EVAL-ADF5000EB2Z

4 GHz to 18 GHz Divide-by-2 Prescaler ADF5000 Data Sheet FEATURES FUNCTIONAL BLOCK DIAGRAM APPLICATIONS CE ADF5000 BIAS VDDx 100Ω 3pF RFIN 100Ω 1pF RFOUT DIVIDE BY 2 RFOUT 1pF 50Ω 09129-001 Divide-by-2 prescaler High frequency operation: 4 GHz to 18 GHz Integrated RF decoupling capacitors Low power consumption Active mode: 30 mA Power-down mode: 17 mA Low phase noise: −147 dBc/Hz Single dc supply: 3.3 V compatible with ADF4xxx PLLs Temperature range: −40°C to +105°C Small package: 3 mm × 3 mm LFCSP GND Figure 1. PLL frequency range extender Point-to-point radios VSAT radios Communications test equipment GENERAL DESCRIPTION The ADF5000 prescaler is a low noise, low power, fixed RF divider block that can be used to divide down frequencies as high as 18 GHz to a lower frequency suitable for input to a PLL IC, such as the ADF4156 or the ADF4106. The ADF5000 provides a divide-by-2 function. The ADF5000 operates from a 3.3 V supply and has differential 100 Ω RF outputs to allow direct interface to the differential RF inputs of PLLs such as the ADF4156 and ADF4106. Rev. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2011–2013 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADF5000 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Pin Configuration and Function Descriptions..............................5 Applications ....................................................................................... 1 Typical Performance Characteristics ..............................................6 General Description ......................................................................... 1 Evaluation Board PCB ......................................................................7 Functional Block Diagram .............................................................. 1 PCB Material Stack-Up ................................................................7 Revision History ............................................................................... 2 Bill of Materials ..............................................................................7 Specifications..................................................................................... 3 Application Circuit ............................................................................8 Absolute Maximum Ratings............................................................ 4 Outline Dimensions ..........................................................................9 ESD Caution .................................................................................. 4 Ordering Guide .............................................................................9 REVISION HISTORY 9/13—Rev. 0 to Rev. A Updated Outline Dimensions ......................................................... 9 Changes to Ordering Guide ............................................................ 9 1/11—Revision 0: Initial Version Rev. A | Page 2 of 12 Data Sheet ADF5000 SPECIFICATIONS VDD1 = VDD2 = 3.3 V ± 10%, GND = 0 V; dBm referred to 50 Ω; TA = TMIN to TMAX, unless otherwise noted. The operating temperature range is −40°C to +105°C. Table 1. Parameter RF CHARACTERISTICS Input Frequency RF Input Sensitivity Output Power Output Voltage Swing Phase Noise Reverse Leakage Second Harmonic Content Third Harmonic Content Fourth Harmonic Content Fifth Harmonic Content CE INPUT Input High Voltage, VIH Input Low Voltage, VIL POWER SUPPLIES Voltage Supply IDD (IDD1 + IDD2) Active Power-Down Min Typ Max Unit 18 +10 4 −10 −10 −7 −5 −2 GHz dBm dBm dBm 200 330 mV p-p 400 660 mV p-p 1000 mV p-p −147 −60 −28 −12 −37 −19 dBc/Hz dBm dBc dBc dBc dBc 2.2 3.0 0.3 V V 3.3 3.6 V 30 17 60 30 mA mA Rev. A | Page 3 of 12 Test Conditions/Comments 4 GHz to 18 GHz Single-ended output connected into 50 Ω load Differential outputs connected into 100 Ω differential load Peak-to-peak voltage swing on each single-ended output, connected into 50 Ω load Peak-to-peak voltage swing on differential