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EVAL-SSM3515Z

EVAL-SSM3515Z

  • 厂商:

    AD(亚德诺)

  • 封装:

    -

  • 描述:

    EVAL BOARD FOR SSM3515

  • 数据手册
  • 价格&库存
EVAL-SSM3515Z 数据手册
31 W, Filterless, Class-D Digital Input Audio Amplifier SSM3515 Data Sheet FEATURES GENERAL DESCRIPTION Filterless digital input, mono Class-D amplifier Operates from a single 4.5 V to 17 V supply 31.3 W output power, 17 V supply, and 4 Ω load at 1% THD + N 107 dB A-weighted signal-to-noise ratio 93.3% efficiency into 8 Ω load at 12 V I2C control with up to 4 pin selectable slots/addresses Supports multiple serial data formats up to TDM16 Digital interface supports sample rates from 8 kHz to 192 kHz Flexible digital and analog gain adjustment Flexible supply monitoring AGC function 6.55 mA quiescent current with single 17 V PVDD supply Short-circuit and thermal protection, thermal warning 20-ball, 1.8 mm × 2.2 mm, 0.4 mm pitch WLCSP Pop and click suppression User selectable ultralow EMI emissions mode Power-on reset The SSM3515 is a fully integrated, high efficiency, mono Class-D audio amplifier with digital inputs. The application circuit requires a minimum of external components and can operate from a single 4.5 V to 17 V supply. It can deliver 8.4 W of output power into an 8 Ω load or 15.8 W into an 4 Ω load from a 12 V power supply, or 31.3 W into an 4 Ω load from a 17 V power supply, all with 1% THD + N. APPLICATIONS The digital input eliminates the need for an external digital-toanalog converter (DAC). The SSM3515 has a micropower shutdown mode with a typical shutdown current of 39 nA at the 12 V PVDD supply. The device also includes pop and click suppression circuitry that minimizes voltage glitches at the output during turn on and turn off. The SSM3515 features a high efficiency, low noise modulation scheme that requires no external LC output filters. This scheme provides high efficiency even at low output power. It operates with 92% efficiency at 7 W into an 8 Ω load or 88% efficiency at 15 W into 4 Ω from a 12 V supply. Spread spectrum pulse density modulation provides lower EMI radiated emissions compared with other Class-D architectures, particularly above 100 MHz. Notebooks Portable electronics Home audio The SSM3515 operates with or without an I2C control interface. The SSM3515 is specified over the commercial temperature range (−40C to +85C). It has built in thermal shutdown and output short-circuit protection. It is available in a halide-free, 20-ball, 1.8 mm × 2.2 mm wafer-level chip scale package (WLCSP). FUNCTIONAL BLOCK DIAGRAM 1.8V 5V VREG50/AVDD SCL SDA VREG18/DVDD AGND I2C TDM I2S INPUT ADDR BST+ BCLK FSYNC REG_EN VOLUME DAC Σ-∆ CLASS-D MODULATOR SDATA FULL BRIDGE POWER STAGE OUT+ OUT– BST– SSM3515 13327-001 PVDD PGND Figure 1. Rev. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2015–2017 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com SSM3515 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1  EMI Noise.................................................................................... 24  Applications ....................................................................................... 1  Output Modulation Description .............................................. 24  General Description ......................................................................... 1  Faults and Limiter Status Reporting ........................................ 25  Functional Block Diagram .............................................................. 1  VBAT Sensing ............................................................................. 25  Revision History ............................................................................... 2  Limiter and Battery Tracking Threshold Control .................. 25  Specifications..................................................................................... 3  Layout .......................................................................................... 28  Digital Timing Characteristics ................................................... 6  Bootstrap Capacitors.................................................................. 28  Absolute Maximum Ratings............................................................ 8  Power Supply Decoupling ......................................................... 28  Thermal Resistance ...................................................................... 8  Register Summary .......................................................................... 29  ESD Caution .................................................................................. 8  Register Details ............................................................................... 30  Pin Configuration and Function Descriptions ............................. 9  Power Control Register ............................................................. 30  Typical Performance Characteristics ........................................... 10  Gain and Edge Control Register............................................... 30  Theory of Operation ...................................................................... 19  DAC Control Register................................................................ 31  Overview...................................................................................... 19  DAC Volume Control Register ................................................. 32  Power Supplies ............................................................................ 19  SAI Control 1 Register ............................................................... 33  Power-Up Sequence ................................................................... 19  SAI Control 2 Register ............................................................... 34  Power-Down Operation ............................................................ 19  Battery Voltage Output Register ............................................... 35  REG_EN Pin Setup and Control .............................................. 19  Limiter Control 1 Register ........................................................ 35  ADDR Pin Setup and Control .................................................. 20  Limiter Control 2 Register ........................................................ 36  Clocking ....................................................................................... 20  Limiter Control 3 Register ........................................................ 37  Digital Audio Serial Interface ....................................................... 21  Status Register ............................................................................. 37  Stereo (I S/Left Justified) Operating Mode ............................. 21  Fault Control Register ................................................................ 38  TDM Operating Mode ............................................................... 21  Typical Application Circuit ........................................................... 40  I C Control .................................................................................. 21  Outline Dimensions ....................................................................... 41  Analog and Digital Gain............................................................ 24  Ordering Guide .......................................................................... 41  2 2 Pop and Click Suppression ........................................................ 24  REVISION HISTORY 1/2017—Rev. 0 to Rev. A Changes to Figure 2 and Table 5 ..................................................... 6 6/2015—Revision 0: Initial Version Rev. A| Page 2 of 41 Data Sheet SSM3515 SPECIFICATIONS PVDD = 12 V, VREG50/AVDD = 5 V (internal), VREG18/DVDD = 1.8 V (external), RL = 8 Ω + 33 μH, BCLK = 3.072 MHz and FSYNC = 48 kHz, TA = −40°C to +85°C, unless otherwise noted. The measurements are with a 20 kHz AES17 low-pass filter. The other load impedances used are 4 Ω + 15 μH and 3 Ω +10 μH. Measurements are with a 20 kHz AES17 low-pass filter, unless otherwise noted. The sine wave output powers above 20 W in 4 Ω cannot be continuous and may invoke the thermal limit indicator based on the power dissipation capability of the board. Table 1. Parameter DEVICE CHARACTERISTICS Output Power/Channel RL = 8 Ω Symbol Test Conditions/Comments POUT f = 1 kHz THD + N = 1%, PVDD = 17 V THD + N = 1%, PVDD = 12 V THD + N = 1%, PVDD = 7 V THD + N = 1%, PVDD = 5 V THD + N = 10%, PVDD = 17 V THD + N = 10%, PVDD = 12 V THD + N = 10%, PVDD = 7 V THD + N = 10%, PVDD = 5 V THD + N = 1%, PVDD = 17 V THD + N = 1%, PVDD = 12 V THD + N = 1%, PVDD = 7 V THD + N = 1%, PVDD = 5 V THD + N = 10%, PVDD = 17 V THD + N = 10%, PVDD = 12 V THD + N = 10%, PVDD = 7 V THD + N = 10%, PVDD = 5 V POUT = 9 W, RL = 8 Ω, PVDD = 12 V POUT = 9 W, RL = 8 Ω, PVDD = 12 V (low EMI mode) POUT = 30 W, RL = 4 Ω, PVDD = 17 V POUT = 30 W, RL = 4 Ω, PVDD = 17 V (low EMI mode) POUT = 5 W into RL = 8 Ω, f = 1 kHz, PVDD = 16 V RL = 4 Ω Efficiency η Total Harmonic Distortion + Noise Load Resistance Load Inductance Output FET On Resistance Overcurrent Protection Trip Point Average Switching Frequency Differential Output DC Offset Voltage THD + N POWER SUPPLIES Supply Voltage Range AC Power Supply Rejection Ratio GAIN CONTROL Output Voltage Peak Min 3 5 RON I OC Typ Max 16 8.4 2.8 1.4 19.7 10.5 3.5 1.8 31.3 15.8 5.4 2.8 39.3 19.7 6.7 3.4 93.3 93.2 88 87.8 0.004 W W W W W W W W W W W W W W W W % % % % % 10 110 Ω μH mΩ A peak 300 kHz 5.8 fSW VOOS Gain = 12.6 V PVDD VREG50/AVDD VREG18/DVDD PSRRAC Guaranteed from PSRR test Internal Internal or external