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EVAL01-HMC911LC4B

EVAL01-HMC911LC4B

  • 厂商:

    AD(亚德诺)

  • 封装:

    -

  • 描述:

    EVAL BOARD HMC911LC4B

  • 数据手册
  • 价格&库存
EVAL01-HMC911LC4B 数据手册
19 VCC 20 VCC 21 VCC VCC VCC HMC911 GND 2 16 QP AMP BUF INN 4 15 QN TEMPERATURE COMPENSATION AND BIAS 14 GND 9 VDCP VEE 11 8 VEE 13 VEE PACKAGE BASE GND 14816-001 VCC BUF VAC 12 VCC 7 EN 6 18 NC 17 GND INP 3 GND 5 Synchronization of clock and data Transponder design Serial data transmissions up to 32 Gbps Broadband test and measurement RF ATE applications 22 VCC NC 1 VDCN 10 APPLICATIONS 23 VCC FUNCTIONAL BLOCK DIAGRAM Very wide bandwidth to 24 GHz Time delay range: 70 ps typical Single-ended or differential operation Adjustable differential output amplitude with 780 mV p-p typical at 10 GHz Delay control modulation bandwidth: 1.6 GHz typical Single supply: 3.3 V 24-terminal ceramic, leadless chip carrier (LCC) 24 VCC FEATURES VEE Data Sheet Broadband Analog Time Delay to 24 GHz HMC911 Figure 1. GENERAL DESCRIPTION The HMC911 is a broadband time delay with 62 ps to 75 ps continuously adjustable delay range to 24 GHz. The delay control is linearly monotonic with respect to the differential delay control voltage (VDCP and VDCN), and the control input has a modulation bandwidth of 1.6 Hz. The HMC911 provides a differential output voltage with constant amplitude for single-ended or differential input voltages above the input sensitivity level, and the output voltage swing can be adjusted using the VAC control pin. Rev. B The HMC911 features internal temperature compensation and bias circuitry to minimize delay variations with temperature. All RF inputs and outputs of the HMC911 are internally terminated with 50 Ω to VCC and can be ac-coupled or dc-coupled. Output pins connect directly to a 50 Ω to VCC terminated system. However, use dc blocking capacitors if the terminated system input is 50 Ω to a dc voltage other than VCC. The HMC911 is available in a RoHS-compliant, 24-terminal, ceramic, leadless chip carrier. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2014–2016 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com HMC911 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Pin Configuration and Function Descriptions..............................5 Applications ....................................................................................... 1 Interface Schematics .....................................................................6 Functional Block Diagram .............................................................. 1 Typical Performance Characteristics ..............................................7 General Description ......................................................................... 1 Applications Information .............................................................. 11 Revision History ............................................................................... 2 Evaluation Printed Circuit Board (PCB)................................. 11 Specifications..................................................................................... 3 Typical Application Circuit ........................................................... 12 Absolute Maximum Ratings ............................................................ 