HMC156A

HMC156A v00.0111 Typical Applications Features The HMC156A is suitable for: Conversion Loss: 15 dB • Wireless Local Loop Fo, 3Fo, 4Fo Isolation: 38 dB • LMDS, VSAT, and Point-to-Point Radios Input Drive Level: 10 to 20 dBm • UNII & HiperLAN TE • Test Equipment Functional Diagram General Description B SO LE The HMC156A is a miniature frequency doubler in a MMIC die. Suppression of undesired fundamental and higher order harmonics is 38 dB typical with respect to input signal levels. The doubler uses the same diode/balun technology used in Hittite MMIC mixers, features small size and requires no DC bias. Electrical Specifications, TA = +25° C, As a Function of Drive Level O FREQUency MULTIPLIERS - Passive - CHIP 2 Parameter Input = +10 dBm Min. Typ. Input = +15 dBm Max. Min. Typ. Input = +20 dBm Max. Min. Typ. Max. Units Frequency Range, Input 1.1 - 2.1 0.8 - 2.4 0.7 - 2.3 GHz Frequency Range, Output 2.2 - 4.2 1.6 - 4.8 1.4 - 4.6 GHz Conversion Loss 2-1 GaAs MMIC PASSIVE FREQUENCY DOUBLER, 0.7 - 2.4 GHz INPUT 17 22 15 20 15 20 dB FO Isolation (with respect to input level) 42 47 43 47 27 35 dB 3FO Isolation (with respect to input level) 45 55 44 55 29 40 dB 4FO Isolation (with respect to input level) 28 38 31 38 25 35 dB Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, delivery, andRoad, to placeChelmsford, orders: AnalogMA Devices, Inc., For price, delivery toforplace orders: Hittite Microwave Corporation, 20 Alpha 01824 responsibility is assumed by Analogand Devices its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 Fax: 978-250-3373 Phone: Order781-329-4700 On-line at www.hittite.com • Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks areApplication the property of their respective owners. Support: Phone: 978-250-3343 or apps@hittite.com HMC156A v00.0111 GaAs MMIC PASSIVE FREQUENCY DOUBLER, 0.7 - 2.4 GHz INPUT Isolation @ +15 dBm Drive Level* Fo 3Fo 4Fo -20 -10 ISOLATION (dB) -20 -30 -40 -60 TE CONVERSION GAIN (dB) 2 0 0 Pin = 10 dBm Pin = 15 dBm Pin = 20 dBm -80 -100 -40 1 1.5 2 2.5 3 3.5 4 4.5 0 5 2 4 6 8 10 FREQUENCY (GHz) OUTPUT FREQUENCY (GHz) Input Return Loss vs. Drive Level 0 Output Return Loss @ +15 Drive Level -15 B SO -10 Pin =10 dBm Pin =15 dBm Pin = 20 dBm -20 -25 0 0.5 1 1.5 2 2.5 3 3.5 4 -4 -8 -12 -16 0 1 2 3 4 5 OUTPUT FREQUENCY (GHz) O INPUT FREQUENCY (GHz) RETURN LOSS (dB) 0 -5 RETURN LOSS (dB) LE *With respect to input level Absolute Maximum Ratings Input Drive +27 dBm Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C FREQUency MULTIPLIERS - Passive - CHIP Conversion Gain vs. Drive Level ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, delivery, andRoad, to place orders: Analog Devices, For price, delivery and to for place Hittite Microwave Corporation, 20 Alpha Chelmsford, MA 01824Inc., responsibility is assumed by Analog Devices its use, orders: nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 Fax: 978-250-3373 Phone: Order781-329-4700 On-line at www.hittite.com • Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 978-250-3343 or apps@hittite.com 2-2 HMC156A v00.0111 GaAs MMIC PASSIVE FREQUENCY DOUBLER, 0.7 - 2.4 GHz INPUT Outline Drawing 2-3 TE LE B SO Die Packaging Information [1] Standard Alternate WP-13 (Waffle Pack) [2] NOTES: 1. ALL UNLABELED PADS MUST BE BONDED TO GROUND (8 TOTAL). 2. ALL DIMENSIONS IN INCHES [MILLIMETERS] 3. ALL TOLERANCES ARE ±0.001 [0.025] 4. DIE THICKNESS IS ±0.005 [0.127] 5. BOND PADS ARE ±0.004 [0.100] SQUARE 6. EQUALLY SPACED AT ±0.006 [0.150] CENTERS 7. BACKSIDE METALLIZATION: NONE 8. BOND PAD METALLIZATION: GOLD [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. Pad Description O FREQUency MULTIPLIERS - Passive - CHIP 2 Pad Number Function Description 1 RFIN DC coupled and matched to 50 Ohm. 2 RFOUT DC coupled and matched to 50 Ohm. Die Bottom GND Die bottom must be connected to RF/DC ground. Interface Schematic Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, delivery, andRoad, to placeChelmsford, orders: AnalogMA Devices, Inc., For price, delivery toforplace orders: Hittite Microwave Corporation, 20 Alpha 01824 responsibility is assumed by Analogand Devices its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 Fax: 978-250-3373 Phone: Order781-329-4700 On-line at www.hittite.com • Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks areApplication the property of their respective owners. Support: Phone: 978-250-3343 or apps@hittite.com HMC156A v00.0111 GaAs MMIC PASSIVE FREQUENCY DOUBLER, 0.7 - 2.4 GHz INPUT Handling Precautions Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. TE Static Sensitivity: Follow ESD precautions to protect against ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. Mounting LE General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. B SO Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding O Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package. RF bonds should be as short as possible. Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, delivery, andRoad, to place orders: Analog Devices, For price, delivery and to for place Hittite Microwave Corporation, 20 Alpha Chelmsford, MA 01824Inc., responsibility is assumed by Analog Devices its use, orders: nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 Fax: 978-250-3373 Phone: Order781-329-4700 On-line at www.hittite.com • Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 978-250-3343 or apps@hittite.com 2 FREQUency MULTIPLIERS - Passive - CHIP Follow these precautions to avoid permanent damage. 2-4