 10 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 15452-029 20 Figure 29. Input IP2 vs. RF Frequency at Various Temperatures 0 2.5 9dBm 11dBm 13dBm 15dBm 17dBm 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 32. Input IP2 vs. RF Frequency at Various LO Powers Rev. A | Page 10 of 27 15452-032 INPUT IP2 (dBm) 60 0 2.5 4.0 15452-031 5 0 2.5 3.5 Figure 30. Conversion Gain vs. RF Frequency at Various LO Powers +85°C +25°C –40°C 25 3.0 RF FREQUENCY (GHz) Figure 27. Conversion Gain vs. RF Frequency at Various Temperatures INPUT IP3 (dBm) –8 –10 –18 –20 2.5 INPUT IP2 (dBm) –6 –16 15452-027 CONVERSION GAIN (dB) –4 9dBm 11dBm 13dBm 15dBm 17dBm 15452-030 0 Data Sheet 20 HMC219B 35 +85°C +25°C –40°C 18 NOISE FIGURE (dB) 14 12 10 8 6 4 25 20 15 10 3.0 3.5 4.0 4.5 5.0 5.5 6.0 RF FREQUENCY (GHz) Figure 33. Input P1dB vs. RF Frequency at Various Temperatures 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 34. Noise Figure vs. RF Frequency at Various Temperatures Rev. A | Page 11 of 27 15452-034 5 2 15452-033 INPUT P1dB (dBm) 16 0 2.5 +85°C +25°C –40°C 30 HMC219B Data Sheet Data taken as downconverter, upper sideband, TA = 25°C, IF = 100 MHz, and LO power = 13 dBm, unless otherwise noted. 0 +85°C +25°C –40°C –2 –2 CONVERSION GAIN (dB) –4 –6 –8 –10 –12 –14 –12 –14 –16 –18 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) –20 2.5 30 30 25 INPUT IP3 (dBm) 20 15 10 4.5 5.0 5.5 6.0 6.5 7.0 9dBm 11dBm 13dBm 15dBm 17dBm 20 15 10 5 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 0 2.5 15452-036 3.0 RF FREQUENCY (GHz) 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 36. Input IP3 vs. RF Frequency at Various Temperatures Figure 39. Input IP3 vs. RF Frequency at Various LO Powers 80 80 +85°C +25°C –40°C 70 70 60 50 40 30 50 40 30 20 10 10 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 15452-037 20 Figure 37. Input IP2 vs. RF Frequency at Various Temperatures 0 2.5 9dBm 11dBm 13dBm 15dBm 17dBm 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 40. Input IP2 vs. RF Frequency at Various LO Powers Rev. A | Page 12 of 27 15452-040 INPUT IP2 (dBm) 60 0 2.5 4.0 15452-039 5 0 2.5 3.5 Figure 38. Conversion Gain vs. RF Frequency at Various LO Powers +85°C +25°C –40°C 25 3.0 RF FREQUENCY (GHz) Figure 35. Conversion Gain vs. RF Frequency at Various Temperatures INPUT IP3 (dBm) –8 –10 –18 –20 2.5 INPUT IP2 (dBm) –6 –16 15452-035 CONVERSION GAIN (dB) –4 9dBm 11dBm 13dBm 15dBm 17dBm 15452-038 0 Data Sheet 18 16 14 14 NOISE FIGURE (dB) 16 12 10 8 6 12 10 8 6 4 4 2 2 0 2.5 3.0 3.5 +85°C +25°C –40°C 18 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 15452-041 INPUT P1dB (dBm) 20 +85°C +25°C –40°C Figure 41. Input P1dB vs. RF Frequency at Various Temperatures 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 42. Noise Figure vs. RF Frequency at Various Temperatures Rev. A | Page 13 of 27 15452-042 20 HMC219B HMC219B Data Sheet Data taken as downconverter, upper sideband, TA = 25°C, IF = 1000 MHz, and LO power = 13 dBm, unless otherwise noted. 