4 Outline Dimensions ....................................................................... 13 ESD Caution .................................................................................. 4 Ordering Guide .......................................................................... 13 REVISION HISTORY 10/2016—Rev. v02.0614 to Rev. B Updated Format .................................................................. Universal Changes to Product Title, Features Section, and General Description Section .......................................................................... 1 Changes to Table 1 ............................................................................ 3 Changes to Table 2 ............................................................................ 4 Changes to Table 3 ............................................................................ 5 Changes to Figure 4 and Figure 6 ................................................... 6 Changes to Figure 13 Caption .........................................................7 Changes to Figure 17 Caption and Figure 20 Caption .................8 Changes to Figure 31 Caption ...................................................... 10 Changes to Table 4.......................................................................... 11 Changes to Typical Application Circuit Section ........................ 12 Updated Outline Dimensions ....................................................... 13 Changes to Ordering Guide .......................................................... 13 Rev. B | Page 2 of 13 Data Sheet HMC911 SPECIFICATIONS TA = 25°C, VCC = 3.3 V, VAC = 2.6 V, VEE = GND = 0 V, unless otherwise noted. Table 1. Parameter POWER SUPPLY Voltage Current TIME DELAY RANGE 10 GHz 18 GHz 22 GHz TIME DELAY SENSITIVITY Voltage Temperature PHASE SHIFT RANGE 10 GHz 18 GHz 22 GHz MAXIMUM DATA RATE MAXIMUM CLOCK FREQUENCY DELAY CONTROL Modulation Bandwidth Voltage (VDCP and VDCN) INPUT VOLTAGE Low (VIL) High (VIH) INPUT AMPLITUDE, PEAK TO PEAK Single Ended Differential OUTPUT AMPLITUDE 10 GHz 18 GHz 22 GHz CONTROL VOLTAGE (VAC) HARMONIC SUPPRESSION (fIN − 2fIN) 1, 2 10 GHz 20 GHz RETURN LOSS Input Output RMS JITTER TIME 3 Rise (tR) Fall (tF) PROPAGATION DELAY Min Typ Max Unit Test Conditions/Comments 3.13 460 3.3 3.47 530 V mA ±5% tolerance 62 64 66 70 70 70 71 73 75 ps ps ps VDCP = 3.9 V, VDCN = 3.3 V 116 0.04 ps/V ps/°C 210 400 515 32 24 250 475 595 1.6 VCC − 0.6 VCC − 500 VCC + 25 VCC − 200 VCC + 200 50 100 370 740 350 700 340 680 1.7 390 780 375 750 350 700 2.6 VDCP = VDCN = 3.3 V at 18 GHz VDCP = 3.9 V, VDCN = 3.3 V Degrees Degrees Degrees Gbps GHz VCC + 0.6 GHz V VCC − 25 VCC + 500 mV mV 1000 2000 mV p-p mV p-p 640 1280 640 1280 640 1280 2.7 mV p-p mV p-p mV p-p mV p-p mV p-p mV p-p V 32 30 dBc dBc VAC = 2.6 V Single-ended Differential Single-ended Differential Single-ended Differential VDCP = VDCN = 3.3 V 21 19 Frequency < 24 GHz 9 10 0.3 dB dB ps, p-p 32 Gbps, 10101 … data 15 14 480 ps ps ps VDCP = 2.7 V, VDCN = 3.3 V (relative to zero time delay) Harmonic suppression measurements were taken for single-ended inputs and outputs. fIN is the fundamental frequency. 