VRIPPLE = 1 V rms at 1 kHz Measured with 0 dBFS input at 1 kHz Analog gain setting = 8.4 V/V with PVDD = 17 V Analog gain setting = 12.6 V/V with PVDD = 17 V Analog gain setting = 14.0 V/V with PVDD = 17 V Analog gain setting = 15.0 V/V with PVDD = 17 V Rev. A| Page 3 of 41 4.5 4.5 1.62 Unit ±1 ±5.0 mV 5.0 1.80 87 17 5.5 1.98 73 V V V dB 8.4 12.6 14 15 V peak V peak V peak V peak SSM3515 Parameter SHUTDOWN CONTROL 1 Turn On Time, Volume Ramp Disabled fS = 12 kHz fS = 24 kHz fS = 48 kHz fS = 96 kHz fS = 192 kHz Turn On Time, Volume Ramp Enabled fS = 12 kHz fS = 24 kHz fS = 48 kHz fS = 96 kHz fS = 192 kHz Turn Off Time, Volume Ramp Disabled Turn Off Time, Volume Ramp Enabled fS = 12 kHz fS = 24 kHz fS = 48 kHz fS = 96 kHz fS = 192 kHz Output Impedance NOISE PERFORMANCE 2 Output Voltage Noise Signal-to-Noise Ratio PVDD ADC PERFORMANCE PVDD Sense Full-Scale Range PVDD Sense Absolute Accuracy Resolution DIE TEMPERATURE Overtemperature Warning Overtemperature Protection 1 2 Data Sheet Symbol Test Conditions/Comments t WU Time from SPWDN = 0 to output switching, DAC_HV = 1 or DAC_MUTE = 1, t WU = 4 FSYNC cycles to 7 FSYNC cycles + 7.68 ms t WUR t SD t SDR Time from SPWDN = 0 to full volume output switching, DAC_HV = 0 and DAC_MUTE = 0, VOL = 0x40 t WUR = t WU + 15.83 ms t WUR = t WU + 15.83 ms t WUR = t WU + 15.83 ms t WUR = t WU + 7.92 ms t WUR = t WU + 0.99 ms Time from SPWDN = 1 to full power-down, DAC_HV = 1 or DAC_MUTE = 1 Time from SPWDN = 1 to full power-down, DAC_HV = 0 and DAC_MUTE = 0, VOL = 0x40 Min Max Unit 8.01 7.84 7.76 7.72 7.70 8.27 7.98 7.83 7.76 7.72 ms ms ms ms ms 23.84 23.67 23.59 15.64 8.69 24.10 23.81 23.66 15.68 8.71 ms ms ms ms ms µs 100 t SDR = t SD + 15.83 ms t SDR = t SD + 15.83 ms t SDR = t SD + 15.83 ms t SDR = t SD + 7.92 ms t SDR = t SD + 0.99 ms ZOUT en SNR Typ 15.932 15.932 15.932 8.016 1.09 ms ms ms ms ms kΩ 37.5 48 107 107 µV rms µV rms dB dB 100 f = 20 Hz to 20 kHz, A-weighted, PVDD = 12 V f = 20 Hz to 20 kHz, A-weighted, PVDD = 17 V POUT = 8.2 W, RL = 8 Ω, A-weighted, PVDD = 12 V POUT = 31 W, RL = 4 Ω, A-weighted, PVDD = 17 V PVDD with full-scale ADC out 3.8 16.2 V PVDD = 15 V −8 +8 LSB PVDD = 5 V Unsigned 8-bit output with 3.8 V offset −6 +6 8 LSB Bits 117 °C 145 °C Guaranteed by design. Noise performance is based on the bench data for TA = −40°C to +85°C. Rev. A| Page 4 of 41 Data Sheet SSM3515 Software master power-down indicates that the clocks are turned off. Auto power-down indicates that there is no dither or zero input signal with clocks on; the device enters soft power-down after 2048 cycles of zero input values. Quiescent indicates triangular dither with zero input signal. All specifications are typical, with a 48 kHz sample rate, unless otherwise noted. Table 2. Power Supply Current Consumption 1 Edge Rate Control Mode REG_EN Pin Normal Low PVDD Low EMI Low PVDD 1 Test Conditions PVDD Software master power-down Auto power-down Quiescent Software master power-down Auto power-down Quiescent Software master power-down Auto power-down Quiescent Software master power-down Auto power-down Quiescent 5V 0.01 No Load IPVDD 12 V 17 V 0.03 0.03 IREG18 1.8 V 7 5V 0.01 4 Ω + 15 µH IPVDD 12 V 17 V 0.03 0.03 IREG18 1.8 V 7 0.01 4.10 0.01 0.03 5.00 0.03 0.03 5.60 0.03 310 4.64 0.01 310 5.60 0.03 0.01 4.00 0.01 310 4.60 5V 0.01 8 Ω + 33 µH IPVDD 12 V 17 V 0.03 0.03 IREG18 1.8 V 7 μA 54 0.48 N/A 0.01 4.10 0.01 0.03 5.12 0.03 0.03 5.90 0.03 54 0.48 N/A 0.01 4.10 0.01 0.03 5.10 0.03 0.03 5.80 0.03 54 0.48 N/A μA mA μA 316 6.26 0.03 N/A N/A 7 310 4.74 0.01 310 5.85 0.03 316 6.55 0.03 N/A N/A 7 310 4.74 0.01 310 5.85 0.03 316 6.55 0.03 N/A N/A 7 μA mA μA 0.03 4.95 0.03 0.03 5.54 0.03 54 0.48 N/A 0.01 4.70 0.01 0.03 3.99 0.03 0.03 5.59 0.03 54 0.48 N/A 0.01 4.02 0.01 0.03 4.98 0.03 0.03 5.63 0.03 54 0.48 N/A μA mA μA 310 5.60 316 6.17 N/A N/A 310 4.60 310 5.65 316 6.35 N/A N/A 310 4.60 310 5.60 316 6.40 N/A N/A μA mA Min Typ Max Unit 27 30 30 38 39 39 7 95 100 152 27 nA nA nA μA Unit N/A means not applicable. Table 3. Power-Down Current Parameter POWER-DOWN CURRENT Symbol I PVDD I DVDD Test Conditions/Comments VREG18/DVDD = 1.8 V external, software master power-down, no BCLK/FSYNC PVDD = 5 V PVDD = 12 V PVDD = 17 V VREG18/DVDD = 1.8 V external Table 4. Digital Input/Output Parameter INPUT VOLTAGE 1 High (VIH) BCLK, FSYNC, SCL, SDA SDATA, ADDR Low (VIL) BCLK, FSYNC, SDATA, SCL, SDA ADDR INPUT LEAKAGE High (I IH) Low (I IL) INPUT CAPACITANCE OUTPUT VOLTAGE (SDATA) High (VOH) Low (VOL) OUTPUT DRIVE STRENGTH1 SDA SDATA BCLK Frequency (BCLK) Sample Rate (FSYNC) 1 Min Typ Max Unit 1.13 0.7 × VREG18/DVDD 5.5 1.98 V V −0.3 −0.3 +0.54 +1.98 V V 1 1 5 µA µA pF 0.45 V V 5 24 24.576 192 mA mA MHz kHz 1.17 3 2 2.048 8 Test Comments/Comments The pull-up resistor for SCL and SDA must be scaled according to the external pull-up voltage in the system. The typical value for a pull-up resistor for 1.8 V is 2.2 kΩ. Rev. A| Page 5 of 41 SSM3515 Data Sheet DIGITAL TIMING CHARACTERISTICS All timing specifications are given for the default setting (I2S mode) of the serial input port. Table 5. I 2 C Port Timing Parameter I 2 C PORT fSCL t SCLH t SCLL t SCS t SCH t DS t SCR t SCF tR tF t BFT t HOLD Min Limit Max 400 0.6 1.3 0.6 0.6 100 300 300 300 300 0.6 140 0 Unit Description kHz µs µs µs µs ns ns ns ns ns µs ns ns SCL frequency SCL high SCL low Setup time; relevant for repeated start condition Hold time; after this period, the first clock is generated Data setup time SCL rise time SCL fall time SDA rise time, not shown in Figure 2 SDA fall time, not shown in Figure 2 Bus-free time (time between stop and start) SCL falling to SDA rising SCL falling to SDA falling Table 6. Digital Input Timing Parameter SERIAL PORT t BIL t BIH t SIS t SIH t LIS t LIH t BP TMIN Limit TMAX 15 15 6 6 10 5 40 Unit Description ns ns ns ns ns ns ns BCLK low pulse width BCLK high pulse width SDATA setup, time to BCLK rising SDATA hold, time from BCLK rising FSYNC setup time to BCLK rising FSYNC hold time to BCLK rising Minimum BCLK period Digital Timing Diagrams tDS tSCH tSCH SDA tSCR tSCLH tSCS tSCLL START CONDITION tSCF tBFT STOP CONDITION tHOLD Figure 2. I2C Port Timing Rev. A| Page 6 of 41 13327-005 SCL Data Sheet SSM3515 tBIH tBP BCLK tBIL tLIH tLIS FSYNC SDATA LEFT-JUSTIFIED MODE tSIS MSB – 1 MSB tSIH SDATA I2C-JUSTIFIED MODE tSIS MSB tSIH tSIS MSB LSB tSIH tSIH Figure 3. Serial Input Port Timing PVDD tWU PVDD/2 OUTPUT 0V 13327-161 I2C POWER-UP COMMAND Figure 4. Turn On Hard Volume tSD PVDD OUTPUT I2C POWER-DOWN COMMAND Figure 5. Turn Off Hard Volume Rev. A| Page 7 of 41 13327-162 0V 13327-002 tSIS SDATA RIGHT-JUSTIFIED MODE SSM3515 Data Sheet ABSOLUTE MAXIMUM RATINGS Absolute maximum ratings apply at TA = 25°C, unless otherwise noted. Table 7. Parameter PVDD Supply Voltage VREG18/DVDD Supply Voltage VREG50/AVDD Supply Voltage PGND and AGND Differential ADDR, SDATA Input Voltage SCL, SDA, BCLK, FSYNC Input Voltage REG_EN Input Voltage Storage Temperature Range Operating Temperature Range Junction Temperature Range Lead Temperature Range (Soldering, 60 sec) Rating −0.3 V to +18 V −0.3 V to +1.98 V −0.3 V to +5.5 V ±0.3 V −0.3 V to +1.98 V −0.3 V to +5.5 V −0.3 V to +18 V −65°C to +150°C −40°C to +85°C −65°C to +165°C 300°C THERMAL RESISTANCE θJA (junction to air) is specified for worst case conditions, that is, a device soldered in a circuit board for surface-mount packages. θJA and θJB are determined according to JESD51-9 on a 4-layer printed circuit board (PCB) with natural convection cooling. Table 8. Thermal Resistance Package Type 20-Ball, 1.8 mm × 2.2 mm WLCSP ESD CAUTION Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A| Page 8 of 41 θJA 55.5 Unit °C/W Data Sheet SSM3515 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 2 3 4 A VREG50/ AVDD AGND PGND BST– B SDA ADDR OUT– OUT– C SCL REG_EN PVDD PVDD D VREG18/ DVDD FSYNC OUT+ OUT+ E SDATA BCLK PGND BST+ 13327-006 1 Figure 6. Pin Configuration (Top Side View) Table 9. Pin Function Descriptions Pin No. A1 A2 A3 Mnemonic VREG50/AVDD AGND PGND Type1 AOUT PWR PWR A4 B1 B2 B3 B4 C1 C2 C3 C4 D1 D2 D3 D4 E1 E2 E3 BST− SDA ADDR OUT− OUT− SCL REG_EN PVDD PVDD VREG18/DVDD FSYNC OUT+ OUT+ SDATA BCLK PGND AIN DIO DIN AOUT AOUT DIN AIN PWR PWR PWR DIN AOUT AOUT DIO DIN PWR E4 BST+ AIN 1 Description 5 V Regulator Output. Analog Ground. It is recommended to connect the AGND pin to a single ground plane on the board. Power Stage Ground. The PGND pin is shorted internally. It is recommended to connect PGND to a single ground plane on the board. Bootstrap Capacitor for OUT−. I2C Serial Data. I2C Address Selection. Power Stage Inverting Output. Power Stage Inverting Output. I2C Clock. Regulator Enable Tie to PVDD to Enable Regulators. Power Stage Supply. Power Stage Supply. 