0 +85°C +25°C –40°C –2 –2 CONVERSION GAIN (dB) –4 –6 –8 –10 –12 –14 –12 –14 –16 –18 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) –20 2.5 30 30 INPUT IP3 (dBm) 15 10 5.0 5.5 6.0 6.5 7.0 20 15 10 5 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 0 2.5 15452-044 3.0 RF FREQUENCY (GHz) 80 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 Figure 47. Input IP3 vs. RF Frequency at Various LO Powers 80 +85°C +25°C –40°C 70 3.0 RF FREQUENCY (GHz) Figure 44. Input IP3 vs. RF Frequency at Various Temperatures 70 60 50 40 30 50 40 30 20 10 10 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 15452-045 20 Figure 45. Input IP2 vs. RF Frequency at Various Temperatures 0 2.5 9dBm 11dBm 13dBm 15dBm 17dBm 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 48. Input IP2 vs. RF Frequency at Various LO Powers Rev. A | Page 14 of 27 15452-048 INPUT IP2 (dBm) 60 0 2.5 4.5 15452-047 5 0 2.5 4.0 9dBm 11dBm 13dBm 15dBm 17dBm 25 20 3.5 Figure 46. Conversion Gain vs. RF Frequency at Various LO Powers +85°C +25°C –40°C 25 3.0 RF FREQUENCY (GHz) Figure 43. Conversion Gain vs. RF Frequency at Various Temperatures INPUT IP3 (dBm) –8 –10 –18 –20 2.5 INPUT IP2 (dBm) –6 –16 15452-043 CONVERSION GAIN (dB) –4 9dBm 11dBm 13dBm 15dBm 17dBm 15452-046 0 Data Sheet 18 16 14 14 NOISE FIGURE (dB) 16 12 10 8 6 12 10 8 6 4 4 2 2 0 2.5 3.0 3.5 +85°C +25°C –40°C 18 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 15452-049 INPUT P1dB (dBm) 20 +85°C +25°C –40°C Figure 49. Input P1dB vs. RF Frequency at Various Temperatures 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 50. Noise Figure vs. RF Frequency at Various Temperatures Rev. A | Page 15 of 27 15452-050 20 HMC219B HMC219B Data Sheet Data taken as downconverter, upper sideband, TA = 25°C, IF = 2000 MHz, and LO power = 13 dBm, unless otherwise noted. 0 +85°C +25°C –40°C –2 –2 CONVERSION GAIN (dB) –4 –6 –8 –10 –12 –14 –12 –14 –16 –18 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) –20 2.5 30 30 25 INPUT IP3 (dBm) 20 15 10 4.5 5.0 5.5 6.0 6.5 7.0 9dBm 11dBm 13dBm 15dBm 17dBm 20 15 10 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 0 2.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 Figure 55. Input IP3 vs. RF Frequency at Various LO Powers 80 +85°C +25°C –40°C 70 3.5 RF FREQUENCY (GHz) Figure 52. Input IP3 vs. RF Frequency at Various Temperatures 80 3.0 15452-055 3.5 15452-052 3.0 RF FREQUENCY (GHz) 70 60 50 40 30 50 40 30 20 10 10 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 15452-053 20 Figure 53. Input IP2 vs. RF Frequency at Various Temperatures 0 2.5 9dBm 11dBm 13dBm 15dBm 17dBm 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 56. Input IP2 vs. RF Frequency at Various LO Powers Rev. A | Page 16 of 27 15452-056 INPUT IP2 (dBm) 60 0 2.5 4.0 5 5 0 2.5 3.5 Figure 54. Conversion Gain vs. RF Frequency at Various LO Powers +85°C +25°C –40°C 25 3.0 RF FREQUENCY (GHz) Figure 51. Conversion Gain vs. RF Frequency at Various Temperatures INPUT IP3 (dBm) –8 –10 –18 –20 2.5 INPUT IP2 (dBm) –6 –16 15452-051 CONVERSION GAIN (dB) –4 9dBm 11dBm 13dBm 15dBm 17dBm 15452-054 0 Data Sheet 18 18 16 14 14 NOISE FIGURE (dB) 16 12 10 8 6 10 8 6 4 2 2 0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 57. Input P1dB vs. RF Frequency at Various Temperatures +85°C +25°C –40°C 12 4 15452-057 INPUT P1dB (dBm) 20 +85°C +25°C –40°C 0 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 58. Noise Figure vs. RF Frequency at Various Temperatures Rev. A | Page 17 of 27 15452-058 20 HMC219B HMC219B Data Sheet UPCONVERTER PERFORMANCE Data taken as upconverter, lower sideband, TA = 25°C, IF = 100 MHz, and LO power = 13 dBm, unless otherwise noted. 