3 VINPUT = differential 400 mV p-p, and fDATA = 22.5 Gbps, and pseudorandom bit sequences (PRBS) 233 − 1 1 2 Rev. B | Page 3 of 13 HMC911 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Power Supply Voltage (VCC) Input Voltage (VIN) Output Voltage (VOUT) Delay Control Voltage (VDCP, VDCN) Power-Down (Enable) Pin (EN) Amplitude Control (VAC) Continuous Power Dissipation, PDISS (TA = 85°C, Derate 54.96 mW/°C above 85°C) Thermal Resistance (Junction to Ground Paddle) Channel Temperature (TC) Maximum Peak Reflow Temperature (MSL3)1 Storage Temperature Range Operating Temperature Range Electrostatic Discharge (ESD) Human Body Model (HBM) 1 Rating −0.5 V to +3.75 V VCC – 1.2 V to VCC + 0.6 V VCC – 1.2 V to VCC + 0.6 V 0 V to VCC + 0.6 V 0 V to VCC + 0.6 V 0 V to VCC + 0.6 V 2.2 W Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. ESD CAUTION 18.2°C/W 125°C 260°C −65°C to +125°C −40°C to +85°C Class 1B See the Ordering Guide section. Rev. B | Page 4 of 13 Data Sheet HMC911 19 VCC 20 VCC 21 VCC 22 VCC 23 VCC 24 VCC PIN CONFIGURATION AND FUNCTION DESCRIPTIONS NC 1 18 NC GND 2 17 GND HMC911 INP 3 16 QP TOP VIEW (Not to Scale) INN 4 15 QN GND 5 14 GND PACKAGE BASE NOTES 1. NC = NO CONNECT. 2. EXPOSED PAD. CONNECT THE EXPOSED PAD TO RF/DC GROUND GND 14816-002 VAC 12 9 VDCP VEE 11 8 VEE VDCN 10 7 13 VEE VEE EN 6 Figure 2. Pin Configuration Table 3. Pin Function Descriptions Pin No. 1, 18 Mnemonic NC 2, 5, 14, 17 3 4 6 GND INP INN EN 7, 8, 11, 13 9 10 12 15 16 19 to 24 VEE VDCP VDCN VAC QN QP VCC EPAD Description No Connect. These pins are not connected internally; however, all data shown herein was measured with these pins connected to RF/dc ground externally. Ground Pin. Connect these signal grounds to 0 V. See Figure 3 for the interface schematic. Positive Differential RF Input Pin. See Figure 4 for the interface schematic. Negative Differential RF Input Pin. See Figure 4 for the interface schematic. Enable Pin for the Time Delay. For normal operation, leave this pin open or apply 3.3 V. To disable the HMC911, apply 0 V. When disabled, the total current consumption drops to 15 mA. See Figure 5 for the interface schematic. Supply Grounds. Connect these pins to 0 V. See Figure 6 for the interface schematic. Positive Differential Time Delay Control Pin. See Figure 7 for the interface schematic. Negative Differential Time Delay Control Pin. See Figure 7 for the interface schematic. Output Amplitude Control Pin. See Figure 8 for the interface schematic. Negative Differential RF Output Pin. See Figure 9 for the interface schematic. Positive Differential RF Output Pin. See Figure 9 for the interface schematic. Positive Supply Pins. See Figure 10 for the interface schematic. Exposed Pad. Connect the exposed pad to RF/dc ground. Rev. B | Page 5 of 13 HMC911 Data Sheet INTERFACE SCHEMATICS VCC 50Ω 14816-003 GND 14816-007 VDCP , VDCN VEE Figure 7. VDCP and VDCN Interface Schematic Figure 3. GND Interface Schematic VCC VCC 50Ω INP, INN 14816-008 VEE 14816-004 VAC VEE Figure 4. INP and INN Interface Schematic Figure 8. VAC Interface Schematic VCC VCC 50Ω 20kΩ QP, QN VEE 14816-005 VEE Figure 5. EN Interface Schematic Figure 9. QN and QP Interface Schematic VCC GND 14816-006 VEE GND 14816-010 EN 14816-009 250Ω Figure 10. VCC Interface Schematic Figure 6. VEE Interface Schematic Rev. B | Page 6 of 13 Data Sheet HMC911 TYPICAL PERFORMANCE