1.8 V Regulator Output/DVDD Input. TDM Frame Sync Input. Power Stage Noninverting Output. Power Stage Noninverting Output. Serial Data Input to DAC. TDM Bit Clock Input. Power Stage Ground. The PGND pin is shorted internally. It is recommended to connect PGND to a single ground plane on the board. Bootstrap Capacitor for OUT+. AOUT is analog output; PWR is power supply or ground pin; AIN is analog input; DIO is digital input/output; DIN is digital input. Rev. A| Page 9 of 41 SSM3515 Data Sheet 10k AMPLITUDE (dBV) AMPLITUDE (dBV) 1k 10k FREQUENCY (Hz) 20 10 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 –140 –150 –160 –170 –180 20 AMPLITUDE (dBV) AMPLITUDE (dBV) 1k 10k FREQUENCY (Hz) 1k 10k Figure 11. FFT, No Signal, Analog Gain = 8.4, RL = 4 Ω 13327-103 100 100 FREQUENCY (Hz) Figure 8. FFT, 60 dBFS Input, Analog Gain = 12.6, RL = 4 Ω 20 10 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 –140 –150 –160 –170 –180 20 10k Figure 10. FFT, 60 dBFS Input, Analog Gain = 15, RL = 4 Ω 13327-102 100 1k FREQUENCY (Hz) Figure 7. Fast Fourier Transform (FFT), 60 dBFS Input, Analog Gain = 8.4, RL = 4 Ω 20 10 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 –140 –150 –160 –170 –180 20 100 13327-105 1k FREQUENCY (Hz) 20 10 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 –140 –150 –160 –170 –180 20 100 1k 10k FREQUENCY (Hz) Figure 9. FFT, 60 dBFS Analog Gain = 14, RL = 4 Ω Figure 12. FFT, No Signal, Analog Gain =12.6, RL = 4 Ω Rev. A| Page 10 of 41 13327-106 100 13327-104 20 10 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 –140 –150 –160 –170 –180 20 AMPLITUDE (dBV) 20 10 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 –140 –150 –160 –170 –180 20 13327-101 AMPLITUDE (dBV) TYPICAL PERFORMANCE CHARACTERISTICS 1 100mW 1W 5W 0.1 THD + N (%) 0.01 100 20 1k 10k FREQUENCY (Hz) 0.001 20 10k Figure 16. THD + N vs. Frequency, RL = 4 Ω, PVDD = 12 V 1 100mW 1W 10W THD + N (%) 0.1 100 20 1k 10k FREQUENCY (Hz) 0.001 20 100 1k 10k FREQUENCY (Hz) Figure 14. FFT, No Signal, Analog Gain = 15, RL = 4 Ω 13327-009 0.01 13327-108 Figure 17. THD + N vs. Frequency, RL = 4 Ω, PVDD = 17 V 1 1 100mW 1W 100mW 1W 0.1 THD + N (%) THD + N (%) 0.1 0.01 0.001 20 100 1k 10k FREQUENCY (Hz) 13327-007 0.01 Figure 15. THD + N vs. Frequency into RL = 4 Ω, PVDD = 4.5 V 0.001 20 100 1k 10k FREQUENCY (Hz) Figure 18. THD + N vs. Frequency, RL = 8 Ω, PVDD = 4.5 V Rev. A| Page 11 of 41 13327-010 AMPLITUDE (dBV) 1k FREQUENCY (Hz) Figure 13. FFT, No Signal, Analog Gain = 14, RL = 4 Ω 20 10 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 –140 –150 –160 –170 –180 100 13327-008 20 10 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 –140 –150 –160 –170 –180 SSM3515 13327-107 AMPLITUDE (dBV) Data Sheet SSM3515 Data Sheet 1 10 100mW 1W 5W 4.5V 12V 17V 1 THD + N (%) THD + N (%) 0.1 0.1 0.01 100 1k 10k FREQUENCY (Hz) Figure 19. THD + N vs. Frequency, RL = 8 Ω, PVDD = 12 V 0.001 10µ 100µ 1m 10m 100m 1 10 POWER (W) 13327-014 0.001 20 13327-011 0.01 Figure 22. THD + N vs. Output Power, RL = 4 Ω, Analog Gain = 12.6 10 1 100mW 1W 5W 4.5V 14V 17V 1 THD + N (%) THD + N (%) 0.1 0.1 0.01 100 10k 1k FREQUENCY (Hz) 0.001 10µ 10m 100m 1 10 Figure 23. THD + N vs. Output Power, RL = 4 Ω, Analog Gain = 14 10 10 8V 4.5V 17V 1 4.5V 15V 17V 1 THD + N (%) 0.1 0.01 0.1 100µ 1m 10m 100m 1 10 POWER (W) 13327-013 0.01 Figure 21. THD + N vs. Output Power, RL = 4 Ω, Analog Gain = 8.4 0.001 10µ 100µ 1m 10m 100m 1 10 POWER (W) Figure 24. THD + N vs. Output Power, RL = 4 Ω, Analog Gain = 15 Rev. A| Page 12 of 41 13327-016 THD + N (%) 1m POWER (W) Figure 20. THD + N vs. Frequency, RL = 8 Ω, PVDD = 17 V 0.001 10µ 100µ 13327-015 0.001 20 13327-012 0.01 Data Sheet 10 4.5V 14V 17V 1 THD + N (%) THD + N (%) 1 0.1 1m 10m 100m 1 10 0.001 10µ 13327-017 100µ POWER (W) 1m 10m 100m 1 10 Figure 28. THD + N vs. Output Power, RL = 8 Ω, Analog Gain = 15 14 4.5V 12V 14V POUT 10%, 8V GAIN POUT 1%, 8V GAIN 12 1 10 POWER (W) THD + N (%) 100µ POWER (W) Figure 25. THD + N vs. Output Power, RL = 8 Ω, Analog Gain = 8.4 10 0.1 0.01 0.01 0.001 10µ 4.5V 15V 17V 13327-020 10 SSM3515 0.1 8 6 4 0.01 100µ 1m 10m 100m 1 10 POWER (W) 0 6 7 8 9 10 11 12 13 14 PVDD (V) Figure 26. THD + N vs. Output Power, RL = 8 Ω, Analog Gain = 12.6 10 5 13327-021 0.001 10µ 13327-018 2 Figure 29. Output Power vs. PVDD Supply Voltage (PVDD), RL = 4 Ω, Analog Gain = 8.4 30 4.5V 14V 16V POUT 10% POUT 1% 25 1 POWER (W) THD + N (%) 20 0.1 15 10 0.01 100µ 1m 10m 100m 1 10 POWER (W) 0 5 6 7 8 9 10 11 12 13 14 15 16 17 PVDD (V) Figure 30. Output Power vs. PVDD, RL = 4 Ω, Analog Gain = 12.6 Figure 27. THD + N vs. Output Power, RL = 8 Ω, Analog Gain = 14 Rev. A| Page 13 of 41 13327-022 0.001 10µ 13327-019 5 SSM3515 35 Data Sheet 100 POUT 10% POUT 1% 30 90 80 70 EFFICIENCY (%) POWER (W) 25 20 15 60 50 40 30 10 20 5 6 7 8 9 10 11 12 13 14 15 16 17 PVDD (V) 0 13327-023 0 10 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 34. Efficiency vs. POUT, RL = 4 Ω, FB and 220 pF Capacitor, PVDD = 5 V, Analog Gain = 8.4 100 POUT 10% POUT 1% 35 0 POUT (W) Figure 31. Output Power vs. PVDD, RL = 4 Ω, Analog Gain = 14 40 5V FB NORMAL 5V FB LOW 13327-026 5 90 80 30 EFFICIENCY (%) POWER (W) 70 25 20 15 60 50 40 30 10 20 6 7 8 9 10 11 12 13 14 15 16 17 PVDD (V) 80 80 70 70 EFFICIENCY (%) 90 60 50 40 20 10 5V NO FB NORMAL 5V NO FB LOW 1.5 2.0 2.5 POUT (W) 3.0 3.5 4.0 4.5 5.0 20 25 40 20 1.0 15 50 30 0.5 10 60 30 0 13327-025 EFFICIENCY (%) 100 90 0 5 Figure 35. Efficiency vs. POUT, RL = 4 Ω, No FB and 220 pF, PVDD = 12 V, Analog Gain = 12.6 100 0 0 POUT (W) Figure 32. Output Power vs. PVDD, RL = 4 Ω, Analog Gain = 15 10 12V NO FB NORMAL 12V NO FB LOW Figure 33. Efficiency vs. Output Power (POUT), RL = 4 Ω, No Ferrite Bead (FB) and 220 pF Capacitor, PVDD = 5 V, Analog Gain = 8.4 12V FB NORMAL 12V FB LOW 0 5 10 15 POUT (W) 20 25 13327-028 5 0 13327-024 0 10 13327-027 5 Figure 36. Efficiency vs. POUT, RL = 4 Ω, FB and 220 pF Capacitor, PVDD = 12 V, Analog Gain = 12.6 Rev. A| Page 14 of 41 SSM3515 0.010 90 0.009 80 0.008 70 0.007 60 0.006 IPVDD (A) 100 50 40 0.004 30 0.003 20 0.002 0.001 17V FB NORMAL 17V FB LOW 0 0 5 10 15 20 25 30 35 40 POUT (W) 0 5 7 9 11 13 15 17 13327-032 10 4Ω + 15µH FB 220pF LOW MODE 4Ω + 15µH FB 220pF NORMAL MODE 0.005 13327-029 EFFICIENCY (%) Data Sheet 19 PVDD (V) Figure 37. Efficiency vs. POUT, RL = 4 Ω, FB and 220 pF Capacitor, PVDD = 17 V, Analog Gain = 14 Figure 40. Quiescent Current, RL = 4 Ω, FB and 220 pF Capacitor, Analog Gain = 12 100 7 POUT 10% POUT 1% 90 6 80 5 POWER (W) EFFICIENCY (%) 70 60 50 40 30 4 3 2 20 17V NO FB NORMAL 17V NO FB LOW 0 5 10 15 20 25 30 35 40 45 POUT (W) 0 13327-030 0 5 7 8 9 10 11 12 13 14 PVDD (V) Figure 38. Efficiency vs. POUT, RL = 4 Ω, No FB and 220 pF Capacitor, PVDD = 17 V, Analog Gain = 14 Figure 41. Output Power vs. PVDD, RL = 8 Ω, Analog Gain = 8 14 0.007 POUT 10% POUT 1% NO LOAD NO FB NORMAL MODE NO LOAD NO FB LOW MODE 12 0.005 10 0.004 0.003 8 6 0.002 4 0.001 2 0 5 7 9 11 13 15 17 PVDD (V) Figure 39. Quiescent Current, RL = 4 Ω, No FB and 220 pF Capacitor, Analog Gain = 12 0 5.0 7.5 10 12.5 PVDD (V) Figure 42. Output Power vs. PVDD, RL = 8 Ω, Analog Gain = 12 Rev. A| Page 15 of 41 13327-034 POWER (W) 0.006 13327-031 IPVDD (AMP) 6 13327-033 1 10 SSM3515 18 Data Sheet 100 POUT 10% POUT 1% 16 90 80 14 70 EFFICIENCY (%) 10 8 6 60 50 40 30 20 2 10 0 0 5 10 13327-035 4 15 PVDD (V) Figure 43. Output Power vs. PVDD, RL = 8 Ω, Analog Gain = 14 NORMAL NO FB/220pF LOW NO FB/220pF 0 2 4 6 8 10 12 POUT (W) 13327-038 POWER (W) 12 Figure 46. Efficiency vs. POUT, RL = 8 Ω, No FB and 220 pF Capacitor, PVDD = 12 V, Analog Gain = 12.6 20 100 17V NO FB NORMAL 17V NO FB LOW POUT 10% POUT 1% 80 EFFICIENCY (%) POWER (W) 15 10 60 40 5 5 15 10 0 13327-036 0 PVDD (V) Figure 44. Output Power vs. PVDD, RL = 8 Ω, Analog Gain = 15 0 5 10 15 20 POUT (W) 13327-041 20 Figure 47. Efficiency vs. POUT, RL = 8 Ω, No FB and 220 pF Capacitor, PVDD = 17 V, Analog Gain = 14 100 100 5V NO FB NORMAL 5V NO FB LOW 90 80 80 EFFICIENCY (%) EFFICIENCY (%) 70 60 40 60 50 40 30 20 0 2 1 POUT (W) 3 13327-037 10 0 Figure 45. Efficiency vs. POUT, RL = 8 Ω, No FB and 220 pF Capacitor, PVDD = 5 V, Analog Gain = 8.4 5V NO FB NORMAL 5V NO FB LOW 0 0 2 1 3 POUT (W) Figure 48. Efficiency vs. POUT, RL = 8 Ω, FB and 220 pF Capacitor, PVDD = 5 V, Analog Gain = 8.4 Rev. A| Page 16 of 41 13327-040 20 Data Sheet SSM3515 100 100 12V NO FB NORMAL 12V NO FB LOW 90 80 80 EFFICIENCY (%) EFFICIENCY (%) 70 60 50 40 60 40 30 20 20 10 0 2 4 6 8 10 12 14 POUT (W) 0 30 100 17V FB LOW 17V FB NORMAL 17V NO FB NORMAL 17V NO FB LOW 80 EFFICIENCY (%) 60 40 60 40 20 20 10 5 15 20 POUT (W) 0 13327-042 0 0 5 10 15 20 25 30 35 40 45 50 POUT (W) Figure 50. Efficiency vs. POUT, RL = 8 Ω, FB and 220 pF Capacitor, PVDD = 17 V, Analog Gain = 14 13327-047 EFFICIENCY (%) 20 Figure 52. Efficiency vs. POUT, RL = 3 Ω, No FB and 220 pF Capacitor, PVDD = 12 V, Analog Gain = 12.6 80 0 10 POUT (W) Figure 49. Efficiency vs. POUT, RL = 8 Ω, FB and 220 pF Capacitor, PVDD = 12 V, Analog Gain = 12.6 100 0 13327-046 NORMAL FB/220pF LOW FB/220pF 13327-039 0 Figure 53. Efficiency vs. POUT, RL = 3 Ω, No FB and 220 pF Capacitor, PVDD = 17 V, Analog Gain = 14 100 100 5V FB NORMAL 5V FB LOW 80 EFFICIENCY (%) 60 40 20 40 20 5V NO FB NORMAL 5V NO FB LOW 0 4 2 POUT (W) 6 0 13327-045 0 60 Figure 51. Efficiency vs. POUT, RL = 3 Ω, No FB and 220 pF Capacitor, PVDD = 5 V, Analog Gain = 8.4 0 4 2 POUT (W) 6 13327-048 EFFICIENCY (%) 80 Figure 54. Efficiency vs. POUT, RL = 3 Ω, FB and 220 pF Capacitor, PVDD = 5 V, Analog Gain = 8.4 Rev. A| Page 17 of 41 SSM3515 Data Sheet 40 100 12V FB NORMAL 12V FB LOW POUT 10% POUT 1% 35 80 POWER (W) EFFICIENCY (%) 30 60 40 25 20 15 10 20 0 10 20 30 POUT (W) 0 13327-049 8 PVDD (V) Figure 55. Efficiency vs. POUT, RL = 3 Ω, FB and 220 pF Capacitor, PVDD = 12 V, Analog Gain = 12.6 Figure 58. Output Power vs. PVDD, RL = 3 Ω, Analog Gain = 12.6 100 50 17V FB LOW 17V FB NORMAL POUT 10% POUT 1% 40 POWER (W) EFFICIENCY (%) 80 60 40 20 30 20 10 0 5 10 15 30 25 20 35 40 45 50 POUT (W) 0 13327-050 0 14 12 10 15 Figure 59. Output Power vs. PVDD, RL = 3 Ω, Analog Gain = 14 50 POUT 10% POUT 1% 16 10 PVDD (V) Figure 56. Efficiency vs. POUT,, RL = 3 Ω, FB and 220 pF Capacitor, PVDD = 17 V, Analog Gain = 14 18 5 13327-053 0 13327-052 5 POUT 10% POUT 1% 40 14 POWER (W) 10 8 30 20 6 4 10 0 5 6 7 8 9 10 11 12 13 14 PVDD (V) Figure 57. Output Power vs. PVDD, RL = 3 Ω, Analog Gain = 8.4 0 5 10 15 PVDD (V) Figure 60. Output Power vs. PVDD, RL = 3 Ω, Analog Gain = 15 Rev. A| Page 18 of 41 13327-054 2 13327-051 POWER (W) 12 Data Sheet SSM3515 THEORY OF OPERATION OVERVIEW POWER-UP SEQUENCE The SSM3515 Class-D audio amplifier features a filterless modulation scheme that greatly reduces the external component count, conserving board space and reducing system cost. The SSM3515 does not require an output filter; it relies on the inherent inductance of the speaker coil and the natural filtering of the speaker and human ear to recover the audio component of the square wave output. If the REG_EN pin is tied to PVDD, the power-up sequence is performed internally. As the PVDD voltage ramps up, the VREG18/DVDD voltage (generated internally) also ramps up. The typical wait time before the I2C commands can be sent to the device depends on the PVDD supply ramp-up time. Most Class-D amplifiers use some variation of pulse-width modulation (PWM), but the SSM3515 uses Σ-Δ modulation to determine the switching pattern of the output devices, resulting in a number of important benefits. Σ-Δ modulators do not produce a sharp peak with many harmonics in the AM broadcast band, as pulse-width modulators often do. Σ-Δ modulation reduces the amplitude of spectral components at high frequencies, reducing EMI emission that may otherwise be radiated by speakers and long cable traces. Due to the inherent spread spectrum nature of Σ-Δ modulation, the need for oscillator synchronization is eliminated for designs incorporating multiple SSM3515 amplifiers. The SSM3515 also integrates overcurrent and temperature protection and a thermal warning with optional programmable gain reduction. POWER SUPPLIES The power supply pins on the SSM3515 are PVDD, VREG50/ AVDD, and VREG18/DVDD. PVDD, the battery supply, is used for the output stage and also supplies power to the 5 V regulator. In addition, it can be used to supply power to the 1.8 V regulator. This pin must be decoupled to ground using a 100 nF capacitor in parallel with a 1 µF MLCC capacitor to ground as close as possible to the respective pins. In addition, a bulk electrolytic capacitor may be required depending on the output power to supply the current at low frequency output. Typically, 220 µF and 25 V is recommended. This must be sized according to the power supply regulation in the system. VREG50/AVDD (5 V) is the analog supply used for the input stage, modulator, power stage driver, and other blocks. It uses the VREG50/AVDD pin. It is generated internally by the integrated 5 V linear regulator. This pin must be decoupled to ground using the 100 nF and 10 µF capacitor. VREG18/DVDD (1.8 V) is the supply for the digital circuitry. It uses the VREG18/DVDD pin. It can be generated internally using an integrated 1.8 V linear regulator. Alternatively, an external 1.8 V supply can be used to save the power dissipation. The VREG18/DVDD pin must be decoupled to ground using 100 nF and 10 µF MLCC capacitors close to the pin. If the REG_EN pin is tied low, ensure that 1.8 V is supplied externally and that PVDD is greater than 4.5 V before sending I2C commands to enable the device. POWER-DOWN OPERATION The SSM3515 offers several power down options via I2C. Register 0x00 provides multiple options for setting the various power-down modes. Set the SPWDN bit to 1 to fully power down the device. Only the I2C, 1.8 V regulator is kept alive. The SSM3515 monitors both the BCLK and FSYNC pins for clock presence when in 2-wire mode. When no BCLK or FSYNC signals are present, the device automatically powers down all internal circuitry to its lowest power state. When a BCLK or FSYNC signal returns, the device automatically powers up following its usual power up sequence. When enabled, the APWDN_EN bit (auto power down), activates a low power state as soon as 2048 consecutive zero input samples are received. Only the I2C and digital audio input blocks are kept active. REG_EN PIN SETUP AND CONTROL The REG_EN (regulator enable) pin enables or disables the internal 1.8 V regulator. Table 10. Regulator Enable Pin Function REG_EN Ground PVDD 1.8 V Regulator Disabled Enabled Comment External 1.8 V Internal 1.8 V The status of the REG_EN pin determines if the 1.8 V supply is generated internally or if it must be provided externally. If the REG_EN pin is tied to PVDD, the internal 1.8 V regulator is enabled. If the REG_EN pin is tied to ground, a 1.8 V supply must be supplied externally to the VREG18/DVDD pin for the device to operate. For the device to respond to I2C commands, the 1.8 V supply must be stable. Rev. A| Page 19 of 41 SSM3515 Data Sheet ADDR PIN SETUP AND CONTROL The ADDR pin sets the device I2C address. See Table 11 for details. CLOCKING In 3-wire mode (BCLK, FSYNC, SDATA), a BCLK signal must be provided to the SSM3515 for correct operation. The BCLK signal must have a minimum frequency of 2.048 MHz. The BCLK signal is used for internal clocking of the device. The BCLK rate is detected automatically, but the sampling frequency must be known to the device. The supported BCLK rates at 32 kHz to 48 kHz are 50, 64, 100, 128, 192, 200, 256, 384, 400, and 512 times the sample rate. Table 11. Pin Setup List ADDR Pin Connected to Ground Using a 47 kΩ Resistor Open (No Connection) Connected to 1.8 V Using a 47 kΩ Resistor Connected to 1.8 V SCL Pin SCL SCL SCL SCL SDA Pin Control Mode 7-Bit I2C Address TDM Slot SDA SDA SDA SDA I2C 0x14 0x15 0x16 0x17 1 2 3 4 I2C I2C I2C Rev. A| Page 20 of 41 Data Sheet SSM3515 DIGITAL AUDIO SERIAL INTERFACE The SSM3515 includes a standard serial audio interface that is slave only. The interface is capable of receiving I2S, left justified, PCM, or TDM formatted data. The serial interface has three main operating modes, listed in Table 12. Table 12. Operating Modes Mode 2-Channel (Stereo) Format I 2 S/left justified Multichannel TDM I 2 S/left justified Comments Register control using I 2 C port Register control using I 2 C port I2C CONTROL The SSM3515 supports a 2-wire serial (I2C-compatible) microprocessor bus driving multiple peripherals. Two pins, serial data (SDA) and serial clock (SCL), carry information between the SSM3515 and the system I2C master controller. The SSM3515 is always a slave on the bus, meaning it cannot initiate a data transfer. Each slave device is recognized by a unique address. Using the ADDR pin provides the four device addresses, which are listed in Table 11. The address byte format is shown in Table 13. The address resides in the first seven bits of the I2C write. The LSB of this byte sets either a read or write operation. Logic Level 1 corresponds to a read operation, and Logic Level 0 corresponds to a write operation. Stereo modes, typically I2S or left justified, are used when there is one or two devices on the interface bus. Standard multichannel TDM modes are more flexible and offer the ability to have multiple devices on the bus. In both of these cases, the register control uses an I2C port. Connect 2.2 kΩ pull-up resistors on the lines connected to the SDA and SCL pins. The voltage on these signal lines must not be more than 5 V. STEREO (I2S/LEFT JUSTIFIED) OPERATING MODE Addressing Stereo modes use both edges of FSYNC to determine placement of data. Stereo mode is enabled when SAI_MODE = 0 and the data format is determined by the SDATA_FMT register setting. Initially, each device on the I2C bus is in an idle state, monitoring the SDA and SCL lines for a start condition and the proper address. The I2C master initiates a data transfer by establishing a start condition, defined by a high to low transition on SDA while SCL remains high. This indicates that an address or data stream follows. All devices on the bus respond to the start condition and shift the next eight bits (the 7-bit address plus the R/W bit) MSB first. The device that recognizes the transmitted address responds by pulling the data line low during the ninth clock pulse. This ninth bit is an acknowledge bit. All other devices withdraw from the bus at this point and return to the idle condition. The device address for the SSM3515 is determined by the state of the ADDR pin. See Table 11 for four available addresses. The I2S or left justified interface formats accept any number of BCLK cycles per FSYNC cycle. Sample rates from 8 kHz to 192 kHz are accepted. The maximum BCLK rate is 24.576 MHz. TDM OPERATING MODE The TDM operating mode allows multiple chips to use a single serial interface bus for audio data. The FSYNC signal operates at the desired sample rate. A rising edge of the FSYNC signal indicates the start of a new frame. For proper operation, this signal must be one BCLK cycle wide, transitioning on a falling BCLK edge. The MSB of data must be present on the SDATA one BCLK cycle later. The SDATA signal latches on the rising edge of BCLK. Each chip on the TDM bus can occupy 16, 24, 32, 48, or 64 BCLK cycles. This is set with the TDM_BCLKS bits and all devices on the bus must have the same setting. Up to 16 SSM3515 devices can be used on a single TDM bus, but only 4 unique I2C device addresses are available. The SSM3515 automatically determines how many possible devices can be placed on the bus from the BCLK rate. There is no limit to the total number of BCLK cycles per FSYNC pulse. Which chip slot each SSM3515 uses is determined by the ADDR pin settings (see Table 11 for details), or by the TDM_SLOT bits in Register 0x05. The input data width to the DAC can be either 16-bit or 24-bit. The R/W bit determines the direction of the data. A Logic 0 on the LSB of the first byte means the master writes information to the peripheral, whereas a Logic 1 means the master reads information from the peripheral after writing the subaddress and repeating the start