output, connected into 100 Ω differential load Peak-to-peak voltage swing on each single-ended output, no load condition Input frequency (fIN) = 12 GHz, offset = 100 kHz RF input power (PIN) = 0 dBm, RFOUT = 4 GHz CE is high CE is low ADF5000 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. Parameter VDDx to GND RFIN Operating Temperature Range Industrial (B Version) Storage Temperature Range Maximum Junction Temperature LFCSP θJA Thermal Impedance Peak Temperature Time at Peak Temperature This device is a high performance RF integrated circuit with an ESD rating of 2 kV, human body model (HBM) and is ESD sensitive. Implement proper precautions for handling and assembly. Rating −0.3 V to +3.9 V 10 dBm −40°C to +105°C −65°C to +150°C 150°C 27.3°C/W 260°C 40 sec ESD CAUTION Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 4 of 12 Data Sheet ADF5000 PIN 1 INDICATOR GND 1 12 GND 11 RFOUT GND 3 TOP VIEW (Not to Scale) 10 RFOUT 9 GND GND 8 GND 5 GND 4 CE 7 ADF5000 NC 6 RFIN 2 NOTES 1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN. 2. THE EXPOSED PADDLE MUST BE CONNECTED TO GND. 09129-002 14 VDD2 13 GND 15 VDD1 16 GND PIN CONFIGURATION AND FUNCTION DESCRIPTIONS Figure 2. Pin Configuration Table 3. Pin Function Descriptions Pin No. 1, 3, 4, 5, 8, 9, 12, 13, 16 2 6 7 Mnemonic GND Description RF Ground. Tie all ground pins together. RFIN NC CE 10 RFOUT 11 RFOUT 14 VDD2 15 VDD1 Single-Ended 50 Ω Input to the RF Prescaler. This pin is ac-coupled internally via a 3 pF capacitor. No Connect. Do not connect to this pin. Chip Enable. This pin is active high. When CE is brought low, the part enters power-down mode. If this functionality is not required, the pin can be left unconnected because it is pulled up internally through a weak pull-up resistor. Divided-Down Output of the Prescaler. This pin has an internal 100 Ω load resistor tied to VDD2 and an ac coupling capacitor of 1 pF. Complementary Divided Down Output of the Prescaler. This pin has an internal 100 Ω load resistor tied to VDD2 and an ac coupling capacitor of 1 pF. Voltage Supply for the Output Stage. Decouple this pin to ground with a 0.1 µF capacitor in parallel with a 10 pF capacitor. VDD2 can be tied directly to VDD1. Voltage Supply for the Input Stage and Divider Block. Decouple this pin to ground with a 0.1 µF capacitor in parallel with a 10 pF capacitor. The LFCSP has an exposed paddle that must be connected to GND. EPAD Rev. A | Page 5 of 12 ADF5000 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS –5 0 RF OUTPUT POWER (dBm) –10 –20 –30 –40 VDD = 3.0V VDD = 3.3V VDD = 3.6V –60 0 5 –15 THIRD HARMONIC –20 FIFTH HARMONIC –25 –30 –35 20 10 15 RF INPUT FREQUENCY (GHz) 30 25 –40 2.4 VDDx (V) Figure 3. RF Input Sensitivity 20 18 3.6 3.3 3.0 2.7 09129-106 –50 09129-003 MINIMUM INPUT POWER (dBm) FIRST HARMONIC –10 Figure 6. RF Output Harmonic Content vs. VDDx 0 ICCOUT AT fIN = 10GHz PIN = 0dBm ICCIN AT fIN = 10GHz PIN = 0dBm POUT AT PIN = 0dBm VCC = 3V POUT AT PIN = 0dBm VCC = 3.3V POUT AT PIN = 0dBm VCC = 3.6V RF OUTPUT POWER (dBm) 16 ICC (mA) 14 12 10 8 6 –5 4 2.7 2.9 3.1 3.3 3.5 3.7 3.9 VCC (V) –10 09129-104 0 2.5 POUT AT fIN = 10GHz PIN = 0dBm OUTPUT POWER (dBm) –4 –6 –8 –10 –12 –14 –16 2.9 3.1 3.3 VCC (V) 3.5 3.7 3.9 09129-105 –18 2.7 10 15 20 25 30 Figure 7. RF Output Power vs. RF Input Frequency, fIN = 10 GHz, VDD = 3.3 V 0 –20 2.5 5 RF INPUT FREQUENCY (GHz) Figure 4. IDD1 and IDD2 vs. VDDx, fIN = 10 GHz, PIN = 0 dBm –2 0 09129-107 2 Figure 5. RF Output Power (Single-Ended) vs. VDDx, fIN = 10 GHz, PIN = 0 dBm Rev. A | Page 6 of 12 Data Sheet ADF5000 EVALUATION BOARD PCB The evaluation board has four connectors as shown in Figure 8. The RF input connector (J4) is a high frequency precision SMA connector from Emerson. This connector is mechanically compatible with SMA, 3.5 mm, and 2.92 mm cables. PCB MATERIAL STACK-UP The evaluation board is built using Rogers RO4003C material (0.008 inch). RF track widths are 0.015 inch to achieve a controlled 50 Ω characteristic impedance. The complete printed circuit board (PCB) stack-up is shown in Figure 9. 