CHARACTERISTICS 60 50 40 30 20 10GHz 16GHz 20GHz 22GHz 24GHz –0.4 –0.2 0 0.2 0.4 0.6 DIFFERENTIAL DELAY CONTROL VOLTAGE (V) Figure 11. Normalized Time Delay vs. Differential Delay Control Voltage, Differential Delay Control Voltage Represents VDCP − VDCN Voltage on the X-Axis 30 20 3.13V 3.30V 3.47V –0.4 –0.2 0 0.2 0.4 0.6 DIFFERENTIAL DELAY CONTROL VOLTAGE (V) Figure 14. Normalized Time Delay vs. Differential Delay Control Voltage at 22 GHz for Various Voltages, Differential Delay Control Voltage Represents VDCP − VDCN Voltage on the X-Axis VAC = 2.6V VDCN = 3.3V VCC = 3.3V 70 60 TIME DELAY (ps) 60 50 40 30 50 40 30 20 20 +85°C +25°C –40°C –0.4 –0.2 0 0.2 0.4 0.6 DIFFERENTIAL DELAY CONTROL VOLTAGE (V) Figure 12. Normalized Time Delay vs. Differential Delay Control Voltage at 22 GHz for Various Temperatures, Differential Delay Control Voltage Represents VDCP − VDCN Voltage on the X-Axis 45 0 TIME DELAY ERROR (ps) 20 VDCP – VDCN VDCP – VDCN VDCP – VDCN VDCP – VDCN VDCP – VDCN VDCP – VDCN VDCP – VDCN 10 5 9 = –0.6V = –0.4V = –0.2V = 0V = +0.2V = +0.4V = +0.6V 12 14 16 18 10 11 12 13 14 15 16 17 18 19 20 FREQUENCY (GHz) Figure 13. fIN Power – 2fIN Power vs. Frequency 20 22 24 4 = –0.6V (REFERENCE) = –0.4V = –0.2V = 0V = +0.2V = +0.4V = +0.6V VAC = 2.6V VDCN = 3.3V VCC = 3.3V 2 0 –2 –4 –6 –8 14816-013 15 8 10 VDCP – VDCN VDCP – VDCN VDCP – VDCN VDCP – VDCN VDCP – VDCN VDCP – VDCN VDCP – VDCN 6 25 7 8 8 30 6 6 Figure 15. Time Delay vs. Frequency at VDCP = 2.7 V to 3.9 V with 0.1 V Step 35 5 4 FREQUENCY (GHz) VAC = 2.6V VDCN = 3.3V VCC = 3.3V 40 2 14816-015 0 –0.6 10 2 4 6 8 10 12 14 FREQUENCY (GHz) 16 18 20 22 14816-016 10 14816-012 NORMALIZED TIME DELAY (ps) 40 0 –0.6 VAC = 2.6V VDCN = 3.3V VCC = 3.3V 70 fIN POWER – 2fIN POWER (dBc) 50 80 80 0 60 10 14816-011 10 0 –0.6 VAC = 2.6V VDCN = 3.3V VCC = 3.3V 70 NORMALIZED TIME DELAY (ps) 70 NORMALIZED TIME DELAY (ps) 80 VAC = 2.6V VDCN = 3.3V VCC = 3.3V 14816-014 80 Figure 16. Time Delay Error vs. Frequency at Mean Frequency (fMEAN) = 18 GHz Rev. B | Page 7 of 13 HMC911 75 TIME DELAY (ps) 70 65 60 55 4 6 8 10 12 14 16 18 20 22 24 FREQUENCY (GHz) 60 50 375 550 350 500 DC CURRENT (mA) 600 300 275 250 4 6 8 10 12 14 16 18 20 22 24 450 400 350 300 VAC = 2.6V VDCP = VDCN = 3.3V fIN = 18GHz +85°C +25°C –40°C 200 3.13 3.30 250 3.47 SUPPLY VOLTAGE (V) 400 3.30 3.47 SUPPLY VOLTAGE (V) Figure 21. DC Current vs. Supply Voltage for Various Temperatures 600 VDCP = VDCN = 3.3V VCC = 3.3V fIN = 10GHz 550 350 500 DC CURRENT (mA) 300 250 200 150 450 400 350 300 100 +85°C +25°C –40°C 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 AMPLITUDE CONTROL VOLTAGE (V) 2.6 250 2.7 14816-019 50 0 1.7 +85°C +25°C –40°C 200 3.13 Figure 18. Single-Ended Output Voltage Swing vs. Supply Voltage for Various Temperatures 450 VAC = 2.6V VDCP = VDCN = 3.3V fIN = 18GHz 14816-021 225 2 Figure 20. Programmable Maximum Time Delay vs. Frequency for Various Voltages 400 325 3.13V 3.30V 3.47V FREQUENCY (GHz) 14816-018 OUTPUT VOLTAGE SWING (mV p-p) Figure 17. Programmable Maximum Time Delay vs. Frequency for Various Temperatures OUTPUT VOLTAGE SWING (mV p-p) 65 55 +85°C +25°C –40°C 2 70 Figure 19. Single-Ended Output Voltage Swing vs. Amplitude Control Voltage (VAC) for Various Temperatures Rev. B | Page 8 of 13 +85°C +25°C –40°C