0 +85°C +25°C –40°C –2 –2 –4 CONVERSION GAIN (dB) –6 –8 –10 –12 –14 –8 –10 –12 –14 –16 –18 –18 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) –20 2.5 4.5 5.0 5.5 6.0 30 INPUT IP3 (dBm) 15 10 6.5 7.0 9dBm 11dBm 13dBm 15dBm 17dBm 25 20 20 15 10 5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 15452-060 5 0 2.5 4.0 Figure 61. Conversion Gain vs. RF Frequency at Various LO Powers +85°C +25°C –40°C 25 3.5 RF FREQUENCY (GHz) Figure 59. Conversion Gain vs. RF Frequency at Various Temperatures 30 3.0 Figure 60. Input IP3 vs. RF Frequency at Various Temperatures 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 62. Input IP3 vs. RF Frequency at Various LO Powers Rev. A | Page 18 of 27 15452-062 –20 2.5 INPUT IP3 (dBm) –6 –16 15452-059 CONVERSION GAIN (dB) –4 9dBm 11dBm 13dBm 15dBm 17dBm 15452-061 0 Data Sheet HMC219B Data taken as upconverter, lower sideband, TA = 25°C, IF = 1000 MHz, and LO drive level = 13 dBm, unless otherwise noted. 0 +85°C +25°C –40°C –2 CONVERSION GAIN (dB) –4 –6 –8 –10 –12 –14 –8 –10 –12 –14 –16 –18 –18 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) –20 2.5 30 30 INPUT IP3 (dBm) 15 10 4.5 5.0 5.5 6.0 6.5 7.0 20 15 10 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 64. Input IP3 vs. RF Frequency at Various Temperatures 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 66. Input IP3 vs. RF Frequency at Various LO Powers Rev. A | Page 19 of 27 15452-066 5 15452-064 5 0 2.5 4.0 9dBm 11dBm 13dBm 15dBm 17dBm 25 20 3.5 Figure 65. Conversion Gain vs. RF Frequency at Various LO Powers +85°C +25°C –40°C 25 3.0 RF FREQUENCY (GHz) Figure 63. Conversion Gain vs. RF Frequency at Various Temperatures INPUT IP3 (dBm) –6 –16 15452-063 CONVERSION GAIN (dB) –4 –20 2.5 9dBm 11dBm 13dBm 15dBm 17dBm –2 15452-065 0 HMC219B Data Sheet Data taken as upconverter, lower sideband, TA = 25°C, IF = 2000 MHz, and LO drive level = 13 dBm, unless otherwise noted. 0 +85°C +25°C –40°C –2 –2 CONVERSION GAIN (dB) –4 –6 –8 –10 –12 –14 –8 –10 –12 –14 –16 –18 –18 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) –20 2.5 30 25 INPUT IP3 (dBm) 20 15 10 4.5 5.0 5.5 6.0 6.5 7.0 9dBm 11dBm 13dBm 15dBm 17dBm 20 15 10 5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 15452-068 5 0 2.5 4.0 Figure 69. Conversion Gain vs. RF Frequency at Various LO Powers +85°C +25°C –40°C 25 3.5 RF FREQUENCY (GHz) Figure 67. Conversion Gain vs. RF Frequency at Various Temperatures 30 3.0 Figure 68. Input IP3 vs. RF Frequency at Various Temperatures 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 70. Input IP3 vs. RF Frequency at Various LO Powers Rev. A | Page 20 of 27 15452-070 –20 2.5 INPUT IP3 (dBm) –6 –16 15452-067 CONVERSION GAIN (dB) –4 9dBm 11dBm 13dBm 15dBm 17dBm 15452-069 0 Data Sheet HMC219B Data taken as upconverter, upper sideband, TA = 25°C, IF = 100 MHz, and LO drive level = 13 dBm, unless otherwise noted. 0 +85°C +25°C –40°C –2 –2 CONVERSION GAIN (dB) –4 –6 –8 –10 –12 –14 –8 –10 –12 –14 –16 –18 –18 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) –20 2.5 30 25 INPUT IP3 (dBm) 20 15 10 4.5 5.0 5.5 6.0 6.5 7.0 9dBm 11dBm 13dBm 15dBm 17dBm 20 15 10 5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 15452-072 5 0 2.5 4.0 Figure 73. Conversion Gain vs. RF Frequency at Various LO Powers +85°C +25°C –40°C 25 3.5 RF FREQUENCY (GHz) Figure 71. Conversion Gain vs. RF Frequency at Various Temperatures 30 3.0 Figure 72. Input IP3 vs. RF Frequency at Various Temperatures 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 74. Input IP3 vs. RF Frequency at Various LO Powers Rev. A | Page 21 of 27 15452-074 –20 2.5 INPUT IP3 (dBm) –6 –16 15452-071 CONVERSION GAIN (dB) –4 9dBm 11dBm 13dBm 15dBm 17dBm 15452-073 0 HMC219B Data Sheet Data taken as upconverter, upper sideband, TA = 25°C, IF = 1000 MHz, and LO drive level = 13 dBm, unless otherwise noted. 