HMC-ALH482

HMC-ALH482

  • 厂商:

    AD(亚德诺)

  • 封装:

    模具

  • 描述:

    IC RF AMP LN DIE

  • 数据手册
  • 价格&库存
HMC-ALH482 数据手册
HMC-ALH482 v04.1009 LOW NOISE AMPLIFIERS - CHIP 1 GaAs HEMT MMIC LOW NOISE AMPLIFIER, 2 - 22 GHz Typical Applications Features This HMC-ALH482 is ideal for: Noise Figure: 1.7 dB @ 2-12 GHz • Wideband Communication Systems Noise Figure: 2.2 dB @ 12-22 GHz • Surveillance Systems Gain: 16 dB @ 12 GHz • Point-to-Point Radios P1dB Output Power: +14 dBm • Point-to-Multi-Point Radios Supply Voltage: +4V @ 45 mA • Military & Space Die Size: 2.04 x 1.2 x 0.1 mm • Test Instrumentation General Description Functional Diagram The HMC-ALH482 is a GaAs MMIC HEMT Low Noise Wideband Amplifier die which operates between 2 and 22 GHz. The amplifier provides 16 dB of gain, 1.7 dB noise figure up to 12 GHz and +14 dBm of output power at 1 dB gain compression while requiring only 45 mA from a +4V supply voltage. The HMC-ALH482 amplifier is ideal for integration into Multi-ChipModules (MCMs) due to its small size. Electrical Specifi cations*, TA = +25° C, Vdd= +4V Parameter Min. Frequency Range Gain Typ. Max. Min. 2 - 12 15 Gain Variation over Temperature Noise Figure 16 15 0.01 1.7 Typ. Max. 12 - 22 2.5 Units GHz 16 dB 0.01 dB / °C 2.2 3 dB Input Return Loss 8 6 dB Output Return Loss 10 5 dB Output Power for 1 dB Compression 14 14 dBm Supply Current (Idd) (Vdd = 4V, Vgg = -0.2V Typ.) 45 45 mA *Unless otherwise indicated, all measurements are from probed die 1 - 204 For price, delivery, and to placeCorporation: orders: Analog Devices, Inc., For price, delivery, and to place orders, please contact Hittite Microwave One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone:Phone: 978-250-3343 978-250-3373 781-329-4700Fax: • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D Order On-line at www.hittite.com Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. HMC-ALH482 v04.1009 GaAs HEMT MMIC LOW NOISE AMPLIFIER, 2 - 22 GHz 3 20 18 2.5 NOISE FIGURE (dB) 16 GAIN (dB) 14 12 10 8 6 4 2 1.5 1 0.5 2 0 0 0 2 4 6 8 10 12 14 16 18 20 22 0 24 2 4 6 FREQUENCY (GHz) 8 10 12 14 16 18 20 22 24 22 24 FREQUENCY (GHz) Input Return Loss vs. Frequency Output Return Loss vs. Frequency 0 0 -4 RETURN LOSS (dB) RETURN LOSS (dB) -2 -6 -8 -10 -12 -5 -10 -15 LOW NOISE AMPLIFIERS - CHIP 1 Noise Figure vs. Frequency Linear Gain vs. Frequency -20 -14 -16 -25 0 2 4 6 8 10 12 14 16 18 20 22 24 FREQUENCY (GHz) 0 2 4 6 8 10 12 14 16 18 20 FREQUENCY (GHz) For price, delivery, and to placeCorporation: orders: Analog Devices, Inc., For price, delivery, and to place orders, please contact Hittite Microwave One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone: Phone: 978-250-3343 978-250-3373 781-329-4700Fax: • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D Order On-line at www.hittite.com Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. 1 - 205 HMC-ALH482 v04.1009 GaAs HEMT MMIC LOW NOISE AMPLIFIER, 2 - 22 GHz LOW NOISE AMPLIFIERS - CHIP 1 Absolute Maximum Ratings Drain Bias Voltage +5 Vdc Drain Bias Current 60 mA RF Input Power 5 dBm Gate Bias Voltage -1 to 0.3 Vdc Channel Temperature 180 °C Continuous Pdiss (T = 85 °C) derate 4.7 mW/ °C above 85 °C 0.45 W Thermal Resistance (channel to die bottom) 213.3 °C/W Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C Outline Drawing Die Packaging Information [1] Standard Alternate GP-2 (Gel Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. 1 - 206 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. TYPICAL BOND PAD IS .004” SQUARE. 3. BACKSIDE METALLIZATION: GOLD. 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 7. OVERALL DIE SIZE ±.002” For price, delivery, and to placeCorporation: orders: Analog Devices, Inc., For price, delivery, and to place orders, please contact Hittite Microwave One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone:Phone: 978-250-3343 978-250-3373 781-329-4700Fax: • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D Order On-line at www.hittite.com Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. HMC-ALH482 v04.1009 GaAs HEMT MMIC LOW NOISE AMPLIFIER, 2 - 22 GHz Pad Number Function Description 1 RFIN This pad is AC coupled and matched to 50 Ohms. 2 RFOUT This pad is AC coupled and matched to 50 Ohms. 3 Vdd Power Supply Voltage for the amplifier. See assembly for required external components. 4 Vgg Gate control for amplifier. Please follow “MMIC Amplifier Biasing Procedure” application note. See assembly for required external components. Die bottom GND Die bottom must be connected to RF/DC ground. Interface Schematic For price, delivery, and to placeCorporation: orders: Analog Devices, Inc., For price, delivery, and to place orders, please contact Hittite Microwave One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone: Phone: 978-250-3343 978-250-3373 781-329-4700Fax: • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D Order On-line at www.hittite.com Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. LOW NOISE AMPLIFIERS - CHIP 1 Pad Descriptions 1 - 207 HMC-ALH482 v04.1009 GaAs HEMT MMIC LOW NOISE AMPLIFIER, 2 - 22 GHz Assembly Diagram LOW NOISE AMPLIFIERS - CHIP 1 Note 1: Bypass caps should be 100 pF (approximately) ceramic (single-layer) placed no farther than 30 mils from the amplifier. Note 2: Best performance obtained from use of
HMC-ALH482 价格&库存

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