VDCP = VDCN = 3.3V VCC = 3.3V fIN = 10GHz 200 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 AMPLITUDE CONTROL VOLTAGE (V) 2.6 2.7 14816-022 50 VAC = 2.6V VDCN = 3.3V VCC = 3.3V VDCP = 3.9V 75 14816-017 TIME DELAY (ps) 80 VAC = 2.6V VDCN = 3.3V VCC = 3.3V VDCP = 3.9V 14816-020 80 Data Sheet Figure 22. DC Current vs. Amplitude Control Voltage (VAC) for Various Temperatures Data Sheet HMC911 500 400 350 300 250 2 4 6 8 10 12 14 16 18 20 22 24 FREQUENCY (GHz) Figure 23. Single-Ended Output Voltage Swing vs. Frequency for Various Temperatures 0.35 5GHz 14GHz 22GHz –0.4 –0.2 0 0.2 0.4 0.6 Figure 26. Single-Ended Output Voltage Swing vs. Differential Delay Control Voltage, Differential Control Voltage Represents VDCP − VDCN Voltage on the X-Axis 0.40 VAC = 2.6V VDCN = 3.3V VCC = 3.3V VAC = 2.6V VDCN = 3.3V VCC = 3.3V 0.35 0.30 RMS JITTER (ps) RMS JITTER (ps) 250 DIFFERENTIAL DELAY CONTROL VOLTAGE (V) 0.25 0.20 0.15 0.10 0.25 0.20 0.15 0.10 +85°C +25°C –40°C 0 –0.6 –0.4 –0.2 0 0.2 0.4 3.13V 3.30V 3.47V 0.05 0.6 DIFFERENTIAL DELAY CONTROL VOLTAGE (V) 0 –0.6 14816-024 0.05 Figure 24. RMS Jitter vs. Differential Delay Control Voltage at 18 GHz for Various Temperatures, Differential Control Voltage Represents VDCP − VDCN Voltage on the X-Axis –0.4 –0.2 0 0.2 0.4 Figure 27. RMS Jitter vs. Differential Delay Control Voltage at 18 GHz for Various Voltages, Differential Control Voltage Represents VDCP − VDCN Voltage on the X-Axis 18 VAC = 2.6V VDCN = 3.3V VCC = 3.3V VAC = 2.6V VDCN = 3.3V VCC = 3.3V FALL TIME (ps) 16 14 12 10 14 12 10 +85°C +25°C –40°C –0.4 –0.2 0 0.2 0.4 DIFFERENTIAL DELAY CONTROL VOLTAGE (V) +85°C +25°C –40°C 0.6 8 –0.6 14816-025 8 –0.6 0.6 DIFFERENTIAL DELAY CONTROL VOLTAGE (V) 16 RISE TIME (ps) 300 200 –0.6 0.30 18 350 14816-027 0.40 400 Figure 25. Rise Time vs. Differential Delay Control Voltage, Differential Control Voltage Represents VDCP − VDCN Voltage on the X-Axis, Input Data Rate = 22.5 Gbps, PRBS 233 − 1 –0.4 –0.2 0 0.2 0.4 DIFFERENTIAL DELAY CONTROL VOLTAGE (V) 0.6 14816-028 200 +85°C +25°C –40°C 450 VAC = 2.6V VDCP = VDCN = 3.3V VCC = 3.3V 14816-026 450 OUTPUT VOLTAGE SWING (mV p-p) VAC = 2.6V VDCP = VDCN = 3.3V VCC = 3.3V 14816-023 OUTPUT VOLTAGE SWING (mV p-p) 500 Figure 28. Fall Time vs. Differential Delay Control Voltage, Differential Control Voltage Represents VDCP − VDCN Voltage on the X-Axis, Input Data Rate = 22.5 Gbps, PRBS 233 − 1 Rev. B | Page 9 of 13 HMC911 0 Data Sheet 0 VAC = 2.6V VDCN = 3.3V VCC = 3.3V –5 INN INP –25 –30 –15 –20 –25 –30 –35 –35 –40 –40 –45 2 4 6 8 10 12 14 16 18 20 22 24 –50 0 2 4 6 8 10 12 14 16 18 20 VCC = 3.3V VAC = 2.6V VDCP IS VARIED FROM 2.7V TO 3.3V (50% OF THE WHOLE DELAY RANGE) INPUT DATA = SINGLE-ENDED 400mV p-p 16GHz CLOCK SIGNAL VDCP = 1200mV p-p AT 1800MHz, VDCN = 50Ω TERMINATED, INPUT DATA = DIFFERENTIAL 400mV p-p, 10Gbps NRZ, PRBS 223 – 1 PATTERN TIME DELAY = 37ps 14816-030 VCC = 3.3V VAC = 2.6V 20ps/DIV 96.4mV/DIV Figure 30. Output Eye Diagram Continuous Snapshot for 16 GHz Input +85°C +25°C –40°C 60 50 40 30 20 VAC = 2.6V VCC = 3.3V 0 100M 1G MODULATION FREQUENCY (Hz) 10G 14816-031 10 20ps/DIV TIME DELAY = 45.2ps Figure 33. Output Eye Diagram Continuous Snapshot for 10 Gbps Input 80 70 24 Figure 32. Output Return Loss vs. Frequency, Figure 29. Input Return