address. A data transfer occurs until a stop condition is encountered. A stop condition occurs when SDA transitions from low to high while SCL is held high. The timing for the I2C port is shown in Figure 61. Stop and start conditions can be detected at any stage during the data transfer. If these conditions are asserted out of sequence with normal read and write operations, the SSM3515 immediately jumps to the idle condition. During a given SCL high period, the user must issue only one start condition, one stop condition, or a single stop condition followed by a single start condition. If the user issues an invalid subaddress, the SSM3515 does not issue an acknowledge and returns to the idle condition. If the user exceeds the highest subaddress while in auto-increment mode, one of two actions is taken. Rev. A| Page 21 of 41 SSM3515 Data Sheet In read mode, the SSM3515 outputs the highest subaddress register contents until the master device issues a no acknowledge, indicating the end of a read. A no acknowledge condition is when the SDA line is not pulled low on the ninth clock pulse on SCL. If the highest subaddress location is reached while in write mode, the data for the invalid byte is not loaded into any subaddress register, a no acknowledge is issued by the SSM3515, and the device returns to the idle condition. I 2C Read and Write Operations Figure 62 shows the timing of a single-word write operation. Every ninth clock, the SSM3515 issues an acknowledge (ACK) by pulling SDA low. every byte because the requested subaddress corresponds to a register or memory area with a byte word length. The timing of a single word read operation is shown in Figure 64. Note that the first R/W bit is 0, indicating a write operation. This is because the subaddress still must be written to set up the internal address. After the SSM3515 acknowledges the receipt of the subaddress, the master must issue a repeated start command followed by the chip address byte with the R/W set to 1 (read). This causes the SSM3515 SDA to reverse and begin driving data back to the master. The master then responds every ninth pulse with an acknowledge pulse to the SSM3515. See Table 15 for a list of abbreviations in Figure 62 through Figure 65. Figure 63 shows the timing of a burst mode write sequence. This figure shows an example in which the target destination registers are two bytes. The SSM3515 increments its subaddress register Table 13. I 2 C Device Address Byte Format Using the ADDR Pin1 Bit 0 0 1 Bit 1 0 Bit 2 1 Bit 3 0 Bit 4 1 Bit 5 X Bit 6 X X means don’t care. Table 14. ADDR Pin to I 2 C Device Address Mapping ADDR Pin GND Pull-Down 47 kΩ Resistor Open Pull-Up 47 kΩ Resistor DVDD I2C Address Bit 5 Not applicable 0 0 1 1 ADDR Voltage GND 0.25 × VREG18/DVDD 0.5 × VREG18/DVDD 0.75 × VREG18/DVDD DVDD Table 15. Abbreviations for Figure 62 Through Figure 65 Symbol Meaning S P AM AS Start bit Stop bit Acknowledge by master Acknowledge by slave Rev. A| Page 22 of 41 I2C Address Bit 6 Not applicable 0 1 0 1 Bit 7 R/W Data Sheet SSM3515 SCK SDA START BY MASTER ACK ACK R/W FRAME 2 SUBADDRESS BYTE FRAME 1 CHIP ADDRESS BYTE SCK (CONTINUED) ACK ACK STOP BY MASTER FRAME 4 DATA BYTE 2 FRAME 3 DATA BYTE 1 2 START BIT I2C ADDRESS (7 BITS) R/W = 0 SUBADDRESS (8 BITS) ACK BY SLAVE DATA BYTE 1 (8 BITS) ACK BY SLAVE STOP BIT 13327-067 Figure 61. I C Read/Write Timing S CHIP ADDRESS, R/W = 0 AS SUBADDRESS AS DATA WORD 1 AS DATA WORD 2 AS … P 13327-068 Figure 62. Single Word I2C Write Format CHIP ADDRESS, R/W = 0 AS SUBADDRESS AS S CHIP ADDRESS, R/W = 1 AS DATA BYTE 1 AM DATA BYTE N P 13327-069 S DATA WORD 1 AM … P 13327-070 Figure 63. Burst Mode I2C Write Format Figure 64. Single Word I2C Read Format S CHIP ADDRESS, R/W = 0 AS SUBADDRESS AS S CHIP ADDRESS, R/W = 1 AS Figure 65. Burst Mode I2C Read Format Rev. A| Page 23 of 41 13327-066 SDA (CONTINUED) SSM3515 Data Sheet ANALOG AND DIGITAL GAIN EMI NOISE Several selectable settings are available for the analog gain of the system. These provide optimal gain settings at various PVDD supply voltages. The ANA_GAIN bits are available in Register 0x01, Bits[1:0]. The SSM3515 uses a proprietary modulation and spread spectrum technology to minimize EMI emissions from the device. The SSM3515 can pass FCC Class B emissions testing with an unshielded 20-inch cable using ferrite bead-based filtering. For applications that have difficulty passing FCC Class B emission tests, the SSM3515 includes a modulation select pin (ultralow EMI emission mode) that significantly reduces the radiated emissions at the Class-D outputs, particularly above 100 MHz. Note that reducing the supply voltage greatly reduces radiated emissions. The available options are as shown in Table 16. Table 16. Analog Gain Options PVDD 5 V to 9 V 9 V to 13 V 13 V to 14 V 14 V to 16 V ANA_GAIN 00 01 10 11 Amplifier Analog Gain Selection 8.4 V full-scale gain mapping 12.6 V full-scale gain mapping 14 V full-scale gain mapping 15 V full-scale gain mapping OUTPUT MODULATION DESCRIPTION POP AND CLICK SUPPRESSION The SSM3515 uses three-level, Σ-Δ output modulation. Each output can swing from GND to PVDD and vice versa. Ideally, when no input signal is present, the output differential voltage is 0 V because there is no need to generate a pulse. In a real-world situation, there are always noise sources present. Voltage transients at the output of audio amplifiers may occur when shutdown is activated or deactivated. Voltage transients as small as 10 mV can be heard as an audible pop in the speaker. Clicks and pops are defined as undesirable audible transients generated by the amplifier system that do not come from the system input signal. Due to this constant presence of noise, a differential pulse is occasionally generated in response to this stimulus. A small amount of current flows into the inductive load when the differential pulse is generated. However, most of the time, the output differential voltage is 0 V. This feature ensures that the current flowing through the inductive load is small. Such transients may be generated when the amplifier system changes its operating mode. For example, system power-up and power-down can be sources of audible transients. When the user sends an input signal, an output pulse is generated to follow the input voltage. The differential pulse density is increased by raising the input signal level. Figure 66 depicts three-level, Σ-Δ output modulation with and without input stimulus. There is also a digital gain or volume control that provides fine control in 0.375 dB steps from −70 dB to +24 dB. The SSM3515 has a pop and click suppression architecture that reduces these output transients, resulting in noiseless activation and deactivation. Either mute or power-down must be set before the BCLK is removed to ensure a pop free power-down. OUTPUT = 0V +5V OUT+ 0V +5V OUT– 0V +5V VOUT 0V –5V OUTPUT > 0V +5V OUT+ 0V +5V OUT– 0V +5V VOUT 0V OUTPUT < 0V +5V OUT+ 0V +5V OUT– 0V –5V NOTES 1. VOUT = (OUT+) – (OUT−) MEASURED ACROSS THE LOAD. 13327-071 0V Figure 66. Three-Level, Σ-Δ Output Modulation With and Without Input Stimulus Rev. A| Page 24 of 41 Data Sheet SSM3515 FAULTS AND LIMITER STATUS REPORTING VBAT SENSING The SSM3515 offers comprehensive protections against the faults at the outputs and reporting to help with system design. The faults listed in Table 17 are reported using the status registers. The SSM3515 contains an 8-bit ADC that measures the voltage of the battery voltage (VBAT) supply. The battery voltage information is stored in Register 0x06 as an 8-bit unsigned format. The ADC input range is fixed internally as 3.8 V to 16.2 V. To convert the hexidecimal (hex) value to the voltage value, use the following steps: Table 17. Register 0x0A, Faults Fault Type 5 V Regulator UV Flag Set Condition 5 V regulator voltage at VREG50/AVDD < 3.6 V Limiter engaged Limiter/Gain Reduction Engage Clipping DAC clipping Output Overcurrent (OC) Die Overtemperature (OT) Die Overtemperature Warning (OTW) Battery Voltage > VBAT_INF Output current > 6 A peak Die temperature > 145°C Die temperature > 117°C Battery voltage PVDD > VBAT_INF Status Reported Register Register 0x0A, Bit 6, UVLO_VREG Register 0x0A, Bit 5, LIM_EG Register 0x0A, Bit 4, CLIP Register 0x0A, Bit 3, AMP_OC Register 0x0A, Bit 2, OTF Register 0x0A, Bit 4, OTW Register 0x0A, Bit 0, BAT_WARN The faults listed in Table 17 are reported in Register 0x0A and can be read via I2C by the microcontroller in the system. In the event of a fault occurrence, how the device reacts to the faults can be controlled by using Register 0x0B. Table 18. Register 0x0B, Fault Recovery Fault Type OTW Manual Recovery Autorecovery Attempts UV Die OT OC Flag Set Condition The amount of gain reduction applied if there is an OTW Use to attempt manual recovery in case of a fault event When autorecovery from faults is used, set the number of attempts using this bit Recovery can be automatic or manual Recovery can be automatic or manual Recovery can be automatic or manual Status Reported Register Register 0x0B, Bits[7:6], OTW_GAIN Register 0x0B, Bit 5, MRCV Register 0x0B, Bits[4:3], MAX_AR Register 0x0B, Bit 2, ARCV_UV Register 0x0B, Bit 1, ARCV_OT Register 0x0B, Bit 0, ARCV_OC When the automatic recovery mode is set, the device attempts to recover itself after the fault event and, in case the fault persists, then the device sets the fault again. This process repeats until the fault is resolved. 1. 