1.5oz (53µm) FINISHED COPPER ROGERS RO4003C LAMINATE 0.008” εr = 3.38. STARTING COPPER WEIGHT 0.5oz/0.5oz 0.5oz (18µm) FINISHED COPPER 0.062” ± 0.003” COPPER TO COPPER 09129-008 FR4 PREPREG 0.0372” 0.5oz (18µm) FINISHED COPPER Figure 8. Evaluation Board Silkscreen—Top View ROGERS RO4003C LAMINATE 0.008” εr = 3.38. STARTING COPPER WEIGHT 0.5oz/0.5oz 1.5oz (53µm) FINISHED COPPER Figure 9. Evaluation Board PCB Layer Stack-Up The differential RF outputs are brought out on the J2 and J3 SMA connectors. If only one of the outputs is being used, the unused output should be correctly terminated using a 50 Ω SMA termination. The chip enable (CE) pin can be controlled using the T1 test point. If this function is not required, the test point can be left unconnected. BILL OF MATERIALS Table 4. Qty. 1 1 3 1 3 1 Reference Designator C1 C2 J1, J2, J3 J4 T1, T2, T3 U1 Description 0.1 µF, 0603 capacitor 10 pF, 0402 capacitor SMA RF connector SMA RF connector Test points ADF5000 RF prescaler Supplier Murata Murata Emerson Emerson Vero Analog Devices, Inc. Rev. A | Page 7 of 12 Part Number GRM188R71H104KA93D GRM1555C1H100JZ01D 142-0701-851 142-0761-801 20-2137 ADF5000BCPZ 09129-009 The evaluation board is powered from a single 3.0 V to 3.6 V supply, which should be connected to the J1 SMA connector. The power supply can also be connected using the T3 (VDDx) and T2 (GND) test points. ADF5000 Data Sheet APPLICATION CIRCUIT The positive input pin of the OP184 is biased at half the ADF4156 charge pump supply (VP). This can be easily achieved using a simple resistor divider, ensuring sufficient decoupling close to the +IN A pin of the OP184. This configuration, in turn, allows the use of a single positive supply for the op amp. Alternatively, to optimize performance by ensuring a clean bias voltage, a low noise regulator such as the ADP150 can be used to power the resistor divider network or the +IN A pin directly. The ADF5000 can be connected either single-ended or differentially to any of the Analog Devices PLL family of ICs. It is recommended that a differential connection be used for best performance and to achieve maximum power transfer. The application circuit shown in Figure 10 shows the ADF5000 used as the RF prescaler in a microwave 12 GHz PLL loop. The ADF5000 divides the 12 GHz RF signal down to 6 GHz, which is input differentially into the ADF4156 PLL. An active filter topology, using the OP184 op amp, is used to provide the wide tuning ranges typically required by microwave VCOs. 1.8nF 10pF 0.1µF 330Ω VDD1 RFIN VDD2 ADF5000 RFOUT DECOUPLING INTEGRATED ADF4156 PLL RFINA CP PRESCALER 220Ω VP/2 RFINB RFOUT 47nF 820pF GND OP184 1µF 6dB ATTENUATION PAD 18Ω 1kΩ OP AMP 1.8nF MICROWAVE VCO RFOUT VTUNE 37Ω 150Ω 18Ω 09129-010 150Ω 12GHz OUT Figure 10. ADF5000 Used as the RF Prescaler in a Microwave 12 GHz PLL Loop Rev. A | Page 8 of 12 Data Sheet ADF5000 OUTLINE DIMENSIONS 0.30 0.25 0.18 0.50 BSC 13 PIN 1 INDICATOR 16 1 12 EXPOSED PAD 1.60 1.50 SQ 1.40 9 TOP VIEW 0.80 0.75 0.70 SEATING PLANE 0.45 0.40 0.35 4 8 5 0.20 MIN BOTTOM VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6. 08-16-2010-B PIN 1 INDICATOR 3.10 3.00 SQ 2.90 Figure 11. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 3 mm × 3 mm Body, Very Very Thin Quad (CP-16-18) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADF5000BCPZ ADF5000BCPZ-RL7 EVAL-ADF5000EB2Z 1 Temperature Range −40°C to +105°C −40°C to +105°C Package Description 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ], 7” Tape and Reel Evaluation Board Z = RoHS Compliant Part. Rev. A | Page 9 of 12 Package Option CP-16-18 CP-16-18 Branding Q1T Q1T ADF5000 Data Sheet NOTES Rev. A | Page 10 of 12 Data Sheet ADF5000 NOTES Rev. A | Page 11 of 12 ADF5000 Data Sheet NOTES ©2011–2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09129-0-9/13(A) Rev. A | Page 12 of 12