Loss vs. Frequency, 99.1mV/DIV 22 FREQUENCY (GHz) 14816-033 0 14816-032 RETURN LOSS (dB) –20 14816-029 RETURN LOSS (dB) –15 FREQUENCY (GHz) MAXIMUM TIME DELAY (ps) QN QP –10 –10 –45 VAC = 2.6V VDCN = 3.3V VCC = 3.3V –5 Figure 31. Maximum Time Delay vs. Modulation Frequency, Input Data Rate = 22.5 Gbps, PRBS 233 – 1, 6 dBm Input Power Applied to VDCP and VDCN Terminated to 50 Ω Rev. B | Page 10 of 13 Data Sheet HMC911 APPLICATIONS INFORMATION EVALUATION PRINTED CIRCUIT BOARD (PCB) 14816-035 Generate the evaluation PCB used in this application with proper RF circuit design techniques. Signal lines at the RF port must have 50 Ω impedance, and the package ground leads and exposed paddle must be connected directly to the ground plane similar to what is shown in Figure 34. Use a sufficient number of via holes to connect the top and bottom ground planes. Mount the evaluation board to an appropriate heat sink. The evaluation PCB shown is available from Analog Devices, Inc., upon request. Figure 34. 600-00070-00-1 (EVAL01-HMC911LC4B) Evaluation Board Bill of Materials Table 4. Component J1 to J4 J5, J6 J7, J8 TP1 to TP6 C1, C3 to C6 C2, C7 to C10 C9 C11 to C14 U1 PCB 1 Description K connectors SMA connectors SMA connectors for through calibration DC test points 1 nF capacitors, 0402 package 0.1 μF capacitors, 0402 package 100 nF capacitor, 0402 package 4.7 μF tantalum capacitors HMC911 analog phase shifter 600-00070-00-1 (EVAL01-HMC911LC4B1) evaluation PCB, circuit board material: Rogers 4350 or Arlon 25 FR Reference this number when ordering the completed evaluation PCB. Rev. B | Page 11 of 13 HMC911 Data Sheet TYPICAL APPLICATION CIRCUIT Figure 35 shows the typical application circuit. Note that TP2 goes to ground and is not shown in Figure 35. 19 20 21 C1 1nF 1 VCC VCC HMC911 2 3 INN J2 4 AMP VCC VEE TP3 11 10 C10 0.1µF 6 9 C14 4.7µF QP J3 15 QN J4 14 VCC BUF 8 C6 1nF 7 C9 100nF 16 BUF TEMPERATURE COMPENSATION AND BIAS 5 EN TP1 17 13 12 INP J1 18 C5 1nF VDCP J5 VDCN J6 Figure 35. Typical Application Circuit Rev. B | Page 12 of 13 C3 1nF C8 0.1µF C12 4.7µF C4 1nF C7 0.1µF C13 4.7µF VAC TP5 VEE TP4 14816-034 22 C2 0.1µF 23 C11 4.7µF 24 VCC TP6 Data Sheet HMC911 OUTLINE DIMENSIONS PIN 1 INDICATOR 4.13 4.00 SQ 3.87 0.36 0.30 0.24 PIN 1 (0.32 × 0.32) 19 24 1 18 0.50 BSC EXPOSED PAD 2.50 SQ 13 6 7 12 TOP VIEW BOTTOM VIEW SIDE VIEW 3.10 BSC FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. PKG-000000 SEATING PLANE 04-03-2015-A 2.50 REF 1.02 MAX Figure 36. 24-Terminal Ceramic Leadless Chip [LCC] (E-24-1) Dimensions shown in millimeters ORDERING GUIDE Model1 HMC911LC4B HMC911LC4BTR HMC911LC4BTR-R5 EVAL01-HMC911LC4B 1 2 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Body Material Alumina, White Alumina, White Alumina, White Lead Finish Gold over Nickel Gold over Nickel Gold over Nickel The HMC911LC4B, HMC911LC4BTR, and HMC911LC4BTR-R5 are RoHS Compliant Parts. See the Absolute Maximum Ratings section for additional information. ©2014–2016 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D14816-0-10/16(B) Rev. B | Page 13 of 13 MSL Rating2 MSL3 MSL3 MSL3 Package Description 24-Terminal LCC 24-Terminal LCC 24-Terminal LCC Evaluation Board Package Option E-24-1 E-24-1 E-24-1
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