2. Convert the hex value to decimal. For example, if the hex value is 0xA9, the decimal value = 169. Calculate the voltage using the following equation: Voltage = 3.8 V + 12.4 V × Decimal Value/255 With a decimal value of 169, Voltage = 3.8 V + 12.4 V × 169/255 = 12.02 V LIMITER AND BATTERY TRACKING THRESHOLD CONTROL The SSM3515 contains an output limiter that can be used limit the peak output voltage of the amplifier. The limiter works on the rms and peak value of the signal. The limiter threshold, slope, attack rate, and release rate are programmable using Register 0x07, Register 0x08, and Register 0x09. The limiter can be enabled or disabled using LIM_EN, Bits[1:0] in Register 0x07. The threshold at which the output is limited is determined by the LIM_THRES register setting, in Register 0x08, Bits[7:3]. When the ouput signal level exceeds the set therhold level, the limiter activates and limits the signal level to the set limit. Below the set threshold, the output level is not affected. The limiter threshold can be set from 1 V peak to 15 V peak. The limiter threshold can be set above the maximum output voltage of the amplifier. In this case, the limiter allows maximum peak output; in other words, the output may clip depending on the power supply voltage and not the limiter. The limiter threshold can be set as fixed or to vary with the battery voltage via the VBAT_TRACK bit (Register 0x07, Bit 2). When set to fixed, the limiter threshold is fixed and does not vary with battery voltage. The threshold can be set from 1 V peak to 15 V peak using the LIM_THRES bit (see Figure 68). When set to a variable threshold, the SSM3515 monitors the VBAT supply and automatically adjusts the limiter threshold based on the VBAT supply voltage. The VBAT supply voltage at which the limiter threshold level begins to decrease the output level is determined by the VBAT inflection point, the VBAT_INF bits (Register 0x09, Bits[7:0]). When the manual recovery mode is used, the device shuts down and the recovery must be attempted using the system microcontroller. Rev. A| Page 25 of 41 SSM3515 Data Sheet The limiter, when active, reduces the gain of the amplifier. The rate of gain reduction or attack rate is determined by the LIM_ATR bits (Register 0x07, Bits[5:4]). Similarly, when the signal level drops below the limiter threshold, the gain is restored. The gain release rate is determined by the LIM_RRT bits (Register 0x07, Bits[7:6]). LIM_EN = 00 VBAT_TRACK = 0 AMPLIFIER CLIPPING LEVEL Voltage = 3.8 + 12.4 × Decimal Value/255 Convert the decimal value to an 8-bit hex value and use it to set the VBAT_INF bits. The rate at which the limiter threshold is lowered relative to the amount change in VBAT below the VBAT_INF point is determined by the slope bits (Register 0x08, Bits[1:0]). The slope is the ratio of the limiter threshold reduction to the VBAT voltage reduction. INPUT LEVEL Slope = ΔLimiter Threshold/ΔVBAT Figure 67. Limiter Example (LIM_EN = 0b0, VBAT_TRACK = 0bx) LIMITER THRESHOLD FIXED AT SET VALUE AND DOES NOT TRACK VBAT LIM_THRES The limiter offers various active modes which can be set using the LIM_EN bits (Register 0x07, Bits[1:0]) and the VBAT_TRACK bit, as shown in Table 19. When LIM_EN = 01, the limiter is enabled. When LIM_EN = 10, the limiter mutes the output if VBAT falls below VBAT_INF. When LIM_EN = 11, the limiter engages only when the battery voltage is lower than VBAT_INF. When VBAT is above VBAT_INF, no limiting occurs. Note that there is hysteresis on VBAT_INF for the limiter disengaging. VBAT Figure 68. Limiter Fixed (LIM_EN = 0b01, VBAT_TRACK = 0b0) Table 19. Limiter Modes VBAT_TRACK 0/1 0 1 0/1 0 1 Limiter No Fixed Variable Fixed Fixed Variable VBAT < VBAT_INF Not applicable Use the set threshold Lowers the threshold Mutes the output Use the set threshold Lowers the threshold VBAT > VBAT_INF Not applicable Use the set threshold Use the set threshold Use the set threshold No limiting No limiting Rev. A| Page 26 of 41 Comments See Figure 67 See Figure 68 See Figure 69 and Figure 70 See Figure 71 and Figure 72 See Figure 73 and Figure 74 13327-080 LIMITER THRESHOLD The slope ratio can be set from 1:1 to 4:1. This function is useful to prevent early shutdown under low battery conditions. As the VBAT voltage falls, the limiter threshold is lowered. This results in the lower output level and therefore helps to reduce the current drawn from the battery and in turn helps prevent early shutdown due to low VBAT. LIM_EN 00 01 01 10 11 11 13327-078 PEAK OUTPUT LEVEL The VBAT_INF point is defined as the battery voltage at which the limiter either activates or deactivates depending on the LIM_EN mode (see Table 19). When the battery voltage is greater than VBAT_INF, the limiter is not active. When it battery voltage is less than VBAT_INF, the limiter is activated. The VBAT_INF bits can be set from 3.8 V to 16.2 V. The 8-bit value for the voltage can be calculated using the following equation. Data Sheet SSM3515 LIM_EN = 01 VBAT_TRACK = 1 LIMITER THRESHOLD CHANGE FOR VBAT < VBAT_INF 13327-081 CHANGE IN LIM THRESHOLD = N × (VBAT_INF – VBAT) WHERE N = 1 TO 4, SET USING SLOPE BIT IN REG 0x08 INPUT LEVEL 13327-182 LIMITER THRESHOLD PEAK OUTPUT LEVEL LIMITER THRESHOLD FIXED AT SET VALUE AND DOES NOT TRACK VBAT LIM_THRES VBAT > VBAT_INF LIMITER LIMITER THRESHOLD SETTING VBAT Figure 69. Limiter Fixed (LIM_EN = 0b01, VBAT_TRACK = 0b1) Figure 72. Limiter Fixed (LIM_EN = 0b11, VBAT_TRACK = 0b0) LIM_EN = 11 VBAT_TRACK = 1 LIMITER THRESHOLD STAYS AT THE SET VALUE FOR VBAT > VBAT_INF VBAT > VBAT_INF LIMITER IS NOT ACTIVE AMPLIFIER CLIPPING LEVEL VBAT_INF PEAK OUTPUT LEVEL LIMITER THRESHOLD LOWERS FOR VBAT < VBAT_INF LIMITER THRESHOLD CHANGE FOR VBAT < VBAT_INF CHANGE IN LIM THRESHOLD = N × (VBAT_INF – VBAT) WHERE N = 1 TO 4, SET USING SLOPE BIT IN REG 0x08 VBAT INPUT LEVEL Figure 70. Output Level vs. VBAT in Limiter Tracking Mode (LIM_EN = 0b01, VBAT_TRACK = 0b1) Figure 73. Limiter Example (LIM_EN = 0b11, VBAT_TRACK = 0b1) LIM_EN = 11 VBAT_TRACK = 0 LIMITER THRESHOLD INACTIVE FOR VBAT > VBAT_INF LIMITER THRESHOLD SET LIM_THRES INPUT LEVEL Figure 71. Limiter Example (LIM_EN = 0b11, VBAT_TRACK = 0) 13327-082 LIMITER THRESHOLD SETTING NO CHANGE IN LIM THRESHOLD PER VBAT VBAT_INF SLOPE LIMITER THRESHOLD LOWERS FOR VBAT < VBAT_INF VBAT Figure 74. Output Level vs. VBAT in Limiter Tracking Mode (LIM_EN = 0b11, VBAT_TRACK = 0b1) Rev. A| Page 27 of 41 13327-183 AMPLIFIER CLIPPING LEVEL PEAK OUTPUT LEVEL 13327-083 SLOPE LIMITER THRESHOLD SETTING 13327-181 LIMITER THRESHOLD LIM_THRES SSM3515 Data Sheet LAYOUT As output power increases, care must be taken to lay out PCB traces and wires properly among the amplifier, load, and power supply; a poor layout increases voltage drops, consequently decreasing efficiency. A good practice is to use short, wide PCB tracks to decrease voltage drops and minimize inductance. For lowest dc resistance (DCR) and minimum inductance, ensure that track widths are at least 200 mil for every inch of length and use 1 oz or 2 oz copper. Use large traces for the power supply inputs and amplifier outputs. Proper grounding guidelines improve audio performance, minimize crosstalk between channels, and prevent switching noise from coupling into the audio signal. To maintain high output swing and high peak output power, the PCB traces that connect the output pins to the load and supply pins must be as wide as possible to maintain the minimum trace resistances. It is also recommended that a large ground plane be used for minimum impedances. In addition, good PCB layout isolates critical analog paths from sources of high interference. Separate high frequency circuits (analog and digital) from low frequency circuits. Properly designed multilayer PCBs can reduce EMI emission and increase immunity to the RF field by a factor of 10 or more, compared with double-sided boards. A multilayer board allows a complete layer to be used for the ground plane, whereas the ground plane side of a double-sided board is often disrupted by signal crossover. If the system has separate analog and digital ground and power planes, the analog ground plane must be directly beneath the analog power plane, and, similarly, the digital ground plane must be directly beneath the digital power plane. There must be no overlap between analog and digital ground planes or between analog and digital power planes. BOOTSTRAP CAPACITORS The output stage of the SSM3515 uses a high-side NMOS driver, rather than PMOS. Therefore, a bootstrap supply is needed to drive the high-side NMOS. To generate the boosted gate driver voltage for the high-side NMOS, a 0.22 μF bootstrap capacitor is used from each output pin to BST± pins. This capacitor boosts the voltage at BST± pins when the high-side NMOS turns on and acts as a floating power supply for that particular switching cycle. The bootstrap capacitor is charged during the low-side NMOS active period. POWER SUPPLY DECOUPLING To ensure high efficiency, low total harmonic distortion (THD), and high power supply rejection ratio (PSRR), proper power supply decoupling is necessary. Noise transients on the power supply lines are short duration voltage spikes. These spikes can contain frequency components that extend into the hundreds of megahertz. The power supply input must be decoupled with a good quality, low ESL, low ESR bulk capacitor larger than 220 µF. This capacitor bypasses low frequency noises to the ground plane. For high frequency transient noises, place 1 µF capacitors as close as possible to the PVDD pins of the device. Rev. A| Page 28 of 41 Data Sheet SSM3515 REGISTER SUMMARY Table 20. Register Summary Reg. Name Bits Bit 7 Bit 6 0x00 Power Control [7:0] APWDN_ EN BSNS_ PWDN 0x01 Gain and Edge Control [7:0] 0x02 DAC Control [7:0] 0x03 DAC Volume Control [7:0] 0x04 SAI Control 1 [7:0] DAC_POL 0x05 SAI Control 2 [7:0] DATA_ WIDTH 0x06 Battery Voltage Output [7:0] 0x07 Limiter Control 1 [7:0] 0x08 Limiter Control 2 [7:0] 0x09 Limiter Control 3 [7:0] 0x0A Status [7:0] 0x0B Fault Control [7:0] Bit 5 Bit 4 RESERVED DAC_HV Bit 3 Bit 2 RESERVED DAC_MUTE EDGE DAC_HPF Bit 1 Bit 0 Reset RW S_RST SPWDN 0x81 R/W 0x01 R/W 0x32 R/W 0x40 R/W 0x11 R/W 0x00 R/W 0x00 R RESERVED DAC_LPM ANA_GAIN RESERVED DAC_FS VOL BCLK_POL TDM_BCLKS RESERVED FSYNC_ MODE AUTO_ SLOT SDATA_ FMT SAI_MODE TDM_SLOT VBAT LIM_RRT LIM_ATR RESERVED LIM_THRES VBAT_ TRACK LIM_EN 0xA4 R/W RESERVED SLOPE 0x51 R/W VBAT_INF RESERVED UVLO_VREG OTW_GAIN LIM_EG MRCV CLIP AMP_OC MAX_AR Rev. A| Page 29 of 41 0x22 R/W OTF OTW BAT_WARN 0x00 R ARCV_UV ARCV_OT ARCV_OC 0x18 R/W SSM3515 Data Sheet REGISTER DETAILS POWER CONTROL REGISTER Address: 0x00, Reset: 0x81, Name: Power Control 7 6 5 1 0 4 3 0 0 2 1 0 0 0 0 1 [7] APW DN_EN (R/W) Auto Power-Down Enable 0: Auto Power-Down Disabled. 