0 +85°C +25°C –40°C –2 –2 CONVERSION GAIN (dB) –4 –6 –8 –10 –12 –14 –8 –10 –12 –14 –16 –18 –18 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) –20 2.5 30 INPUT IP3 (dBm) 15 10 5.0 5.5 6.0 6.5 7.0 20 15 10 5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) 15452-076 5 0 2.5 4.5 9dBm 11dBm 13dBm 15dBm 17dBm 25 20 4.0 Figure 77. Conversion Gain vs. RF Frequency at Various LO Powers +85°C +25°C –40°C 25 3.5 RF FREQUENCY (GHz) Figure 75. Conversion Gain vs. RF Frequency at Various Temperatures 30 3.0 Figure 76. Input IP3 vs. RF Frequency at Various Temperatures 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 78. Input IP3 vs. RF Frequency at Various LO Powers Rev. A | Page 22 of 27 15452-078 –20 2.5 INPUT IP3 (dBm) –6 –16 15452-075 CONVERSION GAIN (dB) –4 9dBm 11dBm 13dBm 15dBm 17dBm 15452-077 0 Data Sheet HMC219B Data taken as upconverter, upper sideband, TA = 25°C, IF = 2000 MHz, and LO drive level = 13 dBm, unless otherwise noted. 0 +85°C +25°C –40°C –2 CONVERSION GAIN (dB) –4 –6 –8 –10 –12 –14 –8 –10 –12 –14 –16 –18 –18 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) –20 2.5 30 30 25 INPUT IP3 (dBm) 20 15 10 4.0 4.5 5.0 5.5 6.0 6.5 7.0 9dBm 11dBm 13dBm 15dBm 17dBm 20 15 10 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 80. Input IP3 vs. RF Frequency at Various Temperatures 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 RF FREQUENCY (GHz) Figure 82. Input IP3 vs. RF Frequency at Various LO Powers Rev. A | Page 23 of 27 15452-082 5 15452-080 5 0 2.5 3.5 Figure 81. Conversion Gain vs. RF Frequency at Various LO Powers +85°C +25°C –40°C 25 3.0 RF FREQUENCY (GHz) Figure 79. Conversion Gain vs. RF Frequency at Various Temperatures INPUT IP3 (dBm) –6 –16 15452-079 CONVERSION GAIN (dB) –4 –20 2.5 9dBm 11dBm 13dBm 15dBm 17dBm –2 15452-081 0 HMC219B Data Sheet SPURIOUS AND HARMONICS PERFORMANCE Mixer spurious products are measured in dBc from the IF output power level, unless otherwise noted. Spur values are (M × RF) − (N × LO). M × N Spurious Outputs, IF = 100 MHz M × N Spurious Outputs, IF = 1000 MHz RF = +2.5 GHz, LO = +3.5 GHz, RF power = −10 dBm, and LO power = +13 dBm. RF = +2.5 GHz, LO = +2.6 GHz, RF power = −10 dBm, and LO power = +13 dBm. 0 M × RF 1 0 1 2 3 4 5 1 1 N/A1 62 72 82 82 7 79 81 83 83 2 28 20 73 67 85 81 N × LO 3 27 35 86 67 85 84 4 55 44 82 73 90 87 0 5 39 62 77 81 85 90 M × RF 1 0 1 2 3 4 5 M × RF 1 15 85 80 80 80 1 3 N/A1 55 83 81 79 4 35 71 83 88 88 86 0 5 33 57 76 86 89 89 N/A means not applicable. M × RF 1 0 M × RF 1 0 1 2 3 4 5 17 79 81 76 N/A 1 7 N/A 72 84 79 76 2 39 38 62 82 83 79 4 29 45 83 87 89 86 5 N/A 42 79 82 85 89 5 +36 +61 +75 +81 +78 +79 0 1 2 3 4 5 13 85 81 81 77 1 6 N/A 57 83 83 79 2 44 36 64 76 84 85 N × LO1 3 27 51 74 71 89 87 4 29 45 82 84 86 90 5 N/A 45 79 82 84 87 N/A means not applicable. RF = +6 GHz, LO = +7 GHz, RF power = −10 dBm, and LO power = +13 dBm. RF = +6 GHz, LO = +6.1 GHz, RF power = −10 dBm, and LO power = +13 dBm. N × LO1 3 28 51 85 78 87 84 4 +51 +56 +80 +82 +62 +55 N/A means not applicable. RF = +4.5 GHz, LO = +4.6 GHz, RF power = −10 dBm, and LO power = +13 dBm. 0 +7 +75 +77 +82 +80 1 −2 N/A1 +55 +61 +83 +83 RF = +4.5 GHz, LO = +5.5 GHz, RF power = −10 dBm, and LO power = +13 dBm. N/A means not applicable. N × LO 2 3 39 31 34 46 57 57 74 71 84 87 80 84 0 1 2 3 4 5 N × LO 2 3 +22 +17 +29 +38 +62 +76 +69 +60 +60 +69 +74 +63 0 M × RF 1 0 1 2 3 4 5 16 80 79 70 N/A N/A means not applicable. N/A means not applicable. Rev. A | Page 24 of 27 1 6 N/A 68 82 79 67 2 36 37 59 73 83 79 N × LO1 3 4 22 N/A 60 29 70 78 66 82 65 73 70 59 5 N/A N/A 64 78 80 67 Data Sheet HMC219B THEORY OF OPERATION The HMC219B is a general-purpose, double balanced mixer in an 8-lead, MINI_SO_EP, RoHS-compliant package that can be used as an upconverter or a downconverter from 2.5 GHz to 7.0 GHz. When used a downconverter, the HMC219B downconverts RF between 2.5 GHz and 7.0 GHz to IF between dc and 3 GHz. When used as an upconverter, the mixer upconverts IF between dc and 3 GHz to RF between 2.5 GHz and 7.0 GHz. The mixer provides excellent LO to RF and LO to IF isolation due to optimized balun structures. The HMC219B requires no external components or matching circuitry. The RoHS compliant HMC219B eliminates the need for wire bonding and is compatible with high volume, surface-mount manufacturing techniques. Rev. A | Page 25 of 27 HMC219B Data Sheet APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT EVALUATION PCB INFORMATION Figure 83 shows the typical application circuit for the HMC219B. The HMC219B is a passive device and does not require any external components. The LO and RF pins are internally dc-coupled. When IF operation is not required until dc, use an ac-coupled capacitor at the IF port. When IF operation to dc is required, do not exceed the IF source and sink the current rating specified in the Absolute Maximum Ratings section. RF circuit design techniques must be implemented for the evaluation board PCB shown in Figure 84. Signal lines must have 50 Ω impedance, and the package ground leads and exposed pad must connect directly to the ground plane, similar to what is shown in Figure 84. Use a sufficient number of via holes to connect the top and bottom ground planes. The evaluation circuit board shown in Figure 84 is available from Analog Devices, Inc., upon request. Reference EV1HMC219BMS8G when ordering the evaluation PCB assembly. The bill of materials for the evaluation PCB is shown in Table 5. 1 HMC219B 8 2 7 3 6 4 5 RF GND GND IF 15452-083 LO Table 5. Bill of Materials for Evaluation PCB EV1HM219BMS8G Reference Designator J1 to J3 U1 PCB1 Figure 83. Typical Application Circuit 101650 is the bare EV1HMC219BMS8G PCB. 15452-084 1 Description SMA RF connectors HMC219B 101650 evaluation PCB, Rogers 4350 Figure 84. HMC219B Evaluation PCB Rev. A | Page 26 of 27 Data Sheet HMC219B OUTLINE DIMENSIONS 3.10 3.00 2.90 8 3.10 3.00 2.90 2.41 MAX 5 5.08 4.90 4.68 1.78 MAX EXPOSED PAD 1 4 0.95 0.85 0.75 BOTTOM VIEW 1.95 BSC 1.10 MAX SIDE VIEW PKG-004854 0.13 MAX COPLANARITY 0.10 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.25 GAGE PLANE 6° 0° 0.38 0.30 0.22 0.22 0.08 END VIEW 0.80 0.60 0.40 0.95 REF 01-13-2017-A 0.65 BSC TOP VIEW COMPLIANT TO JEDEC STANDARDS MO-187-AA-T Figure 85. 8-Lead Mini Small Outline Package with Exposed Pad (MINI_SO_EP) (RH-8-4) Dimensions shown in millimeters) ORDERING GUIDE Model1, 2 HMC219BMS8GE Temperature Range −40°C to +85°C MSL Rating3 MSL1 Package Body Material Low Stress Injection Molded Plastic Package Description 8-Lead MINI_SO_EP Package Option RH-8-4 HMC219BMS8GETR −40°C to +85°C MSL1 Low Stress Injection Molded Plastic 8-Lead MINI_SO_EP RH-8-4 EV1HMC219BMS8G Evaluation PCB Assembly 1 The HMC219BMS8GE and the HMC219BMS8GETR are RoHS Compliant Parts. Lead finish, 100% SN 10 micron minimum. 3 See the Absolute Maximum Ratings section. 4 XXXX = four digit lot number. 2 ©2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D15452-0-10/17(A) Rev. A | Page 27 of 27 Package Marking4 H219B XXXX H219B XXXX