1: Auto Power-Down Enabled. [0] SPW DN (R/W) Master Software Power-Down 0: Normal Operation. 1: Software Master Power-Down. [6] BSNS_PWDN (R/W) Battery Voltage Sense Power-Down 0: Battery Voltage Sense Powered On. 1: Battery Voltage Sense Powered Off. [1] S_RST (W) Full Software Reset 0: Normal Operation. 1: Reset all blocks and I2C registers. [5:2] RESERVED Table 21. Bit Descriptions for Power Control Bits Bit Name 7 APWDN_EN 6 Settings Description Reset Access Auto Power-Down Enable. Auto power-down automatically puts the IC in a low power state when 2048 consecutive zero input samples have been received. 0x1 R/W 0x0 R/W 0 Auto Power-Down Disabled. 1 Auto Power-Down Enabled. When APWDN_EN = 1 the device automatically powers down when 2048 consecutive zero value input samples have been received. The device automatically powers up when a single nonzero sample is received. BSNS_PWDN Battery Voltage Sense Power-Down. 0 Battery Voltage Sense Powered On. 1 Battery Voltage Sense Powered Off. [5:2] RESERVED Reserved. 0x0 R/W 1 S_RST Full Software Reset. 0x0 W 0x1 R/W Description Reset Access Reserved. 0x0 R/W 0 0 Normal Operation. 1 Reset all Blocks and I 2 C Registers. Master Software Power-Down. Software power-down puts all blocks except the I 2 C interface in a low-power state. SPWDN 0 Normal Operation. 1 Software Master Power-Down. GAIN AND EDGE CONTROL REGISTER Address: 0x01, Reset: 0x01, Name: Gain and Edge Control 7 6 0 0 5 4 0 0 3 2 0 0 1 0 0 1 [7:5] RESERVED [1:0] ANA_GAIN (R/W) Amp Analog Gain Selection 00: 8.4V Full-Scale Gain Mapping. 01: 12.6V Full-Scale Gain Mapping. 10: 14V Full-Scale Gain Mapping. 11: 15V Full-Scale Gain Mapping. [4] EDGE (R/W) Edge Rate Control 0: Normal Operation. 1: Low EMI Mode Operation. [3:2] RESERVED Table 22. Bit Descriptions for Gain and Edge Control Bits Bit Name [7:5] RESERVED Settings Rev. A| Page 30 of 41 Data Sheet Bits Bit Name 4 EDGE [3:2] RESERVED [1:0] ANA_GAIN SSM3515 Settings Description Reset Access Edge Rate Control. This controls the edge speed of the power stage. The low EMI operation mode reduces the edge speed, lowering EMI and power efficiency 0x0 R/W Reserved. 0x0 R/W Amp Analog Gain Selection. 0x1 R/W 0 Normal Operation. 1 Low EMI Mode Operation. 00 8.4 V Full-Scale Gain Mapping. 01 12.6 V Full-Scale Gain Mapping. 10 14 V Full-Scale Gain Mapping. 11 15 V Full-Scale Gain Mapping. DAC CONTROL REGISTER Address: 0x02, Reset: 0x32, Name: DAC Control 7 6 5 4 3 2 1 0 0 0 1 1 0 0 1 0 [7] DAC_HV (R/W) DAC Hard Volume 0: Soft Volume Ramping. 1: Hard/Immediate Volume Change. [2:0] DAC_FS (R/W) DAC Sample Rate Selection 000: 8 kHz to 12 kHz Sample Rate. 001: 16 kHz to 24 kHz Sample Rate. 010: 32 kHz to 48 kHz Sample Rate. 011: 64 kHz to 96 kHz Sample Rate. 100: 128 kHz to 192 kHz Sample Rate. 101: 48 kHz to 72 kHz Sample Rate. 110: Reserved. 111: Reserved. [6] DAC_MUTE (R/W) DAC Mute Control 0: DAC Unmuted. 1: DAC Muted. [5] DAC_HPF (R/W) DAC High Pass Filter Enable 0: DAC High Pass Filter Off. 1: DAC High Pass Filter On. [3] RESERVED [4] DAC_LPM (R/W) DAC Low Power Mode Enable 0: DAC Low Power Mode Off. 1: DAC Low Power Mode On. Table 23. Bit Descriptions for DAC Control Bits Bit Name 7 DAC_HV 6 5 4 3 Settings Reset Access DAC Hard Volume. 0x0 R/W 0x0 R/W 0x1 R/W 0x1 R/W 0x0 R/W 0 Soft Volume Ramping. 1 Hard/Immediate Volume Change. DAC_MUTE DAC Mute Control. 0 DAC Unmuted. 1 DAC Muted. DAC_HPF DAC High-Pass Filter Enable. 0 DAC High-Pass Filter Off. 1 DAC High-Pass Filter On. DAC_LPM RESERVED Description DAC Low Power Mode Enable. 0 DAC Low Power Mode Off. 1 DAC Low Power Mode On. Reserved. Rev. A| Page 31 of 41 SSM3515 Bits Bit Name [2:0] DAC_FS Data Sheet Settings Description Reset Access DAC Sample Rate Selection. 0x2 R/W Description Reset Access Volume Control. 0x40 R/W 000 8 kHz to 12 kHz Sample Rate. 001 16 kHz to 24 kHz Sample Rate. 010 32 kHz to 48 kHz Sample Rate. 011 64 kHz to 96 kHz Sample Rate. 100 128 kHz to 192 kHz Sample Rate. 101 48 kHz to 72 kHz Sample Rate. 110 Reserved. 111 Reserved. DAC VOLUME CONTROL REGISTER Address: 0x03, Reset: 0x40, Name: DAC Volume Control 7 6 0 1 0 5 4 3 0 0 1 0 0 0 2 0 [7:0] VOL (R/W) Volume Control 00000000: +24 dB. 00000001: +23.625 dB. 00000010: +23.35 dB. ... 11111101: -70.875 dB. 11111110: -71.25 dB. 11111111: Mute. Table 24. Bit Descriptions for DAC Volume Control Bits Bit Name [7:0] VOL Settings 00000000 +24 dB. 00000001 +23.625 dB. 00000010 +23.35 dB. 00000011 +22.875 dB. 00000100 +22.5 dB. 00000101 ... 00111111 +0.375 dB. 01000000 0. 01000001 −0.375 dB. 01000010 ... 11111101 −70.875 dB. 11111110 −71.25 dB. 11111111 Mute. Rev. A| Page 32 of 41 Data Sheet SSM3515 SAI CONTROL 1 REGISTER Address: 0x04, Reset: 0x11, Name: SAI Control 1 7 6 0 0 0 5 4 3 1 0 1 0 0 0 2 1 [7] DAC_POL (R/W) DAC Output Polarity 0: Normal Operation. 1: Invert the Audio Output Signal. [0] SAI_MODE (R/W) Serial Interface Mode Selection 0: Stereo Modes (I2S,LJ) 1: TDM/PCM Modes. [6] BCLK_POL (R/W) BCLK Polarity Control 0: Rising Edge of BCLK is used to register SDATA. 1: Falling Edge of BCLK is used to register SDATA. [1] SDATA_FMT (R/W) Serial Data Format 0: I2S/Delay by one from FSYNC edge. 1: Left Justified/No delay from FSYNC edge. [2] FSYNC_MODE (R/W) FSYNC Mode Control 0: Low FSYNC is Left Channel in Stereo Modes or Pulsed FSYNC Mode in TDM Modes. 1: High FSYNC is Left Channel in Stereo Modes or 50% FSYNC Mode in TDM Modes. [5:3] TDM_BCLKS (R/W) Number of BCLKs per chip in TDM mode 000: 16 BCLKs per chip in TDM. 001: 24 BCLKs per chip in TDM. 010: 32 BCLKs per chip in TDM. 011: 48 BCLKs per chip in TDM. 100: 64 BCLKs per chip in TDM. Table 25. Bit Descriptions for SAI Control 1 Bits Bit Name 7 DAC_POL 6 [5:3] 2 1 0 Settings Description Reset Access DAC Output Polarity. 0x0 R/W 0x0 R/W 0x2 R/W 0x0 R/W 0x0 R/W 0x1 R/W 0 Normal Operation. 1 Invert the Audio Output Signal. BCLK_POL BCLK Polarity Control. 0 Rising Edge of BCLK is Used to Register SDATA. 1 Falling Edge of BCLK is Used to Register SDATA. Number of BCLKs per Chip in TDM Mode. Any number of BCLK cycles per FSYNC can be used in stereo modes (I 2 S/LJ) or in TDM mode with only one chip. When in TDM mode and having multiple chips on the TDM bus, the number of BCLKs per chip must be defined. TDM_BCLKS 000 16 BCLKs per Chip in TDM. 001 24 BCLKs per Chip in TDM. 010 32 BCLKs per Chip in TDM. 011 48 BCLKs per Chip in TDM. 100 64 BCLKs per Chip in TDM. FSYNC_MODE FSYNC Mode Control. 0 Low FSYNC is Left Channel in Stereo Modes or Pulsed FSYNC Mode in TDM Modes. 1 High FSYNC is Left Channel in Stereo Modes or 50% FSYNC Mode in TDM Modes. SDATA_FMT Serial Data Format. 0 I 2 S/Delay by 1 Left Justified/No Delay from FSYNC Edge. SAI_MODE One from FSYNC Edge. Serial Interface Mode Selection. 0 Stereo Modes (I 2 S, LJ). 1 TDM/PCM Modes. Rev. A| Page 33 of 41 SSM3515 Data Sheet SAI CONTROL 2 REGISTER Address: 0x05, Reset: 0x00, Name: SAI Control 2 7 6 0 0 5 4 0 0 3 2 0 0 [7] DATA_W IDTH (R/W) Audio Data W idth 0: Audio input on SDATA is 24 bits. 1: Audio input on SDATA is 16 bits. [6:5] RESERVED [4] AUTO_SLOT (R/W) Automatic TDM Slot Selection 0: TDM Slot determined by TDM_SLOT register. 1: TDM Slot determined by ADDR pin. 1 0 0 0 [3:0] TDM_SLOT (R/W) TDM Slot Selection 0000: Chip Slot 1 Used. 0001: Chip Slot 2 Used. 0010: Chip Slot 3 Used. ... 1101: Chip Slot 14 Used. 1110: Chip Slot 15 Used. 1111: Chip Slot 16 Used. Table 26. Bit Descriptions for SAI Control 2 Bits Bit Name 7 DATA_WIDTH Settings Description Reset Access Audio Data Width. 0x0 R/W 0 Audio Input on SDATA is 24 Bits. 1 Audio Input on SDATA is 16 Bits. [6:5] RESERVED Reserved. 0x0 R/W 4 AUTO_SLOT Automatic TDM Slot Selection. 0x0 R/W 0x0 R/W [3:0] 0 TDM Slot Determined by the TDM_SLOT Register. 1 TDM Slot Determined by the ADDR Pin. TDM_SLOT TDM Slot Selection. 0000 Chip Slot 1 Used. 0001 Chip Slot 2 Used. 0010 Chip Slot 3 Used. 0011 Chip Slot 4 Used. 0100 Chip Slot 5 Used. 0101 Chip Slot 6 Used. 0110 Chip Slot 7 Used. 0111 Chip Slot 8 Used. 1000 Chip Slot 9 Used. 1001 Chip Slot 10 Used. 1010 Chip Slot 11 Used. 1011 Chip Slot 12 Used. 1100 Chip Slot 13 Used. 1101 Chip Slot 14 Used. 1110 Chip Slot 15 Used. 1111 Chip Slot 16 Used. Rev. A| Page 34 of 41 Data Sheet SSM3515 BATTERY VOLTAGE OUTPUT REGISTER Address: 0x06, Reset: 0x00, Name: Battery Voltage Output 7 6 0 0 5 4 0 0 3 2 0 0 1 0 0 0 [7:0] VBAT (R) 8-Bit Unsigned Battery Voltage Table 27. Bit Descriptions for Battery Voltage Output Bits Bit Name [7:0] VBAT Settings Description Reset Access 8-Bit Unsigned Battery Voltage 0x0 R LIMITER CONTROL 1 REGISTER Address: 0x07, Reset: 0xA4, Name: Limiter Control 1 7 6 1 0 1 5 4 3 0 0 1 0 1 0 2 0 [7:6] LIM_RRT (R/W) Limiter Release Rate 00: 3200 ms/dB. 01: 1600 ms/dB. 10: 1200 ms/dB. 11: 800 ms/dB. [1:0] LIM_EN (R/W) Limiter or Mute Mode Enable 00: Limiter and Mute Mode Off. 01: Limiter On. 10: Output mutes if VBAT is below VBAT_INF. 11: Limiter On but only engages if VBAT is below VBAT_INF. [5:4] LIM_ATR (R/W) Limiter Attack Rate 00: 120 us/dB. 01: 60 us/dB. 10: 30 us/dB. 11: 20 us/dB. [2] VBAT_TRACK (R/W) Threshold Battery Tracking Enable 0: Limiter Attack Threshold Fixed. 1: Limiter Attack Threshold Varies or gain reduction with Battery Voltage. [3] RESERVED Table 28. Bit Descriptions for Limiter Control 1 Bits Bit Name [7:6] LIM_RRT [5:4] Settings Description Reset Access Limiter Release Rate. 0x2 R/W 0x2 R/W 00 3200 ms/dB. 01 1600 ms/dB. 10 1200 ms/dB. 11 800 ms/dB. LIM_ATR Limiter Attack Rate. 00 120 µs/dB. 01 60 µs/dB. 10 30 µs/dB. 11 20 µs/dB. 3 RESERVED Reserved. 0x0 R/W 2 VBAT_TRACK Threshold Battery Tracking Enable. 0x1 R/W 0x0 R/W [1:0] 0 Limiter Attack Threshold Fixed. 1 Limiter Attack Threshold Varies or Gain Reduction with Battery Voltage. LIM_EN Limiter or Mute Mode Enable. 00 Limiter and Mute Mode Off. 01 Limiter On. 10 Output Mutes if VBAT is Below VBAT_INF. 11 Limiter On But Only Engages if VBAT is Below VBAT_INF. Rev. A| Page 35 of 41 SSM3515 Data Sheet LIMITER CONTROL 2 REGISTER Address: 0x08, Reset: 0x51, Name: Limiter Control 2 7 6 0 1 0 5 4 3 1 0 1 0 0 0 2 1 [7:3] LIM_THRES (R/W) Limiter Attack Threshold 00000: 15.0 V peak Output. 00001: 14.5 V peak Output. 00010: 14.0 V peak Output. ... 11101: 2.0 V peak Output. 11110: 1.5V V peak Output. 11111: 1.0 V peak Output. [1:0] SLOPE (R/W) Slope of threshold reduction/battery voltage change 00: 1:1 Threshold/Battery Reduction. 01: 2:1 Threshold/Battery Reduction. 10: 3:1 Threshold/Battery Reduction. 11: 4:1 Threshold/Battery Reduction. [2] RESERVED Table 29. Bit Descriptions for Limiter Control 2 Bits Bit Name [7:3] LIM_THRES Settings Description Reset Access Limiter Attack Threshold. 0xA R/W 00000 15.0 V peak Output. 00001 14.5 V peak Output. 00010 14.0 V peak Output. 00011 13.5 V peak Output. 00100 13.0 V peak Output. 00101 12.5 V peak Output. 00110 12.0 V peak Output. 00111 11.5 V peak Output. 01000 11.0 V peak Output. 01001 10.5 V peak Output. 01010 10.0 V peak Output. 01011 9.5 V peak Output. 01100 9.0 V peak Output. 01101 8.5 V peak Output. 01110 8.25 V peak Output. 01111 8.0 V peak Output. 10000 7.75 V peak Output. 10001 7.5 V peak Output. 10010 7.25 V peak Output. 10011 7.0 V peak Output. 10100 6.5 V peak Output. 10101 6.0 V peak Output. 10110 5.5 V peak Output. 10111 5.0 V peak Output. 11000 4.5 V peak Output. 11001 4.0 V peak Output. 11010 3.5 V peak Output. 11011 3.0 V peak Output. 11100 2.5 V peak Output. 11101 2.0 V peak Output. 11110 1.5 V peak Output. 11111 1.0 V peak Output. Rev. A| Page 36 of 41 Data Sheet Bits Bit Name 2 [1:0] SSM3515 Settings Description Reset Access RESERVED Reserved. 0x0 R/W SLOPE Slope of Threshold Reduction/Battery Voltage Change. 0x1 R/W 00 1:1 Threshold/Battery Reduction. 01 2:1 Threshold/Battery Reduction. 10 3:1 Threshold/Battery Reduction. 11 4:1 Threshold/Battery Reduction. LIMITER CONTROL 3 REGISTER Address: 0x09, Reset: 0x22, Name: Limiter Control 3 7 6 0 0 5 4 1 0 3 2 0 0 1 0 1 0 [7:0] VBAT_INF (R/W) Battery Voltage Inflection Point Table 30. Bit Descriptions for Limiter Control 3 Bits [7:0] Bit Name Settings VBAT_INF Description Reset Access Battery Voltage Inflection Point. This is the VBAT sense value at which the limiter either activates or starts reducing the threshold. It corresponds to the value that can be read in the VBAT read only status register. To calculate this value in volts, refer to the VBAT Sensing section. Voltage = 3.8 + 12.4 × Decimal Value/255. 0x22 R/W STATUS REGISTER Address: 0x0A, Reset: 0x00, Name: Status 7 6 0 0 0 5 4 3 0 0 1 0 0 0 2 0 [7] RESERVED [0] BAT_W ARN (R) Battery Voltage W arning 0: Battery Voltage above VBAT_INF. 1: Battery Voltage at or below VBAT_INF. [6] UVLO_VREG (R) Regulator Undervoltage Fault Status 0: Normal Operation. 1: Voltage Regulator Fault Condition. [1] OTW (R) Over Temperature Warning Status 0: Normal Operation. 1: Over Temperature Warning Condition. [5] LIM_EG (R) Limiter/Gain Reduction Engaged 0: Normal Operation. 1: Limiter or Gain Reduction has Reduced Gain. [2] OTF (R) Over Temperature Fault Status 0: Normal Operation. 1: Over Temperature Fault Condition. [4] CLIP (R) Clip Detector 0: Normal Operation. 1: Amplifier Clipping Detected. [3] AMP_OC (R) Amplifier Over-Current Fault Status 0: Normal Operation. 1: Amp Over-Current Fault Condition. Table 31. Bit Descriptions for Status Bits Bit Name 7 6 5 Settings Description Reset Access RESERVED Reserved. 0x0 R UVLO_VREG Regulator Undervoltage Fault Status. 0x0 R 0x0 R 0 Normal Operation. 1 Voltage Regulator Fault Condition. LIM_EG Limiter/Gain Reduction Engaged. 0 Normal Operation. 1 Limiter or Gain Reduction has Reduced Gain. Rev. A| Page 37 of 41 SSM3515 Data Sheet Bits Bit Name 4 CLIP 3 2 1 0 Settings Description Reset Access Clip Detector. 0x0 R 0x0 R 0x0 R 0x0 R 0x0 R 0 Normal Operation. 1 Amplifier Clipping Detected. AMP_OC Amplifier Overcurrent Fault Status. 0 Normal Operation. 1 Amp Over-Current Fault Condition. OTF Overtemperature Fault Status. 0 Normal Operation. 1 Overtemperature Fault Condition. OTW Overtemperature Warning Status. 0 Normal Operation. 1 Overtemperature Warning Condition. BAT_WARN Battery Voltage Warning. 0 Battery Voltage Above VBAT_INF. 1 Battery Voltage at or Below VBAT_INF. FAULT CONTROL REGISTER Address: 0x0B, Reset: 0x18, Name: Fault Control 7 6 0 0 5 4 0 1 3 2 1 0 1 0 0 0 [7:6] OTW_GAIN (R/W) Over Thermal W arning Gain Reduction 00: No gain reduction in thermal warning. 01: 1.5dB gain reduction in thermal warning. 10: 3dB gain reduction in thermal warning. 11: 5.625dB gain reduction in thermal warning. [0] ARCV_OC (R/W) Over Current Automatic Fault Recovery Control 0: Automatic Fault Recovery for Over-Current Fault. 1: Manual Fault Recovery for Over-Current Fault. [5] MRCV (W) Manual Fault Recovery 0: Normal Operation. 1: W riting of 1 causes a manual fault recovery attempt when ARCV=11. [1] ARCV_OT (R/W) Overtemperature Automatic Fault Recovery Control 0: Automatic Fault Recovery for Overtemperature Fault. 1: Manual Fault Recovery for Overtemperature Fault. [4:3] MAX_AR (R/W) Maximum Fault recovery Attempts 00: 1 Auto Recovery Attempt. 01: 3 Auto Recovery Attempts. 10: 7 Auto Recovery Attempts. 11: Unlimited Auto Recovery Attempts. [2] ARCV_UV (R/W) Undervoltage Automatic Fault Recovery Control 0: Automatic Fault Recovery for Undervoltage Fault. 1: Manual Fault Recovery for Undervoltage Fault. Table 32. Bit Descriptions for Fault Control Bits Bit Name [7:6] OTW_GAIN 5 Settings Description Reset Access Over Thermal Warning Gain Reduction. 0x0 R/W 0x0 W 00 No Gain Reduction in Thermal Warning. 01 1.5 dB Gain Reduction in Thermal Warning. 10 3 dB Gain Reduction in Thermal Warning. 11 5.625 dB Gain Reduction in Thermal Warning. MRCV Manual Fault Recovery. 0 Normal Operation. 1 Writing of 1 Causes a Manual Fault Recovery Attempt when ARCV = 11. Rev. A| Page 38 of 41 Data Sheet Bits Bit Name [4:3] MAX_AR SSM3515 Settings 1 0 Reset Access Maximum Fault Recovery Attempts. The maximum autorecovery register determines how many attempts at autorecovery are performed. 0x3 R/W 0x0 R/W 0x0 R/W 0x0 R/W 00 1 Autorecovery Attempt. 01 3 Autorecovery Attempts. 10 7 Autorecovery Attempts. 11 2 Description ARCV_UV Unlimited Autorecovery Attempts. Undervoltage Automatic Fault Recovery Control. 0 Automatic Fault Recovery for Undervoltage Fault. 1 Manual Fault Recovery for Undervoltage Fault. ARCV_OT Overtemperature Automatic Fault Recovery Control. 0 Automatic Fault Recovery for Overtemperature Fault. 1 Manual Fault Recovery for Overtemperature Fault. ARCV_OC Overcurrent Automatic Fault Recovery Control. 0 Automatic Fault Recovery for Overcurrent Fault. 1 Manual Fault Recovery for Overcurrent Fault. Rev. A| Page 39 of 41 SSM3515 Data Sheet TYPICAL APPLICATION CIRCUIT Figure 75 shows a typical application circuit for a single channel output. REG_EN R3 0Ω EXTERNAL DVDD R4 0Ω INTERNAL DVDD PVDD R4 I2C R2 2.2kΩ SCL SDA REG_EN I2C FSYNC SDATA TDM I2S INPUT C1 2.2µF C4 0.1µF VREG50/AVDD VREG18/DVDD PVDD REG REG AVDD DVDD BCLK I2S/TDM C3 1µF VOLUME SSM3515 DAC Σ-∆ CLASS-D MODULATOR PVDD BST+ FULL BRIDGE POWER STAGE AGND C5 0.22µF OUT+ PGND C6 0.22µF FB1 C7 220pF 4Ω/8Ω C8 220pF FB1/FB2: MURATA FERRITE BEAD NFZ2MSM181 SEE THE ADDR PIN SETUP AND CONTROL SECTION Figure 75. Typical Application Circuit for Single Channel Output Rev. A| Page 40 of 41 OPTIONAL FB2 OUT– BST– ADDR PVDD +4.5V TO +17V C6 C5 10µF 470µF 13327-184 C2 0.1uF R1 2.2kΩ +5V (AVDD) +1.8V (DVDD) R3 +1.8V Data Sheet SSM3515 OUTLINE DIMENSIONS 1.840 1.800 1.760 4 3 2 1 A BALL A1 IDENTIFIER B 2.240 2.200 2.160 1.60 REF C D E 0.40 BSC BOTTOM VIEW TOP VIEW (BALL SIDE UP) (BALL SIDE DOWN) 1.20 REF SIDE VIEW COPLANARITY 0.05 0.300 0.260 0.220 SEATING PLANE 0.230 0.200 0.170 12-19-2012-A 0.560 0.500 0.440 Figure 76. 20-Ball Wafer Level Chip Scale Package [WLCSP] (CB-20-10) Dimensions shown in millimeters ORDERING GUIDE Model1 SSM3515CCBZ-RL SSM3515CCBZ-R7 EVAL-SSM3515Z 1 Temperature Range −40°C to +85°C −40°C to +85°C Package Description 20-Ball Wafer Level Chip Scale Package [WLCSP] 20-Ball Wafer Level Chip Scale Package [WLCSP] Evaluation Board Z = RoHS Compliant Part. I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors). ©2015–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D13327-0-1/17(A) Rev. A| Page 41 of 41 Package Option CB-20-10 CB-20-10
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